KR20220004551A - Molding apparatus for resin and manufacturing method of resin molded article - Google Patents

Abstract

The present invention provides a resin molding device and a method for manufacturing a resin molded product in which a supply pattern of a resin material can be easily changed. A resin molding device (D) is equipped with a resin supply mechanism (21) that supplies a resin material to a supply object (F), a molding mold (M) that includes an upper mold and a lower mold (LM) facing the upper mold, a mold clamping mechanism that clamps the molding mold (M) with the supply object (F) placed between the upper mold and the lower mold (LM), a display unit (6) that graphically displays the resin material supply state based on the resin material supply input to the supply object (F), and a control unit (5) that controls the operation of the resin supply mechanism (21) and the display unit (6).

Description

A resin molding apparatus and the manufacturing method of a resin molded article TECHNICAL FIELD

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded article.

A substrate on which a semiconductor chip is mounted is generally used as an electronic component by sealing with resin. Conventionally, as a resin molding apparatus for resin-sealing a substrate, a resin supply mechanism for supplying a resin material to a substrate as an object to be supplied, and a substrate supplied with the resin material are disposed between an upper die and a lower die It is known that a mold clamping mechanism for mold clamping a molding mold is provided (for example, refer to Patent Document 1).

The resin molding apparatus of patent document 1 calculates the amount of resin discharged by the resin supply mechanism based on the weight of the board|substrate measured by the measuring means. Accordingly, the amount of resin supplied to the substrate is adjusted according to the number of defects in the semiconductor chip.

[Patent Document 1] Japanese Patent Laid-Open No. 2003-165133

However, in the resin molding apparatus described in Patent Document 1, it is possible to increase the amount of resin to be supplied to the substrate by the volume of the defective semiconductor chip, but it is not optimized to the supply position of the resin material. That is, it is not possible to easily change the supply pattern of the resin material, which is set variously according to the type or shape of the substrate.

Therefore, the resin molding apparatus and the manufacturing method of the resin molded article which can easily change the supply pattern of a resin material are calculated|required.

The characteristic configuration of the resin molding apparatus according to the present invention is a resin supply mechanism for supplying a resin material to a supply object, a molding mold including an upper mold and a lower mold opposite to the upper mold, and the supply object is disposed between the upper mold and the lower mold a mold clamping mechanism for mold-clamping the molding mold in a state disposed on the It has a point provided with the control part which controls the operation|movement of a supply mechanism and the said display part.

Characteristics of the method for manufacturing a resin molded article according to the present invention include a display step of graphically displaying the supply state of the resin material based on a supply input of the resin material to the supply object, and based on the supply state, It is a point comprising a resin supply step of supplying a resin material to the object to be supplied, and a resin molding step of performing resin molding using the resin material supplied in the resin supply step.

ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the resin molding apparatus and resin molded article which can change the supply pattern of a resin material easily can be provided.

1 : is a schematic diagram which shows the resin molding apparatus.
2 : is a schematic diagram which shows a mold clamping mechanism.
3 is a diagram showing the entire display unit.
4 is a diagram illustrating a part of a display unit.
5 is a diagram illustrating a part of a display unit.
6 is a flowchart of a resin material supply method.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of the manufacturing method of the resin molding apparatus which concerns on this invention and a resin molded article is demonstrated based on drawing. In this embodiment, as an example of a resin molding apparatus, as shown in FIG. 1, the resin molding apparatus D provided with the resin supply module 2 is demonstrated. However, it is not limited to the following embodiment, and various modifications are possible within the range which does not deviate from the summary.

[Device Configuration]

The board|substrate etc. on which the semiconductor chip was mounted are used as an electronic component by resin sealing. A compression method (compression molding), a transfer method, etc. are mentioned as a technique for resin-sealing an object to be molded. As one of the compression methods, after supplying a resin in liquid or granular form to a release film, the release film is loaded on the lower mold of the molding mold, and the molded object is immersed in the resin on the release film to mold the resin. A resin encapsulation method is exemplified. The resin molding apparatus D in the present embodiment employs a compression method, and the resin supply module 2 includes a molding mold or a substrate (an example of a supply target) or a release film F (an example of a supply target). ) is a device for supplying liquid resin (an example of a resin material). Hereinafter, a supply target to which a resin material composed of a liquid resin is supplied is referred to as a release film F, and a substrate S on which a semiconductor chip (hereinafter, sometimes referred to as “chip”) is mounted is used as a molded object. As an example, the direction of gravity will be described as downward and the direction opposite to the direction of gravity as upward. On the other hand, the Y direction shown in FIG. 1 is an up-down direction.

1, the schematic diagram of the resin molding apparatus D is shown. The resin molding apparatus D in this embodiment includes a resin supply module 2, a plurality of (three in this embodiment) compression molding modules 3, a conveying module 4, a control unit 5, and a display unit ( 6) is provided. The resin supply module 2, the plurality of compression molding modules 3 and the conveying module 4 may be independently mounted or detached. In addition, although the compression molding module 3 in this embodiment is comprised by three, you may comprise by one or two or more plurality.

The resin supply module 2 includes a resin supply mechanism 21 for supplying a liquid resin for resin molding to a resin supply region on the release film F. Here, liquid resin includes not only liquid resin at normal temperature (room temperature), but also molten resin used as liquid resin by melting solid resin by heating. The liquid resin that becomes liquid at room temperature may be a thermoplastic resin or a thermosetting resin. A thermosetting resin is a liquid resin at room temperature, and when heated, the viscosity becomes low, and when further heated, it polymerizes and hardens|cures to become a cured resin. The liquid resin in the present embodiment is preferably a thermosetting resin having a relatively high viscosity to such an extent that it does not flow rapidly at normal temperature.

The resin supply mechanism 21 includes a table 21A on which the release film F is mounted, a discharge mechanism 21B that discharges the liquid resin, and a weight sensor 25 . The release film supply mechanism 22 which cut|disconnects and isolates the release film F while sending out the release film F wound on the reel which is not shown in figure is provided in the table 21A. This separated release film F is adsorbed and held on the upper surface of the table 21A by a suction mechanism (not shown). On the upper surface of the release film F, a frame-shaped member (not shown) is mounted. A space corresponding to a lower mold cavity MC, which will be described later, is formed in this frame member.

The discharge mechanism 21B includes a dispenser unit 24 to which a nozzle unit 23 is attached. The dispenser unit 24 includes a press member (not shown) for extruding the liquid resin in the cartridge 23a containing the liquid resin, which will be described later, and moves the press member downward through the nozzle unit 23 . It is quantitatively supplied on the release film (F). The dispenser unit 24 with the nozzle unit 23 is comprised so that the XY plane image (horizontal direction) used as the mounting surface of the release film F can be moved arbitrarily. In addition, in addition to the dispenser unit 24, or instead of the dispenser unit 24, you may comprise so that the table 21A can move arbitrarily on XY plane. In addition, the dispenser unit 24 is configured to be movable in the Z direction (up and down direction).

The nozzle unit 23 includes a cartridge 23a in which the liquid resin is accommodated, and a nozzle 23b for discharging the liquid resin. A plurality of the nozzle units 23 (six in this embodiment) are previously accommodated in the resin accommodating part 11 . The dispenser unit 24 is configured such that, when all of the liquid resin filled in the nozzle unit 23 is used, it can be automatically exchanged for different nozzle units 23 .

The weight sensor 25 measures the weight of the liquid resin supplied on the release film F. This weight sensor 25 measures the supplied liquid resin by the difference between the weight of the table 21A or the release film F after the resin supply and the weight of the table 21A or the release film F before the resin supply. It is a well-known load sensor.

The resin loader 12 is configured to be movable between the resin supply module 2 and the compression molding module 3 on the rail. The resin loader 12 holds the release film F supplied with the liquid resin by the resin supply mechanism 21 and can transfer it to the compression molding module 3 .

The compression molding module 3 has at least a molding mold M and a mold clamping mechanism 35 for mold clamping the molding mold M. The details of the compression molding module 3 will be described later.

The conveyance module 4 conveys the resin-sealed board|substrate Sa (pre-molding board|substrate) on which the chip|tip before resin sealing was mounted, and conveys the resin-sealed board|substrate Sb (resin molded article) after resin sealing. The transfer module 4 includes a substrate loader 41, a first accommodating part 43 for accommodating the pre-resin encapsulation substrate Sa, and a second accommodating part 44 for accommodating the resin-sealed substrate Sb; , and a substrate guide portion 45 . The substrate delivery unit 45 can move in the Y-direction in the transfer module 4 to guide the substrate Sa before resin encapsulation to the substrate loader 41 . Moreover, the board|substrate delivery part 45 can receive the resin-sealed board|substrate Sb conveyed from the board|substrate loader 41. As shown in FIG. The substrate loader 41 moves in the X direction and the Y direction within the transfer module 4 and each compression molding module 3 .

The transfer module 4 further includes an inspection mechanism (not shown). The inspection mechanism inspects the region of existence of the chip in the substrate S, which is the object to be molded in the compression molding module 3 . The inspection mechanism inspects whether or not the chip is actually present in the region of existence of the chip scheduled for inspection by scanning the laser displacement meter, and stores the place where the chip is present and the place where the chip does not exist. In addition, an inspection mechanism may image|photograph the board|substrate S with a visible light camera etc., and may test|inspect the presence area|region of the chip|tip in the board|substrate S based on this captured image.

The control part 5 is software which controls the operation|movement of the resin molding apparatus D, is comprised with the program memorize|stored in hardware, such as an HDD and a memory, and is executed by the CPU of a computer. In this embodiment, as an example of the control mode of the control part 5, the case where the operation|movement of the resin supply mechanism 21 and the display part 6 is controlled is mentioned later.

The display part 6 is comprised by the well-known liquid crystal display fixed to the casing of the conveyance module 4 in the state which can be visually recognized from the outside, and is display-controlled by the control part 5. As shown in FIG. The display unit 6 is constituted by a touch panel that can be operated by pressing a display on the screen with a finger. Although the display part 6 in this embodiment is provided in the front surface of the conveyance module 4, you may provide in the front surface of the resin supply module 2 or the compression molding module 3. As shown in FIG. The display form of the display unit 6 will be described later.

On the other hand, the display unit 6 may be configured as a display of a desktop PC, notebook or tablet terminal, etc. You may display the screen. In this case, the display unit 6 is configured to enable wireless communication with the control unit 5 through a predetermined wireless access point, or to be electrically connected to the control unit 5 to enable wired communication. Moreover, you may comprise so that the display part 6 can be operated by operation, such as a mouse|mouth, a keyboard.

As shown in FIG. 2, the compression molding module 3 in this embodiment is comprised by the press frame in which the lower fixed board 31 and the upper fixed board 33 were integrated by the plate-shaped member 32. . A movable platen 34 is provided between the lower fixed plate 31 and the upper fixed plate 33 . The movable template 34 is movable up and down along the plate-shaped member 32 . A mold clamping mechanism 35 composed of a pair of ball screws, which is a device for moving the movable template 34 up and down, is provided on the lower fixed plate 31 . The mold clamping mechanism 35 can clamp the molding mold type M by moving the movable template 34 upward, and can open the molding mold M by moving the movable template 34 downward. Although the drive source of the mold clamping mechanism 35 is not specifically limited, For example, electric motors, such as a servo motor, can be used.

The upper mold UM and the lower mold LM as the molding mold M are disposed to face each other, and both are constituted by a mold or the like. An upper heater 37 is disposed on a lower surface of the upper fixed plate 33 , and an upper mold UM is attached below the upper heater 37 . The upper die UM is provided with an upper die substrate set unit (not shown) for arranging the substrate S, and a substrate S on which a chip or the like is mounted is attached to the lower surface of the upper die UM. A lower heater 36 is disposed on the upper surface of the movable template 34 , and a lower mold LM is provided on the lower heater 36 . As the release film F sucked by a suction mechanism (not shown) is held in the lower mold cavity MC, the liquid resin applied on the release film F by the resin supply mechanism 21 is transferred to the lower mold cavity MC. is supplied By clamping the molding mold M by the mold clamping mechanism 35 and heating the lower mold LM with the lower heater 36, the liquid resin in the lower mold cavity MC is cured. That is, in a state in which the pre-resin sealing substrate Sa and the release film F as a supply object are disposed between the upper mold UM and the lower mold LM, the molding mold M is molded by the mold clamping mechanism 35 . clamp it. Thereby, the chip|tip etc. mounted on the board|substrate Sa (substrate before molding) before resin sealing are resin-sealed in the lower mold|type cavity MC, and it becomes the resin-sealed board|substrate Sb (resin molded article).

3 shows an example of a display screen of the display unit 6 . The display unit 6 includes an application line adjustment unit 60 , a supply state display unit 61 , an operation result display unit 62 , a parameter display unit 63 , and an input switching unit 64 . The input switching unit 64 has a resin supply input mode 64a, an adjustment point input mode 64b, and a liquid cut point input mode 64c. In the rectangular area of the supply state display part 61, the outer shape of the board|substrate Sa before resin encapsulation when seen from the Z direction is displayed. When the resin supply input mode 64a is selected, the supply position of the liquid resin to the release film F (the substrate Sa before resin sealing) can be input to the supply state display unit 61 . The supply position of the liquid resin with respect to the release film F turns into the supply position of the liquid resin to the board|substrate Sa before resin sealing when the shaping|molding mold M is mold-clamped. That is, since the resin supply mechanism 21 supplies the liquid resin to the release film F as a supply object, and the liquid resin on the release film F is supplied to the substrate Sa before resin sealing, the resin supply mechanism 21 ) indirectly supplies the liquid resin to the substrate Sa before sealing with resin, and in the rectangular area of the supply state display unit 61, the outer shape of the substrate Sa before sealing with resin as viewed from the Z direction is displayed.

Arrows in multiple directions (eight directions in this embodiment) are displayed on the application line adjustment unit 60, and the length of the line segment drawn by touching the supply status display unit 61 with a finger to input a start point and an end point (release of liquid resin) The length on the film F) and the direction can be corrected by cursor operation (pressing the arrow operation). This line segment is the supply input of the liquid resin to the release film F as a supply object, and is an application line of the liquid resin.

The supply status display unit 61 is displayed on the release film F (substrate Sa before sealing with resin) based on the input of the supply position of the liquid resin to the release film F (an example of the supply input of the resin material). The state of supply of liquid resin is displayed in a graphic form. In the example of FIG. 3 , as an input of the supply position of the liquid resin to the release film F, a plurality of points serving as start and end points are touch-inputted in the supply state display unit 61 , and then a line is displayed on the parameter display unit 63 . A line segment is drawn by inputting a number (the "Line" field shown in the parameter display section 63 of the same figure). Then, by repeating this input, a plurality of (five in the same figure) line segments (application lines) are drawn as a supply state of the liquid resin to the release film F (substrate Sa before sealing with resin). Each of these plurality of line segments or a combination thereof is a figure used as an application region of the liquid resin to the release film F (the substrate Sa before sealing the resin). On the other hand, as a supply input of the resin material, graphic data such as downloaded CAD data may be input to the control unit 5 , and the control unit 5 may display the supply state of the liquid resin on the display unit 6 . In addition, the control unit 5 may automatically draw a line segment by input of the XY coordinates to the parameter display unit 63 (“X axis” and “Y axis” columns shown in the parameter display unit 63 in the same figure). . In addition, the supply state display unit 61 may have a configuration in which each point can be freely combined by touch-inputting a plurality of points serving as a starting point and an ending point.

The control unit 5 specifies, based on the figure displayed on the supply state display unit 61, XY coordinates serving as respective start and end points for a plurality of line segments, and the weight of the liquid resin in the application area of the release film F And calculate the length on the release film (F). The control unit 5 controls the discharge amount (g/s) of the liquid resin per unit time discharged from the nozzle unit 23 of the resin supply mechanism 21, and the moving speed (g/s) of the dispenser unit 24 to which the nozzle unit 23 is attached. mm/s) to calculate the weight (g) and length (mm) of the liquid resin. The discharge amount of the liquid resin per unit time discharged from the nozzle unit 23 is set based on the diameter of the nozzle 23b, the specific gravity of the liquid resin, and the like. Further, the moving speed of the dispenser unit 24 is set to coincide with the discharge speed of the liquid resin discharged from the nozzle unit 23 . The moving speed of the dispenser unit 24 is calculated by dividing a value obtained by dividing the discharge weight of the nozzle 23b per unit time by the specific gravity of the liquid resin by the discharge cross-sectional area of the nozzle 23b. In this way, the control unit 5 calculates the supply state of the liquid resin to the release film F (the substrate Sa before sealing the resin) according to the physical properties of the liquid resin and the specification of the resin supply mechanism 21 .

In addition, the control unit 5 controls the maximum weight of the liquid resin in the application area of the release film F and the release film based on at least the size of the substrate S, which is the object to be molded, or the region in which chips are present in the substrate S. (F) Calculate the maximum length of the phase. In this calculation, the physical properties of the liquid resin and the specification of the resin supply mechanism 21 may be taken into consideration. Specifically, based on the size of the substrate S and the region of the chip, the volume to be resin-sealed to the substrate S is calculated, and the volume is multiplied by the specific gravity of the liquid resin, whereby the application region of the release film F The maximum length of the liquid resin in the application region of the release film F is calculated by calculating the maximum weight of the liquid resin and dividing the volume by the discharge cross-sectional area of the nozzle 23b. In addition, the size of the board|substrate S, the presence area|region of a chip|tip etc. in the board|substrate S, and the diameter of the nozzle unit 23, etc. may be input and set manually in advance, The board|substrate S memorize|stored in the above-mentioned inspection mechanism. The size of , and the area of existence of chips or the like on the substrate S may be read in real time.

4, the calculation result display unit 62 displays the weight and length of the liquid resin related to the supply state displayed on the supply state display unit 61 (“Amount”, “ Distance" column). In the example of FIG. 4 , the maximum weight and maximum length of the liquid resin in the application region of the release film F are displayed at the upper end, and the weight and length of the liquid resin in the supply state displayed on the supply state display unit 61 are displayed at the lower end. is displayed in

In this way, based on the input of the supply position of the liquid resin, the supply state of the liquid resin to the release film F (the substrate Sa before sealing the resin) is graphically displayed and thus the supply state of the liquid resin is visually displayed. can figure out That is, just by inputting the flat position of the liquid resin to be supplied to the release film (F), the supply state of the liquid resin can be intuitively grasped, and the ideal supply pattern of the liquid resin can be set so that an appropriate supply amount and an appropriate supply position are obtained. have. As a result, when the mold clamping mechanism 35 is molded, the problem such as the liquid resin being pushed out of the lower mold cavity MC is solved, and depending on the type of the substrate S, the liquid resin is mainly focused on the parts that are likely to be insufficient. It becomes possible to supply liquid resin. In addition, when the weight and length of the liquid resin are displayed on the calculation result display unit 62, it is possible to easily change the supply pattern of the liquid resin so as to obtain an appropriate supply amount and an appropriate supply position.

When the adjustment point input mode 64b of the input switching unit 64 is selected, the supply state display unit 61 sets the position (adjustment point) at which the supply state display unit 61 supplies the insufficient liquid resin again after the resin supply is completed. ) and input is possible. This adjustment point is, for example, set in the central portion (“ADJ” shown in the upper figure of Fig. 4) of the release film F (substrate Sa before sealing with resin), whereby the mold clamping mechanism 35 is At the time of molding, there is no problem such as an insufficient amount of liquid resin being pushed out of the lower mold cavity MC. In this way, after the resin supply mechanism 21 completes the supply of the liquid resin to the release film F, the supply status display unit 61 displays the position to supply the insufficient liquid resin again. By adjusting, the resin material can be supplied so that it may become an appropriate supply amount and an appropriate supply position.

As shown in Fig. 5, the parameter display section 63 may display a correction value for correcting the operating speed of the resin supply mechanism 21 ("Offset" shown in the same figure). If the moving speed of the dispenser unit 24 to which the nozzle unit 23 is attached (hereinafter referred to as the moving speed of the nozzle unit 23) does not match the discharging speed of the liquid resin discharged from the nozzle unit 23, the application The line is swelled, and the application line cannot be drawn according to the setting. Accordingly, as a correction value for correcting the operating speed of the resin supply mechanism 21 , the correction ratio (ratio, 1 being a standard value) of the moving speed of the nozzle unit 23 is input to the parameter display unit 63 , and the control unit 5 . It is preferable to change the moving speed of the nozzle unit 23 according to the correction ratio. Thereby, the swell of the application line of the liquid resin with respect to the release film F is removed, and the supply pattern of liquid resin can be set so that it may become an appropriate supply amount and an appropriate supply position. In addition, the moving speed of the nozzle unit 23 may be changed for every application line, and may be changed uniformly as a whole.

In addition, the parameter display section 63 is the operation contents at the end of one turn of supply by the resin supply mechanism 21 , after the resin supply mechanism 21 temporarily stops the supply of the liquid resin to the release film F . The number of times the nozzle 23b is moved up and down may be displayed (“Drain” shown in FIG. 5). Even if the nozzle 23b is closed after the supply of the liquid resin to one application line is finished and the drive of the dispenser unit 24 is temporarily stopped, the higher the viscosity of the liquid resin, the higher the liquid resin is in the nozzle 23b. Since the state in which the resin is stretched like a thread lasts for a long time, the driving of the dispenser unit 24 is stopped until the state in which the thread is stretched is resolved, and productivity is lowered. Therefore, it is preferable that the control unit 5 moves the nozzle unit 23 up and down at a predetermined liquid cutting point by inputting the number of times the nozzle unit 23 is moved up and down in the parameter display section 63 . By adjusting the number of times the nozzle unit 23 is moved up and down, the thread-like state can be eliminated more quickly.

When the liquid cutting point input mode 64c of the input switching unit 64 is selected, the resin supply mechanism 21 temporarily stops the supply of the liquid resin to the release film F and then moves the nozzle 23b up and down. The position (liquid cutting point) can be input to the supply state display unit 61 . This liquid cutting point can supply liquid resin uniformly on the release film F by setting, for example in the central part of each application line. In this way, when the resin supply mechanism 21 displays the position at which the nozzle 23b moves up and down after temporarily stopping the supply of the liquid resin to the release film F, the resin material can be uniformly supplied by adjusting this position. can

On the other hand, the parameter display unit 63 may display the time (predetermined time to be described later) for reciprocating the nozzle unit 23 along the application line as the operation contents at the end of one turn of supply by the resin supply mechanism 21 . good. In this case, it is preferable to input the time for reciprocating the nozzle unit 23 to the parameter display unit 63 and the control unit 5 to reciprocate the nozzle unit 23 along the application line according to the time. Accordingly, after temporarily stopping the driving of the dispenser unit 24, the residual liquid discharged from the nozzle 23b is evenly applied to the application line until the pressure in the cartridge 23a is released, thereby preventing resin from accumulating. can do.

In addition, the parameter display unit 63 may display the length and weight of the liquid resin for each application line related to the supply state displayed on the supply state display unit 61 (“Distance” and “Amount” columns shown in FIG. 5 ). In this way, when the supply state of the liquid resin is grasped for each application line based on the input of the supply position of the liquid resin in the supply state display unit 61, the liquid resin is supplied so that the supply length and supply amount are equal between the application lines. You can change the pattern.

[Method of supplying resin material]

A method of supplying a resin material will be mainly described with reference to FIG. 6 .

In advance, the control unit 5 controls the maximum weight and maximum of the liquid resin in the application region of the release film F based on at least the size of the substrate S as the molding object or the region in which chips are present in the substrate S. Calculate the length. Next, by touching the supply status display unit 61 with a finger to input a start point and an end point, and then input a line number to the parameter display unit 63, a plurality of (eg, N=5) application lines are drawn, and the resin Enter the supply location (#61). Specifically, the point number is displayed in the supply status display unit 61 shown in Fig. 3 in response to the touch input of the start point and the end point, and the line number is displayed in the parameter display unit 63 (shown in the parameter display unit 63 in the same figure). By inputting one "Line" field), multiple line segments are drawn. At this time, you may adjust the length of each application|coating line by cursor-operating the application|coating line adjustment part 60 shown in FIG. 3 as needed. As a result, as shown in the upper drawing of FIG. 4 , the supply state of the liquid resin to the release film F (the substrate Sa before sealing with the resin) is graphically displayed on the supply state display unit 61 ( #62, display step). Then, the control unit 5 specifies, based on the figure displayed on the supply state display unit 61 , the XY coordinates that are the start and end points of each of the plurality of line segments, and the liquid resin in the application area of the release film F Calculate the weight and length of (calculation step). As a result, as shown in the lower drawing of FIG. 4 , the calculation result display unit 62 includes the maximum weight and maximum length of the liquid resin in the application area of the release film F, and the supply displayed on the supply state display unit 61 . The weight and length of the liquid resin in relation to the state are displayed at the top and bottom in this order.

Next, the control unit 5 determines whether the weight and length of the liquid resin with respect to the supply state displayed on the supply state display unit 61 is less than the maximum weight and maximum length of the liquid resin in the application area of the release film F; That is, it is determined whether the supply state (supply amount and supply position) is appropriate (#63). When the weight or length of the liquid resin with respect to the supply state displayed on the supply state display unit 61 does not fall below the maximum weight or maximum length, for example, the number of the calculation result display unit 62 is displayed in red. Color it to indicate a warning. Accordingly, it is possible to visually determine whether the supply state is appropriate. As a result of the determination of #63, when the supply state is not appropriate (No determination of #63), the input of the resin supply position of #61 is corrected again. In this correction input, as shown in the parameter display part 63 of FIG. 5, since the weight and length of the liquid resin are displayed for each application line, it is possible to make fine correction for each application line.

As a result of the determination of #63, if the supply condition is appropriate (#63 Yes determination), the control unit 5 controls the N = upper part of the starting point of the first (#64) application line (the point number shown in the upper figure of Fig. 4 " Move the dispenser unit 24 to which the nozzle unit 23 of the resin supply mechanism 21 is attached so that the nozzle 23b of the nozzle unit 23 is located at the upper part of the The liquid resin is supplied along the application line (#65, supply step). At this time, if the correction ratio of the moving speed of the nozzle unit 23 is input to the parameter display unit 63, the control unit 5 corrects the moving speed of the nozzle unit 23 for discharging the liquid resin (correction step) . As a result, the moving speed of the nozzle unit 23 and the discharge speed of the liquid resin discharged from the nozzle unit 23 can be matched, and the swell of the application line can be eliminated. Next, the control unit 5 determines whether or not the nozzle unit 23 has reached the upper end of the N=1st application line (the upper part of the point number "01" shown in the upper drawing of FIG. 4) (#66). ). As a result of the #66 determination, if the nozzle unit 23 has not reached the upper end of the N=1st application line (#66 No determination), then the liquid resin is supplied to the N=1st application line.

As a result of the determination of #66, if the nozzle unit 23 has reached the upper end of the N = 1st application line (Yes determination of #66), the control unit 5 determines that the resin supply for one turn has ended, and the dispenser unit (24) is temporarily stopped. And the nozzle unit 23 is reciprocally moved along the N = 1st application|coating line (horizontal direction parallel to the release film F) (#67, reciprocating movement step). Next, as the time for reciprocating the nozzle unit 23 input to the parameter display unit 63, it is determined whether a predetermined time for releasing the residual pressure of the nozzle unit 23 has elapsed (#68). As a result of the determination of #68, if the predetermined time has not elapsed (#68 No determination), the control unit 5 continues the reciprocating movement of the nozzle unit 23, and if the predetermined time has elapsed (#68 Yes determination), N Add 1 to (#69). Prior to this addition, in order to ensure that the liquid cutting of the nozzle unit 23 is assured, the control unit 5 moves the nozzle unit 23 up and down by the number of times input into the parameter display unit 63 at a predetermined liquid cutting point. . Next, the control unit 5 determines whether or not N exceeds the total number of lines (N=5), and if N is within the total number of lines (#70 No determination), controls #65 to #68 are repeated.

On the other hand, when N exceeds the total number of lines (N=5) (#70 Yes determination), the control unit 5 controls the amount of liquid resin supplied by the resin supply mechanism 21 measured by the weight sensor 25 to reach the target amount. It is determined whether or not it is within the tolerance range (#71). If the supply amount of the liquid resin by the resin supply mechanism 21 exceeds the tolerance range with respect to the target amount and is insufficient (#71 No determination), the control unit 5 sets an adjustment point (“ADJ” shown in the upper diagram of FIG. 4 ). ), the nozzle unit 23 is moved, and the insufficient amount of liquid resin is supplied to the adjustment point to end (#72). This adjustment point may be the central portion of the release film F (substrate Sa before sealing with resin), or may be an application line with a relatively small amount of resin between a plurality of application lines, and the absence of chips or the like inspected by an inspection mechanism It may be an area. On the other hand, as a result of the determination of #71, if the supply amount of the liquid resin by the resin supply mechanism 21 is within the tolerance range with respect to the target amount (#71 Yes determination), it ends.

[Manufacturing method of resin molded article]

Next, the manufacturing method of the resin molded article including the said resin material supply method is demonstrated.

First, as shown in FIG. 1 , the pre-resin encapsulation substrate Sa guided by the substrate delivery portion 45 from the first accommodating portion 43 is loaded onto the substrate loader 41 . At this time, the inspection mechanism inspects a region in which chips or the like exist in the substrate S (substrate Sa before sealing with resin) serving as the object to be molded. Moreover, the liquid resin is supplied to the release film F by performing the resin material supply method mentioned above.

Next, the resin loader 12 transfers the release film F to the lower mold|type LM, and attracts and holds the release film F to the lower mold|type cavity MC by a suction mechanism. In addition, the substrate loader 41 transfers the substrate Sa before the resin sealing to the upper mold UM and delivers it to the upper mold UM. Then, by heating the lower mold LM with the lower heater 36 while performing mold clamping of the molding mold M by the mold clamping mechanism 35, the liquid resin on the release film F is transferred to the substrate Sa before resin sealing. ) on the chip mounting surface. Then, by further heating the lower mold LM with the lower heater 36, the liquid resin in the lower mold cavity MC is cured, and the resin-sealed substrate Sa is resin-sealed to form the resin-sealed substrate Sb. (resin molding step). Next, the molding mold M is mold-opened by moving the movable template 34 downward, and the resin-sealed substrate Sb from which the release film F has been peeled by the substrate loader 41 is transferred to the transfer module 4 ), the substrate delivery unit 45 receives the resin-sealed substrate Sb from the substrate loader 41 and accommodates it in the second accommodating unit 44 (refer to FIG. 1 ).

[Other embodiment]

Hereinafter, members similar to those in the above-described embodiment will be described using the same terms and symbols for easy understanding.

<1>

The supply state of the liquid resin to be supplied to the release film F (substrate Sa before resin sealing) as a supply object is not limited to the plurality of application lines illustrated in the upper drawing of FIG. 4, for example, , may be formed by a plurality of parallel straight lines, or may be constituted by a point group. In this case, each point becomes a "figure". In addition, the application line is not limited to a straight line, and may be formed by a curve or a combination of a straight line and a curved line.

<2>

The resin supply mechanism 21 may be comprised by the apparatus which supplies powder or granular resin (an example of a resin material) to the release film F. In this case, the container filled with powder or granular resin is conveyed to the resin supply mechanism 21 by the resin loader 12 mentioned above. And the powder or granular resin is supplied to the mold release film F through the vibration trough connected to the bottom part opening of a container.

<3>

In the above-described embodiment, the nozzle unit 23 was previously filled with liquid resin, but a resin filling unit may be provided separately. In this case, the resin filling unit fills the inside of the container with a predetermined amount of liquid resin. Then, the resin loader 12 transfers the container filled with the liquid resin to the resin supply mechanism 21, the dispenser unit 24 sucks the liquid resin from the container, and the nozzle 23b on the release film F. Supply liquid resin.

<4>

In general, although a plurality of semiconductor chips exist at equal intervals in almost the entire region of the substrate S, there are cases where the semiconductor chips do not exist in a part of the substrate S. Therefore, it is good also considering the part where a semiconductor chip does not exist as a liquid cutting point or an adjustment point.

<5>

In the above-described embodiment, the resin material is supplied onto the release film F inside the resin supply module 2 , but the resin supply module 2 provides a release film supply mechanism 22 from the resin supply module 2 . It is good also as a two-module structure by separating as a release film supply module.

<6>

The substrate S in the above-described embodiment may have a shape such as a circular shape or a rectangular shape.

<7>

The correction value which corrects the operation speed of the resin supply mechanism 21 in the above-mentioned embodiment divides one application|coating line into a plurality, and you may comprise so that it can set in each division line.

<8>

Although the above-mentioned embodiment demonstrated the compression method of die-up, it is good also considering a molding object, such as a board|substrate, as a supply object to which resin is supplied from the resin supply mechanism 21 as a compression method of die-up. Moreover, it is good also as a supply object to which the mold release film F is abbreviate|omitted and resin is supplied by the resin supply mechanism 21 for the shaping|molding mold M.

[Summary of the above embodiment]

Hereinafter, the outline|summary of the resin molding apparatus D demonstrated in embodiment mentioned above, the manufacturing method of a resin molded article, and the resin material supply method is demonstrated.

(1) The characteristic configuration of the resin molding apparatus D is a resin supply mechanism 21 for supplying a resin material to a supply target (release film F), and an upper mold UM and a lower mold opposite to the upper mold UM ( LM), a mold clamping mechanism 35 for mold-clamping the molding mold M in a state in which the object to be supplied is placed between the upper die UM and the lower die LM; A display unit 6 which graphically displays the supply state of the resin material based on the input of the supply of the resin material to the machine, and a control unit 5 that controls the operation of at least the resin supply mechanism 21 and the display unit 6 . there is one point

In this configuration, the supply state of the resin material is graphically displayed based on the supply input of the resin material to the object to be supplied, so that the supply state of the resin material can be visually grasped. That is, just by inputting the planar position of the resin material to be supplied to the object to be supplied, the supply state of the resin material can be intuitively grasped, and the ideal supply pattern of the resin material can be set so that an appropriate supply amount and an appropriate supply position are obtained. As a result, problems such as the resin material being pushed out of the lower mold cavity MC during molding in a state in which the molding mold M is mold-clamped by the mold clamping mechanism 35 is solved, and depending on the type of object to be molded It becomes possible to supply a resin material intensively to the site|part which is easy to run out of a resin material. In this way, it was possible to provide the resin molding apparatus D in which the supply pattern of the resin material can be easily changed.

(2) The display section 6 may display the weight and length of the resin material related to the supply state of the resin material.

As in this configuration, if the weight and length of the resin material are displayed, the supply pattern of the resin material can be easily changed so as to obtain an appropriate supply amount and an appropriate supply position.

(3) The display unit 6 may display a correction value for correcting the operating speed of the resin supply mechanism 21 .

If the moving speed of the nozzle unit 23 and the discharging speed of the resin material do not match, the application line as set cannot be drawn. If a correction value for correcting the operating speed of the resin supply mechanism 21 is displayed as in this configuration, an application line as set can be drawn.

(4) In the display unit 6, the resin supply mechanism 21 includes a nozzle 23b for discharging the resin material, and the display unit 6 includes the resin supply mechanism 21 for supplying the resin material to the object to be supplied. After temporarily stopping, the number of times the nozzle 23b is moved up and down may be displayed.

The higher the viscosity of the resin material, the longer the nozzle 23b continues to hang after the temporary stop of the resin supply in the resin supply mechanism 21. The drive of (24) is stopped, and productivity is lowered. As in this configuration, if the resin supply mechanism 21 displays the number of times the nozzle 23b moves up and down after temporarily stopping the supply of the resin material to the object to be supplied, by adjusting the number of times, the state of drooping like a thread can be seen. can be resolved quickly.

(5) The display part 6 may display the position where the nozzle 23b is moved up and down.

As in this configuration, if the resin supply mechanism 21 displays the position at which the nozzle 23b moves up and down after temporarily stopping the supply of the resin material to the object to be supplied, the resin material can be uniformly supplied by adjusting this position. have.

(6) The display section 6 may display a position at which the resin supply mechanism 21 supplies the insufficient amount of the resin material again after the supply of the resin material to the object to be supplied is completed.

As in this configuration, after the resin supply mechanism 21 completes the supply of the resin material to the object to be supplied, the position for supplying the insufficient resin material is displayed. By adjusting this position, an appropriate supply amount and an appropriate supply position are obtained. A resin material can be supplied as much as possible.

(7) The control unit 5 may calculate the weight and length of the resin material related to the supply state of the resin material according to the physical properties of the resin material and the specifications of the resin supply mechanism 21 .

The supply state of the resin material changes according to the specific gravity of the resin material, the nozzle diameter, and the like. Therefore, as in this configuration, if the weight and length of the resin material in relation to the supply state are calculated according to the physical properties of the resin material and the specifications of the resin supply mechanism 21, the resin material can be supplied so that an appropriate supply amount and an appropriate supply position are obtained. have.

(8) Characteristics of the method for manufacturing a resin molded article include: a display step of graphically displaying the supply state of the resin material based on the supply input of the resin material to the supply target (release film F); Based on this, it is a point comprising a resin supply step of supplying a resin material to the object to be supplied, and a resin molding step of performing resin molding using the resin material supplied in the resin supply step.

In this method, the supply state of the resin material is graphically displayed based on the supply input of the resin material to the object to be supplied, so that the supply state of the resin material can be visually grasped. That is, only by inputting the planar position of the resin material to be supplied to the object to be supplied, the supply state of the resin material can be grasped, and the ideal supply pattern of the resin material can be set so that an appropriate supply amount and an appropriate supply position are obtained. As a result, it becomes possible to supply a resin material intensively to a site|part which tends to run out of resin material according to the kind of molding object. In this way, it was possible to provide a method for producing a resin molded article in which the supply pattern of the resin material can be easily changed.

(9) Characteristics of the resin material supply method include a display step of graphically displaying the supply state of the resin material based on the supply input of the resin material to the supply target (release film F), and based on the supply state Thus, it includes a resin supply step of supplying the resin material to the object to be supplied.

In this method, the supply state of the resin material is graphically displayed based on the supply input of the resin material to the object to be supplied, so that the supply state of the resin material can be visually grasped. That is, only by inputting the planar position of the resin material to be supplied to the object to be supplied, the supply state of the resin material can be grasped, and the ideal supply pattern of the resin material can be set so that an appropriate supply amount and an appropriate supply position are obtained. As a result, it becomes possible to supply a resin material intensively to a site|part which tends to run out of resin material according to the kind of molding object. In this way, it was possible to provide a method for supplying a resin material in which the supply pattern of the resin material can be easily changed.

(10) The resin material supply method may further include a calculation step of calculating the weight and length of the resin material in relation to the supply state of the resin material.

As in the present method, if the weight and length of the resin material are calculated, the supply pattern of the resin material can be easily changed so as to obtain an appropriate supply amount and an appropriate supply position.

(11) The resin material supply method may further include a correction step of correcting the moving speed of the nozzle unit 23 for discharging the resin material in the resin supply step.

If the moving speed of the nozzle unit 23 and the discharging speed of the resin material do not match, the application line as set cannot be drawn. If the moving speed of the nozzle unit 23 for discharging the resin material is corrected as in the present method, an application line as set can be drawn.

(12) In the resin material supply method, after temporarily stopping the supply of the resin material to the object to be supplied in the resin supply step, the nozzle unit 23 for discharging the resin material is reciprocally moved in a horizontal direction parallel to the object to be supplied. The reciprocating step may further be included.

After the temporary stop of the resin supply in the resin supply step, until the residual pressure of the nozzle unit 23 is released, there is a possibility that a resin pool may be formed by the residual liquid discharged from the nozzle 23b. As in the present method, after the supply of the resin material to the object to be supplied is temporarily stopped, if the nozzle unit 23 for discharging the resin material is reciprocally moved in the horizontal direction parallel to the object to be supplied, resin pooling can be prevented.

In addition, as long as a contradiction does not arise, the structure disclosed by the above-mentioned embodiment (including another embodiment, the same hereinafter) can be applied in combination with the structure disclosed by another embodiment. In addition, the embodiments disclosed in this specification are examples, and the embodiments of the present invention are not limited thereto, and appropriate modifications may be made within the scope without departing from the purpose of the present invention.

INDUSTRIAL APPLICATION This invention can be utilized for the manufacturing method of a resin molding apparatus and a resin molded article.

2: Resin supply module
3: Compression molding module
4: transfer module
5: control unit
6: display unit
21: resin supply mechanism
23b : Nozzle
35: mold clamping mechanism
D: Resin molding equipment
F: Release film (subject to supply)
LM : lower
M: molding mold
UM: pictograph

Claims (8)

a resin supply mechanism for supplying a resin material to a supply target;
A molding mold comprising an upper mold and a lower mold opposing the upper mold;
a mold clamping mechanism for mold clamping the molding mold in a state in which the object to be supplied is disposed between the upper mold and the lower mold;
a display unit for graphically displaying a supply state of the resin material based on a supply input of the resin material to the supply target;
and a control unit for controlling operations of at least the resin supply mechanism and the display unit. According to claim 1,
and the display section displays the weight and length of the resin material in relation to the supply state. 3. The method of claim 1 or 2,
and the display unit displays a correction value for correcting the operating speed of the resin supply mechanism. 4. The method according to any one of claims 1 to 3,
The resin supply mechanism includes a nozzle for discharging the resin material,
and the display section displays the number of times the nozzle is vertically moved after the resin supply mechanism temporarily stops the supply of the resin material to the object to be supplied. 5. The method of claim 4,
The resin molding apparatus, characterized in that the display unit displays a position at which the nozzle is vertically moved. 6. The method according to any one of claims 1 to 5,
The resin molding apparatus according to claim 1, wherein said display section displays a position at which said resin material is re-supplied in shortfall after said resin supply mechanism completes supply of said resin material to said object to be supplied. 7. The method according to any one of claims 1 to 6,
The resin molding apparatus according to claim 1, wherein the control unit calculates the weight and length of the resin material in relation to the supply state according to the physical properties of the resin material and specifications of the resin supply mechanism. a display step of graphically displaying the supply state of the resin material based on the supply input of the resin material to the object to be supplied;
a resin supply step of supplying the resin material to the supply object based on the supply state;
and a resin molding step of performing resin molding using the resin material supplied in the resin supply step.

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