KR20210151680A - Holding apparatus, lithography apparatus, and method of manufacturing article - Google Patents

Abstract

The present invention provides a holding apparatus to increase productivity. According to the present invention, the holding apparatus comprises: a suction unit for vacuum-sucking an object; a plurality of generation units installed corresponding to each of a plurality of first lines connected to the suction unit and generating vacuum air supplied to the suction unit through the plurality of first lines; a pump supplying compressed air to the plurality of generation units through a plurality of second lines connected to each of the plurality of generation units; a third line including a plurality of connection lines connected to each of the plurality of second lines and an integrated line integrating the plurality of connection lines; a control valve installed in the integrated line and opening and closing the integrated line to control atmospheric opening of the plurality of second lines through the plurality of connection lines; and a plurality of check valves installed in each of the plurality of connection lines and suppressing the compressed air present in one of the plurality of second lines from flowing into the other of the plurality of second lines through the third line.

Description

HOLDING APPARATUS, LITHOGRAPHY APPARATUS, AND METHOD OF MANUFACTURING ARTICLE

The present invention relates to a holding apparatus, a lithographic apparatus and a method of manufacturing an article.

An exposure apparatus that illuminates an original plate (reticle or mask) with an illumination optical system and projects the original plate pattern onto a substrate (wafer) via a projection optical system has been conventionally used. In the substrate holding device (stage) used in the exposure apparatus, the number of systems for substrate adsorption tends to increase with the recent increase in the size of the substrate, and as a countermeasure against the warpage (shape) of the substrate, the substrate is adsorbed for each area. A split adsorption method is employed.

In general, as disclosed in Japanese Unexamined Patent Application Laid-Open No. 5-39798 and Japanese Unexamined Patent Application Publication No. Hei 11-340305, the substrate holding device uses vacuum air and vacuum air generated by the vacuum generator for substrate adsorption. Often times. In this case, vacuum air or compressed air to the vacuum generator is supplied from the adsorption control unit to the substrate adsorption unit or the vacuum generating device, and vacuum air or compressed air is supplied or stopped by a supply valve in the adsorption control unit, whereby the substrate adsorption unit is supplied or stopped. Control of vacuum adsorption or vacuum opening of the substrate placed on the substrate is performed.

However, in the prior art, when vacuum adsorption to the substrate is released, even if the supply of vacuum air or compressed air to the adsorption control unit is stopped, the vacuum air or compressed air remaining in the tube between the stage and the adsorption control unit adsorbs the substrate. continues to be supplied to the wealth. For this reason, it takes time to open the vacuum in the substrate adsorption part, which becomes a factor of reducing productivity. In addition, although it is also conceivable to provide an atmospheric release valve in each split adsorption system in order to shorten the time required for vacuum opening, the enlargement and cost increase of the stage and piping unit due to the increase in the atmospheric release valve become a problem.

The present invention provides a technique advantageous for improving productivity by shortening the time required for vacuum opening in an adsorption unit for vacuum adsorbing an object.

A holding device as an aspect of the present invention is a holding device for holding an object, and is provided corresponding to each of a suction unit for vacuum adsorbing the object, and a plurality of first lines connected to the suction unit, the plurality of Compressed air is supplied to the plurality of generators through a plurality of generators for generating vacuum air supplied to the adsorption section through a first line of and a third line including a pump, a plurality of connection lines connected to each of the plurality of second lines, and an integrated line for integrating the plurality of connection lines, and installed in the integrated line, the integrated line a control valve for controlling atmospheric release of the plurality of second lines through the plurality of connection lines by opening and closing It is characterized in that it has a plurality of check valves for suppressing the compressed air from flowing into the other of the plurality of second lines through the third line.

Further objects or other aspects of the present invention will become apparent by means of the embodiments described hereinafter with reference to the accompanying drawings.

According to the present invention, for example, it is possible to provide a technique advantageous for improving productivity by shortening the time required for vacuum opening in an adsorption unit for vacuum adsorbing an object.

1 is a schematic diagram showing the configuration of an exposure apparatus as an aspect of the present invention.
Fig. 2 is a diagram showing an example of a specific configuration of an adsorption unit.
Fig. 3 is a diagram showing the configuration of the holding device in the first embodiment.
Fig. 4 is a diagram showing the configuration of the holding device in the first embodiment.
Fig. 5 is a diagram showing the configuration of the holding device in the first embodiment.
Fig. 6 is a diagram showing the configuration of the holding device according to the second embodiment.
Fig. 7 is a diagram showing the configuration of the holding device according to the second embodiment.
Fig. 8 is a diagram showing the configuration of the holding device according to the second embodiment.
Fig. 9 is a diagram showing the configuration of the holding device according to the third embodiment.
Fig. 10 is a diagram showing the configuration of the holding device according to the third embodiment.
Fig. 11 is a diagram showing the configuration of the holding device according to the third embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment is described in detail with reference to an accompanying drawing. In addition, the following embodiment does not limit the invention which concerns on a claim. Although a plurality of features are described in the embodiment, it is not limited to all of these plurality of features being essential to the invention, and a plurality of features may be arbitrarily combined. In addition, in the accompanying drawings, the same reference numbers are attached to the same or the same structure, and the overlapping description is abbreviate|omitted.

1 is a schematic diagram showing the configuration of an exposure apparatus 100 as an aspect of the present invention. The exposure apparatus 100 is a lithographic apparatus employed in a lithography process that is a manufacturing process of a semiconductor device or a liquid crystal display element, and forms a pattern on a substrate using an original plate. The exposure apparatus 100 exposes the substrate W through a reticle (mask) R serving as an original plate, and performs exposure processing in which the pattern of the reticle R is transferred to the substrate W. For the exposure apparatus 100 , a step-and-scan method, a step-and-repeat method, and other exposure methods can be employed. In addition, in this specification and accompanying drawings, the direction parallel to the surface of the board|substrate W is shown by the XX coordinate system used as an X-plane. A direction parallel to each of the X-axis, Y-axis, and Z-axis in the XY coordinate system is defined as the X-direction, the Y-direction, and the Z-direction.

The exposure apparatus 100 includes an illumination optical system 120 for illuminating a reticle R with light from a light source 110, a projection optical system 130 for projecting a pattern formed on the reticle R onto a substrate W, and a substrate W as an object. It has a holding device 200 to hold, and a control unit 150 .

The light source 110 includes excimer lasers such as a mercury lamp having a wavelength of about 365 nm, a KF excimer laser having a wavelength of about 248 nm, and an AFA excimer laser having a wavelength of about 193 nm, and emits light in a plurality of wavelength bands as exposure light (output )do.

The illumination optical system 120 includes a light blocking plate 121 , a half mirror 122 , a photosensor 123 , a mirror 124 , a stereoscopic optical system (not shown), and an optical integrator (not shown). includes The light emitted from the light source 110 is shaped into a predetermined shape through the shaping optical system, and is incident on the optical integrator. The optical integrator forms a plurality of secondary light sources for illuminating the reticle R with a uniform illuminance distribution. In the reticle R, a pattern to be transferred to the substrate W (eg, a circuit pattern of a device) is formed on the surface thereof. The light shielding plate 121 is disposed on the optical path of the illumination optical system 120 to define (form) an arbitrary illumination area on the reticle. The half mirror 122 is disposed on the optical path of the illumination optical system 120 and reflects (extracts) a part of the exposure light that illuminates the reticle R. The photosensor 123 is disposed on the optical path of the light reflected by the half mirror 122 , and outputs a signal corresponding to the intensity (exposure energy) of the exposure light to the control unit 150 . The control unit 150 controls the light blocking plate 121 and the like based on a signal output from the photosensor 123 .

The projection optical system 130 is a refractive optical system or a catadioptric optical system, which reduces the pattern of the reticle R to a magnification β (for example, β = 1/2), and a resist (photosensitizer) coated substrate W (of It is projected (imaged) on the shot area). The projection optical system 130 includes, for example, an optical element 131 and an aperture stop 132 . The first driving unit 101 drives (moves) the optical element 131 in a direction (Z-axis direction) along the optical axis of the projection optical system 130 under the control of the control unit 150 . By driving the optical element 131, it is possible to suppress an increase in various aberrations of the projection optical system 130 while maintaining good projection magnification, thereby reducing distortion errors. The aperture stop 132 is disposed on the pupil plane (Fourier transform plane with respect to the reticle R) of the projection optical system 130 . The opening stopper 132 has a circular opening. The second driving unit 102 adjusts (controls) the diameter of the opening of the aperture stopper 132 under the control of the control unit 150 .

The holding device 200 includes a stage 140 , an adsorption unit 160 , and an adsorption control unit 170 , and is implemented as a holding mechanism holding the substrate W in the present embodiment.

The stage 140 is a movable stage by supporting the adsorption unit 160 . The stage 140 is controlled with respect to six degrees of freedom by the third driving unit 103 to position the substrate W. Here, the six degrees of freedom includes translational degrees of freedom along each axis of the XX coordinate system and rotational degrees of freedom around each axis.

The position of the stage 140 in the X-plane is obtained by measuring the distance to the mirror 141 fixed to the stage 140 with the laser interferometer 142 . The positional relationship between the stage 140 and the substrate W is measured by the alignment measurement system 104 .

The defocus of the substrate W is measured by a focus measurement system FM including a light projection optical system 105 and a detection optical system 106 . The light projection optical system 105 transmits light that does not sensitize the resist applied to the substrate W. The detection optical system 106 detects the light reflected from the substrate W. In the detection optical system 106, a plurality of light-receiving elements are arranged in correspondence with the light reflected from the substrate W. Each light-receiving surface of the plurality of light-receiving elements is configured to be substantially conjugate with each reflection point of the light reflected from the substrate W via the imaging optical system. Accordingly, the defocus of the substrate W is measured in the detection optical system 106 as a misalignment of the light incident on the light receiving element (light receiving surface).

The adsorption unit 160 is supported by the stage 140 . The adsorption unit 160 vacuum adsorbs (holds) the substrate W under the control of the adsorption control unit 170 . In addition, in this embodiment, although the adsorption|suction control part 170 is provided separately from the control part 150, it is not limited to this. For example, the control part 150 may have the function of the adsorption|suction control part 170. As shown in FIG.

The control unit 150 is constituted by an information processing apparatus (computer) including a CPU, a memory, and the like, and controls the entire exposure apparatus 100 according to a program stored in the storage unit 152 . The control unit 150 controls each unit of the exposure apparatus 100, and performs exposure processing in which the substrate is exposed and the pattern of the reticle R is transferred to each shot region on the substrate, and various processing related to the exposure processing.

A specific configuration of the adsorption unit 160 will be described with reference to FIG. 2 . The adsorption unit 160 includes adsorption regions 11, 12, and 13 divided (divided) by boundaries 21, 22, and 23, as shown in FIG. Further, in the suction unit 160 , suction holes 31 , 32 , and 33 for vacuum adsorbing the substrate W by discharging air from the suction regions 11 , 12 and 13 , and pin lifting holes 41 , 42 and 43 are provided in the suction unit 160 . It is provided through (that is, as a through hole). The pin lifting holes 41 to 43 are openings for raising the lifting pins (not shown) when transferring (transferring) the substrate W between the suction unit 160 and the substrate transfer hand (not shown). . The board|substrate carrying hand puts the board|substrate W on the lifting pins raised from the pin raising/lowering holes 41-43. Then, after the substrate transfer hand is retracted, the substrate W is placed on the suction unit 160 by lowering the lifting pins.

Hereinafter, the specific structure and function of the holding|maintenance apparatus 200 are demonstrated in each embodiment.

<First embodiment>

3 and 4 are diagrams showing an example of the configuration of the holding device 200A in the first embodiment, particularly, piping of the holding device 200A. The holding device 200A is a holding mechanism that is incorporated in the exposure apparatus 100 as the holding device 200 and holds the substrate W.

3 shows a state when the holding device 200A holds the substrate W, that is, the suction unit 160 vacuum-sucks the substrate W. As shown in FIG. In each of the adsorption regions 11 to 13 of the adsorption unit 160, a plurality of small projections for supporting the substrate W when the substrate W is vacuum-adsorbed are provided.

Each of the plurality of adsorption holes 31, 32 and 33 provided in the adsorption unit 160 generates a plurality of vacuums through a plurality of first lines L1 connected to each of the adsorption holes 31, 32 and 33 (the adsorption unit 160). It is connected to parts E1, E2 and E3. The vacuum generating units E1 to E3 are provided corresponding to each of the first lines L1 in the present embodiment, and generate vacuum air supplied to the adsorption units 160 (adsorption holes 31 to 33) through the first line L1. It is a vacuum generator that Each of the vacuum generating units E1 to E3 is constituted by an ejector in the present embodiment.

A plurality of second lines L2 are connected to the plurality of vacuum generators E1, E2 and E3, and through the plurality of second lines L2, the vacuum generators E1 to E3 supply compressed air to the vacuum generators E1 to E3. It is connected to the compressed air pump 173 which supplies. Further, in each of the plurality of second lines L2, between each of the plurality of vacuum generating units E1, E2, and E3 and the compressed air pump 173, a plurality of air operator valves AV1 and AV2 each including a solenoid valve and AV3 are installed. The air operator valves A1 to AV3 control the supply of compressed gas from the compressed air pump 173 to the vacuum generators E1 to E3 and the stop of the supply of such compressed gas by opening and closing the second line L2 with a solenoid valve. valve for The air operator valves AV1 to AV3 are connected to the compressed air pump 173 through the branch manifold 171 in the present embodiment.

In the plurality of second lines L2, between each of the vacuum generating units E1 to E3 and each of the air operator valves AV1 to AV3, a third line L3 is a branching path branching from each of the plurality of second lines L2. connected. The third line L3 includes a plurality of connection lines L3 connected to each of the plurality of second lines L2, and an integrated line MLS for integrating the plurality of connection lines L2. In addition, the integrated line MLE is provided with a solenoid valve 701 as a control valve for controlling the atmospheric release of the plurality of second lines L2 through the plurality of connection lines L2 by opening and closing the integrated line MLE. Further, in each of the plurality of connection lines L2, a plurality of check valves CV1 for suppressing (preventing) that compressed air existing in one of the plurality of second lines L2 flows into the other line through the third line L3; CV2 and CV3 are installed.

When the substrate W is vacuum-adsorbed by the adsorption unit 160 , the adsorption control unit 170 controls the air operator valves AV1 to AV3 (the solenoid valves) to the OPN state so as to open the plurality of lines L2. By discharging the compressed air supplied from the compressed air pump 173 to the vacuum generating units E1 to E3 from each of the vacuum generating units E1 to E3 to the inside of the stage 140, the vacuum air is generated in each of the vacuum generating units E1 to E3. is created The vacuum air generated in each of the vacuum generating units E1 to E3 is supplied to each of the suction holes 31 to 33 through the first line L1, and the substrate W is vacuum-adsorbed by the suction unit 160 .

As described above, a third line L3 (branch path) connected to the solenoid valve 701 functioning as an exhaust port in this embodiment is provided between the vacuum generating units E1 to E3 and the air operator valves AV1 to AV3. has been When the substrate W is vacuum-adsorbed by the adsorption unit 160 , the adsorption control unit 170 controls the solenoid valve 701 to the CLAOSE state so as to close the integrated line MLA (the third line L3 ). Accordingly, the compressed air flowing into (flowing into) the third line L3 from the plurality of second lines L2 is sealed. In addition, the return of the compressed air flowing into the third line L3 to the second line L2 through the solenoid valve 701 (that is, return to the system connected to the other outlet) is a check valve installed in the connection line L3. It is prevented by CV1 to CV3.

Fig. 4 shows the state when the holding device 200A does not hold the substrate W, that is, the vacuum adsorption of the substrate W by the suction unit 160 is canceled and, for example, the substrate W is being conveyed. is showing When the vacuum adsorption of the substrate W by the adsorption unit 160 is canceled, the adsorption control unit 170 controls the air operator valves AV1 to AV3 (the solenoid valves) to the CLAOSE state so as to close the plurality of second lines L2. . Accordingly, the supply of compressed air from the compressed air pump 173 to the vacuum generating units E1 to E3 is stopped. At the same time, the adsorption control unit 170 controls the solenoid valve 701 serving as the exhaust port to be in the OPN state so as to open the integrated line ML. Accordingly, the compressed air remaining in the second line L2 between each of the vacuum generating units E1 to E3 and each of the air operator valves AV1 to AV3 is transferred from the third line L3 connected to the solenoid valve 701 to electrons. It flows into the valve 701 and discharges from the solenoid valve 701. Accordingly, the supply of compressed air from the compressed air pump 173 to the vacuum generating units E1 to E3 is stopped immediately, and the time required for vacuum opening in the adsorption unit 160 can be shortened. For this reason, according to the exposure apparatus 100 which has 200 A of holding|maintenance apparatuses of this embodiment, the time required for sending/receiving the board|substrate W is shortened, and it becomes advantageous to the improvement of productivity (throughput).

In addition, in this embodiment, the adsorption control unit 170 controls the opening and closing of the plurality of second lines L2 at once, that is, the plurality of air operator valves AV1 to AV3 are all controlled to be in the same state. It is not limited to this. For example, as shown in FIG. 5 , the adsorption control unit 170 may individually control the states of the plurality of air operator valves AV1 to AV3 so that the respective openings and closings of the plurality of second lines L2 are independently controlled. good. Fig. 5 shows a state in which only the air operator valve AV1 is controlled to the OPN state, compressed air is supplied only to the vacuum generating unit E1, and the substrate W is vacuum adsorbed only by the suction hole 31 provided in the adsorption unit 160. .

<Second embodiment>

6 and 7 are diagrams showing an example of the configuration of the holding device 200B in the second embodiment, particularly, piping of the holding device 200B. The holding device 200B is a holding mechanism that is incorporated in the exposure apparatus 100 as the holding device 200 and holds the substrate W.

6 shows a state in which the holding device 200B holds the substrate W, that is, the suction unit 160 vacuum-sucks the substrate W. As shown in FIG. In the plurality of first lines L1, between each of the suction holes 31 to 33 provided in the suction unit 160 and each of the vacuum generating units E1 to E3, there is a branching path branching from each of the plurality of first lines L1. The third line L3 is connected as The third line L3 includes a plurality of connection lines L3 connected to each of the plurality of first lines L1, and an integrated line MLE for integrating the plurality of connection lines L1. In addition, the integrated line MLE is provided with a solenoid valve 801 as a control valve for controlling the atmospheric release of the plurality of first lines L1 through the plurality of connection lines L1 by opening and closing the integrated line MLE. Further, in each of the plurality of connection lines L1, a plurality of check valves CV1 for suppressing (preventing) that vacuum air existing in one line among the plurality of first lines L1 flows into the other line through the third line L3 , CV2 and CV3 are installed.

When the substrate W is vacuum-adsorbed by the adsorption unit 160 , the adsorption control unit 170 controls the air operator valves AV1 to AV3 (the solenoid valves) to the OPN state so as to open the plurality of second lines L2. By discharging the compressed air supplied from the compressed air pump 173 to the vacuum generating units E1 to E3 from each of the vacuum generating units E1 to E3 to the inside of the stage 140, the vacuum air is generated in each of the vacuum generating units E1 to E3. is created The vacuum air generated in each of the vacuum generating units E1 to E3 is supplied to each of the suction holes 31 to 33 through the first line L1, and the substrate W is vacuum-adsorbed by the suction unit 160 .

Between the suction holes 31 to 33 provided in the suction unit 160 and the vacuum generating units E1 to E3, as described above, in this embodiment, a third line is connected to the solenoid valve 801 functioning as an atmospheric release port. L3 (branch path) is installed. When the substrate W is vacuum-adsorbed by the adsorption unit 160 , the adsorption control unit 170 controls the solenoid valve 801 to the CLAOSE state so as to close the integrated line MLA (the third line L3 ). Accordingly, the vacuum air flowing into (flowing into) the third line L3 from the plurality of first lines L1 is sealed. In addition, the return of the vacuum air flowing into the third line L3 to the first line L1 through the solenoid valve 801 (that is, returning to the system connected to the other outlet) is a check valve installed in the connection line L3. It is prevented by CV1 to CV3.

Fig. 7 shows a state in which the holding device 200B does not hold the substrate W, that is, the vacuum adsorption of the substrate W by the suction unit 160 is canceled and, for example, the substrate W is being conveyed. is showing When the vacuum adsorption of the substrate W by the adsorption unit 160 is canceled, the adsorption control unit 170 controls the air operator valves AV1 to AV3 (solenoid valves) to the CLAPS state so as to close the plurality of second lines L2. . Accordingly, the supply of compressed air from the compressed air pump 173 to the vacuum generating units E1 to E3 is stopped. At the same time, the adsorption control unit 170 controls the solenoid valve 801 serving as the atmospheric release port to the OPN state so as to open the integrated line ML. Thereby, the atmosphere is pushed in from the solenoid valve 801 through the third line L3 and into the plurality of first lines L1 between each of the suction holes 31 to 33 and each of the vacuum generating units E1 to E3. On the other hand, the compressed air remaining in the plurality of second lines L2 between each of the vacuum generating units E1 to E3 and each of the air operator valves AV1 to AV3 is supplied to the stage 140 from each of the vacuum generating units E1 to E3. is discharged inside the For this reason, to the plurality of first lines L1 between each of the suction holes 31 to 33 and each of the vacuum generating units E1 to E3, temporarily (that is, when the compressed air remaining in the second line L2 is discharged) up to), vacuum air is supplied from the vacuum generating units E1 to E3. However, since the atmosphere also pushes into the plurality of first lines L1 between each of the adsorption holes 31 to 33 and each of the vacuum generating units E1 to E3 from the third line L3, in the plurality of first lines L1 vacuum can be released to the atmosphere. Accordingly, the time required for vacuum opening in the adsorption unit 160 can be shortened. For this reason, according to the exposure apparatus 100 which has the holding|maintenance apparatus 200B of this embodiment, the time required for sending/receiving the board|substrate W is shortened, and it becomes advantageous to the improvement of productivity (throughput).

In addition, in this embodiment, the adsorption control unit 170 controls the opening and closing of the plurality of second lines L2 at once, that is, the plurality of air operator valves AV1 to AV3 are all controlled to be in the same state. It is not limited to this. For example, as shown in FIG. 8 , the adsorption control unit 170 may individually control the states of the plurality of air operator valves AV1 to AV3 so that the respective opening and closing of the plurality of second lines L2 are independently controlled. good. Fig. 8 shows a state in which only the air operator valve AV1 is controlled to the OPN state, compressed air is supplied only to the vacuum generating unit E1, and the substrate W is vacuum adsorbed only by the suction hole 31 provided in the suction unit 160. .

<Third embodiment>

9 and 10 are diagrams showing an example of the configuration of the holding device 200C in the third embodiment, particularly, piping of the holding device 200C. The holding device 200C is a holding mechanism that is incorporated in the exposure apparatus 100 as the holding device 200 and holds the substrate W.

Fig. 9 shows a state in which the holding device 200C holds the substrate W, that is, the suction unit 160 vacuum-sucks the substrate W. Each of the plurality of adsorption holes 31, 32, and 33 provided in the adsorption unit 160 is connected to each of the adsorption holes 31, 32 and 33 (the adsorption unit 160) through a plurality of first lines L1 connected to the vacuum pump 273 ) is connected to The vacuum pump 273 exhausts the plurality of first lines L1 to generate vacuum air supplied to each of the plurality of suction holes 31 to 33 (the suction unit 160 ). In each of the plurality of first lines L1 , a plurality of solenoid valves SV1 , SV2 , and SV3 are provided between the suction unit 160 and the vacuum pump 273 . The solenoid valves SV1 to SV3 open and close each of the plurality of first lines L1 , thereby evacuating the plurality of first lines L1 by the vacuum pump 273 , and the plurality of first lines L1 by the vacuum pump 273 . It is a valve to control the stop of exhaust of The solenoid valves SV1 to SV3 include three or more ports in the present embodiment, and are connected to the vacuum pump 273 via the branch manifold 171 .

In the plurality of first lines L1, between each of the suction holes 31 to 33 provided in the suction unit 160 and each of the solenoid valves SV1 to SV3, as a branch path branching from each of the plurality of first lines L1 A second line L22 is connected. The second line L22 includes a plurality of connection lines L1 connected to each of the plurality of first lines L1, and an integrated line M1 that integrates the plurality of connection lines L1. Further, the integrated line MLA is provided with a solenoid valve 801 as a control valve for controlling the atmospheric release of the plurality of first lines L1 through the plurality of connection lines L1 by opening and closing the integrated line MLA. Further, each of the plurality of connection lines L1 includes a plurality of check valves CV1 for suppressing (preventing) that vacuum air existing in one of the plurality of first lines L1 flows into the other line through the second line L22; CV2 and CV3 are installed.

When the substrate W is vacuum-adsorbed by the adsorption unit 160 , the adsorption control unit 170 controls the solenoid valves SV1 to SV3 to the OPN state so as to open the plurality of first lines L1 . Between the suction holes 31 to 33 provided in the suction unit 160 and the solenoid valves SV1 to SV3, as described above, in this embodiment, the third line L3 connected to the solenoid valve 801 functioning as an atmospheric release port. (branch path) is installed. When the substrate W is vacuum-adsorbed by the adsorption unit 160 , the adsorption control unit 170 controls the solenoid valve 801 to be in the CLAOSE state so as to close the integrated line MLA (second line L22). Accordingly, the vacuum air flowing into (flowing into) the second line L22 from the plurality of first lines L1 is sealed. In addition, the return of the vacuum air flowing into the second line L22 to the first line L1 through the solenoid valve 801 (that is, returning to the system connected to another outlet) is a check valve installed in the connection line L1. It is prevented by CV1 to CV3. Accordingly, vacuum air is supplied to each of the suction holes 31 to 33 through the first line L1 , and the substrate W is vacuum-adsorbed by the suction unit 160 .

Fig. 10 shows a state in which the holding device 200C does not hold the substrate W, that is, the vacuum adsorption of the substrate W by the suction unit 160 is canceled and, for example, the substrate W is being conveyed. is showing When the vacuum adsorption of the substrate W by the adsorption unit 160 is canceled, the adsorption control unit 170 controls the solenoid valves SV1 to SV3 to the CLASOEL state so as to close the plurality of first lines L1. Thereby, supply of the vacuum air from the vacuum pump 273 to the suction holes 31 to 33 is stopped. Further, the atmosphere is pushed in from the other ports of the solenoid valves SV1 to SV3, and the plurality of first lines L1 between the suction holes 31 to 33 and the solenoid valves SV1 to SV3 are released to the atmosphere from a vacuum state. At the same time, the adsorption control unit 170 controls the solenoid valve 801 serving as the atmospheric release port to the OPIN state so as to open the integrated line ML1. Thereby, the atmosphere pushes into the plurality of first lines L1 from the solenoid valve 801 through the second line L22 between each of the suction holes 31 to 33 and each of the solenoid valves SV1 to SV3. In addition to the air pushed in from the solenoid valves SV1 to SV3, the air is pushed in also from the second line L22, so that the time required for vacuum opening in the adsorption unit 160 can be shortened. For this reason, according to the exposure apparatus 100 which has 200 C of holding apparatuses of this embodiment, the time required for sending/receiving the board|substrate W is shortened, and it becomes advantageous to the improvement of productivity (throughput).

In addition, in the present embodiment, the adsorption control unit 170 controls the opening and closing of the plurality of first lines L1 at once, that is, the plurality of solenoid valves SV1 to SV3 are all controlled to be in the same state. is not limited to For example, as shown in FIG. 11 , the adsorption control unit 170 may individually control the states of the plurality of solenoid valves SV1 to SV3 so that the opening and closing of each of the plurality of first lines L1 are independently controlled. . FIG. 11 shows a state in which only the solenoid valve SV1 is controlled to the OPI state, and the substrate W is vacuum-adsorbed only by the suction hole 31 provided in the suction unit 160 .

In the above-described embodiment, the suction unit 160 is composed of one suction member, specifically, a suction member (so-called chuck) on which the substrate W is placed and vacuum-sucks the substrate W, and the suction member includes a plurality of A plurality of adsorption holes 31 to 33 connected to each of the lines L1 are provided. However, the adsorption|suction part 160 may be comprised with the some adsorption|suction member. In this case, each of the suction members may be provided with a plurality of suction holes 31 to 33 connected to each of the plurality of lines L1, or may be provided with a plurality of suction holes connected to at least one line among the plurality of lines L1.

The method for manufacturing an article according to the embodiment of the present invention is also suitable for manufacturing articles such as devices (semiconductor elements, magnetic storage media, liquid crystal display elements, etc.), for example. This manufacturing method includes, using the exposure apparatus 100 , a process of forming a pattern on a substrate, a process of processing the substrate on which the pattern has been formed, and a process of manufacturing an article from the processed substrate. In addition, this manufacturing method may include other well-known processes (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the prior art.

In addition, the present invention is not limited to the lithographic apparatus to the exposure apparatus, and can be applied to, for example, an imprint apparatus. The imprint apparatus brings the imprint material supplied (arranged) on the substrate into contact with the mold (original plate), and applies energy for curing to the imprint material, thereby forming a pattern of the cured product onto which the pattern of the mold is transferred.

The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Accordingly, the claims are attached to clarify the scope of the invention.

Claims (25)

a holding device that holds an object,
an adsorption unit for vacuum adsorbing the object;
a plurality of generating units provided corresponding to each of the plurality of first lines connected to the adsorption unit and generating vacuum air supplied to the adsorption unit through the plurality of first lines;
a pump for supplying compressed air to the plurality of generating units through a plurality of second lines connected to each of the plurality of generating units;
a third line including a plurality of connection lines connected to each of the plurality of second lines, and an integrated line for integrating the plurality of connection lines;
a control valve installed in the integrated line and configured to open and close the integrated line to control atmospheric release of the plurality of second lines through the plurality of connection lines;
A plurality of lines installed in each of the plurality of connection lines to prevent the compressed air existing in one line among the plurality of second lines from flowing into another line among the plurality of second lines through the third line of the check valve,
Retention device, characterized in that it has.
The method of claim 1,
It is provided between each of the plurality of generators and the pump and opens and closes each of the plurality of second lines to supply the compressed air from the pump to the plurality of generators, and from the pump to the The holding device further comprising a plurality of valves for controlling the stop of the supply of the compressed air to the plurality of generators.
3. The method of claim 2,
Further comprising a control unit for controlling the control valve and the plurality of valves,
The control unit is
When the object is vacuum-adsorbed by the adsorption unit, the control valve and the plurality of valves are controlled to close the integrated line to open the plurality of second lines,
and controlling the control valve and the plurality of valves so as to open the integrated line and close the plurality of second lines when the vacuum adsorption of the object by the adsorption unit is canceled.
4. The method of claim 3,
The control unit individually controls the plurality of valves so that opening and closing of each of the plurality of second lines is independently controlled.
The method of claim 1,
and each of the plurality of generating units includes an ejector configured to generate the vacuum air by discharging the compressed air supplied from the pump.
The method of claim 1,
The adsorption unit includes an adsorption member on which the object is placed to vacuum adsorb the object,
The holding device, wherein the suction member is provided with a plurality of suction holes connected to each of the plurality of first lines.
The method of claim 1,
The adsorption unit includes a plurality of adsorption members on which the objects are placed on each other to vacuum-suck the objects, respectively,
A holding device characterized in that each of the plurality of suction members is provided with a suction hole connected to at least one of the plurality of first lines.
a holding device that holds an object,
an adsorption unit for vacuum adsorbing the object;
a plurality of generating units provided corresponding to each of the plurality of first lines connected to the adsorption unit and generating vacuum air supplied to the adsorption unit through the plurality of first lines;
a pump for supplying compressed air to the plurality of generating units through a plurality of second lines connected to each of the plurality of generating units;
a third line comprising a plurality of connection lines connected to each of the plurality of first lines, and an integrated line for integrating the plurality of connection lines;
a control valve installed in the integrated line to control the atmospheric opening of the plurality of first lines through the plurality of connection lines by opening and closing the integrated line;
A plurality of lines installed in each of the plurality of connection lines to prevent the vacuum air present in one line among the plurality of first lines from flowing into another line among the plurality of first lines through the third line of the check valve,
Retention device, characterized in that it has.
9. The method of claim 8,
It is provided between each of the plurality of generators and the pump and opens and closes each of the plurality of second lines to supply the compressed air from the pump to the plurality of generators, and from the pump to the The holding device further comprising a plurality of valves for controlling the stop of the supply of the compressed air to the plurality of generators.
10. The method of claim 9,
Further comprising a control unit for controlling the control valve and the plurality of valves,
The control unit is
When the object is vacuum-adsorbed by the adsorption unit, the control valve and the plurality of valves are controlled to close the integrated line to open the plurality of second lines,
and controlling the control valve and the plurality of valves so as to open the integrated line and close the plurality of second lines when the vacuum adsorption of the object by the adsorption unit is canceled.
11. The method of claim 10,
The control unit individually controls the plurality of valves so that opening and closing of each of the plurality of second lines is independently controlled.
9. The method of claim 8,
and each of the plurality of generating units includes an ejector configured to generate the vacuum air by discharging the compressed air supplied from the pump.
9. The method of claim 8,
The adsorption unit includes an adsorption member on which the object is placed to vacuum adsorb the object,
The holding device, wherein the suction member is provided with a plurality of suction holes connected to each of the plurality of first lines.
9. The method of claim 8,
The adsorption unit includes a plurality of adsorption members on which the objects are placed on each other to vacuum-suck the objects, respectively,
A holding device characterized in that each of the plurality of suction members is provided with a suction hole connected to at least one of the plurality of first lines.
a holding device that holds an object,
an adsorption unit for vacuum adsorbing the object;
a pump for evacuating a plurality of first lines connected to the adsorption unit to generate vacuum air supplied to the adsorption unit;
It is installed between the adsorption unit and the pump, and by opening and closing each of the plurality of first lines, exhaust of the plurality of first lines by the pump, and the plurality of first lines by the pump A plurality of solenoid valves for controlling the stop of the exhaust,
a second line comprising a plurality of connection lines connected to each of the plurality of first lines, and an integrated line for integrating the plurality of connection lines;
a control valve installed in the integrated line and configured to open and close the integrated line to control the atmospheric opening of the plurality of first lines through the plurality of connection lines;
A plurality of lines installed in each of the plurality of connection lines and configured to prevent the vacuum air present in one line among the plurality of first lines from flowing into another line among the plurality of first lines through the second line of the check valve,
Have,
Each of the plurality of solenoid valves is a solenoid valve including three or more ports.
16. The method of claim 15,
Further comprising a control unit for controlling the plurality of solenoid valves and the control valve,
The control unit is
When the object is vacuum-adsorbed by the adsorption unit, the plurality of solenoid valves and the control valve are controlled to open the plurality of first lines to close the integrated line,
When the vacuum adsorption of the object by the adsorption unit is released, the plurality of solenoid valves and the control valve are controlled to close the plurality of first lines to open the integrated line. .
16. The method of claim 15,
The adsorption unit includes an adsorption member on which the object is placed to vacuum adsorb the object,
The holding device, wherein the suction member is provided with a plurality of suction holes connected to each of the plurality of first lines.
16. The method of claim 15,
The adsorption unit includes a plurality of adsorption members on which the objects are placed on each other to vacuum-suck the objects, respectively,
A holding device characterized in that each of the plurality of suction members is provided with a suction hole connected to at least one of the plurality of first lines.
A lithographic apparatus for forming a pattern on a substrate,
A lithographic apparatus comprising the holding device according to claim 1 for holding the substrate as an object.
20. The method of claim 19,
and a projection optical system for projecting the pattern of the original plate onto the substrate held by the holding device.
A lithographic apparatus for forming a pattern on a substrate,
A lithographic apparatus comprising the holding device according to claim 8 for holding the substrate as an object.
A lithographic apparatus for forming a pattern on a substrate,
A lithographic apparatus comprising the holding device according to claim 15 for holding the substrate as an object.
A step of forming a pattern on a substrate using the lithographic apparatus according to claim 19;
processing the substrate on which the pattern is formed by the above process;
manufacturing an article from the treated substrate;
A method of manufacturing an article, characterized in that it has
A step of forming a pattern on a substrate using the lithographic apparatus according to claim 21;
processing the substrate on which the pattern is formed by the above process;
manufacturing an article from the treated substrate;
A method of manufacturing an article, characterized in that it has
A step of forming a pattern on a substrate using the lithographic apparatus according to claim 22;
processing the substrate on which the pattern is formed by the above process;
manufacturing an article from the treated substrate;
A method of manufacturing an article, characterized in that it has

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