KR20220020211A - Film forming apparatus and manufacturing method of electronic device - Google Patents

Abstract

The present invention provides a film forming apparatus and a manufacturing method of electronic device, which can stabilize the rotation of a mask and a substrate to allow high-definition film formation. The film forming apparatus comprises: a mask holding support unit holding and supporting the mask; a substrate holding support unit holding and supporting the substrate; a center shaft connected to the substrate holding support unit, and moving the substrate holding support unit along a rotational centerline of the mask and the substrate; a rotational torque transfer means connected to one between the mask holding support unit and the substrate holding support unit; and a position changing means changing the relative positions of the mask holding support unit and the substrate holding support unit in a direction parallel with the rotational center line while maintaining the relative positions of the mask holding support unit and the substrate holding support unit in a rotational direction.

Description

A film-forming apparatus and the manufacturing method of an electronic device TECHNICAL FIELD

The present invention relates to a film forming apparatus and a method for manufacturing an electronic device in which a substrate and a mask are integrally rotated with respect to a film forming source.

Recently, as a flat panel display, an organic electroluminescent display (OLED) has been in the spotlight. The organic electroluminescent display is a self-luminous display, and has superior characteristics such as response speed, viewing angle, and thinness compared to liquid crystal panel displays. are doing Moreover, the field of application is expanding also to the display etc. for automobiles.

As a conventional rotary film-forming apparatus, the mask vapor deposition apparatus (film-forming apparatus) as described in patent document 1 is known, for example. This mask vapor deposition apparatus has a vacuum chamber, and a film-forming object (substrate), a vapor deposition mask (mask), and an evaporation source for supplying vapor deposition molecules to the film-forming object are arranged inside the vacuum chamber. The film-forming object and the mask are held by a magnet unit (substrate support member) supported by a rotation mechanism having a rotation shaft, and during vapor deposition, the magnet unit, the film formation object and the mask are rotated around the rotation shaft by the rotation mechanism. It is configured to rotate integrally.

However, with the recent increase in size of the substrate, the request for further stabilizing the rotation is increasing. If it is enlarged, the horizontality of a board|substrate and a mask will fall and rotation will become unstable. In order to reduce the sag of a mask or a board|substrate, it is necessary to make each structural part high rigidity. However, when rigidity is increased, it will enlarge and weight will also increase.

On the other hand, in Patent Document 2, an alignment unit for positioning a substrate and a mask in a vacuum chamber, a transport tray for receiving the substrate and mask from the alignment unit, and an evaporation source or sputter disposed along a transport path of the transport tray A film-forming apparatus provided with film-forming means, such as a target, is described. The alignment unit has a substrate holding unit for holding a substrate, and a mask holder (mask holding member) for supporting the mask, and the mask holder has a support shaft (corresponding to a center shaft) and a guide bush ( It is connected via a guide rod with a guide bush. The shaft is rotatable by a motor, and is movable in the X-Y direction orthogonal to the shaft by the X-Y direction moving unit. The mask holder also rotates in synchronization with the axis|shaft, and it aligns with respect to the stationary board|substrate by moving in an X-Y direction. After alignment, although a mask and a board|substrate are lowered and placed on a conveyance tray, the mask holder acquires the guide action by a guide rod, and falls, and is ensuring predetermined|prescribed alignment precision.

However, this mask holder rotates a mask for alignment, it is moved from an alignment unit to a conveyance tray at the time of film-forming, it does not have a structure which rotates in a film-forming process, It cannot be applied to a rotary film-forming apparatus.

Patent Document 1: Japanese Patent Laid-Open No. 2010-185107 Patent Document 2: Japanese Patent Laid-Open No. 2005-248249

It is an object of the present invention to provide a film forming apparatus and a method for manufacturing an electronic device that further stabilize rotation of a substrate and a mask and enable higher-definition film formation.

In order to achieve the above object, the film forming apparatus of the present invention,

A film forming apparatus for forming a film forming material on the substrate through the mask while integrally rotating a substrate and a mask overlapping the film forming surface of the substrate,

a mask holder for holding the mask;

a substrate holding unit for holding the substrate;

a center shaft connected to the substrate holder and configured to move the substrate holder along a rotation center line of the substrate and the mask;

rotational torque transmitting means connected to either one of the mask holding part and the substrate holding part;

Position changing means for changing the relative positions of the mask holder and the substrate holder in a direction parallel to the rotation center line while maintaining the relative positions of the mask holder and the substrate holder in the rotational direction; characterized in that

In addition, the manufacturing method of the electronic device of the present invention,

An electronic device is manufactured using the said film-forming apparatus, It is characterized by the above-mentioned.

ADVANTAGE OF THE INVENTION According to this invention, the horizontality of a board|substrate and a mask can improve, rotation can be stabilized, and high-definition film-forming is attained.

BRIEF DESCRIPTION OF THE DRAWINGS It is a partial schematic diagram of an electronic device manufacturing apparatus.
2 is a schematic configuration diagram at the time of film formation of the rotary film forming apparatus according to the embodiment.
FIG. 3 is a schematic configuration diagram of a state before film formation in FIG. 2 .
Fig. 4 (A) is a partially enlarged cross-sectional view of the attachment portion of the center shaft of Fig. 2 , (B) is a partially enlarged cross-sectional view of the guide shaft portion of Fig. 2 .
Fig. 5 (A) is a partial cross-sectional view of a state in which a shim is inserted into a connecting portion of a guide bush, and (B) is a plan view schematically showing a contact state of the shim.
Fig. 6 is a perspective view showing the configuration of the mask holding unit and the substrate holding unit of Fig. 2;
It is explanatory drawing of the alignment process of the film-forming apparatus of FIG. 2, and a film-forming process.
8 is a schematic diagram of an organic EL display device manufactured by the manufacturing method of the present invention.

EMBODIMENT OF THE INVENTION Below, embodiment of this invention is described in detail with reference to drawings. However, the following embodiment only shows the preferable structure of this invention by way of example, and the scope of the present invention is not limited to these structures. In addition, in the following description, the hardware configuration and software configuration of the device, the flow of processing, manufacturing conditions, size, material, shape, etc. are not intended to limit the scope of the present invention only to these unless otherwise specified.

<Electronic device manufacturing apparatus>

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows typically a part of structure of the manufacturing apparatus of an electronic device. The manufacturing apparatus of FIG. 1 is used for manufacture of the display panel of the organic electroluminescent display for smartphones, for example. In the case of a display panel for a smartphone, for example, an organic EL film is formed on a substrate having a size of about 1800 mm × about 1500 mm and a thickness of about 0.5 mm, and then the substrate is diced to produce a plurality of small-sized panels.

Generally, as shown in FIG. 1 , an electronic device manufacturing apparatus has a plurality of film formation chambers 111 , 112 and a transfer chamber 110 . In the transfer chamber 110 , a transfer robot 119 that holds and transfers the substrate 3 is installed. The transfer robot 119 is, for example, a robot having a structure in which a robot hand for holding a substrate is attached to an articulated arm, and carries in/out of the substrate 3 to each film formation chamber.

A film forming apparatus (also called a vapor deposition apparatus) is provided in each of the film forming chambers 111 and 112 , respectively. A series of film formation processes such as transfer of the substrate 3 with the transfer robot 119, adjustment (alignment) of the relative positions of the substrate 3 and the mask, fixing of the substrate 3 on the mask, and film formation (deposition) is automatically performed by the film forming apparatus.

Hereinafter, the structure of the film-forming apparatus installed in the film-forming chamber is demonstrated.

<Film forming device>

FIG. 2 is a block diagram schematically showing the configuration at the time of film formation of the rotary film forming apparatus 1 according to the embodiment of the present invention, and FIG. 3 is a block diagram schematically illustrating a state before film formation.

In the following description, the XYZ rectangular coordinate system which makes a perpendicular direction a Z direction, and makes a direction orthogonal to a Z direction an XY direction orthogonal to a Z direction is used. At the time of film formation, the substrate is fixed so as to be parallel to the horizontal plane (XY plane). At this time, the short longitudinal direction (direction parallel to the short side) of the substrate is the X direction, and the long longitudinal direction (the direction parallel to the long side) is the Y direction of the substrate. do in the direction In addition, the rotation angle around the Z-axis is represented by θ.

The film forming apparatus 1 has a vacuum chamber 100 . The inside of the vacuum chamber 100 is maintained in a reduced pressure atmosphere such as vacuum or an inert gas atmosphere such as nitrogen gas. In the upper space inside the vacuum chamber 100 , a mask holding unit (mask holding part) 20 for holding the mask 2 , and a substrate 3 as a film forming object superimposed on the mask 2 are held. A substrate holding unit (substrate holding unit) 30 is disposed.

A center shaft 32 is connected to the substrate holding unit 30 , and a hollow rotating shaft (drive shaft) 15 as a rotating torque transmitting means is connected to the mask holding unit 20 . The center shaft 32 is slidably inserted into the inner periphery of the hollow rotating shaft 15 .

In addition, the guide mechanism 10 for supporting the mask holding unit 20 and the substrate holding unit 30 to be relatively movable in the direction parallel to the rotation center line without changing their relative positions in the rotation direction. is installed Via this guide mechanism 10 , the rotation torque transmitted from the hollow rotation shaft 15 is transmitted from the mask holding unit 20 to the substrate holding unit 30 , and the mask holding unit 20 and the substrate holding unit are transmitted. The support unit 30 is designed to rotate integrally.

Meanwhile, an evaporation source 50 is installed in the lower space of the vacuum chamber 100 , and a film-forming material is deposited with respect to the substrate 3 through a mask. The evaporation source 50 is constituted by a crucible in which the evaporation material is accommodated, a heater, a shutter, a driving mechanism of the evaporation source, an evaporation rate monitor, and the like (all not shown). The shutter covers the substrate 3 except at the time of film formation on the substrate 3 , and suppresses deposition of the vapor deposition material evaporated from the evaporation source 50 on the substrate 3 .

Further, separate from the mask holding unit 20 and the substrate holding unit 30, a support 41 for receiving the substrate 3 from the transfer robot 119 in the transfer chamber 110 is provided; The board|substrate raising/lowering unit 40 conveyed on the mask 2 hold|maintained by the mask holding unit, and superimposed on the mask is provided.

Hereinafter, the structure of each part is demonstrated in detail.

Configuration of the mask holding unit 20

The mask holding unit 20 includes a mask stand 21 on which the mask 2 is mounted, a support plate 22 arranged in parallel above the mask stand 21 with a predetermined interval therebetween, and the mask stand 21 . ) and a structure of a frame structure having a connecting member 23 connecting the support plate 22 . The mask 2 is a metal mask which has an opening pattern corresponding to the thin film pattern formed on the board|substrate 3 . The mask base 21 has a frame structure that holds the periphery of the mask 2 , and the substrate 3 is placed on the mask 2 during film formation. Therefore, the mask 2 also plays a role as a mounting body on which the board|substrate 3 is mounted.

A hollow rotating shaft 15 is connected to this mask holding unit 20 . The hollow rotation shaft 15 is inserted from the outside of the vacuum chamber 100 , and transmits rotation torque to the mask holding unit 20 , and the end of the hollow rotation shaft 15 is connected to the center of the support plate 22 . It is fixed.

Configuration of the substrate holding unit 30

The substrate holding unit 30 is disposed between the mask stand 21 of the mask holding unit 20 and the support plate 22 .

4A is a partial configuration diagram showing an example of the substrate holding unit 30 .

That is, the substrate holding unit 30 is a lamination unit having a cooling plate 31 , a magnet 33a , a yoke plate 33 supporting the magnet 33a , and a fixing plate 34 , and is cooled Also called plate unit. The cooling plate 31 is a member that is disposed opposite to the mask base 21 and is in close contact with the substrate 3 (surface on the opposite side to the mask 2 ) during film formation to suppress the temperature rise of the substrate 3 . am. In addition, the yoke plate 33 is laminated with a yoke plate 33 supporting the magnet 33a overlaid on the cooling plate 31, and magnetically attracts the mask 2 by magnetic force, so that the substrate ( 3) and the adhesiveness of the mask 2 are improved. Furthermore, on the other hand, the cooling plate 31 may also serve as a magnet or a yoke plate. The fixing plate 34 is a base plate of the substrate holding unit 30 , and the yoke plate 33 , the magnet 33a and the cooling plate 31 are laminated and fixed to the fixing plate 34 .

At the center of this fixed plate 34, one end of the center shaft 32 that penetrates the support plate 22 of the mask holding unit 20 and is slidably inserted into the inner periphery of the hollow rotating shaft 15 is connected, there is. The center shaft 32 raises and lowers the substrate holding unit 30 in the Z-axis direction.

Configuration of the guide mechanism (10)

The guide mechanism 10, as shown in FIGS. 2 and 3, a guide shaft 11 arranged parallel to the rotation center line N of the substrate holding unit 30 and the mask holding unit 20; A guide bush (12) as a fitting member that fits relative to the guide shaft (11) is provided. The guide bush 12 is mounted on the support plate 22 of the mask holding unit 20 , and one end of the guide shaft 11 inserted into the guide bush 12 is fixed to the substrate holding unit 30 . .

FIG. 4B is a diagram showing a fixed state of the guide shaft 11 and the substrate holding unit 30 .

The end of the guide shaft 11 is inserted into a cross-sectional hat-shaped receiving port 13 provided on the fixing plate 34 of the substrate holding unit 30, and is fixed to the bottom surface by bolts. The distal end of the guide bushing 12 can also be inserted into the receiving tool 13 , and the end of the guide bushing abuts against the bottom so that upward movement of the substrate holding unit 30 is restricted.

Next, this guide mechanism 10 is demonstrated with reference to FIG.

6 is a perspective view showing a mask holding unit and a substrate holding unit.

As shown in FIG. 6, the guide shaft 11 is provided in multiple numbers, and the guide shaft 11 and the guide bushing 12 are provided in multiple sets, 4 sets in this example. The plurality of guide shafts 11 are arranged at positions symmetrical to each other with respect to the rotational center line N. In this example, the support plate 22 of the mask holding unit 20 is a rectangular plate-shaped member, and is arrange|positioned at the position of four corner|angular parts. The guide shaft 11 is arranged parallel to the center shaft 32 and, on the other hand, is assembled so that the center line of the guide bush 12 is also parallel to the rotation center line N.

<Inclination adjustment of guide shaft by shim>

Next, with reference to FIG. 5 , the inclination adjustment of each guide shaft 11 will be described.

Fig. 5 (A) is a partial cross-sectional view of a state in which a shim is inserted into a connecting portion of a guide bush, and (B) is a plan view schematically showing a contact state of the shim.

In this embodiment, the inclination of the guide shaft 11 is adjusted in the four connection positions A, B, C, D of the guide bush 12 and the support plate 22 of the mask holding unit 20. A shim 18 is inserted as an adjustment means. That is, the fixing flange 12a of the guide bushing 12 is being fixed with the bolt 13 at four circumferential directions. By adjusting the gaps in these four places with the shims 18, the central axis of the guide bushing 12 can be tilted in all directions in the XY-axis direction with respect to the Z-axis direction, and the guide shaft 11 fits this. It is possible to adjust the inclination of As the insertion position of the shim 18, it may be provided in the connection position of the guide shaft 11 and the board|substrate holding unit 30, and may be installed in both the connection positions of the guide shaft 11 and the guide bushing 12. do.

As a method of adjusting the inclination of the guide shaft 11 , in addition to the method by inserting the shim 18 , an inclination adjusting screw may be provided to adjust the inclination of the connection position, and the method is not limited to insertion of the shim 18 .

About the upper (outer) structure of the vacuum chamber 100

Next, returning to FIGS. 2 and 3 , the upper (outer) structure of the vacuum chamber 100 will be described.

On the upper outer side of the vacuum chamber 100, the rotary joint 120, the magnetic seal 125, the X actuator 130X and Y actuator 130Y for moving the hollow rotation shaft 15 in the XY direction, and the θ actuator for rotating ( 130θ), and further, a Z actuator 130Z for moving the substrate holding unit in the Z-axis direction via the center shaft 32 is provided.

The X actuator 130X and the Y actuator 130Y move the first stage 141 in the XY direction with respect to the vacuum chamber 100 , and on this first stage 141 through a magnetic seal 125 . A hollow rotating shaft 15 is supported. Furthermore, on the 1st stage 141, the 2nd stage 142 fixed via the support|pillar 142a is provided, and the rotary joint 120 is being fixed to this 2nd stage 142. As shown in FIG. In addition, a θ actuator 130θ is mounted on the second stage 142, and the hollow rotating shaft 15 is rotationally driven via a drive transmission member 135 such as a gear.

Further, above the second stage 142, a third stage 143 is further provided via a post 143a, and a Z actuator 130Z is provided on this third stage 143, and the center shaft ( 32) is moved in the Z-axis direction.

The rotary joint 120 circulates a cooling medium through the cooling plate 31 of the substrate holding unit 30, and a supply path and a discharge path are provided on the hollow rotating shaft 15, and the supply path and the discharge path It is comprised so that it may connect to the supply port and the discharge port provided in the rotary joint via an annular flow path with respect to a port.

The magnetic seal 125 is a magnetic fluid seal, and a vacuum chamber ( 100) is sealed.

In addition, the magnetic seal 125 and the insertion hole 102 of the hollow rotating shaft 15 provided in the upper wall 101 of the vacuum chamber 100 are sealed by the deformable bellows 150.

In addition, the substrate lifting actuator 160 for driving the substrate lifting unit 40 is provided separately on the upper wall 101 of the vacuum chamber 100 .

The X actuator 130X, the Y actuator 130Y, and the θ actuator 130θ rotate the mask holding unit 20 through the hollow rotation shaft 15 in the X direction, the Y direction, and the θ direction, In the case of alignment, alignment adjustment of the board|substrate 3 and the mask 2 is performed by moving the mask 2 with respect to the stationary board|substrate 3 . At the time of film formation, the drive torque is transferred to the substrate holding unit 30 via the mask holding unit 20 and the guide mechanism 10 by rotationally driving the hollow rotating shaft 15 by the θ actuator 130θ. It transmits, and the mask holding unit 20 and the whole board|substrate holding unit 30 are rotationally driven integrally.

Above (outside) the vacuum chamber 100, for alignment adjustment of the substrate 3 and the mask 2, a camera (not shown) for measuring the positions of the substrate 3 and the mask 2, respectively, is installed. . The camera takes pictures of the substrate 3 and the mask 2 through a window installed in the vacuum chamber 100 . By recognizing the alignment mark on the board|substrate 3 and the alignment mark on the mask 2 from the image, each XY position and the relative shift in XY plane can be measured.

The film forming apparatus 1 has a control unit 170 . The control unit 170 includes an X actuator 130X, a Y actuator 130Y, a Z actuator 130Z, a θ actuator 130θ, a substrate lifting actuator 160, and a camera (not shown), an evaporation source 50, etc. control to execute a series of steps of conveying the substrate 3 , an alignment step, and a film forming step. The control unit 170 can be configured by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the function of the control unit 170 is realized when the processor executes the program stored in the memory or storage. As the computer, a general-purpose computer may be used, an embedded computer or a programmable logic controller (PLC) may be used. Alternatively, some or all of the functions of the control unit 170 may be configured by circuits such as ASICs or FPGAs. In addition, the control part 170 may be provided for each film-forming apparatus, and one control part 170 may control a plurality of film-forming apparatuses.

Next, the basic procedure of film-forming is demonstrated with reference to FIG.

It is explanatory drawing of the alignment process of the film-forming apparatus of FIG. 2, and a film-forming process.

alignment process

Before film formation, the board|substrate 3 is supported at a predetermined position by the support tool 41 of the board|substrate raising/lowering unit 40, as shown to Fig.7 (A). The position of the substrate 3 is between the mask stand 21 and the substrate holding unit 30 . In this position, the hollow rotation shaft 15 is moved in the XY direction by the X actuator 130X, the Y actuator 130Y, and the θ actuator 130θ, and rotates in the θ direction with respect to the rotation center line N , The mask 2 held by the mask holding unit 20 connected to the hollow rotating shaft 15 is moved relative to the substrate 3 to perform alignment adjustment.

At this time, the substrate holding unit 30 connected to the mask holding unit 20 via the guide mechanism 10 also moves in synchronization with the mask holding unit 20 .

After the alignment adjustment, as shown in FIG. 7B , the substrate 3 is lowered by the substrate lifting unit 40 and placed on the mask 2 supported by the mask stand 21 , The earth 41 is evacuated from the substrate 3 by an actuator not shown.

Next, as shown in FIG.7(C), by Z actuator 130Z (refer FIG.2, FIG.3), the board|substrate holding unit 30 is lowered through the center shaft 32, and it cools. The plate 31 is brought into contact with the surface of the substrate 3 on the opposite side to the mask 2 . The mask 2 is attracted|sucked so that it may closely_contact|adhere to the board|substrate 3 by the magnet 33a provided in the board|substrate holding unit 30 .

film formation process

At the time of film-forming, the mask holding unit 20 is rotationally driven via the hollow rotating shaft 15 by the (theta) actuator 130(theta) used by alignment. The rotational torque of this mask holding unit 20 is transmitted to the substrate holding unit 30 via the four guide shafts 11 and the guide bushing 12 of the guide mechanism 10, so that the mask holding unit ( 20) and the substrate holding unit 30 are integrally rotationally driven.

At this time, since it is guided by the guide shaft 11 and the guide bush 12, stable rotation is maintained. The rotation is usually rotated at a speed of about 50 rpm, but the rotation speed is arbitrary.

Thereby, the film-forming material can be vapor-deposited uniformly on the board|substrate 3, and the film of a uniform film thickness can be produced|generated.

On the other hand, in the above embodiment, the hollow rotating shaft 15 is used as the rotational torque transmitting means, and the torque is transmitted from the mask holding unit 20 to the substrate holding unit 30 through the guide mechanism 10 . , Using the center shaft 32 as a rotational torque transmitting means, you may comprise so that a torque may be transmitted from the board|substrate holding|maintenance unit 30 to the mask holding|maintenance unit 20 via the guide mechanism 10. For example, various configurations can be employed, such as providing the θ actuator 130θ on the center shaft 32 side. Specifically, the actuator 130θ is configured to rotationally drive the center shaft 32 through a ball spline mechanism, and the Z actuator 130Z is configured to convert rotational motion into linear motion through a ball screw mechanism. Do it. In this way, while rotating the center shaft 32 through the ball spline mechanism by the θ actuator 130θ, the Z actuator 130Z prevents the center shaft 32 from moving in the axial direction. By also rotating the nut, only rotational motion can be realized. In other words, the rotational torque from the rotational torque transmitting means is transmitted from one of the mask holder and the substrate holder to the other via the guide mechanism, and the mask holder and the substrate holder are configured to rotate integrally.

In addition, about the guide mechanism 10, although it comprised by the guide shaft and the guide bush in the said embodiment, it should just be a mechanism which is relatively non-rotatable and can be relatively moved linearly in the direction parallel to the rotation center line, for example, A straight guide composed of a track rail and a sliding bar moving along the track rail may be used, but is not limited to a guide shaft and a guide bush.

<Example of manufacturing method of electronic device>

Next, an example of the manufacturing method of the electronic device using the film-forming apparatus of this embodiment is demonstrated. Hereinafter, the structure and manufacturing method of an organic electroluminescent display are illustrated as an example of an electronic device.

First, an organic EL display device to be manufactured will be described. Fig. 8A is an overall view of the organic EL display device 60, and Fig. 8B is a cross-sectional structure of one pixel.

As shown in FIG. 8A , in the display area 61 of the organic EL display device 60 , a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix shape. Although the details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. In addition, the pixel here refers to the minimum unit which enables display of a desired color in the display area 61. As shown in FIG. In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit light different from each other. has been The pixel 62 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is particularly limited if at least one color or more it is not

Fig. 8(B) is a schematic partial cross-sectional view taken along line A-B of Fig. 8(A). The pixel 62 includes, on a substrate 63 , a first electrode (anode) 64 , a hole transport layer 65 , any one of the light emitting layers 66R, 66G, and 66B, an electron transport layer 67 and , an organic EL element including a second electrode (cathode) 68 . Among them, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to organic layers. In the present embodiment, the light emitting layer 66R is an organic EL layer emitting red light, the light emitting layer 66G is an organic EL layer emitting green color, and the light emitting layer 66B is an organic EL layer emitting blue color. The light-emitting layers 66R, 66G, and 66B are formed in a pattern corresponding to light-emitting elements (sometimes referred to as organic EL elements) emitting red, green, and blue, respectively. In addition, the 1st electrode 64 is formed separately for each light emitting element. The hole transport layer 65 , the electron transport layer 67 , and the second electrode 68 may be formed in common with a plurality of light emitting elements, or may be formed for each light emitting element. On the other hand, in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign substances, an insulating layer 69 is provided between the first electrodes 64 . Furthermore, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

In order to form an organic EL layer in a light emitting element unit, the method of film-forming through a mask is used. In recent years, high definition of a display device is progressing, and a mask with an opening width|variety of several tens of micrometers is used for formation of an organic electroluminescent layer. In the case of film formation using such a mask, when the mask receives heat from an evaporation source and is thermally deformed during film formation, the positions of the mask and the substrate are shifted, and the pattern of the thin film formed on the substrate is shifted from the desired position. Accordingly, the film forming apparatus (vacuum vapor deposition apparatus) according to the present invention is preferably used for film formation of these organic EL layers.

Next, the example of the manufacturing method of an organic electroluminescent display apparatus is demonstrated concretely.

First, a substrate 63 on which a circuit (not shown) for driving an organic EL display device and a first electrode 64 are formed is prepared.

An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by a lithography method to form an opening in the portion where the first electrode 64 is formed to form an insulating layer 69 ) to form This opening corresponds to the light emitting region in which the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 has been patterned is loaded into the first film forming apparatus, the substrate is held in the substrate holding unit, and the hole transport layer 65 is shared over the first electrode 64 of the display area. It forms a film as a layer. The hole transport layer 65 is formed by vacuum deposition. In reality, since the hole transport layer 65 is formed to have a size larger than that of the display area 61 , a very fine (high definition) mask is unnecessary.

Next, the substrate 63 on which up to the hole transport layer 65 has been formed is loaded into the second film forming apparatus, and is held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and the red light emitting layer 66R is formed on the portion of the substrate 63 where the red light emitting element is disposed. According to this example, a mask and a board|substrate can be laminated|stacked favorably, and high-precision film-forming can be performed.

Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G emitting green light is formed by the third film forming apparatus, and the light emitting layer 66B which emits blue light is further formed by the fourth film forming apparatus. After the formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transporting layer 67 is formed over the entire display area 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a common layer to the light emitting layers 66R, 66G, and 66B of the three colors.

The substrate on which the electron transport layer 67 has been formed is moved to a sputtering device, a second electrode 68 is formed, and then moved to a plasma CVD device to form a protective layer 70, and an organic EL display device 60 is completed

The light emitting layer made of an organic EL material is exposed to an atmosphere containing moisture or oxygen until the film formation of the protective layer 70 is completed after the substrate 63 on which the insulating layer 69 has been patterned is loaded into the film forming apparatus. There is a possibility of deterioration by this moisture or oxygen. Therefore, in this example, carrying in and carrying out of the board|substrate between film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

In the organic EL display device thus obtained, a light emitting layer is precisely formed for each light emitting element. Accordingly, by using the above manufacturing method, it is possible to suppress the occurrence of defects in the organic EL display device due to the displacement of the light emitting layer.

1: rotational film forming apparatus, 2: mask, 3: substrate,
10: guide mechanism, 11: guide shaft, 12: guide bush,
15: hollow rotating shaft (torque transmission means),
18: Sim,
20: mask holding unit, 21: mask stand, 22: support plate,
23: connection member;
30: substrate holding unit, 31: cooling plate, 33: yoke plate;
33a: magnet,
32: center shaft,
40: substrate lifting unit, 41: support,
50: evaporation source,
100: vacuum chamber;
130θ: θ actuator,
130Z: Z actuator,
N: center of rotation

Claims (29)

A film forming apparatus for forming a film forming material on the substrate through the mask while integrally rotating a substrate and a mask overlapping the film forming surface of the substrate,
a mask holder for holding the mask;
a substrate holding unit for holding the substrate;
a center shaft connected to the substrate holder and configured to move the substrate holder along a rotation center line of the substrate and the mask;
rotational torque transmitting means connected to either one of the mask holding part and the substrate holding part;
Position changing means for changing the relative positions of the mask holder and the substrate holder in a direction parallel to the rotation center line while maintaining the relative positions of the mask holder and the substrate holder in the rotational direction; A film forming apparatus, characterized in that. According to claim 1,
The rotational torque transmitting means includes a drive shaft connected to the mask holder. 3. The method of claim 2,
The drive shaft of the rotation torque transmitting means is hollow,
and the center shaft is inserted into the hollow part of the drive shaft. 4. The method of claim 3,
and guide means for regulating a change in the relative positions of the mask holder and the substrate holder in the rotational direction;
and transmitting a rotational torque from the mask holder to the substrate holder via the guide means. According to claim 1,
The film forming apparatus, wherein the center shaft transmits the rotation torque to the substrate holding unit as the rotation torque transmitting means. 6. The method of claim 5,
and guide means for regulating a change in the relative positions of the mask holder and the substrate holder in the rotational direction;
and transmitting a rotational torque from the substrate holder to the mask holder via the guide means. According to claim 1,
a guide shaft disposed parallel to the rotation center line;
and a fitting member that fits relative to the guide shaft so as to be movable relative to the guide shaft. 8. The method of claim 7,
A film forming apparatus comprising a plurality of the guide shafts. 9. The method of claim 8,
The plurality of guide shafts are disposed at symmetrical positions with respect to the rotation center line. 8. The method of claim 7,
At a connection position between at least one of the guide shaft and the fitting member, and at least one of the mask holder and the substrate holder, the substrate holding surface of the substrate holding part and the mask holding part of the mask holding part are connected. A film forming apparatus comprising an adjustment means for adjusting the parallelism with the surface. 11. The method of claim 10,
The film forming apparatus according to claim 1, wherein the adjusting means is a shim. 8. The method of claim 7,
The mask holding unit,
a mask stand on which the mask is placed;
a support plate disposed in parallel with a predetermined distance above the mask stand;
and a connecting member connecting the mask stand and the support plate,
The substrate holding unit is disposed between the mask stand and the supporting plate,
and the fitting member is mounted to the support plate of the mask holding part, and one end of the guide shaft inserted into the fitting member is fixed to the substrate holding part. According to claim 1,
The mask holding unit,
a mask stand on which the mask is placed;
a support plate disposed in parallel with a predetermined distance above the mask stand;
and a connecting member connecting the mask stand and the support plate,
The substrate holding unit is disposed between the mask stand and the supporting plate,
the center shaft passes through the support plate of the mask holder and is connected to the substrate holder;
The film forming apparatus, wherein the center shaft moves the substrate holding part in an axial direction as the position changing means. According to claim 1,
and alignment means for moving the substrate holding part and the mask holding part in two directions perpendicular to the rotation center line and orthogonal to each other, respectively. 15. The method of claim 14,
The alignment means aligns the substrate and the mask in a state in which the position change means changes the relative positions of the mask holder and the substrate holder so that the mask and the substrate are spaced apart. A film forming apparatus for forming a film forming material on the substrate through the mask while integrally rotating a substrate and a mask overlapping the film forming surface of the substrate,
a mask holder for holding the mask;
a substrate holding unit for holding the substrate;
a center shaft connected to the substrate holder and configured to move the substrate holder along a rotation center line of the substrate and the mask;
rotational torque transmitting means connected to either one of the mask holding part and the substrate holding part;
Guide means for regulating a change in the relative position of the mask holder and the substrate holder in a rotational direction, and allowing a change in the relative position of the mask holder and the substrate holder in a direction parallel to the rotation center line A film forming apparatus comprising a. 17. The method of claim 16,
The rotational torque transmitting means includes a drive shaft connected to the mask holder. 18. The method of claim 17,
The drive shaft of the rotation torque transmitting means is hollow,
and the center shaft is inserted into the hollow part of the drive shaft. 19. The method of claim 18,
and transmitting a rotational torque from the mask holder to the substrate holder via the guide means. 17. The method of claim 16,
The film forming apparatus, wherein the center shaft transmits the rotation torque to the substrate holding unit as the rotation torque transmitting means. 21. The method of claim 20,
and transmitting a rotational torque from the substrate holder to the mask holder via the guide means. 17. The method of claim 16,
The guide means,
a guide shaft disposed parallel to the rotation center line;
and a fitting member that fits relative to the guide shaft so as to be movable relative to the guide shaft. 23. The method of claim 22,
A film forming apparatus comprising a plurality of the guide shafts. 23. The method of claim 22,
At a connection position between at least one of the guide shaft and the fitting member, and at least one of the mask holder and the substrate holder, the substrate holding surface of the substrate holding part and the mask holding part of the mask holding part are connected. A film forming apparatus comprising adjusting means for adjusting parallelism with a surface. 17. The method of claim 16,
The said center shaft changes the relative position of the said mask holding part and the said board|substrate holding part by changing the position of the said board|substrate holding part. 17. The method of claim 16,
The mask holding unit,
a mask stand on which the mask is placed;
a support plate disposed in parallel with a predetermined distance above the mask stand;
and a connecting member connecting the mask stand and the support plate,
The substrate holding unit is disposed between the mask stand and the supporting plate,
and the center shaft passes through the support plate of the mask holder and is connected to the substrate holder. 17. The method of claim 16,
and alignment means for moving the substrate holding part and the mask holding part in two directions perpendicular to the rotation center line and orthogonal to each other, respectively. 28. The method of claim 27,
The film forming apparatus, wherein the alignment means aligns the substrate and the mask in a state in which the guide means changes the relative positions of the mask holder and the substrate holder so that the mask and the substrate are spaced apart. A method of manufacturing an electronic device, comprising:
29. A manufacturing method of an electronic device characterized by manufacturing an electronic device using the film-forming apparatus in any one of Claims 1-28.

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