KR20200049148A - Assebmly of gas sensor - Google Patents

Abstract

The present invention relates to a gas sensor assembly, and more specifically, to a gas sensor assembly composed of a gas sensor (g) and an LED light source (I) produced in a chip. In particular, an LED (L1) as a changing light with electric properties corresponding to a gas sensor (g1) is installed in a housing (H) having an entrance and exit slot (I/O) through which gas to be detected is introduced and discharged in order to project light towards the gas sensor (g1) at the lower side at the upper side of the gas sensor (g1) which is installed on a base substrate (P) and has a detection film on the surface thereof. Here, the housing (H) is made of a cooling metal having one portion of a non-conductive area for forming a wire in an insulated manner for supplying power to the LEDs (L1, L2, L3...), or of a heat-radiating plastic which is produced after an electric short wire is installed. In addition, in the gas sensor assembly (GA), the LEDs (L1, L2, L3...) as a projection light, corresponding to the plurality of gas sensors (g1, g2, g3...) detecting a plurality of detection materials installed on the base substrate (P) and having detection films different from each other on the surface, are installed in the housing (H) to project light towards the gas sensors (g1, g2, g3...) at the lower side, thereby detecting multiple kinds of gases. Therefore, electricity consumption can be minimized, and the packaging can be miniaturized and thinned.

Description

Gas sensor assembly {ASSEBMLY OF GAS SENSOR}

The present invention relates to a gas sensor assembly, and more particularly, to an assembly of a gas sensor for the purpose of detecting harmful gases that are environmentally harmful substances indoors and outdoors.

In general, the gas sensor analyzes changes in the surrounding gas environment and provides corresponding information. Electrochemical gas sensors, contact combustion gas sensors, photoionization gas sensors, and semiconductor gas sensors are widely used.

As shown in FIG. 1, the dual contact combustion type gas sensor, in Korean Patent No. 10-0810120, screens the mixture on one platinum heater 9 formed on an alumina substrate to form a sensing element 6, Al2O3 powder is screen-printed on a separate platinum heater to form a compensation element, and the alumina substrate on which the compensation element and the sensing element are formed is fixed to a contact-combustion sensor support using a spot welding machine and a platinum wire, and the UV LED (7) A method of manufacturing a flat-type contact-combustible combustible gas sensor including UV LED and photocatalyst (TI / O2), which includes fixing to the body so as to emit ultraviolet light to the sensing element, is disclosed, but the package has a large size and an independent heater. As a result, its efficiency is lowered and it has a problem described later.

Among them, the semiconductor type gas sensor, which is easy to mass-produce and package, induces a change in resistance of the sensor component when the material to be sensed (ie, gas such as gas) is adsorbed and desorpted on the sensor surface. By measuring the change in resistance, it operates on the principle of detecting the concentration of gas.

According to these characteristics, it is possible to selectively detect a desired gas component according to the composition of the sensing material.

 Among these gas sensors, the semiconductor sensor is composed of a substrate on which an electrode is formed, a ceramic sensing film (sensing material), and a heater connected to the electrode. The resistance change is too small depending on the concentration of the target gas to be adsorbed and desorbed on the sensor surface. Therefore, a heater is required to operate at a high temperature of about 300 to 400 degrees Celsius for high sensitivity and selective driving of the sensor to the target gas.

In this case, since the heater needs to be guaranteed to operate at a high temperature, it uses high power, which entails problems such as power loss and heat generation, thereby reducing the durability of the sensor, and in particular, it becomes a great limitation in application to mobile devices.

If an example of the configuration of such heating is described as a sailor technology;

On the upper surface of Korean Patent No. 10-0777192, a sacrificial layer 3 made of polysilicon is formed flat on the top of the wafer 1 having the first insulating film formed thereon, and a plurality of sacrificial layers 3 After the insulating layer 4 is formed, a polysilicon heater 5 and an insulating layer 6, an aluminum (Al) temperature sensor 7 and an insulating layer 8 are formed on top of the insulating layer 4 And a zinc oxide (ZnO) -based gas sensing film 9 is sequentially stacked, a second insulating film 10 is coated on the gas sensing film 9, and then a second insulating film 10 is formed using a photomask. ) To form an etched hole 11, and blow the plasma gas for dry etching through the etched hole 11 to form an 'U' shaped insulation between the heater 5 and the wafer 1 by isotropic etching. There is a method for manufacturing a micro heater for a gas sensor, characterized in that the space 12 is formed, but its configuration is very complicated and the manufacturing process increases. And has a heat problem is not easy,

In Korean Patent No. 10-1602843, a base film; A graphene sensor unit formed on one surface of the base film and including a patterned graphene-based layer; And a graphene heater unit including a patterned graphene-based layer formed on the other surface of the base film, wherein the graphene-based layer of the graphene sensor unit and the graphene-based layer of the graphene heater unit are vertically or horizontally aligned with each other. A graphene gas sensor having a pattern is disclosed, but such a graphene gas sensor also requires a number of complicated manufacturing processes and processes such as photo processing to limit the number of sensing materials that can be detected.

As another embodiment, a configuration using an LED as a heating heat source is proposed. As in the configuration of FIG. 4, in Korean Patent Publication No. 10-2018-0097464, a gas detection unit; a light emitting diode (LED; and the gas detection unit is a gas And a semiconductor oxide layer that reacts with and an electrode that supplies a current to the semiconductor oxide layer to detect a change in electrical conductivity, and the light emitting diode (LED) amplifies electrical conductivity by transmitting light energy to the semiconductor oxide layer. The light fusion type gas sensor is disclosed, but it is a configuration that directly irradiates LED light from below, and the configuration is complicated, and the package is also increased, which makes it difficult to downsize.

Korean Patent 10-0777192 (2007.11.12) Korean Patent 10-0810120 (2008.02.27) Korean Patent 10-1602843 (2016.03.07) Korean Patent Publication 10-2018-0097464 (2018.08.31)

Therefore, as a replacement technology for the existing high-temperature driving semiconductor sensor, there is a need to develop a gas sensor material capable of driving at room temperature without a heater, and as an alternative, instead of the direct heating method, the gas sensor through the irradiation method of the light source (including ultraviolet and visible light) It proposes a way to lower the operating temperature of the product, and in particular, it can be applied to various portable information and communication devices by making it possible to reduce the thickness compared to the existing proposed method.

This perspective is additionally applied to various portable information and communication device examples and VR function implementation in the future, enabling the use as a three-dimensional information communication device.

Accordingly, the present invention is to solve the problems of the prior art as described above,

A gas sensor assembly comprising a gas sensor and a chipped LED light source;

The gas sensor located on the base substrate, the gas sensor having a sensing film on its surface, and the LED as a change light of electrical characteristics corresponding to the gas sensor above the gas sensor. Exposed to be irradiated toward, and the housing is made of a heat-resistant plastic having some non-conductive area for insulatingly forming a wiring path for supplying power to the LED, or a heat-dissipative plastic having an electric connection path,

The gas sensor assembly detects a plurality of sensing materials disposed on a base substrate and disposes LEDs as irradiation light corresponding to a plurality of gas sensors having different sensing films on the surface toward the gas sensors below the housing. It is a basic first characteristic that multiple gas detection is possible by irradiation.

One or more gas sensors for detecting one or more sensing objects are disposed on a heat-dissipating base sheet, and have one or more LEDs disposed at an upward irradiation angle on the same plane as the gas sensor, and irradiating the LEDs A reflector reflecting a light source to irradiate the gas sensor on the same plane of the base sheet is provided as a reflector having an inner surface reflective film,

The reflector is a circular or elliptical dome-shaped feature of another embodiment.

In the gas sensor assembly of the present invention, the gas sensor and the LED having the sensing film according to the gas to be measured on the base sheet are disposed on the same plane or above the housing, so that processing and manufacturing are extremely easy.

Since the light irradiated upward by a single or one or more LEDs is reflected by the reflector, it is also configured to act as irradiation light to a plurality of gas sensors disposed downward.

Gas detection measurement at room temperature is possible, so power consumption is minimized and packaging is miniaturized and thinned accordingly, so it can be adopted as a sensor that can be mounted on various mobile devices, thereby increasing various utilizations based on the measured gas. Have

1 is a perspective view showing a configuration of a gas sensor in contact combustion according to a conventional sailor.
2A to 2C are perspective views showing one configuration example of a semiconductor type gas sensor in a conventional source.
Figure 3 is an explanatory view showing the configuration of a graphene gas sensor according to a conventional sailor.
Fig. 4 is an explanatory diagram showing an embodiment in which a conventional sailor employs LEDs.
5A and 5B are perspective views showing a preferred gas sensor unit employed in the present invention and a power LED as a light source.
6 is a configuration in which the basic concept of the gas sensor assembly of the present invention is applied, a is a perspective view of a gas sensor assembly of an independent first embodiment, and b is a partial broken perspective view.
7 is a configuration in which the basic concept of the gas sensor assembly of the present invention is applied, a is a perspective view of the gas sensor assembly of the second embodiment, and b is a partial broken perspective view.
8 is a schematic conceptual diagram of a third embodiment of the present invention, where a is an overall perspective view, b is a partial broken perspective view, and c is an explanatory view.

Hereinafter, the configuration and operation according to a preferred embodiment of the gas sensor assembly of the present invention will be described in detail with reference to the accompanying drawings. In the following description, detailed descriptions of parts that can be easily implemented by those skilled in the art may be omitted. In addition, the following description is to describe the preferred embodiment for the present invention, the present invention is not limited by the following examples, it is natural that various modifications can be provided within the scope of the scope of the present invention. will be.

5 a and b are perspective views showing a preferred gas sensor unit and a power LED as a light source employed in the present invention, and FIG. 6 is a configuration in which the basic concept of the gas sensor assembly of the present invention is applied and a is a gas sensor of an independent first embodiment Perspective perspective view of the assembly, b is a partial broken perspective view, FIG. 7 is a configuration in which the basic concept of the gas sensor assembly of the present invention is applied, a is a perspective perspective view of the gas sensor assembly of the second embodiment, b is a partial broken perspective view, and FIG. As a schematic conceptual diagram of the third embodiment of the present invention, a is an overall perspective view, b is a partial broken perspective view, and c is an explanatory view.

In the conventional crew, a gas sensor using LED as an activation energy has been devised.

In the conventional literature, there was also a configuration of a semiconductor gas sensor using LED, but it is a configuration in which the LED irradiated to the sensing area is mounted in the form of a lamp of a high temperature heat source mainly produced as an independent element.

Since it operates at a high temperature in the visible region of the micro heating element or LED, there is a drawback that power consumption is increased, and thus there is a problem in durability, and of course, the size and thickness of the entire sensor must be increased.

The heater proposed by the gas sensor assembly of the present invention has a main focus in the production of a gas sensor that can be driven at room temperature, and it is possible to detect a very small amount of gas and package it by combining a sensing film and a gas sensor in preparation for an existing gas sensor. Therefore, selectivity to the target gas increases and detection accuracy increases.

In an embodiment of the present invention, to enable miniaturization and thinning,

In the first and second embodiments, the gas sensor and the LED are chipped, respectively, and thus, miniaturization is possible, and a configuration in which a plurality of gas sensors are integrated is implemented to enable detection and measurement of various types of gas,

In the third embodiment, instead of the top-mounted type, the light source is placed in the bottom area where the sensor is located, and the structure with a thin reflector on the top of the LED light source is adopted to promote efficient activation of the light source. In order to deteriorate the function or weaken the durability of the sensor, a metal substrate such as aluminum, which has excellent heat dissipation characteristics, is adopted as the LED substrate.

The gas sensor for detection mentioned below of the present invention has a sensing film above it, and the sensitivity and selectivity for sensing gas depend on the sensing film and the operating temperature. The sensing film covering the temperature sensor part is mainly composed of compound thin film materials such as SnO2, ZnO, InO3, and TI / O2, and the compound thin film material applied according to the type of gas to be detected is mounted on the sensor by printing, etc. do.

Therefore, in the present invention, as the sensing film itself has an activation characteristic at a specific wavelength at room temperature, the gas sensing unit itself of the ultraviolet active room temperature driving gas sensor adopts a material whose electrical characteristics are changed by ultraviolet light (UV).

The pre-election for gas detection employed in the present invention is formed by a method such as printing in the form of a thin film in the sensor sensing portion of a conventional ceramic sheet type, for example, a ceramic material (ZnO, TiO ₂ , whose electrical properties change by UV). SnO ₂ , InO _3, etc.) are used.

The LEDs used are simply those that emit UV wavelengths (eg of 365 nm wavelength).

The gas sensor assembly of the present invention includes a gas sensor (g) coated with a sensing film (not particularly shown) as in the perspective view showing a preferred gas sensor unit and a power LED as a light source employed in the present invention of Figs. It is a package assembly constructed using a chipped LED light source (l).

The configuration of the present invention for solving the above-described problems will be described with reference to FIG. 6 and below.

[Example 1-Basic Embodiment]

6 is a configuration in which the basic concept of the gas sensor assembly of the present invention is applied, a is a perspective perspective view of a gas sensor assembly of an independent first embodiment, and b is a partial broken perspective view. This will be described in more detail with reference to the drawings.

The schematic diagram of the gas sensor assembly GA of the configuration using the power LED of FIG. 6 is connected to the gas sensor g1 above the gas sensor g1 that detects various types of sensing substances disposed on the base substrate P. The LED (L1) that is irradiated and changes the electrical characteristics is excreted in the housing H toward the gas sensor g1 below.

I / O is an access slot through which gas to be detected flows in and out.

In such a configuration, since a gas sensor g1 for measuring a single gas is disposed, there is an unsuitable aspect for the measurement of various types of complex gases recently required.

[Second Example-Application Embodiment]

The schematic diagram of the gas sensor assembly GA of the configuration of FIG. 7 is a gas sensor (g1, g2, g3 ..) for detecting various types of sensing substances disposed on the base substrate (P). LEDs (L1, L2, L3 ..) corresponding to g1, g2, g3 ..) are disposed in the housing (H) toward the lower gas sensors (g1, g2, g3 ..).

In the first and second embodiments, the housing H is preferably made of a coolable metal having excellent thermal conductivity, such as aluminum, for cooling the heat of the LEDs L1, L2, and L3 ..

Since the internal LEDs (L1, L2, L3 ..) must be provided with wiring (not shown) for supplying power from the lower base substrate (P), a coolable metal having some non-conductive areas for forming wiring paths, or It can be composed of various types of heat-dissipative plastics that have the electrical wiring rolls.

More preferably, a heat conduction pad (PD) for increasing heat conduction is provided between the gas sensors (g1, g2, g3 ..) having a heat sink (HS) having a downward heat sink fin (HP) and contacting the heat sink (HS). It is good to configure.

[Third Example-Improved Embodiment]

A third embodiment of an optimal configuration to be applied to the concept of the gas sensor assembly (GA) of the present invention will be described below in FIG. 8A.

A plurality of gas sensors (G1, G2, G3 ..) for sensing various types of sensing materials or detecting the same sensing materials are heat-dissipating materials such as aluminum and disposed on a base sheet (ST) such as a circular shape.

As described above, the gas sensors (G1, G2, G3 ..) having a sensing film mounted on its surface may have a sensing film having different components according to each sensing material.

In the central portion of the base sheet ST, an LED L as a heat source is mounted on a heater mounting portion HS of a heat sink H made of metal such as aluminum.

 That is, at least one power LED (Lm) as a heater heat source is mounted at the center of each of the gas sensors (G1, G2, G3 ..) arranged. Therefore, the gas sensors G1, G2, and G3 .. centered around the LED Lm constitute a shape excreted in all directions or radially.

On the base sheet (ST), while receiving the gas sensors (G1, G2, G3 ..) mounted, the reflector (R) for constructing a hemispherical reflector of a circular, elliptical, polygonal body covered as a cover on the upper side is fixed. Have it.

The reflector R can be made of various materials such as glass, plastic, metal thin film, etc., and has a reflective film RS such as a silver film or an aluminum film coated therein as a process such as sputtering deposition.

As shown, the reflector (R) may be composed of a dome-shaped spherical or ellipsoid, a polygonal body, and the like, and the focal length, long and short radius, radius and width of the dome shaped body that optimizes the shape and reflection of the inner surface of the reflector (R). -The value of height (in the case of a polygonal dome) is the gas of each heat source of the LED (L) located in the center, depending on the number of gas sensors (G1, G2, G3 ..) and the mounting location. Of course, it is configured to maximize the irradiation value to the sensors (G1, G2, G3 ..).

With this configuration, the gas sensors G1, G2, G3 .. and the LED Lm on the base sheet ST are disposed on the same plane, so that consistent processing and manufacturing are extremely easy.

In addition, a single or one or more LEDs (L) are reflected by upward reflecting light reflected by the reflector (R) acting as a factor of change in electrical characteristics of a number of gas sensors (G1, G2, G3 ..) Because it is possible to irradiate multiple gas sensors (G1, G2, G3 ..) as one LED (L), it can be driven at room temperature, minimizing power consumption and packaging accordingly, minimizing packaging. It can be configured as a mountable sensor.

B: Base board
G1, G2, G3 .: Gas sensor
R: Reflector

Claims (5)

A gas sensor assembly comprising a gas sensor (g) and a chipped LED light source (1);
The gas to be detected is disposed on the base substrate P and the LED (L1) as a change light of electrical characteristics corresponding to the gas sensor g1 is located above the gas sensor g1 having a sensing film on its surface. The housing (H) having an entry / exit slot (I / O) that flows in and out is disposed to irradiate toward the gas sensor (g1) below, and the housing (H) supplies power to the LEDs (L1, L2, L3 ..). A gas sensor assembly characterized in that it is made of a coolable metal having a part of a non-conductive region for insulatingly forming a wiring path for heating, or a heat-dissipating plastic having an electric wiring. According to claim 1;
The gas sensor assembly GA senses a plurality of sensing materials disposed on the base substrate P and serves as irradiation light corresponding to a plurality of gas sensors (g1, g2, g3 ..) having different sensing films on the surface. Gas characterized in that a plurality of gas detection is possible by exposing LEDs (L1, L2, L3 ..) toward the gas sensors (g1, g2, g3 ..) below in the housing (H) Sensor assembly. One or more gas sensors (G1, G2, G3 ..) for detecting one or more sensing objects are disposed on a base sheet (ST) of heat dissipation, and are the same as the gas sensors (G1, G2, G3 ..) The gas sensor (G1, G2, G3.) Having one or more LEDs (L) which are disposed at an upward irradiation angle on a plane, and the irradiation light source of the LED (L) on the same plane of the base sheet (ST). Gas sensor assembly characterized in that it comprises a reflector (R) for reflecting to irradiate as a reflector having an inner surface reflective film. The method of claim 3;
The reflector (R) is a gas sensor assembly characterized in that the dome-shaped circular or elliptical. The method according to any one of claims 1 to 2 or 3;
The base substrate (P) has a heat radiation plate (HS) having a heat dissipation fin (HP) below, the gas sensor (g1) in contact with the heat radiation plate (HS) between the heat conduction pad (PD) for increasing the thermal conductivity. Gas sensor assembly characterized in that it can be further provided.

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