KR20210029001A - Light emitting package and sterilization module including the same - Google Patents

Abstract

Disclosed are a light emitting element package capable of irradiating a sufficient amount of light to an irradiated object, and a sterilization module including the same. The light emitting element package comprises: a substrate; a side wall member disposed on the substrate and having a through hole; a light emitting element disposed in the through hole; and an adhesive layer fixing the side wall member to the substrate, wherein the light emitting element generates light in an ultraviolet wavelength band, and ratio of the distance from an upper surface of the substrate to an upper surface of the light emitting element to the distance from the upper surface of the substrate to an upper surface of the side wall member is 1 : 2.5 to 1 : 20.

Description

Light emitting device package and sterilization module including the same {LIGHT EMITTING PACKAGE AND STERILIZATION MODULE INCLUDING THE SAME}

The embodiment relates to a light emitting device package and a sterilization module including the same.

Semiconductor devices including compounds such as GaN and AlGaN have many advantages, such as having a wide and easy-to-adjust band gap energy, and thus can be variously used as light-emitting devices, light-receiving devices, and various diodes.

In particular, light emitting devices such as light emitting diodes and laser diodes using a group 3-5 or group 2-6 compound semiconductor material of semiconductors are red, green, and red by the development of thin film growth technology and device materials. Various colors such as blue and ultraviolet light can be implemented, and efficient white light can be realized by using fluorescent materials or by combining colors. Low power consumption, semi-permanent life, and fast response speed compared to conventional light sources such as fluorescent lamps and incandescent lamps. , Has the advantages of safety and environmental friendliness.

In addition, when a photodetector or a light-receiving device such as a solar cell is also manufactured using a compound semiconductor material of Group 3-5 or Group 2-6 of semiconductor, the development of device material generates photocurrent by absorbing light in various wavelength ranges. By doing so, light in various wavelength ranges from gamma rays to radio wavelength ranges can be used. In addition, it has the advantages of fast response speed, safety, environmental friendliness, and easy adjustment of device materials, so it can be easily used for power control or ultra-high frequency circuits or communication modules.

Therefore, the semiconductor device can replace a light emitting diode backlight, a fluorescent lamp, or an incandescent lamp that replaces the cold cathode fluorescent lamp (CCFL) constituting the transmission module of the optical communication means, the backlight of the LCD (Liquid Crystal Display) display device. Applications are expanding to white light emitting diode lighting devices, automobile headlights, traffic lights, and sensors that detect gas or fire. In addition, the application of the semiconductor device can be extended to high-frequency application circuits, other power control devices, and communication modules.

In particular, a light emitting device that emits light in the ultraviolet wavelength range can be used for curing, medical, and sterilization by performing a curing or sterilizing action. However, in order to cure or sterilize the irradiated object, it is necessary to adjust the angle of the emitted light to provide a sufficient amount of light.

The embodiment provides a light emitting device package capable of adjusting the angle of emitted light and a sterilization module including the same.

In addition, there is provided a light emitting device package capable of irradiating a sufficient amount of light to an irradiated object and a sterilization module including the same.

The problems to be solved in the examples are not limited thereto, and the objectives and effects that can be grasped from the solutions or embodiments of the problems described below are also included.

A light emitting device package according to an embodiment of the present invention includes: a substrate; A sidewall member disposed on the substrate and having a through hole; A light emitting device disposed in the through hole; And an adhesive layer fixing the sidewall member to the substrate, wherein the light emitting device generates light in an ultraviolet wavelength band, and a distance from an upper surface of the substrate to an upper surface of the light emitting device and a distance of the sidewall member from the upper surface of the substrate to the upper surface of the substrate. The ratio of the distance to the top surface is 1:2.5 to 1:20.

The side wall member may include a support portion and a reflective portion disposed on the support portion, and the reflective portion may include aluminum.

The substrate may include an insertion groove in which the side wall member is disposed.

The sidewall member may include a curvature formed on a surface facing the light emitting device.

The substrate may be a printed circuit board.

A directivity angle of light emitted from the sidewall member may be greater than 86 degrees and less than 130 degrees.

The sterilization module according to an embodiment of the present invention includes: a circulation passage including one end portion in which an inlet port is disposed and the other end portion in which an outlet port is disposed; A light-transmitting member disposed on at least one of one end and the other end of the circulation passage; And a light emitting device package disposed at one end or the other end to irradiate ultraviolet light to the circulation passage, wherein the light emitting device package includes: a substrate; A sidewall member disposed on the substrate and having a through hole; A light emitting device disposed in the through hole; And an adhesive layer fixing the sidewall member to the substrate, wherein the light emitting device generates light in an ultraviolet wavelength band, and a distance from an upper surface of the substrate to an upper surface of the light emitting device and a distance of the sidewall member from the upper surface of the substrate to the upper surface of the substrate. The ratio of the distance to the top surface is 1:2.5 to 1:20.

A virtual line connecting the top end of the light emitting device and the top end of the light-transmitting member may cross the top surface of the sidewall member.

The side wall member may include a support portion and a reflective portion disposed on the support portion, and the reflective portion may include aluminum.

A directivity angle of light emitted from the sidewall member may be greater than 86 degrees and less than 130 degrees.

The light emitting device package may include a first light emitting device package disposed at one end of the circulation passage and a second light emitting device package disposed at the other end of the circulation passage.

The first light emitting device package may irradiate light in an infrared wavelength band to the circulation passage, and the second light emitting device package may irradiate light in an ultraviolet wavelength band to the circulation passage.

According to an embodiment, the angle of light emitted from the light emitting device package may be adjusted.

Accordingly, sufficient light can be focused on the irradiated object, so that the curing and sterilizing effect can be excellent.

Various and beneficial advantages and effects of the present invention are not limited to the above description, and will be more easily understood in the course of describing specific embodiments of the present invention.

1 is a conceptual diagram of a light emitting device package according to a first embodiment of the present invention,
2 is a cross-sectional view of a light emitting device package according to a first embodiment of the present invention,
3 is a cross-sectional view of a light emitting device package according to a second embodiment of the present invention,
4 is a cross-sectional view of a light emitting device package according to a third embodiment of the present invention,
5 is a cross-sectional view of a light emitting device package according to a fourth embodiment of the present invention,
6 is a cross-sectional view of a light emitting device package according to a second embodiment of the present invention,
7 is a conceptual diagram of a sterilization module according to the first embodiment of the present invention,
8 is a diagram showing a configuration in which light emitted from a light emitting device package is incident on a sterilization module,
9 is a conceptual diagram of a sterilization module according to a second embodiment of the present invention,
10 is a conceptual diagram of a sterilization module according to a third embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to some embodiments to be described, but may be implemented in various different forms, and within the scope of the technical idea of the present invention, one or more of the constituent elements may be selectively selected between the embodiments. It can be combined with and substituted for use.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention are generally understood by those of ordinary skill in the art, unless explicitly defined and described. It can be interpreted as a meaning, and terms generally used, such as terms defined in a dictionary, may be interpreted in consideration of the meaning in the context of the related technology.

In addition, terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In the present specification, the singular form may also include the plural form unless specifically stated in the phrase, and when described as "at least one (or more than one) of A and (and) B and C", it is combined with A, B, and C. It may contain one or more of all possible combinations.

In addition, in describing the constituent elements of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used.

These terms are only for distinguishing the constituent element from other constituent elements, and are not limited to the nature, order, or order of the constituent element by the term.

And, when a component is described as being'connected','coupled' or'connected' to another component, the component is not only directly connected, coupled, or connected to the other component, but also with the component. It may also include the case of being'connected','coupled' or'connected' due to another element between the other elements.

In addition, when it is described as being formed or disposed on the “top (top) or bottom (bottom)” of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other. It also includes the case where the above other component is formed or disposed between the two components. In addition, when expressed as "upper (upper) or lower (lower)", the meaning of not only an upward direction but also a downward direction based on one component may be included.

1 is a conceptual diagram of a light emitting device package according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of a light emitting device package according to a first embodiment of the present invention, and FIG. 3 is It is a cross-sectional view of a light emitting device package.

1 and 2, the light emitting device 100 according to the embodiment includes a first substrate 10, a sidewall member 200 disposed on the first substrate 10 and having a through hole 220, It includes an adhesive layer 210 that fixes the light emitting device 100 and the sidewall member 200 disposed in the through hole 220 to the first substrate 10.

Substrates of various materials may be applied to the first substrate 10. The first substrate 10 may have a circuit pattern formed therein. The first substrate 10 may be a printed circuit board, but is not limited thereto. For example, the first substrate 10 may be a support substrate of a chip scale package (CSP) or a chip on substrate (COS). When the first substrate 10 is a printed circuit board, a connector 21 to which an external socket is connected may be disposed.

The sidewall member 200 may be fixed on the first substrate 10 and a through hole 220 may be formed therein. The light emitting device 100 may be disposed inside the through hole 220 to be electrically connected to the first substrate 10.

The sidewall member 200 may be disposed to surround the light emitting device 100 to reflect light L1 emitted from the light emitting device 100 upward. In the case of a general blue LED, it is manufactured in the form of a package and is modularized. However, since the light emitting device 100 according to the embodiment is an ultraviolet light emitting device, it is not easy to manufacture the package, so the angle of direction can be adjusted by arranging a separate side wall member 200. .

The sidewall member 200 may be fixed on the first substrate 10 by the adhesive layer 210. Exemplarily, the adhesive layer 210 may be epoxy or silicone, but is not limited thereto, and an adhesive of various materials capable of fixing the sidewall member 200 to the first substrate 10 may be selected, and ultraviolet light When a material that is cured and does not lower the fixing force of the sidewall member 200 and the first substrate 10 is disposed, the reliability of the light emitting device package may be improved. For example, during surface mounting (SMT), after applying solder to a region where the side wall member 200 is disposed, the side wall member 200 may be formed thereon. In an embodiment, the adhesive may be a concept including solder. The sidewall member 200 may be selected from a material that can be fixed by solder. For example, the sidewall member 200 may be made of various metal materials forming an electrode.

The sidewall member 200 may include aluminum to reflect light emitted from the light emitting device 100. Aluminum can reflect 80% of the light in the UVC wavelength range. The side wall member 200 may be made of aluminum itself, or aluminum may be coated only on the outside. In addition, in addition to aluminum, various materials capable of reflecting light in the ultraviolet wavelength band may be selected.

The angle θ of the side wall member 200 may be 90 degrees to 150 degrees. If the angle of the side wall member 200 is less than 90 degrees, it is difficult to reflect light upward, and if the angle is greater than 150 degrees, it may be difficult to control the directivity angle. The angle θ of the sidewall member 200 may be an angle between an inner surface facing the light emitting device 100 and a horizontal surface of the substrate 10.

The separation distance W1 between the side wall member 200 and the light emitting device 100 is not particularly limited. The separation distance W1 may be spaced apart at predetermined intervals so that light emitted from the side of the light emitting device is reflected by the side wall member and emitted upward. Exemplarily, the separation distance W1 may be 0.1mm to 5mm or 0.5mm to 4mm.

The light emitting device 100 may output light in an ultraviolet wavelength band. Exemplarily, the light-emitting device 100 may output light (UV-A) in the near ultraviolet wavelength band, may output light (UV-B) in the far ultraviolet wavelength band, and light in the deep ultraviolet wavelength band (UV-C). ) Can be printed. The wavelength range may be determined by the composition ratio of aluminum of the semiconductor structure.

Illustratively, light in the near-ultraviolet wavelength band (UV-A) may have a main peak in a wavelength band ranging from 320nm to 420nm, and light in the far ultraviolet wavelength band (UV-B) may have a main peak in the range of 280nm to 320nm. In addition, the deep ultraviolet wavelength band (UV-C) may have a main peak in the range of 100 nm to 280 nm.

The configuration of the light emitting device 100 is not particularly limited. For example, the light emitting device 100 may be a CSP type light emitting device package or a COS type light emitting device package. In addition, the chip itself may be mounted on the first substrate 10 without separate packaging. In addition, various structures such as a horizontal type, a vertical type, and a flip chip type may be applied to the light emitting device 100 without limitation.

Table 1 below is a table in which the angle of inclination (θ) is 110 degrees, and the angle of directivity and the amount of effective light are measured while gradually increasing the height of the side wall member 200 made of aluminum. The light emitting device 100 was tested based on a COS type having an active layer height of 0.35 mm on the upper surface of the first substrate 10. The distance H3 between the light-emitting element 100 and the light-transmitting member 30 was 5 mm. The light-transmitting member 30 is a member for injecting light onto an object to be irradiated.

Comparative Example 1 Example 1 Example 2 Example 3 Example 4 Example 5 Side wall height none 1mm 2mm 3mm 4mm 5mm Directing angle 136.8 133.6 102 86.4 77.6 70.4 Effective light quantity 100% 105% 112% 108% 106% 105%

Referring to Table 1, when there is no sidewall, the directivity angle is 136.8 degrees, whereas the directivity angle gradually decreases as the height of the sidewall increases. For example, it can be seen that in the case of Example 2 having a side wall height of 2 mm, the directing angle was reduced to 102 degrees, and in the case of Example 5 having a side wall of 5 mm, the directing angle was reduced to 70.4 degrees.

The effective amount of light may be defined as the amount of light injected into the light transmitting member 30. When the effective light amount of the comparative example is defined as 100%, in Examples 1 and 2, it can be seen that the effective light amount increases as the sidewall height increases. This is because the directivity angle decreases and the amount of light incident on the light transmitting member 30 increases.

However, in Examples 3 to 5, it can be seen that as the height of the sidewall increases, the amount of effective light rather decreases. The sidewall member 200 reflects most of the ultraviolet light, but may absorb some of the ultraviolet light. For example, since aluminum, which has the highest reflectance of ultraviolet light, also has a reflectance of about 80%, about 20% of the light emitted from the light emitting device 100 may be absorbed by the sidewall member 200. Accordingly, as the height of the sidewall increases, the surface area of the sidewall member 200 increases and the amount of light absorption increases, so that the amount of effective light decreases.

The height of the top surface of the light emitting device 100 may be variously changed. For example, the height of the top surface may vary according to the type of the light emitting device 100. Depending on the type of the light emitting device 100, the height of the top surface of the light emitting device 100 may be 0.1mm to 0.8mm. In addition, referring to Table 1, it can be seen that the height of the side wall is the highest at 2 mm.

The ratio of the distance H1 from the upper surface of the first substrate 10 to the upper surface of the light emitting device 100 and the distance H2 from the upper surface of the first substrate 10 to the upper surface of the sidewall member 200 is 1: It may be from 2.5 to 1:20.

When the distance ratio is smaller than 1:2.5 (eg, 1:2.2), there is a problem that the height of the side wall member decreases and the directivity angle increases. In addition, when the distance ratio is greater than 1:40, there is a problem in that the area of the side wall member is widened and the light absorption rate of the side wall member is increased.

The angle (direction angle) of light emitted from the side wall member 200 may be greater than 86 degrees and less than 130 degrees. When the angle of light emitted from the sidewall member 200 is greater than 130 degrees, some light cannot be incident on the light transmitting member (or the object to be irradiated), and thus there is a problem that the amount of effective light incident on the member (or the object to be irradiated) is reduced. In addition, when the angle of light is less than 86 degrees, there is a problem that the area of the side wall member increases, and the light absorption rate of the side wall member increases.

The top surface 200-1 of the side wall member 200 may cross a virtual line S1 connecting the ends of the light-transmitting member 30 from the top surface 101 of the light emitting device 100. According to this configuration, the angle (direction angle) of light emitted from the side wall member 200 can be controlled to be greater than 86 degrees and less than 130 degrees.

Table 2 below is a table in which the amount of effective light is measured while gradually increasing the height of the side wall member 200 having an angle of 110 degrees. At this time, the light-emitting device 100 was tested based on the COS type whose height of the active layer is 0.35 mm from the top surface of the first substrate 10, but the distance between the light-emitting device 100 and the light-transmitting member 30 (H3 ) Increased to 10 mm.

Example 7 Example 8 Example 9 Side wall height 2mm 4mm 6mm Effective light quantity 71.58% 83.62% 81.46%

As a result of the examination, it can be seen that the amount of effective light increased more when the side wall height was 4 mm than when the side wall height was 2 mm. That is, when the height of the side wall is 2 mm, it can be seen that the effective light amount is dependent on the separation distance of the irradiated object.

Referring to FIG. 3, the sidewall member 200 may include a support part 201 made of a polymer resin and a reflective part 202 disposed on an outer surface of the support part 201. Polymeric resins can be applied without limitation in various types of resins generally used in semiconductor fabrication. In addition, the reflector 202 may include aluminum. However, the present invention is not limited thereto, and various materials capable of reflecting ultraviolet light may be included.

Referring to FIG. 3, in the light emitting device 100, a plurality of semiconductor structures 120 may include a first conductivity type semiconductor layer 121, a second conductivity type semiconductor layer 122, and an active layer 123. . The semiconductor structure according to the embodiment may be a flip chip structure, but is not limited thereto. The semiconductor structure may be a lateral structure.

The third substrate 110 may be a sapphire substrate, but any material capable of transmitting ultraviolet light is not particularly limited. The third substrate 110 may be a growth substrate on which the first conductivity type semiconductor layer 121 or the like is formed.

The first conductivity type semiconductor layer 121 may be implemented with at least one of compound semiconductors such as Group III-V and Group II-VI. The first conductivity-type semiconductor layer 121 is a semiconductor material having a composition formula of InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1), or AlInN, AlGaAs, GaP, GaAs , GaAsP, AlGaInP may be formed of a selected material. The first conductivity type semiconductor layer 121 may be doped with a first dopant. The first dopant may be an n-type dopant such as Si, Ge, Sn, Se, and Te. That is, the first conductivity-type semiconductor layer 121 may be an n-type semiconductor layer doped with an n-type dopant.

Meanwhile, an uneven structure may be formed on the first conductivity type semiconductor layer 121. The uneven structure may improve light extraction efficiency of the semiconductor structure 120.

The second conductivity-type semiconductor layer 122 may be implemented with at least one of compound semiconductors such as Group III-V and Group II-VI. The second conductivity type semiconductor layer 122 is a semiconductor material having a composition formula of InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1), or AlInN, AlGaAs, GaP, GaAs , GaAsP, AlGaInP may be formed of a selected material. The second conductivity type semiconductor layer 122 may be doped with a second dopant. The second dopant may be a p-type dopant such as Mg, Zn, Ca, Sr, or Ba. That is, the second conductivity-type semiconductor layer 122 may be a p-type semiconductor layer doped with a p-type dopant.

The active layer 123 may be disposed between the first conductivity type semiconductor layer 121 and the second conductivity type semiconductor layer 122. The active layer 123 is a layer where electrons (or holes) injected through the first conductivity type semiconductor layer 121 and holes (or electrons) injected through the second conductivity type semiconductor layer 122 meet. The active layer 123 transitions to a low energy level as electrons and holes recombine, and may generate light having a wavelength corresponding thereto.

The active layer 123 may have any one of a single well structure, a multiple well structure, a single quantum well structure, a multi quantum well (MQW) structure, a quantum dot structure, or a quantum wire structure. Is not limited to. When the active layer 123 is formed in a well structure, the well layer/barrier layer of the active layer 123 is InGaN/GaN, InGaN/InGaN, GaN/AlGaN, InAlGaN/GaN, GaAs (InGaAs)/AlGaAs, GaP (InGaP) /AlGaP may be formed in any one or more pair structure, but is not limited thereto. The well layer may be formed of a material having a band gap smaller than that of the barrier layer.

The first electrode 181 may be electrically connected to the first conductivity type semiconductor layer 121, and the second electrode 182 may be electrically connected to the second conductivity type semiconductor layer 122. The first electrode 181 may be electrically connected to the first pad 11 of the substrate, and the second electrode 182 may be electrically connected to the second pad 12 of the substrate.

In the embodiment, the first electrode 181 and the second electrode 182 are illustrated as a flip chip type disposed under the light emitting device, but the structure of the light emitting device is not limited thereto.

4 is a cross-sectional view of a light emitting device package according to a third embodiment of the present invention, FIG. 5 is a cross-sectional view of a light emitting device package according to a fourth embodiment of the present invention, and FIG. 6 is It is a cross-sectional view of a light emitting device package.

Referring to FIG. 4, the light emitting device 100 may be of a COS type. Specifically, the light emitting device 100 may be disposed on the electrodes of the sub second substrate 102 and the sub second substrate 102. In this case, the height of the top surface of the light emitting device 100 may be increased by the height of the sub-second substrate 102.

The side surface of the side wall member 200 may have a curvature R1. The curvature of the sidewall member may be intentionally formed to increase the reflection efficiency.

Referring to FIG. 5, an insertion groove 10-1 to which the side wall member 200 is fixed may be formed in the first substrate 10. The lower end 210 of the side wall member 200 may be fixed by an adhesive applied to the insertion groove 10-1. According to this configuration, the sidewall member 200 may be firmly fixed to the first substrate 10.

Referring to FIG. 6, the sidewall member according to the embodiment may be manufactured by forming a step on a substrate. In this case, the process of disposing a separate side wall member may be omitted. An aluminum reflective layer may be formed on the inner side of the side wall member to reflect ultraviolet light. It is preferable that the sidewall member according to the embodiment also has a height ratio of H1 and H2 described above.

7 is a conceptual diagram of a sterilization module according to a first embodiment of the present invention, and FIG. 8 is a diagram illustrating a configuration in which light emitted from a light emitting device package is incident on the sterilization module.

7, The light transmitting member 30 disposed at at least one of one end 2-1 and the other end 2-2 of the circulation passage 2, and one end 2-1 or the other end of the circulation passage 2 It includes a light emitting device package (1) arranged in (2-2) to irradiate ultraviolet light.

In the circulation passage 2, an inlet 2a through which a fluid is introduced may be disposed at one end 2-1, and a discharge port 2b through which a fluid is discharged may be disposed at the other end 2-2. The circulation passage 2 may be connected to a member for purifying a fluid. Alternatively, the circulation passage 2 may be connected to a member that cools or heats the fluid. The circulation passage 2 may be disposed in a water purifier or the like.

A light-transmitting member 30 may be disposed at the inlet 2a of the circulation passage 2. Accordingly, the ultraviolet light emitted from the light emitting device package 1 may pass through the light-transmitting member 30 and enter the circulation passage 2. Therefore, the light passing through the circulation passage 2 can be sterilized by ultraviolet light.

The light emitting device package 1 includes a first substrate 10, a sidewall member 200 disposed on the first substrate 10 and having a through hole 220, and a light emitting device 100 disposed in the through hole 220 And an adhesive layer 210 fixing the sidewall member 200 to the first substrate 10.

Substrates of various materials may be applied to the first substrate 10. The first substrate 10 may have a circuit pattern formed therein. The first substrate 10 may be a printed circuit board, but is not limited thereto. For example, the first substrate 10 may be a support substrate of a chip scale package (CSP) or a chip on substrate (COS). When the first substrate 10 is a printed circuit board, a connector 21 to which an external socket is connected may be disposed.

The sidewall member 200 may be fixed on the first substrate 10 and a through hole 220 may be formed therein. The light emitting device 100 may be disposed inside the through hole 220 to be electrically connected to the first substrate 10.

The sidewall member 200 may be disposed to surround the light emitting device 100 to reflect light L1 emitted from the light emitting device 100 upward. In the case of a general blue LED, it is manufactured in the form of a package and is modularized. However, since the light emitting device 100 according to the embodiment is an ultraviolet light emitting device, it is not easy to manufacture the package, so the angle of direction can be adjusted by arranging a separate side wall member 200. .

The sidewall member 200 may be fixed on the first substrate 10 by the adhesive layer 210. For example, the adhesive layer 210 may be epoxy or silicone, but is not limited thereto, and an adhesive of various materials may be selected. However, the present invention is not limited thereto, and any configuration capable of fixing the sidewall member 200 to the first substrate 10 is not particularly limited.

For example, during surface mounting (SMT), after applying solder to a region where the side wall member 200 is disposed, the side wall member 200 may be formed thereon. In an embodiment, the adhesive may be a concept including solder. The sidewall member 200 may be selected from a material that can be fixed by solder. For example, the sidewall member 200 may be made of various metal materials forming an electrode.

The sidewall member 200 may include aluminum to reflect light emitted from the light emitting device 100. Aluminum can reflect 80% of the light in the UVC wavelength range. The side wall member 200 may be made of aluminum itself, or aluminum may be coated only on the outside. In addition, in addition to aluminum, various materials capable of reflecting light in the ultraviolet wavelength band may be selected.

The angle of the side wall member 200 may be 90 degrees to 130 degrees. If the angle of the side wall member 200 is less than 90 degrees, it is difficult to reflect light upward, and if the angle is greater than 130 degrees, it may be difficult to control the directivity angle.

9 is a conceptual diagram of a sterilization module according to a second embodiment of the present invention, and FIG. 10 is a conceptual diagram of a sterilization module according to a third embodiment of the present invention.

Referring to FIG. 9, a first light emitting device package 3 is disposed at one end 2-1 of the circulation passage 2, and a second light emitting device package 1 is disposed at the other end 2-2. Can be. The first light emitting device package 3 may inject infrared light into the circulation passage 2, and the second light emitting device package 1 may inject ultraviolet light into the circulation passage 2.

According to an embodiment, if the first light emitting device package 3 that emits infrared light first irradiates light near the inlet 2a, it can effectively decompose proteins and increase the sterilization effect.

The structure of the first light emitting device package 3 and the second light emitting device package 1 may be the same. That is, only the structure of the chip is different, and the configuration of the sidewall member 200 may be the same. The first light emitting device package 3 that emits infrared light may also include a sidewall member 200 surrounding the infrared light emitting device.

Referring to FIG. 10, both the first light emitting device package 3 and the second light emitting device package 1 may be disposed at one end 2-1 of the circulation passage 2. That is, the sterilization effect may be improved by irradiating infrared light and ultraviolet light near the inlet 2a through which the fluid flows.

The light-emitting device and the light-emitting device package described above may be used as light sources for various lighting in addition to the sterilization module described above. For example, it may be used as a light source of an image display device or a light source such as a lighting device.

The embodiments have been described above, but these are only examples and do not limit the present invention, and those of ordinary skill in the field to which the present invention belongs are not exemplified above without departing from the essential characteristics of the present embodiment. It will be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

Claims (12)

Board;
A sidewall member disposed on the substrate and having a through hole;
A light emitting device disposed in the through hole; And
Including an adhesive layer for fixing the side wall member to the substrate,
The light emitting device generates light in an ultraviolet wavelength band,
A light emitting device package having a ratio of a distance from an upper surface of the substrate to an upper surface of the light emitting device and a distance from an upper surface of the substrate to an upper surface of the sidewall member is 1:2.5 to 1:20.
The method of claim 1,
The side wall member includes a support portion and a reflective portion disposed on the support portion,
The light emitting device package including the reflective part aluminum.
The method of claim 1,
The substrate is a light emitting device package including an insertion groove in which the side wall member is disposed.
The method of claim 1,
The sidewall member includes a curvature formed on a surface facing the light emitting device.
The method of claim 1,
The substrate is a light emitting device package that is a printed circuit board.
The method of claim 1,
A light emitting device package having a directivity angle of greater than 86 degrees and less than 130 degrees of light emitted from the side wall member.
A circulation flow path including one end in which the inlet is disposed and the other end in which the discharge port is disposed;
A light-transmitting member disposed on at least one of one end and the other end of the circulation passage; And
It is disposed at the one end or the other end and includes a light emitting device package for irradiating ultraviolet light to the circulation passage,
The light emitting device package,
Board;
A sidewall member disposed on the substrate and having a through hole;
A light emitting device disposed in the through hole; And
Including an adhesive layer for fixing the side wall member to the substrate,
The light emitting device generates light in an ultraviolet wavelength band,
A sterilization module in which a ratio of a distance from an upper surface of the substrate to an upper surface of the light emitting device and a distance from an upper surface of the substrate to an upper surface of the sidewall member is 1:2.5 to 1:20.
The method of claim 7,
A sterilization module wherein a virtual line connecting an upper surface end of the light emitting device and an upper surface end of the light-transmitting member crosses the upper surface of the sidewall member.
The method of claim 7,
The side wall member includes a support portion and a reflective portion disposed on the support portion,
The sterilization module including the reflective portion aluminum.
The method of claim 7,
A sterilization module having a directivity angle of greater than 86 degrees and less than 130 degrees of light emitted from the side wall member.
The method of claim 7,
The light emitting device package includes a first light emitting device package disposed at one end of the circulation passage and a second light emitting device package disposed at the other end of the circulation passage.
The method of claim 11,
The first light emitting device package injects light of an infrared wavelength band into the circulation passage,
The second light emitting device package is a sterilization module for injecting light of an ultraviolet wavelength band into the circulation passage.

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