KR20220022548A - Method for determining status of placing of electronic in components equipment for processing electronic components - Google Patents

Abstract

The present invention relates to an electronic component processing device, and a method for determining a seating status of an electronic component. According to the present invention, the electronic component processing device comprises: a first mover for moving an electronic component from a first to second loading element; a second mover for moving the electronic component from the second loading element to a third loading element; a camera for photographing the electronic component loaded on the second loading element; and a controller for determining whether the electronic component is not properly seated through an image photographed by the camera. The controller determines whether the electronic component is not properly seated through the extracted image obtained by extracting a certain area of a planar image photographed by the camera. According to the present invention, a failure of gripping the electronic component by the second mover is prevented, such that the reliability on an operation of the electronic component processing device is ultimately guaranteed.

Description

Method for determining the seating status of electronic parts in magnetic parts processing equipment

The present invention relates to a technique for checking the seating state of electronic components loaded on loading elements.

Produced electronic components are shipped after passing through various types of processes such as a test process or a classification process. In this process, electronic component processing equipment for processing electronic components is used.

Electronic component processing equipment may be manufactured in various forms according to its work function. A loading element in which electronic components can be loaded is used for the operation of supplying or collecting electronic components to the electronic component processing equipment and the operation of moving the electronic components. The loading element may be manufactured in various forms depending on the type of electronic component, the type of work used, and the like.

When a loading element is used, the electronic parts may be moved from the loading element to another loading element, or a required processing operation may be performed on the electronic parts while being loaded on the loading element, and in some cases, the processed electronic parts may be It is also necessary to take out the loaded loading elements and supply them to other processing equipment. Therefore, in order to properly move electronic components and to properly handle electronic components, or to prevent defective processing in other processing equipment in advance, it is necessary for electronic components to be accurately seated on loading elements. Otherwise, if the electronic component is mounted on the loading element in a defective seating state, a defective operation will naturally occur.

Therefore, a technology (hereinafter referred to as 'prior art 1') of photographing with a camera and comparing it with a pre-input image was introduced to confirm the seating state of the electronic component. However, the prior art 1 is difficult to apply when fast distribution of electronic parts is required because the processing speed is slow in terms of image-to-image comparison. In addition, since the prior art 1 is an image-to-image comparison, it may be difficult to check the focus from lighting, shooting conditions, or equipment shake due to momentary disturbance.

Therefore, in order to more quickly and accurately check the seating state of the electronic component, the present applicant has proposed Korean Patent Application Laid-Open Nos. 10-2016-0018211 and 10-2017-0093624 (hereinafter referred to as 'prior art').

In the prior art, after photographing with a camera by irradiating a laser, an error in the loading of electronic components can be checked by analyzing the pattern of the photographed laser. According to this cited technology, it is possible to quickly check the seating state of the electronic component by simplifying the analysis factor. However, prior art 2 can be appropriately used when the electronic component is erected in a standing position, but it may be difficult to use when the electronic component is laid in a supine position.

On the other hand, referring to the Korean Patent Application No. 10-2020-0015914 of the present applicant (hereinafter referred to as 'pre-application technology'), several electronic devices are installed on one substrate and used for testing electronic components having a relatively large area. We are proposing electronic parts processing equipment that can be used.

Referring to the prior application technology, the electronic components of the reclining position (the wide side facing up and down) are transferred from the customer tray to the relay pocket (the ‘pocket unit) and move the electronic parts from the relay pocket to the test tray with the second mover (called 'gripper' in the prior art), while moving the electronic parts to the standing (with the wide side facing the side) It has a structure that converts it to a standing posture).

If a defect occurs in the operation of moving the electronic component by hand in the prior art, the electronic component may be defectively seated in the relay pocket. That is, the gripper may fail to grip the electronic component or improperly grip the electronic component, thereby causing the electronic component to be defectively seated on the test tray. Accordingly, ultimately, a defect occurs in the electrical connection between the electronic component and the tester.

Therefore, even in the prior application technology, a technology for confirming the seating state of the electronic component is required.

As in the prior art, the present invention is suitable when the electronic component is moved from the first loading element to the second loading element by the first mover and then moved from the second loading element to the third loading element by the second mover. It was devised from concerns about technology that can check the seating status of applicable electronic components.

In addition, the present invention has been devised from concerns about a technology that can check the seating state of electronic components when the electronic components are stacked in a supine state and the terminals are long flat to one side rather than protruding.

The method for determining the seating state of the electronic component in the electronic component processing equipment according to the present invention includes a plane photographing step of photographing the plane of the electronic component stacked on the loading element in a supine manner - the terminals of the electronic component are exposed upwardly; an extraction image generation step of generating an extraction image by extracting a partial region where terminals of electronic components are located from the plane image photographed in the plane photographing step; a seating state determination step of determining whether the electronic component is defectively seated through the extracted image generated in the extraction image generation step; includes

The seated state determination step determines whether the electronic component is defective by comparing whether the first reference line and the second reference line are parallel to each other. is the first side that touches the , and the second reference line is an inner wall facing the terminals in the loading element.

The seating state determination step determines whether the electronic component is defective by comparing the positions of both endpoints of the first reference line segment and the second reference line segment, and the first reference line segment determines whether the electronic component is connected to the test socket of the tester. The terminals are set based on the side that first comes into contact with the test socket upon contact, and the second reference line is set based on the inner wall facing the terminals in the loading element.

The step of determining the seating state includes a first step of blocking the terminal portion; a second step of finding the center of the blocked area; a third step of comparing the calculated center with a reference point in the relay pocket to obtain coordinates between the two; and a fourth step of determining whether the electronic component is not properly seated by comparing the calculated coordinates with a preset coordinate; includes

According to the present invention, there are the following effects.

First, when the electronic component is to be moved continuously by the first mover and the second mover, the electronic component is manufactured by checking whether the electronic component is defectively seated between the moving operation of the first mover and the second mover. 2 It can be properly gripped by a mover.

Second, it is possible to check whether the electronic component is badly seated even when the terminal in the form of a long plane is applied to one side while being in a supine shape.

Third, it is possible to prevent damage to mechanical objects or electronic components that may occur due to a defective grip by the second mover.

Therefore, ultimately, there is an effect that the reliability of the operation of the electronic component processing equipment is guaranteed.

1 is a conceptual plan view of an electronic component processing equipment according to an embodiment of the present invention.
FIG. 2 is a reference diagram for explaining a relationship between a first mover and a camera applied to the electronic component processing equipment of FIG. 1 .
3 is a flowchart for explaining an operation method of the electronic component processing equipment of FIG. 1 .
4 is a flowchart of a method of determining a seating state of an electronic component made in the electronic component processing equipment of FIG. 1 .
5 is a reference diagram for explaining the step of determining a seated state according to the first embodiment.
6 is a reference diagram for explaining the step of determining a seated state according to the second embodiment.
7 is a flowchart of a settling state determination step according to the third embodiment.
8 is a reference diagram for explaining the step of determining a seated state according to the third embodiment.

Hereinafter, preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings, but overlapping descriptions will be omitted or compressed as much as possible for the sake of brevity of description.

<Description of electronic parts processing equipment>

The electronic component processing equipment to which the method of determining the seating state of the electronic component according to the present invention is applied is basically the same as the electronic component test handler according to the above-mentioned prior application technique. Therefore, since the specific and detailed configuration and operation of the electronic component processing equipment 100 have already been presented through the previous application, the present description will mainly focus on the features of the present invention.

On the other hand, the electronic component processing equipment 100 is provided with three types of loading elements capable of loading electronic components.

The first loading element is a customer tray and is used to bring in an electronic component to be tested into the electronic component processing equipment or take out the electronic component that has been tested from the electronic component processing equipment.

The second loading element is a relay pocket, which serves to relay electronic components between the first and second movers, and is used to adjust the distance between the electronic components to be tested and to set the exact position of the electronic components. .

The third loading element is a test tray, which is used to electrically connect the loaded electronic components to the tester at once.

Therefore, the electronic component to be tested is moved from the customer tray through the relay pocket to the test tray, and when the test is completed, the electronic component is moved from the test tray through the relay pocket to the customer tray. Here, electronic components can be stacked on the customer tray and relay pocket, and stacked on the test tray. In addition, in a state in which the electronic component is in a supine state, the terminals are exposed upward, and in a state in which the electronic component is in a standing state, the terminals are directed downward.

And the terminals of the electronic components to be processed in the present electronic component processing equipment 100 is a gold pinker. Here, the gold finger is a metal material connected to the test socket and means a flat bar-shaped terminal.

1 is a conceptual plan view of an electronic component processing equipment 100 .

The electronic component processing equipment 100 of FIG. 1 includes stackers 111 to 115, a first mover 120, eight relay pockets 131 to 138, a second mover 140, and eight cameras 151 to 158), a transfer machine 160 (referred to as a 'gap control shuttle' in the prior art), a pressurizer 170 (referred to as a 'press module' in the prior art), and a controller 180 .

The stackers 111 to 115 are provided to accommodate the customer tray CT, which is a first loading element capable of loading electronic components. Some of the stackers 111 and 112 accommodate the customer tray CT on which electronic components to be tested are loaded, and some of the stackers 113 to 114 receive the customer tray CT on which the tested electronic components are loaded. store it

The first mover 120 moves eight electronic components from the customer tray CT to the relay pockets 131 to 138 at a time. To this end, the first mover 120 has eight pickers P capable of holding or releasing the large surface of the electronic component stacked on the customer tray CT in a vacuum adsorption method.

The relay pockets 131 to 138 may load electronic components from the customer tray CT. The relay pockets 131 to 138 are provided to adjust the distance between the electronic components and to precisely set the positions of the electronic components. In general, the interval between electronic components loaded on the customer tray CT is narrow at the first interval, and the interval between the electronic components loaded on the test tray TT is wide at the second interval. Therefore, in the process of moving the electronic component from the customer tray CT to the test tray TT or vice versa, the distance between the electronic components must be adjusted. In this embodiment, the relay pockets 131 to 138 are used to Adjust the spacing between parts. Accordingly, the distance between the eight relay pockets 131 to 138 may be narrowed at the first interval or widened at the second interval.

The second mover 140 is provided to move the electronic components loaded in the relay pockets 131 to 138 to the test tray TT. The second mover 140 holds the electronic components seated in the supine position in the relay pockets 131 to 138, converts them to a standing position, and loads them on the test tray TT. Here, the second mover 140 presses both sides of the electronic component and grips it, unlike the gripping method of the first mover 120 that grips the electronic component by an adsorption method. At this time, since the terminals of the electronic component are on the rear side, it is preferable that the portion gripped by the second mover 140 is the front side of the electronic component.

The cameras 151 to 158 are provided to check the seating state of the electronic components loaded in the relay pockets 131 to 138 . Because, when the second mover 140 grips the electronic component seated in the relay pockets 131 to 138, a defective grip occurs when the electronic component is seated defectively, which means that the electronic component is not properly seated on the test tray TT. make it possible So, ultimately, it may cause a defect in the electrical connection between the electronic component and the tester. Therefore, it is important to check whether the second mover 140 is in a state capable of properly gripping the electronic components in the relay pockets 131 to 138, and for this purpose, the cameras 151 to 158 are provided. These cameras 151 to 158 are provided at the rear of the picker P as referenced in the schematic excerpt of FIG. 2 . That is, the eight cameras 151 to 158 are provided at positions corresponding to the eight pickers P in the front-rear direction, and are mounted on the first mover 120 to move together with the eight pickers P. According to this embodiment, eight relay pockets 131 to 138 are provided, the number that the first mover 120 can move at a time is eight, and one camera 151 to 158 is one electronic component. Take a structure to shoot However, in order to reduce the number of cameras, taking an example of allowing one camera to photograph two or more electronic components may be sufficiently considered. In addition, in this embodiment, the cameras 151 to 158 are mounted on the first mover 120 to move together with the picker P, but depending on the implementation, the cameras 151 to 158 are the relay pockets 131 to 158. 138) can be sufficiently considered to be fixedly provided above. However, since it is preferable that the cameras 151 to 158 be as close to the electronic component as possible while reducing the focal length of the cameras 151 to 158 in order to increase the resolution of the image, one camera 151 to 158 is one electronic component. It is preferable to be provided so as to be able to photograph and move in the horizontal and vertical directions together with the picker (P).

For reference, unexplained reference numeral 'LU' in FIG. 2 is an illuminator for illuminating light with the electronic component ED, and in this embodiment, the illuminator LU takes a structure in which the terminal portion of the electronic component is focused. The illuminator of FIG. 2 according to this embodiment has a structure in which LEDs are arranged in a line and surrounded by a diffusion plate.

The transfer unit 160 includes the relay pockets 131 to 138 in a first area F1 in which the first mover 120 can move an electronic component and a second mover 140 in which the second mover 140 can move the electronic component. Transfer between the 2 areas F2. That is, in the present embodiment, the work area (first area) of the first mover 120 and the work area (second area) of the second mover 140 overlap, so that the first mover 120 and the second mover 140 are overlapped. ) to prevent interference, relay pockets 131 to 138 are provided between the customer tray CT and the test tray TT, and the relay pockets 131 to 138 are first It has a structure that can go back and forth between the area F1 and the second area F2. As such, the relay pockets 131 to 138 serve to relay electronic components between the first mover 120 and the second mover 140 .

And the transfer unit 160 also has a function of widening the interval between the relay pockets 131 to 138 from the first interval to the second interval or narrowing the interval from the second interval to the first interval (refer to the movement arrow in FIG. 1 ). Accordingly, the distance between the electronic components can be adjusted while the electronic components are loaded in the relay pockets 131 to 138 .

The presser 170 presses the electronic component loaded on the test tray TT downward to electrically connect the electronic component and the tester. Of course, a test socket for the tester is provided on the lower side. Since this pressurizer 170 is provided because the electronic component processing equipment 100 according to the present embodiment is for testing, processing that does not require testing of electronic products (for example, processing of lot-by-lot classification, simple classification by test grade, etc.) It can be omitted in other electronic parts processing equipment for

The controller 180 controls each of the above-described components. In particular, the controller 180 uses the first mover 120 and the cameras 151 to 158 to photograph the electronic components moved from the customer tray CT to the relay pockets 131 to 138 by the first mover 120 . control And the controller 180 determines whether the electronic component is satisfactorily seated in the relay pockets 131 to 138 through the images captured by the cameras 151 to 158, and only when it is satisfactorily satisfies the second mover 140 Controls the movement of electronic components by Here, the controller 180 extracts the terminal portion of the electronic component from the image taken by the cameras 151 to 158 to determine whether the electronic component is not properly seated. Describe in detail.

In addition, when it is determined that the seating state of the electronic components loaded in the relay pockets 131 to 138 is good, the controller 180 controls the transporter 160 to move the relay pockets 131 to 138 to the first area F1. By transferring it from the to the second area F2, the second mover 140 enables the electronic component to be gripped from the relay pockets 131 to 138. Of course, in this process, the interval between the relay pockets 131 to 138 is widened by the second interval.

Meanwhile, according to the present embodiment, the number of electronic components that the first mover 120 can move, the number of electronic components that the second mover 140 can move, and the number of relay pockets 131 to 138 are The number is equal to 8. That is, in the present embodiment, rather than the structure in which all electronic components loaded in one customer tray CT are moved to the relay pockets 131 to 138 and then moved back to the test tray TT, eight electronic components are first From this customer tray (CT), it is moved to the test tray (TT) through the relay pockets (131 to 138), and again the next 8 electronic components are transferred from the customer tray (CT) through the relay pockets (131 to 138) to the test tray ( TT) takes a sequential movement method. Therefore, when the first movement operation in which the eight electronic components are moved to the eight relay pockets 131 to 138 by the first mover 120 is performed, the eight cameras 151 to 158 are sequentially connected to the corresponding relay pockets, respectively. A photographing operation of photographing the electronic components loaded in (131 to 138) is performed. Of course, the first mover 120 will have to position the cameras 151 to 158 above the electronic components so that the electronic components can be photographed by the cameras 151 to 158 . And after the photographing operation, the second movement unit 140 moves the electronic components to the test tray TT, so that the electronic components to be moved next can be loaded into the relay pockets 131 to 138. The relay pockets 131 to 138 are emptied.

<Operation Description>

Next, a flowchart of FIG. 3 will be described with respect to the operation of the electronic component processing equipment 100 described above.

1. Import step <S310>

The customer trays CT on which electronic components to be tested are loaded by a worker or a carrying mechanism are loaded into some of the stackers 111 and 112 .

2. First moving step <S320>

The loaded customer trays (CT) are sequentially positioned one by one to the supply position (not shown, but located above the stacker), and the first mover 120 moves eight electronic components from the customer tray (CT) in the supply position. is adsorbed and held and loaded in the eight relay pockets 131 to 138 currently in the first area F1.

3. Judgment step <S330>

Next, the first mover 120 positions the cameras 151 to 158 above the electronic components in the relay pockets 131 to 138, and the electronic components are photographed by the cameras 151 to 158. Then, the controller 180 analyzes the eight images acquired by the eight cameras 151 to 158 to determine whether the electronic component is properly seated in the relay pockets 131 to 138 . And if the electronic component is properly seated, the controller 180 proceeds with a transfer step to be described later, and if the electronic component is not properly seated, the controller 180 does not proceed with the transfer step to be described later, and a jam occurs. control to make If the jam occurs, the operation of the electronic component processing equipment 100 is stopped, and in this state, the operator re-operates the electronic component processing equipment 100 after seating the electronic component normally. In this case, the electronic component processing equipment 100 re-performs the determination step <S330>.

In the present invention, since the determination step <S330> has its main characteristics, the determination step <S330> will be further subdivided by changing the table of contents later and will be described for each embodiment.

4. Transfer step <S340>

When the electronic components are normally seated in the relay pockets 131 to 138 , the transfer unit 160 transfers the relay pockets 131 to 138 from the first area F1 to the second area F2 . In this process, the transfer unit 160 spreads the interval between the relay pockets 131 to 138 from the first interval to the second interval.

5. Second moving step <S350>

The second mover 140 grasps eight electronic components from the relay pockets 131 to 138 that have been transferred to the second area F2, and then changes their posture to a standing position and moves them to the test tray TT.

6. Pressurization step <S360>

When the electronic components are filled in the test tray TT, the pressurizer 170 operates to electrically connect the electronic components to the test sockets of the tester located below the test tray TT.

7. Carry out step <S370>

When the test is finished, the pressurizer 170 releases the pressurization of the electronic components, and the electronic components that have been tested through the reverse process are loaded onto the customer tray CT. At this time, the first mover 120 classifies the electronic components that have been tested by test grade and moves them to the customer tray CT. Then, the customer tray CT filled with the electronic components that have been tested is accommodated in the remaining part of the stackers 113 to 115, and then taken out from the electronic component processing equipment by a worker or a take-out mechanism. For reference, depending on implementation, a table (or customer tray) for separately loading electronic components determined to be defective may be provided.

<First Example for Judgment Step ?? See the flowchart of Fig. 4>

1. Planar shooting<S331>

The plane of the electronic component stacked in the relay pockets 131 to 138, which is the second loading element, is photographed. At this time, since not only electronic components but also relay pockets 131 to 138 are included in the viewing angle of the cameras 151 to 158, the images acquired by the cameras 151 to 158 include relay pockets 131 to 138 including electronic components. ) up to And, since the terminals of the electronic components stacked in the supine phase are exposed upward, the images acquired by the cameras 151 to 158 also include terminals of the electronic components.

2. Create extract image<S332>

The controller 180 extracts a part of the region A in which the terminals T of the electronic component ED are located from the plane image I ₁ taken in the plane photographing step <S331> as in FIG. 5 and extracts the extracted image ( I ₂ ) is generated.

3. Determination of the seated state<S333>

The controller 180 determines whether the electronic component ED is defectively seated through the extracted image I ₂ generated in the extracted image generation step <S312>. To this end, the controller 180 sets the first reference line L1 and the second reference line L2.

The first reference line L1 may be a side where the terminals T first contact the test socket when the electronic component comes into contact with the test socket of the tester, and the second reference line L2 is the terminal (I ₂ ) in the relay pocket I 2 . It may be an inner wall facing T). Of course, depending on implementation, the first reference line L1 may be any other reference line on the side of the electronic component ED, and the second reference line L2 may be any other reference line on the side of the relay pockets 131 to 138 .

When the first reference line L1 and the second reference line L2 are set, the controller 180 checks whether the first reference line L1 and the second reference line L2 are parallel to each other. Therefore, if the first reference line L1 and the second reference line L2 are parallel, the controller 180 determines that the electronic components ED are normally seated, and the first reference line L1 and the second reference line L2 are not parallel. Otherwise, it is judged that the electronic components (ED) are defectively seated. Of course, whether the first reference line L1 and the second reference line L2 for determining good seating and bad seating are parallel to each other may have a certain tolerance range. That is, even if the first reference line L1 and the second reference line L2 are not exactly parallel, the second mover 140 can normally grip the electronic component ED loaded in the relay pockets 131 to 138. If they are not parallel within the error range, the controller 180 may determine that the electronic component ED is normally seated in the relay pockets 131 to 138 .

Here, the distance between the two reference lines L1 and L2 and whether they are parallel may be determined by determining the number of pixels in the image.

<Second Example for Judgment Step ?? See the flowchart of Fig. 4>

1. Planar shooting<S331>

The plane of the electronic component stacked in the relay pockets 131 to 138, which is the second loading element, is photographed.

2. Generate extracted image<S312>

The controller 180 extracts and extracts a partial area A in which the terminals T of the electronic component ED are located from the plane image I ₁ taken in the photographing step <S331> in the same manner as described in FIG. 5 . Create an image I ₂ .

3. Settling status <S313>

The controller 100 determines whether the electronic component ED is defectively seated through the extracted image I ₂ generated in the extracted image generation step <S332>. To this end, as shown in FIG. 6 , the controller 180 sets the first reference line segment S1 and the second reference line segment S2 .

The first reference line segment S1 is set based on the side where the terminals first contact the test socket when the electronic component ED comes into contact with the test socket of the tester, and the second reference line segment S2 is the relay pocket 131 to 138) based on the inner wall facing the terminals T.

When the first reference line segment S1 and the second reference line segment S2 are set, the controller 180 controls both end points P ₁ and P ₂ of the first reference line segment S1 and the second reference line segment S2. Compare the positions of both endpoints (P ₃ , P ₄ ). So, if there is no bias between both endpoints P ₁ , P ₂ of the first reference line segment S1 and both endpoints P ₃ , P ₄ of the second reference line segment S2, the controller 180 controls the electronic component ED. If it is determined that they are normally seated, and there is a bias between both endpoints P ₁ , P ₂ of the first reference line segment S1 and both endpoints P ₃ , P ₄ of the second reference line segment S2, the controller 180 judges that the electronic components (ED) are seated defectively. Of course, even in this embodiment, the bias between both endpoints P ₁ , P ₂ of the first reference line segment S1 and both endpoints P ₃ , P ₄ of the second reference line segment S2 has a certain tolerance. can

In the present embodiment, the distance between the endpoints P ₁ , P ₂ , P ₃ , and P ₄ may be a pixel as a reference. That is, by comparing the distance between the endpoints (P ₁ , P ₂ , P ₃ , P ₄ ) by how many pixels apart the endpoints (P ₁ , P ₂ , P ₃ , P ₄ ) are, and comparing them, the endpoint (P ₁ , P ₂ , P ₃ , P ₄ ) can be determined whether there is a bias between them. For example, you can check the bias between the endpoints (P _{1 , P 2 , P 3 , P 4 ) by finding the coordinates of the endpoints (P 1 , P 2 , P 3 , P 4} ) based on the pixel on the XY plane. there is. Alternatively, a reference image having a normal position between the endpoints (P ₁ , P ₂ , P ₃ , P ₄ ) is preset, and the endpoint (P ₁ , P ₂ , P ₃ , P ₄ ) is compared with the reference image. ), a method for checking the bias between the two can be considered.

<Third Example for Judgment Step ?? See the flow charts in Figs. 4 and 7>

1. Planar shooting<S331>

The plane of the electronic component (ED) which is stacked on the relay pockets 131 to 138, which is the second loading element, is photographed.

2. Create extract image<S332>

The controller 180 extracts and extracts a partial area A in which the terminals T of the electronic component ED are located from the plane image I ₁ taken in the photographing step <S331> in the same manner as described in FIG. 5 . Create an image I ₂ .

3. Determination of the seated state<S333>

The controller 180 determines whether the electronic component ED is defectively seated through the extracted image I ₂ generated in the extracted image generation step <S332>. To this end, the step of determining the settling state <S312> in the present embodiment may have more subdivided steps as will be described later with reference to FIG. 7 .

3-1. Step 1 <S333a>

As in FIG. 8 , the controller 180 blocks the terminal portion having the terminal T in the extracted image I ₂ . For reference, there may be a groove (a) or protrusion for preventing reverse insertion between the terminals (T). In this case, the terminal (T) on one side based on the groove (a) or protrusion for preventing reverse insertion It is also possible to block only these parts, or to block all the terminals (T) including the groove (a) or protrusion for preventing reverse insertion. This blocking process is preferably applied to the above first and second embodiments as well.

3-2. Step 2 <S333b>

The controller 180 obtains the center O of the blocked area B.

3-3. Step 3 <S333c>

By comparing the center (O) calculated in the second step <S313b> and the reference point (O') in the relay pockets 131 to 138, the relative coordinates between the two are obtained. To this end, the relay pockets 131 to 138 may be provided with holes, markings, protrusions, or other types of marks for knowing the reference point O'.

3-4. Step 4 <S333d)

By comparing the calculated coordinates with preset normal reference coordinates, it is determined whether the electronic component (ED) is not properly seated.

The method of the third embodiment as described above is useful when the color of the relay pockets 131 to 138 is too dark or it is difficult to set the second reference line L2 by shooting with the cameras 151 to 158 due to diffuse reflection, etc. can be used Therefore, the above first embodiment, second embodiment, and third embodiment can all be implemented programmatically. After programming all of the first to third embodiments, it may also be advantageously considered to take an example in which the administrator selects a mode that operates as an optimal embodiment according to a situation.

In addition, the above embodiments may be considered particularly preferably when the terminals T of the electronic component ED are provided in a long planar shape to one side instead of a protruding shape like a ball type.

<Additional notes>

1. Matters concerning the first reference line and the first reference line segment

The first reference line in the above first embodiment and the first reference line in the second embodiment are set with terminals serving as a reference. Therefore, in order to properly set the first reference line and the first reference line segment, it may be more preferable to first pass the step of blocking the terminal portion as in the third embodiment.

2. Reason for setting the terminal part as a standard

A case in which the electronic components loaded on the loading element are not seated in the correct position is called seating failure. However, it is important here how to determine whether the seating is defective based on what criteria.

In the present invention, one of the standards is taken as the terminal T of the electronic component ED. This is because the position of the terminal T is the most important because the terminal T is correctly inserted into the test socket so that the electronic component ED and the tester are electrically properly connected.

However, the difficult point is that the electronic components (ED) loaded in the relay pockets 131 to 138 are in a form in which numerous large and small electronic components are installed on the PCB board as shown in the photo of FIG. 5, and large and small and various Various information on color two-dimensional or three-dimensional barcodes and electronic elements are recorded in numbers, symbols, or letters. In addition, this information is directly printed or engraved on the electronic element, or printed and attached to a sticker. Moreover, as shown in FIG. 6 , around the terminal T connected to the test socket, various connection lines connecting the terminal T and numerous electronic elements are exposed and exist in a row. Such information must sometimes be seen well with the naked eye, and some have materials and shapes with excellent visibility or high light reflectance, and most of them are created indispensably in the manufacturing process. Therefore, in order to find and photograph the terminal T of the electronic component ED in a photographing device such as the cameras 151 to 158, it is difficult to automatically find the position of the terminal T because problems such as light blur and reflection overlap. It's not easy at all Therefore, an attempt was made based on the part used as the substrate, but it was difficult to establish a position as a standard for analyzing the seating failure of the substrate part due to poor visibility as well as minute errors in manufacturing and assembly.

Therefore, the method of equipping the electronic component (ED) with a illuminator that irradiates light, allowing more light to be irradiated to the area where the terminal (T) exists, and finding the brightest spot in the periphery including the terminal (T) tried That is, when the light by the illuminator LU is concentrated on the terminal part, the terminal T with high reflectivity shines the brightest because the plane is in the form of a flat gold finger, so this point is used.

However, there was a difficulty in distinguishing whether the brightly shining part due to the diffuse reflection is the terminal (T) or the other part is brightly lit. Accordingly, in the present invention, the reverse insertion prevention groove (a, or, since it has a function of preventing erroneous loading, it may be called 'misloading prevention groove'), which is a specific shape of the electronic component (D), is connected to the terminal (T) It has a feature that utilizes being between the fields and the terminals (T).

In the end, there are two brightest parts on the photographed plane, and if there is a black part between them, that area is the area of the terminal (T). it has become Then, among the two brightest areas divided by the blackest part, a bright area occupying a wider (longer) area is selected and the area is blocked, and then based on the blocked area, the first reference line (L1) or the first reference line segment (S1) or center (O) is set. Depending on the implementation, it is possible to select a bright area occupying a narrower (shorter) area among the two brightest areas, but selecting a bright area occupying a wider area will This is because there is relatively little error in setting the coordinates and the center O between the reference line segments S1 and S2. Of course, as mentioned above, it is also possible to set the blocked area (B) by including both terminal parts including the reverse insertion prevention groove (a).

That is, in the first embodiment, it may be preferably considered that the first reference line L1 is set by the side that first contacts the test socket in the blocked area B.

In addition, in the second embodiment, it can be preferably considered that the first reference line segment S1 is set by the side that first contacts the test socket in the blocked area B, and the second reference line segment S1 is In the relay pockets (131 to 138), the inner wall facing the terminals (T) is set as a reference.

According to the above first embodiment, even if there is no reference information stored in advance, it is possible to determine whether the electronic component ED is not properly seated by comparing the parallelism between the first reference line L1 and the second reference line L2 .

By the way, by comparing the coordinate values of both end points (P ₁ , P ₂ , P ₃ , P ₄ ) of the first reference line segment S1 and the second reference line segment S2 relative to each other, it is determined whether the electronic component ED is not properly seated. Since it is to confirm, it is preferable that there is reference information stored in advance. For reference, when defining the vertical direction as the Y-axis and the left-right direction as the X-axis in the drawing, comparing both the X-axis coordinates and the Y-axis coordinates of both endpoints (P ₁ , P ₂ , P ₃ , P ₄ ) Most preferably, determining whether a defect is determined by comparing only the coordinates of one side direction (X-axis direction or Y-axis direction) may be sufficiently considered.

However, since the bar-shaped terminal T has the characteristics of a metal material and a large-area flat plate, the reflectance is high and there may be diffuse reflection. And in some cases, since the terminal part is an aggregate of a plurality of terminals (T), some may emit more light and some may emit less light. So, in consideration of such a point, more logic is needed, such as recognizing the area occupied by the bar-shaped terminal T as the area of the terminal T by additionally utilizing the location information and size information to a certain degree of blur. may be

Of course, the edge of the blocked area B may be set based on a threshold value of a certain brightness.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, but since the above-described embodiments have only been described with preferred examples of the present invention, the present invention is limited only to the above embodiments It should not be understood as that, and the scope of the present invention should be understood as the following claims and their equivalents.

100: electronic parts processing equipment
120: first mobile unit
131 to 138: relay pocket
140: second mobile unit
151 to 158: camera
160: transfer
180: controller
CT: customer tray
TT : test tray
F1: first area
F2: second area

Claims (5)

A plane photographing step of photographing the plane of the electronic component stacked on the stacking element in a vortex shape, the terminals of the electronic component being exposed upward;
an extraction image generation step of generating an extraction image by extracting a partial region where terminals of electronic components are located from the plane image photographed in the plane photographing step;
a seating state determination step of determining whether the electronic component is defectively seated through the extracted image generated in the extraction image generation step; containing
A method for determining the seating state of electronic components in electronic component processing equipment. According to claim 1,
In the seated state determination step, it is determined whether or not the electronic component is seated badly by comparing whether the first reference line and the second reference line are parallel,
The first reference line is the side at which the terminals first contact the test socket when the electronic component comes into contact with the test socket of the tester, and the second reference line is the inner wall facing the terminals in the loading element.
A method for determining the seating state of electronic components in electronic component processing equipment. According to claim 1,
In the seated state determination step, it is determined whether the electronic component is defectively seated by comparing the positions of both end points of the first reference line segment and both end points of the second reference line segment,
The first reference line segment is set based on the side where the terminals first contact the test socket when the electronic component comes into contact with the test socket of the tester, and the second reference line segment is the inner wall facing the terminals in the loading element. set on the basis
A method for determining the seating state of electronic components in electronic component processing equipment. 4. The method of claim 3,
The settling state determination step is,
A first step of blocking the terminal portion;
a second step of finding the center of the blocked area;
a third step of comparing the calculated center with a reference point in the relay pocket to obtain coordinates between the two; and
a fourth step of determining whether the electronic component is not properly seated by comparing the calculated coordinates with a preset coordinate; containing
A method for determining the seating state of electronic components in electronic component processing equipment. According to claim 1,
The terminals of electronic components are gold fingers.
A method for determining the seating state of electronic components in electronic component processing equipment.

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