KR20220053029A - 현상 후 이미지에 기초하여 패턴의 결함이 있음을 결정하는 방법 - Google Patents

현상 후 이미지에 기초하여 패턴의 결함이 있음을 결정하는 방법 Download PDF

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Publication number
KR20220053029A
KR20220053029A KR1020227011188A KR20227011188A KR20220053029A KR 20220053029 A KR20220053029 A KR 20220053029A KR 1020227011188 A KR1020227011188 A KR 1020227011188A KR 20227011188 A KR20227011188 A KR 20227011188A KR 20220053029 A KR20220053029 A KR 20220053029A
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KR
South Korea
Prior art keywords
adi
feature
image
features
model
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KR1020227011188A
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English (en)
Korean (ko)
Inventor
말린 쿠이만
맥심 피사렌코
아브라함 슬라츠터
마크 존 매슬로우
베르나르도 안드레스 오야르준 리베라
빔 티보 텔
루벤 코르넬리스 마스
Original Assignee
에이에스엠엘 네델란즈 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from EP19195527.7A external-priority patent/EP3789826A1/fr
Application filed by 에이에스엠엘 네델란즈 비.브이. filed Critical 에이에스엠엘 네델란즈 비.브이.
Publication of KR20220053029A publication Critical patent/KR20220053029A/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
KR1020227011188A 2019-09-05 2020-09-03 현상 후 이미지에 기초하여 패턴의 결함이 있음을 결정하는 방법 KR20220053029A (ko)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
EP19195527.7A EP3789826A1 (fr) 2019-09-05 2019-09-05 Procédé de détermination de défectuosité de motif basée sur une image post-développement
EP19195527.7 2019-09-05
EP19196323.0 2019-09-10
EP19196323 2019-09-10
EP19218296.2 2019-12-19
EP19218296 2019-12-19
EP20169181.3 2020-04-10
EP20169181 2020-04-10
EP20176236.6 2020-05-25
EP20176236 2020-05-25
EP20189952.3 2020-08-06
EP20189952 2020-08-06
EP20192283.8 2020-08-21
EP20192283 2020-08-21
PCT/EP2020/074663 WO2021043936A1 (fr) 2019-09-05 2020-09-03 Procédé de détermination de la défectuosité d'un motif sur la base d'une image post-développement

Publications (1)

Publication Number Publication Date
KR20220053029A true KR20220053029A (ko) 2022-04-28

Family

ID=72340367

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227011188A KR20220053029A (ko) 2019-09-05 2020-09-03 현상 후 이미지에 기초하여 패턴의 결함이 있음을 결정하는 방법

Country Status (5)

Country Link
KR (1) KR20220053029A (fr)
CN (1) CN114556228A (fr)
IL (1) IL290778A (fr)
TW (2) TWI780476B (fr)
WO (1) WO2021043936A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116342983A (zh) * 2023-05-29 2023-06-27 全芯智造技术有限公司 生成及使用图刻模型的方法、电子设备和计算机可读介质
CN117213696A (zh) * 2023-11-07 2023-12-12 南京易信同控制设备科技有限公司 基于压力敏感芯体的多通道压力扫描阀及其压力检测方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023524095A (ja) * 2020-04-30 2023-06-08 フォトロニクス・インコーポレイテッド フォトマスクを製造するシステム、方法、及びプログラム製品
US20220128899A1 (en) * 2020-10-22 2022-04-28 D2S, Inc. Methods and systems to determine shapes for semiconductor or flat panel display fabrication
EP4152096A1 (fr) * 2021-09-15 2023-03-22 ASML Netherlands B.V. Système et procédé d'inspection par classification et identification des mécanismes de défaillance dans un système à particules chargées
CN115967609B (zh) * 2021-10-11 2024-05-24 中国移动通信集团山东有限公司 内容分发网络故障检测方法和设备
CN114975153A (zh) * 2022-05-31 2022-08-30 长鑫存储技术有限公司 半导体结构缺陷监测方法、装置、计算机设备和存储介质
CN114771120B (zh) * 2022-06-18 2022-09-02 南通人民彩印有限公司 微接触印刷过程压力控制方法、装置及人工智能系统
US20240087135A1 (en) * 2022-09-09 2024-03-14 Applied Materials, Inc. Clog detection via image analytics
TWI833471B (zh) * 2022-11-29 2024-02-21 孟申機械工廠股份有限公司 瑕疵檢測方法及其裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6782337B2 (en) * 2000-09-20 2004-08-24 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension an a presence of defects on a specimen
US7587704B2 (en) 2005-09-09 2009-09-08 Brion Technologies, Inc. System and method for mask verification using an individual mask error model
NL1036189A1 (nl) 2007-12-05 2009-06-08 Brion Tech Inc Methods and System for Lithography Process Window Simulation.
WO2018125219A1 (fr) * 2016-12-30 2018-07-05 Intel Corporation Systèmes, procédés et appareils de mise en œuvre d'apprentissage machine basé sur un noyau géométrique permettant de réduire une erreur de modèle d'opc
US10474042B2 (en) * 2017-03-22 2019-11-12 Kla-Tencor Corporation Stochastically-aware metrology and fabrication
US11086229B2 (en) * 2017-05-05 2021-08-10 Asml Netherlands B.V. Method to predict yield of a device manufacturing process
CN107728589B (zh) * 2017-09-25 2019-11-15 华南理工大学 一种柔性ic基板蚀刻显影工艺过程的在线监控方法
KR102644214B1 (ko) * 2018-02-23 2024-03-07 에이에스엠엘 네델란즈 비.브이. 컴퓨테이션 리소그래피를 위한 머신 러닝 모델을 트레이닝시키기 위한 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116342983A (zh) * 2023-05-29 2023-06-27 全芯智造技术有限公司 生成及使用图刻模型的方法、电子设备和计算机可读介质
CN117213696A (zh) * 2023-11-07 2023-12-12 南京易信同控制设备科技有限公司 基于压力敏感芯体的多通道压力扫描阀及其压力检测方法

Also Published As

Publication number Publication date
WO2021043936A1 (fr) 2021-03-11
TW202117576A (zh) 2021-05-01
TW202303433A (zh) 2023-01-16
IL290778A (en) 2022-04-01
CN114556228A (zh) 2022-05-27
TWI780476B (zh) 2022-10-11

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