KR20220016757A - Multilayer ceramic substrate with mutual coupling means and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a multilayer ceramic substrate which comprises: a first thin ceramic plate; a second thin ceramic plate disposed in the upper part of the first thin ceramic plate; and a third thin ceramic plate disposed in the upper part of the second thin ceramic plate. One end of the second thin ceramic plate is stacked to protrude more than one end of the first thin ceramic plate and the third thin ceramic plate to form a protrusion, and electrodes are formed on upper and lower surfaces of the protrusion.

Description

Multilayer ceramic substrate for LED having mutual coupling means and manufacturing method thereof

The present invention relates to a multilayer ceramic substrate for LED having mutual coupling means and a method for manufacturing the same, wherein coupling means is formed on the multilayer ceramic substrate so that bonding of the multilayer ceramic substrate can be performed without other coupling members, and the multilayer ceramic substrate It relates to a multilayer ceramic substrate for LEDs having a mutual coupling means for making the distance between LEDs constant even after bonding of the LEDs and a method for manufacturing the same.

A light emitting diode (LED) display is a device that visually expresses data using an LED substrate on which a plurality of LEDs are installed.

Since the LED display has to have constant luminance and uniformity over the entire screen, the distance between the LEDs installed on the LED substrate must be uniformly positioned.

Such an LED display is configured by connecting a plurality of LED substrate blocks to each other.

On the other hand, when connecting different LED board blocks, a means for coupling must be added between each LED board block, and the LED spacing between each LED board block cannot be kept constant due to the size and thickness of the coupling means. There is a problem.

In addition, since a coupling means must be used whenever different LED substrate blocks are connected, the number of processes increases, and thus, there is a problem in that a large amount of process time and personnel are required.

Under this background, the present inventors developed a multilayer ceramic substrate for LED having a mutual coupling means and a manufacturing method thereof, and completed the present invention by confirming the effect.

Korean Patent Office Laid-Open Patent Publication No. 10-2015-014403

An object of the present invention to solve the above problems is to form a coupling means on the multilayer ceramic substrate so that the bonding of the multilayer ceramic substrate can be performed without other bonding members, and to keep the distance between the LEDs constant even after the bonding of the multilayer ceramic substrate. An object of the present invention is to provide a multilayer ceramic substrate for LEDs having mutual coupling means and a method for manufacturing the same.

A multilayer ceramic substrate for LEDs having a mutual coupling means according to an embodiment of the present invention is disposed on a first thin ceramic plate, a second thin ceramic plate disposed on the first thin ceramic plate, and on the second thin ceramic plate A multilayer ceramic substrate including a third thin ceramic plate, wherein one end of the second thin ceramic plate is laminated to protrude from one end of the first thin ceramic plate and the third thin ceramic plate to form a protrusion, and upper and lower surfaces of the protrusion have electrodes this is formed

A method of manufacturing a multilayer ceramic substrate for LED having a mutual coupling means according to another embodiment of the present invention includes: printing a pattern with a conductive material on each end surface of a plurality of thin ceramic plates and performing heat treatment to form internal electrodes; and arranging and stacking each of the plurality of thin ceramic plates so that each of the plurality of thin ceramic plates is electrically connected to form a protrusion, and internal electrodes are exposed on upper and lower surfaces of the protrusion.

A multilayer ceramic substrate for LEDs having a mutual coupling means according to another embodiment of the present invention includes a thin ceramic plate, a second thin ceramic plate disposed on the first thin ceramic plate, and disposed on the second thin ceramic plate A second multilayer ceramic substrate comprising a third thin ceramic plate to be used, wherein one end of the first thin ceramic plate and the third thin ceramic plate is laminated to protrude from one end of the second thin ceramic plate to form a groove, and the groove is formed An electrode is formed on the upper surface of the first thin ceramic plate and the lower surface of the third thin ceramic plate.

A method of manufacturing a multilayer ceramic substrate for LED having a mutual coupling means according to another embodiment of the present invention includes: printing a pattern with a conductive material on each end surface of a plurality of thin ceramic plates and performing heat treatment to form internal electrodes; and arranging and stacking each of the plurality of thin ceramic plates so that each of the plurality of thin ceramic plates is electrically connected to form a groove, and electrodes are exposed on upper and lower surfaces of the ceramic thin plate forming the groove.

A method of manufacturing a multilayer ceramic substrate for LED having a mutual coupling means according to another embodiment of the present invention comprises: forming a first multilayer ceramic substrate in which a protrusion is formed and electrodes are formed on upper and lower surfaces of the protrusion; forming a second multilayer ceramic substrate in which a groove is formed and electrodes are formed on upper and lower surfaces forming the groove; and an electrode formed in the protrusion of the first multilayer ceramic substrate and an electrode formed in the groove of the second multilayer ceramic substrate by fitting the protrusion of the first multilayer ceramic substrate and the groove portion of the second multilayer ceramic substrate together. and electrically connecting the first multilayer ceramic substrate and the second multilayer ceramic substrate by bringing them into contact with each other.

A multilayer ceramic substrate for LED having a mutual coupling means according to another embodiment of the present invention is a multilayer ceramic substrate including a first thin ceramic plate and a second thin ceramic plate disposed on the first thin ceramic plate, One end of the two thin ceramic plates is laminated to protrude from one end of the first thin ceramic plate to form a protrusion, and an electrode is formed on a lower surface of the protrusion.

In a method of manufacturing a multilayer ceramic substrate for LED having a mutual coupling means according to another embodiment of the present invention, a pattern is printed with a conductive material on each end surface of a first thin ceramic plate and a second thin ceramic plate, and an internal electrode is formed by heat treatment. forming; and aligning and stacking each of the first ceramic thin plate and the second ceramic thin plate to form a protrusion while the first ceramic plate and the second thin ceramic plate are electrically connected to each other, and the electrode is exposed on the lower surface of the protrusion. include

A method of manufacturing a multilayer ceramic substrate for LED having a mutual coupling means according to another embodiment of the present invention includes: forming a plurality of multilayer ceramic substrates having protrusions and electrodes formed on a lower surface of the protrusions; and arranging a plurality of multilayer ceramic substrates so that each of the protrusions face each other, and electrically connecting the plurality of multilayer ceramic substrates by forming solder with a conductive material on the electrodes formed on the lower surfaces of each of the protrusions.

A multilayer ceramic substrate for LED having a mutual coupling means according to another embodiment of the present invention is a multilayer ceramic substrate including one or more thin ceramic plates, one end of which is formed with a protruding concave-convex portion, and one side of the protruding concavo-convex portion is formed with an electrode. this is formed

A method of manufacturing a multilayer ceramic substrate for LED having a mutual coupling means according to another embodiment of the present invention comprises the steps of: generating a plurality of thin ceramic plates; forming via holes in the plurality of thin ceramic plates and filling the via holes with a conductive material to form via electrodes; forming electrodes on side surfaces of the plurality of thin ceramic plates by cutting the via electrodes in a direction perpendicular to the upper surfaces of the plurality of thin ceramic plates; and cutting the plurality of thin ceramic plates so that protruding concavo-convex portions are formed at one end of the plurality of thin ceramic plates, wherein a first side electrode is formed on one protruding side of the protruding concavo-convex portions, except for one protruding side of the protruding concave-convex portion and cutting the plurality of thin ceramic plates to form a second side electrode on the side surface.

A multilayer ceramic substrate for LEDs having a mutual coupling means according to another embodiment of the present invention is a multilayer ceramic substrate including one or more thin ceramic plates, a recessed concavo-convex portion is formed at one end, and an electrode is formed on one side of the depressed concavo-convex portion is formed

A method of manufacturing a multilayer ceramic substrate for LED having a mutual coupling means according to another embodiment of the present invention comprises the steps of: generating a plurality of thin ceramic plates; forming via holes in the plurality of thin ceramic plates and filling the via holes with a conductive material to form via electrodes; forming electrodes on side surfaces of the plurality of thin ceramic plates by cutting the via electrodes in a direction perpendicular to the upper surfaces of the plurality of thin ceramic plates; and cutting the plurality of thin ceramic plates so that a protruding depression is formed at one end of the plurality of thin ceramic plates, a first side electrode is formed on one side of the recessed concavo-convex part, and one side except for one side of the protruding concave recessed part. and cutting the plurality of thin ceramic plates to form a second side electrode on the side surface.

According to another embodiment of the present invention, there is provided a method of manufacturing a multilayer ceramic substrate for LED having a mutual coupling means, the method comprising: forming a first multilayer ceramic substrate having a protruding concave-convex portion formed at one end; forming a second multilayer ceramic substrate having a recessed and convex portion formed at one end; and electrically connecting the first multilayer ceramic substrate and the second multilayer ceramic substrate by fitting the protrusion and convexity portions of the first multilayer ceramic substrate and the concave and convex portions of the second multilayer ceramic substrate to each other.

According to the present invention, there is an effect that can easily combine different LED substrate blocks without other coupling members.

In addition, according to the present invention, even by combining a plurality of LED substrate blocks, there is an effect that the distance between each LED can be maintained constant.

In addition, according to the present invention, since the number of processes can be reduced, process time and personnel can be reduced, there is an effect of improving process efficiency.

1 is a view showing the configuration of a multilayer ceramic substrate 100 on which a protrusion is formed according to an embodiment of the present invention.
2 is a view showing a method of manufacturing a multilayer ceramic substrate 100 according to an embodiment of the present invention.
3 is a view showing the configuration of a multilayer ceramic substrate 200 on which a groove portion is formed according to another embodiment of the present invention.
4 is a view showing a method of manufacturing a multilayer ceramic substrate 200 according to another embodiment of the present invention.
5 is a diagram illustrating the configuration of a multilayer ceramic substrate 300 on which grooves and protrusions are formed according to another embodiment of the present invention.
6 is a view showing a state in which the multilayer ceramic substrate 100 on which the protrusions are formed and the multilayer ceramic substrate 200 on which the grooves are formed are combined according to another embodiment of the present invention.
7 is a diagram illustrating a method of bonding the multilayer ceramic substrate 100 on which the protrusions are formed and the multilayer ceramic substrate 200 on which the grooves are formed according to another embodiment of the present invention.
8 is a view showing the configuration of a multilayer ceramic substrate 400 on which a protrusion is formed according to another embodiment of the present invention.
9 is a view showing a method of manufacturing a multilayer ceramic substrate 400 on which a protrusion is formed according to another embodiment of the present invention.
10 is a view showing a method of bonding the multilayer ceramic substrate 400 on which the protrusion is formed according to another embodiment of the present invention.
11 is a view showing a state in which a plurality of multilayer ceramic substrates 400 are combined according to another embodiment of the present invention.
12 is a view showing the configuration of the ceramic substrate 600 on which the protruding concavo-convex portions are formed according to another embodiment of the present invention.
13 is a view showing the configuration of the ceramic substrate 700 on which the recessed and concave-convex portions are formed according to another embodiment of the present invention.
14 is a diagram illustrating a method of manufacturing a ceramic substrate 600 on which a protruding concavo-convex portion is formed according to another embodiment of the present invention.
15 is a view illustrating a method of manufacturing a ceramic substrate 700 on which a recessed and convex portion is formed according to another embodiment of the present invention.
16 is a diagram illustrating a method of bonding the ceramic substrate 600 on which the protruding concavo-convex portions are formed and the ceramic substrate 700 in which the concave concavo-convex portions are formed according to another embodiment of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In adding reference numerals to components in each drawing, it should be noted that the same components are given the same reference numerals as much as possible even though they are indicated in different drawings.

In the description of the embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function interferes with the understanding of the embodiment of the present invention, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, or order of the elements are not limited by the terms.

Hereinafter, with reference to the accompanying drawings, a multilayer ceramic substrate (hereinafter referred to as "multilayer ceramic substrate") for LEDs having a mutual coupling means according to an embodiment of the present invention and a manufacturing method thereof will be described in detail.

Referring to FIG. 1 , the configuration of the multilayer ceramic substrate 100 according to an embodiment of the present invention will be described.

1 is a view showing the configuration of a multilayer ceramic substrate 100 on which a protrusion is formed according to an embodiment of the present invention.

Referring to FIG. 1 , the multilayer ceramic substrate 100 of the present invention includes a first thin ceramic plate 110 , a second thin ceramic plate 120 , and/or a third thin ceramic plate 130 .

The first thin ceramic plate 110 may be made by sintering to have a uniform flat surface by creating a uniform temperature and pressure distribution on the ceramic sheet.

The second thin ceramic plate 120 and the third thin ceramic plate 130 may also be made in the same way as the first thin ceramic plate 110 .

The second thin ceramic plate 120 may be disposed on the first thin ceramic plate 110 , and the third thin ceramic plate 130 may be disposed on the second thin ceramic plate 120 .

A plurality of LEDs 1 may be installed on the upper surface of the third ceramic thin plate 130 at a predetermined distance. That is, the present multilayer ceramic substrate 100 may form one LED substrate block. Here, the LED 1 may be a Top LED and/or a Side LED. However, the LED (1) is not limited to the above-described type of LED, and any type of LED (1) is irrelevant as long as it is installed on a thin ceramic plate and can emit light.

One end of the second thin ceramic plate 120 may be laminated to protrude from one end of the first thin ceramic plate 110 and/or the third thin ceramic plate 130 to form the protrusion 121 .

In this case, the other end of the second thin ceramic plate 120 may be disposed in parallel with the other end of the first thin ceramic plate 110 and/or the other end of the third thin ceramic plate 130 .

For example, the second thin ceramic plate 120 may be formed to be larger than the size of the first thin ceramic plate 110 and/or the third thin ceramic plate 130 , and the other end of the first thin ceramic plate 110 , the second thin ceramic plate By arranging the other end of 120 and/or the other end of the third thin ceramic plate 130 side by side, one end of the second thin ceramic plate 120 is one end of the first thin ceramic plate 110 and/or the third thin ceramic plate ( The protrusion 121 may be formed by protruding from one end of the 130 .

An electrode 122 may be formed on the upper and lower surfaces of the protrusion 121 , and the electrode 122 includes a first electrode 122a formed on the upper surface of the protrusion 121 and a second electrode 122a formed on the lower surface of the protrusion 121 . It may include two electrodes 122b.

The first electrode 122a and the second electrode 122b may be formed by printing a pattern with a conductive material on both end surfaces of the second thin ceramic plate 120 and performing heat treatment. In this case, the first electrode 122a and the second electrode 122b may refer to the pattern itself printed on the cross section of the second thin ceramic plate 120 .

A method of manufacturing the multilayer ceramic substrate 100 according to an embodiment of the present invention will be described with reference to FIG. 2 .

2 is a view showing a method of manufacturing a multilayer ceramic substrate 100 according to an embodiment of the present invention.

According to an embodiment of the present invention, a method of manufacturing the multilayer ceramic substrate 100 includes the following steps. (1) printing a pattern with a conductive material on the cross-section of each of the plurality of thin ceramic plates and heat-treating them to form internal electrodes, (2) forming protrusions while electrically connecting the plurality of thin ceramic plates, and upper and lower surfaces of the protrusions Aligning and stacking each of a plurality of thin ceramic plates so that the electrodes are exposed.

In step (1), the plurality of ceramic thin plates of the present invention may be ceramic thin plates produced by firing a plurality of ceramic green sheets. That is, according to an embodiment of the present invention, one ceramic green sheet is fired to generate one ceramic thin plate, and another ceramic green sheet is fired to generate another ceramic thin plate. can create

Specifically, the ceramic thin plate may be produced by firing the ceramic green sheet at 1000° C. to 1600° C. for 1 hour to 5 hours in an oxygen-free reducing environment or atmospheric environment. Further, the ceramic green sheet may have a thickness of 50 microns to 600 microns, and the thin ceramic plate may have a thickness of 10 microns to 500 microns. In addition, the diameter of the ceramic green sheet and the thin ceramic plate may be 12 inches or more.

In addition, via holes may be formed in the plurality of thin ceramic plates. In this case, one or more via holes may be formed in one thin ceramic plate. The via hole may be formed through a process such as laser irradiation and chemical etching. Furthermore, the diameter of the via hole may be 30 microns to 200 microns.

The plurality of thin ceramic plates in which the via holes are formed may be filled with a conductive material and subjected to heat treatment to form a via electrode. At this time, the reason for filling the via hole of the ceramic thin plate with the conductive material is for electrical connection between the plurality of thin ceramic plates to be stacked later.

On the other hand, the conductive material filled in the via hole may correspond to at least one of Ag, Cu, Au, Pd, Pt, Ag-Pd, Ni, Mo, and W, and the filled conductive material is subjected to a heat treatment process. It is cured in the via hole to form a via electrode. That is, when the conductive material is filled in the via hole and then cured, it becomes a via electrode. The conductive material may include 0.1 to 10 weight percent of the inorganic material.

In the step (1), the present invention may print a pattern using a conductive material on the cross-section of each of the plurality of thin ceramic plates described above. In this case, the printed pattern for each ceramic thin plate may be different. And, the printed and heat-treated pattern may correspond to the internal electrode. According to the present invention, the thickness of the internal electrode may be 1 micron to 10 microns. Meanwhile, the conductive material may correspond to at least one of Ag, Cu, Au, Pd, Pt, Ag-Pd, Ni, Mo, and W, and may include an inorganic material in an amount of 0.1 to 10 weight percent.

On the other hand, the patterns printed on the upper and lower surfaces of each ceramic thin plate are formed to be in contact with the upper and lower surfaces of via holes formed inside the ceramic thin plates, and the patterns printed on the upper and/or lower surfaces of each ceramic thin plate are electrically connected to each other through the via holes.

Thereafter, the bonding agent may be applied to the cross-section of each of the remaining ceramic thin plates except for the uppermost ceramic thin plate among the plurality of ceramic thin plates, avoiding the via hole. In this case, the uppermost ceramic thin plate may mean a ceramic thin plate to be positioned on the uppermost layer when a plurality of ceramic thin plates are later stacked layer by layer. In this case, the bonding agent used in this step is a material that does not affect the cross-section and pattern of the ceramic thin plate, and may be composed of at least one of inorganic materials such as glass and ceramics, and organic materials such as epoxy. Furthermore, the bonding agent may be used to bond the ceramic thin plates to be laminated later. According to an embodiment of the present invention, the bonding agent may form a bonding layer, and the bonding layer may have a thickness of 2 microns to 100 microns.

In the step (2), in the present invention, each of the plurality of thin ceramic plates may be arranged so that each of the plurality of thin ceramic plates is electrically connected through the via electrode and the internal electrode, and may be stacked (stacked). That is, the pattern printed on the surface of the thin ceramic plate of one layer may be electrically connected to the pattern printed on the surface of the thin ceramic plate of the other layer through the via hole. In other words, the inner electrode of one layer is electrically connected with the inner electrode of the lower layer through the via electrode of the corresponding layer, and the inner electrode of one layer is electrically connected with the inner electrode of the upper layer through the via electrode of the upper layer. can At this time, one or more ceramic thin plates among the plurality of thin ceramic plates may be stacked to protrude from one end of the other thin ceramic plates. Accordingly, a protrusion may be formed, and internal electrodes may be exposed on upper and lower surfaces of the protrusion.

For example, an embodiment of the present invention includes a first thin ceramic plate 110 , a second thin ceramic plate 120 , and/or a third thin ceramic plate 130 . And, by arranging the other end of the first thin ceramic plate 110, the other end of the second thin ceramic plate 120 and/or the other end of the third thin ceramic plate 130 side by side, one end of the second thin ceramic plate 120 is first The protrusion 121 may be formed by protruding from one end of the first thin ceramic plate 110 and/or one end of the third thin ceramic plate 130 .

Thereafter, an embodiment of the present invention may heat-treat a plurality of laminated ceramic thin plates. That is, in one embodiment of the present invention, the plurality of thin ceramic plates can be adhered to each other by heat-treating the laminated plurality of thin ceramic plates to melt the bonding agent applied to the cross-section of each of the plurality of thin ceramic plates. The point may be different depending on the material constituting the bonding agent. Furthermore, in this process, in order to prevent melting of the thin ceramic plate, the pattern printed on the thin ceramic plate, and/or the conductive material filled in the via hole of the thin ceramic plate, the melting point of the bonding agent is the melting point of the thin ceramic plate, used for pattern printing It may be lower than the melting point of the conductive material (melting point of the internal electrode material) and the melting point of the conductive material filled in the via hole. In this case, the melting point of the thin ceramic plate may be different depending on the material constituting the thin ceramic plate.

Accordingly, in one embodiment of the present invention, a plurality of laminated ceramic thin plates may be heat-treated at a temperature higher than the melting point of the bonding agent and lower than the melting point of the ceramic thin plate. That is, according to an embodiment of the present invention, defects such as cracks occurring in the ceramic thin plate itself can be prevented by heat-treating a plurality of laminated ceramic thin plates at a temperature that does not affect the ceramic thin plate. For example, an embodiment of the present invention may heat-treat a plurality of ceramic thin plates laminated at 600°C to 900°C, preferably at 800°C, in an atmospheric environment. In this case, the heat treatment time may vary depending on the number and area of the plurality of laminated ceramic thin plates. For example, when the diameter of each of the plurality of laminated ceramic thin plates is 12 inches, in one embodiment of the present invention, the plurality of laminated ceramic thin plates may be fired or heat treated for 0.5 to 2 hours. In one embodiment of the present invention, the multilayer ceramic substrate may be manufactured through the steps (1) to (2).

According to the present invention, the conductive material used for the internal electrode or the via electrode may contain 0 to 20% of the glass component. In this case, the bonding agent may be applied on the ceramic thin plate avoiding the internal electrode and the via electrode. When a bonding agent is applied and a plurality of ceramic thin plates are laminated and then heat treated, some glass components included in the internal electrode are exposed on the upper surface of the conductive material to form a thin glass layer, thereby making it possible to more strongly adhere a plurality of ceramic thin plates. Furthermore, some glass components included in the internal electrode may exist under the conductive material to strengthen the adhesive force between the thin ceramic plate of the corresponding layer and the internal electrode.

Another embodiment of the present invention is to form a bonding layer by applying a bonding agent to a cross section of a thin ceramic plate avoiding a via hole, and filling the via hole with a conductive material as much as the thickness of the bonding layer to electrically connect a plurality of thin ceramic plates. can be connected

A multilayer ceramic substrate 200 on which a groove portion is formed according to another embodiment of the present invention will be described with reference to FIG. 3 .

3 is a view showing the configuration of a multilayer ceramic substrate 200 on which a groove portion is formed according to another embodiment of the present invention.

Referring to FIG. 3 , the multilayer ceramic substrate 200 includes a first thin ceramic plate 210 , a second thin ceramic plate 220 , and/or a third thin ceramic plate 230 .

A second thin ceramic plate 220 is disposed on the first thin ceramic plate 210 , and a third thin ceramic plate 230 is disposed on an upper part of the second thin ceramic plate 220 .

A plurality of LEDs 1 may be installed on the upper surface of the third ceramic thin plate 230 at a predetermined distance. That is, the present multilayer ceramic substrate 200 may form one LED substrate block.

In this case, the first thin ceramic plate 210 and the third thin ceramic plate 230 may be stacked to protrude from one end of the second thin ceramic plate 220 to form the groove portion 221 .

For example, the second thin ceramic plate 220 may be formed to be smaller in size and length than the first thin ceramic plate 210 and/or the third thin ceramic plate 230 . And by arranging the other end of the first thin ceramic plate 210, the other end of the second thin ceramic plate 220, and/or the other end of the third thin ceramic plate 230 side by side, one end of the second thin ceramic plate 220 is the first ceramic Since one end of the thin plate 210 and/or one end of the third ceramic thin plate 230 is inserted into the inner side, the groove portion 221 may be formed.

Electrodes 222 may be formed on the upper surface of the first thin ceramic plate 210 and the lower surface of the third thin ceramic plate 230 forming the groove portion 221 . The electrode 222 may include a first electrode 222a formed on the upper surface of the first thin ceramic plate 210 and a second electrode 222b formed on the lower surface of the third thin ceramic plate 230 .

The first electrode 222a and the second electrode 222b may be internal electrodes formed by printing a pattern with a conductive material on the first thin ceramic plate 210 and/or the third thin ceramic plate 230 and performing heat treatment.

A method of manufacturing the multilayer ceramic substrate 200 according to another embodiment of the present invention will be described with reference to FIG. 4 .

4 is a view showing a method of manufacturing a multilayer ceramic substrate 200 according to another embodiment of the present invention.

According to another embodiment of the present invention, a method of manufacturing the multilayer ceramic substrate 200 includes the following steps. (1) printing a pattern with a conductive material on the cross-section of each of a plurality of thin ceramic plates and heat-treating to form internal electrodes, (2) forming a groove while electrically connecting each of the plurality of thin ceramic plates, Aligning and stacking each of a plurality of thin ceramic plates so that the electrodes are exposed.

The description of the step (1) is replaced with a description of the corresponding step of the embodiment according to FIG. 2 .

In the step (2), in another embodiment of the present invention, unlike the embodiment according to FIG. 2, two or more thin ceramic plates among the plurality of thin ceramic plates may be stacked to protrude from one end of the other thin ceramic plates. Accordingly, a groove portion may be formed. Further, the inner electrode may be exposed on upper and lower surfaces forming the groove portion. The description after lamination of a plurality of thin ceramic plates is replaced with a description after lamination of a plurality of thin ceramic plates of the embodiment according to FIG. 2 .

A multilayer ceramic substrate 300 on which grooves and protrusions are formed according to another embodiment of the present invention will be described with reference to FIG. 5 .

5 is a diagram illustrating the configuration of a multilayer ceramic substrate 300 on which grooves and protrusions are formed according to another embodiment of the present invention.

Referring to FIG. 5 , the multilayer ceramic substrate 300 includes a first thin ceramic plate 310 , a second thin ceramic plate 320 , and/or a third thin ceramic plate 330 .

The first thin ceramic plate 310 , the second thin ceramic plate 320 , and/or the third thin ceramic plate 330 may have the same size and shape. In addition, one end of the second thin ceramic plate 320 may be laminated to protrude from one end of the first thin ceramic plate 310 and/or one end of the third thin ceramic plate 330 to form the protrusion 321 .

At this time, since the size of the first thin ceramic plate 310, the second thin ceramic plate 320, and/or the third thin ceramic plate 330 is the same, the other end of the second thin ceramic plate 320 is the first ceramic thin plate 310. The other end and/or the other end of the third ceramic thin plate 330 may not be arranged in parallel, and may be arranged inwardly.

Accordingly, the protrusion 321 may be formed at one end of the multilayer ceramic substrate 300 , and the groove portion 322 may be simultaneously formed at the other end of the multilayer ceramic substrate 300 .

Electrodes may be respectively formed on the upper and lower surfaces of the protrusion 321 of the multilayer ceramic substrate 300 and the upper and lower surfaces forming the groove 322 . For example, the electrode formed on the upper surface of the protrusion 321 is the first electrode 333 , the electrode formed on the lower surface of the protrusion 321 is the second electrode 334 , and the electrode formed on the upper surface of the groove 322 . is the third electrode 335 , and the electrode formed on the lower surface of the groove 322 may be the fourth electrode 336 .

Here, the electrode is an internal electrode formed by printing a pattern with a conductive material on the upper and/or lower surface of each of the first thin ceramic plate 310, the second thin ceramic plate 320, and/or the third thin ceramic plate 330 and performing heat treatment. can

A bonding structure and a bonding method of a plurality of ceramic substrates will be described with reference to FIGS. 6 to 7 .

6 is a view showing a state in which the multilayer ceramic substrate 100 on which the protrusions are formed and the multilayer ceramic substrate 200 on which the grooves are formed are combined according to another embodiment of the present invention, and FIG. 7 is another embodiment of the present invention. It is a view showing a method of bonding the multilayer ceramic substrate 100 on which the protrusions are formed and the multilayer ceramic substrate 200 on which the grooves are formed according to an exemplary embodiment.

According to the present invention, the coupling structure of the plurality of ceramic substrates includes a first multilayer ceramic substrate 100 in which protrusions are formed, a second multilayer ceramic substrate 200 in which grooves are formed, and/or a first multilayer ceramic substrate 200 in which protrusions and grooves are simultaneously formed. 3 may include a multilayer ceramic substrate 300 .

Here, the first multilayer ceramic substrate 100 is the multilayer ceramic substrate 100 of the embodiment according to FIG. 1 , the second multilayer ceramic substrate 200 is the multilayer ceramic substrate 200 of the embodiment according to FIG. 3 , and the third multilayer The ceramic substrate 300 is a multilayer ceramic substrate 300 of the embodiment according to FIG. 5 . A description of the configuration and/or structure of each of the substrates 100 , 200 , and 300 will be omitted.

The protrusion 121 of the first multilayer ceramic substrate 100 may be inserted into the groove 221 formed in the second multilayer ceramic substrate 200 to be fitted. At this time, the first electrode 122 of the protrusion 121 is in contact with the first electrode 222 of the groove 221 , and the second electrode 123 of the protrusion 121 is connected to the second electrode ( 223) to be electrically connected to each other.

That is, the protrusion portion 121 of the first multilayer ceramic substrate 100 is fitted into the groove portion 221 of the second multilayer ceramic substrate 200 , thereby forming the first multilayer ceramic substrate 100 and the second multilayer ceramic substrate 200 . are structurally coupled, but also electrically coupled.

Accordingly, the first multilayer ceramic substrate 100 and the second multilayer ceramic substrate 200 constituting each LED substrate block can be firmly fixed to each other and connected while maintaining a constant distance between the LEDs 1 attached to each substrate. .

Meanwhile, one or more third multilayer ceramic substrates 300 may be coupled between the first multilayer ceramic substrate 100 and the second multilayer ceramic substrate 200 .

In more detail, the protrusion 121 of the first multilayer ceramic substrate 100 is fitted into the groove 322 of the third multilayer ceramic substrate 300 , and the protrusion 321 of the third multilayer ceramic substrate 300 . may be structurally connected by being fitted into the groove portion 221 of the second multilayer ceramic substrate 200 .

At this time, the first electrode 122 formed in the protrusion 121 of the first multilayer ceramic substrate 100 is in contact with the third electrode 335 formed in the groove 322 of the third multilayer ceramic substrate 300 , The second electrode 123 formed in the protrusion 121 of the first multilayer ceramic substrate 100 may contact the fourth electrode 336 formed in the groove 322 of the third multilayer ceramic substrate 300 .

And, the first electrode 333 of the protrusion 321 of the third multilayer ceramic substrate 300 is in contact with the first electrode 222 of the groove 221 of the second multilayer ceramic substrate 200, and the third multilayer The second electrode 334 of the protrusion 321 of the ceramic substrate 300 may contact the second electrode 223 of the groove 221 of the second multilayer ceramic substrate 200 .

According to the contact structure of each electrode, the first multilayer ceramic substrate 100 , the second multilayer ceramic substrate 200 , and/or the third multilayer ceramic substrate 300 may be electrically coupled to each other.

Accordingly, the first multilayer ceramic substrate 100 , the second multilayer ceramic substrate 200 , and/or the third multilayer ceramic substrate 300 constituting each LED substrate block is at a constant distance between the LEDs 1 attached to each substrate. It can be firmly fixed and connected to each other while maintaining the

According to the structure and coupling of the first multilayer ceramic substrate 100, the second multilayer ceramic substrate 200, and the third multilayer ceramic substrate 300 described above, different LED substrate blocks can be easily combined without other bonding members. there is an effect

In addition, according to the present invention, even by combining a plurality of LED substrate blocks, there is an effect that the distance between each LED (1) can be maintained constant.

In addition, according to the present invention, since the number of processes can be reduced, process time and personnel can be reduced, there is an effect of improving process efficiency.

According to another embodiment of the present invention, the method for bonding the multilayer ceramic substrates 100 , 200 , and 300 includes the following steps. (1) forming a first multilayer ceramic substrate 100 in which protrusions are formed and electrodes are formed on upper and lower surfaces of the protrusions; (2) a second step in which grooves are formed and electrodes are formed on upper and lower surfaces forming the grooves Forming the multilayer ceramic substrate 200, (3) the electrode and the second multilayer ceramic formed on the protrusion of the first multilayer ceramic substrate by fitting the protrusion of the first multilayer ceramic substrate and the groove portion of the second multilayer ceramic substrate with each other Electrically connecting the first multilayer ceramic substrate and the second multilayer ceramic substrate by bringing the electrodes formed in the groove portion of the substrate into contact with each other.

Since step (1) is the same as the method for manufacturing the multilayer ceramic substrate 100 of FIG. 2 , a description thereof will be omitted. Since step (2) is the same as the method for manufacturing the multilayer ceramic substrate 200 shown in FIG. 4 , a description thereof will be omitted.

In the step (3), in another embodiment of the present invention, the protrusion 121 of the first multilayer ceramic substrate 100 and the groove portion 221 of the second multilayer ceramic substrate 200 are fitted with each other to fit the first multilayered ceramic substrate. By making the electrode formed in the protrusion 121 of the ceramic substrate 100 and the electrode formed in the groove 221 of the second multilayer ceramic substrate 200 contact each other, the first multilayer ceramic substrate 100 and the second multilayer ceramic substrate (200) is electrically connected.

In detail, the first electrode 122 formed in the protrusion 121 of the first multilayer ceramic substrate 100 is in contact with the third electrode 335 formed in the groove 322 of the third multilayer ceramic substrate 300 and , the second electrode 123 formed in the protrusion 121 of the first multilayer ceramic substrate 100 may contact the fourth electrode 336 formed in the groove 322 of the third multilayer ceramic substrate 300 .

Accordingly, the first multilayer ceramic substrate 100 and the second multilayer ceramic substrate 200 may be structurally coupled to each other and electrically coupled to each other.

Meanwhile, one or more third multilayer ceramic substrates 300 may be coupled between the first multilayer ceramic substrate 100 and the second multilayer ceramic substrate 200 .

A multilayer ceramic substrate 400 on which a protrusion is formed according to another embodiment of the present invention will be described with reference to FIG. 8 .

8 is a view showing the configuration of a multilayer ceramic substrate 400 on which a protrusion is formed according to another embodiment of the present invention.

Referring to FIG. 8 , the multilayer ceramic substrate 400 includes a first thin ceramic plate 410 and/or a second thin ceramic plate 420 .

A second thin ceramic plate 420 is disposed on the first thin ceramic plate 410 . In this case, a plurality of LEDs 1 may be installed on the upper surface of the second ceramic thin plate 420 at a predetermined distance. That is, the present multilayer ceramic substrate 400 may form one LED substrate block.

One end of the second thin ceramic plate 420 may be stacked to protrude than one end of the first thin ceramic plate 410 to form a protrusion 421 .

In this case, the other end of the second thin ceramic plate 420 may be disposed parallel to the other end of the first thin ceramic plate 410 .

For example, the second thin ceramic plate 420 may be formed to be larger than the size of the first thin ceramic plate 410, and by arranging the other end of the first thin ceramic plate 410 and the other end of the second thin ceramic plate 420 side by side. , one end of the second thin ceramic plate 420 protrudes from one end of the first thin ceramic plate 410 to form a protrusion 421 .

An electrode may be formed on the lower surface of the protrusion 421 , and the electrode may be an internal electrode formed by printing a pattern with a conductive material on both end surfaces of the second thin ceramic plate 420 and performing heat treatment.

The multilayer ceramic substrate 400 may be formed in plurality, and may be combined with each other.

More specifically, in another embodiment of the present invention, the multilayer ceramic substrate 400 may be configured as a pair, and the protrusions 421 may be disposed to face each other. According to this arrangement, a groove due to the two protrusions 421 may be formed between the substrate 400 and the substrate 400 . By forming solder in these grooves, the substrate 400 and the substrate 400 may be structurally coupled to each other.

In this case, the internal electrodes formed at the lower ends of the respective protrusions 421 are connected to each other through solder, so that the substrate 400 and the substrate 400 may be electrically connected.

Accordingly, the plurality of multilayer ceramic substrates 400 constituting each LED substrate block may be firmly fixed to each other and connected while maintaining a constant distance between the LEDs 1 attached to each substrate.

According to the structure and combination of the multilayer ceramic substrate 400 described above, there is an effect that can be easily combined with different LED substrate blocks without other bonding members.

In addition, according to the present invention, even by combining a plurality of LED substrate blocks, there is an effect that the distance between each LED (1) can be maintained constant.

A manufacturing method and a bonding method of the multilayer ceramic substrate 400 on which the protrusion is formed according to another exemplary embodiment of the present invention will be described with reference to FIGS. 9 to 11 .

9 is a view showing a method of manufacturing a multilayer ceramic substrate 400 on which protrusions are formed according to another embodiment of the present invention, and FIG. 10 is a multilayer ceramic substrate on which protrusions are formed according to another embodiment of the present invention ( 400) is a view showing a bonding method, and FIG. 11 is a view showing a state in which a plurality of multilayer ceramic substrates 400 are combined according to another embodiment of the present invention.

Referring to FIG. 9 , according to another embodiment of the present invention, a method of manufacturing a multilayer ceramic substrate 400 includes the following steps.

(1) forming a first ceramic thin plate and a second ceramic thin plate, printing a pattern with a conductive material on each end face of the first ceramic thin plate and the second thin ceramic plate, and performing heat treatment to form internal electrodes (2) 1 A thin ceramic plate and a second thin ceramic plate are electrically connected to each other to form a protrusion, and the first thin ceramic plate and the second thin ceramic plate are arranged and stacked so that an electrode is exposed on a lower surface of the protrusion.

The description of step (1) of the present invention described above is replaced with a description of the corresponding step of the embodiment according to FIG. 2 .

In step (2), in another embodiment of the present invention, each of the first ceramic plate 410 and the second thin ceramic plate 420 is formed through the via electrode and the internal electrode formed on the first thin ceramic plate and the second thin ceramic plate. Each of the first thin ceramic plates 410 and the second thin ceramic plates 420 may be aligned and stacked to be electrically connected. That is, the pattern printed on the surface of the thin ceramic plate of one layer may be electrically connected to the pattern printed on the surface of the thin ceramic plate of the other layer through the via hole.

In this case, one end of the second thin ceramic plate 420 may be stacked to protrude than one end of the first thin ceramic plate 410 , and a protrusion 421 may be formed. For example, the second thin ceramic plate 420 may be formed to be larger than the size of the first thin ceramic plate 410, and by arranging the other end of the first thin ceramic plate 410 and the other end of the second thin ceramic plate 420 side by side. , one end of the second thin ceramic plate 420 may be stacked to protrude than one end of the first thin ceramic plate 410 . Accordingly, the protrusion 421 may be formed. Furthermore, the internal electrode may be exposed on the protrusion 421 .

Thereafter, the laminated first thin ceramic plate 410 and the second thin ceramic plate 420 may be heat-treated. That is, by heat-treating the laminated first thin ceramic plate 410 and the second thin ceramic plate 420 to melt the bonding agent applied between the first thin ceramic plate 410 and the second thin ceramic plate 420 , the first thin ceramic plate The 410 and the second thin ceramic plate 410 may be bonded to each other.

Referring to FIG. 10 , according to another embodiment of the present invention, a method of bonding a multilayer ceramic substrate 400 includes the following steps.

(1) forming a plurality of multilayer ceramic substrates 400 on which protrusions 421 are formed and electrodes are formed on the lower surface of protrusions 421 (2) forming a plurality of multilayer ceramic substrates 400 with respective protrusions ( The step of electrically connecting the plurality of multilayer ceramic substrates 400 by arranging the 421 to face each other and forming solder with a conductive material on the electrodes formed on the lower surface of each of the protrusions 421 .

Since step (1) is the same as the method of manufacturing the multilayer ceramic substrate 400 according to FIG. 9 , a description thereof will be omitted.

In step (2), the multilayer ceramic substrate 400 of the present invention may be configured as a pair, and the protrusions 421 may be disposed to face each other. According to this arrangement, a groove due to the protrusion 421 facing between the substrate 400 and the substrate 400 may be formed. Thereafter, the multilayer ceramic substrate 400 disposed to face each other may be bonded by forming solder using a conductive material in the groove. In this case, the internal electrodes formed at the lower ends of the respective protrusions 421 are connected to each other through solder, so that the substrate 400 and the substrate 400 may be electrically connected.

Meanwhile, in the multilayer ceramic substrate 500 according to another embodiment of the present invention, protrusions 521 may be formed at both ends. Referring to FIG. 11 , both ends of the second thin ceramic plate 520 may be disposed to protrude from both ends of the first thin ceramic plate 510 . Accordingly, protrusions 521 may be formed at both ends of the multilayer ceramic substrate 500 . In addition, electrodes may be formed on the lower surface of the protrusions 521 formed at both ends.

Meanwhile, the multilayer ceramic substrate 500 having the protrusions 521 formed at both ends may be disposed between the multilayer ceramic substrates 400 having the protrusions 521 formed at one end to be coupled to each other.

For example, the multilayer ceramic substrate 400 having protrusions 421 formed at one end is referred to as a first ceramic substrate 400 , and the multilayer ceramic substrate 500 having protrusions 521 formed at both ends is referred to as a second ceramic substrate. Referring to ( 500 ), a plurality of second ceramic substrates 500 may be disposed between the first ceramic substrate 400 and the first ceramic substrate 400 and may be coupled to each other.

Referring to FIG. 11 , the protrusion 421 of the first ceramic substrate 400 may be disposed to face the protrusion 521 of one end of the second ceramic substrate 500 , and the other end of the second ceramic substrate 500 . A protrusion 421 of another first ceramic substrate 400 may be disposed to face the protrusion 521 .

According to this arrangement, a groove may be formed between each of the first ceramic substrates 400 and the second ceramic substrates 500 . And by forming a solder of a conductive material in the groove formed between each of the first ceramic substrate 400 and the second ceramic substrate 500, each of the first ceramic substrate 400 and the second ceramic substrate 500 is structurally and / or may be electrically coupled to each other.

A ceramic substrate 600 on which a protruding concavo-convex portion is formed according to another embodiment of the present invention will be described with reference to FIG. 12 .

12 (a) is a plan view showing the ceramic substrate 600 on which the protruding concavo-convex part is formed according to another embodiment of the present invention, and (b) is a protruding concavo-convex part formed according to another embodiment of the present invention. It is a view showing the ceramic substrate 600 from the side.

Referring to FIG. 12 , the ceramic substrate 600 on which the protruding concavo-convex portions are formed includes one or more thin ceramic plates 610 . A protruding concave-convex portion 620 may be formed at one end of the ceramic thin plate 610 . In addition, an electrode 621 may be formed on one side of the protruding concavo-convex portion 620 .

The electrode 621 includes a first side electrode 621a formed on one protruding side of the protruding concavo-convex portion 620 and a second side surface formed on one side excluding one protruding side of the protruding concave-convex unit 620 . An electrode 621b may be included.

A plurality of LEDs 1 may be installed on the upper surface of the ceramic substrate 600 at a predetermined distance. That is, the present multilayer ceramic substrate 600 may form one LED substrate block.

The ceramic substrate 700 on which the recessed and concave-convex portions are formed according to another embodiment of the present invention will be described with reference to FIG. 13 .

13(a) is a plan view showing a ceramic substrate 700 on which a recessed uneven part is formed according to another embodiment of the present invention, and (b) is a recessed uneven part formed according to another embodiment of the present invention. It is a view showing the ceramic substrate 700 to be used from the side.

Referring to FIG. 13 , the ceramic substrate 700 on which the recessed and convex portions are formed includes one or more thin ceramic plates 710 . At one end of the thin ceramic plate 710 , a recessed and concave-convex portion 720 may be formed. In addition, an electrode 721 may be formed on one side of the recessed concavo-convex portion 720 .

The electrode 721 is formed on one side of the first side electrode 721a formed on the recessed side of the recessed concavo-convex part 720 and the second side surface formed on one side except for the recessed side of the recessed and recessed part 720 . An electrode 721b may be included.

A plurality of LEDs 1 may be installed on the upper surface of the ceramic substrate 700 at a predetermined distance. That is, the present multilayer ceramic substrate 700 may form one LED substrate block.

A method of manufacturing and a bonding method of the ceramic substrate 600 on which the protrusion and convexities are formed and the ceramic substrate 700 on which the recessed and convex portions are formed will be described with reference to FIGS. 14 to 16 .

14 is a view showing a method of manufacturing a ceramic substrate 600 in which the protruding concavo-convex portion is formed according to another embodiment of the present invention, and FIG. 700), and FIG. 16 is a view showing a bonding method of the ceramic substrate 600 on which the protruding concavo-convex portions are formed and the ceramic substrate 700 on which the concave concavo-convex portions are formed according to another embodiment of the present invention. to be.

Referring to FIG. 14 , the method of manufacturing a ceramic substrate 600 on which protruding concavo-convex portions are formed according to the present invention includes the steps of (1) generating a plurality of thin ceramic plates (2) forming via holes in the plurality of thin ceramic plates and conducting a conductive material in the via holes (3) Forming electrodes on the side surfaces of the plurality of thin ceramic plates by cutting the via electrodes in a direction perpendicular to the top surface of the plurality of thin ceramic plates (4) At one end of the plurality of thin ceramic plates A plurality of ceramic thin plates are cut so as to form protruding concavo-convex portions, and a plurality of ceramic plates are formed so that a first side electrode is formed on one protruding side of the protruding concavo-convex portion and a second side electrode is formed on one side except for one protruding side of the protruding concave-convex portion. cutting the thin plate.

Since step (1) is the same as the method of forming the plurality of thin ceramic plates 610 according to FIG. 2 , a description thereof will be omitted.

In the step (2), in the present invention, via holes are formed in the plurality of thin ceramic plates 610 and a conductive material is filled in the formed via holes to form via electrodes. On the other hand, if the via hole is filled with a conductive material and then cured, it becomes a via electrode. At this time, the conductive material corresponds to at least one of Ag, Cu, Au, Pd, Pt, Ag-Pd, Ni, Mo, and W. and may contain 0.1 to 10 weight percent of inorganic material.

In the step (3), in the present invention, the via electrode is cut in a direction perpendicular to the upper surface of the thin ceramic plate 610 . At this time, the via electrode is cut through laser irradiation. The center of the via electrode may be cut or the edge of the via electrode may be cut. That is, any part of the via electrode may be cut. Thereafter, in the present invention, one or more thin ceramic plates 610 are stacked so that patterns and via holes formed on each thin ceramic plate 610 are conductive to each other.

In the step (4), the present invention cuts the ceramic thin plate 610 in the direction of the cut surface of the via electrode. At this time, in the present invention, the thin ceramic plate 610 may be cut to form a protruding concavo-convex portion at one end of the thin ceramic plate 610 . In addition, a first side electrode 621a is formed on one side of the protruding concave-convex portion of the thin ceramic plate 610, and a second side electrode ( The ceramic thin plate 610 may be cut to form 621b).

That is, in the present invention, the first side electrode 621a and the second side electrode 621b may be formed on the side surface of the protruding concavo-convex portion of the ceramic thin plate 610 .

At this time, the ceramic thin plate 610 is any one of a scribing method, a saw method of cutting a place to be cut with a saw (SAW), and/or a laser method of cutting a place to be cut with a laser according to the size and thickness can be cut in the manner of

However, the cutting method of the thin ceramic plate 610 is not limited to the above-described method, and any method may be used as long as it is a method capable of smoothly cutting the thin ceramic plate 610 .

Referring to FIG. 15 , in the method of manufacturing a ceramic substrate 700 on which depressions and convexities are formed according to the present invention, (1) generating a plurality of thin ceramic plates (2) forming via holes in the plurality of thin ceramic plates and conducting conductivity in the via holes Forming via electrodes by filling material (3) forming electrodes on the side surfaces of the plurality of thin ceramic plates by cutting the via electrodes in a direction perpendicular to the upper surfaces of the plurality of thin ceramic plates (4) One end of the plurality of thin ceramic plates A plurality of thin ceramic plates are cut to form a recessed concavo-convex portion in and cutting the ceramic sheet.

Steps (1), (2), and (3) above are replaced with descriptions of the corresponding steps of the embodiment according to FIG. 14 .

In the step (4), the present invention cuts the ceramic thin plate 710 in the direction of the cut surface of the via electrode. At this time, in the present invention, the thin ceramic plate 710 may be cut so that a recessed and convex portion is formed at one end of the thin ceramic plate 710 . In addition, the first side electrode 721a is formed on one side of the recessed concavo-convex portion of the thin ceramic plate 710 , and the second side electrode is formed on the other side except for the depressed one side of the recessed concavo-convex part of the thin ceramic plate 710 . The ceramic thin plate 710 may be cut so that the 721b may be formed.

That is, in the present invention, the first side electrode 721a and the second side electrode 721b may be formed on the side surface of the protruding concavo-convex portion of the thin ceramic plate 710 .

At this time, according to the size and thickness of the ceramic thin plate 710, any one of a scribing method, a saw method for cutting a place to be cut with a saw (SAW), and/or a laser method for cutting a place to be cut with a laser (Laser) can be cut in the manner of

However, the cutting method of the thin ceramic plate 710 is not limited to the above-described method, and any method may be used as long as it is a method capable of smoothly cutting the thin ceramic plate 710 .

Referring to FIG. 16 , the bonding method of the ceramic substrate 600 on which the protruding concavo-convex portions are formed and the ceramic substrate 700 on which the concave concavo-convex portions are formed includes (1) a first multilayer ceramic substrate 600 having a protruding concave-convex portion formed at one end. (2) forming a second multilayer ceramic substrate 700 having a recessed and convex portion formed at one end (3) protruding and convex portions of the first multilayer ceramic substrate 600 and a second multilayer ceramic substrate 700 and electrically connecting the first multilayer ceramic substrate 600 and the second multilayer ceramic substrate 700 to each other by fitting the recessed and convex portions of the .

Since step (1) is the same as the method for manufacturing the ceramic substrate 600 according to FIG. 14 and step (2) is the same as the method for manufacturing the ceramic substrate 700 according to FIG. 15 , a description thereof will be omitted.

In the step (3), in the present invention, the protruding concavo-convex portion of the first multi-layer ceramic substrate 600 may be inserted into the concave concave-convex portion of the second multi-layer ceramic substrate 700 to be fitted. In this case, the shape of the protruding concavo-convex portion of the first multilayer ceramic substrate 600 may be a shape corresponding to the concave concavo-convex portion of the second multilayer ceramic substrate 700 . According to this structure, the first multilayer ceramic substrate 600 and the second multilayer ceramic substrate 700 may be structurally coupled.

In addition, the first side electrode 621a formed in the protruding concavo-convex portion of the first multilayer ceramic substrate 600 is in contact with the first side electrode 721a formed in the concave concavo-convex portion of the second multilayer ceramic substrate 700, and 1 The second side electrode 621b formed on a portion of the multilayer ceramic substrate 600 except for the protruding concavo-convex portion may be in contact with the second side electrode 721b formed on a portion of the second multilayer ceramic substrate 700 excluding the concave and concave-convex portion. have. Accordingly, the first multilayer ceramic substrate 600 and the second multilayer ceramic substrate 700 may be electrically coupled to each other.

On the other hand, the method of manufacturing a ceramic substrate according to another embodiment of the present invention comprises the step of forming a groove forming a scribing line in the surface direction of the cut surface of the via electrode on the upper surface of the plurality of thin ceramic plates 610 and 710. It may further include, and in the step of cutting the multilayer ceramic substrate, the multilayer ceramic substrate may be cut by applying an external force to the scribing line formed by the groove.

At this time, scribing refers to the operation of drawing a line in advance where to cut in order to divide a large-area substrate into several usable substrate chips as a one-way cutting process. That is to say, in the present invention, the groove is formed on a cross-section of the multilayer ceramic substrate in a straight line extending in the vertical direction.

Meanwhile, in this specification, a multilayer ceramic substrate composed of one, two and/or three layers is exemplified to express the present invention, but the present invention may also be applied to a multilayer ceramic substrate composed of four or more layers.

The protection scope of the present invention is not limited to the description and expression of the embodiments explicitly described above. In addition, it is added once again that the protection scope of the present invention cannot be limited due to obvious changes or substitutions in the technical field to which the present invention pertains.

1: LED 2: Solder
100, 200, 300, 400, 500, 600, 700: multilayer ceramic substrate
110: a first thin ceramic plate 120: a second thin ceramic plate
130: third ceramic thin plate
121, 321, 421: protrusions 221, 322: grooves
620: protruding concavo-convex unit 720: concave concavo-convex unit

Claims (13)

A multilayer ceramic substrate comprising a first thin ceramic plate, a second thin ceramic plate disposed on the first thin ceramic plate, and a third thin ceramic plate disposed on the second thin ceramic plate,
One end of the second thin ceramic plate is laminated to protrude from one end of the first thin ceramic plate and the third thin ceramic plate to form a protrusion,
A multilayer ceramic substrate for LEDs having mutual coupling means in which electrodes are formed on upper and lower surfaces of the protrusions.
forming an internal electrode by printing a pattern with a conductive material on each end face of a plurality of thin ceramic plates and performing heat treatment; and
A multilayer for LED having a mutual coupling means comprising the step of forming a protrusion while electrically connected to each of the plurality of ceramic plates, and aligning and stacking each of the plurality of thin ceramic plates so that the upper and lower surfaces of the protrusions expose internal electrodes A method of manufacturing a ceramic substrate.
A second multilayer ceramic substrate comprising a first thin ceramic plate, a second thin ceramic plate disposed on the first thin ceramic plate, and a third thin ceramic plate disposed on the second thin ceramic plate,
One end of the first thin ceramic plate and the third thin ceramic plate is laminated to protrude from one end of the second thin ceramic plate to form a groove,
A multilayer ceramic substrate for LEDs having mutual coupling means in which electrodes are formed on the upper surface of the first thin ceramic plate and the lower surface of the third thin ceramic plate forming the groove portion.
forming an internal electrode by printing a pattern with a conductive material on each end face of a plurality of thin ceramic plates and performing heat treatment; and
Each of the plurality of thin ceramic plates is electrically connected to form a groove, and the upper and lower surfaces of the ceramic thin plate forming the groove are provided with mutual coupling means comprising the step of arranging and stacking each of the plurality of thin ceramic plates so that electrodes are exposed A method for manufacturing a multilayer ceramic substrate for an LED.
forming a first multilayer ceramic substrate in which a protrusion is formed and electrodes are formed on upper and lower surfaces of the protrusion;
forming a second multilayer ceramic substrate in which a groove is formed and electrodes are formed on upper and lower surfaces forming the groove; and
The electrode formed in the protrusion of the first multilayer ceramic substrate and the electrode formed in the groove of the second multilayer ceramic substrate by fitting the protrusion of the first multilayer ceramic substrate and the groove portion of the second multilayer ceramic substrate together are mutually connected. A method of manufacturing a multilayer ceramic substrate for an LED having mutual coupling means comprising the step of electrically connecting the first multilayer ceramic substrate and the second multilayer ceramic substrate by bringing them into contact.
A multilayer ceramic substrate comprising a first thin ceramic plate and a second thin ceramic plate disposed on the first thin ceramic plate,
One end of the second thin ceramic plate is laminated to protrude from one end of the first thin ceramic plate to form a protrusion, and an electrode is formed on the lower surface of the protrusion.
forming internal electrodes by printing a pattern with a conductive material on each end face of the first thin ceramic plate and the second thin ceramic plate and performing heat treatment; and
Forming a protrusion while the first ceramic thin plate and the second thin ceramic plate are electrically connected to each other, and aligning and stacking each of the first ceramic thin plate and the second thin ceramic plate so that the electrode is exposed on the lower surface of the protrusion A method for manufacturing a multilayer ceramic substrate for LEDs having mutual coupling means.
forming a plurality of multilayer ceramic substrates on which protrusions are formed and electrodes are formed on a lower surface of the protrusions; and
Mutual coupling means comprising the step of arranging a plurality of multilayer ceramic substrates so that respective protrusions face each other, and electrically connecting the plurality of multilayer ceramic substrates by forming solder with a conductive material on electrodes formed on a lower surface of each of the protrusions A multilayer ceramic substrate for LEDs with
A multilayer ceramic substrate comprising one or more thin ceramic plates,
A multilayer ceramic substrate for LEDs having a mutual coupling means in which a protruding concavo-convex portion is formed at one end, and an electrode is formed on one side of the protruding concave-convex portion.
creating a plurality of ceramic thin plates;
forming via holes in the plurality of thin ceramic plates and filling the via holes with a conductive material to form via electrodes;
forming electrodes on side surfaces of the plurality of thin ceramic plates by cutting the via electrodes in a direction perpendicular to the upper surfaces of the plurality of thin ceramic plates; and
The plurality of thin ceramic plates are cut to form protruding concavo-convex portions at one end of the plurality of thin ceramic plates, but a first side electrode is formed on one protruding side of the protruding concave-convex portion, and one side except for one protruding side of the protruding concave-convex portion A method of manufacturing a multilayer ceramic substrate for LEDs having a mutual coupling means comprising the step of cutting the plurality of ceramic thin plates to form a second side electrode thereon.
A multilayer ceramic substrate comprising one or more thin ceramic plates,
A multilayer ceramic substrate for LEDs having a mutual coupling means in which a depression is formed at one end, and an electrode is formed on one side of the depression.
creating a plurality of ceramic thin plates;
forming via holes in the plurality of thin ceramic plates and filling the via holes with a conductive material to form via electrodes;
forming electrodes on side surfaces of the plurality of thin ceramic plates by cutting the via electrodes in a direction perpendicular to the upper surfaces of the plurality of thin ceramic plates; and
The plurality of thin ceramic plates are cut so that protruding depressions are formed at one end of the plurality of thin ceramic plates, but a first side electrode is formed on one depressed side of the concave and convex portions, and one side of the protruding concavities and convexities is excluded. A method of manufacturing a multilayer ceramic substrate for LEDs having a mutual coupling means comprising the step of cutting the plurality of thin ceramic plates to form a second side electrode thereon.
forming a first multilayer ceramic substrate having a protruding concave-convex portion formed on one end thereof;
forming a second multilayer ceramic substrate having a recessed and convex portion formed at one end; and
and electrically connecting the first multilayer ceramic substrate and the second multilayer ceramic substrate by fitting the protrusion and convexity portions of the first multilayer ceramic substrate and the concave and convex portions of the second multilayer ceramic substrate to each other. A method for manufacturing a multilayer ceramic substrate for LEDs comprising means.

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