KR20200145877A - 표시 장치, 칩온 필름의 제조 장치, 및 칩온 필름의 제조 방법 - Google Patents
표시 장치, 칩온 필름의 제조 장치, 및 칩온 필름의 제조 방법 Download PDFInfo
- Publication number
- KR20200145877A KR20200145877A KR1020190072584A KR20190072584A KR20200145877A KR 20200145877 A KR20200145877 A KR 20200145877A KR 1020190072584 A KR1020190072584 A KR 1020190072584A KR 20190072584 A KR20190072584 A KR 20190072584A KR 20200145877 A KR20200145877 A KR 20200145877A
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- South Korea
- Prior art keywords
- pad
- film
- base film
- disposed
- driving chip
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 230000001154 acute effect Effects 0.000 claims abstract description 5
- 238000004080 punching Methods 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 139
- 239000010410 layer Substances 0.000 description 47
- 101150037468 CPD1 gene Proteins 0.000 description 46
- 101100108853 Mus musculus Anp32e gene Proteins 0.000 description 46
- 101100221809 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) cpd-7 gene Proteins 0.000 description 46
- 101100165815 Oryza sativa subsp. japonica CYP90A3 gene Proteins 0.000 description 46
- 101100490727 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) AIF1 gene Proteins 0.000 description 46
- 101150025236 dmaW gene Proteins 0.000 description 46
- 102100035233 Furin Human genes 0.000 description 15
- 101001022148 Homo sapiens Furin Proteins 0.000 description 15
- 101000701936 Homo sapiens Signal peptidase complex subunit 1 Proteins 0.000 description 15
- 238000010586 diagram Methods 0.000 description 15
- 101000820585 Homo sapiens SUN domain-containing ossification factor Proteins 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 12
- 101000673946 Homo sapiens Synaptotagmin-like protein 1 Proteins 0.000 description 11
- 102100040541 Synaptotagmin-like protein 1 Human genes 0.000 description 11
- 101000601394 Homo sapiens Neuroendocrine convertase 2 Proteins 0.000 description 10
- 102100037732 Neuroendocrine convertase 2 Human genes 0.000 description 10
- 101000658112 Homo sapiens Synaptotagmin-like protein 3 Proteins 0.000 description 8
- 102100035001 Synaptotagmin-like protein 3 Human genes 0.000 description 8
- 101000658110 Homo sapiens Synaptotagmin-like protein 2 Proteins 0.000 description 7
- 101150089655 Ins2 gene Proteins 0.000 description 7
- 102100035007 Synaptotagmin-like protein 2 Human genes 0.000 description 7
- 101100072652 Xenopus laevis ins-b gene Proteins 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 101100312652 Mus musculus Sytl4 gene Proteins 0.000 description 6
- 101100179596 Caenorhabditis elegans ins-3 gene Proteins 0.000 description 5
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- 239000011368 organic material Substances 0.000 description 3
- 239000002096 quantum dot Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 101100113507 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) cnh-1 gene Proteins 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- UCGJZJXOPSNTGZ-UHFFFAOYSA-M Prifinium bromide Chemical compound [Br-].CC1[N+](CC)(CC)CCC1=C(C=1C=CC=CC=1)C1=CC=CC=C1 UCGJZJXOPSNTGZ-UHFFFAOYSA-M 0.000 description 1
- 102100021651 SUN domain-containing ossification factor Human genes 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H01L27/32—
-
- H01L51/56—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09154—Bevelled, chamferred or tapered edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190072584A KR20200145877A (ko) | 2019-06-19 | 2019-06-19 | 표시 장치, 칩온 필름의 제조 장치, 및 칩온 필름의 제조 방법 |
| US17/602,069 US20220199751A1 (en) | 2019-06-19 | 2020-03-05 | Display device, manufacturing apparatus of chip on film, and manufacturing method of chip on film |
| CN202080043555.8A CN113994476A (zh) | 2019-06-19 | 2020-03-05 | 显示装置、覆晶薄膜的制造设备和覆晶薄膜的制造方法 |
| EP20827360.7A EP3989289A4 (de) | 2019-06-19 | 2020-03-05 | Anzeigevorrichtung, herstellungsvorrichtung für chip-on-film und herstellungsverfahren für chip-on-film |
| PCT/KR2020/095013 WO2020256533A1 (ko) | 2019-06-19 | 2020-03-05 | 표시 장치, 칩온 필름의 제조 장치, 및 칩온 필름의 제조 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190072584A KR20200145877A (ko) | 2019-06-19 | 2019-06-19 | 표시 장치, 칩온 필름의 제조 장치, 및 칩온 필름의 제조 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20200145877A true KR20200145877A (ko) | 2020-12-31 |
Family
ID=74040346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190072584A KR20200145877A (ko) | 2019-06-19 | 2019-06-19 | 표시 장치, 칩온 필름의 제조 장치, 및 칩온 필름의 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20220199751A1 (de) |
| EP (1) | EP3989289A4 (de) |
| KR (1) | KR20200145877A (de) |
| CN (1) | CN113994476A (de) |
| WO (1) | WO2020256533A1 (de) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100943731B1 (ko) * | 2003-06-28 | 2010-02-23 | 엘지디스플레이 주식회사 | 씨오지 방식 디스플레이 장치 |
| KR100512992B1 (ko) * | 2003-07-09 | 2005-09-05 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널의 접속 구조 및 방법 |
| KR100718963B1 (ko) * | 2005-02-17 | 2007-05-16 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널의 씨오에프/티씨피 패키지 |
| JP2007214385A (ja) * | 2006-02-09 | 2007-08-23 | Toshiba Matsushita Display Technology Co Ltd | テープ打ち抜き装置 |
| KR20130036592A (ko) * | 2011-10-04 | 2013-04-12 | 삼성디스플레이 주식회사 | 인쇄 회로 필름 모재 제조 방법 및 상기 인쇄 회로 필름을 타발하는 장치 |
| JP2014102440A (ja) * | 2012-11-21 | 2014-06-05 | Dainippon Printing Co Ltd | 光学フィルム、光学フィルム用転写体、画像表示装置 |
| KR102539031B1 (ko) * | 2016-04-28 | 2023-06-02 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR102654925B1 (ko) * | 2016-06-21 | 2024-04-05 | 삼성디스플레이 주식회사 | 디스플레이 장치 및 이의 제조 방법 |
| KR102569967B1 (ko) * | 2016-08-30 | 2023-08-23 | 삼성디스플레이 주식회사 | 인쇄회로기판 및 이를 포함하는 표시 장치 |
| KR102631839B1 (ko) * | 2016-09-07 | 2024-01-31 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR102583781B1 (ko) * | 2016-11-30 | 2023-10-05 | 엘지디스플레이 주식회사 | 칩온필름 및 이를 포함하는 표시장치 |
| DE102017129541B4 (de) * | 2016-12-23 | 2023-07-06 | Lg Display Co., Ltd. | Elektronische Vorrichtung und Anzeigevorrichtung damit |
| KR102451017B1 (ko) * | 2017-08-16 | 2022-10-04 | 엘지디스플레이 주식회사 | 플렉서블 표시 장치 |
| KR102481818B1 (ko) * | 2017-08-22 | 2022-12-28 | 삼성디스플레이 주식회사 | 전자 부품 및 이를 포함하는 전자 장치 |
| US11023011B2 (en) * | 2018-09-28 | 2021-06-01 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device for attaching to a flexible display and a method of manufacturing the same |
-
2019
- 2019-06-19 KR KR1020190072584A patent/KR20200145877A/ko active Search and Examination
-
2020
- 2020-03-05 CN CN202080043555.8A patent/CN113994476A/zh active Pending
- 2020-03-05 WO PCT/KR2020/095013 patent/WO2020256533A1/ko unknown
- 2020-03-05 EP EP20827360.7A patent/EP3989289A4/de active Pending
- 2020-03-05 US US17/602,069 patent/US20220199751A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20220199751A1 (en) | 2022-06-23 |
| CN113994476A (zh) | 2022-01-28 |
| EP3989289A1 (de) | 2022-04-27 |
| WO2020256533A1 (ko) | 2020-12-24 |
| EP3989289A4 (de) | 2023-07-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination |