KR20200138088A - Electrically insulated and heat radiated busbar - Google Patents

Abstract

An insulated heat dissipation busbar is provided. According to an embodiment of the present invention, an insulating heat dissipating busbar is implemented by comprising a busbar and an insulating heat dissipating plastic fixed to surround part or all of the busbar. Accordingly, the insulating heat dissipation busbar is excellent not only in thermal conductivity but also in heat radiation, so that excellent heat dissipation performance can be expressed. In addition, since it has heat dissipation property and insulation property, it may be provided in direct contact with various electric and electronic components or devices requiring heat dissipation. Furthermore, since the delamination does not occur even in the bonding between different materials, the durability is excellent, and thus, it can be widely applied to the entire industry in which insulation and heat dissipation properties are simultaneously required.

Description

Electrically insulated and heat radiated busbar}

The present invention relates to an insulating heat dissipation busbar.

In general, a bus bar provided in an electronic device is widely used in related technical fields as it can accommodate a large amount of current compared to a wire type wire.

However, in the case of general busbars, insulation and heat dissipation were not good. In particular, busbars applied to batteries require insulation to prevent malfunction with other parts, and malfunction due to heat generated from each part of the battery. In order to prevent heat dissipation, as heat dissipation is required so that heat can be quickly released to the outside, development is underway so that the busbar can achieve the above-described effects.

Thus, conventionally, the expression of this effect has been sought through an insulating tube or an insulating coating, but in the case of a conventional insulating tube or an insulating coating, the insulating property can be expressed, but there is a problem that the heat dissipation property is significantly lowered due to insulation.

In addition, a method of forming a predetermined coating layer to express insulation and heat dissipation is being developed, but it is never possible to implement a thickness of a certain level or more by forming a coating layer. It was not possible to express heat dissipation, and it was difficult to design it so as to exhibit even excellent durability.

Accordingly, there is an urgent need for a study on a bus bar that has excellent interlayer adhesive strength and can simultaneously exhibit both excellent insulation and heat dissipation effects.

KR 10-1146447 B1 (Registration date: 2012.05.08)

The present invention has been conceived to solve the above-described problems, and has an object to provide an insulating heat dissipation busbar that exhibits excellent heat dissipation performance by having excellent thermal conductivity as well as heat radiation.

In addition, an object of the present invention is to provide an insulating heat dissipation busbar that can be provided in direct contact with various electric and electronic components or devices requiring heat dissipation as it has heat radiation and insulation.

In addition, it is an object of the present invention to provide an insulating heat dissipating bus bar having excellent durability by not causing delamination even in bonding between different materials.

In order to solve the above-described problems, the present invention provides an insulating heat dissipating bus bar including a bus bar and an insulating heat dissipating plastic fixed to surround part or all of the bus bar.

According to an embodiment of the present invention, the insulating heat dissipating plastic may have an average thickness of 500 μm or more.

In addition, the insulating heat-dissipating plastic may be integrally formed by insert-injection, or may be formed by fastening assembly pieces implemented in a plurality to correspond to the fixing surface of the bus bar.

In addition, the insulating heat dissipating plastic may be formed of an insulating heat dissipating plastic forming composition including a main resin and a heat dissipating filler.

In addition, the main resin is polyamide, polyester, polyketone, liquid crystal polymer, polyolefin, polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polyphenylene oxide (PPO), polyethersulfone (PES). , Polyetherimide (PEI) and polyimide may include one compound selected from the group consisting of, or a mixture or copolymer of two or more.

In addition, the heat dissipation filler is selected from the group consisting of silicon carbide, magnesium oxide, titanium dioxide, silicon dioxide, aluminum nitride, silicon nitride, boron nitride, aluminum oxide, silica, zinc oxide, barium titanate, strontium titanate, beryllium oxide, and manganese oxide. It may contain one or more.

In addition, the heat dissipation filler may be included in an amount of 30 to 300 parts by weight based on 100 parts by weight of the main resin.

In addition, the radiating filler may have an average particle diameter of 2 to 40 μm.

In addition, the busbar may have micro-reliefs formed in a part or all of the area where the insulating heat-radiating plastic is fixed.

In addition, it may further include a primer layer formed on the microrelief.

In addition, the primer layer may be formed including a first epoxy resin.

In addition, it may further include a thermally conductive adhesive provided on a part or all of the area between the surface of the bus bar and the insulating heat-radiating plastic.

In addition, the thermally conductive adhesive may be formed to include a second epoxy clock resin and a thermally conductive filler.

As the insulating heat dissipating busbar of the present invention includes an insulating heat dissipating plastic, it is excellent not only in thermal conductivity but also in heat radiation, and thus excellent heat dissipation performance can be expressed. In addition, due to the heat dissipation filler provided in the insulating heat dissipation plastic, it may be provided in direct contact with various electric and electronic components or devices requiring heat dissipation as it has heat dissipation and insulation. Further, as the primer layer and/or the thermally conductive adhesive portion are included, interlayer peeling does not occur even when bonding between dissimilar materials, and thus durability is excellent, and thus, it can be widely applied to the entire industry where insulation and heat dissipation properties are simultaneously required.

1 is a perspective view of an insulating heat dissipation bus bar according to an embodiment of the present invention,
2 is a perspective view of an insulating heat dissipation busbar according to another embodiment of the present invention,
3 is a schematic partial cross-sectional view of an insulating heat dissipation busbar according to an embodiment of the present invention, and,
4 is a partial cross-sectional schematic view of an insulating heat dissipation busbar according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily implement the present invention. The present invention may be implemented in various different forms, and is not limited to the embodiments described herein. In the drawings, parts not related to the description are omitted in order to clearly describe the present invention, and the same reference numerals are added to the same or similar components throughout the specification.

1 and 2, insulating heat dissipation bus bars 1000 and 1000 ′ according to an embodiment of the present invention surround part or all of the bus bars 100 and 100 ′ and the bus bars 100 and 100 ′. It is implemented by including insulating heat dissipating plastics 200 and 200 ′ that are fixed to and provided.

First, the bus bars 100 and 100' will be described.

The bus bars 100 and 100 ′ may be used without limitation as long as the configuration of a bus bar commonly used in the art is used. For example, the bus bar is formed of a predetermined metal member alone or a plurality of metal members are stacked. It can also be formed. In addition, the bus bars 100 and 100 ′ may be used without limitation as long as they are a material of a bus bar commonly used in the art. For example, the bus bar may be made of copper or aluminum, and in this case, a smooth amount of electricity is secured. There is an advantage to be able to do.

In addition, the bus bars 100 and 100 ′ may further include a metal layer formed by plating a surface, and the metal layer may be plated with a predetermined metal alone, or a plurality of metals such as double plating and triple plating are sequentially applied. It can also be plated. For example, the metal layer may be formed of at least one selected from the group consisting of copper, nickel, tin, and two or more alloys.

Meanwhile, the shape of the bus bar shown in FIGS. 1 and 2 is only exemplary, and the material, size, thickness and shape of the bus bar can be changed according to the internal design considering the desired input voltage and/or output voltage. Accordingly, the present invention is not particularly limited thereto.

Next, an insulating heat dissipating plastic 200 and 200 ′ that is fixed and provided to surround part or all of the bus bars 100 and 100 ′ will be described.

The insulating heat dissipation plastics 200 and 200 ′ may be integrally formed by insert injection, or may be formed by fastening assembly pieces 200 a, 200 b and 200 c implemented in a plurality to correspond to the fixing surfaces of the bus bars 100 and 100 ′. .

Specifically, as shown in FIG. 1, the insulating heat dissipating plastic 200 of the insulating heat dissipating bus bar 1000 according to an embodiment of the present invention includes the bus bar 100 disposed in an insulating heat dissipating plastic forming composition to be described later. , By insert injection to surround part or all of the bus bar 100, the bus bar 100 and the insulating heat dissipating plastic 200 may be integrally formed as shown in FIG. 1.

In addition, as shown in Figure 2, the insulating heat dissipation plastic 200 of the insulating heat dissipation busbar 1000' according to an embodiment of the present invention corresponds to the fixed surface of the busbar 100', which will be described later. The assembly pieces 200a, 200b, 200c, which are separately injected from the plastic forming composition, are fastened and fixed to surround some or all of them, and thus may be implemented as an insulating heat dissipating busbar 1000' as shown in FIG. 2. At this time, the assembly pieces (200a, 200b, 200c) may be formed by separately injecting the insulating heat-dissipating plastic forming composition described later as described above, or the assembly pieces (200a, 200b) and the bus bar (100') The fastening assembly piece 200c performing the function of fixing may be implemented with a different material, and at this time, the assembly piece 200c can be used without limitation as long as it is a material of a fastening assembly piece commonly used in the art. Accordingly, in the present invention, this is not particularly limited.

Meanwhile, the insulating heat dissipating plastics 200 and 200 ′ may have an average thickness of 500 μm or more, and preferably, an average thickness of 550 μm or more. If the average thickness of the insulating heat-dissipating plastic is less than 500 μm, insulation and heat-radiation properties may not be improved to a desired level, or durability may be deteriorated.

In addition, the insulating heat dissipating plastics 200 and 200 ′ may be formed of an insulating heat dissipating plastic forming composition including a main resin and a heat dissipating filler.

The main resin has good compatibility with the busbar and the heat dissipation filler described later, and does not affect the dispersion of the heat dissipation filler, and is not limited if it is implemented as a polymer compound capable of injection molding. As a preferred example for this, the main resin may be a known thermoplastic polymer compound. The main resin as the thermoplastic polymer compound is preferably polyamide, polyester, polyketone, liquid crystal polymer, polyolefin, polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polyphenylene oxide (PPO), poly Ethersulfone (PES), polyetherimide (PEI), and one compound selected from the group consisting of polyimide, or a mixture or copolymer of two or more may be included, more preferably polyamide.

For example, the polyamide may be a known polyamide-based compound such as nylon 6, nylon 66, nylon 11, nylon 610, nylon 12, nylon 46, nylon 9T (PA-9T), kina and aramid.

In addition, as an example, the polyester may be a known polyester-based compound such as polyethylene terephthalate (PET), polytrimethylene terephthalate (PTT), polybutylene terephthalate (PBT), and polycarbonate.

In addition, as an example, the polyolefin may be a known polyolefin-based compound such as polyethylene, polypropylene, polystyrene, polyisobutylene, and ethylene vinyl alcohol.

In addition, the liquid crystal polymer may be used without limitation in the case of a polymer exhibiting liquid crystallinity in a solution or dissolved state, and may be a known type, so the present invention is not particularly limited thereto.

Meanwhile, the heat dissipating filler may be used without limitation in the case of a known heat dissipating filler having thermal conductivity, and preferably silicon carbide, magnesium oxide, titanium dioxide, silicon dioxide, aluminum nitride, silicon nitride, boron nitride, aluminum oxide, silica, It may contain at least one selected from the group consisting of zinc oxide, barium titanate, strontium titanate, beryllium oxide, and manganese oxide.

In addition, 1 selected from the group consisting of at least one metal selected from the group consisting of aluminum, silver, copper, nickel, gold and iron, and at least one carbon selected from the group consisting of graphite, graphene, carbon nanotubes, fullerene and carbon black A non-insulating heat-radiating filler including more than one species may be included, but in this case, the surface of the non-insulating heat-radiating filler may be insulated for use in order to develop insulation. The insulation treatment is one selected from the group consisting of silicon carbide, magnesium oxide, titanium dioxide, silicon dioxide, aluminum nitride, silicon nitride, boron nitride, aluminum oxide, silica, zinc oxide, barium titanate, strontium titanate, beryllium oxide, and manganese oxide. The ceramic including the above may be coated on the surface, and preferably, insulating treatment may be performed by coating silicon dioxide on the surface.

In addition, the radiating filler may have an average particle diameter of 1 to 200 μm. However, according to an embodiment of the present invention, the heat dissipating filler may have an average particle diameter of 50 μm or less, more preferably 40 μm or less, more preferably 2 to 40 μm, and more preferably 3 to 35 μm. If the average particle diameter of the heat dissipating filler exceeds 40 μm, the durability of the insulating heat dissipating plastic may be deteriorated, and the surface quality may be deteriorated. However, the heat dissipation filler may have an average particle diameter of 2 µm or more, and there is an advantage of further improving dispersibility and heat dissipation in insulating heat dissipating plastics. Meanwhile, in the present invention, the particle diameter of the heat dissipating filler is a diameter when the shape is a spherical shape, and when the shape is a polyhedron or an irregular shape, it means the longest distance among linear distances between two different points on the surface.

In addition, the heat dissipation filler is provided in a form dispersed within the insulating heat dissipation plastic, and the interface formed between the base resin and the heat dissipation filler implementing the insulating heat dissipation plastic decreases the thermal conductivity at the interface due to low compatibility due to the dissimilar material. Thus, the heat dissipation performance can be relatively low. In addition, there may be a lifting phenomenon at the interface, in which case the heat dissipation performance may be further deteriorated, and there is a concern that durability may be deteriorated, such as cracks occurring in the corresponding portion. Accordingly, the heat dissipation filler may be surface-treated or surface-modified in order to improve interfacial properties with the main resin implementing the insulating heat-dissipating plastic.

The surface treatment may be to remove heterogeneous inorganic substances or impurities buried on the surface of the heat dissipating filler, and through such surface treatment, the heat conduction characteristics of the heat dissipating filler itself are fully exhibited, and It can be advantageous in improving the interfacial properties.

In addition, the surface modification may be used without limitation in the case of a known modification capable of increasing the compatibility between the heat dissipating filler and the main resin implementing the insulating heat dissipating plastic. As an example, the surface modification may be a modification to provide at least one functional group selected from the group consisting of an alkyl group, an alkane group, an amine group, and an aniline group on the surface of the heat dissipating filler, and as an example, the functional group is in the group consisting of an amine group and an aniline group. It may be one or more selected.

The surface treatment or surface modification may be performed by employing a known method, and as an example, it may be performed through acid treatment. The acid treatment can be performed by treating an acidic solution such as nitric acid, sulfuric acid, aluminum, and titanium on a heat dissipating filler, and preferably, sulfuric acid or nitric acid is good for expressing improved thermal conductivity characteristics. Through the acid treatment, inorganic substances or contaminants on the surface of the heat dissipating filler may be removed, as well as hydroxyl functional groups may be provided on the surface.

As an example, explaining the method of performing the acid treatment, after adding the heat dissipating filler to an acidic solution having a concentration of 60 to 70%, stirring at 20 to 40°C for 1 to 10 hours, and then adding a heat dissipating filler to water. It can be neutralized and then washed with distilled water. At this time, in the step of stirring after being added to the acidic solution, ultrasonic waves may be additionally added during or after stirring.

On the other hand, the heat dissipation filler may be included in an amount of 30 to 300 parts by weight, preferably 35 to 280 parts by weight, based on 100 parts by weight of the main resin. If the heat dissipation filler is less than 30 parts by weight based on 100 parts by weight of the main resin, the desired level of insulation and heat dissipation may not be achieved, and if it exceeds 300 parts by weight, the durability of the insulating heat dissipating plastic implemented decreases and the adhesion is weakened Peeling easily occurs, and due to the increase in hardness, it may be easily broken or broken by physical impact.

Meanwhile, FIG. 3 is a partial cross-sectional schematic diagram showing a cross section of an upper portion of an insulating heat-dissipating bus bar 1001 according to an embodiment of the present invention. A bus bar provided in the insulating heat-dissipating bus bar 1001 according to an embodiment of the present invention In 101, a fine convex convex (A) may be formed in a part or all of the region in which the insulating heat dissipating plastic 201 is fixed.

At this time, the fine concave convex (A) may be used without limitation as long as it is a method of forming fine concave convex that is commonly used in the art, and may be preferably formed through a chemical method or a physical method, for example, the chemical method It may be chemical etching by a predetermined chemical, and the physical method may be physical dry etching through particles accelerated at a high speed, but is not limited thereto.

In addition, a primer layer 301 may be further included on the fine concave convex (A) to improve the fixing power and durability by preventing the above-described lifting phenomenon between the bus bar 101 and the insulating heat dissipating plastic 201, and preventing peeling between different materials. I can.

The primer layer 301 may be formed to include a first epoxy-based resin, and the first epoxy-based resin may be a known epoxy-based resin commonly used in the art, according to the present invention. This is not particularly limited.

In this case, the primer layer 301 may have a thickness of 0.1 to 5 μm, preferably 0.2 to 4.5 μm, but is not limited thereto.

Meanwhile, FIG. 4 is a partial cross-sectional schematic diagram showing a cross section of an upper portion of an insulating heat dissipation bus bar 1002 according to another embodiment of the present invention, and the insulating heat radiation bus bar 1002 according to another embodiment of the present invention is a bus bar It may further include a thermally conductive adhesive portion 302 provided on a part or all of the region between the surface of 102 and the insulating heat dissipating plastic 202.

The thermally conductive adhesive part 302 may be formed including a second epoxy clock resin and a thermally conductive filler. The second epoxy clock resin is not particularly limited in the present invention, as it may be a known epoxy-based resin commonly used in the art. In addition, the second epoxy clock resin may be the same as or different from the first epoxy clock resin, but is not limited thereto. In addition, since the thermally conductive filler may be the same as or different from the heat dissipating filler described above, and preferably the same material as the heat dissipating filler may be used, a detailed description of the thermally conductive filler will be omitted.

Meanwhile, the thermally conductive adhesive portion 302 may have a thickness of 1 to 20 μm, preferably 2 to 18 μm, but is not limited thereto.

On the other hand, the insulating heat dissipation busbar of the present invention is excellent not only in thermal conductivity but also in heat radiation, so that excellent heat dissipation performance can be expressed. In addition, since it has heat dissipation property and insulation property, it may be provided in direct contact with various electric and electronic components or devices requiring heat dissipation. Furthermore, since the delamination does not occur even in the bonding between different materials, the durability is excellent, and thus, it can be widely applied in the entire industry where insulation and heat dissipation properties are simultaneously required.

The present invention will be described in more detail through the following examples, but the following examples do not limit the scope of the present invention, which should be interpreted to aid understanding of the present invention.

[Example]

<Example 1: Preparation of insulating heat dissipation busbar>

(1) Preparation of insulating heat-radiating plastic-forming composition

An insulating heat-radiating plastic-forming composition was prepared by mixing 150 parts by weight of silicon carbide having an average particle diameter of 21 μm as a heat-radiating filler with respect to 100 parts by weight of a nylon (PA6) resin as the main resin.

(2) Manufacture of insulating heat dissipation busbar

After forming a 2.5 μm-thick primer layer formed of glycidyl amine epoxy resin, which is a first epoxy clock resin, on an aluminum-based bus bar (Al6061-T7) having fine convexities on the surface, the prepared insulating heat-radiating plastic-forming composition The busbar was disposed and, as shown in FIG. 1, by insert-injecting to surround the busbar, an insulating heat dissipating busbar including an insulating heat dissipating plastic fixed to surround the busbar was manufactured. At this time, the insulating heat-radiating plastic had an average thickness of 1,500 μm.

<Example 2>

In the same manner as in Example 1, a primer layer having a thickness of 2.5 μm formed of glycidyl amine epoxy resin, which is a first epoxy clock resin, was formed on an aluminum-based bus bar (Al6061-T7) with fine convexities formed on the surface, As shown in FIG. 2, an assembly piece was formed from the prepared insulating heat-dissipating plastic forming composition, and an insulating heat-dissipating bus bar including an insulating heat-radiating plastic fixed to surround the bus bar was manufactured. At this time, the insulating heat dissipating plastic had an average thickness of 1,500 µm in the outer direction based on the bus bar.

<Example 3>

Conducted in the same manner as in Example 1, but silicon carbide having an average particle diameter of 4 μm per 100 parts by weight of rubber-modified epoxy resin, which is a second epoxy clock resin, on an aluminum-based bus bar (Al6061-T7) in which fine convex irons are not formed on the surface. By forming a thermally conductive adhesive portion having a thickness of 10 μm including 50 parts by weight, an insulating heat dissipation busbar was manufactured.

<Examples 4 to 15 and Comparative Example 1>

Conducted in the same manner as in Examples 1 or 3, but the average thickness of the insulating heat-dissipating plastic, the content of the heat-dissipating filler, the average particle diameter, whether it is included, whether the fine concave iron and the primer layer are included, whether the thermally conductive adhesive part is included and whether the insulating heat-radiating plastic is included, etc. By changing the bus bar as shown in Tables 1 to 3 was manufactured.

<Experimental Example>

For the bus bars according to the Examples and Comparative Examples, the following physical properties were evaluated and shown in Tables 1 to 3.

1. Evaluation of heat dissipation characteristics

For the busbars according to the Examples and Comparative Examples, busbar Joule heating was performed under conditions of a temperature of 60°C and a current of 335A, and at this time, the maximum temperature on the busbar was measured through thermal imaging to heat dissipation characteristics. Was evaluated.

2. Durability evaluation

For bus bars according to Examples and Comparative Examples, impact strength was measured by applying an impact under conditions of a weight of 45 kg, a height of 0.2 m and a speed of 2 m/s using an impact tester (CEAST9350, INSTRON, USA). Durability was evaluated. At this time, the impact strength value was recorded as the impact strength value at the point at which the peak is 25% from the start point (start point) and the point at which the end point becomes 10%. In addition, the impact strength is expressed as a relative ratio of the impact strength of the other Examples and Comparative Examples based on the impact strength of Example 1 as 100.

3. Adhesion evaluation

The busbars according to the Examples and Comparative Examples were cross-cut with a knife so as to have an interval of 1 mm. Afterwards, attach the scotch tape to the cut surface and pull it at an angle of 60° to check the state in which the insulating heat-radiating plastic is peeled off. The evaluation criteria were evaluated in accordance with ISO 2409. (5B: 0%, 4B: 5% or less, 3B: 5 to 15%, 2B: 15 to 35%, 1B: 35 to 65%, 0B: 65% or more)

4. Surface quality evaluation

For the bus bars according to Examples and Comparative Examples, to check the surface quality, the surface was touched by hand and it was checked whether there was a feeling of unevenness or roughness. When there is a smooth feeling 5, When the area of the rough feeling is 2% or less of the total area of the outer surface of the bus bar 4, When the area is more than 2% and less than 5% 3, When the area is more than 5% and less than 10% 2, the area exceeding 10% and less than 20% is represented as 1, and the area exceeding 20% is represented as 0.

division Example
One Example
2 Example
3 Example
4 Example
5 Example
6 Insulating heat-resistant plastic Average thickness (㎛) 1,500 1,500 1,500 550 450 1,500 Heat dissipation filler content (parts by weight) 150 150 150 150 150 25 Radiating filler average particle diameter (㎛) 21 21 21 21 21 21 Whether fine iron and primer layer are included ○ ○ × ○ ○ ○ Including thermal conductive adhesive × × ○ × × × Evaluation of heat dissipation properties (℃) 134.84 135.02 134.19 137.73 153.96 157.48 Durability evaluation (%) 100 100 99 97 88 99 Adhesive evaluation (B) 5 5 5 5 4 5 Surface quality evaluation 5 5 5 5 5 5

division Example
7 Example
8 Example
9 Example
10 Example
11 Example
12 Insulating heat-resistant plastic Average thickness (㎛) 1,500 1,500 1,500 1,500 1,500 1,500 Heat dissipation filler content (parts by weight) 35 280 330 150 150 150 Radiating filler average particle diameter (㎛) 21 21 21 One 3 35 Whether fine iron and primer layer are included ○ ○ ○ ○ ○ ○ Including thermal conductive adhesive × × × × × × Evaluation of heat dissipation properties (℃) 137.91 134.02 133.88 153.75 137.30 134.87 Durability evaluation (%) 99 97 68 99 99 98 Adhesive evaluation (B) 5 5 3 5 5 5 Surface quality evaluation 5 5 4 5 5 5

division Example
13 Example
14 Example
15 Comparative example
One Insulating heat-resistant plastic Average thickness (㎛) 1,500 1,500 1,500 - Heat dissipation filler content (parts by weight) 150 - 150 - Radiating filler average particle diameter (㎛) 45 - 21 - Whether fine iron and primer layer are included ○ ○ × × Including thermal conductive adhesive × × × × Evaluation of heat dissipation properties (℃) 134.88 163.66 138.57 161.55 Durability evaluation (%) 71 104 97 - Adhesive evaluation (B) 4 5 One - Surface quality evaluation 2 5 5 -

As can be seen from Tables 1 to 3, the average thickness of the insulating heat-radiating plastic according to the present invention, the content of the heat-radiating filler, the average particle diameter, whether it contains, whether it contains fine concave iron and primer layer, whether or not a thermally conductive adhesive is included and whether or not the insulating heat-radiating plastic Examples 1 to 4, 7, 8, 11, and 12 satisfying all of the inclusion, etc., compared to Examples 5, 6, 9, 10, 13 to 15 and Comparative Example 1 in which any of them are omitted, Durability, adhesion and surface quality were all excellent at the same time.

Although an embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiment presented in the present specification, and those skilled in the art who understand the spirit of the present invention can add components within the scope of the same idea It will be possible to easily propose other embodiments by changing, deleting, adding, etc., but it will be said that this is also within the scope of the present invention.

100,100',101,102: bus bar
200,200',201,202: insulating heat-resistant plastic
200a,200b,200c: assembly piece
301: primer layer
302: thermally conductive adhesive portion
1000,1000',1001,1002: insulating heat dissipation busbar

Claims (13)

Busbar; And
Insulating heat dissipation busbar comprising; insulating heat dissipation plastic fixed to surround part or all of the busbar. The method of claim 1,
The insulating heat dissipating plastic is an insulating heat dissipating bus bar having an average thickness of 500 μm or more. The method of claim 1,
The insulating heat dissipating plastic is insert-injected to form integrally, or the insulating heat dissipating bus bar formed by fastening a plurality of assembly pieces implemented to correspond to a fixed surface of the bus bar. The method of claim 1,
The insulating heat dissipating plastic is an insulating heat dissipating bus bar formed of an insulating heat dissipating plastic forming composition comprising a main resin and a heat dissipating filler. The method of claim 4,
The main resin is polyamide, polyester, polyketone, liquid crystal polymer, polyolefin, polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polyphenylene oxide (PPO), polyethersulfone (PES), poly An insulating heat dissipation busbar comprising one compound selected from the group consisting of etherimide (PEI) and polyimide, or a mixture or copolymer of two or more. The method of claim 4,
The heat dissipation filler is one selected from the group consisting of silicon carbide, magnesium oxide, titanium dioxide, silicon dioxide, aluminum nitride, silicon nitride, boron nitride, aluminum oxide, silica, zinc oxide, barium titanate, strontium titanate, beryllium oxide, and manganese oxide. Insulating heat dissipation busbar including the above. The method of claim 4,
The heat dissipation filler is an insulating heat dissipation bus bar that is included in an amount of 30 to 300 parts by weight based on 100 parts by weight of the main resin. The method of claim 4,
The heat dissipation filler is an insulating heat dissipation bus bar having an average particle diameter of 2 to 40 μm. The method of claim 1,
The busbar is an insulating heat-dissipating bus bar in which fine convex and convexities are formed in a part or all of an area where insulating heat-radiating plastic is fixed. The method of claim 9,
Insulating heat dissipation busbar further comprising a; primer layer formed on the fine concave and convex. The method of claim 10,
The primer layer is an insulating heat dissipation bus bar formed by including a first epoxy clock resin. The method of claim 1,
An insulating heat dissipating busbar further comprising a thermally conductive adhesive part provided on a part or all of a region between the surface of the busbar and the insulating heat dissipating plastic. The method of claim 12, wherein the thermally conductive adhesive portion,
An insulating heat dissipation bus bar formed including a second epoxy clock resin and a thermally conductive filler.

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