KR20220017572A - Apparatus and method for treating substrate - Google Patents

Abstract

The present invention provides a substrate treating apparatus for treating a substrate. The substrate treating apparatus according to one embodiment of the present invention includes: a support unit that supports a substrate; a fluid supply unit that includes a fluid supply nozzle for supplying a fluid onto the substrate supported by the support unit; a jig supported by the support unit; and a controller that controls the fluid supply unit and the jig, wherein the jig includes a plurality of pressure sensors that detects a pressure applied to the jig to transmit a pressure signal to the controller; and a light emitting member that emits light in response to the pressure signal input from the controller, and the controller may control the fluid supply unit to supply the fluid onto the jig before the fluid supply nozzle supplies the fluid onto the substrate, and control the fluid supply unit and the jig to adjust at least one of brightness or color of the light emitting member according to an intensity of the pressure detected by the pressure sensor. According to the present invention, it is possible to easily set a position of the nozzle for discharging the fluid.

Description

Substrate processing apparatus and substrate processing method {APPARATUS AND METHOD FOR TREATING SUBSTRATE}

The present invention relates to an apparatus and method for processing a substrate.

In order to manufacture a semiconductor device or a liquid crystal display, various processes such as photography, ashing, etching, ion implantation, thin film deposition, and cleaning of a substrate are performed. The double cleaning process is a process for removing particles remaining on the substrate, and is performed before and after each process.

These cleaning processes are applied differently depending on the surface properties of the substrate. In particular, when the surface of the substrate is hydrophobized or the hydrophobized surface is cleaned, a chemical treatment step and a wetting treatment step are performed. A chemical is supplied while the substrate is being rotated, and then a wetting liquid is supplied. In addition, a gas such as an inert gas may be supplied to the substrate for drying or the like before and after a process of treating the substrate by supplying a liquid such as a chemical wetting liquid.

In the process of supplying a fluid such as liquid or gas, a position on the substrate to which the fluid is supplied affects the process. Accordingly, it is required to accurately set the nozzle so that the fluid supplied to the substrate is supplied to the correct position on the substrate.

In addition, it is not easy to determine whether the point at which the fluid is supplied on the substrate deviates from the original position, and it is also not easy to determine whether the supply amount or supply pressure of the supplied gas and liquid is abnormal.

An object of the present invention is to provide an apparatus and method capable of easily determining whether a fluid supply point on a substrate is positioned properly.

Another object of the present invention is to provide an apparatus and method capable of easily setting a position of a nozzle for discharging a fluid.

Another object of the present invention is to provide an apparatus and method capable of easily determining whether a fluid supply state is abnormal.

The present invention provides a substrate processing apparatus for processing a substrate. A substrate processing apparatus according to an embodiment of the present invention includes: a support unit for supporting a substrate; a fluid supply unit including a fluid supply nozzle for supplying a fluid onto a substrate supported by the support unit; a jig supported by the support unit; a fluid supply unit and a controller for controlling the jig, the jig comprising: a plurality of pressure sensors for sensing pressure applied to the jig and transmitting a pressure signal to the controller; and a light emitting member that emits light according to a pressure signal input from the controller, wherein the fluid supply unit supplies the fluid onto the jig before the fluid supply nozzle supplies the fluid onto the substrate, and The fluid supply unit and the jig may be controlled to adjust any one of the brightness or the color of the light emitting member according to the intensity.

In an embodiment, the controller may control the jig so that the brightness of the light emitting member increases as the intensity of the pressure sensed by the pressure sensor increases.

In an embodiment, the controller may control the jig so that the intensity of the pressure sensed by the pressure sensor is divided into 5 stages so that the color of the light emitting member is provided differently in each stage.

In an embodiment, the pressure sensor and the light emitting member may be provided radially on the jig.

In an embodiment, the light emitting member may be an LED lamp.

In one embodiment, the fluid may include a gas.

In one embodiment, the jig may be provided in a shape corresponding to the substrate.

In an embodiment, the fluid supply nozzle may be provided as a fixed nozzle for discharging the fluid from a position outside a region facing the substrate placed on the support unit above the support unit.

The present invention also provides a method for processing a substrate. In one embodiment, there is provided a method for setting a position of a nozzle, the method comprising: a jig loading step of loading a jig on a support unit; The method may include a nozzle position setting step of supplying a fluid onto a jig to adjust the position of the fluid supply nozzle so that the impact point of the fluid supply nozzle becomes a preset position based on the brightness or color of the light emitting member.

In an embodiment, the light emitting member may be provided with a brighter brightness as the intensity of the pressure sensed by the pressure sensor increases.

In an embodiment, the light emitting member divides the intensity of the pressure sensed by the pressure sensor into 5 stages, and each stage may be provided with a different color.

In an embodiment, the pressure sensor and the light emitting member may be provided radially on the jig.

In one embodiment, in the nozzle position setting step, the fluid is supplied onto the central region of the jig, but the position of the fluid supply nozzle may be adjusted so that the brightness of the light emitting member provided in the central region is the brightest.

In an embodiment, the light emitting member may be an LED lamp.

In one embodiment, the fluid may include a gas.

In one embodiment, the jig may be provided in a shape corresponding to the substrate.

In one embodiment, after the nozzle position setting step, the cleaning step of unloading the jig on the support unit and loading the substrate on the support unit to supply a fluid onto the substrate to clean the substrate may be further included.

The apparatus and method according to an embodiment of the present invention can easily determine whether the fluid supply point on the substrate is in the correct position.

In addition, the apparatus and method according to the embodiment of the present invention can easily set the position of the nozzle for discharging the fluid.

In addition, the apparatus and method according to an embodiment of the present invention can easily determine whether a fluid supply state is abnormal.

1 is a plan view showing a substrate processing facility according to an embodiment of the present invention.
FIG. 2 is a plan view illustrating the substrate processing apparatus of FIG. 1 .
3 is a cross-sectional view illustrating the substrate processing apparatus of FIG. 1 .
4 is a perspective view illustrating a gas supply nozzle according to an embodiment of the present invention.
5 is a plan view showing a state of a jig according to an embodiment of the present invention.
6 is a flowchart showing the procedure of the substrate processing method of the present invention.
7 to 8 are views sequentially showing a substrate processing method of the present invention, respectively.

Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those of ordinary skill in the art. Accordingly, the shapes of the components in the drawings are exaggerated in order to emphasize a clearer description.

In this embodiment, a process of hydrophobizing the surface of the substrate and cleaning it will be described as an example. However, the present invention is not limited thereto, and may be applied to various types of apparatuses for processing a substrate by supplying a fluid such as liquid or gas.

1 is a plan view showing a substrate processing facility according to an embodiment of the present invention. Referring to FIG. 1 , a substrate processing facility 1 includes an index module 10 and a process processing module 20 . The index module 10 has a load port 120 and a transport frame 140 . The load port 120 , the transfer frame 140 , and the process processing module 20 are sequentially arranged in a line. Hereinafter, a direction in which the load port 120 , the transfer frame 140 , and the process processing module 20 are arranged is referred to as a first direction 12 , and when viewed from the top, is perpendicular to the first direction 12 . The direction is referred to as a second direction 14 , and a direction perpendicular to a plane including the first direction 12 and the second direction 14 is referred to as a third direction 16 .

The carrier 18 in which the substrate W is accommodated is seated on the load port 120 . A plurality of load ports 120 are provided and they are arranged in a line along the second direction 14 . The number of load ports 120 may increase or decrease according to process efficiency and footprint conditions of the process processing module 20 . A plurality of slots (not shown) are formed in the carrier 18 for accommodating the substrates W in a horizontally arranged state with respect to the ground. As the carrier 18 , a Front Opening Unifed Pod (FOUP) may be used.

The process module 20 includes a buffer unit 220 , a transfer chamber 240 , and a process chamber 260 . The transfer chamber 240 is disposed so that its longitudinal direction is parallel to the first direction 12 . Process chambers 260 are respectively disposed on both sides of the transfer chamber 240 . On both sides of the transfer chamber 240 , the process chambers 260 are symmetrically positioned with respect to the transfer chamber 240 . Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240 . Also, some of the process chambers 260 are arranged to be stacked on each other. That is, the process chambers 260 may be arranged in an A X B arrangement on one side of the transfer chamber 240 . Here, A is the number of process chambers 260 provided in a line along the first direction 12 , and B is the number of process chambers 260 provided in a line along the third direction 16 . When four or six process chambers 260 are provided on one side of the transfer chamber 240 , the process chambers 260 may be arranged in an arrangement of 2 X 2 or 3 X 2 . The number of process chambers 260 may increase or decrease.

Optionally, the process chamber 260 may be provided on only one side of the transfer chamber 240 . In addition, the process chamber 260 may be provided as a single layer on one side or both sides of the transfer chamber 240 .

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240 . The buffer unit 220 provides a space in which the substrate W stays before the substrate W is transferred between the transfer chamber 240 and the transfer frame 140 . A slot (not shown) in which the substrate W is placed is provided in the buffer unit 220 . A plurality of slots (not shown) are provided to be spaced apart from each other in the third direction 16 . A surface of the buffer unit 220 facing the transfer frame 140 and a surface facing the transfer chamber 240 are open.

The transfer frame 140 transfers the substrate W between the carrier 18 seated on the load port 120 and the buffer unit 220 . The transfer frame 140 is provided with an index rail 142 and an index robot 144 . The index rail 142 is provided in a longitudinal direction parallel to the second direction 14 . The index robot 144 is installed on the index rail 142 and linearly moves in the second direction 14 along the index rail 142 . The index robot 144 has a base 144a, a body 144b, and an index arm 144c.

The base 144a is installed to be movable along the index rail 142 . The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. In addition, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward with respect to the body 144b. A plurality of index arms 144c are provided to be individually driven. The index arms 144c are disposed to be stacked apart from each other in the third direction 16 . Some of the index arms 144c are used when transferring the substrate W from the process processing module 20 to the carrier 18 , and other parts of the index arms 144c are used when transferring the substrate W from the carrier 18 to the process processing module 20 . ) can be used to return This may prevent the particles generated from the substrate W before the process from adhering to the substrate W after the process in the process of the index robot 144 loading and unloading the substrate W.

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260 . The transfer chamber 240 is provided with a guide rail 242 and a main robot 244 . The guide rail 242 is disposed so that its longitudinal direction is parallel to the first direction 12 . The main robot 244 is installed on the guide rail 242 and linearly moved along the first direction 12 on the guide rail 242 . The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed to be movable along the guide rail 242 . The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. In addition, the body 244b is provided to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b, which is provided to be movable forward and backward with respect to the body 244b. A plurality of main arms 244c are provided to be individually driven. The main arms 244c are arranged to be stacked apart from each other in the third direction 16 .

A substrate processing apparatus 300 (see FIGS. 2 and 3 ) for performing a cleaning process on the substrate W is provided in the process chamber 260 . The substrate processing apparatus 300 provided in each process chamber may have different structures depending on the type of cleaning process to be performed. Alternatively, the substrate processing apparatus 300 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups, so that the substrate processing apparatuses 300 in the process chamber 260 belonging to the same group are the same as each other, and the substrate processing apparatuses 300 are the same in the process chamber 260 belonging to different groups. The structures of the processing device 300 may be provided to be different from each other.

The substrate processing apparatus 300 performs a process of hydrophobizing the surface of the substrate and cleaning the surface. FIG. 2 is a cross-sectional view illustrating the substrate processing apparatus of FIG. 1 . Referring to FIG. 2 , the substrate processing apparatus 300 includes a processing container 320 , a support unit 340 , an elevation unit 360 , and fluid supply units 380 , 420 , and 500 .

The processing container 320 has a cylindrical shape with an open top. The processing vessel 320 has an internal recovery container 322 and an external recovery container 326 . Each of the recovery tanks 322 and 326 recovers different treatment liquids from among the treatment liquids used in the process. The inner recovery container 322 is provided in the shape of an annular ring surrounding the support unit 340 , and the external recovery container 326 is provided in the shape of an annular ring surrounding the inner recovery container 326 . The inner space 322a and the internal recovery barrel 322 of the internal recovery barrel 322 function as a first inlet 322a through which the treatment liquid flows into the internal recovery barrel 322 . The space 326a between the internal collection tube 322 and the external collection tube 326 functions as a second inlet 326a through which the treatment liquid flows into the external collection tube 326 . According to an example, each of the inlets 322a and 326a may be located at different heights. Recovery lines 322b and 326b are connected under the bottom of each of the recovery barrels 322 and 326 . The treatment liquids introduced into each of the recovery tanks 322 and 326 may be provided to an external treatment liquid regeneration system (not shown) through the recovery lines 322b and 326b to be reused.

The support unit 340 supports and rotates the substrate W during the process. The support unit 340 has a body 342 , a support pin 344 , a chuck pin 346 , and a support shaft 348 . Body 342 has a top surface that is provided as a generally circular shape when viewed from above. A rotatable support shaft 348 is fixedly coupled to the bottom surface of the body 342 by the driving unit 349 .

A plurality of support pins 344 are provided. The support pins 344 are disposed to be spaced apart from each other at predetermined intervals on the edge of the upper surface of the body 342 and protrude upward from the body 342 . The support pins 344 are arranged to have an annular ring shape as a whole by combination with each other. The support pin 344 supports the rear edge of the substrate W so that the substrate W is spaced apart from the upper surface of the body 342 by a predetermined distance.

A plurality of chuck pins 346 are provided. The chuck pin 346 is disposed farther from the center of the body 342 than the support pin 344 . The chuck pin 346 is provided to protrude upward from the body 342 . The chuck pin 346 supports the side of the substrate W so that the substrate W is not laterally separated from the original position when the support unit 340 is rotated. The chuck pin 346 is provided to enable linear movement between the standby position and the support position along the radial direction of the body 342 . The standby position is a position further away from the center of the body 342 compared to the support position. When the substrate W is loaded or unloaded from the support unit 340 , the chuck pin 346 is positioned at the standby position, and when a process is performed on the substrate W, the chuck pin 346 is positioned at the support position. In the supporting position, the chuck pin 346 is in contact with the side of the substrate W.

The lifting unit 360 linearly moves the processing container 320 in the vertical direction. As the processing vessel 320 moves up and down, the relative height of the processing vessel 320 with respect to the support unit 340 is changed. The lifting unit 360 has a bracket 362 , a moving shaft 364 , and a driver 366 . The bracket 362 is fixedly installed on the outer wall of the processing vessel 320 , and a moving shaft 364 , which is moved in the vertical direction by the driver 366 , is fixedly coupled to the bracket 362 . When the substrate W is placed on or lifted from the support unit 340 , the processing container 320 is lowered so that the support unit 340 protrudes above the processing container 320 . In addition, when the process is in progress, the height of the processing vessel 320 is adjusted so that the processing liquid can be introduced into the predetermined collection troughs 322 and 326 according to the type of the processing liquid supplied to the substrate W. Optionally, the lifting unit 360 may move the support unit 340 in the vertical direction.

The fluid supply units 380 , 420 , and 500 supply various types of fluids onto the substrate W . According to an example, the fluid supply units 380 , 420 , and 500 may supply chemicals, a rinse solution, an organic solvent, and a drying gas. The fluid supply units 380 , 420 , and 500 include a moving nozzle unit 380 and fixed nozzle units 420 , 500 .

The moving nozzle unit 380 includes a first moving nozzle 389 , a second moving nozzle 399 , a replacement nozzle 409 , and a plurality of nozzle moving members 381 . The first moving nozzle 389 discharges the first processing liquid, the second moving nozzle 399 discharges the second processing liquid, and the displacement nozzle 409 discharges the organic solvent. The first moving nozzle 389 , the second moving nozzle 399 , and the replacement nozzle 409 supply a liquid to a processing position of the substrate W supported by the support unit 340 . Here, the processing position may be a position including the center of the substrate W. Each of the first moving nozzle 389 , the second moving nozzle 399 , and the replacement nozzle 409 is movable to the process position and the standby position by the nozzle moving member 381 . Here, the process position is a position where each nozzle faces the substrate W supported by the support unit 340 , and the standby position is a position where each of the nozzles 389 , 399 , and 409 deviate from the process position. According to an example, the process position may be a position at which each of the nozzles 389 , 399 , and 409 can supply a liquid to the center of the substrate W . The first treatment liquid and the second treatment liquid may be chemicals having different properties. The first treatment liquid may be a chemical containing diluted hydrofluoric acid (HF), and the second treatment liquid may be a chemical containing ammonia (NH3). The organic solvent may be a liquid containing isopropyl alcohol (IPA).

The nozzle moving member 381 includes a support shaft 386 , a support arm 382 , and a drive member 388 . The support shaft 386 is located on one side of the processing vessel 320 . The support shaft 386 has a rod shape whose longitudinal direction faces the third direction 16 . The support shaft 386 is provided to be rotatable by the driving member 388 . The support arm 382 is coupled to the upper end of the support shaft 386 . Support arm 382 extends perpendicularly from support shaft 386 . Each nozzle is fixedly coupled to an end of the support arm 382 . As the support shaft 386 is rotated, each nozzle 389 , 399 , 409 is swingable with the support arm 382 . Each nozzle 389 , 399 , 409 may be swingably moved to a process position and a standby position. When viewed from the top, each of the nozzles 389 , 399 , and 409 may be positioned such that the discharge port coincides with the center of the substrate W at the process position.

Optionally, the support shaft 386 may be provided to enable lifting and lowering movement. In addition, the support arm 382 may be provided to be movable forward and backward in its longitudinal direction.

The fixed nozzle units 420 and 500 include one or a plurality of fixed nozzles for discharging a fluid such as a drying gas or a wetting liquid onto the substrate W placed on the support unit 340 .

In one example, the fixed nozzle units 420 and 500 include a first nozzle 421 , a second nozzle 422 , a third nozzle 423 , and a gas supply nozzle 500 . The first nozzle 421 , the second nozzle 422 , the third nozzle 423 , and the gas supply nozzle 500 are opposite to the substrate W placed on the support unit 340 above the support unit 340 . It may be provided as a fixed nozzle for discharging the fluid from a position out of the area.

In one example, the first nozzle 421 discharges the first liquid onto the substrate W placed on the support unit 340 , and the second nozzle 422 is the substrate W placed on the support unit 340 . The second liquid is discharged onto the upper surface, the third nozzle 423 discharges the third liquid onto the substrate W placed on the support unit 340 , and the gas supply nozzle 500 is placed on the support unit 340 . A gas may be discharged on the substrate W.

In one example, the first liquid is a treatment liquid. For example, the first liquid may be a liquid containing ammonia and hydrogen peroxide. In one example, the second liquid and the third liquid are the same liquid. For example, the second liquid and the third liquid are deionized water (DIW). In one example, the gas may be nitrogen (N2).

In one example, the impact point of the first nozzle 421 , the third nozzle 423 , and the gas supply nozzle 500 is a central area of the substrate, and the impact point of the second nozzle 422 is an edge area of the substrate.

The fluid supply units 380 , 420 , and 500 may further include a controller (not shown). The controller controls the moving nozzle unit 380 and the fixed nozzle units 420 and 500 . The controller controls the moving nozzle unit 380 and the fixed nozzle units 420 and 500 to supply each fluid according to each stage of the process.

Since the positions of the fixed nozzle units 420 and 500 are fixed while processing the substrate, it is necessary to set the positions of the fixed nozzle units 420 and 500 to the correct position before processing the substrate. Hereinafter, a nozzle to which the position of the nozzle is set will be described as the gas supply nozzle 500 . Optionally, the nozzle to be set may be any one or more of the first nozzle 421 , the second nozzle 422 , and the third nozzle 423 .

4 is a perspective view illustrating a gas supply nozzle 500 according to an embodiment of the present invention. The gas supply nozzle 500 has a discharge port 510 , a nozzle body 522 , a driving shaft 520 , and a guide rail 521 . In one example, the discharge port 510 of the gas supply nozzle 500 is provided to be rotatable in one direction. The nozzle body 522 is provided to be movable in the vertical direction by the driving shaft 520 . The nozzle body 522 is provided movably left and right by the guide rail 521 on which the driving shaft 520 is mounted. In one example, the discharge port 510 and the driving shaft 520 may be automatically moved by the controller. Optionally, the discharge port 510 and the driving shaft 520 may be manually moved by a person.

The present invention uses a jig 550 to set the position of the nozzle. The jig 550 is supported on the support unit. In one example, the jig 550 is provided in a shape corresponding to the substrate. Accordingly, the impact point of the nozzle is maintained the same on the jig 550 and the substrate.

A pressure sensor 552 and a light emitting member 554 are provided on the jig 550 . The pressure sensor 552 senses the pressure applied to the upper surface of the jig 550 and transmits a pressure signal to the controller 530 . The light emitting member 554 emits light according to a pressure signal input from the controller 530 . In one example, the light emitting member 554 is provided as an LED lamp. In one example, the pressure sensor 552 and the light emitting member 554 correspond one-to-one. In one example, the pressure sensor 552 and the light emitting member 554 are provided radially on the jig 550 . For example, the pressure sensor 552 and the light emitting member 554 may be provided in three lines along the radial direction of the jig 550 .

The light emitting member 554 has a different brightness or color according to the intensity of the pressure measured by the pressure sensor 552 . In one example, as the intensity of the pressure sensed by the pressure sensor 552 increases, the brightness of the light emitting member 554 may be provided to be brighter. Optionally, the controller 530 may provide different brightness of the light emitting member 554 by dividing the pressure sensed by the pressure sensor 552 into five stages. The controller 530 sets a pressure range for each step, and when a pressure within the corresponding range is sensed, the light emitting member 554 emits light with a brightness corresponding to each step.

Optionally, the color of the light emitting member 554 may be changed according to the pressure sensed by the pressure sensor 552 . For example, the controller 530 may provide a different color of the light emitting member 554 by dividing the pressure sensed by the pressure sensor 552 into five stages. The color of the light emitting member 554 may be red, purple, green, blue, or white. The controller 530 may provide different colors of the light emitting member 554 by dividing the pressure sensed by the pressure sensor 552 into five stages. The controller 530 sets a pressure range for each step, and when a pressure within the corresponding range is sensed, the light emitting member 554 emits light with a color corresponding to each step.

Hereinafter, a substrate processing method of the present invention will be described with reference to FIGS. 6 to 8 . 6 is a flowchart sequentially illustrating the substrate processing method of the present invention, and FIGS. 7 to 8 are views sequentially illustrating the substrate processing method of the present invention.

Referring to FIG. 6 , the substrate processing method of the present invention includes a jig loading step ( S10 ), a nozzle position setting step ( S20 ), and a cleaning step ( S30 ). In the jig loading step ( S10 ), the jig 550 is loaded onto the support unit 340 as shown in FIG. 7 . Hereinafter, it will be described that the light emitting member 554 differently provides brightness according to the pressure sensed by the pressure sensor 552 in the nozzle position setting step S20 . Optionally, the light emitting member 554 may provide a different color according to the pressure sensed by the pressure sensor 552 .

Thereafter, in the nozzle position setting step ( S20 ), the gas supply nozzle 500 supplies gas toward the jig 550 as shown in FIG. 8 . In one example, the target point of the gas supply nozzle 500 is a central region of the substrate. Since the substrate and the jig 550 are provided in the same shape, the gas supply nozzle 500 supplies gas toward the central region of the jig 550 .

Since the target point of the gas supply nozzle 500 is the central region, the correct position of the gas supply nozzle 500 is when the brightness of the light emitting member 554 provided in the central region of the jig 550 is the brightest. A pressure sensor 552 placed in the path of the gas discharged from the gas supply nozzle 500 senses the gas pressure. Accordingly, as shown in FIG. 8 , when the gas supply nozzle 500 is placed in the correct position, the brightness of the light emitting member 554 provided in the central region of the jig 550 is the brightest, and the light provided on the gas path. As the brightness of the member 554 moves away from the central region, the darker the light is emitted. Through this, the path through which the gas is supplied can be checked. Accordingly, in the nozzle position setting step S20 , the position of the fluid supply nozzle is adjusted so that the impact point of the fluid supply nozzle becomes a preset position based on the brightness of the light emitting member 554 . In one example, when the intensity of the gas pressure displayed by the light emitting member 554 is not appropriate, the flow rate or the discharge pressure of the gas discharged from the gas supply nozzle 500 may be adjusted.

After the nozzle position setting step (S20), a cleaning step (S30) is performed. In the cleaning step (S30), the substrate is cleaned by unloading the jig 550 on the support unit and loading the substrate on the support unit to supply a fluid onto the substrate.

As described above, the present invention provides a configuration for irradiating light that can easily determine the discharge direction of the fluid discharged from the nozzle, thereby making it possible to easily determine whether the fluid supply point on the substrate is in the correct position. Accordingly, the present invention can easily set the position of the nozzle for discharging the fluid.

In addition, it is possible to easily determine whether there is an abnormality in the supply state of the fluid, such as an abnormality in the flow rate of the nozzle and an abnormality in the discharge pressure.

The above detailed description is illustrative of the present invention. In addition, the above description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed herein, the scope equivalent to the written disclosure, and/or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in specific application fields and uses of the present invention are possible. Accordingly, the detailed description of the present invention is not intended to limit the present invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

300: substrate processing apparatus 340: support unit
421: first nozzle 422: second nozzle
423: third nozzle 500: gas supply nozzle
550: jig
552: pressure sensor
554: light emitting member

Claims (17)

An apparatus for processing a substrate, comprising:
a support unit for supporting the substrate;
a fluid supply unit including a fluid supply nozzle for supplying a fluid onto the substrate supported by the support unit;
a jig supported by the support unit;
A controller for controlling the fluid supply unit and the jig,
The jig is
a plurality of pressure sensors that sense the pressure applied to the jig and transmit a pressure signal to the controller;
and a light emitting member that emits light according to the pressure signal input from the controller,
wherein the controller supplies the fluid onto the jig by the fluid supply unit before the fluid supply nozzle supplies the fluid onto the substrate,
A substrate processing apparatus for controlling the fluid supply unit and the jig so that any one of a brightness or a color of the light emitting member is adjusted according to the intensity of the pressure sensed by the pressure sensor. According to claim 1,
The controller is
and controlling the jig so that the brightness of the light emitting member increases as the intensity of the pressure sensed by the pressure sensor increases. According to claim 1,
The controller is
The substrate processing apparatus divides the intensity of the pressure sensed by the pressure sensor into 5 stages, and controls the jig so that the color of the light emitting member is provided differently in each stage. According to claim 1,
The pressure sensor and the light emitting member are provided radially on the jig. According to claim 1,
The light emitting member is an LED lamp. According to claim 1,
The fluid is a substrate processing apparatus including a gas. 7. The method according to any one of claims 1 to 6,
The jig is a substrate processing apparatus provided in a shape corresponding to the substrate. 8. The method of claim 7,
and the fluid supply nozzle is provided as a fixed nozzle for discharging the fluid from a position out of an area facing the substrate placed on the support unit above the support unit. In the method of processing a substrate using the substrate processing apparatus of claim 1,
a jig loading step of loading the jig onto the support unit;
and a nozzle position setting step of supplying the fluid onto the jig to adjust a position of the fluid supply nozzle so that an impact point of the fluid supply nozzle becomes a preset position based on the brightness or color of the light emitting member. . 10. The method of claim 9,
In the light emitting member, the brightness of the light emitting member increases as the intensity of the pressure sensed by the pressure sensor increases. 10. The method of claim 9,
The light emitting member divides the intensity of the pressure sensed by the pressure sensor into 5 stages, and each stage is provided with a different color. 10. The method of claim 9,
The pressure sensor and the light emitting member are provided radially on the jig. 13. The method of claim 12,
In the nozzle position setting step,
supplying the fluid onto the central region of the jig,
and adjusting the position of the fluid supply nozzle so that the brightness of the light emitting member provided in the central region is the brightest. 10. The method of claim 9,
wherein the light emitting member is an LED lamp. 10. The method of claim 9,
wherein the fluid includes a gas. 16. The method according to any one of claims 9 to 15,
The jig is a substrate processing method provided in a shape corresponding to the substrate. 17. The method of claim 16,
After the nozzle position setting step,
and unloading the jig on the support unit and loading the substrate on the support unit to supply the fluid onto the substrate to clean the substrate.

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