KR20200068500A - Anisotropic conductive film, display device comprising the same and/or semiconductor device comprising the same - Google Patents

Abstract

The present invention provides an anisotropic conductive film, a display device including the same and/or a semiconductor device including the same. The anisotropic conductive film comprises: an insulating adhesive; and a conductive particle included in the insulating adhesive and having a relative dielectric constant of 2.51 to 3.0. Therefore, the anisotropic conductive film is provided with improved reliability in connection resistance and adhesion.

Description

Anisotropic conductive film and/or display device comprising the same and/or semiconductor device including the same {ANISOTROPIC CONDUCTIVE FILM, DISPLAY DEVICE COMPRISING THE SAME AND/OR SEMICONDUCTOR DEVICE COMPRISING THE SAME}

The present invention relates to an anisotropic conductive film and/or a display device comprising the same and/or a semiconductor device comprising the same.

When the anisotropic conductive film is placed between circuit terminals to be connected and then subjected to heating and pressurization under a certain condition, the conductive particles are electrically connected between the circuit terminals by conductive particles and filled with an insulating adhesive between adjacent electrodes. By being present independently of each other, insulation is imparted.

In recent years, according to the trend of high image quality of the optical display device, the pitch between the bumps, which are circuit electrodes of the IC chip, is narrowed or the area of the bumps is narrowed. Accordingly, when connecting by an anisotropic conductive film, the conductive particles are likely to flow out between the circuit electrodes, and short-circuiting is likely to occur. In addition, there is a problem that a malfunction of the display device may occur due to electrostatic induction and induced current due to conductive particles between circuit electrodes during connection. Moreover, as the pitch becomes narrower and the area becomes narrower, when the conductive particles are excessively included in the anisotropic conductive film, the possibility of short-circuiting and malfunctioning becomes higher.

Background art of the present invention is disclosed in Japanese Patent Registration No. 3419436 and the like.

An object of the present invention is to provide an anisotropic conductive film capable of preventing short circuit occurrence and malfunction of the display device even when used in a connection member having a narrow connection pitch or a small area.

Another object of the present invention is to provide an anisotropic conductive film that may have no short-circuiting or malfunction-producing problems even if it contains an excessive amount of conductive particles.

Another object of the present invention is to provide an anisotropic conductive film excellent in reliability in connection resistance and adhesion.

1. The anisotropic conductive film of the present invention includes an insulating adhesive and conductive particles contained in the insulating adhesive and having a specific permittivity of 2.51 to 3.0.

2. In 1, the conductive particles include conductive fine particles and an insulating resin layer formed on the surface of the conductive fine particles, and the insulating resin layer includes an aromatic group-containing monomer, an acid anhydride-based monomer, and trifunctional to hexafunctional (meth)acrylic. And an insulating resin polymerized from a monomer mixture containing a rate.

3. In 2, the insulating resin layer may be a single layer.

4. In 2, the insulating resin layer may have a specific dielectric constant of 0.5 to 4.

5. In 2, the trifunctional to hexafunctional (meth)acrylate may have an isocyanurate group.

6. In 2, the monomer mixture may include the aromatic group-containing monomer, the acid anhydride-based monomer, and the six-functional (meth)acrylate.

7. In 2, the aromatic group-containing monomer in the monomer mixture of the insulating resin is 40% by weight to 75% by weight, the acid anhydride-based monomer is 5% by weight to 40% by weight, and the trifunctional to hexafunctional (meth)acrylic The rate may be included in 5% to 20% by weight.

8. In 2, the aromatic group-containing monomer is styrene, and the acid anhydride-based monomer may be maleic anhydride.

9. In 2, the monomer mixture may further include a divinylbenzene-based monomer.

In 10. 2, the monomer mixture may further include (meth)acrylic acid.

11. In 2, the conductive fine particles may have protrusions formed on the surface.

In 12. 11, the conductive fine particles may have a specific permittivity of 10,000 or more.

13. In 1-12, the conductive particles may be included in 10% to 40% by weight of the anisotropic conductive film.

14. In 1-13, the conductive particles may have an average particle diameter (D50) of 2 μm to 10 μm.

15. In 1-14, the insulating adhesive may be an epoxy-based, urethane-based or (meth)acrylate-based.

16. In 1-15, the insulating adhesive may be formed of a composition comprising a binder resin, a curable compound, and an initiator.

In 17. 16, the composition may further include at least one of an inorganic filler, a silane coupling agent, and an additive.

The display device and/or semiconductor device of the present invention includes the anisotropic conductive film of the present invention.

The display device and/or semiconductor device of the present invention are connected by the anisotropic conductive film of the present invention.

The present invention provides an anisotropic conductive film capable of preventing short circuit occurrence and malfunction of a display device even when used in a connection member having a narrow connection pitch or a small area.

The present invention provides an anisotropic conductive film that may have no short-circuiting or malfunction-producing problems even if it contains an excessive amount of conductive particles.

The present invention provides an anisotropic conductive film having excellent reliability in connection resistance and adhesion.

The present invention will be described in more detail by the following examples. However, the technology disclosed in the present application is not limited to the embodiments described herein and may be embodied in other forms. However, the embodiments introduced herein are provided to ensure that the disclosed contents are thorough and complete, and that the spirit of the present application is sufficiently conveyed to those skilled in the art.

"Average particle diameter" as used herein means D50. The "average particle diameter D50" means a common particle diameter known to those skilled in the art, and means a particle diameter of conductive particles, conductive fine particles, and core corresponding to 50% by weight when each of the conductive particles, conductive fine particles, and cores is distributed by weight. .

As used herein, “(meth)acrylate” means acrylate and/or methacrylate.

When describing a numerical range in this specification, "X to Y" means X or more and Y or less (X≤ and ≤Y).

In the present specification, "conductive fine particles" means fine particles not having an insulating resin layer coated on the surface, and "conductive particles" means particles having an insulating resin layer coated on the surface of the conductive fine particles.

“Relative permittivity” in this specification is a value measured by a conventional method at 25°C. The conductive fine particles and the conductive particles may have respective specific permittivity ranges as described below in the diameter ranges of the conductive fine particles and the conductive particles described below. With respect to the insulating resin layer, the relative dielectric constant in the thickness range of the insulating resin layer described below and the specific dielectric constant of the insulating resin layer having a thickness of 3 µm were not so large that the error of the relative dielectric constant was large enough to affect the specific dielectric constant of the conductive particles.

The inventor of the present invention includes conductive particles having a specific inductive capacity of 2.51 to 3.0 in an anisotropic conductive film, and thus is excellent in reliability in connection resistance and adhesion, and used in connection members having a narrow connection pitch and/or area Even if there was no aggregation of the dispersed conductive particles, there was no short circuit and the malfunction of the display device did not occur, and the present invention was completed.

Hereinafter, an anisotropic conductive film of one embodiment of the present invention will be described.

The anisotropic conductive film includes conductive particles contained in the insulating adhesive and the insulating adhesive and has a specific permittivity of 2.51 to 3.0. The term “included in the insulating adhesive” means not only when the conductive particles are completely impregnated in the insulating adhesive, but also when the at least one surface of the conductive particles is exposed on the surface of the insulating adhesive.

When the specific dielectric constant of the conductive particles is less than 2.51, it may be difficult to secure insulating properties due to difficulty in expanding and improving flowability of an insulating adhesive or anisotropic conductive film. When the specific permittivity of the conductive particles is greater than 3.0, when the connection pitch and/or the connection member having a small area is used, the dispersed conductive particles are easily aggregated, and short and malfunction may occur, and high reliability of connection resistance and adhesion can be obtained. There may be no energization or an error caused by the induced current. Preferably, the specific dielectric constant of the conductive particles may be 2.6 to 2.8.

The conductive particles include conductive fine particles and an insulating resin layer coated on at least a portion of the surface of the conductive fine particles, and the insulating resin layer contains an aromatic group-containing monomer, an acid anhydride-based monomer, and trifunctional to hexafunctional (meth)acrylate. An insulating resin polymerized from a containing monomer mixture may be included. By forming the insulating resin layer with the above-mentioned insulating resin, the dielectric constant of the conductive particles of the present invention can reach 2.51 to 3.0.

The aromatic group-containing monomer may include a styrene-based monomer, but is not limited thereto. The styrene-based monomers may include alkyl-substituted styrenes such as styrene, methyl styrene, and ethyl styrene, halogenated styrenes such as chlorostyrene, and halogenated styrenes such as chloromethyl styrene. The aromatic group-containing monomer may be included in 40% to 75% by weight of the monomer mixture, preferably 50% to 75% by weight. In the above range, the specific permittivity of the present invention can be secured, and an effect of insulation and heat resistance may be obtained.

The acid anhydride-based monomer may include, but is not limited to, maleic anhydride, fumaric anhydride, and the like. The acid anhydride-based monomer may be included in the monomer mixture of 5% to 40% by weight, preferably 5% to 20% by weight, and more preferably 8% to 15% by weight. In the above range, the specific permittivity of the present invention can be secured, and excellent dispersibility and reliability can be increased.

The trifunctional to hexafunctional (meth)acrylate is polymerized with an aromatic group-containing monomer and an acid anhydride-based monomer to increase the crosslinking degree of the insulating resin layer, thereby lowering the specific dielectric constant of the conductive particles.

Trifunctional to hexafunctional (meth)acrylates include trimethylolpropane tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, propionic acid-modified dipentaerythritol tri(meth)acrylate, and pentae Trifunctional (meth) such as thritol tri(meth)acrylate, propylene oxide-modified trimethylolpropane tri(meth)acrylate, trifunctional urethane (meth)acrylate or tris(meth)acryloxyethylisocyanurate Acrylate; Tetrafunctional (meth)acrylates such as diglycerin tetra(meth)acrylate or pentaerythritol tetra(meth)acrylate; 5-functional (meth)acrylates such as dipentaerythritol penta(meth)acrylate; And six-functional (meth)acrylates such as dipentaerythritol hexa(meth)acrylate and caprolactone-modified dipentaerythritol hexa(meth)acrylate.

Preferably, a (meth)acrylate having an isocyanurate group among trifunctional to hexafunctional (meth)acrylates (e.g. tris(meth)acryloxyethylisocyanurate), hexafunctional (meth)acrylate (Example: dipentaerythritol hexa(meth)acrylate). These can lower the specific permittivity by providing hydrophobicity to the insulating resin layer or increasing the degree of crosslinking. In one embodiment, the degree of crosslinking of the insulating resin layer may be 85% or more, for example, 90% to 100%. Within this range, the specific permittivity of the conductive particles can be reached.

The trifunctional to hexafunctional (meth)acrylate may be included in 5% to 20% by weight, preferably 5% to 15% by weight, more preferably 7% to 15% by weight of the monomer mixture. have. In the above range, the specific permittivity of the present invention can be secured, and an effect of increasing reliability and weatherability may be obtained.

The monomer mixture may further include a crosslinkable polymerizable monomer including a divinylbenzene-based monomer containing divinylbenzene. The divinylbenzene-based monomer can ensure a specific dielectric constant even when the content of other monomers other than the divinylbenzene-based monomer is relatively reduced. The crosslinkable polymerizable monomer may be included in 5% to 30% by weight of the monomer mixture, preferably 10% to 25% by weight. In the above range, there may be effects of reducing the specific dielectric constant and increasing the reliability.

The monomer mixture may further include (meth)acrylic acid. The (meth)acrylic acid can increase the bonding force between the conductive particles and the insulating adhesive through bonding with a binder resin and a radically polymerizable material included in the insulating adhesive. In addition, (meth)acrylic acid may lower the relative dielectric constant of the insulating resin compared to monomers having different polar groups. The (meth) acrylic acid may be included in 0.1 to 20% by weight, preferably 7 to 15% by weight of the monomer mixture. In the above range, there may be an effect of increasing the adhesion of the conductive particles and the binding force with the binder.

The insulating resin can be formed by polymerizing the monomer mixture in a conventional manner. The polymerization may include, but is not limited to, emulsion polymerization, suspension polymerization, dispersion polymerization, seed polymerization, sol-gel seed polymerization, and the like.

The insulating resin layer may have a specific dielectric constant of 0.5 to 4, for example, 1 to 3.8. In the above range, when the conductive fine particles are coated, the specific permittivity of the conductive particles of the present invention can be easily reached.

The insulating resin layer is a single layer and may have a thickness of 0.1 μm to 0.6 μm, preferably 0.1 μm to 0.4 μm, more preferably 0.2 μm to 0.38 μm. In the above range, a connection with high heat resistance and reliability can be made, and the conduction characteristics can be excellent. The "single layer" means one layer formed of the same insulating resin.

The insulating resin layer may be formed by grafting the insulating resin-containing composition on the conductive fine particles described below and stirring the insulating resin on the surface of the conductive fine particles.

The specific dielectric constant of the conductive fine particles, that is, the conductive fine particles having no insulating resin layer formed on the surface, may be 10,000 or more, for example 100,000 or more, for example 100,000 to 500,000. In the above range, the specific permittivity of the conductive particles of the present invention can be easily reached.

The conductive fine particles may be particles made of only conductive metal, but the conductive fine particles described below may be employed in consideration of performance of the conductive fine particles, manufacturing cost, connection efficiency, and ease of securing specific dielectric constant of the conductive particles.

The conductive fine particles include a core; And a conductive layer formed on the surface of the core, and protrusions may be formed on the surface of the conductive layer.

The core may include a polymer resin. The core made of a polymer resin may have an average particle diameter (D50) of 0.5 μm to 10 μm, for example, 2 μm to 6 μm.

In one embodiment, the polymer resin may be one or more polymers selected from the group consisting of crosslinkable polymerizable monomers and monofunctional monomers. Crosslinkable polymerizable monomers include vinylbenzene monomers including divinylbenzene, 1,4-divinyloxybutane, divinylsulfone, diallylphthalate, diallyl acrylamide, triallyl (iso)cyanurate, triallyl tree Allyl compound containing melitate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylic Rate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate and glycerol tri(meth)acrylic It may include one or more selected from the group consisting of acrylate-based monomers containing a rate. Monofunctional monomers are styrene-based monomers including styrene, methylstyrene, m-chloromethylstyrene, and ethyl styrene, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth )Acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, lauryl (meth)acrylate, stearyl It may include one or more selected from the group consisting of (meth)acrylate-based monomers including (meth)acrylate, vinyl chloride, vinyl acetate, vinyl ether, vinyl propionate, and vinyl butyrate.

In another embodiment, the polymer resin is a thermosetting polymer resin such as phenol resin, urea resin, melamine resin, fluorine resin, polyester resin, epoxy resin, silicone resin, polyimide resin, polyurethane resin, propylene resin, polyolefin resin, and the like. , Polyethylene resin, polypropylene resin, polybutylene resin, polymethacrylic acid resin, methylene resin, polystyrene resin, acrylonitrile-styrene resin, acrylonitrile-styrene-butadiene resin, vinyl resin, divinylbenzene resin, poly It may also include thermoplastic polymer resins such as amide resins, polyester resins, polycarbonate resins, polyacetal resins, polyether sulfone resins, polyphenyl oxide resins, polyphenylene sulfide resins, polysulfone resins, and polyurethane resins.

The conductive layer is formed on the surface of the core to provide conductivity. The metal constituting the conductive layer is not particularly limited, but gold, silver, copper, platinum, iron, lead, aluminum, chromium, palladium, nickel, rhodium, ruthenium, antimony, bismuth, germanium, tin, cobalt, indium and nickel- And metals and metal compounds such as phosphorus, nickel-boron, and nickel-silver, and alloys thereof.

The thickness of the conductive layer is 3% to 15% of the core average particle diameter (D50), and may be 100 nm to 400 nm, preferably 150 nm to 350 nm. In the above range, the connection resistance becomes low and stable connection can be maintained.

The conductive fine particles have an average particle diameter (D50) smaller than the average particle diameter (D50) of the conductive particles, and may be 2 μm to 10 μm, preferably 2.5 μm to 4 μm. In the above range, conduction reliability may be excellent and insulation reliability may be excellent.

Protrusions are formed on the surface of the conductive layer to facilitate connection when connecting to the connecting member. Protrusions can be produced by a method in which fine particles having a conductive layer are added to an electroless plating solution containing a metal salt solution and a reducing agent and electroless plating is performed.

The difference in specific permittivity between the conductive fine particles having protrusions formed on the surface and the insulating resin layer may be 10,000 or more, for example 100,000 or more, and 100,000 to 500,000. In the above range, there may be an effect showing insulation.

The conductive particles may be included in 10% to 40% by weight of the anisotropic conductive film, preferably 15% to 35% by weight. In the above range, when connecting, it is possible to prevent a short circuit and prevent a malfunction, and may have an effect of excellent conduction reliability and excellent insulation reliability.

The conductive particles may have an average particle diameter (D50) of 2 μm to 10 μm, preferably 2.5 μm to 4 μm. In the above range, conduction reliability may be excellent and insulation reliability may be excellent.

The anisotropic conductive film may be formed of an anisotropic conductive film composition containing the above-described conductive particles, a curable compound, and an initiator. The anisotropic conductive film composition may further include a binder resin. The anisotropic conductive film composition may further include an inorganic filler and a silane coupling agent.

Among the anisotropic conductive film compositions, curable compounds, initiators, and the like form an insulating adhesive. The type and content of the curable compound, initiator, binder resin, inorganic filler, and silane coupling agent can be selected to control the specific dielectric constant of the insulating adhesive.

The dielectric constant of the insulating adhesive may be 0.5 to 4, preferably 1 to 3.8. In the above range, there may be an excellent insulating effect.

The insulating adhesive may be an epoxy-based, urethane-based or (meth)acrylate-based adhesive.

The curable compound may include at least one of a radical curable compound and a cationic curable compound. For example, radical curable compounds include methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, 2- Ethylhexyl (meth)acrylate, isodecyl (meth)acrylate, n-lauryl (meth)acrylate, C ₁₂ -C ₁₅ alkyl (meth)acrylate, n-stearyl (meth)acrylate, n- Butoxyethyl (meth)acrylate, butoxydiethylene glycol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, cyclohexyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, benzyl (Meth)acrylate, 2-phenoxyethyl (meth)acrylate, isobornyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxy With hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, (meth)acrylic acid, 2-(meth)acrylic Monooxyethylsuccinic acid, 2-(meth)acryloyloxyethylhexahydrophthalate, 2-(meth)acryloyloxyethyl-2-hydroxypropylphthalate, glycidyl (meth)acrylate, 2-(meth) )Acryloyloxyethyl acid phosphate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, Neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, glycerin Di(meth)acrylate, 2-hydroxy-3-acryloyloxypropyl (meth)acrylate, dimethylol tricyclodecane di(meth)acrylate, trifluoroethyl (meth)acrylate, perfluoro Octylethyl (meth)acrylate, isoamyl acrylate, lauroyl acrylate, di(meth)acrylate of bisphenol A ethylene oxide, bisphenol A diglycidyl di(meth)acrylate, trimethylolpropane tri(meth )Acrylate, pentaerythritol tree (meth)acrylic Rate, urethane (meth)acrylate, epoxy (meth)acrylate, (meth)acrylate having an isocyanurate group (e.g., tris(meth)acryloxyethylisocyanurate), etc. It can be used as a mixture of two or more. The cationic curable compound may include, but is not limited to, one or more of aromatic epoxy-based, alicyclic epoxy-based, hydrogenated epoxy-based, and aliphatic epoxy-based compounds.

The curable compound may be included in an anisotropic conductive film composition based on solid content of 15% to 70% by weight, preferably 15% to 60% by weight. In the above range, sufficient reaction required for curing occurs, and may be excellent in adhesive strength and reliability after bonding.

The initiator may be a peroxide-based, acid anhydride-based, amine-based, imidazole-based, isocyanate-based, amide-based, hydrazide-based, phenolic, sulfonium-based or the like.

The initiator may be included in an anisotropic conductive film composition based on solid content of 1% to 10% by weight, preferably 3% to 7% by weight. In the above range, sufficient reaction required for curing occurs, and may be excellent in adhesive strength and reliability after bonding.

The binder resin is phenoxy resin, epoxy resin, polycarbonate resin, polyimide resin, polyamide resin, polymethacrylate resin, polyacrylate resin, polyurethane resin, polyester resin, polyester urethane resin, polyvinyl butyral Resin, styrene-butylene-styrene resin, epoxy-modified styrene-butylene-styrene resin, styrene-ethylene-butylene-styrene resin, styrene-ethylene-butylene-styrene resin Epoxy modified material, acrylonitrile butadiene rubber, a hydrogenated product of acrylonitrile butadiene rubber, and one or more of urethane (meth)acrylate.

The binder resin may be included in 10% to 60% by weight, preferably 20% to 60% by weight of the anisotropic conductive film composition based on solid content. In the above range, it is possible to obtain the effect of film formation and adhesion increase.

The inorganic filler is one of silica, alumina, titania, zirconia, magnesia, ceria, zinc oxide, iron oxide, silicon nitride, titanium nitride, boron nitride, calcium carbonate, aluminum sulfate, aluminum hydroxide, calcium titanate, talc, calcium silicate, and magnesium silicate. The above can be used.

The inorganic filler may be included in an anisotropic conductive film composition in an amount of 0.5% to 20% by weight, preferably 1% to 20% by weight, based on solid content. Within this range, it is possible to obtain an effect of increasing durability reliability, adhesion, and tensile properties.

The silane coupling agent can increase the adhesion of the anisotropic conductive film. Silane coupling agents include polymerizable unsaturated group-containing silicon compounds such as vinyl trimethoxysilane, vinyl triethoxysilane, and (meth)acryloxypropyl trimethoxysilane; Epoxy group-containing silicon compounds such as 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; Amino group-containing silicon compounds such as -aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, and N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane; 3-chloropropyl trimethoxysilane.

The silane coupling agent may be included in an amount of 0.1% to 2% by weight, preferably 0.5% to 1.5% by weight of the anisotropic conductive film composition based on solid content. Within this range, excellent durability reliability effects can be obtained.

The composition for an anisotropic conductive film may include conventional additives such as thickeners, surfactants, and adhesion promoters.

The additive may be included in an anisotropic conductive film composition in an amount of 0.1% to 2% by weight, preferably 0.5% to 1.5% by weight, based on solid content. In the above range, an additive effect can be obtained without affecting the effect of the anisotropic conductive film.

The composition for an anisotropic conductive film may further include a common solvent such as ethyl acetate and methyl ethyl ketone in order to improve coating properties.

The anisotropic conductive film may have a thickness of 10 μm to 40 μm, preferably 10 μm to 25 μm. In the above range, it can be used for connection, and can be used for semiconductor devices or display devices.

The anisotropic conductive film is placed between the first to-be-connected member and the second to-be-connected member, and is pressed at 50°C to 80°C for 1 second to 3 seconds and under 0.5 to 2 MPa pressure conditions; And 130° C. to 180° C., for 3 seconds to 8 seconds and under 50 to 80 MPa pressure conditions, the connection resistance may be 1 Ω or less, preferably 0 Ω or more and less than 0.5 Ω. Within this range, connection reliability can be improved.

The anisotropic conductive film is placed between the first to-be-connected member and the second to-be-connected member, and is pressed at 50°C to 80°C for 1 second to 3 seconds and under 0.5 to 2 MPa pressure conditions; And 130° C. to 180° C., after 3 seconds to 8 seconds, and after 50 to 80 MPa pressure conditions, the connection resistance after reliability measured after standing at 85° C. and 85% relative humidity for 500 hours is 3 Ω or less, preferably May be 0 Ω or more and less than 1 Ω. It is possible to maintain low connection resistance even under high temperature and high humidity conditions within the above range, thereby improving connection reliability.

The connection resistance after the reliability refers to the connection resistance after being left for 500 hours at 85°C and 85% relative humidity after the above-mentioned pressure bonding and main bonding. The method for measuring the connection resistance after the reliability is not particularly limited and may be measured according to a method commonly used in the art. A non-limiting example of a method for measuring the connection resistance after reliability is as follows: after pressing and main-pressing a plurality of film specimens, after leaving for 500 hours at 85°C and 85% relative humidity, the test current is 1 mA. Apply and measure each connection resistance (using Keithley's 2000 Multimeter, 4-probe method), and measure the average value.

The press-bonding and main-pressing conditions are as follows:

1) Pressure bonding condition: 60℃, 1 second, 1.0MPa

2) Main compression conditions: 150℃, 5 seconds, 60MPa

In the above range, the conductive particles are sufficiently positioned on the terminals to improve the electrical conductivity and to reduce the outflow of the conductive particles to the space portion, thereby reducing shorts between terminals.

The anisotropic conductive film may have an adhesive strength of 1.0 MPa or more, preferably 1.0 MPa to 3.0 MPa. Reliability can be improved when connecting in the above range. The adhesive force can be measured in substantially the same way as the above-described method in the experimental examples described below.

The anisotropic conductive film may be made of only a conductive layer containing conductive particles, but may further include an insulating layer in order to solve the problem that the conductive layer is torn or has poor flow when connecting.

The anisotropic conductive film of the present invention may be disposed by heat-pressing an anisotropic conductive film between the first substrate on which the first member is connected and the second substrate on which the second member is connected. The first substrate is a glass substrate such as an LCD or PD panel, and a first to-be-connected member may be formed as a terminal for connecting with an electronic component. 2nd connection The member may be, for example, chip on glass (COG), chip on plastic (COP), flexible printed circuits (FPC), chip on film (COF), or a tape carrier package (TCP). For example, the member to be connected may be a polyimide film or the like.

The method for forming the anisotropic conductive film of the present invention is not particularly limited, and a method commonly used in the art may be used. The method of forming the anisotropic conductive film does not require a special device or equipment, the binder resin is dissolved in an organic solvent, liquefied, and the remaining components are added and stirred for a period of time to provide a composition for the conductive layer, and the composition for the conductive layer is a release film After applying a predetermined thickness on top, it can be cured at 80°C to 130°C for 5 to 10 minutes to obtain a conductive layer. An anisotropic conductive film can be obtained by applying the composition for an insulating layer to one surface of the obtained conductive layer to a predetermined thickness and then drying to volatilize the organic solvent.

The display device of the present invention includes a driver circuit; panel; And an anisotropic conductive film according to an example of the present invention. Specifically, the panel may be a liquid crystal display (LCD) device that is a liquid crystal display (LCD) panel. Further, the panel may be an organic light emitting diode display (OLED) device, which is an organic light emitting diode (OLED) panel.

The method for manufacturing the display device of the present invention is not particularly limited, and may be performed by a method known in the art.

According to another aspect of the present invention, there is provided a semiconductor device connected to any one of the anisotropic conductive films of the present invention described above. The semiconductor device includes: a wiring board; It may include a semiconductor chip, the wiring substrate, the semiconductor chip is not particularly limited, may be used in the art. Circuits or electrodes may be formed on the wiring board by ITO or metal wiring, and IC chips or the like may be mounted at positions corresponding to the circuits or electrodes using anisotropic conductive films according to embodiments of the present invention. have.

Hereinafter, the configuration and operation of the present invention through embodiments of the present invention will be described in more detail. However, the following examples are intended to help understanding of the present invention, and the scope of the present invention is not limited to the following examples.

Example One

Preparation of conductive particles

75 parts by weight of styrene, 10 parts by weight of maleic anhydride, 100 parts by weight of a monomer mixture containing 15 parts by weight of dipentaerythritol hexaacrylate (DPHA), 0.5 parts by weight of ammonium persulfate, 1 part by weight of sodium lauryl sulfate, dehydration An insulating resin was prepared by adding 3,000 parts by weight of ionized water and polymerizing at 80° C. for 24 hours. Conductive fine particles (no insulating resin layer is formed. N2EHHB4-003, Sekisui Corporation, average particle diameter (D50): 2.98 µm, nickel and silver electroless plated fine particles on the styrene resin core) Put and stirred with a stirrer (hybridizer) to prepare a conductive particle (average particle diameter (D50): 3.58㎛) coated with an insulating resin layer on the surface of the conductive fine particles.

Preparation of anisotropic conductive film

Based on solid content, 35 parts by weight of phenoxy resin (Y50, Toto Chemical Co., Ltd.), 20 parts by weight of aromatic epoxy resin (YL980, Japan epoxy resin, epoxy equivalent 185g/eq), 15 parts by weight of alicyclic epoxy resin Cel2021P (daicel), 5 parts by weight of alicyclic epoxy resin ST-3000 (Kukdo Chemical), 5 parts by weight of SI-B3A (Sanshin Chemical Co., Japan) as a cationic initiator, 1 part by weight of rosin ester (5020F, Eastman) as an additive, silane coupling agent (KBM403 , Shin-Etsu) 1 part by weight, 30 parts by weight of ethyl acetate and 20 parts by weight of methyl ethyl ketone based on 18 parts by weight of silica, and a composition for an anisotropic conductive film containing 25 parts by weight of the prepared conductive particles was prepared.

The prepared anisotropic conductive film composition was coated on a release film (polyethylene terephthalate film) with a thickness of 25 μm, and the solvent was volatilized for 5 minutes in a dryer at 70° C. to prepare an anisotropic conductive film having a thickness of 25 μm.

Example 2

In Example 1, 100 parts by weight of the monomer mixture of the insulating resin layer on the surface of the conductive fine particles, 70 parts by weight of styrene, 20 parts by weight of maleic anhydride, trifunctional (meth)acrylate having an isocyanurate group (M315, Toagosei ) An anisotropic conductive film was prepared in the same manner as in Example 1, except that 100 parts by weight of the monomer mixture containing 10 parts by weight was used.

Example 3

In the same manner as in Example 1, conductive particles were coated with an insulating resin layer on the surface of the conductive fine particles.

Based on solid content, 38 parts by weight of non-reactive urethane acrylate (ether-based, NPC-9200, Nanux), 10 parts by weight of M313, 5 parts by weight of hydroxybutyl acrylate, 1 part by weight of silane coupling agent (KBM403, Shin-Etsu) , Polycarbonate resin KU-1000 (Negami) 19 parts by weight, titania 4 parts by weight, reactive urethane acrylate (NPA-7000, Nanux) 9 parts by weight, initiator luperox26 (arkema) 5 parts by weight, silica 9 parts by weight A composition for an anisotropic conductive film was prepared comprising 30 parts by weight of the prepared conductive particles, 30 parts by weight of ethyl acetate, and 20 parts by weight of methyl ethyl ketone.

An anisotropic conductive film was prepared in the same manner as in Example 1 for the prepared anisotropic conductive film composition.

Example 4

In Example 1, 100 parts by weight of the insulating resin layer monomer mixture on the surface of the conductive fine particles, 60 parts by weight of styrene, 10 parts by weight of maleic anhydride, trifunctional (meth)acrylate having an isocyanurate group (M315, Toagosei) An anisotropic conductive film was prepared in the same manner as in Example 1, except that 100 parts by weight of the monomer mixture containing 15 parts by weight of acrylic acid and 15 parts by weight of acrylic acid was used.

Example 5

In Example 1, 100 parts by weight of the insulating resin layer monomer mixture on the surface of the conductive fine particles, 60 parts by weight of styrene, 5 parts by weight of maleic anhydride, and trifunctional (meth)acrylate M315, Toagosei having isocyanurate groups 5 An anisotropic conductive film was prepared in the same manner as in Example 1, except that 100 parts by weight of the monomer mixture containing 15 parts by weight of acrylic acid, 15 parts by weight of acrylic acid, and 15 parts by weight of divinylbenzene was used.

Comparative example One

Conductive by coating conductive fine particles (N2EHHB4-003, Sekisui Chemical Co., Ltd.) with an acrylic acid and styrene copolymer (PP-2000S, Japan Ink Chemical Industry Co., Ltd., 80 parts by weight of styrene and 20 parts by weight of acrylic acid) with a thickness of 0.2 μm. The particles were prepared.

An anisotropic conductive film was prepared in the same manner as in Example 1 using the produced conductive particles.

Comparative example 2

An anisotropic conductive film was prepared in the same manner as in Example 1, except that conductive fine particles without coating the insulating resin layer on the surface of the conductive fine particles (the insulating resin layer was not formed) were used in Example 1.

Comparative example 3

An anisotropic conductive film was prepared in the same manner as in Example 1, except that 100 parts by weight of the monomer mixture containing 70 parts by weight of styrene and 30 parts by weight of maleic anhydride as 100 parts by weight of the monomer mixture when forming the insulating resin in Example 1 was used. .

Comparative example 4

When forming the insulating resin in Example 1, 100 parts by weight of the monomer mixture containing 65 parts by weight of styrene, 20 parts by weight of maleic anhydride, and 15 parts by weight of product name (HDDA:skcytec) as bifunctional (meth)acrylate An anisotropic conductive film was prepared in the same manner as in Example 1, except that it was used.

Table 1 below shows the monomer mixture forming the insulating resin of the insulating resin layer.

Example Comparative example One 2 3 4 5 One 2 3 4 Styrene 75 70 75 60 60 80 0 70 65 Maleic anhydride 10 20 10 10 5 0 0 30 20 DPHA 15 0 15 0 0 0 0 0 0 M315 0 10 0 15 5 0 0 0 0 Acrylic acid 0 0 0 15 15 20 0 0 0 Divinylbenzene 0 0 0 0 15 0 0 0 0 Bifunctional acrylate 0 0 0 0 0 0 0 0 15

The following physical properties were evaluated for the anisotropic conductive films prepared in Examples and Comparative Examples, and the results are shown in Table 2 below.

(1) Specific permittivity of conductive fine particles, anisotropic conductive films, insulating resin layers, and insulated conductive fine particles (conductive particles): a specific dielectric constant measuring device (E- for conductive particles, anisotropic conductive films, insulating resin layers, and conductive fine particles) 4980A) was used to measure the thickness of the object to be measured in Examples and Comparative Examples into the specific dielectric constant measuring apparatus and measure at 25°C. However, since the insulating resin layer was thin, it was prepared in the same manner as in Examples and Comparative Examples, but was measured by making a thickness of 3 µm.

(2) Initial connection resistance (unit: Ω): The following method was performed to measure the initial connection resistance of the anisotropic conductive film prepared in Examples and Comparative Examples.

Under the following conditions, the anisotropic conductive film prepared in the above Examples and Comparative Examples was press-bonded to a panel and the driver IC was main-compressed onto the anisotropic conductive film, and then a 4-probe method was used using a connection resistance meter (Keithley 2000 Multimeter). The initial connection resistance was measured by applying a test current of 1 mA, and the average value was calculated.

1) Pressure bonding condition: 60℃, 1 second, 1.0MPa

2) Main compression conditions: 150℃, 5 seconds, 60MPa

(3) Reliability After connection resistance (unit: Ω): To measure the connection resistance after the reliability of the anisotropic conductive film prepared in Examples and Comparative Examples, the following method was performed.

In the same manner as in the initial connection resistance measurement, after press bonding and main bonding, after leaving for 500 hours at a temperature of 85°C and a relative humidity of 85% for high-temperature and high-humidity reliability evaluation, the connection resistance after each of the reliability is connected. The resistance was measured in the same manner.

(4) Adhesion (unit: MPa): The anisotropic conductive films of Examples and Comparative Examples were cut horizontally and vertically (20mm x 10mm) to prepare specimens, and the specimens were prepared using UTM (Universal Testing Machine, H5KT, Hounsfield). The adhesion was measured by pushing at a peeling rate of 10 mm/min, a peeling angle of 180°, and a peeling temperature of 25°C.

(5) Short probability (unit:%): Anisotropic conductive film for insulating TEG for short evaluation (chip size: 25mm x 2.5mm, number of bumps: 8376, bump size 35㎛ x 55㎛, pitch between bumps: 10㎛) Was pressed at 210° C., 60 MPa pressure, for 5 seconds. The insulation resistance between bumps was measured, and the probability of occurrence of a short was evaluated.

Example Comparative example One 2 3 4 5 One 2 3 4 Specific permittivity Conductive fine particles 395741 Anisotropic conductive film 3.677 3.5 3.977 3.787 3.551 4.489 9.685 4.617 5.398 Insulation resin layer 2.08 2.1 2.08 1.99 1.99 4.1 - 4.2 4.6 Conductive particles 2.8 2.6 2.8 2.8 2.6 3.2 - 3.2 3.4 Connection resistance Early 0.25 0.25 0.28 0.25 0.25 0.4 1.5 0.5 0.5 After reliability 0.68 0.62 0.75 0.65 0.59 6.5 9 8.1 4.5 Adhesion 2.0 1.9 1.2 2.0 1.9 1.8 1.8 1.9 1.8 Short probability (%) 2.5 2.5 2.5 2.5 2.4 3.5 10 3 3.8

As shown in Table 2, the anisotropic conductive film of the present invention has a low probability of short circuit, low connection resistance, and excellent reliability and adhesion of connection resistance.

On the other hand, Comparative Example 1, Comparative Example 3 and Comparative Example 4, which did not form an insulating resin layer or included conductive particles outside the specific permittivity range of the present invention, had low adhesion and a high probability of occurrence of short.

Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be considered to be included in the scope of the present invention.

Claims (18)

An anisotropic conductive film comprising an insulating adhesive and conductive particles contained in the insulating adhesive and having a specific inductive capacity of 2.51 to 3.0.
According to claim 1, The conductive particles include conductive fine particles and an insulating resin layer formed on the surface of the conductive fine particles,
The insulating resin layer is an anisotropic conductive film comprising an insulating resin polymerized from a monomer mixture containing an aromatic group-containing monomer, an acid anhydride-based monomer, and a trifunctional to six-functional (meth)acrylate.
The anisotropic conductive film according to claim 2, wherein the insulating resin layer is a single layer.
The anisotropic conductive film according to claim 2, wherein the insulating resin layer has a specific dielectric constant of 0.5 to 4.
The anisotropic conductive film according to claim 2, wherein the trifunctional to hexafunctional (meth)acrylate has an isocyanurate group.
The anisotropic conductive film according to claim 2, wherein the monomer mixture contains the aromatic group-containing monomer, the acid anhydride-based monomer, and the six-functional (meth)acrylate.
The method of claim 2, wherein the monomer mixture of the insulating resin
The aromatic group-containing monomer is 40% by weight to 75% by weight
5 to 40% by weight of the acid anhydride-based monomer
The trifunctional to hexafunctional (meth)acrylate is contained in 5% to 20% by weight of the monomer mixture, an anisotropic conductive film.
The anisotropic conductive film according to claim 2, wherein the aromatic group-containing monomer is styrene, and the acid anhydride-based monomer is maleic anhydride.
The anisotropic conductive film according to claim 2, wherein the monomer mixture further comprises a divinylbenzene-based monomer.
The anisotropic conductive film according to claim 2, wherein the monomer mixture further comprises (meth)acrylic acid.
The anisotropic conductive film according to claim 2, wherein the conductive fine particles have protrusions formed on the surface.
The anisotropic conductive film according to claim 11, wherein the conductive fine particles have a specific permittivity of 10,000 or more.
The anisotropic conductive film according to claim 1, wherein the conductive particles are contained in an amount of 10% to 40% by weight in the anisotropic conductive film.
The anisotropic conductive film according to claim 1, wherein the conductive particles have an average particle diameter (D50) of 2 μm to 10 μm.
The anisotropic conductive film according to claim 1, wherein the insulating adhesive is an epoxy-based, urethane-based or (meth)acrylate-based adhesive.
The anisotropic conductive film according to claim 1, wherein the insulating adhesive is formed of a composition comprising a binder resin, a curable compound, and an initiator.
The anisotropic conductive film of claim 16, wherein the composition further comprises at least one of an inorganic filler, a silane coupling agent, and an additive.
A display device comprising the anisotropic conductive film of claim 1.