KR20200058765A - Deposition apparatus of thin film - Google Patents

Abstract

The present invention relates to a thin film deposition apparatus, and more specifically, to a thin film deposition apparatus which adjusts the permeation amount of deposited materials according to the difference between distances of the deposited materials from an evaporation source in a vacuum chamber so that a uniform thin film thickness on the deposited materials can be obtained.

Description

Thin film deposition equipment {DEPOSITION APPARATUS OF THIN FILM}

The present invention relates to a thin film deposition apparatus, and more specifically, a thin film to allow the thin film thickness of the deposited material to be formed by controlling the permeation amount of the deposited material according to the distance difference between the deposited material and the evaporation source in the vacuum chamber. It relates to a deposition apparatus.

Recently, mobile phones, MP3 players, portable multimedia players (PMPs), tablet PCs, Galaxy Tabs, iPads and e-book terminals and various electronic devices have been provided to users, and users can access various contents while carrying these various electronic devices. Can be.

The electronic device is equipped with a window for protecting the screen of the display device, and employs a CMF (Coler, Material, Finishing: CMF) effect that glows the surface of the electronic device like a metal-like color and jewelry.

The CMF effect is realized by a printing film method, which produces a pattern for an optical effect as a resin on a PET film, deposits a multi-layer thin film composed of 3 to 5 layers on a pre-patterned resin, and then turns it into a black ink. The printing film is manufactured through the process of printing a single layer. This printing film is produced by laminating on a transparent window or cover.

The twinkling optical effect (interference, moire) is emitted from the resin pattern layer, and the color of the metallic feel is realized through a multi-layer thin film, which can be implemented using a process called E-beam evaporation.

Here, the electron beam evaporation method is a method of heating a deposition material using an electron beam and vaporizing the deposition material by reducing the pressure inside the vacuum chamber with a vacuum pump to coat the deposition material.

That is, the electron beam evaporation method is a principle of irradiating the deposition material with an electron beam and heating it.

For example, a dome jig is installed in a vacuum chamber, an evaporation source is disposed under the dome jig, and an evaporation source is disposed inside the dome jig in this state, and the evaporation source is evaporated by irradiating an electron beam to the thus-deposited object. The material is deposited.

However, there is a problem in that a thickness difference of a thin film deposited for each position of an object deposited on a dome jig provided in a vacuum chamber may occur.

As a prior art that partially improves these problems, Korean Patent Publication No. 10-2018-0032086 (2018.03.29.) Discloses a 'thin film deposition device'.

However, such a conventional thin film deposition apparatus has a problem in that it is difficult to stably support the correction mask, and it is difficult to adjust the slope of the correction mask according to the amount of deposition material.

Republic of Korea Patent Publication No. 10-2018-0032086 (2018.03.29.) 'Thin film deposition apparatus and method'

The present invention was devised to solve the above-described problem, and the object of the present invention is to control the amount of deposited material in accordance with the difference in the distance between the evaporation source and the evaporation source in the vacuum chamber so that the thin film thickness of the deposition material can be formed. It is to provide a thin film deposition apparatus to enable.

The problem to be solved of the present invention is not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the present invention is a vacuum chamber 20; A dome-shaped rotating jig 30 provided inside the vacuum chamber 20 and to which the deposit 11 is attached; A rotating part 40 for transmitting rotational force to the rotating jig 30; An evaporation source (50) which is disposed on one side of the lower portion of the center of the rotating jig (30) and vaporizes the deposited material (A); A correction mask 60 disposed on the evaporation source 50 and adjusting a transmission amount of the deposition material A while a plurality of transmission holes 70 through which the vaporized deposition material A passes is formed; And a support portion (100) for supporting the correction disk (60) from the inner bottom of the vacuum chamber (20) and adjusting the inclination of the correction disk (60). .

The correction mask 60 according to the present invention is divided into a first region 61 on one side and a second region 62 on the other side around the central portion, and the second region 62 is the first region 61 ), The separation distance from the rotating jig 30 is longer, and the transmission hole formed in the second area 62 is formed larger than the transmission hole formed in the first area 61, and the second area 62 It is characterized in that the amount of transmission of the deposition material (A) to () is greater than the amount of transmission in the first region (61).

The support part 100 according to the present invention includes: first and second support bars 110 and 120 extending upward from an inner bottom of the vacuum chamber 20; An elevating member 130 coupled to the first support bar 110 so as to be elevating and descending, while one side of the correction disk 60 is rotatably connected; First support means (140) for supporting the lifting member (130) from the first support bar (110); And second support means 150 for supporting the other side of the correction disk 60 from the second support bar 120 to be elevated and lowered, and the correction disk 60 is based on a horizontal state. In accordance with the adjustment of the second support means 150, the other side is characterized in that the tilt is adjusted while rotating in the vertical direction around one side.

The first support means 140 according to the present invention includes a first support member 141 that is screwed to the first support bar 110 so as to be located under the elevating member 130, and the first 2 support means 150, one end is connected to the other side of the correction disk 60 and the other end is formed to extend outward, the second support bar 120 passes through (151a) passes from the other end A fixing plate 151 extending in a negative direction; And a second support member 152 that is screwed to the second support bar 120 so as to be positioned at a lower portion of the fixing plate 151, and is screwed to the second support bar 120, wherein the first and second support members 141 and 152 are The distance between the evaporation source 50 and the correction mask 60 is adjusted as it is raised or lowered according to rotation, and the first support member 141 rotates while the second support member 152 is stopped. It is characterized by adjusting the inclination of the correction mask 60 while ascending and descending according to.

The first support means 140 according to the present invention includes: a first pressing member 142 screwed to the first support bar 110 so as to be located under the first support member 141; And a first spring 143 disposed between the first pressing member 142 and the first supporting member 141, wherein the second supporting means 150 includes the second supporting member 152. A second pressing member 153 screwed to the second support bar 120 so as to be located at the bottom; And a second spring 154 disposed between the second pressing member 153 and the second supporting member 152, while the first and second pressing members 142 and 153 are raised and lowered according to rotation. It characterized in that to adjust the elastic force of the first and second springs (143,154).

According to the present invention, it is possible to adjust the permeation amount of the deposition material according to the difference in the distance between the evaporation source and the evaporation source in the vacuum chamber, thereby making it possible to form the same thin film thickness.

The effects of the present invention are not limited to those mentioned above, and other solutions not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a perspective view showing a thin film deposition apparatus according to the present invention.
2 is a plan view showing a correction mask in the thin film deposition apparatus according to the present invention.
3 is a front view showing a support in the thin film deposition apparatus according to the present invention.
4 is a plan view showing a support in the thin film deposition apparatus according to the present invention.
5 is a use state diagram showing a state in which the height of the correction mask in FIG. 4 is adjusted.
6 is a use state diagram showing a state in which the slope of the correction mask in FIG. 4 is adjusted.
And
7 is a front view showing another example of the support in the thin film deposition apparatus according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

Referring to FIG. 1, the thin film deposition apparatus 10 according to the present invention includes a vacuum chamber 20, a rotating jig 30, a rotating portion 40, an evaporation source 50, a heating device 21 and a correction mask 60 It includes.

In general, an electronic device equipped with a display unit is provided with a window or a cover to protect liquid crystals, etc., and a printing film is attached to the window or cover for a metallic color or a shiny effect.

The thin film deposition apparatus 10 according to the present invention deposits the surface of a printing film to have a metallic feel color or a shiny effect.

Looking at this in detail, the vacuum chamber 20 decompresses the pressure using a vacuum pump, and can form a vacuum with the internal pressure at a level of 10 million of atmospheric pressure.

In the vacuum chamber 20, a rotating jig 30, a rotating portion 40, an evaporation source 50, a heating device 21 and a correction mask 60 are provided. Although not shown, the vacuum chamber 20 may be provided with a vacuum pump, a vacuum gauge, a gas injection device, a gas analysis device, an ion generating device, and an object heating device.

The rotating jig 30 is provided on the inner upper portion of the vacuum chamber 20 to rotate by the rotating portion 40.

The rotating jig 30 is formed in a dome shape protruding upward, and a plurality of deposits 11 are mounted on the inner surface, that is, the lower surface. The deposit 11 may be mounted from the center of the rotating jig 30 to the edge. Here, the deposit 11 can be understood as a printing film.

The evaporation source 50 is provided on the inner bottom of the vacuum chamber 20 so as to be located at the bottom of the rotating jig 30, and is heated by the heating device 21 to vaporize the deposited material (A).

The deposition material may include any one of iridium, platinum, molybdenum, tungsten, tantalum, copper, silicon oxide, silicon nitride, silicon carbide, zirconium oxide, aluminum oxide, and graphite, or two or more.

The heating device 21 is provided in the vacuum chamber 20 to heat the evaporation source 50, and may be made of any one of resistance heating, induction heating, and electron beam heating.

The correction mask 60 is disposed on the top of the evaporation source 50 so that the deposition material A is deposited on the deposit 11 by controlling the amount of the deposition material A.

As shown in FIG. 2, the correction mask 60 is formed with a plurality of transmission holes 70 penetrating in the vertical direction.

The evaporation source 50 is disposed on one side with respect to the central portion of the rotating jig 30 as shown in FIG. 1, and the correction mask 60 is located on one side with respect to the central portion as shown in FIG. It can be divided into a first region 61 and a second region 62 located on the other side.

As shown in FIG. 2, the first region 61 is located on one side, that is, on the right side of the center portion of the correction mask 60, and the second region 62 is on the other side about the center portion of the correction mask 60. That is, it can be understood that it is located on the left side.

The transmission hole 70 may be formed to control the amount of transmission of the deposition material (A) according to the distance difference between the deposition target 11 and the evaporation source 50.

Accordingly, the correction mask 60 can reduce the defect rate of the product caused by the non-uniformity of the thin film thickness by allowing the thin film thicknesses of a plurality of deposits 11 attached to the rotating jig 30 to be deposited the same. have.

For example, as illustrated in FIG. 2, the transmission hole formed in the second region 62 is formed to have a larger size than the transmission hole formed in the first region 61. That is, the transmissive portion 70 corresponds to the separation distance between the rotating jig 30 and the correction mask 60, that is, a region having a long separation distance, that is, a region having a short separation distance from the second region 62, that is, a first region 61 ), A larger transmission hole is formed. Here, the separation distance can be understood as referring to a difference according to the short and long distance by comparing the vertical distance from the first region 61 to the rotating jig 30 and the second region 62 from the second region 62 to the rotating jig 30. have.

Accordingly, the permeable portion 70 may have a larger amount of permeate to be deposited than the first region 61 in the second region 62.

This, while the rotating jig 30 forms a dome, while the evaporation source 50 is arranged to be deflected to one side, that is, to the right, with respect to the central portion of the rotating jig 30, between the correction mask 60 and the rotating jig 30 This is because the separation distance is shorter from the left to the right, that is, from the center portion of the rotating jig 30 toward the outside. For example, when the amount of the deposited material transmitted in the state in which the separation distance between the first and second regions 61 and 62 and the rotating jig 30 are different is the same, the second region 61 is disposed substantially on the same vertical line. The to-be-deposited material may be thinner in thickness than the to-be-deposited object disposed on the same vertical line as the first region 61.

On the other hand, the thin film deposition apparatus 10 according to the present invention transmits the deposition amount of the deposition material in the second region 62 while the separation distance between the first and second regions 61 and 62 and the rotating jig 30 is different. The thickness of the thin film coated with the deposited object 11 may be the same at any position of the rotating jig 30 by being greater than the amount of permeation in the first region 61.

The thin film deposition apparatus 10 according to the present invention supports the correction disk 60 from the inner bottom of the vacuum chamber 20, as shown in FIG. 3, and supports 100 to adjust the inclination of the correction disk 60 ).

The support part 100 stably supports the correction disk 60 from the bottom of the vacuum chamber 20, while rotating the rotation jig 30 so that the tilt can be adjusted based on the state in which the correction disk 60 is horizontal. The angle formed with the lower surface of one side can be adjusted. At this time, the rotary jig 30 may be understood that one lower surface forms an inclined surface.

Accordingly, the support part 100 may appropriately adjust the slope of the correction disk 60 according to the amount of deposition material transmitted through the first and second regions 61 and 62.

Alternatively, the support part 100 may adjust the slope according to the separation distance between the rotating jig 30 and the first and second regions 61 and 62. For example, when the size of the transmission holes 70 formed in the first and second regions 61 and 62 is the same as that of the support part 100 as illustrated in FIG. 4, the correction disk 60 rotates the jig 30 ).

The support part 100 is coupled to the first and second support bars 110 and 120 and the first support bar 110 which are formed to extend upward from the inner bottom of the vacuum chamber 20, and the correction disk ( Correction disk from the first supporting means 140 and the second supporting bar 120 for supporting the lifting member 130 from the lifting member 130 and the first supporting bar 110 to which one side of the 60 is rotatably connected. It includes a second support means 150 for supporting the other side of the (60) to be raised and lowered.

The first and second support bars 110 and 120 are disposed on both sides of the correction mask 60, and threads are formed on the outer circumferential surface.

The lifting member 130 is coupled to be able to move up and down to the outside of the second support bar 120 while a hollow 131 is formed at one end and penetrates in the vertical direction, and one side of the correction mask 60 is rotated at the other end Connected as possible.

The correction mask 60 may be rotatably connected to the elevating member 130 by various known forms.

For example, the correction mask 60 is rotatably connected by a lifting member 130 and the hinge shaft 131 while a pair of fastening protrusions 60a are formed on one side as shown in FIGS. 3 to 4. Can be.

The first support means 140 is screwed to the first support bar 110 so as to be located below the lifting member 130, the first support member supporting the lifting member 130 from the first support bar 110 ( 141).

The first support member 141 is formed with a thread on the inner circumferential surface, and is screwed to the first support bar 110 to stably support the lifting member 130 from the first support bar 110.

The second support means 150 has one end connected to the other side of the correction disk 60 and the fixing plate 151 through which the through hole 151a through which the second support bar 120 passes extends from the other end in the direction of one end, and It includes a second support member 152 that is screwed to the second support bar 120 so as to be located on the lower portion of the fixing plate 151.

The second support member 152 is formed with a thread on the inner circumferential surface, and is screwed into the second support bar 120 so as to be located below the fixing plate 151, and is corrected together with the fixing plate 151 from the second support bar 120. The other side of the disc 60 is stably supported.

The first and second support members 141 and 152 may adjust the height of the correction mask 60 from the inner bottom of the vacuum chamber 20 as it is raised and lowered according to rotation as illustrated in FIG. 5. In other words, as the first and second support members 141 and 152 are raised and lowered according to rotation, the separation distance between the evaporation source 50 and the correction mask 60 may be adjusted.

Accordingly, the first and second support members 141 and 152 are vaporized at the evaporation source 50 by allowing the separation distance between the evaporation source 50 and the correction mask 60 to be adjusted by adjusting the height of the correction mask 60. As the material (A) effectively passes through the correction mask 60, it is possible to easily control the position where it is deposited on the deposit.

As shown in FIG. 6, the first support member 141 adjusts the slope of the correction mask 60 as the second support member 152 is raised and lowered according to rotation in a stopped state.

The first supporting means 140 is a first pressing member 142 and the first pressing member 142 and the first supporting screwed to the first supporting bar 110 so as to be located below the first supporting member 141. A first spring 143 disposed between the members 141 may be further included.

The first spring 143 prevents the first support member 141 from descending while supporting the first support member 141 from the first pressing member 142, while rotating the first support member 141. When ascending and descending, the first support member 141 is smoothly elevated by the elastic force.

The first pressing member 142 is formed with a thread on the inner circumferential surface and is screwed to the first support bar 110 to support the first spring 143.

The first pressing member 142 may adjust the elastic force of the first spring 143 as it is raised and lowered as it rotates.

The second supporting means 150 is a second pressing member 153 and the second pressing member 153 and the second supporting screw that is screwed to the second supporting bar 120 so as to be located under the second supporting member 152 A second spring 154 disposed between the members 152 may be further included.

The second spring 154 prevents the second support member 152 from descending while supporting the second support member 152 from the second pressing member 153, while rotating the second support member 152. When ascending and descending, the second support member 152 is smoothly elevated by the elastic force.

The second pressing member 153 is formed with a screw thread on the inner circumferential surface and is screwed to the second support bar 120 to support the second spring 154.

The second pressing member 153 may adjust the elastic force of the second spring 154 as it rises and falls as it rotates.

For this reason, the thin film deposition apparatus 10 according to the present invention can make the thickness of the thin film coated with the deposited object 11 the same at any position of the rotating jig 30.

What has been described above is only an embodiment for implementing the thin film deposition apparatus according to the present invention, and the present invention is not limited to the above-described embodiment, and deviates from the gist of the present invention as claimed in the claims below. Without this, anyone skilled in the art to which the present invention pertains will have the technical spirit of the present invention to the extent that various changes can be implemented.

10: thin film deposition apparatus 20: vacuum chamber
30: rotating jig 40: rotating part
50: evaporation source 60: correction mask
61: first area 62: second area
70: transmission hole 100: support
110: first support bar 120: second support bar
130: elevating member 140: first support means
141: first support member 150: second support means
151: fixed plate 151a: through
152: second support member

Claims (5)

Vacuum chamber 20;
A dome-shaped rotating jig 30 provided inside the vacuum chamber 20 and to which the deposit 11 is attached;
A rotating part 40 for transmitting rotational force to the rotating jig 30;
An evaporation source (50) which is disposed on one side of the lower portion of the center of the rotating jig (30) and vaporizes the deposited material (A);
A correction mask 60 disposed on the evaporation source 50 and adjusting a transmission amount of the deposition material A while a plurality of transmission holes 70 through which the vaporized deposition material A passes is formed; And
A thin film deposition apparatus comprising a support portion (100) for controlling the inclination of the correction disk (60) while supporting the correction disk (60) from the inner bottom of the vacuum chamber (20). According to claim 1,
The correction mask 60,
The center region is divided into a first region 61 on one side and a second region 62 on the other side, and the second region 62 is spaced apart from the rotating jig 30 compared to the first region 61. Is long,
The transmission hole formed in the second region 62 is formed larger than the transmission hole formed in the first region 61 while the amount of transmission of the deposition material A to the second region 62 is the first region Thin film deposition apparatus, characterized in that more than the amount of transmission in (61). The method according to claim 1 or 2,
The support 100,
First and second support bars 110 and 120 extending upward from the inner bottom of the vacuum chamber 20;
An elevating member 130 coupled to the first support bar 110 so as to be elevating and descending, while one side of the correction disk 60 is rotatably connected;
First support means (140) for supporting the lifting member (130) from the first support bar (110); And
It includes a second support means 150 for supporting the other side of the correction disk 60 from the second support bar 120 so as to be elevated and lowered,
The correction disk 60,
Thin film deposition apparatus characterized in that the tilt is adjusted while the other side is rotated in the vertical direction around one side according to the adjustment of the second support means 150 based on the horizontal state. According to claim 3,
The first support means 140,
It includes a first support member 141 that is screwed to the first support bar 110 so as to be located at the bottom of the lifting member 130,
The second support means 150,
One end is connected to the other side of the correction disk 60 and the other end is formed to extend outward, the second support bar 120 through the through hole (151a) is formed in the fixed plate extending in one direction from the other end ( 151); And
It includes a second support member 152 that is screwed to the second support bar 120 so as to be located on the lower portion of the fixing plate 151, it is possible to screw up and down,
The first and second support members 141 and 152 adjust the separation distance between the evaporation source 50 and the correction mask 60 while rising and falling according to rotation,
The first support member 141,
The second support member 152 is a thin film deposition apparatus characterized in that to adjust the inclination of the correction mask 60 as it is raised and lowered as it rotates while being stopped. The method of claim 4,
The first support means 140,
A first pressing member 142 screwed to the first supporting bar 110 so as to be positioned under the first supporting member 141; And
Further comprising a first spring 143 disposed between the first pressing member 142 and the first support member 141,
The second support means 150,
A second pressing member 153 screwed to the second supporting bar 120 so as to be located under the second supporting member 152; And
Further comprising a second spring 154 disposed between the second pressing member 153 and the second support member 152,
The first and second pressing members (142,153),
Thin film deposition apparatus characterized by adjusting the elastic force of the first and second springs (143,154) as it is raised and lowered as it rotates.

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