KR20220009994A - Manufacturing method of electronic components and electronic components - Google Patents

Abstract

Provided are a method and an electronic component for manufacturing an electronic component having excellent adhesion between a fluororesin and an electronic device by a simple method. A method for manufacturing an electronic component comprising: a step of providing a resin composition above an electronic device mounted on a wiring substrate; and a step of covering the electronic device with the resin composition by heating the resin composition to a melting point or higher, wherein the resin composition Silver contains a crystalline fluororesin, and does not contain a volatile component substantially, The manufacturing method of the electronic component characterized by the above-mentioned.

Description

Manufacturing method of electronic components and electronic components

The present invention relates to a method for manufacturing an electronic component and to an electronic component.

In electronic parts provided with electronic elements, such as LED (Light Emitting Diode), in order to prevent deterioration of an electronic element, the said electronic element is sealed with an epoxy resin or a silicone resin in many cases, and there exists an example sealing with a fluororesin.

Patent Document 1 describes an LED element sealed with a coating layer (sealing layer), wherein the coating layer contains at least tetrafluoroethylene (TFE), hexafluoropropylene (HFP) and vinylidene fluoride (VdF). It is described that it can be prepared by dissolving the contained fluoropolymer (THV) in a solvent to prepare a solution having a viscosity suitable for application, and applying and drying the solution. Moreover, in patent document 1, in order to thicken the thickness while maintaining transparency of a coating film, using the filler which consists of a fluororesin, making high solid content concentration of a solution is described.

On the other hand, Patent Document 2 describes an ultraviolet light emitting device using an amorphous fluororesin as a sealing resin for sealing the ultraviolet light emitting element.

Japanese Patent Laid-Open No. 2009-51876 International Publication No. 2014/178288

However, when THV is dissolved in a solvent, if the concentration of the solution is increased, the viscosity becomes excessively high and the solution cannot be applied. Therefore, in order to seal an electronic device using the THV solution, it is necessary to apply a low concentration solution a plurality of times. Moreover, since it is difficult to make the refractive index of resin and a filler match completely when a coating film is thickened using a filler, the transmittance|permeability falls. On the other hand, when an amorphous fluororesin is used, the adhesiveness between the amorphous fluororesin and the electronic device is insufficient. The present invention has been made in view of the above circumstances, and an object thereof is to provide a method for manufacturing an electronic component having excellent adhesion between a fluororesin and an electronic device by a simpler method.

The manufacturing method and electronic component of this invention which were able to solve the said subject consist of the following structures.

[1] A method for manufacturing an electronic component comprising: a step of providing a resin composition above an electronic device mounted on a wiring substrate; and a step of covering the electronic device with the resin composition by heating the resin composition to a melting point or higher, the method comprising: The said resin composition contains a crystalline fluororesin and does not contain a volatile component substantially, The manufacturing method of the electronic component characterized by the above-mentioned.

[2] The production method according to [1], wherein the melting point of the crystalline fluororesin is 278°C or less.

[3] The production method according to [1] or [2], wherein in the crystalline fluororesin, atoms other than carbon and fluorine are bonded to some carbon atoms.

[4] The production method according to any one of [1] to [3], wherein the crystalline fluororesin is a tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer.

[5] The production according to [4], wherein the molar ratio of the structural unit T to the total of the structural unit T derived from tetrafluoroethylene, the structural unit H derived from hexafluoropropylene, and the structural unit V derived from vinylidene fluoride is 0.50 or less Way.

[6] The manufacturing method according to any one of [1] to [4], wherein the electronic element is an LED.

[7] An electronic component mounted on a wiring substrate is an electronic component covered with a resin composition, the resin composition containing a crystalline fluororesin and substantially free of volatile components and fillers, the thickness of the resin composition Electronic components with a thickness of 0.5 mm or more.

[8] The electronic component according to [7], wherein the crystalline fluororesin is a tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer.

[9] The former according to [8], wherein the molar ratio of the structural unit T to the total of the structural unit T derived from tetrafluoroethylene, the structural unit H derived from hexafluoropropylene, and the structural unit V derived from vinylidene fluoride is 0.50 or less part.

By using the manufacturing method of this invention, an electronic element can be sealed easily. Further, the sealed electronic device has excellent adhesion between the resin composition and the electronic device.

1 is a schematic cross-sectional view showing an example of a conventional electronic device.
2 is a schematic cross-sectional view showing an example of a package on which a conventional electronic device is mounted.
It is a schematic sectional drawing which shows an example of the state which provided the resin composition above the electronic element.
4 is a schematic cross-sectional view showing an example of an electronic component manufactured by the manufacturing method of the present invention.
5 is a schematic cross-sectional view showing another example of an electronic component manufactured by the manufacturing method of the present invention.
6 is a schematic cross-sectional view showing another example of an electronic component manufactured by the manufacturing method of the present invention.

The present invention provides a step of providing a resin composition containing a crystalline fluororesin above an electronic device mounted on a wiring substrate, and a step of heating the resin composition to a melting point or higher to cover the electronic device with the resin composition. The eggplant relates to a method of manufacturing an electronic component and to an electronic component. In addition, in this specification, "sealing" refers to blocking the electronic element which is a target object from external air.

(1) electronic device

The electronic device is generally a semiconductor, and a transistor, a diode, etc. are mentioned, and a semiconductor diode is preferable. As the semiconductor diode, a light emitting diode (LED) is preferable, and an ultraviolet light emitting diode (hereinafter sometimes referred to as an ultraviolet light emitting element) is particularly preferable. When the ultraviolet light emitting diode is sealed with an epoxy resin or a silicone resin, deterioration of the resin is increased by ultraviolet rays, whereas when the ultraviolet light emitting diode is sealed with a crystalline fluororesin, the deterioration of the resin can be suppressed. On the other hand, when sealing with an amorphous fluororesin, the adhesiveness of a resin composition and an electronic element will fall.

1 is a schematic cross-sectional view showing an example of the ultraviolet light emitting device. The ultraviolet light emitting device 2 of the example shown in the figure is a flip-chip type device, and has a p-electrode 10 on the anode side on a part of its lower side, and a p-layer 12 is formed on the p-electrode 10. has been Further, an n-electrode 11 on the cathode side is provided on another part of the lower surface of the ultraviolet light-emitting element 2 , and an n-layer 14 is formed on the n-electrode 11 . The n-electrode 11 and the n-layer 14 are formed shifting upward from the p-electrode 10 and the p-layer 12, and the n-layer 14 present above and the p present below the p-electrode 10 and the p-layer 12. An active layer 13 is formed between the layer 12 and the layer 12 . In addition, the element substrate 15 exists above the n-layer 14 which exists above.

The n-layer 14 in the ultraviolet light emitting element 2 is, for example, a Si-containing AlGaN layer. The p-layer 12 may be, for example, an Mg-containing GaN layer. This p-layer 12 is good also as an electron blocking layer etc. laminated|stacked structure as needed. The active layer 13 is, for example, an AlGaN layer.

By passing a forward current from the p-electrode 10 and p-layer 12 toward the n-layer 14 and the n-electrode 11, light emission according to the band gap energy in the active layer 13 is generated. The band gap energy can be controlled within the range of band gap energies (about 3.4 eV and about 6.2 eV) that can be taken by GaN and AlN by adjusting, for example, the AlN mole fraction of the active layer 13, so that the emission wavelength is about Ultraviolet light emission from 200 nm to about 365 nm can be obtained.

In addition, for the element substrate 15, a sapphire substrate, an aluminum nitride substrate, etc. can be used. Ni/Au may be used as a material for the p-electrode 10 , and Ti/Al/Ti/Au may be used for the n-electrode 11 . In addition, the exposed surface between the p-electrode 10 and the n-electrode 11 may be covered with a protective insulating film (not shown) such as _{SiO 2 in order to prevent a short circuit.}

The emission peak wavelength of the ultraviolet light emitting element 2 can be appropriately set in the range of 200-365 nm, and it is preferable that it is 300 nm or less. Since the sterilization effect becomes easy to be exhibited when the emission peak wavelength is 300 nm or less, the ultraviolet light emitting element 2 can be used for the light emitting device for sterilization. The emission peak wavelength is more preferably 280 nm or less.

(2) Wiring equipment

A wiring base material is a base material in which electrode wiring was formed on the surface, and may be called a package. The package may be either a surface mount type or a chip-on-board type, and it is preferable that bumps are formed on the surface on which the electronic element is mounted. Base material of the wiring substrate, it is possible to use ceramics such as aluminum nitride (AlN), alumina (Al ₂ O _3).

FIG. 2 is a schematic cross-sectional view illustrating a state in which the ultraviolet light emitting device of FIG. 1 is mounted on a surface mount type package. In the ultraviolet light emitting device mounting package 6 of FIG. 2 , the p-electrodes 10 and n of the ultraviolet light emitting device 2 are interposed between metal bumps 5 in the wiring not shown in the drawing on the substrate 4 . The electrodes 11 are fixed so that they can be electrically connected to each other. In addition, as mentioned above, a chip-on-board type package can also be used for this invention, and it is not limited to the example shown in drawing.

(3) resin composition

The resin composition includes a crystalline fluororesin. As used herein, "fluororesin" means a polymer of an olefin containing fluorine or a modified product thereof, and the modified product includes, for example, those in which a polar group such as -OH or -COOH is bonded to the end of the main chain. . Moreover, as a crystalline fluororesin, it is preferable from a viewpoint of maintaining the performance of an electronic component that it is a crystalline fluororesin which does not have polar groups, such as _{-SO 3 H group, in a side chain, for example, tetrafluoroethylene-perfluoro} Alkyl vinyl ether copolymer (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), chlorotrifluoroethylene polymer (PCTFE), tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer ( THV) and the like. The number of crystalline fluororesins may be one, and may use 2 or more types together. As for the crystalline fluororesin, it is preferable that atoms other than carbon and fluorine are bonded to some carbon atoms, and more preferably contain a CH bond or a C-Cl bond, and tetrafluoroethylene-hexafluoropropylene-fluorinated more preferably comprising vinylidene copolymer (THV) or chlorotrifluoroethylene polymer (PCTFE), most preferably comprising tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer (THV) . The tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer (THV) is particularly excellent in adhesion to a substrate or an electronic device.

In addition, the crystalline fluororesin used in the present invention is crystalline at room temperature (about 25°C). Whether the fluororesin is crystalline or amorphous can be determined, for example, by performing X-ray diffraction measurement.

The THV includes a structural unit T derived from tetrafluoroethylene, a structural unit H derived from hexafluoropropylene, and a structural unit V derived from vinylidene fluoride, and a structural unit T, a structural unit H, and a structural unit V A resin having a molar ratio (T) of the structural unit T to the total of 0.25 or more and a molar ratio (V) of the structural unit V to the sum of the structural unit T, the structural unit H, and the structural unit V is 0.60 or less is preferable.

It is preferable that the molar ratio (T) of structural unit T with respect to the sum total of structural unit T, structural unit H, and structural unit V is 0.25 or more. Thereby, it becomes the tendency for adhesiveness to improve. For this reason, the minimum of the molar ratio (T) of the structural unit T becomes like this. More preferably, it is 0.28 or more, More preferably, it is 0.30 or more. On the other hand, the upper limit of the molar ratio (T) of the structural unit T is preferably 0.75 or less, more preferably 0.60 or less, still more preferably 0.50 or less, and particularly preferably 0.40 or less.

It is preferable that the molar ratio (V) of the structural unit V with respect to the sum total of the structural unit T, the structural unit H, and the structural unit V is 0.60 or less. Thereby, it becomes the tendency for adhesiveness to improve. For this reason, the upper limit of the molar ratio (V) of the structural unit V becomes like this. Preferably it is 0.58 or less, More preferably, it is 0.56 or less. On the other hand, the lower limit of the molar ratio (V) of the structural unit V is preferably 0.20 or more, more preferably 0.30 or more, still more preferably 0.40 or more, still more preferably 0.50 or more.

It is preferable that the molar ratio (H) of the structural unit H with respect to the sum total of structural unit T, structural unit H, and structural unit V is 0.05 or more and 0.50 or less. From the viewpoint of solubility, the lower limit of the molar ratio (H) of the structural unit H is more preferably 0.07 or more, still more preferably 0.09 or more. On the other hand, from the viewpoint of heat resistance, the upper limit of the molar ratio (H) of the structural unit H is more preferably 0.40 or less, still more preferably 0.30 or less, still more preferably 0.20 or less, and particularly preferably 0.12 or less.

It is preferable that the ratio (molar ratio (V)/molar ratio (T)) of the molar ratio (V) to the molar ratio (T) is 0.20 or more and 3.50 or less. By controlling molar ratio (V)/molar ratio (T) to the said range, it becomes the tendency for adhesiveness to improve. Moreover, coloring of resin at the time of high temperature heating can be prevented. The lower limit of the molar ratio (V)/molar ratio (T) is more preferably 0.50 or more, still more preferably 0.80 or more, still more preferably 1.00 or more, and particularly preferably 1.30 or more. On the other hand, the upper limit of molar ratio (V)/molar ratio (T) becomes like this. More preferably, it is 3.00 or less, More preferably, it is 2.50 or less, More preferably, it is 2.00 or less.

It is preferable that the ratio (molar ratio (H)/molar ratio (T)) of the molar ratio (H) to the molar ratio (T) is 0.10 or more and 0.80 or less. By controlling molar ratio (H)/molar ratio (T) in the said range, it becomes the tendency for adhesiveness to improve. The lower limit of the molar ratio (H)/molar ratio (T) is more preferably 0.20 or more, still more preferably 0.24 or more, still more preferably 0.28 or more. On the other hand, the upper limit of the molar ratio (H)/molar ratio (T) is more preferably 0.60 or less, still more preferably 0.50 or less, still more preferably 0.40 or less.

The molar ratio of each structural unit of the crystalline fluororesin can be determined by NMR measurement described in Examples below. For the calculation of the molar ratio, for example, Eric B. Twum et al., “Multidimensional 19F NMR Analysis of Terpolymers from Vinylidene Fluoride (VDF)-Hexafluoropropylene (HFP)-Tetrafluoroethylene (TFE)”, Macromolecules, 2015, Vol. 48, 11, p.3563-3576.

Although it is preferable that the said crystalline fluororesin contains the structural unit T derived from tetrafluoroethylene, the structural unit H derived from hexafluoropropylene, and the structural unit V derived from vinylidene fluoride, the structural unit T and the structural unit H , and other structural units other than the structural unit V may be included. As another structural unit, the structural unit derived from ethylene, the structural unit derived from perfluoroalkyl vinyl ether, the structural unit derived from chlorotrifluoroethylene, etc. are mentioned, for example.

The total molar ratio of the structural unit T, the structural unit H, and the structural unit V to all the structural units of the crystalline fluororesin is preferably 0.70 or more, more preferably 0.80 or more, still more preferably 0.90 or more, particularly preferably preferably 0.95 or more, and most preferably 1. That is, it is most preferable that the precursor unit of the crystalline fluororesin consists of the structural unit T, the structural unit H, and the structural unit V (which is unmodified THV). Thereby, it can be made easy to improve heat-resistance deformability.

It is preferable that the weight average molecular weights of the said crystalline fluororesin are 50,000 or more and 1,000,000 or less. Since the viscosity at the time of melting can be made high by making a weight average molecular weight into 50,000 or more, the shape change of the sealing resin at the time of LED lighting can be suppressed. The lower limit of the weight average molecular weight of the crystalline fluororesin is more preferably 100,000 or more, still more preferably 200,000 or more, still more preferably 250,000 or more, particularly preferably 300,000 or more. On the other hand, solubility improves by making the weight average molecular weight of the said crystalline fluororesin into 1,000,000 or less. The upper limit of the weight average molecular weight of the said crystalline fluororesin becomes like this. More preferably, it is 800,000 or less, More preferably, it is 500,000 or less, More preferably, it is 450,000 or less, Especially preferably, it is 400,000 or less. In addition, a weight average molecular weight is a standard polystyrene conversion value.

The crystalline fluororesin may be either a random copolymer or a block copolymer, but is preferably a random copolymer. Thereby, the crystallinity of the structural unit T or the structural unit V can be suppressed, and transparency is easy to ensure.

The refractive index of the said crystalline fluororesin becomes like this. Preferably it is more than 1.34, More preferably, it is 1.35 or more, More preferably, it is 1.36 or more. Thereby, the difference in refractive index between the ultraviolet light emitting element and the sealing part described later can be reduced, total reflection at the interface between the ultraviolet light emitting element and the sealing part can be reduced, and the light extraction efficiency can be improved. In addition, the light extraction efficiency refers to the efficiency with which light generated from the ultraviolet light emitting element is extracted to the outside of the ultraviolet light emitting element. In addition, the upper limit of the refractive index of the crystalline fluororesin of this invention is 1.45 or less, for example, Preferably, 1.40 or less may be sufficient. The refractive index may use a numerical value described in a catalog value or a general physical property table, and can be measured with a commercially available Abbe refractometer or an ellipsometer.

The content of the crystalline fluororesin with respect to 100 parts by mass of the total mass (solid content) of the resin contained in the resin composition is preferably 50 mass % or more, more preferably 75 mass % or more, and still more preferably 90 mass % or more. and 99 mass % or more is especially preferable, and it is most preferable that it is 100 mass %. That is, it is most preferable that resin contained in the resin composition used by this invention consists only of a crystalline fluororesin. In addition, when 2 or more types of crystalline fluororesin are contained, content of a crystalline fluororesin refers to the total content of a crystalline fluororesin.

It is preferable that melting|fusing point of the said crystalline fluororesin is 90 degreeC or more and 278 degrees C or less. When melting|fusing point is 90 degreeC or more, melting of the sealing member by heat_generation|fever of an electronic element can be prevented. The lower limit of melting|fusing point of a crystalline fluororesin becomes like this. More preferably, it is 100 degreeC or more, More preferably, it is 110 degreeC or more, More preferably, it is 115 degreeC or more. On the other hand, when melting|fusing point is 278 degrees C or less, sealing of the electronic element by heat melting of a crystalline fluororesin can be made easily. Moreover, melting of the bump at the time of sealing by heat melting can be prevented. The upper limit of melting|fusing point of a crystalline fluororesin becomes like this. More preferably, it is 200 degrees C or less, More preferably, it is 170 degrees C or less, More preferably, it is 150 degrees C or less, Especially preferably, it is 130 degrees C or less. For the melting point of the crystalline fluororesin used in the present invention, a catalog value may be used, for example, using a differential scanning calorimeter (DSC, manufactured by Hitachi High-Tech Sciences Co., Ltd.) at -50°C at a temperature increase rate of 10°C/min. It can be calculated|required by changing to the temperature of 200 degreeC, and measuring the melting peak temperature (Tm) from the melting curve obtained by this. In addition, the crystalline fluororesin used in the present invention is solid at room temperature, has no tackiness on the surface after sealing, has sufficient hardness, and can exhibit appropriate fluidity by heating above the melting point. Even a single layer can seal an electronic element.

The resin composition contains substantially no volatile components. It is preferable that the volatile component contained in a resin composition is 5 mass % or less, More preferably, it is 3 mass % or less, More preferably, it is 1 mass % or less.

The content rate of a volatile component can be measured by thermal analysis. The content rate of the volatile component contained in the resin composition can be measured using a differential thermal thermogravimetric simultaneous measurement apparatus etc., the resin composition is heated up, the mass of the resin composition at 30 degreeC time, and the resin composition at 300 degreeC time point It can measure and calculate|require by dividing the mass of the resin composition at the time of 30 degreeC, and the mass difference of the resin composition at the time of 300 degreeC by the mass of the resin composition at the time of 30 degreeC by measuring the mass of with. Moreover, although water, a solvent, etc. are mentioned as a volatile component, What is necessary is just to analyze the said volatile component using a gas mass spectrometer together when you want to specify a volatile component.

In the electronic component of the present invention, the thickness of the resin composition covering the electronic device mounted on the wiring substrate (hereinafter simply referred to as “thickness of the resin composition”) can be increased by using the resin composition substantially free of fillers. have. Since it does not contain a filler substantially, compared with the case where a filler is included, transparency can be maintained and the light condensing property of a lens can be improved. Moreover, when the thickness of a resin composition becomes thick, the protective performance of the electronic element with respect to gas barrier property and a mechanical impact from the outside will improve. Here, substantially free of a filler means that the filler concentration contained in the resin composition is 5 mass% or less, preferably 3 mass% or less, more preferably 1 mass% or less, still more preferably 0 mass%. .

It is preferable that the resin composition of this invention is excellent in transparency, and it is especially high in the transmittance|permeability of an ultraviolet region. For example, it is preferable that the transmittance|permeability of the light of wavelength 265nm in the resin composition of thickness 1.5mm is 50 % or more, More preferably, it is 55 % or more, More preferably, it is 60 % or more, Especially preferably, it is 65 % or more. to be. Also about the resin composition after sealing, it is preferable that the transmittance|permeability in sealed thickness is the said range.

In addition, the resin composition may contain the filler as needed. The filler can prevent thermal decomposition of the crystalline fluororesin. Examples of the filler include inorganic fillers such as metal, metal fluoride, metal oxide, metal phosphate, metal carbonate, metal sulfonate, metal nitrate, metal nitride, and boron nitride. A filler may be used by 1 type, and may use 2 or more types together. A preferable filler is a metal fluoride. The metal fluoride has a small refractive index difference with the crystalline fluororesin, and when sealing the light emitting element, light extraction efficiency can be improved.

Calcium fluoride, barium fluoride, strontium fluoride, lithium fluoride, magnesium fluoride, sodium fluoride, cryolite etc. are mentioned as a metal fluoride, Magnesium fluoride is preferable. These metal fluorides may be used by 1 type, and may use 2 or more types together.

It is preferable that the particle diameter of an inorganic filler is 500 micrometers or less. When the inorganic filler is 300 µm or less, thermal decomposition accompanying a temperature rise of the crystalline fluororesin can be reduced. On the other hand, it is preferable that the particle diameter of an inorganic filler is 0.5 micrometer or more. When the particle size of the inorganic filler is 0.5 µm or more, scattering of light between the crystalline fluororesin and the inorganic filler can be suppressed, and the transparency of the crystalline fluororesin is excellent. Particle size of the inorganic filler is a particle diameter D ₅₀ of volume cumulative frequency 50% by the laser diffraction method.

It is preferable that the difference of the refractive index of a crystalline fluororesin and an inorganic filler is 0.05 or less. By reducing the difference in refractive index in this way, light scattering on the surface of the inorganic filler (the interface between the surface of the inorganic filler and the crystalline fluororesin in the composition) can be suppressed, so that the light extraction efficiency can be improved. have. The difference in refractive index between the crystalline fluororesin and the inorganic filler is more preferably 0.04 or less, still more preferably 0.03 or less. In addition, although the minimum of the difference of the refractive index of a crystalline fluororesin and an inorganic filler is not specifically limited, 0.001 or more may be sufficient, for example. The refractive index of the inorganic filler may be a catalog value or a numerical value described in a general physical property table, and can be measured with an Abbe refractometer, an ellipsometer, or the like.

When a resin composition contains a filler, it is preferable that the quantity of the filler with respect to a total of 100 mass parts of a crystalline fluororesin and a filler is 1 mass part or more and 60 mass parts or less. When the amount of the filler is 1 part by mass or more, thermal decomposition of the crystalline fluororesin can be easily prevented. The lower limit of the amount of filler is more preferably 10 parts by mass or more, still more preferably 15 parts by mass or more. On the other hand, when the amount of the filler is 60 parts by mass or less, the adhesiveness of the crystalline fluororesin is easily exhibited. The upper limit of the quantity of a filler becomes like this. More preferably, it is 50 mass parts or less, More preferably, it is 45 mass parts or less.

The resin composition containing a filler can be prepared by mixing a crystalline fluororesin and a filler. As the adjustment method, a method of mixing and cooling a crystalline fluororesin in a molten state and a filler, a method of mixing with an inorganic filler in the presence of a solvent for dissolving or dispersing the crystalline fluororesin, a method of mixing in the presence of the solvent, the solvent, The method of removing by filtration, concentration, etc. are mentioned.

Examples of the solvent include ester solvents such as methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl propionate, and glycol ester obtained by adding an acetic acid group to glycol ether; ketone solvents such as acetone, methyl ethyl ketone, diethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether solvents such as diethyl ether, dipropyl ether, butyl ether, glycol ether and tetrahydrofuran; amide solvents such as N,N-dimethylformamide, N,N-dibutylformamide, and N,N-dimethylacetamide; lactam solvents such as N-methyl-2-pyrrolidone; and the like. Among these, an ester solvent, a ketone solvent, and an ether solvent are preferable, and an ester solvent is more preferable. These organic solvents may be used by 1 type, and may use 2 or more types together.

When using a solvent for mixing, the quantity of the solvent with respect to 100 mass parts of crystalline fluororesin becomes like this. Preferably they are 100 mass parts or more and 5000 mass parts or less. When it is 100 mass parts or more, it can be made easy to melt|dissolve or disperse|distribute a crystalline fluororesin. The quantity of a solvent becomes like this. More preferably, it is 200 mass parts or more, More preferably, it is 400 mass parts or more, More preferably, it is 600 mass parts or more. On the other hand, when it is 5000 mass parts or less, the number of times of application|coating in sealing an ultraviolet light emitting device can be reduced. The quantity of a solvent becomes like this. More preferably, it is 2000 mass parts or less, More preferably, it is 1200 parts mass or less, More preferably, it is 1000 mass parts or less.

When a solvent is used for mixing, the solvent is removed after mixing. Although the method of removing a solvent is not specifically limited, The method of applying heat, the method of setting it as reduced pressure, and the method of combining them are preferable. The residual amount of the solvent after removal is 5 mass % or less with respect to the resin composition, Preferably it is 3 mass % or less, More preferably, it is 1 mass % or less, More preferably, it is 0.5 mass % or less, More preferably, 0.1 mass% or less.

In a preferred embodiment in which THV or a modified product thereof is used for the crystalline fluororesin, the resin composition may contain other fluororesins, additives, and the like.

As another fluororesin, Preferably, a crystalline fluororesin is mentioned, Specifically, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene-hexafluoropropylene copolymer ( FEP), a chlorotrifluoroethylene polymer (PCTFE), etc. are mentioned. These other fluororesins may be used by 1 type, and may use 2 or more types together.

The amount of the other fluororesin relative to 100 parts by mass of THV is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, still more preferably 2 parts by mass or less, particularly preferably 1 part by mass or less, most preferably is 0 parts by mass. That is, it is most preferable that the fluororesin contained in the resin composition of this invention consists of THV. Accordingly, the difference in refractive index between the resins is reduced, so that the light extraction efficiency can be improved.

The total content of the total fluororesin (the sum of THV and other fluororesins) and the inorganic filler with respect to the total mass of the resin composition (solid content) is preferably 90% by mass or more, more preferably 95% by mass or more, and 97% by mass It is more preferable that it is more than it, and it is especially preferable that it is 99 mass % or more. Thereby, the adhesiveness of a fluororesin and the thermal conductivity of an inorganic filler become easy to exhibit.

(4) sealing

In the present invention, as described above, the resin composition is provided above the electronic element mounted on a wiring substrate (also referred to as a package), and then the resin composition is heated to a melting point or higher to thereby convert the electronic element to the resin. The electronic device is sealed by covering it with the composition. By sealing with a resin composition, an electronic element can be interrupted|blocked from external oxygen and moisture. 4 is a schematic cross-sectional view showing an example in which the ultraviolet light emitting device 2 of FIG. 2 is sealed to form an electronic component, and FIG. 3 is a sealing process of manufacturing the electronic component of FIG. 4 by sealing the electronic device mounting package of FIG. It is a schematic sectional drawing which shows an example of .

In the electronic component 1a of FIG. 4, from the lower surface (electrodes 10, 11) to the upper surface (element substrate 15) of the ultraviolet light emitting element 2 of the ultraviolet light emitting element mounting package 6 shown in FIG. The sealing part 3a coat|covered with the resin composition is formed, and this electronic component 1a is manufactured through the sealing process shown in FIG. 3 as mentioned above.

FIG. 3 shows a state in which the resin sheet 3' is disposed on the upper surface of the electronic device mounting package of FIG. 2 . The resin sheet 3' is manufactured by shape|molding the above-mentioned resin composition into sheet shape beforehand. As the molding method of the resin sheet 3', various known molding methods can be adopted, and molding methods using a molten fluororesin or a dissolved fluororesin, such as a press molding method, an extrusion molding method, an injection molding method, a blow molding method, a coating method, etc. can be hired The obtained resin sheet 3' is provided above the ultraviolet light emitting element 2, as shown in FIG. Next, by heating the resin sheet 3' to a melting point or higher, the resin sheet 3' (resin composition) is melted and dropped under its own weight. Then, the dropped resin composition covers the entirety of the ultraviolet light emitting element 2 (to form the sealing portion 3a), so that the ultraviolet light emitting element 2 can be sealed. Finally, the electronic component 1a is cooled to solidify the resin composition covering the entire ultraviolet light emitting element 2 .

In addition, although it is preferable to use a resin sheet as above-mentioned for sealing by a resin composition, use of a resin sheet is not essential. For example, sealing is possible similarly also by heating more than melting|fusing point of a resin composition after spread|dispersing a powdery resin composition on the upper surface of an electronic element.

Although heating of the resin composition, such as a sheet form and powder form, may be performed in oxygen containing atmosphere, such as air|atmosphere, it is preferable to perform in inert gas atmosphere, such as in nitrogen atmosphere and argon atmosphere. In addition, although heating of a resin composition may be performed under atmospheric pressure, it is also preferable to perform under reduced pressure, such as in a vacuum. When a predetermined resin composition is heated under reduced pressure, the bubbles remaining in the resin composition after sealing are reduced and transparency is improved.

+10 degreeC or more of melting|fusing point of a resin composition is preferable, and, as for the heating temperature of a resin composition (powder, resin sheet, etc.), melting|fusing point +20 degreeC or more is more preferable. The upper limit of heating temperature is, for example, 278 degrees C or less, More preferably, it is 250 degrees C or less, More preferably, it is 200 degrees C or less, Especially preferably, it is 150 degrees C or less.

It is preferable that they are 10 minutes or more and 20 hours or less, and, as for the heating time of a resin composition (powder, resin sheet, etc.), it is more preferable that they are 30 minutes or more and 10 hours or less.

By using the resin composition which does not contain a filler substantially, the thickness of a resin composition can be made into 0.5 mm or more. It is preferable that the thickness of a resin composition is 0.5 mm or more, More preferably, it is 0.7 mm or more, More preferably, it is 0.8 mm or more, Especially preferably, it is 1.0 mm or more. The thickness here means the thing of the distance (T1 in FIG. 4) from the bottom surface of the package in which the electronic element is provided to the maximum height of a resin composition, as shown in FIG. The thickness of the resin composition can be calculated|required by observing the side projection image of the electronic component after sealing with an optical microscope like description in an Example, for example. When the thickness of a resin composition is 0.5 mm or more, it is more preferable that the resin composition used contains a crystalline fluororesin, and does not contain a volatile component and a filler substantially.

In an electronic component having an ultraviolet light emitting element, as long as the resin composition encapsulates the ultraviolet light emitting element, the sealing portion can take various shapes, for example, a lens shape, a plate shape, a truncated cone shape, a cylindrical shape, a hemispherical shape, and a semi-spherical shape. Although shapes, such as an ellipsoidal shape, are mentioned, It is preferable to use the upper surface of an ultraviolet light emitting element as a lens shape (the upper surface of an ultraviolet light emitting element as a convex curved surface) as a condensing lens. The electronic component 1a of FIG. 4 is an example in which the sealing part 3a itself by the resin composition swells to an upper surface, and forms the convex curved surface. For this reason, in the sealing process (FIG. 3), a convex-shaped condensing lens is formed by the surface tension at the time of melting using the resin sheet 3' or resin powder of a sufficient volume volume.

In addition, the electronic component 1c of FIG. 6 is an example in which the sealing part 3b became plate shape. This electronic component 1c can be formed by melt-sealing using the resin sheet 3' or resin powder of the volume substantially equal to the volume in a bank. 6, when the upper surface of the sealing part 3b does not have a convex curved surface, for example, like the electronic component 1b of FIG. 5, on the upper part of the sealing part 3b, a convex curved surface You may laminate|stack the condensing lens component 7 which has In addition, although not shown in a figure, you may mount an electronic element on the wiring base material of a chip-on-board type, and you may further seal.

In Figs. 4 to 6, an example of sealing the resin composition so as to cover the entire ultraviolet light emitting element in one package is given. By disposing a resin sheet and melting the resin sheet by heating it to a melting point or higher in the same manner as in the manufacturing process in FIG. 4 , a plurality of ultraviolet light emitting elements can be simultaneously covered with the resin composition. Then, similarly to the manufacturing process in FIG. 4, the resin composition is cooled and solidified. At this point in time, each package is in a state connected by the covered resin composition, but the connected packages can be separated by cutting the resin composition connecting the packages with a cutter or the like.

(5) Irradiation

When sealing with the resin composition containing a crystalline fluororesin, the heat deformation resistance after sealing may be inadequate. Therefore, after sealing with a resin composition, it is preferable to irradiate the said resin composition with radiation. When a resin composition containing a crystalline fluororesin is irradiated with radiation, the surface of the resin composition (the surface of the sealing portion) can be cured, and even if heat from the electronic device is large, thermal deformation of the sealing portion can be suppressed. For this reason, for example, when a light emitting element is used as an electronic element, the orientation of light does not change, but equivalent light can be extracted over a long period of time.

Examples of the radiation include ultraviolet rays, X-rays, γ-rays, electron beams, and ion beams, and electron beams are preferable. An electron beam is excellent in control of the hardening depth, and it becomes easy to improve heat-resistance deformation|transformation resistance without adversely affecting the characteristics of the whole sealing part.

(6) condensing lens

The electronic component manufactured by the manufacturing method of this invention may have a condensing lens as shown in FIGS. 4 and 6, and when it has a condensing lens, it may attach the condensing lens component 7 as shown in FIG. The condensing lens component 7 is made of, for example, silica glass, borosilicate glass, or the like.

(7) Electronic components

As an electronic component manufactured by the manufacturing method of this invention, the electronic component provided with a light emitting element is preferable, and the electronic component provided with an ultraviolet light emitting element is more preferable. The electronic component provided with the ultraviolet light emitting element can be utilized, for example, an analysis device, a photocatalyst device, a phototherapy device, a banknote appraisal device, an air/water sterilization purification device, a UV resin curing device, etc.

Example

Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited by the following examples, needless to say, and is carried out with appropriate changes within a range that can be suitable for the gist of the preceding and latter period. It is of course also possible, and they are all included in the technical scope of the present invention.

(1) Composition of fluororesin

In Examples 1, 3, and 4 below, tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer (THV) was used. The structural unit T derived from tetrafluoroethylene, the structural unit H derived from hexafluoropropylene, and the structural unit V derived from vinylidene fluoride in THV, each molar ratio was calculated|required by the following NMR measurement.

Measuring device: JEOL ECZ-400

Sample: About 60mg/0.8ml ACT-d6

IS: 0.01 mL of 4-chlorobenzotrifluoride

Measuring mode: ¹ H, ¹⁹ F

Relief Time: ¹ H 30 sec, ¹⁹ F 20 sec

The number of units of the structural unit H: ¹⁹ Calculated by dividing the integral ratio _{of CF 3} in F-NMR _{by 3 (CF 3} integral ratio/3)

Number of units of structural unit V: Calculated by dividing the integral ratio _{of CH 2} ^{in 1} H-NMR _{by 2 (CH 2} integral ratio/2)

Number of units of the structural units T: ¹⁹ F-NMR Calculated from sum The integration of the CF _2, by dividing the minus CF ₂ of the structural unit V derived from a CF ₂ of the structural unit H derived from 4 of the (CF ₂ total ever secretion -The number of units in the constituent unit V × 2 the number of units in the constituent unit H × 2)/4

The crystalline fluororesin (trade name: Dainion THV221AZ; manufactured by 3M, melting point 120° C.) used in the Examples had a molar ratio of the structural unit T of 0.35, a molar ratio of the structural unit H of 0.11, and a molar ratio of the structural unit V of 0.54. Further, in the crystalline fluororesin (trade name: Dainion THV500GZ; manufactured by 3M, melting point 165° C.), the molar ratio of the structural unit T was 0.55, the molar ratio of the structural unit H was 0.13, and the molar ratio of the structural unit V was 0.33.

(2) X-ray diffraction measurement

When X-ray diffraction measurement was performed on THV221AZ and PCTFE used in Example 2 below, THV221AZ, THV500GZ and PCTFE were crystalline.

Device: MiniFlex600 (manufactured by Rigaku Co., Ltd.)

Wavelength: CuKα

Voltage: 40kV

Current: 15mA

Measuring range: 2θ=3~80°

Measurement temperature: room temperature (about 25°C)

(3) Content rate of volatile component in resin composition

The temperature of the sample (THV221AZ and PCTFE, which are crystalline fluororesins) is raised, and the mass of the sample at 30°C and the mass of the sample at 300°C are measured, and the mass of the sample at 30°C and at 300°C The ratio of the volatile component in the sample was calculated|required by dividing the difference with the mass of the sample by the mass of the sample at the time of 30 degreeC. The apparatus and measurement conditions used for the measurement are as follows. The ratio of the volatile component in THV221AZ was 0.55 mass %. In addition, the ratio of the volatile component in THV500GZ was 0.99 mass %. Moreover, the ratio of the volatile component in PCTFE was 0.28 mass %.

Measuring device: TG/DTA6200 (manufactured by SI Nanotechnology Co., Ltd.)

Measuring Atmosphere: Atmosphere

Temperature rise range: 30℃ to 500℃

Temperature increase rate: 10°C/min

(4) tensile strength

Two identical samples were prepared, and the strength when each sample was fractured under conditions of a load cell 500N and a tensile rate of 5 mm/min was measured using a "small tabletop tester EZ-L" manufactured by Shimadzu Corporation. The average value of two measurement results was made into the tensile strength of the sample.

Example 1

A heat-resistant tape was used at one end on a 76×26 mm (thickness 0.8 to 1.0 mm) slide glass to make a 26×25 mm area surrounded by the heat-resistant tape. Next, a crystalline fluororesin (trade name: "THV221AZ") is dissolved in propyl acetate to prepare a 9 mass % resin solution, 200 μl of the resin solution is applied to a 26 × 25 mm area surrounded by heat-resistant tape, and then 200 ° C. was dried for 3 hours. Then, a slide glass was placed so that one end overlapped on the resin, and a sample was produced by heating at 200°C for 3 hours while applying a load of 100 g to perform fusion. However, the slide glass above the area was provided so that the other end of the slide glass above the area did not overlap the slide glass below the area when viewed from above. The tensile strength of the sample was 73.9N.

Example 2

A PCTFE (melting point 210°C) film (Toho Chemical Co., Ltd.) having a thickness of 25×25 mm and a thickness of 75 μm was installed on one end of the slide glass. Next, a slide glass was placed so that one end overlapped on the PCTFE film, and a sample was produced by heating at 200° C. for 3 hours while applying a load of 100 g to perform fusion. However, the slide glass above the region was provided so that the other end of the glass slide above the PCTFE film did not overlap the glass slide below the PCTFE film when viewed from above. The tensile strength of the sample was 58.7N.

Comparative Example 1

A sample was produced in the same manner as in Example 1 except that Cytop (trademark; manufactured by AGC, 9% by mass) which is an amorphous fluororesin was used instead of THV. The tensile strength of the sample was 14.3N.

Example 3

3.5 g of crystalline fluororesin (trade name "THV221AZ") was placed in a 48 mm diameter PFA (tetrafluoroethylene-perfluoroalkylvinyl ether copolymer) petri dish, and heated at 200°C for 3 hours to prepare a fluororesin sheet. created, and a rectangular sheet having a size of 3.0 x 3.0 mm was cut out with a cutter knife.

The sheet is placed on the LED package (KD-LA9R48, manufactured by Kyocera Corporation), the fluororesin is melted by heating at a temperature of 200° C. for 3 hours, and the inside of the package is filled (sealed) with the fluororesin, so that the resin composition after sealing is The thickness was 1.47 mm, and the electronic component sealed with the resin composition which does not contain a filler was obtained. The thickness of the resin composition was computed with the following method. By observing the sealed electronic component from the side with an optical microscope (VHX-2000, manufactured by Gience Corporation), the length of the resin composition portion protruding outward from the package (T2 in Fig. 4) is obtained, and the side wall of the package from the drawing was calculated|required (T3 (thickness of the depth part of a package) in FIG. 4) of the hidden part, and the value which added both was made into the thickness (T1 in FIG. 4) of the resin composition.

Example 4

3.5 g of crystalline fluororesin (trade name: "THV221AZ") was placed in a 48 mm diameter PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer) petri dish, and heated at 200°C for 3 hours to prepare a fluororesin sheet. created, and a rectangular sheet having a size of 10.5 x 10.5 mm was cut out with a cutter knife.

A flat panel LED package with a width of 3.5 mm (YCL-2X97ES, manufactured by Yoko Corporation) is placed in close contact with each other (9 sheets in total), the sheet is placed on it, and heated at a temperature of 200°C for 3 hours. The crystalline fluororesin was melted, and all nine packages were covered (sealed) with the crystalline fluororesin. Also, nine electronic components were obtained by cutting with a cutter along the boundary line between each package. The resin composition did not contain a filler, and when the thickness of the resin composition in one central electronic component was computed by the method similar to Example 3, the thickness of the resin composition was 1.38 mm.

Example 5

[Production of filler]

_{MgF 2} powder manufactured by Pear Optics Co., Ltd. (part number: crushed MFGR3-6 and passed through a 60 mesh sieve, D ₅₀ =218 µm, refractive index 1.38 at 589 nm) was pulverized with a ball mill under the following conditions By doing so, the particle size was controlled.

<Grinding conditions>

Grinding device: Ball mill ANZ-51S (manufactured by Nitto Chemical)

Container: 250ml Eyeboy (Azuwan Co., Ltd. Part No. 5-002-03)

Media: 400 g zirconia ball 10 mm Φ (Azuwan Co., Ltd. part number: 5-4060-14)

MgF ₂ powder: 100 g

Solvent: 100 g of isopropyl alcohol (IPA, manufactured by Nacalai Tech)

RPM: 58rpm

Grinding time: 4 hours

[Measurement of particle size distribution of _{MgF 2 powder (filler)]}

The particle size distribution measurement of the MgF ₂ powder (filler) is obtained by using a laser diffraction method under the following conditions _{to obtain an integrated distribution curve of the particle size of each prepared MgF 2 filler, and the particle size D 50} which is the particle size at a volume accumulation frequency of 50% was carried out in a way to obtain The particle size D ₅₀ of the MgF _{2 powder (filler) was 112 µm.}

Measuring device: LS230 (manufactured by Beckman Coulter Co., Ltd.)

Dispersion solvent: deionized water + neutral detergent

Dispersion method: stirrer stirring + ultrasonic irradiation 3 minutes

Refractive Index (MgF ₂ ): 1.40-0.20i

<Preparation of resin solution (THV221 solution)>

The water bath was heated up to 85 degreeC, measuring and putting 160 g of butyl acetate (made by Fujifilm Wako Pure Co., Ltd.) into the separable flask set in the water bath, and stirring it. While stirring, 40 g of THV221AZ (manufactured by 3M, refractive index with respect to light having a wavelength of 589 nm measured with an ellipsometer: 1.36, melting point: 115° C., weight average molecular weight: 384,000) was gradually added and dissolved to prepare a resin solution. It was 19.5 mass % when the obtained solution was heated at 120 degreeC for 3 hours, and solid content concentration was calculated|required from the residue.

<Production of Pellets of Resin-Filler Composite>

Into a resin solution having a concentration of 19.5% by weight prepared in the above step in di Castello cup of 35g, 250ml, there was added to the above MgF ₂ powder particle diameter D ₅₀ is 112㎛ as filler to 2.76g. The concentration of the filler is 20% by volume when ^{the density of the resin is calculated as 1.95 g/cm 3} , and the density of the _{MgF 2} ^{powder is calculated as 3.15 g/cm 3 .} This solution was mixed with Awatori Rentaro ARV-310 for 2 minutes at a rotation speed of 2000 rpm three times, mixing the solution and the filler, and then isopropyl alcohol (IPA, Naka) as a poor solvent 70 g (manufactured by Litex Co., Ltd.) was added to precipitate a fluororesin containing a filler. Precipitating resin was taken out from the screw pipe, it was made to dry with a dryer, and the solidified material of the resin composition was obtained. The obtained sample was cut into the size of about 2 mm by using scissors, and it was set as the pellet.

<Preparation of sheet of resin-filler composite body>

The pellets obtained above were hot-pressed at 200° C. using a mold to prepare a sheet having a thickness of 1.5 mm and a width of 50 mm, and a rectangular sheet having a size of 10×10 mm was cut out with a cutter knife.

The flat panel LED package (YCL-2X97ES, manufactured by Yoko Corporation) of 3.5 mm in width and length is placed in close contact with each other (4 sheets in total), the sheet is installed thereon, and the filler is heated at 200°C for 3 hours. was melted, and all four packages were covered (sealed) with the crystalline fluororesin. Furthermore, four electronic components were obtained by cutting with a cutter along the boundary line of each package. When the thickness of the resin composition in one electronic component was computed by the method similar to the method of Example 3, the thickness of the resin composition was 1.42 mm.

<Measurement of transmittance of sheet>

A sheet of THV221AZ containing no filler having a thickness of 1.5 mm and a width of 50 mm was produced by hot pressing, and the transmittance at a plurality of wavelengths was measured under the following conditions. Moreover, the transmittance|permeability of the resin sheet containing the filler produced above was also measured similarly.

Measurement conditions for transmittance

Apparatus: UV-3600 manufactured by Shimadzu Corporation

Attachment: integrating sphere ISR-3100

Background measurement: waiting

A measurement result is shown in Table 1.

Example 6

27 electronic components described in Example 3 were produced. 27 electronic components WHEREIN: The average thickness of the resin composition after sealing was 1.5 mm. About 27 produced electronic components, when it observed at 50 times magnification with the optical microscope (VHX-2000, the Geiens Corporation make) from upper direction, generation|occurrence|production of a bubble was confirmed in 9 electronic components. In addition, confirmation with an optical microscope WHEREIN: When there existed a bubble with a maximum diameter of 100 micrometers or more, it was judged that a bubble was generate|occur|produced.

Example 7

27 resin-sealed electronic components were produced in the same manner as in Example 6 except that the crystalline fluororesin was changed from THV221AZ to THV500GZ. The average thickness of the resin composition after sealing was 1.7 mm. About 27 electronic components, when it carried out similarly to the method described in Example 6, and confirmed the presence or absence of generation|occurrence|production of a bubble, generation|occurrence|production of bubble was confirmed in 24 pieces.

Example 8

A fluororesin sheet having a thickness of 100 µm was prepared by hot pressing a crystalline fluororesin (trade name: “THV221AZ”) using a mold, and a rectangular sheet having a size of 10×10 mm was cut out with a cutter knife.

The crystalline fluororesin THV221AZ film having a thickness of 10×10 mm and a thickness of 100 μm was provided at one end of a polyimide film (manufactured by Azuwan Corporation, model number HJA-A4-100 μm) having a thickness of 20×75 mm and a thickness of 100 μm. Next, the polyimide film was put on the polyimide film so that one end might overlap, and it fusion|fusion was performed by heating at 200 degreeC for 1 hour, applying a load of 100 g, and the sample was produced. However, the polyimide film above the region was provided so that the other end of the polyimide film above the region did not overlap the polyimide film below the region when viewed from above. The sample did not break even when the tensile strength exceeded 200N.

Example 9

A sample was produced in the same manner as in Example 8 except that THV500GZ was used instead of THV221AZ as the crystalline fluororesin. The tensile strength of the sample was 113.5N. In the tensile test of Example 9, the interface between the polyimide film and the polyimide film peeled and fractured.

1a, 1b, 1c electronic components
2 Ultraviolet light emitting element
3a, 3b resin composition
Thickness of T1 resin composition
Length of the portion of the resin composition protruding outward from the T2 package
Length of the depth part of the T3 package

Claims (9)

A step of providing a resin composition above an electronic device mounted on a wiring substrate;
As a manufacturing method of an electronic component which has the process of covering the said electronic element with the said resin composition by heating the said resin composition above melting|fusing point,
The said resin composition contains a crystalline fluororesin and does not contain a volatile component substantially, The manufacturing method of the electronic component characterized by the above-mentioned. The method of claim 1,
The melting point of the crystalline fluororesin is 278° C. or less. 3. The method of claim 1 or 2,
The said crystalline fluororesin is a manufacturing method in which atoms other than carbon and fluorine are couple|bonded with some carbon atoms. The method of claim 1,
The production method wherein the crystalline fluororesin is a tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer. 5. The method of claim 4,
The manufacturing method whose molar ratio of the structural unit T with respect to the sum total of the structural unit T derived from tetrafluoroethylene, the structural unit H derived from hexafluoropropylene, and the structural unit V derived from vinylidene fluoride is 0.50 or less. The method of claim 1,
A manufacturing method wherein the electronic device is an LED. An electronic component mounted on a wiring substrate is an electronic component covered with a resin composition,
The said resin composition contains a crystalline fluororesin, and does not contain a volatile component and a filler substantially,
The thickness of the said resin composition is 0.5 mm or more electronic component. 8. The method of claim 7,
The electronic component wherein the crystalline fluororesin is a tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer. 9. The method of claim 8,
The electronic component whose molar ratio of the structural unit T with respect to the sum total of the structural unit T derived from tetrafluoroethylene, the structural unit H derived from hexafluoropropylene, and the structural unit V derived from vinylidene fluoride is 0.50 or less.

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