KR20200045638A - Substrate processing apparatus - Google Patents

Abstract

The present invention relates to a substrate processing apparatus. The substrate processing apparatus in which a polishing process of a substrate is performed includes: a transfer belt which is movably provided along a predetermined path and of which a substrate is mounted on an outer surface; a loading part loading the substrate on the transfer belt; a detection part detecting movement of the transfer belt with respect to the loading part; and an aligning unit aligning the loading part with respect to the transfer belt based on a signal detected in the detection part. Therefore, polishing stability and uniformity of the substrate can be improved.

Description

Substrate processing device {SUBSTRATE PROCESSING APPARATUS}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of improving polishing stability and polishing uniformity of a substrate.

Recently, as interest in information display has increased and the demand to use a portable information medium has increased, it has been applied to a lightweight flat panel display (FPD) that replaces the existing display device, the cathode ray tube (CRT). Korea's research and commercialization are focused.

In the field of flat panel display devices, a liquid crystal display device (LCD), which is light and has low power consumption, has been the most popular display device, but the liquid crystal display device is not a light emitting device but a light receiving device, and has a brightness and contrast ratio. ratio) and viewing angles, etc., development of a new display device capable of overcoming these disadvantages has been actively developed. Among them, an organic light emitting display (OLED) is one of the next-generation displays that have recently been spotlighted.

In general, a glass substrate having excellent strength and transmittance is used in a display device. Recently, since a display device is directed toward slimming and high-pixel, a corresponding glass substrate must be prepared.

For example, as one of the OLED processes, in the laser laser annealing (ELA) process in which amorphous silicon (a-Si) is injected and crystallized into polysilicon (poly-Si), protrusions may occur on the surface while polysilicon is crystallized. Since these projections can cause mura-effects, the glass substrate must be polished to remove the projections.

To this end, in recent years, various studies have been conducted to efficiently polish the surface of the substrate, but it is still insufficient to develop it.

An object of the present invention is to provide a substrate processing apparatus capable of improving polishing stability and polishing uniformity of a substrate.

In addition, an object of the present invention is to shorten the time required to process the substrate and to improve productivity and yield.

In addition, an object of the present invention is to enable the substrate to be continuously supplied and processed.

In addition, the present invention aims to simplify the equipment and to reduce manufacturing costs.

The present invention for achieving the above-described objects of the present invention is provided to be movable along a predetermined path and a transfer belt on which the substrate is mounted on an outer surface, a loading part for loading the substrate on the transfer belt, and a transfer for the loading part It provides a substrate processing apparatus including a sensing unit for sensing the movement of the belt, and an alignment unit for aligning the loading part with respect to the transport belt based on the signal detected by the sensing unit.

According to the present invention as described above, an advantageous effect of improving the polishing stability and polishing uniformity of the substrate can be obtained.

In particular, according to the present invention, the substrate can be accurately supplied to the intended position, and an advantageous effect of stably maintaining the placement position of the substrate can be obtained.

In addition, according to the present invention, it is possible to shorten the time required to process the substrate and to obtain an advantageous effect of improving productivity and yield.

Further, according to the present invention, it is possible to obtain an advantageous effect of continuously supplying and processing the substrate.

In addition, according to the present invention, it is possible to simplify the equipment, reduce manufacturing costs, and obtain an advantageous effect of improving space utilization.

1 is a plan view showing the configuration of a substrate processing apparatus according to the present invention,
Figure 2 is a side view showing the configuration of a substrate processing apparatus according to the present invention,
3 is a substrate processing apparatus according to the present invention, a plan view for explaining the loading part and the alignment unit,
4 to 6 is a substrate processing apparatus according to the present invention, a view for explaining the loading process of the substrate,
7 and 8 is a substrate processing apparatus according to the present invention, a view for explaining the alignment process of the loading part,
9 is a substrate processing apparatus according to the present invention, a plan view for explaining the polishing path of the polishing unit,
10 is a substrate processing apparatus according to the present invention, a view for explaining a retainer,
11 and 12 is a substrate processing apparatus according to the present invention, a view for explaining the unloading process of the substrate,
13 is a substrate processing apparatus according to the present invention, a view for explaining another embodiment of the alignment unit.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and the contents described in other drawings may be cited and described under these rules, and repeated contents that are deemed to be obvious to those skilled in the art or may be omitted.

1 is a plan view showing a configuration of a substrate processing apparatus according to the present invention, FIG. 2 is a side view showing a configuration of a substrate processing apparatus according to the present invention, and FIG. 3 is a substrate processing apparatus according to the present invention, and a loading part And a plan view for explaining the alignment unit. In addition, FIGS. 4 to 6 are substrate processing apparatuses according to the present invention, and are views for explaining the loading process of the substrates, and FIGS. 7 and 8 are substrate processing apparatuses according to the present invention, which describe the alignment process of the loading parts. It is a drawing to do. And, Figure 9 is a substrate processing apparatus according to the present invention, a plan view for explaining the polishing path of the polishing unit, Figure 10 is a substrate processing apparatus according to the present invention, a view for explaining the retainer. 11 and 12 are substrate processing apparatuses according to the present invention, and are views for explaining a substrate unloading process, and FIG. 13 is a substrate processing apparatus according to the present invention, which describes another embodiment of an alignment unit. It is a drawing for.

Referring to Figures 1 to 13, the substrate processing apparatus 10 according to the present invention is provided to be movable along a predetermined path and the transfer belt 210 and the transfer belt 210 on which the substrate is mounted on the outer surface. Based on the loading part 100 for loading the substrate W, the sensing part 400 for sensing the movement of the transfer belt 210 relative to the loading part 100, and the signals detected by the sensing part 400 And an alignment unit 130 that aligns the loading part 100 relative to the transport belt 210.

This is to improve the processing efficiency of the substrate W, and to improve the polishing stability and uniformity of the substrate.

In polishing a substrate seated on a transfer belt, there is a problem in that the polishing accuracy and polishing uniformity of the substrate are deteriorated if the substrate is not accurately positioned at an intended polishing position (where polishing is performed).

Particularly, in order to accurately position the substrate at the intended polishing position, it is important to accurately place the substrate on the transport belt, but when the position of the transport belt deviates from the original intended position when the transport belt is rotated, the substrate is accurately placed on the transport belt. Even if it is seated, there is a problem that the substrate is difficult to be accurately placed in the polishing position. In addition, there is a problem in that the substrate is damaged or damaged when the polishing process is performed while the substrate is out of the polishing position.

However, the present invention detects the movement of the transfer belt 210, and by aligning the position of the loading part 100 with respect to the transfer belt 210 in response to the movement of the transfer belt 210, the substrate (W) Can be accurately placed at the intended polishing position, and an advantageous effect of improving the polishing stability and polishing uniformity of the substrate W can be obtained.

Moreover, the present invention does not need to reload the substrate W mounted on the transfer belt to the transfer belt 210 again or to change the polishing conditions of the polishing unit 230, so that the processing efficiency of the substrate W is improved. It is possible to obtain an advantageous effect of increasing and shortening the processing time.

Above all, according to the present invention, by aligning the position of the loading part with respect to the transfer belt in response to the movement of the transfer belt, the size of the substrate receiving portion in which the substrate is accommodated in a retainer formed on the surface of the transfer belt to surround the periphery of the substrate Since it can be minimized (size corresponding to the substrate), it is possible to obtain an advantageous effect of further improving the polishing stability and the uniformity of polishing of the substrate.

That is, in the state where the substrate is mounted on the transfer belt, as the substrate is disposed to protrude from the surface of the transfer belt on which the substrate is mounted, the boundary between the inner region (the upper surface of the substrate) and the outer region of the substrate (the edge of the substrate) Steps will occur. However, when the substrate is polished by the polishing unit and passes through the edge of the substrate of the polishing unit, there is a problem in that the polishing unit is rebound from the substrate due to a step at the edge of the substrate.

Conventionally, by providing a retainer having a height similar to that of the substrate around the edge of the substrate, the polishing unit moves from the outer region of the substrate to the inner region of the substrate (the upper surface of the substrate) during the polishing process, or from the inner region of the substrate. While moving to the outer region of the substrate, it was possible to minimize the rebound phenomenon of the polishing unit due to the height deviation between the inner region and the outer region of the substrate.

However, if the substrate receiving portion of the retainer does not have a size sufficiently larger than the substrate, there is a problem that the substrate is not accurately accommodated in the substrate receiving portion of the retainer when the transfer belt moves during the loading process of the substrate. Therefore, even if the transfer belt moves during the loading process of the substrate, in order to allow the substrate to be accommodated in the substrate accommodating portion of the retainer, the size of the substrate accommodating portion must inevitably be made larger than the substrate.

However, as the size of the substrate accommodating portion increases, the gap between the edge of the substrate and the inner wall surface of the substrate accommodating portion increases, and despite the provision of a retainer around the substrate, the polishing unit causes the substrate to be cut by the gap at the edge of the substrate. There is a problem in that a rebound phenomenon occurs during passage.

Accordingly, according to the present invention, by aligning the position of the loading part with respect to the transfer belt in response to the movement of the transfer belt, the size of the substrate receiving portion in which the substrate is accommodated in the retainer can be minimized, so that the polishing unit moves the edge of the substrate. In the meantime, the rebound phenomenon of the polishing unit 230 can be minimized, and an advantageous effect of minimizing the occurrence of a non-abrasive area due to the rebound phenomenon can be obtained.

The transfer belt 210 is disposed between the loading part 100 and the unloading part 300, and the substrate W supplied to the loading part 100 is transferred to the transfer belt 210 to be transferred to the transfer belt 210 After being polished in a seated state, it is unloaded through the unloading part 300.

The loading part 100 is provided to load the substrate W to be polished to the transfer belt 210.

The loading part 100 may be formed of various structures capable of loading the substrate W on the transfer belt 210, and the present invention is not limited or limited by the structure of the loading part 100.

For example, the loading part 100 is provided to transport the substrate W at the same height as the transport belt 210, and includes a plurality of loading transport rollers 120 which are spaced apart at predetermined intervals, and a plurality of The substrate W supplied to the upper portion of the loading transfer roller 120 is transported cooperatively by a plurality of loading transfer rollers 120 as the loading transfer roller 120 rotates. Preferably, the plurality of loading transfer rollers 120 are rotatably mounted to the support 110.

According to another embodiment of the present invention, it is possible that a plurality of loading transport rollers are individually supported, and it is also possible that the loading part comprises a circulation belt that rotates circulating by the loading transport roller.

Here, the loading part 100 transfers the substrate W at the same height as the transfer belt 210 means that the loading part 100 is disposed at a height that allows bending deformation of the substrate W, and the substrate W ). For example, in consideration of the substrate bending deformation in the state where the substrate protrudes from the loading part (the substrate is transferred so as to escape the loading transport roller disposed at the outermost), the loading part is slightly higher than the transport belt 210 (for example, For example, within 10 mm). However, if bending deformation of the substrate can be suppressed, the height at which the substrate W is transferred from the loading part 100 and the height at which the substrate W is seated and transferred at the transfer belt 210 may be the same. .

In addition, the substrate W supplied to the loading part 100 may be aligned in a posture and position in which posture and position are determined by an alignment unit (not shown) before being supplied to the loading part 100.

For reference, as the substrate W used in the present invention, a rectangular substrate W having a side length greater than 1 m may be used. For example, as the substrate W to which the chemical mechanical polishing process is performed, a 6th generation glass substrate W having a size of 1500 mm * 1850 mm may be used. In some cases, it is also possible that 7th and 8th generation glass substrates are used as substrates to be processed. Alternatively, alternatively, it is also possible that a substrate having a length of one side smaller than 1 m (for example, a second-generation glass substrate) is used.

The transfer belt 210 is provided to constitute the polishing part 200 between the loading part 100 and the unloading part 300.

The polishing part 200 may include various structures capable of polishing the substrate, including the transfer belt 210, and the present invention is not limited or limited by the structure of the polishing part. More specifically, the polishing part 200 includes a transfer belt 210 on which the substrate is mounted, a substrate support 230 supporting the bottom surface of the substrate with the transfer belt 210 interposed therebetween, and an upper surface of the substrate W It includes a polishing unit 230 for polishing.

For reference, in the present invention, the polishing unit 230 polishes the substrate W is defined as polishing the substrate W by a mechanical polishing process on the substrate W or a chemical mechanical polishing (CMP) process. do. As an example, in the polishing part 200, while mechanical polishing is performed on the substrate W, a slurry for chemical polishing is supplied together and a chemical mechanical polishing (CMP) process is performed.

The transfer belt 210 is disposed adjacent to the loading part 100 and is configured to rotate in an infinite loop manner along a predetermined path. The substrate W transferred from the loading part 100 to the transfer belt 210 is transferred as the transfer belt 210 rotates circulating while seated on the outer surface of the transfer belt 210.

More specifically, the substrate W transferred from the loading part 100 to the transfer belt 210 is polished in a state where it is seated on the outer surface of the transfer belt 210 as the transfer belt 210 rotates (substrate It can be transferred to the upper position of the support. In addition, the substrate W, which has been polished, may be transferred from the polishing position to the unloading part 300 side as the transport belt 210 rotates.

The circulating rotation of the transfer belt 210 can be done in various ways depending on the required conditions and design specifications. For example, the transfer belt 210 rotates circulatingly along a path determined by the roller unit 212, and the substrate W seated on the transfer belt 210 moves linearly by the rotational rotation of the transfer belt 210. It is transported along the path.

The movement path (eg, a circulation path) of the transfer belt 210 may be variously changed according to required conditions and design specifications. For example, the roller unit 212 includes a first roller 212a and a second roller 212b disposed horizontally spaced from the first roller 212a, and the transfer belt 210 includes a first roller ( 212a) and the second roller 212b rotates in an infinite loop manner.

For reference, the outer surface of the transfer belt 210 means an outer surface exposed to the outside of the transfer belt 210, and a substrate W is mounted on the outer surface of the transfer belt 210. In addition, the inner surface of the transfer belt 210 means an inner surface of the transfer belt 210 in which the first roller 212a and the second roller 212b contact.

In addition, any one or more of the first roller 212a and the second roller 212b may be configured to move linearly in a direction that is selectively approached and separated from each other. For example, the first roller 212a is fixed and the second roller 212b may be configured to move linearly in a direction approaching and spaced apart from the first roller 212a. In this way, the tension of the transfer belt 210 can be adjusted by allowing the second roller 212b to approach and be spaced apart from the first roller 212a according to manufacturing tolerances and assembly tolerances.

Here, adjusting the tension of the transfer belt 210 is defined as adjusting the tension by pulling or loosening the transfer belt 210 tautly. In some cases, it is also possible to provide a separate tension adjusting roller and adjust the tension of the transport belt by moving the tension adjusting roller. However, it is preferable to move any one or more of the first roller and the second roller to improve the structure and space utilization.

In addition, a surface pad (see 210a of FIG. 10) may be provided on the outer surface of the transfer belt 210 to suppress slip by increasing a coefficient of friction with respect to the substrate W. That is, the surface pad 210a may restrain the movement of the substrate W relative to the transfer belt 210 (constrain slippage) while the substrate W is seated on the outer surface of the transfer belt 210. , It is possible to stably maintain the placement position of the substrate (W).

The surface pad 210a may be formed of various materials having bonding properties with the substrate W, and the present invention is not limited or limited by the material of the surface pad. For example, the surface pad is formed of polyurethane or silicone having excellent elasticity and adhesion (friction). In some cases, it is also possible to form the surface pad from other materials having a non-slip function, for example, engineering plastics having a non-slip function.

Furthermore, by forming the surface pad 210a having elasticity on the outer surface of the transfer belt 210, even if foreign substances flow between the substrate W and the transfer belt 210, the portion where the foreign substance is located as much as the thickness of the foreign substance is located. Since the surface pad can be pressed, the height deviation of the substrate W due to foreign matter (a specific part of the substrate is locally projected by the foreign material) can be resolved, and a specific part of the substrate W is projected locally. Accordingly, it is possible to obtain an advantageous effect of minimizing a decrease in polishing uniformity.

The sensing unit 400 is provided to detect the movement (position change) of the transfer belt 210 with respect to the loading part 100 before the substrate W supplied to the loading part is transferred to the transfer belt 210. .

As the sensing unit 400, various sensing means capable of sensing the movement of the transport belt 210 with respect to the loading part 100 may be used. For example, any one or more of a conventional vision camera or sensor (eg, laser sensor or laser scanner) may be used as the sensing unit 400.

Preferably, the sensing unit 400 detects the moving distance of the transfer belt 210 with respect to the loading part 100. For example, the sensing unit 400 detects the moving distances L1 and L2 of the transfer belt 210 along a direction orthogonal to the loading direction in which the substrate W is loaded on the transfer belt 210.

That is, as the conveying belt 210 is configured to rotate cyclically by the roller unit 212, during rotation of the conveying belt 210, the axial direction of the first roller 212a and the second roller 212b (loading of the substrate) The movement of the conveying belt 210 along the direction orthogonal to the direction occurs, and the sensing unit 400 includes the conveying belt 210 along the axial direction of the first roller 212a and the second roller 212b. Detects the travel distance.

More specifically, the sensing unit 400 measures the distance from the predetermined reference position 401 to the end of the transfer belt 210 to detect the movement distances L1 and L2 of the transfer belt 210.

More preferably, the sensing unit 400 detects the movement of the transfer belt 210 in real time while the substrate W is being loaded onto the transfer belt 210. In this way, by detecting the movement of the transfer belt 210 in real time while the substrate W is being loaded on the transfer belt 210, the transfer belt for the loading part 100 during the loading process of the substrate W ( It is possible to obtain an advantageous effect of sensing the movement of 210 more accurately.

In the embodiment of the present invention, the sensing unit 400 is described as an example of sensing one side end of the conveying belt 210 adjacent to the second roller 212b, but in some cases, the sensing unit is another end of the conveying belt. It is possible to detect or detect both ends of the transfer belt, the present invention is not limited or limited by the position and number of the sensing unit.

The substrate support 230 is provided to support the bottom surface of the substrate W with the transfer belt 210 interposed therebetween.

More specifically, the substrate support 230 is disposed under the transfer belt 210 to face the bottom surface of the substrate W, and supports the inner surface of the transfer belt 210.

The substrate support 230 may be configured to support the inner surface of the transfer belt 210 in various ways depending on the required conditions and design specifications. For example, a crystal plate may be used as the substrate support 230, and the substrate support 230 is disposed in close contact with the inner surface of the transfer belt 210 to support the inner surface of the transfer belt 210.

In this way, by allowing the substrate support 230 to support the inner surface of the transfer belt 210, the weight of the substrate W and the transfer unit 210 as the polishing unit 230 presses the substrate W Can prevent sagging.

Hereinafter, an example in which the substrate support 230 is formed in a substantially rectangular plate shape will be described. In some cases, the substrate support may be formed in other shapes and structures, and it is also possible to support the inner surface of the substrate carrier by two or more substrate supports.

On the other hand, in the above-described and illustrated embodiment of the present invention, the substrate support 230 is described as an example configured to support the inner surface of the transfer belt 210 in a contact manner, but in some cases, the substrate support is a substrate carrier It is also possible to configure the inner surface to be supported in a non-contact manner. For example, the substrate support portion may be configured to spray a fluid on the inner surface of the substrate carrier, and support the inner surface of the substrate carrier by an injection force by the fluid. (Not shown)

At this time, the substrate support portion may spray at least one of a gas (for example, air) and a liquid (for example, pure water) to the inner surface of the substrate carrier, and the type of fluid may be determined according to required conditions and design specifications. It can be changed in various ways.

Thus, by supporting the inner surface of the substrate carrier in a non-contact state, an advantageous effect of minimizing the reduction in processing efficiency due to frictional resistance (factors that interfere with the movement (rotation) of the substrate carrier) can be obtained. According to another embodiment of the present invention, it is also possible to configure the substrate support portion to support the inner surface of the substrate carrier in a non-contact manner by using a magnetic force (eg, repulsive force) or a floating force caused by ultrasonic vibration.

The polishing unit 230 is provided to polish the surface of the substrate W in contact with the surface of the substrate W.

For example, the polishing unit 230 is formed to have a smaller size than the substrate W, and includes a polishing pad 232 that moves while rotating in contact with the substrate W.

More specifically, the polishing pad 232 is mounted on a carrier (not shown), and linearly polishes (flattens) the surface of the substrate W while rotating in contact with the surface of the substrate W.

The polishing pad 232 carrier may be formed of various structures capable of rotating the polishing pad 232, and the present invention is not limited or limited by the structure of the polishing pad 232 carrier. As an example, the carrier of the polishing pad 232 may be configured as one body, or may be configured by combining a plurality of bodies, and is configured to rotate in connection with a drive shaft (not shown). In addition, the carrier of the polishing pad 232 is provided with a pressing portion (for example, a pneumatic pressing portion for pressing the polishing pad with pneumatic pressure) for pressing the polishing pad 232 to the surface of the substrate W.

The polishing pad 232 is formed of a material suitable for mechanical polishing of the substrate W. For example, the polishing pad 232 is polyurethane, polyurea, polyester, polyether, epoxy, polyamide, polycarbonate, polyethylene, polypropylene, fluoropolymer, vinyl polymer, acrylic and methacrylic polymer, Silicon, latex, nitride rubber, isoprene rubber, butadiene rubber, and may be formed using various copolymers of styrene, butadiene, and acrylonitrile, and the material and properties of the polishing pad 232 are subject to required conditions and design specifications. It can be changed in various ways.

Preferably, as the polishing pad 232, a circular polishing pad 232 having a smaller size than the substrate W is used. That is, it is also possible to polish the substrate W using the polishing pad 232 having a size larger than the substrate W, but when using the polishing pad 232 having a size larger than the substrate W, polishing Since a very large rotating equipment and space are required to rotate the pad 232, there is a problem in that space efficiency, design freedom, and stability decrease.

Substantially, the substrate W rotates a polishing pad (eg, a polishing pad having a diameter greater than 1 m) having a size larger than the substrate W because at least one side has a size greater than 1 m. There is a very difficult problem itself. In addition, when a non-circular polishing pad (for example, a rectangular polishing pad) is used, the surface of the substrate W polished by the rotating polishing pad cannot be polished to a uniform thickness as a whole. However, the present invention, by rotating the circular polishing pad 232 having a smaller size than the substrate (W) to polish the surface of the substrate (W), without significantly reducing the space efficiency and design freedom polishing pad ( It is possible to polish the substrate W by rotating 232, and an advantageous effect of keeping the amount of polishing by the polishing pad 232 uniform throughout can be obtained.

At this time, the polishing path of the polishing unit 230 may be variously changed according to required conditions and design specifications.

For example, referring to FIG. 9, the polishing pad 232 has a first diagonal path L1 inclined with respect to one side of the substrate W, and a second diagonal path inclined in opposite directions of the first diagonal path L1. It is configured to polish the surface of the substrate W while repeatedly zigzag along the path L2.

Here, the first diagonal path L1 means a path inclined at a predetermined angle θ with respect to the left side of the substrate W, for example. In addition, the second diagonal path L2 means a path inclined at a predetermined angle toward the opposite direction of the first diagonal path L1 so as to intersect with the first diagonal path L1.

In addition, in the present invention, that the polishing pad 232 repeatedly zigzag moves along the first diagonal path L1 and the second diagonal path L2, the polishing pad 232 contacts the surface of the substrate W It is defined that the movement path of the polishing pad 232 with respect to the substrate W is not interrupted while moving to the other state (conversion from the first diagonal path to the second diagonal path) without being interrupted. In other words, the polishing pad 232 continuously moves along the first diagonal path L1 and the second diagonal path L2 and forms a moving trajectory of continuously connected waves.

More specifically, the first diagonal path L1 and the second diagonal path L2 are line-symmetrical based on one side of the substrate W, and the polishing pad 232 has a first diagonal path L1 and a second diagonal path The surface of the substrate W is polished while repeatedly zigzag along (L2). In this case, the first diagonal path L1 and the second diagonal path L2 are referred to as line symmetry based on one side of the substrate W, and the first diagonal path L1 is centered around one side 11 of the substrate W. ) And the second diagonal path (L2) are symmetrical, it means that the first diagonal path (L1) and the second diagonal path (L2) overlap completely, and one side of the substrate (W) and the first diagonal path (L1) ) And the angle formed by one side of the substrate W and the second diagonal path L2 are defined to be the same.

Preferably, the polishing pad 232 has a length less than or equal to the diameter of the polishing pad 232 as a reciprocating pitch to the substrate W along the first diagonal path L1 and the second diagonal path L2. About to go back and forth. Hereinafter, the length of the polishing pad 232 is equal to the diameter of the polishing pad 232 as a reciprocating pitch P, with respect to the substrate W along the first diagonal path L1 and the second diagonal path L2. An example of regular round trip movement will be described.

As described above, the surface of the substrate W is polished while the polishing pad 232 repeatedly zigzag moves along the first and second diagonal paths L1 and L2 with respect to the substrate W. The polishing pad 232 in the entire surface area of the substrate W is allowed to move forward with respect to the substrate W by making the length 232 equal to or smaller than the diameter of the polishing pad 232 as the reciprocating pitch P. It is possible to obtain an advantageous effect of regularly and uniformly polishing the entire surface of the substrate W without a region where polishing by) is omitted.

Here, when the polishing pad 232 moves forward with respect to the substrate W, the polishing pad 232 moves with respect to the substrate W along the first diagonal path L1 and the second diagonal path L2. While it is defined as moving forward toward the front of the substrate W (for example, from the left side to the right side of the substrate based on FIG. 9). In other words, for a right triangle having a base, hypotenuse, and stool, the base of the right triangle is defined as the left side of the substrate W, and the hypotenuse of the right triangle is the first diagonal path L1 or the second diagonal path ( L2), and a right triangle can be defined as a forward movement distance of the polishing pad 232 with respect to the substrate W.

In other words, the polishing pad 232 is repeatedly moved in a zigzag manner with respect to the substrate W by moving the length smaller than or equal to the diameter of the polishing pad 232 to the reciprocating pitch (moving along the first and second diagonal paths) ), By polishing the substrate W, it is possible to prevent the occurrence of a region where polishing by the polishing pad 232 is omitted in the entire surface area of the substrate W, and thus the thickness variation of the substrate W And uniformly control the thickness distribution of the substrate W with respect to the two-dimensional plate surface, thereby obtaining an advantageous effect of improving the polishing quality.

As another example, the polishing pad repeatedly moves zigzag along the first straight path (not shown) along one side of the substrate and the second straight path (not shown) opposite to the first straight path to move the surface of the substrate. It is also possible to grind. Here, the first linear path means a path along a direction from one end of the substrate to the other end, for example. Also, the second straight path means a path toward the opposite direction to the first straight path.

The alignment unit 130 is provided to align the position of the loading part 100 with respect to the transport belt 210 based on the signal detected by the detection unit 400.

Here, to align the position of the loading part 100 with respect to the transport belt 210 means that the substrate receiving portion 214a of the retainer 214 provided in the transport belt 210 and the substrate supplied to the loading part are It is defined as adjusting the position of the loading part 100 so that it can be arranged on the same line.

More specifically, the alignment unit 130 adjusts the position of the loading part 100 in response to the movement distances L1 and L2 of the conveyance belt 210 sensed by the detection unit 400. At this time, the adjustment of the position of the loading part 100 is defined as including at least one of a left-right position or a front-rear position of the loading part 100 based on the transport belt 210.

The alignment unit 130 may be formed of various structures that can selectively adjust the position of the loading part 100, and the present invention is not limited or limited by the structure and operation method of the alignment unit 130.

For example, the alignment unit 130 is configured to selectively linearly move the loading part 100 along a direction orthogonal to the loading direction in which the substrate W is loaded into the transport belt 210. Preferably, the alignment unit 130 may move the support 110 of the loading part 100 to simultaneously adjust the positions of the plurality of loading transfer rollers 120. In some cases, it is also possible for the alignment unit to individually adjust the positions of the plurality of loading transfer rollers.

As described above, the substrate W is intended by sensing the movement of the transfer belt 210 and aligning the position of the loading part 100 with respect to the transfer belt 210 in response to the movement of the transfer belt 210 It can be accurately placed in the polished position, it is possible to obtain an advantageous effect of improving the polishing stability and the uniformity of the substrate (W).

That is, in polishing the substrate seated on the transfer belt, there is a problem in that the polishing accuracy and the polishing uniformity of the substrate are deteriorated if the substrate is not accurately positioned at the intended polishing position (the position where polishing is performed). Particularly, in order to accurately position the substrate at the intended polishing position, it is important to accurately place the substrate on the transport belt, but when the position of the transport belt deviates from the original intended position when the transport belt is rotated, the substrate is accurately placed on the transport belt. Even if it is seated, there is a problem that the substrate is difficult to be accurately placed in the polishing position. In addition, there is a problem in that the substrate is damaged or damaged when the polishing process is performed while the substrate is out of the polishing position.

However, the present invention detects the movement of the transfer belt 210, and by aligning the position of the loading part 100 with respect to the transfer belt 210 in response to the movement of the transfer belt 210, the loading process of the substrate Even when the transfer belt 210 moves, the substrate W can be accurately placed at the intended polishing position, and an advantageous effect of improving the polishing stability and uniformity of the substrate can be obtained.

Moreover, the present invention does not need to reload the substrate W seated on the transfer belt 210 to the transfer belt 210 again or to change the polishing conditions of the polishing unit 230, the substrate W It is possible to obtain an advantageous effect of increasing the processing efficiency and shortening the processing time.

On the other hand, referring to Figure 13, according to another embodiment of the present invention, even if the transfer belt 210 is moved inclined at a predetermined angle (θ) with respect to the loading part 100, the alignment unit 130 'is transferred The transfer belt 210 and the loading part 100 may be aligned by adjusting the position of the loading part 100 in response to the movement of the belt 210.

For example, the alignment unit 130 is different from the left and right positions of the front part (a portion adjacent to the transport belt) of the loading part 100 based on the axial direction of the first roller 212a and the second roller 212b. By adjusting or rotating the loading part 100, the transfer belt 210 and the loading part 100 can be aligned. Alternatively, it is also possible to configure the loading part to be aligned with respect to the conveyance belt while simultaneously performing linear and rotational motion relative to the conveyance belt.

In addition, referring to FIGS. 1 and 10, the polishing part 200 includes a retainer 214 provided to protrude on the outer surface of the transfer belt 210 to surround the periphery of the substrate W.

The retainer 214 polishes at the edge of the substrate W when the polishing pad 232 of the polishing unit 230 enters the inner region of the substrate W from the outer region of the substrate W during the polishing process. Minimizes the phenomenon that the pad 232 is rebounded (a phenomenon that bounces), and a non-abrasive zone at the edge portion of the substrate W due to the rebound phenomenon of the polishing pad 232 (polishing by the polishing pad) It is provided to minimize the area that is not done).

That is, in a state where the substrate is seated so as to protrude on the outer surface of the transfer belt, a step occurs at the boundary between the inner region of the substrate (the upper surface of the substrate) and the outer region of the substrate (the edge of the substrate). However, when the substrate is polished by the polishing unit and passes through the edge of the substrate of the polishing unit, there is a problem in that the polishing unit is rebound from the substrate due to a step at the edge of the substrate. In particular, when the polishing unit is disposed at a height lower than the upper surface of the substrate in the outer region of the substrate and then enters the inner region of the substrate, the step at the edge of the substrate (height difference between the bottom surface of the polishing unit and the top surface of the substrate) This causes the polishing unit to strike the substrate and rebound from the substrate. As described above, when the rebound phenomenon of the polishing unit occurs in the edge region of the substrate, polishing uniformity in the edge region of the substrate is not guaranteed, and in severe cases, a dead zone (on the polishing pad) in the edge region of the substrate. There is a problem in that a region where polishing is not performed) occurs. For example, there is a problem in that the edge region of the substrate corresponding to an area of about 10 mm from the edge of the substrate to the inside of the substrate cannot be polished by the polishing unit.

However, according to the present invention, by providing a retainer 214 having a height similar to that of the substrate W around the edge of the substrate W, the polishing unit 230 in the outer region of the substrate W during the polishing process While moving to the inner region of (W) or from the inner region of the substrate W to the outer region of the substrate W, the polishing unit 230 according to the height difference between the inner region and the outer region of the substrate W It is possible to minimize the rebound phenomenon of, it is possible to obtain an advantageous effect of minimizing the occurrence of the non-polishing region by the rebound phenomenon.

More specifically, the retainer 214 is formed with a substrate receiving portion 214a corresponding to the shape of the substrate W penetrating, and the substrate W is outside the transfer belt 210 inside the substrate receiving portion 214a. It sits on the surface.

In the state in which the substrate W is accommodated in the substrate receiving portion 214a, the surface height of the retainer 214 has a height similar to the surface height of the edge of the substrate W. As described above, by making the outer region of the substrate W (the region of the retainer 214) adjacent to the edge portion of the substrate W and the edge portion of the substrate W have a similar height to each other, the polishing pad during the polishing process While the 232 moves from the outer region of the substrate W to the inner region of the substrate W or from the inner region of the substrate W to the outer region of the substrate W, the inner region of the substrate W It is possible to minimize the rebound phenomenon of the polishing pad 232 according to the height difference between the and the outer region, and it is possible to obtain an advantageous effect of minimizing the occurrence of the non-abrasive region due to the rebound phenomenon.

Preferably, the retainer 214 is formed to have the same thickness range as the substrate W. As described above, by forming the retainer 214 to have the same thickness range as the substrate W, the polishing pad 232 moves from the outer region of the substrate W to the inner region of the substrate W while polishing. An advantageous effect of preventing the occurrence of a rebound phenomenon due to the collision of the pad 232 and the retainer 214 can be obtained.

More preferably, the substrate receiving portion 214a is formed in a size corresponding to the substrate W.

Here, that the substrate receiving portion 214a is formed to a size corresponding to the substrate W means that the substrate receiving portion 214a and the substrate have the same size, or a fine gap between the substrate receiving portion 214a and the substrate. It is defined to include all that is formed.

More specifically, the gap (G in FIG. 10) between the inner wall surface of the substrate receiving portion 214a and the side surface of the substrate W is formed to be 0.1 to 5 mm. In this way, the gap between the inner wall surface of the substrate receiving portion 214a and the side surface of the substrate is set to 0.1 to 5 mm, so that during the polishing, the arrangement of the substrate W is stably maintained while the polishing unit 230 is maintained. The rebound phenomenon may be minimized, and after polishing, the substrate W may be more smoothly separated from the substrate receiving portion 214a.

As described above, by minimizing the size of the substrate receiving portion 214a in which the substrate W is accommodated in the retainer 214 to a size corresponding to the substrate, the polishing unit 230 moves the edge of the substrate W. In the meantime, the rebound phenomenon of the polishing unit 230 can be minimized, and an advantageous effect of minimizing the occurrence of a non-abrasive area due to the rebound phenomenon can be obtained.

That is, in the past, even if the transfer belt moves during the loading process of the substrate, the retainer is provided around the substrate as the size of the substrate receiving portion is formed to be much larger than the substrate so that the substrate is accommodated in the substrate receiving portion of the retainer. Despite this, there is a problem in that a rebound phenomenon occurs while the polishing unit passes through the edge of the substrate due to the gap at the edge of the substrate.

However, the present invention, by aligning the position of the loading part 100 with respect to the transfer belt 210 in response to the movement of the transfer belt 210, the substrate receiving portion 214a in which the substrate is accommodated in the retainer 214 Since the size of can be minimized to a size corresponding to the substrate, it is possible to minimize the rebound phenomenon of the polishing unit 230 while the polishing unit moves the edge of the substrate, and minimize the occurrence of non-polishing areas due to the rebound phenomenon. Advantageous effect can be obtained.

In addition, the substrate processing apparatus 10, during the loading transfer process for transferring the substrate W from the loading part 100 to the polishing part 200, the loading transfer speed at which the loading part 100 transfers the substrate W And, the transfer belt 210 includes a loading control unit 140 for synchronizing the transfer speed of the transfer belt 210 to transfer the substrate (W).

More specifically, the loading control unit 140, when one end of the substrate (W) is disposed at a predetermined seating start position (SP) on the transfer belt 210, synchronizes the loading transfer speed and the transfer belt 210 transfer speed Order. In other words, when one end of the substrate is detected by the sensing unit 400, the loading control unit 140 synchronizes the loading transport speed and the transport belt 210 transport speed.

Here, the seating start position (SP) in advance to the transfer belt 210 is defined as a position where the substrate (W) can start to be transferred by cyclic rotation of the transfer belt 210, and the seating start position (SP) In, the bonding property between the transfer belt 210 and the substrate W is given. For example, the seating start position SP may be set at one side of the substrate receiving portion 214a facing the distal end of the substrate W transferred from the loading part 100.

For reference, the transfer belt 210 is configured to rotate continuously, and when the detection sensor 250 detects a seating point of the substrate W while the transfer belt 210 is rotating, for example, the detection sensor 250 ) Senses the seating start position SP on the transfer belt 210, the substrate W is transferred from the loading part 100 to the seating start position SP and seated on the transfer belt 210. 4 and 5)

The sensing sensor 250 may be mounted at various positions according to required conditions and design specifications. For example, the detection sensor 250 may detect the seating start position SP while the transfer belt 210 moves through the outer surface of the first roller 212a. In some cases, the sensing sensor may be mounted adjacent to the second roller or may be mounted at other locations, and the present invention is not limited or limited by the position and number of sensing sensors. Alternatively, it is also possible for the detection sensor to detect the end of the retainer.

As the sensing sensor 250, a conventional contact sensor, a non-contact sensor, a vision sensor, a photo sensor, a color sensor, and the like can be used, and the present invention is limited or limited by the type and sensing method of the sensing sensor 250. no.

The unloading part 300 is provided to unload the substrate W on which the polishing treatment has been completed in the polishing part 200.

The unloading part 300 may be formed of various structures capable of unloading the substrate W from the polishing part 200, and the present invention is not limited or limited by the structure of the unloading part 300.

For example, referring to FIGS. 11 and 12, the unloading part 300 transports the substrate W at the same height as the transport belt 210, but a plurality of unloading transport rollers are spaced apart at predetermined intervals. The substrate W supplied to the upper portion of the plurality of unloading transfer rollers 310 including 310 is mutually cooperative by the plurality of unloading transfer rollers 310 as the unloading transfer rollers 310 rotate. Is transferred to. In some cases, it is also possible that the unloading part comprises a circulating belt that circulates and rotates by an unloading transfer roller.

Here, that the unloading part 300 transfers the substrate W at the same height as the transport belt 210 means that the unloading part 300 is disposed at a height that allows bending deformation of the substrate W. It is defined as conveying (W). For example, in a state in which the substrate protrudes from the conveyance belt 210 (a part of the substrate is conveyed outside the conveyance belt 210), in consideration of the bending deformation of the substrate, the loading part is slightly lower than the conveyance belt 210 ( For example, within 10 mm). However, if the bending deformation of the substrate can be suppressed, the height at which the substrate W is transferred from the unloading part 300 and the height at which the substrate W is seated and transferred at the transfer belt 210 may be the same. have.

In addition, during the unloading transfer process in which the substrate processing apparatus 10 transfers the substrate W from the polishing part 200 to the unloading part 300, the transfer belt 210 transfers the substrate W The belt 210 includes an unloading control unit 320 that synchronizes the transfer speed and the unloading transfer speed at which the unloading part 300 transfers the substrate W.

For example, when one end of the substrate W is detected, the unloading control unit 320 synchronizes the unloading transfer speed at the same speed as the transfer belt 210 transfer speed at which the transfer belt 210 transfers the substrate W. Order. In some cases, regardless of whether one end of the substrate is detected, the substrate carrier is transferred to the unloading part by transferring the substrate carrier while the unloading transfer roller is rotated so that the substrate carrier transfer speed and the unloading transfer speed are the same. It is also possible.

Meanwhile, the transfer belt 210 moves in a direction spaced apart from the bottom surface of the substrate W in a state in which the substrate W, which has been polished, is transferred for a predetermined period or more.

More specifically, referring to FIG. 11, the transfer belt 210 is configured to rotate and rotate the substrate W along a predetermined path, and the substrate W moves the transfer belt 210 along the rotation path. In the starting position (the position where the substrate carrier starts moving along the curved path along the outer surface of the driving member), the conveying belt 210 is moved as the conveying belt 210 moves in a direction away from the bottom surface of the substrate W. 210).

As described above, in a state in which the transport belt 210 transporting the substrate W transports the substrate W for a predetermined period or more, the transport belt 210 is moved in a direction spaced from the bottom surface of the substrate W. By this, it is possible to obtain an advantageous effect of naturally separating the substrate W from the transfer belt 210 without a separate pickup process (for example, a pickup process using a substrate adsorption device).

In some cases, the moving member is wound from one direction to another, and it is also possible to transfer the substrate carrier. (Not shown) Here, the moving member is wound from one direction to the other. Reel to reel winding method of a conventional cassette tape (wound on the first reel and then wound again in the opposite direction to the second reel) by moving (winding) along an open loop moving trajectory Is defined.

Even when the transfer belt 210 moves in a reel-to-reel winding method, the substrate is positioned where the movement path of the transfer belt 210 is bent (for example, the transfer belt 210 follows the outer surface of the driving member). At a location where it begins to move along a curved path), the transfer belt 210 is separated from the transfer belt 210 as it moves in a direction away from the bottom surface of the substrate.

As described above, in the present invention, in a state where the substrate W supplied to the loading part 100 is directly transferred to the conveying belt 210 that rotates and rotates, a polishing process for the substrate W is performed, and the substrate W is By being transferred directly to the unloading part 300 on the transfer belt 210, an advantageous effect of simplifying the processing process of the substrate W and shortening the processing time can be obtained.

That is, in order to load the substrate supplied to the loading part into the polishing part, the substrate is picked up from the loading part using a separate pickup device (for example, a substrate adsorption device), and then the substrate is lowered to the polishing part again. Since it had to be placed, there is a problem in that the processing time increases so that the time required to load the substrate takes several seconds to several tens of seconds. Moreover, in order to unload the substrate, which has been previously polished, to the unloading part, the substrate is picked up from the polishing part using a separate pick-up device (for example, a substrate adsorption device), and then the substrate is again unloaded Since it had to be put down, there is a problem in that the processing time increases so that the time required to unload the substrate takes several seconds to several tens of seconds.

However, the present invention excludes a separate pick-up process when loading and unloading the substrate W, and by allowing the substrate W to be processed in an in-line manner using a circulating rotating transfer belt 210, the substrate ( It is possible to obtain an advantageous effect of simplifying the loading time and unloading process of W) and shortening the time required for loading and unloading the substrate W.

Moreover, in the present invention, since there is no need to provide a pick-up device for picking up the substrate W when loading and unloading the substrate W, it is possible to simplify equipment and equipment, and advantageous effect of improving space utilization. Can get

As described above, it has been described with reference to preferred embodiments of the present invention, but those skilled in the art can variously modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that you can change it.

10: substrate processing apparatus 100: loading part
110: support 120: loading transfer roller
130: alignment unit 140: loading control
200: polishing part 210: transfer belt
212: roller unit 212a: first roller
212b: second roller 214: retainer
214a: substrate receiving portion 220: substrate supporting portion
230: polishing unit 232: polishing pad
300: unloading part 310: unloading transfer roller
320: unloading control unit 400: detection unit

Claims (13)

A substrate processing apparatus for performing a substrate polishing process,
A transport belt provided to be movable along a predetermined path and having a substrate mounted on an outer surface;
A loading part for loading the substrate on the transfer belt;
A sensing unit detecting movement of the transport belt with respect to the loading part;
An alignment unit that aligns the loading part with respect to the transport belt based on the signal detected by the sensing unit;
A substrate processing apparatus comprising a.
According to claim 1,
The sensing unit detects a movement distance of the transport belt along a direction orthogonal to a loading direction in which the substrate is loaded on the transport belt,
The alignment unit, the substrate processing apparatus characterized in that for adjusting the position of the loading part in response to the movement distance of the transfer belt.
According to claim 1,
The sensing unit measures the distance from the reference position to the end of the transfer belt to detect the movement distance.
According to claim 1,
And a retainer formed on the outer surface of the transfer belt so as to surround the periphery of the substrate.
According to claim 4,
The substrate processing unit, characterized in that formed in a size corresponding to the substrate.
The method of claim 5,
The substrate processing apparatus, characterized in that the gap between the inner wall surface of the substrate receiving portion and the side surface of the substrate is 0.1 to 5 mm.
The method of claim 5,
The alignment unit is a substrate processing apparatus characterized in that for adjusting the position of the loading part so that the substrate is accommodated inside the substrate receiving portion.
According to claim 4,
The retainer is a substrate processing apparatus, characterized in that formed to have the same thickness range as the substrate.
The method according to any one of claims 1 to 8,
The loading part,
A support;
A plurality of loading transfer rollers rotatably mounted on the support and transferring the substrate cooperatively; Including,
The alignment unit moves the support to adjust the position of the loading part with respect to the transfer belt.
The method according to any one of claims 1 to 8,
A first roller;
A second roller spaced apart from the first roller; Including,
The transfer belt is a substrate processing apparatus, characterized in that circulating rotation along the path defined by the first roller and the second roller.
The method according to any one of claims 1 to 8,
A substrate support portion disposed inside the transfer belt and supporting the bottom surface of the substrate with the transfer belt interposed therebetween;
A polishing unit including a polishing unit for polishing an upper surface of the substrate;
A substrate processing apparatus comprising a.
The method of claim 11,
The substrate support unit is disposed spaced apart from the inner surface of the transfer belt, the substrate processing apparatus, characterized in that for supporting the inner surface of the transfer belt in a non-contact state.
The method according to any one of claims 1 to 8,
The sensing unit detects the movement of the transfer belt in real time while the substrate is being loaded onto the transfer belt.

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