KR20200032485A - Hybrid reflow apparatus combining mass reflow and laser selective reflow - Google Patents

Abstract

The present invention relates to a hybrid reflow apparatus for combining mass reflow and laser-selective reflow. The hybrid reflow apparatus comprises: an input conveyor module feeding a substrate having an electronic device to be bonded; a chamber module performing mass reflow on the substrate fed from the input conveyor module to be disposed thereinside; a laser optical module disposed inside the chamber module to perform, in a flowing manner, laser-selective reflow on the substrate disposed inside the chamber module to be subjected to the mass reflow; and an output conveyor module releasing the substrate bonded through the mass reflow and the laser-selective reflow. A laser emission area of the laser optical module is smaller than the entire area of the substrate, and the laser-selective reflow on the entire area of the substrate is performed by a flowing method using a relative movement of the laser optical module and the chamber module having the substrate disposed therein. According to the present invention, the hybrid reflow apparatus combines the advantages of the mass reflow and the laser-selective reflow, thereby increasing the bonding quality of the electronic device, reducing the time required for the bonding, and reducing costs.

Description

Hybrid reflow device combining mass reflow and selective laser reflow {HYBRID REFLOW APPARATUS COMBINING MASS REFLOW AND LASER SELECTIVE REFLOW}

The present invention relates to a hybrid reflow device combining mass reflow and selective laser reflow. More specifically, the present invention combines the advantages of mass reflow and laser selective reflow, thereby improving the bonding quality of an electronic device while reducing the time required for bonding. , It relates to a hybrid reflow device that can reduce the cost.

In general, as a technology for attaching an electronic device such as a semiconductor chip to a printed circuit board (PCB), a mass ripple such as a thermal reflow oven technology, which is a standard process of surface mount technology (SMT) Low (Mass Reflow, MR) technology is known.

Mass reflow technology is a technology that performs soldering in a continuous manner, in a different way, by flowing a substrate on which an electronic device is placed in a reflow oven in a high temperature environment, and is particularly suitable for mass processing. .

On the other hand, according to this mass reflow technology, the substrate on which the electronic device to be bonded is placed is exposed to an air temperature environment of 100 to 300 ° C. for a time of hundreds of seconds, so that the soldering bonding is adhered due to a difference in coefficient of thermal expansion (CTE). Defects can occur in various forms, such as chip-boundary warpage, PCB-boundary warpage, and thermal-bonding failure by thermal shock.

In addition, the mass reflow technology requires a long process time (several hundreds of seconds), and requires high temperature consumption for a long time before and after the process. Since the entire three-dimensional space of the mass reflow oven needs to be maintained at a high temperature, there are disadvantages such as electric consumption is very large, more than several tens of kilowatts, and it is not suitable for small-scale production of various kinds.

The selective laser reflow (LSR) technology, which is one of the other bonding technologies, has the advantage of being non-contact, and the method by which laser light is directly absorbed by the semiconductor chip is the primary heat-absorption mechanism, resulting in differences in thermal expansion coefficients. It has the advantage that there is no thermal shock, and if the proper wavelength is selected, it has the advantage that the laser light can perform the direct absorption heating evenly to the upper and lower portions of the semiconductor chip, and it consumes only a very necessary time for very local heating. It has advantages such as minimizing total heat input / minimizing thermal shock / minimizing process time.

On the other hand, according to the selective laser reflow technology, when the substrate to be processed is a large area, the output capacity of the laser optical system for irradiating the laser should be increased accordingly, because the price of the laser optical system increases rapidly in proportion to the output capacity. , There is a problem that the overall manufacturing cost related to bonding is significantly increased.

In addition, when the area to be bonded is a large area, according to a method of irradiating a laser beam having a large area corresponding to the area of the bonding object once, a deviation may occur in the uniformity of the laser beam. As a result, there is a problem that it may lead to a defective bonding process.

Republic of Korea Patent Publication No. 10-2017-0141865 (published date: December 27, 2017, name: reflow device)

The present invention combines the advantages of mass reflow and laser selective reflow, thereby improving the bonding quality of electronic devices, while reducing the time required for bonding and reducing costs. It is a technical problem to provide a hybrid reflow device capable of being used.

In addition, it is a technical object of the present invention to provide a hybrid reflow device capable of shortening the bonding process time and shortening the time itself for the electronic device to be exposed to the contamination section caused by the bonding process.

In addition, according to the present invention, a large-scale substrate is processed in parallel with a mass-reflow of a flow type and a selective laser reflow using a small area / low-power laser optical module, thereby increasing the overall bonding uniformity and increasing time and cost. It is a technical problem to provide a hybrid reflow device capable of increasing efficiency in the aspect.

The hybrid reflow device combining the mass reflow and the selective laser reflow according to the present invention for solving the above technical problem is an input conveyor module for inputting a substrate on which an electronic device to be bonded is formed, and is input from the input conveyor module to Chamber module for performing mass reflow on the placed substrate, and selective laser reflow for a substrate disposed inside the chamber module to perform the mass reflow in a flowing manner and a laser optical module performing selective reflow, and an output conveyor module outputting a substrate on which bonding is performed through the mass reflow and the selective laser reflow, wherein the laser irradiation area of the laser optical module is the entire area of the substrate. Smaller than the area, the laser optical module and the substrate In accordance with the flowing method using the relative movement of the deployed chamber module performs the selectively laser reflow on the entire area of the substrate.

In the hybrid reflow device combining the mass reflow and the selective laser reflow according to the present invention, the laser optical module is moved while the chamber module is fixed, or the chamber module while the laser optical module is fixed This movement is characterized in that a selective laser reflow is performed for the entire area of the substrate.

In the hybrid reflow apparatus combining the mass reflow and the selective laser reflow according to the present invention, the chamber module is coupled to the lower unit, the lower unit, and an upper portion providing a space for reflow of electronic devices formed on the substrate. It is characterized in that it comprises a unit, a driving unit for driving the upper unit in the vertical direction, and a window unit coupled to the upper unit and transmitting a laser beam irradiated by the laser optical module to an electronic device formed on the substrate. .

In the hybrid reflow apparatus combining the mass reflow and the selective laser reflow according to the present invention, the chamber module is coupled to the lower unit, and the suction chuck unit suctions and fixes the substrate received from the input conveyor module. It characterized in that it further comprises.

In the hybrid reflow device combining mass reflow and selective laser reflow according to the present invention, the chamber module heats the suction chuck unit that sucks and fixes the substrate to a substrate fixed by the suction chuck unit. It characterized in that it further comprises a heating plate unit for supplying heat for the mass reflow.

In the hybrid reflow device combining mass reflow and selective laser reflow according to the present invention, the relative speed of the chamber module on which the laser optical module and the substrate are disposed is inversely proportional to the heating temperature of the heating plate. .

In the hybrid reflow device combining the mass reflow and the selective laser reflow according to the present invention, the interior of the chamber module in which the electronic device formed on the substrate is reflowed in a hybrid manner combining the mass reflow and the selective laser reflow It is characterized by maintaining a nitrogen atmosphere.

In the hybrid reflow device combining the mass reflow and the selective laser reflow according to the present invention, the window unit is characterized by having a quartz material.

In the hybrid reflow device combining mass reflow and selective laser reflow according to the present invention, when the substrate is input by the input conveyor module, the driving unit lowers the upper unit to cause the upper unit and the lower unit When the upper unit and the lower unit are hermetically coupled, the suction chuck unit suctions the substrate to fix it, and is formed on the substrate in a hybrid manner combining the mass reflow and the selective laser reflow. It characterized in that the reflow of the electronic device.

In the hybrid reflow device combining the mass reflow and the selective laser reflow according to the present invention, when the hybrid reflow combining the mass reflow and the selective laser reflow is completed, the driving unit raises the upper unit to It is characterized in that the upper unit and the lower unit are separated, and the substrate is output to the outside while the suction fixing of the substrate by the suction chuck unit is released.

According to the present invention, by combining the advantages of mass reflow (mass reflow) and selective laser reflow (laser selective reflow), while improving the bonding quality of the electronic device, while reducing the time associated with bonding, cost It has the effect of providing a hybrid reflow device that can reduce.

In addition, there is an effect of providing a hybrid reflow device capable of shortening the bonding process time and shortening the time itself for the electronic device to be exposed to the contamination section caused by the bonding process.

In addition, for large-area substrates, by performing mass flow reflow of the flow type and selective laser reflow using a small area / low power laser optical module in parallel, the overall bonding uniformity is increased and time and cost are increased. There is an effect that a hybrid reflow device capable of increasing efficiency is provided.

1 is a view showing a hybrid reflow device combining a mass reflow and a selective laser reflow according to an embodiment of the present invention,
2 is a view showing an exemplary configuration of the chamber module in an embodiment of the present invention,
3 is an exemplary partial cutaway perspective view of a chamber module in one embodiment of the present invention,
4 is a view for explaining the coupling / separation method of the upper unit constituting the chamber module in an embodiment of the present invention by way of example,
5 is a diagram showing an exemplary method of laser flowing in one embodiment of the present invention,
6 is a diagram showing another exemplary method of laser flow in an embodiment of the present invention,
FIG. 7 is a diagram illustrating a method in which a laser optical module having an irradiation area smaller than the total area of the substrate irradiates a laser to the entire area of the substrate in a floating manner in an embodiment of the present invention.

Specific structural or functional descriptions of the embodiments according to the concept of the present invention disclosed in this specification are exemplified only for the purpose of explaining the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention It can be implemented in various forms and is not limited to the embodiments described herein.

Embodiments according to the concept of the present invention can be applied to various changes and can have various forms, so the embodiments will be illustrated in the drawings and described in detail herein. However, this is not intended to limit the embodiments according to the concept of the present invention to specific disclosure forms, and includes all changes, equivalents, or substitutes included in the spirit and scope of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing a hybrid reflow device combining a mass reflow and a selective laser reflow according to an embodiment of the present invention, and FIG. 2 is an exemplary embodiment of the chamber module 20 in the present invention. 3 is a diagram illustrating an exemplary partial cutaway view of the chamber module 20 in one embodiment of the present invention.

1 to 3, a hybrid reflow device combining mass reflow and selective laser reflow according to an embodiment of the present invention includes an input conveyor module 10, a chamber module 20, and a laser optical module 30. ) And the output conveyor module 40.

Prior to describing the components of the present invention in detail, the main technical features of the present invention will be first described with reference to FIG. 7.

7 shows that in an embodiment of the present invention, the laser optical module 30 having an irradiation area smaller than the total area of the substrate 1 irradiates the entire area of the substrate 1 in a flowing manner. It is a diagram showing an exemplary method.

Referring first to FIG. 7, in order to perform a laser reflow on the large area substrate 1, a high-power laser is required, and there is a problem that it is difficult to perform a uniform reflow over the entire area.

In order to solve this problem, an embodiment of the present invention, the laser optical module 30 is configured to have a laser irradiation area smaller than the total area of the substrate 1, the chamber 1, the substrate 1 is disposed 20 And it is configured to perform a selective laser reflow (laser selective reflow) for the entire area of the substrate according to the flow (flowing) method using the relative movement of the laser optical module 30.

This will be described in more detail as follows.

First, as illustrated in (a) of FIG. 7, in the case of a large area substrate 1, when a laser is irradiated over the entire area, a high-capacity laser optical module 30 is required, which greatly increases manufacturing costs. , The power consumption of the laser optical module 30 is large, and reflow uniformity for the large area substrate 1 is not guaranteed.

As a means for solving this problem, as illustrated in FIGS. 7 (b) and 7 (c), the laser optical module 30 is configured to have a laser irradiation area smaller than the total area of the substrate 1 And, according to the flow (flowing) method using the relative movement of the chamber module 20 and the laser optical module 30 on which the substrate 1 is disposed, laser selective reflow for the entire area of the substrate is performed. It can be configured to perform.

Hereinafter, detailed components of one embodiment of the present invention will be described, and descriptions of components less relevant to the technical features of the present invention will be omitted. A control module is one of the components whose description is omitted, and the control module is a component that is generally provided in a production facility that produces a product according to an automatic process. In one embodiment of the present invention, an input conveyor module 10 ), The chamber module 20, the laser optical module 30 and the output conveyor module 40 performs a function of controlling the overall operation of the components.

The input conveyor module 10 performs a function of inputting the substrate 1 on which the electronic device to be bonded is formed into the chamber module 20.

The chamber module 20 receives input from the input conveyor module 10 and performs a function of performing mass reflow on the substrate 1 disposed therein.

For example, the chamber module 20 includes a lower unit 210, an upper unit 220, a driving unit 230, a window unit 240, a suction chuck unit 250 and a heating plate unit 260 Can be configured.

The lower unit 210 and the upper unit 220 provide a space in which the electronic elements formed on the substrate 1 reflow by direct coupling between each other or indirect coupling through other components.

The driving unit 230 functions to drive the upper unit 220 in the vertical direction. For example, the driving unit 230 may be a cylinder, and when the substrate 1 to be subjected to reflow is supplied to a fixed position, the upper unit 220 is lowered to seal the space where reflow is performed, and ripple When the row is completed, the upper unit 220 may be raised to perform the function of discharging the substrate 1 to the outside.

The window unit 240 is coupled to the upper unit 220 to face the laser optical module 30 on the upper surface, and transmits a laser beam irradiated by the laser optical module 30 to form an electronic device formed on the substrate 1 To perform the function of passing.

For example, the window unit 240 may be configured to have a quartz material having excellent laser transmittance, but the material of the window unit 240 is not limited thereto.

The suction chuck unit 250 is coupled to the lower unit 210 and performs a function of sucking and fixing the substrate 1 received from the input conveyor module 10.

For example, the suction chuck unit 250 can suck and fix the substrate 1 by using air pressure, and as a means for this, the suction chuck unit 250 is a plate having an area larger than the area of the substrate 1 It may be configured in a manner to form a plurality of air flow paths.

The heating plate unit 260 heats the suction chuck unit 250 for sucking and fixing the substrate 1 to supply heat for mass reflow to the substrate 1 fixed by the suction chuck unit 250. Perform a function.

For example, in order to increase the heat transfer efficiency to the substrate 1, the heating plate unit 260 and the suction chuck unit 250 may be configured to have a material having excellent thermal conductivity, such as metal.

For example, the interior of the chamber module 20 in which the electronic device formed on the substrate 1 is reflowed in a hybrid manner combining mass reflow and selective laser reflow may be configured to maintain a nitrogen atmosphere. When the reflow is performed in a nitrogen atmosphere as described above, it is possible to improve the soldering quality by preventing the surfaces of the electronic elements formed on the substrate 1 and the substrate 1 from being oxidized by high temperature heat applied during the reflow process. .

The laser optical module 30 is disposed inside the chamber module 20 to perform a selective laser reflow on a substrate 1 on which mass reflow is performed in a flowing manner. To perform.

The laser irradiation area of the laser optical module 30 is smaller than the total area of the substrate 1, and according to the flow method using the relative movement of the laser module 30 and the chamber module 20 on which the substrate 1 is disposed. , It is configured to perform a selective laser reflow for the entire area of the substrate (1).

As described above, in order to perform a laser reflow on the substrate 1 having a large area, a high-power laser is required and it is difficult to perform a uniform reflow over the entire area.

In order to solve this problem, an embodiment of the present invention, the laser optical module 30 is configured to have a laser irradiation area smaller than the total area of the substrate 1, the chamber 1, the substrate 1 is disposed 20 And it is configured to perform a selective laser reflow (laser selective reflow) for the entire area of the substrate according to the flow (flowing) method using the relative movement of the laser optical module 30.

This will be described in more detail as follows.

First, as illustrated in (a) of FIG. 7, in the case of a large area substrate 1, when a laser is irradiated over the entire area, a high-capacity laser optical module 30 is required, which greatly increases manufacturing costs. , The power consumption of the laser optical module 30 is large, and reflow uniformity for the large area substrate 1 is not guaranteed.

As a means for solving this problem, as illustrated in FIGS. 7 (b) and 7 (c), the laser optical module 30 is configured to have a laser irradiation area smaller than the total area of the substrate 1 And a selective laser reflow for the entire area of the substrate 1 according to a flowing method using the relative movement of the chamber module 20 on which the substrate 1 is disposed and the laser optical module 30 reflow).

For example, the relative speed of the chamber module 20 in which the laser optical module 30 and the substrate 1 are disposed may be configured to be inversely proportional to the heating temperature of the heating plate.

The reason for this configuration and the effects thereof are as follows.

One embodiment of the present invention is a hybrid reflow device that combines mass reflow and selective laser reflow, the heating plate is a means for mass reflow, and the laser optical module 30 is for a selective laser reflow of the flow method. Means. Through the combination of these two technical means, the energy supplied to the bonding object, that is, the soldering area of the electronic device, must be kept constant over the entire area range. On the other hand, the relative speed of the laser optical module 30 and the chamber module 20 is a factor that determines the time at which the selective laser reflow of the flow type is performed, the relative of the laser optical module 30 and the chamber module 20 The speed is inversely proportional to the energy supplied to the bonding object, and the heating temperature of the heating plate is proportional to the energy supplied to the bonding object.

Therefore, according to an embodiment of the present invention, the bonding uniformity can be improved by configuring the relative speed of the laser optical module 30 and the chamber module 20 to be inversely proportional to the heating temperature of the heating plate. More specifically, when the heating temperature of the heating plate is high, the relative speed is fast, that is, the time at which the laser reflow is performed is shortened. Conversely, when the heating temperature of the heating plate is low, the relative speed is slow, that is, It is possible to improve the bonding uniformity for the entire area of the substrate 1 by keeping the energy supplied to the soldering constant by making the laser reflow time longer.

The output conveyor module 40 performs a function of outputting the substrate 1 on which bonding has been performed to the outside through mass reflow and selective laser reflow inside the chamber module 20.

FIG. 4 is a view for exemplarily illustrating a coupling / separation method of the upper unit 220 constituting the chamber module 20 in the exemplary embodiment of the present invention. Referring to FIG. 4, the chamber module In the 20, four upper unit separation handles 271, 272, 273, and 274, which can easily and quickly separate the upper unit 220, may be additionally provided.

Hereinafter, with reference to FIGS. 5 and 6, an example for performing laser flowing using relative movement of the chamber module 20 and the laser optical module 30 on which the substrate 1 is disposed Explain the way.

5 is a diagram illustrating an exemplary method of laser flowing in an embodiment of the present invention.

Referring to FIG. 5 further, the laser optical module moves while the chamber module on which the substrate is disposed is fixed, so that selective laser reflow of the entire area of the substrate can be performed.

Specifically, first, referring to (a) of FIG. 5, in a state where the substrate 1 is loaded on the input conveyor module 10, the driving unit 230 raises the upper unit 220, and the input conveyor module ( 10), the process of inputting the substrate 1 into the chamber module 2 is performed.

Next, referring to (b) of FIG. 5, the substrate 1 is fixed by the suction chuck unit 250, and the inside of the chamber module 20 is maintained in a nitrogen atmosphere, the heating plate unit 260 At the same time, mass reflow is performed by heating), and a process of performing a selective laser reflow of a flow method is performed on the entire area of the substrate 1 by irradiating a laser by a flow method.

The process is described in more detail as follows.

First, in a state where the substrate 1 is seated on the suction chuck unit 250, a process of sealingly coupling the upper unit 220 and the lower unit 210 by the driving unit 230 lowering the upper unit 220 is performed. do. When this process is performed, the substrate 1 on which the electronic device to be bonded is formed is positioned in a closed space in the chamber module 20 by the combination of the upper unit 220 and the lower unit 210. As described above, when the upper unit 220 and the lower unit 210 are hermetically coupled, the suction chuck unit 250 sucks and fixes the substrate 1 and supplies nitrogen through the nitrogen inlet 280 to provide a chamber module. A process is performed so that the interior of the interior 20 maintains a nitrogen atmosphere, and a process is performed in which the laser optical module 30 irradiates the laser reaching the electronic device of the substrate 1 through the window unit 240. . At the same time, the laser optical module 30 moves along the long side of the substrate 1 while the chamber module 2 is fixed. That is, the laser optical module 30 flows along the area to be bonded.

Next, referring to (c) of FIG. 5, when the hybrid reflow combining the mass reflow and the selective laser reflow is completed, the driving unit 230 raises the upper unit 220 to raise the upper unit 220 and the lower unit. With the unit 210 separated and the suction fixing of the substrate 1 by the suction chuck unit 250 is released, the substrate 1 is output to the outside of the chamber module 20 to output the conveyor module 40 The process of loading on is performed.

6 is a diagram illustrating another exemplary method of laser flow in an embodiment of the present invention.

Referring to FIG. 6 further, as opposed to the configuration illustrated in FIG. 5, the chamber module 20 in which the substrate 1 is disposed moves while the laser optical module 30 is fixed, so that the substrate 1 Selective laser reflow over the entire area can be performed.

According to the example disclosed in FIG. 5 described in detail above, while the chamber module 20 in which the substrate 1 is disposed is fixed, the laser optical module 30 is moved, that is, flowed, while in FIG. 6 In the disclosed example, on the contrary, the chamber module 20 in which the substrate 1 is disposed while the laser optical module 30 is fixed is moved, that is, flowed. Since the operation except this point is the same as each other, overlapping descriptions are omitted.

As described in detail above, according to the present invention, by combining the advantages of mass reflow (mass reflow) and selective laser reflow (laser selective reflow), while improving the bonding quality of the electronic device, at the same time required for bonding It is effective to provide a hybrid reflow device that can reduce time and reduce costs.

In addition, there is an effect of providing a hybrid reflow device capable of shortening the bonding process time and shortening the time itself for the electronic device to be exposed to the contamination section caused by the bonding process.

In addition, for large-area substrates, by performing mass flow reflow of the flow type and selective laser reflow using a small area / low power laser optical module in parallel, the overall bonding uniformity is increased and time and cost are increased. There is an effect that a hybrid reflow device capable of increasing efficiency is provided.

1: Substrate
10: Input conveyor module
20: chamber module
30: laser optical module
40: output conveyor module
210: lower unit
220: upper unit
230: drive unit
240: window unit
250: suction chuck unit
260: heating plate unit
271, 272, 273, 274: upper unit separation handle
280: nitrogen inlet
290: oxygen sensor

Claims (10)

A hybrid reflow device that combines mass reflow and selective laser reflow,
An input conveyor module for inputting a substrate on which an electronic device to be bonded is formed;
A chamber module that receives input from the input conveyor module and performs mass reflow on the substrate disposed therein;
A laser optical module disposed inside the chamber module to perform laser selective reflow on a substrate on which the mass reflow is performed; And
And an output conveyor module outputting a substrate on which bonding has been performed through the mass reflow and the selective laser reflow.
The laser irradiation area of the laser optical module is smaller than the total area of the substrate,
Hybrid reflow combining mass reflow and selective laser reflow, which performs selective laser reflow for the entire area of the substrate according to a flow method using the relative movement of the laser module and the chamber module on which the substrate is disposed. Device.
According to claim 1,
The laser optical module is moved while the chamber module is fixed, or the chamber module is moved while the laser optical module is fixed, so that selective laser reflow of the entire area of the substrate is performed. A hybrid reflow device that combines mass reflow and selective laser reflow.
According to claim 1,
The chamber module,
Lower unit;
An upper unit coupled to the lower unit to provide a space in which the electronic device formed on the substrate reflows;
A driving unit driving the upper unit in the vertical direction; And
A hybrid ripple combining a mass reflow and a selective laser reflow, which is coupled to the upper unit and includes a window unit that transmits a laser beam irradiated by the laser optical module and transmits it to an electronic device formed on the substrate. Low device.
According to claim 3,
The chamber module,
It is coupled to the lower unit, characterized in that it further comprises a suction chuck unit for sucking and fixing the substrate received from the input conveyor module, hybrid reflow device combining a mass reflow and a selective laser reflow.
According to claim 4,
The chamber module,
And a heating plate unit that heats the suction chuck unit that sucks and fixes the substrate to supply heat for the mass reflow to the substrate fixed by the suction chuck unit. Hybrid reflow device combining selective laser reflow.
The method of claim 5,
A hybrid reflow device combining mass reflow and selective laser reflow, characterized in that the relative speed of the chamber module on which the laser optical module and the substrate are disposed is inversely proportional to the heating temperature of the heating plate.
According to claim 1,
The interior of the chamber module, in which the electronic device formed on the substrate is reflowed in a hybrid manner combining the mass reflow and the selective laser reflow, maintains a nitrogen atmosphere, and combines mass reflow and selective laser reflow. Hybrid reflow device.
According to claim 3,
The window unit is characterized in that it has a quartz material, hybrid reflow device combining a mass reflow and a selective laser reflow.
The method of claim 5,
When the substrate is input by the input conveyor module, the driving unit lowers the upper unit to hermetically couple the upper unit and the lower unit,
When the upper unit and the lower unit are hermetically coupled, the electronic device formed on the substrate is reflowed in a hybrid manner in which the mass reflow and the selective laser reflow are combined while the suction chuck unit sucks and fixes the substrate. A hybrid reflow device combining mass reflow and selective laser reflow.
The method of claim 9,
When the hybrid reflow combining the mass reflow and the selective laser reflow is completed, the driving unit raises the upper unit to separate the upper unit and the lower unit,
A hybrid reflow device combining mass reflow and selective laser reflow, characterized in that the substrate is output to the outside while the suction fixing of the substrate by the suction chuck unit is released.

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