KR20220075285A - System for cleaning of assistance solvent and method thereof - Google Patents

Abstract

The present invention discloses an auxiliary solvent cleaning system and method therefor. That is, in the present invention, when bonding another semiconductor chip on a semiconductor chip or a printed circuit board, a cleaning solution is sprayed through the spraying part from one side between the two bonded base materials, and the other side of the microcavity between the two bonded base materials or the microcavity periphery By sucking the cleaning liquid and auxiliary solvent sprayed through the spraying part through the suction part from above, the cleaning liquid flows directly into the microscopic gaps between the base materials to increase the cleaning effect, reduce the number of times of cleaning compared to the conventional method, and reduce the amount of ultrapure water consumption and power consumption Reduces cost, reduces wastewater and lowers power consumption can be improved and product defects can be prevented.

Description

A cleaning system for an auxiliary solvent and a method therefor

The present invention relates to a cleaning system for an auxiliary solvent and a method therefor. In particular, when bonding another semiconductor chip on a semiconductor chip or a printed circuit board, the cleaning solution is sprayed through a spraying part from one side between two bonded base materials, and the bonded It relates to a cleaning system for an auxiliary solvent and a method therefor for sucking a cleaning liquid and an auxiliary solvent sprayed through the injection unit through the suction unit on the other side of the microcavity between two base materials or a region around the microcavity.

Among semiconductor processes, processes such as flux remaining between a printed circuit board (PCB) and a semiconductor chip or between a semiconductor chip and a semiconductor chip after surface mount technology (SMT), reflow, etc. The process of cleaning the auxiliary material is essential.

In the existing cleaning process, the same cleaning is performed several times by spraying cleaning liquid or ultrapure water at high pressure, spraying cleaning liquid with other additives added, spraying after increasing the amount of ultrapure water used, or heating to increase the use temperature of ultrapure water Since a method such as spraying ultrapure water in a high state is used, the cost is increased or the operating efficiency is lowered.

In addition, in the conventional cleaning process, when the solder bumper or bonding metal is small, the gap between the two base materials after bonding is narrow, making it difficult to penetrate the cleaning solution, making cleaning inefficient. There are problems such as being

Korean Patent Registration No. 10-0907568 [Title: Solder Flux Removal Cleaning Agent and Solder Flux Cleaning Method]

An object of the present invention is to inject a cleaning solution through a spraying part from one side between two bonded base materials when bonding another semiconductor chip on a semiconductor chip or a printed circuit board, and the other side of the microcavity between the two bonded base materials or the microcavity periphery An object of the present invention is to provide a cleaning system for an auxiliary solvent and a method therefor for sucking the cleaning liquid and the auxiliary solvent sprayed through the injection unit through the suction unit from above.

A cleaning method of an auxiliary solvent according to an embodiment of the present invention includes bonding a first base material and a second base material using solder or solder balls for electronic device bonding and an auxiliary solvent; continuously spraying a cleaning solution or ultrapure water from one side of the microcavity formed between the bonded first base material and the second base material by the spraying unit; and sucking the cleaning liquid sprayed through the injection unit from the other side or the side of the microcavity and the auxiliary solvent remaining in the microcavity by the suction unit.

As an example related to the present invention, in the step of sucking the cleaning solution and the auxiliary solvent remaining in the microcavity, the bonding first base material and the second base material are immersed in a water tank containing the cleaning solution, the bonding The cleaning liquid and the auxiliary solvent remaining in the microcavity may be sucked from the other side or side of the microcavity formed between the first base material and the second base material.

A cleaning system of an auxiliary solvent according to an embodiment of the present invention includes a first base material; a second base material formed on one side of the first base material and bonding to the first base material using solder or solder balls for electronic device bonding and an auxiliary solvent; a spraying unit continuously spraying a cleaning solution or ultrapure water from one side of the microcavity formed between the bonded first base material and the second base material; and a suction unit for sucking the cleaning liquid sprayed through the injection unit from the other side or side of the microcavity and the auxiliary solvent remaining in the microcavity.

As an example related to the present invention, it further includes a water tank in which the cleaning liquid or ultrapure water is stored, and the suction unit, when the bonded first and second base materials are contained in the water tank, the bonded first base material and The cleaning liquid and the auxiliary solvent remaining in the microcavity may be sucked from the other side or side of the microcavity formed between the second base material.

As an example related to the present invention, the side surfaces of the suction unit in contact with the bonded first and second substrates in which the microcavity is formed are configured to be bifurcated, and the outer surfaces of the bonded first and second substrates It is possible to suck the cleaning liquid and the auxiliary solvent sprayed from the spraying part in a state in which the airtightness is maintained by pressing the .

As an example related to the present invention, the suction unit is configured to be of a type that performs suction for each unit, and after placing one unit material for a PCB strip or wafer in a cleaning section, each unit, each horizontal row and vertical row Cleaning is performed with any one of the stars, and one end of the suction unit is formed of bifurcated first and second suction plates, and one end of the first suction plate is in close contact with one surface of the first base material, and one end of the second suction plate is in close contact with one surface of the second base material, it may be formed in a structure in which airtightness is maintained with respect to the other side or side of the microcavity in which the suction part is formed.

As an example related to the present invention, the suction unit cleans one unit material for a PCB strip or wafer in any one of 2 unit units in the cleaning section, unit units paired in a horizontal row, and unit units paired in a vertical row proceeding, and one end of the suction unit is formed of bifurcated first and second suction plates, one end of the first suction plate is in close contact with one surface of the first unit among the two units, and one end of the second suction plate is the second It may be formed in a structure in which airtightness is maintained with respect to the microcavities respectively formed in the first unit and the second unit by being in close contact with one surface of the second unit among the units.

In the present invention, when bonding another semiconductor chip on a semiconductor chip or a printed circuit board, the cleaning liquid is sprayed through the spraying part from one side between the two bonded base materials, and the microcavity between the two bonded base materials is sucked from the other side or around the microcavity. By sucking the cleaning liquid and auxiliary solvent sprayed through the spraying part through the part, the cleaning liquid flows directly into the microscopic gaps between the base materials to increase the cleaning effect, reduce the number of times of cleaning compared to the conventional method, and reduce the consumption of ultrapure water and power consumption, thereby reducing the cost Reduces the amount of cleaning liquid and power consumption as the cleaning liquid easily penetrates into the gap even if the gap is narrow because the solder bumper or solder ball is very small, thereby reducing equipment operation cost and improving product quality This has the effect of preventing product defects.

1 is a block diagram showing the configuration of an auxiliary solvent cleaning system according to an embodiment of the present invention.
2 to 5 are views showing an example of the structure of the suction unit according to the embodiment of the present invention.
6 is a flowchart illustrating a cleaning method of an auxiliary solvent according to an embodiment of the present invention.
7 is a view showing an example of bonding between base materials according to an embodiment of the present invention.

It should be noted that the technical terms used in the present invention are only used to describe specific embodiments, and are not intended to limit the present invention. In addition, the technical terms used in the present invention should be interpreted as meanings generally understood by those of ordinary skill in the art to which the present invention belongs, unless otherwise specifically defined in the present invention, and excessively comprehensive It should not be construed in the meaning of a human being or in an excessively reduced meaning. In addition, when the technical term used in the present invention is an incorrect technical term that does not accurately express the spirit of the present invention, it should be understood by being replaced with a technical term that can be correctly understood by those skilled in the art. In addition, the general terms used in the present invention should be interpreted according to the definition in the dictionary or according to the context before and after, and should not be interpreted in an excessively reduced meaning.

Also, the singular expression used in the present invention includes the plural expression unless the context clearly dictates otherwise. In the present invention, terms such as “consisting of” or “comprising” should not be construed as necessarily including all of the various components or various steps described in the invention, and some components or some steps may not be included. It should be construed that it may further include additional components or steps.

Also, terms including ordinal numbers such as first, second, etc. used in the present invention may be used to describe the elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to the accompanying drawings, but the same or similar components are assigned the same reference numerals regardless of reference numerals, and redundant description thereof will be omitted.

In addition, in the description of the present invention, if it is determined that a detailed description of a related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, it should be noted that the accompanying drawings are only for easy understanding of the spirit of the present invention, and should not be construed as limiting the spirit of the present invention by the accompanying drawings.

1 is a block diagram showing the configuration of a cleaning system 10 for an auxiliary solvent according to an embodiment of the present invention.

As shown in FIG. 1 , the cleaning system 10 for the auxiliary solvent includes a main body 100 , a transfer unit 200 , a bonding unit 300 , a spray unit 400 , a suction unit 500 , and a control unit 600 . is composed Not all components of the auxiliary solvent cleaning system 10 shown in FIG. 1 are essential components, and the auxiliary solvent cleaning system 10 may be implemented by more components than those shown in FIG. 1 . Also, the cleaning system 10 of the auxiliary solvent may be implemented with fewer components.

The main body (or plate) 100 is configured to support the transfer unit 200 , the bonding unit 300 , the spray unit 400 , and the suction unit 500 .

The transfer unit 200 is formed (or configured) on one surface (or upper surface/upper portion) of the main body 100 .

The conveying unit 200 is composed of rollers, etc., and transfers (or moves) semiconductor chips, electronic devices, printed circuit boards, etc. positioned on the conveying unit 200 under the control of the control unit 600 .

The bonding unit 300 includes a first base material 310 , a second base material 320 , a solder 330 , and an auxiliary solvent 340 .

The first base material 310 includes a semiconductor chip, an electronic device, a printed circuit board (PCB), and the like.

The second base material 320 includes a semiconductor chip, an electronic device, a printed circuit board, and the like.

In addition, the second base material 320 is bonded to the first base material 310 through a bonding process using the solder 330 .

The solder (or the solder ball) 330 bonds the first base material 310 and the second base material 320 together with the auxiliary solvent 340 by bonding. In this case, the solder 330 may be formed of solder balls as well as solder for bonding electronic devices.

The auxiliary solvent 340 is to facilitate bonding of the base materials 310 and 320, and is composed of a flux (or flux solvent), an organic solvent (for example, rosin for bonding electronic devices, etc.). do.

The injection part (or injection nozzle) 400 is formed (or configured) on one side of the microcavity (or micro-gap) formed between the two base materials 310 and 320 bonded by the bonding part 300 .

In addition, the injection unit 400, under the control of the control unit 600, in a state in which the injection angle, the injection amount, the injection pressure, etc. are adjusted, the cleaning liquid stored in the auxiliary container (not shown), ultrapure water, etc. It is continuously sprayed into the microcavity. Here, the cleaning solution may be composed of various known products used to remove (or separate) the auxiliary solvent 340 after the bonding process in the semiconductor manufacturing process.

The suction unit (or suction nozzle) 500 is the other side or side of the microcavity formed between the two base materials 310 and 320 bonded by the bonding unit 300 (or the other side opposite to the injection unit 400 ). Or formed (or configured) on the side of the suction unit 500 and a predetermined angle (for example, 90 degrees) rotated.

In addition, the suction unit 500 is cleaned by the cleaning liquid sprayed through the injection unit 400 from the other side or the side of the microcavity, and the cleaning liquid in a state remaining in the microcavity to move together with the cleaning liquid. By sucking the auxiliary solvent 340 and the like, the auxiliary solvent 340 remaining in the microcavity between the first base material 310 and the second base material 320 after the bonding process is removed.

At this time, as shown in FIG. 2, the side of the suction unit 500 in contact with the bonded first base material 310 and the second base material 320 in which the microcavity is formed is configured to be bifurcated, and the Composed (or formed) so that airtightness is maintained by compressing the outer surfaces of the bonded first base material 310 and the second base material 320 and sucking the cleaning liquid sprayed from the spray unit 400, the auxiliary solvent 340, etc. do.

That is, as shown in FIG. 2 , one end (or lower portion) of the suction unit 500 is formed of a V-shaped bifurcated suction plate (or supporter) 510 and 520 , and the One end of the suction plate (or the first support) 510 is in close contact with one surface (or the upper surface) of the first base material 310, and one end of the second suction plate (or the second support) 520 of the two prongs is the second base material ( The other side or side of the microcavity in which the suction part 500 is formed by being in close contact with one surface of the 320) is formed in a structure (or closed structure) in which the airtightness is maintained with the two base materials 310 and 320, the minute The cleaning liquid, etc. sprayed from the master 400 may be collected from two forks formed at one end of the suction unit 500 and sucked (or moved) into the suction unit 500 . Here, the suction plates 510 and 520 may be formed of an elastic material such as urethane, sponge, rubber, or silicone.

In addition, as shown in FIG. 3 , the suction unit 500 is configured to be of a type that performs suction for each unit, and one unit material is applied to the cleaning section for a PCB strip, a wafer, etc. After positioning, cleaning can be carried out by individual units or by rows or columns. In this case, the suction unit 500 may perform a cleaning process by moving the suction nozzle for each unit in a state in which the material is fixed. At this time, one end of the suction unit 500 is formed of bi-pronged suction plates 510 and 520 in the shape of a letter, and one end of the first suction plate 510 is in close contact with one surface of the first base material 310 , and the The second suction plate 520 is formed to be in close contact with one surface of the second base material 320 .

In addition, as shown in FIG. 4 , the suction unit 500 applies one unit material for a PCB strip, a wafer, etc. in a cleaning section in a 2 unit unit or in a row or a column in pairs (or forming) a plurality of Cleaning can be performed in units of In this case, the suction unit 500 may perform a cleaning process by moving the suction nozzle for each cleaning section in a state in which the material is fixed. At this time, one end of the suction unit 500 is formed of two-pronged suction plates 510 and 520 in a T-shape, and one end of the first suction plate 510 is in close contact with one surface of the first unit 530 among the two units. and one end of the second suction plate 520 is in close contact with one surface of the second unit 540 among the two units, and the airtightness of the microcavities formed in the first unit 530 and the second unit 540, respectively configured to be maintained.

In addition, as shown in FIG. 5 , the suction unit 500 transfers one unit material for a PCB strip, a wafer, etc. to a predetermined cleaning area, and a continuous cleaning operation can be performed using a roller-type suction nozzle. . In this case, compared to the cleaning process shown in FIGS. 3 and 4 above, workability can be further improved. At this time, the suction pipe (black area in FIG. 5 ) 550 formed at one end of the suction unit 500 is in a non-rotating state, and the roller (yellow area in FIG. 5 ) formed at one end of the suction unit 500 . ) 560 rotates, and is in close contact with the second base material 320, and the cleaning liquid sprayed through the spray unit 400 from the microcavity formed in the first unit 530 and the second unit 540, It is configured to easily inhale the auxiliary solvent 340 and the like.

In this way, the cleaning liquid is sprayed through the spraying part 400 from one side of the microcavity formed between the two bonded base materials 310 and 320, and from the other side or the side of the microcavity through the spraying part 400. The cleaning effect can be enhanced by inhaling the sprayed cleaning liquid, the auxiliary solvent 340, and the like together.

In addition, in a state in which the two bonded base materials 310 and 320 are immersed in a water tank (not shown) containing a cleaning solution, the suction located on the other side or side of the microcavity formed between the two bonded base materials 310 and 320 It may be configured to suck the cleaning liquid, the auxiliary solvent 340, and the like through the unit 500 .

In addition, by blocking the other side or a part of the side of the microcavity through a blocking part (not shown) extending and formed in the suction part 500, the flow or effect of the cleaning liquid, the auxiliary solvent 340, etc. may be controlled.

The controller (or microcontroller unit) 600 executes an overall control function of the auxiliary solvent cleaning system 10 .

In addition, the control unit 600 controls the operation of the injection unit 400 to spray the cleaning liquid, ultrapure water, etc. stored in the auxiliary container.

In addition, the control unit 600 is an auxiliary solvent ( 340) and controls the operation of the suction unit 500 to absorb.

In this way, when another semiconductor chip is bonded on a semiconductor chip or a printed circuit board, the cleaning solution is sprayed through the spraying part from one side between the two bonded base materials, and the other side of the microcavity between the two bonded base materials is sucked from the microcavity peripheral part. The cleaning liquid and auxiliary solvent sprayed through the spraying part may be sucked through the part.

Hereinafter, the cleaning method of the auxiliary solvent according to the present invention will be described in detail with reference to FIGS. 1 to 7 .

6 is a flowchart illustrating a cleaning method of an auxiliary solvent according to an embodiment of the present invention.

First, the bonding unit 300 performs a bonding process of bonding (or bonding) the first base material 310 and the second base material 320 using the solder 330 for electronic device bonding and the auxiliary solvent 340. . In this case, the first base material 310 and the second base material 320 include a semiconductor chip, an electronic device, a printed circuit board (PCB), and the like. In addition, the solder 330 may be a solder ball as well as a solder for bonding electronic devices. In addition, the auxiliary solvent 340 is used to facilitate bonding of the base materials 310 and 320, and includes a flux (or flux solvent), an organic solvent (for example, rosin for bonding electronic devices, etc.), etc. consist of

For example, as shown in FIG. 7 , the bonding part 300 is formed by bonding the first base material 310 and the second base material 320 to the solder (or solder ball) 330 and the auxiliary solvent 340 . is used to bond (S610).

Thereafter, the spraying unit 400 continuously sprays the cleaning liquid (or ultrapure water) from one side of the microcavity formed between the two bonded base materials 310 and 320 . Here, the cleaning solution may be composed of various known products used to remove (or separate) the auxiliary solvent 340 after the bonding process in the semiconductor manufacturing process.

In addition, the suction unit 500 is cleaned by the cleaning liquid sprayed through the spraying unit 400 from the other side or side of the microcavity, and the cleaning liquid in a state remaining in the microcavity, and moves together with the cleaning liquid. The auxiliary solvent 340 and the like are inhaled.

In this way, the cleaning liquid is sprayed through the spraying part 400 from one side of the microcavity formed between the two bonded base materials 310 and 320, and from the other side or the side of the microcavity through the spraying part 400. The cleaning effect can be enhanced by inhaling the sprayed cleaning liquid, the auxiliary solvent 340, and the like together.

In addition, in a state in which the two bonded base materials 310 and 320 are immersed in a water tank (not shown) containing a cleaning solution, the suction located on the other side or side of the microcavity formed between the two bonded base materials 310 and 320 It may be configured to suck the cleaning liquid, the auxiliary solvent 340, and the like through the unit 500 .

In addition, a rinse process, a rinsing process, an air shower process, a drying process, etc. may be sequentially performed on the two cleaned and bonded base materials 310 and 320 .

For example, as shown in FIG. 2 , the spraying unit 400 continuously sprays the cleaning solution from one side of the microcavity formed between the bonded first base material 310 and the second base material 320 .

In addition, as shown in FIG. 2 , the suction unit 500 is configured to face the injection unit 400 , and the cleaning liquid sprayed through the injection unit 400 and the cleaning liquid are moved together. The auxiliary solvent 340 is sucked (S620).

As described above, in an embodiment of the present invention, when bonding a semiconductor chip or another semiconductor chip on a printed circuit board, a cleaning solution is sprayed through a spraying unit from one side between the two bonded base materials, and between the two bonded base materials. By sucking the cleaning liquid and auxiliary solvent sprayed through the spraying part through the suction part from the other side of the microcavity or around the microcavity, the cleaning liquid flows directly into the microscopic gaps between the base materials to increase the cleaning effect, and to increase the number of times of cleaning compared to the conventional method Reduces cost by reducing ultrapure water usage and power consumption, reducing wastewater and reducing power consumption It can reduce operating costs, improve product quality, and prevent product defects.

Those of ordinary skill in the art to which the present invention pertains may modify and modify the above-described contents without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

10: auxiliary solvent cleaning system 100: body/plate
200: transfer unit 300: bonding unit
400: injection unit 500: suction unit
600: control unit 310: first base material
320: second base material 330: solder / solder ball
340: auxiliary solvent

Claims (2)

bonding a first base material and a second base material using solder and auxiliary solvent for electronic device bonding, respectively, by using one unit material as two units in the cleaning section;
continuously spraying a cleaning solution from one side of the microcavity formed between the bonded first base material and the second base material by the spraying unit; and
Including the step of sucking, by the suction unit, the cleaning liquid sprayed through the injection unit from the other side or the side of the microcavity and the auxiliary solvent remaining in the microcavity,
One end of the suction part in contact with the bonded first and second base materials in which the microcavity is formed,
It is formed of a bifurcated T-shaped first and second sucker plate,
One end of the first suction plate is in close contact with one surface of the first unit among the two units,
One end of the second suction plate is in close contact with one surface of the second unit of the two units, and the airtight structure is maintained with respect to the other side or side of the microcavity formed in the first unit and the second unit, respectively, in the suction unit. is formed with
The suction unit operates under the control of the control unit to suck the cleaning liquid and the auxiliary solvent,
The step of sucking the cleaning solution and the auxiliary solvent remaining in the microcavity,
When the bonded first base material and the second base material are immersed in the water tank containing the cleaning liquid, the cleaning liquid contained in the water tank and the Inhaling the auxiliary solvent remaining in the microcavity,
The cleaning method of the auxiliary solvent, characterized in that the suction part further comprises a blocking part extending to block the other side or a part of the side surface of the microcavity. a first base material;
a second base material formed on one side of the first base material and bonding to the first base material using a solder ball and an auxiliary solvent; a first unit and a second unit provided in a cleaning section as a unit unit;
a spraying unit continuously spraying ultrapure water from one side of the microcavity formed between the bonded first base material and the second base material;
a suction unit for sucking the ultrapure water sprayed through the injection unit from the other side or side of the microcavity and the auxiliary solvent remaining in the microcavity; and
It includes a control unit for controlling the operation of the suction unit,
One end of the suction part in contact with the bonded first and second base materials in which the microcavity is formed,
It is formed of a bifurcated T-shaped first and second sucker plate,
One end of the first suction plate is in close contact with one surface of the first unit among the two units,
One end of the second suction plate is in close contact with one surface of the second unit among the two units, and the airtight structure is maintained with respect to the other side or side of the microcavity formed in the first unit and the second unit, respectively, in the suction unit. is formed with
The suction unit operates under the control of the control unit to suck the ultrapure water and the auxiliary solvent,
Further comprising a tank in which the ultrapure water is stored,
The suction unit,
When the bonded first base material and the second base material are in the water tank, the ultrapure water contained in the water tank and the microcavity from the other side or side of the microcavity formed between the bonded first base material and the second base material remain in the microcavity Inhaling the auxiliary solvent,
The cleaning system of the auxiliary solvent, characterized in that the suction part further comprises a blocking part extending to block the other side or a part of the side surface of the microcavity.

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