KR20220056614A - Wafer inspection equipment - Google Patents

Wafer inspection equipment Download PDF

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KR20220056614A
KR20220056614A KR1020200141353A KR20200141353A KR20220056614A KR 20220056614 A KR20220056614 A KR 20220056614A KR 1020200141353 A KR1020200141353 A KR 1020200141353A KR 20200141353 A KR20200141353 A KR 20200141353A KR 20220056614 A KR20220056614 A KR 20220056614A
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wafer
unit
inspection
process gas
gate
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KR1020200141353A
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Korean (ko)
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KR102508266B1 (en
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박진섭
김영환
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박진섭
김영환
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention can improve the inspection reliability for a wafer by photographing the front and rear surfaces of the wafer, discovering a problem which can occur on both surfaces of the wafer in advance by reading and inspecting a photographed image, and spraying process gas to the wafer to remove foreign substances or fumes. A wafer inspection apparatus comprises: an inspection case (100) having an internal space in which a wafer (10) is accommodated; a gate (200) provided on one side of the inspection case (100) and opening and closing the internal space to allow the wafer (10) to enter; a wafer mounting unit (300) on which the wafer (10) entering through the gate (200) is mounted; a lighting unit (600) providing light for the wafer (10) mounted on the wafer mounting unit (300); a primary inspection unit (700) inspecting the surface of the wafer (10) transported to the internal space of the inspection case (100); a secondary inspection unit (800) precisely inspecting the wafer (10) transported to the internal space of the inspection case (100); and a control unit (900) controlling the gate (200), the lighting unit (600), the primary inspection unit (700), and the secondary inspection unit (800).

Description

웨이퍼 검사장치{Wafer inspection equipment}Wafer inspection equipment

본 발명은 웨이퍼의 앞면 및 뒷면을 촬영하고 촬영된 영상의 판독 및 검사에 따라 웨이퍼의 양쪽 표면에 발생가능한 문제를 사전에 발견하고, 웨이퍼에 공정가스를 분사하여 이물질이나 흄을 제거하여 웨이퍼에 대한 검사신뢰도가 향상될 수 있는 웨이퍼 검사장치에 관한 것이다. The present invention shoots the front and back surfaces of the wafer, detects problems that may occur on both surfaces of the wafer in advance according to the reading and inspection of the captured images, and sprays process gas to the wafer to remove foreign substances or fumes. It relates to a wafer inspection apparatus capable of improving inspection reliability.

일반적으로, 반도체 검사장비 중에는 웨이퍼(Wafer) 상의 이물질이나 균열 또는 스크래치와 같은 불량을 검사하기 위해 일부에서는 레이저를 이용한 포토 디텍터(Photo detector)를 사용하고 있으며, 이 포토 디텍터는 피검사물에 레이저를 조사한 후에 광량의 변화를 측정하여 웨이퍼의 결점을 검사하는 것이다. In general, some semiconductor inspection equipment uses a photo detector using a laser to inspect defects such as foreign substances, cracks, or scratches on the wafer. Afterwards, the change in the amount of light is measured to inspect the wafer for defects.

이러한 포토 디텍터에는 광량증폭기가 구비되어 이미지의 감도를 높일 수 있으므로 보다 효과적인 웨이퍼의 검사를 행할 수 있으나, 포토 디텍터에 구비된 광량증폭기는 대부분 고가의 장비이므로 대규모의 반도체 제조공장 이외에는 사용하기에 곤란함이 있다. These photo detectors are equipped with a light amplifier to increase the sensitivity of the image, so more effective wafer inspection can be performed. There is this.

더욱이, 하나의 웨이퍼를 검사하기 위해서는 웨이퍼의 앞면을 검사한 후에 다시 웨이퍼를 뒤집어서 뒷면을 검사하는 과정으로 이루어짐에 따라, 검사시간이 많이 소요되는 문제점이 있다. Moreover, in order to inspect one wafer, since the front side of the wafer is inspected and then the wafer is turned over to inspect the back side, there is a problem in that it takes a lot of inspection time.

본 발명의 배경기술은 대한민국 특허청에 출원되어 등록된 등록특허공보 제10-0931859호(등록일자:2009.12.07.)가 게재되어 있다. The background technology of the present invention is published in Patent Registration No. 10-0931859 (registration date: 2009.12.07.) which has been applied for and registered with the Korean Intellectual Property Office.

본 발명이 해결하고자 하는 과제는, 웨이퍼의 앞면 및 뒷면을 촬영하고 촬영된 영상의 판독 및 검사에 따라 웨이퍼의 양쪽 표면에 발생가능한 문제를 사전에 발견할 수 있는 웨이퍼 검사장치를 제공하는 데 있다. An object of the present invention is to provide a wafer inspection apparatus capable of photographing the front and back surfaces of a wafer and detecting problems that may occur on both surfaces of the wafer in advance according to reading and inspection of the captured images.

본 발명의 다른 과제는, 웨이퍼에 공정가스를 분사하여 이물질이나 흄을 제거하여 웨이퍼에 대한 검사신뢰도가 향상될 수 있는 웨이퍼 검사장치를 제공하는 데 있다. Another object of the present invention is to provide a wafer inspection apparatus capable of improving inspection reliability for a wafer by spraying a process gas to the wafer to remove foreign substances or fumes.

본 발명의 일실시예에 따른 웨이퍼 검사장치는, 웨이퍼(10)가 수용되는 내부공간이 형성되는 검사케이스(100)와, 웨이퍼(10)가 출입되도록 검사케이스(100)의 일측에 구비된 상태로 내부공간을 개폐하는 게이트(200)와, 게이트(200)를 통해 유입되는 웨이퍼(10)가 거치되는 웨이퍼거치부(300)와, 웨이퍼거치부(300)에 거치된 웨이퍼(10)에 빛을 제공하는 조명부(600)와, 검사케이스(100)의 내부공간으로 이송된 웨이퍼(10)의 표면을 검사하는 1차검사부(700)와, 검사케이스(100)의 내부공간으로 이송된 웨이퍼(10)를 정밀검사하는 2차검사부(800)와, 게이트(200), 조명부(600), 1차검사부(700), 2차검사부(800)를 제어하는 제어부(900)를 포함하는 것을 특징으로 한다. A wafer inspection apparatus according to an embodiment of the present invention is provided on one side of the inspection case 100 in which the internal space in which the wafer 10 is accommodated is formed, and the wafer 10 is entered and exited at one side of the inspection case 100 A gate 200 that opens and closes the inner space of the furnace, a wafer holder 300 on which the wafer 10 flowing in through the gate 200 is mounted, and light on the wafer 10 mounted on the wafer holder 300 A lighting unit 600 that provides 10) characterized in that it comprises a control unit 900 for controlling the secondary inspection unit 800, the gate 200, the lighting unit 600, the primary inspection unit 700, and the secondary inspection unit 800 for a close inspection. do.

바람직하게, 웨이퍼거치부(300)는 검사케이스(100)에 설치되면서 웨이퍼(10)가 위치되는 거치홈(311)이 형성되는 거치대(310)와, 거치대(310)의 거치홈(311)에 분산되게 형성되어 웨이퍼(10)를 지지하는 지지핀(320)을 포함하는 것을 특징으로 한다. Preferably, the wafer holder 300 includes a holder 310 in which a holder groove 311 in which the wafer 10 is positioned while being installed in the inspection case 100 is formed, and in the holder groove 311 of the holder 310 . It is formed to be dispersed and characterized in that it includes a support pin 320 for supporting the wafer (10).

바람직하게, 본 발명은 웨이퍼거치부(300)에 거치된 웨이퍼(10)에 공정가스를 분사하는 공정가스분사부(400)와, 공정가스가 배기되도록 검사케이스(100)의 타측에 구비된 상태로 내부공간을 개폐하는 배기부(500)를 포함하고, 제어부(900)는 공정가스분사부(400) 및 배기부(500)를 제어하도록 설정되는 것을 특징으로 한다. Preferably, in the present invention, the process gas injection unit 400 for injecting the process gas to the wafer 10 mounted on the wafer holder 300, and the other side of the inspection case 100 so that the process gas is exhausted. It includes an exhaust unit 500 for opening and closing the furnace interior space, and the control unit 900 is set to control the process gas injection unit 400 and the exhaust unit 500 .

바람직하게, 2차검사부(800)는 웨이퍼거치부(300)의 상부에서 일측에 구비되는 상부구동부(810)와, 웨이퍼거치부(300)의 상부에서 타측에 구비되는 상부가이드(820)와, 상부구동부(810)의 구동에 의해 상부가이드(820)를 따라 이동하면서 웨이퍼(10)의 상부를 스캔하여 이미지를 획득하는 상부스캐너(830)와, 웨이퍼거치부(300)의 하부에서 일측에 구비되는 하부구동부(840)와, 웨이퍼거치부(300)의 하부에서 타측에 구비되는 하부가이드(850)와, 하부구동부(840)의 구동에 의해 하부가이드(850)를 따라 이동하면서 웨이퍼(10)의 하부를 스캔하여 이미지를 획득하는 하부스캐너(860)를 포함하는 것을 특징으로 한다. Preferably, the secondary inspection unit 800 includes an upper driving unit 810 provided on one side in the upper portion of the wafer holder 300, and an upper guide 820 provided on the other side in the upper portion of the wafer holder 300, and, An upper scanner 830 that acquires an image by scanning the upper portion of the wafer 10 while moving along the upper guide 820 by driving the upper driving unit 810, and the wafer holder 300 are provided on one side at the bottom The wafer 10 while moving along the lower guide 850 by the driving of the lower driving unit 840 that becomes the lower driving unit 840, the lower guide 850 provided on the other side in the lower part of the wafer holder 300, and the lower driving unit 840. It characterized in that it includes a lower scanner 860 for acquiring an image by scanning the lower part of the.

바람직하게, 1차검사부(700)는 복수의 비전 카메라로 구성되어, 웨이퍼거치부(300)의 상부 및 하부에 각각 위치된 상태로 웨이퍼(10)의 상부 및 하부를 촬영하고, 촬영된 영상을 제어부(900)로 전송하고, 2차검사부(800)는 2차검사부(800)는 복수의 스캐너로 구성되어 웨이퍼(10)의 상부 및 하부에서 각각의 이미지를 획득하고, 획득된 이미지를 제어부(900)로 전송하고, 제어부(900)는 게이트(200)를 작동시키는 게이트작동부(910)와, 공정가스분사부(400)를 작동시키는 공정가스작동부(920)와, 배기부(500)를 작동시키는 배기작동부(930)와, 조명부(600)를 작동시키는 조명작동부(940)와, 1차검사부(700)를 작동시키는 1차검사작동부(950)와, 2차검사부(800)를 작동시키는 2차검사작동부(960)와, 1차검사부(700)에 의해 웨이퍼(10)에서 획득되는 표면영상을 미리 설정된 기준표면영상과 비교하여 이상여부를 판단하는 1차판단부(970)와, 2차검사부(800)에 의해 웨이퍼(10)에서 획득되는 이미지를 미리 설정된 기준이미지에 비교하여 이상여부를 판단하는 2차판단부(980)와, 1차판단부(970)나 2차판단부(980)에서 이상으로 판단하면 경보신호를 발신하는 경보신호발신부(990)와, 웨이퍼(10)가 유입되도록 게이트작동부(910)를 조작하여 게이트(200)를 개방시키고, 웨이퍼(10)가 유입되면 게이트작동부(910)를 조작하여 게이트(200)를 폐쇄시키고, 웨이퍼(10)에 공정가스가 제공되도록 공정가스작동부(920)를 조작하여 공정가스분사부(400)를 작동시키고, 배기작동부(930)를 조작하여 배기부(500)를 개방시키고, 웨이퍼(10)에 빛이 조사되도록 조명작동부(940)를 조작하여 조명부(600)를 점등시키고, 웨이퍼(10)의 표면을 검사하도록 1차검사작동부(950)를 조작하여 1차검사부(700)를 작동시키고, 웨이퍼(10)를 정밀검사 하도록 조명작동부(940)를 조작하여 조명부(600)를 소등시키고, 2차검사작동부(960)를 조작하여 2차검사부(800)를 작동시키고, 웨이퍼(10)의 검사가 완료되면 공정가스 공급이 중지되도록 공정가스작동부(920)를 조작하여 공정가스분사부(400)를 정지시키고, 배기작동부(930)를 조작하여 배기부(500)를 폐쇄동작 시키고, 검사된 웨이퍼(10)가 배출되도록 게이트작동부(910)를 조작하여 게이트(200)를 개방시키는 조작부(1000)를 포함하는 것을 특징으로 한다. Preferably, the primary inspection unit 700 is composed of a plurality of vision cameras, photographing the upper and lower portions of the wafer 10 in a state respectively positioned at the upper and lower portions of the wafer holder 300, and displaying the captured images. Transmits to the control unit 900, the secondary inspection unit 800, the secondary inspection unit 800 is composed of a plurality of scanners to acquire respective images from the upper and lower portions of the wafer 10, and to control the obtained images ( 900), and the control unit 900 includes a gate operation unit 910 that operates the gate 200, a process gas operation unit 920 that operates the process gas injection unit 400, and an exhaust unit 500 The exhaust operation unit 930 for operating the , the lighting operation unit 940 for operating the lighting unit 600, the primary inspection operation unit 950 for operating the primary inspection unit 700, and the secondary inspection unit 800 ), a secondary inspection operation unit 960 that operates, and a primary judgment unit ( 970), a secondary determination unit 980 that determines whether there is an abnormality by comparing the image obtained from the wafer 10 by the secondary inspection unit 800 with a preset reference image, and a first determination unit 970 or When the secondary determination unit 980 determines that there is an abnormality, the gate 200 is opened by manipulating the gate operation unit 910 so that the alarm signal transmitting unit 990 that sends an alarm signal and the wafer 10 are introduced, When the wafer 10 is introduced, the gate operation unit 910 is operated to close the gate 200 , and the process gas operation unit 920 is operated to provide the process gas to the wafer 10 to thereby operate the process gas injection unit 400 . ), operate the exhaust operation unit 930 to open the exhaust unit 500 , and operate the illumination operation unit 940 to illuminate the wafer 10 so that light is irradiated to light the illumination unit 600 , and the wafer The primary inspection unit 700 is operated by operating the primary inspection operation unit 950 to inspect the surface of (10), and the illumination unit 600 is operated by operating the illumination operation unit 940 to precisely inspect the wafer 10. is turned off, and the secondary inspection operation unit (960) to operate the secondary inspection unit 800, and when the inspection of the wafer 10 is completed, the process gas operation unit 920 is operated to stop the process gas supply to stop the process gas injection unit 400, and exhaust Manipulating the operating unit 930 to close the exhaust unit 500, and operating the gate operating unit 910 to open the gate 200 so that the inspected wafer 10 is discharged. characterized in that

바람직하게, 조작부(1000)는 1차판단부(970)에서 이상으로 판단하면 2차검사부(800)를 작동시키도록 설정되는 것을 특징으로 한다. Preferably, the operation unit 1000 is characterized in that it is set to operate the secondary inspection unit 800 when the first determination unit 970 determines that there is an abnormality.

바람직하게, 본 발명은 웨이퍼거치부(300)의 상부에서 양측에 구비된 상태로 웨이퍼(10)의 위치를 검사하는 추가검사부(701)를 포함하고, 추가검사부(701)는 웨이퍼(10)를 촬영하는 카메라로 구성되고, 1차판단부(970)는 기준표면영상에 외곽프레임을 설정하고 추가검사부(701)에서 촬영되는 웨이퍼(10)에 대한 표면영상의 둘레가 설정된 기준표면영상의 외곽프레임을 벗어나는지 비교하여 판단하도록 설정될 수 있고, 경보신호발신부(990)는 1차판단부(970)에서 해당 웨이퍼(10)가 외곽프레임을 벗어나는 것으로 판단하면 경보하도록 설정될 수 있는 것을 특징으로 한다. Preferably, the present invention includes an additional inspection unit 701 for inspecting the position of the wafer 10 in a state provided on both sides in the upper portion of the wafer holder 300, and the additional inspection unit 701 inspects the wafer 10 Consists of a camera that takes pictures, the first determination unit 970 sets an outer frame on the reference surface image, and the outer frame of the reference surface image in which the perimeter of the surface image for the wafer 10 photographed by the additional inspection unit 701 is set It can be set to compare and determine whether or not it deviates, and the alarm signal transmitter 990 can be set to alert when the first determination unit 970 determines that the wafer 10 is out of the outer frame. do.

바람직하게, 제어부(900)는 1차판단부(970)나 2차판단부(980)에서 이상으로 판단하면 해당하는 표면영상이나 이미지에 마크를 표시하는 마크표시부(1100)와, 마크가 표시된 표면영상이나 이미지를 저장하여 관리하는 정보관리부(1200)를 포함하는 것을 특징으로 한다. Preferably, the control unit 900 includes a mark display unit 1100 that displays a mark on a corresponding surface image or image when it is determined as abnormal in the first determination unit 970 or the second determination unit 980, and the surface on which the mark is displayed It is characterized in that it includes an information management unit 1200 that stores and manages images or images.

본 발명은, 웨이퍼의 앞면 및 뒷면을 촬영하고 촬영된 영상의 판독 및 검사에 따라 웨이퍼의 양쪽 표면에 발생가능한 문제를 사전에 발견하고, 웨이퍼에 공정가스를 분사하여 이물질이나 흄을 제거하여 웨이퍼에 대한 검사신뢰도가 향상될 수 있다. The present invention, by photographing the front and back surfaces of the wafer, detecting problems that may occur on both surfaces of the wafer in advance according to the reading and inspection of the captured images, and spraying process gas to the wafer to remove foreign substances or fumes, Inspection reliability can be improved.

또한, 웨이퍼의 양면을 동시에 촬영하므로 촬영시간을 단축할 수 있다. In addition, since both sides of the wafer are photographed at the same time, the photographing time can be shortened.

또한, 비전 카메라로 영상을 촬영하거나 스캐너로 이미지를 획득하여 양부를 판별하므로 정확도를 높일 수 있다. In addition, the accuracy can be improved by taking an image with a vision camera or acquiring an image with a scanner to determine the quality.

또한, 공정가스인 질소를 웨이퍼에 분사하므로 흄발생을 사전에 제거하여 웨이퍼에 대한 선명한 영상 및 이미지 획득이 가능하다. In addition, since nitrogen, which is a process gas, is sprayed onto the wafer, it is possible to obtain clear images and images of the wafer by removing fumes in advance.

또한, 고가의 외신장비를 대체할 수 있어서 비용을 절감할 수 있는 이점이 있다. In addition, it is possible to replace expensive foreign telecommunication equipment, there is an advantage that can reduce the cost.

도 1은 본 발명의 일실시예에 따른 웨이퍼 검사장치를 보인 사시도.
도 2는 본 발명의 요부를 보인 사시도.
도 3은 본 발명의 내부를 보인 도면.
도 4는 본 발명의 내부를 다른 방향에서 보인 도면.
도 5는 본 발명의 구성을 개략적으로 보인 블록도.
도 6은 본 발명의 제어부를 개략적으로 보인 블록도. 1 is a perspective view showing a wafer inspection apparatus according to an embodiment of the present invention.
Figure 2 is a perspective view showing the main part of the present invention.
3 is a view showing the inside of the present invention.
4 is a view showing the inside of the present invention from another direction.
5 is a block diagram schematically showing the configuration of the present invention.
6 is a block diagram schematically showing a control unit of the present invention.

이하, 첨부된 도면을 참조하여 본 발명의 일실시예에 따른 웨이퍼 검사장치를 자세히 설명한다. Hereinafter, a wafer inspection apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 1 내지 도 6에 도시된 바와 같이, 본 발명의 웨이퍼 검사장치는, 웨이퍼(10)가 수용되는 내부공간이 형성되는 검사케이스(100)와, 웨이퍼(10)가 출입되도록 검사케이스(100)의 일측에 구비된 상태로 내부공간을 개폐하는 게이트(200)와, 게이트(200)를 통해 유입되는 웨이퍼(10)가 거치되는 웨이퍼거치부(300)와, 웨이퍼거치부(300)에 거치된 웨이퍼(10)에 공정가스를 분사하는 공정가스분사부(400)와, 공정가스가 배기되도록 검사케이스(100)의 타측에 구비된 상태로 내부공간을 개폐하는 배기부(500)와, 웨이퍼거치부(300)에 거치된 웨이퍼(10)에 빛을 제공하는 조명부(600)와, 검사케이스(100)의 내부공간으로 이송된 웨이퍼(10)의 표면을 검사하는 1차검사부(700)와, 검사케이스(100)의 내부공간으로 이송된 웨이퍼(10)를 정밀검사하는 2차검사부(800)와, 게이트(200), 공정가스분사부(400), 배기부(500), 조명부(600), 1차검사부(700), 2차검사부(800)를 제어하는 제어부(900)를 포함한다. As shown in FIGS. 1 to 6 , the wafer inspection apparatus of the present invention includes an inspection case 100 having an internal space in which the wafer 10 is accommodated, and an inspection case 100 such that the wafer 10 is moved in and out. The gate 200 for opening and closing the inner space in a state provided on one side of the wafer holder 300 on which the wafer 10 flowing in through the gate 200 is mounted, and the wafer holder 300 mounted on the The process gas injection unit 400 for injecting the process gas to the wafer 10, the exhaust unit 500 for opening and closing the inner space while being provided on the other side of the inspection case 100 so that the process gas is exhausted, and the wafer holder A lighting unit 600 for providing light to the wafer 10 mounted on the unit 300, and a primary inspection unit 700 for inspecting the surface of the wafer 10 transferred to the inner space of the inspection case 100; A secondary inspection unit 800 that closely inspects the wafer 10 transferred to the inner space of the inspection case 100, the gate 200, the process gas injection unit 400, the exhaust unit 500, and the lighting unit 600 , and a control unit 900 for controlling the primary inspection unit 700 and the secondary inspection unit 800 .

검사케이스(100)는 게이트(200) 및 배기부(500)가 폐쇄동작하면 내부공간이 외부와 차단되어, 내부공간에 공급되는 공정가스의 유실됨이 방지되면서 외부로부터 빛의 유입됨이 방지될 수 있다. In the inspection case 100, when the gate 200 and the exhaust unit 500 are closed, the internal space is blocked from the outside, thereby preventing the loss of the process gas supplied to the internal space and preventing the inflow of light from the outside. can

게이트(200)는 밸브에 의해 작동되어서 검사케이스(100)에 관통되게 형성된 개방구를 개폐한다. 즉, 게이트(200)가 개방되면 개방구를 통해 웨이퍼가 유입되거나 배출될 수 있다. The gate 200 is operated by a valve to open and close an opening formed to pass through the test case 100 . That is, when the gate 200 is opened, the wafer may be introduced or discharged through the opening.

여기서, 게이트(200)는 트랜스퍼 로봇을 감지하는 센서(미도시)에 의해 작동되도록 설정될 수도 있다. 즉, 웨이퍼(10)를 이송시키는 트랜스퍼 로봇이 게이트(200)에 접근하면 센서가 감지함에 따라 게이트(200)가 개방되고, 트랜스퍼 로봇이 게이트(200)에서 멀어지면 센서가 감지하지 못함에 따라 게이트(200)가 폐쇄된다. Here, the gate 200 may be set to be operated by a sensor (not shown) that detects the transfer robot. That is, when the transfer robot transferring the wafer 10 approaches the gate 200 , the gate 200 is opened as the sensor detects it, and when the transfer robot moves away from the gate 200 , the gate 200 is not detected as the sensor does not detect it. (200) is closed.

웨이퍼거치부(300)는 검사케이스(100)에 설치되면서 웨이퍼(10)가 위치되는 거치홈(311)이 형성되는 거치대(310)와, 거치대(310)의 거치홈(311)에 분산되게 형성되어 웨이퍼(10)를 지지하는 지지핀(320)을 포함한다. The wafer holder 300 is installed in the inspection case 100 while being dispersed in the holder 310 in which the holder groove 311 in which the wafer 10 is located is formed, and the holder groove 311 of the holder 310 . and a support pin 320 for supporting the wafer 10 .

따라서, 외부로부터 트랜스퍼 로봇에 의해 웨이퍼(10)가 게이트(200)를 통해 유입되어서 거치대(310)의 거치홈(311)에 위치되면 웨이퍼(10)의 하부가 지지핀(320)에 지지된다. 즉, 웨이퍼(10)는 지지핀(320)들에 의해 최소한으로 걸려서 거치된다. Accordingly, when the wafer 10 is introduced through the gate 200 by the transfer robot from the outside and is positioned in the mounting groove 311 of the holder 310 , the lower portion of the wafer 10 is supported by the support pins 320 . That is, the wafer 10 is mounted while being minimally caught by the support pins 320 .

공정가스분사부(400)는 검사케이스(100)를 관통되게 설치되는 메인가스관(410)과, 메인가스관(410)에서 양측으로 분기되는 분기관(420)과, 분기관(420)에 연결된 상태로 공정가스를 분사하는 분사노즐(430)을 포함한다. 여기서, 공정가스는 질소가스(N2 Gas)일 수 있다. The process gas injection unit 400 is connected to a main gas pipe 410 installed to pass through the inspection case 100 , a branch pipe 420 branching from the main gas pipe 410 to both sides, and the branch pipe 420 . It includes an injection nozzle 430 for injecting the furnace process gas. Here, the process gas may be nitrogen gas (N2 Gas).

분사노즐(430)는 샤프트형태로 형성되면서 공정가스가 분사되는 분사구가 일정간격으로 이격되게 형성될 수 있다. 분사구들에서 분사되는 공정가스가 웨이퍼(10)의 표면에 고르게 분사될 수 있다. The injection nozzle 430 may be formed in the form of a shaft, and injection holes through which the process gas is injected may be formed to be spaced apart from each other at regular intervals. The process gas injected from the injection holes may be uniformly injected onto the surface of the wafer 10 .

따라서, 분사노즐(430)들에서 분사되는 공정가스가 웨이퍼(10)의 양측으로 고르게 제공될 수 있다. 이와 같이, 분사되는 공정가스에 의해 웨이퍼(10)에서 발생될 수 있는 흄(Fume)이 제거될 수 있다. Accordingly, the process gas injected from the injection nozzles 430 may be uniformly provided to both sides of the wafer 10 . In this way, fumes that may be generated from the wafer 10 by the process gas injected may be removed.

이와 같이, 분사노즐(430)을 통해 분사되는 공정가스에 의해 웨이퍼(10)에 부착된 이물질이나 웨이퍼(10)에서 발생되는 흄이 제거되므로, 영상을 촬영하거나 이미지를 획득하여 웨이퍼(10)를 검사하는 과정에서 이물질이나 흄에 의한 오류가 발생됨을 미연에 방지할 뿐만 아니라 검사에 대한 신뢰성이 향상될 수 있다. In this way, foreign substances attached to the wafer 10 or fumes generated from the wafer 10 are removed by the process gas sprayed through the injection nozzle 430, so the wafer 10 is removed by photographing an image or acquiring an image. In the process of inspection, errors caused by foreign substances or fumes can be prevented in advance, and reliability of inspection can be improved.

배기부(500)는 밸브에 의해 작동되어서 검사케이스(100)에 관통되게 형성된 개방구를 개폐한다. 즉, 배기부(500)가 개방되면 개방구를 통해 공정가스가 외부로 배출될 수 있다. 이때, 이물질이 배기되는 공정가스와 함께 외부로 배출되어 제거될 수 있다. The exhaust unit 500 is operated by a valve to open and close an opening formed to pass through the test case 100 . That is, when the exhaust unit 500 is opened, the process gas may be discharged to the outside through the opening. In this case, the foreign material may be discharged and removed together with the exhausted process gas.

조명부(600)는 복수의 LED조명으로 구성되어, 웨이퍼거치부(300)의 상부에서 사방에 위치된 상태로 웨이퍼(10)의 상부에 빛을 조사하고, 웨이퍼거치부(300)의 하부에서 사방에 위치된 상태로 웨이퍼(10)의 하부에 빛을 조사한다. The lighting unit 600 is composed of a plurality of LED lights, irradiating light to the upper portion of the wafer 10 in a state located in all directions from the upper portion of the wafer holder 300 , and from the lower portion of the wafer holder 300 in all directions. Light is irradiated to the lower portion of the wafer 10 in a state positioned in the .

따라서, 웨이퍼(10)의 상부 및 하부에 사방에서 빛이 조사되므로 웨이퍼(10)의 표면에는 그림자가 형성되지 않는다. Accordingly, since light is irradiated from all directions to the upper and lower portions of the wafer 10 , a shadow is not formed on the surface of the wafer 10 .

1차검사부(700)는 복수의 비전 카메라로 구성되어, 웨이퍼거치부(300)의 상부 및 하부에 각각 위치된 상태로 웨이퍼(10)의 상부 및 하부를 촬영하고, 촬영된 영상을 제어부(900)로 전송한다. 또는, 라인스캐너로 구성될 수도 있다. The primary inspection unit 700 is composed of a plurality of vision cameras, photographing the upper and lower portions of the wafer 10 in a state respectively positioned at the upper and lower portions of the wafer holder 300 , and displaying the captured images to the controller 900 . ) is sent to Alternatively, it may be configured as a line scanner.

이와 같이, 1차검사부(700)인 복수의 비전 카메라가 웨이퍼(10)의 양면을 동시에 촬영하므로 촬영시간이 단축될 수 있다. As described above, since the plurality of vision cameras serving as the primary inspection unit 700 simultaneously photograph both surfaces of the wafer 10 , the photographing time can be shortened.

2차검사부(800)는 2차검사부(800)는 복수의 스캐너로 구성되어 웨이퍼(10)의 상부 및 하부에서 각각의 이미지를 획득하고, 획득된 이미지를 제어부(900)로 전송할 수 있다. The secondary inspection unit 800 may include a plurality of scanners to acquire respective images from the upper and lower portions of the wafer 10 , and transmit the obtained images to the controller 900 .

이러한, 2차검사부(800)는 웨이퍼거치부(300)의 상부에서 일측에 구비되는 상부구동부(810)와, 웨이퍼거치부(300)의 상부에서 타측에 구비되는 상부가이드(820)와, 상부구동부(810)의 구동에 의해 상부가이드(820)를 따라 이동하면서 웨이퍼(10)의 상부를 스캔하여 이미지를 획득하는 상부스캐너(830)와, 웨이퍼거치부(300)의 하부에서 일측에 구비되는 하부구동부(840)와, 웨이퍼거치부(300)의 하부에서 타측에 구비되는 하부가이드(850)와, 하부구동부(840)의 구동에 의해 하부가이드(850)를 따라 이동하면서 웨이퍼(10)의 하부를 스캔하여 이미지를 획득하는 하부스캐너(860)를 포함한다. The secondary inspection unit 800 includes an upper driving unit 810 provided on one side of the upper portion of the wafer holder 300 , an upper guide 820 provided on the other side on the upper side of the wafer holder 300 , and an upper portion of the second inspection unit 800 . An upper scanner 830 that acquires an image by scanning the upper portion of the wafer 10 while moving along the upper guide 820 by the driving of the driver 810, and the wafer holder 300 provided on one side under the lower portion The lower driver 840, the lower guide 850 provided on the other side in the lower part of the wafer holder 300, and the wafer 10 while moving along the lower guide 850 by driving the lower driver 840. It includes a lower scanner 860 that acquires an image by scanning the lower portion.

상부구동부(810) 및 하부구동부(840)는 각각 리니어모터로 구성되어 웨이퍼거치부(300)의 거치대(310) 상부 및 하부에 각각 구비된다. The upper driving unit 810 and the lower driving unit 840 are respectively configured as linear motors and are respectively provided on the upper and lower portions of the holder 310 of the wafer holder 300 .

상부가이드(820) 및 하부가이드(850)는 샤프트 및 상부스캐너(830) 및 하부스캐너(860)에 고정된 상태로 샤프트를 따라 이동되는 블록으로 이루어지면서, 웨이퍼거치부(300)의 거치대(310) 상부 및 하부에 각각 구비된다. The upper guide 820 and the lower guide 850 are formed of blocks moving along the shaft while being fixed to the shaft and the upper scanner 830 and the lower scanner 860, and the holder 310 of the wafer holder 300 ) are provided in the upper and lower parts, respectively.

여기서, 상부스캐너(830) 및 하부스캐너(860)는 플랫스캐너(Flat scanner)로 구성되어 웨이퍼(10)의 상부 및 하부에서 각각의 이미지를 획득하고, 획득된 이미지를 제어부(900)로 전송할 수 있다. 이때, 상부스캐너(830) 및 하부스캐너(860)에는 자제 조명이 구비되어 있어서 조명부(600)는 소등됨이 바람직하다. Here, the upper scanner 830 and the lower scanner 860 are configured as flat scanners to acquire respective images from the upper and lower portions of the wafer 10, and to transmit the obtained images to the controller 900. there is. At this time, the upper scanner 830 and the lower scanner 860 are provided with self-illumination, so that the lighting unit 600 is preferably turned off.

이와 같이, 상부스캐너(830) 및 하부스캐너(860)가 동시에 작동되므로 스캔시간이 최소로 단축될 수 있다. In this way, since the upper scanner 830 and the lower scanner 860 are simultaneously operated, the scan time can be shortened to a minimum.

제어부(900)는 게이트(200)를 작동시키는 게이트작동부(910)와, 공정가스분사부(400)를 작동시키는 공정가스작동부(920)와, 배기부(500)를 작동시키는 배기작동부(930)와, 조명부(600)를 작동시키는 조명작동부(940)와, 1차검사부(700)를 작동시키는 1차검사작동부(950)와, 2차검사부(800)를 작동시키는 2차검사작동부(960)와, 1차검사부(700)에 의해 웨이퍼(10)에서 획득되는 표면영상을 미리 설정된 기준표면영상과 비교하여 이상여부를 판단하는 1차판단부(970)와, 2차검사부(800)에 의해 웨이퍼(10)에서 획득되는 이미지를 미리 설정된 기준이미지에 비교하여 이상여부를 판단하는 2차판단부(980)와, 1차판단부(970)나 2차판단부(980)에서 이상으로 판단하면 경보신호를 발신하는 경보신호발신부(990)와, 웨이퍼(10)가 유입되도록 게이트작동부(910)를 조작하여 게이트(200)를 개방시키고, 웨이퍼(10)가 유입되면 게이트작동부(910)를 조작하여 게이트(200)를 폐쇄시키고, 웨이퍼(10)에 공정가스가 제공되도록 공정가스작동부(920)를 조작하여 공정가스분사부(400)를 작동시키고, 배기작동부(930)를 조작하여 배기부(500)를 개방시키고, 웨이퍼(10)에 빛이 조사되도록 조명작동부(940)를 조작하여 조명부(600)를 점등시키고, 웨이퍼(10)의 표면을 검사하도록 1차검사작동부(950)를 조작하여 1차검사부(700)를 작동시키고, 웨이퍼(10)를 정밀검사 하도록 조명작동부(940)를 조작하여 조명부(600)를 소등시키고, 2차검사작동부(960)를 조작하여 2차검사부(800)를 작동시키고, 웨이퍼(10)의 검사가 완료되면 공정가스 공급이 중지되도록 공정가스작동부(920)를 조작하여 공정가스분사부(400)를 정지시키고, 배기작동부(930)를 조작하여 배기부(500)를 폐쇄동작 시키고, 검사된 웨이퍼(10)가 배출되도록 게이트작동부(910)를 조작하여 게이트(200)를 개방시키는 조작부(1000)를 포함한다. The control unit 900 includes a gate operation unit 910 that operates the gate 200 , a process gas operation unit 920 that operates the process gas injection unit 400 , and an exhaust operation unit that operates the exhaust unit 500 . 930, a lighting operation unit 940 for operating the lighting unit 600, a primary inspection operation unit 950 for operating the primary inspection unit 700, and a secondary operation for operating the secondary inspection unit 800 The inspection operation unit 960, the first determination unit 970 for determining whether an abnormality by comparing the surface image obtained from the wafer 10 by the primary inspection unit 700 with a preset reference surface image, and the secondary A secondary determination unit 980 that determines whether an abnormality is found by comparing the image obtained from the wafer 10 by the inspection unit 800 with a preset reference image, and the first determination unit 970 or the second determination unit 980 . ), the gate 200 is opened by manipulating the alarm signal transmitting unit 990 for transmitting an alarm signal, and the gate operating unit 910 so that the wafer 10 is introduced, and the wafer 10 is introduced. When the gate operation unit 910 is operated to close the gate 200 , the process gas operation unit 920 is operated to provide the process gas to the wafer 10 to operate the process gas injection unit 400 , and exhaust Manipulate the operation unit 930 to open the exhaust unit 500 , operate the illumination operation unit 940 to illuminate the wafer 10 so that light is irradiated to the wafer 10 , to turn on the illumination unit 600 , and illuminate the surface of the wafer 10 . The primary inspection unit 700 is operated by operating the primary inspection operation unit 950 to inspect, and the illumination unit 600 is turned off by manipulating the illumination operation unit 940 to precisely inspect the wafer 10, and the second inspection unit 700 is operated. The second inspection unit 800 is operated by manipulating the inspection operation unit 960, and the process gas operation unit 920 is operated so that the supply of the process gas is stopped when the inspection of the wafer 10 is completed to operate the process gas injection unit 400 ), operates the exhaust operation unit 930 to close the exhaust unit 500, and operates the gate operation unit 910 to open the gate 200 so that the inspected wafer 10 is discharged. (1000).

1차판단부(970)는 웨이퍼(10)에 대한 기준표면영상을 구비하여 웨이퍼(10)에 대해 상하로 촬영되는 표면영상들에 비교될 수 있다. 2차검사부(800)는 웨이퍼(10)에 대한 기준이미지를 구비하여 웨이퍼(10)에 대해 상하로 획득되는 이미지들에 비교될 수 있다. 이러한, 표면영상 및 이미지를 검사하여 스크래치(Scratch) 및 치핑(Chipping)문제를 확인할 수 있다. The first determination unit 970 includes a reference surface image of the wafer 10 and may be compared to surface images photographed vertically with respect to the wafer 10 . The secondary inspection unit 800 includes a reference image of the wafer 10 and may be compared with images obtained vertically with respect to the wafer 10 . By examining these surface images and images, scratches and chipping problems can be identified.

경보신호발신부(990)는 경보신호에 의해 작동되어 빛으로 경보하는 경광등이나 경보신호에 의해 작동되어 소리로 경보하는 알람이 연결될 수 있다. The alarm signal transmitter 990 may be connected to a warning light operated by an alarm signal to alarm with light or an alarm operated by an alarm signal to alarm with sound.

이와 같이, 제어부(900)에 의해 웨이퍼(10)에 대한 1차로 검사가 이루어진 후에 2차로 검사가 이루어지므로 검사에 대한 신뢰성이 향상될 수 있다. As described above, since the second inspection is performed after the first inspection is performed on the wafer 10 by the controller 900 , the reliability of the inspection can be improved.

그리고, 조작부(1000)는 1차판단부(970)에서 이상으로 판단하면 2차검사부(800)를 작동시키도록 설정될 수 있다. 따라서, 웨이퍼(10)가 1차판단부(970)에서 이상으로 판단되면 2차검사부(800)가 연이어서 검사하므로 검사에 대한 신뢰도가 향상될 수 있다. In addition, the manipulation unit 1000 may be set to operate the secondary inspection unit 800 when the first determination unit 970 determines that there is an abnormality. Accordingly, when the wafer 10 is determined to be abnormal by the first determination unit 970 , the second inspection unit 800 continuously inspects the wafer 10 , thereby improving the reliability of the inspection.

또한, 제어부(900)는 1차판단부(970)나 2차판단부(980)에서 이상으로 판단하면 해당하는 표면영상이나 이미지에 마크를 표시하는 마크표시부(1100)와, 마크가 표시된 표면영상이나 이미지를 저장하여 관리하는 정보관리부(1200)를 포함한다. 따라서, 사용자는 정보관리부(1200)에서 관리되는 표면영상들나 이미지들에 표시된 마크가 어느 부위에 집중적으로 표시되었는지 확인하여 불량의 이유를 유추할 수 있다. In addition, if the control unit 900 determines that the first determination unit 970 or the second determination unit 980 is abnormal, the mark display unit 1100 for displaying a mark on the corresponding surface image or image, and the surface image on which the mark is displayed or an information management unit 1200 that stores and manages the image. Accordingly, the user can infer the reason for the defect by confirming on which part the marks displayed on the surface images or images managed by the information management unit 1200 are intensively displayed.

그리고, 본 발명은 웨이퍼거치부(300)의 상부에서 양측에 구비된 상태로 웨이퍼(10)의 위치를 검사하는 추가검사부(701)를 포함하고, 추가검사부(701)는 웨이퍼(10)를 촬영하는 카메라로 구성된다. And, the present invention includes an additional inspection unit 701 for inspecting the position of the wafer 10 in a state provided on both sides in the upper portion of the wafer holder 300, and the additional inspection unit 701 takes the wafer 10 It consists of a camera that

1차판단부(970)는 기준표면영상에 외곽프레임을 설정하고 추가검사부(701)에서 촬영되는 웨이퍼(10)에 대한 표면영상의 둘레가 설정된 기준표면영상의 외곽프레임을 벗어나는지 비교하여 판단하도록 설정될 수 있다. The first determination unit 970 sets the outer frame on the reference surface image and compares and determines whether the circumference of the surface image for the wafer 10 photographed by the additional inspection unit 701 is outside the outer frame of the set reference surface image. can be set.

경보신호발신부(990)는 1차판단부(970)에서 해당 웨이퍼(10)가 외곽프레임을 벗어나는 것으로 판단하면 경보하도록 설정될 수 있다. The warning signal transmitting unit 990 may be set to alarm when the first determination unit 970 determines that the wafer 10 is out of the outer frame.

따라서, 촬영되는 표면영상의 둘레가 기준표면영상의 외곽프레임을 벗어나면 웨이퍼(10)가 웨이퍼거치부(300)에서 정확한 위치에 거치되지 않은 것으로 판단할 수 있다. 이와 같이, 사용자는 웨이퍼(10)가 웨이퍼거치부(300)에서 정확한 위치에 거치되지 못하는 원인을 확인하여 웨이퍼거치부(300)를 점검 및 보수하거나 트랜스퍼 로봇을 조사하는 등의 조취를 취할 수 있다. Therefore, when the circumference of the surface image to be photographed is out of the outer frame of the reference surface image, it can be determined that the wafer 10 is not placed in the correct position in the wafer holder 300 . In this way, the user can check the cause of the wafer 10 not being mounted in the correct position in the wafer holder 300 and take measures such as checking and repairing the wafer holder 300 or examining the transfer robot. .

이에 더하여, 제어부(900)는 2차판단부(940)에서 이상으로 판단되면 1차검사부(700)에서 획득된 표면영상 및 2차검사부(800)에서 획득된 이미지를 외부로 전송하는 영상전송부(1300)를 포함한다. In addition, the control unit 900 is an image transmission unit ( 1300).

따라서, 외부의 센터에 구비된 서버로 웨이퍼(10)에 대한 표면영상 및 이미지가 전송되어서 저장되므로, 서버를 관리하는 관리자가 웨이퍼(10)의 이상을 원거리에서 확인할 수 있다. Therefore, since the surface image and image of the wafer 10 are transmitted and stored to the server provided in the external center, the administrator who manages the server can check the abnormality of the wafer 10 from a distance.

이와 같은, 본 발명은 웨이퍼의 앞면 및 뒷면을 촬영하고 촬영된 영상의 판독 및 검사에 따라 웨이퍼의 양쪽 표면에 발생가능한 문제를 사전에 발견하고, 웨이퍼에 공정가스를 분사하여 이물질이나 흄을 제거하여 웨이퍼에 대한 검사신뢰도가 향상될 있어서, 해당 분야에서 널리 사용될 수 있는 매우 유용한 발명이라 할 수 있다. As described above, the present invention photographed the front and back surfaces of the wafer, and found problems that could occur on both surfaces of the wafer in advance according to the reading and inspection of the captured images, and spraying process gas to the wafer to remove foreign substances or fumes. Since the inspection reliability of the wafer is improved, it can be said that it is a very useful invention that can be widely used in the field.

본 발명이 속하는 기술분야의 당업자는 본 발명이 그 기술적 사상이나 필수적 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예는 모든 면에서 예시적인 것이며 한정적인 것이 아닌 것으로서 이해되어야 하고, 본 발명의 범위는 상세한 설명보다는 후술하는 청구범위에 의하여 나타내어지며, 청구범위의 의의 및 범위 그리고 그 등가개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다. Those skilled in the art to which the present invention pertains will understand that the present invention may be embodied in other specific forms without changing the technical spirit or essential characteristics thereof. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the following claims rather than the detailed description, and the meaning and scope of the claims and their equivalents Any changes or modifications derived from it should be construed as being included in the scope of the present invention.

10 : 웨이퍼 100 : 검사케이스
200 : 게이트 300 : 웨이퍼거치부
310 : 거치대 311 : 거치홈
320 : 지지핀 400 : 공정가스분사부
410 : 메인가스관 420 : 분기관
430 : 분사노즐 500 : 배기부
600 : 조명부 700 : 1차검사부
800 : 2차검사부 810 : 상부구동부
820 : 상부가이드 830 : 상부스캐너
840 : 하부구동부 850 : 하부가이드
860 : 하부스캐너 900 : 제어부
910 : 게이트작동부 920 : 공정가스작동부
930 : 배기작동부 940 : 조명작동부
950 : 1차검사작동부 960 : 2차검사작동부
970 : 1차판단부 980 : 2차판단부
990 : 경보신호발신부 1000 : 조작부
1100 : 마크표시부 1200 : 정보관리부
1300 : 영상전송부10: wafer 100: inspection case
200: Gate 300: Wafer holder
310: holder 311: holder groove
320: support pin 400: process gas injection unit
410: main gas pipe 420: branch pipe
430: injection nozzle 500: exhaust
600: lighting unit 700: primary inspection unit
800: secondary inspection unit 810: upper driving unit
820: upper guide 830: upper scanner
840: lower driving part 850: lower guide
860: lower scanner 900: control unit
910: gate operation unit 920: process gas operation unit
930: exhaust operation unit 940: lighting operation unit
950: 1st inspection operation unit 960: 2nd inspection operation unit
970: 1st judgment part 980: 2nd judgment part
990: alarm signal transmitter 1000: operation unit
1100: mark display unit 1200: information management unit
1300: video transmission unit

Claims (8)

웨이퍼(10)가 수용되는 내부공간이 형성되는 검사케이스(100)와,
웨이퍼(10)가 출입되도록 검사케이스(100)의 일측에 구비된 상태로 내부공간을 개폐하는 게이트(200)와,
게이트(200)를 통해 유입되는 웨이퍼(10)가 거치되는 웨이퍼거치부(300)와,
웨이퍼거치부(300)에 거치된 웨이퍼(10)에 빛을 제공하는 조명부(600)와,
검사케이스(100)의 내부공간으로 이송된 웨이퍼(10)의 표면을 검사하는 1차검사부(700)와,
검사케이스(100)의 내부공간으로 이송된 웨이퍼(10)를 정밀검사하는 2차검사부(800)와,
게이트(200), 조명부(600), 1차검사부(700), 2차검사부(800)를 제어하는 제어부(900)를 포함하는 것을 특징으로 하는 웨이퍼 검사장치.
An inspection case 100 in which an inner space in which the wafer 10 is accommodated is formed;
A gate 200 that opens and closes the inner space in a state provided on one side of the inspection case 100 so that the wafer 10 enters and exits;
A wafer holder 300 on which the wafer 10 flowing in through the gate 200 is mounted;
An illumination unit 600 providing light to the wafer 10 mounted on the wafer holder 300;
A primary inspection unit 700 for inspecting the surface of the wafer 10 transferred to the inner space of the inspection case 100,
A secondary inspection unit 800 that closely inspects the wafer 10 transferred to the inner space of the inspection case 100, and
A wafer inspection apparatus comprising a control unit 900 for controlling the gate 200, the lighting unit 600, the primary inspection unit 700, and the secondary inspection unit 800.
 청구항 1에 있어서, 웨이퍼거치부(300)는
검사케이스(100)에 설치되면서 웨이퍼(10)가 위치되는 거치홈(311)이 형성되는 거치대(310)와,
거치대(310)의 거치홈(311)에 분산되게 형성되어 웨이퍼(10)를 지지하는 지지핀(320)을 포함하는 것을 특징으로 하는 웨이퍼 검사장치.
The method according to claim 1, The wafer holder 300
A holder 310 in which a holder groove 311 in which the wafer 10 is positioned is formed while being installed in the inspection case 100;
Wafer inspection apparatus, characterized in that it comprises a support pin (320) formed to be dispersed in the holder groove (311) of the holder (310) to support the wafer (10).
 청구항 1에 있어서,
웨이퍼거치부(300)에 거치된 웨이퍼(10)에 공정가스를 분사하는 공정가스분사부(400)와,
공정가스가 배기되도록 검사케이스(100)의 타측에 구비된 상태로 내부공간을 개폐하는 배기부(500)를 포함하고,
제어부(900)는 공정가스분사부(400) 및 배기부(500)를 제어하도록 설정되는 것을 특징으로 하는 웨이퍼 검사장치.
The method according to claim 1,
A process gas injection unit 400 that injects a process gas to the wafer 10 mounted on the wafer holder 300;
and an exhaust unit 500 that opens and closes the inner space in a state provided on the other side of the inspection case 100 so that the process gas is exhausted,
The control unit 900 is a wafer inspection apparatus, characterized in that it is set to control the process gas injection unit 400 and the exhaust unit (500).
 청구항 1에 있어서, 2차검사부(800)는
웨이퍼거치부(300)의 상부에서 일측에 구비되는 상부구동부(810)와,
웨이퍼거치부(300)의 상부에서 타측에 구비되는 상부가이드(820)와,
상부구동부(810)의 구동에 의해 상부가이드(820)를 따라 이동하면서 웨이퍼(10)의 상부를 스캔하여 이미지를 획득하는 상부스캐너(830)와,
웨이퍼거치부(300)의 하부에서 일측에 구비되는 하부구동부(840)와,
웨이퍼거치부(300)의 하부에서 타측에 구비되는 하부가이드(850)와,
하부구동부(840)의 구동에 의해 하부가이드(850)를 따라 이동하면서 웨이퍼(10)의 하부를 스캔하여 이미지를 획득하는 하부스캐너(860)를 포함하는 것을 특징으로 하는 웨이퍼 검사장치.
The method according to claim 1, The secondary inspection unit (800)
An upper driving unit 810 provided on one side of the upper portion of the wafer holder 300, and
An upper guide 820 provided on the other side in the upper portion of the wafer holder 300, and
An upper scanner 830 that scans the upper portion of the wafer 10 while moving along the upper guide 820 by driving the upper driver 810 to obtain an image;
A lower driving unit 840 provided on one side of the lower portion of the wafer holder 300, and
A lower guide 850 provided on the other side in the lower portion of the wafer holder 300, and
Wafer inspection apparatus comprising: a lower scanner (860) for acquiring an image by scanning the lower portion of the wafer (10) while moving along the lower guide (850) by driving the lower driver (840).
 청구항 1에 있어서,
1차검사부(700)는 복수의 비전 카메라로 구성되어, 웨이퍼거치부(300)의 상부 및 하부에 각각 위치된 상태로 웨이퍼(10)의 상부 및 하부를 촬영하고, 촬영된 영상을 제어부(900)로 전송하고,
2차검사부(800)는 2차검사부(800)는 복수의 스캐너로 구성되어 웨이퍼(10)의 상부 및 하부에서 각각의 이미지를 획득하고, 획득된 이미지를 제어부(900)로 전송하고,
제어부(900)는
게이트(200)를 작동시키는 게이트작동부(910)와,
공정가스분사부(400)를 작동시키는 공정가스작동부(920)와,
배기부(500)를 작동시키는 배기작동부(930)와,
조명부(600)를 작동시키는 조명작동부(940)와,
1차검사부(700)를 작동시키는 1차검사작동부(950)와,
2차검사부(800)를 작동시키는 2차검사작동부(960)와,
1차검사부(700)에 의해 웨이퍼(10)에서 획득되는 표면영상을 미리 설정된 기준표면영상과 비교하여 이상여부를 판단하는 1차판단부(970)와,
2차검사부(800)에 의해 웨이퍼(10)에서 획득되는 이미지를 미리 설정된 기준이미지에 비교하여 이상여부를 판단하는 2차판단부(980)와,
1차판단부(970)나 2차판단부(980)에서 이상으로 판단하면 경보신호를 발신하는 경보신호발신부(990)와,
웨이퍼(10)가 유입되도록 게이트작동부(910)를 조작하여 게이트(200)를 개방시키고, 웨이퍼(10)가 유입되면 게이트작동부(910)를 조작하여 게이트(200)를 폐쇄시키고, 웨이퍼(10)에 공정가스가 제공되도록 공정가스작동부(920)를 조작하여 공정가스분사부(400)를 작동시키고, 배기작동부(930)를 조작하여 배기부(500)를 개방시키고, 웨이퍼(10)에 빛이 조사되도록 조명작동부(940)를 조작하여 조명부(600)를 점등시키고, 웨이퍼(10)의 표면을 검사하도록 1차검사작동부(950)를 조작하여 1차검사부(700)를 작동시키고, 웨이퍼(10)를 정밀검사 하도록 조명작동부(940)를 조작하여 조명부(600)를 소등시키고, 2차검사작동부(960)를 조작하여 2차검사부(800)를 작동시키고, 웨이퍼(10)의 검사가 완료되면 공정가스 공급이 중지되도록 공정가스작동부(920)를 조작하여 공정가스분사부(400)를 정지시키고, 배기작동부(930)를 조작하여 배기부(500)를 폐쇄동작 시키고, 검사된 웨이퍼(10)가 배출되도록 게이트작동부(910)를 조작하여 게이트(200)를 개방시키는 조작부(1000)를 포함하는 것을 특징으로 하는 웨이퍼 검사장치.
The method according to claim 1,
The primary inspection unit 700 is composed of a plurality of vision cameras, photographing the upper and lower portions of the wafer 10 in a state respectively positioned at the upper and lower portions of the wafer holder 300 , and displaying the captured images to the controller 900 . ) to send
Secondary inspection unit 800, secondary inspection unit 800 is composed of a plurality of scanners to acquire respective images from the upper and lower portions of the wafer 10, and transmit the obtained images to the controller 900,
The control unit 900 is
A gate operation unit 910 for operating the gate 200, and
A process gas operation unit 920 for operating the process gas injection unit 400, and
an exhaust operation unit 930 for operating the exhaust unit 500;
A lighting operation unit 940 for operating the lighting unit 600, and
A primary inspection operation unit 950 for operating the primary inspection unit 700, and
and a secondary inspection operation unit 960 for operating the secondary inspection unit 800;
A first determination unit 970 for determining whether there is an abnormality by comparing the surface image obtained from the wafer 10 by the primary inspection unit 700 with a preset reference surface image;
A secondary determination unit 980 for determining whether there is an abnormality by comparing the image obtained from the wafer 10 by the secondary inspection unit 800 with a preset reference image;
An alarm signal transmitting unit 990 that transmits an alarm signal when the first determination unit 970 or the second determination unit 980 determines that there is an abnormality;
The gate 200 is opened by manipulating the gate operating unit 910 to allow the wafer 10 to flow in, and when the wafer 10 is introduced, the gate operating unit 910 is operated to close the gate 200, and the wafer ( 10) to operate the process gas operation unit 920 to provide the process gas to the process gas injection unit 400, operate the exhaust operation unit 930 to open the exhaust unit 500, and to open the wafer 10 ) to illuminate the lighting unit 600 by manipulating the lighting operation unit 940 to irradiate light to the Operate the lighting operation unit 940 to turn off the lighting unit 600 to precisely inspect the wafer 10, operate the secondary inspection operation unit 960 to operate the secondary inspection unit 800, and operate the wafer When the inspection of (10) is completed, the process gas operation unit 920 is operated to stop the process gas supply to stop the process gas injection unit 400, and the exhaust unit 500 is operated by operating the exhaust operation unit 930. Wafer inspection apparatus, comprising: a control unit 1000 to open the gate 200 by operating the gate operating unit 910 to close the wafer 10 and to discharge the inspected wafer 10.
 청구항 5에 있어서, 1차판단부(970)에서 이상으로 판단하면 2차검사부(800)를 작동시키도록 설정되는 것을 특징으로 하는 웨이퍼 검사장치.
The wafer inspection apparatus according to claim 5, wherein the secondary inspection unit (800) is set to operate when the primary determination unit (970) determines that there is an abnormality.
 청구항 5에 있어서, 웨이퍼거치부(300)의 상부에서 양측에 구비된 상태로 웨이퍼(10)의 위치를 검사하는 추가검사부(701)를 포함하고,
추가검사부(701)는 웨이퍼(10)를 촬영하는 카메라로 구성되고,
1차판단부(970)는 기준표면영상에 외곽프레임을 설정하고 추가검사부(701)에서 촬영되는 웨이퍼(10)에 대한 표면영상의 둘레가 설정된 기준표면영상의 외곽프레임을 벗어나는지 비교하여 판단하도록 설정될 수 있고,
경보신호발신부(990)는 1차판단부(970)에서 해당 웨이퍼(10)가 외곽프레임을 벗어나는 것으로 판단하면 경보하도록 설정될 수 있는 것을 특징으로 하는 웨이퍼 검사장치.
The method according to claim 5, comprising an additional inspection unit 701 for inspecting the position of the wafer 10 in a state provided on both sides in the upper portion of the wafer holder 300,
The additional inspection unit 701 is composed of a camera for photographing the wafer 10,
The first determination unit 970 sets the outer frame on the reference surface image and compares and determines whether the circumference of the surface image for the wafer 10 photographed by the additional inspection unit 701 is outside the outer frame of the set reference surface image. can be set,
The warning signal transmitting unit 990 may be set to alarm when the first determination unit 970 determines that the wafer 10 is out of the outer frame.
 청구항 5에 있어서, 제어부(900)는
1차판단부(970)나 2차판단부(980)에서 이상으로 판단하면 해당하는 표면영상이나 이미지에 마크를 표시하는 마크표시부(1100)와,
마크가 표시된 표면영상이나 이미지를 저장하여 관리하는 정보관리부(1200)를 포함하는 것을 특징으로 하는 웨이퍼 검사장치. The method according to claim 5, The control unit 900 is
A mark display unit 1100 for displaying a mark on the corresponding surface image or image when it is judged as abnormal in the first determination unit 970 or the second determination unit 980;
A wafer inspection apparatus comprising an information management unit 1200 that stores and manages a surface image or image on which a mark is displayed.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100662960B1 (en) * 2005-12-27 2006-12-28 동부일렉트로닉스 주식회사 Cooling module of track coater for semiconductor manufacturing and particle detecting method
KR101015807B1 (en) * 2008-04-08 2011-02-22 한국영상기술(주) Apparatus for inspecting surface and method for inspecting surface
KR20110087069A (en) * 2010-01-25 2011-08-02 주식회사 엘지실트론 Wafer surface inspection apparatus in capable of inspecting both sides of wafer simultaneously
KR20190013464A (en) * 2017-07-31 2019-02-11 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Automated inspection tool
KR20190140202A (en) * 2018-06-11 2019-12-19 세메스 주식회사 Camera posture estimation method and substrate treating apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100662960B1 (en) * 2005-12-27 2006-12-28 동부일렉트로닉스 주식회사 Cooling module of track coater for semiconductor manufacturing and particle detecting method
KR101015807B1 (en) * 2008-04-08 2011-02-22 한국영상기술(주) Apparatus for inspecting surface and method for inspecting surface
KR20110087069A (en) * 2010-01-25 2011-08-02 주식회사 엘지실트론 Wafer surface inspection apparatus in capable of inspecting both sides of wafer simultaneously
KR20190013464A (en) * 2017-07-31 2019-02-11 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Automated inspection tool
KR20190140202A (en) * 2018-06-11 2019-12-19 세메스 주식회사 Camera posture estimation method and substrate treating apparatus

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