KR20220051389A - Self-diagnosis method and test device of test device - Google Patents

Abstract

The self-diagnosis method of the inspection device 80 according to the present disclosure includes a step of arranging, a step of irradiating, a step of receiving light, and a step of determining an abnormality in the amount of light. In the arranging step, the holding unit 400 is provided with a diagnosis unit 700 having an attenuation member 720 for attenuating light as a holding unit holding the outer periphery of the polymerized substrate T by moving the holding unit 400, so that the light is applied to the polymerized substrate T. A damping member is disposed between the lighting units 610 and 620 for irradiating light and the imaging units 51 and 520 for imaging the polymerization substrate. In the irradiating step, after the arranging step, light is irradiated with a set light amount from the lighting unit. In the step of receiving light, after the step of irradiating, the light irradiated from the illumination unit and transmitted through the attenuation member is received using the imaging unit. In the step of determining the abnormality of the light amount, after the light receiving step, based on the received amount of the light received by the imaging unit, the abnormality of the light quantity of the light irradiated from the lighting unit is determined.

Description

Self-diagnosis method and test device of test device

The present disclosure relates to a self-diagnosis method of a test apparatus and a test apparatus.

DESCRIPTION OF RELATED ART A bonding system provided with the bonding apparatus which forms a polymeric substrate by bonding substrates, such as a semiconductor wafer, and the inspection apparatus which test|inspects the polymeric substrate formed by this bonding apparatus is known (refer patent document 1).

Japanese Patent Laid-Open No. 2011-187716

The present disclosure provides a technique capable of facilitating maintenance of measurement accuracy of an inspection apparatus.

A self-diagnostic method of an inspection apparatus according to an aspect of the present disclosure is a self-diagnosis method of an inspection apparatus that inspects a polymer substrate to which a first substrate and a second substrate are bonded, comprising: arranging; irradiating; It includes a process and the process of determining abnormality in the amount of light. In the disposing step, the holding unit for holding the outer periphery of the polymerized substrate is disposed on one of the upper and lower sides of the holding unit and held by the holding unit by moving the holding unit provided with a diagnostic unit having a damping member for attenuating light. The attenuation member is disposed between the illumination unit irradiating light to the light source and the imaging unit disposed at a position opposite to the illumination unit in the other of the upper and lower sides of the holding unit and capturing an image of the polymer substrate held in the holding unit. In the irradiating step, after the arranging step, light is irradiated with a set light amount from the lighting unit. In the step of receiving light, after the step of irradiating, the light irradiated from the illumination unit and transmitted through the attenuation member is received using the imaging unit. In the step of determining the abnormality of the light amount, after the light receiving step, based on the received amount of the light received by the imaging unit, the abnormality of the light quantity of the light irradiated from the lighting unit is determined.

According to the present disclosure, it is possible to easily maintain the measurement accuracy of the inspection apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the structure of the bonding system which concerns on embodiment.
It is a schematic diagram which shows the state before bonding of the 1st board|substrate and 2nd board|substrate which concern on embodiment.
It is a schematic diagram which shows the structure of the bonding apparatus which concerns on embodiment.
It is a schematic diagram which shows the structure of the inspection apparatus which concerns on embodiment.
It is a schematic diagram which shows the structure of the holding part of the inspection apparatus which concerns on embodiment.
It is a figure which shows an example of the imaging method of a measurement mark.
It is a figure which shows an example of a measurement mark.
8 is a diagram showing a configuration of a damping member according to an embodiment.
It is a figure which shows an example of the correction mark formed in the damping member.
10 is a block diagram showing the configuration of a control device according to an embodiment.
11 is a flowchart showing an example of a sequence of processing performed by the bonding system until the polymerization substrate is formed by the bonding apparatus.
12 is a flowchart showing an example of the procedure of the light amount check processing.
13 is a flowchart showing an example of the procedure of the optical axis check processing.

Hereinafter, a form (hereinafter, referred to as an 'embodiment') for implementing the self-diagnosis method and the test apparatus of the test apparatus according to the present disclosure will be described in detail with reference to the drawings. In addition, the self-diagnosis method and test apparatus of the test apparatus which concern on this indication are not limited by this embodiment. In addition, each embodiment can be combined suitably in the range which does not contradict a process content. In addition, in each following embodiment, the same code|symbol is attached|subjected to the same site|part, and overlapping description is abbreviate|omitted.

In addition, in the embodiments shown below, expressions such as 'constant', 'orthogonal', 'vertical' or 'parallel' may be used in some cases, but these expressions are strictly 'constant', 'orthogonal', 'vertical' ' or 'parallel'. That is, it is assumed that each of the above expressions allows errors such as manufacturing precision and installation precision, for example.

In addition, in each drawing referenced below, in order to make the description easy to understand, the X-axis direction, the Y-axis direction, and the Z-axis direction orthogonal to each other are defined, and a Cartesian coordinate system in which the positive Z-axis direction is a vertically upward direction is sometimes indicated. In addition, the rotation direction which makes the vertical axis|shaft as a rotation center is called the θ direction in some cases.

<Configuration of junction system>

First, the structure of the bonding system which concerns on embodiment is demonstrated with reference to FIG.1 and FIG.2. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the structure of the bonding system which concerns on embodiment. Moreover, FIG. 2 is a schematic diagram which shows the state before bonding of the 1st board|substrate and 2nd board|substrate which concern on embodiment.

In the bonding system 1 shown in FIG. 1 , the polymerization substrate T is formed by bonding the first substrate W1 and the second substrate W2 (see FIG. 2 ).

The first substrate W1 and the second substrate W2 are substrates in which a plurality of electronic circuits are formed on a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, for example. The first substrate W1 and the second substrate W2 have approximately the same diameter. Further, one of the first substrate W1 and the second substrate W2 may be, for example, a substrate on which no electronic circuit is formed.

Hereinafter, as shown in FIG. 2 , among the plate surfaces of the first substrate W1 , the plate surface on the side to be bonded to the second substrate W2 is described as a 'bonding surface W1j', and the bonding surface W1j and describes the plate surface on the opposite side as 'non-bonding surface (W1n)'. In addition, among the plate surfaces of the second substrate W2, the plate surface on the side bonded to the first substrate W1 is described as a 'bonding surface W2j', and the plate surface on the opposite side to the bonding surface W2j is 'non-bonding' side (W2n)'.

As shown in FIG. 1 , the bonding system 1 includes a carry-in/out station 2 , a processing station 3 , and an inspection station 4 . The carry-in/out station 2 is disposed on the X-axis negative direction side of the processing station 3 , and is integrally connected with the processing station 3 . In addition, the inspection station 4 is disposed on the X-axis positive direction side of the processing station 3 , and is integrally connected with the processing station 3 .

The carry-in/out station 2 includes a mounting table 10 and a carrying area 20 . The mounting table 10 includes a plurality of mounting plates 11 . Cassettes C1 to C4 for accommodating a plurality of (for example, 25) substrates in a horizontal state are respectively disposed on each of the placement plates 11 . The cassette C1 can accommodate a plurality of first substrates W1, the cassette C2 can accommodate a plurality of second substrates W2, and the cassette C3 includes a plurality of polymerized substrates T ) is acceptable. The cassette C4 is, for example, a cassette for recovering a defective substrate. In addition, the number of cassettes C1 - C4 arrange|positioned on the arrangement plate 11 is not limited to what was shown in figure.

The conveyance area|region 20 is arrange|positioned adjacent to the X-axis positive direction side of the mounting table 10. As shown in FIG. In the conveyance area 20 , a conveyance path 21 extending in the Y-axis direction and a conveyance apparatus 22 movable along the conveyance path 21 are provided. The conveying device 22 is movable not only in the Y-axis direction but also in the X-axis direction, and can be turned around the Z-axis. The transfer device 22 includes a first substrate W1 between the cassettes C1 to C4 disposed on the placement plate 11 and a third processing block G3 of a processing station 3 to be described later; The second substrate W2 and the polymerization substrate T are transported.

The processing station 3 is provided with, for example, three processing blocks G1 , G2 , G3 . The first processing block G1 is disposed on the back side of the processing station 3 (the Y-axis positive side in FIG. 1 ). Further, the second processing block G2 is disposed on the front side (the negative Y-axis direction side in FIG. 1 ) of the processing station 3 , and the third processing block G3 is carried in and out of the processing station 3 . It is arranged on the station 2 side (X-axis negative direction side in FIG. 1).

In the first processing block G1 , a surface modification device 30 for modifying the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 is disposed. The surface modification apparatus 30 cuts the bond of SiO ₂ in the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 to form single bond SiO, thereby becoming hydrophilic thereafter. The bonding surfaces W1j and W2j are modified to make it easier.

Specifically, in the surface modifying apparatus 30 , for example, in a reduced pressure atmosphere, oxygen gas or nitrogen gas, which is a processing gas, is excited to be plasmaized and ionized. Then, when these oxygen ions or nitrogen ions are irradiated to the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2, the bonding surfaces W1j and W2j are plasma-treated and modified.

Further, in the first processing block G1 , a surface hydrophilization device 40 is disposed. The surface hydrophilization device 40 hydrophilizes the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 with, for example, pure water, and further heats the bonding surfaces W1j and W2j. Clean up. Specifically, the surface hydrophilization device 40 rotates the first substrate W1 or the second substrate W2 held by the spin chuck, for example, while the first substrate W1 or the second substrate W2 is rotated. ) to supply pure water. Thereby, the pure water supplied on the first substrate W1 or the second substrate W2 diffuses on the bonding surfaces W1j and W2j of the first substrate W1 or the second substrate W2, and the bonding surface (W1j, W2j) becomes hydrophilic.

Here, an example is shown in which the surface modifying device 30 and the surface hydrophilizing device 40 are arranged in a horizontal arrangement, but the surface hydrophilizing device 40 may be laminated above the surface modifying device 30 . .

The bonding apparatus 41 is arrange|positioned in the 2nd process block G2. The bonding apparatus 41 bonds the first and second substrates W1 and W2 that have been hydrophilized by intermolecular force. The structure of such a bonding apparatus 41 is mentioned later.

In a region surrounded by the first processing block G1 , the second processing block G2 , and the third processing block G3 , a transfer region 60 is formed. In the conveyance area 60, the conveyance apparatus 61 is arrange|positioned. The conveying apparatus 61 has a conveying arm which is movable about a vertical direction, a horizontal direction, and a vertical axis, for example. Such a transfer device 61 moves within the transfer region 60 , and moves within the first processing block G1 , the second processing block G2 , and the third processing block G3 adjacent to the transfer region 60 . The first substrate W1 , the second substrate W2 , and the polymerization substrate T are transported by a predetermined apparatus.

The inspection station 4 is provided with an inspection device 80 . The inspection apparatus 80 inspects the polymerized substrate T formed by the bonding apparatus 41 .

The bonding system 1 also includes a control device 70 . The control device 70 controls the operation of the bonding system 1 . The configuration of the control device 70 will be described later.

<Configuration of bonding device>

Next, the structure of the bonding apparatus 41 is demonstrated with reference to FIG. 3 : is a schematic diagram which shows the structure of the bonding apparatus 41 which concerns on embodiment.

As shown in FIG. 3 , the bonding apparatus 41 includes a first holding part 140 , a second holding part 141 , and a striker 190 .

The first holding part 140 has a body part 170 . The main body 170 is supported by the support member 180 . A through hole 176 passing through the support member 180 and the body 170 in a vertical direction is formed in the support member 180 and the body part 170 . The position of the through hole 176 corresponds to the central portion of the first substrate W1 adsorbed and held by the first holding unit 140 . A push pin 191 of the striker 190 is inserted through the through hole 176 .

The striker 190 is disposed on the upper surface of the support member 180 , and includes a push pin 191 , an actuator unit 192 , and a linear mechanism 193 . The pressing pin 191 is a member of a column shape extending along the vertical direction, and is supported by the actuator unit 192 .

The actuator unit 192 generates a constant pressure in a predetermined direction (here, vertically downward) by air supplied from, for example, an electro-pneumatic regulator (not shown). The actuator unit 192 may contact the central portion of the first substrate W1 by air supplied from the pneumatic regulator and control the pressing load applied to the central portion of the first substrate W1 . Moreover, the front-end|tip part of the actuator part 192 penetrates the through-hole 176 with the air from an electro-pneumatic regulator, and it becomes possible to raise/lower in a vertical direction.

The actuator unit 192 is supported by the linear mechanism 193 . The linear mechanism 193 moves the actuator part 192 along the vertical direction by the drive part which built-in a motor, for example.

The striker 190 controls the movement of the actuator unit 192 by the linear mechanism 193 , and controls the pressing load of the first substrate W1 by the pressing pin 191 by the actuator unit 192 . . Thereby, the striker 190 presses the center of the 1st board|substrate W1 adsorbed and held by the 1st holding part 140, and makes it contact the 2nd board|substrate W2.

A plurality of pins 171 are provided on the lower surface of the main body 170 to contact the upper surface (non-bonding surface W1n) of the first substrate W1 . The plurality of pins 171 have, for example, a diameter of 0.1 mm to 1 mm and a height of several tens of μm to several hundreds of μm. The plurality of pins 171 are equally arranged at an interval of, for example, 2 mm.

The first holding unit 140 includes a plurality of adsorption units for adsorbing the first substrate W1 in a part of the regions in which the plurality of fins 171 are provided. Specifically, on the lower surface of the main body 170 of the first holding unit 140 , a plurality of outer suction units 301 and a plurality of inner suction units 302 for evacuating and adsorbing the first substrate W1 are provided. ) is provided. The plurality of outer suction units 301 and the plurality of inner suction units 302 have circular arc-shaped suction regions in plan view. The plurality of outer suction units 301 and the plurality of inner suction units 302 have the same height as the fins 171 .

The plurality of outer suction parts 301 are disposed on the outer periphery of the main body 170 . The plurality of outer suction units 301 are connected to a suction device (not shown) such as a vacuum pump, and suck the outer peripheral portion of the first substrate W1 by evacuation.

The plurality of inner suction parts 302 are arranged in a line along the circumferential direction in the radial direction inward of the main body 170 rather than the plurality of outer suction parts 301 . The plurality of inner suction units 302 are connected to a suction device (not shown) such as a vacuum pump, and suck a region between the outer peripheral portion and the central portion of the first substrate W1 by evacuation.

The second holding unit 141 will be described. The second holding part 141 has the body part 200 having the same diameter as the second substrate W2 or a larger diameter than the second substrate W2 . Here, the second holding part 141 having a larger diameter than that of the second substrate W2 is shown. The upper surface of the main body 200 is a surface opposite to the lower surface (non-bonding surface W2n) of the second substrate W2.

A plurality of pins 201 are provided on the upper surface of the main body 200 to contact the lower surface (non-bonding surface Wn2) of the second substrate W2. The plurality of pins 201 have, for example, a diameter of 0.1 mm to 1 mm and a height of several tens of micrometers to several hundreds of micrometers. The plurality of pins 201 are equally arranged at intervals of 2 mm, for example.

Further, on the upper surface of the main body 200 , a lower rib 202 is provided on the outside of the plurality of pins 201 in an annular shape. The lower rib 202 is formed in an annular shape and supports the outer periphery of the second substrate W2 over the entire circumference.

In addition, the main body 200 has a plurality of lower suction ports 203 . The plurality of lower suction ports 203 are provided in a plurality of suction regions surrounded by the lower ribs 202 . The plurality of lower suction ports 203 are connected to a suction device (not shown) such as a vacuum pump via a suction pipe (not shown).

The second holding unit 141 depressurizes the adsorption area by evacuating the adsorption area surrounded by the lower rib 202 from the plurality of lower suction ports 203 . Thereby, the 2nd board|substrate W2 arrange|positioned in the adsorption|suction area|region is adsorbed-held by the 2nd holding part 141.

Since the lower rib 202 supports the outer periphery of the lower surface of the second substrate W2 over the entire circumference, the second substrate W2 is properly evacuated to the outer periphery. Thereby, the entire surface of the second substrate W2 can be adsorbed and held. In addition, since the lower surface of the second substrate W2 is supported by the plurality of fins 201 , when the evacuation of the second substrate W2 is released, the second substrate W2 holds the second holding part 141 . ) is easy to fall from.

In addition, although illustration is abbreviate|omitted here, the bonding apparatus 41 is equipped with a transition, an inversion mechanism, a position adjustment mechanism, etc. in the front stage of the 1st holding part 140 or the 2nd holding part 141 etc. shown in FIG. do. In the transition, the first substrate W1 , the second substrate W2 , and the polymerization substrate T are temporarily arranged. The position adjustment mechanism adjusts the horizontal direction of the first substrate W1 and the second substrate W2. The inversion mechanism reverses the front and back of the 1st board|substrate W1.

<Configuration of inspection device>

Next, the structure of an inspection apparatus is demonstrated with reference to FIG.4 and FIG.5. It is a schematic diagram which shows the structure of the inspection apparatus which concerns on embodiment. Moreover, FIG. 5 is a schematic diagram which shows the structure of the holding part of the inspection apparatus which concerns on embodiment. In addition, FIG. 4 is the schematic diagram which looked at the test|inspection apparatus from the side, and FIG. 5 is the schematic diagram which looked at the holding part of the test|inspection apparatus from upper direction.

As shown in FIG. 4 , the inspection device 80 includes a holding unit 400 , an imaging unit 500 , and an illumination unit 600 . In addition, as shown in FIG. 5 , the test apparatus 80 includes a diagnostic unit 700 .

4 and 5 , the holding unit 400 holds the polymerization substrate T horizontally. The holding unit 400 includes a main body 410 and a plurality of supporting members 420 .

The body portion 410 is a flat-panel frame-shaped member having an opening 411 having a larger diameter than that of the polymerization substrate T. The main body 410 is connected to the moving mechanism 440 , and by the moving mechanism 440 , movement in the horizontal direction (X-axis direction and Y-axis direction) and rotation about the vertical axis are possible.

The plurality of support members 420 are provided in the body portion 410 to extend toward the center of the opening 411 . The outer peripheral portion of the polymeric substrate T is supported by the tip ends of the plurality of supporting members 420 . The distal ends of the plurality of support members 420 are connected to a suction device 480 such as a vacuum pump via a suction pipe 460 , and the outer peripheral portion of the lower surface of the polymerized substrate T is sucked by evacuation.

The imaging unit 500 includes a macro imaging unit 510 , a micro imaging unit 520 , a fixing unit 530 , and a lifting mechanism 540 .

The macro imaging unit 510 and the micro imaging unit 520 are disposed above the holding unit 400 . The macro imaging unit 510 includes a camera lens 511 for macro imaging and an imaging device 512 such as a CCD image sensor or CMOS image sensor. The micro imaging unit 520 includes a camera lens 521 for micro imaging and an imaging device 522 such as a CCD image sensor or a CMOS image sensor. The magnification of the camera lens 511 included in the macro imaging unit 510 is, for example, 10 times. In addition, the magnification of the camera lens 521 with which the micro imaging part 520 is equipped is 50 times, for example.

The macro imaging unit 510 and the micro imaging unit 520 are fixed to the fixing unit 530 in a state in which the camera lenses 511 and 521 are directed vertically downward. The fixing part 530 is connected to the raising/lowering mechanism 540, and moves along the vertical direction by the raising/lowering mechanism 540 (elevating/lowering). The imaging unit 500 can adjust the distance between the macro imaging unit 510 and the micro imaging unit 520 and the polymerization substrate T by raising and lowering the fixing part 530 using the elevation mechanism 540 . .

The lighting unit 600 includes a macro lighting unit 610 , a micro lighting unit 620 , a fixing unit 630 , and a lifting mechanism 640 .

The macro lighting unit 610 and the micro lighting unit 620 are disposed below the holding unit 400 . Specifically, the macro lighting unit 610 is disposed at a position facing the macro imaging unit 510 with the polymerization substrate T held by the holding unit 400 interposed therebetween. In addition, the micro-illumination unit 620 is disposed at a position facing the micro-imaging unit 520 with the polymer substrate T held by the holding unit 400 interposed therebetween.

The macro lighting unit 610 includes a light source 611 and a light collecting unit 612 . The light source 611 irradiates, for example, near-infrared light of 1000 to 1200 nm. The condensing unit 612 is, for example, a condensing lens, and converges the light emitted from the light source 611 to one point. The micro lighting unit 620 has the same configuration as the macro lighting unit 610 . That is, the micro illumination unit 620 includes a light source 621 and a light collecting unit 622 , and these structures are the same as the light source 611 and the light collecting unit 612 provided in the macro illumination unit 610 .

In addition, the light sources 611 and 621 may be arranged outside the macro lighting unit 610 and the micro lighting unit 620 . In this case, the light sources 611 and 621 may supply light to the inside of the macro illumination unit 610 and the micro illumination unit 620 via an optical fiber or the like.

The macro illumination unit 610 and the micro illumination unit 620 are fixed to the fixing unit 630 in a state in which the optical axis is oriented in the vertical direction. The fixing part 630 is connected to the raising/lowering mechanism 640, and moves (raise|lifts/lower) along the vertical direction by the raising/lowering mechanism 640. The lighting unit 600 may adjust the distance between the macro lighting unit 610 and the micro lighting unit 620 and the polymerization substrate T by raising and lowering the fixing unit 630 using the lifting mechanism 640 .

The inspection apparatus 80 uses the micro-imaging part 520 and the micro-illumination part 620 to image the measurement marks respectively formed in the 1st board|substrate W1 and the 2nd board|substrate W2. It is a figure which shows an example of the imaging method of a measurement mark. 7 is a figure which shows an example of a measurement mark. In addition, the macro imaging part 510 and the macro illumination part 610 are used for the process of specifying the place of a measurement mark, This point is mentioned later.

As shown in FIG. 6 , the micro-illumination unit 620 is fixed to the fixing unit 630 (refer to FIG. 4 ) so that the optical axis Ax of the light emitted from the light source 621 faces in the vertical direction. In addition, the micro imaging unit 520 includes a fixing unit 530 ( 4) is fixed. Incidentally, here, an example is shown in which the imaging unit 500 is disposed above the polymerized substrate T and the lighting unit 600 is disposed below the polymerized substrate T. The illumination unit 600 may be arranged above, and the imaging unit 500 may be arranged below the polymerization substrate T.

The distance between the micro-capturing unit 520 and the micro-illuminating unit 620 is, for example, a distance between the focus of the camera lens 521 and the focus of the light collecting unit 622 by a prior adjustment operation by a human hand. is set The inspection device 80 interlocks the elevating mechanism 540 and the elevating mechanism 640 to maintain a distance at which the focus of the camera lens 521 and the focus of the condensing unit 622 coincide with the micro-imaging unit ( 520) and the micro-illumination unit 620 are raised and lowered.

The inspection apparatus 80 integrally raises and lowers the micro imaging unit 520 and the micro illumination unit 620 using the fixing unit 530 and the lifting mechanism 540, thereby forming a measurement mark ( The focus of the camera lens 521 and the light collecting unit 622 is positioned at M1 and M2. And the inspection apparatus 80 images measurement marks M1 and M2. Specifically, the light irradiated vertically upward from the micro-illumination unit 620 reaches the imaging device 522 of the micro-imaging unit 520 via the second substrate W2 and the first substrate W1 . That is, the micro-imaging unit 520 images the measurement marks M1 and M2 by the transmitted light passing through the polymerization substrate T. As shown in FIG. The image data captured by the micro-imaging unit 520 is output to the control device 70 .

As shown in FIG. 7, the image of the measurement mark M1 formed in the 1st board|substrate W1, and the measurement mark M2 formed in the 2nd board|substrate W2 is contained in image data. The control device 70 performs image recognition processing such as edge detection on the image data, so that the coordinates of the center points G1 and G2 of the measurement marks M1 and M2, the deviation amount of the center points G1 and G2, etc. A measurement result is obtained, and the bonding state of the polymeric substrate T is inspected based on the obtained measurement result.

However, when the amount of light emitted from the light source 621 of the micro-illumination unit 620 changes, the thickness of the outline of the measurement mark M1 or the measurement mark M2 included in the image data changes, and is detected by edge detection There is a possibility that the position of the used edge may change. In this case, there is a possibility that the measurement results such as the coordinates of the center points G1 and G2 or the deviation amount of the center points G1 and G2 may be misaligned. For this reason, in order to maintain the measurement precision of the inspection apparatus 80, it is preferable that the light quantity of the light emitted from the light source 621 of the micro-illumination part 620 is always constant.

However, the light source 621 included in the micro-illumination unit 620 gradually deteriorates as it is used, and with this, the amount of light actually obtained becomes lower than the set amount of light. That is, the amount of light of the light source 621 included in the micro-illumination unit 620 changes (decreases) with use.

Moreover, even when the optical axis of the micro-illumination part 620 shifts|deviates from the vertical direction, there exists a possibility that a shift|offset|difference may arise in the measurement result of the inspection apparatus 80. As shown in FIG.

Therefore, in the bonding system 1, the diagnostic part 700 is provided in the test|inspection apparatus 80, and the light quantity check and the optical axis check of the micro-illumination part 620 were decided using this diagnostic part 700.

As shown in FIG. 5 , the diagnosis unit 700 includes a mounting unit 710 provided in the main body 410 of the holding unit 400 and extending toward the center of the opening 411 , and the mounting unit 710 . It has a damping member 720 mounted to the distal end. The mounting part 710 is disposed between two adjacent support members 420 . The mounting portion 710 is shorter than the support member 420 , and the damping member 720 is disposed at a position exposed from the polymeric substrate T supported by the plurality of support members 420 in a plan view. Thereby, the inspection apparatus 80 can perform the light quantity check and the optical axis check using the diagnostic unit 700 even when the polymer substrate T is held by the holding unit 400 .

8 is a diagram showing the configuration of the damping member 720 according to the embodiment. Moreover, FIG. 9 is a figure which shows an example of the correction mark formed in the damping|damping member 720. As shown in FIG.

As shown in FIG. 8 , the damping member 720 includes a glass plate 721 and a plurality (here, two) silicon plates 722 . The glass plate 721 and the two silicon plates 722 are laminated in the order of the silicon plate 722 , the glass plate 721 , and the silicon plate 722 from the bottom.

The light amount check is performed by receiving the light irradiated from the light source 621 and passing through the attenuation member 720 by the micro-imaging unit 520 and checking the light amount of the received light. The amount of light of the light source 621 is set to a relatively high value in order to transmit the polymerization substrate T. For this reason, when the light emitted from the light source 621 is directly imaged by the micro-imaging part 520 at the time of a light quantity check, there exists a possibility that an appropriate image may not be obtained because the light quantity is too strong. Accordingly, in the inspection apparatus 80 , the light emitted from the light source 621 is attenuated by using the silicon plate 722 , in the same manner as the polymerization substrate T . Thereby, the light amount check can be performed appropriately. Further, the damping member 720 may include at least one silicon plate 722 .

The inspection apparatus 80 may perform a light quantity check whenever a predetermined time (for example, 24 o'clock every day) arrives. In addition, the inspection apparatus 80 may perform a light quantity check every time the number of processed sheets or the number of processed lots of the polymeric substrate T reaches a predetermined number. In addition, the inspection apparatus 80 may perform a light quantity check at predetermined time intervals (for example, every 12 hours). As described above, since the inspection device 80 can check the amount of light even when the polymer substrate T is held by the holding unit 400 , the amount of light can be periodically checked regardless of the presence or absence of the polymer substrate T. It is easy to do a check.

A correction mark M3 is formed on the glass plate 721 . The correction mark M3 is formed on the glass plate 721 by, for example, vapor deposition. By forming the correction mark M3 on the glass plate 721 in this way, for example, the damping member 720 can be formed at a lower cost compared to the case where the correction mark M3 is formed on the silicon plate 722 . there is. In addition, the damping member 720 is not necessarily provided with the glass plate 721, and the correction mark M3 formed in the silicon plate 722 may be sufficient.

As shown in FIG. 9, the correction mark M3 contains 1st square M3a and 2nd square M3b, for example. The first square M3a and the second square M3b have a square frame shape having a uniform thickness. The second square M3b is smaller than the first square M3a and is disposed inside the first square M3a. In addition, the position of the center G3a of the first square M3a coincides with the position of the center G3b of the second square M3b.

The optical axis check is calculated based on the image data captured by the micro imaging unit 520, the coordinates of the center G3a of the first square M3a and the coordinates of the center G3b of the second square M3b This is done by checking the degree of deviation from . That is, for example, when the optical axis of the micro-illumination unit 620 is inclined, the thickness of the frames of the first square M3a and the second square M3b included in the image data becomes non-uniform, so that the center G3a, G3b coordinates do not match. The inspection apparatus 80 can determine the presence or absence of the inclination of an optical axis by checking the shift|offset|difference of this coordinate of center G3a, G3b.

While the decrease in the amount of light due to deterioration of the light source 621 occurs over time, the deviation of the optical axis occurs suddenly in many cases, for example, when a person comes into contact during maintenance. For this reason, the inspection apparatus 80 may reduce the execution frequency of an optical axis check compared with the execution frequency of a light quantity check. For example, the inspection apparatus 80 may be made to perform an optical axis check once every time a light quantity check is performed a plurality of times. In addition, the inspection apparatus 80 may be made to perform an optical axis check at the time of power-up.

<Configuration of control device>

Next, the configuration of the control device 70 will be described with reference to FIG. 10 . 10 is a block diagram showing the configuration of the control device 70 according to the embodiment. In addition, in FIG. 10, the structure concerning the inspection apparatus 80 is shown among the structures with which the control apparatus 70 is equipped.

As shown in FIG. 10 , the control device 70 includes a control unit 71 and a storage unit 72 . The control unit 71 includes a measurement control unit 71a and a diagnostic control unit 71b. Further, the storage unit 72 stores the light amount initial information 72a.

In addition, the control device 70 is, for example, a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a HDD (Hard Disk Drive), a computer having an input/output port, and various circuits. includes

The CPU of the computer functions as the measurement control unit 71a and the diagnostic control unit 71b of the control unit 71 by, for example, reading and executing a program stored in the ROM. In addition, at least one or all of the measurement control unit 71a and the diagnostic control unit 71b may be configured with hardware such as an ASIC (Application Specific Integrated Circuit), GPU (Graphics Processing Unit), FPGA (Field Programmable Gate Array), etc. .

Further, the storage unit 72 corresponds to, for example, RAM and HDD. The RAM and HDD can store light amount initial information 72a. In addition, the control device 70 may acquire the above-mentioned program and various information via another computer or portable recording medium connected by a wired or wireless network.

(About the measurement control unit)

The measurement control unit 71a sets a plurality of (eg, 5 to 13 points) measurement points on the plate surface of the polymerization substrate T, and sends the inspection apparatus 80 to the polymerization substrate T at each measurement point. to make measurements of

Specifically, in the inspection device 80 , first, the loading process of the polymerized substrate T is performed. The polymerized substrate T is conveyed into the inspection apparatus 80 by the conveying apparatus 61 (refer to FIG. 1 ). The inspection device 80 receives the polymerized substrate T from the transport device 61 using a lifter (not shown), moves the lifter, and places the polymerized substrate T on the plurality of support members 420 . do. Thereafter, the suction device 480 evacuates the polymerization substrate T via the suction pipe 460 , so that the polymerization substrate T is adsorbed and held by the holding unit 400 .

Next, in the inspection apparatus 80, the (theta) alignment process is performed. The θ alignment process is a process for adjusting the position of the polymerization substrate T in the rotational direction. Specifically, the inspection device 80 uses a macro imaging unit to detect a plurality of reference points present on the polymerization substrate T (for example, a reference point located in the center of the polymerization substrate T and a reference point located next to it). The image is captured by 510 . Then, the inspection apparatus 80 calculates the rotation angle of the polymerization substrate T from the obtained image, and rotates the polymerization substrate T using the moving mechanism 440 so that the rotation angle becomes 0 degrees. This reference point is, for example, when a pattern is formed by exposure processing on the first substrate W1 or the second substrate W2, the first substrate W1 or the second substrate W1 or the second substrate together with the pattern for each shot. It is formed on (W2). That is, the inspection apparatus 80 rotates the polymerization substrate T so that the arrangement direction of the patterns for each shot is always the same.

Next, in the inspection apparatus 80, a measurement process is performed. Specifically, the inspection apparatus 80 horizontally moves the holding unit 400 using the moving mechanism 440 to position the micro imaging unit 520 and the micro illumination unit 620 on the vertical line of the first measurement point. make it Thereafter, the inspection device 80 performs focus alignment of the micro-imaging unit 520 or a position correction of the holding unit 400 , and then uses the micro-imaging unit 520 and the micro-illuminating unit 620 for the first time. The measurement marks M1 and M2 located at the measurement points of are imaged.

The inspection device 80 performs the same processing for the remaining measurement points. That is, the test|inspection apparatus 80 repeats the above-mentioned process by the number of measurement points.

The measurement control unit 71a acquires image data as a measurement result from the inspection device 80 . Then, the measurement control unit 71a derives, based on the acquired image data, an inspection result including the amount of shift between the first substrate W1 and the second substrate W2 in the polymerized substrate T. Specifically, the measurement control unit 71a analyzes the image data, and at each measurement point, the X coordinate (x1) and Y coordinate (y1) of the measurement mark M1, and the X coordinate (x2) of the measurement mark M2 ) and calculates the Y coordinate (y2). Moreover, the measurement control part 71a calculates the deviation amount Δx of the X coordinate of the measurement marks M1 and M2 and the amount of deviation Δy of the Y coordinate of the measurement marks M1 and M2. Then, the measurement control unit 71a substitutes the calculation results (x1, y1, x2, y2, Δx, Δy) of the first number of measurement points (in this case, only 5 points) into the calculation model prepared in advance.

The calculation model, for example, calculates the shift amount of the first substrate W1 with respect to the second substrate W2 around the shift in the X-axis direction (X shift), the shift in the Y-axis direction (Y shift), and the vertical axis. It is decomposed into each component of shift in the rotational direction (rotate) and shift (scaling) due to expansion and contraction. The measurement control part 71a acquires the test result for each said component using this calculation model, and makes the memory|storage part 72 store the acquired test result.

(About the diagnostic control unit)

The diagnostic control unit 71b controls the operation of the light quantity check and the optical axis check according to the inspection device 80 .

The light amount initial information 72a stored in the storage unit 72 is used in the light amount check. The initial light amount information 72a includes the set light amount of the light source 621 included in the micro-illumination unit 620, and the light emitted from the light source 621 with this set light amount through the attenuation member 720 through the micro imaging unit ( 520) is information indicating a relationship with the amount of light received when light is received. The set light amount is a command value of the light amount output to the light source 621 . For example, it is assumed that the set light amount '100' of the light source 621 and the light amount '80' received by the micro-imaging unit 520 are related to the light amount initial information 72a.

The light amount initial information 72a is information indicating an initial relationship between the set light amount of the light source 621 and the light received amount in the micro-imaging unit 520 before deterioration of the light source 621 occurs, for example, It is created when the system 1 is started up or used for the first time. When the light source 621 is deteriorated due to use, even if a command is issued to the light source 621 to emit light with a set light amount of '100', the actual amount of light, that is, the amount of light received by the micro imaging unit 520 is '80 ' will be lower than

In addition, the specific procedure of a light quantity check process and an optical axis check process is mentioned later using FIG.12 and FIG.13.

<Specific operation of the junction system>

Next, the specific operation|movement of the bonding system 1 is demonstrated. First, the processing procedure until the polymerization substrate T is formed by the bonding apparatus 41 will be described with reference to FIG. 11 . 11 is a flowchart showing an example of a sequence of processing performed by the bonding system 1 until the polymerization substrate T is formed by the bonding apparatus 41 . Various processes shown in FIG. 11 are executed based on control by the control device 70 .

First, a cassette C1 accommodating a plurality of first substrates W1, a cassette C2 accommodating a plurality of second substrates W2, and an empty cassette C3 are carried in/out station 2 is arranged on a predetermined arrangement plate 11 of Thereafter, the first substrate W1 in the cassette C1 is taken out by the transfer device 22 and transferred to the transition device disposed in the third processing block G3 .

Next, the first substrate W1 is transferred to the surface modification apparatus 30 of the first processing block G1 by the transfer apparatus 61 . In the surface modifying apparatus 30 , in a predetermined reduced pressure atmosphere, oxygen gas, which is a processing gas, is excited to be plasma-formed and ionized. This oxygen ion is irradiated to the bonding surface of the first substrate W1, and the bonding surface is plasma-treated. Thereby, the bonding surface of the first substrate W1 is modified (step S101).

Next, the first substrate W1 is transferred to the surface hydrophilization apparatus 40 of the second processing block G1 by the transfer apparatus 61 . In the surface hydrophilization apparatus 40 , pure water is supplied onto the first substrate W1 while rotating the first substrate W1 held by the spin chuck. Thereby, the bonding surface of the 1st board|substrate W1 becomes hydrophilic. Further, the bonding surface of the first substrate W1 is cleaned with the pure water (step S102).

Next, the 1st board|substrate W1 is conveyed by the conveying apparatus 61 to the bonding apparatus 41 of the 2nd process block G2. The 1st board|substrate W1 carried in into the bonding apparatus 41 is conveyed to a position adjustment mechanism via a transition, and the horizontal direction is adjusted by the position adjustment mechanism (step S103).

Thereafter, the first substrate W1 is transferred from the position adjustment mechanism to the inversion mechanism, and the front and back surfaces of the first substrate W1 are inverted by the inversion mechanism (step S104). Specifically, the bonding surface W1j of the first substrate W1 faces downward.

Thereafter, the first substrate W1 is transferred from the inversion mechanism to the first holding unit 140 . The first substrate W1 is adsorbed and held by the first holding unit 140 with the notch facing in a predetermined direction (step S105).

In overlap with the processing of steps S101 to S105 for the first substrate W1, the processing of the second substrate W2 is performed. First, the second substrate W2 in the cassette C2 is taken out by the transfer device 22 and transferred to the transition device disposed in the third processing block G3.

Next, the second substrate W2 is transferred to the surface modification apparatus 30 by the transfer apparatus 61 , and the bonding surface W2j of the second substrate W2 is modified (step S106 ). Thereafter, the second substrate W2 is transported to the surface hydrophilization device 40 by the transport device 61 , so that the bonding surface W2j of the second substrate W2 becomes hydrophilic and the bonding surface is is cleaned (step S107).

Thereafter, the second substrate W2 is transferred to the bonding apparatus 41 by the transfer apparatus 61 . The 2nd board|substrate W2 carried in by the bonding apparatus 41 is conveyed by a position adjustment mechanism via a transition. Then, the horizontal direction of the second substrate W2 is adjusted by the position adjustment mechanism (step S108).

Then, the 2nd board|substrate W2 is conveyed to the 2nd holding|maintenance part 141, and is adsorbed-held by the 2nd holding|maintenance part 141 in the state which made the notch part facing a predetermined direction (step S109).

Next, the horizontal position adjustment of the first substrate W1 held by the first holding unit 140 and the second substrate W2 held by the second holding unit 141 is performed (step S110 ). ).

Next, the vertical position of the first substrate W1 held by the first holding unit 140 and the second substrate W2 held by the second holding unit 141 is adjusted (step S111 ). . Specifically, the first moving unit 160 moves the second holding unit 141 vertically upward, thereby bringing the second substrate W2 closer to the first substrate W1 .

Next, after releasing the adsorption and holding of the first substrate W1 by the plurality of inner suction units 302 (step S112), by lowering the push pin 191 of the striker 190, the first substrate ( Press the center of W1) (step S113).

When the central portion of the first substrate W1 is in contact with the central portion of the second substrate W2, the central portion of the first substrate W1 and the central portion of the second substrate W2 are pressed by the striker 190 with a predetermined force, Bonding is started between the central portion of the pressed first substrate W1 and the central portion of the second substrate W2 . That is, since the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 are modified in steps S101 and S109, respectively, first, the bonding surfaces W1j and W2j ), a van der Waals force (intermolecular force) is generated, and the bonding surfaces W1j and W2j are joined to each other. In addition, since the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 are hydrophilized in steps S102 and S110, respectively, the bonding surfaces W1j and W2j Hydrophilic groups of the liver bond with each other, and the bonding surfaces W1j and W2j are strongly bonded to each other. In this way, a junction region is formed.

Thereafter, between the first substrate W1 and the second substrate W2 , a bonding wave is generated in which the bonding area expands from the center of the first substrate W1 and the second substrate W2 toward the outer periphery. do. Thereafter, the adsorption and holding of the first substrate W1 by the plurality of outside adsorption units 301 is released (step S114). Thereby, the outer peripheral part of the 1st board|substrate W1 which was adsorbed and held by the outer side adsorption|suction part 301 falls. As a result, the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 contact over the entire surface, thereby forming the polymerized substrate T.

Thereafter, the push pin 191 is raised to the first holding part 140 to release the adsorption holding of the second substrate W2 by the second holding part 141 . Thereafter, the polymerized substrate T is carried out from the bonding apparatus 41 by the transfer apparatus 61 . In this way, a series of bonding processing is completed.

Next, the procedure of the light quantity check process in the inspection apparatus 80 is demonstrated with reference to FIG. 12 is a flowchart showing an example of the procedure of the light amount check processing. In addition, although the processing procedure in the case of performing light quantity check of the micro illumination part 620 is shown here as an example, the light quantity check of the macro illumination part 610 may be performed in the same processing procedure. The light amount check processing is performed under control by the diagnostic control unit 71b.

As shown in FIG. 12 , in the inspection device 80 , first, the moving mechanism 440 (refer to FIG. 4 ) moves the diagnostic unit 700 , so that the damping member 720 of the diagnostic unit 700 is connected to the micro-illumination unit. It is placed above the 620 (below the micro imaging unit 520) (step S201).

Next, in the inspection apparatus 80 , after focus adjustment of the micro-imaging unit 520 , etc. are performed, the light source 621 of the micro-illumination unit 620 is made to emit light with a set light amount (step S202 ). The light emitted from the light source 621 passes through the attenuation member 720 and is received by the imaging element 522 of the micro imaging unit 520 .

Next, the diagnostic control unit 71b calculates, based on the image data captured by the micro-imaging unit 520, the amount of light received by the micro-imaging unit 520 (hereinafter referred to as “measured light reception amount”) ( step (S203)). Further, the diagnostic control unit 71b calculates a difference between the calculated measured received light amount and the received light amount included in the light amount initial information 72a (hereinafter referred to as “initial received light amount”) (step S204). Then, the diagnostic control unit 71b determines whether or not the difference between the measured light reception amount and the initial light reception amount is less than a threshold value (hereinafter referred to as a “light amount threshold value”) (step S205).

In step S205, if the difference between the measured received light amount and the initial received light amount is equal to or greater than the light amount threshold (step S205, No), that is, when the light amount of the light source 621 is not normal, the diagnostic control unit 71b is It is determined whether the mode of is the automatic adjustment mode (step S206). When it is determined in step S206 that it is in the automatic adjustment mode (step S206, Yes), the diagnostic control unit 71b changes the set light amount of the light source 621 (step S207). Specifically, the diagnostic control unit 71b increases the set light amount of the light source 621 . For example, the diagnostic control unit 71b may increase the set light amount by the difference between the measured light reception amount and the initial light reception amount. In addition, the diagnostic control unit 71b may increase the set light amount by a predetermined amount. When the processing of step S206 is finished, the diagnostic control unit 71b returns to step S202 and causes the light source 621 to emit light with the set light amount after the change.

On the other hand, in step S206, when it is not in the automatic adjustment mode (step S206, No), the diagnosis control part 71b performs a notification process (step S208). For example, the diagnosis control part 71b may transmit the information to the effect that the light quantity of the light source 621 is falling with respect to the host apparatus connected to the bonding system 1 via a network as a notification process. In addition, the diagnostic control part 71b may operate the alarm apparatus (alarm, a lamp, etc.) not shown provided in the bonding system 1 as a notification process.

When the processing of step S208 is finished, or when the difference between the measured received light amount and the initial received light amount is less than the light amount threshold (step S205, Yes), that is, when the light amount of the light source 621 is normal in step S205 In this case, the diagnostic control unit 71b ends the light amount check processing.

Next, the procedure of the optical axis check process in the inspection apparatus 80 is demonstrated with reference to FIG. 13 is a flowchart showing an example of the procedure of the optical axis check processing.

As shown in FIG. 13 , in the inspection device 80 , first, the moving mechanism 440 (refer to FIG. 4 ) moves the diagnostic unit 700 so that the damping member 720 of the diagnostic unit 700 is connected to the micro-illumination unit. It is placed above the 620 (below the micro imaging unit 520) (step S301).

Next, in the inspection apparatus 80, after focusing or the like of the micro-imaging unit 520 is performed, the light source 621 of the micro-illuminating unit 620 is made to emit light with a set light amount (step S302). And in the inspection apparatus 80, the micro-imaging part 520 images the calibration mark M3 formed in the damping member 720 (step S303).

Next, the diagnostic control unit 71b controls the distance between the center G3a of the first blind spot M3a and the center G3b of the second blind spot M3b based on the image data captured by the micro imaging unit 520 . is calculated as a mark measurement value (step S304). Further, the diagnostic control unit 71b calculates a difference between the calculated mark measurement value and the normal value (hereinafter referred to as a 'Ref value') of the distance between the centers G3a and G3b (step S305). Further, in the present embodiment, the case where the Ref value is 0, that is, the case where the centers G3a and G3b coincide with each other has been described as an example, but the Ref value is not necessarily 0.

Next, the diagnosis control unit 71b determines whether the difference between the mark measurement value and the Ref value is less than a threshold value (hereinafter referred to as “optical axis threshold value”) (step S306). In this process, when the difference between the mark measurement value and the Ref value is not less than the optical axis threshold (step S306, No), the diagnostic control unit 71b performs a notification process (step S307). For example, the diagnostic control part 71b may transmit information to the effect that the optical axis of the light source 621 inclines with respect to the host apparatus connected to the bonding system 1 via a network as a notification process. In addition, the diagnostic control part 71b may operate the alarm apparatus (alarm, a lamp, etc.) not shown provided in the bonding system 1 as a notification process.

When the processing of step S307 is finished, or when the difference between the mark measurement value and the Ref value is less than the optical axis threshold in step S306 (step S306, Yes), the diagnostic control unit 71b controls the optical axis Check processing is finished.

As described above, the self-diagnosis method of the inspection apparatus (eg, inspection apparatus 80 ) according to the embodiment includes a first substrate (eg, first substrate W1 ) and a second substrate (eg, second substrate). A self-diagnostic method of an inspection apparatus for inspecting a polymer substrate (eg, polymer substrate T) to which two substrates W2) are bonded, a process for arranging, a process for irradiating, a process for receiving light, and abnormality of light quantity It includes the process of judging. In the disposing step, a holding unit for holding the outer periphery of the polymerized substrate, the holding unit provided with a diagnosis unit (eg, the diagnosis unit 700 ) having an attenuation member (eg, attenuation member 720 ) for attenuating light By moving (as an example, the holding unit 400), an illumination unit (eg, a macro illumination unit 610 or a micro illumination unit disposed at one of the upper and lower sides of the holding unit and irradiating light to the polymer substrate held by the holding unit) 620) and an imaging unit (eg, a macro imaging unit 510 or a micro imaging unit disposed at a position opposite to the lighting unit in the other of the upper and lower sides of the holding unit and capturing an image of the polymer substrate held by the holding unit) 520), a damping member is disposed. The irradiating process irradiates light with the set light quantity from the illumination part after the arrange|positioning process. In the step of receiving light, after the step of irradiating, the light irradiated from the illumination unit and transmitted through the attenuation member is received using the imaging unit. In the step of determining the abnormality in the amount of light, after the step of receiving light, based on the received amount of the light received by the imaging unit, the abnormality in the amount of light irradiated from the lighting unit is determined.

According to the self-diagnosis method of the inspection apparatus according to the embodiment, it is possible to easily check the amount of light in the lighting unit by using the diagnostic unit built in the inspection apparatus. Accordingly, it is possible to facilitate the maintenance of the measurement accuracy of the inspection apparatus.

In the step of determining the abnormality of the light amount, an initial received amount (for example, the initial light amount included in the initial light amount information 72a) stored in advance as the received amount of light irradiated from the illumination unit at a set light amount, transmitted through the attenuation member and received by the imaging unit ) and the amount of light received by the imaging unit (eg, measured light reception amount) in the step of imaging, and when the difference is equal to or greater than the light amount threshold, it may be determined that the amount of light emitted from the illumination unit is abnormal. Thereby, the deterioration accompanying use of the light source of an illumination part can be discovered easily.

The self-diagnosis method of the inspection apparatus according to the embodiment may further include a step of changing the set light amount when it is determined that the light amount of the light irradiated from the illumination unit is abnormal in the step of determining the abnormality of the light amount. Thereby, it is possible to easily maintain a state where the amount of light emitted from the lighting unit is always constant.

The damping member may have a calibration mark. In this case, the self-diagnosis method of the inspection apparatus according to the embodiment may further include a step of imaging and a step of determining the inclination of the optical axis. The process of imaging images a calibration mark using an imaging part after the process of irradiating. The step of determining the inclination of the optical axis determines the inclination of the optical axis of the lighting unit based on the calibration mark imaged by the imaging unit after the imaging step. Thereby, the inclination of the optical axis can also be checked using the diagnostic unit for checking the amount of light.

In addition, the inspection apparatus (eg, inspection apparatus 80 ) according to the embodiment includes a first substrate (eg, first substrate W1 ) and a second substrate (eg, second substrate W2 ). An inspection device for inspecting a bonded polymerized substrate (eg, polymeric substrate T), comprising: a holding unit (eg, holding unit 400 ); and an illumination unit (eg, macro illumination unit 610 or micro-illumination unit 620 ) )), an imaging unit (eg, macro imaging unit 510 or micro imaging unit 520 ), a moving mechanism (eg, moving mechanism 440 ), and a diagnostic unit (eg, diagnostic unit 700 ) )) is provided. The holding portion holds the outer periphery of the polymerization substrate. The lighting unit is disposed on one of the upper and lower sides of the holding unit, and irradiates light to the polymerization substrate held by the holding unit. The imaging unit is disposed at a position opposite to the lighting unit in the other of the upper and lower sides of the holding unit, and images the polymer substrate held by the holding unit. The moving mechanism moves the holding unit. The diagnostic unit has an attenuation member (eg, attenuation member 720 ) provided in the holding unit and attenuating light irradiated from the lighting unit.

According to the inspection apparatus according to the embodiment, it is possible to easily check the amount of light in the lighting unit using the diagnostic unit built in the inspection apparatus. Accordingly, it is possible to facilitate the maintenance of the measurement accuracy of the inspection apparatus.

The damping member may contain silicon (eg, a silicon plate 722 ). By attenuating the light emitted from the lighting unit in the same manner as in the polymerization substrate using silicon, it is possible to appropriately check the amount of light.

The damping member may include silicon, a glass laminated on silicon (as an example, a glass plate 721), and a calibration mark formed on the glass (as an example, a calibration mark M3). By forming the calibration mark on the glass, for example, the damping member can be formed at a lower cost compared to the case where the calibration mark is formed on silicon.

The holding unit may include a main body (eg, the main body 410 ) and a plurality of supporting members (eg, the supporting members 420 ). The body portion has an opening (eg, an opening 411 ) having a larger diameter than that of the polymerization substrate. A plurality of support members are provided in the body portion, extend toward the center of the opening, and support the outer peripheral portion of the polymerization substrate at the tip portion. In this case, the diagnostic unit may be disposed between two adjacent supporting members. Thereby, enlargement of the inspection apparatus 80 can be suppressed.

The diagnostic unit may include a mounting unit (eg, the mounting unit 710 ) and a damping member (eg, the damping member 720 ). The mounting portion is provided on the holding portion and extends toward the center of the opening. The damping member is attached to the distal end of the mounting portion. In this case, the damping member may be disposed at a position exposed from the polymerization substrate when the inspection apparatus is viewed in a plane (eg, FIG. 5 ) from a direction perpendicular to the plate surface of the polymerization substrate. Thereby, even when the polymer substrate is held by the holding unit, self-diagnosis using the diagnosis unit can be performed.

Further, in the above-described embodiment, the central portion of the first substrate is pressed with a striker to contact the second substrate, and the first substrate is used by using intermolecular force generated between the bonding surfaces of the first substrate and the second substrate, the surfaces of which are modified. The bonding apparatus for bonding the and the second substrate was described as an example. It is not limited to this, For example, the bonding apparatus of the type which joins a 1st board|substrate and a 2nd board|substrate via an adhesive agent may be sufficient as a bonding apparatus.

It should be considered that embodiment disclosed this time is not restrictive by an illustration in all points. Indeed, the above-described embodiment may be implemented in various forms. In addition, said embodiment may abbreviate|omit, substitute, and change in various forms, without deviating from the attached claim and the meaning.

W1: first substrate
W2: second substrate
T: polymerization substrate
1: splicing system
2: Carry-in/out station
3: processing station
4: Inspection Station
41: bonding device
70: control device
71: control unit
71a: measurement control
71b: diagnostic control
72: memory
72a: light amount initial information
80: inspection device
400: holding part
410: body part
420: support member
460: suction tube
500: imaging unit
510: macro imaging unit
520: micro imaging unit
600: lighting unit
610: macro lighting unit
620: micro lighting unit
700: diagnostic unit
710: mounting part
720: damping member

Claims (9)

A self-diagnosis method of an inspection apparatus for inspecting a polymer substrate to which a first substrate and a second substrate are bonded, the method comprising:
A holding part for holding the outer periphery of the polymeric substrate and provided with a diagnostic part having an attenuation member for attenuating light is moved by moving the holding part, the polymeric substrate being disposed on one of the upper and lower sides of the holding part and held by the holding part the attenuation member between an illuminating unit irradiating light onto The process of placing
After the arranging process, a process of irradiating light with a set amount of light from the lighting unit;
After the irradiating step, a step of receiving the light irradiated from the illumination unit and transmitted through the attenuation member using the imaging unit;
After the step of receiving light, a step of determining abnormality in the amount of light irradiated from the illuminating section based on the received amount of light received by the imaging section
A self-diagnosis method of a test device comprising a. The method of claim 1,
The step of determining the abnormality of the light quantity,
The difference between the initial light reception amount stored in advance as the light reception amount of the light irradiated from the illumination unit at the set light amount, transmitted through the attenuation member and received by the image pickup unit, and the light reception amount of the light received by the image pickup unit in the light receiving step is calculated and determining that the amount of light emitted from the illumination unit is abnormal when the difference is equal to or greater than a light amount threshold. 3. The method according to claim 1 or 2,
In the step of determining the abnormality of the light quantity, the step of changing the set light quantity when it is determined that the light quantity of the light irradiated from the illumination unit is abnormal
Further comprising, the self-diagnosis method of the test device. 4. The method according to any one of claims 1 to 3,
The damping member has a calibration mark,
After the step of irradiating, the step of imaging the calibration mark using the imaging unit;
After the said imaging process, based on the said calibration mark imaged by the said imaging part, the process of determining the inclination of the optical axis of the said illumination part.
Further comprising, the self-diagnosis method of the test device. An inspection apparatus for inspecting a polymer substrate to which a first substrate and a second substrate are bonded, comprising:
a holding part for holding the outer periphery of the polymerized substrate;
an illumination unit disposed on one of an upper side and a lower side of the holding unit and irradiating light to the polymer substrate held by the holding unit;
an imaging unit disposed at a position opposite to the lighting unit in the other of the upper and lower portions of the holding unit and configured to image the polymer substrate held by the holding unit;
a moving mechanism for moving the holding unit;
A diagnosis unit provided in the holding unit and having an attenuation member for attenuating the light emitted from the illumination unit
, which includes an inspection device. 6. The method of claim 5,
wherein the damping member comprises silicon. 7. The method of claim 6,
The damping member is
the silicone;
a glass laminated on the silicon;
Calibration marks formed on the glass
Including, inspection device. 8. The method according to any one of claims 5 to 7,
The holding unit,
a body portion having an opening having a larger diameter than that of the polymer substrate;
A plurality of support members provided in the main body, extending toward the center of the opening, and supporting the outer periphery of the polymerized substrate at the tip end.
to provide
The diagnostic unit,
An inspection device disposed between two adjacent support members. 9. The method of claim 8,
The diagnostic unit,
a mounting part provided on the holding part and extending toward the center of the opening;
the damping member mounted to the distal end of the mounting part
to provide
The damping member is
an inspection device disposed at a position exposed from the polymer substrate when the inspection device is viewed in a plan view from a direction perpendicular to the plate surface of the polymer substrate.

Images