JP7153184B2 - light emitting device - Google Patents

Description

Embodiments of the present invention relate to light emitting devices.

For example, in Patent Document 1, an LED (Light Emitting Diode) element is mounted on a support substrate, a through hole is formed in the support substrate at a position corresponding to an electrode of the LED element, and an electrode of the LED element is formed in the through hole. A light-emitting device is disclosed that is provided with a conductive member connected to the .

JP 2015-192095 A

An object of the embodiments of the present invention is to provide a light-emitting device capable of increasing the reliability of electrical connection between a light source and a wiring layer of a support member.

According to one aspect of the present invention, a light-emitting device is a support member including a wiring layer, and has a first surface and a second surface located on the opposite side of the first surface and including a connection portion of the wiring layer. , a hole separated from the connecting portion in plan view and penetrating from the first surface to the second surface; a light source including an electrode; and a conductive member disposed in the hole and connecting one of the positive electrode and the negative electrode to the connecting portion. The connection portion is arranged in a region other than between the positive electrode and the negative electrode in plan view. The hole includes a first hole that opens on the first surface side, and a second hole that communicates with the first hole and opens on the second surface side. The first hole overlaps with either one of the positive electrode and the negative electrode connected to the conductive member in plan view. The second hole includes, in plan view, a first portion that overlaps the first hole, and a second portion that extends from the first portion toward the connecting portion in the first direction. The volume of the hole on the second surface side is larger than the volume of the hole on the first surface side.

According to the embodiments of the present invention, it is possible to improve the reliability of the electrical connection between the light source and the wiring layer of the support member.

1 is a top view of a light emitting device according to a first embodiment of the invention; FIG. FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1; 1 is a top view of a light source according to a first embodiment of the invention; FIG. It is a bottom view of the light source of the first embodiment of the present invention. FIG. 3B is a cross-sectional view taken along line IIIC-IIIC of FIG. 3A; FIG. 3B is a cross-sectional view taken along line IIID-IIID of FIG. 3A; FIG. 4 is a bottom view showing an example of a lower area of the light source in the light emitting device according to the first embodiment of the invention; FIG. 4 is a bottom view showing an example of a lower area of the light source in the light emitting device according to the first embodiment of the invention; FIG. 4 is a bottom view showing an example of a lower area of the light source in the light emitting device according to the first embodiment of the invention; FIG. 4 is a bottom view showing an example of a lower area of the light source in the light emitting device according to the first embodiment of the invention; It is a sectional view showing a manufacturing method of a light emitting device of a 1st embodiment of the present invention. It is a sectional view showing a manufacturing method of a light emitting device of a 1st embodiment of the present invention. It is a sectional view showing a manufacturing method of a light emitting device of a 1st embodiment of the present invention. It is a sectional view showing a manufacturing method of a light emitting device of a 1st embodiment of the present invention. It is a sectional view showing a manufacturing method of a light emitting device of a 1st embodiment of the present invention. It is a sectional view showing a manufacturing method of a light emitting device of a 1st embodiment of the present invention. It is a sectional view showing a manufacturing method of a light emitting device of a 1st embodiment of the present invention. It is a sectional view showing a manufacturing method of a light emitting device of a 1st embodiment of the present invention. It is a sectional view showing a manufacturing method of a light emitting device of a 1st embodiment of the present invention. It is a sectional view showing a manufacturing method of a light emitting device of a 1st embodiment of the present invention. It is a sectional view showing a manufacturing method of a light emitting device of a 1st embodiment of the present invention. It is a sectional view showing a manufacturing method of a light emitting device of a 1st embodiment of the present invention. FIG. 10 is a bottom view showing an example of a lower area of a light source in a light emitting device according to a second embodiment of the invention; FIG. 10 is a bottom view showing an example of a lower area of a light source in a light emitting device according to a second embodiment of the invention; FIG. 10 is a bottom view showing an example of a lower area of a light source in a light emitting device according to a second embodiment of the invention; FIG. 10 is a bottom view showing an example of a lower area of a light source in a light emitting device according to a second embodiment of the invention; FIG. 10 is a bottom view showing an example of a lower area of a light source in a light emitting device according to a second embodiment of the invention; FIG. 10 is a bottom view showing an example of a lower area of a light source in a light emitting device according to a second embodiment of the invention; It is a top view which shows an example of the light-emitting device of 2nd Embodiment of this invention. FIG. 5 is a cross-sectional view of a light emitting device according to a third embodiment of the invention; FIG. 5 is a cross-sectional view of a light emitting device according to a fourth embodiment of the invention; FIG. 10 is a cross-sectional view of a light emitting device according to a fifth embodiment of the present invention; It is a top view of the light-emitting device of 6th Embodiment of this invention. FIG. 19 is a cross-sectional view taken along line XIX-XIX of FIG. 18; It is sectional drawing which shows the manufacturing method of the light-emitting device of 6th Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the light-emitting device of 6th Embodiment of this invention. FIG. 11 is a cross-sectional view showing an example of the periphery of a dividing groove of a light emitting device according to a sixth embodiment of the present invention; FIG. 11 is a cross-sectional view showing an example of the periphery of a dividing groove of a light emitting device according to a sixth embodiment of the present invention; FIG. 11 is a cross-sectional view showing an example of the periphery of a dividing groove of a light emitting device according to a sixth embodiment of the present invention; FIG. 11 is a cross-sectional view of a light emitting device according to a seventh embodiment of the invention; FIG. 11 is a cross-sectional view showing an example of a light emitting device according to a seventh embodiment of the present invention; FIG. 14 is a cross-sectional view of a light emitting device according to an eighth embodiment of the present invention;

Hereinafter, embodiments will be described with reference to the drawings. Since each drawing schematically shows the embodiment, the scale, interval or positional relationship of each member may be exaggerated, illustration of a part of the member may be omitted, or an end face showing only a cut surface as a cross-sectional view. Figures may be used. In addition, the same code|symbol is attached|subjected to the same structure in each drawing.

[First embodiment]
FIG. 1 is a top view of a light emitting device 300A according to the first embodiment of the invention.
FIG. 2 is a cross-sectional view taken along line II--II of FIG.

The light emitting device 300A includes a support member 200, a light source 20A, a light guide plate 10, and conductive members 61a and 61b.

The support member 200 includes a first surface 201, a second surface 202 opposite to the first surface 201, and holes 210a and 210b. The holes 210 a and 210 b penetrate from the first surface 201 to the second surface 202 . Further, the support member 200 includes wiring layer connection portions 51a and 51b arranged on the second surface 202 side. The light source 20A is arranged on the first surface 201 of the support member 200 .

FIG. 3A is a top view of light source 20A. In FIG. 3A, the light emitting element 21, the positive electrode 26a, and the negative electrode 26b, which are covered with the first light adjusting member 28, the first translucent member 23, and the like, are indicated by dashed lines.
FIG. 3B is a bottom view of light source 20A.
FIG. 3C is a cross-sectional view taken along line IIIC-IIIC of FIG. 3A.
FIG. 3D is a cross-sectional view along line IIID-IIID of FIG. 3A.
20 A of light sources contain the light emitting element 21 at least. Only the light emitting element 21 can be used as the light source 20A. Alternatively, as the light source 20A, the light emitting element 21 and other members can be combined and used. Other members include, for example, a positive electrode 26a and a negative electrode 26b.

Light emitting element 21 includes a semiconductor laminate. The semiconductor laminate includes, for example, a support substrate such as sapphire or gallium nitride, an n-type semiconductor layer and a p-type semiconductor layer arranged on the support substrate, a light-emitting layer sandwiched between them, an n-type semiconductor layer and a p-type semiconductor layer. an n-side electrode and a p-side electrode respectively electrically connected to the semiconductor layer. Note that the semiconductor laminate from which the supporting substrate has been removed may be used.

The structure of the light emitting layer may be a structure having a single active layer such as a double hetero structure or a single quantum well structure (SQW), or a group of active layers such as a multiple quantum well structure (MQW). A structure with The light-emitting layer can emit visible light or ultraviolet light. The light-emitting layer can emit visible light from blue to red. A semiconductor laminate including such a light-emitting layer may include, for example, In _x Al _y Ga _1-xy N (0≦x, 0≦y, x+y≦1).

The semiconductor laminate can include at least one light-emitting layer capable of emitting light as described above. For example, the semiconductor laminate may have a structure including one or more light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or may include an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer. Structures in order may be repeated multiple times. When the semiconductor laminate includes a plurality of light-emitting layers, it may include light-emitting layers with different emission peak wavelengths, or may include light-emitting layers with the same emission peak wavelength. It should be noted that the same emission peak wavelength may be, for example, a variation of about several nanometers. Such a combination of light-emitting layers can be appropriately selected. For example, when the semiconductor laminate includes two light-emitting layers, blue light and blue light, green light and green light, red light and red light, ultraviolet light The light-emitting layer can be selected with a combination of ultraviolet light, blue light and green light, blue light and red light, green light and red light, or the like. Moreover, the light-emitting layer may include a plurality of active layers with different emission peak wavelengths, or may include a plurality of active layers with the same emission peak wavelength.

The positive electrode 26a and the negative electrode 26b are arranged on the lower surface of the light emitting element 21 while being separated from each other. The positive electrode 26 a is electrically connected to the p-side electrode of the light emitting element 21 , and the negative electrode 26 b is electrically connected to the n-side electrode of the light emitting element 21 .

The light source 20A can further include a first translucent member 23 and a covering member 24 as other members. The first translucent member 23 is arranged on the upper surface and side surfaces of the light emitting element 21 and continuously covers the upper surface and side surfaces. In the light source 20A, as shown in FIG. 3D, the distance d1 from the side surface of the light emitting element 21 to the side surface of the first translucent member 23 is the distance from the top surface of the light emitting element 21 to the top surface of the first translucent member 23. Longer than d2 is preferred. This makes it easier for the light emitted from the side surface of the light emitting element 21 to propagate to the side surface side of the first translucent member 23 rather than the upper surface side, so that the light incident on the light guide plate 10 can be increased. Note that the distance d1 from the side surface of the light emitting element 21 to the side surface of the first translucent member 23 is 1.5 or more and 2.5 of the distance d2 from the top surface of the light emitting element 21 to the top surface of the first translucent member 23. The distance is preferably about twice or less, and more preferably, the distance d1 is about twice the distance d2. Moreover, the covering member 24 is arranged on the lower surface of the light emitting element 21 to cover the lower surface of the light emitting element 21 . The covering member 24 is also arranged on the lower surface of the first translucent member 23 and continuously covers the lower surface of the light emitting element 21 and the lower surface of the first translucent member 23 . The first translucent member 23 and the covering member 24 can protect the light emitting element 21 from the external environment such as moisture, for example.

Furthermore, the first translucent member 23 has functions such as wavelength conversion and light diffusion depending on the particles added to the first translucent member 23 . Specifically, the first translucent member 23 contains a translucent resin and may further contain a phosphor. As translucent resin, for example, silicone resin, phenol resin, epoxy resin, acrylic resin, or the like can be used. Further, as the phosphor, yttrium-aluminum-garnet-based phosphor (e.g., Y3 ₍ Al, Ga) _5O12 :Ce), lutetium-aluminum-garnet-based phosphor (e.g., _{Lu3 (} Al, Ga) _5O12 :Ce), terbium-aluminum-garnet-based phosphors (e.g., _{Tb3 (} Al, Ga) _5O12 :Ce), β-sialon-based phosphors (e.g., (Si, Al) _{3 (} O, N ) ₄ :Eu), an α-based SiAlON phosphor (e.g., Ca(Si, Al) ₁₂ (O, N) ₁₆ :Eu), a CASN-based phosphor (e.g., CaAlSiN ₃ :Eu) or a SCASN-based phosphor (e.g., , (Sr, Ca) AlSiN ₃ :Eu) and other nitride phosphors, KSF phosphors (e.g., K ₂ SiF ₆ :Mn), KSAF phosphors (e.g., K ₂ (Si, Al) F ₆ : Mn) or fluoride-based phosphors such as MGF-based phosphors (for example, 3.5MgO.0.5MgF ₂ .GeO ₂ :Mn), phosphors having a perovskite structure (for example, CsPb (F, Cl, Br, I) ₃ ), or quantum dot phosphors (eg, CdSe, InP, AgInS ₂ or AgInSe ₂ ), or the like can be used. As the phosphor added to the first translucent member 23, one kind of phosphor may be used, or plural kinds of phosphors may be used.

The KSAF-based phosphor may have a composition represented by the following formula (I).
_{M2 [ SipAlqMnrFs ] (} I)

In formula (I), M represents an alkali metal and may contain at least K. Mn may be a tetravalent Mn ion. p, q, r and s may satisfy 0.9≤p+q+r≤1.1, 0<q≤0.1, 0<r≤0.2, 5.9≤s≤6.1. Preferably, 0.95≦p+q+r≦1.05 or 0.97≦p+q+r≦1.03, 0<q≦0.03, 0.002≦q≦0.02 or 0.003≦q≦0.015 , 0.005≦r≦0.15, 0.01≦r≦0.12 or 0.015≦r≦0.1, 5.92≦s≦6.05 or 5.95≦s≦6.025 can be For example, _{K2 [ Si0.946Al0.005Mn0.049F5.995 ]} , _{K2 [ Si0.942Al0.008Mn0.050F5.992 ]} , _{K2 [ Si0 . 939} Al _0.014 Mn _0.047 F _5.986 ]. With such a KSAF-based phosphor, it is possible to obtain red light emission with high brightness and a narrow half-value width of the emission peak wavelength.

The covering member 24 has reflectivity with respect to the light emitted by the light emitting element 21 . When the first translucent member 23 contains a phosphor, the covering member 24 also reflects light emitted by the phosphor.

The covering member 24 is, for example, silicone resin, phenol resin, epoxy resin, or acrylic resin containing a light diffusing agent made of particles such as TiO ₂ , SiO ₂ , Al ₂ O ₃ , ZnO, or glass.

The covering member 24 covers the side surfaces of the electrodes 26a and 26b. The lower surfaces of the electrodes 26 a and 26 b are not covered with the covering member 24 and are exposed from the covering member 24 . For example, the material of the electrodes 26a and 26b is Cu. As shown in FIG. 3B, the electrodes 26a and 26b are, for example, triangular in plan view. Moreover, in plan view, the shape of the electrodes 26a and 26b may be circular, elliptical, or polygonal such as quadrangular.

The light source 20A can further include a first light conditioning member 28 depending on the desired light distribution. The first light adjusting member 28 is arranged on the upper surface of the first translucent member 23 . Alternatively, the first light adjusting member 28 may not be arranged on the first translucent member 23 , in other words, the upper surface of the light source 20</b>A may be formed by the upper surface of the first translucent member 23 .

The first light adjusting member 28 controls the amount and direction of light emitted from the upper surface of the first translucent member 23 . The first light adjusting member 28 has reflectivity and translucency with respect to the light emitted by the light emitting element 21 and the phosphor. Part of the light emitted from the upper surface of the first translucent member 23 is reflected by the first light adjustment member 28 and the other part is transmitted through the first light adjustment member 28 . For example, the transmittance of the first light adjustment member 28 is preferably 1% or more and 50% or less, and more preferably 3% or more and 30% or less. As a result, the luminance directly above the light source 20A can be reduced, and the in-plane variation in the luminance of the light emitting device 300A can be reduced.

The first light adjusting member 28 can be made of a translucent resin and a light diffusing agent or the like contained in the translucent resin. Translucent resins are, for example, silicone resins, phenolic resins, epoxy resins, or acrylic resins. Light diffusing agents include particles such as TiO ₂ , SiO ₂ , Al ₂ O ₃ , ZnO, or glass. The first light adjustment member 28 may be, for example, a metal member such as Al or Ag, or a dielectric multilayer film.

As shown in FIG. 2 , the light guide plate 10 includes a first principal surface 11 , a second principal surface 12 located on the opposite side of the first principal surface 11 , and a light source placement portion 13 . For example, the light source arrangement portion 13 is a through hole penetrating from the first main surface 11 to the second main surface 12 . The light guide plate 10 is arranged on the support member 200 with the second main surface 12 facing the first surface 201 of the support member 200 .

The light guide plate 10 has translucency with respect to the light emitted by the light source 20A. The light emitted by the light source 20A includes at least the light emitted by the light emitting element 21 . When the light source 20A contains a phosphor, the light emitted by the light source 20A also includes the light emitted by the phosphor. For example, the transmittance of the light guide plate 10 with respect to the light from the light source 20A is preferably 80% or more, more preferably 90% or more.

As the material of the light guide plate 10, for example, acrylic, polycarbonate, cyclic polyolefin, thermoplastic resin such as polyethylene terephthalate or polyester, thermosetting resin such as epoxy or silicone, glass, or the like can be used.

The thickness of the light guide plate 10 is preferably 200 μm or more and 800 μm or less, for example. The light guide plate 10 may be composed of a single layer or a laminate of a plurality of layers in its thickness direction. When the light guide plate 10 is composed of a laminate, a translucent adhesive member may be arranged between each layer. Each layer of the laminate may use a different type of base material. As the material of the adhesive member, for example, thermoplastic resin such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate or polyester, or thermosetting resin such as epoxy or silicone can be used.

As shown in FIG. 1 , the light guide plate 10 is partitioned into a plurality of light emitting regions 5 by partition grooves 14 . The dividing grooves 14 are grid-like in plan view, and divide the light guide plate 10 such that at least one light source 20A is included in one light emitting region 5 . FIG. 1 shows, for example, a light-emitting device 300A including four light-emitting regions 5 partitioned into two rows and two columns. Each light emitting region 5 partitioned by the partition groove 14 can be used as a drive unit for local dimming, for example. Note that the number of light emitting regions 5 forming the light emitting device 300A is not limited to the number shown in FIG.

The shape of the light source arrangement portion 13 formed as, for example, a through-hole in the light guide plate 10 can be, for example, circular in a top view shown in FIG. Further, the shape of the light source arrangement portion 13 can be, for example, an ellipse, or a polygon such as a triangle, a quadrangle, a hexagon, or an octagon when viewed from above.

As shown in FIG. 2 , the light source 20A is arranged on the support member 200 within the light source arrangement portion 13 of the light guide plate 10 .

The light emitting device 300A can further include a second translucent member 71 , a wavelength conversion member 72 , a third translucent member 73 and a second light adjustment member 74 . The second translucent member 71 , the wavelength converting member 72 , and the third translucent member 73 are arranged inside the light source arrangement portion 13 of the light guide plate 10 .

The second translucent member 71 and the third translucent member 73 have translucency with respect to the light emitted from the light source 20A. A resin with a small rate difference can be used.

The second translucent member 71 is arranged between the side surface of the light source 20</b>A and the side surface of the light source arrangement portion 13 of the light guide plate 10 . The second light-transmitting member 71 and the side surface of the light source 20A and the second light-transmitting member 71 and the side surface of the light source arrangement portion 13 and the second light-transmitting member 71 are arranged so as not to form a space such as an air layer. It is preferable to arrange the elastic member 71 . This makes it easier for the light from the light source 20A to be guided to the light guide plate 10 .

The wavelength conversion member 72 covers the upper surface of the light source 20A. The wavelength conversion member 72 also covers the upper surface of the second translucent member 71 . The wavelength conversion member 72 is a translucent resin member containing a phosphor for adjusting the color of the light source 20A.

The third translucent member 73 covers the upper surface of the wavelength conversion member 72 . The upper surface of the third translucent member 73 can be a flat surface. Alternatively, the upper surface of the third translucent member 73 can be a concave or convex curved surface.

The second light adjusting member 74 is arranged on the third translucent member 73 . The second light adjusting member 74 has reflectivity and translucency with respect to the light emitted by the light source 20A. The second light adjusting member 74 can be made of translucent resin and a light diffusing agent or the like contained in the translucent resin. Translucent resins are, for example, silicone resins, phenolic resins, epoxy resins, or acrylic resins. Light diffusing agents include particles such as TiO ₂ , SiO ₂ , Al ₂ O ₃ , ZnO, or glass.

The second light adjusting member 74 can be arranged to cover all or part of the upper surface of the third translucent member 73 . Further, the second light adjusting member 74 can be extended over the upper surface of the third translucent member 73 and the first major surface 11 of the light guide plate 10 therearound.

As shown in FIG. 1, the second light adjustment member 74 is arranged at a position overlapping the light source 20A in top view. In the example shown in FIG. 1, the shape of the second light adjusting member 74 is a square that is larger than the light source 20A that is square when viewed from above. The shape of the second light adjusting member 74 can be a polygonal shape such as a circle, triangle, hexagon, or octagon when viewed from above.

The second light adjustment member 74 reflects part of the light emitted directly above the light source 20A and transmits the other part. Accordingly, in the first main surface 11 of the light guide plate 10, which is the light emitting surface (light emitting surface) of the light emitting device 300A, the brightness of the region directly above the light source 20A is prevented from being extremely higher than the brightness of other regions. can. In other words, it is possible to reduce uneven brightness of light emitted from one light emitting region 5 partitioned by the partition groove 14 .

The thickness of the second light adjusting member 74 is preferably 0.005 mm or more and 0.2 mm or less, more preferably 0.01 mm or more and 0.075 mm or less. In addition, the reflectance of the second light adjustment member 74 is preferably set lower than the reflectance of the first light adjustment member 28 of the light source 20A. The following is preferable, and more preferably 30% or more and 85% or less.

A third translucent member 73 is arranged between the second light adjusting member 74 and the first light adjusting member 28 . The third translucent member 73 has a higher transmittance with respect to the light emitted from the light source 20A than the first light adjusting member 28 and the second light adjusting member 74 do. The transmittance of the third translucent member 73 with respect to the light emitted by the light source 20A is 2 to 100 times the transmittance of the first light adjustment member 28 and the transmittance of the second light adjustment member 74 within the range of 100% or less. can be: As a result, the area immediately above the light source 20A does not become too bright or too dark, and as a result, uneven brightness in the light emitting surface of each light emitting area 5 can be reduced.

Further, the second translucent member 71 may be arranged as a single layer in the through hole, which is the light source arrangement portion 13 , without arranging the wavelength converting member 72 and the third translucent member 73 . In this case, the second light adjusting member 74 is arranged on the second translucent member 71 . Alternatively, the second translucent member 71 itself may contain a phosphor to function as a wavelength conversion member.

As shown in FIG. 2 , the support member 200 includes a wiring board 50 , a first adhesive member 41 , a light reflecting member 42 and a second adhesive member 43 . A first adhesive member 41 , a light reflecting member 42 , and a second adhesive member 43 are arranged in this order on the wiring board 50 .

The first adhesive member 41 is arranged between the wiring board 50 and the light reflecting member 42 and bonds the wiring board 50 and the light reflecting member 42 together. The second adhesive member 43 is arranged between the light reflecting member 42 and the second main surface 12 of the light guide plate 10 and bonds the light reflecting member 42 and the light guide plate 10 together. The second adhesive member 43 is also arranged below the light source arrangement portion 13 , and the light source 20</b>A is arranged on the second adhesive member 43 within the light source arrangement portion 13 . The upper surface of the second adhesive member 43 constitutes the first surface 201 of the support member 200 . The bottom surface of the light source 20A is in contact with the top surface of the second adhesive member 43 .

The second adhesive member 43 has translucency with respect to the light emitted by the light source 20A. The first adhesive member 41 and the second adhesive member 43 are made of, for example, epoxy resin, acrylic resin, or cyclic polyolefin resin.

The light reflecting member 42 is arranged between the wiring board 50 and the second main surface 12 of the light guide plate 10 and between the wiring board 50 and the light source 20A. The light reflecting member 42 between the wiring board 50 and the second main surface 12 and the light reflecting member 42 between the wiring board 50 and the light source 20A may be integrated or separated.

The light reflecting member 42 has reflectivity with respect to the light emitted by the light source 20A. For the light reflecting member 42, for example, a resin member containing a large number of air bubbles or a resin member containing a light diffusing agent can be used. The material of the resin member is, for example, polyethylene terephthalate (PET) resin, cyclic polyolefin resin, acrylic resin, silicone resin, urethane resin, epoxy resin, or the like. Examples of light _diffusing agents include _SiO2 , _CaF2 , _MgF2 , _TiO2 , _Nb2O5 , _BaTiO3 , _Ta2O5 , _Zr2O3 , _{ZnO , Y2O3 , Al2O3 ,} MgO or _BaSO4 or the like can be used.

In the light-emitting device 300A, the light from the light source 20A guided through the light guide plate 10 toward the second main surface 12 is directed to the first main surface 11, which is the light-emitting surface of the light-emitting device 300A, by the light reflecting member 42. reflected to Thereby, the light emitting device 300A can improve the brightness of the light extracted from the first main surface 11 .

In the region between the light reflecting member 42 and the first main surface 11, the light from the light source 20A is guided toward the dividing groove 14 while total reflection is repeated between the light reflecting member 42 and the first main surface 11. The light is guided through the light plate 10 . A portion of the light directed toward the first main surface 11 is extracted from the first main surface 11 to the outside of the light guide plate 10 .

The wiring board 50 includes an insulating base material and wiring layers. At least one wiring layer is included in the thickness direction of the wiring board 50 . The upper surface of the wiring board 50 is adhered to the first adhesive member 41 . A first connection portion 51a and a second connection portion 51b, which are part of the wiring layer, are arranged apart from each other on the lower surface of the wiring board 50 . The lower surface of the wiring board 50 is covered with an insulating film 52 . The first connection portion 51 a and the second connection portion 51 b are exposed from the insulating film 52 without being covered with the insulating film 52 .

A pair of holes 210a and 210b are arranged under the light source 20A corresponding to the positive electrode 26a and the negative electrode 26b of the light source 20A, respectively.

A positive electrode 26a is located above one of the holes 210a. A first conductive member 61a is arranged in the hole 210a. The positive electrode 26a is entirely located inside the hole 210a in plan view. Also, at least part of the positive electrode 26a may be positioned within the hole 210a. The first conductive member 61a further extends to the first connection portion 51a on the second surface 202 side of the support member 200 . The first conductive member 61a electrically connects the positive electrode 26a and the first connection portion 51a.

Negative electrode 26b is located above the other hole 210b. A second conductive member 61b is arranged in the hole 210b. The entire negative electrode 26b is located inside the hole 210b in plan view. Also, at least part of the negative electrode 26b may be positioned within the hole 210b. The second conductive member 61b further extends to the second connection portion 51b on the second surface 202 side of the support member 200 . The second conductive member 61b electrically connects the negative electrode 26b and the second connection portion 51b.

The first conductive member 61a and the second conductive member 61b are, for example, hardened conductive paste in which conductive filler is dispersed in resin. The first conductive member 61a and the second conductive member 61b can contain metal particles such as copper or silver as a filler. The filler is, for example, spherical, acicular or flake-like particles.

An insulating film 53 is arranged on the lower surface of the insulating film 52 so as to cover the first conductive member 61a and the second conductive member 61b. The insulating film 53 is formed to cover between the first conductive member 61a and the second conductive member 61b, and enhances the insulation between the first conductive member 61a and the second conductive member 61b.

Light emitted from the light source 20A from an external circuit via the first connection portion 51a, the second connection portion 51b, the first conductive member 61a, the second conductive member 61b, the positive electrode 26a, and the negative electrode 26b of the wiring board 50. Power is supplied to the element 21 .

FIG. 4A is a bottom view showing an example of the area below the light source 20A (the insulating film 53 is not shown) in the light emitting device 300A shown in FIG. In the bottom view of FIG. 4A, the positive electrode 26a, the negative electrode 26b, the holes 210a and 210b, the first connection portion 51a, and the second connection portion covered with the first conductive member 61a and the second conductive member 61b 51b is represented by a dashed line. The same applies to FIGS. 4B to 4D, which will be described later.

The first connection portion 51a and the second connection portion 51b are arranged in a region other than between the positive electrode 26a and the negative electrode 26b in plan view. For example, the first connection portion 51a, the second connection portion 51b, the positive electrode 26a, and the negative electrode 26b are arranged in the first direction X, and the positive electrode 26a and the negative electrode 26b are arranged in the first connection portion 51a and the second connection portion 51b. located between

Each of the pair of holes 210 a and 210 b includes a first hole 211 and a second hole 212 . The first hole 211 opens on the first surface 201 side of the support member 200 , and the second hole 212 communicates with the first hole 211 and opens on the second surface 202 side of the support member 200 .

The first hole 211 of each of the pair of holes 210a and 210b is connected to either the positive electrode 26a connected to the first conductive member 61a or the negative electrode 26b connected to the second conductive member 61b in plan view. Overlaps with one or the other. The first hole portion 211 of one hole portion 210a overlaps the positive electrode 26a connected to the first conductive member 61a in plan view. The first hole portion 211 of the other hole portion 210b overlaps the negative electrode 26b connected to the second conductive member 61b in plan view.

The positive electrode 26 a is connected to the first conductive member 61 a arranged in the one first hole 211 near the opening of the first hole 211 on the first surface 201 side. The negative electrode 26b is connected to the second conductive member 61b arranged in the other first hole 211 near the opening of the other first hole 211 on the first surface 201 side.

The second hole 212 includes a first portion 212a and a second portion 212b communicating with the first portion 212a. In plan view, the first portion 212 a overlaps the first hole portion 211 and communicates with the first hole portion 211 .

A second portion 212b of one hole portion 210a extends along the first direction X from the first portion 212a toward the first connecting portion 51a. A second portion 212b of the other hole portion 210b extends along the first direction X from the first portion 212a toward the second connecting portion 51b. The pair of second portions 212b extend in opposite directions from the pair of first portions 212a. In the first direction X, the second portion 212b of one hole 210a is separated from the first connection portion 51a, and the second portion 212b of the other hole 210b is separated from the second connection portion 51b.

The shapes of the first portion 212a and the second portion 212b of the first hole portion 211 and the second hole portion 212 are, for example, circular in plan view. The shape of the first hole 211 and the first portion 212a of the second hole 212 are circular with substantially the same diameter. The shape of the second part 212b of the second hole 212 is a circle with a larger diameter than the first part 212a of the first hole 211 and the second hole 212 .

In addition, the shape of the first portion 212a and the second portion 212b of the first hole portion 211 and the second hole portion 212 is an ellipse or a polygon such as a triangle, quadrangle, hexagon, or octagon in plan view. be able to.

Next, a method for manufacturing the light emitting device 300A will be described with reference to FIGS. 5A to 13. FIG.

The manufacturing method of the light emitting device 300A has a step of preparing the light guide plate 10 shown in FIG. 5A. The light guide plate 10 includes a first major surface 11 and a second major surface 12 opposite the first major surface 11 .

As shown in FIG. 5B, a light source arrangement portion 13 is formed on the light guide plate 10 . The light source arrangement portion 13 is formed as a through hole penetrating from the first main surface 11 to the second main surface 12 by, for example, drilling, punching, or laser processing. The light guide plate 10 including the light source arrangement portion 13 may be purchased and prepared.

The method for manufacturing the light emitting device 300A further includes a step of preparing the support member 200. FIG. The step of preparing the support member 200 includes the step of preparing the wiring board 50 shown in FIG. 6A. A first connection portion 51 a and a second connection portion 51 b of the wiring layer and an insulating film 52 are arranged on the lower surface of the wiring substrate 50 . The first connection portion 51 a and the second connection portion 51 b are arranged in openings formed in the insulating film 52 and exposed from the insulating film 52 .

As shown in FIG. 6B, the first adhesive member 41, the light reflecting member 42, and the second adhesive member 43 are laminated on the upper surface of the wiring board 50 to obtain the support member 200'.

A thermosetting resin can be used as the first adhesive member 41 . After placing an uncured thermosetting resin between the wiring board 50 and the light reflecting member 42, the uncured thermosetting resin is cured to fix the wiring board 50 and the light reflecting member 42 with the thermosetting resin. can be done. The thermosetting resin used for the first adhesive member 41 is not particularly limited. For example, known thermosetting resins such as silicone resins, epoxy resins, phenol resins, BT resins, polyimide resins, and unsaturated polyester resins can be used. The _first adhesive member 41 may contain a known light diffusing agent such as _TiO2 , _SiO2 , _{Al2O3 ,} ZrO2, or glass. Since the first adhesive member 41 contains the light diffusing agent, it is possible to improve the brightness of the light extracted from the first main surface 11 of the light emitting device. OCA (Optical Clear Adhesive) can be used as the second adhesive member 43 . OCA includes an acrylic pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, or the like. The order of the steps for curing the uncured thermosetting resin (first adhesive member) placed between the wiring board 50 and the light reflecting member 42 is not particularly limited. When thermosetting resin is used as the first adhesive member 41 and OCA is used as the second adhesive member 43, the uncured thermosetting resin (first adhesive member) placed between the wiring board 50 and the light reflecting member 42 is used. It is preferable to bond the light reflecting member 42 and the OCA (second adhesive member) after curing. By doing so, it is possible to suppress deterioration of the OCA (second adhesive member) due to heat when the thermosetting resin (first adhesive member) is cured. Note that OCA may be used as the first adhesive member 41 and a thermosetting resin may be used as the second adhesive member 43 . Both the first adhesive member 41 and the second adhesive member 43 may be made of thermosetting resin, or may be made of OCA.

Holes 210a and 210b are formed in the support member 200' as shown in FIG. 6C. A pair of holes 210a and 210b penetrating through the second adhesive member 43, the light reflecting member 42, the first adhesive member 41, the wiring substrate 50, and the insulating film 52 are formed to obtain the supporting member 200. FIG.

As described above, each of the pair of holes 210a, 210b includes the first hole 211 and the second hole 212. As shown in FIG. The second hole portion 212 includes a first portion 212a that overlaps the first hole portion 211 and a second portion 212b that extends from the first portion 212a toward the connecting portions 51a and 51b in plan view. In FIG. 6C, the boundary between the first hole 211 and the first portion 212a of the second hole 212 and the boundary between the first portion 212a and the second portion 212b of the second hole 212 are indicated by broken lines for convenience. show. For example, the first hole 211 and the second hole 212 can be formed by laser processing.

When the holes 210a and 210b are formed by laser processing, the material of the support member 200 may be scorched by the heat of the laser beam to form smears (organic residues). If smears are formed around the edges of the openings of the holes 210a and 210b, when the conductive paste is supplied into the holes 210a and 210b in a later step, the smears will also be applied to the holes 210a and 210b together with the conductive paste. It can get inside and cause cracks and cracks when the conductive paste hardens.

Therefore, as a countermeasure against smear, for example, a protective film may be attached to the incident surface of the laser beam in the supporting member 200' shown in FIG. 6B. The material of the protective film is a material (eg, polyethylene terephthalate, etc.) that has lower laser light absorption and is less likely to burn than the resin material (eg, polyimide, etc.) of the support member 200′. For example, with the protective film attached to the second surface 202 of the support member 200′ shown in FIG. 6B, as shown in FIG. Alternatively, after forming the first portion 212a of the first hole 211 and the second hole 212, the second portion 212b of the second hole 212 is formed. Also, a protective film may be attached to the first surface 201 on the opposite side of the incident surface (second surface 202) of the laser beam. After the holes 210a and 210b are formed, the protective film is peeled off from the support member 200, so that the smears formed around the edges of the holes 210a and 210b on the side of the laser light incident surface are removed from the support member 200 together with the protective film. removed.

As another smear countermeasure without using a protective film, after the first laser light irradiation for forming the holes 210a and 210b, the second laser light irradiation is performed to remove the smear. For example, a CO ₂ laser is used for the first laser light irradiation. For the second laser light irradiation, a CO ₂ laser having a lower laser light output and/or a defocused laser light than the first laser light irradiation is used. In the second laser beam irradiation, the laser beam is irradiated around the edges of the holes 210 a and 210 b on the side of the laser beam incidence surface to sublimate the smear and remove it from the support member 200 . The second laser beam is applied so that the amount of heat generated in the portion irradiated with the second laser beam is sufficient to sublimate the smear formed by the irradiation of the first laser beam while suppressing the occurrence of new smear. Set the conditions such as the power of the _CO2 laser in the irradiation. Since the same CO ₂ laser is used for the first laser light irradiation and the second laser light irradiation, the same laser device can be used as it is for the first laser light irradiation and the second laser light irradiation.

Alternatively, a CO ₂ laser may be used for the first laser light irradiation, and a UV laser may be used for the second laser light irradiation. The resin material of the support member 200 has a lower absorptivity for UV laser than for CO ₂ laser, and is less likely to generate heat that causes smear. Therefore, by using a UV laser for the second laser light irradiation, the leeway of the laser light output condition can be made wider than when a CO ₂ laser is used for the second laser light irradiation.

After the first hole 211 and the first part 212a of the second hole 212 are collectively formed by punching or drilling, the second part 212b of the second hole 212 is formed by laser processing. can do.

The first hole 211 penetrates through the second bonding member 43 , the light reflecting member 42 and the first bonding member 41 . The second hole 212 penetrates the wiring board 50 and the insulating film 52 and does not reach the light reflecting member 42 .

In the example shown in FIG. 6C, the lower surface of the first adhesive member 41 is exposed to the second portion 212b of the second hole 212. In the example shown in FIG. The depth from the second surface 202 of the second portion 212b is not limited to this, as long as the second bonding member 43 is not exposed. For example, the depth from the second surface 202 of the second portion 212b may be the depth at which the light reflecting member 42 is exposed. Also, the depth from the second surface 202 of the second portion 212b may be the depth at which the wiring board 50 is exposed.

In the example shown in FIG. 6C, the surface exposed on the second portion 212b of the support member 200 is flat. Further, the surface of the support member 200 exposed to the second portion 212b is not limited to a flat surface, and may be a curved surface (for example, a concave surface recessed from the second surface 202 side), or a combination of a flat surface and a curved surface. It can be a face. By including the curved surface in the surface exposed to the second portion 212b in this manner, breakage of the conductive members 61a and 61b can be suppressed. The curved surface exposed at the second portion 212 b of the support member 200 is a curved surface that straddles the wiring substrate 50 and the first adhesive member 41 , or a curved surface that spans the wiring substrate 50 , the first adhesive member 41 and the light reflecting member 42 . It can be a straddling curved surface.

The second portion 212b of the second hole 212 is designed to reflect light in order to prevent a decrease in luminance due to a reduction in the area of the light reflecting member 42 in the area below the light source 20A and light leakage from the light source 20A to the wiring board 50 side. It is preferable that the member 42 is completely removed in the thickness direction and does not reach the depth where the second adhesive member 43 is exposed. That is, at least part of the light reflecting member 42 should remain between the second portion 212b and the light source 20A. However, if the light reflecting member 42 becomes thin, light tends to escape to the wiring board 50 side, so it is more preferable that the second portion 212b has a depth that does not reach the light reflecting member 42 .

As shown in FIG. 7 , the light guide plate 10 is arranged on the support member 200 . The second main surface 12 of the light guide plate 10 faces the upper surface of the second adhesive member 43 forming the first surface 201 of the support member 200 and is adhered to the upper surface of the second adhesive member 43 .

The holes 210 a and 210 b formed in the support member 200 are arranged so as to overlap the light source arrangement portion 13 formed in the light guide plate 10 and communicate with the light source arrangement portion 13 . A pair of hole portions 210 a and 210 b overlaps one light source placement portion 13 .

After placing the light guide plate 10 on the support member 200, the light source 20A is placed in the light source placement portion 13 of the light guide plate 10 as shown in FIG. The lower surface of the light source 20A is adhered to the upper surface of the second adhesive member 43 exposed inside the light source arrangement portion 13 . The positive electrode 26a of the light source 20A is positioned in one hole 210a and the negative electrode 26b is positioned in the other hole 210b. The openings of the holes 210a and 210b on the side of the first surface 201 of the support member 200 (the openings of the first holes 211) are closed by the light source 20A.

After arranging the light source 20A on the support member 200, as shown in FIG. The second translucent member 71 is formed between the side surface of the light source 20A and the side surface of the light source arrangement portion. The upper surface of the light source 20A is exposed from the second translucent member 71. As shown in FIG. For example, the second translucent member 71 is formed by supplying a liquid translucent resin into the light source arrangement portion 13 and then curing it by heating. For example, the heating temperature at this time is 100° C. or more and 120° C. or less, and the heating time is 0.5 hours or more and 1 hour or less. The light source 20</b>A is fixed to the light guide plate 10 by the second translucent member 71 .

After forming the second translucent member 71, a conductive paste is supplied into the holes 210a and 210b. For example, the conductive paste is supplied into the holes 210a and 210b by printing, dispensing, or the like. In the state shown in FIG. 9, the openings of the holes 210a and 210b are directed downward. A conductive paste is supplied in 210b.

Alternatively, the second translucent member 71 may be formed in the light source arrangement portion 13 after the conductive paste is first supplied into the holes 210a and 210b and cured.

By thermally curing, for example, the conductive paste supplied into the holes 210a and 210b, as shown in FIG. A second conductive member 61b is formed that is connected to the electrode 26b. For example, the heating temperature at this time is 100° C. or more and 120° C. or less, and the heating time is 0.5 hours or more and 1 hour or less. Alternatively, the conductive paste may be supplied into the holes 210a and 210b and cured while being pressurized at an atmospheric pressure of 5 or more and 10 or less.

When hardening the conductive paste, it is preferable to harden while applying pressure. By doing so, it is possible to suppress the formation of air bubbles in the first conductive member 61a and/or the second conductive member 61b. For example, when the conductive paste is supplied into the holes 210a and 210b, air bubbles that have entered the conductive paste can be released to the outside of the conductive paste by curing the conductive paste while pressurizing it. By suppressing the formation of air bubbles in the first conductive member 61a and/or the second conductive member 61b, the reliability of the first conductive member 61a and/or the second conductive member 61b in electrical connection is improved. . In addition, air bubbles located between the first adhesive member, the light reflecting member and/or the second adhesive member and the conductive paste are forced out through the conductive paste by curing the conductive paste while pressurizing it. can be done. Thereby, the adhesion between the first conductive member 61a and/or the second conductive member 61b and the first adhesive member, the light reflecting member and/or the second adhesive member can be improved. If the first adhesive member and/or the second adhesive member contain air bubbles before the conductive paste is cured, the air bubbles are removed through the conductive paste by curing the conductive paste while applying pressure. can be taken outside. This makes it easier to improve the adhesive strength of the first adhesive member and/or the second adhesive member. When the conductive paste contains metal particles and resin, the volume of the resin can be reduced by curing the conductive paste while applying pressure. As a result, the volume ratio of the metal particles to the first conductive member 61a can be increased, thereby improving the reliability of the first conductive member 61a in electrical connection. Similarly, by curing the conductive paste while applying pressure, the volume ratio of the metal particles to the second conductive member 61b can be increased. This improves the reliability of the second conductive member 61b in electrical connection. In general, the volume of metal particles is less likely to change under pressure than resin. By reducing the volume of the resin contained in the conductive paste, depressions are formed on the surfaces of the first conductive member 61a and/or the second conductive member 61b located on the opposite side of the light guide plate 10 as shown in FIG. It is formed. The temperature for curing the conductive paste is not particularly limited. The temperature for curing the conductive paste is preferably 40° C. or higher and 130° C. or lower, for example. The pressure when curing the conductive paste is not particularly limited. The pressure when curing the conductive paste is preferably 0.15 MPa or more and 1 MPa or less, for example. The conductive paste preferably contains an organic solvent. When the conductive paste is cured, the volatilized organic solvent makes it easier to release air bubbles in the conductive paste to the outside of the conductive paste. The amount of solvent contained in the conductive paste is not particularly limited. The amount of solvent contained in the conductive paste is preferably 0.1 wt % or more and 10 wt % or less, for example. The material of the organic solvent contained in the conductive paste is not particularly limited. As the material of the organic solvent contained in the conductive paste, known materials such as methanol, ethanol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, cyclopentanone, cyclohexanone, and γ-butyrolactone are used. be able to.

The conductive paste is also supplied to the second surface 202 side of the support member 200, and is connected to the first conductive member 61a connected to the first connection portion 51a and the second connection portion 51b on the second surface 202 side. A second conductive member 61b is formed.

According to the present embodiment, the second portion 212b of the second hole 212 that opens on the second surface 202 side of the support member 200 extends from the first hole 211 toward the connection portions 51a and 51b. , the volume of the holes 210a and 210b on the second surface 202 side can be increased. Therefore, the volume of the conductive paste supplied to the second portion 212b is increased so that even if curing shrinkage occurs, the portion covering the corner portion C between the side surface of the second portion 212b and the second surface 202 is enough. A small amount of conductive paste can be left behind. This prevents breakage of the conductive members 61a and 61b after curing, and increases the reliability of the electrical connection between the light source 20A and the wiring layers of the support member 200. FIG.

If the volume of the first conductive member 61a connected to the positive electrode 26a of the light source 20A is smaller than the design value (target value), the conductive paste may be supplied so as to come into contact with the first conductive member 61a. . By doing so, the volume of the conductive member connected to the positive electrode 26a of the light source 20A can be increased. In this specification, a first conductive portion having conductivity formed by the conductive paste supplied into the hole 210a and a conductive paste formed so as to be electrically connected to the first conductive portion The second conductive portion having the improved conductivity is referred to as a first conductive member 61a. Similarly, a third conductive portion having conductivity formed by the conductive paste supplied into the hole 210b and a conductive portion formed by the conductive paste so as to be electrically connected to the third conductive portion is called a second conductive member 61b.

When the volume of the formed first conductive member 61a is smaller than the design value (target value), the conductive paste is supplied so as to electrically connect with the first conductive member 61a, and the first conductive member 61a is formed. The volume of 61a can be increased. Thereby, the volume of the first conductive member 61a can be brought closer to the design value (target value). The conductive paste may be supplied only once or may be supplied twice or more so as to be electrically connected to the first conductive member 61a. Similarly, when the volume of the formed second conductive member 61b is smaller than the design value (target value), the conductive paste is supplied so as to electrically connect with the second conductive member 61b, and the second conductive member 61b is electrically connected to the second conductive member 61b. The volume of the conductive member 61b can be increased. The conductive paste may be supplied only once or may be supplied twice or more so as to be electrically connected to the second conductive member 61b.

If the volume of the formed first conductive member 61a is larger than the design value (target value), part of the first conductive member 61a may be removed. Thereby, the volume of the first conductive member 61a can be brought closer to the design value (target value). Similarly, when the volume of the formed second conductive member 61b is larger than the design value (target value), part of the second conductive member 61b may be removed. As a method for partially removing the first conductive member 61a and/or the second conductive member 61b, known methods such as laser light irradiation and cutting can be used.

Since the diameter (or width) of the first hole 211 passing through the light reflecting member 42 is smaller than the diameter (or width) of the second hole 212, the area of the light reflecting member 42 in the area below the light source 20A is reduced. It is possible to prevent a decrease in luminance due to

As shown in FIG. 4A, the first conductive member 61a overlaps and covers the positive electrode 26a, the hole 210a, and the first connecting portion 51a in plan view. In plan view, the second conductive member 61b is separated from the first conductive member 61a and overlaps and covers the negative electrode 26b, the hole 210b, and the second connection portion 51b.

In order to increase the volume of the conductive paste supplied to the second portion 212b, the width (maximum width) in the second direction Y orthogonal to the first direction X of the second portion 212b is set to the width of the first portion 212a. It is preferably larger than the width (maximum width) in the two Y directions. For example, the shapes of the first portion 212a and the second portion 212b are both circular in plan view, and the diameter of the second portion 212b is larger than the diameter of the first portion 212a.

After forming the first conductive member 61a and the second conductive member 61b, as shown in FIG. Form. For example, the wavelength conversion member 72 is formed by supplying a liquid resin containing a phosphor into the light source arrangement portion 13 and then thermally curing the resin. For example, the heating temperature at this time is 80° C. or higher and 120° C. or lower, and the heating time is 5 minutes or longer and 30 minutes or shorter.

After forming the wavelength conversion member 72, as shown in FIG. For example, the third translucent member 73 is formed by supplying a liquid resin onto the wavelength conversion member 72 and then thermally curing it. For example, the heating temperature at this time is 80° C. or higher and 120° C. or lower, and the heating time is 5 minutes or longer and 30 minutes or shorter.

In addition, only the second translucent member 71 may be arranged in the light source arrangement portion 13 . In this case, the second translucent member 71 can function as a wavelength conversion member by containing a phosphor in the second translucent member 71 .

After forming the third translucent member 73, a second light adjusting member 74 is formed on the third translucent member 73, as shown in FIG. For example, the second light adjusting member 74 is formed by supplying a liquid resin containing a light diffusing agent onto the third translucent member 73 and then thermally curing the resin. For example, the heating temperature at this time is 80° C. or higher and 120° C. or lower, and the heating time is 5 minutes or longer and 30 minutes or shorter.

After forming the second light adjusting member 74, as shown in FIG. 2, the insulating film 53 is formed on the second surface 202 of the supporting member 200 so as to cover the first conductive member 61a and the second conductive member 61b. do. The insulating film 53 is formed by, for example, printing, potting, spraying, ink jetting, bonding of resin sheets, or the like.

4B-4D are bottom views showing examples of the lower area of the light source 20A similar to FIG. 4A.

In the example shown in FIG. 4B, the maximum width in the second direction Y of the second portion 212b is smaller than the maximum width (diameter) in the second direction Y of the first portion 212a. As a result, the volume of the conductive paste can be reduced to such an extent that the cured conductive members 61a and 61b are not broken, and the processing time of the second portion 212b can be shortened. and the wiring layer of the supporting member can be made more reliable.

In the example shown in FIG. 4C, the maximum width or diameter in the second direction Y of the second portion 212b is the same as the maximum width or diameter in the second direction Y of the first portion 212a. The first portion 212a connects to the second portion 212b in a straight line or forms an obtuse angle, and the portion connecting the first portion 212a to the second portion 212b does not have a sharp corner that can be a starting point of fracture. . As a result, the conductive members 61a and 61b are less likely to break, so that the reliability of the electrical connection between the light source and the wiring layer of the support member can be increased.

In the example shown in FIG. 4D, the maximum width in the second direction Y of the second portion 212b is greater than the maximum width (diameter) in the second direction Y of the first portion 212a. Furthermore, the second portion 212b of the second hole portion 212 of one hole portion 210a extends in the second direction Y to a position overlapping the first connection portion 51a. The second portion 212b of the second hole portion 212 of the other hole portion 210b extends in the second direction Y to a position overlapping the second connection portion 51b. In the second direction Y, the second portion 212b is separated from the connecting portions 51a and 51b. According to the second portion 212b shown in FIG. 4D, the volume of the conductive paste supplied to the second portion 212b can be increased. In addition, the outer circumference of the second portion 212b can be lengthened, and the possibility that the conductive members 61a and 61b are broken at the outer circumference of the second portion 212b and the light source is turned off can be reduced. Therefore, the reliability of the electrical connection between the light source and the wiring layer of the supporting member can be further improved.

[Second embodiment]
14A to 14D are bottom views showing an example of the area below the light source 20A in the light emitting device 300A. In the bottom view of FIGS. 14A to 14D, the light source 20A, the light emitting element 21, the positive electrode 26a, the negative electrode 26b, and the hole are covered with the insulating film 52, the first conductive member 61a, and the second conductive member 61b. 210a, 210b, the first connection portion 51a, and the second connection portion 51b are indicated by dashed lines.

14A to 14D, a portion of the second portion 212b of the second hole portion 212 of one hole portion 210a extends in the first direction from the first portion 212a overlapping the first hole portion 211 to the first connection portion 51a. extending to the side. A part of the second portion 212b of the second hole portion 212 of the other hole portion 210b extends from the first portion 212a overlapping the first hole portion 211 toward the second connection portion 51b in the first direction. ing.

14A to 14D, the first connection portion 51a and the second connection portion 51b extend in a direction intersecting the direction connecting the positive electrode 26a and the negative electrode 26b at the shortest distance. A portion of the first connecting portion 51 a is exposed from the insulating film 52 in a first opening 52 a formed in the insulating film 52 , and the other portion of the first connecting portion 51 a is covered with the insulating film 52 . A portion of the first connection portion 51a is connected to the first conductive member 61a at the first opening 52a. A part of the second connecting portion 51b is exposed from the insulating film 52 in a second opening 52b formed in the insulating film 52, and the other portion of the second connecting portion 51b is covered with the insulating film 52. As shown in FIG. A portion of the second connection portion 51b is connected to the second conductive member 61b at the second opening 52b.

In the example shown in FIG. 14A, the shape of the first hole 211 and the first portion 212a of the second hole 212 is circular with approximately the same diameter in plan view. The second portion 212b of the second hole portion 212 is arranged along part of the outer circumference of the first portion 212a in plan view.

When a plurality of light sources 20A are arranged on the support member 200, a plurality of pairs of holes 210a and 210b are arranged. In this case, the conductive paste is arranged along the direction in which the plurality of pairs of holes 210a and 210b are arranged at predetermined intervals based on the design value of the spacing between the plurality of pairs of holes 210a and 210b. However, the spacing between the pairs of holes 210a and 210b may deviate from the design value in terms of manufacturing. The amount of manufacturing deviation from this design value is, for example, about 150 μm or less. In that case, the holes 210a and 210b and the conductive members 61a and 61b may be misaligned.

In the example shown in FIG. 14B, the first hole 211 and the first portion 212a of the second hole 212 overlapping the first hole 211 are arranged in an elliptical or oval shape in plan view. The long axis of the elliptical or oval shape of the first hole 211 and the first portion 212a extends in the direction connecting the positive electrode 26a and the negative electrode 26b at the shortest distance. The second portion 212b is formed along part of the outer circumference of the first portion 212a in plan view. That is, the opening shape of the holes 210a and 210b opening on the second surface 202 side of the support member 200 is different from the example shown in FIG. ). As a result, when the plurality of pairs of holes 210a and 210b are arranged in the horizontal direction, even if the spacing between the plurality of pairs of holes 210a and 210b deviates from the design value in terms of manufacturing, the supply position of the conductive paste overlaps at least part of the openings of the holes 210a and 210b on the second surface 202 side. The conductive paste flows into and fills the holes 210a and 210b from the portions overlapping the holes 210a and 210b.

In the example shown in FIG. 14C, similarly to the example shown in FIG. 14B, the shape of the openings of the holes 210a and 210b opening toward the second surface 202 of the support member 200 is different from the example shown in FIG. 14A. It is formed long in the direction Furthermore, in the example shown in FIG. 14C, the width of the first hole 211 that opens on the first surface 201 side of the support member 200 and overlaps the electrodes 26a and 26b (the width in the vertical direction in FIG. 14C) is the same as that of the electrodes 26a and 26b. It becomes smaller in the direction from the area overlapping with the second hole 212b toward the area connected to the second hole 212b. As a result, the contact areas between the conductive members 61a and 61b and the electrodes 26a and 26b are increased, and the conductive members 61a and 61b in the first hole 211 that do not overlap the light source 20A become the light emitting surface (the light guide plate 10). can be made invisible on the first main surface 11) side of the .

In the example shown in FIGS. 14A to 14C, the arrangement relationship in plan view between the rectangular light source 20A in plan view and the light guide plate 10 is as shown in FIG. That is, in plan view, the corners of the light source 20A do not face the corners of the light emitting region 5 partitioned by the partition grooves 14, but face the sides of the light emitting region 5. As shown in FIG.

On the other hand, the light source 20A shown in FIG. 14D is arranged in a posture rotated by 45° from the light source 20A shown in FIGS. 14A to 14C. That is, the corners of the light source 20A shown in FIG. 14D face the corners of the light-emitting regions 5 partitioned by the partition grooves 14 . The shape of the holes 210a and 210b shown in FIG. 14D in plan view is the same as the shape of the holes 210a and 210b shown in FIG. 14A in plan view. The shape of the holes 210a and 210b shown in FIG. 14D in plan view can also be the shape of the holes 210a and 210b shown in FIG. 14B or 14C in plan view.

14E and 14F are bottom views showing an example of the area below the light source 20A in the light emitting device 300A. 14E and 14F, the light source 20A, the light emitting element 21, the positive electrode 26a, the negative electrode 26b, and the hole are covered with the insulating film 52, the first conductive member 61a, and the second conductive member 61b. 210a, 210b, the first connection portion 51a, and the second connection portion 51b are indicated by dashed lines.

14E and 14F, the first hole portion 211 of one hole portion 210a is called the first A hole portion 2111, the second hole portion 212 of the hole portion 210a is called the second A hole portion 2121, and the hole portion 210a The first portion 212a may be called a first A portion 212a1. 14E and 14F, the first hole portion 211 of the other hole portion 210b is called the first B hole portion 2112, the second hole portion 212 of the hole portion 210b is called the second B hole portion 2122, and the hole portion The first portion 212a of 210b may be referred to as the first B portion 212a2. In FIGS. 14E and 14F, the first direction X from the first A portion 212a1 to the first connection portion 51a side is called the first A direction X1, and the first direction X from the first B portion 212a2 to the second connection portion 51b side. is sometimes referred to as the first B direction X2. The first A direction X1 and the first B direction X2 may be the same direction or different directions. For example, as shown in FIGS. 14E and 14F, the first A direction X1 and the first B direction X2 may be orthogonal.

The light source 20A shown in FIGS. 14E and 14F is arranged in a posture obtained by rotating the light source 20A shown in FIGS. 14A to 14C by 45°, like the light source 20A shown in FIG. 14D. That is, as shown in FIG. 14G, at least one of the outer edges of the light source 20A is parallel to at least one of the dividing grooves 14 extending in a grid pattern. In this specification, the term “parallel” includes not only the case where two straight lines do not intersect even if they are extended, but also the case where the angle formed by the two straight lines is within a range of 10°.

A second A hole portion 2121 of one hole portion 210a shown in FIG. 1 extension hole 212c1. A second B hole portion 2122 of the other hole portion 210a shown in FIG. 2 extension holes 212c2. The first extension hole portion 212c1 and/or the second extension hole portion 212c2 may be referred to as an extension hole portion 212c. The extension hole portion 212c may extend from the first portion 212a toward the connecting portion in the first direction, or may not extend from the first portion 212a toward the connecting portion in the first direction. . The extension hole portion 212c is configured in the same manner as the second portion 212b, except that it does not have to extend from the first portion 212a toward the connection portion side in the first direction. That is, it can be said that the second portion 212b is one form of the extension hole portion 212c. The extension hole portion 212c may have the same configuration as the second portion 212b.

As shown in FIG. 14E, the first extension hole portion 212c1 may extend from the first A portion 212a1 in the first B direction X2 perpendicular to the first A direction X1 in plan view. The second extension hole portion 212c2 may extend in the first B direction X2 from the first B portion 212a2 in plan view.

As shown in FIG. 14E, the first extension hole portion 212c1 may have a portion extending leftward from the first A portion 212a1 along the first B direction X2 and a portion extending rightward. In other words, the first extension hole portions 212c1 may be positioned so as to sandwich the first A portion 212a1 in the first B direction X2. By doing so, the reliability of the electrical connection between the light source and the wiring layer of the support member can be enhanced. As shown in FIG. 14E, the first extension hole 212c1 and/or the second extension hole 212c2 are preferably linear. This makes it easier to form the first extension hole 212c1 and/or the second extension hole 212c2. The number of extension holes 212c is not particularly limited, and one extension hole 212c may extend from one first portion 212a, and two or more extension holes 212c may extend from one first portion 212a. May be extended. In a plan view, when a plurality of extension holes 212c extend from one first portion 212a, the plurality of extension holes may extend in the same direction, or the plurality of extension holes may extend in different directions. may

The maximum width of the first extension hole portion 212c1 in the first A direction X1 may be larger than, equal to, or smaller than the maximum width of the first A portion 212a1 in the first A direction X1. Since the maximum width of the first extension hole portion 212c1 in the first A direction X1 is larger than the maximum width of the first A portion 212a1, reliability of electrical connection between the light source and the wiring layer of the support member can be enhanced. When the maximum width of the first extension hole portion 212c1 is the same as the maximum width of the first A portion 212a1 in the first A direction X1, and thus the maximum width of the first extension hole portion 212c1 is smaller than the maximum width of the first A portion 212a1. The reliability of the electrical connection between the light source and the wiring layer of the support member can be made higher than in the case of the first embodiment. In addition, in the first A direction X1, the maximum width of the first extension hole portion 212c1 is the same as the maximum width of the first A portion 212a1, so that the maximum width of the first extension hole portion 212c1 is larger than the maximum width of the first A portion 212a1. The processing time for the first extension hole portion 212c1 can be shortened as compared with the case of a large size. As shown in FIG. 14E, the maximum width of the first extension hole portion 212c1 in the first A direction X1 is preferably smaller than the maximum width of the first A portion 212a1 in the first A direction X1. Thereby, the processing time of the first extension hole portion 212c1 can be shortened.

The maximum width of the first extension hole portion 212c1 in the first B direction X2 may be greater than, the same as, or less than the maximum width of the first A portion 212a1 in the first B direction X2. The maximum width of the first extension hole portion 212c1 in the first B direction X2 is preferably greater than the maximum width of the first A portion 212a1 in the first B direction X2. Thereby, the reliability of the electrical connection between the light source and the wiring layer of the support member can be improved. When the maximum width of the first extension hole portion 212c1 is the same as the maximum width of the first A portion 212a1 in the first B direction X2, and thus the maximum width of the first extension hole portion 212c1 is smaller than the maximum width of the first A portion 212a1. The reliability of the electrical connection between the light source and the wiring layer of the support member can be made higher than in the case of the first embodiment. In addition, in the first B direction X2, the maximum width of the first extension hole portion 212c1 is the same as the maximum width of the first A portion 212a1, so that the maximum width of the first extension hole portion 212c1 is larger than the maximum width of the first A portion 212a1. The processing time for the first extension hole portion 212c1 can be shortened as compared with the case of a large size. Since the maximum width of the first extension hole portion 212c1 in the first B direction X2 is smaller than the maximum width of the first A portion 212a1, the processing time of the first extension hole portion 212c1 can be shortened.

In plan view, it is preferable that at least a portion of the outer edge of the first extension hole portion 212c1 and at least a portion of the outer edge of the second extension hole portion 212c2 are parallel to each other. For example, as shown in FIG. 14E, at least part of the outer edge of the first extension hole 212c1 and at least part of the outer edge of the second extension hole 212c2 preferably extend in the first B direction X2. By doing so, it becomes easier to form the first extension hole portion 212c1 and the second extension hole portion 212c2. When the first extension hole portion 212c1 and the second extension hole portion 212c2 are linear in plan view, the direction in which the first extension hole portion extends and the direction in which the second extension hole portion 212c extends may be parallel. preferable. By doing so, it becomes easier to form the first extension hole portion 212c1 and the second extension hole portion 212c2.

As shown in FIG. 14E, when the first extension hole 212c1 and the second extension hole 212c2 extend in the first B direction X2, the first extension hole 212c1 and/or the second extension hole 212c2 are It is preferable not to overlap the area from the center of the first A hole portion 2111 to the center of the first B hole portion 2112 in the first A direction X1. By doing so, it is possible to suppress contact between the first conductive member 61a and the second conductive member 61b. As used herein, "the center of the first portion" means the geometric center of gravity of the first portion in plan view. For example, if the shape of the first portion is circular, the center of the first portion means the center of the circle.

As shown in FIG. 14E , a first opening 52a through which a portion of the first connecting portion 51a is exposed corresponds to a second opening through which a portion of the second connecting portion 51b is exposed in the first direction X and the second direction Y. It is preferable not to overlap with the portion 52b. By doing so, it is possible to suppress contact between the first conductive member 61a and the second conductive member 61b. In addition, since the first opening 52a and the second opening 52b do not overlap in the first direction X, the size of the light emitting device in the first direction X can be reduced. Since the first opening 52a and the second opening 52b do not overlap in the second direction Y, the size of the light emitting device in the second direction Y can be reduced.

As shown in FIG. 14F, the second holes 212 of the holes 210a and 210b have a first portion 212a overlapping the first hole 211 and a first portion 212a extending from the first portion 212a to the first hole 211 in plan view. and non-overlapping extension holes 212c. The extension hole portion 212c is arranged along a part of the outer circumference of the first portion 212a in plan view. As shown in FIG. 14F, the first extending hole portion 212c1 and the second extending hole portion 212c2 do not overlap the region between the first A portion 212a1 of the hole portion 210a and the first B portion 212a2 of the hole portion 210b in plan view. is preferred. By doing so, it is possible to suppress contact between the first conductive member 61a and the second conductive member 61b.

[Third Embodiment]
FIG. 15 is a cross-sectional view of a light emitting device 300B according to the third embodiment of the invention.

A light source arrangement portion 15 is formed on the second main surface 12 side of the light guide plate 10 . The light source placement portion 15 is formed as a recess opening in the second main surface 12 . A light source 20B is arranged in the light source arrangement portion 15 .

Light source 20</b>B includes light emitting element 21 , a pair of electrodes (positive electrode 26 a and negative electrode 26 b ) arranged on the lower surface of light emitting element 21 , fourth translucent member 25 , and covering member 29 . The fourth translucent member 25 is arranged on the light emitting element 21 and the covering member 29 . The light emitting element 21 is adhered to the lower surface of the fourth translucent member 25 with an adhesive member.

A fifth translucent member 22 that covers the side surface of the light source 20B is arranged in the light source arrangement portion 15 . The fifth translucent member 22 is, for example, a resin member translucent to the light from the light source 20B.

The support member 220 includes the resin member 44 arranged on the second main surface 12 of the light guide plate 10 , the first connecting portion 151 a arranged on the lower surface of the resin member 44 , and the second connecting portion 151 a arranged on the lower surface of the resin member 44 . connection portion 151b. The resin member 44 is a light reflecting member containing a light diffusing material such as _TiO2 .

A pair of holes 210a and 210b are formed in the resin member 44 below the light source 20B. A first conductive member 61a is arranged in the hole 210a, and a second conductive member 61b is arranged in the hole 210b. The first conductive member 61a connects the positive electrode 26a and the first connection portion 151a. The second conductive member 61b connects the negative electrode 26b and the second connection portion 151b.

Each of the pair of holes 210a and 210b includes a first hole 211 that opens to the upper surface of the resin member 44, and a second hole that communicates with the first hole 211 and opens to the lower surface of the resin member 44. 212. In plan view, the first hole 211 of one hole 210a overlaps the positive electrode 26a connected to the first conductive member 61a, and the first hole 211 of the other hole 210b has the second conductivity. It overlaps the negative electrode 26b connected to the member 61b.

The second hole portion 212 of one hole portion 210a includes a first portion 212a that overlaps the first hole portion 211 and an extension from the first portion 212a along the first direction X toward the first connecting portion 151a in plan view. and second portion 212b present. The second hole portion 212 of the other hole portion 210b has a first portion 212a that overlaps with the first hole portion 211 and extends from the first portion 212a along the first direction X toward the second connecting portion 151b in plan view. and second portion 212b present.

Also in the third embodiment, the second portion 212b of the second hole 212 that opens on the lower surface side of the support member 220 is extended toward the connection portions 151a and 151b from the first hole 211, thereby The volume of the lower surface side of the support member 220 at 210a and 210b can be increased. Therefore, it is possible to increase the volume of the conductive paste supplied to the second portion 212b and leave a sufficient amount of the conductive paste on the second portion 212b even if curing shrinkage occurs. This prevents breakage of the conductive members 61a and 61b after curing, and increases the reliability of the electrical connection between the light source 20B and the connection portions 151a and 151b of the support member 220. FIG.

[Fourth Embodiment]
FIG. 16 is a cross-sectional view of a light emitting device 300C according to the fourth embodiment of the invention.

Light source 20</b>C includes light emitting element 21 and a pair of electrodes (positive electrode 26 a and negative electrode 26 b ) arranged on the lower surface of light emitting element 21 .

The support member 230 includes a substrate 45 , a first connecting portion 151 a arranged on the lower surface of the substrate 45 , and a second connecting portion 151 b arranged on the lower surface of the substrate 45 . The substrate 45 is made of resin containing a light diffusing material such as TiO ₂ . Also, the substrate 45 may be a substrate made of, for example, ceramics, glass, or fiber-reinforced resin such as glass epoxy resin.

20 C of light sources are arrange|positioned on the upper surface of the resin member 45. As shown in FIG. A sixth translucent member 27 is arranged on the upper surface of the resin member 45 . The sixth translucent member 27 covers the light source 20C. The sixth translucent member 27 has functions such as wavelength conversion and light diffusion depending on the particles added to the sixth translucent member 27 .

A pair of holes 210a and 210b are formed in the resin member 45 below the light source 20C. A first conductive member 61a is arranged in the hole 210a, and a second conductive member 61b is arranged in the hole 210b. The first conductive member 61a connects the positive electrode 26a and the first connection portion 151a. The second conductive member 61b connects the negative electrode 26b and the second connection portion 151b.

Each of the pair of holes 210a and 210b includes a first hole 211 that opens to the upper surface of the resin member 45, and a second hole that communicates with the first hole 211 and opens to the lower surface of the resin member 45. 212. In plan view, the first hole 211 of one hole 210a overlaps the positive electrode 26a connected to the first conductive member 61a, and the first hole 211 of the other hole 210b has the second conductivity. It overlaps the negative electrode 26b connected to the member 61b.

The second hole portion 212 of one hole portion 210a includes a first portion 212a that overlaps the first hole portion 211 and an extension from the first portion 212a along the first direction X toward the first connecting portion 151a in plan view. and second portion 212b present. The second hole portion 212 of the other hole portion 210b has a first portion 212a that overlaps with the first hole portion 211 and extends from the first portion 212a along the first direction X toward the second connecting portion 151b in plan view. and second portion 212b present.

Also in the fourth embodiment, by extending the second portion 212b of the second hole 212 opening on the lower surface side of the support member 230 toward the connecting portions 151a and 151b rather than the first hole 211, the hole portion The volume of the lower surface side of the support member 230 at 210a and 210b can be increased. Therefore, it is possible to increase the volume of the conductive paste supplied to the second portion 212b and leave a sufficient amount of the conductive paste on the second portion 212b even if curing shrinkage occurs. This prevents breakage of the conductive members 61a and 61b after curing, and increases the reliability of the electrical connection between the light source 20C and the connection portions 151a and 151b of the support member 230. FIG.

The light emitting device 300A of the first and second embodiments and the light emitting device 300B of the third embodiment are planar light sources, for example. Also, the light emitting device 300A and the light emitting device 300B may be linear light sources. Further, the light guide plate 10 may be omitted in the light emitting device 300A and the light emitting device 300B.

[Fifth embodiment]
FIG. 17 is a cross-sectional view of a light emitting device 300D according to the fifth embodiment of the invention.

The light emitting device 300D is configured in the same manner as the light emitting device 300A of the first embodiment except that it includes a first member 81 and a second member 82 that cover the upper surface of the light source 20A. In the light emitting device 300D, the second translucent member 71 is arranged as a single layer without arranging the wavelength conversion member and the third translucent member in the through hole that is the light source arrangement portion 13 .

The first member 81 is a translucent member containing phosphor. For example, the first member 81 may be translucent resin containing phosphor. Materials similar to those of the first translucent member 23 can be used for the phosphor and/or the translucent resin. Further, as the material of the first member 81, a thermoplastic resin such as polyethylene terephthalate or polyester, acryl, polycarbonate, cyclic polyolefin, glass, or the like may be used. The first member 81 may contain a known light diffusing agent such as TiO ₂ , SiO ₂ , Al ₂ O ₃ , ZnO, or glass. The first member 81 may be a single layer or multiple layers.

For example, when blue light is emitted from the light source 20A, the first member 81 converts the light emitted from the light source 20A into green light, and the first member 81 converts the light emitted from the light source 20A into red light. and a phosphor. By doing so, the light emitting device 300D can emit white light. Phosphors that convert green light include, for example, β-sialon-based phosphors and phosphors having a perovskite structure. Examples of phosphors that convert red light include nitride phosphors such as CASN phosphors and SCASN phosphors, KSF phosphors, and KSAF phosphors. Moreover, when blue light and green light are emitted from the light source 20A, it is preferable that the first member 81 includes a phosphor that converts the light emitted from the light source 20A into red light. By doing so, the light emitting device 300D can emit white light. Further, when green light and/or red light is emitted from the light source 20A, the first member 81 converts the light emitted from the light source 20A into green light and the phosphor that converts the light emitted from the light source 20A. and a phosphor that converts to red light. This facilitates color adjustment of the light emitting device. Moreover, it is preferable that the first member 81 includes a phosphor that converts the light emitted from the light source 20A into blue light. This facilitates color adjustment of the light emitting device.

The first member 81 may cover the top surface of the light source 20A in contact with the light source 20A, or may cover the top surface of the light source 20A in contact with the second light adjustment member 74. As shown in FIG. The upper surface of the light source 20A may be covered with the member 82 interposed therebetween. The second member 82 is a member that fixes the light source 20A and the first member 81 together. Examples of materials for the second member 82 include translucent resin. The second member 82 may contain a phosphor and/or a light diffusing agent.

A light emitting device 300D of the fifth embodiment is, for example, a planar light source. Also, the light emitting device 300D may be a linear light source. Further, the light guide plate 10 may be omitted in the light emitting device 300D.

[Sixth Embodiment]
FIG. 18 is a top view of a light emitting device 300E according to the sixth embodiment of the invention.
19 is a cross-sectional view taken along line XIX-XIX of FIG. 18. FIG.

As shown in FIGS. 18 and 19, the light emitting device 300E includes a third light adjustment member 85 located inside the dividing groove 14. As shown in FIGS. By locating the third light adjusting member 85 in the dividing groove 14, the contrast ratio between the adjacent light emitting regions 5 can be improved. 18 and 19, one light emitting region 5 of the adjacent light emitting regions is called a first light emitting region 5A, and the other light emitting region 5 is called a second light emitting region 5B. 20 A of light sources may be called 21 A of 1st light sources, and 20 A of light sources arrange|positioned at the 2nd light emission area|region 5B may be called 22 A of 2nd light sources. Since the light emitting device 300E has the third light adjusting member 85 in the partition groove 14, part of the light traveling from the first light source 21A to the second light emitting region 5B is blocked by the third light adjusting member 85. Thereby, when the first light source 21A is lit and the second light source 22A is not lit, the contrast ratio between the first light emitting region 5A and the second light emitting region 5B can be improved. When viewed from above, the third light adjusting member 85 may surround at least a portion of the first light emitting region 5A. When viewed from above, the third light adjusting member 85 may surround the first light emitting region 5A seamlessly. As the material of the third light adjusting member 85, the same material as that of the first light adjusting member can be used.

As shown in FIG. 19, the light guide plate 10 includes a first light guide portion 10A and a second light guide portion 10B that are separated from each other in the dividing grooves 14 . At least part of the side surface of the first light guide section 10A facing the second light guide section 10B is covered with the third light adjustment member 85. As shown in FIG. All of the side surfaces of the first light guide section 10A facing the second light guide section 10B may be covered with the third light adjustment member 85 . This makes it easier for the third light adjusting member 85 to block the light traveling from the first light source 21A to the second light emitting region 5B. By appropriately selecting the area of the third light adjusting member 85 covering the side surface of the first light guide portion 10A facing the second light guide portion 10B, the light propagating between the first light emitting region 5A and the second light emitting region 5B You can adjust the amount of

As shown in FIG. 19 , the second adhesive member 43 includes a second adhesive first portion 43A and a second adhesive second portion 43B that are separated from each other in the partition groove 14 . The method of forming the second adhesive first part 43A and the second adhesive second part 43B is not particularly limited. For example, the light guide plate 10 is arranged on the support member 200 as shown in FIG. 20A. Next, as shown in FIG. 20B, part of the light guide plate 10 is removed to form the first light guide portion 10A and the second light guide portion 10B. At this time, a part of the second adhesive member 43 can be removed to form the second adhesive first part 43A and the second adhesive second part 43B. When part of the light guide plate 10 is removed, part of the light reflecting member 42 may be removed to divide the light reflecting member 42 into a plurality of parts. When part of the light guide plate 10 is removed, part of the first adhesive member 41 may be removed to divide the first adhesive member 41 into a plurality of parts. A portion of the light guide plate 10 may be removed to divide the light guide plate 10 into the first light guide portion 10A and the second light guide portion 10B, or the light guide plate 10 may be divided into three or more portions. By appropriately selecting the shape of the light guide plate 10, the amount of light propagating between the first light emitting region 5A and the second light emitting region 5B can be adjusted. As a method for removing part of the light guide plate 10, for example, a known method such as cutting or laser processing can be used. A third light adjusting member that covers the side surfaces of the first light guide portion 10A and the second light guide portion 10B after part of the light guide plate 10 is removed to form the first light guide portion 10A and the second light guide portion 10B. form 85; As a method of forming the third light adjusting member 85, for example, a known method such as printing, potting, or spraying can be used.

As shown in FIG. 19, the third light adjusting member 85 may continuously cover the side surface of the first light guide section 10A and the side surface of the second light guide section 10B, and as shown in FIG. The third light adjustment member 85 covering the side surface of the light section 10A and the third light adjustment member 85 covering the side surface of the second light guide section 10B may be separated. Since the third light adjusting member 85 continuously covers the side surface of the first light guide section 10A and the side surface of the second light guide section 10B, the third light adjusting member 85 is less likely to peel off from the light guide plate 10 . Since the third light adjustment member 85 covering the side surface of the first light guide section 10A and the third light adjustment member 85 covering the side surface of the second light guide section 10B are separated, the third light adjustment member 85 Compared to the case where the side surface of the first light guide portion 10A and the side surface of the second light guide portion 10B are continuously covered, the difference in the coefficient of thermal expansion of each member constituting the third light adjustment member 85 and the support member 200 makes the support member 200 can be suppressed from warping. The third light adjusting member 85 may embed at least part of the dividing groove 14 . As shown in FIG. 21B , the third light adjusting member 85 may fill the entire dividing groove 14 . This makes it easier to increase the volume of the third light adjusting member 85, making it easier to adjust the amount of light propagating between adjacent light emitting regions. As shown in FIG. 21C, the third light adjustment member 85 includes a layered (film-like) third light adjustment first portion 85A covering the side surface of the first light guide portion 10A and the side surface of the second light guide portion 10B, A third light adjustment second portion 85B that is in contact with the third light adjustment first portion 85A and embeds at least a portion of the partition groove 14 may be provided. This makes it easier to adjust the amount of light propagating between adjacent light emitting regions.

[Seventh Embodiment]
FIG. 22 is a cross-sectional view of a light emitting device 300F according to the seventh embodiment of the invention.
FIG. 23 is a cross-sectional view showing an example of a light emitting device according to the seventh embodiment of the invention.

As shown in FIG. 22, the lower surface of the wiring board 50 and the conductive members 61a and 61b are in contact with each other at the second portion 212b of the second hole 212. As shown in FIG. When viewed from above, the thickness of the wiring substrate 50 in the portion overlapping the second portion 212b of the second hole 212 is thinner than the thickness of the wiring substrate 50 in the portion positioned outside the second portion 212b of the second hole 212. . By removing a part of the wiring board 50 when forming the second part 212b of the second hole 212 by laser processing or the like, the part of the wiring board 50 that overlaps the second part 212b of the second hole 212 when viewed from above can be removed. thickness can be reduced. By leaving a portion of the wiring substrate 50 overlapping the second portion 212b of the second hole 212 in top view, the first adhesive member 41 in the portion overlapping the second portion 212b of the second hole 212 in top view is removed. can be suppressed from being removed. This improves the adhesion between the wiring board 50 and the first adhesive member 41 .

As shown in FIG. 22, the inner side surfaces defining the holes 210a and 210b may be perpendicular to the second main surface 12 of the light guide plate 10, and as shown in FIG. may be inclined with respect to the second main surface 12 of the light guide plate 10 . When OCA (Optical Clear Adhesive) is used for the first adhesive member 41 and/or the second adhesive member 43, at least a part of the inner surface defining the holes 210a and 210b is the second main surface of the light guide plate 10. 12. Since OCA changes its shape more easily than hardened resin, using OCA for the first adhesive member 41 and/or the second adhesive member 43 can serve as a cushioning material. For example, even if the amount of deformation of the wiring board 50 and the amount of deformation of the light reflecting member 42 due to heat are different, the change in the shape of the OCA can prevent the wiring board 50 and the light reflecting member 42 from peeling off. Further, the deformation of the first bonding member 41 and/or the second bonding member 43, which is the OCA, causes the hole portion defined by the first bonding member 41 and/or the second bonding member 43 to be deformed, as shown in FIG. The inner surfaces of 210 a and 210 b may be inclined with respect to the second major surface 12 of the light guide plate 10 . When the OCA is deformed due to the difference in thermal expansion coefficient between the wiring substrate 50 and the light reflecting member 42, the centers of the holes 210a and 210b defined by the upper surface of the second adhesive member 43 in a top view will be aligned with the first adhesive. It is located outside the centers of the holes 210 a and 210 b defined by the lower surface of the member 41 . The center of the holes 210a and 210b defined by the lower surface of the first adhesive member 41 is called the first center, and the center of the holes 210a and 210b defined by the upper surface of the second adhesive member 43 is called the second center. There is In this specification, that the second center is located outside the first center means that the second center is farther from the center of the support body 200 than the first center. The center of the support 200 means the geometric center of gravity of the support 200 in top view. The center of the holes 210a and 210b means the geometric center of gravity of the holes 210a and 210b in top view. 23, the center of the support 200 is on the left side of the light source 20A. The shortest distance from the first center to the second center tends to increase as the first center is further away from the center of the support 200 .

[Eighth Embodiment]
FIG. 24 is a cross-sectional view of a light emitting device 300G according to the eighth embodiment of the invention.

The light emitting device 300G includes a diffuser plate 91 covering the plurality of light emitting regions 5, a first prism sheet 92A and a second prism sheet 92B. The diffusion plate 91 may be in contact with the second light adjustment member 74 and/or the light guide plate 10, and is spaced apart from the second light adjustment member 74 and/or the light guide plate 10 as shown in FIG. may The diffuser plate 91 is a member that diffuses incident light to widen the directivity of the light. By covering the plurality of light emitting regions 5 with the diffuser plate 91, it is possible to reduce uneven brightness of light emitted from the plurality of light emitting regions. As a structure for diffusing incident light, for example, unevenness may be provided on the surface of the diffuser plate 91, or members having different refractive indices may be included in the base material of the diffuser plate 91. FIG. The diffuser plate 91 is preferably made of a material that absorbs less visible light. Materials for the diffusion plate 91 include, for example, polycarbonate resin, polystyrene resin, acrylic resin, and polyethylene resin. For the diffusion plate 91, an optical sheet commercially available under the name of a light diffusion sheet, a diffuser film, or the like can be used. The number of layers of the diffusion plate 91 covering the plurality of light emitting regions 5 may be a single layer or a plurality of layers. For example, as shown in FIG. 24, the diffusion plate 91 may be two layers of a first diffusion plate 91A and a second diffusion plate 91B.

The first prism sheet 92A covers the plurality of light emitting areas 5 with the diffuser plate 91 interposed therebetween. The second prism sheet 92B covers the plurality of light emitting areas 5 via the diffusion sheet 85 and the first prism sheet 92A. Each of the first prism sheet 92A and the second prism sheet 92B has a structure in which a plurality of prisms extending in a predetermined direction are arranged. For example, the first prism sheet 92A has a plurality of prisms extending in the third direction, and the second prism sheet 92B has a plurality of prisms in a fourth direction orthogonal to the third direction. The first prism sheet 92A and the second prism sheet 92B refract light incident from various directions in a fifth direction toward a display panel or the like facing the light emitting device. The fifth direction is a direction orthogonal to the third direction and the fourth direction, and is the same direction as the thickness direction of the light guide plate 10 and the like. Therefore, the light emitted from the second prism sheet 92B contains many components of light traveling in the fifth direction, so that the luminance when the light emitting device 300G is viewed from above can be increased. As materials for the first prism sheet 92A and the second prism sheet 92B, polyethylene terephthalate, acrylic, or the like can be used. For the first prism sheet 92A and the second prism sheet 92B, an optical sheet commercially available under the name of prism sheet or the like can be used.

DESCRIPTION OF SYMBOLS 10... Light guide plate 11... 1st main surface 12... 2nd main surface 13... Light source arrangement part 20A, 20B, 20C... Light source 26a Positive electrode 26b... Negative electrode 42... Light reflecting member 50... Wiring board 51a First connection portion 51b Second connection portion 61a First conductive member 61b Second conductive member 200 Supporting member 201 First surface 202 Second surface 210a, 210b... hole 211... first hole 212... second hole 212a... first portion 212b... second portion 300A, 300B, 300C... light emitting device

Claims (7)

A support member including a wiring layer, comprising: a first surface; a second surface located on the opposite side of the first surface and including a connection portion of the wiring layer; a hole penetrating from a surface to the second surface; and
a light source disposed on the first surface of the support member and including a positive electrode and a negative electrode;
a conductive member disposed in the hole and connecting one of the positive electrode and the negative electrode to the connecting portion;
with
The connecting portion is arranged in a region other than between the positive electrode and the negative electrode in plan view,
The hole includes a first hole that opens on the first surface side and a second hole that communicates with the first hole and opens on the second surface side,
The first hole overlaps with either one of the positive electrode and the negative electrode connected to the conductive member in a plan view,
The second hole includes, in a plan view, a first portion that overlaps the first hole, and a second portion that extends from the first portion toward the connecting portion in a first direction ,
The light-emitting device , wherein the volume of the hole on the second surface side is larger than the volume of the hole on the first surface side . 2. The light emitting device according to claim 1, wherein the width of said second portion in a second direction perpendicular to said first direction is greater than the width of said first portion in said second direction. The light-emitting device according to claim 2, wherein the second portion extends to a position overlapping the connecting portion in the second direction. The support member includes a wiring board including the wiring layer, and a light reflecting member disposed between the wiring board and the light source,
The first hole penetrates the light reflecting member,
The light emitting device according to any one of claims 1 to 3, wherein the second hole penetrates the wiring board and does not reach the light reflecting member. a first principal surface, a second principal surface opposite to the first principal surface, and a light source placement portion penetrating from the first principal surface to the second principal surface; further comprising a light guide plate arranged on the support member so as to face the support member;
The light emitting device according to any one of claims 1 to 4, wherein the light source is arranged on the support member within the light source arrangement portion. The connecting portion includes a first connecting portion and a second connecting portion,
A pair of said holes are arranged corresponding to each of said positive electrode and said negative electrode,
The conductive member is
a first conductive member disposed in one of the pair of holes and connecting the positive electrode and the first connection portion;
6. The second conductive member arranged in the other of the pair of holes and connecting the negative electrode and the second connection part according to any one of claims 1 to 5. luminous device. A support member including a wiring layer, comprising: a first surface; a second surface located on the opposite side of the first surface and including a connection portion of the wiring layer; a hole penetrating from a surface to the second surface; and
a light source disposed on the first surface of the support member and including a positive electrode and a negative electrode;
a conductive member disposed in the hole and connecting one of the positive electrode and the negative electrode to the connecting portion;
with
The connecting portion is arranged in a region other than between the positive electrode and the negative electrode in plan view,
The hole includes a first hole that opens on the first surface side and a second hole that communicates with the first hole and opens on the second surface side,
The first hole overlaps with either one of the positive electrode and the negative electrode connected to the conductive member in a plan view,
The second hole includes, in a plan view, a first portion that overlaps the first hole, and an extension hole that extends from the first portion and does not overlap the first hole ,
The light-emitting device , wherein the volume of the hole on the second surface side is larger than the volume of the hole on the first surface side .

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