KR20220020780A - Sheet for forming protective film and method for producing the same - Google Patents

Abstract

Provided are a sheet for forming a protective film which can sufficiently suppress a stripping defect even when the width of insertion is relatedly narrow during shearing processing, and a manufacturing method thereof. The sheet for forming a protective film is a long sheet having a protective film-forming film and a first release film formed on one surface of the protective film-forming film, wherein after affixing two protective film-forming films at 23℃ by the load of 2 kgf, the adhesive force thereof after 2 minutes is 19 N per 25 mm or less.

Description

A sheet for forming a protective film and a manufacturing method thereof

The present invention relates to a sheet for forming a protective film and a method for manufacturing the same. In particular, it relates to a sheet for forming a protective film provided with a film for forming a protective film that is preferably used for protecting a workpiece such as a semiconductor wafer or a workpiece such as a semiconductor chip obtained by processing the workpiece, and a method for manufacturing the sheet for forming a protective film.

In recent years, manufacturing a semiconductor device by the mounting method called flip-chip bonding is performed. In this mounting method, when a semiconductor chip having a circuit surface on which convex electrodes such as bumps or the like is formed is mounted, the circuit surface side of the semiconductor chip is inverted (face down) by the chip mounting portion and joined. Accordingly, the semiconductor device has a structure in which the back side of the semiconductor chip on which no circuit is formed is exposed.

For this reason, in order to protect the semiconductor chip from an impact at the time of conveyance etc. on the back side of a semiconductor chip, the hard protective film which consists of an organic material is formed in many cases. For formation of such a protective film, the uncured resin film (henceforth "protective film formation film") which is the precursor is used. The protective film formation film is affixed on the back surface of a semiconductor wafer, and it is diced together with a wafer, and is formed into a chip. By hardening a protective film formation film, the chip|tip which has a protective film on the back surface is obtained.

As a product form of a protective film forming film, a protective film forming sheet 10 having a two-layer structure in which a protective film forming film 11 is releasably laminated on a first release film 12 as shown in FIG. 1 , or in FIG. As shown in 3, the sheet|seat 20 for protective film formation of the three-layer structure which clamped the protective film formation film 11 between the peeling films 12 and 13 of 2 sheets is known. Moreover, the said sheet|seat for protective film formation is elongate, is wound up in roll shape, and is stored and transported. Such a sheet for forming a protective film may be affixed to the work by shearing the protective film forming film into substantially the same shape as that of the work (general term for an adherend such as a semiconductor wafer) in advance. In this shear-processed protective film forming sheet, the protective film forming film 16 sheared into a predetermined closed shape is laminated on the first release film 12 (FIG. 2) or between two release films 12 and 13. It is pinched to (Fig. 4).

The shear-processed protective film-forming sheet is produced by punching a protective film-forming film into a predetermined closed shape with a shearing die, and is used by removing the unnecessary portion 17 around the shear-processed protective film-forming film 16 . In the case of the sheet for forming a protective film having a two-layer structure comprising the protective film forming film 11 and the first release film 12, the protective film forming film 11 is completely punched out into a predetermined closed shape, and the first release film 12 ), the cutout 14 is inserted so as not to be completely punched, and the protective film forming film 16 having a predetermined closed shape is left on the first release film 12 to remove the unnecessary portion 17 in the periphery. When the protective film forming film 11 is a sheet for forming a protective film having a three-layer structure sandwiched between two release films 12 and 13, the protective film forming film 11 and one of the second release films 13 are predetermined The first release film 12 is completely punched out in a closed shape of It is made to remain in the phase, and the peripheral unnecessary part 17 and the 2nd peeling film 13 are removed.

The case of the sheet|seat for protective film formation of a two-layer structure is taken as an example, and it demonstrates further in detail. As shown in FIG. 5, the protective film formation film 11 is completely punched out into the protective film formation sheet 10 which consists of the protective film formation film 11 and the 1st peeling film 12 in a predetermined closed shape, and the 1st The cut-out 14 is put so that the peeling film 12 may not be completely punched out, and it becomes the sheet|seat for protective film formation by which the shearing process was carried out. This process is called a "shear processing process".

Next, in order to use the shear-processed sheet for forming a protective film for affixing to the work, unnecessary portions 17 around the protective film forming film 16 punched out into a predetermined closed shape are removed (FIG. 6). This process is called a "stripping process". As a result, the laminated body which has the protective film formation film 16 punched out in the predetermined|prescribed closed shape on the 1st peeling film 12 which can be used for sticking to a workpiece|work is obtained.

In the case of the sheet for forming a protective film having a three-layer structure, there is another release film 13 (the second release film 13) on the protective film forming film 11 in the shearing step, and the second release film 13 is also It is the same as in the case of the sheet|seat for protective film formation of a two-layer structure except that it is completely punched in a predetermined closed shape, and the stripping process removes the 2nd peeling film 13.

As a sheet|seat for protective film formation, what can perform a shearing process stably (work stability) is calculated|required. In particular, after shearing the protective film forming film, work stability of the stripping process for removing unnecessary parts is required. More specifically, in a stripping process, the problem that the protective film formation film 16 which should remain is peeled off from the 1st peeling film 12 together with the unnecessary part 17 unintentionally (hereinafter also referred to as "striping failure") ) does not occur.

In order to solve such a problem, controlling the peeling force between a peeling film and a protective film formation film to a predetermined range is proposed by patent document 1, for example.

International publication WO2017/145735

When a stripping defect arises, it is necessary to stop a manufacturing line, and also to discard a defective article, the yield of a product falls and cost increases. Therefore, further suppressing a stripping defect is calculated|required.

The inventors of the present invention obtained the following knowledge when they further continued searching about the cause of a stripping defect.

The sheet 10 for forming a protective film passes through a plurality of rollers such as guide rollers for the purpose of, for example, control of the tension of the sheet for forming a protective film between the shearing process and the stripping process. At this time, as shown in FIG. 7, the sheet|seat 10 for protective film formation may be bent so that the upper side of the cutout 14 (surface on the side where a shearing die entered) may become the roller 19 side. As a result of bending, especially in the cut-out portion that is substantially parallel to the width direction of the sheet 10, the width of the cut-out 14 is narrowed, and at the same time, the protective film forming film 16 is pressed and slightly deformed also partially acts, so that adjacent The protective film formation film 16 and the unnecessary part 17 may contact and adhere.

After passing through the roller 19, in most cases, the attached portion of the protective film forming film 16 and the unnecessary portion 17 is separated again, but there are cases where it remains attached without being separated. When stripping is performed in the state in which the protective film forming film 16 and the unnecessary part 17 are attached, the protective film forming film 16 which should remain on the 1st peeling film 12 becomes the unnecessary part 17 to be removed and Together, it peels from the 1st peeling film 12 unintentionally, and it becomes stripping defect.

An object of the present invention is to provide a sheet for forming a protective film, which can sufficiently suppress a stripping defect, and a method for manufacturing the same, even when the width of the cut at the time of extraction is relatively narrow. .

Aspects of the present invention are as follows.

(1) a protective film forming film;

A long sheet having a first release film formed on one surface of the protective film forming film,

The sheet for forming a protective film having an adhesive force of 19 N/25 mm or less 2 minutes after affixing two protective film forming films at 23°C under a load of 2 kgf.

(2) The sheet for forming a protective film according to (1), wherein the surface elastic modulus of the surface of the first release film in contact with the protective film forming film is 17 MPa or less.

(3) when the sheet for forming a protective film is viewed in a plan view, a cutout is formed in the sheet for forming a protective film so that a part of the sheet for forming a protective film has a predetermined closed shape;

The sheet for forming a protective film according to (1) or (2), wherein in the thickness direction of the sheet for forming a protective film, the cut penetrates the film for forming a protective film and reaches a part of the first release film.

(4) The sheet|seat for protective film formation as described in (3) whose width|variety of the said cut|disconnection in the interface of the said protective film formation film and the said 1st peeling film is 8 micrometers or more.

(5) a step of forming cutouts so that a part of the sheet for forming a protective film according to (1) or (2) has a predetermined closed shape;

In the thickness direction of the said protective film formation sheet, the said cut penetrates the said protective film formation film, and the manufacturing method of the shearing-processed sheet for protective film formation in which it has reached|attained a part of the said 1st peeling film.

(6) The method for producing a sheet for forming a protective film according to (5), wherein the width of the cut at the interface between the protective film forming film and the first release film is 8 µm or more.

ADVANTAGE OF THE INVENTION According to this invention, also when the width|variety of the cut at the time of shearing is comparatively narrow, the sheet|seat for protective film formation which can fully suppress a stripping defect, and its manufacturing method are provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a cross-sectional schematic diagram of the sheet|seat for protective film formation which concerns on embodiment.
It is a cross-sectional schematic diagram which shows the state after shearing the sheet|seat for protective film formation which concerns on embodiment.
It is a cross-sectional schematic diagram of the sheet|seat for protective film formation which concerns on another embodiment.
It is a cross-sectional schematic diagram which shows the state after shearing the sheet|seat for protective film formation which concerns on another embodiment.
It is a schematic perspective view of the sheet|seat for protective film formation after a shearing process.
6 : is a schematic perspective view which shows a stripping process.
7 : is sectional drawing which shows the state in which the sheet|seat for protective film formation after a shearing process is passing through the roller.
It is a cross-sectional schematic diagram of an example of the chip|tip which has a protective film obtained by making the protective film formation film which concerns on this embodiment into a protective film.
It is a cross-sectional schematic diagram for demonstrating the process of sticking the sheet|seat for protective film formation which concerns on this embodiment to a wafer.
10 is a schematic cross-sectional view for explaining a step of separating a protective film-formed wafer into pieces.
11 is a schematic cross-sectional view for explaining a step of arranging a chip with a protective film on a substrate.

First, the main terms used in this specification will be described.

A work is a plate-shaped object processed by affixing the protective film formation film which concerns on this embodiment. As a work, a wafer and a panel are mentioned, for example. Specifically, a semiconductor wafer and a semiconductor panel are mentioned. As a workpiece of a workpiece, a chip obtained by dividing a wafer into pieces is mentioned, for example. Specifically, a semiconductor chip obtained by separating a semiconductor wafer into pieces is exemplified. In this case, the protective film is formed on the back side of the wafer and the chip.

The "surface" of a workpiece such as a wafer refers to a surface on which circuits and convex electrodes such as bumps are formed, and "back surface" refers to a surface on which circuits and electrodes (eg, convex electrodes such as bumps) are not formed. points to

In this specification, for example, "(meth)acrylate" is used as a word which shows both "acrylate" and "methacrylate", and it is the same about another similar term.

A peeling film is a film which supports a protective film formation film so that peeling is possible. The film does not limit the thickness and is used as a concept including a sheet.

The mass ratio in description regarding the composition for protective film formation films and the composition for release agent layers is based on an active ingredient (solid content), and unless there is a special explanation, a solvent is not included.

EMBODIMENT OF THE INVENTION Hereinafter, based on specific embodiment, this invention is demonstrated in detail in the following order.

(1. Protective film forming film)

1 and 5, the sheet|seat 10 for protective film formation which concerns on this embodiment is the 1st peeling film 12 formed in the one surface of the protective film formation film 11 and the protective film formation film 11, as shown to FIG. ), and is usually wound in a roll shape.

The protective film formation film 11 is affixed to a work and forms a protective film, thereby forming a protective film for protecting the work or the workpiece of the work.

"To form a protective film" means to put the protective film-forming film 11 in a state having sufficient characteristics to protect a work or a workpiece of the work. Specifically, when the protective film formation film which concerns on this embodiment is sclerosis|hardenable, "it turns into a protective film" means making an uncured protective film formation film into hardened|cured material. In other words, the protective film formation film formed into a protective film is hardened|cured material of a protective film formation film, and is different from a protective film formation film.

After laminating a work on the curable protective film forming film, by curing the protective film forming film, the protective film can be firmly adhered to the work and a durable protective film can be formed.

When the protective film forming film 11 does not contain a curable component and is used in a non-hardened state, when the protective film forming film which concerns on this embodiment is affixed to a work, the said protective film forming film becomes a protective film. In other words, the protective film may be the same as the protective film forming film.

Since it is not necessary to harden the protective film forming film when high protective performance is not requested|required, the protective film forming film may be non-curable.

In this embodiment, it is preferable that the protective film formation film is curable. Therefore, it is preferable that a protective film is hardened|cured material. As a hardened|cured material, a thermosetting material and an energy-beam hardened|cured material are illustrated, for example. In this embodiment, it is more preferable that a protective film is a thermosetting material.

Moreover, it is preferable that a protective film formation film has adhesiveness at normal temperature (23 degreeC), or exhibits adhesiveness by heating. Thereby, when superimposing a workpiece|work on a protective film formation film, both can be bonded together. Therefore, before hardening a protective film formation film, positioning can be performed reliably.

The protective film formation film may be comprised by one layer (single layer), and may be comprised by multiple layers of two or more layers. When a protective film formation film has multiple layers, these multiple layers may mutually be same or different, and the combination in particular of the layer which comprises these multiple layers is not restrict|limited.

In this embodiment, it is preferable that the protective film formation film is one layer (single layer). When the protective film forming film is composed of multiple layers, there is a risk that delamination may occur due to the difference in thermal elasticity between the layers in a process in which a temperature change occurs (during reflow processing or when using an apparatus), but if it is one layer, the risk is reduced can do.

The thickness of the protective film forming film is not particularly limited, but is preferably 100 µm or less, more preferably 70 µm or less, still more preferably 45 µm or less, and particularly preferably 30 µm or less. When the thickness of the protective film forming film is within the above range, when passing through the roller after the shearing step, even when the sheared protective film forming film and the unnecessary portion come into contact with and adhered, it becomes easy to separate again after passing through the roller. Moreover, it is preferable that it is 5 micrometers or more, and, as for the thickness of a protective film formation film, it is more preferable that it is 10 micrometers or more, It is more preferable that it is 15 micrometers or more. When the thickness of a protective film formation film exists in the said range, the protective performance of the protective film obtained will become favorable.

In addition, the thickness of a protective film formation film means the thickness of the whole protective film formation film. For example, the thickness of the protective film formation film comprised from multiple layers means the thickness of the sum total of all the layers which comprise a protective film formation film.

Hereinafter, the protective film formed on the chip as a workpiece of the workpiece will be described. The protective film formed by making the protective film formation film which concerns on this embodiment into a protective film specifically, using the protective film formation chip 30 shown in FIG. 8 is demonstrated.

As shown in FIG. 8 , as for the protective film forming chip 30 , a protective film 32 is formed on the back side (upper side in FIG. 8 ) of the chip 31 , and on the front side (downward in FIG. 8 ) of the chip 31 . side), a convex electrode 33 is formed.

A circuit is formed on the surface side of the chip 31, and the convex electrode 33 is formed so as to be electrically connected to the circuit. The protective film forming chip 30 is arranged so that the surface on which the convex electrode 33 is formed faces the chip mounting substrate. Then, it is electrically and mechanically joined to the said board|substrate through the convex electrode 33 by predetermined|prescribed heat processing (reflow process), and is mounted. As the convex electrode 33, a bump, a filler electrode, etc. are illustrated.

(1.1 Adhesion between protective film forming films)

In this embodiment, a stripping defect is suppressed by controlling the adhesive force when the protective film formation films which comprise the sheet|seat for protective film formation are affixed to a predetermined range. It is characterized by the adhesion force of 19 N/25 mm or less after 2 minutes after sticking two protective film formation films by the load of 2 kgf at 23 degreeC specifically,. The adhesive force is preferably 15 N/25 mm or less, and more preferably 11 N/25 mm or less. In addition, if the adhesive force is too small, the holding performance of the workpiece may be lowered. Therefore, the adhesive force is preferably 0.1 N/25 mm or more, more preferably 1 N/25 mm or more, and particularly preferably 3 N/25 mm or more. In addition, the reason that the measurement of adhesive force was set to 2 minutes after affixing protective film formation films is an apparatus which performs stripping and sticking to a workpiece|work, In the process in which the sheet|seat for protective film formation passes through the roller 19 WHEREIN: cut This is because the time during which the part is stopped in contact with the roller 19 is approximately 2 minutes.

By controlling the adhesive force between the protective film forming films in a predetermined range as described above, the protective film forming sheet is bent after the shearing step, and even if the sheared protective film forming film 16 and the unnecessary portion 17 are adhered, the protective film formation After the sheet passes through the roller, the protective film forming film 16 and the unnecessary portion 17 are separated again, so that the stripping defect is reduced.

(1.2 Composition for protective film forming film)

As long as the protective film forming film has the above physical properties, the composition of the protective film forming film is not particularly limited. In this embodiment, it is preferable that the composition (composition for protective film formation films) which comprises a protective film formation film is a resin composition containing a polymer component (A), a curable component (B), and a filler (E) at least. A polymer component is a component which can be considered to be formed by the polymerization reaction of a polymeric compound. Further, the thermosetting component is a component capable of curing (polymerization) reaction. Moreover, in this invention, a polycondensation reaction is also included in a polymerization reaction.

In addition, the component contained in a polymer component may correspond also to a sclerosing|hardenable component. In this embodiment, when the composition for protective film formation films contains the component corresponding to both such a polymer component and a sclerosing|hardenable component, it is considered that the composition for protective film formation films contains both a polymer component and a sclerosing|hardenable component.

(1.2.1 Polymer Component)

A polymer component (A) provides an appropriate tack|tack to a protective film formation film, giving film formation (film-forming property), and ensures uniform sticking of the protective film formation film with respect to a workpiece|work. The weight average molecular weight of a polymer component is 50,000-2 million normally, Preferably it is 100,000-1,500,000, Especially preferably, it exists in the range of 200,000-1 million. When the weight average molecular weight is too low, there exists a tendency for the adhesive force of protective film formation films to increase. On the other hand, when the weight average molecular weight is too high, compatibility with other components will worsen, and uniform film formation is hindered as a result. As such a polymer component, an acrylic resin, a urethane resin, a phenoxy resin, a silicone resin, saturated polyester resin etc. are used, for example, Especially an acrylic resin is used preferably.

In addition, in this specification, unless otherwise indicated, a "weight average molecular weight" is a polystyrene conversion value measured by the gel permeation chromatography (GPC) method. The measurement by such a method is, for example, high-speed column "TSK gurd column H _XL -H", "TSK Gel GMH _XL ", "TSK Gel G2000 H" in high-speed GPC apparatus "HLC-8120GPC" manufactured by Tosoh Corporation. _XL " (above, both manufactured by Tosoh Corporation) is used in this order, and the detector is used as a differential refractometer under the conditions of a column temperature: 40°C and a liquid feed rate: 1.0 mL/min.

As acrylic resin, the (meth)acrylic acid ester copolymer which consists of structural units derived from a (meth)acrylic acid ester monomer and a (meth)acrylic acid derivative is mentioned, for example. Here, as a (meth)acrylic acid ester monomer, Preferably (meth)acrylic acid alkylester whose C1-C18 alkyl group is mentioned, Specifically, (meth)acrylate methyl, (meth)ethyl acrylate, (meth)acrylate ) propyl acrylate, (meth)butyl acrylate, etc. are used. Moreover, as a (meth)acrylic acid derivative, (meth)acrylic acid, (meth)acrylic-acid glycidyl, (meth)acrylic-acid hydroxyethyl, etc. are mentioned, for example.

In this embodiment, it is preferable to introduce|transduce a glycidyl group into an acrylic resin using glycidyl methacrylate etc. The compatibility of the acrylic resin into which the glycidyl group was introduce|transduced and the epoxy resin as a thermosetting component mentioned later improves, the glass transition temperature (Tg) after hardening of a protective film formation film becomes high, and heat resistance improves. Moreover, in this embodiment, in order to control the adhesiveness with respect to a workpiece|work, and adhesive physical property, it is preferable to introduce|transduce a hydroxyl group into an acrylic resin using hydroxyethyl acrylate etc.

The glass transition temperature of the acrylic resin is preferably -70°C to 40°C, more preferably -35°C to 35°C, more preferably -20°C to 30°C, still more preferably -10°C to 25°C, Especially preferably, it is -5 degreeC - 20 degreeC. Since the fluidity|liquidity at the time of heating of a protective film formation film and a protective film is suppressed by making the glass transition temperature of an acrylic resin into the said range, a smooth protective film is easy to be obtained. When a glass transition temperature is too low, there exists a tendency for the adhesive force of protective film formation films to increase. When the glass transition temperature is too high, compatibility with other components deteriorates, and as a result, uniform film formation is prevented.

When an acrylic resin has the structural unit of m types (m is an integer of 2 or more), the glass transition temperature of the said acrylic resin is computable as follows. That is, when non-overlapping numbers from 1 to m are sequentially assigned to each of the m types of monomers that induce structural units in the acrylic resin, and named "monomer m", the glass transition temperature of the acrylic resin ( Tg) is computable using the formula of Fox shown below.

[Equation 1]

(wherein Tg is the glass transition temperature of the acrylic resin; m is an integer of 2 or more; Tgk is the glass transition temperature of the homopolymer of the monomer m; Wk is the structural unit m derived from the monomer m in the acrylic resin mass fraction, provided that Wk satisfies the following formula)

[Equation 2]

(Wherein, m and Wk are the same as above.)

As Tgk, the value described in a polymer data handbook, an adhesive handbook, a Polymer Handbook, etc. can be used. For example, the Tgk of the homopolymer of methyl acrylate is 10 °C, the Tgk of the homopolymer of n-butyl acrylate is -54 °C, the Tgk of the homopolymer of methyl methacrylate is 105 °C, 2-hydroxyethylacryl The Tgk of the homopolymer of the rate is -15°C, the Tgk of the homopolymer of glycidyl methacrylate is 41°C, and the Tgk of 2-ethylhexyl acrylate is -70°C.

Content of the polymer component when the total weight of the composition for protective film formation films is 100 mass parts becomes like this. Preferably it is 5-80 mass parts, More preferably, it is 8-70 mass parts, More preferably, it is 10-60 mass parts, More preferably, it is 12-55 mass parts, More preferably, it is 14-50 mass parts, Especially preferably, it is 15-45 mass parts. When content of a polymer component is in the said range, since the quantity of the low molecular-weight component which increases the adhesive force of protective film formation films is restrict|limited to an appropriate range, the material design of the composition for protective film formation films becomes easy.

(1.2.2 thermosetting components)

A curable component (B) hardens a protective film formation film, and forms a hard protective film. As the curable component, a thermosetting component, an energy ray-curable component, or a mixture thereof can be used. When hardening by irradiation of an energy ray, since the protective film formation film which concerns on this embodiment contains the filler, a coloring agent, etc. which are mentioned later, the light transmittance falls. Therefore, for example, when the thickness of a protective film formation film becomes thick, energy-beam hardening tends to become inadequate.

On the other hand, even if the thickness of a thermosetting protective film formation film becomes thick, since it fully hardens|cures by heating, a protective film with high protective performance can be formed. Moreover, by using normal heating means, such as a heating oven, a large number of protective film formation films can be heated collectively, and can be thermosetted.

Therefore, in this embodiment, it is preferable that a sclerosing|hardenable component is thermosetting. That is, it is preferable that the protective film formation film which concerns on this embodiment is thermosetting.

Whether or not the protective film forming film is thermosetting can be judged as follows. First, the protective film formation film of normal temperature (23 degreeC) is heated until it becomes the temperature exceeding normal temperature, Then, it is set as the protective film formation film after a heating and cooling by cooling until it becomes normal temperature. Next, when the hardness of the protective film forming film after heating and cooling is compared with the hardness of the protective film forming film before heating at the same temperature, when the protective film forming film after heating and cooling is harder, it is judged that this protective film forming film is thermosetting do.

As the thermosetting component, for example, an epoxy resin, a thermosetting polyimide resin, an unsaturated polyester resin, and mixtures thereof are preferably used. In addition, thermosetting polyimide resin is a generic name of the low molecular weight, low viscosity monomer or precursor polymer which forms a polyimide resin by thermosetting. Non-limiting examples of thermosetting polyimide resins are, for example, in the Journal of the Textile Society "Fiber and Industry", Vol. 50, No. 3 (1994), P106-P118.

The epoxy resin as the thermosetting component has a property of forming a three-dimensional network and forming a strong film when heated. As such an epoxy resin, a conventionally well-known various epoxy resin is used. In the present embodiment, the molecular weight (food) of the epoxy resin is preferably 300 or more and less than 50000, 300 or more and less than 10000, 300 or more and less than 5000, and 300 or more and less than 3000. Moreover, it is preferable that it is 50-5000 g/eq, as for the epoxy equivalent of an epoxy resin, it is more preferable that it is 100-2000 g/eq, It is more preferable that it is 150-1000 g/eq.

Specific examples of the epoxy resin include glycidyl ethers of phenols such as bisphenol A, bisphenol F, resorcinol, phenyl novolac, and cresol novolac; glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ethers of carboxylic acids such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidyl-type or alkylglycidyl-type epoxy resins in which active hydrogen bonded to a nitrogen atom, such as aniline isocyanurate, is substituted with a glycidyl group; Vinylcyclohexane diepoxide, 3,4-epoxycyclohexylmethyl-3,4-dicyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexyl-5,5-spiro (3,4-epoxy) ) such as cyclohexane-m-dioxane, so-called alicyclic epoxides in which an epoxy is introduced by, for example, oxidation of a carbon-carbon double bond in a molecule. In addition, the epoxy resin which has a biphenyl skeleton, a dicyclohexadiene skeleton, a naphthalene skeleton, etc. can also be used.

When using a thermosetting component as a curable component (B), it is preferable to use together a hardening|curing agent (C) as an adjuvant. As the curing agent for the epoxy resin, a heat-activated latent epoxy resin curing agent is preferable. "Heat-activated latent epoxy resin curing agent" is a curing agent of a type that does not react well with an epoxy resin at room temperature (23°C), but is activated by heating at a certain temperature or higher and reacts with the epoxy resin. Examples of the activation method of the heat-activated latent epoxy resin curing agent include a method of generating active species (anions, cations) by a chemical reaction by heating; a method in which it is stably dispersed in an epoxy resin in the vicinity of room temperature and is compatible and dissolved with an epoxy resin at a high temperature to initiate a curing reaction; A method of initiating a curing reaction by eluting at a high temperature as a curing agent of a molecular sieve encapsulation type; A method using microcapsules and the like exist.

Among the exemplified methods, a method in which a curing reaction is initiated by stably dispersed in the epoxy resin near room temperature and compatible with and dissolved in the epoxy resin at a high temperature is preferable.

Specific examples of the thermally active latent epoxy resin curing agent include various onium salts, dibasic acid dihydrazide compounds, dicyandiamide, amine adduct curing agents, and high melting point active hydrogen compounds such as imidazole compounds. These thermally active latent epoxy resin curing agents can be used individually by 1 type or in combination of 2 or more type. In this embodiment, dicyandiamide is especially preferable.

Moreover, as a hardening|curing agent with respect to an epoxy resin, a phenol resin is also preferable. As a phenolic resin, the condensate of phenols, such as alkylphenol, polyhydric phenol, and naphthol, and aldehydes, etc. are not restrict|limited and used in particular. Specifically, phenol novolak resin, o-cresol novolak resin, p-cresol novolak resin, t-butylphenol novolak resin, dicyclopentadiencresol resin, polyparavinyl phenol resin, bisphenol A type novolak resin , or modified products thereof, etc. are used.

The phenolic hydroxyl group contained in these phenolic resin can easily add-react with the epoxy group of the said epoxy resin by heating, and can form the hardened|cured material with high impact resistance.

The content of the curing agent (C) is preferably 0.01 to 30 parts by mass, further preferably 0.1 to 20 parts by mass, more preferably 0.2 to 15 parts by mass, particularly preferably 0.3 to 100 parts by mass of the epoxy resin. - 10 parts by mass. Since the network structure of a protective film becomes dense by making content of a hardening|curing agent (C) into said range, the performance which protects a workpiece|work as a protective film is easy to be acquired.

When using dicyandiamide as a hardening|curing agent (C), it is preferable to use together a hardening accelerator (D) further. Examples of the curing accelerator include 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, Preferred are imidazoles such as 2-phenyl-4-methyl-5-hydroxymethylimidazole (imidazole in which one or more hydrogen atoms are substituted with groups other than hydrogen atoms). Among these, 2-phenyl-4-methyl-5-hydroxymethylimidazole is especially preferable.

To [ content of a hardening accelerator / 100 mass parts of epoxy resins ] Preferably 0.01-30 mass parts, More preferably, 0.1-20 mass parts, More preferably, 0.2-15 mass parts, Especially preferably, 0.3-10 mass parts is the mass part. By making content of a hardening accelerator (D) into said range, since the network structure of a protective film becomes dense, the performance which protects a workpiece|work as a protective film is easy to be acquired.

The total content of the thermosetting component and the curing agent when the total weight of the composition for protective film forming films is 100 parts by mass is preferably 3 to 80 parts by mass, more preferably 5 to 60 parts by mass, more preferably 7 to It is 50 mass parts, More preferably, it is 9-40 mass parts, Especially preferably, it is 10-30 mass parts. When a thermosetting component and a hardening|curing agent are mix|blended in such a ratio, an appropriate tack|tack will be shown before hardening, and sticking operation can be performed stably. Moreover, after hardening, the performance which protects a workpiece|work as a protective film is easy to be acquired.

When a low molecular weight compound is used as a thermosetting component and a hardening|curing agent, the tack of a protective film formation film may rise and the adhesive force of protective film formation films may increase. Therefore, the type of the thermosetting component and the curing agent and the blending amount thereof are preferably selected so as to control the tack to an appropriate value within the above range.

(1.2.3 Energy-ray-curable component)

When a sclerosing|hardenable component (B) is an energy ray-curable component, it is preferable that it is non-hardened, and, as for an energy ray-curable component, it is preferable to have adhesiveness, and it is more preferable that it is non-hardened and has adhesiveness.

An energy-beam-curable component is a component hardened|cured by irradiation of an energy-beam, and is also a component for providing film-forming property, flexibility, etc. to a protective film formation film.

As the energy ray-curable component, for example, a compound having an energy ray-curable group is preferable. As such a compound, a well-known thing is mentioned.

When a low molecular weight compound is used as an energy ray-curable component, the adhesiveness of a protective film formation film may rise, and the adhesive force of protective film formation films may increase. Therefore, it is preferable to select the kind of energy-beam-curable component and its compounding quantity so that a tack may be controlled to an appropriate value.

(1.2.4 Filling)

When the protective film-forming film contains the filler (E), the protective film obtained by forming the protective film-forming film into a protective film can easily adjust the thermal expansion coefficient, and by making this thermal expansion coefficient close to the thermal expansion coefficient of the work, obtained using the protective film-forming film The adhesive reliability of the package is further improved. Moreover, when a protective film formation film contains a filler (E), a hard protective film is obtained, and the moisture absorption rate of a protective film can be reduced, and the adhesive reliability of a package improves further.

Although any of an organic filler and an inorganic filler may be sufficient as a filler (E), it is preferable that it is an inorganic filler from a viewpoint of the shape stability in high temperature.

As a preferable inorganic filler, For example, powders, such as a silica, an alumina, a talc, a calcium carbonate, a bengala, a silicon carbide, and boron nitride; Beads obtained by spheroidizing these inorganic fillers; The surface-modified product of these inorganic fillers; single crystal fibers of these inorganic fillers; Glass fiber etc. are mentioned. Among these, silica and surface-modified silica are preferable. The surface-modified silica is preferably surface-modified with a coupling agent, and more preferably surface-modified with a silane coupling agent.

The average particle diameter of the filler is preferably 0.02 to 10 µm, more preferably 0.05 to 5 µm, particularly preferably 0.10 to 3 µm.

By making the average particle diameter of a filler into said value, the handleability of the composition for protective film formation films becomes favorable. Therefore, the composition for protective film formation films and the quality of a protective film formation film are easy to stabilize.

In this specification, "average particle diameter" means the value of the particle diameter (D50) at 50% of the integrated value in the particle size distribution curve obtained by the laser diffraction scattering method, unless otherwise specified.

Content of the filler when the total weight of the composition for protective film formation films is 100 mass parts becomes like this. Preferably it is 15-80 mass parts, More preferably, it is 30-75 mass parts, More preferably, it is 40-70 mass parts, Especially preferably Preferably it is 45-65 mass parts.

By making content of a filler into said value, it is easy to control the adhesive force of protective film formation films in an appropriate range. When there is too little content of a filler, the tack of a protective film formation film will increase, and the adhesive force of protective film formation films will increase excessively. On the other hand, if the blending amount of the filler is too large, the shape retention of the protective film forming film is lowered, the film cannot maintain its shape due to bending due to the roller, or the tack and adhesiveness of the protective film forming film to the work is excessively reduced. there is

Moreover, it is preferable that the protective film formation film contains 2 or more types of fillers. That is, it is preferable that a filler (E) is a mixture of 2 or more types of fillers. Two or more types of fillers from which materials differ may be included with "two or more types of fillers are included", and two or more types of fillers from which an average particle diameter differs may be included.

In this embodiment, it is preferable to contain 2 or more types of fillers from which an average particle diameter differs. When the filler from which an average particle diameter differs is contained in a protective film formation film, it becomes easy to arrange|position a filler with a small average particle diameter in the clearance gap of a filler with a large average particle diameter. As a result, it becomes easy to make the adhesive force of protective film formation films into said range, while said effect is acquired.

When two or more types of fillers having different average particle diameters are included, the average particle diameter of the filler having the largest average particle diameter is preferably 1.5 to 100 times the average particle diameter of the filler having the smallest average particle diameter, and more preferably 2 to 20 times. , more preferably 3 to 18 times.

In addition, whether the protective film or protective film formation film contains two or more types of fillers from which an average particle diameter differs can be confirmed also by observing the cross section of a protective film or protective film formation film.

(1.2.5 Coupling agent)

It is preferable that a protective film formation film contains a coupling agent (F). By containing a coupling agent, after hardening of a protective film formation film WHEREIN: While not impairing the heat resistance of a protective film, while being able to improve the adhesiveness of a protective film and a work, water resistance (moisture and heat resistance) can be improved. As the coupling agent, a silane coupling agent is preferable in terms of its versatility and cost advantages.

Examples of the silane coupling agent include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ- (methacryloxypropyl)trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-amino Propylmethyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis (3-triethoxysilylpropyl)tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazolesilane, etc. are mentioned. These can be used individually by 1 type or in mixture of 2 or more types.

Content of the coupling agent when the total weight of the composition for protective film formation films is 100 mass parts becomes like this. Preferably they are 0.01-20 mass parts, 0.1-10 mass parts, 0.2-5 mass parts, and 0.3-3 mass parts.

(1.2.6 Colorant)

It is preferable that a protective film formation film contains a coloring agent (G). Thereby, since the back surface of the workpiece of a workpiece, such as a chip, is hidden, various electromagnetic waves generated in an electronic device can be blocked, and malfunction of a workpiece|work, such as a chip, can be reduced. Moreover, when a stripping defect generate|occur|produces, it can detect immediately with the naked eye.

As a coloring agent (G), well-known things, such as an inorganic type pigment, an organic type pigment, and organic type dye, can be used, for example. In this embodiment, an inorganic pigment is preferable.

Examples of inorganic pigments include carbon black, cobalt pigments, iron pigments, chromium pigments, titanium pigments, vanadium pigments, zirconium pigments, molybdenum pigments, ruthenium pigments, platinum pigments, ITO (indium tin oxide) ) dyes, and ATO (antimony tin oxide) dyes. Among these, it is especially preferable to use carbon black. According to carbon black, electromagnetic waves in a wide wavelength range can be blocked.

The compounding amount of the colorant (especially carbon black) in the protective film-forming film varies depending on the thickness of the protective film-forming film, for example, when the thickness of the protective film-forming film is 20 µm, the total weight of the composition for protective film-forming film is 100 Content of a coloring agent when it is set as mass part becomes like this. Preferably it is 0.01-10 mass parts, More preferably, it is 0.03-7 mass parts, More preferably, it is 0.05-4 mass parts.

It is preferable that it is 1-500 nm, and, as for the average particle diameter of a coloring agent (especially carbon black), it is especially preferable that it is 3-100 nm, It is more preferable that it is 5-50 nm. When the average particle diameter of a coloring agent exists in said range, it will be easy to control a light transmittance to a desired range.

(1.2.7 Other additives)

The composition for protective film formation films is within the range which does not impair the effect of this invention, As another additive, For example, a photoinitiator, a crosslinking agent, a plasticizer, an antistatic agent, antioxidant, a gettering agent, a tackifier, a release agent. etc. may be contained.

However, it is preferable that content of the releasing agent in the composition for protective film formation films is less than predetermined quantity. In this embodiment, it is preferable that it is less than 0.00099 mass % with respect to the total mass of a protective film formation film. When there is too much content of a release agent, there exists a tendency for the adhesive reliability of a protective film and a workpiece|work to fall. Examples of the release agent include an alkyd release agent, a silicone release agent, a fluorine release agent, an unsaturated polyester release agent, a polyolefin release agent, and a wax release agent.

(1.2.8 Control of adhesion between protective film forming films)

As above-mentioned, in this embodiment, the adhesive force at the time of bonding together the protective film formation films which comprise the sheet|seat for protective film formation is controlled in a predetermined range, It is characterized by the above-mentioned, The stripping defect is suppressed by this.

The adhesive force of protective film formation films is controllable with the kind of each component which comprises a protective film formation film, and its compounding quantity.

When the weight average molecular weight of the polymer component (A) is low, the adhesion tends to increase. When the glass transition temperature of the polymer component (A) is low, the adhesion tends to increase. Moreover, when a low molecular-weight compound is used as a curable component (B), a hardening|curing agent (C), a hardening accelerator (D), and an energy-beam curable component, there exists a tendency for adhesive force to increase. When there is much compounding quantity of a filler (E), there exists a tendency for adhesive force to fall.

By partially curing the protective film forming film, the adhesive force can also be controlled. For example, adhesive force can be reduced by hardening|curing a sclerosing|hardenable component (B) partially. The timing to partially harden the protective film formation film is not specifically limited, For example, in the case of shearing of the sheet|seat for protective film formation, what is necessary is just a step before passing through the roller 19. However, from the viewpoint of making the peeling forces F1 and F2 described later in appropriate ranges, and from the viewpoint of adhesion to the work, it is preferable that the protective film-forming film is not partially cured as in the Examples described later.

(2. Sheet for forming a protective film)

Before use, the protective film forming film is in the form of a protective film forming sheet 10 having a two-layer structure in which a protective film forming film 11 is laminated so as to be peelable on a first release film 12, as shown in FIG. 1 , It may be wound up and stored. Further, as shown in Fig. 3, a sheet for forming a protective film having a three-layer structure in which a protective film forming film 11 is sandwiched between two release films (the first release film 12 and the second release film 13). In the form of (20) (another embodiment), you may wind up and store. The release film is peeled off at the time of use of the protective film forming film.

The sheet for forming a protective film is long, wound in a roll shape, and stored and transported. As such a sheet for forming a protective film, there is also known a sheet for forming a protective film in which the protective film forming film is subjected to shearing in advance to be substantially the same shape as the work. In this shear-processed protective film forming sheet, the protective film forming film 16 sheared into a predetermined closed shape is laminated on the first release film 12 (FIG. 2) or between two release films 12 and 13. It is pinched to (Fig. 4).

The 1st peeling film may be comprised from the base material of one layer (single layer) or two or more layers, and from a viewpoint of controlling peelability, the peeling process of the surface of a base material may be carried out. That is, the surface of the base material may be modified, and a material not derived from the base material may be formed on the surface of the base material. In this embodiment, it is preferable that a 1st peeling film has a base material and a release agent layer. By having a release agent layer, it is easy to control the physical property of the surface in which the release agent layer is formed in the 1st peeling film. In this embodiment, after apply|coating the coating agent containing the composition for release agent layers mentioned later to one surface of a base material, a release agent layer is formed by drying and hardening the coating film. Thereby, a 1st peeling film is obtained.

Although the thickness in particular of the 1st peeling film 12 is not restrict|limited, Preferably it is 30-100 micrometers, More preferably, it is 40-80 micrometers, More preferably, it is 45-70 micrometers.

When the lower limit of the thickness of the 1st peeling film 12 is said value, at the time of cutting of the protective film formation film by a cutting blade, a cutting blade penetrates the 1st peeling film 12, and the 1st peeling film 12 ) can be prevented from being cut. Further, until the sheet 10 for forming a protective film is fed out and the film 11 for forming a protective film is cut out and conveyed to the next step, the sheet 10 for forming a protective film passes through rollers such as guide rollers in the apparatus, the first When the upper limit of the thickness of the peeling film 12 is said value, it can prevent that the protective film formation film 11 peels from the 1st peeling film 12.

In addition, the thickness of the 1st peeling film 12 means the thickness of the 1st peeling film whole. For example, the thickness of the 1st peeling film comprised from multiple layers means the thickness of the sum total of all the layers which comprise a 1st peeling film.

As a base material of the 1st peeling film 12, a resin film, paper, etc. are mentioned. Examples of the resin for the resin film include polyethylene terephthalate, polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polybutylene terephthalate, polyurethane, ethylene-vinyl acetate copolymer. , ionomer resin, ethylene (meth)acrylic acid copolymer, polystyrene, polycarbonate, fluororesin, low-density polyethylene, linear low-density polyethylene, triacetyl cellulose, and the like. Examples of the paper include fine paper, coated paper, glassine paper, and laminated paper. These may be used individually by 1 type, and may use 2 or more types together. Among these, a polyethylene terephthalate film is preferable from a viewpoint that it is inexpensive and there is also rigidity.

The peeling process may be carried out with the composition for release agent layers at least on the single side|surface (surface laminated|stacked with a protective film formation film) of the 1st peeling film 12. It is preferable that they are 30 nm or more and 200 nm or less, and, as for the thickness of a release agent layer, it is more preferable that they are 50 nm or more and 180 nm or less.

The surface elastic modulus (23°C) of the surface of the first release film 12 in contact with the protective film forming film 11 is preferably 17 MPa or less, more preferably 14 MPa or less, more preferably 13 MPa or less, particularly preferably preferably 12 MPa or less. The surface elastic modulus is an index of the easiness of deformation of the surface. By making the surface elastic modulus of the surface in contact with the protective film formation film 11 of the 1st peeling film 12 into the said range, a shearing die is press-fitted in a shearing process, and when it draws out after that, the protective film formation film 11 It can suppress that a float (a peeling of about 1-4 mm) generate|occur|produces between and the 1st peeling film 12. This is considered to be because the surface of the first release film 12 is relatively soft, and therefore the surface of the first release film follows the deformation of the protective film forming film even if there is compression by a shearing die and depressurization by the detachment. . By suppressing generation|occurrence|production of a float, a stripping defect can be reduced more. The lower limit of the surface elastic modulus of the surface of the first peeling film 12 in contact with the protective film forming film 11 is not particularly limited, but if the surface elastic modulus is too low, the peeling force may increase. , more preferably 4 MPa or more, particularly preferably 5 MPa or more.

The surface elastic modulus of the surface which contact|connects the protective film formation film 11 of the 1st peeling film 12 in 23 degreeC can be measured using the atomic force microscope provided with a cantilever. That is, with respect to the surface which contact|connects the protective film formation film 11 of the 1st peeling film 12, press-fitting of a cantilever and isolation|separation are performed, and a force curve curve is obtained. With respect to the obtained force curve curve, fitting by JKR theoretical formula is performed, the elasticity modulus is calculated|required, and let it be the surface elasticity modulus of this invention. A specific measurement method will be described in detail in Examples to be described later.

In order to make the peeling force F1 mentioned later into an appropriate range, and to make the surface elastic modulus of the 1st peeling film 12 into the said range, in this embodiment, the composition for release agent layers is an alkyd type release agent, a silicone type release agent, a fluorine type release agent, unsaturated, for example. A polyester-based mold release agent, a polyolefin-based mold release agent, and a wax-based mold release agent are preferable, and among these, a silicone-based mold release agent is preferable, and it is particularly preferable to include a silicone-based mold release agent and a heavy release additive.

As a silicone type mold release agent, the silicone mold release agent which mix|blended the silicone which has dimethylpolysiloxane as a basic skeleton can be used.

The silicone may be any of an addition reaction type, a condensation reaction type, and an energy ray curing type such as an ultraviolet curing type and an electron beam curing type, but is preferably an addition reaction type silicone. The addition reaction type silicone has advantages such as high reactivity and excellent productivity, and a small change in peel force after manufacture and no cure shrinkage compared to a condensation reaction type silicone.

Specific examples of the addition-reaction silicone include organopolysiloxane having two or more alkenyl groups having 2 to 10 carbon atoms such as vinyl, allyl, propenyl, and hexenyl groups at the terminal and/or side chain of the molecule. can be heard From the viewpoint of lowering the surface elastic modulus, it is preferable that the number of alkenyl groups in the addition-reaction silicone is small.

When the total weight of the release agent layer composition (excluding the catalyst described later) is 100 parts by mass, the content of silicone composed of dimethylpolysiloxane is preferably less than 100 parts by mass, more preferably less than 90 parts by mass, more preferably is less than 80 parts by mass, particularly preferably less than 70 parts by mass.

When using such an addition reaction type silicone, it is preferable to use a crosslinking agent and a catalyst together.

As a crosslinking agent, the organopolysiloxane which has at least 2 silicon atoms to which the hydrogen atom couple|bonded in 1 molecule is mentioned, for example. From a viewpoint of making surface elastic modulus low, it is preferable that there is little content of the crosslinking agent in the composition for release agent layers.

Specific examples of the crosslinking agent include terminal-blocking dimethylsiloxane-methylhydrogensiloxane copolymer, trimethylsiloxane-methylhydrogensiloxane copolymer, terminal-blocking trimethylsiloxy group methylhydrogenpolysiloxane, poly(hydroxy Rosensilsesquioxane) etc. are mentioned.

Examples of the catalyst include particulate platinum, particulate platinum adsorbed on a carbon powder carrier, chloroplatinic acid, alcohol-modified chloroplatinic acid, olefin complex of chloroplatinic acid, and platinum group metal compounds such as palladium and rhodium.

By using such a catalyst, the hardening reaction of the composition for release agent layers can be advanced more efficiently.

The content of the silicone-based release agent when the total weight of the composition for release agent layer (excluding the catalyst) is 100 parts by mass is, from the viewpoint of bringing the surface elastic modulus into the above-mentioned range, and the peeling force F1 to be described later within the appropriate range, Preferably it is 30-100 mass parts, More preferably, it is 50-100 mass parts.

A heavy peeling additive is used in order to enlarge the peeling force F1 mentioned later. Although organosilane, such as a silicone resin and a silane coupling agent, is mentioned as a heavy release additive, for example, it is preferable to use a silicone resin among these.

As the silicone resin, it is preferable to use, for example, MQ resin including M units that are monofunctional siloxane units [R ₃ SiO _1/2 ] and Q units that are tetrafunctional siloxane units [SiO _4/2 ]. In addition, three R in M unit respectively independently represent a hydrogen atom, a hydroxyl group, or an organic group. From the viewpoint of easily suppressing silicone migration, at least one of the three Rs in the M unit is preferably a hydroxyl group or a vinyl group, and more preferably a vinyl group. It is preferable that there is little content of the silicone resin (especially MQ resin) in the composition for release agent layers from a viewpoint of making surface elastic modulus low.

The content of the heavy release additive when the total weight of the release agent layer composition (excluding the catalyst) is 100 parts by mass is preferably 0 to 50 parts by mass, more preferably 5 to 45 parts by mass, particularly preferably 10 - 40 parts by mass.

It is preferable to use the composition for release agent layers as a coating agent containing a dilution solvent together with the various active ingredients mentioned above from a viewpoint of adjusting a viscosity and improving the applicability|paintability with respect to a base material. In this specification, an "active ingredient" refers to the component except a dilution solvent among the components contained in the coating agent containing the composition used as object.

Examples of the dilution solvent include organic solvents such as aromatic hydrocarbons such as toluene, fatty acid esters such as ethyl acetate, ketones such as methyl ethyl ketone, and aliphatic hydrocarbons such as hexane and heptane. These dilution solvents may be used individually by 1 type, and may use 2 or more types together.

As an active ingredient (solid content) concentration of the coating agent containing the composition for release agent layers, Preferably it is 0.3-10 mass %, More preferably, it is 0.5-5 mass %, More preferably, it is 0.5-3 mass %.

The composition for release agent layers may contain the additive generally used in a release agent layer in the range which does not impair the effect of this invention. As such an additive, a dye, a dispersing agent, etc. are mentioned.

In the sheet|seat 10 for protective film formation which concerns on this embodiment, it is preferable that the protective film formation film 11 is shear-processed to a predetermined shape. That is, when the sheet 10 for forming a protective film is viewed in a plan view, it is preferable that the cutout 14 is formed in the sheet for forming a protective film so that a part of the sheet 10 for forming a protective film has a predetermined closed shape. In addition, the shape of the protective film forming film after shearing is preferably smaller than the shape of the work from the viewpoint that the protective film forming film does not protrude from the work when the protective film forming film is affixed to the work.

(3. Manufacturing method of sheet for forming a protective film)

The manufacturing method in particular of a protective film formation film is not limited. The said film is manufactured using the coating agent containing the composition for protective film formation films mentioned above. A coating agent mixes the component which comprises the composition for protective film formation films by a well-known method, and is prepared.

The obtained coating agent is applied to the release surface of the first release film 12 using a coater such as a roll coater, knife coater, roll knife coater, air knife coater, die coater, bar coater, gravure coater, or curtain coater and dried It makes it, and the sheet|seat 10 for protective film formation which concerns on this embodiment which has the protective film formation film 11 on the 1st peeling film 12 is obtained. Moreover, you may transcribe|transfer the protective film formation film obtained by apply|coating and drying a coating agent on another resin film to a 1st peeling film. When obtaining the sheet|seat 20 for protective film formation which concerns on another embodiment, the 1st peeling film 12 and the 2nd peeling film 13 are bonded to the exposed surface of the laminated|stacked protective film formation film 11, and two sheets The sheet|seat 20 for protective film formation by which the protective film formation film 1 was pinched|interposed by the peeling film is obtained.

(4. Manufacturing method of sheet for forming a protective film subjected to shear processing)

The method of shearing the sheet|seat 10 for protective film formation, and obtaining the protective film formation film 16 shear-processed into the predetermined closed shape on the 1st peeling film 12 is demonstrated.

(4.1 Shearing process)

First, as shown in FIG. 1, the sheet|seat 10 for protective film formation which is not shear-processed is prepared. From the side of the protective film forming film 11 side of the protective film forming sheet 10, the protective film forming film 11 is penetrated by a shearing die (not shown), and to a part of the surface of the first release film 12 Insert the infeed (14) to reach it. An operation in which the infeed is made to reach part of the surface and not completely cut is called a half-cut. As a result, the cutout 14 is formed in a part of the surface of the sheet 10 for forming a protective film so as to have a predetermined closed shape (see Figs. 2 and 5). Here, the predetermined closed shape becomes substantially the same shape as the wafer when the protective film forming film is transferred to the semiconductor wafer. That is, the cutout 14 is formed so that it may become substantially the same shape as the shape of the workpiece|work to which the protective film formation film 11 is affixed, or the area|region which should form a protective film. This process is called a "shear processing process".

By the shearing process, the protective film forming film 11 is divided into the protective film forming film 16 shear-processed into the predetermined closed shape, and the unnecessary part 17 continuous around it. The protective film forming film 16 sheared into a predetermined closed shape is provided at a plurality of locations along the longitudinal direction of the protective film forming sheet 10 .

In a shearing process, a well-known shearing die can be used suitably. Shearing is performed by cutting|disconnecting the protective film formation film 11 completely, and carrying out half-cut so that the 1st peeling film 12 may not be cut|disconnected completely.

The cross-sectional shape of the cut 14 is, as shown in Figs. 2 and 4, almost wedge-shaped, and the width of the cut 14 is wide on the upper surface side of the protective film forming film 11 into which the shear die enters, On the lower surface side (interface of the protective film formation film 11 and the 1st peeling film 12), it becomes narrow. The width of the cut 14 is not particularly limited, but from the viewpoint of preventing contact and adhesion of the shear-processed protective film forming film 16 and the unnecessary portion 17, or shortening the contact and adhesion time, The width D of the cut 14 in the lower surface portion of the protective film forming film 11 (that is, the upper surface portion of the first release film 12) is preferably 8 µm or more, more preferably 10 µm or more, , more preferably 15 µm or more, and particularly preferably 20 µm or more. Width D cut|disconnects the sheet|seat for protective film formation in the thickness direction, and can measure it as the width|variety of the cut in the upper surface part of the 1st peeling film 12 of a cross section. The upper limit of the width D is not particularly limited, but considering the width of the cutting blade that can reliably cut the protective film-forming film, it is usually 100 µm or less, preferably 80 µm or less, more preferably 60 µm or less, More preferably, it is 40 micrometers or less. In order to form such a cut 14, it is preferable to use as a shearing die|dye which has a cutting blade with a comparatively wide blade width|variety at the front-end|tip part.

The sheet 10 for forming a protective film subjected to shearing through the above steps is obtained. When the shear-processed sheet 10 for forming a protective film is planarly viewed from the upper surface of the protective film forming film 11, a part of the sheet for forming a protective film has a predetermined closed shape (for example, substantially the same shape as the planar shape of a semiconductor wafer) The cutout 14 is formed in the sheet for protective film formation so that it may have ), and the cutout 14 has reached a part of the 1st peeling film 12 in the thickness direction of the sheet|seat 10 for protective film formation. That is, a cut is formed also in the surface of the 1st peeling film 12 which contact|connects the protective film formation film 11. By making a cutting blade reach to the 1st peeling film 12, the protective film formation film 11 can be cut|disconnected completely.

(4.2 Stripping Process)

The sheet 10 for forming a protective film passes through a plurality of rollers such as guide rollers for the purpose of, for example, control of the tension of the sheet for forming a protective film between the shearing process and the stripping process.

In the stripping process, as shown in FIG. 6, the continuous unnecessary part 17 is peeled from the 1st peeling film 12, and the protective film formation film 16 which carried out the shearing process was applied to the 1st peeling film 12. remain on the The peeled unnecessary portion 17 is wound around a roller for disposal.

According to the sheet 10 for forming a protective film according to the present embodiment, when passing through the roller 19 or the like after the shearing step, the sheared protective film forming film 16 and the unnecessary portion 17 come into contact with and adhere to each other. , since the adhesive force between the protective film forming films is low, the protective film forming film 16 and the unnecessary portion 17 are separated again after passing through the roller. As a result, the stripping defect in a stripping process is suppressed.

The shear-processed sheet|seat 10 for protective film formation may be wound up in roll shape, and may be stored and transported.

(5. Workpiece processing method)

As an example of a processing method of a workpiece using the shear-processed sheet for forming a protective film according to the present embodiment, a method for manufacturing a package in which a protective film-forming chip obtained by processing a wafer to which a protective film-forming film is affixed is disposed on a substrate. do.

The method for manufacturing a substrate device according to the present embodiment includes at least the following steps 1 to 9.

Step 1: Step of shearing the sheet 10 for forming a protective film

Process 2: A process in which the shear-processed sheet for forming a protective film passes between rollers

Step 3: Step of stripping the unnecessary portion 17 of the sheet 10 for forming a protective film

Process 4: The process of affixing the protective film formation film 11 of the sheet|seat 10 for protective film formation to the wafer back surface

Step 5: Process of turning the attached protective film forming film into a protective film

Process 6: Process of peeling a 1st peeling film from a protective film or protective film formation film

Step 7: A step of separating a wafer having a protective film or a protective film-forming film on the back surface into pieces to obtain a plurality of protective films or protective film-forming chips

Step 8: A step of arranging a protective film or a protective film-forming film-forming chip on a substrate

Step 9: A step of heating the protective film or protective film forming chip and the substrate disposed on the substrate

Steps 1 to 3 are as described above. Step 5 may be performed before step 6 or after any of steps 6 to 9. That is, you may perform the process of turning a protective film formation film into a protective film at any stage after affixing a protective film formation film to a wafer.

The manufacturing method of the apparatus which has said process 1 thru|or 9 is demonstrated with reference to drawings.

2, 4, and 5 schematically show the process 1 as described above. 6 shows the outline of step 3.

As shown in FIG. 9, the protective film formation film 11 of the sheet|seat 10 for protective film formation is affixed on the back surface of the wafer 21 (process 4). Then, the affixed protective film formation film 11 is turned into a protective film, the protective film 32 is formed (process 5), and a protective film formation wafer is obtained. When the protective film formation film 11 is thermosetting, what is necessary is just to heat the protective film formation film 11 at predetermined temperature for an appropriate time. In addition, when the protective film formation film 11 is energy-beam sclerosis|hardenability, what is necessary is just to inject an energy-beam from the 1st peeling film 12 side using an energy-beam permeable film as the 1st peeling film 12.

In addition, hardening of the protective film formation film 11 may be performed after the dicing process mentioned later, a chip|tip with a protective film formation film is picked up from a dicing sheet, and the protective film formation film 11 may be hardened after that.

Subsequently, the protective film forming wafer 21 is transferred onto a known dicing sheet 22, the protective film forming wafer 21 is diced, and as shown in FIG. 10, a chip having a protective film 32 ( 31) (protective film formation chip 30) is obtained (step 7). Then, the dicing sheet 22 is expanded in a planar direction as needed, and the protective film formation chip|tip 30 is picked up from the dicing sheet 22 by a suction collet (not shown) etc.

The picked-up protective film formation chip 30 may be conveyed to a next process, may be temporarily stored in a tray, a tape, etc., and may be conveyed to a next process after a predetermined period of time.

As shown in FIG. 11, the protective film formation chip 30 conveyed in the next process is conveyed to the board|substrate 50 by a suction collet, In the terminal part on a board|substrate, it detach|desorbs from the suction collet, and convex shape, such as a bump The electrode 33 and a terminal portion such as a pad are arranged at a connectable position (Step 8). At this time, another chip different from the protective film forming chip 30 may also be mounted on the substrate 50 . Accordingly, a plurality of chips may be mounted on this substrate.

The protective film forming chip disposed at a predetermined position on the substrate is subjected to heat treatment (reflow treatment) (Step 9). It is preferable that reflow processing conditions are 180-350 degreeC of maximum heating temperature, and reflow time is 2 to 10 minutes, for example.

In the reflow process, the convex electrode 33 of the protective film forming chip 30 is melted, electrically and mechanically joined to the terminal portion on the substrate, and the protective film forming chip 30 is mounted on the substrate.

(6. Modifications)

As mentioned above, although the sheet for protective film formation of the two-layer structure which has the protective film formation film 11 on the 1st peeling film 12 was mentioned as an example with respect to embodiment of this invention, and was demonstrated, the exposed surface of the protective film formation film 11 The 2nd peeling film 13 may be laminated|stacked. That is, the sheet for forming a protective film may be a sheet for forming a protective film 20 in which the protective film forming film 11 is sandwiched between the first release film 12 and the second release film 13 ( FIGS. 3 and 4 ). Reference). In that case, what is necessary is just to peel the 2nd peeling film 13 before affixing the protective film formation film 11 to a workpiece|work.

The material of the protective film formation film 11 of the sheet|seat 20 for protective film formation, and its preferable aspect are the same as that of the said embodiment, Moreover, the 1st peeling film 12 is also the same as what was demonstrated about the said embodiment.

In addition, in this embodiment, in the sheet|seat 20 for protective film formation, let the peeling force from the protective film formation film 11 of the 1st peeling film 12 be F1, and the protective film of the 2nd peeling film 13 mentioned later. When the peeling force from the forming film 11 is F2, it is preferable that F1 and F2 satisfy the relationship F1>F2. By satisfying such a relationship, when removing the 2nd peeling film 13 from the sheet|seat 20 for protective film formation, the protective film formation film 16 which should remain is not removed together with the 2nd peeling film 13, but a protective film It becomes easy to leave the formation film 16 on the 1st peeling film 12, and stripping defect can be suppressed more.

Therefore, the 1st peeling film 12 is a heavy peeling film with strong peeling force, and the 2nd peeling film 13 is a light peeling film with a weak peeling force.

Further, the peeling force F1 is preferably 50 mN/100 mm or more, more preferably 70 mN/100 mm or more, more preferably 90 mN/100 mm or more, still more preferably 110 mN/100 mm or more, particularly Preferably it is 130 mN/100 mm or more. When F1 exists in said range, it can suppress that the protective film formation film 11 and the 1st peeling film 12 peel unintentionally.

Adjustment of peeling force is controllable with the kind of composition for release agent layers, the thickness of a release agent layer, etc., for example. The 2nd peeling film 13 is designed so that peeling force may become smaller than the 1st peeling film 12. When the 2nd release film 13 has a release agent layer, if the release agent layer is comprised from the material which can provide peelability, it will not restrict|limit in particular. For example, the release agent layer of the 2nd release film 13 is obtained by hardening|curing the composition for release agent layers containing silicone similarly to the release agent layer of the 1st release film 12.

The composition for release agent layers of the 2nd release film 13 can be selected from the material illustrated by the 1st release film 12, as long as the relationship of said F1 and F2 is satisfy|filled. However, it is preferable that the material illustrated as a heavy release additive is less than content in the 1st peeling film 12, or it is not contained.

Although the thickness in particular of the 2nd peeling film 13 is not restrict|limited, It is preferable that they are 10 micrometers or more and 75 micrometers or less. Moreover, as for the thickness of a 2nd peeling film, it is more preferable that it is 18 micrometers or more, and it is still more preferable that it is 24 micrometers or more. Moreover, it is more preferable that it is 60 micrometers or less, and, as for the thickness of a 2nd peeling film, it is still more preferable that it is 45 micrometers or less. The thickness of the second release film is preferably equal to or less than the thickness of the first release film, more preferably less than the thickness of the first release film, from the viewpoint of setting the peel force F2 and the peel force F1 to F1 > F2 described above.

In addition, the thickness of a 2nd peeling film means the thickness of the whole 2nd peeling film. For example, the thickness of the 2nd peeling film comprised from multiple layers means the thickness of the sum total of all the layers which comprise a 2nd peeling film.

As for the manufacturing method of the sheet|seat 20 for protective film formation, what is necessary is just to bond the 2nd peeling film 13 together to the exposed surface of the 1st peeling film 12 and the laminated|stacked protective film formation film 11, as demonstrated in embodiment.

When shearing the protective film forming sheet 20, a shearing die is introduced from the second release film 13 side, and the protective film forming film 11 and the second release film 13 are cut into a predetermined closed shape. Other than that, it is the same as that of the said embodiment. As a result, the protective film formation film 11 and the 2nd peeling film 13 shear-processed on the 1st peeling film 12 are obtained. The shear-processed sheet|seat 20 for protective film formation may be wound up in roll shape, and may be stored and transported.

In a stripping process, the 2nd peeling film 13 and the unnecessary part 17 are wound up simultaneously and are removed. At this time, the 2nd peeling film 13 after shearing is carried out and cut|disconnected becomes easy to remove the 2nd peeling film 13 by connecting again with a long adhesive tape. As a result, the protective film-forming film 16 cut into a predetermined closed shape remains on the first release film 12 .

As mentioned above, although embodiment of this invention was described, this invention is not limited to said embodiment at all, You may change in various aspects within the scope of this invention.

Example

Hereinafter, the invention will be described in more detail using Examples, but the present invention is not limited to these Examples.

(Production of sheet for forming a protective film)

[First release film (middle release film)]

<Coating agent containing composition for release agent layer>

The following composition raw material for release agent layers was prepared.

- Silicone-based release agent containing organopolysiloxane having a vinyl group and organopolysiloxane having a hydrosilyl group (manufactured by Toray Dow Corning Co., Ltd., BY24-561, solid content 30% by mass)

・Dimethylpolysiloxane (weight average molecular weight: 2000) (manufactured by Shin-Etsu Chemical Co., Ltd., X-62-1387, solid content 100% by mass)

· MQ resin having a vinyl group as a heavy release additive (manufactured by Toray Dow Corning Co., Ltd., SD-7292, solid content 71% by mass)

・Platinum (Pt) catalyst (manufactured by Toray Dow Corning Co., Ltd., SRX-212, solid content 100% by mass)

The above raw materials were added to a mixed solvent of toluene and methyl ethyl ketone (toluene/methyl ethyl ketone = 1/1 (mass ratio)) at the compounding ratio (solid content conversion) shown in Table 1 to adjust the total solid content to 2 mass %, and the release agent A coating agent containing the composition for layers was prepared.

<Preparation of 1st peeling film>

PET film (manufactured by Mitsubishi Chemical, trade name: Daifoil (registered trademark) T-100, thickness: 50 μm) is coated with a coating agent containing the release agent layer composition to a film thickness of 0.15 μm after drying, heated and dried to PET The release agent layer was formed on the film, and 1st peeling film (heavy peeling film) A-C was produced.

<Measurement of surface elastic modulus>

The surface elastic modulus of the peeling process surface of the obtained 1st peeling film was measured as follows.

An atomic force microscope (manufactured by Bruker Corporation, Multi Mode8) was equipped with a silicon nitride cantilever (manufactured by Bruker Corporation, trade name: MLCT, tip radius: 20 nm, resonance frequency: 125 kHz, spring constant: 0.6 N/m). . The prepared first release film was placed on an atomic force microscope, and the surface of the release agent layer of the produced first release film was press-fitted and separated with a cantilever installed at a press-in amount of 2 nm and a scan rate: 10 Hz. This operation was performed at 23 degreeC. The force curve curve obtained by this operation was fit by JKR theoretical formula, and the surface elasticity modulus was computed. The surface elastic modulus measured 4096 points|pieces in the surface 1 micrometer x 1 micrometer of the release agent layer of the 1st peeling film, these values were averaged, the decimal point was rounded off, and it was set as the surface elasticity modulus (MPa). A result is shown in Table 1.

[Second release film (light release film)]

Lintech "SP-PET381130 (thickness 38 m)" was used.

[Coating agent containing composition for protective film forming film]

Each of the following components was mixed at the compounding ratio (in terms of solid content) shown in Table 2, and diluted with methyl ethyl ketone so that the solid content concentration was 50 mass% to prepare a coating agent.

(A) polymer component

(A-1) (meth)acrylic acid ester formed by copolymerizing 10 parts by mass of n-butyl acrylate, 70 parts by mass of methyl acrylate, 5 parts by mass of glycidyl methacrylate, and 15 parts by mass of 2-hydroxyethyl acrylate Copolymer (weight average molecular weight: 400,000, glass transition temperature: -1°C)

(A-2) (meth)acrylic acid ester formed by copolymerizing 10 parts by mass of n-butyl acrylate, 65 parts by mass of methyl acrylate, 12 parts by mass of glycidyl methacrylate, and 13 parts by mass of 2-hydroxyethyl acrylate Copolymer (weight average molecular weight: 450,000, glass transition temperature: 2°C)

(B) curable component (thermosetting component)

(B-1) bisphenol A epoxy resin (manufactured by Mitsubishi Chemical Corporation, jER828, epoxy equivalent of 184 to 194 g/eq)

(B-2) Acrylic rubber fine particles dispersed bisphenol A liquid epoxy resin (manufactured by Nippon Shokubai, BPA328, epoxy equivalent 230 g/eq, acrylic rubber content 20 phr)

(B-3) dicyclopentadiene type epoxy resin (Dainippon Ink Chemicals Co., Ltd., Epiclone HP-7200HH, softening point 88 to 98°C, epoxy equivalent 255 to 260 g/eq)

(C) Curing agent: dicyandiamide (manufactured by Mitsubishi Chemical, DICY7)

(D) Curing accelerator: 2-phenyl-4,5-dihydroxymethylimidazole (Shikoku Chemical Industry Co., Ltd., Qazole 2PHZ)

(E) filling material

(E-1) Epoxy group-modified spherical silica filler (manufactured by Admatex, SC2050MA, average particle diameter 0.5 μm)

(E-2) Silica filler (“YC100C-MLA” manufactured by Admatex, average particle diameter 0.1 μm)

(F) Silane coupling agent: γ-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM403, methoxy equivalent 12.7 mmol/g, molecular weight 236.3)

(G) Colorant: carbon black (manufactured by Mitsubishi Chemical, MA600B, average particle diameter 28 nm)

The prepared composition for protective film formation films was coated on the peeling-treated surface of the said 1st peeling film (any of said A-C), it dried at 100 degreeC for 2 minutes, and the protective film formation film with a thickness of 20 micrometers was formed. Then, the 2nd peeling film was affixed on the protective film formation film, and the sheet|seat for protective film formation of the three-layer structure in which the peeling film was formed in both surfaces of the protective film formation film was obtained. The sticking conditions were a temperature of 60°C, a pressure of 0.4 MPa, and a speed of 1 m/min. Next, the sheet for forming a protective film was cut to a width of 208 mm, and a length of 50 meters was wound up to make a roll body.

The following measurement and evaluation were performed using the obtained sheet|seat for protective film formation.

[Adhesive force between protective film forming films]

From the sheet for protective film formation, the protective film formation film was exposed as follows, the protective film formation films were affixed, and the adhesive force was measured.

<Fixing the protective film forming film on the adhesive tape>

I. The 2nd peeling film of the sheet|seat for protective film formation of the three-layer structure of I. 2nd peeling film/protective film formation film/1st peeling film was peeled.

II. An adhesive tape manufactured by Lintec (product name: PET50PL new: acrylic adhesive layer/50 μm PET substrate) was affixed to the exposed protective film forming film at 23° C. A sieve sample was prepared.

III. The laminate sample was cut into a rectangular shape with a width of 25 mm and a length of 250 mm.

<Fixing the protective film forming film on the SUS plate>

I. A double-sided tape having a PET film as a core material was affixed on the entire surface of the SUS plate (0.5 mm thickness × 70 mm × 150 mm).

II. The 2nd peeling film of the sheet|seat for protective film formation of 3 layer structure of 2nd peeling film / protective film formation film / 1st peeling film was peeled.

III. The exposed protective film formation film was affixed on the whole surface of the adhesive surface of the said double-sided tape, and the laminated body sample of "SUS board / double-sided tape / protective film formation film / 1st peeling film" was obtained.

IV. The 1st peeling film was peeled, and the protective film formation film was exposed.

<Measurement of adhesion>

The 1st peeling film was peeled from the laminated body sample of "PET base material / acrylic adhesive layer / protective film formation film / 1st peeling film", and the protective film formation film was exposed. The laminate of "PET base material / acrylic adhesive layer / protective film forming film" and the laminate of "SUS plate / double-sided tape / protective film forming film" are laminated so that the protective film forming films face each other, and using a 2 kg roller, It was joined at 23 degreeC.

It was left still without heating, and after 2 minutes (± 20 sec) had elapsed after sticking, the adhesive force was measured by the following measuring method.

Using a universal tensile tester (manufactured by Shimadzu Corporation, product name "Autograph AG-IS"), the peeling force was measured at a peeling rate of 300 mm/min, a temperature of 23°C, and a peeling angle of 180° at a measurement distance of 70 mm. . The average of the measured values between the first 10 mm and 50 mm excluding the last 10 mm of the measurement distance was defined as "adhesion force between protective film forming films".

[Peel force F1 of the first release film from the protective film forming film]

The 2nd peeling film was peeled from the obtained sheet|seat for protective film formation. On the surface of the protective film forming film exposed by peeling, the both-adhesive side of 25 micrometers-thick double-adhesive PET (Toyobo Co., Ltd. make, PET25A-4100) was affixed by hot lamination (70 degreeC, 1 m/min), and lamination|stacking A sieve sample was prepared. A sample of the laminate was cut out to a width of 100 mm to prepare a sample for measurement. The back surface of the 1st peeling film of the sample for a measurement was fixed to the hard support plate with a double-sided tape.

Using a universal tensile tester (manufactured by Shimadzu Corporation, product name “Autograph (registered trademark) AG-IS”), a protective film-forming film/double-adhesive PET composite (integral) sieve was subjected to a peeling angle of 180°, a peeling rate of 1 It peeled from the 1st peeling film at m/min, and the load at that time was measured. The total measurement distance was 100 mm, and the average of the measured values between 80 mm excluding the first 10 mm and the last 10 mm was used as the peel force F1. A result is shown in Table 2.

[Peel force F2 of the second release film from the protective film forming film]

The obtained sheet for protective film formation was cut out to 100 mm width, and the sample for a measurement was produced. The back surface of the 1st peeling film of the sample for a measurement was fixed to the hard support plate with a double-sided tape.

Using a universal tensile tester (manufactured by Shimadzu Corporation, product name “Autograph (registered trademark) AG-IS”), the second release film was peeled off from the sample for measurement, and the load at that time was measured under the same conditions as those of F1 above. was measured and the peel force F2.

By comparing the obtained peeling forces F1 and F2, it was confirmed for all samples that F1 was greater than F2.

[Shearing and stripping of sheet for forming protective film]

Using RAD-3600F/12 manufactured by Lintec as a specification for a 200 mm wafer, a shearing die was introduced from the second release film side of the protective film forming sheet, and the protective film forming film and the second release film were circular (inner diameter 198 mm) hit with At this time, a cut was put in the 1st peeling film so that it might not be punched out completely (shear processing process). The half-cut from which the cutting width differs was implemented using 4 types of shearing dies from which the blade width of a cutting blade differs. 40 shearing was performed.

After the shearing step, the sheet for forming a protective film was run between the plurality of rollers. Thereafter, the circularly punched part was left on the first peeling film, and the second peeling film and unnecessary parts around the circularly punched out part were removed (stripping process). At this time, after shearing was carried out and the 2nd peeling film after cut|disconnected completely connected again with a long adhesive tape, the 2nd peeling film was removed.

<Incision width>

After the stripping process, the sheet for forming a protective film is cut in the thickness direction so that the cut-out portion of the first release film is not deformed, the sheet for forming a protective film is kept flat, and the cross section is scanned using a scanning electron microscope (SEM, manufactured by KEYENCE Corporation "VE-9800" ') was observed. The width of the cut which remained in the 1st peeling film in the interface of a 1st peeling film and a protective film formation film was measured.

The measurement was performed at 6 points (a regular hexagon when connecting points) at equal intervals on the circumference of one circle by selecting the 20th among 40 circular parts. The minimum value among 6 points|pieces was made into "cutting width". Rounded to one decimal place.

There is no adhesion of protective film formation films, and stripping can be performed smoothly, so that a cut width|variety is wide.

<Evaluation of stripping properties>

At the time of the stripping process, among the 40 circular parts, the protective film forming film of the circular part was accompanied by the unnecessary part, and the number of floats was counted. It means that there is no adhesion of protective film formation films, and stripping can be performed smoothly, so that there are few floating sheets.

Table 3 summarizes the above results.

From Table 3, when the adhesive force of protective film formation films was 19 N or less, there was no adhesion of protective film formation films after a shearing process, and it has confirmed that stripping could be performed smoothly. Moreover, like Example 7, when a cut width became narrow, protective film formation films adhered after a shearing process, and it turned out that there exists a tendency for stripping to become impossible to perform smoothly.

As mentioned above, according to this invention, even when the width|variety of the cutout at the time of shearing is comparatively narrow, the sheet|seat for protective film formation which can fully suppress a stripping defect, and its manufacturing method are provided.

10: sheet for forming a protective film (this embodiment)
11: protective film forming film
12: first release film
13: second release film
14: infeed
16: shear-processed protective film forming film
17: unnecessary part
19 : roller
20: sheet for forming a protective film (another embodiment)
21: wafer
22: dicing sheet
30: protective film forming chip
31 : Chip
32: Shield
33: convex electrode
50: substrate

Claims (6)

a protective film forming film;
A long sheet having a first release film formed on one surface of the protective film forming film,
The sheet|seat for protective film formation whose adhesive force 2 minutes after affixing two protective film formation films at 23 degreeC with a load of 2 kgf is 19 N/25 mm or less. The method of claim 1,
The sheet|seat for protective film formation whose surface elasticity modulus of the surface which contact|connects the protective film formation film of a said 1st peeling film is 17 MPa or less. 3. The method of claim 1 or 2,
When the sheet for forming a protective film is viewed in a plan view, a cutout is formed in the sheet for forming a protective film so that a part of the sheet for forming a protective film has a predetermined closed shape,
The thickness direction of the said sheet|seat for protective film formation WHEREIN: The said cut-out penetrates the said protective film formation film, The sheet|seat for protective film formation has reached a part of the said 1st peeling film. 4. The method of claim 3,
The sheet|seat for protective film formation whose said cut width in the interface of the said protective film formation film and the said 1st peeling film is 8 micrometers or more. A step of forming a cutout so that a part of the sheet for forming a protective film according to claim 1 or 2 has a predetermined closed shape;
In the thickness direction of the said sheet|seat for protective film formation, the said cut-out penetrates the said protective film formation film, and the manufacturing method of the sheet|seat for shearing processed protective film formation has reached|attained a part of the said 1st peeling film. 6. The method of claim 5,
The manufacturing method of the sheet|seat for protective film formation by which the said cut width in the interface of the said protective film formation film and the said 1st peeling film was shear-processed 8 micrometers or more.

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