JPWO2019131095A1 - Epoxy resin composition for sealing ball grid array packages, cured epoxy resin, and electronic component equipment - Google Patents

Abstract

The epoxy resin composition for encapsulating the BGA package contains an epoxy resin, a phenol curing agent having a hydroxyl group equivalent of 120 g / eq or less, and an inorganic filler containing alumina particles and silica particles, and the content of the inorganic filler. Is 65% by volume to 85% by volume, and the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by volume to 15% by volume.

Description

The present disclosure relates to an epoxy resin composition for encapsulating a ball grid array package, an epoxy resin cured product, and an electronic component device.

In recent years, the demand for high-density mounting due to the miniaturization and thinning of electronic devices has increased rapidly. For this reason, surface mount type suitable for high-density mounting has become the mainstream of semiconductor packages instead of the conventional pin insertion type. The surface mount type semiconductor package is mounted by directly soldering to a printed circuit board or the like. Examples of a general mounting method include a method of heating and mounting the entire semiconductor package by an infrared reflow method, a vapor phase reflow method, a solder dip method, or the like.

In recent years, in order to further increase the mounting density, an area mounting package such as a ball grid array (Ball Grid Array, hereinafter also referred to as BGA) is widely used among surface mount type semiconductor packages. The BGA package is a single-sided resin-sealed package in which the semiconductor element mounting surface of the substrate is sealed with a resin composition. As the resin composition for sealing, an epoxy resin composition is widely used from the viewpoint of balancing various properties such as moldability, electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesiveness to insert products. There is.

On the other hand, in recent years, the speed and density of electronic components have been increasing, and the amount of heat generated by electronic components has been remarkably increased accordingly. There is also an increasing demand for electronic components that operate at high temperatures. Therefore, it is required to improve the thermal conductivity of plastics used for electronic parts, particularly cured products of epoxy resins. In particular, in the BGA package, high thermal conductivity of the resin composition for sealing is required due to the demand for miniaturization and high density. As a method for improving the thermal conductivity of the cured product of the epoxy resin, an inorganic filler having a high thermal conductivity such as alumina is used, and a resin having a low viscosity and a small amount of fine silica are used in combination to fill the inorganic filler. (See, for example, Patent Document 1).

Japanese Patent No. 4188634

However, if the amount of alumina filled in the epoxy resin composition is increased for the purpose of increasing thermal conductivity, the fluidity may decrease and the moldability may be impaired. In Patent Document 1, a small amount of fine silica is mixed with an alumina filler, and a specific biphenyl type epoxy resin having a relatively low viscosity is used to increase the filling of the filler. However, there was room for improvement in liquidity with this method. Further, as the BGA package becomes thinner, the pitch of the bonding wire becomes narrower, the number of pins increases, and the density increases, further higher fluidity is required.

Therefore, the present disclosure describes an epoxy resin composition for sealing a BGA package, which has excellent fluidity and excellent thermal conductivity when cured, an epoxy resin cured product obtained by curing the epoxy resin composition, and the epoxy resin curing. An object of the present invention is to provide an electronic component device including an element sealed with an object.

Means for solving the above problems include the following embodiments.
<1> An epoxy resin, a phenol curing agent having a hydroxyl group equivalent of 120 g / eq or less, and an inorganic filler containing alumina particles and silica particles are contained.
The content of the inorganic filler is 65% by volume to 85% by volume.
An epoxy resin composition for encapsulating a ball grid array package, wherein the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by mass to 15% by mass.
<2> The epoxy resin composition for encapsulating a ball grid array package according to <1>, which further contains a curing accelerator and the curing accelerator contains an organic phosphorus compound.
<3> The epoxy resin composition for encapsulating a ball grid array package according to <1> or <2>, wherein the phenol curing agent contains a phenol resin having three or more phenolic hydroxyl groups in one molecule.
<4> The epoxy resin composition for encapsulating a ball grid array package according to any one of <1> to <3>, wherein the phenol curing agent contains a triphenylmethane type phenol resin.
<5> An epoxy resin cured product obtained by curing the epoxy resin composition for encapsulating a ball grid array package according to any one of <1> to <4>.
<6> An electronic component device having an element and the epoxy resin cured product according to <5> that seals the element, and having the form of a ball grid array package.

According to the present disclosure, an epoxy resin composition for sealing a BGA package, which has excellent fluidity and excellent thermal conductivity when cured, an epoxy resin cured product obtained by curing the epoxy resin composition, and the epoxy resin curing. An electronic component device comprising an element sealed by an object is provided.

Hereinafter, embodiments for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the components (including element steps and the like) are not essential unless otherwise specified. The same applies to the numerical values and their ranges, and does not limit the present invention.

In the present disclosure, the term "process" includes not only a process independent of other processes but also the process if the purpose of the process is achieved even if the process cannot be clearly distinguished from the other process. ..
The numerical range indicated by using "~" in the present disclosure includes the numerical values before and after "~" as the minimum value and the maximum value, respectively.
In the numerical range described stepwise in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range described stepwise. .. Further, in the numerical range described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
In the present disclosure, each component may contain a plurality of applicable substances. When a plurality of substances corresponding to each component are present in the composition, the content rate or content of each component is the total content rate or content of the plurality of substances present in the composition unless otherwise specified. Means quantity.
In the present disclosure, a plurality of types of particles corresponding to each component may be contained. When a plurality of particles corresponding to each component are present in the composition, the particle size of each component means a value for a mixture of the plurality of particles present in the composition unless otherwise specified.

<Epoxy resin composition for BGA package sealing>
The epoxy resin composition for encapsulating a BGA package (hereinafter, also simply referred to as an epoxy resin composition) of the present disclosure is an inorganic filler containing an epoxy resin, a phenol curing agent having a hydroxyl group equivalent of 120 g / eq or less, alumina particles, and silica particles. The content of the inorganic filler is 65% by volume to 85% by volume, and the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by volume to 15% by volume. is there.

In general, increasing the content of alumina particles in order to increase the thermal conductivity of the cured product reduces the fluidity. On the other hand, the epoxy resin composition of the present disclosure has excellent thermal conductivity when cured, and maintains good fluidity. The reason is not clear, but it can be thought of as follows. In the epoxy resin composition, the content of the inorganic filler is 65% by volume to 85% by volume, and the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by volume to 15% by volume. When it is contained in, the thermal conductivity can be ensured by alumina, while the resin component and the silica particles are appropriately present around the alumina particles and reduce the friction between the alumina particles, so that the fluidity is lowered. Is thought to be suppressed. Further, if the inorganic filler is set as such and contains a phenol curing agent having a hydroxyl group equivalent of 120 g / eq or less as the curing agent, the crosslink density after curing can be ensured without impairing the fluidity. It is thought that it will be possible to improve thermal conductivity.

The epoxy resin composition of the present disclosure is used for sealing a BGA package. The BGA package is a semiconductor package in which a plurality of metal bumps are arranged in a grid pattern on the substrate of the package. The BGA package is manufactured by mounting an element on the front surface of a substrate having metal bumps formed on the back surface, connecting the element and the wiring formed on the substrate by bumps or wire bonding, and then sealing the element. A CSP (Chip Size Package) or the like in which the outer diameter dimension is reduced to the same level as the element dimension is also one form of the BGA package.

[Epoxy resin]
The epoxy resin composition of the present disclosure contains an epoxy resin. The epoxy resin composition preferably contains an epoxy resin having two or more epoxy groups in one molecule. The epoxy resin is not particularly limited, and at least one selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A, and bisphenol F and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene. A novolak type epoxy resin (phenol novolak type) which is an epoxy obtained by condensing or cocondensing a kind of phenolic compound and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc. under an acidic catalyst. Epoxy resin, orthocresol novolac type epoxy resin, etc.); A triphenylmethane type phenol resin obtained by condensing or cocondensing the above phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst. Triphenylmethane type epoxy resin; a copolymerized epoxy resin obtained by co-condensing the above phenol compound and naphthol compound with an aldehyde compound under an acidic catalyst; Diphenylmethane type epoxy resin which is a diglycidyl ether such as A and bisphenol F; biphenyl type epoxy resin which is an alkyl-substituted or unsubstituted biphenol diglycidyl ether; stillben-type epoxy resin which is a diglycidyl ether of a stillben-based phenol compound; bisphenol Sulfur atom-containing epoxy resin such as diglycidyl ether such as S; epoxy resin which is glycidyl ether of alcohols such as butanediol, polyethylene glycol and polypropylene glycol; polyvalent carboxylic acid compound such as phthalic acid, isophthalic acid and tetrahydrophthalic acid Glycidyl ester type epoxy resin, which is a glycidyl ester of glycidyl ester; glycidylamine type epoxy resin in which active hydrogen bonded to a nitrogen atom such as aniline, diaminodiphenylmethane, isocyanuric acid is replaced with a glycidyl group; co-dicyclopentadiene and phenol compound Dicyclopentadiene type epoxy resin, which is an epoxy of a condensed resin; vinylcyclohexene diepoxide, which is an epoxy of an olefin bond in a molecule, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexyl-5,5 Alicyclic epoxy resin such as 5-spiro (3,4-epoxy) cyclohexane-m-dioxane; paraxylylene-modified epoxy resin which is glycidyl ether of paraxylylene-modified phenol resin; metaxylylene-modified epoxy resin which is glycidyl ether of metaxylylene-modified phenol resin Terpen-modified epoxy resin, which is a glycidyl ether of terpen-modified phenol resin; Dicyclopentadiene-modified epoxy resin, which is a glycidyl ether of dicyclopentadiene-modified phenol resin; Cyclopentadiene-modified epoxy resin, which is a glycidyl ether of cyclopentadiene-modified phenol resin; Polycyclic aromatic ring-modified epoxy resin which is a glycidyl ether of a ring-aromatic ring-modified phenol resin; naphthalene-type epoxy resin which is a glycidyl ether of a naphthalene ring-containing phenol resin; halogenated phenol novolac-type epoxy resin; hydroquinone-type epoxy resin; trimethylol propane Type epoxy resin; Linear aliphatic epoxy resin obtained by oxidizing an olefin bond with a peracid such as peracetic acid; Aralkyl type epoxy resin obtained by epoxyizing an aralkyl type phenol resin such as phenol aralkyl resin and naphthol aralkyl resin. ; And so on. Further, an epoxy resin made of a silicone resin, an epoxy resin made of an acrylic resin, and the like can be mentioned as the epoxy resin. The epoxy resin may be used alone or in combination of two or more.

Among the above epoxy resins, from the viewpoint of the balance between reflow resistance and fluidity, biphenyl type epoxy resin, stillben type epoxy resin, diphenylmethane type epoxy resin, sulfur atom-containing epoxy resin, novolak type epoxy resin, dicyclopentadiene type epoxy resin , Triphenylmethane type epoxy resin, copolymer type epoxy resin, and at least one epoxy resin selected from the group consisting of aralkyl type epoxy resin (these are referred to as "specific epoxy resin") is preferable. The specific epoxy resin may be used alone or in combination of two or more.

When the epoxy resin contains the specific epoxy resin, the content of the specific epoxy resin is preferably 30% by mass or more, preferably 50% by mass or more, from the viewpoint of exhibiting the performance of the specific epoxy resin. Is more preferable.

Among the specific epoxy resins, from the viewpoint of fluidity, at least one selected from the group consisting of biphenyl type epoxy resin, stillben type epoxy resin, diphenylmethane type epoxy resin, and sulfur atom-containing epoxy resin is preferable, and heat resistance is preferable. From the viewpoint of the above, at least one selected from the group consisting of a dicyclopentadiene type epoxy resin, a triphenylmethane type epoxy resin, and an aralkyl type epoxy resin is preferable. Of these, a biphenyl type epoxy resin is preferable from the viewpoint of fluidity.

The biphenyl type epoxy resin is not particularly limited as long as it is an epoxy resin having a biphenyl skeleton. For example, an epoxy resin represented by the following general formula (II) is preferable. In '3,3 when the position', 5,5 'position methyl group oxygen atom of R ⁸ Among the epoxy resins represented by the following general formula (II) is position 4 and 4 are replaced There, YX-4000H (Mitsubishi Chemical Corporation, trade name) other ^{R 8} is a hydrogen atom, all the ^{R 8} are hydrogen atoms 4,4'-bis (2,3-epoxypropoxy) biphenyl, all '3,3 when the position' of the oxygen atom 4 and 4 positions that are substituted R ⁸ may well R ⁸ a hydrogen atom, 5,5 'position otherwise a methyl group R YL-6121H (Mitsubishi Chemical Co., Ltd., trade name) or the like, which is a mixed product when ⁸ is a hydrogen atom, is available as a commercially available product.

In formula (II), R ⁸ represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or an aromatic group having 4 to 18 carbon atoms, all of which may be the same or different. n is an average value and indicates a number from 0 to 10.

In formula (II), R ⁸ is preferably a hydrogen atom or an alkyl group having 1 to 12 carbon atoms independently, more preferably a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. It is more preferably a methyl group.

In formula (II), n represents a number from 0 to 10, preferably 0 to 4. When n is 10 or less, the melt viscosity of the resin component does not become too high, the viscosity of the epoxy resin composition during melt molding decreases, filling defects, deformation of the bonding wire (gold wire connecting the element and the lead), etc. Tends to be suppressed.

As a more specific preferable biphenyl type epoxy resin, from the viewpoint of fluidity and reflow resistance, 4,4'-bis (2,3-epoxypropoxy) -3,3', 5,5'-tetramethylbiphenyl From the viewpoint of fluidity, moldability and heat resistance, 4,4'-bis (2,3-epoxypropoxy) -biphenyl can be mentioned.

The diphenylmethane type epoxy resin is not particularly limited as long as it is an epoxy resin having a diphenylmethane skeleton. For example, an epoxy resin represented by the following general formula (IV) is preferable. Among the epoxy resins represented by the following general formula (IV), all of R ¹¹ are hydrogen atoms, and the positions of R ¹² in which oxygen atoms are substituted are set to the 4 and 4'positions of 3,3. YSLV-80XY (Nippon Steel & Sumikin Chemical Co., Ltd., trade name) in which the', 5, and 5'positions are methyl groups and the other R ¹² is a hydrogen atom is available as a commercially available product.

In formula (IV), R ¹¹ and R ¹² represent hydrogen atoms or monovalent organic groups having 1 to 18 carbon atoms, all of which may be the same or different. n is an average value and indicates a number from 0 to 10.

In formula (IV), R ¹¹ and R ¹² are each independently preferably a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, or a hydrogen atom or an alkyl group. It is more preferably a methyl group.
In formula (IV), n is preferably 0 to 4.

The triphenylmethane type epoxy resin is not particularly limited as long as it is an epoxy resin made from a compound having a triphenylmethane skeleton. For example, an epoxy resin obtained by glycidyl etherification of a triphenylmethane-type phenolic resin such as a novolak-type phenolic resin of a compound having a triphenylmethane skeleton and a compound having a phenolic hydroxyl group is preferable, and is represented by the following general formula (VIII). The epoxy resin to be used is more preferable. Among the epoxy resins represented by the following general formula (VIII), 1032H60 (Mitsubishi Chemical Corporation, trade name) and EPPN-502H (Nippon Kayaku Co., Ltd., trade name) in which i is 0 and k is 0. Etc. are available as commercial products.

In formula (VIII), R ¹⁷ and R ¹⁸ represent monovalent organic groups having 1 to ¹⁸ carbon atoms, all of which may be the same or different. i indicates an integer of 0 to 3 independently, and k indicates an integer of 0 to 4 independently. n is an average value and indicates a number from 0 to 10. In the formula (VIII), the hydrogen atom existing on the aromatic ring is hidden.

In formula (VIII), R ¹⁷ and R ¹⁸ are each independently preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and preferably a methyl group. More preferred.
In formula (VIII), n is preferably 0-4.

In one embodiment, the epoxy resin composition is at least one selected from the group consisting of a biphenyl type epoxy resin, a diphenylmethane type epoxy resin, and a triphenylmethane type epoxy resin from the viewpoint of reflow resistance and fluidity. Is preferably contained. The epoxy resin composition may contain at least two selected from the group consisting of these epoxy resins, or may contain any of these epoxy resins.

In one embodiment when the epoxy resin composition contains a biphenyl type epoxy resin, the content of the biphenyl type epoxy resin is preferably 60% by mass to 100% by mass, preferably 70% by mass, based on the total amount of the epoxy resin. It is preferably ~ 100% by mass, and more preferably 80% by mass to 100% by mass.
In another embodiment when the epoxy resin composition contains a biphenyl type epoxy resin, the content of the biphenyl type epoxy resin is preferably 5% by mass to 60% by mass with respect to the total amount of the epoxy resin. It is more preferably from mass% to 50% by mass, and even more preferably from 20% by mass to 40% by mass.
In one embodiment when the epoxy resin composition contains a diphenylmethane type epoxy resin, the content of the diphenylmethane type epoxy resin is preferably 5% by mass to 45% by mass, preferably 5% by mass, based on the total amount of the epoxy resin. It is more preferably ~ 35% by mass, and even more preferably 5% by mass to 25% by mass.
In one embodiment when the epoxy resin composition contains a triphenylmethane type epoxy resin, the content of the triphenylmethane type epoxy resin is preferably 25% by mass to 85% by mass with respect to the total amount of the epoxy resin. , 35% by mass to 75% by mass, more preferably 45% by mass to 65% by mass.

The epoxy equivalent of the epoxy resin is not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 100 g / eq to 1000 g / eq, preferably 150 g / eq to 500 g / eq. Is more preferable. The epoxy equivalent of the epoxy resin shall be a value measured by a method according to JIS K 7236: 2009.

When the epoxy resin is a solid, its softening point or melting point is not particularly limited. The softening point or melting point of the epoxy resin is preferably 40 ° C. to 180 ° C. from the viewpoint of moldability and reflow resistance, and 50 ° C. to 130 ° C. from the viewpoint of handleability when preparing the epoxy resin composition. Is more preferable. The melting point of the epoxy resin is a value measured by differential scanning calorimetry (DSC), and the softening point of the epoxy resin is a value measured by a method (ring ball method) according to JIS K 7234: 1986.

The content of the epoxy resin in the epoxy resin composition is preferably 0.5% by mass to 50% by mass, preferably 2% by mass to 30% by mass, from the viewpoints of strength, fluidity, heat resistance, moldability, and the like. More preferably.

The epoxy resin may contain an epoxy resin having three or more epoxy groups in one molecule (also referred to as a polyfunctional epoxy resin). As will be described later, when the epoxy resin composition contains an organophosphorus compound as a curing accelerator, the content of the polyfunctional epoxy resin with respect to the total mass of the epoxy resin is 10 from the viewpoint of controlling the warp behavior of the package after reflow. It is preferably 0% by mass or less, more preferably 5% by mass or less, further preferably 1% by mass or less, and particularly preferably substantially 0% by mass. The content of "substantially 0% by mass" means a content to which no influence on the control of the warp behavior of the package after the reflow of the polyfunctional epoxy resin is observed.

[Specific phenol curing agent]
The epoxy resin composition of the present disclosure contains a phenol curing agent having a hydroxyl group equivalent of 120 g / eq or less (hereinafter, also referred to as a specific phenol curing agent). The specific phenol curing agent is not particularly limited as long as it is a compound having a phenolic hydroxyl group and having a hydroxyl group equivalent of 120 g / eq or less. The specific phenol curing agent may be a low-molecular-weight phenol compound or a phenolic resin obtained by polymerizing a low-molecular-weight phenol compound. From the viewpoint of thermal conductivity, the specific phenol curing agent is preferably a phenol resin. As the specific phenol curing agent, one type may be used alone or two or more types may be used in combination.

The specific phenol curing agent preferably contains a phenol resin having two or more phenolic hydroxyl groups in one molecule, and is a phenol resin having three or more phenolic hydroxyl groups in one molecule (also referred to as a polyfunctional phenol resin). It is more preferable to include.

The phenol resin is not particularly limited, and examples thereof include biphenylene type phenol resin, aralkyl type phenol resin, dicyclopentadiene type phenol resin, copolymer resin of benzaldehyde type phenol resin and aralkyl type phenol resin, and triphenylmethane type phenol resin. Can be mentioned. Of these, triphenylmethane-type phenolic resin is preferable.

The triphenylmethane type phenol resin is not particularly limited as long as it is a phenol resin obtained from a compound having a triphenylmethane skeleton as a raw material. For example, a phenol resin represented by the following general formula (XVI) is preferable.

Among the phenolic resins represented by the following general formula (XVI), MEH-7500 (Meiwa Kasei Co., Ltd., trade name) in which i is 0 and k is 0 is available as a commercially available product.

In formula (XVI), R ³⁰ and R ³¹ represent monovalent organic groups having 1 to 18 carbon atoms, all of which may be the same or different. i is an integer of 0 to 3 independently, and k is an integer of 0 to 4 independently. n is an average value, which is a number from 0 to 10. In the formula (XVI), the hydrogen atom existing on the aromatic ring is hidden.

In the formula (XVI), R ³⁰ and R ³¹ are each independently preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and preferably a methyl group. More preferred.
In formula (XVI), n is preferably 0 to 5.

The hydroxyl group equivalent of the specific phenol curing agent is 120 g / eq or less, preferably 110 g / eq or less, and more preferably 100 g / eq or less. When the hydroxyl group equivalent of the phenol curing agent is 120 g / eq or less, good moldability tends to be obtained. Further, the lower limit of the hydroxyl group equivalent is not particularly limited, and is preferably 50 g / eq or more, more preferably 60 g / eq or more, from the viewpoint of various characteristic balances such as reflow resistance and electrical reliability. It is more preferably 70 g / eq or more. The preferred range of hydroxyl group equivalents is preferably 50 g / eq to 120 g / eq, more preferably 60 g / eq to 115 eq, and even more preferably 70 g / eq to 110 g / eq.

The hydroxyl group equivalent of the specific phenol curing agent shall be a value measured by a method according to JIS K 0070: 1992.

When the specific phenol curing agent is a solid, its melting point or softening point is not particularly limited. The melting point or softening point of the specific phenol curing agent is preferably 50 ° C. to 250 ° C., more preferably 65 ° C. to 200 ° C., and even more preferably 70 ° C. to 170 ° C.

The melting point or softening point of the specific phenol curing agent shall be a value measured in the same manner as the melting point or softening point of the epoxy resin.

The content ratio of the epoxy resin to the specific phenol curing agent in the epoxy resin composition is the ratio of the number of hydroxyl groups of the specific phenol curing agent to the number of equivalents of the epoxy groups of the epoxy resin (equivalent number of hydroxyl groups / equivalent number of epoxy groups). ) Is preferably set to be in the range of 0.5 to 2.0, more preferably set to 0.7 to 1.5, and 0.8 to 1.3. It is more preferable that the setting is made as follows. When the ratio is 0.5 or more, the epoxy resin is sufficiently cured, and the cured product tends to be excellent in heat resistance, moisture resistance, and electrical characteristics. Further, when the ratio is 2.0 or less, the amount of phenolic hydroxyl groups remaining in the cured resin is suppressed, and the electrical characteristics and moisture resistance tend to be excellent.

The epoxy resin composition may further contain a curing agent other than the specific phenol curing agent as the curing agent. Examples of the curing agent other than the specific phenol curing agent include phenolic resins other than the specific phenol curing agent commonly used in the art. As the curing agent other than the specific phenol curing agent, one type may be used alone or two or more types may be used in combination.

When the epoxy resin composition contains a curing agent other than the specific phenol curing agent, the content of the specific phenol curing agent in the total amount of the curing agent is 60% by mass or more from the viewpoint of fully exhibiting the performance of the specific phenol curing agent. It is preferably 75% by mass or more, and more preferably 90% by mass or more.

When the epoxy resin composition contains a curing agent other than the specific phenol curing agent, the content ratio of the epoxy resin and the total curing agent is the ratio of the equivalent number of functional groups of the total curing agent to the equivalent number of epoxy groups of the epoxy resin. It is preferably set according to (the number of functional groups equivalent to the curing agent / the number of epoxy groups equivalent). For example, the ratio is preferably set to be in the range of 0.5 to 2.0, more preferably set to 0.7 to 1.5, and 0.8 to 1. It is more preferable to set it to 3.

[Inorganic filler]
The epoxy resin composition of the present disclosure contains an inorganic filler containing alumina particles and silica particles. The content of the inorganic filler is 65% by mass to 85% by mass with respect to the total volume of the composition, and the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by mass to 15% by mass. The inorganic filler may contain an inorganic filler other than the alumina particles and the silica particles, and the inorganic filler is preferably composed of the alumina particles and the silica particles. Examples of the silica particles include spherical silica and crystalline silica.

The volume average particle size of the inorganic filler is not particularly limited. The volume average particle size of the inorganic filler is, for example, preferably 0.1 μm to 80 μm, and more preferably 0.3 μm to 50 μm. When the volume average particle size of the inorganic filler is 0.1 μm or more, it tends to be easy to suppress an increase in the viscosity of the epoxy resin composition. When the volume average particle size of the inorganic filler is 80 μm or less, the miscibility of the epoxy resin composition and the inorganic filler is improved, the state of the package obtained by curing tends to be more homogenized, and the variation in characteristics is suppressed. There is a tendency for the filling property to be further improved in a narrow area. The distribution of the particle size of the inorganic filler preferably has a maximum value in the range of 0.1 μm to 80 μm.

Above all, the volume average particle diameter of the alumina particles is preferably, for example, 0.1 μm to 80 μm, and more preferably 0.3 μm to 50 μm. When the volume average particle diameter of the alumina particles is 0.1 μm or more, it tends to be easy to suppress an increase in the viscosity of the epoxy resin composition. When the volume average particle diameter of the alumina particles is 80 μm or less, the mixing property of the epoxy resin composition and the alumina particles tends to be improved, the state of the package obtained by curing tends to be more homogenized, and the variation in characteristics tends to be suppressed. , There is a tendency to improve the filling property to a narrower area.

The volume average particle diameter of the silica particles is, for example, preferably 0.1 μm to 50 μm, more preferably 0.3 μm to 30 μm, and even more preferably 0.5 μm to 20 μm. When the volume average particle diameter of the silica particles is 50 μm or less, the fluidity tends to be improved.

In the present disclosure, the volume average particle size of the inorganic filler is determined by using a dry particle size distribution meter or by using a wet particle size distribution measuring device in the state of a slurry in which the inorganic filler is dispersed in water or an organic solvent. Can be measured. In particular, when particles of 1 μm or less are contained, it is preferable to measure using a wet particle size distribution meter. Specifically, a water slurry in which the concentration of the inorganic filler is adjusted to about 0.01% by mass is treated with a bath type ultrasonic cleaner for 5 minutes, and a laser diffraction type particle size measuring device (LA-960, HORIBA, Ltd.) ) Can be obtained from the average value of all the particles detected using. In the present disclosure, the volume average particle size represents the particle size (D50) when the cumulative amount from the small diameter side is 50% in the volume-based particle size distribution.

From the viewpoint of the fluidity of the epoxy resin composition, the particle shape of the inorganic filler is preferably spherical, and the particle size distribution of the inorganic filler is preferably widely distributed. For example, it is preferable that 70% by mass or more of the inorganic filler is spherical particles, and the particle diameter of the spherical particles is widely distributed from 0.1 μm to 80 μm. Since such an inorganic filler tends to form a close-packed structure by mixing particles of different sizes, an increase in the viscosity of the epoxy resin composition can be suppressed even if the content of the inorganic filler is increased. There is a tendency to obtain an epoxy resin composition having excellent fluidity.

From the viewpoint of further improving the fluidity of the epoxy resin composition and the thermal conductivity of the cured product, the inorganic filler has, for example, alumina particles having a volume average particle diameter of 1 μm or less and a volume average particle diameter of 1 μm or less. It may contain the silica particles of the above.
The fact that the inorganic filler contains alumina particles having a volume average particle diameter of 1 μm or less and silica particles having a volume average particle diameter of 1 μm or less means that, for example, a volume-based particle size distribution (frequency distribution) of the inorganic filler is obtained. It can be confirmed by.

Further, the inorganic filler is, for example, alumina particles having a volume average particle diameter of 1 μm or less from the viewpoint of reducing the warp of the package while improving the fluidity of the epoxy resin composition and the thermal conductivity of the cured product. It may contain silica particles having a volume average particle diameter of more than 1 μm and 20 μm or less, preferably 5 μm to 15 μm. The fact that the inorganic filler contains alumina particles having a volume average particle diameter of 1 μm or less and silica particles having a volume average particle diameter of more than 1 μm and 20 μm or less, preferably 5 μm to 15 μm is, for example, based on the volume of the inorganic filler. It can be confirmed by obtaining the particle size distribution (frequency distribution).

The content of the inorganic filler is 65% by volume to 85% by volume with respect to the total volume of the composition, and 68% by volume to 80% by volume from the viewpoint of characteristic balance such as thermal conductivity and fluidity. Is preferable, and 70% by volume to 78% by volume is more preferable.
The content of the inorganic filler is preferably 84% by mass to 95% by mass, preferably 85% by mass or more, based on the total mass of the composition, from the viewpoint of the balance of characteristics such as thermal conductivity and fluidity. It is more preferably 94% by mass, and further preferably 86% by mass to 92% by mass.

The ratio of silica particles to the total amount of alumina particles and silica particles in the epoxy resin composition is 10% by mass to 15% by mass, and from the viewpoint of characteristic balance such as thermal conductivity and fluidity, 12% by mass to 14%. It is more preferably by mass%, and even more preferably 12% by mass to 13% by mass.

The inorganic filler other than the alumina particles and the silica particles is not particularly limited, and glass, calcium carbonate, zirconium silicate, magnesium oxide, calcium silicate, silicon nitride, aluminum nitride, boron nitride, silicon carbide, industrial diamond, etc. Examples include inorganic particles such as beryllia, zirconia, zircone, fosterite, steatite, spinel, mulite, titania, talc, clay, and mica, and spherical beads of these particles. In addition, an inorganic filler having a flame-retardant effect may be used. Examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxide such as a composite hydroxide of magnesium and zinc, and particles such as zinc borate. As the inorganic filler other than the alumina particles and the silica particles, one type may be used alone or two or more types may be used in combination.

The total content of the alumina particles and the silica particles with respect to the total volume of the inorganic filler is preferably 80% by volume or more, more preferably 90% by volume or more, and further preferably 95% by volume or more. , 98% by volume or more is particularly preferable.

[Curing accelerator]
The epoxy resin composition of the present disclosure may contain a curing accelerator, if necessary. As the curing accelerator, those generally used for the sealing epoxy resin composition can be appropriately selected and used. Examples of the curing accelerator include organic phosphorus compounds, imidazole compounds, tertiary amines, and quaternary ammonium salts. Of these, organic phosphorus compounds are preferable. As the curing accelerator, one type may be used alone or two or more types may be used in combination.

Examples of the organic phosphorus compound include organic phosphines such as tributylphosphine, phenylphosphine, diphenylphosphine, triphenylphosphine, methyldiphenylphosphine and triparatrilphosphine, and π such as maleic anhydride, benzoquinone and diazophenylmethane in these phosphines. Phosphine compounds with intramolecular polarization (eg, triphenylphosphine and benzoquinone adducts, and triparatrilphosphine and benzoquinone adducts); tetraphenylphosphine tetraphenylborate, triphenylphosphine tetra Examples thereof include phenylborate, 2-ethyl-4-methylimidazole tetraphenylborate, triphenylphosphonium-triphenylborane and the like. When an organic phosphorus compound is used as a curing accelerator, high reliability tends to be obtained in an electronic component device sealed with an epoxy resin composition. The reason for this is not clear, but it can be thought of as follows. In general, when the epoxy resin composition contains alumina particles, the curability is lowered, so that the amount of the curing accelerator used tends to be increased. However, when the amount of the curing accelerator is increased, the amount of chlorine ions generated by the reaction between chlorine derived from epichlorohydrin, which is a raw material of the epoxy resin, and the curing accelerator increases, and the reliability of the electronic component device is lowered. In some cases. On the other hand, since organophosphorus compounds are not too reactive, when organophosphorus compounds are used as a curing accelerator, the reaction with chlorine is suppressed, so that the generation of chlorine ions is also suppressed and the decrease in reliability is suppressed. It is thought that it can be done. Since the epoxy resin composition of the present disclosure uses a phenol curing agent having a hydroxyl group equivalent of 120 g / eq or less, even if an organic phosphorus compound is used, the curability is excellent and good moldability tends to be obtained. is there.

When the epoxy resin composition contains a curing accelerator, the content of the curing accelerator is not particularly limited, and may be, for example, 1.0% by mass to 10% by mass with respect to the total amount of the epoxy resin and the curing agent. It is more preferably 1.5% by mass to 7% by mass, and even more preferably 2.0% by mass to 6% by mass.

[Organic solvent]
The epoxy resin composition of the present disclosure may contain an organic solvent. When the epoxy resin composition contains an organic solvent, the viscosity of the composition tends to decrease, and the kneadability and fluidity tend to improve. The organic solvent is not particularly limited, and may contain, for example, an organic solvent having a boiling point of 50 ° C. to 100 ° C. (hereinafter, also referred to as a specific organic solvent).

The specific organic solvent is not particularly limited, and for example, a solvent having a boiling point of 50 ° C. to 100 ° C. and which is not reactive with the components in the epoxy resin composition can be appropriately selected and used. Examples of the specific organic solvent include alcohol solvents, ether solvents, ketone solvents, ester solvents and the like. Of these, alcohol solvents are preferable, and methanol (boiling point 64.7 ° C.), ethanol (boiling point 78.37 ° C.), propanol (boiling point 97 ° C.) and isopropanol (boiling point 82.6 ° C.) are more preferable. As the specific organic solvent, one type may be used alone or two or more types may be used in combination. The specific organic solvent may be one added when preparing the epoxy resin composition, or may be one generated by the reaction in the kneading process when preparing the epoxy resin composition. In the present disclosure, the boiling point of the specific organic solvent refers to the boiling point of the specific organic solvent measured at normal pressure.

The content of the specific organic solvent in the epoxy resin composition is not particularly limited. The content of the specific organic solvent is, for example, preferably 0.1% by mass to 10% by mass with respect to the total mass of the epoxy resin composition, and is 0.3% by mass from the viewpoint of further improving thermal conductivity. It is more preferably ~ 4.0% by mass, further preferably 0.3% by mass to 3.0% by mass, and particularly preferably 0.3% by mass to 2.5% by mass. When the content of the specific organic solvent is 0.3% by mass or more, the effect of improving the fluidity tends to be further enhanced. When the content of the specific organic solvent is 3.0% by mass or less, the generation of voids is more suppressed when the epoxy resin in the epoxy resin composition is cured, and the decrease in insulation reliability tends to be further suppressed. is there.

The content of the alcohol solvent in the specific organic solvent is not particularly limited. The content of the alcohol solvent is, for example, preferably 50% by mass or more, more preferably 70% by mass or more, and further preferably 90% by mass or more, based on the total mass of the specific organic solvent. , 95% by mass or more is particularly preferable. Further, the epoxy resin composition may not substantially contain a specific organic solvent other than the alcohol solvent.

[Additive]
The epoxy resin composition may contain additives such as an anion exchanger, a mold release agent, a flame retardant, a coupling agent, a stress relaxant, a plasticizer, and a colorant, if necessary.

(Anion exchanger)
The epoxy resin composition may contain an anion exchanger, if necessary. In particular, when the epoxy resin composition is used as the sealing material, it is preferable to contain an anion exchanger from the viewpoint of improving the moisture resistance and high temperature standing characteristics of the electronic component device including the element to be sealed.

The anion exchanger is not particularly limited, and can be selected from those commonly used in the art. Examples include hydrotalcite compounds and hydrous oxides of elements selected from magnesium, aluminum, titanium, zirconium and bismuth.

The anion exchanger is not particularly limited, and can be selected from those commonly used in the art. Examples of the anion exchanger include hydrotalcite compounds having a composition represented by the following formula (I), and hydrous oxides of elements selected from the group consisting of magnesium, aluminum, titanium, zirconium, bismuth and antimony. .. As the anion exchanger, one type may be used alone or two or more types may be used in combination.
Mg _1-x Al _x (OH) ₂ (CO ₃ ) _{x / 2} · mH ₂ O (I)
(0 <X ≤ 0.5, m is a positive number)

Hydrotalite compounds capture anions such as halogen ions by replacing them with CO ₃ in the structure, and the halogen ions incorporated into the crystal structure are desorbed at about 350 ° C or higher until the crystal structure is destroyed. It is a compound with no properties. The hydrotalcite having such properties, _Mg 6 _Al 2 which is produced as a natural product _{(OH) 16 CO 3 · 4H} 2 O, Mg 4.3 Al 2 (OH) 12.6 CO 3 as synthetic products・ MH ₂ O and the like can be mentioned.

Since the epoxy resin composition of the present disclosure contains a phenol curing agent as a curing agent, the epoxy resin composition is acidic due to the influence of the phenol curing agent (for example, the extract of the cured product using pure water has a pH of 3 to 3 to It becomes 5). In this case, for example, aluminum, which is an amphoteric metal, is easily corroded by the epoxy resin composition, but the epoxy resin composition contains a hydrotalcite compound that also has an acid-adsorbing effect, so that aluminum is corroded. Tends to be suppressed.

Further, the hydrous oxide of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, bismuth and antimony can also be captured by substituting anions such as halogen ions with hydroxide ions. it can. Furthermore, these ion exchangers exhibit excellent ion exchange ability on the acidic side. Therefore, when these ion exchangers are contained in the epoxy resin composition, corrosion of aluminum tends to be suppressed as in the case where the hydrotalcite compound is contained. Examples of the hydrous oxide include MgO · nH ₂ O, Al ₂ O ₃ · nH ₂ O, ZrO ₂ · H ₂ O, Bi ₂ O ₃ · H ₂ O, Sb ₂ O ₅ · nH ₂ O and the like.

When the epoxy resin composition contains an anion exchanger, the content of the anion exchanger is not particularly limited as long as it is in a sufficient amount to capture anions such as halogen ions. When the epoxy resin composition contains an anion exchanger, the content of the anion exchanger is preferably, for example, 0.1% by mass to 30% by mass, preferably 1.0% by mass to 5% by mass. More preferably.

(Release agent)
The epoxy resin composition may contain a mold release agent, if necessary, from the viewpoint of exhibiting good mold releasability with respect to the mold in the molding process. The type of mold release agent is not particularly limited, and examples thereof include mold release agents known in the art. Specifically, as the release agent, higher fatty acids such as carnauba wax, montanic acid and stearic acid, ester waxes such as higher fatty acid metal salts and montanic acid esters, and polyolefin waxes such as polyethylene oxide and non-oxidized polyethylene are used. Can be mentioned. Of these, carnauba wax and polyolefin wax are preferable. As the release agent, one type may be used alone or two or more types may be used in combination.

As the polyolefin wax, a commercially available product may be used, and examples thereof include low molecular weight polyethylene having a number average molecular weight of about 500 to 10,000, such as Hoechst's H4, PE, and PED series.

When the epoxy resin composition contains a polyolefin-based wax, the content of the polyolefin-based wax is preferably 0.01% by mass to 10% by mass, preferably 0.10% by mass to 5% by mass, based on the epoxy resin. Is more preferable. When the content of the polyolefin wax is 0.01% by mass or more, sufficient releasability tends to be obtained, and when it is 10% by mass or less, sufficient adhesiveness tends to be obtained.
When the epoxy resin composition contains a mold release agent other than the polyolefin wax, or when the epoxy resin composition contains a polyolefin wax and other mold release agents, other release agents other than the polyolefin wax are released. The content of the mold agent is preferably 0.1% by mass to 10% by mass, more preferably 0.5% by mass to 3% by mass, based on the epoxy resin.

(Flame retardants)
The epoxy resin composition may contain a flame retardant, if necessary, from the viewpoint of imparting flame retardancy. The flame retardant is not particularly limited, and examples thereof include known organic and inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms or phosphorus atoms, metal hydroxides, and acenaphthylene. The flame retardant may be used alone or in combination of two or more.

When the epoxy resin composition contains a flame retardant, the content of the flame retardant is not particularly limited as long as the flame retardant effect can be obtained. When the epoxy resin composition contains a flame retardant, the content of the flame retardant is preferably 1% by mass to 30% by mass, more preferably 2% by mass to 15% by mass, based on the epoxy resin. preferable.

(Coupling agent)
If necessary, the epoxy resin composition may contain a coupling agent from the viewpoint of enhancing the adhesiveness between the resin component and the inorganic filler. The type of coupling agent is not particularly limited. Examples of the coupling agent include various silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, methacrylsilane, acrylicsilane and vinylsilane, titanium compounds, aluminum chelate compounds, aluminum and zirconium-containing compounds. As the coupling agent, one type may be used alone or two or more types may be used in combination.

When the epoxy resin composition contains a coupling agent, the content of the coupling agent is preferably 0.05% by mass to 5.0% by mass, preferably 0.10% by mass to 5.0% by mass with respect to the inorganic filler. More preferably, it is 2.5% by mass. When the content of the coupling agent is 0.05% by mass or more, the adhesiveness with the frame tends to be improved, and when it is 5.0% by mass or less, the moldability of the package tends to be excellent.

(Stress relaxation agent)
The epoxy resin composition may contain a stress relaxation agent such as silicone oil or silicone rubber particles, if necessary, from the viewpoint of reducing the amount of warpage deformation of the package and the package cracks. As the stress relaxation agent that can be used, a known flexible agent (stress relaxation agent) generally used in the art can be appropriately selected and used.

Specific examples of the stress relieving agent include thermoplastic elastomers such as silicone, polystyrene, polyolefin, polyurethane, polyester, polyether, polyamide, and polybutadiene; NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic rubber, and urethane rubber. , Rubber particles such as silicone powder; rubber having a core-shell structure such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, methyl methacrylate-butyl acrylate copolymer Particles; etc. Of these, a silicone-based stress relaxant containing silicone is preferable. Examples of the silicone-based stress relaxant include those having an epoxy group, those having an amino group, and those obtained by modifying these with a polyether. The stress relaxation agent may be used alone or in combination of two or more.

(Plasticizer)
The epoxy resin composition may contain a plasticizer from the viewpoint of lowering the high temperature elastic modulus. Examples of the plasticizer include trialkylphosphine oxides, organic phosphorus compounds such as phosphoric acid esters, and silicones. The content of the plasticizer is preferably 0.001% by mass to 20% by mass, and more preferably 10% by mass to 20% by mass with respect to the epoxy resin. The plasticizer may be used alone or in combination of two or more.

(Colorant)
The epoxy resin composition may contain a colorant such as carbon black, fibrous carbon, an organic dye, an organic colorant, titanium oxide, lead tan, and red iron oxide. When the epoxy resin composition contains a colorant, the content of the colorant is preferably 0.05% by mass to 5.0% by mass, and 0.10% by mass to 2.% by mass with respect to the inorganic filler. More preferably, it is 5% by mass.

[Preparation method of epoxy resin composition]
Any method may be used for preparing the epoxy resin composition as long as various components can be dispersed and mixed. As a general method, a method in which various components are sufficiently mixed by a mixer or the like, then melt-kneaded by a mixing roll, an extruder or the like, cooled and pulverized can be mentioned. More specifically, the epoxy resin composition is, for example, mixed with the above-mentioned components, stirred, kneaded with a kneader, roll, extruder or the like preheated to 70 ° C. to 140 ° C., and then cooled. It can be obtained by a method such as crushing. The epoxy resin composition may be tableted in a size and mass suitable for the molding conditions of the package. Tableting the epoxy resin composition facilitates handling.

[Fluidity of epoxy resin composition]
The epoxy resin composition of the present disclosure preferably exhibits a flow distance of 160 cm or more when the fluidity is measured by the following method. The epoxy resin composition is molded using a spiral flow measuring mold according to EMMI-1-66, and the flow distance (cm) of the molded product of the epoxy resin composition is measured. The epoxy resin composition shall be molded using a transfer molding machine under the conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 120 seconds.

<Epoxy resin cured product>
The epoxy resin cured product of the present disclosure is obtained by curing the epoxy resin composition described above. Since the cured epoxy resin of the present disclosure is obtained by curing the above-mentioned epoxy resin composition, it tends to be excellent in moldability and thermal conductivity.

[Thermal conductivity of cured epoxy resin]
The thermal conductivity of the cured epoxy resin is not particularly limited, and is preferably 2.5 W / (m · K) or more. In the present disclosure, the thermal conductivity of the cured epoxy resin product is a value measured as follows. Using the epoxy resin composition, transfer molding is performed under the conditions of a mold temperature of 180 ° C., a molding pressure of 7 MPa, and a curing time of 300 seconds to obtain a mold-shaped epoxy resin cured product. The specific gravity of the obtained cured epoxy resin is measured by the Archimedes method, and the specific heat is measured by DSC (for example, Perkin Elmer, DSC Pyris1). Further, the thermal diffusivity of the obtained cured product is measured by a laser flash method using a thermal diffusivity measuring device (for example, NETZSCH, LFA467). The thermal conductivity of the cured epoxy resin is calculated using the obtained specific gravity, specific heat, and thermal diffusivity.

<Electronic component equipment>
The electronic component device of the present disclosure includes an element and a cured product of the epoxy resin composition of the present disclosure that seals the element, and has the form of a BGA package. The BGA package is manufactured by mounting an element on the front surface of a substrate having metal bumps formed on the back surface, connecting the element and the wiring formed on the substrate by bumps or wire bonding, and then sealing the element. .. Examples of the substrate include a glass-epoxy printed wiring board and the like. Examples of the element include an active element and a passive element. Examples of active elements include semiconductor chips, transistors, diodes, thyristors and the like. Examples of the passive element include a capacitor, a resistor, a coil and the like.

In the electronic component device of the present disclosure, the method of sealing the element with a cured epoxy resin is not particularly limited, and a method known in the art can be applied. For example, a low-pressure transfer molding method is generally used, but an injection molding method, a compression molding method, or the like may be used.

Hereinafter, an example of the above embodiment will be specifically described with reference to Examples, but the present invention is not limited to these Examples.

(Preparation of resin composition)
The components shown below were mixed at the blending ratios (parts by mass) shown in Table 1 to prepare resin compositions of Examples and Comparative Examples. In Table 1, "-" indicates that no component is blended.

-Epoxy resin 1 ... Biphenyl type epoxy resin (Mitsubishi Chemical Corporation, product name "YX-4000")
-Epoxy resin 2 ... Diphenylmethane type epoxy resin (Nippon Steel & Sumikin Chemical Co., Ltd., trade name "YSLV-80XY")
-Epoxy resin 3 ... Polyfunctional epoxy resin (Mitsubishi Chemical Corporation, product name "1032H60")
Hardener 1 ... Polyfunctional phenolic resin (Air Water Co., Ltd., trade name "HE910", triphenylmethane type phenolic resin with hydroxyl group equivalent of 105 g / eq)
・ Hardener 2 ... Polyfunctional phenolic resin (Air Water Co., Ltd., trade name "HE200", biphenylene aralkyl type phenolic resin with hydroxyl group equivalent of 199 g / eq)
-Curing accelerator 1 ... Phosphorus-based curing accelerator (organophosphorus compound)

The following were prepared as the inorganic filler.
-Inorganic filler 1: Alumina-silica mixed filler (silica content: 10% by mass), volume average particle size: 10 μm
-Inorganic filler 2: Alumina filler, volume average particle diameter: 0.8 μm
-Inorganic filler 3: silica filler, volume average particle diameter: 0.8 μm
-Inorganic filler 4: silica filler, volume average particle diameter: 10 μm

In addition, the following were prepared as various additives.
-Coupling agent: Epoxysilane (anilinosilane (N-phenyl-3-aminopropyltrimethoxysilane, Shin-Etsu Chemical Co., Ltd., trade name: KBM-573))
-Colorant: Carbon black (Mitsubishi Chemical Corporation, product name: MA-100)
-Release agent: Montanic acid ester (Cerarica NODA Co., Ltd.)

(Evaluation of liquidity)
The fluidity of the epoxy resin composition was evaluated by a spiral flow test.
Specifically, the epoxy resin composition was molded using a mold for measuring spiral flow according to EMMI-1-66, and the flow distance (cm) of the molded product of the epoxy resin composition was measured. The epoxy resin composition was molded using a transfer molding machine under the conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 120 seconds. Further, the fluidity was defined as A for 160 cm or more and B for less than 160 cm.

(Evaluation of thermal conductivity)
The evaluation of the thermal conductivity when the epoxy resin composition was cured was carried out as follows. Specifically, using the prepared epoxy resin composition, transfer molding was performed under the conditions of a mold temperature of 180 ° C., a molding pressure of 7 MPa, and a curing time of 300 seconds to obtain a cured product having a mold shape. The specific gravity of the obtained cured product measured by the Archimedes method was 3.00. The specific heat of the obtained cured product was measured by DSC (Perkin Elmer, DSC Pyris1). Further, the thermal diffusivity of the cured product was measured by a laser flash method using a thermal diffusivity measuring device (NETZSCH, LFA467). The thermal conductivity of the cured epoxy resin was calculated using the obtained specific gravity, specific heat, and thermal diffusivity. The thermal conductivity was defined as A for 2.5 W / (m · K) or more and B for less than 2.5 W / (m · K).

As can be seen from Table 2, the curing agent 1 is contained, the content of the inorganic filler is 65% by volume to 85% by volume, and the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by volume to 15%. In Examples 1 to 3 in the range of mass%, both the evaluation of fluidity and thermal conductivity were good.

The disclosure of Japanese Patent Application No. 2017-254880 is incorporated herein by reference in its entirety.
All documents, patent applications, and technical standards described herein are to the same extent as if the individual documents, patent applications, and technical standards were specifically and individually stated to be incorporated by reference. Incorporated and incorporated herein.

Claims (6)

It contains an epoxy resin, a phenol curing agent having a hydroxyl group equivalent of 120 g / eq or less, and an inorganic filler containing alumina particles and silica particles.
The content of the inorganic filler is 65% by volume to 85% by volume.
An epoxy resin composition for encapsulating a ball grid array package, wherein the ratio of the silica particles to the total amount of the alumina particles and the silica particles is 10% by mass to 15% by mass. The epoxy resin composition for encapsulating a ball grid array package according to claim 1, further comprising a curing accelerator, wherein the curing accelerator contains an organic phosphorus compound. The epoxy resin composition for encapsulating a ball grid array package according to claim 1 or 2, wherein the phenol curing agent contains a phenol resin having 3 or more phenolic hydroxyl groups in one molecule. The epoxy resin composition for encapsulating a ball grid array package according to any one of claims 1 to 3, wherein the phenol curing agent contains a triphenylmethane type phenol resin. An epoxy resin cured product obtained by curing the epoxy resin composition for encapsulating a ball grid array package according to any one of claims 1 to 4. An electronic component device having an element and the epoxy resin cured product according to claim 5 that seals the element, and having the form of a ball grid array package.