KR20200090393A - Light emitting device package and light module having the same - Google Patents

Abstract

According to an embodiment, a light emitting element package can comprise: a body; a light emitting element disposed on the body; a solder disposed between the light emitting element and the body; a solder flow prevention barrier disposed to surround the outer periphery of the light emitting element, and including at least one opening at a side surface; and an underfill member disposed on the body, and disposed to cover a side surface of the light emitting element and the solder flow prevention barrier. In the embodiment, by forming the solder flow prevention barrier, the present invention has an effect of preventing the solder from spreading to the outside of the light emitting element.

Description

Light emitting device package and light source module including the same {LIGHT EMITTING DEVICE PACKAGE AND LIGHT MODULE HAVING THE SAME}

The embodiment relates to a light emitting device package.

Semiconductor devices including compounds such as GaN and AlGaN have many advantages such as having a wide and easily adjustable band gap energy, and thus can be used in various ways as light emitting devices, light receiving devices, and various diodes.

In particular, light emitting devices such as light emitting diodes or laser diodes using a group 3-5 or 2-6 compound semiconductor material are red, green, and green due to the development of thin film growth technology and device materials. There is an advantage that can realize light in various wavelength bands such as blue and ultraviolet light. In addition, a light emitting device such as a light emitting diode or a laser diode using a Group 3-5 or 2-6 compound semiconductor material can use a fluorescent material or combine colors to implement a white light source with high efficiency. Such a light emitting device has advantages of low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps.

In addition, when a light-receiving device such as a photodetector or a solar cell is manufactured using a group 3-5 or 2-6 compound semiconductor material, the development of the device material absorbs light in various wavelength regions to generate a photocurrent. By doing so, it is possible to use light in various wavelength ranges from gamma rays to radio wavelength ranges. In addition, such a light-receiving device has the advantages of fast response speed, safety, environmental friendliness, and easy adjustment of device materials, and thus can be easily used in power control or ultra-high-frequency circuits or communication modules.

Therefore, the semiconductor device can replace a light emitting diode backlight, a fluorescent lamp or an incandescent light bulb that replaces a cold cathode tube (CCFL) constituting a backlight of a transmission module of an optical communication means and a liquid crystal display (LCD) display device. Its application is expanding to white light emitting diode lighting devices, automobile headlights and traffic lights, and sensors for detecting gas or fire. In addition, the application of the semiconductor device can be expanded to high-frequency application circuits, other power control devices, and communication modules.

In addition, the light emitting device has been receiving great attention in the field of optical device and high power electronic device development due to its high thermal stability and wide band gap energy. In particular, ultraviolet (UV) light-emitting elements using nitride semiconductors, blue (Blue) light-emitting elements, green (Green) light-emitting elements, yellow (Yellow) light-emitting elements, red (Red) light-emitting elements, and the like are commercialized and widely used.

In a conventional light emitting device package, a light emitting device is mounted using solder in a cavity of a body, and an underfill member is disposed around the light emitting device to fix the light emitting device.

However, during the reflow process for connecting the light emitting device package to the main substrate, the expansion of the solder and the flux component of the solder are diffused between the body and the underfill member due to high temperature, thereby causing the underfill member to peel off.

An object of the embodiment is to provide a light emitting device package and a light source member including the light emitting device package for preventing the underfill member from being peeled off due to the expansion of solder due to high temperature.

In addition, an object of the present invention is to provide a light emitting device package and a light source module including the light emitting device package for preventing the underfill member from being peeled off due to the flux component of the solder due to high temperature.

The light emitting device package of the embodiment includes a body, a light emitting device disposed on the body, a solder disposed between the light emitting device and the body, and disposed to surround an outer periphery of the light emitting device, and includes at least one opening on a side surface. It may include a solder flow prevention jaw, and an underfill member disposed on the body to cover the side surface of the light emitting device and the solder flow prevention jaw.

The solder flow prevention jaw has a first side of the light emitting device having a first length and a second side facing the first side and a second side of the light emitting device having a second length smaller than the first length. The third side and the fourth side facing the third side may include a second protruding jaw spaced apart.

The opening may be formed in the first protruding jaw, and a distance between the first side of the light emitting device and the first protruding jaw may be formed smaller than a distance between the second side of the light emitting device and the second prohibiting jaw.

The opening is formed in the second protruding jaw, and a distance between the first side of the light emitting device and the first protruding jaw may be formed to be larger than a distance between the second side of the light emitting device and the second prohibiting jaw.

The opening is formed in the first protruding jaw and the second protruding jaw, and a distance between the first side of the light emitting device and the first protruding jaw is formed to be the same as the distance between the second side of the light emitting device and the second prohibiting jaw. Can be.

The opening is formed between a side surface of the first protruding jaw and a side surface of the second protruding jaw, and a distance between the first side of the light emitting device and the first protruding jaw is between the second side of the light emitting device and the second protruding jaw. It can be formed equal to the distance.

The opening may be formed to penetrate the side surface of the solder flow prevention jaw.

The solder flow prevention jaw is disposed under the opening, and the height of the solder flow prevention jaw disposed below the opening may be formed to be 1/2 or less of the height of the opening.

The solder flow prevention jaw may be disposed on the upper portion of the opening.

The height of the solder flow prevention jaw may be formed larger than the distance between the light emitting element and the body.

The distance between the side surface of the light emitting device and the solder flow prevention jaw may include 100 μm to 200 μm.

In addition, the light source module of the embodiment includes a circuit board and a light emitting device package disposed on the circuit board, wherein the light emitting device package includes a body, a light emitting device disposed on the body, and between the light emitting device and the body Solder disposed on the solder flow prevention jaw disposed to surround the outer periphery of the light emitting element and includes at least one opening on the side, and disposed on the body to cover the side and the solder flow prevention jaw of the light emitting element It may include an underfill member.

The embodiment has an effect of preventing the solder from being diffused to the outside of the light emitting device by forming a solder flow prevention jaw.

In addition, in the embodiment, by forming an opening in the solder flow prevention jaw, it is possible to more effectively prevent the flux component of the solder from being diffused to the lower portion of the underfill member.

In addition, according to the embodiment, the solder flow prevention jaw is further formed under the opening, thereby effectively preventing diffusion of solder.

In addition, according to the embodiment, the solder flow prevention jaw is further formed on the upper portion of the opening, so that the solder flow prevention jaw can be more firmly formed.

1 is a cross-sectional view showing a light emitting device package according to a first embodiment.
2 is a plan view showing the light emitting device and the solder flow prevention chin as a center.
3 is a cross-sectional view showing the light emitting element and the solder flow prevention jaw as a center.
4 to 6 are views showing various embodiments of a state in which the solder flow prevention jaw is viewed from the side.
7 is a plan view showing a solder flow prevention jaw according to the second embodiment.
8 is a plan view showing a solder flow prevention jaw according to the third embodiment.
9 is a plan view showing a solder flow prevention jaw according to the fourth embodiment.
10 is a cross-sectional view showing a light source module including a light emitting device package according to an embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical spirit of the present invention is not limited to some embodiments described, but may be implemented in various different forms, and within the technical spirit scope of the present invention, one or more of its components between embodiments may be selectively selected. It can be used by bonding and substitution.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless specifically defined and explicitly described, can be generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as a meaning, and terms that are commonly used, such as terms defined in the dictionary, may be interpreted by considering the meaning in the relevant context.

In addition, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In the present specification, a singular form may also include a plural form unless specifically stated in the phrase, and when described as "at least one (or more than one) of A and B and C", combinations of A, B, and C It can contain one or more of all possible combinations.

In addition, in describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used.

These terms are only for distinguishing the component from other components, and the term is not limited to the nature, order, or order of the component.

And, when a component is described as being'connected','coupled' or'connected' to another component, the component is directly connected to, coupled to, or connected to the other component, as well as the component. It may also include the case of'connected','coupled' or'connected' due to another component between the other components.

Further, when described as being formed or disposed in the "top (top) or bottom (bottom)" of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other. It also includes a case in which another component described above is formed or disposed between two components. In addition, when expressed as "up (up) or down (down)", it may include the meaning of the downward direction as well as the upward direction based on one component.

1 is a cross-sectional view showing a light emitting device package according to a first embodiment, FIG. 2 is a plan view mainly showing a light emitting device and a solder flow prevention jaw, and FIG. 3 is a cross section showing a light emitting device and a solder flow prevention jaw as a center, FIG. 4 to 6 are views showing various embodiments of a state in which the solder flow prevention jaw is viewed from the side.

Referring to FIG. 1, the light emitting device package 1000 according to the first embodiment may include a body 100 having a cavity c and a light emitting device 200 disposed on the body 100. .

The body 100 may be made of a resin material or an insulating resin material. The body 100 is polyphthalamide (PPA: Polyphthalamide), PCT (Polychloro Triphenyl), LCP (Liquid Crystal Polymer), PA9T (Polyamide9T), silicone, epoxy, epoxy molding compound (EMC: Epoxy molding compound), silicone It may be formed of at least one selected from the group comprising a molding compound (SMC), ceramic, photosensitive glass (PSG), sapphire (Al ₂ O ₃ ), and the like. The body 100 may be formed of a resin material, and may include fillers of a high refractive material such as TiO ₂ and SiO ₂ therein.

The body 100 may be formed of a thermoplastic resin, and the thermoplastic resin is a material that is re-hardened when heated and cooled, so that the frame to be described later and materials in contact with it expand or contract by heat. 100 may act as a buffer. At this time, when the body 100 performs the buffering action, it is possible to prevent the conductive parts such as solder-based paste, Ag-based paste and SAC (Sn-Ag-Cu)-based paste from being damaged. In the package, the coefficient of thermal expansion (CTE) due to thermal expansion and contraction may be greater than the first direction in the first direction. The body 100 according to the embodiment may preferably include a high melting point thermoplastic resin PCT or PPA material.

An electrode position indicator (not shown) may be formed in at least one of the four corners of the upper end of the body 100. For example, the electrode position indicator may be formed to indicate the polarity of at least one of the cathode or the anode, and may be formed by cutting one edge of the body 100 in a step shape.

The body 100 may include a first body 110 and a second body 120. For example, the body 100 may include a first body 110 and a second body 120 disposed on the first body 110.

The first body 110 may include a square or rectangular shape. The first body 110 may be referred to as a lower body. A reflective member (not shown) may be further disposed on the first body 110. The reflective member may have a structure in which reflective particles are dispersed in a substrate. The substrate may be any one or more of light-transmitting epoxy resin, silicone resin, polyimide resin, urea resin, and acrylic resin. For example, the polymer resin may be a silicone resin. The reflective particles may include particles such as TiO ₂ or SiO ₂ . The reflective member may be white silicon.

The reflective member may be entirely disposed on the first body 110. Light emitted to the lower portion of the cavity c may be reflected upward. Therefore, the light extraction efficiency can be improved.

The second body 120 may be disposed around the upper surface of the first body 110. The second body 120 may provide an inclined surface on the first body 110. Accordingly, the second body 120 may provide a cavity c on the top surface of the first body 110. Here, the second body 120 may be referred to as an upper body. That is, the second body 120 may be a side wall that provides a cavity (c).

The first body 110 and the second body 120 may be integrally formed or separately formed. When the first body 110 and the second body 120 are separately formed, an adhesive material is applied between the first body 110 and the second body 120 to be coupled to each other. A portion of the upper surface of the first body 110 may be exposed by the cavity c.

The second body 120 may include an inclined surface and an upper surface. The inclined surface of the second body 120 may be an inner surface of the second body 120. In detail, the second body 120 may include inner surfaces inclined around the cavity c and upper surfaces connected to the inner surfaces. The inner surface of the second body 120 may be a surface facing the light emitting device 200. The inner surface of the second body 120 may be a surface facing the light emitting device 200.

The first body 110 may have a thickness of about 400 μm or less. In detail, the thickness of the first body 110 may be about 80 μm to about 400 μm. In more detail, the thickness of the first body 110 may be about 100 μm to about 300 μm.

In addition, the total thickness of the body 100 may be about 100㎛ or more. In detail, the thickness of the body 100 may be about 100 μm to about 800 μm. The thickness of the body 100 may mean the sum of the thickness of the first body 110 and the second body 120. The thickness of the second body 120 may be thicker than the thickness of the light emitting device 200. The upper surface of the second body 120 may be disposed at a position higher than or equal to the upper surface of the light emitting device 200 for distribution of the directivity of light.

The second body 120 may be removed from the first body 110. Accordingly, the light emitting device package 1000 may have a light directing angle distribution of 130 degrees or more.

Although not illustrated in the drawing, the first body 110 may include a first frame and a second frame. The first frame and the second frame may be disposed to be spaced apart from each other in the left-right direction on the bottom surface of the cavity (c). The first frame and the second frame may be disposed to penetrate the first body 110 vertically. From this, the upper surface of the first body 110 and the lower surface of the first body 110 may be disposed to be exposed.

The first frame and the second frame may be provided as conductive frames. The conductive frame is a metal such as copper (Cu), titanium (Ti), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver ( Ag), and may be formed in a single layer or multiple layers.

The first frame and the second frame may have a thickness in consideration of heat dissipation characteristics and electrical conduction characteristics. For example, the thickness of each of the first and second frames may be about 100 μm to about 300 μm.

The first and second frames may have different polarities. For example, the first frame may be connected to the P-type electrode of the light-emitting element 200, and the second frame may be connected to the N-type electrode of the light-emitting element 200. Alternatively, the first frame may be connected to the N-type electrode of the light-emitting element 200, and the second frame may be connected to the P-type electrode of the light-emitting element 200.

The light emitting device 200 may be disposed on the body 100. The light emitting device 200 may be disposed on the first body 110. The light emitting device 200 may be disposed in the cavity c.

The light emitting device 200 may include a light emitting structure (not shown), a first electrode (not shown), and a second electrode (not shown). The first electrode may be disposed on the top surface of the light emitting structure, and the second electrode may be disposed on the bottom surface of the light emitting structure.

The light emitting structure may include a compound semiconductor. For example, the light emitting structure may be provided as, for example, a group 2-6 group or a group 3-5 compound semiconductor. For example, the light emitting structure may include a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer.

The light emitting device 200 may include one or a plurality of light emitting cells therein. The light emitting cell may include at least one of n-p junction, p-n junction, n-p-n junction, and p-n-p junction. The plurality of light emitting cells may be connected to each other in series within one light emitting device. Accordingly, the light emitting device 200 may have one or a plurality of light emitting cells.

A first electrode may be disposed on the top surface of the light emitting structure, and a second electrode may be disposed on the bottom surface of the light emitting structure. The first electrode may be electrically connected to the first conductivity type semiconductor layer. Further, the second electrode may be electrically connected to the second conductivity type semiconductor layer. The first electrode may be electrically connected to the first frame, and the second electrode may be electrically connected to the second frame.

The light emitting device package 1000 according to the first embodiment may further include a solder 300 to arrange the light emitting device 100 on the body. The solder 300 can stably fix the light emitting device 200 to the body 100.

The solder 300 includes the first solder 310 disposed between the first electrode of the light emitting device 200 and the first frame of the first body 110 and the second electrode and body 110 of the light emitting device 200. It may include a second solder 320 disposed between the second frame.

The solder 300 may have a melting point of 220°C to 230°C. The solder 300 may include a metal component and a flux component. The metal component of the solder 300 may include at least one of Au, Ag, Sn, Pb, Sb, In, AuSn, AgSn, SnSb, SnAgSb, PbIn, PbSn, PbSnAg, PbInAg, PbAg, and alloys thereof.

Although the flux component of the solder 300 is not particularly limited, various substrates having an adhesive component can be selected. For example, a resin such as rosin, resin, or inorganic acid, amine, organic acid, and the like. The flux component may be RMA flux, but is not limited thereto. The flux component may perform a function of reducing surface foreign substances such as oxides on the surface of the molten conductive component or the surface of the upper and lower electrodes to change and remove them into a soluble and fusible compound.

The light emitting device package 1000 according to the first embodiment may include a solder flow prevention jaw 400 for preventing the flux component of the solder 300 from diffusing.

The solder flow prevention jaw 400 may be disposed outside the solder 300. The solder flow prevention jaw 400 may be formed on the first body 110. The solder flow prevention jaw 400 may be disposed between the solder 300 and the inner surface of the second body 120. The solder flow prevention jaw 400 may be formed of the same material as the body 100. The solder flow prevention jaw 400 may be integrally formed with the body 110. The solder flow prevention jaw 400 will be described in detail later with reference to the drawings.

The light emitting device package 1000 according to the first embodiment may further include an underfill member 500.

The underfill member 500 may be disposed outside the light emitting device 200. The underfill member 500 may perform a function of stably underfilling the light emitting device 200. The underfill member 500 is made of an insulating material and may include an epoxy-based resin or white silicone having high affinity with the molding part 600. The epoxy-based resin has a very high adhesion upon curing and good flowability when melted compared to silicone, and thus may be a material having excellent permeability, that is, a property to be excluded from a metal component, that is, hydrophobicity. The underfill member 500 may include a phosphor or a reflective material therein.

Since the underfill member 500 has good flowability upon melting, it effectively penetrates into the edge region of the light emitting device 200 and effectively underfills the light emitting device 200.

The underfill member 500 may be formed on the first body 110 to cover the solder flow prevention jaw 400, and may be formed to cover a part of the side surface of the light emitting device 200. The underfill member 500 may contact the upper surface of the first body 110 and the side and upper surfaces of the solder flow prevention jaw 400.

The light emitting device package 1000 according to the first embodiment may include a molding part 600.

The molding part 600 may be provided on the body 100 and the light emitting device 200. The molding part 600 may be disposed in the cavity c provided by the second body 120. The molding part 600 may be disposed surrounding the light emitting device 200.

The molding part 600 may include an insulating material. In addition, the molding part 600 may include a wavelength conversion means for receiving light emitted from the light emitting device 200 and providing wavelength-converted light. For example, the molding part 600 may be at least one selected from the group including phosphors, quantum dots, and the like. The light emitting device 200 may emit light of yellow, blue, green, red, white, infrared, or ultraviolet light. The phosphor or the quantum dot may emit blue, green, and red light. The molding part 600 may not be formed.

Meanwhile, as illustrated in FIG. 2, the solder flow prevention jaw 400 may be disposed outside the light emitting device 200. The solder flow prevention jaw 400 may be disposed to surround the outer periphery of the light emitting device 200. The solder flow prevention jaw 400 may include a first prevention jaw 410 and a second prevention jaw 420.

The light emitting device 200 may include first to fourth sides 210, 220, 230, and 240. The first side 210 and the second side 220 may be arranged in a first direction. The first side 210 and the second side 220 may be opposite sides of the light emitting device 200. The first side 210 and the second side 220 may have a first length.

The third side 230 and the fourth side 240 may be arranged in a second direction. The second direction may be a direction perpendicular to the first direction. The third side 230 and the fourth side 240 may be opposite sides of the light emitting device 200. The third side 230 and the fourth side 240 may have a second length. The second length may be smaller than the first length.

The first protruding jaw 410 may be disposed to be spaced apart from the first side 210 and the second side 220 of the light emitting device 200. The first protruding jaw 410 may include a first-first protruding jaw 410a spaced apart from the first side 210 and a first-second protruding jaw 410b spaced apart from the second side 220. . The first-first prevention jaw 410a may be formed to be parallel to the first side 210 of the light emitting device 200. A first separation distance L1 may be provided between the first-first prevention jaw 410a and the first side 210 of the light emitting device 200. It may be formed to be parallel to the second side 220 of the first to second prevention jaw 410b and the light emitting device 200. A first separation distance L1 may be provided between the first-2 protruding jaw 410b and the second side 220 of the light emitting device 200. The first separation distance L1 may include 100 μm to 200 μm.

When the light emitting device 200 is placed after the solder 300 is doped on the first body 110, the spread of the solder 300 occurs due to the weight of the light emitting device 200 over time. As a result, the solder 300 spreads to the side surface of the light emitting device 200, thereby causing electrical short and discoloration. Accordingly, the embodiment prevents the spreading phenomenon of the solder 300 by placing a certain distance between the side of the prevention jaw 400 and the light emitting device 200.

When the first separation distance (L1) is formed to less than 100㎛, the first prevention jaw 410 according to the spreading phenomenon of the solder 300 can not withstand the force applied by the solder and can collapse. In addition, when the first separation distance (L1) is formed in excess of 200㎛, the function of preventing the spread of the solder 300 may be deteriorated, and the area where the solder 300 spreads becomes wider, thereby increasing the discoloration area. Problems perceived from the outside may occur.

The second protruding jaw 420 may be disposed to be spaced apart from the third side 230 and the fourth side 240 of the light emitting device 200. The second protruding jaw 420 includes a 2-1 protruding jaw 420a spaced apart from the third side 230 of the light emitting device 200, and a second protruding jaw 420 spaced apart from the fourth side 240 of the light emitting device 200. 2-2 may include a protruding jaw 420b. The 2-1 prevention jaw 420a and the third side surface 230 of the light emitting device 200 may be formed to be parallel. A second separation distance L2 may be provided between the 2-1 preventive jaw 420a and the third side 230 of the light emitting device 200. The 2-2 throttle 420b and the fourth side surface 240 of the light emitting device 200 may be arranged to be parallel. A second separation distance L2 may be provided between the 2-2 anti-chin 420b and the fourth side 240 of the light emitting device 200. The second separation distance L2 may include 100 μm to 200 μm.

When the second separation distance (L2) is less than 100㎛, the second prevention jaw 420 is able to withstand the force applied by the solder and collapse due to the spread phenomenon of the solder 300. In addition, when the second separation distance (L2) is formed in excess of 200㎛, the function of preventing the spread of the solder 300 may be deteriorated, and the area where the solder 300 spreads becomes wider, thereby increasing the discoloration area. Problems perceived from the outside may occur.

As shown in FIG. 3, the height h1 of the preventive jaw 400 may be formed higher than the height of the solder 300. The height h1 of the preventive jaw 400 may be formed to be larger than the distance L3 between the light emitting device 200 and the first body 110.

When the height h1 of the preventive jaw 400 is formed to be smaller than the distance L3 between the light emitting device 200 and the first body 110, the solder 300 can easily pass over the preventive jaw 400. .

Therefore, the anti-jaw 400 is formed to be higher than the height of the solder 300, thereby preventing the solder 300 from exceeding the anti-jaw 400 when the solder 300 spreads. The height h1 of the preventive jaw 400 may be formed to be 30 μm to 40 μm higher than the height of the solder 300. The height h1 of the prevention jaw 400 may be formed to be 30 μm to 40 μm higher than the distance L3 between the light emitting device 200 and the first body 110. The height h1 of the preventive jaw 400 may be formed to be 50 μm or more.

When the height h1 of the preventive jaw 400 is formed to be less than 30 μm than the height of the solder 300, as described above, the solder 300 easily crosses the preventive jaw 400 and peeling of the underfill member 500 Can cause In addition, when the height h1 of the preventive jaw 400 is formed to exceed 40 μm than the height of the solder 300, the area where the underfill member 500 covers the side surface of the light emitting device 200 increases more than necessary, Due to this, the efficiency of light emitted from the light emitting device 200 is lowered.

Returning to FIG. 2, the first separation distance L1 between the first prevention jaw 410 and the side surface of the light emitting device 200 is the second separation distance between the second prevention jaw 420 and the side surface of the light emitting device 200 ( L2). Since the opening 430 for discharging some flux components to the outside during the solder reflow process is formed on the first preventive jaw 410, the degree of expansion of the solder 300 is reduced. Therefore, the first separation distance L1 can be formed smaller than the second separation distance L2. When the first separation distance L1 is formed to be the same or larger than the second separation distance L2, the amount of the flux component released to the outside by expansion is reduced, so that the spreading phenomenon of the solder 300 may be increased. .

The opening 430 may be formed on the first side 210 and the second side 220 corresponding to the long side of the light emitting device 200, the first protruding jaw 410 facing the second side 220. The opening 430 may be formed in a shape in which a part of the first prevention jaw 410 is removed.

As illustrated in FIG. 4, the opening 430 may be formed in a partial region of the first preventive jaw 410. The opening 430 may be formed to penetrate the side surface of the first preventive jaw 410. The width w1 of the opening 430 may be formed in a range of 20% to 40% of the entire width of the first prevention jaw 410.

When the width w1 of the opening 430 is less than 20% of the entire width of the first preventive jaw 410, the flux component of the solder 300 cannot be easily released. In addition, when the width w1 of the opening 430 exceeds 40% of the entire width of the first preventive jaw 410, the flux component is discharged more than necessary and the underfill member 500 may be peeled.

The height h2 of the opening 430 may be the same as the height h1 of the first prevention jaw 410. Due to this, the opening 400 may separate the first prevention jaw 410 into a plurality. The plurality of first protruding jaws 410 may have a structure spaced apart from each other.

During the reflow process, a part of the flux component of the solder 300 may be discharged through the opening of the first preventive jaw 410.

Alternatively, as illustrated in FIG. 5, the opening 430 may be formed in a portion of the first preventive jaw 410. The opening 430 may be formed to penetrate the side surface of the first preventive jaw 410. The width w1 of the opening 430 may be formed in a range of 20% to 40% of the entire width of the first protruding jaw, but is not limited thereto.

The height h2 of the opening 430 may be smaller than the height h1 of the first preventive jaw 410. A first preventive jaw 410-1 may be disposed under the opening 430. The height h3 of the first preventive jaw 410-1 disposed under the opening 430 may be formed lower than the height h2 of the first preventive jaw 410 in which the opening 430 is not formed. The height h3 of the first prevention jaw 410-1 disposed under the opening 430 may be 1/2 or less of the height h1 of the first prevention jaw 410 in which the opening 430 is not formed. When the height h3 of the first preventive jaw 410-1 is higher than 1/2 of the height h1 of the first preventive jaw 410 in which the opening 430 is not formed, the amount of the flux component released is reduced. The first anti-jaw 410, the holding force can be reduced.

Alternatively, as illustrated in FIG. 6, the opening 430 may be formed in a partial region of the first preventive jaw 410. The opening 430 may be formed to penetrate the side surface of the first preventive jaw 410. The width w1 of the opening 430 may be formed in a range of 20% to 40% of the entire width of the first prevention jaw 410, but is not limited thereto.

The height h2 of the opening 430 may be smaller than the height h1 of the first preventive jaw 410. A first preventive jaw 410-1 may be disposed under the opening 430. The height h2 of the first preventive jaw 410-1 disposed under the opening 430 may be formed lower than the height h1 of the first preventive jaw 410 in which the opening 430 is not formed. The height h3 of the first prevention jaw 410-1 disposed under the opening 430 may be 1/2 or less of the height h1 of the first prevention jaw 410 in which the opening 430 is not formed.

A first preventive jaw 410-2 may be disposed on the opening 430. The height h4 of the first preventive jaw 410-2 disposed above the opening 430 may be the same as the height h3 of the first preventive jaw 410-1 disposed under the opening 430. Alternatively, the height h4 of the first preventive jaw 410-2 disposed above the opening 430 is smaller than the height h3 of the first preventive jaw 410-1 disposed below the opening 430. Can be.

The height of the first preventive jaw 410-1 disposed under the opening 430 serves to prevent the flux component of the solder 300 from spreading to the lower portion of the underfill member 500. have.

When the height h4 of the first preventive jaw 410-2 disposed above the opening 430 is formed to be greater than the height h3 of the first preventive jaw 410-1 disposed under the opening 430, The flux component of the solder 300 may be concentrated down and diffused between the body 100 and the underfill member 500.

The opening 430 as described above may be formed in one or more numbers on the first prevention jaw 410. Due to this, it is possible to more effectively prevent the flux component of the solder 300 from being diffused to the lower portion of the underfill member 500 by properly discharging the flux component of the solder 300.

7 is a plan view showing a solder flow prevention jaw according to the second embodiment.

As illustrated in FIG. 7, the solder flow prevention jaw 400 may be disposed outside the light emitting device 200. The solder flow prevention jaw 400 may be disposed to surround the outer periphery of the light emitting device 200. The solder flow prevention jaw 400 may include a first prevention jaw 410 and a second prevention jaw 420.

The first protruding jaw 410 may be disposed to be spaced apart from the first side 210 and the second side 220 of the light emitting device 200. The first protruding jaw 410 may be formed to be parallel to the first side 210 of the light emitting device 200. A first separation distance L1 may be provided between the first protruding jaw 410 and the first side 210 of the light emitting device 200. The first protruding jaw 410 and the second side 220 of the light emitting device 200 may be formed to be parallel. A first separation distance L1 may be provided between the first prevention jaw 410 and the second side 220 of the light emitting device 200. The first separation distance L1 may include 100 μm to 200 μm.

When the light emitting device 200 is placed after the solder 300 is doped on the first body 110, the spread of the solder 300 occurs due to the weight of the light emitting device 200 over time. As a result, the solder 300 spreads to the side surface of the light emitting device 200, thereby causing electrical short and discoloration. Accordingly, the embodiment prevents the spreading phenomenon of the solder 300 by placing a certain distance between the side of the prevention jaw 400 and the light emitting device 200.

The second protruding jaw 420 may be disposed to be spaced apart from the third side 230 and the fourth side 240 of the light emitting device 200. The second prevention jaw 420 and the third side surface 230 of the light emitting device 200 may be formed to be parallel. A second separation distance L2 may be provided between the second prevention jaw 420 and the third side surface 230 of the light emitting device 200. The second preventive jaw 420 and the fourth side 240 of the light emitting device 200 may be disposed to be parallel. A second separation distance L2 may be provided between the second prevention jaw 420 and the fourth side surface 240 of the light emitting device 200. The second separation distance L2 may include 100 μm to 200 μm.

The height h1 of the preventive jaw 400 may be formed higher than the height of the solder 300. The prevention jaw 400 is formed to be higher than the height of the solder 300, thereby preventing the solder 300 from exceeding the prevention jaw 400 when the solder 300 spreads. The height h1 of the preventive jaw 400 may be formed to be 30 μm to 40 μm higher than the height of the solder 300.

The first separation distance L1 between the first prevention jaw 410 and the side surface of the light emitting device 200 is formed to be greater than the second separation distance L2 between the second prevention jaw 420 and the side surface of the light emitting device 200. Can be. Since the opening 430 for discharging some flux components to the outside during the solder reflow process is formed on the second preventive jaw 420, the degree of expansion of the solder 300 is reduced. Therefore, the first separation distance L1 can be formed larger than the second separation distance L2.

The opening 430 may be formed on the third side 230 corresponding to the short side of the light emitting device 200 and the second prevention jaw 420 facing the second side 220. The opening 430 may be formed in a shape in which a part of the second prevention jaw 420 is removed.

When the second separation distance L2 is formed equal to or smaller than the first separation distance L1, the width of the opening 430 is formed because the opening 430 is formed on a side surface corresponding to the cross section of the light emitting device 200. It becomes small and the flux component cannot be easily released.

The structure of the opening 430 may adopt the structure of FIGS. 4 to 6.

For example, the opening 430 may be formed to penetrate the side surface of the second preventive jaw 420. The width w1 of the opening 430 may be formed in a range of 20% to 40% of the entire width of the second prevention jaw 420. The height of the opening 430 may be the same as the height of the second preventive jaw 420.

Alternatively, the opening 430 may be formed to penetrate the side surface of the second preventive jaw 420. The width w1 of the opening 430 may be formed in a range of 20% to 40% of the entire width of the second prevention jaw 420. The height of the opening 430 may be formed smaller than the height of the second preventive jaw 420. The second prevention jaw 420 may be disposed under the opening 430.

Alternatively, the opening 430 may be formed to penetrate the side surface of the second preventive jaw 420. The width w1 of the opening 430 may be formed in a range of 20% to 40% of the entire width of the second prevention jaw 420. The height of the opening 430 may be formed smaller than the height of the second preventive jaw 420. The second prevention jaw 420 may be disposed under the opening 430. A second preventive jaw 420 may be disposed on the opening 430.

8 is a plan view showing a solder flow prevention jaw according to the third embodiment.

As illustrated in FIG. 8, the solder flow prevention jaw 400 may be disposed outside the light emitting device 200. The solder flow prevention jaw 400 may be disposed to surround the outer periphery of the light emitting device 200. The solder flow prevention jaw 400 may include a first prevention jaw 410 and a second prevention jaw 420.

The first protruding jaw 410 may be disposed to be spaced apart from the first side 210 and the second side 220 of the light emitting device 200. The first protruding jaw 410 may be formed to be parallel to the first side 210 of the light emitting device 200. A first separation distance L1 may be provided between the first protruding jaw 410 and the first side 210 of the light emitting device 200. The first protruding jaw 410 and the second side 220 of the light emitting device 200 may be formed to be parallel. A first separation distance L1 may be provided between the first prevention jaw 410 and the second side 220 of the light emitting device 200. The first separation distance L1 may include 100 μm to 200 μm.

When the light emitting device 200 is placed after the solder 300 is doped on the first body 110, the spread of the solder 300 occurs due to the weight of the light emitting device 200 over time. As a result, the solder 300 spreads to the side surface of the light emitting device 200, thereby causing electrical short and discoloration. Accordingly, the embodiment prevents the spreading phenomenon of the solder 300 by placing a certain distance between the side of the prevention jaw 400 and the light emitting device 200.

The second protruding jaw 420 may be disposed to be spaced apart from the third side 230 and the fourth side 240 of the light emitting device 200. The second prevention jaw 420 and the third side surface 230 of the light emitting device 200 may be formed to be parallel. A second separation distance L2 may be provided between the second prevention jaw 420 and the third side surface 230 of the light emitting device 200. The second preventive jaw 420 and the fourth side 240 of the light emitting device 200 may be disposed to be parallel. A second separation distance L2 may be provided between the second protruding jaw 420 and the fourth side 240 of the light emitting device 200. The second separation distance L2 may include 100 μm to 200 μm.

The height h1 of the preventive jaw 400 may be formed higher than the height of the solder 300. The prevention jaw 400 is formed to be higher than the height of the solder 300, thereby preventing the solder 300 from exceeding the prevention jaw 400 when the solder 300 spreads. The height h1 of the preventive jaw 400 may be formed to be 30 μm to 40 μm higher than the height of the solder 300.

The first separation distance L1 between the first prevention jaw 410 and the side surface of the light emitting device 200 is the same as the second separation distance L2 between the second prevention jaw 420 and the side surface of the light emitting device 200. Can be formed. Openings may be formed in both the first protruding jaw 410 and the second protruding jaw 420.

When the first separation distance (L1) and the second separation distance (L2) are formed differently, the force exerted by the flux component of the solder 300 on any one of the prevention jaws 400 becomes large and the force with which the prevention jaws 400 endure This can degrade. Accordingly, when the first separation distance L1 and the second separation distance L2 are formed in the same manner, the flux component applies an even force to the prevention jaw 400, thereby preventing damage to the prevention jaw 400.

The structure of the opening 430 may adopt the structure of FIGS. 4 to 6. As an example, a structure in which the opening is formed in the first preventive jaw will be described.

For example, the opening 430 may be formed to penetrate the side surface of the second preventive jaw 410. The width w1 of the opening 430 may be formed in a range of 20% to 40% of the entire width of the first prevention jaw 410. The height of the opening 430 may be the same as the height of the first preventive jaw 410.

Alternatively, the opening 430 may be formed to penetrate the side surface of the first preventive jaw 410. The width w1 of the opening 430 may be formed in a range of 20% to 40% of the entire width of the first prevention jaw 410. The height of the opening 430 may be formed smaller than the height of the first preventive jaw 410. A first prevention jaw 410 may be disposed under the opening 430.

Alternatively, the opening 430 may be formed to penetrate the side surface of the first preventive jaw 410. The width w1 of the opening 430 may be formed in a range of 20% to 40% of the entire width of the first prevention jaw 410. The height of the opening 430 may be formed smaller than the height of the first preventive jaw 410. A first prevention jaw 410 may be disposed under the opening 430. A first preventive jaw 410 may be disposed on the opening 430.

According to the embodiment, the opening 430 is simultaneously formed in the first protruding jaw 410 and the second protruding jaw 420, thereby effectively discharging the flux component to the outside.

9 is a plan view showing a solder flow prevention jaw according to the fourth embodiment.

As shown in FIG. 9, the solder flow prevention jaw 400 may be disposed outside the light emitting device 200. The solder flow prevention jaw 400 may be disposed to surround the outer periphery of the light emitting device 200. The solder flow prevention jaw 400 may include a first prevention jaw 410 and a second prevention jaw 420.

The first protruding jaw 410 may be disposed to be spaced apart from the first side 210 and the second side 220 of the light emitting device 200. The first protruding jaw 410 may be formed to be parallel to the first side 210 of the light emitting device 200. A first separation distance L1 may be provided between the first protruding jaw 410 and the first side 210 of the light emitting device 200. The first protruding jaw 410 and the second side 220 of the light emitting device 200 may be formed to be parallel. A first separation distance L1 may be provided between the first prevention jaw 410 and the second side 220 of the light emitting device 200. The first separation distance L1 may include 100 μm to 200 μm.

When the light emitting device 200 is placed after the solder 300 is doped on the first body 110, the spread of the solder 300 occurs due to the weight of the light emitting device 200 over time. As a result, the solder 300 spreads to the side surface of the light emitting device 200, thereby causing electrical short and discoloration. Accordingly, the embodiment prevents the spreading phenomenon of the solder 300 by placing a certain distance between the side of the prevention jaw 400 and the light emitting device 200.

The second protruding jaw 420 may be disposed to be spaced apart from the third side 230 and the fourth side 240 of the light emitting device 200. The second prevention jaw 420 and the third side surface 230 of the light emitting device 200 may be formed to be parallel. A second separation distance L2 may be provided between the second prevention jaw 420 and the third side surface 230 of the light emitting device 200. The second preventive jaw 420 and the fourth side 240 of the light emitting device 200 may be disposed to be parallel. A second separation distance L2 may be provided between the second prevention jaw 420 and the fourth side surface 240 of the light emitting device 200. The second separation distance L2 may include 100 μm to 200 μm.

The height h1 of the preventive jaw 400 may be formed higher than the height of the solder 300. The prevention jaw 400 is formed to be higher than the height of the solder 300, thereby preventing the solder 300 from exceeding the prevention jaw 400 when the solder 300 spreads. The height h1 of the preventive jaw 400 may be formed to be 30 μm to 40 μm higher than the height of the solder 300.

The first separation distance L1 between the first prevention jaw 410 and the side surface of the light emitting device 200 is the same as the second separation distance L2 between the second prevention jaw 420 and the side surface of the light emitting device 200. Can be formed. An opening may be formed between the first preventive jaw 410 and the second preventive jaw 420.

The opening may be disposed between the side of the first preventive jaw and the side of the second preventive jaw. The opening may be formed in a portion of the solder flow prevention jaw facing the edge region of the light emitting device. Four openings may be formed to face the four corners of the light emitting device.

According to an embodiment, the solder flow prevention jaw 400 can be easily formed by forming the opening 300 in the solder flow prevention jaw 400 corresponding to the edge region of the light emitting device. In addition, in the embodiment, the opening 300 is formed to have symmetry, so that the force applied to the solder flow prevention jaw 400 is evenly formed to make the solder flow prevention jaw 400 more robust.

The opening can be employed by modifying the structure of FIGS. 4 to 6.

For example, the width w1 of the opening 430 may be formed in a range of 20% to 40% of the entire width of the solder flow prevention jaw 400. The height of the opening 430 may be the same as the height of the solder flow prevention jaw 410.

Alternatively, the width w1 of the opening 430 may be formed in a range of 20% to 40% of the entire width of the solder flow prevention jaw 400. The height of the opening 430 may be formed smaller than the height of the solder flow prevention jaw 400. A solder flow prevention jaw 400 may be disposed under the opening 430. The solder flow prevention jaw 400 disposed under the opening 430 may include a bent shape, for example, a curved or right-angled structure.

Alternatively, the width w1 of the opening 430 may be formed in a range of 20% to 40% of the entire width of the solder flow prevention jaw 400. The height of the opening 430 may be formed smaller than the height of the solder flow prevention jaw 400. A solder flow prevention jaw 400 may be disposed under the opening 430. A solder flow prevention jaw 400 may be disposed on the opening 430. The solder flow prevention jaw 400 disposed below the opening 430 and above the opening 430 may include a bent shape, for example, a curved surface or a right angle structure.

10 is a cross-sectional view showing a light source module including a light emitting device package according to an embodiment.

10, in the light source module 2000 according to the embodiment, one or a plurality of light emitting device packages 1000 may be disposed on the circuit board 700. A power supply circuit for controlling the driving of the light emitting device package 1000 may be provided on the circuit board 700. Here, since the structure of the light emitting device package 1000 is the same as that of FIG. 1, description thereof is omitted.

The light emitting device package 1000 may be disposed on the circuit board 700. The circuit board 700 may be a printed circuit board (PCB). The circuit board 700 may include at least one of a resin-made PCB, a metal core PCB (MCPCB, Metal Core PCB), a flexible PCB (FPCB), and a rigid PCB.

Pads 710 and 720 may be exposed on the circuit board 700. The pads 710 and 720 may include a first pad 710 and a second pad 720. The first pad 710 and the second pad 720 may electrically connect one or a plurality of light emitting device packages 1000 to the circuit board 700.

The light emitting device package 1000 may be disposed to face the top surface of the circuit board 700. For example, the bottom surface of the light emitting device package 1000 may be disposed to face the top surface of the circuit board 700. In detail, the bottom surfaces of the first and second frames formed on the body 100 may be disposed to face the top surface of the circuit board 700.

The first pad 710 and the second pad 720 are at least one selected from the group consisting of Ti, Cu, Ni, Au, Cr, Ta, Pt, Sn, Ag, P, Fe, Sn, Zn, Al It may include a material or an alloy thereof.

The first pad 710 and the second pad 720 may be spaced apart from each other. The first pad 710 may be disposed at a position corresponding to the first frame in a vertical direction (third direction). The second pad 720 may be disposed at a position corresponding to the second frame in a vertical direction.

The first pad 710 may be electrically connected to the first frame, and the second pad 720 may be electrically connected to the second frame. A conductive portion may be further disposed between the first pad 710 and the first frame.

The light emitting device package 1000 may be fixed to the circuit board 700 by the second solder 800. The second solder 800 may be disposed between the second pad 720 and the light emitting device package 1000 between the first pad 710 and the light emitting device package 1000.

The light source module 2000 according to the embodiment forms an solder flow prevention jaw 4000 in the light emitting device package 1000 to form an underfill member during a reflow process for mounting the light emitting device package 1000 on the circuit board 700 ( 500) has the effect of effectively preventing the body 100 from being peeled off.

100: body
200: light emitting element
300: solder
400: solder flow prevention jaw
500: no underfill

Claims (12)

Body;
A light emitting element disposed on the body;
A solder disposed between the light emitting element and the body;
A solder flow prevention jaw disposed to surround the outer periphery of the light emitting element and including at least one opening on a side surface; And
And an underfill member disposed on the body and covering the side surface of the light emitting device and the solder flow prevention jaw. According to claim 1,
The solder flow prevention jaw has a first side of the light emitting device having a first length and a second side facing the second side facing the first side, and the light emitting device having a second length smaller than the first length. A light emitting device package including a third side of the third and the second side of the fourth side opposite to the third side is disposed to be spaced apart. According to claim 2,
The opening is formed in the first protruding jaw, and the distance between the first side of the light emitting device and the first protruding jaw is less than the distance between the second side of the light emitting device and the second prohibiting jaw. According to claim 2,
The opening is formed in the second protruding jaw, and the distance between the first side of the light emitting device and the first protruding jaw is greater than the distance between the second side of the light emitting device and the second prohibiting jaw. According to claim 2,
The opening is formed in the first protruding jaw and the second protruding jaw, and a distance between the first side of the light emitting device and the first protruding jaw is the same as the distance between the second side of the light emitting device and the second prohibiting jaw. package. According to claim 2,
The opening is formed between a side surface of the first protruding jaw and a side surface of the second protruding jaw, and a distance between the first side of the light emitting device and the first protruding jaw is between the second side of the light emitting device and the second protruding jaw. Light emitting device package equal to distance. According to claim 1,
The opening is a light emitting device package formed to penetrate the side of the solder flow prevention jaw. The method of claim 7,
The solder flow prevention jaw is disposed under the opening, and the height of the solder flow prevention jaw disposed below the opening is less than 1/2 of the height of the opening. The method of claim 8,
A light emitting device package in which the solder flow prevention jaw is disposed on an upper portion of the opening. According to claim 1,
The height of the solder flow prevention jaw is greater than the distance between the light emitting device and the body light emitting device package. According to claim 1,
The distance between the side surface of the light emitting device and the solder flow prevention jaw includes a light emitting device package comprising 100㎛ to 200㎛. Circuit board; And
A light source module including the light emitting device package of any one of claims 1 to 11 on the circuit board.

Images