KR20210042824A - 가공 장치 - Google Patents

가공 장치 Download PDF

Info

Publication number
KR20210042824A
KR20210042824A KR1020200129453A KR20200129453A KR20210042824A KR 20210042824 A KR20210042824 A KR 20210042824A KR 1020200129453 A KR1020200129453 A KR 1020200129453A KR 20200129453 A KR20200129453 A KR 20200129453A KR 20210042824 A KR20210042824 A KR 20210042824A
Authority
KR
South Korea
Prior art keywords
cutting blade
flange
blade
unit
cutting
Prior art date
Application number
KR1020200129453A
Other languages
English (en)
Korean (ko)
Inventor
후미오 우치다
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20210042824A publication Critical patent/KR20210042824A/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2703/00—Work clamping
    • B23Q2703/02—Work clamping means
    • B23Q2703/04—Work clamping means using fluid means or a vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
KR1020200129453A 2019-10-10 2020-10-07 가공 장치 KR20210042824A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-186979 2019-10-10
JP2019186979A JP7365844B2 (ja) 2019-10-10 2019-10-10 切削ブレードを取り外す方法

Publications (1)

Publication Number Publication Date
KR20210042824A true KR20210042824A (ko) 2021-04-20

Family

ID=75346443

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200129453A KR20210042824A (ko) 2019-10-10 2020-10-07 가공 장치

Country Status (4)

Country Link
JP (1) JP7365844B2 (ja)
KR (1) KR20210042824A (ja)
CN (1) CN112652576A (ja)
TW (1) TW202114819A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102432332B1 (ko) 2022-02-22 2022-08-12 주식회사 한스팜 도축부산물을 이용한 고농축 유리아미노산 액비의 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016064450A (ja) 2014-09-22 2016-04-28 株式会社ディスコ 切削ブレード交換システム
JP2016144838A (ja) 2015-02-06 2016-08-12 株式会社ディスコ 位置調整治具及び位置調整方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4694122B2 (ja) 2003-12-24 2011-06-08 株式会社ディスコ ブレード着脱補助装置
JP6069122B2 (ja) 2013-07-22 2017-02-01 株式会社ディスコ 切削装置
JP6934334B2 (ja) 2017-06-30 2021-09-15 株式会社ディスコ 切削ブレードの装着方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016064450A (ja) 2014-09-22 2016-04-28 株式会社ディスコ 切削ブレード交換システム
JP2016144838A (ja) 2015-02-06 2016-08-12 株式会社ディスコ 位置調整治具及び位置調整方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102432332B1 (ko) 2022-02-22 2022-08-12 주식회사 한스팜 도축부산물을 이용한 고농축 유리아미노산 액비의 제조방법

Also Published As

Publication number Publication date
JP2021062420A (ja) 2021-04-22
TW202114819A (zh) 2021-04-16
JP7365844B2 (ja) 2023-10-20
CN112652576A (zh) 2021-04-13

Similar Documents

Publication Publication Date Title
KR102094047B1 (ko) 절삭 장치
KR102094048B1 (ko) 절삭 장치
TWI788571B (zh) 搬送用治具以及交換方法
US11224986B2 (en) Cutting apparatus and method of changing consumable parts
US11192190B2 (en) Blade attachment-detachment assisting apparatus
TWI770322B (zh) 切割裝置
JP2019010703A (ja) 切削ブレードの装着方法
KR20210042824A (ko) 가공 장치
KR20210042254A (ko) 절삭 블레이드의 식별 방법 및 가공 장치
JP7357521B2 (ja) 加工装置
JP7486893B2 (ja) ブレード交換装置及びブレード交換装置の調整方法
JP7377685B2 (ja) ブレード交換ユニット、及び、それを備える切削装置
JP7373936B2 (ja) フランジ機構と切削装置
CN112092222B (en) Cutting device and replacement method
JP7397615B2 (ja) 切削ブレード及び加工装置
JP2021084169A (ja) 切削ブレードの製造方法、及び、切削方法
KR20240035707A (ko) 장착 방법 및 절삭 장치
JP2021013968A (ja) 加工装置

Legal Events

Date Code Title Description
A201 Request for examination