KR20200080166A - Display device and method of manufacturing the same - Google Patents

Abstract

An object of the present invention is to suppress thermal deterioration at the time of bonding a display panel and an electronic component. A display device in the present invention includes: a display panel in which an end of a wiring is installed on the outer peripheral end surface; an electronic component having a circuit board and a connection electrode provided on one surface of the circuit board, wherein the connection electrode is disposed opposite to the end of the wiring; and a bonding portion for bonding the outer peripheral end surface of the display panel and the electronic component. The bonding portion includes a solder bump provided between the end of the wiring and the connection electrode, and a resin layer provided around the solder bump and the connection electrode on the one surface of the circuit board.

Description

Display device and method of manufacturing the same}

The present invention relates to a display device and a method for manufacturing the display device.

Patent Document 1 discloses a method of manufacturing a connection structure in which electrodes are joined to each other using an anisotropic conductive paste in which solder particles are uniformly dispersed in a thermosetting resin. When heated in the state where the paste is applied between the electrodes, the solder particles contained in the paste self-aggregate to the electrode portion to metal-bond the electrode.

Patent Document 1: Japanese Patent Publication No. 2015-233162

The anisotropic conductive paste exemplified in Patent Document 1 is also used when mounting electronic components on a display panel. However, in order to self-aggregate the anisotropic conductive paste applied between the display panel and the electronic component and bond the wiring portion (electrode portion) of the display panel to the electrode portion of the electronic component, heating may be performed for several minutes at a heating temperature of, for example, 150°C. There is a need. Therefore, there is a concern that the constituent members of the display panel may deteriorate due to the influence of excessive heating.

Accordingly, an object of the present invention is to provide a display device and a method for manufacturing the display device in which thermal deterioration at the time of joining a display panel and an electronic component is suppressed in view of the problems in the above-mentioned prior art.

According to one aspect of the present invention, an electronic component having a display panel having an end portion of a wiring provided on an outer circumferential end surface, a wiring board and a connecting electrode provided on one surface of the wiring board, wherein the connecting electrode is disposed opposite the end of the wiring. And a joining portion for joining the outer peripheral end surface of the display panel and the electronic component, wherein the joining portion comprises a solder bump provided between the end portion of the wiring and the connecting electrode, and on one side of the wiring board. A display device having a resin layer provided around the solder bump and the connection electrode is provided.

According to another aspect of the present invention, a step of applying a self-cohesive solder paste containing a thermosetting resin and solder particles to a surface of a connection electrode provided on a wiring board of an electronic component, and the self-cohesive solder paste at a first heating temperature. Heating to form a solder bump made of the solder particles on the surface of the connecting electrode, while forming a resin layer of the thermosetting resin around the solder bump and the connecting electrode, and an end of the wiring at an outer circumferential end surface A step of aligning the installed display panel and the electronic component such that the ends of the wiring and the solder bumps are disposed opposite each other; and while heating the solder bumps at a second heating temperature, the ends of the wirings and the connection electrodes A method of manufacturing a display device is provided, which includes pressing and pressing in an approaching direction to bond the electronic component and the display panel with the solder bumps.

According to another aspect of the present invention, a step of applying a self-cohesive solder paste containing a thermosetting resin and solder particles to a surface of a connection electrode provided on a wiring board of an electronic component, and the self-cohesive solder paste at a first heating temperature. Heating to form a solder bump made of the solder particles on the surface of the connecting electrode, while forming a resin layer of the thermosetting resin around the solder bump and the connecting electrode, and on the outer peripheral end surface of the display panel. , A process of adhering a thermosetting adhesive layer, and alignment of the display panel and the electronic component so that the ends of the wiring provided on the outer circumferential end surface of the display panel and the solder bumps are disposed to face each other with the adhesive layer interposed therebetween. The step of performing, and heating the solder bump and the adhesive layer to a second heating temperature, pressing the end portion of the wiring and the connection electrode in a direction approaching each other, the electronic component and the display by the solder bump and the adhesive layer A method of manufacturing a display device having a process of bonding panels is provided.

ADVANTAGE OF THE INVENTION According to this invention, the display apparatus which suppressed thermal deterioration at the time of joining a display panel and an electronic component, and the manufacturing method of a display apparatus are provided.

1 is a cross-sectional view showing a part of an organic light emitting display device according to the first embodiment.
2 is a plan view showing a part of the organic light emitting display device according to the first embodiment.
3 is a plan view showing electronic components of the organic light emitting diode display according to the first embodiment.
4 is a flow chart showing a method of manufacturing the organic light emitting display device according to the first embodiment.
5 is a cross-sectional view showing a state in which a self-aggregating solder paste is applied to the surface of an electronic component in the first embodiment.
6 is a cross-sectional view showing a state in which solder bumps are formed on the surface of the connection electrode in the first embodiment.
7 is a cross-sectional view showing a state where an adhesive layer is attached to the solder bump and the resin layer in the first embodiment.
8 is a cross-sectional view showing a state in which electronic components and a display panel are aligned in the first embodiment.
9 is a cross-sectional view showing a state in which the organic light emitting display device is heated and compressed from the electronic component side in the first embodiment.
10 is a cross-sectional view showing a part of the organic light emitting display device according to the second embodiment.
11 is a plan view showing a state in which a self-cohesive solder paste is applied to the surface of an electronic component in the second embodiment.
12 is a plan view showing a state in which solder bumps are formed on the surface of the connection electrode in the second embodiment.
13 is a cross-sectional view showing a state in which solder bumps are formed on the surface of the connection electrode in the second embodiment.
14 is a plan view showing an electronic component after a heating and pressing process in the second embodiment.
15 is a cross-sectional view showing a part of the organic light emitting diode display in the third embodiment.
16 is a cross-sectional view showing a state where an adhesive layer is attached to the solder bump and the resin layer in the third embodiment.
17 is a cross-sectional view showing a state in which the electronic components and the display panel are aligned in the third embodiment.
18 is a cross-sectional view showing a state in which the organic light emitting display device is heated and compressed from the electronic component side in the third embodiment.

Hereinafter, the present invention will be described in detail with reference to the drawings. In addition, in this embodiment, each drawing is a schematic drawing for description, and it is not according to dimensions. In particular, a number of repetitive elements are shown by greatly reducing the quantity for clarity of the city.

<First Embodiment>

1 is a cross-sectional view showing a part of the organic light emitting display device 100 according to the present embodiment. 2 is a plan view showing a part of the organic light emitting diode display 100. In the following description, the directions of the two sides that define the display surface of the display panel 110 are referred to as the X direction and the Y direction, respectively, and the direction perpendicular to the display surface (that is, the direction perpendicular to the XY plane) is the Z direction. It is said.

As illustrated in FIG. 1, the organic light emitting diode display 100 includes a display panel 110 and electronic components 120. The display panel 110 includes an element substrate 111, an opposing substrate 112, an organic light emitting element layer 113, a passivation layer 114, a wiring portion 115, a seal material 116, and a filler 117. It contains.

The element substrate 111 is, for example, a glass substrate. In addition, a barrier layer (not shown) is formed on the element substrate 111. The material of the barrier layer is not particularly limited as long as it is a material having shielding properties against oxygen and moisture, and examples thereof include silicon oxide, silicon nitride, and aluminum oxide. In addition, the barrier layer may be a single layer or a stacked structure of two or more layers. Furthermore, a TFT layer (not shown) including a thin film transistor (TFT) constituting a driving circuit for driving the organic light emitting element layer 113 is formed on the barrier layer.

The counter substrate 112 is, for example, a glass substrate. The display device of the front emission type can be configured by positioning the counter substrate 112 having transparency in the emission direction (Z direction) of the organic light emitting element layer 113. The counter substrate 112 is adhered and fixed on the seal material 116 and the filler 117. In addition, the element substrate 111 and the counter substrate 112 are not limited to a glass substrate, and substrates of various materials such as a resin substrate and a printed substrate can be used.

The organic light emitting element layer 113 is provided on the TFT layer described above. The organic light emitting element layer 113 includes an organic light emitting element (not shown) and a bank (not shown). The organic light emitting device has an anode (anode), an organic compound layer (organic light emitting layer) formed on the anode, and a cathode (cathode) formed on the organic compound layer. In addition, the organic compound layer has a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in order from the anode side. In addition, each layer constituting the organic light emitting element layer 113 can be formed using a known material.

As the anode, for example, a reflective electrode made of a thin film of a material having high reflectivity such as aluminum, silver, platinum, and chromium, and a thin film of transparent conductive oxide such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide) are formed on the thin film. One reflective electrode is used.

The organic compound layer includes, for example, an organic compound layer for R that emits red light, an organic compound layer for G that emits green light, and an organic compound layer for B that emits blue light according to sub-pixels constituting a pixel. The organic compound layers for R, G, and B are made of a known material corresponding to each emission color.

As the cathode, a translucent electrode or a transparent electrode made of a thin film such as silver, silver alloy, ITO, or IZO is used, for example.

The bank is formed to partition the pixel, for example, to cover the end of the anode. That is, the bank serves as a pixel defining layer defining pixels. As the bank, for example, an organic film such as an acrylic resin and an epoxy resin is used.

The passivation layer 114 is provided on the top and side surfaces of the organic light emitting element layer 113 as if covering the organic light emitting element layer 113. The passivation layer 114 is made of an inorganic film having low moisture permeability, and functions as a protective film that protects the organic light emitting element layer 113 from oxygen and moisture. As the passivation layer 114, for example, a silicon oxide film, a silicon nitride film, or the like is used.

The wiring unit 115 is a plurality of wirings having a data line and a gate line (not shown) and the TFT layer described above, and extends from the organic light emitting element layer 113 side to the outer peripheral end surface of the display panel 110. have. The wiring portion 115 can be formed of a single-layer structure made of a single body of a low-resistance conductive material such as copper (Cu) or aluminum (Al), for example. In addition, the wiring section 115 is a stacked structure of a single body of a low-resistance conductive material such as copper (Cu) or aluminum (Al), and a single body of materials such as chromium (Cr), molybdenum (Mo), and titanium (Ti). It may be formed by.

The sealing material 116 is provided around the plurality of organic light emitting element layers 113 formed on the element substrate 111. The sealing material 116 is made of a resin such as a thermosetting resin or a photocurable resin. As the material of the sealing material 116, for example, an epoxy resin, an acrylic resin, or the like is used.

On the sealing material 116, an opposing substrate 112 is provided to face the element substrate 111. The sealing material 116 is provided between the element substrate 111 (barrier layer) and the counter substrate 112, and functions as an adhesive member between the substrates by curing with heat and light. The sealing material 116 also functions as a shielding member that prevents moisture or the like from permeating the inside of the display panel 110.

The filler 117 is filled in a space region surrounded by the passivation layer 114, the seal material 116 and the counter substrate 112. The filler 117 is made of a resin such as a thermosetting resin or a photocurable resin, similarly to the sealing material 116. The filler 117 functions as an adhesive member of the substrate by curing with heat and light (ultraviolet rays) like the seal material 116.

As shown in FIG. 1, each position of the outer circumferential end surface of the element substrate 111, the outer circumferential end surface of the opposing substrate 112, and the end surface of the wiring section 115 is coincident in the Z direction. The outer circumferential end surfaces of the display panel 110 are formed by these end surfaces.

3 is a plan view illustrating the electronic component 120 of the organic light emitting diode display 100. The electronic component 120 includes a film-like wiring board 120a made of COF (Chip on Film), and chip components 120b such as LSI (Large Scale Integration). On the surface 120d of the wiring board 120a, five connection electrodes 120c that are bonded to each wiring portion 115 of the display panel 110 are formed. Each connection electrode 120c is formed of a conductive material capable of bonding with solders such as copper (Cu), tin (Sn), lead (Pb), zinc (Zn), silver (Ag), for example.

In addition, as shown in FIGS. 1 and 2, the connection electrode 120c of the electronic component 120 is provided on the outer circumferential end surface of the display panel 110 by the solder bumps 130b. The end is solder-bonded. In addition, portions other than the connecting electrode 120c of the electronic component 120 are adhered and fixed by the adhesive layer 140. The pitch between the ends of the plurality of wiring portions 115 in the display panel 110 and the electrode pitch of the connecting electrode 120c in the electronic component 120 are preferably 10 to 150 μm, for example.

The self-cohesive solder paste 130 is an anisotropic conductive paste in which solder particles are uniformly dispersed in a thermosetting resin and a thermosetting resin. The solder particles are formed from a solder alloy material containing copper (Cu), tin (Sn), or the like. The thermosetting resin is formed from a material having a lower melting point than the solder particles. As the thermosetting resin, for example, an epoxy resin having an melting point of 90°C to 150°C, an acrylic resin, a urethane resin, or a silicone resin can be used. Here, it is assumed that the thermosetting resin exhibits fluidity when it reaches the melting point or higher.

1 and 2, the thermosetting resin constituting the self-cohesive solder paste 130 is cured by heating on the surface of the wiring board 120a around the connecting electrode 120c. Is formed. Further, a solder bump 130b is provided on the outer circumferential end surface of the display panel 110 between the end of the wiring section 115 and the connection electrode 120c of the electronic component 120. The solder bumps 130b are formed by self-aggregation of solder particles in a thermosetting resin fluidized by heating.

The adhesive layer 140 is formed of, for example, a non-conductive film (NCF) having thermosetting properties. The non-conductive film contains a polymer resin. As the polymer resin, an epoxy resin, an acrylic resin, or the like is used. In this embodiment, the bonding portion between the display panel 110 and the electronic component 120 is constituted by the resin layer 130a, the solder bumps 130b, and the adhesive layer 140 described above.

1 and 2, the display panel 110 on which the electronic component 120 is mounted has a bezel 150 constituting a non-display area of the organic light emitting diode display 100 in its outer circumferential direction. Installed. The bezel 150 includes a side plate portion 150a positioned in an outer circumferential direction of an outer circumferential end surface of the display panel 110 and an inner side (X direction in the drawing) of the display panel 110 from one end of the side plate portion 150a. It extends toward, and has a front plate portion 150b surrounding the display surface of the display panel 110. In Fig. 2, the frame portion formed by the side plate portion 150a and the front plate portion 150b is illustrated by a double-dashed line. Since the electronic component 120 is joined to the outer circumferential end surface (the side surface of the panel) of the display panel 110, the value of the width W of the frame portion becomes small. It is preferable that the width W of the bezel 150 in this embodiment is 0.5 mm or less, for example.

Subsequently, a method of manufacturing the organic light emitting display device 100 according to the present embodiment will be described in detail with reference to FIGS. 4 to 9. 4 is a flowchart showing a method of manufacturing the organic light emitting display device 100 according to the present embodiment.

First, as shown in FIG. 5, a self-aggregating solder paste 130 is applied to the surface of the connecting electrode 120c provided on the wiring board 120a of the electronic component 120 (step S11). As the coating method, for example, methods such as screen printing, printing using a mesh mask, and ejection by an inkjet method are used.

Next, the electronic component 120 coated with the self-cohesive solder paste 130 is heated, for example, in a reflow furnace (not shown) heated to 160° C. or on a hot plate (not shown) for 3 minutes. Thereby, as shown in Fig. 6, solder bumps 130b are formed on the surface of the connecting electrode 120c by self-aggregation of the solder particles (step S12).

In Fig. 6, the solder bump 130b has a hemispherical protrusion shape due to the surface tension. In addition, the thermosetting resin contained in the self-cohesive solder paste 130 is heat-cured at a position including the solder bumps 130b and the connecting electrodes 120c on the wiring board 120a to form the resin layer 130a. .

Next, as shown in FIG. 7, the adhesive layer 140, which is a non-conductive film, is attached as if the surfaces of the connecting electrodes 120c, the solder bumps 130b, and the resin layer 130a are all covered (step S13).

Next, as shown in FIG. 8, the adhesive layer 140 is faced downward, and the adhesive layer 140 is sandwiched between the display panel 110 and the electronic component 120 while each of the display panels 110 is inserted. Position alignment of the end portion of the wiring section 115 and each connection electrode 120c on the electronic component 120 side is performed (step S14.).

And, as shown in Figure 9, the solder bumps 130b and the adhesive layer 140, for example, while heating at 150 °C for a few seconds (for example, for 5 seconds), while the electronic component 120 side, The end portion of the wiring portion 115 and the connection electrode 120c are pressed in a direction in which they approach each other (in the downward direction in FIG. 9 ). Thereby, the electronic component 120 and the display panel 110 are joined by the solder bumps 130b and the adhesive layer 140 (step S15).

When the solder bump 130b is partially melted by the second heating (step S15), the solder bump 130b is metal-bonded with the component metal of the wiring portion 115, between the wiring portion 115 and the connection electrode 120c. The solder bumps 130b are joined. Moreover, in FIG. 9, the shape of the solder bump 130b changes in the up-down and left-right directions by pressure. At the same time, the adhesive layer 140 bonds between the outer peripheral end surface of the display panel 110 and the electronic component 120 (wiring board 120a and resin layer 130a) at portions other than the solder bumps 130b. By cooling the display panel 110 and the electronic component 120, bonding of the electronic component 120 to the display panel 110 is completed.

As described above, according to the organic light emitting display device 100 according to the present embodiment, the solder bumps 130b are previously formed on the surface of the connection electrode 120c of the electronic component 120 by the first heating step, The wiring 115 of the display panel 110 and the connection electrode 120c of the electronic component 120 are joined by solder bumps 130b. Since the self-aggregation of the solder particles has already been completed, it is not necessary to apply excessive heat for a long time when the outer peripheral end surface of the display panel 110 and the electronic component 120 are joined, that is, in the second heating process. For this reason, it is possible to provide a high-quality display device that suppresses thermal deterioration of components (for example, light-emitting elements) of the display panel 110 during manufacturing.

In addition, in this embodiment, the heating time for the solder bumps 130b and the adhesive layer 140 in the second heating process (for example, for several seconds) is the self-cohesive solder paste 130 in the first heating process. ) Is shorter than the heating time (for 3 minutes). Moreover, the heating temperature in the second heating process (for example, 150°C or less) is lower than the heating temperature in the first heating process (for example, 160°C). By performing the heating in two steps as described above, thermal deterioration of components (for example, light-emitting elements) of the display panel 110 at the time of manufacture can be suppressed.

In addition, in the present embodiment, the electronic component 120 is attached to the outer circumferential end surface of the display panel 110 by the adhesive force of the adhesive layer 140 instead of the thermosetting resin contained in the self-cohesive solder paste 130. As a result, the adhesive strength between the outer circumferential end surface of the display panel 110 and the electronic component 120 is improved.

Further, in the present embodiment, the solder bumps 130b are metal-connected to the wiring portion 115 of the display panel 110 at one end and the connection electrode 120c of the electronic component 120 at the other end. Therefore, it is possible to increase the reliability of the device against vibration and shock from the outside.

In addition, in the present embodiment, as shown in FIG. 9, the thermocompressing device (heating device 160) is brought into contact with the end surface of the wiring board 120a positioned on the opposite side of the display panel 110, thereby wiring The solder bumps 130b and the adhesive layer 140 are being heated by heat transfer from the substrate 120a. By making the heating position away from the display panel 110, excessive heating to the constituent members of the display panel 110 can be further suppressed.

Moreover, in this embodiment, pad printing using silver (Ag) paste is not performed on the side region (outer circumferential end surface) where electrodes are drawn from the inside of the display panel 110, and the ends of the wiring portions 115 are solder bumps. It is directly bonded to 130b. Therefore, there is an advantage that the migration problem caused by silver (Ag) does not occur.

<Second Embodiment>

Subsequently, the organic light emitting display device 200 according to the second embodiment will be described. In addition, in the drawing of 1st Embodiment, the code|symbol attached|subjected and the code|symbol shared in common represent the same object. Hereinafter, descriptions of parts common to those of the first embodiment will be omitted, and description will be mainly focused on the configuration and operation different from those of the first embodiment.

10 is a cross-sectional view showing a part of the organic light emitting display device 200 according to the present embodiment. As shown in Fig. 10, the cross-sectional structure of the organic light emitting display device 200 in this embodiment is substantially the same as the organic light emitting display device 100 shown in Fig. 1, and the solder bumps in the Z direction are shown. Only the length of (130b) is different. This difference is caused by the difference in the application area and the application amount in the application process of the self-cohesive solder paste 130. Hereinafter, the heating and pressing process will be described from the coating step of the self-cohesive solder paste 130 in the present embodiment.

11 is a plan view showing a state in which the self-cohesive solder paste 130 is applied on the electronic component 120 in the present embodiment. Here, five connection electrodes 120c of length L1 are provided on the surface of the wiring board 120a of the electronic component 120. The self-cohesive solder paste 130 is applied to the central region as though five connection electrodes 120c were worn.

12 and 13 are a plan view and a cross-sectional view showing a state in which the self-aggregating solder paste 130 in this embodiment self-aggregates. As shown in FIGS. 12 and 13, as the electronic component 120 in the state of FIG. 11 is heated, the self-cohesive solder paste 130 and the solder bumps 130b formed in the central portion of the connection electrode 120c , Turned into a resin layer 130a formed around the solder bumps 130b and the connecting electrode 120c.

12, the length in the longitudinal direction of the solder bump 130b is L2, which is the same as the length of the self-aggregating solder paste 130 applied in FIG. In this embodiment, the length L2 of the solder bump 130b after heating is made sufficiently shorter than L1 by changing the application width of the self-cohesive solder paste 130. It is preferable to adjust the length L2 of the solder bump 130b to 50% or less of the length L1 of the connection electrode 120c. For example, when the length L1 of the connection electrode 120c is 1 mm, the length of the solder bump 130b can be adjusted to 0.3 mm by setting the application width of the self-aggregating solder paste 130 to 0.3 mm.

Further, as shown in Fig. 13, the solder bumps 130b are formed at a height H on each connecting electrode 120c. It is preferable that the height H of the solder bump 130b is 50 μm or less, for example. The coating amount of the self-cohesive solder paste 130 is adjusted according to the height H of the solder bump 130b to be formed. Further, the appropriate height of the solder bumps 130b may be determined depending on the lateral width of the connecting electrode 120c and the pitch width between the electrodes.

14 is a plan view showing the electronic component 120 after the heating and pressing process in the present embodiment. The display panel 110 compressed to the electronic component 120 is omitted and displayed. As shown in FIG. 14, the solder bumps 130b respectively formed on the five connection electrodes 120c are expanded outward from the state in FIG. 12 by pressing. The length L3 in the longitudinal direction was longer than the length L2 in FIG. 12. However, the length L3 of the solder bump 130b is sufficiently shorter than the length L1 of the connection electrode 120c. That is, when the self-cohesive solder paste 130 is applied as shown in Figs. 11 to 13, the solder bumps 130b do not protrude from the connecting electrode 120c even after compression.

As described above, according to the organic light emitting display device 200 according to the present embodiment, the application width of the self-aggregating solder paste 130 has the length in the longitudinal direction of the solder bumps 130b as the electronic component 120. The connection electrode 120c is adjusted to be 50% or less of the length. Therefore, it is possible to prevent the solder bumps 130b from protruding outwardly from the connection electrode 120c in the heating and compression process. That is, it is possible to suppress the short circuit between the electrodes due to the solder bump 130b protruding.

Moreover, in this embodiment, the self-cohesive solder paste 130 is applied in an application amount such that the height of the solder bumps 130b after heating becomes a thickness of 50 μm or less. Thereby, the short-circuit suppression effect between the electrodes described above can be further enhanced.

<Third embodiment>

Next, the organic light emitting diode display 300 in the third embodiment will be described. In addition, in the drawing of 1st Embodiment, the code|symbol attached|subjected and the code|symbol common to the same code|symbol represent the same object. Hereinafter, description of parts common to the first embodiment will be omitted, and a description will be given focusing on a configuration and operation different from the first embodiment.

15 is a cross-sectional view showing a part of the organic light emitting diode display 300 in the present embodiment. As illustrated in FIG. 15, the organic light emitting diode display 300 according to the present embodiment includes a conductive ball 171 in the adhesive layer 170 and the solder bump 130b, and the adhesive layer 170 This anisotropic conductive film (ACF) is different from the first embodiment in that it is made of an anisotropic conductive film (ACF). Hereinafter, the heating and pressing process will be described from the step of attaching the adhesive layer 170 in the present embodiment.

16 is a view showing a state where the adhesive layer 170 is attached to the solder bumps 130b and the resin layer 130a in the present embodiment. Here, it is shown that the conductive ball 171 is dispersed in the adhesive layer 170 made of an anisotropic conductive film. In addition, the conductive ball 171 of the present embodiment is formed by plating a metal surface that can be bonded to a solder such as copper (Cu), nickel (Ni), or tin (Sn) on a plastic spherical surface. The diameter of the conductive ball 171 is preferably 1 to 30 μm, for example.

17 is a diagram showing a state in which the electronic components 120 and the display panel 110 are aligned in this embodiment. Here, as in FIG. 8 described above, the adhesive layer 170 is faced downward, and the adhesive layer 170 is sandwiched between the display panel 110 and the electronic component 120 while each of the display panels 110 is inserted. Positioning of the ends of the wiring unit 115 and each connection electrode 120c on the electronic component 120 side is performed.

18 is a diagram showing a state in which the organic light emitting display device 300 is heated and compressed from the electronic component 120 side in the present embodiment. Here, as in FIG. 9 described above, the solder bump 130b and the adhesive layer 170 are heated at 150° C. or lower for several seconds (for example, for 5 seconds), while the electronic component 120 side is heated. , The end portion of the wiring portion 115 and the connection electrode 120c are pressed in a direction approaching each other. In addition, in FIG. 18, it is also illustrated that a portion of the conductive ball 171 of the adhesive layer 170 is accommodated in the solder bump 130b melted by heating.

As described above, according to the organic light emitting display device 300 according to the present embodiment, the conductive ball 171 included in the adhesive layer 170 serves as a spacer in the heating/pressing process, and excessive compression can be suppressed. have. In addition, since the conductive ball 171 is plated with a metal such as nickel, there is also an advantage in that electrical continuity between the connecting electrode 120c and the end of the wiring portion 115 can be taken in the same manner as the solder bump 130b.

<Modified embodiment>

Although the preferred embodiment of the present invention has been described above, the present invention can be modified in various aspects as shown below, for example.

In the above-described embodiment, a case where a non-conductive film (adhesive layer 140) is attached to the electronic component 120 (wiring board 120a) side on which the solder bumps 130b are previously formed on the surface of the connection electrode 120c Although described, the place of attachment is not limited to this. A non-conductive film may be attached to the display panel 110 side as if covering the surface of the wiring portion 115 on the display panel 110 side.

Further, in the above-described embodiments, the organic light emitting display devices 100, 200, and 300 are illustrated as display devices, but the present invention is similarly applied to the mounting of electronic components 120 in liquid crystal display devices, plasma display devices, and the like. can do.

In addition, in the above-described embodiment, the organic light emitting element layer 113 includes an organic compound layer for R that emits red light, an organic compound layer for G that emits green light, and an organic compound layer for B that emits blue light. Although illustrated, the display method is not limited to this. For example, the pixel may have a configuration in which a light emitting element having a red emission color, a light emitting element having a green emission color, a light emitting element having a blue emission color, and a light emitting element having a white emission color may be provided. In addition, a structure in which all light-emitting elements have the same light-emitting color (for example, white or blue) and a color filter necessary for each pixel is added may be employed.

Moreover, in the above-described embodiment, the case where the solder bumps 130b are directly bonded to the end portion of the wiring section 115 of the display panel 110 has been described, but the structure of the bonding section is not limited to this. For example, a bonding pad may be provided at the end, and the bonding pad and the solder bumps 130b may be metal-bonded. The bonding pad can be formed by using copper (Cu) or silver (Ag) paste or nano ink, and using screen printing, printing using a mesh mask, or inkjet that can eject material microscopically.

100, 200, 300: organic light emitting display device
110: display panel
111: device substrate
112: opposite substrate
113: organic light emitting device layer
114: passivation layer
115: wiring part
116: Seal material
117: filler
120: electronic components
120a: wiring board
120b: chip parts
120c: connection electrode
130: self-cohesive solder paste
130a: thermosetting resin
130b: solder bump
140: adhesive layer (NCF)
150: bezel
150a: side plate
150b: front panel
160: thermocompression device
170: adhesive layer (ACF)
171: conductive ball

Claims (12)

A display panel having an end portion of the wiring provided on an outer peripheral end surface;
An electronic component having a wiring board and a connecting electrode provided on one surface of the wiring board, wherein the connecting electrode is disposed opposite the end of the wiring;
And a joining portion for joining the outer peripheral end surface of the display panel and the electronic component,
The junction,
A solder bump provided between the end of the wiring and the connecting electrode,
A display device having a resin layer provided around the solder bump and the connection electrode on the one side of the wiring board.
According to claim 1,
The solder bump is a display device that is metal-bonded to the end of the wiring at one end and the connection electrode at the other end.
The method according to claim 1 or 2,
The bonding portion is provided between the resin layer and the outer circumferential end surface of the display panel, and further includes an adhesive layer that adheres the outer circumferential end surface of the display panel to the electronic component in portions other than the solder bumps. .
The method of claim 3,
The adhesive layer is a display device made of a non-conductive film.
The method according to claim 1 or 2,
The wiring and the connecting electrode are made of any one of copper, tin, lead, and silver.
A step of applying a self-cohesive solder paste containing a thermosetting resin and solder particles to the surface of the connecting electrode provided on the wiring board of the electronic component;
The self-cohesive solder paste is heated to a first heating temperature to form a solder bump made of the solder particles on the surface of the connecting electrode, while forming a resin layer of the thermosetting resin around the solder bump and the connecting electrode. Fairness,
A process of aligning the display panel and the electronic component with the ends of the wirings arranged on the outer circumferential end surfaces such that the ends of the wirings and the solder bumps are disposed opposite each other;
A display device comprising a step of bonding the electronic component and the display panel by the solder bumps by pressing the solder bumps in a direction in which the ends of the wirings and the connection electrodes approach each other while heating to a second heating temperature. Manufacturing method.
The method of claim 6,
And a step of attaching an adhesive layer to the surface of the solder bump and the resin layer.
A step of applying a self-cohesive solder paste containing a thermosetting resin and solder particles to the surface of the connecting electrode provided on the wiring board of the electronic component;
The self-cohesive solder paste is heated to a first heating temperature to form a solder bump made of the solder particles on the surface of the connecting electrode, while forming a resin layer of the thermosetting resin around the solder bump and the connecting electrode. Fairness,
Attaching a thermosetting adhesive layer to the outer circumferential end surface of the display panel;
A step of aligning the display panel and the electronic component such that an end portion of a wiring provided on an outer circumferential end surface of the display panel and the solder bump are disposed to face each other with the adhesive layer interposed therebetween;
A process of bonding the electronic component and the display panel by the solder bump and the adhesive layer by pressing the solder bump and the adhesive layer at a second heating temperature while pressing the end portion of the wiring and the connection electrode in a direction approaching each other. Method for manufacturing a display device comprising a.
The method according to any one of claims 6 to 8,
The heating time for the solder bumps is shorter than the heating time for the self-aggregating solder paste, and the second heating temperature is lower than the first heating temperature.
The method according to any one of claims 6 to 8,
The self-cohesive solder paste is a display device manufacturing method in which the length in the longitudinal direction of the solder bump after heating is applied with an application width of 50% or less of the length in the longitudinal direction of the connection electrode.
The method of claim 10,
The self-cohesive solder paste is a method of manufacturing a display device that is applied in a coating amount such that the height of the solder bump after heating becomes 50 μm or less.
The method according to any one of claims 6 to 8,
A method of manufacturing a display device for heating the solder bump by bringing a heating device adjusted to the second heating temperature into contact with an end surface of the wiring board located on the opposite side of the display panel.

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