KR20210100375A - Manufacturing method of light emitting device - Google Patents

Abstract

A light emitting device manufacturing method comprises the following steps of: mounting a plurality of light emitting elements on a front surface of a mother substrate; disposing light transmitting units on the light emitting elements; disposing a first cutter on the front side of the mother substrate and cutting at least a portion of the light transmitting units; forming an alignment mark by removing a portion of the mother substrate from the mother substrate; and disposing a second cutter on a rear side of the mother substrate and cutting the mother substrate corresponding to each light emitting element based on an alignment mark.

Description

Method of manufacturing a light emitting device

The present invention relates to a method of manufacturing a light emitting device, and more particularly, to a method of manufacturing a light emitting device including a light emitting diode as a light emitting element.

In general, light emitting diodes can be broadly classified into top type light emitting diodes and side type light emitting diodes. The side-type light emitting diode package is widely used as a light source for a backlight of a display device that injects light to a side surface of a light guide plate. Recently, the side-type light emitting diode package has a wider range of uses and uses in addition to the backlight use of the existing display device.

Recently, as the thickness of the display device becomes thinner, the thickness of the side-type light emitting diode package also tends to be thinner. However, since various defects occur in the process of manufacturing the conventional side-type light emitting diode package, there is an urgent need for a method of manufacturing the light emitting diode package with a reduced defect rate.

An object of the present invention is to provide a method for manufacturing a light emitting device in which the defect rate in manufacturing the light emitting device is reduced.

The method of manufacturing a light emitting device according to an embodiment of the present invention includes the steps of mounting a plurality of light emitting elements on the front surface of a mother substrate, arranging light transmitting parts on the light emitting elements, and using a first cutter on the front surface of the mother substrate Disposing on the side and cutting at least a portion of the light transmitting portions, removing a part of the mother substrate on the mother substrate to form an alignment mark, and disposing a second cutter on the back side of the mother substrate, and cutting the mother substrate corresponding to each light emitting device based on the alignment mark, and cutting at least a portion of the light transmitting portions and forming the alignment mark are performed in a single process.

In an embodiment of the present invention, the forming of the alignment mark may be performed using the first cutter.

In one embodiment of the present invention, each light emitting device has a rectangular shape having a pair of first sides and a pair of second sides, a direction in which the first sides extend is referred to as a first direction, and the second When the direction in which the sides extend is referred to as a second direction, the light emitting devices may be arranged in a matrix form in which the first direction is a column direction and the second direction is a row direction.

In one embodiment of the present invention, each light emitting device may have a rectangular shape having the first sides as long sides and the second sides as short sides.

In one embodiment of the present invention, the first cutter cuts at least a portion of the light-transmitting parts along a cutting line extending in the first direction, and the alignment mark is an end of the mother substrate where the extension line of the cutting line is It may be formed at the part where it meets.

In one embodiment of the present invention, the alignment mark may be a slot formed by removing a part of the mother substrate.

In one embodiment of the present invention, the alignment mark may be provided as a pair at a point where the cut line and both ends of the mother substrate meet.

In one embodiment of the present invention, the alignment mark includes a first alignment mark provided as a pair at a point where the cutting line and both ends of the mother substrate meet, and the first alignment mark and the second direction. It may include second alignment marks provided as a pair at points spaced apart from each other.

In one embodiment of the present invention, the second cutter may cut the mother substrate along the first direction at a predetermined interval in consideration of the pitch of two light emitting devices adjacent to each other based on the alignment mark.

In one embodiment of the present invention, the first cutter may be a circular blade rotating in one direction.

In one embodiment of the present invention, the step of cutting at least a portion of the light transmitting parts with the first cutter may be performed in a down-cutting manner in which the rotational direction of the circular blade faces the mother substrate.

The method of manufacturing a light emitting device according to an embodiment of the present invention may further include the step of inverting the mother substrate before the step of cutting the mother substrate corresponding to each light emitting element with the second cutter. .

In one embodiment of the present invention, the second cutter is a circular blade rotating in one direction, and the step of cutting the mother substrate with the second cutter corresponding to each light emitting element is that the rotation direction of the circular blade is the It may be performed in a down-cutting manner toward the mother substrate.

In one embodiment of the present invention, in the step of disposing the light transmitting parts on the light emitting devices, the light transmitting parts are provided in a smaller number than the light emitting devices, and at least one light transmitting part is at least two or more light emitting units. It can be placed on the elements.

The method of manufacturing a light emitting device according to an embodiment of the present invention may further include cutting the mother substrate in the second direction using the second cutter.

In an embodiment of the present invention, the manufacturing method according to an embodiment of the present invention may further include forming a cover part covering the light emitting devices and the light transmitting parts.

In one embodiment of the present invention, the method may further include the step of exposing upper surfaces of the light-transmitting parts to the outside by removing the upper part of the cover part after forming the cover part covering the light-emitting elements and the light-transmitting parts. .

In one embodiment of the present invention, when viewed from a direction opposite to the upper surfaces of the light transmitting portions, each of the light transmitting portions is surrounded by the cover portion, and the width at the side extending in the first direction of the light transmitting portion is may be greater than a width at a side extending in the second direction.

The present invention provides a method for manufacturing a light emitting device in which the defect rate in manufacturing the light emitting device is reduced.

1A is a perspective view illustrating a light emitting device according to an embodiment of the present invention, and FIG. 1B is a transparent perspective view illustrating the light emitting device of FIG. 1A .
FIG. 2A is a plan view of the light emitting device of FIG. 1A , FIG. 2B is a rear view of the light emitting device of FIG. 1A , FIG. 2C is a cross-sectional view taken along line AA′ of FIG. 1B, and FIG. 2D is a line BB′ of FIG. 1B . It is a cross section.
3A, 4A, 5A, 6A, 6A, 7A, and 8 are perspective views sequentially illustrating a method of manufacturing a light emitting device according to an embodiment of the present invention.
3B, 4B, 5B, 6B, 6B, and 7B are cross-sectional views sequentially illustrating a method of manufacturing a light emitting device according to an embodiment of the present invention, respectively, FIGS. 3A, 4A, and 5A , a cross-sectional view corresponding to the line C-C' of FIGS. 6A, 6A, and 7A.
9A, 9B, and 9C are views corresponding to FIG. 8, in which FIG. 9A is a plan view corresponding to P1 in FIG. 8, FIG. 9B is a cross-sectional view corresponding to C-C' in FIG. 9A, and FIG. 9C is FIG. It is a cross-sectional view corresponding to D-D' of 9a.
10A and 10B are plan views illustrating alignment marks according to an embodiment of the present invention.

Since the present invention can have various changes and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

The present invention relates to a light emitting device, and more particularly, to a light emitting diode used in a display device, a lighting device, an image reading device, and the like. The display device includes a television, a tablet, an e-book display device, a computer monitor, a kiosk, a digital camera, a game console, a large outdoor/indoor display board, and the like. The lighting device includes household lighting, medical lighting, industrial lighting, and the like. The image reading apparatus includes a copier, a facsimile, a scanner, and the like.

1A is a perspective view illustrating a light emitting device according to an embodiment of the present invention, and FIG. 1B is a transparent perspective view illustrating the light emitting device of FIG. 1A .

FIG. 2A is a plan view of the light emitting device of FIG. 1A , FIG. 2B is a rear view of the light emitting device of FIG. 1A , FIG. 2C is a cross-sectional view taken along line AA′ of FIG. 1B, and FIG. 2D is a line BB′ of FIG. 1B . It is a cross section.

1A, 1B, and 2A to 2D , the light emitting device 100 is provided in a substantially rectangular parallelepiped shape elongated in one direction. In the present embodiment, the longitudinal direction of the light emitting device 100 is the first direction D1 , the width direction perpendicular to the longitudinal direction is the second direction D2 , and the first and second directions D1 and D2 are used. A direction perpendicular to the plane (the direction in which the front surface from which light is emitted in the drawing) is indicated as a third direction D3. In one embodiment of the present invention, the third direction D3 corresponds to the light emission direction. Hereinafter, for convenience of explanation, the longitudinal direction and the first direction D1 have the same meaning, the width direction and the second direction D2 have the same meaning, and the front-facing direction and the third direction D3 have the same meaning. use it as Also, the downward direction refers to a direction opposite to the third direction D3 .

In one embodiment of the present invention, the overall shape of the light emitting device is presented as a substantially rectangular parallelepiped, but is not limited thereto. For example, although the surface from which the light is emitted is illustrated as having a rectangular shape, it is not required to have a rectangular shape, and other shapes may be provided without departing from the concept of the present invention to be described later.

In one embodiment of the present invention, although the light emission direction is shown as the upward direction, the light emission direction may vary depending on the mounting direction of the light emitting device to other devices, and is not limited to a specific direction. For example, the light emitting device according to an embodiment of the present invention having the above-described structure may be used as a side emission type. The side light emitting device corresponds to a case in which the mounting direction and the light emitting direction are perpendicular when the light emitting device is mounted on another device. However, the light emitting device according to an embodiment of the present invention may be used as a top emission type rather than a side invention type. The top emission type corresponds to a case in which the mounting direction and the light emitting direction are parallel when the light emitting device is mounted on another device.

In one embodiment of the present invention, the light emitting device 100 includes a light emitting device 110 emitting light, a light transmitting unit 130 disposed on the light emitting device 110 , and a device substrate on which the light emitting device 110 is mounted. 120 , a wiring part 140 provided on the device substrate 120 , and a cover part 150 covering the light emitting device 110 .

The light emitting device 110 is mounted on the device substrate 120 as a light emitting diode chip. The light emitting device 110 may be provided in the form of a flip chip and mounted on the device substrate 120 with a conductive adhesive member interposed therebetween. In one embodiment of the present invention, the type of the light emitting device 110 is not limited thereto, and as long as it does not depart from the concept of the present invention, it may be provided in various forms such as a lateral type or a vertical type.

The light emitting device 110 may have a shape similar to the overall shape of the light emitting device 100 and may extend long in the first direction D1 similar to the shape of the light emitting device. Accordingly, each light emitting device 110 is provided in a rectangular shape having a pair of long sides and a pair of short sides when facing the surface from which the light is emitted. Assuming that the long sides are first sides and the short sides are second sides, the first sides extend in the first direction D1 and the second sides extend in the second direction D2 . However, the present invention is not limited thereto, and the light emitting device 110 may not have a shape similar to the overall shape of the light emitting device.

In an embodiment of the present invention, one light emitting device 110 may be provided in one light emitting device 100 , but two or more light emitting devices 110 are included in one light emitting device 100 . may be provided within. When a plurality of light emitting devices 110 are provided in the light emitting device 100 , two or more regions from which light is emitted in an upper direction may be provided. When a plurality of light emitting devices 110 are provided in the light emitting device 100 , the light emitting devices 110 may be connected to each other in series or in parallel.

Although not shown, the light emitting device 110 may include a light emitting structure and an electrode part.

The light emitting structure may include a first semiconductor layer, an active layer, and a second semiconductor layer sequentially provided.

The light emitting structure may be provided on the base substrate. The base substrate may be a growth substrate such as sapphire, or a substrate provided separately from the growth substrate. The base substrate may be made of, for example, sapphire, gallium nitride, gallium arsenide, gallium phosphorus, aluminum nitride, silicon, silicon carbide, indium phosphorus, zinc sulfide, zinc oxide, zinc selenide, diamond, etc. no. The base substrate is preferably an insulating substrate, but is not limited to the insulating substrate, and may be omitted if necessary.

The first semiconductor layer is a semiconductor layer doped with a first conductivity type dopant. The first conductivity-type dopant may be an n-type dopant. The first conductivity type dopant may be Si, Ge, Se, Te or C. In one embodiment of the present invention, the first semiconductor layer may include a nitride-based semiconductor material. For example, the first semiconductor layer may be made of a semiconductor material having a composition formula of InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1). In one embodiment of the present invention, the semiconductor material having the composition formula may include GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, and the like. The first semiconductor layer may be formed by using the semiconductor material and growing it to include an n-type dopant such as Si, Ge, Sn, Se, or Te.

The active layer is provided on the first semiconductor layer and corresponds to the light emitting layer.

In the active layer, electrons (or holes) injected through the first conductivity type semiconductor layer and holes (or electrons) injected through the second semiconductor layer meet each other, so that the band gap of the energy band according to the material of the active layer is formed. (Band Gap) It is a layer that emits light due to the difference. The active layer may emit at least one peak wavelength of ultraviolet, blue, green, and red.

The active layer may be implemented with a compound semiconductor. The active layer may be implemented, for example, by at least one of group 3-5 or group 2-6 compound semiconductor, and InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤ It may be disposed of a material having the composition formula of 1).

A second semiconductor layer is provided on the active layer.

The second semiconductor layer is a semiconductor layer having a second conductivity type dopant having a polarity opposite to that of the first conductivity type dopant. The second conductivity-type dopant may be a p-type dopant, and the second conductivity-type dopant may include, for example, Mg, Zn, Ca, Sr, Ba, or the like. In one embodiment of the present invention, the second semiconductor layer may include a nitride-based semiconductor material. The second semiconductor layer may be made of a semiconductor material having a compositional formula of InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1). In one embodiment of the present invention, the semiconductor material having the composition formula may include GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, and the like. The second semiconductor layer may be formed by using the semiconductor material to grow to include p-type dopants such as Mg, Zn, Ca, Sr, and Ba.

In one embodiment of the present invention, an insulating film is provided on the first semiconductor layer and the second semiconductor layer, and the insulating film is disposed on the insulating film and includes a cathode and an anode respectively connected to the first semiconductor layer and the second semiconductor layer An electrode part is provided. The electrode part is electrically connected to the device substrate 120 through a conductive adhesive member. The electrode part may be made of various materials, for example, at least one of gold, silver, tin, platinum, rhodium, titanium, aluminum, tungsten, palladium, nickel, and alloys thereof, or a combination of at least one thereof. may include.

In one embodiment of the present invention, various components may be further included in addition to the base substrate, the light emitting structure, and the electrode unit. For example, it may further include an insulating film to cover and protect the light emitting structure. The insulating layer may be at least one oxide or nitride selected from the group consisting of silicon, titanium, zirconium, niobium, tantalum, and aluminum, but is not limited thereto.

The light transmitting part 130 is provided on the light emitting devices 110 . The light transmitting part 130 is provided in a shape corresponding to the light emitting device 110 , and may completely cover the upper surface of the light emitting device 110 . To this end, the light transmitting part 130 may be provided with a larger area than the light emitting device 110 . Although not shown, the light transmitting part 130 may be adhered to the upper surface of the light emitting device 110 through a light transmitting adhesive.

The light transmitting unit 130 transmits light of at least a partial wavelength of the light emitted from the light emitting device 110 to the outside of the device. The light transmitting unit 130 transmits all of the light of all wavelengths of the light from the light emitting device 110 , blocks some and transmits some, or converts the wavelength of at least a portion of the light from the light emitting device 110 and transmits it can do it

Here, the light transmitting unit 130 may transmit at least about 50% or more of the light emitted from the light emitting device 110 according to the wavelength, in one embodiment about 80%, in another embodiment, about 90% of the light. can penetrate.

In one embodiment of the present invention, the light transmitting unit 130 may be made of various materials as capable of transmitting light. For example, the material may be glass, quartz, a polymer resin, or the like. When the material is a polymer resin, an epoxy resin, a phenol resin, a polycarbonate resin, a silicone resin, an acrylic resin, or a modified resin thereof may be used as the polymer resin. In an embodiment of the present invention, the polymer resin may be a silicone or a modified silicone resin, such as a dimethyl silicone resin, a phenyl-methyl silicone resin, or a diphenyl silicone resin. Silicone or modified silicone resin has good heat resistance and is less susceptible to modification by light.

When the light transmitting part 130 is made of a polymer resin or glass, a filler may be contained therein. As the filler, silicon oxide, aluminum oxide, zirconium oxide, zinc oxide, etc. may be used, and two or more kinds of these fillers may be mixed and used. In one embodiment of the present invention, the filler may be provided as nanoparticles (eg, particles having a particle size of 1 nm or more and 100 nm or less), when provided as nanoparticles, scattering of emitted light degree can be increased.

In the present embodiment, although it is illustrated that the light transmitting part 130 is formed as a single layer, the present invention is not limited thereto, and may be formed as a multilayer (eg, a double layer). When formed in multiple layers, the plurality of layers may be made of the same or different materials.

When the light transmitting unit 130 converts the wavelength of at least a portion of the light emitted from the light emitting device 110 , the light transmitting unit 130 may include a light converting material.

The light conversion material converts light of a predetermined wavelength (first wavelength) of light into light of a wavelength different from the original wavelength (second wavelength). The first wavelength is shorter than the second wavelength. The light conversion material may convert, for example, ultraviolet light into visible light or light of a blue wavelength into light of a red wavelength. The light transmitting unit 130 may be provided with one or more types of light conversion materials, and may be converted into various types of light different from the light emitted from the light emitting device 110 according to the type of the light conversion material.

In one embodiment of the present invention, the light conversion material may be a phosphor. For example, as the green light-emitting phosphor, a yttrium-aluminum-garnet-based phosphor (for example, Y ₃ (Al,Ga) ₅ O ₁₂ :Ce), a lutetium-aluminum-garnet-based phosphor (for example, Lu ₃ (Al, Ga) ₅ O ₁₂ :Ce), a terbium/aluminum/garnet-based phosphor (eg, Tb ₃ (Al, Ga) ₅ O ₁₂ :Ce), a silicate-based phosphor (eg (Ba, Sr) ₂ SiO ₄ : Eu), a chlorosilicate-based phosphor (eg, Ca ₈ Mg(SiO ₄ ) ₄ Cl ₂ :Eu), a β-sialon-based phosphor (eg, Si _{6 -z} Al _z O _z N _8-z :Eu (0) <z<4.2)), an SGS-based phosphor (eg, SrGa ₂ S ₄ :Eu), and the like. As the phosphor of the yellow emitting patent light, an α-sialon-based phosphor (for example, M _z (Si, Al) ₁₂ (O, N) ₁₆ (provided that 0<z≤2, and M is Li, Mg, Ca, Y) and lanthanide elements other than La and Ce).

In addition, among the above-mentioned green-emitting phosphors, there are also yellow-emitting phosphors. In addition, for example, in the yttrium/aluminum/garnet-based phosphor, by substituting a part of Y for Gd, the emission peak wavelength can be shifted to the long wavelength side, and thus yellow light can be emitted. In addition, there are also phosphors capable of emitting orange light among them. Examples of the red emitting phosphor include a nitrogen-containing calcium aluminosilicon (CASN or SCASN)-based phosphor (eg (Sr, Ca)AlSiN ₃ :Eu). In addition, it is a manganese-activated fluoride-based phosphor (a phosphor represented by the general formula (I)A ₂ [M _1-a M _na F ₆ ]. However, in the general formula (I), A is K, Li, Na, Rb. , Cs and NH ₄ at least one selected from the group consisting of, M is at least one element selected from the group consisting of a group 4 element and a group 14 element, and a satisfies 0<a<0.2) can be heard A typical example of this manganese-activated fluoride-based phosphor is a phosphor of manganese-activated potassium silicon fluoride (eg, K ₂ SiF ₆ :Mn).

The cover part 150 covers at least a portion of the light emitting device 110 and the light transmitting part 130 . The cover part 150 is provided on the device substrate 120 , and covers both the side surface of the light emitting device 110 and the side surface of the light transmitting part 130 . The cover unit 150 does not cover the upper surface of the light transmitting unit 130 , and thus the upper surface of the light transmitting unit 130 is exposed to the outside. Here, the upper surface of the light transmitting part 130 and the upper surface of the cover part 150 are disposed on the same plane.

In an embodiment of the present invention, when viewed from a direction opposite to the upper surface of the light transmitting part 130 , the width of the cover part 150 may vary depending on the direction. For example, the width W1 on the long side and the width W2 on the short side of the cover part 150 of the light emitting device 100 may be different from each other. In this embodiment, the width W1 of the cover part 150 on the long side may be greater than the width W2 of the cover part 150 on the short side.

The cover unit 150 may have light reflectivity so that the light emitted from the light emitting device 110 may be effectively emitted through the light transmitting unit 130 . The light reflectivity of the cover 150 may be, for example, about 70%, and may be about 80% or about 90% according to an embodiment.

The cover part 150 may be provided in a white color having high light reflectivity. The cover part 150 may include a material having light reflectivity therein, for example, a white pigment, so that the cover part 150 has light reflectivity.

The cover part 150 can effectively cover the light emitting element 110 and the light transmitting part 130 and may be made of various materials. For example, the cover part 150 may be made of a polymer resin. When the cover part 150 is made of a polymer resin, the light-emitting element 110 and the light-transmitting part 130 are formed by providing a resin material in an uncured or semi-cured state on the light-emitting element 110 and the light-transmitting part 130 . It can be easily manufactured by wrapping it all up, curing it and then cutting it. The resin material in an uncured or semi-cured state may be provided by various methods such as injection molding, extrusion molding, transfer molding, and the like.

In one embodiment of the present invention, an epoxy resin, a phenol resin, a polycarbonate resin, a silicone resin, an acrylic resin, or a modified resin thereof may be used as the polymer resin constituting the cover part 150 . In an embodiment of the present invention, the polymer resin may be a silicone or a modified silicone resin, such as a dimethyl silicone resin, a phenyl-methyl silicone resin, or a diphenyl silicone resin. Silicone or modified silicone resin has good heat resistance and is less susceptible to modification by light.

Various white pigments may be used, for example, aluminum oxide, titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicon, magnesium silicon, barium titanate, barium sulfate, zirconium oxide and the like may be used. Alternatively, at least one or more of the above materials may be used in combination. The shape of the pigment is limited, for example, it may be provided as fine particles having a particle size of 0.1 μm or more, 0.5 μm or less, or less.

A device substrate 120 on which the light emitting device 110 is mounted is provided under the light emitting device 110 .

The device substrate 120 may be made of a rigid material, but is not limited thereto, and may be made of a flexible material. When the display device according to the exemplary embodiment is implemented as a curved or bendable display device, it may be advantageous that the element substrate 120 is made of a flexible material. In one embodiment of the present invention, when the device substrate 120 is made of a material such as glass, quartz, metal, etc., the heat resistance is relatively higher than that of the organic polymer device substrate 120, so that various laminations are possible on the upper surface. . When the element substrate 120 is made of a transparent material such as glass or quartz, it may be advantageous for manufacturing a front or bottom light emitting display device. When the device substrate 120 is made of an organic polymer or an organic/inorganic composite, it may have relatively high flexibility and may be advantageous in manufacturing a curved display device. In addition to the wiring unit 140 , an insulating protective layer such as a solder resist or a coverlay may be further provided on the device substrate 120 .

In an embodiment of the present invention, the device substrate 120 may include a wiring unit 140 formed inside or outside the device substrate 120 . For example, in one embodiment of the present invention, the device substrate 120 may be a printed circuit board, and when the device substrate 120 is provided as a printed circuit board, the printed circuit board includes the light emitting device 110 . A wiring unit 140 to be connected may be provided.

The wiring unit 140 may be made of a conductive metal, for example, at least one selected from the group consisting of gold, silver, copper, iron, nickel, aluminum, chromium, titanium, palladium, tungsten, rhodium, and alloys thereof. can be The wiring unit 140 may be formed of a single layer or multiple layers.

In an embodiment of the present invention, a solder hole HL for ease of mounting may be provided in the second sub-substrate 120b when the light emitting device is subsequently mounted on another device.

2A to 2D , when the device substrate 120 is provided as a single layer, the wiring unit 140 includes the device contact electrode 141 and the device substrate 120 provided on the upper surface of the device substrate 120 . The device may include an external contact electrode 145 provided on a lower surface of the , and a via electrode connecting the device contact electrode 141 and the external contact electrode 145 in the device substrate 120 .

In one embodiment of the present invention, the device substrate 120 may be provided in a plurality of layers. For example, as shown in an embodiment of the present invention, the device substrate 120 may include a first sub-substrate 120a and a second sub-substrate 120b.

When the device substrate 120 has a plurality of layers, an intermediate contact electrode 143 may be further provided between the device contact electrode 141 and the external contact electrode 145 . In this case, between the device contact electrode 141 and the intermediate contact electrode 143, a first via electrode ( 147 is provided, and the second sub-substrate 120b is interposed between the intermediate contact electrode 143 and the external contact electrode 145 to connect the intermediate contact electrode 143 and the external contact electrode 145 . A via electrode 149 may be provided.

Here, the device contact electrodes 141 are provided as a pair to be respectively connected to the anode and the cathode of the light emitting device 110 . Each of the pair of contact electrodes may be electrically connected to a cathode and an anode of the light emitting device 110 . Each of the intermediate contact electrode 143 and the via electrodes 147 and 149 may also be provided as a pair corresponding to the pair of device contact electrodes 141 .

In one embodiment of the present invention, although the number of the device contact electrode 141 , the intermediate contact electrode 143 , and the external contact electrode 145 is shown as a pair, it is not limited thereto. A different number may be provided according to the number of light emitting devices 110 and a connection relationship of parallel or series. For example, the number of device contact electrodes 141 , intermediate contact electrodes 143 , and external contact electrodes 145 per one light emitting device may be three each.

In one embodiment of the present invention, although it is illustrated that the wiring unit 140 is formed on the upper surface, the lower surface, and the inside of the device substrate 120 , the present invention is not limited thereto. It may be formed in a part of 120 .

The solder hole HL is formed by removing a portion of the second sub substrate 120b , has a shape that is opened in the second direction D2 , and is formed to correspond to each of the external contact electrodes 145 .

That is, the region in which the solder hole HL is provided is a portion in which the external contact electrode 145 is provided. The external contact electrode 145 is also provided on the lower surface of the second sub-substrate 120b, but may be integrally provided on the inner wall of the recessed portion of the solder hole HL along the inner wall surface. Since the external contact electrode 145 is provided in the solder hole HL, thereafter, when a conductive adhesive member such as solder paste is filled in the solder hole HL, the external contact electrode 145 and other devices are electrically connected and physically bonded. is to improve performance. When the other device and the light emitting device are connected, an electrical connection occurs within the solder hole HL recessed inside, so a separate space for connecting the light emitting device and the other device is not required. Accordingly, it is possible to reduce the size of the light emitting device when assembling it with other devices.

Here, the conductive adhesive member is conductive and may be a metal paste. The metal paste may include at least one metal powder selected from the group consisting of gold, silver, copper, iron, nickel, aluminum, chromium, titanium, palladium, tungsten, rhodium, and alloys thereof, and a resin binder, or lead-containing solder alloys such as Sn-Pb or Sn-Pb-Ag-based, or lead-free solder alloys such as Sn-Ag-based alloys, Sn-Bi-based alloys, Sn-Zn-based alloys, Sn-Sb-based or Sn-Ag-based alloys It may include a Cu alloy. Alternatively, the conductive adhesive member may be provided as a conductive resin, or may be provided as an anisotropic conductive film.

In the light emitting device 100 having the above-described configuration, the wiring unit 140 is adhered to another device (eg, a circuit board) using a conductive adhesive member, and then the light emitting device 110 is connected through the wiring unit 140 . ) by supplying power to the light emitting device can be driven. The light emitting device 110 supplied with power emits light, and the light is emitted to the outside through the light transmitting unit 130 .

The light emitting device having the above-described configuration can be manufactured in the following order.

3A, 4A, 5A, 6A, 6A, 7A, and 8 are perspective views sequentially illustrating a method of manufacturing a light emitting device according to an embodiment of the present invention. 3B, 4B, 5B, 6B, 6B, and 7B are cross-sectional views sequentially illustrating a method of manufacturing a light emitting device according to an embodiment of the present invention, respectively, FIGS. 3A, 4A, and 5A , a cross-sectional view corresponding to the line C-C' of FIGS. 6A, 6A, and 7A. 9A, 9B, and 9C are views corresponding to FIG. 8, in which FIG. 9A is a plan view corresponding to P1 in FIG. 8, FIG. 9B is a cross-sectional view corresponding to C-C' in FIG. 9A, and FIG. 9C is FIG. It is a cross-sectional view corresponding to D-D' of 9a. With reference to the above drawings, a method of manufacturing a light emitting device according to an embodiment of the present invention will be sequentially described.

Referring to FIGS. 3A and 3B , a plurality of light emitting devices 110 are mounted on the front surface of the mother substrate 12 .

A plurality of light emitting elements 110 The elements 110 are mounted on the mother substrate 12 corresponding to the number of light emitting devices to be manufactured. Since the light emitting elements 110 and the elements 110 have to go through a process of being cut before completing the final light emitting device, one-to-one or one-to-many (one-to-one or one-to-many ( are arranged in multiple).

The mother substrate 12 is then cut to become a device substrate 120 , and includes a first sub mother substrate 12a and a second sub mother substrate 12b. The mother substrate 12 is a substrate before being cut, to which the element substrate 120 is connected. The mother substrate 12 is then cut to have a larger area than the element substrate 120 so that a plurality of light emitting devices can be manufactured.

A wiring portion is formed on the mother substrate 12 to correspond to a region corresponding to each light emitting device. In the wiring part, a device contact electrode, an intermediate contact electrode, an external contact electrode, and a via electrode may be formed in each region.

Light emitting elements 110 The elements 110 may be arranged in a matrix form on the mother substrate 12 . Here, the elements 110 of the light emitting elements 110 may be arranged such that the first direction D1 is a column direction and the second direction D2 is a row direction. When the light emitting devices 110 are arranged in a matrix form in this way, it is possible to easily separate the individual light emitting devices 110 along a line extending in the first direction D1 and/or the second direction D2. can

A conductive adhesive member is coated on the device contact electrode of the mother substrate 12 , the light emitting devices 110 are disposed on the conductive adhesive member, and then the conductive adhesive member is subjected to heat treatment, such as reflow, to remove the light emitting devices. 110 may be attached to the mother substrate 12 .

4A and 4B , the light transmitting parts 130 are disposed on the light emitting devices 110 .

In the step of disposing the light transmitting parts 130 on the light emitting devices 110 , the light transmitting parts 130 may be provided in the same number as the light emitting devices 110 , but less than the light emitting devices 110 . It may be provided in number. When provided in a smaller number than the light emitting devices 110 , the light transmitting parts 130 are provided with a size sufficiently larger than the upper surfaces of the light emitting devices 110 to completely cover the upper portions of the plurality of light emitting devices 110 . . In one embodiment of the present invention, a case in which one light transmitting part 130 can cover two light emitting devices 110 adjacent to each other in the second direction D2 is illustrated as an example, but the present invention is not limited thereto.

The disposing of the light transmitting parts 130 on the light emitting devices 110 may be performed by bonding the light transmitting parts 130 on the light emitting device 110 . Here, a light-transmitting adhesive may be interposed between the light-transmitting part 130 and the light-emitting device 110 .

Referring to FIGS. 5A and 5B , after disposing the light transmitting portions 130 on the mother substrate, the step of cutting the light transmitting portions 130 to correspond to each light emitting device 110 is performed. The step of cutting the light transmitting portions 130 is performed on the front side of the mother substrate 12 , that is, on the surface on which the light transmitting portions 130 are provided. To this end, the first cutter 161 is disposed on the front side of the mother substrate 12 and the light transmitting parts 130 are separated by moving the first cutter 161 from the upper direction to the lower direction of the mother substrate 12 . cut Here, the light transmitting part 130 is cut along the first direction D1 using the first cutter 161 .

When the light transmitting parts 130 are cut, the size of the cut region 169 may vary depending on the shape or thickness of the first cutter 161 , and in FIG. 5B , the light transmitting part corresponding to the thickness of the first cutter 161 . It is schematically shown that a part of the ones 130 are removed.

Side surfaces of the light transmitting parts 130 are cut to be spaced apart from each other. If the two light emitting devices 110 disposed adjacent to each other are referred to as first and second light emitting devices, the first cutter 161 cuts the corresponding light transmitting part 130 between the first and second light emitting devices, or By further cutting the side surfaces of the light transmitting portions 30 , first and second light transmitting portions disposed on the first and second light emitting elements to correspond to the first and second light emitting elements are formed. In this case, the side surfaces of the first and second light transmitting portions facing each other are spaced apart by cutting.

In one embodiment of the present invention, each light transmitting part 130 may have a larger area than each light emitting device 110 , and accordingly, the side surfaces of each light transmitting part 130 are the sides of each light emitting device 110 . The side surfaces may not overlap, and the side surfaces of each light transmitting unit 130 may be disposed outside the side surfaces of each light emitting device 110 when viewed in a plan view. Accordingly, the distance between the opposing sides of the two light transmitting parts 130 adjacent to each other is smaller than the distance between the opposing sides of the two light emitting devices 110 adjacent to each other, that is, the first and second light emitting devices. can

In addition, the first cutter 161 may further cut the light transmitting part 130 along the second direction D2. Here, when cutting along the second direction D2, a cutter different from the first cutter 161 may be used. In the present embodiment, the first cutter 161 may be a circular blade rotating in one direction. When cutting at least a portion of the light transmitting portions 130 with the first cutter 161 , the rotational direction R1 of the circular blade faces the lower portion of the mother substrate 12 , that is, the opposite direction to the third direction D3 . It may be performed in a down-cutting manner toward the Alternatively, the first cutter 161 may be a non-rotating cutter. In this case, the non-rotating cutter may be performed in a down-cutting manner similar to a circular blade. If necessary, ultrasonic waves or the like may be applied to the non-rotating cutter for ease of cutting.

In one embodiment of the present invention, when the light transmitting part 130 is cut, the first cutter 161 is moved in the first direction D1, and the A portion is cut to form a slot-shaped alignment mark 190 . That is, the step of cutting at least a portion of the light transmitting portions 130 and the step of forming the alignment mark 190 may be performed in a single process. Here, "performed in a single process" means that a specific step is performed simultaneously with another step, as well as at an adjacent time if not simultaneously, that is, immediately before or immediately after the specific step, but the specific step and the other step are one means that it is carried out for a single purpose of For example, the step of cutting the light transmitting part 130 and the step of forming the alignment mark 190 are both processes for the purpose of cutting a predetermined component and can be performed at adjacent times, so that they can be performed as a single process. can be understood

After the alignment mark 190 is cut to manufacture a final light emitting device, a bar cutting process is performed to accurately determine the arrangement position of the light emitting elements 110 in the cutting process. When cutting in a later step, by confirming the position of the light emitting elements 110 arranged through the alignment mark 190 and setting the cutting position in consideration of the degree of this position, by minimizing defects of other components due to cutting This is to manufacture a light emitting device without defects even after cutting.

Here, the first cutter 161 cuts at least a portion of the light transmitting portions 130 along a cutting line extending in the first direction D1, and the first cutter 161 along the first direction D1. may be further moved to form a slot-shaped alignment mark 190 at a portion where the extension line of the cutting line meets the end of the mother substrate 12 . The slot is formed to pass through both the front and rear surfaces of the mother substrate 12 , and thus the position of the alignment mark 190 can be clearly recognized when viewed from the rear surface. The alignment mark 190 is formed on the front side of the mother substrate 12 in which the arrangement on which the light emitting elements 110 are mounted is visible, but penetrates to the rear side, so that the alignment mark 190 is disposed on the front side of the mother substrate 12 . It may be formed by clearly reflecting the arrangement position of the light emitting elements 110 .

The alignment mark 190 may be provided as a pair at a point where the cut line and both ends of the mother substrate 12 meet. However, the alignment marks 190 are not limited thereto and may be provided in various numbers at various locations.

10A and 10B are plan views illustrating alignment marks according to an embodiment of the present invention.

Referring to FIGS. 10A and 10B , a plurality of alignment marks may be formed. For example, the alignment mark may be provided in a region where a line parallel to the first direction D1 and both ends of the mother substrate 12 meet, respectively. Assuming that the light emitting elements 110 or the light transmitting unit 130 are arranged in a matrix, cutting is performed on both sides of each column. An alignment mark may be formed at a point where both ends of the plate 12 meet.

For example, in FIG. 10A, a pair of alignment marks 191a and 191b is formed at a point where a line extending in the column direction corresponding to the cut line on the left side of the first column and both ends of the mother substrate 12 meet, 10B illustrates that a pair of alignment marks 191a and 191b is formed at a point where a line extending in the column direction corresponding to the right side of the first column and both ends of the mother substrate 12 meet.

In addition, as in FIG. 10A , not a pair but two pairs of alignment marks may be provided, or only a pair of alignment marks may be provided as in FIG. 10B . When two pairs of alignment marks are provided on the mother substrate 12, the alignment marks are first alignment marks 191a and 191b provided as a pair at the point where the cut line and both ends of the mother substrate 12 meet; , first alignment marks 191a and 191b and second alignment marks 193a and 193b provided as a pair at points spaced apart along the second direction D2 are included.

In addition, the alignment mark may be formed every time the light transmitting parts 130 are cut with the first cutter 161 , that is, at a portion corresponding to each column, but is not limited thereto. It is sufficient to form it in a position where the arrangement can be accurately confirmed.

In the exemplary embodiment of the present invention, only the formation of the alignment mark along the first direction D1 is illustrated, but the exemplary embodiment of the present invention is not limited thereto. It will be apparent that the alignment mark can be formed along the second direction D2 in the same principle as in the above-described embodiment.

Referring to FIGS. 6A and 6B , the cover part 150 covering the light emitting devices 110 and the light transmitting parts 130 is formed thereafter.

The cover part 150 is formed to completely cover the light emitting devices and the light transmitting parts 130 . When the cover part 150 is made of a polymer resin, a resin material in an uncured or semi-cured state is formed on the mother substrate 12 on which the light-emitting elements 110 and the light-transmitting parts 130 are formed. Both 110 and the light transmitting portions 130 may be covered. At this time, the non-hardened or semi-cured material of the cover part 150 is formed from the upper surfaces of the light transmitting parts 130 to a predetermined thickness so as to completely cover the upper surfaces of the light transmitting parts 130 . Here, the resin material in an uncured or semi-cured state may be provided by various methods such as injection molding, extrusion molding, transfer molding, and the like.

The uncured or semi-cured cover portion 150 material is then cured. Curing may be performed at a different temperature depending on the material of the cover 150, for example, may be performed at room temperature or through heat treatment in an oven.

Referring to FIGS. 7A and 7B , after forming the cover part 150 that covers the light emitting devices 110 and the light transmitting parts 130 , the upper part of the cover part 150 is removed so that the light transmitting parts 130 are removed. top surface is exposed to the outside. The portion of the cover 150 covering the upper surfaces of the light transmitting units 130 may be removed by polishing or blasting until the upper surface of the light transmitting unit 130 is exposed. Here, if the thickness of the cover part 150 on the upper surface of the light transmitting part 130 is TH, it is polished to be thicker than TH of the light transmitting part 130 so that not only a part of the cover part 150 is removed, but the light A part of the upper surface of the transmission part 130 may also be removed together with the cover part 150 . At this time, the upper surface of the light transmitting part 130 and the upper surface of the cover part 150 are simultaneously removed through polishing, etc. As a result, the upper surface of the light transmitting part 130 and the upper surface of the cover part 150 form the same plane.

First, referring to FIG. 8 , the mother substrate 12 on which the cover part 150 is formed is cut corresponding to each light emitting device 110 by the second cutter 163 . Through this process, the light emitting devices 110 mounted on the mother substrate 12 are individualized, and a light emitting device including the light emitting devices mounted on the separated device substrate 120 is completed.

The step of cutting the mother substrate 12 with the second cutter 163 differs from the step of cutting the light transmitting portions 130 corresponding to each light emitting device 110 on the back side of the mother substrate 12 , that is, the light It is performed on the side opposite to the side where the transmission parts 130 are provided.

To this end, a step of inverting the mother substrate 12 may be performed before the step of cutting the mother substrate 12 on which the cover portion 150 is formed with the second cutter 163 .

In the inverted mother substrate 12 , the light emitting device 110 and the light transmitting portions 130 of the mother substrate 12 are disposed on the lower side, and the rear surface of the mother substrate 12 is disposed on the upper side. Next, the mother substrate 12 and the cover unit 150 disposed thereunder are cut by moving the second cutter 163 from the upper direction to the lower direction of the mother substrate 12 . Here, the mother substrate 12 and the cover part 150 are cut along the first direction D1 using the second cutter 163 .

When the light transmitting part 130 is cut, the size of the cut region may vary depending on the shape or thickness of the second cutter 163, and in FIGS. 9B and 9C, the mother substrate corresponding to the thickness of the second cutter 163 ( 12) and the cover part 150 are schematically shown to be cut corresponding to each light emitting device.

The mother substrate 12 and the cover unit 150 may be cut in a single process, and in this embodiment may be cut substantially simultaneously. In the case of cutting the mother board 12 after cutting the cover 150, or vice versa, a cutting line alignment step between the first cut part and the later cut part is additionally required, and the two cutting lines are misaligned. Match-related defects may increase. However, in the case of one embodiment of the present invention, as the mother substrate 12 and the cover part 150 are cut in a single process, alignment mismatch is prevented.

The second cutter 163 cuts between the opposite sides of the light transmitting portions 130 . For example, the two light emitting devices 110 disposed adjacent to each other are referred to as first and second light emitting devices, and correspondingly, the two light transmitting portions 130 disposed adjacent to each other are referred to as first and second light transmitting portions. That is, the second cutter cuts the mother substrate 110 and the cover portion 150 corresponding to the first and second light transmitting portions.

Here, the cover unit 150 is cut to have a shape that completely surrounds each light transmitting unit 130 when viewed in a plan view. Accordingly, the side surfaces of each light transmitting unit 130 are cut side surfaces of the cover unit 150 may not overlap with each other, and when viewed in a plan view, side surfaces of each cover unit 150 may be disposed outside the side surfaces of the light transmitting unit 130 .

In this embodiment, the second cutter 163 may be the same as or different from the first cutter 161, and may be a circular blade rotating in one direction. When cutting the mother substrate 12 and the light transmitting parts 130 with the second cutter 163, the rotation direction R1 of the circular blade is from the top to the bottom of the mother substrate 12, that is, the third direction ( towards D3), it can be performed in a down-cutting manner. Alternatively, the second cutter 163 may be a non-rotating cutter. In this case, the non-rotating cutter may be performed in a down-cutting manner similar to a circular blade. If necessary, ultrasonic waves or the like may be applied to the non-rotating cutter for ease of cutting.

Then, the second cutter 163 may further cut the light transmitting part 130 along the second direction D2.

In the step of cutting the mother substrate 12 according to an embodiment of the present invention, an external contact electrode 145 among wiring portions is previously formed on the rear surface of the mother substrate 12 , and when the mother substrate 12 is cut A portion of the external contact electrode 145 may be cut together.

9A to 9C are views showing the rear surface of the mother substrate 12 corresponding to FIG. 8, FIG. 9A is a plan view corresponding to P1 in FIG. 8, FIG. 9B is a cross-sectional view corresponding to C-C' in FIG. 9A; and FIG. 9C is a cross-sectional view corresponding to D-D' of FIG. 9A.

Referring to FIGS. 9A to 9C , a plurality of external contact electrodes 145 (eg, a pair) are provided on the rear surface (upper surface in an inverted state) of the mother substrate 12 in a region corresponding to each light emitting device. is provided as

The external contact electrodes 145 may be provided separately for each region corresponding to the light emitting device. However, for convenience in manufacturing, the external contact electrodes 145 in the regions corresponding to the light emitting device adjacent to each other are not separated. It may be provided as an integral part. For example, as shown in FIG. 9B , the external contact electrodes 145 are separated in some regions, but in some regions as shown in FIG. 9C , adjacent external contact electrodes 145 may be connected to each other. .

Also, although FIG. 9A illustrates that the external contact electrodes 145 in regions corresponding to two adjacent light emitting devices are respectively connected to each other, the present invention is not limited thereto, and all external contact electrodes 145 are regions corresponding to the light emitting devices. It can also be connected in other areas.

In the cutting step of the mother substrate 12, all parts other than the region corresponding to the light emitting device are cut and removed, and the connected external contact electrodes 145 are used as components of each light emitting device in the cutting step of the mother board 12. are individualized

Next, the mother substrate 12 may be cut along the second direction D2 using the second cutter 163 . Here, when cutting along the second direction D2, a cutter different from the second cutter 163 may be used. After the mother substrate 12 is cut in the first direction D1 , the mother substrate 12 is temporarily attached to another additional substrate so that the cut portions are fixed and cutting is possible in the second direction D2 . can be attached. For example, after attaching the mother substrate 12 using a UV adhesive on another additional substrate, the mother substrate 12 is cut in the first direction D1 using the second cutter 163, Again, the mother substrate 12 may be cut in the second direction D2 using the second cutter 163 (or another cutter). The final light emitting device completed by cutting the mother substrate 12 in the first and second directions D2 can be separated from other additional substrates by applying UV to the UV adhesive.

In one embodiment of the present invention, in the step of cutting the mother substrate 12 with the second cutter 163 , the positions of the light emitting elements 110 are determined using the alignment mark 190 as a reference point.

In particular, before cutting the mother substrate 12 using the second cutter 163 , by checking the alignment mark 190 , the cutting line of the region corresponding to the light emitting elements 110 and thus the entire light emitting device. At least one location may be determined. Based on the determined position of the cutting line, the position of the cutting line may be calculated after considering the pitch of the light emitting devices (in detail, including the pitch of the light emitting elements 110 in the light emitting device). If the alignment marks 190 are provided in two pairs, the pitches of the two light emitting devices 110 adjacent to each other are further increased based on the first alignment mark 190 and the second alignment mark 190 . It can be calculated clearly, and the position of the cutting line can be easily calculated accordingly. As a result, the second cutter 163 may sequentially cut the mother substrate 12 along the first direction D1 at predetermined intervals in consideration of the alignment marks 190 .

In the light emitting device manufactured by the above method, defects that may occur during cutting are remarkably reduced, which will be described as follows.

According to the existing invention, after forming the light emitting element, the light transmitting part, and the cover part, in the process of cutting the mother substrate, the cutting must be performed in consideration of the arrangement of the light emitting elements arranged on the mother substrate. The mother board was cut. However, in this case, it is easy to set the cut line by performing the cut on the front surface where the arrangement of the light emitting elements can be directly checked, but there is a problem in that the external contact electrode disposed on the rear surface of the mother substrate is deformed. In particular, when down-cutting is performed using a rotating blade, a burr defect occurs due to the downward force of the lower external contact electrode.

When up-cutting is performed in order to solve such a burr defect, since a force is applied upwardly to the light emitting element and the light transmitting part, a problem arises that the element is separated from the mother substrate.

Also, in order to solve the burr defect, it was difficult to determine the standard of the cut line because the arrangement of the light emitting elements could not be confirmed even if the mother substrate was reversed and the cutter was placed on the back side to cut. In addition, it is also possible to consider a method of machining an alignment hole when manufacturing the mother substrate before mounting the light emitting device on the mother substrate. Therefore, it is not possible to solve the arrangement deviation of the light emitting elements according to how the light emitting elements are arranged afterwards.

However, according to an embodiment of the present invention, an alignment mark can be formed without adding a separate process by using the existing cutting step of the light transmitting part during the steps after disposing the light emitting devices. Then, after inverting the mother substrate and placing a cutter in the rear direction of the mother substrate, cutting of the mother substrate is performed based on the alignment mark. Since the alignment mark is formed in consideration of the positions after arranging the light emitting elements, the positions of the light emitting elements can be easily predicted even if they are inverted.

In addition, since the mother substrate is cut through down-cutting from the back side, deformation of the external contact electrode provided on the mother substrate is minimized, so that burr defects are remarkably reduced.

In addition, when using the method of manufacturing a light emitting device according to an embodiment of the present invention, defects related to the light emitting device and the light transmitting parts during cutting can be remarkably reduced by appropriately adjusting the cutting line according to the arrangement of the light emitting devices. In the case of an embodiment of the present invention, since the alignment mark reflecting information according to the arrangement of the light emitting elements is also formed on the back side of the mother substrate, the second cutter is disposed based on the alignment mark and the mother substrate is cut. because it can Accordingly, cutting defects of the light emitting devices may be significantly reduced.

In the light emitting device, not only the width in the long side direction and the width in the short side direction are different from each other, but also when the width in any one direction is narrow, cutting failure may occur even if the light emitting elements are slightly deviated from their original positions. The cutting failure includes the side surface of each light emitting element or the light transmitting part being exposed to the outside by cutting without being sufficiently covered by the cover part.

In particular, due to a difference in the width at the long side or the width at the short side, defects may appear to different degrees in a cutting process when manufacturing the light emitting device. For example, when the width on the long side is formed to be larger than the width on the short side, when the light emitting element or the light transmitting part is arranged out of the original position because the width on the short side is relatively small, when cutting into individual light emitting devices ( In particular, when cutting in the first direction), the frequency in which the side surface of the light emitting element or the light transmitting part is exposed to the outside may be high. When the light emitting element or the light transmitting part is exposed to the outside, there is a defect that light of an undesired wavelength band is emitted in a direction other than a desired direction. In addition, since the light transmitting portion is provided to have a larger area than that of the light emitting device, the side surface may be exposed more often than the light emitting device without being covered by the cover portion.

However, according to the present invention, this problem can be solved because the cover part and the mother substrate are cut at an accurate position in consideration of the positions of the light emitting elements and the light transmitting part. In fact, according to the existing invention, the width of the cover part in one direction is about 50 micrometers or less, and furthermore, it is impossible to cut the mother substrate on the back of a product having a width of about 30 micrometers or less, but it is possible according to an embodiment of the present invention.

Although the above has been described with reference to the preferred embodiment of the present invention, those skilled in the art or those having ordinary knowledge in the technical field will not depart from the spirit and technical scope of the present invention described in the claims to be described later. It will be understood that various modifications and variations of the present invention can be made without departing from the scope of the present invention.

Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

12 Motherboard 100 Light emitting device
110 light emitting element 120 element substrate
120a first sub-substrate 120b second sub-substrate
130 light transmitting part 140 contact electrode
141 Device contact electrode 143 Intermediate contact electrode
145 external contact electrode HL solder hole
150 Cover 161 First Cutter
163 Second cutter 190 Alignment mark
D1, D2, D3 first to third directions

Claims (20)

mounting a plurality of light emitting devices on the entire surface of the mother substrate;
disposing light transmitting portions on the light emitting devices;
disposing a first cutter on the front side of the mother substrate and cutting at least a portion of the light transmitting portions;
forming an alignment mark on the mother substrate by removing a portion of the mother substrate; and
Placing a second cutter on the rear side of the mother substrate and cutting the mother substrate corresponding to each light emitting element based on the alignment mark,
The step of cutting at least a portion of the light transmitting portions and the step of forming the alignment mark are performed in a single process. According to claim 1,
The forming of the alignment mark is performed using the first cutter. According to claim 1,
Each light emitting device has a rectangular shape having a pair of first sides and a pair of second sides, a direction in which the first sides extend is referred to as a first direction, and a direction in which the second sides extend is a second direction , the light emitting devices are arranged in a matrix form in which the first direction is a column direction and the second direction is a row direction. 4. The method of claim 3,
Each of the light emitting devices has a rectangular shape having the first sides as long sides and the second sides as short sides. According to claim 1,
The first cutter cuts at least a portion of the light transmitting parts along the cutting line extending in the first direction,
The alignment mark is a light emitting device manufacturing method in which an extension of the cutting line meets an end of the mother substrate. 6. The method of claim 5,
The alignment mark is a slot formed by removing a part of the mother substrate. 7. The method of claim 6,
The alignment mark is provided as a pair at a point where the cut line and both ends of the mother substrate meet. 7. The method of claim 6,
The alignment marks include a first alignment mark provided as a pair at a point where the cutting line and both ends of the mother substrate meet, and a first alignment mark provided as a pair at a point spaced apart from the first alignment mark along the second direction. 2 A method of manufacturing a light emitting device including an alignment mark. According to claim 1,
The second cutter cuts the mother substrate along the first direction at a predetermined interval in consideration of a pitch of two light emitting elements adjacent to each other based on an alignment mark. According to claim 1,
The first cutter is a circular blade rotating in one direction, the light emitting device manufacturing method. 11. The method of claim 10,
The step of cutting at least a portion of the light transmitting parts with the first cutter is a light emitting device manufacturing method in which the rotation direction of the circular blade is performed in a down-cutting manner toward the mother substrate. According to claim 1,
The method of manufacturing a light emitting device further comprising the step of inverting the mother substrate before the step of cutting the mother substrate corresponding to each light emitting element with the second cutter. 13. The method of claim 12,
The second cutter is a circular blade rotating in one direction, and the step of cutting the mother substrate corresponding to each light emitting element with the second cutter is performed in a down-cutting manner in which the rotational direction of the circular blade faces the mother substrate. A method for manufacturing a light emitting device. According to claim 1,
In the step of disposing the light transmitting parts on the light emitting elements, the light transmitting parts are provided in a smaller number than the light emitting elements, and at least one light transmitting part is disposed on at least two or more light emitting devices. method. According to claim 1,
and cutting the mother substrate along the second direction using the second cutter. According to claim 1,
The method of manufacturing a light emitting device further comprising the step of forming a cover that covers the light emitting elements and the light transmitting parts. 17. The method of claim 16,
The method further comprising the step of exposing upper surfaces of the light-transmitting parts to the outside by removing an upper portion of the cover after forming the cover part covering the light-emitting elements and the light-transmitting parts. 18. The method of claim 17,
When viewed from a direction opposite to the upper surface of the light transmitting portions, each of the light transmitting portions is surrounded by the cover portion, and the width at the side extending in the first direction of the light transmitting portion is the side extending in the second direction A method of manufacturing a light emitting device greater than the width in mounting the light emitting devices on the entire surface of the mother substrate;
disposing light transmitting portions on the light emitting devices;
disposing a first cutter on the front side of the mother substrate and cutting at least a portion of the light transmitting portions;
forming an alignment mark by cutting at least a portion of the light transmitting portions and removing a portion of the mother substrate on the mother substrate in a single process;
forming a cover portion covering side surfaces of the light emitting elements and the light transmitting portions;
exposing upper surfaces of the light transmitting parts by removing a portion of the cover part; and
Placing a second cutter on the rear side of the mother substrate and cutting the mother substrate and the cover portion corresponding to each light emitting element based on the alignment mark,
The side surfaces of the light transmitting parts and the cut side surfaces of the cover parts are spaced apart from each other. mounting the first and second light emitting devices to be spaced apart from each other on the entire surface of the mother substrate;
disposing at least one light transmitting part on the first and second light emitting devices;
arranging a first cutter on the front side of the mother substrate and cutting at least a portion of the light transmitting portion to form first and second light transmitting portions having side surfaces facing each other spaced apart from each other;
forming the first and second light transmitting portions and forming an alignment mark on the mother substrate by removing a portion of the mother substrate, performed in a single process;
forming a cover portion covering side surfaces of the first and second light emitting devices and the first and second light transmitting portions;
exposing upper surfaces of the first and second light transmitting portions by removing a portion of the cover; and
Placing a second cutter on the rear side of the mother substrate and cutting the mother substrate and the cover portion between the side surfaces of the first and second light transmitting portions facing each other based on the alignment mark A method for manufacturing a light emitting device.

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