KR20200103756A - Epoxy resin composition for sealing ball grid array package, cured epoxy resin, and electronic component device - Google Patents

Abstract

The epoxy resin composition for sealing a BGA package contains an epoxy resin, a phenol curing agent having a hydroxyl equivalent weight of 120 g/eq or less, and an inorganic filler including alumina particles and silica particles, and the content of the inorganic filler is 65% to 85% by volume. %, and the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by mass to 15% by mass.

Description

Epoxy resin composition for sealing ball grid array package, cured epoxy resin, and electronic component device

The present disclosure relates to an epoxy resin composition for sealing a ball grid array package, a cured epoxy resin product, and an electronic component device.

The demand for high-density mounting by miniaturization and thinning of electronic devices has rapidly increased in recent years. For this reason, the semiconductor package is a mainstream surface mount type suitable for high density mounting in place of the conventional pin insertion type. A surface-mount semiconductor package is mounted by directly soldering to a printed circuit board or the like. As a general mounting method, a method of heating and mounting the entire semiconductor package by an infrared reflow method, a vapor phase reflow method, a solder dip method, or the like is mentioned.

In recent years, in order to further increase the mounting density, area-mounted packages such as a ball grid array (hereinafter, also referred to as BGA) have been widely used among surface-mounted semiconductor packages. The BGA package is a single-sided resin-sealed package in which a semiconductor element mounting surface of a substrate is sealed with a resin composition. As a resin composition for sealing, an epoxy resin composition is widely used from the viewpoint of balance of various properties such as moldability, electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesion to inserts.

On the other hand, in the field of electronic components in recent years, high-speed and high-density are in progress, and with this, the amount of heat generated by electronic components is remarkably increased. In addition, there is an increasing demand for electronic components that operate under high temperatures. Therefore, for plastics used in electronic parts, particularly cured products of epoxy resins, improvement in thermal conductivity is required. In particular, in the case of a BGA package, high thermal conductivity of the sealing resin composition is required from the demand for miniaturization and high density. As a method of improving the thermal conductivity of a cured product of an epoxy resin, a method of increasing the filling amount of the inorganic filler by using a high thermally conductive inorganic filler such as alumina and using a resin having a low viscosity and a small amount of fine silica in combination has been reported. Yes (see, for example, Patent Document 1).

Japanese Patent No. 4188634

However, if the amount of alumina filled in the epoxy resin composition is increased for the purpose of high thermal conductivity, there is a possibility that the fluidity is lowered and the moldability is impaired. In Patent Document 1, a small amount of fine-grained silica is mixed with an alumina filler, and a specific biphenyl-type epoxy resin having a relatively low viscosity is used to achieve high filling of the filler. However, in this method, there was room for improvement in fluidity. In addition, with the thinning of the BGA package, the narrower pitch of the bonding wire, the increase of the number of pins, and the increase of density, a further high fluidity is also required.

Accordingly, the present disclosure is an epoxy resin composition for sealing a BGA package having excellent fluidity and excellent thermal conductivity when cured, an epoxy resin cured product obtained by curing the epoxy resin composition, and sealed by the epoxy resin cured product. It is an object to provide an electronic component device including an element.

The following embodiment is included in the solution means of the said subject.

<1> containing an epoxy resin, a phenol curing agent having a hydroxyl equivalent weight of 120 g/eq or less, and an inorganic filler containing alumina particles and silica particles,

The content of the inorganic filler is 65% by volume to 85% by volume,

The epoxy resin composition for sealing a ball grid array package, wherein the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by mass to 15% by mass.

<2> The epoxy resin composition for sealing a ball grid array package according to <1>, which further contains a curing accelerator, and the curing accelerator contains an organic phosphorus compound.

<3> The epoxy resin composition for sealing a ball grid array package according to <1> or <2>, wherein the phenol curing agent contains a phenol resin having three or more phenolic hydroxyl groups in one molecule.

<4> The epoxy resin composition for sealing a ball grid array package according to any one of <1> to <3>, wherein the phenol curing agent contains a triphenylmethane-type phenol resin.

<5> An epoxy resin cured product obtained by curing the epoxy resin composition for sealing a ball grid array package according to any one of <1> to <4>.

An electronic component device having a form of a ball grid array package, having a <6> element and the cured epoxy resin according to <5> sealing the element.

According to the present disclosure, an epoxy resin composition for sealing a BGA package having excellent fluidity and excellent thermal conductivity when cured, an epoxy resin cured product obtained by curing the epoxy resin composition, and a device sealed by the cured epoxy resin product An electronic component device is provided.

Hereinafter, embodiments for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps, etc.) are not essential except in the case where it is specifically stated. The same applies to the numerical value and its range, and does not limit the present invention.

In the present disclosure, the word "step" includes, in addition to a step independent from other steps, if the purpose of the step is achieved even when it cannot be clearly distinguished from another step, the step is also included.

In the numerical range indicated using "to" in the present disclosure, the numerical values described before and after "to" are included as the minimum value and the maximum value, respectively.

In the numerical range described stepwise in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be substituted with the upper limit value or the lower limit value of the numerical range described in another stepwise manner. In addition, in the numerical range described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be substituted with a value shown in Examples.

In the present disclosure, each component may contain a plurality of types of corresponding substances. When a plurality of types of substances corresponding to each component are present in the composition, the content or content of each component means the total content or content of the plurality of substances present in the composition, unless otherwise noted.

In the present disclosure, a plurality of types of particles corresponding to each component may be included. When a plurality of types of particles corresponding to each component are present in the composition, the particle diameter of each component means a value relating to a mixture of the plurality of particles present in the composition, unless otherwise specified.

<Epoxy resin composition for sealing BGA package>

The epoxy resin composition for sealing a BGA package of the present disclosure (hereinafter, also simply referred to as an epoxy resin composition) contains an epoxy resin, a phenol curing agent having a hydroxyl equivalent weight of 120 g/eq or less, and an inorganic filler including alumina particles and silica particles, , The content of the inorganic filler is 65% by volume to 85% by volume, and the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by mass to 15% by mass.

In general, when the content of alumina particles is increased in order to increase the thermal conductivity of the cured product, the fluidity decreases. On the other hand, the epoxy resin composition of the present disclosure, when cured, has excellent thermal conductivity and maintains good fluidity. Although the reason is not clear, it can think as follows. In the epoxy resin composition, when the content of the inorganic filler is 65% by volume to 85% by volume, and the silica particles are contained so that the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by mass to 15% by mass , While thermal conductivity can be secured by alumina, the resin component and silica particles are appropriately present around the alumina particles, thereby reducing the friction between the particles of the alumina particles, so that the decrease in fluidity is considered to be suppressed. In addition, when the inorganic filler is set to such a setting and contains a phenol curing agent having a hydroxyl equivalent weight of 120 g/eq or less as a curing agent, it is possible to improve thermal conductivity because the crosslinking density after curing can be secured without impairing fluidity. I think.

The epoxy resin composition of the present disclosure is used for sealing a BGA package. The BGA package refers to a semiconductor package in which a plurality of metal bumps are arranged in a grid on a substrate of the package. In the BGA package, an element is mounted on the surface of a substrate having a metal bump formed on the back surface, and the element is connected to a wiring formed on the substrate by bump or wire bonding, and then the element is sealed. CSP (Chip Size Package), in which the outer diameter is reduced to the same degree as that of the device, is also a type of BGA package.

[Epoxy resin]

The epoxy resin composition of the present disclosure contains an epoxy resin. The epoxy resin composition preferably contains an epoxy resin having two or more epoxy groups per molecule. The epoxy resin is not particularly limited, and consists of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A, and bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene. A novolak-type epoxy resin obtained by condensing or co-condensing at least one phenolic compound selected from the group and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, and propionaldehyde under an acidic catalyst. (Phenol novolak type epoxy resin, orthocresol novolak type epoxy resin, etc.); Triphenylmethane-type epoxy resin obtained by epoxidating a triphenylmethane-type phenol resin obtained by condensing or co-condensing the phenolic compound and an aromatic aldehyde compound such as benzaldehyde and salicylaldehyde under an acidic catalyst; A copolymerization type epoxy resin obtained by epoxidating a novolac resin obtained by co-condensing the phenol compound, naphthol compound, and an aldehyde compound under an acidic catalyst; Diphenylmethane type epoxy resins which are diglycidyl ethers such as bisphenol A and bisphenol F; Biphenyl-type epoxy resin which is a diglycidyl ether of alkyl substituted or unsubstituted biphenol; A stilbene-type epoxy resin which is a diglycidyl ether of a stilbene-based phenol compound; Sulfur atom-containing epoxy resins such as diglycidyl ethers such as bisphenol S; Epoxy resins which are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; Glycidyl ester type epoxy resins which are glycidyl esters of polyhydric carboxylic acid compounds such as phthalic acid, isophthalic acid and tetrahydrophthalic acid; A glycidylamine type epoxy resin in which active hydrogen bonded to a nitrogen atom such as aniline, diaminodiphenylmethane, and isocyanuric acid is substituted with a glycidyl group; A dicyclopentadiene type epoxy resin obtained by epoxidating a cocondensation resin of dicyclopentadiene and a phenol compound; Vinylcyclohexenediepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 2-(3,4-epoxy)cyclohexyl-5 obtained by epoxidation of olefin bonds in the molecule Alicyclic epoxy resins such as ,5-spiro(3,4-epoxy)cyclohexane-m-dioxane; Paraxylylene-modified epoxy resin, which is a glycidyl ether of a paraxylylene-modified phenol resin; Metaxylylene-modified epoxy resin, which is a glycidyl ether of metaxylylene-modified phenol resin; Terpene-modified epoxy resin which is glycidyl ether of terpene-modified phenol resin; Dicyclopentadiene-modified epoxy resin, which is a glycidyl ether of dicyclopentadiene-modified phenol resin; Cyclopentadiene-modified epoxy resin, which is a glycidyl ether of a cyclopentadiene-modified phenol resin; Polycyclic aromatic ring-modified epoxy resin which is glycidyl ether of polycyclic aromatic ring-modified phenol resin; Naphthalene type epoxy resin which is a glycidyl ether of a naphthalene ring-containing phenol resin; Halogenated phenol novolak type epoxy resin; Hydroquinone type epoxy resin; Trimethylolpropane type epoxy resin; Linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid; Aralkyl type epoxy resin obtained by epoxidating aralkyl type phenol resin such as phenol aralkyl resin and naphthol aralkyl resin; And the like. Furthermore, an epoxidation product of a silicone resin, an epoxidation product of an acrylic resin, etc. are mentioned as an epoxy resin. Epoxy resins may be used singly or in combination of two or more.

Among the above epoxy resins, from the viewpoint of balance of reflow and fluidity, biphenyl type epoxy resin, stilbene type epoxy resin, diphenylmethane type epoxy resin, sulfur atom-containing epoxy resin, novolak type epoxy resin, dicyclopentadiene type At least any one epoxy resin selected from the group consisting of an epoxy resin, a triphenylmethane-type epoxy resin, a copolymerization-type epoxy resin, and an aralkyl-type epoxy resin (referred to as "specific epoxy resins") is preferable. Specific epoxy resins may be used alone or in combination of two or more.

When the epoxy resin contains a specific epoxy resin, from the viewpoint of exhibiting the performance of the specific epoxy resin, the content ratio of the specific epoxy resin is preferably 30% by mass or more, and more preferably 50% by mass or more with respect to the entire epoxy resin.

Among the specific epoxy resins, from the viewpoint of fluidity, at least any one selected from the group consisting of a biphenyl-type epoxy resin, a stilbene-type epoxy resin, a diphenylmethane-type epoxy resin, and a sulfur atom-containing epoxy resin is preferred, and from the viewpoint of heat resistance , At least one selected from the group consisting of dicyclopentadiene-type epoxy resin, triphenylmethane-type epoxy resin, and aralkyl-type epoxy resin is preferable. Among them, a biphenyl type epoxy resin is preferable from the viewpoint of fluidity.

The biphenyl type epoxy resin is not particularly limited as long as it is an epoxy resin having a biphenyl skeleton. For example, an epoxy resin represented by the following general formula (II) is preferable. In the epoxy resin represented by the following general formula (II), 3,3', 5,5' positions are methyl groups when the position where the oxygen atom is substituted in R ⁸ is the 4 and 4'position, and other R ⁸ is when the hydrogen atom YX-4000H (manufactured by whether or Mitsubishi Chemical, trade name), all of R ⁸ is a 4,4-bis (2,3-epoxypropoxy) biphenyl, all of R ⁸ is a hydrogen atom and a hydrogen atom When the position where the oxygen atom is substituted in R ⁸ is the 4 and 4'position, the 3,3', 5,5' position is a methyl group and the other R ⁸ is a hydrogen atom, YL-6121H (Mitsubishi Chemical Co., Ltd., brand name) etc. can be obtained as a commercial item.

In formula (II), R ⁸ represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aromatic group having 4 to 18 carbon atoms, and each of them may be the same or different. n is an average value, and represents the number of 0-10.

In formula (II), R ⁸ is each independently preferably a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and still more preferably a hydrogen atom or a methyl group. .

In formula (II), n represents the number of 0-10, and it is preferable that it is 0-4. If n is 10 or less, the melt viscosity of the resin component does not become too high, and the viscosity during melt molding of the epoxy resin composition decreases, thereby suppressing the occurrence of poor filling and deformation of the bonding wire (the gold wire connecting the element and the lead). Tend to be.

As a more specific preferable biphenyl-type epoxy resin, from the viewpoint of fluidity and reflowability, 4,4'-bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl is mentioned. And 4,4'-bis(2,3-epoxypropoxy)-biphenyl is mentioned from the viewpoint of fluidity, moldability and heat resistance.

The diphenylmethane type epoxy resin is not particularly limited as long as it is an epoxy resin having a diphenylmethane skeleton. For example, an epoxy resin represented by the following general formula (IV) is preferable. Among the epoxy resins represented by the following general formula (IV), all of R ¹¹ are hydrogen atoms, and 3,3', 5,5' positions when the positions at which oxygen atoms are substituted in R ¹² are 4 and 4'positions. Is a methyl group, and YSLV-80XY (Shinnittetsu Sumikin Chemical Co., Ltd., brand name) etc. in which R ¹² is a hydrogen atom other than that can be obtained as a commercial item.

In formula (IV), R ¹¹ and R ¹² represent a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and each of them may be the same or different. n is an average value, and represents the number of 0-10.

In formula (IV), R ¹¹ and R ¹² are each independently preferably a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a hydrogen atom or a methyl group. .

In formula (IV), it is preferable that n is 0-4.

The triphenylmethane type epoxy resin is not particularly limited as long as it is an epoxy resin containing a compound having a triphenylmethane skeleton as a raw material. For example, an epoxy resin obtained by glycidyl etherification of a triphenylmethane type phenol resin such as a novolak type phenol resin of a compound having a triphenylmethane skeleton and a compound having a phenolic hydroxyl group is preferable, and the following general formula ( Epoxy resin represented by VIII) is more preferable. Among the epoxy resins represented by the following general formula (VIII), 1032H60 in which i is 0 and k is 0 (Mitsubishi Chemical Co., Ltd., brand name), EPPN-502H (Nippon Kayaku Co., Ltd., brand name), etc. are commercially available products. Available.

In formula (VIII), R ¹⁷ and R ¹⁸ represent a monovalent organic group having 1 to 18 carbon atoms, and each of them may be the same or different. i is each independently an integer of 0 to 3, k is each independently an integer of 0 to 4. n is an average value, and represents the number of 0-10. In other words, in formula (VIII), the hydrogen atom present on the aromatic ring is made non-display.

In formula (VIII), R ¹⁷ and R ¹⁸ are each independently preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a methyl group.

In formula (VIII), it is preferable that n is 0-4.

In one embodiment, the epoxy resin composition contains at least one selected from the group consisting of a biphenyl-type epoxy resin, a diphenylmethane-type epoxy resin, and a triphenylmethane-type epoxy resin from the viewpoint of reflow and fluidity. It is desirable. The epoxy resin composition may contain at least any two selected from the group consisting of these epoxy resins, and may contain all of these epoxy resins.

In one embodiment when the epoxy resin composition contains a biphenyl-type epoxy resin, the content of the biphenyl-type epoxy resin is preferably 60% by mass to 100% by mass, and 70% by mass with respect to the total amount of the epoxy resin. It is preferable that it is 100 mass %, and it is more preferable that it is 80 mass%-100 mass %.

In another embodiment when the epoxy resin composition contains a biphenyl type epoxy resin, the content of the biphenyl type epoxy resin is preferably 5% by mass to 60% by mass, and 10% by mass with respect to the total amount of the epoxy resin. It is more preferably from% to 50% by mass, and still more preferably from 20% by mass to 40% by mass.

In one embodiment when the epoxy resin composition contains a diphenylmethane type epoxy resin, the content of the diphenylmethane type epoxy resin is preferably 5% by mass to 45% by mass with respect to the total amount of the epoxy resin, and 5 It is more preferable that it is mass%-35 mass %, and it is still more preferable that it is 5 mass%-25 mass %.

In one embodiment when the epoxy resin composition contains a triphenylmethane type epoxy resin, the content of the triphenylmethane type epoxy resin is preferably 25% by mass to 85% by mass relative to the total amount of the epoxy resin, and 35 It is more preferable that it is mass%-75 mass %, and it is still more preferable that it is 45 mass%-65 mass %.

The epoxy equivalent of the epoxy resin is not particularly limited. From the viewpoint of balance of various properties such as moldability, reflow property, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 100 g/eq to 1000 g/eq, and more preferably 150 g/eq to 500 g/eq. The epoxy equivalent of the epoxy resin is a value measured by a method according to JIS K 7236:2009.

When the epoxy resin is a solid, its softening point or melting point is not particularly limited. The softening point or melting point of the epoxy resin is preferably 40° C. to 180° C. from the viewpoint of moldability and reflowability, and more preferably 50° C. to 130° C. from the viewpoint of handling properties when preparing the epoxy resin composition. The melting point of the epoxy resin is a value measured by differential scanning calorimetry (DSC), and the softening point of the epoxy resin is a value measured by a method (ring ball method) according to JIS K 7234:1986.

The content of the epoxy resin in the epoxy resin composition is preferably 0.5% by mass to 50% by mass, and more preferably 2% by mass to 30% by mass from the viewpoints of strength, fluidity, heat resistance, and moldability.

The epoxy resin may contain an epoxy resin (also referred to as a polyfunctional epoxy resin) having three or more epoxy groups per molecule. As described later, when the epoxy resin composition contains an organophosphorus compound as a curing accelerator, from the viewpoint of controlling the bending behavior of the package after reflow, the content of the polyfunctional epoxy resin relative to the total mass of the epoxy resin is 10% by mass. It is preferable that it is below, it is more preferable that it is 5 mass% or less, it is still more preferable that it is 1 mass% or less, and it is especially preferable that it is substantially 0 mass %. The content rate of "substantially 0 mass%" refers to a content rate such that no influence on the control of the warpage behavior of the package after reflow of the polyfunctional epoxy resin is observed.

[Specific phenol hardener]

The epoxy resin composition of the present disclosure contains a phenol curing agent (hereinafter also referred to as a specific phenol curing agent) having a hydroxyl equivalent weight of 120 g/eq or less. The specific phenol curing agent is not particularly limited as long as it has a phenolic hydroxyl group and is a compound having a hydroxyl group equivalent of 120 g/eq or less. The specific phenol curing agent may be a low-molecular phenolic compound or a phenolic resin obtained by polymerizing a low-molecular phenolic compound. From the viewpoint of thermal conductivity, it is preferable that the specific phenol curing agent is a phenol resin. Specific phenol curing agents may be used alone or in combination of two or more.

The specific phenol curing agent preferably contains a phenol resin having two or more phenolic hydroxyl groups in one molecule, and one containing a phenolic resin (also referred to as polyfunctional phenolic resin) having three or more phenolic hydroxyl groups in one molecule. More preferable.

The phenol resin is not particularly limited, and a biphenylene type phenol resin, an aralkyl type phenol resin, a dicyclopentadiene type phenol resin, a copolymer resin of a benzaldehyde type phenol resin and an aralkyl type phenol resin, a triphenylmethane type phenol resin, etc. Can be lifted. Among them, a triphenylmethane type phenol resin is preferable.

The triphenylmethane type phenol resin is not particularly limited as long as it is a phenol resin obtained from a compound having a triphenylmethane skeleton as a raw material. For example, a phenol resin represented by the following general formula (XVI) is preferable.

Among the phenolic resins represented by the following general formula (XVI), MEH-7500 in which i is 0 and k is 0 (Meiwa Kasei Co., Ltd., brand name) or the like can be obtained as a commercial item.

In formula (XVI), R ³⁰ and R ³¹ represent a monovalent organic group having 1 to 18 carbon atoms, and each of them may be the same or different. i is each independently an integer of 0 to 3, and k is each independently an integer of 0 to 4. n is an average value and is a number from 0 to 10. In other words, in the formula (XVI), the hydrogen atom present on the aromatic ring is made non-display.

In formula (XVI), R ³⁰ and R ³¹ are each independently preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a methyl group.

In formula (XVI), it is preferable that n is 0-5.

The hydroxyl group equivalent of a specific phenol curing agent is 120 g/eq or less, it is preferable that it is 110 g/eq or less, and it is more preferable that it is 100 g/eq or less. When the hydroxyl equivalent of the phenol curing agent is 120 g/eq or less, good moldability tends to be obtained. In addition, the lower limit of the hydroxyl equivalent weight is not particularly limited, and from the viewpoint of balance of various properties such as reflowability and electrical reliability, it is preferably 50 g/eq or more, more preferably 60 g/eq or more, and furthermore 70 g/eq or more. desirable. The range of the preferred hydroxyl group equivalent is preferably 50 g/eq to 120 g/eq, more preferably 60 g/eq to 115 eq, and still more preferably 70 g/eq to 110 g/eq.

The hydroxyl group equivalent of a specific phenol curing agent is a value measured by a method according to JIS K 0070:1992.

When a specific phenol curing agent is a solid, its melting point or softening point is not particularly limited. The melting point or softening point of the specific phenol curing agent is preferably 50°C to 250°C, more preferably 65°C to 200°C, and still more preferably 70°C to 170°C.

The melting point or softening point of the specific phenol curing agent is a value measured in the same manner as the melting point or softening point of the epoxy resin.

In the epoxy resin composition, the content ratio of the epoxy resin and the specific phenol curing agent is 0.5 in the ratio of the number of equivalents of the hydroxyl groups of the specific phenol curing agent to the number of equivalents of the epoxy groups of the epoxy resin (number of equivalents of hydroxyl groups/number of equivalents of epoxy groups). It is preferably set to be in the range of to 2.0, more preferably set to be 0.7 to 1.5, and even more preferably set to be 0.8 to 1.3. When the ratio is 0.5 or more, curing of the epoxy resin becomes sufficient, and the cured product tends to exhibit excellent heat resistance, moisture resistance, and electrical properties. Further, when the ratio is 2.0 or less, the amount of phenolic hydroxyl groups remaining in the cured resin is suppressed, and there is a tendency for excellent electrical properties and moisture resistance.

The epoxy resin composition may further contain a curing agent other than a specific phenol curing agent as a curing agent. Examples of the curing agent other than the specific phenol curing agent include phenol resins other than the specific phenol curing agent commonly used in the field. Curing agents other than the specific phenol curing agent may be used singly or in combination of two or more.

When the epoxy resin composition contains a curing agent other than a specific phenol curing agent, from the viewpoint of sufficiently exhibiting the performance of the specific phenol curing agent, the content rate of the specific phenol curing agent in the total amount of the curing agent is preferably 60% by mass or more, and 75% by mass or more. It is more preferable and it is still more preferable that it is 90 mass% or more.

When the epoxy resin composition contains a curing agent other than a specific phenol curing agent, the content ratio of the epoxy resin and the total curing agent is the ratio of the number of equivalents of the functional groups of the entire curing agent to the number of equivalents of the epoxy groups of the epoxy resin (the equivalent of the functional groups of the curing agent It is preferable to set according to the number/number of equivalents of the epoxy group). For example, the ratio is preferably set to be in the range of 0.5 to 2.0, more preferably set to be 0.7 to 1.5, and still more preferably set to be 0.8 to 1.3.

[Inorganic filling material]

The epoxy resin composition of the present disclosure contains an inorganic filler containing alumina particles and silica particles. The content of the inorganic filler is 65 to 85% by volume with respect to the total volume of the composition, and the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by mass to 15% by mass. The inorganic filler may contain inorganic fillers other than alumina particles and silica particles, and the inorganic filler preferably includes alumina particles and silica particles. As a silica particle, spherical silica, crystalline silica, etc. are mentioned.

The volume average particle diameter of the inorganic filler is not particularly limited. The volume average particle diameter of the inorganic filler is preferably 0.1 µm to 80 µm, and more preferably 0.3 µm to 50 µm, for example. When the volume average particle diameter of the inorganic filler is 0.1 µm or more, there is a tendency for an increase in viscosity of the epoxy resin composition to be easily suppressed. If the volume average particle diameter of the inorganic filler is 80 µm or less, the mixing property of the epoxy resin composition and the inorganic filler is improved, the state of the package obtained by curing is more homogenized, and the variation in properties tends to be suppressed, and also a narrow area There is a tendency for the filling property to be improved. In other words, it is preferable that the particle diameter distribution of the inorganic filler has a maximum value within the range of 0.1 µm to 80 µm.

Among them, the volume average particle diameter of the alumina particles is preferably 0.1 µm to 80 µm, and more preferably 0.3 µm to 50 µm, for example. When the volume average particle diameter of the alumina particles is 0.1 µm or more, there is a tendency that the increase in viscosity of the epoxy resin composition is easily suppressed. When the volume average particle diameter of the alumina particles is 80 µm or less, the mixing property of the epoxy resin composition and the alumina particles is improved, the state of the package obtained by curing is more homogenized, and the variation in properties tends to be suppressed. There is a tendency for the filling property to be improved.

Further, the volume average particle diameter of the silica particles is, for example, preferably 0.1 µm to 50 µm, more preferably 0.3 µm to 30 µm, and still more preferably 0.5 µm to 20 µm. When the volume average particle diameter of the silica particles is 50 µm or less, the fluidity tends to be improved.

In the present disclosure, the volume average particle diameter of the inorganic filler can be measured using a dry particle size distribution meter or a wet particle size distribution measuring device in the state of a slurry in which the inorganic filler is dispersed in water or an organic solvent. . In particular, in the case of containing particles of 1 μm or less, it is preferable to measure using a wet particle size distribution meter. Specifically, a water slurry in which the concentration of the inorganic filler was adjusted to about 0.01% by mass was treated with a bath ultrasonic cleaner for 5 minutes, and a laser diffraction particle size measuring device (LA-960, Horiba Seisakusho Co., Ltd.) was used. Thus, it can be obtained from the average value of all detected particles. In the present disclosure, the volume average particle diameter represents the particle diameter (D50) when the accumulation from the small-diameter side becomes 50% in a particle size distribution on a volume basis.

From the viewpoint of fluidity of the epoxy resin composition, the particle shape of the inorganic filler is preferably spherical, and the particle size distribution of the inorganic filler is preferably widely distributed. For example, it is preferable that 70% by mass or more of the inorganic filler is used as spherical particles, and the particle diameter of the spherical particles is widely distributed such as 0.1 µm to 80 µm. Since such inorganic fillers are likely to form the tightest packing structure by mixing particles of different sizes, increase in viscosity of the epoxy resin composition is suppressed even when the content of the inorganic filler is increased, and an epoxy resin composition having excellent fluidity tends to be obtained.

Inorganic fillers are, for example, alumina particles having a volume average particle diameter of 1 μm or less, and silica particles having a volume average particle diameter of 1 μm or less from the viewpoint of further improving the fluidity of the epoxy resin composition and thermal conductivity when used as a cured product. It may contain.

When the inorganic filler contains alumina particles having a volume average particle diameter of 1 μm or less and silica particles having a volume average particle diameter of 1 μm or less, for example, the volume-based particle size distribution (frequency distribution) of the inorganic filler is determined. It can be confirmed by doing.

In addition, from the viewpoint of reducing the warpage of the package while improving the fluidity of the epoxy resin composition and the thermal conductivity of the cured product, the inorganic filler, for example, alumina particles having a volume average particle diameter of 1 μm or less, and a volume average particle It may contain silica particles having a diameter of more than 1 µm and 20 µm or less, and preferably 5 µm to 15 µm. If the inorganic filler contains alumina particles having a volume average particle diameter of 1 μm or less, and silica particles having a volume average particle diameter of more than 1 μm and 20 μm or less, preferably 5 μ to 15 μm, for example, based on the volume of the inorganic filler. It can be confirmed by obtaining the particle size distribution (frequency distribution) of.

The content of the inorganic filler is 65 to 85% by volume with respect to the total volume of the composition, and from the viewpoint of the balance of properties such as thermal conductivity and fluidity, it is preferably 68 to 80% by volume, and 70 to 78% by volume. It is more preferable that it is volume %.

In addition, the content rate of the inorganic filler is preferably 84% by mass to 95% by mass, more preferably 85% by mass to 94% by mass, with respect to the total mass of the composition, from the viewpoint of the balance of properties such as thermal conductivity and fluidity. It is more preferable that it is 86 mass%-92 mass %.

In the epoxy resin composition, the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by mass to 15% by mass, and 12% by mass to 14% by mass from the viewpoint of the balance of properties such as thermal conductivity and fluidity. It is more preferable and it is still more preferable that it is 12 mass%-13 mass %.

Inorganic fillers other than alumina particles and silica particles are not particularly limited, and glass, calcium carbonate, zirconium silicate, magnesium oxide, calcium silicate, silicon nitride, aluminum nitride, boron nitride, silicon carbide, industrial diamond, beryllia, zirconia, zircon , Inorganic particles such as forsterite, steatite, spinel, mullite, titania, talc, clay, mica, and beads in which these particles are spheroidized. In addition, an inorganic filler having a flame retardant effect may be used. Examples of the inorganic filler having a flame-retardant effect include composite metal hydroxides such as aluminum hydroxide, magnesium hydroxide, complex hydroxides of magnesium and zinc, and particles such as zinc borate. Inorganic fillers other than the alumina particles and silica particles may be used singly or in combination of two or more.

The total content of the alumina particles and silica particles relative to the total volume of the inorganic filler is preferably 80% by volume or more, more preferably 90% by volume or more, even more preferably 95% by volume or more, and particularly 98% by volume or more. desirable.

[Hardening accelerator]

The epoxy resin composition of the present disclosure may contain a curing accelerator as necessary. As the curing accelerator, those generally used in the sealing epoxy resin composition can be appropriately selected and used. Examples of the curing accelerator include organic phosphorus compounds, imidazole compounds, tertiary amines and quaternary ammonium salts. Among them, organic phosphorus compounds are preferred. The hardening accelerator may be used singly or in combination of two or more.

Examples of the organophosphorus compound include organic phosphines such as tributylphosphine, phenylphosphine, diphenylphosphine, triphenylphosphine, methyldiphenylphosphine, and tripatolylphosphine, and maleic anhydride in these phosphines, Phosphorus compounds having intramolecular polarization obtained by adding a compound having a π bond such as benzoquinone and diazophenylmethane (e.g., an adduct of triphenylphosphine and benzoquinone, and triparatolylphosphine and benzoquinone Adducts); Tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate, 2-ethyl-4-methylimidazole tetraphenylborate, triphenylphosphonium-triphenylborane, and the like. When an organophosphorus compound is used as a curing accelerator, high reliability tends to be obtained in an electronic component device sealed using an epoxy resin composition. Although this reason is not clear, it can think as follows. In general, when the epoxy resin composition contains alumina particles, there is a tendency to increase the amount of the curing accelerator to be used, since curability is lowered. However, when the amount of the curing accelerator is increased, the amount of chlorine ions generated by the reaction of the curing accelerator with chlorine derived from epichlorohydrin, which is a raw material of the epoxy resin, increases, and the reliability of the electronic component device may be lowered. On the other hand, since organophosphorus compounds are not too reactive, the use of organophosphorus compounds as a curing accelerator suppresses the reaction with chlorine, so the generation of chlorine ions is also suppressed, and it is thought that the decrease in reliability can be suppressed. do. Incidentally, in the epoxy resin composition of the present disclosure, since a phenol curing agent having a hydroxyl equivalent weight of 120 g/eq or less is used, even when an organophosphorus compound is used, the curing property is excellent and good moldability tends to be obtained.

When the epoxy resin composition contains a curing accelerator, the content rate of the curing accelerator is not particularly limited, and for example, it is preferably 1.0% by mass to 10% by mass, and 1.5% by mass to 7% by mass with respect to the total amount of the epoxy resin and the curing agent. It is more preferable that it is 2.0 mass %, and it is still more preferable that it is 2.0 mass%-6 mass %.

[Organic solvents]

The epoxy resin composition of the present disclosure may contain an organic solvent. When the epoxy resin composition contains an organic solvent, the viscosity of the composition decreases, and kneading properties and fluidity tend to improve. The organic solvent is not particularly limited, and may contain, for example, an organic solvent having a boiling point of 50°C to 100°C (hereinafter, also referred to as a specific organic solvent).

The specific organic solvent is not particularly limited and, for example, has a boiling point of 50°C to 100°C, and preferably, a component in the epoxy resin composition and a non-reactive one can be appropriately selected and used. Examples of the specific organic solvent include alcohol-based solvents, ether-based solvents, ketone-based solvents, and ester-based solvents. Among them, alcohol-based solvents are preferable, and methanol (boiling point 64.7°C), ethanol (boiling point 78.37°C), propanol (boiling point 97°C), and isopropanol (boiling point 82.6°C) are more preferable. Specific organic solvents may be used alone or in combination of two or more. In other words, the specific organic solvent may be added when producing the epoxy resin composition, or may be generated in the reaction of the kneading process when producing the epoxy resin composition. In other words, in the present disclosure, the boiling point of the specific organic solvent refers to the boiling point of the specific organic solvent measured at normal pressure.

The content rate of the specific organic solvent in the epoxy resin composition is not particularly limited. The content rate of the specific organic solvent is preferably 0.1% by mass to 10% by mass with respect to the total mass of the epoxy resin composition, and more preferably 0.3% by mass to 4.0% by mass from the viewpoint of further improving the thermal conductivity. And it is more preferable that it is 0.3 mass%-3.0 mass %, and it is especially preferable that it is 0.3 mass%-2.5 mass %. When the content rate of the specific organic solvent is 0.3% by mass or more, the effect of improving the fluidity tends to be higher. When the content rate of the specific organic solvent is 3.0% by mass or less, generation of voids is more suppressed when curing the epoxy resin in the epoxy resin composition, and there is a tendency that a decrease in insulation reliability is more suppressed.

The content rate of the alcohol-based solvent in the specific organic solvent is not particularly limited. The content rate of the alcohol-based solvent is preferably 50% by mass or more, more preferably 70% by mass or more, still more preferably 90% by mass or more, and particularly 95% by mass or more with respect to the total mass of the specific organic solvent. desirable. In addition, the epoxy resin composition does not need to substantially contain specific organic solvents other than alcohol-based solvents.

[additive]

The epoxy resin composition may contain additives such as an anion exchanger, a mold release agent, a flame retardant, a coupling agent, a stress reliever, a plasticizer, and a colorant as necessary.

(Anion exchanger)

The epoxy resin composition may contain an anion exchanger as necessary. In particular, when using an epoxy resin composition as a sealing material, it is preferable to contain an anion exchanger from the viewpoint of improving moisture resistance and high temperature storage characteristics of an electronic component device including an element to be sealed.

The anion exchanger is not particularly limited, and can be selected from those generally used in the art from the prior art. For example, a hydrotalcite compound and a hydrous oxide of an element selected from magnesium, aluminum, titanium, zirconium and bismuth are mentioned.

The anion exchanger is not particularly limited, and can be selected from those generally used in the art from the prior art. Examples of the anion exchanger include a hydrotalcite compound having a composition represented by the following formula (I), and a hydrous oxide of an element selected from the group consisting of magnesium, aluminum, titanium, zirconium, bismuth and antimony. Anion exchanger may be used singly or in combination of two or more.

Mg _1-x Al _x (OH) ₂ (CO ₃ ) _x/2 mH ₂ O (I)

(0<X≤0.5, m is a positive number)

Hydrotalcite compounds are compounds that capture anions such as halogen ions by replacing them with CO ₃ in the structure, and halogen ions introduced into the crystal structure do not desorb until the crystal structure is destroyed at about 350°C or higher. . Hydrotalcites having such properties include Mg ₆ Al ₂ (OH) ₁₆ CO ₃ 4H ₂ O produced as a natural product, and Mg _4.3 Al ₂ (OH) _12.6 CO ₃ mH ₂ O as a synthetic product. .

Since the epoxy resin composition of the present disclosure contains a phenol curing agent as a curing agent, the epoxy resin composition exhibits acidity under the influence of the phenol curing agent (for example, the extract of the cured product using pure water becomes pH 3 to 5). In this case, for example, aluminum, which is an amphoteric metal, becomes an environment susceptible to corrosion by the epoxy resin composition, but the corrosion of aluminum tends to be suppressed by the epoxy resin composition containing a hydrotalcite compound that also has an action of adsorbing acid. There is this.

Further, the hydrous oxide of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, bismuth and antimony can also be captured by substituting an anion such as a halogen ion with a hydroxide ion. In addition, these ion exchangers exhibit excellent ion exchange ability on the acidic side. Therefore, when the epoxy resin composition contains these ion exchangers, the corrosion of aluminum tends to be suppressed similarly to the case of containing a hydrotalcite compound. Examples of the hydrous oxide include MgO·nH ₂ O, Al ₂ O ₃ ·nH ₂ O, ZrO ₂ ·H ₂ O, Bi ₂ O ₃ ·H ₂ O, Sb ₂ O ₅ ·nH ₂ O.

When the epoxy resin composition contains an anion exchanger, the content rate of the anion exchanger is not particularly limited as long as it is an amount sufficient to capture anions such as halogen ions. When the epoxy resin composition contains an anion exchanger, the content rate of the anion exchanger is preferably 0.1% by mass to 30% by mass, and more preferably 1.0% by mass to 5% by mass.

(Release agent)

The epoxy resin composition may contain a releasing agent if necessary from the viewpoint of exhibiting good releasability to the mold in the molding step. The kind of the mold release agent is not particularly limited, and a mold release agent known in the art can be mentioned. Specifically, examples of the release agent include higher fatty acids such as carnauba wax, montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid ester, polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. Among them, carnauba wax and polyolefin wax are preferable. Releasing agents may be used singly or in combination of two or more.

As the polyolefin wax, a commercial item may be used, and examples thereof include low molecular weight polyethylene having a number average molecular weight of about 500 to 10,000, such as H4, PE, and PED series of Hext Corporation.

When the epoxy resin composition contains a polyolefin wax, the content ratio of the polyolefin wax is preferably 0.01% by mass to 10% by mass, and more preferably 0.10% by mass to 5% by mass based on the epoxy resin. When the content of the polyolefin wax is 0.01% by mass or more, sufficient releasability tends to be obtained, and when it is 10% by mass or less, sufficient adhesiveness tends to be obtained.

In addition, when the epoxy resin composition contains other releasing agents other than polyolefin wax, or when the epoxy resin composition contains polyolefin wax and other releasing agents, the content of other releasing agents other than polyolefin wax is 0.1 with respect to the epoxy resin. It is preferable that it is mass%-10 mass %, and it is more preferable that it is 0.5 mass%-3 mass %.

(Flame retardant)

The epoxy resin composition may contain a flame retardant as needed from the viewpoint of imparting flame retardancy. The flame retardant is not particularly limited, and examples thereof include known organic and inorganic compounds containing a halogen atom, an antimony atom, a nitrogen atom or a phosphorus atom, a metal hydroxide, and acenaphthylene. Flame retardants may be used singly or in combination of two or more.

When the epoxy resin composition contains a flame retardant, the content rate of the flame retardant is not particularly limited as long as it is an amount at which the flame retardant effect is obtained. When the epoxy resin composition contains a flame retardant, the content rate of the flame retardant is preferably 1% by mass to 30% by mass, and more preferably 2% by mass to 15% by mass with respect to the epoxy resin.

(Coupling agent)

The epoxy resin composition may contain a coupling agent from the viewpoint of enhancing the adhesion between the resin component and the inorganic filler, if necessary. The type of coupling agent is not particularly limited. Examples of the coupling agent include various silane compounds such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, methacrylic silane, acrylic silane, and vinyl silane, titanium compounds, aluminum chelate compounds, aluminum and zirconium-containing compounds, and the like. I can. Coupling agents may be used singly or in combination of two or more.

When the epoxy resin composition contains a coupling agent, the content rate of the coupling agent is preferably 0.05% by mass to 5.0% by mass, and more preferably 0.10% by mass to 2.5% by mass with respect to the inorganic filler. When the content ratio of the coupling agent is 0.05% by mass or more, the adhesion to the frame tends to be improved, and when it is 5.0% by mass or less, the package tends to be excellent in moldability.

(Stress reliever)

The epoxy resin composition may contain a stress reliever such as silicone oil or silicone rubber particles, as necessary, from the viewpoint of reducing the amount of warpage deformation of the package and package cracking. As the stress reliever that can be used, a known flexible agent (stress reliever) generally used in the art can be appropriately selected and used.

Specific examples of the stress reliever include thermoplastic elastomers such as silicone, polystyrene, polyolefin, polyurethane, polyester, polyether, polyamide, and polybutadiene; Rubber particles such as NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic rubber, urethane rubber, and silicone powder; Rubber particles having a core-shell structure such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, and methyl methacrylate-butyl acrylate copolymer; And the like. Among them, silicon-based stress relievers containing silicon are preferable. Examples of the silicone stress reliever include those having an epoxy group, those having an amino group, and those obtained by polyether modification. Stress relievers may be used alone or in combination of two or more.

(Plasticizer)

The epoxy resin composition may contain a plasticizer from the viewpoint of lowering the high-temperature elastic modulus. Examples of the plasticizer include organic phosphorus compounds such as trialkylphosphine oxide and phosphoric acid ester, and silicone. It is preferable that it is 0.001 mass%-20 mass% with respect to an epoxy resin, and, as for content rate of a plasticizer, it is more preferable that it is 10 mass%-20 mass %. Plasticizers may be used alone or in combination of two or more.

(coloring agent)

The epoxy resin composition may contain colorants such as carbon black, fibrous carbon, organic dyes, organic colorants, titanium oxide, brisket, and Bengala. When the epoxy resin composition contains a colorant, the content rate of the colorant is preferably 0.05% by mass to 5.0% by mass, more preferably 0.10% by mass to 2.5% by mass with respect to the inorganic filler.

[Method of preparing epoxy resin composition]

For preparation of the epoxy resin composition, any method may be used as long as various components can be dispersed and mixed. As a general method, a method of sufficiently mixing various components by a mixer or the like, followed by melt-kneading by a mixing roll, an extruder, etc., cooling, and pulverizing may be mentioned. More specifically, the epoxy resin composition is, for example, mixing and stirring the above-described components, kneading in a kneader, roll, extruder, etc. previously heated to 70°C to 140°C, cooling, grinding, etc. You can get it by the way. The epoxy resin composition may be tableted to a size and mass suitable for the molding conditions of the package. By tableting the epoxy resin composition, handling becomes easy.

[Flowability of epoxy resin composition]

When the flowability is measured by the following method, the epoxy resin composition of the present disclosure preferably exhibits a flow distance of 160 cm or more. The epoxy resin composition is molded using a mold for measuring spiral flow according to EMMI-1-66, and the flow distance (cm) of the molded product of the epoxy resin composition is measured. The molding of the epoxy resin composition is performed using a transfer molding machine under conditions of a mold temperature of 180°C, a molding pressure of 6.9 MPa, and a curing time of 120 seconds.

<Epoxy resin cured product>

The epoxy resin cured product of the present disclosure is formed by curing the above-described epoxy resin composition. Since the epoxy resin cured product of the present disclosure is obtained by curing the above-described epoxy resin composition, it tends to be excellent in moldability and thermal conductivity.

[Thermal conductivity of hardened epoxy resin]

The thermal conductivity of the cured epoxy resin product is not particularly limited, and it is preferably 2.5 W/(m·K) or more. In the present disclosure, the thermal conductivity of the cured epoxy resin product is a value measured as follows. Using the epoxy resin composition, transfer molding is performed under conditions of a mold temperature of 180°C, a molding pressure of 7 MPa, and a curing time of 300 seconds to obtain a mold-shaped cured epoxy resin product. The specific gravity of the obtained cured epoxy resin product is measured by the Archimedes method, and the specific heat is measured by DSC (eg, Perkin Elmer, DSC Pyris1). In addition, the thermal diffusivity of the obtained cured product is measured by a laser flash method using a thermal diffusivity measuring apparatus (eg, NETZSCH, LFA467). The obtained specific gravity, specific heat, and thermal diffusivity are used to calculate the thermal conductivity of the cured epoxy resin product.

<Electronic parts device>

The electronic component device of the present disclosure has an element and a cured product of the epoxy resin composition of the present disclosure sealing the element, and has a form of a BGA package. A BGA package is manufactured by mounting an element on the surface of a substrate having a metal bump formed on the back surface, connecting the element to a wiring formed on the substrate by bump or wire bonding, and then sealing the element. As a substrate, a glass-epoxy printed wiring board, etc. are mentioned. As an element, an active element, a passive element, etc. are mentioned. As an active element, a semiconductor chip, a transistor, a diode, a thyristor, etc. are mentioned. As a passive element, a capacitor, a resistor, a coil, etc. are mentioned.

In the electronic component device of the present disclosure, a method of sealing an element with a cured epoxy resin material is not particularly limited, and a method known in the art can be applied. For example, a low pressure transfer molding method is generally used, but an injection molding method, a compression molding method, or the like may be used.

Example

Hereinafter, an example of the above embodiment will be specifically described by way of examples, but the present invention is not limited to these examples.

(Preparation of resin composition)

The components shown below were mixed at the blending ratio (parts by mass) shown in Table 1 to prepare resin compositions of Examples and Comparative Examples. In Table 1, "-" indicates that the component is not blended.

·Epoxy resin 1… Biphenyl type epoxy resin (Mitsubishi Chemical Co., Ltd., brand name "YX-4000")

·Epoxy resin 2… Diphenylmethane type epoxy resin (Shinnittetsu Sumikin Chemical Co., Ltd., brand name "YSLV-80XY")

·Epoxy resin 3… Multifunctional epoxy resin (Mitsubishi Chemical Co., Ltd., brand name "1032H60")

· Hardener 1... Polyfunctional phenol resin (Air Water Co., Ltd., brand name "HE910", triphenylmethane type phenol resin with a hydroxyl equivalent weight of 105 g/eq)

·Hardener 2... Polyfunctional phenol resin (Air Water Co., Ltd., brand name "HE200", biphenylene aralkyl type phenol resin with a hydroxyl equivalent weight of 199 g/eq)

·Hardening accelerator 1... Phosphorus hardening accelerator (organic phosphorus compound)

As an inorganic filler, the following was prepared.

Inorganic filler 1: alumina-silica mixed filler (silica content: 10% by mass), volume average particle diameter: 10 µm

Inorganic filler 2: alumina filler, volume average particle diameter: 0.8 µm

Inorganic filler 3: silica filler, volume average particle diameter: 0.8 µm

Inorganic filler 4: silica filler, volume average particle diameter: 10 µm

In addition, the following were prepared as various additives.

Coupling agent: epoxysilane (anilinosilane (N-phenyl-3-aminopropyltrimethoxysilane, Shin-Etsu Chemical Co., Ltd., brand name: KBM-573)

Colorant: Carbon black (Mitsubishi Chemical Co., Ltd., brand name: MA-100)

Release agent: Montanic acid ester (Ceralica NODA Co., Ltd.)

(Assessment of liquidity)

The fluidity evaluation of the epoxy resin composition was performed by a spiral flow test.

Specifically, the epoxy resin composition was molded using a mold for measuring spiral flow according to EMMI-1-66, and the flow distance (cm) of the molded product of the epoxy resin composition was measured. Molding of the epoxy resin composition was performed using a transfer molding machine under conditions of a mold temperature of 180°C, a molding pressure of 6.9 MPa, and a curing time of 120 seconds. In addition, the fluidity|liquidity was 160cm or more as A and less than 160cm as B.

(Evaluation of thermal conductivity)

Thermal conductivity evaluation when curing the epoxy resin composition was performed as follows. Specifically, using the prepared epoxy resin composition, transfer molding was performed under conditions of a mold temperature of 180°C, a molding pressure of 7 MPa, and a curing time of 300 seconds to obtain a mold-shaped cured product. The specific gravity measured by the Archimedes method of the obtained cured product was 3.00. The specific heat of the obtained cured product was measured by DSC (Perkin Elmer, DSC Pyris1). Further, the thermal diffusivity of the cured product was measured by a laser flash method using a thermal diffusivity measuring device (NETZSCH, LFA467). The thermal conductivity of the cured epoxy resin was calculated using the obtained specific gravity, specific heat, and thermal diffusivity. As for the thermal conductivity, 2.5 W/(m·K) or more was set to A, and less than 2.5 W/(m·K) was set to B.

As can be seen from Table 2, it contains the curing agent 1, the content of the inorganic filler is 65% by volume to 85% by volume, and the ratio of the silica particles to the total amount of the alumina particles and silica particles is 10% by mass to 15% by mass. In Examples 1 to 3 within the range of, all evaluations of fluidity and thermal conductivity were good.

As for the indication of Japanese Patent Application No. 2017-254880, the whole is taken in into this specification by reference.

All documents, patent applications, and technical standards described in this specification are specifically incorporated by reference, and are incorporated in the present specification to the same extent as when individually described.

Claims (6)

It contains an epoxy resin, a phenol curing agent having a hydroxyl equivalent weight of 120 g/eq or less, and an inorganic filler including alumina particles and silica particles,
The content of the inorganic filler is 65% by volume to 85% by volume,
The epoxy resin composition for sealing a ball grid array package, wherein the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by mass to 15% by mass. The epoxy resin composition for sealing a ball grid array package according to claim 1, further comprising a curing accelerator, and wherein the curing accelerator contains an organic phosphorus compound. The epoxy resin composition for sealing a ball grid array package according to claim 1 or 2, wherein the phenol curing agent contains a phenol resin having three or more phenolic hydroxyl groups in one molecule. The epoxy resin composition for sealing a ball grid array package according to any one of claims 1 to 3, wherein the phenol curing agent contains a triphenylmethane-type phenol resin. A cured epoxy resin product obtained by curing the epoxy resin composition for sealing a ball grid array package according to any one of claims 1 to 4. An electronic component device having an element and a cured epoxy resin according to claim 5 sealing the element, and having a form of a ball grid array package.