KR20200140715A - 패턴 측정 장치, 패턴 측정 장치에 있어서의 기울기 산출 방법, 및 패턴 측정 방법 - Google Patents

패턴 측정 장치, 패턴 측정 장치에 있어서의 기울기 산출 방법, 및 패턴 측정 방법 Download PDF

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KR20200140715A
KR20200140715A KR1020200064370A KR20200064370A KR20200140715A KR 20200140715 A KR20200140715 A KR 20200140715A KR 1020200064370 A KR1020200064370 A KR 1020200064370A KR 20200064370 A KR20200064370 A KR 20200064370A KR 20200140715 A KR20200140715 A KR 20200140715A
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South Korea
Prior art keywords
unit
pattern
measurement
substrate
correction
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KR1020200064370A
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English (en)
Korean (ko)
Inventor
마코토 후지와라
고우타로우 오노우에
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20200140715A publication Critical patent/KR20200140715A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/254—Projection of a pattern, viewing through a pattern, e.g. moiré
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8874—Taking dimensions of defect into account
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G01N2021/8893—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques providing a video image and a processed signal for helping visual decision

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Manufacturing & Machinery (AREA)
  • Signal Processing (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Geometry (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020200064370A 2019-06-06 2020-05-28 패턴 측정 장치, 패턴 측정 장치에 있어서의 기울기 산출 방법, 및 패턴 측정 방법 KR20200140715A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019105878A JP7241611B2 (ja) 2019-06-06 2019-06-06 パターン測定装置、パターン測定装置における傾き算出方法およびパターン測定方法
JPJP-P-2019-105878 2019-06-06

Publications (1)

Publication Number Publication Date
KR20200140715A true KR20200140715A (ko) 2020-12-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200064370A KR20200140715A (ko) 2019-06-06 2020-05-28 패턴 측정 장치, 패턴 측정 장치에 있어서의 기울기 산출 방법, 및 패턴 측정 방법

Country Status (4)

Country Link
JP (1) JP7241611B2 (ja)
KR (1) KR20200140715A (ja)
CN (1) CN112129218A (ja)
TW (1) TW202113346A (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015072257A (ja) 2013-09-09 2015-04-16 東京エレクトロン株式会社 測定装置、基板処理システムおよび測定方法

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JP2859946B2 (ja) * 1990-10-12 1999-02-24 株式会社豊田中央研究所 非接触型測定装置
JP3261197B2 (ja) * 1993-03-03 2002-02-25 日立電子エンジニアリング株式会社 位置ずれ量測定光学系の光軸調整方法
JPH10115514A (ja) * 1996-07-31 1998-05-06 Takiron Co Ltd 表面平滑性の検査方法及びその装置
JPH10103924A (ja) * 1996-09-27 1998-04-24 Olympus Optical Co Ltd 微少寸法測定装置
JP3211810B2 (ja) * 1999-04-26 2001-09-25 株式会社ニコン 露光装置、露光方法、及び集積回路の製造方法
JP4266724B2 (ja) * 2003-06-20 2009-05-20 Ｎｅｃディスプレイソリューションズ株式会社 傾斜角度測定装置を有するプロジェクタ
JP2008128651A (ja) * 2006-11-16 2008-06-05 Olympus Corp パターン位置合わせ方法、パターン検査装置及びパターン検査システム
JP2008216076A (ja) * 2007-03-05 2008-09-18 Nikon Corp 形状測定方法
JP5370398B2 (ja) * 2011-03-15 2013-12-18 オムロン株式会社 画像処理装置および画像処理プログラム
JP5132832B1 (ja) * 2011-07-11 2013-01-30 キヤノン株式会社 計測装置および情報処理装置
JP2013164422A (ja) * 2013-02-26 2013-08-22 Hitachi High-Technologies Corp 検査装置および検査方法
EP3000761B1 (en) * 2013-05-21 2019-03-27 Tadano, Ltd. Crane with camera orientation detecting device
JP5780659B2 (ja) * 2013-06-13 2015-09-16 ヤマハ発動機株式会社 ３次元形状測定装置
US9810641B2 (en) * 2013-09-03 2017-11-07 Kulicke & Soffa Industries, Inc. Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
DE202015004613U1 (de) * 2015-06-30 2016-08-04 Helmut Knorr Vorrichtung zur optischen Dicken- oder Neigungsmessung an einer Materialbahn
KR101750521B1 (ko) * 2015-07-27 2017-07-03 주식회사 고영테크놀러지 기판 검사 장치 및 방법
KR102079181B1 (ko) * 2016-03-04 2020-02-19 주식회사 고영테크놀러지 패턴광 조사 장치 및 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015072257A (ja) 2013-09-09 2015-04-16 東京エレクトロン株式会社 測定装置、基板処理システムおよび測定方法

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Publication number Publication date
TW202113346A (zh) 2021-04-01
JP7241611B2 (ja) 2023-03-17
JP2020201045A (ja) 2020-12-17
CN112129218A (zh) 2020-12-25

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