KR20210113063A - 경화성 수지 조성물, 드라이 필름, 경화물 및 전자 부품 - Google Patents

경화성 수지 조성물, 드라이 필름, 경화물 및 전자 부품 Download PDF

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Publication number
KR20210113063A
KR20210113063A KR1020210027961A KR20210027961A KR20210113063A KR 20210113063 A KR20210113063 A KR 20210113063A KR 1020210027961 A KR1020210027961 A KR 1020210027961A KR 20210027961 A KR20210027961 A KR 20210027961A KR 20210113063 A KR20210113063 A KR 20210113063A
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KR
South Korea
Prior art keywords
resin composition
curable resin
alkali
hindered phenolic
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020210027961A
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English (en)
Korean (ko)
Inventor
신이치로 후쿠다
히데카즈 미야베
Original Assignee
다이요 잉키 세이조 가부시키가이샤
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Publication date
Application filed by 다이요 잉키 세이조 가부시키가이샤 filed Critical 다이요 잉키 세이조 가부시키가이샤
Publication of KR20210113063A publication Critical patent/KR20210113063A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/134—Phenols containing ester groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/04—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing halogen atoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
KR1020210027961A 2020-03-06 2021-03-03 경화성 수지 조성물, 드라이 필름, 경화물 및 전자 부품 Pending KR20210113063A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020039156 2020-03-06
JPJP-P-2020-039156 2020-03-06
JP2020213860A JP7574074B2 (ja) 2020-03-06 2020-12-23 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品
JPJP-P-2020-213860 2020-12-23

Publications (1)

Publication Number Publication Date
KR20210113063A true KR20210113063A (ko) 2021-09-15

Family

ID=77667961

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210027961A Pending KR20210113063A (ko) 2020-03-06 2021-03-03 경화성 수지 조성물, 드라이 필름, 경화물 및 전자 부품

Country Status (2)

Country Link
JP (1) JP7574074B2 (https=)
KR (1) KR20210113063A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023120492A1 (https=) * 2021-12-22 2023-06-29
TW202440657A (zh) * 2023-03-08 2024-10-16 日商住友化學股份有限公司 組成物、積層體及顯示裝置
JP7627321B1 (ja) 2023-10-31 2025-02-05 太陽ホールディングス株式会社 樹脂組成物、ドライフィルム、硬化物、及び、発光素子実装基板
JP7627320B1 (ja) * 2023-10-31 2025-02-05 太陽ホールディングス株式会社 透明樹脂組成物、ドライフィルム、硬化物および電子部品
WO2026042175A1 (ja) * 2024-08-20 2026-02-26 株式会社ダイセル セルロースアシレート組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012108523A (ja) 2009-09-10 2012-06-07 Sekisui Chem Co Ltd 感光性組成物及びプリント配線板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6463079B2 (ja) 2014-03-18 2019-01-30 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP5696956B2 (ja) 2014-08-29 2015-04-08 日立金属株式会社 非ハロゲン難燃樹脂組成物を用いた電線およびケーブル

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012108523A (ja) 2009-09-10 2012-06-07 Sekisui Chem Co Ltd 感光性組成物及びプリント配線板

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JP2021138916A (ja) 2021-09-16
JP7574074B2 (ja) 2024-10-28

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