KR20210157882A - Resin molding equipment and manufacturing method of resin molded products - Google Patents

Abstract

The objective of the present invention is to provide a resin molding apparatus, and the like capable of suppressing the occurrence of variations in thickness within one resin molded article. The resin molding apparatus of the present invention is configured to produce a resin molded article, the resin molding apparatus comprising: a supply mechanism; an image capturing unit; and a control unit. The supply mechanism is configured to supply a resin material. The image capturing unit is configured to capture an image of the supplied resin material from above and generate image data. The control unit is configured to analyze the image data and control the supply mechanism on the basis of the analysis result.

Description

A resin molding apparatus and the manufacturing method of a resin molded article TECHNICAL FIELD

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded article.

Japanese Patent Laid-Open No. 2006-286744 (Patent Document 1) discloses a semiconductor mounting substrate. In this semiconductor mounting substrate, an underfill is filled between the substrate and the semiconductor chip. An inspection pattern is formed on the substrate, and when the underfill is properly filled, the inspection pattern is covered by the underfill. On the other hand, when the filling of the underfill is not appropriate, the inspection pattern is exposed. Therefore, according to this semiconductor mounting board|substrate, the quality of underfill formation can be judged by imaging|photographing a semiconductor mounting board and analyzing a captured image (refer patent document 1).

Japanese Patent Laid-Open No. 2006-286744

In recent years, thickness reduction of a semiconductor package (an example of a resin molded article) progresses, and the product whose thickness is 0.38 mm or 0.43 mm is calculated|required in the market. On the other hand, depending on the quality of the molding process, variations in the thickness within one resin molded article may occur. In a resin molded article having a small thickness, slight variations in thickness have a large influence on the quality of the resin molded article. In the said patent document 1, the solution means of such a problem is not disclosed.

The present invention has been made to solve such a problem, and an object thereof is to provide a resin molding apparatus or the like capable of suppressing the occurrence of variations in thickness in one resin molded article.

A resin molding apparatus according to an aspect of the present invention is configured to manufacture a resin molded article. The resin molding apparatus includes a supply mechanism, an imaging unit, and a control unit. The supply mechanism is configured to supply the resin material. The imaging unit is configured to image the supplied resin material from above and generate image data. The control unit is configured to analyze the image data and control the supply mechanism based on the analysis result.

Moreover, the manufacturing method of the resin molded article which concerns on another aspect of this invention is the manufacturing method of the resin molded article using the said resin molding apparatus. The manufacturing method of this resin molded article includes the steps of supplying a resin material, imaging the supplied resin material from above, generating image data, analyzing the image data, and controlling the supply mechanism based on the analysis result. It includes a step, a step of disposing the supplied resin material on a lower die, and a step of performing resin molding by clamping the upper die and the lower die.

ADVANTAGE OF THE INVENTION According to this invention, the resin molding apparatus etc. which can suppress generation|occurrence|production of the fluctuation|variation in thickness in one resin molded article can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows typically a resin molding apparatus.
2 is a cross-sectional view schematically showing a resin material supply mechanism.
It is a figure for demonstrating the imaging state by an imaging part.
Fig. 4 is a view showing an example of a recess in a state in which a resin material is supplied.
5 is a flowchart showing a partial operation procedure in the resin molding apparatus.
6 is a flowchart showing a procedure of analysis processing executed in step S230 of FIG. 5 .
7 is a diagram for explaining a region included in image data indicating a concave portion.
It is a figure which shows an example of analysis data.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment (hereinafter also referred to as “the present embodiment”) according to one aspect of the present invention will be described in detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same or equivalent part in a figure, and the description is not repeated. In addition, in each figure, the object is abbreviate|omitted or exaggerated suitably for ease of understanding, and it is drawn typically.

[One. Composition of Resin Molding Equipment]

1 is a plan view schematically showing a resin molding apparatus 100 according to the present embodiment. The resin molding apparatus 100 resin-seals the board|substrate W on which electronic components, such as a semiconductor chip, were mounted, and is comprised so that a resin molded article may be manufactured. In the resin molding apparatus 100, the component mounting surface on which the electronic component was mounted among the board|substrate W is resin-sealed.

As an example of the board|substrate W, semiconductor substrates, such as a silicon wafer, a lead frame, a printed wiring board, a metal board|substrate, a resin board|substrate, a glass board|substrate, a ceramic board|substrate, etc. are mentioned. The substrate W may be a carrier used for FOWLP (Fan Out Wafer Level Packaging) and FOPLP (Fan Out Panel Level Packaging). In the board|substrate W, wiring may already be implemented and wiring does not need to be implemented.

As shown in FIG. 1 , the resin molding apparatus 100 includes a substrate supply/storage module A (hereinafter simply referred to as “module A”) and two resin molding modules B (hereinafter simply referred to as “module B”). ), a resin material supply module C (hereinafter also simply referred to as “module C”), and a programmable logic controller (PLC) 14 . Each of the modules A-C is detachable and replaceable to another module. In addition, in the resin molding apparatus 100, each of the modules A-C can be increased or decreased.

PLC 14 contains CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), etc., and is comprised so that each control of modules A-C may be performed according to information processing.

Module A includes a substrate supply unit 1 , a substrate storage unit 2 , a substrate mounting unit 3 , and a substrate transport mechanism 4 . The board|substrate supply part 1 is comprised so that the board|substrate W may be supplied on the board|substrate mounting part 3 before sealing. The board|substrate storage part 2 is comprised so that the sealed board|substrate W (resin molded article) may be accommodated. The board|substrate mounting part 3 is comprised so that it may move in the arrow Y direction between the position corresponding to the board|substrate supply part 1, and the position corresponding to the board|substrate storage part 2. As shown in FIG. The substrate transport mechanism 4 is configured to move in the arrow X direction and the arrow Y direction in the module A and each module B. The board|substrate conveyance mechanism 4 holds the board|substrate W before sealing on the board|substrate mounting part 3, for example, and conveys it to the module B, and mounts the sealed board|substrate W on the board|substrate mounting part 3. do.

Each module B includes a compression molding unit 5 . The compression molding part 5 is comprised so that the sealed board|substrate W (resin molded article) may be manufactured by compression molding. In this compression molding, a granular resin material (P) is used. The color of the resin material P is black, for example. The compression molding unit 5 includes an upper die 52 (a first molding die), a lower die 51 (a second molding die) opposing the upper die 52 , and a clamping mechanism 53 . The upper die 52 is configured to hold the substrate W on its lower surface. The lower die 51 includes a bottom member and a side member. The bottom member constitutes the bottom surface of the cavity 51C, and the side member constitutes the side surface of the cavity 51C. That is, the concave cavity 51C is formed by the bottom member and the side member. In the cavity 51C, the resin material P is disposed. The mold clamping mechanism 53 is comprised so that the upper mold|type 52 and the lower mold|type 51 may be clamped.

The module C includes a moving table 6 , a resin material accommodating unit 7 , a resin material supply mechanism 8 , a release film supply unit (not shown), an imaging unit 300 , and a resin material conveying mechanism. (9) is included. The moving table 6 is configured to move in the arrow X direction and the arrow Y direction in the module C. As shown in FIG. The resin material accommodating part 7 contains the release film 73 and the frame-like member 72 (refer FIG. 2, FIG. 3). A resin material is supplied to the resin material accommodating portion 7 . The release film 73 constitutes the bottom surface of the resin material accommodating part 7 , and the frame-like member 72 constitutes the side surface of the resin material accommodating part 7 . A space (recessed portion 71 ) corresponding to the size of the cavity 51C of the lower mold 51 is formed in the frame-like member 72 . The resin material accommodating part 7 is mounted on the moving table 6 .

The resin material supply mechanism 8 is configured to supply the resin material P to the resin material accommodating part 7 from above the resin material accommodating part 7 . The resin material P falling from the discharge port of the resin material supply mechanism 8 is moved relative to the discharge port of the resin material supply mechanism 8 by the moving table 6, whereby the concave portion of the resin material accommodating portion 7 is (71) spread evenly.

2 : is sectional drawing which shows the resin material supply mechanism 8 typically. The resin material supply mechanism 8 is configured to supply the resin material P of a preset weight to the resin material accommodating portion 7 .

As shown in FIG. 2 , the resin material supply mechanism 8 includes a storage unit 11 , a conveyance path 12 , a vibration unit 13 , and a metering unit 16 . The storage part 11 is comprised so that the granular resin material P may be temporarily stored. The conveyance path 12 is a conveyance path of the resin material P which flows in from the storage part 11. As shown in FIG. The vibrating part 13 is comprised so that the resin material P may be conveyed to the discharge port side by vibrating the conveyance path 12. As shown in FIG. The measuring part 16 is comprised so that the weight of the resin material P in the resin material supply mechanism 8 may be measured. PLC14 controls the vibrating part 13 based on the measurement result by the measuring part 16 so that the supply amount of the resin material P to the resin material accommodating part 7 may become a target value.

Referring again to FIG. 1 , the imaging unit 300 is configured to image the resin material P supplied to the resin material accommodating unit 7 from above to generate image data.

FIG. 3 is a view for explaining an imaging state by the imaging unit 300 . As shown in FIG. 3 , the imaging unit 300 includes, for example, a recess 71 of the resin material accommodating unit 7 in a state where the moving table 6 is positioned below the imaging unit 300 . The resin material P inside is imaged. The imaging unit 300 includes, for example, a camera module including an image sensor such as a CCD (Charge Coupled Device) image sensor or CMOS (Complementary Metal Oxide Semiconductor) image sensor.

Referring again to Fig. 1, the resin material conveying mechanism 9 is configured to move in the arrow X direction and the arrow Y direction in the module C and the module B. The resin material conveying mechanism 9 conveys the resin material accommodating part 7 which accommodated the resin material P to the lower die 51, and supplies the resin material P to the cavity 51C of the lower die 51. is configured to do so.

The resin molding apparatus 100 further includes a hard disc drive (HDD) 200 and a control unit 150 . The HDD 200 is configured to store image data generated by the imaging unit 300 . Note that the HDD 200 may be replaced with another storage medium such as a solid state drive.

The control unit 150 includes a CPU, a RAM, a ROM, and the like, and is configured to control the imaging unit 300 and the like in accordance with information processing. Various control by the control part 150 and PLC14 is demonstrated in detail later.

[2. Suppression of fluctuations in thickness of resin molded products]

In recent years, thickness reduction of a semiconductor package (an example of a resin molded article) progresses, and the product whose thickness is 0.38 mm or 0.43 mm is calculated|required in the market. On the other hand, depending on the quality of the molding process, variations in the thickness within one resin molded article may occur. In a resin molded article having a small thickness, slight variations in thickness have a large influence on the quality of the resin molded article. The variation in thickness in one resin molded product is not the thickness variation when the thicknesses of a plurality of resin molded products are compared, but is a variation in thickness within the plane of one resin molded product, and in a plurality of parts in the resin molded product means the variation in thickness.

For example, when the resin material P is not uniformly supplied to the recessed part 71 of the resin material accommodating part 7, such a problem becomes remarkable. That is, when resin molding is performed in the state in which the resin material P runs short in a part of the area|region of the recessed part 71, a fluctuation|variation will generate|occur|produce in the thickness for every area|region of the completed resin molded article.

4 : is a figure which shows an example of the recessed part 71 in the state to which the resin material P was supplied. As shown in FIG. 4 , the concave portion 71 includes a region T30 and a region T40. In the region T30, the resin material P is sufficiently supplied, but in the region T40, the resin material P is insufficient. In the region where the resin material P is insufficient, the bottom surface of the concave portion 71 is exposed. The color of the bottom surface of the recessed part 71 is a color closer to white than the resin material P.

In the resin molding apparatus 100 which concerns on this embodiment, the resin material P supplied to the resin material accommodating part 7 is imaged by the imaging part 300 before resin molding. The control unit 150 analyzes the image data generated by the imaging unit 300 and controls the resin material supply mechanism 8 based on the analysis result. In the resin molding apparatus 100, since the resin material supply mechanism 8 is controlled based on the analysis result of the supply state of the resin material P in the recessed part 71, since the recessed part 71 The supply condition of the resin material P is improved. As a result, according to the resin molding apparatus 100, the situation in which the resin molded article in which the thickness in one resin molded article fluctuates is manufactured can be suppressed. Hereinafter, the operation of the resin molding apparatus 100 will be described in detail.

[3. Operation of Resin Molding Machine]

5 is a flowchart showing a partial operation procedure in the resin molding apparatus 100 . The processing shown in this flowchart is performed in the state where the resin material accommodating part 7 is located below the discharge port of the resin material supply mechanism 8. FIG. The processing shown in the flowchart on the left is executed by PLC 14 , and the processing shown in the flowchart on the right is executed by the control unit 150 .

With reference to the left side of FIG. 5, PLC14 controls the resin material supply mechanism 8 so that the resin material P may be discharged toward the resin material accommodating part 7 (step S100). PLC14 determines whether discharge of the resin material P has been completed (step S110). If it is determined that the discharge of the resin material P is not completed (No in step S110), PLC14 will continue to perform the process required during discharge of the resin material P. For example, PLC14 moves the movement table 6 so that the resin material P may be uniformly supplied to the recessed part 71 of the resin material accommodating part 7 .

On the other hand, if it is determined that the discharging of the resin material P is complete (YES in step S110), the PLC 14 transmits a signal instructing imaging by the imaging unit 300 (imaging instruction signal) to the control unit ( 150) (S120).

With reference to the right side of FIG. 5, the control part 150 determines whether an imaging instruction signal has been received from PLC14 (step S200). If it is determined that the imaging instruction signal has not been received (No in step S200), the control unit 150 waits until the imaging instruction signal is received.

On the other hand, if it is determined that the imaging instruction signal has been received (Yes in step S200), the control unit 150 controls the resin material P in the recess 71 of the resin material accommodating unit 7 from above. The imaging unit 300 is controlled to image and generate image data (step S210). The control unit 150 controls the imaging unit 300 to store the image data generated by the imaging unit 300 in the HDD 200 (step S220). The control unit 150 executes image data analysis processing (step S230).

6 is a flowchart showing a procedure of an analysis process executed in step S230 of FIG. 5 . Referring to Fig. 6, the control unit 150 reads the image data stored in the HDD 200 (step S300). The control unit 150 performs gradation processing and binarization processing on the read image data (step S310).

In the gradation process, each pixel of the image data is classified into 256 levels [0 (dark) - 255 (light)]. For example, "255" is assigned to a white pixel, and "0" is assigned to a black pixel. In the binarization process, each pixel of image data is classified into "white" or "black". For example, a pixel whose value assigned by the gradation process is equal to or greater than the threshold X1 (for example, 200) is classified as "white", and a pixel whose value assigned by the gradation process is less than the threshold X1 is classified as "black" .

FIG. 7 is a diagram for explaining a region included in image data indicating the concave portion 71 . As shown in Fig. 7, the image data includes areas T1-T18.

Referring again to Fig. 6, the control unit 150 calculates numerical data corresponding to each of the regions T1-T18 included in the image data (step S320). In this embodiment, this numerical data is the number of pixels classified as "white" in each area. That is, in step S320, the number of pixels classified as "white" in each of the areas T1-T18 is calculated. A large number of pixels classified as "white" means that the resin material P is not uniformly supplied and the range in which the surface of the resin material accommodating part 7 is exposed is wide.

The control unit 150 compares each numerical data calculated in step S320 with the threshold X2 (for example, 10), and determines whether or not a problem has occurred in each of the regions T1-T18 (step S330) . The control unit 150 determines, for example, that an area in which the numerical data exceeds the threshold X2 is "poor (NG)", and determines that the area in which the numerical data is equal to or less than the threshold X2 is "good (OK)." That is, in step S320, whether or not a shortage of the resin material P has occurred in each region of the resin material accommodating portion 7 corresponding to each of the regions T1-T18 (the number of pixels in "white" is the threshold X2 greater than or not) is determined. The control unit 150 generates analysis data based on the comparison result in step S330 (step S340).

It is a figure which shows an example of analysis data. As shown in FIG. 8 , the analysis data D1 includes the determination result regarding OK/NG in each area of the image data, and the number of pixels classified as "white" in each area of the image data. contains

With reference again to the right side of FIG. 5, when image analysis is complete|finished in step S230, the control part 150 transmits the analysis data D1 to PLC14 (step S240).

With reference again to the left side of FIG. 5, PLC14 determines whether the analysis data D1 was received from the control part 150 (step S130). If it determines with not receiving the analysis data D1 (No in step S130), PLC14 will wait until the analysis data D1 is received.

On the other hand, if it is determined that the analysis data D1 has been received (Yes in step S130), PLC14 will determine the resin material P in the resin material accommodating part 7 based on the analysis data D1. ), it is determined whether or not there is a problem (step S140). PLC14 determines that there is a problem in the state of the resin material P in the resin material accommodating part 7, for example, when any of the areas T1-T18 is determined to be "NG" (NG ), it is determined that there is no problem in the state of the resin material P in the resin material accommodating part 7 when neither of the areas T1-T18 is determined to be "NG" (OK).

When it is determined that there is no problem in the state of the resin material P in the resin material accommodating part 7 (OK in step S140), PLC14 controls each structure so that it may transfer to the process of performing resin molding. (Step S150). That is, even when PLC14 controls the resin material supply mechanism 8 next time, without changing in particular the operation state of the resin material supply mechanism 8, the operation state of the resin material supply mechanism 8 to keep

On the other hand, when it is determined that there is a problem in the state of the resin material P in the resin material accommodating part 7 (NG in step S140), PLC14 executes a process in the case of determining that it is NG ( step S160). That is, PLC14 stops the resin molding apparatus 100 while changing the control content at the time of controlling the resin material supply mechanism 8 next time and memorizing the change content. When PLC14 controls the resin material supply mechanism 8 next time, for example, in the area|regions T1-T18 determined that the shortage of the resin material P is occurring, PLC14 of the resin material P The resin material supply mechanism 8 is controlled so that the shortage is eliminated. More specifically, the PLC 14 reduces the amount of the resin material P to be supplied to the region where the shortage of the resin material P does not occur, and supplies the region where the shortage of the resin material P has occurred. The amount of the resin material (P) is increased. Thereby, in the recessed part 71 of the resin material accommodating part 7, the resin material P is supplied uniformly.

[4. Characteristic]

As mentioned above, the resin molding apparatus 100 which concerns on this embodiment is comprised so that the resin molded article may be manufactured. The resin molding apparatus 100 includes a resin material supply mechanism 8 , an imaging unit 300 , and a control unit 150 . The resin material supply mechanism 8 is comprised so that the resin material P may be supplied. The imaging unit 300 is configured to image the supplied resin material P and generate image data. The control unit 150 is configured to analyze the image data and control the resin material supply mechanism 8 based on the analysis result.

In the resin molding apparatus 100 , the supplied resin material P is imaged by the imaging unit 300 . The control unit 150 analyzes the image data generated by the imaging unit 300 and controls the resin material supply mechanism 8 based on the analysis result. In the resin molding apparatus 100, since the resin material supply mechanism 8 is controlled based on the analysis result of the supply state of the resin material P, the supply state of the resin material P is improved. As a result, according to the resin molding apparatus 100, the situation in which the resin molded article with which thickness fluctuate|varied within one resin molded article is manufactured can be suppressed.

[5. other embodiment]

The idea of the said embodiment is not limited to embodiment demonstrated above. Hereinafter, an example of another embodiment to which the idea of the said embodiment can be applied is demonstrated.

In the said embodiment, the threshold value X1 used when classifying each pixel into "white" or "black" in the binarization process was common in each of area|regions T1-T18. However, the threshold X1 may be different for each region. Since the region closer to the center of the image data is more important, for example, the threshold X1 used in the central regions T9 and T10 is V1, and the threshold value X1 used in the relatively central regions T8 and T11 is 1.1 times V1. It is good also considering the threshold value X1 used in the surrounding area|regions T1-T7 and T12-T18 as the value of 1.2 times V1. Thereby, the shortage of the resin material P can be detected more strictly with respect to the area|region where the influence by the shortage of the resin material P is large. The explanation is supplemented to explain why the region closer to the center of the image data is more important. The granular resin material P supplied to the resin material accommodating part 7 is conveyed by the lower die 51 of a shaping|molding die, and is arrange|positioned. Thereafter, the resin material P is melted by the heat of the molding die, and resin molding is performed by clamping the upper die 52 and the lower die 51 . At this time, since the resin material P flows so that it may diffuse outward, the shortage of the resin material P in a center area|region tends to become a cause of molding defect. For this reason, the area closer to the center of the image data becomes more important.

In addition, in the said embodiment, in each of area|regions T1-T18, the threshold value X2 with which numerical data was compared was common. However, the threshold value X2 with which numerical data is compared may differ for each area|region. Since the region closer to the center is more important, for example, the threshold value X2 in the central regions T9 and T10 is set to V2, and the threshold value X2 used in the regions T8 and T11 relatively close to the center is 1.5 times V2. It is good also considering the threshold value X2 used in area|regions T1-T7 and T12-T18 around , as a value twice V2. For example, the image data includes a first area and a second area, the numerical data corresponding to the first area is compared with a first threshold (eg, V2), and the numerical data corresponding to the second area is It may be compared with a second threshold (eg, a value of 1.5 times V2). That is, image data may be divided into a plurality of regions, threshold values may be set for each numerical data corresponding to those regions, and the numerical data and threshold values may be compared. Thereby, the shortage of the resin material P can be detected more strictly with respect to the area|region where the influence by the shortage of the resin material P is large.

In addition, in the said embodiment, after discharge of the resin material P was completed, imaging by the imaging part 300 was performed. However, the imaging timing by the imaging unit 300 is not limited to this. For example, the imaging unit 300 is disposed in the vicinity of the discharge port of the resin material supply mechanism 8 , and the imaging unit 300 has a recessed portion ( 71) may be constantly captured. In this case, the control unit 150 determines in real time whether or not there is a problem in the state of the resin material P in the resin material accommodating unit 7 on the basis of the moving image data being imaged, so that the resin material supply mechanism ( 8) may be changed in real time.

In addition, in the said embodiment, if the numerical data did not exceed the threshold value X2 in any of the areas T1-T18, the control contents of the resin material supply mechanism 8 were not changed. However, the conditions under which the control contents of the resin material supply mechanism 8 are changed are not limited to this. For example, as long as there are pixels classified as "white" in the binarization process, the control contents of the resin material supply mechanism 8 may be changed so as to eliminate these pixels. In addition, even in this case, as long as the numerical data does not exceed the threshold value X2 in any of the areas T1-T18, the resin molding apparatus 100 is not forcibly stopped.

In addition, in the said embodiment, image analysis was performed through a gradation process and a binarization process. However, the technique used for image analysis is not limited to this. For example, based on the result of the unevenness measurement based on the 3D image of the concave portion 71 , a region in which the resin material P is insufficient in the concave portion 71 may be detected, pattern matching, statistical method, or AI By using (Artificial Intelligence) or the like, a region in which the resin material P is insufficient in the recess 71 may be detected.

In addition, in the said embodiment, if it is determined that there is a problem in the state of the resin material P in the resin material accommodating part 7 (NG in step S140 of FIG. 5), PLC14 will from the next time. , to decrease the amount of the resin material P to be supplied to the region where the shortage of the resin material P has not occurred, and to increase the amount of the resin material P to be supplied to the region where the shortage of the resin material P has occurred it was made However, the control content by PLC14 from the next time is not limited to this. For example, the PLC 14 refers to the analysis data D1, and decreases the amount of the resin material P to be supplied to an area with fewer pixels classified as "white", and decreases to "white". The amount of the resin material P that is supplied to an area with more classified pixels may be further increased.

In addition, in the said embodiment, control of the resin molding apparatus 100 was performed by PLC14 and the control part 150. As shown in FIG. However, the control performed by PLC14 and the control part 150 may be implement|achieved by one computer, for example, and may be implement|achieved by three or more computers.

In addition, in the above embodiment, the resin molding apparatus 100 includes the HDD 200 . However, the resin molding apparatus 100 does not necessarily include the HDD 200 . The HDD 200 may exist on a cloud server, for example. In this case, the control unit 150 accesses the cloud server through a communication unit (not shown).

In the above, embodiments of the present invention have been exemplarily described. That is, for illustrative purposes, the detailed description and accompanying drawings have been disclosed. Therefore, components that are not essential for solving the problem may be included among the components described in the detailed description and the accompanying drawings. Accordingly, even if such non-essential components are described in the detailed description and accompanying drawings, it should not be immediately admitted that such non-essential components are essential.

In addition, the said embodiment is only the illustration of this invention in all points. Various improvement and change are possible in the said embodiment within the scope of the present invention. That is, in the practice of the present invention, a specific configuration can be appropriately adopted depending on the embodiment.

1: substrate supply
2: Board storage unit
3: Board loading part
4: substrate transfer mechanism
5: Compression molding part
6: Moving table
7: Resin material receiving part
8: resin material feeding device
9: Resin material conveying mechanism
11: Reservoir
12: return path
13: vibration unit
14: PLC
16: weighing part
51: Ha Hyung
51C: cavity
52: hieroglyph
53: mold clamping mechanism
71: recess
72: frame member
73: release film
100: resin molding device
150: control unit
200: HDD
300: imaging unit
A: Board supply/storage module
B: resin molding module
C: Resin material supply module
D1: Analysis data
P: resin material
T1-T18, T30, T40: Area
X1, X2: threshold

Claims (9)

A resin molding apparatus configured to manufacture a resin molded article,
a supply mechanism configured to supply the resin material;
an imaging unit configured to image the supplied resin material from above and generate image data;
and a control unit configured to analyze the image data and control the supply mechanism based on an analysis result. According to claim 1,
The said control part is comprised so that the said image data may be analyzed by performing a gradation process and a binarization process to the said image data. 3. The method of claim 1 or 2,
The resin molding apparatus, wherein the control unit is configured to analyze the image data by generating numerical data based on the image data and comparing the numerical data with a threshold value. 4. The method according to any one of claims 1 to 3,
The image data includes a plurality of areas,
The resin molding apparatus, wherein the control unit is configured to analyze the image data by generating numerical data corresponding to each of the plurality of regions based on the image data, and comparing the numerical data with a threshold value. 5. The method of claim 4,
The plurality of regions includes a first region and a second region different from the first region,
the threshold includes a first threshold and a second threshold different from the first threshold;
the numerical data corresponding to the first region is compared with the first threshold,
The numerical data corresponding to the second region is compared with the second threshold value. 6. The method according to claim 4 or 5,
The control unit determines whether a shortage of the resin material has occurred in each region to which the resin material corresponding to each of the plurality of regions has been supplied through comparison of the respective numerical data with the threshold value, The resin molding apparatus is configured to control the supply mechanism so that the shortage is eliminated in an area where it is determined that the shortage is occurring. 7. The method according to any one of claims 1 to 6,
The control unit controls the supply mechanism to maintain an operating state when the analysis result satisfies a predetermined condition, while, when the analysis result does not satisfy the predetermined condition, the supply to change the operating state A resin molding apparatus, configured to control the mechanism. 8. The method according to any one of claims 1 to 7,
A molding die comprising an upper die and a lower die opposite to the upper die;
A resin molding apparatus further comprising a mold clamping mechanism for clamping the molding die. A method for producing a resin molded article using the resin molding apparatus according to any one of claims 1 to 8,
a step of supplying a resin material;
imaging the supplied resin material from above and generating image data;
analyzing the image data and controlling the supply mechanism based on the analysis result;
disposing the supplied resin material on a lower mold;
The manufacturing method of the resin molded article including the step of performing resin molding by clamping an upper die and the said lower die.

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