KR20210053207A - Creep feed grinding method and grinding apparatus - Google Patents

Abstract

An objective is to grind a workpiece by a uniform thickness without the need for controlling a height position of a complex grinding means. To achieve the objective, provided is a creep feed grinding method including: a test grinding process of test-grinding a workpiece (W) through a grinding stone (340); a thickness measurement process of measuring the thickness (T1) of one end of the test-ground workpiece (W) and the thickness (T2) of the other end thereof separately through a thickness measurement means (7); a thickness difference calculation process of calculating a difference (D) in thickness by subtracting T1 from T2 through a thickness difference calculation means (8); a holding surface inclination process of inclining a holding surface (20a) by moving one end (211) of a frame body (21) of a chuck table (2) downward in a -Z direction through an inclination adjustor (6), based on the calculated difference (D) in thickness; and a grinding process of grinding a new workpiece (W) through the grinding stone after inclining the holding surface (20a). Therefore, the workpiece (W) is ground by a uniform thickness.

Description

Creep feed grinding method and grinding device {CREEP FEED GRINDING METHOD AND GRINDING APPARATUS}

The present invention relates to a creep feed grinding method and a grinding device.

By placing the lower surface of the grinding grindstone at a height below the upper surface of the workpiece held on the holding surface of the chuck table, and moving the grinding grindstone and the chuck table in a relatively horizontal Y-axis direction, from one end of the upper surface of the workpiece. In creep feed grinding in which the grinding grindstone is moved to the other end to grind the workpiece, a difference in thickness occurs between the thickness of the workpiece at one end and the thickness of the workpiece at the other end due to consumption of the grinding grindstone.

Therefore, as disclosed in Patent Literature 1, the consumption amount of the grinding grindstone in the relationship with the position in the Y-axis direction is grasped, and while moving the workpiece in the Y-axis direction with respect to the grinding grindstone, the grinding grindstone is It is lowered to reduce the difference in thickness that occurs in the workpiece.

Patent Document 1: Japanese Laid-Open Patent No. 2016-002598

However, in the above-described grinding, since the grinding grindstone is lowered according to the position in the Y axis direction while relatively moving the workpiece and the grinding grindstone in the Y-axis direction, the Y-axis and the Z-axis of the grinding grindstone relative to the workpiece There is a problem that a control unit that controls the relative movement in the direction of the two axes is required and that control is difficult.

In the present invention, the workpiece held on the holding surface and the grinding grindstone rotating are relatively moved in the Y-axis direction parallel to the holding surface, so that the upper surface of the workpiece is moved from one end side to the other end side of the workpiece. A creep feed grinding method for grinding using, wherein the lower surface of the grinding grindstone is positioned at a predetermined distance below the upper surface of the workpiece held on the holding surface, and the workpiece and the grinding grindstone are moved relatively in the Y-axis direction. A test grinding step of grinding the upper surface of the workpiece by performing the test and moving the workpiece held on the holding surface ground in the test grinding step in the Y-axis direction, and at least one end and the other end in the Y-axis direction. A thickness measurement process in which the thickness of the workpiece is measured using a thickness measuring means, and a thickness difference calculation that calculates the thickness difference between the thickness of one end of the workpiece and the thickness of the other end of the workpiece measured in the thickness measurement process. A holding surface inclining step in which the holding surface is inclined by moving one end of the workpiece having a small thickness measured in the thickness measuring step in a downward direction away from the lower surface of the grinding grindstone by the thickness difference, and the holding surface In the tilting process, the lower surface of the grinding grindstone is positioned at a predetermined distance below the upper surface of one end side of the workpiece newly maintained on the inclined holding surface, and the workpiece and the grinding grindstone are moved relatively in the Y-axis direction. It is a creep feed grinding method that includes a grinding step of grinding the upper surface of the workpiece to be processed.

In the test grinding step, it is preferable to grind the workpiece held on the holding surface a plurality of times.

The present invention relates to a chuck table for holding a workpiece on a holding surface, a grinding means for grinding a workpiece by rotating the grinding wheel around a center of a grinding wheel in which a grinding grindstone is annularly arranged on a base, and the chuck table and A horizontal moving means for relatively moving the grinding means in a Y-axis direction parallel to the holding surface, and a vertical moving means for moving the grinding means in a Z-axis direction perpendicular to the holding surface, and one end of the workpiece A grinding device for creep feed grinding an upper surface of a workpiece from the side toward the other end using the grinding grindstone, comprising: a thickness measuring means for measuring the thickness of the workpiece held on the holding surface; and a thickness measuring means measured by the thickness measuring means. A thickness difference calculating means for calculating a thickness difference between the thickness of the one end side and the thickness of the other end side of the workpiece, a tilt adjustment mechanism for adjusting an inclination of the holding surface in the Y-axis direction, and the one end side Or, of the other end side, the tilt adjustment mechanism is controlled to move the side with the smaller thickness of the workpiece measured by the thickness measuring means in a downward direction away from the lower surface of the grinding grindstone by the thickness difference. It is a grinding device provided with a control means for tilting.

In the present invention, since the inclination of the holding surface is adjusted before grinding, a complicated operation such as lowering the grinding grindstone during grinding as in the prior art is unnecessary.

In addition, in the case of finishing the workpiece to a desired thickness by plural creep feed grinding, test grinding is performed as many times as the creep feed grinding, and then the difference in thickness between one end and the other end is calculated, and corresponds to the difference. Lower one end of the oil holding surface. Thereafter, creep feed grinding of the workpiece can be performed to add consumption of the grinding grindstone and finish it to a desired thickness.

1 is a perspective view showing the entire grinding device.
Figure 2 (a) is a cross-sectional view of the workpiece before trial grinding, (b) is a cross-sectional view of the workpiece during trial grinding, and (c) is a cross-sectional view of the workpiece before trial grinding, and (c) is It is a cross-sectional view of the figure from the side.
Figure 3 (a) is a cross-sectional view showing the state of measuring the height of the holding surface using the holding surface height measuring means, (b) is measuring the height of one end of the upper surface of the workpiece using the upper surface height measuring means It is a cross-sectional view showing a mode, and (c) is a cross-sectional view showing a mode of measuring the height of the other end of the upper surface of the workpiece.
4 is a cross-sectional view showing a state in which the holding surface is inclined.
Fig. 5(a) is a cross-sectional view showing a state during grinding of a workpiece, and (b) is a cross-sectional view showing a state after grinding of the workpiece.
6A is a cross-sectional view showing a state after the first test grinding, and (b) is a cross-sectional view showing a state in which the top surface of the workpiece is leveled by raising one end of the chuck table using a tilt adjustment mechanism. .
Figure 7 (a) is a cross-sectional view showing the state after the first grinding, and (b) is, after rotating the chuck table 180 degrees using a rotating means, lower the other end of the chuck table using a tilt adjustment mechanism. It is a cross-sectional view showing a state in which the upper surface of the workpiece is horizontal.

1 grinding device

The grinding device 1 shown in FIG. 1 is a grinding device that grinds the workpiece W held on the holding surface 20a. Hereinafter, the grinding device 1 will be described.

As shown in FIG. 1, the grinding device 1 is provided with a base 10 and a column 11 installed upright on the -X direction side of the base 10.

On the base 10, the chuck table 2 is arranged. The chuck table 2 includes, for example, a rectangular suction portion 20 and a frame body 21 supporting the suction portion 20. The upper surface of the suction part 20 is a holding surface 20a on which the workpiece W is held, and the holding surface 20a is formed in the same plane as the upper surface 21a of the frame body 21.

In addition, the frame body 21 of the chuck table 2 is supported by the rotating means 24. The rotating means 24 has a function of rotating the chuck table 2 with a rotating shaft 25 parallel to the Z-axis as an axis.

On the +X direction side of the column 11, a vertical movement means 4 for moving the grinding means 3 in the Z-axis direction perpendicular to the holding surface 20a is disposed.

The grinding means 3 includes a spindle 30 having a rotation shaft 35 in the Z-axis direction, a housing 31 rotatably supporting the spindle 30, and a spindle 30 with the rotation shaft 35 as an axis. ), a spindle motor 32 that drives rotation, an annular mount 33 connected to the lower end of the spindle 30, and a grinding wheel 34 detachably mounted on the lower surface of the mount 33, and have.

The grinding wheel 34 includes a wheel base 341 and a plurality of grinding grindstones 340 of substantially rectangular parallelepiped shape arranged annularly on the bottom surface of the wheel base 341, and the lower surface of the grinding grindstone 340 ( 340a) is a grinding surface for grinding the workpiece W.

By rotating the spindle 30 with the rotation shaft 35 as an axis using the spindle motor 32, the mount 33 connected to the spindle 30 and the grinding wheel 34 mounted on the mount 33 are integrated. As a result, it rotates around the rotation shaft 35 as an axis.

The vertical movement means 4 includes a ball screw 40 having a rotation shaft 45 in the Z-axis direction, a pair of guide rails 41 arranged in parallel with the ball screw 40, and a rotation shaft 45. A Z-axis motor 42 that rotates the ball screw 40 as an axis, and a lifting plate 43 whose side is in sliding contact with the guide rail 41 by screwing an internal nut to the ball screw 40, It is provided with a holder 44 connected to the elevator plate 43 to support the grinding means 3.

When the ball screw 40 is driven by the Z-axis motor 42 and the ball screw 40 rotates about the rotation shaft 45 as an axis, the lifting plate 43 is guided to the guide rail 41 accordingly. As a result, it moves up and down in the Z-axis direction, and the grinding means 3 held in the holder 44 moves in the Z-axis direction.

Inside the base 10, an inner base 12 is arranged. On the inner base 12, a horizontal moving means 5 for horizontally moving the chuck table 2 in the Y-axis direction is disposed.

The horizontal moving means 5 includes a ball screw 50 having a rotation shaft 55 in the Y-axis direction, a Y-axis motor 52 that rotates the ball screw 50 with the rotation shaft 55 as an axis, and a ball A pair of guide rails 51 arranged in parallel with the screw 50, and a movable plate 53 in which the bottom part slides into contact with the guide rail 51 by screwing the nut inside the ball screw 50. I'm doing it.

By driving the ball screw 50 using the Y-axis motor 52, when the ball screw 50 rotates about the rotation shaft 55 as an axis, the movable plate 53 is guided to the guide rail 51 while Y It moves horizontally in the axial direction.

On the movable plate 53, a tilt adjustment mechanism 6 is disposed. The tilt adjustment mechanism 6 includes a support plate 62 for supporting the rotation means 24, a support roller 60 extending in the X-axis direction disposed on the +Y direction side of the bottom surface of the support plate 62, It is provided with the lifting shaft 61 arranged on the -Y direction side of the bottom surface of the support plate 62.

The chuck table (2) supported by the rotation means (24) to the support plate (62) by adjusting the inclination of the support plate (62) with the support roller (60) as a point by lifting the lifting shaft (61) in the Z-axis direction The inclination of the holding surface 20a in the Y-axis direction can be adjusted.

The lifting shaft 61 may be, for example, a stacked piezoelectric element that expands and contracts according to an applied voltage.

Moreover, you may change the support roller 60 into a support column.

Further, a cover 28 is arranged around the chuck table 2, and a corrugated box 29 is connected to the cover 28 so as to be able to expand and contract. For example, when the chuck table 2 moves in the Y-axis direction by the horizontal moving means 5, the cover 28 moves along with the chuck table 2 in the Y-axis direction, so that the corrugated box 29 expands and contracts. .

The thickness measuring means 7 is arranged on the -X direction side of the movement path of the chuck table 2 on the base 10. The thickness measurement means 7 includes an upper surface height measurement means 71, a holding surface height measurement means 72, and a calculation unit 73.

The upper surface height measuring means 71 includes a first contactor 71 that contacts the upper surface Wa of the workpiece W, and a first scale 711 for recognizing the height position of the first contactor 71 I'm doing it. The holding surface height measuring means 72 includes a second contactor 720 that contacts the upper surface 21a of the frame body 21 and a second scale 721 that recognizes the height position of the second contactor 720. We have.

The work piece (W) is brought into contact with the upper surface (Wa) of the work piece (W) while the work piece (W) is held on the holding surface (20a) by contacting the first contactor (71) of the upper surface height measuring means (71). ) The height of the upper surface Wa can be measured. Further, by bringing the second contactor 720 of the holding surface height measuring means 72 into contact with the upper surface 21a of the frame body 21, the holding surface 20a which is the same plane with the upper surface 21a of the frame body 21 You can measure the height of ).

In the calculation unit 73, the height of the holding surface 20a is subtracted from the measured height of the upper surface Wa of the workpiece W, and the thickness of the workpiece W is measured.

The grinding device 1 is provided with the thickness difference calculation means 8. The thickness difference calculation means 8 can calculate the difference D between the thickness at one end and the thickness at the other end of the workpiece W.

The grinding device 1 is provided with a control means 9 for controlling the operation of various mechanisms provided in the grinding device 1. The control means 9 moves the smaller thickness of the workpiece W measured by the thickness measurement means 7 to the thickness difference calculating means 8 in a downward direction away from the lower surface 340a of the grinding grindstone 340. It has a function of inclining the holding surface 20a by controlling the inclination adjustment mechanism 6 that moves by the thickness difference calculated by this.

2 grinding method

(1) First embodiment

(Test grinding process)

A method of grinding the workpiece W using the grinding device 1 will be described. First, as shown in (a) of FIG. 2, the workpiece W is placed on the holding surface 20a of the chuck table 2 to operate a suction source not shown, and the suction force is applied to the holding surface 20a. To deliver. Thereby, the workpiece W is suction-held on the holding surface 20a.

Next, the spindle 30 of the grinding means 3 is rotated with the rotation shaft 35 as an axis. Thereby, the grinding grindstone 340 rotates with the rotation shaft 35 as an axis.

In a state in which the grinding grindstone 340 is rotating about the rotation shaft 35 as an axis, the grinding means 3 is lowered in the -Z direction using the vertical movement means 4, and is held on the holding surface 20a. The lower surface 340a of the grinding grindstone 340 is positioned below a predetermined distance from the height position of the upper surface Wa of the workpiece W.

Then, the chuck table 2 is moved in the -Y direction using the horizontal moving means 5.

Thereby, as shown in FIG. 2(b), the workpiece W and the grinding grindstone 340 contact. At this time, the -Y direction side of the grinding grindstone 340 is located at a height lower than that of the +Y direction side, and the -Y direction side of the grinding grindstone 340 contacts the workpiece W.

In a state in which the workpiece W and the grinding grindstone 340 are in contact, the chuck table 2 is further moved in the -Y direction as shown in Fig. 2C. Thereby, the upper surface Wa side of the workpiece W is ground by the grinding grindstone 340 by creep feed grinding.

Since the grinding grindstone 340 is consumed by the grinding of the workpiece W, the thickness of the workpiece W after grinding is not uniform, as shown in Fig. 2(c), and the workpiece W The thickness of the -Y direction side is smaller than the thickness of the +Y direction side.

(Thickness calculation process)

Next, the vertical movement means 4 is used to move the grinding means 3 in the +Z direction, so that the grinding grindstone 340 is separated from the workpiece W.

Then, as shown in Fig. 3(a), the second contactor 720 of the holding surface height measuring means 72 is brought into contact with the other end 212 of the frame body 21 of the chuck table 2 The value of the scale 721 is read, and the height of the other end 212 of the frame 21 is measured. Further, by moving the chuck table 2 in the +Y direction, the second contactor 720 is brought into contact with the one end 211 of the frame body 21 as indicated by the dashed-dotted line in FIG. 3A. The value of the second scale 721 is read, and the height of one end 211 of the frame body 21 is measured.

In addition, as shown in Fig. 3(b), the first contact 71 is brought into contact with the other end E2 of the upper surface Wa of the workpiece W to read the value of the first scale 711, The height of the other end (E2) of the upper surface (Wa) of the workpiece (W) is measured. Then, the height of the other end 212 of the frame 21 is subtracted from the height of the other end E2 of the upper surface Wa of the work W, and the thickness T2 of the other end side of the work W is measured. do.

In addition, as shown in Fig. 3(c), after moving the chuck table 2 in the +Y direction using the horizontal moving means 5, the first contact 71 of the upper surface height measuring means 71 Is brought into contact with one end E1 of the upper surface Wa of the workpiece W, the value of the first scale 711 is read, and the height of the one end E1 of the workpiece W is measured. Then, the height of the one end 211 of the frame 21 is subtracted from the height of the one end E1 of the upper surface Wa of the work W, and the thickness T1 of one end side of the work W is measured. do.

In addition, while measuring the height of the upper surface Wa of the workpiece W using, for example, the upper surface height measuring means 71, the upper surface 21a of the frame body 21 using the holding surface height measuring means 72 You may measure the height of.

(Thickness difference calculation process)

As described above, the values of the thickness T1 at one end of the workpiece W and the thickness T2 at the other end of the workpiece W measured by the thickness measuring means 7 are, for example, as electrical signals, It is sent to the thickness difference calculating means 8 shown in FIG. 3(c). Then, in the thickness difference calculating means 8, the thickness T1 on one end side of the work piece W and the thickness T2 on the other end side of the work piece W are subtracted, and one end of the work piece W The thickness difference D between the thickness T1 on the side and the thickness T2 on the other end is calculated.

(Retaining ground tilting process)

Next, the lower end 340a of the grinding grindstone 340 by the thickness difference D calculated by the thickness difference calculating means 8 on the side of the one end E1 having the small thickness of the test-ground work W It moves in the downward direction (-Z direction) away from and tilts the holding surface 20a.

Specifically, the tilt adjustment mechanism 6 is controlled by the control means 9 shown in FIG. 4 to lower the lifting shaft 61 by the thickness difference D in the -Z direction. When one end 211 of the frame body 21 of the chuck table 2 is lowered in the -Z direction by the thickness difference D, the -Y direction side of the holding surface 20a of the chuck table 2 is a support roller Tilt downward with (60) as the axis. Then, one end E1 of the upper surface Wa of the workpiece W held on the chuck table 2 descends in the -Z direction by the thickness difference D.

(Grinding process)

After tilting the holding surface 20a as described above, the workpiece W is ground. First, as shown in Fig. 4, after holding the new workpiece W on the holding surface 20a, the grinding grindstone 340 is lowered in the -Z direction using the vertical movement means 4, and the workpiece The lower surface 340a of the grinding grindstone 340 is positioned below a predetermined distance from the upper surface Wa on the one end E1 side of (W). Subsequently, by moving the chuck table 2 in the -Y direction using the horizontal moving means 5 as shown in Fig. 5A, the grinding grindstone 340 comes into contact with the workpiece W Creep feed grinding of the workpiece W is started. Then, as shown in FIG. 5B, when the workpiece W moves toward the -Y direction side from the grinding grindstone 340, the upper surface Wa side of the workpiece W is subjected to creep feed grinding. Since the holding surface 20a of the chuck table 2 is inclined in advance according to the wear of the grinding grindstone 340 by creep feed grinding, the surface to be ground Wb formed by grinding is the upper surface Wa before grinding. It becomes a surface parallel to and the thickness of the workpiece W becomes uniform. By tilting the holding surface 20a before grinding, it is not necessary to perform difficult control of changing the height position of the grinding grindstone 340 in the Z-axis direction during grinding.

In addition, in the grinding process, since the load in the horizontal direction applied to the grinding grindstone 340 is greater than that during the test grinding, a greater wear of the grinding grindstone 340 is added, and the thickness difference (D) is slightly larger than that of the holding surface. (20a) may be moved downward (-Z direction).

(2) Second embodiment

In the first embodiment, the case where creep feed grinding is performed only once for one workpiece has been described, but there are cases where creep feed grinding is performed multiple times for one workpiece. In that case, since the grinding grindstone 340 wears even in the second and subsequent creep feed grinding, the grinding is performed a plurality of times in the trial grinding process as well. For example, when creep feed grinding is performed twice, the following method is taken.

As shown in Fig. 6(a), as in Fig. 2, in a state where the holding surface 20a is horizontal with respect to the Y-axis direction, the grinding grindstone 340 is placed on the upper surface Wa side of the workpiece W. The first test grinding is performed by bringing into contact with and moving the chuck table 2 in the -Y direction. The thickness of the workpiece W after grinding is not uniform, and the thickness on the -Y direction side of the workpiece W is smaller than the thickness on the +Y direction side (first trial grinding step).

Next, the thickness calculation process and the thickness difference calculation process are performed like 1st Embodiment, and the thickness difference D1 between the thickness at one end side of the workpiece W and the thickness at the other end side is calculated. Then, by performing the holding surface inclining step, as shown in Fig. 6B, the side of the end E1 having a small thickness is brought close to the lower surface 340a of the grinding grindstone 340 by the thickness difference D1 + By moving in the Z direction, the holding surface 20a is inclined. Thereby, the surface Wb to be ground of the workpiece W after the test grinding is in a state horizontal with respect to the Y-axis direction.

In this way, the second trial grinding step is performed while the surface Wb to be ground is horizontal with respect to the Y-axis direction. And, in the same manner as after the first test grinding step, the thickness calculation step and the thickness difference calculation step are performed, and the thickness of the thickness of one end side and the thickness of the other end side of the workpiece W after the second test grinding step The difference D2 (not shown) is calculated.

When the thickness difference D1 and D2 is calculated in this way, creep feed grinding is performed twice in the grinding process. In the first creep feed grinding, the holding surface 20a is moved in the -Z direction away from the lower surface 340a of the grinding grindstone 340 by the thickness difference D1 from the horizontal state to the holding surface 20a. (20a) is inclined, and creep feed grinding is performed in that state. Next, in the second creep feed grinding, the holding surface 20a is tilted by moving the end E1 side further away from the lower surface 340a of the grinding grindstone 340 in the -Z direction by the thickness difference D2, In that state, creep feed grinding is performed.

In this way, in the case of performing the creep feed grinding a plurality of times, the thickness of the workpiece after the plurality of creep feed grinding is determined by performing the test grinding process, the thickness calculation process, the thickness difference calculation process, and the holding surface tilting process a plurality of times. It can be made uniform.

In addition, as shown in FIG. 7A, in a configuration in which the chuck table 2 can rotate with respect to the movable plate 53 with the rotation shaft 25 as an axis, the following method may be employed.

That is, first, in a state in which the grinding grindstone 340 is brought into contact with the upper surface Wa side of the workpiece W, as in FIG. 6A, by moving the chuck table 2 in the -Y direction, The first trial grinding is performed. The thickness of the workpiece W after grinding is not uniform, and the thickness on the -Y direction side of the workpiece W is smaller than the thickness on the +Y direction side (first trial grinding step). Then, the thickness calculation step and the thickness difference calculation step are performed to calculate the thickness difference D1 between the thickness of one end side and the thickness of the other end side of the workpiece W.

Next, the chuck table 2 is rotated 180 degrees with the rotation shaft 25 as an axis. Then, the direction in the Y-axis direction of the workpiece W is reversed, so that the thicker side becomes the -Y direction side, and the thinner side becomes the +Y direction side. Then, by moving the holding surface 20a away from the lower surface 340a of the grinding grindstone 340 by the thickness difference D1 in the -Z direction and tilting the holding surface 20a, as shown in Fig. 7B, the surface to be ground ( Wb) becomes horizontal with respect to the Y-axis direction.

In this way, the direction of the Y-axis direction of the workpiece W is reversed, the surface Wb to be ground is made horizontal with respect to the Y-axis direction, and then a second trial grinding step is performed. In this step, since the grinding is performed from the larger to the smaller thickness, the workpiece after the completion of this process is in a state in which the thickness is close to uniform. And, in the same manner as after the first test grinding step, the thickness calculation step and the thickness difference calculation step are performed, and the thickness of the thickness of one end side and the thickness of the other end side of the workpiece W after the second test grinding step The difference D2 (not shown) is calculated.

When the thickness difference D1 and D2 is calculated in this way, creep feed grinding is performed twice in the grinding process. In the first creep feed grinding, the holding surface 20a is moved in the -Z direction away from the lower surface 340a of the grinding grindstone 340 by the thickness difference D1 from the horizontal state to the holding surface 20a. (20a) is inclined, and creep feed grinding is performed in that state. Next, in the second creep feed grinding, after rotating the chuck table 2 180 degrees with the rotation shaft 25 as an axis, the one end E1 side is further increased by the thickness difference D2 of the grinding grindstone 340. The holding surface 20a is tilted by moving away from the lower surface 340a in the -Z direction, and creep feed grinding is performed in that state.

In this way, the chuck table 2 may be rotated 180 degrees between the thickness difference calculation process and the holding surface tilting process. Also by this method, the thickness of the workpiece after the plurality of creep feed grinding can be made uniform.

Further, even when the creep feed grinding is carried out only once, the trial grinding step may be carried out a plurality of times. In this case as well as in the second embodiment, the workpiece for trial grinding is performed by making the surface to be ground horizontal with respect to the Y-axis direction after the completion of one trial grinding process, and further performing the next trial grinding process in that state. Can be used any number of times. In addition, by varying the difference in the height position in the Z-axis direction between the upper surface of the workpiece before the test grinding and the lower surface of the grinding grindstone, that is, by changing the amount of removal of the workpiece in the test grinding every number of times, each removal amount and one end of the workpiece It becomes possible to grasp the relationship between the thickness difference between the and the other end.

1: grinding device 10: base 11: column 12: inner base
2: chuck table 20: suction part 20a: holding surface
21: frame body 21a: upper surface of frame body 211: one end of frame body 212: one end of frame body
24: rotating means 25: rotating shaft 28: cover 29: corrugated box cover
3: grinding means 30: spindle 31: housing 32: spindle motor
33: mount 34: grinding wheel 340: grinding wheel 340a: lower surface of the grinding wheel
341: wheel base 35: rotating shaft
4: vertical movement means 40: ball screw 41: guide rail 42: Z-axis motor
43: elevator plate 44: holder 45: rotating shaft
5: horizontal moving means 50: ball screw 51: guide rail 52: Y-axis motor
53: movable plate 55: rotating shaft
6: tilt adjustment mechanism 60: support roller 61: elevating shaft 62: support plate
7: means for measuring thickness
71: upper surface height measuring means 710: first contact 711: first scale
72: holding surface height measuring means 720: second contact 721: second scale
73: calculation unit
8: thickness difference calculation means 9: control means
W: workpiece Wa: upper surface of workpiece Wb: grinding surface formed by grinding
E1: one end of the workpiece E2: the other end of the workpiece
T1: thickness at one end T2: thickness at the other end D1, D2: difference in thickness

Claims (3)

Grinding the upper surface of the workpiece from one end to the other by moving the grinding grindstone that rotates with the workpiece held on the holding surface relative to the Y-axis direction parallel to the holding surface, using the grinding grindstone. As a creep feed grinding method,
Trial grinding in which the lower surface of the grinding grindstone is positioned at a predetermined distance below the upper surface of the workpiece held on the holding surface, and the upper surface of the workpiece is ground by relatively moving the workpiece and the grinding grindstone in the Y-axis direction. Process,
The workpiece, which was ground in the test grinding step, held on the holding surface is moved in the Y-axis direction, and the thickness of the workpiece at least one end and the other end in the Y-axis direction is measured using a thickness measuring means. The thickness measurement process and
A thickness difference calculation step of calculating a thickness difference between the thickness of one end of the workpiece and the thickness of the other end of the workpiece measured in the thickness measurement step;
A holding surface tilting step of tilting the holding surface by moving one end of the workpiece having a small thickness measured in the thickness measuring step in a downward direction away from the lower surface of the grinding grindstone by the thickness difference;
In the holding surface inclining process, the lower surface of the grinding grindstone is positioned at a predetermined distance below the upper surface of one end of the workpiece newly maintained on the holding surface inclined, and the workpiece and the grinding grindstone are placed in the Y-axis direction. Grinding process to grind the upper surface of the workpiece by moving it relatively
Creep feed grinding method comprising a. The creep feed grinding method according to claim 1, wherein in the test grinding step, grinding is performed a plurality of times on the workpiece held on the holding surface. A chuck table for holding a workpiece on a holding surface; a grinding means for grinding the workpiece by rotating the grinding wheel about a center of a grinding wheel in which a grinding grindstone is annularly arranged on a base; and the chuck table and the grinding means And a horizontal moving means for relatively moving in a Y-axis direction parallel to the holding surface, and a vertical moving means for moving the grinding means in a Z-axis direction perpendicular to the holding surface. A grinding device for creep feed grinding an upper surface of a workpiece toward a short side by using the grinding grindstone,
A thickness measuring means for measuring the thickness of the workpiece held on the holding surface,
A thickness difference calculation means for calculating a difference in thickness between the thickness of the one end side and the thickness of the other end of the workpiece measured by the thickness measurement means;
A tilt adjustment mechanism for adjusting an inclination of the holding surface in the Y-axis direction;
The inclination adjustment mechanism is controlled so that the side of the one end side or the other end side, the side of which the thickness of the workpiece measured by the thickness measuring means is small, is moved downward by the thickness difference away from the lower surface of the grinding wheel Control means for tilting the holding surface
Grinding device having a.

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