KR20200122728A - Apparatus for processing film - Google Patents

Abstract

The present invention relates to a film processing device which comprises: a controller; a transfer unit transferring a multilayer film connector formed by connecting a first multilayer film and a second multilayer film using a connecting member fixed over one end of the first multilayer film and one end of the second multilayer film facing one end of the first multilayer film along a predetermined transfer direction; and a bubble removing unit configured to form a bubble removing pattern for guiding bubbles penetrating inside the multilayer film connector to the outside by emitting a laser beam to a predetermined bubble removing area of the multilayer film connector. Accordingly, the quality of products manufactured using multilayer films and multilayer films can be improved.

Description

Film processing equipment {APPARATUS FOR PROCESSING FILM}

The present invention relates to a film processing apparatus.

In general, optical films, polarizing films, and other various films are roll-to-roll in which various processing processes are performed on the supplied film by unwinding it from a supply roll, and then wound on a recovery roll for recovery. Can be processed continuously through.

In order to continuously process the film through such a roll-to-roll method, the connection state of the film must be maintained between the supply roll and the recovery roll. To this end, when the film (hereinafter referred to as'used film') that has been previously wound on any one supply roll that is currently being supplied with the film is exhausted, By attaching the tape over the tip of the wound film (hereinafter referred to as “atmospheric film”), the used film and the atmospheric film can be connected with a tape. Through this, it is possible to maintain the connection state of the film between the supply roll and the recovery roll by replacing the supply target film with the standby film from the used film.

However, in the case where the use film and the atmosphere film described above are multilayer films including a plurality of film layers, in the process of attaching the tape across the rear end of the use film and the front end of the atmosphere film, Bubbles may penetrate into the interface between the film layers exposed through the film. The air bubbles thus penetrated are gradually moved toward a point separated from the rear end of the used film and the front end of the atmosphere film through the interface between the film layers. Therefore, conventionally, defects are frequently caused by air bubbles penetrating the interface between the film layers in the process of attaching the tape, so that the multilayer film processed through the roll-to-roll method and the quality of the product manufactured using the multilayer film are poor. There was an aggravating problem.

The present invention is to solve the problems of the prior art described above, in the process of connecting multilayer films, a film processing apparatus having an improved structure to discharge and remove air bubbles penetrating the interface between the film layers to the outside. It has its purpose to provide.

Further, an object of the present invention is to provide a film processing apparatus having an improved structure so as to minimize scrap of a multilayer film generated in the process of removing air bubbles.

Film processing apparatus according to a preferred embodiment of the present invention, the controller; A multilayer film connector formed by connecting the first multilayer film and the second multilayer film by a connecting member fixed over one end of the first multilayer film and one end of the second multilayer film opposite to one end of the first multilayer film A transfer unit that transfers the material along a predetermined transfer direction; And a bubble removing unit that irradiates a laser beam to a predetermined bubble removing area of the multilayer film connector to form a bubble removing pattern for guiding bubbles penetrating into the interior of the multilayer film connector to the outside.

Preferably, the bubble removing unit includes a laser scanner capable of changing the optical path of the laser beam in the transport direction and in a direction perpendicular to the transport direction, and the controller, wherein the optical path of the laser beam is connected to the multilayer film By controlling the laser scanner so as to be selectively adjusted according to the conveying state of the sieve, the bubble removing pattern is formed to extend in the vertical direction.

Preferably, the connecting member is a tape attached over the rear end of the first multilayer film and the line of the second multilayer film.

Preferably, it further comprises a detection unit for detecting the tape, the controller, based on the tape detection signal transmitted from the detection unit specifies the attachment position of the tape.

Preferably, a first bubble removing region spaced apart from the rear end of the first multilayer film by a first reference distance predetermined in the transport direction; And a second bubble removing area spaced apart from the front end of the second multilayer film by a predetermined second reference distance in a direction opposite to the conveying direction, wherein the controller comprises the first bubble removing area based on the attachment position of the tape. The position of and the position of the second bubble removal region are specified.

Preferably, the bubble removing pattern includes a bubble removing groove formed by selectively laser cutting the bubble removing region of some of the film layers among the plurality of film layers included in the multilayer film connector by the laser beam. .

Preferably, the first multilayer film and the second multilayer film each include at least a base film layer, an adhesive film layer laminated on the base film layer, and a protective film layer laminated on the adhesive film layer, wherein the air bubbles are removed The groove is formed by selectively laser cutting the protective film layer.

Preferably, the bubble removal pattern includes at least one bubble removal slit each of which the bubble removal region is laser cut by a predetermined reference length by the laser beam, and is respectively perforated.

Preferably, the bubble removing slits are perforated at a predetermined first reference interval to form a dotted line.

Preferably, the bubble removing slits include: first bubble removing slits perforated along a predetermined first cutting line; And second bubble removing slits that are perforated along a second predetermined cutting line so as to be spaced apart from the first cutting line in a direction opposite to the transfer direction or the transfer direction.

Preferably, the first bubble removal slits and the second bubble removal slits are perforated so as to be staggered with each other by a predetermined second reference interval in a direction perpendicular to the transport direction.

Preferably, the first reference interval is smaller than the reference length, and the second reference interval is smaller than the reference length and larger than the first reference interval.

Film processing apparatus according to another preferred embodiment of the present invention for solving the above-described problem, the controller; A transport unit for transporting the multilayer film formed by stacking the protective film layer on the adhesive film layer laminated on the base film along a predetermined transport direction; And a bubble removing unit configured to form a bubble removing pattern for guiding bubbles penetrating into the interior of the multilayer film to the outside by irradiating a laser beam to a predetermined bubble removing area of the multilayer film.

Preferably, the bubble removal region is determined to be spaced apart from a starting point of the protective film layer by a predetermined first reference distance.

Preferably, the bubble removing unit includes a laser scanner capable of changing an irradiation path of a laser beam in a direction perpendicular to the transfer direction and the transfer direction, and the controller, wherein the irradiation path of the laser beam transfers the multilayer film By controlling the laser scanner to be selectively adjusted according to a state, the bubble removing pattern is formed to extend in the vertical direction.

Preferably, the bubble removal pattern includes at least one bubble removal slit each of which the bubble removal region is laser cut by a predetermined reference length by the laser beam, and is respectively perforated.

Preferably, the bubble removing slits are perforated at a predetermined first reference interval to form a dotted line.

Preferably, the bubble removing slits include: first bubble removing slits which are perforated along a first cutting plan line spaced apart from a stacking start point of the protective film layer by a predetermined second reference distance; And second bubble removing slits that are perforated along a second predetermined cutting line that is spaced apart from the first predetermined cutting line by a predetermined third reference distance.

Preferably, the first bubble removal slits and the second bubble removal slits are perforated so as to be staggered with each other by a predetermined second reference interval in a direction perpendicular to the transport direction.

Preferably, the first reference interval is smaller than the reference length, and the second reference interval is smaller than the reference length and larger than the first reference interval.

Preferably, the protective film layer further comprises a lamination unit that sequentially adheres and laminates the protective film layer from the lamination start point to the lamination end point of the protective film layer along the transport direction, and the first cut line is, It is determined to be spaced apart from the stacking start point by the second reference distance in a direction opposite to the transfer direction, and the second cutting scheduled line is spaced apart from the first cutting scheduled line by the third reference distance in a direction opposite to the transfer direction It is decided as much as possible.

The present invention relates to a film processing apparatus, and has the following effects.

First, the present invention forms a bubble removal pattern that can be removed by selectively laser cutting a predetermined bubble removal area of a multilayer film using a laser beam to guide bubbles that have penetrated into the interior of the multilayer film to the outside. It is possible to improve the quality of a multilayer film and a product manufactured using the multilayer film by preventing defects in the film.

Second, the present invention uses a laser beam to perforate the bubble removal slits in a dotted line shape in a predetermined bubble removal area of the multilayer film, so that not only bubbles penetrated into the interface between the protective film layer and the adhesive film layer, but also between other film layers. Since air bubbles that have penetrated the interface can be guided to the outside and removed, it is possible to further improve the quality of products manufactured using multi-layer films and multi-layer films by preventing the occurrence of defects in the multi-layer film by air bubbles. have.

Third, in the present invention, the bubble removal slits are perforated to form two rows, but the bubble removal slits of different rows are perforated to be staggered with each other in the direction perpendicular to the transport direction of the multilayer films, thereby allowing air bubbles through the gap between the bubble removal slits. It can effectively prevent the diffusion of the multilayer film and further improve the quality of the product manufactured using the multilayer film.

1 is a conceptual diagram showing a schematic configuration of a film processing apparatus according to a preferred embodiment of the present invention.
2 is a cross-sectional view showing a multilayer structure of multilayer films.
3 is a plan view of a multilayer film connector showing a state in which the multilayer films are connected by a tape.
4 is a plan view showing a bubble removing unit.
5 is a perspective view showing a galvano mirror of the bubble removing unit.
6 is a plan view of a multilayer film connector showing a state in which a bubble removing groove is concave formed.
7 is a cross-sectional view of a multilayer film connector showing a state in which a bubble removing groove is concave formed.
8 is a plan view of a multilayer film connector showing a state in which a bubble removing slit is perforated.
9 is a cross-sectional view of a multilayer film connector showing a state in which a bubble removing slit is perforated.
10 is a flow chart for explaining a film processing method using a film processing apparatus according to a preferred embodiment of the present invention.
11 is a conceptual diagram showing a schematic configuration of a film processing apparatus according to another preferred embodiment of the present invention.
12 is a cross-sectional view showing a multilayer structure of multilayer films.
13 is a plan view of a multilayer film showing a state in which a bubble removing slit is formed.
14 is a cross-sectional view of a multilayer film showing a state in which a bubble removing slit is formed.
15 is a flow chart for explaining a film processing method using a film processing apparatus according to another preferred embodiment of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail through exemplary drawings. In adding reference numerals to elements of each drawing, it should be noted that the same elements are assigned the same numerals as possible even if they are indicated on different drawings. In addition, in describing an embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function obstructs an understanding of the embodiment of the present invention, a detailed description thereof will be omitted.

In describing the constituent elements of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish the component from other components, and the nature, order, or order of the component is not limited by the term. In addition, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in this application. Does not.

1 is a conceptual diagram showing a schematic configuration of a film processing apparatus according to a preferred embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a multilayer structure of a multilayer film.

Referring to FIG. 1, a film processing apparatus 1 according to a preferred embodiment of the present invention includes a controller (not shown) that controls various components included in the film processing apparatus 1, and a first multilayer film 10 ) Supplying the first supply roll 110, the second supply roll 120 supplying the second multilayer film 20, and the first multilayer film 10 and the second multilayer film 20 A connection unit 140 for forming a multilayer film connector 30 by connecting the transfer unit 130 and the first multilayer film 10 and the second multilayer film 20 using a connection member (not shown), A recovery roll 150 for recovering the multilayer films 10 and 20 and the multilayer film connector 30, a detection unit 160 for detecting a connection member, and air bubbles penetrated into the multilayer film connector 30 ( It may include a bubble removing unit 170 to remove B).

The kind of the multilayer films 10 and 20 that can be processed using such a film processing apparatus 1 is not particularly limited. For example, as shown in FIG. 2, the first multilayer film 10 and the second multilayer film 20 are each of the base film layers 12 and 22 and one surface of the base film layers 12 and 22. A first adhesive film layer (14, 24) laminated on, a second adhesive film layer (16, 26) laminated on the other surface of the base film layer (12, 22), and a first adhesive film layer (14, 24) It may be an optical film including the protective film layers 18 and 28 laminated on the.

In this case, the base film layers 12 and 22 may be a TAC film layer composed of triacetyl cellulose (TAC). In addition, the first adhesive film layers 14 and 24 and the second adhesive film layers 16 and 26 may be formed of a pressure sensitive adhesive (PSA). These first adhesive film layers 14 and 24 and the second adhesive film layers 16 and 26 may be laminated by applying a pressure-sensitive adhesive to both surfaces of the base film layers 12 and 22, respectively. In addition, the protective film layers 18 and 28 may include at least one of polyethylene terephthalate (PET) and polyethylene (PE). These protective film layers 18 and 28 may be laminated by adhering to the first adhesive film layers 14 and 24.

In the following, as above, the multilayer films 10 and 20 are each of the base film layers 12 and 22, the first adhesive film layers 14 and 24 and the second adhesive film layers 16 and 26, respectively, and the protection The present invention will be described by taking a case of having a multilayer structure including the film layers 18 and 28 as an example.

First, the first supply roll 110 is a member for supplying the first multilayer film 10. The first multilayer film 10 formed by stacking the film layers 12, 14, 16, 18 in advance on the first supply roll 110 is pre-wound in a roll state, and the first supply roll 110 1 The multilayer film 10 can be unwound and supplied.

Next, the second supply roll 120 is a member for supplying the second multilayer film 20. A second multilayer film 20 formed by pre-stacking film layers 22, 24, 26, 28 on the second supply roll 120 is pre-wound in a roll state, and the second supply roll 120 2 The multilayer film 20 can be unwound and supplied.

Next, the transfer unit 130 is a member for transferring the multilayer films 10 and 20 or the multilayer film connector 30 to be described later along a predetermined transfer direction. The transfer unit 130 includes a section between the first supply roll 110 and the connection unit 140, a section between the second supply roll 120 and the connection unit 140, the connection unit 140 and the recovery roll 150 It may be provided with a plurality of transfer rollers 132 that are respectively sequentially installed in the interval. These transfer rollers 132, a drive roller axially coupled to a drive motor, a driven roller provided to be freely rotatable, and a tension can be applied to the multilayer films 10, 20 and the multilayer film connector 30 It may be a dancing roller or the like. These transfer rollers 132 may transfer the multilayer films 10 and 20 or the multilayer film connector 30 to the recovery roll 150 along a predetermined transfer direction in a taut state. The transport direction of the multilayer films 10 and 20 or the multilayer film connector 30 is preferably a longitudinal direction of the multilayer films 10 and 20 or the multilayer film connector 30, but is not limited thereto.

3 is a plan view of a multilayer film connector showing a state in which the multilayer films are connected by a tape.

Next, the connection unit 140 fixes the connection member over one end of the first multilayer film 10 and one end of the second multilayer film 20 opposite to the one end of the first multilayer film 10, It is a member for connecting the films 10 and 20 to each other.

For example, the connection unit 140 fixes the connection member over the rear end 10a of the first multilayer film 10 currently being supplied and the front end of the second multilayer film 20 currently waiting to be supplied, The 1 multilayer film 10 and the second multilayer film 20 may be provided to be connected.

The type of the connecting member is not particularly limited. For example, as shown in FIG. 3, the connection member may be a tape 40. In this case, the connection unit 140 is a trimming member (not shown) that trims the rear end 10a of the first multilayer film 10 and the front end 20a of the second multilayer film 20 in a state suitable for connection Wow, a tape attachment member (not shown) for attaching the tape 40 over the rear end 10a of the first multilayer film 10 and the front end 20a of the second multilayer film 20 may be provided. In particular, as shown in FIG. 3, the tape attachment member includes an outer surface of the rear end of the protective film layer 18 included in the first multilayer film 10 and a protective film layer included in the second multilayer film 20 ( The first multilayer film 10 and the second multilayer film 20 may be connected by attaching the tape 40 over the outer surface of the tip of 28). Since the connection unit 140 has the same structure as the conventional connection unit 140 used to connect the films, a more detailed description thereof will be described.

The connection unit 140 forms a multilayer film connector 30 in which the remaining first multilayer film 10 and the second multilayer film 20 are integrally connected, so that the supply target film is transferred to the first multilayer film 10. It can be replaced with the second multilayer film 20 in.

According to the connection unit 140, a processing process for the first multilayer film 10 and the second multilayer film 20 may be performed in the following order. Prior to the formation of the multilayer film connector 30, the connection state is maintained between the first supply roll 110 and the recovery roll 150 by the first multilayer film 10, so that the first multilayer film is formed through a roll-to-roll method. The film 10 can be processed. After the multilayer film connector 30 is formed, the connection state is maintained between the second supply roll 120 and the recovery roll 150 by the multilayer film connector 30, thereby The 1 multilayer film 10 and the second multilayer film 20 can be processed. After the remaining first multilayer film 10 included in the multilayer film connector 30 is exhausted, the second multilayer film 20 is connected between the second supply roll 120 and the recovery roll 150 by the second multilayer film 20 Is maintained, it is possible to process the second multilayer film 20 through a roll-to-roll method.

Next, the recovery roll 150 is a member for recovering the multilayer films 10 and 20 and the multilayer film connector 30. To this end, the recovery roll 150 may roll up the multilayer films 10 and 20 and the multilayer film connector 30 and collect them in a roll state. For example, the recovery roll 150 can be recovered by winding the first multilayer film 10 when the first supply roll 110 and the recovery roll 150 are connected by the first multilayer film 10. In the case where the second supply roll 120 and the recovery roll 150 are connected by the multilayer film connector 30, the multilayer film connector 30 can be wound and recovered, and the second multilayer film 20 When the second supply roll 120 and the recovery roll 150 are connected to each other, the second multilayer film 20 may be wound and recovered.

Next, the sensing unit 160 is a member for sensing the connection member. For example, when the connecting member is the tape 40, the detection unit 160 may be provided to detect the tape 40. In this case, the sensing unit 160 is preferably provided to detect the tape 40 using an infrared signal, but is not limited thereto. Since the sensing unit 160 has the same structure as the sensing unit 160 that is commonly used to detect the tape 40, a more detailed description thereof will be omitted.

The controller, based on the tape detection signal transmitted from the detection unit 160, the attachment position of the tape 40, that is, the position of the rear end 10a of the first multilayer film 10 and the position of the second multilayer film 20. The position of the tip 20a can be specified.

4 is a plan view showing a bubble removing unit, FIG. 5 is a perspective view showing a galvanomirror of the bubble removing unit, FIG. 6 is a plan view of a multilayer film connector showing a state in which the bubble removing groove is concave formed, and FIG. 7 is a bubble It is a cross-sectional view of a multilayer film connector showing a state in which a removal groove is concave formed.

Next, the bubble removing unit 170, the film layers exposed through the front end 20a of the first multilayer film 10 and the rear end 10a and the second multilayer film 20 in the process of attaching the tape 40 (12, 14, 16, 18, 22, 24, 26, 28) is a member for removing the air bubbles (B) penetrated into the interior of the multilayer film connector 30 through the interface.

Such a bubble removing unit 170, by laser cutting a predetermined bubble removing area (A) of the multilayer film connector 30 using a laser beam (LB), bubbles penetrated into the interior of the multilayer film connector 30 It may be provided to form a bubble removing pattern 50 to guide (B) to the outside.

The position of the bubble removal region A is not particularly limited. For example, as shown in FIG. 4, the bubble removal region A is a first reference distance predetermined in the transport direction of the multilayer film connector 30 from the rear end 10a of the first multilayer film 10 The first bubble removal region A1 determined on the first multilayer film 10 so as to be spaced apart by (D1), and the transport direction of the multilayer film connector 30 from the tip 20a of the second multilayer film 20 A second bubble removal region A2 determined on the second multilayer film 20 may be included to be spaced apart by a predetermined second reference distance D2 in the opposite direction. The first reference distance (D1) and the second reference distance (D2) are not particularly limited, and are preferably determined in consideration of environmental conditions such as the moving speed of the air bubbles (B) penetrating the interior of the multilayer film connector 30 Do.

The structure of the bubble removing unit 170 is not particularly limited. For example, as shown in FIG. 4, the bubble removal unit 170 removes bubbles from a laser oscillator 171 that generates and oscillates a laser beam LB, and a laser beam LB oscillated from the laser oscillator. A laser scanner 173 that irradiates the region A, and a driver 175 for reciprocating the laser scanner 173 in the width direction of the multilayer film connector 30 may be provided.

The laser oscillator 171 is provided to generate a laser beam LB having a predetermined wavelength to enable laser cutting of the multilayer film connector 30 to enable oscillation. In this way, the laser beam LB oscillated from the laser oscillator 171 is switched to the laser scanner 173 by at least one reflective mirror R installed between the laser oscillator 171 and the laser scanner 173. Can be delivered.

The laser scanner 173 is coupled to the driver 175 so that it can be reciprocated in the width direction of the multilayer film connector 30 by the driver 175.

The laser scanner 173 is provided to be able to change the optical path of the laser beam LB according to the transport speed of the multilayer film connector 30 and other transport states of the multilayer film connector 30. To this end, as shown in FIG. 5, the laser scanner 173 is driven by an X-axis servo motor 177b, and the optical path of the laser beam LB is in the transport direction of the multilayer film connector 30. It is driven by the X-axis mirror 177a, which can be changed in the vertical direction, that is, the width direction of the multilayer film connector 30, and the Y-axis servo motor 177c, and connects the optical path of the laser beam LB to the multilayer film connector. A galvano mirror 177 having a Y-axis mirror 177d that can be changed in the transport direction of 30, that is, in the longitudinal direction of the multilayer film connector 30, may be provided.

In addition, the laser scanner 173 may further include a lens 179 capable of condensing the laser beam LB whose optical path is changed by the galvano mirror 177 and irradiating the bubble removal region A. The lens 179 is preferably an f-theta (f-θ) lens, but is not limited thereto.

Such a laser scanner 173 irradiates the laser beam LB transmitted from the laser oscillator 171 to the bubble removal regions A to laser transmit the bubble removal regions A, thereby attaching the tape 40 In the process and in the process of laminating the multilayer films 10 and 20, a bubble removing pattern 50 for guiding and removing the bubbles B penetrated into the interior of the multilayer film connector 30 may be formed.

By the way, the bubble removing area (A) should be discarded as scrap that is difficult to use in manufacturing a product. Therefore, in order to minimize the area of the bubble removing area (A), the bubble removing pattern 50 is formed in the vertical direction of the transport direction of the multilayer film connector 30, that is, in the width direction of the multilayer film connector 30 It is desirable.

To this end, as shown in Figure 6, the controller, the laser scanner so that the optical path of the laser beam (LB) to the bubble removal regions (A) is selectively adjusted according to the transport state of the multilayer film connector 30 By controlling 173, the bubble removing pattern 50 can be formed to extend in the width direction of the multilayer film connector 30. That is, the controller controls the galvanomirror 177 so that the optical path of the laser beam LB is adjusted in the transport direction of the multilayer film connector 30 in accordance with the transfer speed of the multilayer film connector 30 to control the laser beam. By irradiating (LB) to the bubble removing regions (A) in the width direction of the multilayer film connector 30, the bubble removing pattern 50 can be formed to extend in the width direction of the multilayer film connector 30. Through this, by minimizing the amount of scrap generated due to the formation of the bubble removing pattern 50, it is possible to improve the productivity of the film processing apparatus 1.

In addition, the controller accurately identifies the position of the first bubble removal area A1 and the position of the second bubble removal area A2 based on the attachment position of the specific tape 40 using the above-described detection unit 160. In, the bubble removing region A may be formed by controlling the bubble removing unit 170.

The shape of the bubble removing pattern 50 is not particularly limited.

For example, in the bubble removing pattern 50, the bubble removing region A of some of the film layers included in the multilayer film connector 30 is selectively laser beamed by a laser beam LB. At least one bubble removal slit 54 which is cut and concave formed, and at least one bubble removal slit 54 that is respectively perforated by laser cutting the bubble removal region A of the multilayer film connector 30 by a predetermined reference length L ), etc. may be provided.

As shown in FIGS. 6 and 7, the bubble removing groove 52 extends in the width direction of the multilayer film connector 30 to the first bubble removing region A1 and the second bubble removing region A2, respectively. Doedoe, the protective film layers 18 and 28 may be selectively laser cut to form concave. In other words, the bubble removing groove 52 includes the first bubble removing region A1 and the second bubble removing region A2 so that only the protective film layers 18 and 28 are selectively laser cut. ) By half-cutting in the width direction to form a concave.

The length of the bubble removing groove 52 is not particularly limited. For example, as shown in FIG. 6, the bubble removing groove 52 may have the same length as the width of the multilayer film connector 30. In this case, the multilayer film connector 30 may be maintained in a connected state by other film layers 12, 14, 16, 22, 24, 26 in addition to the protective film layers 18 and 28.

In the process of attaching the tape 40, the air bubbles (B) are the protective film layer 18 exposed through the rear end 10a of the first multilayer film 10 and the front end 20a of the second multilayer film 20, 28) mainly penetrates into the interior of the multilayer film connector 30 through the interface between the first adhesive film layers 14 and 24. Accordingly, the air bubbles (B) penetrating into the interior of the multilayer film connector 30 are mainly located at the interface between the protective film layers 18 and 28 and the first adhesive film layers 14 and 24. Therefore, when the bubble removing groove 52 is formed, the bubble B moving along the interface between the protective film layers 18 and 28 and the first adhesive film layers 14 and 24 is removed from the bubble removing groove 52. Through the guide to the outside of the multi-layer film connector 30 can be removed. Accordingly, the bubble removing groove 52 prevents defects of the multilayer films 10 and 20 from being caused by the bubbles B, and thus the multilayer films 10 and 20 and the multilayer films 10 and 20 You can improve the quality of products manufactured by using.

In addition, FIG. 8 is a plan view of the multilayer film connector showing a state in which the bubble removing slit is perforated, and FIG. 9 is a cross-sectional view of the multilayer film connector showing a state in which the bubble removing slit is perforated.

As shown in FIGS. 8 and 9, the bubble removing slits 54 have a predetermined first reference interval G1 so as to form a dotted line in the first bubble removing area A1 and the second bubble removing area A2. ) Can be drilled. That is, the bubble removal slits 54 are formed of the entire film layers 12, 14, 16, 18, 22, 24 so that the first bubble removal region A1 and the second bubble removal region A2 penetrate in the thickness direction. , 26, 28) are laser-cut to perforate, but the multilayer film connector 30 is perforated in a dotted line with a first reference interval G1 to maintain the connected state.

The length of the bubble removing slits 54 is not particularly limited, and the bubble removing slits 54 may have a predetermined reference length L. As shown in FIG. 8, the reference length L is preferably larger than the first reference interval G1, but is not limited thereto.

In the process of attaching the tape 40, the air bubbles (B) are mainly formed into the interior of the multilayer film connector 30 through the interface between the protective film layers 18 and 28 and the first adhesive film layers 14 and 24. Mainly penetrates, but the same process conditions as in the case of additionally attaching the tape 40 even across the lower surface of the rear end 10a of the first multilayer film 10 and the lower surface of the front end 20a of the second multilayer film 20 In E, air bubbles (B) may penetrate through the interface between the other piling layers (12, 14, 16, 22, 24, 26). In this case, when only a portion of the film layer is laser cut through half-cutting to form the bubble removing groove 52, a portion of the bubble B is still remaining inside the multilayer film connector 30 and the multilayer films (10, 20) and multilayer films (10, 20) may deteriorate the quality of a product manufactured.

By the way, the bubble removal slits 54 are perforated so that the multilayer film connector 30 penetrates in the thickness direction, and the interface between the protective film layers 18 and 28 and the first adhesive film layers 14 and 24 In addition, air bubbles (B) penetrating into the interface between the other film layers 12, 14, 16, 22, 24, 26 can also be effectively guided to the outside of the multilayer film connector 30 and removed. Therefore, according to these bubble removing slits 54, by more effectively preventing defects of the multilayer films 10 and 20 caused by the bubbles B, the multilayer films 10 and 20 and the multilayer films The quality of products manufactured using (10, 20) can be further improved.

Meanwhile, as shown in FIG. 8, the bubble removing slits 54 are first bubble removing slits 54a that are perforated along a predetermined first cutting line E1 at a first reference interval G1. ), and a first reference interval along the second predetermined cutting line E2 so as to be spaced apart from the first line E1 in the transfer direction of the multilayer film connector 30 or in the opposite direction to the transfer direction. The second bubble removing slits 54b which are perforated with G1) may be provided.

In addition, as shown in FIG. 8, in the first bubble removal region A1, the first cut line E1 is from the rear end 10a of the first multilayer film 10 to the multilayer film connector 30. It is determined to be spaced apart by a predetermined third reference distance D3 in the transfer direction, and the second scheduled cutting line E2 is predetermined in the transfer direction of the multilayer film connector 30 compared to the first scheduled cutting line E1. It is preferable that it is determined to be separated by the fourth reference distance D4. Correspondingly, in the second bubble removal region A2, the second intended cutting line E2 is in a direction opposite to the transfer direction of the multilayer film connector 30 from the tip 20a of the second multilayer film 20. It is determined to be separated by a third reference distance D3, and the second scheduled cutting line E2 is a fourth reference distance in a direction opposite to the transport direction of the multilayer film connector 30 compared to the first scheduled cutting line E1. It is preferable that it is determined to be spaced apart by (D4).

In addition, as shown in FIG. 8, the first bubble removal slits 54a and the second bubble removal slits 54b are in the vertical direction of the transport direction of the multilayer film connector 30, that is, the multilayer film connector ( It may be perforated so as to be staggered with each other by a predetermined second reference interval G2 in the width direction of 30). When the first reference distance G1 is smaller than the reference length L, it is preferable that the second reference distance G2 is smaller than the reference length L and larger than the first reference distance G1. Then, as shown in FIG. 8, both ends of the first bubble removal slits 54a and both ends of the second bubble removal slits 54b overlap each other in the transport direction of the multilayer film connector 30. I can.

The bubble removing slit 54 is perforated to form a dotted line. If only one row of the bubble removing slits 54 is formed, the bubble B is formed through the gap between the bubble removing slits 54 to form the first multilayer film 10. ), there is a concern that it may be moved to a position far away from the rear end 10a of the second multilayer film 20 and the front end 20a of the second multilayer film 20. However, the first bubble removal slits 54a so that both ends of the first bubble removal slits 54a and both ends of the second bubble removal slit 54b overlap each other in the transport direction of the multilayer film connector 30 And the second bubble removing slits 54b, residual bubbles B that have not yet been removed by the first bubble removing slits 54a may be removed by the second bubble removing slits 54b. . Therefore, according to the first bubble removing slits 54a and the second bubble removing slits 54b, by more effectively preventing defects of the multilayer films 10 and 20 caused by the bubbles B, the multilayer The quality of a product manufactured by using the films 10 and 20 and the multilayer films 10 and 20 may be further improved.

Meanwhile, although it has been described that the bubble removing slits 50 are perforated to form two rows, it is not limited thereto. That is, three or more rows of bubble removing slits 50 may be perforated so that the bubble removing slits 50 located in different rows are alternately disposed in the vertical direction of the multilayer film connector 30.

10 is a flowchart illustrating a film processing method using a film processing apparatus according to a preferred embodiment of the present invention.

Hereinafter, a film processing method using the film processing apparatus 1 according to a preferred embodiment of the present invention will be described with reference to FIG. 10.

First, when the first multilayer film 10 that is currently being supplied is exhausted, the connection unit 140 includes the rear end 10a of the first multilayer film 10 and the front end of the second multilayer film 20 currently waiting for supply ( 20a) is connected with a tape 40 to form a multilayer film connector 30 (S 110). At this time, the transfer unit 130 stops transferring the multilayer films 10 and 20.

Next, the transfer unit 130 starts to transfer the multilayer film connector 30 in a predetermined transfer direction (S 120 ).

Thereafter, the detection unit 160 detects the tape 40 and transmits the tape detection signal to the controller. The controller specifies the attachment position of the tape 40, the position of the first bubble removal area A1, and the position of the second bubble removal area A2, respectively, based on the detection signal of the tape 40 (S130) .

Next, the bubble removal unit 170 is a bubble removal groove 52 in the first bubble removal area A1 and the second bubble removal area A2 based on the position specified by the detection unit 160, and bubble removal. By forming a bubble removing pattern 50 such as a slit 54, bubbles B penetrated into the inside of the multilayer film connector 30 are removed during the attaching process of the tape 40 (S 140).

Thereafter, the recovery roll 150 is recovered by winding the multilayer film connector 30 from which the air bubbles (B) have been removed (S 150).

Meanwhile, the film processing apparatus 1 according to a preferred embodiment of the present invention may further include a processing unit (not shown) for processing the multilayer films 10 and 20. The processing unit is preferably installed in the section between the bubble removing unit 170 and the recovery roll 150, but is not limited thereto. The type of processing unit is not particularly limited. For example, the processing unit may include a slitting machine for slitting the multilayer films 10 and 20 to have a predetermined width.

In addition, the film processing apparatus 10 according to a preferred embodiment of the present invention pre-laminates the film layers 12, 14, 16, 18, 22, 24, 26, 28 in a separate place to form multilayer films 10. , 20) has been described as an example, but is not limited thereto. That is, the film processing apparatus 10 according to a preferred embodiment of the present invention stacks a plurality of film layers 12, 14, 16, 18, 22, 24, 26, 28 to form multilayer films 10 and 20. It may be formed integrally with a film laminating device (not shown) to form. In this case, film stacking units (12, 14, 16, 18, 22, 24, 26, 28) are stacked to form the first multilayer film 10 and the second multilayer film 20 ( Not shown) may be installed instead of the aforementioned supply rolls 110 and 210 or may be installed upstream of the supply rolls 110 and 210.

11 is a conceptual diagram showing a schematic configuration of a film processing apparatus according to another preferred embodiment of the present invention, and FIG. 12 is a cross-sectional view showing a multilayer structure of multilayer films.

The film processing apparatus 2 according to another preferred embodiment of the present invention includes a first supply roll 210 for supplying the first multilayer film 60, and a second supply roll for supplying the protective film 68' ( 220), and a second multilayer film 60' to which a protective film layer 68 is added compared to the first multilayer film 60 by laminating the protective film 68' on the first multilayer film 60. The stacking unit 240, the transfer unit 230 for transferring the first multilayer film 60 and the second multilayer film 60', the recovery roll 250 for recovering the second multilayer film 60', and , A detection unit 260 that detects the protective film layer 68 of the second multilayer film 60 ′, and a bubble removal unit that removes air bubbles (B) penetrating into the inside of the second multilayer film 60 ′ ( 270) and the like.

The kind of the multilayer film which can be processed using such a film processing device 2 is not particularly limited. For example, as shown in FIG. 12(a), the first multilayer film 60 includes a base film layer 62 and a first adhesive film layer 64 laminated on one surface of the base film layer 62. ), and a second adhesive film layer 66 laminated on the other surface of the base film layer 62. For example, as shown in FIG. 12(b), the second multilayer film 60 ′ includes the protective film layer 68 laminated on the first adhesive film layer 64 on the first multilayer film 60. It may be an optical film having more than that.

First, the first supply roll 210 is a member for supplying the first multilayer film 60. A first multilayer film 60 formed by stacking film layers 62, 64, 66 on the first supply roll 210 is pre-wound in a roll state, and the first supply roll 210 is a first multilayer film. (60) can be unwound and supplied.

Next, the second supply roll 220 is a member for supplying the protective film 68'. The protective film 68 ′ is pre-wound on the second supply roll 220 in a roll state, and the second supply roll 220 may unwind and supply the protective film 68 ′.

Next, the transfer unit 230 is a member for transferring the multilayer films 60 and 60' along a predetermined transfer direction. The transfer unit 230 includes a section between the first supply roll 210 and the stacking unit 240, a section between the second supply roll 220 and the stacking unit 240, the stacking unit 240 and the collecting roll 250 A plurality of transfer rollers 232 which are sequentially installed in each section may be provided. The transfer rollers 232 may be a drive roller axially coupled to a drive motor, a driven roller provided to be freely rotatable, a dancing roller capable of applying tension to the multilayer films 60 and 60'. These transfer rollers 232 may transfer the multilayer films 60 and 60' along a predetermined transfer direction. The transport direction of the multilayer films 60 and 60 ′ is preferably a longitudinal direction of the multilayer films 60 and 60 ′, but is not limited thereto.

Next, the lamination unit 240 is a member for laminating the protective film 68 ′ on the first multilayer film 60. The lamination unit 240 may have a pair of lamination rollers 242 and 244 that can be laminated by adhering the protective film 68 ′ to the first adhesive film layer 64 of the first multilayer film 60. 11, the lamination rollers 242, 244 are protected by pressing the first multilayer film 60 and the protective film 68' vertically passing through the space between the lamination rollers 242, 244 It is installed so that the film 68 ′ can be adhered to the first adhesive film layer 64. According to such a lamination unit 240, the protective film 68 ′ may be sequentially stacked on the first adhesive film layer 64 along the transport direction from the lamination start point S of the protective film 68 ′ to the lamination end point. have. In this case, the lamination start point S may be the front end of the protective film 68 ′, and the lamination end point may be the rear end of the protective film 68 ′. Through this, as shown in FIG. 12, the stacking unit 240 further includes a protective film layer 68 composed of a protective film 68 ′ compared to the first multilayer film 60. ') can be formed.

Next, the sensing unit 260 is a member for sensing the starting point S of the protective film 68'. The structure of the sensing unit 260 is not particularly limited. For example, the sensing unit 260 may include a camera sensor (not shown) capable of photographing the second multilayer film 60 ′.

The controller may specify the position of the starting point S of the protective film 68 ′, that is, the position of the front end of the protective film 68 ′, based on the image signal transmitted from the sensing unit 260.

13 is a plan view of a multilayer film showing a state in which a bubble removing slit is formed, and FIG. 14 is a cross-sectional view of a multilayer film showing a state in which the bubble removing slit is formed.

Next, the bubble removing unit 270 is inside of the second multilayer film 60 ′ through the interface between the protective film layer 68 and the first adhesive film layer 64 in the adhesion process of the protective film 68 ′. It is a member for removing air bubbles (B) that have penetrated into.

Such a bubble removing unit 270, by laser cutting a predetermined bubble removing region A of the second multilayer film 60 ′ using a laser beam, the bubbles penetrated into the inside of the second multilayer film 60 ′ ( It may be provided so as to be able to form a bubble removing pattern 50 to guide and remove B) to the outside.

The position of the bubble removal region A is not particularly limited. For example, as shown in FIG. 13, the bubble removal region A is predetermined in a direction opposite to the transfer direction of the second multilayer film 60 ′ from the lamination start point S of the protective film layer 68 It may be determined to be spaced apart by the first reference distance D1. In the process of the protective film layer 68, air bubbles (B) are formed through the interface between the protective film layer 68 and the first adhesive film layer 64 exposed through the starting point S of the protective film layer 68. Since it mainly penetrates, the bubble removal region A is determined to be located in a direction opposite to the transfer direction of the second multilayer film 60 ′ from the lamination start point S of the protective film layer 68. The first reference distance D1 is not particularly limited, and is preferably determined in consideration of environmental conditions such as a moving speed of the air bubbles B penetrating the inside of the second multilayer film 60'.

The structure of the bubble removing unit 270 is not particularly limited. For example, the bubble removal unit 270 includes a laser oscillator (not shown) that generates and oscillates a laser beam, and a laser scanner 273 that irradiates a laser beam oscillated from the laser oscillator to the bubble removal region A. , A driver (not shown) for reciprocating the laser scanner 273 in the width direction of the second multilayer film 60' may be provided. In addition, the laser scanner 273 changes the optical path of the laser beam to the vertical direction (width direction) of the transport direction (length direction) of the second multilayer film 60' and the transport direction of the second multilayer film 60'. A possible galvanomirror (not shown) and a lens (not shown) for condensing a laser beam whose optical path is changed by the galvanomirror and irradiating it to the bubble removal region A may be provided. Since the structure of the bubble removing unit 270 has the same structure as the bubble removing unit 170 of the film processing apparatus 1 described above, a more detailed description thereof will be omitted.

On the other hand, the controller controls the laser scanner 273 so that the optical path of the laser beam is selectively adjusted according to the transport state of the second multilayer film 60 ′, so that the bubble removing pattern 50 is applied to the second multilayer film 60. ') can be formed extending in the width direction. That is, the controller controls the galvanomirror so that the optical path of the laser beam is adjusted in the transport direction of the second multilayer film 60 ′ in accordance with the transport speed of the second multilayer film 60 ′ to remove the laser beam from the bubble removal region. By irradiating (A) in the width direction of the second multilayer film 60 ′, the bubble removing pattern 50 can be formed to extend in the width direction of the second multilayer film 60 ′. Through this, it is possible to improve the productivity of the film processing apparatus 2 by minimizing the amount of scrap generated by the formation of the bubble removing pattern 50.

In addition, the controller uses the above-described detection unit 260 to accurately determine the position of the bubble removal region A based on the position of the lamination start point S of the specific protective film layer 68, and the bubble removal unit ( The bubble removing region A may be formed by controlling 270.

The shape of the bubble removing pattern 50 is not particularly limited.

For example, the bubble removing pattern 50 is a protective film layer 68 among all the film layers 62, 64, 66, 68 included in the second multilayer film 60', and bubbles of some other film layers. The removal area (A) is selectively laser cut by a laser beam to form a concave bubble removal groove (not shown), and the bubble removal area (A) of the second multilayer film 60' is a predetermined reference length (L). It may be provided with at least one bubble removing slit 54 or the like, each of which is laser cut and perforated. Such a bubble removing pattern 50 can be formed using the same method as the method of forming the bubble removing pattern 50 described in the film processing apparatus 1 described above. Accordingly, the method of forming the bubble removing pattern 50 based on the method of forming the bubble removing slit 54 will be briefly described.

As shown in FIGS. 13 and 14, the bubble removal slits 54 may be perforated at a predetermined first reference interval G1 so as to form a dotted line in the bubble removal region A. That is, the bubble removal slits 54 are punched by laser cutting the entire film layers 62, 64, 66, 68 so that the bubble removal region A penetrates in the thickness direction, and the second multilayer film 60' ) To maintain the connection state of the first reference interval (G1) is to perforate in a dotted line shape.

The length of the bubble removing slits 54 is not particularly limited, and the bubble removing slits 54 may have a predetermined reference length L. As shown in FIG. 13, the reference length L is preferably larger than the first reference interval G1, but is not limited thereto.

These bubble removing slits 54 are spaced apart from the starting point S of the protective film layer 68 by a predetermined second reference distance D2 in a direction opposite to the transport direction of the second multilayer film 60 ′. The first bubble removing slits 54a perforated along the first scheduled cutting line E1 on the bubble removing area A, and the second multilayer film 60 ′ compared to the first scheduled cutting line E1 The second bubble removing slits 54b perforated along the second predetermined cutting line E2 on the bubble removing area A so as to be spaced apart by a predetermined third reference distance D3 in the opposite direction of the transport direction of Can be equipped.

The first bubble removal slits 54a and the second bubble removal slits 54b are predetermined in the vertical direction of the transport direction of the second multilayer film 60', that is, the width direction of the second multilayer film 60'. It may be perforated so as to be staggered with each other by the second reference interval G2. When the first reference distance G1 is smaller than the reference length L, it is preferable that the second reference distance G2 is smaller than the reference length L and larger than the first reference distance G1. Then, as shown in FIG. 13, both ends of the first bubble removal slits 54a and both ends of the second bubble removal slits 54b overlap each other in the transport direction of the second multilayer film 60'. Can be.

These air bubble removal slits 54 are air bubbles (B) penetrating into the inside of the second multilayer film 60' during the process of laminating the protective film layer 68 and other, the manufacturing process of the second multilayer film 60'. May be removed by guiding it to the outside of the second multilayer film 60 ′. Therefore, according to the bubble removing slits 54, by preventing defects of the second multilayer film 60 ′ from being caused by the bubbles B, the second multilayer film 60 ′ and the second multilayer film ( 60') can improve the quality of manufactured products.

15 is a flowchart illustrating a film processing method using the film processing apparatus 2 according to another preferred embodiment of the present invention.

Hereinafter, a film processing method using the film processing apparatus 2 according to another preferred embodiment of the present invention will be described with reference to FIG. 15.

First, in a state in which the first multilayer film 60 and the protective film 68 ′ are continuously conveyed in a predetermined conveying direction by the conveying unit 230, the lamination unit 240 provides the protective film 68 ′. 1 A second multilayer film 60 ′ is formed by laminating on the first adhesive film layer 64 of the multilayer film 60 (S210).

Thereafter, the sensing unit 260 detects the starting point S of the protective film layer 68 and transmits a protective film layer detection signal to the controller. The controller specifies the position of the starting point S of the protective film layer 68 and the position of the bubble removing region A, respectively, based on the protective film layer detection signal (S220).

Next, the bubble removal unit 270 forms a bubble removal pattern 50 such as a bubble removal groove and a bubble removal slit 54 in the bubble removal region A based on the position specified by the detection unit 260 Thus, in the process of laminating the protective film layer 68, air bubbles B that have penetrated into the inside of the second multilayer film 60' are removed (S230).

Thereafter, the recovery roll 250 winds and recovers the second multilayer film 60' from which the air bubbles B have been removed (S 240).

The above description is merely illustrative of the technical idea of the present invention, and those of ordinary skill in the art to which the present invention pertains will be able to make various modifications and variations without departing from the essential characteristics of the present invention.

Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

1, 2: film processing equipment
10: first multilayer film
20: second multilayer film
30: multilayer film connector
40: tape
50: bubble removal pattern
52: bubble removing groove
54: bubble removal slit
60: first multilayer film
60': second multilayer film
110: first supply roll
120: second supply roll
130: transfer unit
132: transfer roller
140: connection unit
150: recovery roll
160: detection unit
170: bubble removal unit
210: first supply roll
220: second supply roll
230: transfer unit
240: stacking unit
250: recovery roll
260: detection unit
270: bubble removal unit

Claims (21)

Controller;
A multilayer film connector formed by connecting the first multilayer film and the second multilayer film by a connecting member fixed over one end of the first multilayer film and one end of the second multilayer film opposite to one end of the first multilayer film A transfer unit that transfers the material along a predetermined transfer direction; And
A film processing apparatus comprising: a bubble removing unit configured to form a bubble removing pattern for guiding the air bubbles penetrating into the inside of the multilayer film connector to the outside by irradiating a laser beam to a predetermined bubble removing area of the multilayer film connector. . The method of claim 1,
The bubble removing unit includes a laser scanner capable of changing the optical path of the laser beam in a direction perpendicular to the transport direction and the transport direction,
The controller controls the laser scanner so that the optical path of the laser beam is selectively adjusted according to the transport state of the multilayer film connector, and the bubble removing pattern is extended in the vertical direction. Device. The method of claim 1,
The connecting member is a film processing apparatus, characterized in that the tape attached across the rear end of the first multilayer film and the line of the second multilayer film. The method of claim 3,
Further comprising a sensing unit for sensing the tape,
The controller, a film processing apparatus, characterized in that for specifying the attachment position of the tape based on the tape detection signal transmitted from the detection unit. The method of claim 4,
The bubble removal region,
A first bubble removal region spaced apart from a rear end of the first multilayer film by a first reference distance in the transfer direction; And
It has a second bubble removal region spaced apart from the front end of the second multilayer film by a predetermined second reference distance in a direction opposite to the transfer direction,
Wherein the controller specifies a position of the first bubble removing area and a position of the second bubble removing area based on a position where the tape is attached. The method of claim 1,
The bubble removing pattern includes a bubble removing groove formed by selectively laser cutting the bubble removing region of some of the film layers among the plurality of film layers included in the multilayer film connector. Film processing device. The method of claim 6,
Each of the first multilayer film and the second multilayer film includes at least a base film layer, an adhesive film layer laminated on the base film layer, and a protective film layer laminated on the adhesive film layer,
The bubble removing groove is a film processing apparatus, characterized in that the concave formed by selectively laser cutting the protective film layer. The method of claim 1,
The bubble removal pattern, wherein the bubble removal region is laser cut by a predetermined reference length by the laser beam, and includes at least one bubble removal slit, each perforated. The method of claim 8,
The bubble removing slits are perforated at a predetermined first reference interval to form a dotted line. The method of claim 9,
The bubble removing slits,
First bubble removing slits perforated along a predetermined first cutting line; And
A film processing apparatus comprising: second bubble removing slits perforated along a second predetermined cutting line so as to be spaced apart from the first cutting line in a direction opposite to the transfer direction or the transfer direction. The method of claim 10,
The film processing apparatus, characterized in that the first bubble removing slits and the second bubble removing slits are perforated so as to be staggered with each other by a predetermined second reference interval in a direction perpendicular to the transport direction. The method of claim 11,
The first reference interval is smaller than the reference length,
The second reference distance is smaller than the reference length and larger than the first reference distance. Controller;
A transport unit for transporting the multilayer film formed by stacking the protective film layer on the adhesive film layer laminated on the base film along a predetermined transport direction; And
A film processing apparatus comprising: a bubble removing unit configured to form a bubble removing pattern for guiding the bubbles penetrating inside the multilayer film to the outside by irradiating a laser beam to a predetermined bubble removing area of the multilayer film. The method of claim 13,
The film processing apparatus, wherein the bubble removal region is determined to be spaced apart by a predetermined first reference distance from a lamination start point of the protective film layer. The method of claim 13,
The bubble removing unit includes a laser scanner capable of changing an irradiation path of a laser beam in a direction perpendicular to the transfer direction and the transfer direction,
The controller, by controlling the laser scanner so that the irradiation path of the laser beam is selectively adjusted according to the transport state of the multilayer film, and forming the bubble removing pattern extending in the vertical direction. The method of claim 13,
The bubble removal pattern, wherein the bubble removal region is laser cut by a predetermined reference length by the laser beam, and includes at least one bubble removal slit, each perforated. The method of claim 16,
The bubble removing slits are perforated at a predetermined first reference interval to form a dotted line. The method of claim 17,
The bubble removing slits,
First bubble removing slits perforated along a first line to be cut spaced apart from a starting point of the protective film layer by a predetermined second reference distance; And
A film processing apparatus comprising: second bubble removing slits perforated along a second predetermined cutting line separated by a predetermined third reference distance compared to the first predetermined cutting line. The method of claim 18,
The film processing apparatus, characterized in that the first bubble removing slits and the second bubble removing slits are perforated so as to be staggered with each other by a predetermined second reference interval in a direction perpendicular to the transport direction. The method of claim 19,
The first reference interval is smaller than the reference length,
The second reference distance is smaller than the reference length and larger than the first reference distance. The method of claim 18,
The protective film layer further comprises a lamination unit for laminating by sequentially adhering the protective film layer to the adhesive film layer from a lamination start point to a lamination end point along the transport direction,
The first cutting scheduled line is determined to be spaced apart from the stacking start point by the second reference distance in a direction opposite to the transfer direction,
The second scheduled cutting line is determined to be spaced apart from the first scheduled cutting line by the third reference distance in a direction opposite to the conveying direction.

Images