KR102611441B1 - Electrically insulated and heat radiated coating composition and electrically insulated and heat radiated commodities with the same - Google Patents

Abstract

An insulating heat dissipating coating composition is provided. An insulating heat dissipating coating composition according to an embodiment of the present invention includes a coating layer forming component including a main resin; and an insulating heat dissipating filler included in an amount of 25 to 70 parts by weight based on 100 parts by weight of the main resin. According to this, the insulating heat dissipating coating composition has excellent heat dissipation performance as well as thermal conductivity, and at the same time, it is possible to implement an insulating heat dissipating coating layer with insulating properties. In addition, the insulating heat dissipating coating layer implemented through this has excellent adhesion to the surface to be coated, which significantly prevents peeling of the insulating heat dissipating coating layer during use. After being formed as an insulating heat dissipating coating layer, external heat, organic solvents, moisture, shock, etc. The durability of the insulating heat dissipating coating layer can be maintained despite physical and chemical stimulation. In addition, the dispersibility of the heat dissipation filler dispersed within the formed insulating heat dissipation coating layer is excellent, resulting in uniform insulation and heat dissipation performance. Furthermore, since the surface of the formed insulating heat dissipation coating layer is very smooth and has excellent smoothness, the surface quality is excellent, so it can be widely applied throughout industries that require both insulation and heat dissipation.

Description

Insulating heat dissipating coating composition and insulating heat dissipating article implemented using the same {Electrically insulated and heat radiated coating composition and electrically insulated and heat radiated commodities with the same}

The present invention relates to an insulating heat dissipating coating composition, and more specifically, to an insulating heat dissipating coating composition that simultaneously exhibits heat dissipating and insulating properties, and an insulating heat dissipating article implemented through the same.

In general, in order to prevent malfunctions due to heat generated from various components included in an electronic device during use, heat dissipation members are installed on components that generate heat. Heat dissipation members such as heat sinks and heat sinks typically use metals with high thermal conductivity to allow heat within the device or component to be quickly dissipated to the outside.

For example, the heat sink is made by heating and melting aluminum, copper, and their alloy materials at a high temperature and then extruding them using a mold with a certain shape, so that a plurality of heat dissipation fins that consistently protrude from the front are arranged. This structure has been generally adopted.

Recently, there have been attempts to improve heat dissipation performance by forming a heat dissipation coating layer on the heat dissipation member.

However, fillers that improve heat dissipation performance provided in the heat dissipation coating layer may have conductivity depending on the amount of conductive components, but in this case, it is difficult to use them in applications that require heat dissipation and electrical insulation.

In addition, even if insulating and heat dissipating properties are simultaneously achieved, it is difficult to simultaneously achieve physical properties such as durability, heat dissipating performance, and adhesion to the coated surface of the implemented insulating heat dissipating coating layer, and the surface of the insulating heat dissipating coating layer is uneven or the filler protrudes from the surface. There is a problem that the surface quality of the insulating heat dissipation coating layer is very poor. Additionally, because the filler is not evenly dispersed within the insulating heat dissipating coating layer, there is a problem in that the insulation and heat dissipation performance of the insulating heat dissipating coating layer is not constant.

Accordingly, it has excellent adhesion to the surface to be coated, has excellent durability against external physical and chemical stimuli such as heat/moisture/organic solvents, has excellent surface quality of the insulating heat dissipation coating layer, and significantly improves both insulation and heat dissipation performance at the same time. There is an urgent need to research a composition for forming an insulating heat dissipating coating layer that can create an insulating heat dissipating coating layer with excellent dispersion of fillers within the insulating heat dissipating coating layer.

KR 0783263 B1

The present invention was made to solve the above-mentioned problems, and its purpose is to provide an insulating heat dissipating coating composition capable of implementing an insulating heat dissipating coating layer that exhibits excellent heat dissipation performance by exhibiting excellent heat dissipation performance as well as thermal conductivity.

Another object of the present invention is to provide an insulating heat dissipating coating composition that has heat dissipation properties and insulating properties at the same time, and thus can provide an insulating heat dissipating coating layer that is provided in direct contact with various electrical and electronic components or devices requiring heat dissipation.

In addition, the present invention has excellent adhesion to the surface to be coated, significantly preventing peeling of the insulating heat dissipating coating layer during use, and durability of the insulating heat dissipating coating layer even against physical and chemical stimuli such as external heat, organic solvents, moisture, and shock. Another purpose is to provide an insulating heat dissipating coating composition that can maintain this.

In addition, another object of the present invention is to provide an insulating heat dissipating coating composition that can realize an insulating heat dissipating coating layer with excellent surface quality due to the formed insulating heat dissipating coating layer having a very smooth surface and excellent smoothness.

Another object of the present invention is to provide an insulating heat dissipating coating composition capable of exhibiting uniform insulation and heat dissipation performance due to excellent dispersibility of heat dissipating filler dispersed in the formed insulating heat dissipating coating layer.

Furthermore, another object of the present invention is to provide an insulating heat dissipating article that exhibits excellent heat dissipation characteristics without electrical short circuit even when the insulating heat dissipating coating composition is treated on various adherends requiring insulating properties.

In order to solve the above-described problem, the present invention includes a coating layer forming component containing a main resin; and an insulating heat dissipating filler included in an amount of 25 to 70 parts by weight based on 100 parts by weight of the main resin.

According to one embodiment of the present invention, the main resin is glycidyl ether type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, linear aliphatic epoxy resin, and rubber modified epoxy resin. It may include an epoxy resin containing at least one selected from the group consisting of resins and their derivatives.

Additionally, the main resin may include a compound represented by the following formula (1).

[Formula 1]

R ¹ and R ² are each independently a hydrogen atom, a C1 to C5 linear alkyl group, or a C3 to C5 branched alkyl group, and R ³ and R ⁴ are each independently a hydrogen atom, a C1 to C5 linear alkyl group. Or it is a C3 to C5 pulverized alkyl group, and n is a rational number such that the weight average molecular weight of the compound represented by Formula 1 is 400 to 4000.

Additionally, the insulating heat dissipation filler may have a thermal conductivity of 130 to 200 W/m·K.

Additionally, the coating layer forming component may be included in an amount of 25 to 100 parts by weight based on 100 parts by weight of the main resin.

Additionally, the curing agent may include one or more selected from the group consisting of an aliphatic polyamine-based curing agent, an aromatic polyamine-based curing agent, an acid anhydride-based curing agent, and a catalyst-based curing agent.

In addition, the curing agent includes a first curing agent containing an aliphatic polyamine-based curing agent and a second curing agent containing at least one selected from the group consisting of an aromatic polyamine-based curing agent, an acid anhydride-based curing agent, and a catalyst-based curing agent at a ratio of 1:0.5 to 1.5. It can be included in weight ratio.

Additionally, the aliphatic polyamine-based curing agent may include polyethylenepolyamine.

In addition, the insulating heat dissipating coating composition may further include 0.5 to 20 parts by weight of a physical property enhancing component to improve adhesion based on 100 parts by weight of the main resin.

In addition, the physical property enhancing ingredients include 3-[N-anyl-N-(2-aminoethyl)] aminopropyltrimethoxysilane, 3-(N-anyl-N-glycidyl)aminopropyltrimethoxysilane, 3-(N-anyl-N-methacrylonyl]aminopropyltrimethoxysilane, 3-glycidyl oxypropylmethylethoxysilane, N,N-Bis[3-(trimethoxycinyl)propyl] Methacrylamide, γ-glycidoxytrimethyldimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropylmethylmethoxysilane, Beta (3, 4 -epoxy cyclohexyl)ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, heptadecafluorodecytrimethoxysilane, 3- Methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltris(trimethylsiloxy)silane, methyltris(dimethylsiloxy)silane, 3-aminopropyltriepoxy silane, 3-mercaptopropyltrimethoxy silane, and It may include one or more selected from the group consisting of N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane.

Additionally, the insulating heat dissipating coating composition may have a viscosity of 5 to 600 cps.

In addition, the insulating heat dissipating coating composition is one type selected from the group consisting of talc, zinc oxide, zinc sulfide, metal oxide-based, hydroxyl-based, sulfide-based, azo-based, nitro-based and phthalocyanine-based, based on 100 parts by weight of the main resin. A group consisting of 30 to 60 parts by weight of a colorant containing the above and titanium dioxide, aerogel silica, hydrogel silica, PP wax, PE wax, PTFE wax, urea formalde resin, and benzoguamine formalde resin. It may contain 30 to 60 parts by weight of a matting agent containing one or more types selected from.

In addition, the insulating heat dissipating coating composition contains trizinc bis (orthophosphate), triphenyl phosphate, trixylenyl phosphate, and tricresyl phosphate based on 100 parts by weight of the main resin. , Triisophenyl phosphate, Tris-Choloroethylphosphate, Tris-Chloroprophyphosphate, Resorcinol di-phosphate, Aromatic polyphosphate, It may contain 10 to 35 parts by weight of a flame retardant containing at least one selected from the group consisting of polyphosphoric acid ammonium and red phosphorous.

Additionally, the insulating heat dissipating coating composition may further include 0.5 to 20 parts by weight of a dispersant based on 100 parts by weight of the insulating heat dissipating filler.

On the other hand, the present invention includes a heat dissipation member or a support member; and an insulating heat dissipating coating layer cured by treating at least a portion of the outer surface of the heat generating member or support member with the insulating heat dissipating coating composition according to the present invention.

According to one embodiment of the present invention, the insulating heat dissipation coating layer may have a relative gain in thermal conductivity exceeding 200% according to Equation 2 below.

[Equation 2]

Additionally, the thickness of the insulating heat dissipation coating layer may be 15 to 50 μm.

Additionally, the insulating heat dissipation unit may have a resistance value per unit area of 10 ¹⁰ to 10 ¹⁴ Ω/sq.

Meanwhile, the present invention includes a circuit board on which devices are mounted; and an insulating heat dissipating coating layer cured by treating at least a portion of the outer surface of the circuit board with the insulating heat dissipating coating composition according to the present invention.

Meanwhile, the present invention provides an insulating heat dissipating component for lighting including an insulating heat dissipating coating layer cured by treating at least a portion of the outer surface with the insulating heat dissipating coating composition according to the present invention.

The insulating heat dissipating coating composition of the present invention is excellent not only in thermal conductivity but also in thermal radiation, so it exhibits excellent heat dissipation performance and can simultaneously implement an insulating heat dissipating coating layer with insulating properties. In addition, the insulating heat dissipating coating layer implemented through this has excellent adhesion to the surface to be coated, which significantly prevents peeling of the insulating heat dissipating coating layer during use. After being formed as an insulating heat dissipating coating layer, external heat, organic solvents, moisture, shock, etc. The durability of the insulating heat dissipating coating layer can be maintained despite physical and chemical stimulation. In addition, the dispersibility of the heat dissipation filler dispersed within the formed insulating heat dissipation coating layer is excellent, resulting in uniform insulation and heat dissipation performance. Furthermore, since the surface of the formed insulating heat dissipation coating layer is very smooth and has excellent smoothness, the surface quality is excellent, so it can be widely applied throughout industries that require both insulation and heat dissipation.

1 and 2 are perspective views and partial cross-sectional views of insulating heat dissipation units according to various embodiments of the present invention;
Figure 3 is a cross-sectional view of an insulating heat dissipation circuit board on which an insulating heat dissipation coating layer is formed according to an embodiment of the present invention, and
Figure 4 is a cross-sectional view of a heat sink for LED lighting on which an insulating heat dissipation coating layer is formed according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. The present invention may be implemented in many different forms and is not limited to the embodiments described herein.

An insulating heat dissipating coating composition according to an embodiment of the present invention includes a coating layer forming component including a main resin; And an insulating heat dissipation filler included in an amount of 25 to 70 parts by weight based on 100 parts by weight of the main resin.

First, the coating layer forming components will be described.

The coating layer forming component includes a main resin, and if the main resin is a curable resin, it may further include a curing agent.

The main resin is capable of forming a coating layer, and ingredients known in the art can be used without limitation. However, the heat dissipation performance is improved by improving adhesion to the substrate to be coated, heat resistance that does not become embrittled by the heat of the heat-generating substrate, insulation that does not become embrittled by electrical stimulation, mechanical strength, and compatibility with the insulating heat dissipation filler. To improve dispersibility, the main resin includes glycidyl ether type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, linear aliphatic epoxy resin, rubber modified epoxy resin, and It may include an epoxy resin containing one or more types selected from the group consisting of their derivatives.

Specifically, the glycidyl ether type epoxy resin includes glycidyl ethers of phenols and glycidyl ethers of alcohols, and the glycidyl ethers of phenols include bisphenol A type, bisphenol B type, bisphenol AD type, and bisphenol ether. Bisphenol-based epoxies such as S-type, bisphenol-F-type and resorcinol, phenol novolac epoxy, phenolic novolac such as aralkylphenol novolac, terpene phenol novolac, and o-cresol novolac. There are cresol novolak-based epoxy resins such as epoxy, and these can be used alone or in combination of two or more types.

The glycidyl amine type epoxy resin includes diglycidylaniline, tetraglycidyldiaminodiphenylmethane, N,N,N',N'-tetraglycidyl-m-xylylenediamine, 1,3 -Bis(diglycidylaminomethyl)cyclohexane, triglycidyl-m-aminophenol, which has both the structure of glycidyl ether and glycidylamine, and triglycidyl-p-aminophenol, etc., used alone or Two or more types can be used together.

The glycidyl ester type epoxy resin may be an epoxy resin made of hydroxycarboxylic acid such as p-hydroxybenzoic acid, β-hydroxynaphthoic acid, and polycarboxylic acid such as phthalic acid and terephthalic acid, and may be used alone or in combination of two or more types. can do.

The linear aliphatic epoxy resin includes 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, cyclohexanedimethanol, glycerin, trimethylolethane, thirimethylolpropane, pentaerythrol, and dodecahydrobisphenol A. , dodecahydro, bisphenol F, ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol, etc., may be glycidyl ethers, and may be used alone or in combination of two or more types.

The rubber-modified epoxy resin is not particularly limited as long as it is an epoxy resin having rubber and/or polyether in the skeleton. For example, an epoxy resin (CTBN-modified) chemically bonded to a carboxyl group-modified butadiene-acrylonitrile elastomer within the molecule. It can be a rubber-modified epoxy resin such as acrylonitrile-butadiene rubber-modified epoxy resin (NBR-modified epoxy resin), urethane-modified epoxy resin, or silicone-modified epoxy resin, and can be used alone or in combination of two or more types. there is.

However, it has excellent compatibility with the insulating heat dissipating filler described later, especially silicon carbide, in terms of heat dissipation characteristics, improved durability of the insulating heat dissipating coating layer, improvement of surface quality of the insulating heat dissipating coating layer, and improvement of dispersibility of the heat dissipating filler. , for example, the main resin may include a compound represented by the following formula (1).

[Formula 1]

The R ¹ and R ² are each independently a hydrogen atom, a C1 to C5 linear alkyl group, or a C3 to C5 branched alkyl group, preferably a hydrogen atom, a C1 to C3 linear alkyl group, or a C3 to C4 branched alkyl group. and R ³ and R ⁴ are each independently a hydrogen atom, a C1 to C5 linear alkyl group or a C3 to C5 branched alkyl group, preferably a hydrogen atom, a C1 to C3 linear alkyl group or a C3 to C4 branched alkyl group. type alkyl group, and n is a rational number such that the weight average molecular weight of the compound represented by Formula 1 is 400 to 4000, preferably 450 to 3900.

If the weight average molecular weight of the compound represented by Formula 1 is less than 400, the flowability of the coating composition may increase, making it difficult to create an insulating heat-radiating coating layer, and even after creation, the adhesion to the surface to be coated may decrease, and the weight If the average molecular weight exceeds 4000, it is difficult to manufacture an insulating heat dissipating coating layer of uniform thickness, and the dispersibility of the heat dissipating filler in the coating composition decreases, making it difficult to achieve uniform insulation and heat dissipating performance when forming an insulating heat dissipating coating layer.

In addition, the curing agent included in the coating layer forming component along with the epoxy resin that can be used as the above-mentioned main resin may vary depending on the specific type of epoxy that can be selected, and the specific type includes curing agents known in the art. It can be used, and preferably includes any one or more of an aliphatic polyamine-based curing agent, an aromatic polyamine-based curing agent, an acid anhydride-based curing agent, and a catalyst-based curing agent.

Specifically, the aliphatic polyamine-based curing agent may be, for example, polyethylene polyamine, and is preferably diethylene triamine (DETA), diethylamino propylamine (DEAPA), triethylene tetramine (TETA), or tetraethylene pentamine. (TEPA) and menthane diamine (MDA).

In addition, the aromatic polyamine-based curing agent may include, for example, one or more selected from the group consisting of meta-phenyl diamine (MPDA), diamino diphenyl sulfone (DDS), and diphenyl diamino methane (DDM).

In addition, the acid anhydride-based curing agent includes, for example, phthalic anhydride (PA), tetrahydrophthalic anhydride (THPA), methyl tetrahydrophthalic anhydride (MTHPA), and hexahydrophthalic anhydride. It may include one or more selected from the group consisting of methyl nadic anhydride (HHPA) and methyl nadic anhydride (MNA).

In addition, the catalyst-based curing agent includes, for example, dicyandiamide (DICY), melamine, polymer captan, methylene diphenyl diisocyanate (MDI), toluene diisocyanate (TDI), BF ₃ mono ethylene amine (BF ₃ -MEA), and benzyl. It may include one or more types selected from the group consisting of catalyst-based curing agents including one or more types selected from the group consisting of dimethyl amine (BDMA) and phenyl imidazole.

Meanwhile, according to one embodiment of the present invention, when the main resin includes the compound represented by Formula 1, the coating layer forming component includes a first curing agent including an aliphatic polyamine-based curing agent as a curing agent, an aromatic polyamine-based curing agent, It may include a second curing agent containing at least one selected from the group consisting of acid anhydride-based curing agents and catalyst-based curing agents. Through this, it is very advantageous in improving compatibility with the insulating heat dissipation filler described later, especially silicon carbide, and is advantageous in all physical properties such as adhesion, durability, and surface quality of the insulating heat dissipation coating layer, and also improves the adhesion surface to which the heat dissipation coating composition will be applied. There is an advantage in further preventing cracks or peeling of the insulating heat dissipation coating layer formed in that area when it is curved or has a step instead of a smooth plane. In addition, in order to develop more improved physical properties, the curing agent may preferably include a first curing agent and a second curing agent in a weight ratio of 1:0.5 to 1.5, and preferably in a weight ratio of 1:0.6 to 1.4.

If the weight ratio of the first and second curing agents is less than 1:0.5, the adhesion strength to the adherend may be weakened, and if the weight ratio exceeds 1:1.4, the elasticity of the coating film may decrease and durability may be poor. It may not be possible.

In addition, the coating layer forming component may include 25 to 100 parts by weight of the curing agent, preferably 40 to 80 parts by weight, based on 100 parts by weight of the main resin. If the amount of the curing agent is less than 25 parts by weight, the resin may not be cured or the durability of the formed insulating heat dissipation coating layer may be reduced. Additionally, if the curing agent exceeds 100 parts by weight, cracks may occur in the formed insulating heat dissipating coating layer or the insulating heat dissipating coating layer may be broken.

Next, an insulating heat dissipation filler that improves insulation and heat dissipation performance will be described.

The insulating heat dissipation filler can be selected without limitation as long as it has both insulating and heat dissipating properties. In addition, the shape and size of the insulating heat dissipation filler are not limited, and the structure may be porous or non-porous, and may be selected differently depending on the purpose. For example, the insulating heat dissipation filler may include silicon carbide, magnesium oxide, titanium dioxide, aluminum nitride, silicon nitride, boron nitride, aluminum oxide, silica, zinc oxide, barium titanate, strontium titanate, beryllium oxide, manganese oxide, zirconia oxide, and boron oxide. It may include one or more species selected from the group consisting of. However, preferably in terms of facilitating the achievement of desired physical properties such as excellent insulation and heat dissipation performance, ease of formation of the insulating heat dissipation coating layer, uniform insulation and heat dissipation performance after forming the insulating heat dissipation coating layer, and surface quality of the insulating heat dissipation coating layer. may be silicon carbide.

In addition, in the case of the insulating heat dissipation filler, a filler whose surface is modified with a functional group such as a silane group, amino group, amine group, hydroxy group, or carboxyl group may be used, and in this case, the functional group may be directly bonded to the surface of the filler, or It may be indirectly bonded to the filler through a substituted or unsubstituted aliphatic hydrocarbon having 1 to 20 carbon atoms or a substituted or unsubstituted aromatic hydrocarbon having 6 to 14 carbon atoms.

Additionally, the insulating heat dissipation filler may be a core-shell type filler in which a known conductive heat dissipation filler such as carbon-based or metal is used as a core, and an insulating component surrounds the core.

Additionally, the insulating heat dissipation filler may have an average particle diameter of 10 nm to 15 μm, preferably 30 nm to 12 μm. If the average particle diameter is less than 10 nm, there is a risk of an increase in product price, and the amount of insulating heat dissipation filler that is smeared on the surface after being implemented as an insulating heat dissipation coating layer increases, which may reduce heat dissipation performance. Additionally, if the average particle diameter exceeds 15㎛, surface uniformity may deteriorate. Meanwhile, the insulating heat dissipating filler provided to improve the dispersibility of the insulating heat dissipating filler may have a ratio of D50 to D97 of 1:4.5 or less, preferably 1:1.2 to 3.5. If the ratio of D50 to D97 exceeds 1:4.5, the uniformity of the surface is reduced, the heat dissipation effect may not be uniform due to poor dispersion of the heat dissipation filler, and the heat conduction effect is poor because it contains particles with relatively large particle sizes. The degree may be relatively high, but the desired heat dissipation characteristics may not be achieved. D50 and D97 refer to the particle size of the insulating heat dissipation filler when the cumulative degree is 50% and 97%, respectively, in the volumetric cumulative particle size distribution. Specifically, in a graph (volume-based particle size distribution) with the particle size on the horizontal axis and the volume cumulative frequency from the side with the smallest particle size on the vertical axis, the volume percentage from the smallest particle size is relative to the cumulative volume value of all particles (100%). The particle sizes of particles corresponding to 50% and 97% of the cumulative values, respectively, correspond to D50 and D97. The cumulative volume particle size distribution of the insulating heat dissipation filler can be measured using a laser diffraction scattering particle size distribution device.

On the other hand, the insulating heat dissipating filler can be used by changing the particle size depending on the thickness of the insulating heat dissipating coating layer to be formed. For example, when forming an insulating heat dissipating coating layer with a thickness of 25 μm, the average particle diameter of the insulating heat dissipating filler is 1 to 7 μm. Filler can be used, and when forming a 35㎛ thick insulating heat dissipating coating layer, a heat dissipating filler with an average particle diameter of 8 to 12㎛ can be used. However, in order to further improve the dispersibility of the heat dissipating filler in the composition, it is preferable to use an insulating heat dissipating filler that satisfies both the average particle diameter range of the heat dissipating filler according to the present invention and the ratio range of D50 and D97.

The insulating heat dissipation filler may be included in an amount of 25 to 70 parts by weight based on 100 parts by weight of the above-mentioned main resin, and may preferably be included in an amount of 35 to 60 parts by weight for further improved physical properties. If the insulating heat dissipation filler is included in less than 25 parts by weight based on 100 parts by weight of the main resin, the desired level of heat dissipation performance may not be achieved. In addition, if the insulating heat dissipating filler exceeds 70 parts by weight, the adhesive strength of the implemented insulating heat dissipating coating layer is weakened and peeling easily occurs, and the hardness of the insulating heat dissipating coating layer increases, so it may easily break or crumble due to physical impact. Additionally, as the number of heat dissipating fillers protruding from the surface of the insulating heat dissipating coating layer increases, the surface roughness may increase and the surface quality of the insulating heat dissipating coating layer may deteriorate. In addition, even if additional insulating heat dissipation filler is provided, the degree of improvement in heat dissipation performance may be minimal. In addition, in the process of treating the surface to be coated with the heat dissipation coating composition in order to implement a thin insulating heat dissipation coating layer, when coating using some coating methods, for example, spraying, it is difficult for the composition to uniformly treat the surface to be coated, and the composition The dispersibility of the dispersed heat dissipation filler is reduced, so even if the composition is treated on the surface to be coated, the heat dissipation filler may be dispersed and disposed non-uniformly, which may make it difficult to achieve uniform insulation and heat dissipation performance throughout the surface of the insulating heat dissipation coating layer. there is.

Next, physical property enhancing components that may be further included in the insulating heat dissipation coating composition will be described.

The physical property enhancing component functions to improve insulation/heat dissipation properties when the insulating heat dissipating coating composition according to the present invention is coated on the surface to be coated, and at the same time, improves durability by developing excellent adhesion.

The physical property enhancing component may be a silane-based compound, and in the case of known silane-based compounds employed in the art, it can be used without limitation. However, when used with silicon carbide among the main resins of the above-mentioned coating layer forming components and insulating heat dissipation fillers, the purpose is 3-[N-anyl-N-(2-aminoethyl)] aminopropyltrimethoxysilane, 3-(N-anyl-N-gly) is used to achieve remarkable durability and heat dissipation by synergizing the physical properties. Cydyl) aminopropyltrimethoxysilane, 3-(N-anyl-N-methacrylonyl] aminopropyltrimethoxysilane, 3-glycidyl oxypropylmethylethoxysilane, N,N-Bis[3 -(trimethoxycinyl)propyl]methacrylamide, γ-glycidoxytrimethyldimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3- Glycidyloxypropylmethylmethoxysilane, beta(3, 4-epoxy cyclohexyl)ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, heptadeca Fluorodecytrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltris(trimethylsiloxy)silane, methyltris(dimethylsiloxy)silane, 3-aminopropyltriepoxy silane, It may include any one or more selected from the group consisting of 3-mercaptopropyltrimethoxy silane and N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane.

In addition, the physical property enhancing component may preferably be included in an amount of 0.5 to 20 parts by weight based on 100 parts by weight of the main resin. If the physical property enhancing component is included in less than 0.5 parts by weight, the desired physical properties such as improved heat dissipation and adhesion through the property enhancing component may not be achieved to the desired level. In addition, when provided in excess of 20 parts by weight, the adhesion to the surface to be coated may be weakened.

Meanwhile, the above-described insulating heat dissipating coating composition may further include a colorant to minimize loss of color due to light, air, moisture, or extreme temperatures, and a matting agent to eliminate light to ensure stability of the surface of the coating film. .

The colorant may include at least one selected from the group consisting of talc, zinc oxide, zinc sulfide, metal oxide-based, hydroxyl-based, sulfide-based, azo-based, nitro-based and phthalocyanine-based, preferably talc. Additionally, the colorant may be included in an amount of 30 to 60 parts by weight, preferably 35 to 55 parts by weight, based on 100 parts by weight of the main resin, but is not limited thereto.

In addition, the matting agent is one or more selected from the group consisting of titanium dioxide, aerogel silica, hydrogel silica, PP wax, PE wax, PTFE wax, urea formaldehyde resin, and benzoguamine formaldehyde resin, Preferably, it may contain titanium dioxide. Additionally, the matting agent may be included in an amount of 30 to 60 parts by weight, preferably 35 to 55 parts by weight, based on 100 parts by weight of the main resin, but is not limited thereto.

Talc, which can be used as a colorant, and titanium dioxide, which can be used as a matting agent, can also be used as a filler along with the insulating heat dissipation filler to improve withstand voltage characteristics.

Meanwhile, the above-described insulating heat dissipating coating composition may further include a flame retardant to improve the flame retardancy of the insulating heat dissipating coating layer.

The flame retardant may be a known ingredient employed as a flame retardant in the art. For example, trizinc bis (orthophosphate), triphenyl phosphate, trixylenyl phosphate, tricresyl phosphate, triisophenyl phosphate, trischloroethyl Phosphate (Tris-Choloroethylphosphate), Tris-Chloroprophyphosphate, Resorcinol di-phosphate, Aromatic polyphosphate, Polyphosphoric acid ammonium and red ( It may include one or more species selected from the group consisting of Red Phosphorous. Additionally, the flame retardant may be included in an amount of 10 to 35 parts by weight, preferably 15 to 30 parts by weight, based on 100 parts by weight of the main resin.

Meanwhile, the above-described insulating heat dissipating coating composition may further include a dispersant and a solvent to improve the dispersibility of the insulating heat dissipating filler and to implement a uniform insulating heat dissipating coating layer.

The dispersant may be a known ingredient employed in the art as a dispersant for insulating heat dissipation filler. For example, silicone-based dispersant, polyester-based dispersant, polyphenylene ether-based dispersant; Polyolefin-based dispersant, acrylonitrile-butadiene-styrene copolymer dispersant, polyarylate-based dispersant, polyamide-based dispersant, polyamideimide-based dispersant, polyarylsulfone-based dispersant, polyetherimide-based dispersant, polyethersulfone-based dispersant, poly Phenylene sulfide-based dispersant, polyimide-based dispersant, polyether ketone-based dispersant, polybenzoxazole-based dispersant, polyoxadiazole-based dispersant, polybenzothiazole-based dispersant, polybenzimidazole-based dispersant, polypyridine-based dispersant, polytria A sol-based dispersant, a polypyrrolidine-based dispersant, a polydibenzofuran-based dispersant, a polysulfone-based dispersant, a polyurea-based dispersant, a polyurethane-based dispersant, or a polyphosphazene-based dispersant, etc. may be used alone or with two selected from among them. A mixture or copolymer of more than one species may be used. Additionally, as an example, the dispersant may be a silicone-based dispersant.

Additionally, the dispersant may preferably be included in an amount of 0.5 to 20 parts by weight based on 100 parts by weight of the insulating heat dissipation filler. If the dispersant is provided in less than 0.5 parts by weight per 100 parts by weight of the insulating heat dissipation filler, the desired effect may not be achieved, and if the dispersant is provided in excess of 20 parts by weight, the adhesion strength of the adherend may be weakened or the coating film may be damaged. Pin holes and orange peel may occur on the surface.

In addition, the solvent can be selected according to the selected main resin, curing agent, etc., and is not specifically limited in the present invention. Any solvent that enables appropriate dissolution of each component can be used as the solvent, For example, in the group consisting of aqueous solvents such as water, alcohol-based solvents, ketone-based solvents, amine-based solvents, amine-based solvents, ester-based solvents, amide-based solvents, halogenated hydrocarbon-based solvents, ether-based solvents and furan-based solvents. One or more selected types can be used.

In addition, the above-mentioned insulating heat dissipation coating composition includes a leveling agent, pH adjuster, ion trapping agent, viscosity modifier, thixotropy imparting agent, antioxidant, heat stabilizer, light stabilizer, ultraviolet absorber, colorant, dehydrating agent, flame retardant, and electrifying agent. One or two or more types of various additives such as detergents, anti-fungal agents, preservatives, etc. may be added. The various additives described above can be used as those known in the art and are not particularly limited in the present invention.

The insulating heat dissipating coating composition according to an embodiment of the present invention described above may have a viscosity of 5 to 600 cps at 25°C. If the viscosity of the insulating heat dissipating coating composition is less than 5 cps, it may be difficult to create an insulating heat dissipating coating layer due to the composition flowing down, and even after creation, the adhesion to the surface to be coated may be weakened, and if it exceeds 600 cps, the thickness may be thin. It is difficult to manufacture with an insulating heat dissipation coating layer, and even if manufactured, the surface may not be uniform, and the coating process may not be easy, and especially in the case of spraying coating, the coating process may be more difficult. Additionally, the dispersibility of the insulating heat dissipating filler within the insulating heat dissipating coating layer may be reduced.

Meanwhile, the above-described insulating heat dissipation coating composition may further include a UV stabilizer to prevent yellowing caused by UV.

The UV stabilizer may be a known ingredient employed in the art as a UV stabilizer for an insulating heat dissipating coating composition. For example, 2-(2'-hydroxy-3, 5'-di(1, 1-dimethylbenzyl-phenyl)-benzotriazole, 2-(2'-hydroxy-3', 5'-di- Ter-butylphenyl)-benzotriazole, 2-(2'-hydroxy-3'-terbutyl-5'-methylphenyl)-5-chloro-benzotriazole, 2-(2-hydroxy-5-ter -Octylphenyl)-benzotriazole, 2-(5-methyl-2-hydroxy-phenyl)-benzotriazole, 2,6-di-t-butyl-4-methylphenol, tetrakis[methylene-3- (3,5-di-t-butyl-4-hydroxyphenyl)propionate] methane, octadecyl-3,5-di-t-butyl-4-hydroxyhydrocinnamate, 2,2-methylenebis (4-methyl-6-t-butylphenol), tris(2,4-di-t-butylphenyl)-phosphite, bis(2,4-di-t-butyl), pentaerythritol-di-phosphite As alkyl ester phosphites, dilauryl thio-di-propionate, di-stearyl thio-di-propionate, di-stearyl thio-di-propionate and dimyristyl thio-di-propionate. It may include any one or more selected from the group consisting of: In addition, as an example, the UV stabilizer is 2-(2'-hydroxy-3, 5'-di(1, 1-dimethylbenzyl-phenyl)-benzo It may be a triazole.

In addition, the UV stabilizer may preferably be further included in an amount of 0.05 to 2 parts by weight based on 100 parts by weight of the main resin. If the UV stabilizer is provided in less than 0.05 parts by weight per 100 parts by weight of the main resin, the desired effect may not be achieved, and if the UV stabilizer is provided in excess of 2 parts by weight, the adhesion strength and durability of the insulating heat dissipating coating layer may be reduced. Impact resistance may decrease.

Meanwhile, the above-described insulating heat dissipating coating composition may further include an antioxidant to prevent discoloration of the dried coating film, brittleness due to oxidation, and deterioration of physical properties such as adhesion strength.

The antioxidant may be a known ingredient employed in the art as an antioxidant for the insulating heat dissipating coating composition. For example, the antioxidants include tri-methyl phosphate, tri-phenyl phosphate, tris (2, 4-di-tert-butylphenyl) phosphate, triethylene glycol-bis-3-(3-tert-butyl-4-hyde) Roxy-5-methylphenyl) propionate, 1, 6-hexane-diol-3 (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate, pentaerythrityl-tetrakis (3- (3, 5-di-tert-butyl-4-hydroxyphenyl)propionate, 2-hydroxybenzophenone, 2-hydroxyphenylbenzothiazole, hindered amine, organic nickel compound, salicylate, cinnamate It may include one or more selected from the group consisting of derivatives, resorcinol monobenzoate, oxanilide, and p-hydroxybenzoate.In addition, as an example, the antioxidant is 2-hydroxyphenylbenzotia. It could be a pawn.

In addition, the antioxidant may preferably be further included in an amount of 0.1 to 3 parts by weight based on 100 parts by weight of the main resin. If the antioxidant is provided in less than 0.1 parts by weight per 100 parts by weight of the main resin, discoloration may occur, and if the antioxidant is provided in more than 3 parts by weight, brittleness and adhesion strength may be weakened.

On the other hand, a heat dissipation unit comprising an insulating heat dissipation coating layer with a thickness of 25 μm cured by treating an aluminum plate with a thickness of 1.5 mm and a width of 35 mm × 34 mm with the above insulating heat dissipation coating composition satisfies the following condition (1). You can.

As condition (1), a heat source is placed at the exact center of the lower part of the heat dissipation unit in a closed system at 25°C and humidity of 50%, and after 90 minutes, 10 random points on a circle with a radius of 15 mm centered on the center of the upper surface of the heat dissipation unit. The error in the heating temperature calculated by measuring the temperature at the point and calculated according to Equation 1 below may be within ±1% at each point.

[Equation 1]

The closer the error in the heating temperature calculated according to Equation 1 is to 0% at each point, it means that the heat dissipation filler is uniformly dispersed and the heat dissipation characteristics of the manufactured heat dissipation unit appear uniformly.

The insulating heat dissipating coating composition that implements the insulating heat dissipating coating layer that satisfies the above condition (1) has high dispersibility of the heat dissipating filler within the insulating heat dissipating coating composition, so that the heat dissipating unit including the insulating heat dissipating coating layer implemented with the insulating heat dissipating coating composition has uniform heat dissipating performance. It can be expressed.

On the other hand, a heat dissipation unit including an insulating heat dissipation coating layer with a thickness of 25 μm cured by treating an aluminum plate with a thickness of 1.5 mm and a width of 35 mm × 34 mm with the above insulating heat dissipation coating composition satisfies the following condition (2). You can.

As condition (2), a heat source with a temperature of 88°C is placed at the exact center of the lower part of the heat dissipation unit in a closed system at 25°C and humidity 50%, and after 90 minutes, the temperature at a point 5cm above the center of the heat dissipation unit is measured, according to Equation 3 below: The calculated heat radiation efficiency may be 10% or more, preferably 10 to 100%.

[Equation 3]

A high heat radiation efficiency calculated according to Equation 3 above means that heat can be radiated quickly due to excellent heat dissipation characteristics.

As the above condition (2) is satisfied, a heat dissipation unit including an insulating heat dissipation coating layer cured by treating the insulating heat dissipation coating composition can exhibit excellent heat dissipation characteristics, especially heat radiation characteristics.

The heat source indicated in conditions (1) and (2) above can be used without limitation as long as it is a heat source whose temperature exceeds 25°C and can be maintained at a constant temperature. For example, the heat source is an LED with a certain power consumption. You can.

Meanwhile, the present invention includes a substrate 10a and an insulating heat dissipating coating layer 10b cured by treating at least a portion of the outer surface of the substrate 10a with the insulating heat dissipating coating composition according to the present invention, as shown in FIG. 1. Includes a heat dissipation unit 100. In order to improve heat dissipation performance, if a heat dissipation unit made of metal is applied to a circuit board in direct contact, problems such as electrical shorts may occur. An insulating heat dissipation coating layer is formed with the insulating heat dissipation coating composition of the present invention. In the case of a heat dissipation unit, even when it is placed in direct contact with a circuit board, it has the advantage of eliminating concerns about electrical short circuits and at the same time effectively dissipating heat generated from the circuit board to the outside air.

The substrate 10a may be employed without limitation as long as it has mechanical strength sufficient to form an insulating heat dissipating coating layer after being treated with the insulating heat dissipating coating composition according to the present invention, regardless of whether it has functional heat dissipating characteristics. Accordingly, in terms of material, the substrate 10a may be made of any one or more of metals, non-metals, and high molecular organic compounds. In the case of the metal, it may be molded from any one metal material selected from the group consisting of aluminum, copper, zinc, silver, gold, iron, oxides thereof, and alloys of the above metals.

Additionally, the non-metal may be aluminum oxide, a component commonly referred to as ceramic. In addition, the polymer organic compounds include polyethylene, polypropylene, polystyrene, polyvinyl chloride, acrylonitrile-butadiene-styrene resin (ABS), acrylonitrile-styrene resin (AN), methacrylic resin (PMMA), polyamide, Polyacetal, polycarbonate, polyethylene terephthalate (PET), polybutylene terephthalate (PBT). High molecular organic compounds commonly referred to as plastics, such as fluorine resin, phenoxy resin, phenolic resin (PE), urea resin (UF), melamine resin (MF), unsaturated polyester resin (UP), epoxy resin, and polyurethane resin. It can be.

The shape of the substrate 10a is not limited. If the substrate 10a is a substrate with heat dissipation properties, it may have a structure provided with a plurality of pointed heat dissipation fins 10a ₁ as shown in FIG. 1 in order to expand the surface area for radiating heat to the outside. Alternatively, as shown in FIG. 2, the base plate 11a may be bent upward so that both side ends of the bottom plate face each other to perform the function of a heat dissipation fin. On the other hand, the insulating heat dissipation coating layers 10b and 11b formed with the insulating heat dissipation coating composition according to an embodiment of the present invention exhibit improved heat dissipation performance, and thus the heat dissipation unit 100' as shown in FIG. 2 increases the number of heat dissipation fins of the base material 11a. Even though it is less than that of Figure 1, the heat dissipation performance can be significantly superior to that of a heat dissipation substrate having only the shape as shown in FIG. 1 with a structurally increased surface area without an insulating heat dissipation coating layer. Accordingly, there is an advantage in that the desired level of heat dissipation performance can be achieved even without employing the base material 10a, which is structurally difficult to mold as shown in FIG. 1 and may increase manufacturing time and manufacturing cost.

In addition, even in the case where the substrate 10a has a complex shape including a plurality of heat dissipation fins 10a ₁ as shown in FIG. 1, the insulating heat dissipation coating layer peels off or peels off even on the outer surface where the insulating heat dissipation coating layer is bent or has a step due to the excellent adhesion of the insulating heat dissipation coating layer. Cracks may not occur.

Since the thickness, length, width, etc. of the substrates 10a and 11a may vary depending on the size and location of the application area where the heat dissipation units 100 and 100' are provided, the present invention is not particularly limited thereto. .

In addition, as shown in Figure 2, the substrate 11a may further include a functional layer 11c between the outer surface and the insulating heat dissipating coating layer 11b, and the functional layer improves the adhesion of the insulating heat dissipating coating layer 11b. It may be a separate primer layer to improve heat dissipation performance, or it may be an oxide film formed by surface modifying the outer surface of the substrate 11a, such as anodizing, to improve heat dissipation performance.

The insulating heat dissipating coating composition according to the present invention is coated on at least one area of the above-described substrates 10a and 11a to form an insulating heat dissipating coating layer. Unlike FIGS. 1 and 2, the insulating heat dissipating coating layer is formed only on a portion of the substrates 10a and 11a. can be formed. This means that the area covered during partial coating may vary depending on the desired level of heat dissipation performance, and therefore the present invention is not particularly limited thereto.

The insulating heat dissipating coating layers 10b and 11b are formed by curing the insulating heat dissipating coating composition according to the present invention on the outer surface of the substrate. A specific method of forming the insulating heat dissipating coating layer (10b, 11b) may be a known method of coating an insulating heat dissipating coating composition on a substrate, non-limiting examples of which include spraying, dip coating, silk screen, and roll. It can be manufactured by treating various substrates with methods such as coating, dip coating, or spin coating.

The coating composition can be implemented as an insulating heat dissipating coating layer by treating it with heat and/or light depending on the type of main resin and type of curing agent used during curing after coating. The applied heat temperature and/or light intensity and processing time may vary depending on the type of main resin used, type of hardener, its content, film thickness, etc. For example, it contains the above-mentioned epoxy resin as the main resin, and includes a first curing agent containing an aliphatic polyamine-based curing agent and at least one selected from the group consisting of an aromatic polyamine-based curing agent, an acid anhydride-based curing agent, and a catalyst-based curing agent. When a second curing agent is provided, the treatment can be performed for 1 to 60 minutes at a temperature of 130°C to 150°C, which is below the strain point of the substrate. If the treatment temperature is less than 130°C, it is difficult for the insulating heat dissipating coating composition to be coated on the substrate, and if the treatment temperature exceeds 150°C, the substrate may be deformed, the heat dissipation layer may be destroyed, and the manufacturing cost may increase. In addition, if the treatment process time is less than 1 minute, it is difficult for the insulating heat dissipation coating composition to be coated on the substrate, and if the surface treatment process time exceeds 60 minutes, the manufacturing time of the insulating heat dissipation device is unnecessarily increased. It is preferable that the surface treatment process proceeds for from 60 minutes.

In addition, the insulating heat dissipating coating composition used in the present invention is brought into contact with a solid substrate, especially a metal substrate, and then exposed to the air to form a film that quickly hardens without stickiness within a few minutes at room temperature or at a temperature of 50°C or lower, allowing it to be used in the workplace. There is little possibility of contamination by dust, etc., and final curing can be performed at a relatively low temperature, which not only improves workability but also prevents deformation of the metal substrate during curing.

The formed insulating heat dissipation coating layers 10b and 11b may have a thickness of 15 to 50 ㎛, more preferably 15 to 45 ㎛. If the thickness exceeds 50㎛, boiling may occur on the coating surface, and if the thickness is less than 15㎛, heat dissipation characteristics may deteriorate.

In addition, the insulating heat dissipating coating layers 10b and 11b may contain 10 to 30 wt% of insulating heat dissipating filler, preferably 15 to 25 wt%, based on the total weight of the insulating heat dissipating coating layer. If less than 10% by weight of insulating heat dissipating filler is included in the implemented insulating heat dissipating coating layer, the desired level of heat dissipating performance may not be achieved. In addition, if the insulating heat dissipating filler exceeds 30% by weight, the adhesion of the insulating heat dissipating coating layer weakens, causing peeling to easily occur, and the hardness of the insulating heat dissipating coating layer increases, making it easy to break or crumble due to physical impact. Additionally, as the number of insulating heat dissipating fillers protruding from the surface of the insulating heat dissipating coating layer increases, the surface roughness may increase and the surface quality of the insulating heat dissipating coating layer may deteriorate. In addition, even if additional insulating heat dissipation filler is provided, the degree of improvement in heat dissipation performance may be minimal.

Additionally, the insulating heat dissipation unit of the present invention may have a resistance value per unit area of 10 ¹⁰ to 10 ¹⁴ Ω/sq. If the resistance value per unit area of the insulating heat dissipation unit is less than 10 ¹⁰ Ω/sq, the heat dissipation unit has poor insulating properties and may be difficult to use in applications requiring electrical insulation.

Meanwhile, the insulating heat dissipating coating layer may have a relative gain in thermal conductivity according to Equation 2 below, exceeding 200%, and preferably exceeding 220%.

[Equation 2]

A small value of the relative gain of the thermal conductivity means that the insulating heat dissipation coating layer containing the heat dissipation filler has less improvement in thermal conductivity compared to a coating layer not containing the heat dissipation filler, and a large value of the relative gain means that the heat dissipation filler This means that the insulating heat dissipation coating layer containing a greater degree of improvement in thermal conductivity compared to the coating layer not containing a heat dissipation filler.

If the relative gain of thermal conductivity is less than 200%, the desired level of heat dissipation performance may not be achieved.

Meanwhile, the present invention includes an insulating heat dissipation circuit board including an insulating heat dissipation coating layer cured by treating at least a portion of the outer surface of the circuit board on which devices are mounted with the insulating heat dissipation coating composition according to the present invention.

Specifically, as shown in FIG. 3, the insulating heat dissipation circuit board 200 includes a plurality of elements 203 mounted on the upper surface of the board 201, and the lower part of the board 201 and the board 200. An insulating heat dissipation coating layer 202 may be formed on top of (201) and the plurality of elements 203.

The device may be a known device mounted on a circuit board in an electronic device, such as a driving chip. Additionally, the board may be a known circuit board provided in an electronic device, for example, a PCB or FPCB. Since the size and thickness of the substrate can be changed depending on the internal design of the electronic device to be implemented, the present invention is not particularly limited thereto.

In addition, the present invention includes an insulating heat dissipating component for lighting including an insulating heat dissipating coating layer cured by treating at least a portion of the outer surface with the insulating heat dissipating coating composition according to the present invention.

As an example, the insulating heat dissipation component for lighting may be an insulating heat dissipation heat sink for lighting. Specifically, as shown in FIG. 4, the insulating heat dissipation heat sink 300 for lighting includes a heat sink 301 and an insulating heat dissipation coating layer 302 formed on at least part or all of the outer surface of the heat sink 301. It can be included.

The heat sink may be a known heat sink provided in lighting. Since the material, size, thickness, and shape of the heat sink can be changed depending on the purpose, shape, and internal design of the lighting to be implemented, the present invention is not particularly limited thereto.

Meanwhile, the insulating heat dissipation coating composition according to the present invention is used in addition to the heat dissipation unit, circuit board, and lighting components described above, as well as electronic device components including mobile devices, TVs, wearable devices, and flexible devices, LED lamps, ECUs (electronic control units), Includes automotive parts including EV batteries and inverters, telecommunication devices and network devices including RF equipment, digital equipment, server devices, and setup boxes, solar panels, LEDs, and AI/AIN printed circuit boards (PCBs). It can be applied to lighting parts, including lighting devices, lighting cases, and sockets. For example, an insulating heat dissipation busbar for an EV high voltage switching relay to which an insulating heat dissipation coating layer cured by treating at least a portion of the outer surface with the insulating heat dissipation coating composition according to the present invention is applied, an insulating heat dissipation case for an EV high voltage switching relay, and an insulating heat dissipation for automobiles. It can be applied to automotive parts containing one or more types selected from the group consisting of DC-DC converters, automobile engine cooling devices, automobile LED headlamps, and PTC heaters.

As an example, the automotive part may be an insulating heat dissipation busbar for an EV high-voltage relay including an insulating heat dissipation coating layer cured by treating at least a portion of the outer surface with the insulating heat dissipation coating composition according to the present invention.

The busbar for the EV high-voltage relay may be a known busbar for the EV high-voltage relay commonly used in the industry, and the material, size, thickness, and shape of the busbar are determined by the input of the EV high-voltage relay to be implemented. Since changes are possible depending on internal design considering voltage and/or output voltage, the present invention is not particularly limited thereto.

In addition, the automotive part may be an insulating heat dissipation case for an EV high voltage switching relay including an insulating heat dissipation coating layer cured by treating at least a portion of the outer surface with the insulating heat dissipation coating composition according to the present invention.

The case for the EV high voltage switching relay may be a case for a known EV high voltage relay commonly available in the industry. The EV high-voltage switching relay case may include the above-described busbar for the EV high-voltage relay inside the case, and the material, size, thickness, and shape of the case may be determined by the shape and number of busbars located inside the EV high-voltage relay to be implemented, etc. Since changes are possible depending on the internal design, the present invention is not particularly limited thereto.

In addition, the automotive part may be an insulating heat dissipating DC-DC converter including an insulating heat dissipating coating layer cured by treating at least a portion of the outer surface with the insulating heat dissipating coating composition according to the present invention.

The DC-DC converter functions to convert DC power of a specific voltage into DC power of a different voltage, and may be a known DC-DC converter commonly used in the industry. Since the size and shape of the DC-DC converter can be changed depending on the internal design of the device to be implemented, the present invention is not particularly limited thereto.

Additionally, the automotive part may be an insulating heat dissipating engine cooling device including an insulating heat dissipating coating layer cured by treating at least a portion of the outer surface with the insulating heat dissipating coating composition according to the present invention.

For example, an insulating heat dissipation coating layer may be formed on some or all of the radiator included in the insulating heat dissipation engine cooling device. The radiator may be a known radiator commonly used in the art, and the material, size, and shape of the radiator can be changed depending on the internal design of the engine cooling device to be implemented, so the present invention is specifically limited to this. I never do that.

Additionally, the automotive part may be an insulating heat dissipating LED headlamp including an insulating heat dissipating coating layer cured by treating at least a portion of the outer surface with the insulating heat dissipating coating composition according to the present invention.

By including an insulating heat dissipation coating layer on at least a portion of the outer surface of the LED headlamp, insulation and heat dissipation characteristics can be significantly improved and the LED headlamp can be made lighter. The LED headlamp may be a known LED headlamp commonly used in the industry, and the material, size, and shape of the LED headlamp may vary depending on the design of the vehicle to be implemented and/or the internal design of the LED headlamp. Since changes are possible, the present invention does not specifically limit this.

Additionally, the automotive part may be an insulating heat dissipating PTC heater for an electric vehicle including an insulating heat dissipating coating layer cured by treating at least a portion of the outer surface with the insulating heat dissipating coating composition according to the present invention.

The PTC heater may include a PTC fin. As an insulating heat dissipation coating layer is formed on some or all of the PTC fins, heat dissipation efficiency can be improved and power consumption of the electric vehicle can be reduced. The PTC pin may be a known PTC pin commonly used in the industry, and the material, size, and shape of the PTC pin can be changed depending on the internal design of the PTC heater to be implemented, so the present invention specifically addresses this. It is not limited.

On the other hand, the heat dissipating coating composition that forms the insulating heat dissipating coating layer of the present invention can improve excellent adhesion between the insulating heat dissipating coating layer and the substrate, improved moisture resistance and weather resistance, and wettability of the insulating heat dissipating filler, and reduces viscosity during compounding and reduces the insulating heat dissipating coating layer. This can increase the surface ductility of the formed substrate. In addition, it exhibits excellent heat dissipation and insulation properties, excellent solvent resistance to organic solvents, does not discolor when cured, and heat conduction is easy to control, so the insulating heat dissipation unit including the insulating heat dissipation coating layer implemented here continues to exhibit improved physical properties. can do. In addition, the dispersibility of the heat dissipation filler dispersed within the insulating heat dissipation coating layer is excellent, enabling uniform insulation and heat dissipation performance. It can be widely applied throughout the electrical and electronics, automobile, energy, and aerospace industries, including circuit boards equipped with various electrical and electronic components that require both insulation and heat dissipation, lighting devices such as LED lamps, and display devices.

The present invention will be described in more detail through the following examples, but the following examples do not limit the scope of the present invention, and should be interpreted to aid understanding of the present invention.

<Example 1>

The coating layer forming component is polyethylene polyamine as the first curing agent and 2,4,6-tris[N,N-dimethylamino]methyl]phenol as the second curing agent per 100 parts by weight of the compound represented by the following formula (1) as the main resin. : 60 parts by weight of a curing agent containing a weight ratio of 1, 47 parts by weight of silicon carbide with an average particle diameter of 5㎛ and a ratio of D50 to D97 of 1:1.6, and a property enhancing ingredient (Shanghai Tech Polymer Technology, epoxy-based silane compound) Tech-7130) 3 parts by weight, 44 parts by weight of talc as a colorant, 44 parts by weight of titanium dioxide as a matting agent, 22 parts by weight of trizinc bis (orthophosphate) as a flame retardant, and 2-(2'-hyde) as a UV stabilizer. 0.5 parts by weight of oxy-3, 5'-di(1, 1-dimethylbenzyl-phenyl)-benzotriazole, 1 part by weight of 2-hydroxyphenylbenzothiazole as an antioxidant, and dispersant (condensation of isobutyraldehyde and urea) Water) 5 parts by weight, 13 parts by weight of 1-butanol as a solvent, 13 parts by weight of n-butyl acetate, 13 parts by weight of 2-methoxy-1-methylethyl acetate, 9 parts by weight of methyl ethyl ketone, 37 parts by weight of ethyl acetate , 9 parts by weight of toluene, 43 parts by weight of 4-methyl-2-pentanone, and 103 parts by weight of xylene were mixed and stirred. After stirring, bubbles contained in the mixture were removed, and the final viscosity was adjusted to 100 to 130 cps at 25°C. An insulating heat dissipating coating composition as shown in Table 1 below was prepared, and then stored at 5°C.

[Formula 1]

R ¹ to R ⁴ are each a methyl group, and n is a rational number such that the weight average molecular weight of the compound represented by Formula 1 is 2000.

<Examples 2 to 21>

Manufactured in the same manner as in Example 1, but changing the average particle diameter, particle size distribution, weight ratio of the curing agent, molecular weight of the main resin, etc. of the insulating heat dissipating filler as shown in Table 1, Table 2 or Table 3 below. An insulating heat dissipation coating composition as shown in Table 3 was prepared.

<Comparative Examples 1 to 3>

An insulating heat dissipating coating composition was prepared in the same manner as in Example 1, except that the content of the insulating heat dissipating filler was changed as shown in Table 4 below.

<Experimental Example 1>

The heat dissipating coating composition prepared in the Examples and Comparative Examples was spray-coated on the entire surface of an aluminum (Al 1050) material with a thickness of 1.5 mm and a width of 35 mm × 34 mm in length to a final thickness of 25 ㎛. After heat treatment at 150°C for 10 minutes to manufacture a heat dissipation unit with an insulating heat dissipation coating layer formed, the following physical properties were evaluated and are shown in Tables 1 to 4.

1. Thermal conductivity evaluation

A heat dissipation unit was placed in the center of an acrylic chamber measuring 32 cm × 30 cm × 30 cm in width, length, and height, respectively, and the temperature inside the chamber and the temperature of the heat dissipation unit were adjusted to 25 ± 0.2°C. Afterwards, a test specimen was prepared by attaching LEDs of 20 mm x 20 mm in width and height, respectively, to the heat dissipation unit using TIM (thermal conductive tape: 1 W/mk) as a heat source. Heat was generated by applying an input power of 2.1W (DC 3.9V, 0.53A) to the heat source of the manufactured specimen, and after maintaining it for 90 minutes, the temperature of the heat dissipation unit was measured to evaluate thermal conductivity. Specifically, thermal conductivity was calculated according to Equation 4 below based on the temperature measured under the same conditions for a substrate without a heat dissipation coating layer.

[Equation 4]

2. Thermal radioactivity evaluation

A heat dissipation unit was placed in the center of an acrylic chamber measuring 32 cm × 30 cm × 30 cm in width, length, and height, respectively, and the temperature inside the chamber and the temperature of the heat dissipation unit were adjusted to 25 ± 0.2°C. Afterwards, a test specimen was prepared by attaching LEDs of 20 mm x 20 mm in width and height, respectively, to the heat dissipation unit using TIM (thermal conductive tape: 1 W/mk) as a heat source. An input power of 2.1W (DC 3.9V, 0.53A) was applied to the heat source of the manufactured specimen to generate heat, and after maintaining it for 90 minutes, the temperature at a point 5cm above the exact center of the heat dissipation unit was measured to evaluate the thermal emissivity. Specifically, the thermal emissivity was calculated according to Equation 3 below based on the temperature measured under the same conditions for a substrate without an insulating heat dissipation coating layer.

[Equation 3]

3. Evaluation of uniformity of heat dissipation performance

After placing the heat dissipation unit in the center of an acrylic chamber measuring 32 cm x 30 cm x 30 cm in width, length, and height respectively, adjust the temperature inside the chamber and the temperature of the heat dissipation unit to 25 ± 0.2°C and the humidity inside the chamber to 50%. did. Afterwards, a test specimen was prepared by attaching LEDs of 20 mm x 20 mm in width and height, respectively, to the heat dissipation unit using TIM (thermal conductive tape: 1 W/mk) as a heat source. Heat is generated by applying an input power of 2.1W (DC 3.9V, 0.53A) to the heat source of the manufactured specimen, maintained for 90 minutes, and then randomly spaced on a circle with a radius of 15 mm with the center of the upper surface of the heat dissipation unit as the center point. The temperature at 10 points was measured and the error in heating temperature was calculated according to Equation 1 below. The smaller the error, the more uniform the heat dissipation performance is, and the higher the dispersibility of the heat dissipation filler in the insulating heat dissipation coating layer. The maximum values of the errors in heating temperature are shown in Tables 1 to 4 below.

[Equation 1]

4. Durability evaluation

After placing the heat dissipation unit in a chamber where the temperature was 60°C and the relative humidity was 90%, the surface condition of the heat dissipation unit was evaluated with the naked eye 480 hours later. As a result of the evaluation, the presence or absence of cracks and peeling (lifting) of the insulating heat dissipation coating layer was confirmed. If there was no abnormality, it was indicated as ○, and if an abnormality occurred, it was indicated as ×.

5. Adhesion evaluation

The specimens for which durability was evaluated were cross-cut with a knife at intervals of 1 mm. Afterwards, attach scotch tape to the cut surface and pull it at a 60° angle to check whether the insulating heat dissipation coating layer is peeling off. The evaluation criteria were evaluated according to ISO 2409. (5B: 0%, 4B: 5% or less, 3B: 5~15%, 2B: 15~35%, 1B: 35~65%, 0B: 65% or more)

6. Surface quality evaluation

To check the surface quality of the heat dissipation unit, the surface was touched with the hand to check whether it felt uneven or rough. 5 if there is a smooth feeling, 4 if the area of the rough feeling area is less than 2% of the total external surface area of the heat dissipation unit, 3 if the area is more than 2% but less than 5%, 3 if the area is more than 5% but less than 10% of the total area of the external surface of the heat dissipation unit. 2, if the area is more than 10% and less than 20%, it is expressed as 1, and if the area is more than 20%, it is expressed as 0.

division Example
One Example
2 Example
3 Example
4 Example
5 Example
6 Example
7 Coating layer forming ingredients Topic Resin
(Weight average molecular weight) 2000 2000 2000 310 570 3900 4650 Hardener content
(part by weight) 60 60 60 60 60 60 60 Weight ratio of first hardener and second hardener 1:1 1:1 1:1 1:1 1:1 1:1 1:1 Insulating heat dissipation filler content
(part by weight) 47 35 60 47 47 47 47 Average particle diameter (㎛) 5 5 5 5 5 5 5 D50, D97 ratio 1:1.6 1:1.6 1:1.6 1:1.6 1:1.6 1:1.6 1:1.6 Heat dissipation unit Insulating heat dissipation coating layer thickness (㎛) 25 25 25 25 25 25 25 Thermal conductivity (%) 18.27 17.65 18.34 16.91 17.02 17.13 16.54 Heat radiation efficiency (%) 90 81 96 86 88 88 87 Heating temperature error (%) 0.5 0.6 0.4 0.3 0.4 0.9 4.1 adhesiveness 5B 5B 5B 0B 4B 5B 5B durability ○ ○ ○ × ○ ○ ○ surface quality 5 5 5 5 5 5 5

division Example
8 Example
9 Example
10 Example
11 Example
12 Example
13 Example
14 Coating layer forming ingredients Topic Resin
(Weight average molecular weight) 2000 2000 2000 2000 2000 2000 2000 Hardener content
(part by weight) 15 30 95 110 60 60 60 Weight ratio of first hardener and second hardener 1:1 1:1 1:1 1:1 1:0.2 1:0.6 1:1.4 Insulating heat dissipation filler content
(part by weight) 47 47 47 47 47 47 47 Average particle diameter (㎛) 5 5 5 5 5 5 5 D50, D97 ratio 1:1.6 1:1.6 1:1.6 1:1.6 1:1.6 1:1.6 1:1.6 Heat dissipation unit Insulating heat dissipation coating layer thickness (㎛) 25 25 25 25 25 25 25 Thermal conductivity (%) 16.22 17.39 17.12 14.59 16.94 17.72 17.63 Heat radiation efficiency (%) 88 88 87 87 86 88 89 Heating temperature error (%) 0.5 0.5 0.5 0.5 0.4 0.5 0.5 adhesiveness 0B 4B 4B 2B 0B 5B 5B durability × ○ ○ × × ○ ○ surface quality 2 5 5 One 5 5 5

division Example
15 Example
16 Example
17 Example
18 Example
19 Example
20 Example
21 Coating layer forming ingredients Topic Resin
(Weight average molecular weight) 2000 2000 2000 2000 2000 2000 2000 Hardener content
(part by weight) 60 60 60 60 60 60 60 Weight ratio of first hardener and second hardener 1:2 1:1 1:1 1:1 1:1 1:1 1:1 Insulating heat dissipation filler content
(part by weight) 47 47 47 47 47 47 47 Average particle diameter (㎛) 5 0.005 0.42 10 20 3 5 D50, D97 ratio 1:1.6 1:2.41 1:2.08 1:1.51 1:1.93 1:3.08 1:4.96 Heat dissipation unit Insulating heat dissipation coating layer thickness (㎛) 25 25 25 25 25 25 25 Thermal conductivity (%) 17.01 12.11 17.63 17.92 17.19 17.88 18.31 Heat radiation efficiency (%) 88 7 88 91 90 81 39 Heating temperature error (%) 0.5 0.5 0.5 0.4 2.8 0.8 3.9 adhesiveness 2B 3B 5B 5B 3B 4B 2B durability × ○ ○ ○ ○ ○ ○ surface quality 5 5 5 4 0 4 3

division Comparative Example 1 Comparative example 2 Comparative Example 3 ^{1 )} Coating layer forming ingredients Topic Resin
(Weight average molecular weight) 2000 2000 2000 Hardener content (parts by weight) 60 60 60 Weight ratio of first hardener and second hardener 1:1 1:1 1:1 Insulating heat dissipation filler Content (parts by weight) 15 80 - Average particle diameter (㎛) 5 5 - D50, D97 ratio 1:1.6 1:1.6 - Heat dissipation unit Insulating heat dissipation coating layer thickness (㎛) 25 25 25 Thermal conductivity (%) 14.62 18.36 4.76 Heat radiation efficiency (%) 8 98 2 Heating temperature error (%) 5.3 1.0 0 adhesiveness 5B 3B 5B durability ○ × ○ surface quality 5 One 5 1) Comparative Example 3 represents a composition that does not contain a heat dissipation filler.

As can be seen from Tables 1 to 4 above,

It was confirmed that Examples 1, 5, and 6, where the weight average molecular weight of the main resin is within the preferred range of the present invention, achieved uniformity in adhesiveness, durability, and heat dissipation performance at the same time compared to Examples 4 and 7, which did not satisfy this. You can.

In addition, it can be confirmed that Examples 1, 9, and 10, where the content of the curing agent is within the preferred range of the present invention, achieves thermal conductivity, durability, and adhesiveness simultaneously compared to Examples 8 and 11, which do not satisfy this content.

In addition, it was confirmed that Examples 1, 13, and 14, in which the weight ratio of the first and second curing agents were within the preferred range of the present invention, achieved both adhesion and durability compared to Examples 12 and 15, which did not satisfy this ratio. You can.

In addition, it was confirmed that Examples 1, 17, and 18, in which the average particle diameter of the insulating heat dissipation filler was within the preferred range of the present invention, achieved heat radiation efficiency, thermal conductivity, and surface quality simultaneously compared to Examples 16 and 19, which did not satisfy this. You can.

In addition, it can be confirmed that Examples 1 and 20, where the ratios of D50 and D97 are within the preferred range of the present invention, achieve dispersibility, surface quality, heat radiation efficiency, and adhesion at the same time compared to Example 21, which does not satisfy this ratio. .

In addition, it can be confirmed that Examples 1, 2, and 3, in which the content of heat dissipation filler is within the preferred range of the present invention, are significantly superior in heat dissipation performance and surface quality at the same time compared to Comparative Examples 1 and 2, which do not satisfy this content.

In addition, it can be confirmed that Comparative Example 3, which does not contain a heat dissipation filler, has significantly lower thermal radiation compared to Example 1.

<Experimental Example 2>

Among the manufactured heat dissipation units, the relative gain of thermal conductivity was evaluated for the heat dissipation unit manufactured using the composition of Example 1 (Preparation Example 1) and the heat dissipating unit manufactured using the composition of Comparative Example 3 (Comparative Preparation Example 3). . Specifically, thermal conductivity was measured using the Steady State Heat Flow Method, and the relative gain of thermal conductivity was evaluated according to Equation 2 below. This is shown in Table 5 below.

[Equation 2]

division Manufacturing Example 1 Comparative Manufacturing Example 3 Thermal conductivity (W/m·K) 0.58 0.12 Relative gain of thermal conductivity (%) 383.3

As can be seen in Table 5 above, Preparation Example 1 manufactured including the insulating heat dissipation filler according to the present invention has a much higher thermal conductivity than Comparative Preparation Example 3 without it, and thus can exhibit excellent heat dissipation performance. You can see that

<Experimental Example 3>

Among the manufactured heat dissipation units, a heat dissipation unit manufactured using the composition of Example 1, Example 2, and Example 3 (Preparation Example 1, Preparation Example 2, and Preparation Example 3) and a heat dissipation unit manufactured using the composition of Comparative Example 2 ( For Comparative Manufacturing Example 2), the resistance value of the insulating heat dissipation unit was measured. Specifically, the resistance values were measured using the four-terminal method and are shown in Table 6 below.

division Manufacturing example 1 Manufacturing example 2 Manufacturing example 3 Comparative Manufacturing Example 2 Resistance value (Ω/sq.) 1.3×10 ¹² 7.1×10 ¹³ 9.7×10 ¹⁰ 7.1×10 ⁹

As can be seen in Table 6, Preparation Examples 1 to 3 according to the present invention show significantly higher resistance values than Comparative Preparation Example 2, which contains an insulating heat dissipation filler in excess of the content of the present invention, and thus have excellent insulation performance. It can be seen that it can be expressed.

Although an embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiment presented in the present specification, and those skilled in the art who understand the spirit of the present invention can add components within the scope of the same spirit. , other embodiments can be easily proposed by change, deletion, addition, etc., but this will also be said to be within the scope of the present invention.

10a, 11a: base material 10b, 11b: insulating heat dissipation coating layer
11c: Functional layer 100, 100': Insulating heat dissipation unit

Claims (16)

A main resin, 25 to 100 parts by weight based on 100 parts by weight of the main resin, a first curing agent containing an aliphatic polyamine-based curing agent, and one selected from the group consisting of an aromatic polyamine-based curing agent, an acid anhydride-based curing agent, and a catalyst-based curing agent. A coating layer forming component containing a curing agent containing at least one second curing agent at a weight ratio of 1:0.5 to 1.5; and
An insulating heat dissipating coating composition comprising an insulating heat dissipating filler included in an amount of 25 to 70 parts by weight based on 100 parts by weight of the main resin. According to paragraph 1,
The main resin is an insulating heat dissipating coating composition comprising a compound represented by the following formula (1):
[Formula 1]

R ¹ and R ² are each independently a hydrogen atom, a C1 to C5 linear alkyl group, or a C3 to C5 branched alkyl group, and R ³ and R ⁴ are each independently a hydrogen atom, a C1 to C5 linear alkyl group. Or it is a C3 to C5 pulverized alkyl group, and n is a rational number such that the weight average molecular weight of the compound represented by Formula 1 is 400 to 4000. delete According to paragraph 1,
The aliphatic polyamine-based curing agent is an insulating heat dissipating coating composition containing polyethylene polyamine. Heat dissipation member or support member; and
An insulating heat dissipation unit comprising an insulating heat dissipation coating layer in which the insulating heat dissipation coating composition according to any one of claims 1, 2, and 4 is treated and hardened on at least a portion of an outer surface of the heat dissipation member or the support member. According to clause 5,
The insulating heat dissipation coating layer is an insulating heat dissipation unit whose relative gain in thermal conductivity exceeds 200% according to Equation 2 below:
[Equation 2]
According to clause 5,
An insulating heat dissipation unit wherein the insulating heat dissipation coating layer has a thickness of 15 to 50㎛. According to clause 5,
The insulating heat dissipation unit is an insulating heat dissipation unit with a resistance value per unit area of 10 ¹⁰ to 10 ¹⁴ Ω/sq. A circuit board on which devices are mounted; and
An insulating heat dissipation circuit board comprising an insulating heat dissipation coating layer in which the insulating heat dissipation coating composition according to any one of claims 1, 2, and 4 is treated and hardened on at least a portion of the outer surface of the circuit board. An insulating heat dissipating component for lighting comprising an insulating heat dissipating coating layer cured by treating at least a portion of the outer surface with the insulating heat dissipating coating composition according to any one of claims 1 to 4. delete delete delete delete delete delete