KR20200022091A - Nozzle for cleaning substrate - Google Patents

Abstract

The present invention relates to a nozzle for cleaning a substrate, which discharges cleaning liquid to the substrate, and more specifically, to a nozzle for cleaning a substrate, which prevents flow pressure concentration in one direction, thereby improving discharge performance of the nozzle for cleaning a substrate, preventing a flow path in the nozzle for cleaning a substrate from being damaged, and having high pressure-resistant properties.

Description

Nozzle for Cleaning Substrate {NOZZLE FOR CLEANING SUBSTRATE}

The present invention relates to a substrate cleaning nozzle for discharging a cleaning liquid to a substrate.

Substrates used for the manufacture of semiconductor chips, LED chips and the like are subjected to various processes such as photolithography, etching and thin film deposition.

As described above, foreign matters such as particles are generated in the process of performing various processes on the substrate, and in order to remove such foreign matters, a cleaning process for cleaning the substrate is performed before or after each process.

In the cleaning process, chemicals are sprayed to remove foreign substances remaining on the substrate, a treatment liquid mixed with gas is sprayed, or a cleaning liquid is sprayed. Among these, in the method of spraying the cleaning liquid, the cleaning liquid is supplied to the nozzle for cleaning the substrate to discharge the cleaning liquid.

The substrate cleaning nozzle is important to withstand the pressure of the processing liquid (or cleaning liquid) flowing in the nozzle (hereinafter referred to as "fluid pressure"), that is, the pressure resistance characteristic of the nozzle. This is because, when the flow pressure is higher than the internal pressure of the nozzle, the flow path inside the nozzle is broken by the high flow pressure, or leaks occur in the nozzle coupling portion or the like.

The reason for the increase in the flow pressure is that the pressure of the processing liquid (or cleaning liquid) to be supplied (hereinafter referred to as 'supply pressure') is high and the flow pressure is kept high, and the discharge hole is clogged with foreign matter such as particles, so the flow pressure is abnormal. May rise sharply.

The supply pressure is related to the discharge pressure (hereinafter referred to as 'discharge pressure') of the processing liquid discharged to the discharge hole of the nozzle. This is because if the supply pressure is high, the flow pressure is kept high and the discharge pressure is also kept high. The supply pressure is determined according to the pressure resistance characteristics of the nozzle, and a nozzle having a high pressure resistance characteristic may exhibit high discharge pressure performance through a high supply pressure. In other words, the high withstand pressure characteristic of the nozzle is the cause of raising the discharge performance of the nozzle.

The pressure resistance characteristic of the nozzle is closely related to the shape of the internal flow path of the nozzle through which the cleaning liquid flows. Therefore, the internal flow path of the conventional substrate cleaning nozzle and the pressure resistance characteristic of the nozzle will be described below with reference to FIG. 16.

FIG. 16 is a view showing an internal flow path of a conventional substrate cleaning nozzle. FIG.

As shown in FIG. 1, the conventional substrate cleaning nozzle 1 includes an internal flow path inside the substrate cleaning nozzle 1, and the internal flow path includes a first discharge hole 2 having a first discharge hole 2. The circular flow path 3 and the second discharge hole 4 are provided, the second circular flow path 5 located inside the first circular flow path 3, the first circular flow path 3 and the second circular shape It comprises a connecting passage (6) for connecting the flow path (5), and the up and down flow passage (7) which is connected to the inflow hole in which the cleaning liquid flows, provided on the first circular flow passage (3).

In the conventional substrate cleaning nozzle 1 having the above-described configuration, when the cleaning liquid flows into the upper and lower flow passages 7 through the inflow hole, the introduced cleaning liquid branches into two branches in the circumferential direction of the first circular flow passage 3. By branching to the connecting passage 6 in one branch, the branching flows in three branches.

The flow of the cleaning liquid bifurcated in the circumferential direction of the first circular flow passage 3 is due to the shape of the first circular flow passage 3 and thus, from the first circular flow passage 3 to the second circular flow passage 5, that is, And force vector directionality from the outer side to the inner side of the conventional substrate cleaning nozzle 10.

The flow of the cleaning liquid branched into the connecting flow passage 6 in the direction of the first circular flow passage 3 to the second circular flow passage 5, that is, from the outside of the conventional substrate cleaning nozzle 1 to the inner direction. Force vector has directionality.

As described above, as the flow of the cleaning liquid has the force vector directionality from the outside of the conventional substrate cleaning nozzle 1 to the inward direction, the flow pressure is applied with the force vector concentrated from the outside to the inward direction.

Therefore, the flow pressure of the cleaning liquid generated due to the supply and flow of the cleaning liquid is increased intensively in the vicinity of the second circular flow path 5, and due to this flow pressure, the deformation of the internal flow path due to the flow pressure is second It occurs intensively in the circular flow path (5).

As described above, the phenomenon in which deformation is concentrated in the second circular channel 5 may be confirmed in FIG. 18A.

Such deformation of the flow path also occurs in the inner region of the second circular flow path 5, which causes a decrease in the pressure resistance characteristic of the conventional substrate cleaning nozzle 1.

In other words, if the supply pressure of the cleaning liquid is increased, damage may occur to the region near the second circular flow passage 5, or leakage may occur.

Like the substrate cleaning nozzle 1 described above, the nozzle of Korean Patent No. 10-1842128 (hereinafter referred to as 'Patent Document 1') also has a problem in that the flow pressure is concentrated in the flow path inside the nozzle. do.

Hereinafter, with reference to FIG. 17, the internal flow path of the nozzle of patent document 1 and the withstand pressure characteristic of the nozzle are examined. 17 is a figure with respect to FIG. 4 of patent document 1. FIG.

As shown in FIG. 17, in the nozzle of Patent Document 1, the inflow passage 432 and the third region 412a connected to the inflow passage 432 have a ring-shaped first region 412b and a second region 412c. It is located outside of.

In the nozzle of Patent Document 1 having the above configuration, when the cleaning liquid is supplied through the inflow passage 432, the cleaning liquid flows into the third region 412a located outside the first region 412b, and then the first region ( In 412b, the cleaning liquid is bifurcated in the circumferential direction of the first region 412b, and bifurcated into the third region 412a located inside the first region 412b. Branch and flow. In addition, in the second region 412c, the cleaning liquid flowing into the third region 412a located inside the first region 412b is bifurcated in the circumferential direction of the second region 412c.

In this case, like the conventional substrate cleaning liquid nozzle 1 described above, the flow pressure of the cleaning liquid is concentrated in the direction of the force vector from the first region 412b of the nozzle to the second region 412c, that is, from the outside to the inside. Will be added.

Therefore, the flow pressure of the cleaning liquid generated due to the supply and flow of the cleaning liquid is concentrated in the vicinity of the second region 412c.

It can be seen in FIG. 18B that the deformation of the internal flow path due to the above flow pressure is concentrated in the second region 412c.

Such a deformation of the flow path also occurs in the inner region of the second region 412c, which causes the breakdown voltage characteristic of the conventional substrate cleaning nozzle 10 to be lowered.

In other words, if the supply pressure of the cleaning liquid is increased, damage may occur to the region near the second region 412c or leakage may occur.

As described above, the conventional substrate cleaning nozzles have a problem in that the pressure resistance characteristic of the substrate cleaning nozzle is lowered as the force vector of the flow pressure is intensively applied from the outer side to the inner side, that is, in one direction. Accordingly, there is a need to develop a substrate cleaning nozzle having an internal flow path structure capable of preventing such a force vector concentration phenomenon of the flow pressure in one direction.

Korean Patent Registration No. 10-1842128

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and by preventing the phenomenon of concentration of the flow pressure force vector in the inward direction, it is possible to improve the discharge performance of the substrate cleaning nozzle and to prevent damage to the internal passage of the substrate cleaning nozzle. In addition, an object of the present invention is to provide a nozzle for cleaning a substrate having high breakdown voltage characteristics.

According to an aspect of the present invention, a substrate cleaning nozzle includes: a first passage having a first discharge hole; A second flow passage provided with a second discharge hole and positioned inside the first flow passage; A first connection channel connecting the first channel and the second channel; And a first up and down flow path connected to the first main hole through which the cleaning liquid flows in or out, and provided on the first connection flow path.

In addition, the first passage and the second passage is characterized in that the circular shape having the same center point.

In addition, the 'volume of the first channel: the volume of the second channel = 1: 1' is characterized by satisfying the condition.

In addition, a second connection channel connecting the first channel and the second channel, the second channel is located symmetrically with respect to the first connection channel with respect to the center point of the first channel; And a second vertical flow passage connected to a second main hole through which the cleaning liquid flows in or out, and provided on the second connection flow passage.

In addition, the third passage is provided with a plurality of third discharge hole, located in the second passage; And a third connection channel connecting the second channel and the third channel, wherein the third connection channel is in line with the first connection channel.

In addition, the 'volume of the first channel: the volume of the second channel + the volume of the third channel = 1: 1) is characterized in that it is satisfied.

In addition, a second connection channel connecting the first channel and the second channel, the second channel is located symmetrically with respect to the first connection channel with respect to the center point of the first channel; And a second vertical flow passage connected to a second main hole through which a cleaning solution flows in or out, and provided on the second connection flow passage. And a fourth connection channel connecting the second channel and the third channel, positioned symmetrically with the third connection channel based on the center point of the second channel, and positioned in a line with the second connection channel. It further comprises.

In addition, the first channel, the second channel and the third channel has a circular shape having the same center point, the first to fourth connection channel is characterized in that located on a straight line passing through the center point.

In addition, the first body; A second body coupled to a lower portion of the first body such that a lower surface of the first body and an upper surface thereof contact each other; A plurality of grooves formed on any one of a lower surface of the first body and an upper surface of the second body; And a plurality of protrusions formed on the other surface of the lower surface of the first body or the upper surface of the second body and formed to correspond to the plurality of grooves and inserted into each of the plurality of grooves. The flow path, the second flow path and the first connection flow path are provided on at least one of the lower surface of the first body and the upper surface of the second body, wherein the first flow path, the second flow path and the first connection flow path Characterized in that located between the plurality of grooves and the portion coupled to the plurality of projections.

According to another aspect of the present invention, there is provided a substrate cleaning nozzle comprising: a first passage having a first discharge hole; A second flow passage provided with a second discharge hole and positioned inside the first flow passage; A first connection channel connecting the first channel and the second channel; And a first up and down flow passage connected to the first main hole into which the cleaning liquid is introduced, wherein the cleaning liquid flowing into the first connection channel through the first main hole is branched and flows into the first and second flow paths, respectively. Directions of the washing liquid branched into the first and second flow paths may be opposite to each other based on the connection portion between the first upper and lower flow paths and the first connection channel.

According to another aspect of the present invention, there is provided a substrate cleaning nozzle comprising: a first passage having a first discharge hole; A second flow passage provided with a second discharge hole and positioned inside the first flow passage; First and second connection passages connecting the first channel and the second channel and symmetrically positioned with respect to the center point of the first channel; A first vertical flow passage connected to the first main hole into which the cleaning liquid flows; And a second vertical flow passage connected to the second main hole through which the cleaning liquid flows out, wherein the cleaning liquid flowing into the first connection channel through the first main hole flows branched into the first and second flow paths, respectively. Directions of the cleaning liquid branched into the first and second flow paths are respectively opposite to each other based on the connection portion between the first upper and lower flow paths and the first connection flow path, and flow out to the second main hole through the second connection flow path. The cleaning solution flows from the first and second flow paths to the second connection flow path, respectively, and the direction of the cleaning liquid flowing from each of the first and second flow paths is based on the connection portion between the second up and down flow path and the second connection flow path. Characterized in opposite directions to each other.

According to the nozzle for cleaning the substrate of the present invention as described above has the following advantages.

Force vector of the flow pressure of the cleaning liquid as the cleaning liquids supplied into the substrate cleaning nozzles flow inward and outward from each other on the first connection channel and flow into the first and second channels (or first to third channels), respectively. Since is not concentrated inwardly and evenly distributed inward and outward, it is possible to minimize deformation occurring in any one flow path.

The substrate cleaning nozzle of the present invention can prevent breakage, leakage, etc. of the internal flow paths through an even distribution of the flow pressure in the inward and outward directions, and can contribute to a high breakdown voltage characteristic of the nozzle for cleaning the substrate.

Through the high pressure resistance characteristic of the nozzle for cleaning the substrate of the present invention, it is possible to extract high discharge pressure performance at a high supply pressure and to ensure uniformity of the cleaning liquid discharged through the discharge hole, thereby achieving a discharge of the cleaning liquid without dead zone. can do. In addition, it is possible to prevent breakage of the internal flow paths of the substrate cleaning nozzle and damage of the joint portions of the first and second bodies.

Since the inner flow paths of the substrate cleaning nozzle are located between the plurality of grooves and the plurality of protrusions, it is possible to effectively prevent the cleaning liquid from leaking from the inner flow paths.

Ultrasonic fusion is performed on the outermost and innermost sides of the inner passages through fusion and fusion grooves, thereby achieving the effect of confining the inner passages at the outermost and innermost sides.

1 is a perspective view of a nozzle for cleaning a substrate according to a first embodiment of the present invention.
FIG. 2 is an exploded perspective view of the substrate cleaning nozzle of FIG. 1. FIG.
3 is a bottom view illustrating the bottom surface of the first body of FIG. 2;
4 is a plan view illustrating an upper surface of the second body of FIG. 2;
5 is a bottom view illustrating the bottom surface of the second body of FIG. 2;
6 is a cross-sectional view of the discharge hole of FIG.
FIG. 7A is a view illustrating an inner flow path of the substrate cleaning nozzle of FIG. 1. FIG.
FIG. 7B illustrates the flow of the cleaning liquid of FIG. 7A. FIG.
8 is a bottom view illustrating a bottom surface of a first body of a substrate cleaning nozzle according to a second preferred embodiment of the present invention.
9 is a plan view illustrating a top surface of a second body of the substrate cleaning nozzle according to the second embodiment of the present invention.
FIG. 10 is a bottom view illustrating a bottom surface of a first body of a substrate cleaning nozzle according to a third exemplary embodiment of the present invention. FIG.
FIG. 11 is a plan view illustrating a top surface of a second body of a substrate cleaning nozzle according to a third exemplary embodiment of the present invention. FIG.
12 is a bottom view showing a lower surface of a second body of a substrate cleaning nozzle according to a third embodiment of the present invention.
FIG. 13A illustrates an internal flow path of a nozzle for cleaning a substrate according to a third exemplary embodiment of the present invention. FIG.
FIG. 13B shows the flow of the cleaning liquid of FIG. 13A. FIG.
FIG. 14 is a bottom view illustrating a bottom surface of a first body of a substrate cleaning nozzle according to a fourth preferred embodiment of the present invention. FIG.
FIG. 15 is a plan view illustrating a top surface of a second body of a substrate cleaning nozzle according to a fourth preferred embodiment of the present invention. FIG.
16 is a view showing an inner flow path of a conventional substrate cleaning nozzle.
FIG. 17 is a view showing an internal flow path of a nozzle of Patent Document 1. FIG.
FIG. 18A shows a variation of a conventional substrate cleaning nozzle upon supply of a cleaning liquid. FIG.
18B is a view showing a deformation of a nozzle of Patent Document 1 when supplying a cleaning liquid.
18C is a view showing a modification of the nozzle for cleaning a substrate according to the first embodiment of the present invention when supplying the cleaning liquid.
FIG. 18D illustrates a variation of the nozzle for cleaning the substrate according to the third preferred embodiment of the present invention when supplying the cleaning liquid. FIG.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art, although not explicitly described or illustrated herein, can embody the principles of the invention and invent various devices included in the concept and scope of the invention. In addition, all conditional terms and embodiments listed herein are in principle clearly intended to be understood only for the purpose of understanding the concept of the invention and are not to be limited to the embodiments and states specifically listed. .

The above objects, features, and advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, whereby the technical spirit of the invention may be easily implemented by those skilled in the art. .

Embodiments described herein will be described with reference to cross-sectional and / or perspective views, which are ideal exemplary views of the invention. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in forms generated according to manufacturing processes.

Prior to the description, FIGS. 18A to 18D will be described with reference to the following description.

18A is a diagram showing a modification of a conventional substrate cleaning nozzle when supplying a cleaning liquid.

The dimensions of the flow paths of the conventional substrate cleaning nozzle of FIG. 18A and the supply pressure of the cleaning liquid are as follows.

The line connecting the center of the circumference of the outermost flow path is 15 mm away from the center line of the substrate cleaning nozzle, the width of the outermost flow path is 1 mm, and the height is 1.25 mm. The line connecting the center of the circumference of the inner channel is 7.5 mm away from the center line of the substrate cleaning nozzle, the width of the inner channel is 2 mm, and the height is 1.25 mm. In addition, the conventional substrate cleaning nozzle of FIG. 18A supplied the cleaning liquid of 5 Mpa through the left supply port located on the outermost flow path.

18B is a diagram showing a deformation of the nozzle of Patent Document 1 when supplying the cleaning liquid.

The dimension of the flow path of the nozzle of patent document 1 of FIG. 18B, and the supply pressure of a washing | cleaning liquid are as follows.

The line connecting the center of the circumference of the outermost flow path is 15 mm away from the center line of the substrate cleaning nozzle, the width of the outermost flow path is 1.5 mm, and the height is 1.25 mm. The line connecting the center of the circumference of the inner channel is 7.5 mm away from the center line of the substrate cleaning nozzle, the width of the inner channel is 2 mm, and the height is 1.25 mm. In addition, the nozzle of patent document 1 of FIG. 18B supplied the washing | cleaning liquid of 5 Mpa through the left supply port spaced outwardly from the outermost flow path.

FIG. 18C is a view showing a modification of the nozzle for cleaning a substrate according to the first embodiment of the present invention when supplying the cleaning liquid.

The dimensions of the flow paths of the flow paths of the substrate cleaning nozzle and the supply pressure of the cleaning liquid of FIG. 18C are as follows.

The line connecting the center of the circumference of the outermost flow path (hereinafter referred to as 'first flow path') is 15 mm away from the center line of the substrate cleaning nozzle, and the width of the first flow path is 1.5 mm and the height is 1.25 mm. The line connecting the center of the circumference of the inner passage (hereinafter referred to as 'second channel') is 7.5 mm away from the center line of the substrate cleaning nozzle, the width of the second channel is 1.5 mm, and the height is 1.25 mm. In addition, the substrate cleaning nozzle according to the first preferred embodiment of the present invention of FIG. 18C may include a left supply hole formed on a flow path connecting the first flow path and the second flow path (hereinafter, referred to as a “first connection flow path”). Hereinafter, a 5 Mpa washing liquid was supplied through the 'first main hole'.

18D is a view showing a modification of the nozzle for cleaning a substrate according to the third embodiment of the present invention when supplying the cleaning liquid.

The dimensions of the flow paths of the nozzles for cleaning the substrate according to the third embodiment of the present invention of FIG. 18D and the supply pressure of the cleaning liquid are as follows.

The line connecting the center of the circumference of the outermost flow path (hereinafter referred to as 'first flow path') is 17.5 mm away from the center line of the substrate cleaning nozzle, and the width of the first flow path is 1.5 mm and the height is 1.25 mm. The line connecting the center of the circumference of the inner passage (hereinafter referred to as 'second channel') is 12.5 mm away from the center line of the substrate cleaning nozzle, the width of the second channel is 1.5 mm, and the height is 1.25 mm. The line connecting the center of the circumference of the innermost flow path (hereinafter referred to as 'third flow path') is 7.5 mm away from the center line of the substrate cleaning nozzle, and the third flow path has a width of 1.5 mm and a height of 1.25 mm. In addition, the substrate cleaning nozzle according to the third embodiment of the present invention of FIG. 18D may include a left supply hole formed on a flow path connecting the first flow path and the second flow path (hereinafter, referred to as a “first connection flow path”). Hereinafter, a 5 Mpa washing liquid was supplied through the 'first main hole'.

Substrate cleaning nozzle 10 according to a first embodiment of the present invention

Hereinafter, a substrate cleaning nozzle 10 according to a first exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 6.

1 is a perspective view of a substrate cleaning nozzle according to a first embodiment of the present invention, Figure 2 is an exploded perspective view of the substrate cleaning nozzle of Figure 1, Figure 3 is a bottom view of the first body of Figure 2 4 is a plan view illustrating the top surface of the second body of FIG. 2, FIG. 5 is a bottom view illustrating the bottom surface of the second body of FIG. 2, and FIG. 6 is a cross-sectional view of the discharge hole of FIG. 4.

1 to 5, the substrate cleaning nozzle 10 according to the first exemplary embodiment of the present invention includes a first passage 130 provided with a first discharge hole 210, and a second nozzle. The discharge hole 220 is provided, and the first flow passage 131 connecting the second flow passage 140 located inside the first flow passage 130 and the first flow passage 130 and the second flow passage 140. ) And a second connection channel 132 connecting the first channel 130 and the second channel 140 to be symmetrical with the first connection channel 131 based on the center point of the first channel 130. And, the first main hole 110 is connected to the cleaning solution flows in or out, the first upper and lower flow paths 111 provided on the first connection flow path 131, the second main hole in which the cleaning liquid flows in or out ( A second main passage 121 and a first main hole 110 and a second main hole 120 formed on an upper surface of the second upper and lower flow passages 121 which are provided on the second connection passage 132. The first upper and lower flow passages 111 and the second upper and lower flow passages 121 are formed therein, and the first flow passages are formed on the lower surface thereof. 130, the first body 100 formed with the second flow path 140, the first connection flow path 131, and the second connection flow path 132, and the lower surface of the first body 100 and the upper surface thereof contact with each other. A second coupled to the lower portion of the first body 100, the first discharge hole 210 provided in the first flow path 130 and the second discharge hole 220 provided in the second flow path 140 is formed It may be configured to include a body (200).

The first passage 130 is formed on the bottom surface of the first body 100.

The first passage 130 may have a circular shape.

In the first flow path 130, when the first body 100 and the second body 200 are coupled up and down, the lower surface portion of the first body 100 becomes an upper portion of the first flow path 130, and the second An upper surface portion of the body 200 becomes a bottom portion of the first passage 130.

A plurality of first discharge holes 210 are provided in the first flow path 130, and the plurality of first discharge holes 210 are formed to penetrate the upper and lower surfaces of the second body 200.

When the first body 100 and the second body 200 are coupled up and down, the plurality of first discharge holes 210 are positioned in the bottom portion of the first flow path 130, so that the first flow path 130 has a plurality of. Are connected to the first discharge holes 210.

The plurality of first discharge holes 210 may be provided to have a predetermined distance from each other in a row along the circumferential direction of the circular first flow path 130.

The second flow path 140 is formed on the lower surface of the first body 100 to be located inside the first flow path 130.

The second flow path 140 may have a circular shape.

When the first passage 130 and the second passage 140 have a circular shape, the first passage 130 and the second passage 140 may have the same center point. In other words, the first passage 130 and the second passage 140 may be concentric circles having the same center point.

When the first body 100 and the second body 200 are coupled up and down, the second flow path 140 is a lower portion of the first body 100 to become an upper portion of the second flow path 140. An upper surface portion of the body 200 becomes a bottom portion of the second flow passage 140.

A plurality of second discharge holes 220 are provided in the second flow passage 140, and the plurality of second discharge holes 220 are formed to penetrate the upper and lower surfaces of the second body 200.

When the first body 100 and the second body 200 are coupled up and down, the plurality of second discharge holes 220 are positioned at the bottom of the second flow path 140, so that the second flow path 140 has a plurality of. Are connected to the second discharge holes 220.

The plurality of second discharge holes 220 may be provided to have a predetermined distance from each other in one row along the circumferential direction of the circular second flow passage 140.

The circular shape formed by the plurality of second discharge holes 220 may be located inside the circular shape formed by the plurality of first discharge holes 210. In this case, the circular shape formed by the plurality of second discharge holes 220 and the circular shape formed by the plurality of first discharge holes 210 may be concentric circles having the same center point.

The first connection passage 131 is formed on the lower surface of the first body 100.

The first connection passage 131 is a passage located between the inside of the first passage 130 and the outside of the second passage 140, and connects the first passage 130 and the second passage 140.

When the first body 100 and the second body 200 are coupled up and down, the first connection channel 131 is a lower portion of the first body 100 to become an upper portion of the first connection channel 131. An upper surface portion of the second body 200 becomes a bottom portion of the first connection passage 131.

It is preferable that the first connection passage 131 has a straight shape.

The second connection passage 132 is a passage located between the inside of the first passage 130 and the outside of the second passage 140, and connects the first passage 130 and the second passage 140.

When the first body 100 and the second body 200 are coupled up and down, the second connection flow path 132 becomes an upper portion of the second connection flow path 132 when the first body 100 is coupled up and down. An upper surface portion of the second body 200 becomes a bottom portion of the second connection passage 132.

It is preferable that the second connection passage 132 has a straight shape.

The second connection channel 132 is positioned symmetrically with the first connection channel 131 based on the center point of the first channel 130 or the center point of the second channel 140. Therefore, the first connection passage 131 and the second connection passage 132 are positioned on a straight line passing through the center point of the first passage 130 or the center point of the second passage 140.

The first main hole 110 and the second main hole 120 are formed on the upper surface of the first body 100, and serve as an inlet for cleaning liquid to flow in or an outlet for cleaning liquid to flow out.

The first main hole 110 and the second main hole 120 are provided symmetrically with respect to the hollow 101.

The first up and down flow passage 111 is connected to the first main hole 110 through which the cleaning liquid flows in or out, and is provided on the first connection flow passage 131.

The first upper and lower flow passages 111 are formed inside the first body 100 to penetrate the upper and lower sides of the first body 100, and an upper portion of the first upper and lower flow passages 111 may be formed in the first main hole 110. The lower portion of the first up and down flow passage 111 is connected to the first connection flow passage 131.

Preferably, the first up and down flow passage 111 has a straight shape, and when the first connection flow passage 131 has a straight shape, the first up and down flow passage 111 and the first connection flow passage 131 are perpendicular to each other. .

The second up and down flow passage 121 is connected to the second main hole 120 through which the cleaning liquid flows in or out, and is provided on the second connection flow passage 132.

The second up and down flow passage 121 is formed inside the first body 100 so as to penetrate the top and bottom of the first body 100, and an upper portion of the second up and down flow passage 121 is formed with the second main hole 120. The lower portion of the second up and down flow passage 121 is connected to the second connection flow passage 132.

Preferably, the second up and down flow passage 121 has a straight shape, and when the second connection flow passage 132 has a straight shape, the second up and down flow passage 121 and the second connection flow passage 132 are perpendicular to each other. .

The first body 100 has a hollow 101 in which a piezoelectric element (not shown) is inserted in the center of the upper surface of the first body 100, and is formed around the hollow 101 on the upper surface of the first body 100. The first main hole 110 and the second main hole 120 are formed at both sides.

The first passage 130, the second passage 140, the first connection passage 131, and the second connection passage 132 are formed on the lower surface of the first body 100, and the first body 100 is inside. There is a first up and down flow path 111 connecting the first main hole 110 and the first connection flow path 131 and the second up and down flow path connecting the second main hole 120 and the second connection flow path 132 ( 121) is formed.

The second body 200 is coupled to the lower portion of the first body 100 so that the lower surface of the first body 100 and the upper surface of the second body 200 abut. In other words, the first body 100 and the second body 200 are coupled up and down.

A plurality of first discharge holes 210 and a plurality of second discharge holes 220 are formed in the second body 200. The plurality of first discharge holes 210 and the plurality of second discharge holes 220 are formed to penetrate the upper and lower surfaces of the second body 200.

As described above, the plurality of first discharge holes 210 may be formed at regular intervals from each other in one row along the circumferential direction of the first flow path 130, and the plurality of second discharge holes 220 may have a second flow path. It may be formed at regular intervals from each other in a row along the circumferential direction of 140.

In addition, the circular shape formed by the plurality of second discharge holes 220 may be located inside the circular shape formed by the plurality of first discharge holes 210. In this case, the circular shape formed by the plurality of second discharge holes 220 and the circular shape formed by the plurality of first discharge holes 210 may be concentric circles having the same center point.

As shown in FIG. 6, each of the plurality of first discharge holes 210 has a first discharge hole upper region 210a, a first discharge hole lower region 210b, and a first discharge hole central region 210c. Each of the plurality of second discharge holes 220 may be formed to have a second discharge hole upper region 220a, a second discharge hole lower region 220b, and a second discharge hole central region 220c. have.

The first discharge hole upper region 210a (or the second discharge hole upper region 220a) is formed by a machining process, so that the first discharge hole upper region 210a (or the second discharge hole upper region 220a) is lower than the first discharge hole lower region 210b (or the second discharge hole lower region 220b). Have a large diameter

The first discharge hole 210b (or the second discharge hole lower area 220b) is irradiated with the laser beam to the second body 200 from the upper direction to the lower direction, and thus, the first discharge hole 210 (or the second discharge hole 210b). As a region in which the discharge hole 220 is formed, the discharge hole 220 has a smaller diameter than the first discharge hole upper region 210a (or the second discharge hole upper region 220a).

The first discharge hole central region 210c (or the second discharge hole central region 220c) includes the first discharge hole upper region 210a (or the second discharge hole upper region 220a) and the first discharge hole lower region. A portion connecting the second discharge hole 210b (or the second discharge hole lower region 220b) to be formed by irradiating the first discharge hole lower region 210b (or the second discharge hole lower region 220b) with a laser. At this time, it is an inclined area whose diameter decreases from the top to the bottom.

As described above, each of the plurality of first discharge holes 210 (or the plurality of second discharge holes 220) is the first discharge hole upper region 210a (or the second discharge hole upper region 220a) and the first one. The first discharge is formed to have the discharge hole lower region 210b (or the second discharge hole lower region 220b) and the first discharge hole central region 210c (or the second discharge hole central region 220c). The hole 210 (or the second discharge hole 220) has an inclined area whose diameter decreases from the top to the bottom.

In this case, the diameter of the first discharge hole 210 (or the second discharge hole 220) formed by irradiation with a laser, that is, the first discharge hole lower region 210b (or the second discharge hole lower region 220b) The diameter of)) may have a size of 5㎛ ~ 15㎛.

The first body 100 and the second body 200 may be made of quartz, sapphire of aluminum oxide, and engineering plastics.

Engineering plastics have a tensile strength of 500 kgf / cm 2 or more, a flexural modulus of 20,000 kgf / cm 2 or more, and heat resistance of 100 ° C. or more. . Examples of such thermoplastic enpra include polyamide, POM (Polyacetal), PBT (Polybutylene Terephthalate), PET (Polyethylene Terephthalate), SPS (Syndiotactic Polystyrene), PES (Polyether Sulfone), PEEK (Polyetheretherketone), and the like. Examples are phenol, urea, melamine, alkyds, unsaturated polyesters, epoxies, diarylphthalates, silicones, polyurethanes and the like.

PEEK in the thermoplastic enpra is produced by solution condensation reaction of halogenated benzophenone and hydrokinone, and has excellent characteristics such as heat resistance, toughness, flame resistance, chemical resistance, etc. In addition, for high strength, high rigidity and high precision The grade contains 10, 20 and 30% glass fiber, and the GF 20% reinforced product has a heat deflection temperature of about 300 ° C and a long term heat resistance of 240 ° C at UL temperature index. In addition, despite the excellent heat resistance, it is possible to mold by a general injection molding machine or an extrusion molding machine, and also has good characteristics of resistance to gamma irradiation.

By applying an adhesive to the surface of the lower surface of the first body 100 is not formed, and the surface of the upper surface of the second body 200 is not formed by combining the first and second bodies (100, 200) Can be done. In other words, the first body 100 and the second body 200 may be coupled to each other through an adhesive.

Hereinafter, the flow of the cleaning liquid of the substrate cleaning nozzle 10 according to the first preferred embodiment of the present invention having the above-described configuration will be described with reference to FIGS. 7A, 7B, 18A, 18B, and 18C.

FIG. 7A is a diagram illustrating an internal flow path of the substrate cleaning nozzle of FIG. 1, and FIG. 7B is a diagram illustrating a flow of the cleaning liquid of FIG. 7A.

However, in the following description, the cleaning liquid is supplied through the first main hole 110, and the cleaning liquid flows into the substrate cleaning nozzle 10, and the substrate cleaning nozzle 10 through the second main hole 120. It demonstrates based on the outflow of the washing | cleaning liquid inside.

First, a flow in which the cleaning liquid is supplied through the first main hole 110 and the supplied cleaning liquid is discharged through the plurality of first discharge holes 210 and the plurality of second discharge holes 220 will be described.

When the cleaning liquid is supplied through the first main hole 110, the supplied cleaning liquid flows along the first upper and lower flow passage 111, and then flows to the connection portion between the first upper and lower flow passage 111 and the first connection passage 131. Done. In this case, the connecting portion of the first up and down flow passage 111 and the first connection flow passage 131 means a portion in which the first up and down flow passage 111 and the first connection flow passage 131 are vertically connected to each other.

As shown in FIGS. 7A and 7B, the cleaning liquid flowing into the connecting portion between the first upper and lower flow passages 111 and the first connection passage 131 is divided into two directions in the A and B directions on the first connection passage 131. Branch and flow. In this case, the A direction and the B direction are opposite to each other based on the connecting portion of the first up and down flow path 111 and the first connection flow path 131.

In other words, the cleaning liquid flowing into the first connection passage 131 through the first main hole 110 is branched and flows into the first and second passages 130 and 140, respectively. Directions of the cleaning liquid branched to each other, i.e., the A direction and the B direction are opposite to each other based on the connection portions of the first upper and lower flow passages 111 and the first connection passages 131.

The cleaning liquid branched in the A direction flows into the first channel 130 through the first connection channel 131, and then branches into two branches in the A1 direction and the A2 direction along the circumferential direction of the first channel 130. do.

The cleaning liquid branched and flown in the A1 and A2 directions of the substrate cleaning nozzle 10 through the plurality of first discharge holes 210 provided on the bottom surface of the first passage 130 by ultrasonic vibration of the piezoelectric element. It is discharged to the outside.

The cleaning liquid branched in the B direction flows to the second flow passage 140 through the first connection flow passage 131, and then branches in two directions in the B1 direction and the B2 direction along the circumferential direction of the second flow passage 140. do.

The cleaning liquid branched and flown in the B1 and B2 directions of the substrate cleaning nozzle 10 through the plurality of second discharge holes 220 provided in the bottom surface of the second passage 140 by ultrasonic vibration of the piezoelectric element. It is discharged to the outside.

Hereinafter, a flow through which the cleaning liquid in the first and second flow paths 130 and 140 flows out of the substrate cleaning nozzle 10 through the second main hole 120 will be described.

When the external suction device (not shown) in communication with the second main hole 120 is operated, the cleaning liquid near the second connection passage 132 among the cleaning liquids existing inside the first passage 130 may be a first liquid. As shown in FIGS. 7A and 7B, the cleaning liquid present in the right inner region of the flow path 130 flows in the C direction through the C1 direction and the C2 direction bifurcation on the first flow path 130, thereby providing a second connection flow path. 132 flows into.

Among the cleaning liquids existing in the first passage 130, the cleaning liquid far away from the second connection passage 132, that is, the cleaning liquid existing in the left inner region of the first passage 130 may be formed in the first passage 130. After flowing in the direction opposite to A1 and the direction A2 along, it flows into the first connection channel 131. The cleaning liquid introduced into the first connection channel 131 flows along the first connection channel 131 in the opposite direction to the A and B directions, and then branches and flows into two branches in the B1 direction and the B2 direction to flow through the second channel 140. Flows into). Thereafter, the second flow path 140 flows in the D direction through the two branches of the D1 direction and the D2 direction and flows into the second connection channel 132.

The cleaning liquid introduced into the second connection passage 132 flows out of the substrate cleaning nozzle 10 through the second upper and lower passage 121 and the second main hole 120.

The cleaning liquid present in the second flow passage 140 flows in the circumferential direction of the second flow passage 140 and then flows in the D direction through two branches of the D1 direction and the D2 direction, and thus flows into the second connection flow passage 132. do.

The cleaning liquid introduced into the second connection passage 132 flows out of the substrate cleaning nozzle 10 through the second upper and lower passage 121 and the second main hole 120.

As described above, when the external suction device connected to the second main hole 120 is operated, the cleaning liquid flowing from each of the first passage 130 and the second passage 140 to the second connection passage 132 is shown in FIG. 7. As shown in FIG. 2, the two flow paths flow in two directions in the C direction and the D direction on the second connection channel 132, and flow into the second vertical channel 121. In this case, the C direction and the D direction are opposite to each other based on the connecting portion of the second up and down flow passage 121 and the second connection flow passage 132.

In other words, the cleaning liquid flowing out of the second main hole 120 through the second connection channel 132 flows from the first and second channels 130 and 140 to the second connection channel 132, respectively. The direction of the cleaning liquid flowing from each of the two flow paths 130 and 140, that is, the C direction and the D direction are opposite to each other based on the connection portion of the second up and down flow passage 121 and the second connection flow passage 132.

In this case, the connection portion of the second up and down flow passage 121 and the second connection flow passage 132 means a portion in which the second up and down flow passage 121 and the second connection flow passage 132 are perpendicular to each other.

Due to the structure of the internal flow path and the flow of the cleaning liquid as described above, the nozzle for cleaning the substrate 10 according to the first embodiment of the present invention has the following effects.

The cleaning liquids supplied into the substrate cleaning nozzle 10 through the first main hole 110 and the first upper and lower flow passages 111 are different from each other on the first connection passage 131, that is, in the A direction (outward direction). ) Flows in the B and B directions (inner direction) and flows in the first and second flow paths 130 and 140, respectively, so that the flow pressure of the cleaning liquid is not concentrated in the inward direction, but diffuses evenly, thereby deforming the second flow path 140. Can be minimized.

In detail, as shown in Figs. 18A and 18B, in the case of the nozzle for cleaning the substrate and the nozzle of Patent Document 1, the cleaning liquid supplied has only the direction in the inward direction of the nozzle. The deformation of intensively occurred.

However, in the case of the substrate cleaning nozzle 10 according to the first preferred embodiment of the present invention, the supplied cleaning liquid flows along the B direction and flows to the second channel 140, and the A direction opposite to the B direction is changed. As it flows along the first channel 130, the flow pressure is evenly applied to the inside and outside of the substrate cleaning nozzle 10.

This even distribution of the flow pressure can be seen in Figure 18c, through which, the substrate cleaning nozzle 10 according to the first preferred embodiment of the present invention is a deformation of the second passage 140 compared to the conventional nozzles It can be confirmed that it does not occur greatly.

As such, as the flow pressure applied to the second flow passage 140 is lowered, breakage and leakage of the second flow passage 140 can be effectively prevented compared to the conventional nozzles.

The even distribution of the flow pressure applied to the internal flow paths of the substrate cleaning nozzle 10 contributes to the high breakdown voltage characteristic of the substrate cleaning nozzle 10.

The high pressure resistance characteristics can exert high discharge pressure performance at a high supply pressure or ensure uniformity of the cleaning liquid discharged to the first and second discharge holes 210 and 220, thereby achieving discharge of the cleaning liquid without dead zones. In addition, due to the high withstand voltage characteristics, not only can damage of the flow path inside the nozzle 10 for cleaning the substrate can be prevented, but also the coupling portions of the first and second bodies 100 and 200 can be prevented from being damaged.

In the substrate cleaning nozzle 10 according to the first preferred embodiment of the present invention described above, the relationship between the first passage 130 and the second passage 140 is' volume of the first passage 130: the second passage ( It is preferable that the volume of 140) is satisfactorily formed.

As such, as the ratio of the volume of the first channel 130 to the volume of the second channel 140 becomes 1: 1, the cleaning liquid is branched and flows in two directions in the A direction and the B direction from the first connection channel 131. The ratio of the flow rate of can be close to 1: 1. Therefore, a uniform amount of the cleaning liquid may flow into the first and second flow paths 130 and 140, and through this, the discharge amount of the cleaning liquid discharged through the plurality of first discharge holes 210 of the first flow path 130. The uniformity of the discharge amount of the cleaning liquid discharged through the plurality of second discharge holes 220 of the second passage 140 may be ensured. The uniformity of the discharge amount can prevent the dead zone from being generated during substrate cleaning.

The number of the plurality of first discharge holes 210 and the number of the plurality of second discharge holes 220 together with the condition of the volume of the first channel 130 and the second channel 140 are formed to be the same number. It is preferable. This is because as the number of the first and second discharge holes 210 and 220 become the same, the uniformity of the above-described discharge amount can be more effectively achieved.

Unlike the foregoing, the plurality of second discharge holes 220 may be provided to have a predetermined distance from each other in two rows along the circumferential direction of the circular second flow path 140. As such, as the plurality of second discharge holes 220 are provided in two rows, there is an advantage in that the number of the plurality of first discharge holes 210 and the plurality of second discharge holes 220 can be easily formed to be the same. .

In the above description, the first and second euros 130 and 140 and the first and second connection euros 131 and 132 are formed on the lower surface of the first body 100, but the first and second euros ( 130 and 140 and the first and second connection passages 131 and 132 may be formed on at least one of the lower surface of the first body 100 and the upper surface of the second body 200.

Substrate cleaning nozzle 10 ′ according to the second embodiment of the present invention

Hereinafter, the substrate cleaning nozzle 10 ′ according to the second preferred embodiment of the present invention will be described with reference to FIGS. 8 and 9.

8 is a bottom view illustrating a bottom surface of a first body of a substrate cleaning nozzle according to a second preferred embodiment of the present invention, and FIG. 9 is a second view of the substrate cleaning nozzle according to a second preferred embodiment of the present invention. It is a top view which shows the upper surface of a body.

8 and 9, in the substrate cleaning nozzle 10 ′ according to the second preferred embodiment of the present invention, a plurality of grooves 160 are formed on the lower surface of the first body 100 ′. A plurality of protrusions 260 are formed on the upper surface of the second body 200 ′ corresponding to the plurality of grooves 160 and inserted into the plurality of grooves 160, respectively.

In other words, the substrate cleaning nozzle 10 ′ according to the second preferred embodiment of the present invention is a lower surface of the first body 100 of the substrate cleaning nozzle 10 according to the first preferred embodiment of the present invention described above. A plurality of grooves 160 are additionally formed in the plurality of grooves 160, and a plurality of protrusions 260 are additionally formed on the upper surface of the second body 200.

As shown in FIG. 8, the plurality of grooves 160 are formed on the lower surface of the first body 100 ′, and serve to provide a space into which the plurality of protrusions 260 are inserted.

The plurality of grooves 160 may include a first groove 161 formed outside the first channel 130, and second and third grooves 162 positioned between the first channel 130 and the second channel 140. 163 and a fourth groove 164 formed inside the second passage 140.

The first groove 161 has a circular shape having a larger diameter than the first passage 130 and is formed to surround the first passage 130.

The center of the first groove 161 may be formed to be the same as the center of the first and second flow paths 130 and 140. In other words, the first groove 161, the first passage 130, and the second passage 140 may be concentric circles having the same center point.

A first fusion groove 161a into which the first fusion mountain 261a of the first protrusion 261 to be described later is inserted may be formed in the first groove 161.

The first fusion groove 161a is preferably formed at the center of the first groove 161.

The second groove 162 may be formed to be positioned in the front direction of the first and second connection passages 131 and 132 between the first and second passages 130 and 140. In other words, the second groove 162 is formed to surround the front region, that is, a partial region of the second passage 140.

The third groove 163 may be formed to be located in the rear direction of the first and second connection passages 131 and 132 between the first and second passages 130 and 140. In other words, the third groove 163 is formed to surround the rear region, that is, the remaining region of the second passage 140.

The fourth groove 164 has a circular shape having a smaller diameter than the second passage 140 and is formed to be surrounded by the second passage 140.

The fourth groove 164 may have a center point the same as a center point of the first and second flow paths 130 and 140. In other words, the fourth groove 164, the first passage 130, and the second passage 140 may be concentric circles having the same center point.

A second fusion groove 164a into which the second fusion acid 264a of the fourth protrusion 264 to be described later is inserted may be formed in the fourth groove 164.

The second fusion groove 164a is preferably formed at the center of the fourth groove 164.

As shown in FIG. 9, the plurality of protrusions 260 are formed on the upper surface of the second body 200 ′, and each of the plurality of grooves 160 when the first and second bodies 100 ′ and 200 ′ are coupled to each other. It is inserted into.

The plurality of protrusions 260 may include first and second protrusions 261 formed on the outer side of the circular shape formed by the plurality of first discharge holes 210 and circular shapes and the plurality of first discharge holes 210. The second and third protrusions 262 and 263 positioned between the circular shapes formed by the two second discharge holes 220 and the fourth formed inside the circular shapes formed by the plurality of second discharge holes 220. It may be configured to include a projection (264).

The first protrusion 261 has a circular shape having a larger diameter than the circular shape formed by the plurality of first discharge holes 210 and surrounds the circular shape formed by the plurality of first discharge holes 210. Is formed. The first protrusion 261 is formed at a position corresponding to the first groove 161 to be inserted into the first groove 161 when the first and second bodies 100 'and 200' are coupled to each other.

A first fusion acid 261a is formed on an upper surface of the first protrusion 261, and the first fusion acid 261a has a smaller width than the first projection 261 and protrudes upward. The first fusion acid 261a is inserted into the first fusion groove 161a of the first groove 161.

The first protrusion 261 may have the center point the same as the center point of the circular shape formed by the plurality of first discharge holes 210 and the circular shape formed by the plurality of second discharge holes 220. In other words, the first protrusion 261, the circular shape formed by the plurality of first discharge holes 210 and the circular shape formed by the plurality of second discharge holes 220 may be concentric circles having the same center point.

The second protrusion 262 may be formed to be located in a forward direction between a circular shape formed by the plurality of first discharge holes 210 and a circular shape formed by the plurality of second discharge holes 220. In other words, the second protrusion 262 is formed to surround a circular front region, that is, a partial region, formed by the plurality of second discharge holes 220.

The second protrusion 262 is formed at a position corresponding to the second groove 162 to be inserted into the second groove 162 when the first and second bodies 100 'and 200' are coupled.

The third protrusion 263 may be formed to be located in the rear direction between the circular shape formed by the plurality of first discharge holes 210 and the circular shape formed by the plurality of second discharge holes 220. In other words, the third protrusion 263 is formed to surround a circular rear region formed by the plurality of second discharge holes 220, that is, the remaining region.

The third protrusion 263 is formed at a position corresponding to the third groove 163 to be inserted into the third groove 163 when the first and second bodies 100 ′ and 200 ′ are coupled to each other.

The fourth protrusion 264 has a circular shape having a diameter smaller than the circular shape formed by the plurality of second discharge holes 220, and is formed to be surrounded by the circular shape formed by the plurality of first discharge holes 210. do. The fourth protrusion 264 is formed at a position corresponding to the fourth groove 164 to be inserted into the fourth groove 164 when the first and second bodies 100 'and 200' are coupled.

A second fusion acid 264a is formed on an upper surface of the fourth protrusion 264, and the second fusion acid 264a has a smaller width than the fourth protrusion 264 and protrudes upward. The second fusion 264a is inserted into the second fusion groove 164a of the fourth groove 164.

The fourth protrusion 264 may have the center point the same as the center point of the circular shape formed by the plurality of first discharge holes 210 and the circular shape formed by the plurality of second discharge holes 220. In other words, the fourth protrusion 264, the circular shape formed by the plurality of first discharge holes 210, and the circular shape formed by the plurality of second discharge holes 220 may be concentric circles having the same center point.

The substrate cleaning nozzle 10 ′ according to the second preferred embodiment of the present invention having the above-described configuration may include the first and second bodies when the first body 100 ′ and the second body 200 ′ are made of a resin material. Coupling of the bodies (100, 200) may be made by ultrasonic welding. In particular, the first body 100 ′ and the second body 200 ′ are preferably made of a PEEK material.

Ultrasonic welding refers to the bonding of two or more plastic joint surfaces due to heat generation, softening, and melting caused by ultrasonic vibration of the plastic itself. , Suture fusion (STADING), insert fusion (INSERTING), swaging (SWAGING), the slitting (SLITTING) and the like can be divided into ways. Ultrasonic fusion machine for ultrasonic welding is to convert the power of 100 ~ 250V, 50 ~ 60Hz into electric energy of 20KHz and 35KHz through generator, and then convert it into mechanical vibration energy through converter. It is a principle that the ultrasonic vibration energy thus formed is transmitted to the fusion through the horn and instantaneous frictional heat is generated at the fusion surface of the fusion, so that the plastic is dissolved and bonded to form a strong molecular bond. Can be.

The ultrasonic fusion as described above is the ultrasonic energy fusion in the ultrasonic fusion machine after the electrical energy is converted into the mechanical vibration energy through the vibrator, ultrasonic firing and firing through the horn in the state in which the first body 100 'and the second body 200' When at least one of the first and second bodies 100 'and 200' is pressed, a strong frictional heat is generated instantaneously on the mating surface of the first body 100 'and the second body 200', that is, the joint surface. The bonding surface can be made by dissolution bonding.

As described above, when the ultrasonic vibration is applied through the horn, each of the first fusion mountain 261a of the first projection 261 and the second fusion mountain 264a of the fourth projection 264 is formed of the first groove 161. The first fusion groove 161a and the second fusion groove 164a of the fourth groove 164 are melted inside, and through this, the first and second bodies 100 ′ and 200 ′ may be coupled. In other words, the insertion surface of the first and second fusion acids 261a and 264a inserted into each of the first and second fusion grooves 161a and 164a may be a bonding surface or a bonding surface.

Unlike the foregoing, ultrasonic fusion may be performed by firing ultrasonic waves generated in the horn through the lower surface of the second body 200, in which case, for precise fusion, the first and second fusion acids 261a and 264a may be used. Ultrasonic waves may be emitted only to the first and second fusion grooves 161a and 164a.

The first groove 161, the first protrusion 261, the fourth groove 164, and the fourth protrusion 264 are formed of the first and second fusion holes 261a and 264a, respectively. It is inserted into the 161a, 164a and ultrasonically fused, thereby functioning to join the first and second bodies 100 ', 200'.

In the second and third grooves 162 and 163 and the second and third protrusions 262 and 263, the second and third protrusions 262 and 263 are inserted into the second and third grooves 162 and 163, thereby providing a first body. The function of aligning the position of the 100 'and the second body 200'.

As described above, when the first and second bodies 100 'and 200' of the substrate cleaning nozzle 10 'according to the second exemplary embodiment of the present invention are coupled to each other by ultrasonic welding, the first passage 130, The second channel 140, the first connection channel 131, and the second connection channel 132 are positioned between a portion where the plurality of grooves 160 and the plurality of protrusions 260 are coupled to each other.

In detail, the first passage 130 may include a portion in which the first groove 161 and the second protrusion 262 are coupled, a portion in which the second groove 162 and the second protrusion 262 are coupled to each other, The third groove 163 and the third protrusion 263 is located between the combined portion. In addition, the second channel 140 may include a portion in which the second groove 162 and the second protrusion 262 are coupled, a portion in which the third groove 163 and the third protrusion 263 are coupled, and a fourth groove 164. ) And the fourth protrusion 264 are located between the combined portions. In addition, the first and second connection passages 131 and 132 are portions in which the second grooves 162 and the second protrusions 262 are coupled, and portions in which the third grooves 163 and the third protrusions 263 are coupled to each other. Located in between.

The substrate cleaning nozzle 10 ′ according to the second embodiment of the present invention described above has the following effects.

There is no need for a separate adhesive, and the strong molecular bond allows the bond to remain very solid. Due to such a high bonding force, it is possible to prevent the breakage of the flow paths, thereby contributing to maintaining the high withstand voltage characteristic of the substrate cleaning nozzle 10 '.

In addition, the ultrasonic fusion process is performed within 0.1 seconds to 1 second, so the process time is very short, which is advantageous for mass production, and the bonding process can be performed cleanly without deforming or altering the surface of the product.

In addition, since semiconductors, that is, resin materials, are used, which are less etched than glass materials such as quartz, they are semi-permanent, and when the first and second bodies 100 'and 200' are combined, the power consumption is low and the defect rate of the product is reduced. Not only can it reduce, it also has the effect of reducing process costs.

Since the first passage 130, the second passage 140, the first connection passage 131, and the second connection passage 132 are positioned between the plurality of grooves 160 and the plurality of protrusions 260, When the two grooves 160 and the plurality of protrusions 260 are coupled by ultrasonic welding, the inner flow paths are positioned inside the coupling portion. Therefore, it is possible to effectively prevent the cleaning liquid from leaking out of the inner flow paths.

In addition, a first fusion acid 261a is formed in the first protrusion 261, which is the outermost side of the inner flow paths, and a second fusion acid 264a is formed in the fourth protrusion 264, which is the innermost side. The effect of confining the flow paths at the outermost and innermost sides can be achieved, thereby effectively preventing the cleaning liquid from leaking from the inner flow paths.

In the above description, a plurality of grooves 160 are formed on the lower surface of the first body 100 'and a plurality of protrusions 260 are formed on the upper surface of the second body 200', but the plurality of grooves are formed on the lower surface of the first body 100 '. Dog grooves 160 are formed on any one of the lower surface of the first body 100 'and the upper surface of the second body 200', and the plurality of protrusions 260 are formed on the lower surface and the first surface of the first body 100 '. It may be formed on the other one of the upper surface of the two body (200 ').

Substrate cleaning nozzle 10 "according to the third embodiment of the present invention

Hereinafter, a substrate cleaning nozzle 10 ″ according to a second exemplary embodiment of the present invention will be described with reference to FIGS. 10 to 12.

FIG. 10 is a bottom view illustrating a bottom surface of a first body of a substrate cleaning nozzle according to a third preferred embodiment of the present invention, and FIG. 11 is a second view of the substrate cleaning nozzle according to a third preferred embodiment of the present invention. 12 is a plan view showing a top surface of the body, and FIG. 12 is a bottom view showing a bottom surface of the second body of the nozzle for cleaning the substrate according to the third embodiment of the present invention.

10 to 12, the substrate cleaning nozzle 10 ″ according to the third exemplary embodiment of the present invention may include a first passage 130 having a first discharge hole 210 and a first passage 130. The second discharge hole 220 is provided, the second passage 140 located inside the first passage 130 and the plurality of third discharge holes 230 are provided, and the inside of the second passage 140 is provided. A third passage 150, a first connection passage 131 connecting the first passage 130 and the second passage 140, and a first passage 130 and a second passage 140. The second connection passage 132, which is positioned symmetrically with the first connection passage 131 based on the center point of the first passage 130, connects the second passage 140 and the third passage 150. And a third connection passage 141 located in line with the first connection passage 131, connecting the second passage 140 and the third passage 150 to each other, and forming a center point of the second passage 140. A fourth symmetrically positioned with respect to the third connection channel 141 and positioned in line with the second connection channel 132. The condensation passage 142 and the first main hole 110 through which the cleaning liquid flows in or out, and the first upper and lower flow passages 111 provided on the first connection passage 131 and the cleaning liquid flows in or out. The second main passage 120 is connected to the second main hole 120 and is provided on the second connection passage 132, and the first main hole 110 and the second main hole 120 are formed on the upper surface thereof. The first upper and lower flow passages 111 and the second upper and lower flow passages 121 are formed therein, and the first flow passage 130, the second flow passage 140, the first connection flow passage 131, The first body 100 ″ having the second connection channel 132 formed thereon is coupled to the lower portion of the first body 100 ″ so that the lower surface of the first body 100 ″ contacts the upper surface thereof, 130 may include a first discharge hole 210 and a second body 200 ″ having a second discharge hole 220 provided in the second flow passage 140.

The substrate cleaning nozzle 10 ″ according to the third preferred embodiment of the present invention is compared to the substrate cleaning nozzle 10 according to the first preferred embodiment of the present invention. The only difference is that the third connection channel 141 and the fourth connection channel 142 are additionally formed, and the remaining components are the same, and thus, descriptions of the same components as those described above will be omitted.

The third flow path 150 is formed to be located inside the second flow path 140 on the bottom surface of the first body 100 ″.

The third passage 150 may have a circular shape.

When the first passage 130, the second passage 140, and the third passage 150 have a circular shape, the first passage 130, the second passage 140, and the third passage 150 may be It can have the same center point. In other words, the first passage 130, the second passage 140, and the third passage 150 may be concentric circles having the same center point.

In the third flow path 150, when the first body 100 ″ and the second body 200 ″ are coupled up and down, the lower portion of the first body 100 ″ becomes the upper portion of the third flow path 150. The upper portion of the second body 200 ″ becomes the bottom portion of the third flow path 150.

A plurality of third discharge holes 230 are provided in the third flow path 150, and the plurality of third discharge holes 230 are formed to penetrate the upper and lower surfaces of the second body 200.

When the first body 100 ″ and the second body 200 ″ are coupled up and down, the plurality of third discharge holes 230 may be positioned at the bottom of the third flow path 150, such that the third flow path 150 is disposed. Is connected to the plurality of third discharge holes 230.

The plurality of third discharge holes 230 may be provided to have a predetermined distance from each other in a row along the circumferential direction of the circular third flow path 150.

The circular shape formed by the plurality of third discharge holes 230 may be located inside the circular shape formed by the plurality of second discharge holes 220. In this case, the circular shape formed by the plurality of third discharge holes 230 and the circular shape formed by the plurality of second discharge holes 220 may be concentric circles having the same center point.

The third connection passage 141 is formed on the lower surface of the first body 100 ″.

The third connection passage 141 is a passage located between the inside of the second passage 140 and the outside of the third passage 150, and connects the second passage 140 and the third passage 150.

When the first body 100 ″ and the second body 200 ″ are vertically coupled to the third connection channel 141, the lower portion of the first body 100 is an upper portion of the third connection channel 141. The upper surface portion of the second body 200 ″ becomes the bottom portion of the third connection passage 141.

The third connection channel 141 is positioned in line with the first connection channel 131.

The third connection passage 141 preferably has a straight shape.

The fourth connection passage 142 is a passage located between the inside of the second passage 140 and the outside of the third passage 150, and connects the second passage 140 and the third passage 150.

When the first body 100 ″ and the second body 200 ″ are vertically coupled to the fourth connection channel 142, the lower portion of the first body 100 is an upper portion of the fourth connection channel 142. The upper surface portion of the second body 200 ″ becomes the bottom portion of the fourth connection passage 142.

It is preferable that the fourth connection passage 142 has a straight shape.

The fourth connection passage 142 is positioned in line with the second connection passage 132.

The fourth connection channel 142 is positioned symmetrically with the third connection channel 141 based on the center point of the first channel 130 or the center point of the second channel 140. Accordingly, the first connection passage 131, the second connection passage 132, the third connection passage 141, and the fourth connection passage 142 may be formed at the center of the first passage 130 or the second passage 140. It is positioned on a straight line passing through the center point or the center point of the third flow path 150.

A plurality of third discharge holes 230 are formed in the second body 200 ". The plurality of third discharge holes 230 are formed to penetrate the upper and lower surfaces of the second body 200".

The plurality of third discharge holes 230 may be formed at regular intervals from each other in one row along the circumferential direction of the third flow path 150.

The circular shape formed by the plurality of third discharge holes 230 may be located inside the circular shape formed by the plurality of second discharge holes 220. In this case, the circular shape formed by the plurality of first discharge holes 210 and the circular shape formed by the plurality of second discharge holes 220 and the circular shape formed by the plurality of third discharge holes 230 are the same. It can be a concentric circle with a center point.

The plurality of third discharge holes 230 are the same as the first and second discharge holes 210 and 220 described above, and the third discharge hole upper region (not shown), the third discharge hole lower region (not shown), and the third The discharge hole may be formed to have a central area (not shown), and a detailed description thereof may be replaced with the above description.

Therefore, the plurality of third discharge holes 230 may have an inclined area whose diameter decreases from the top to the bottom.

Hereinafter, the flow of the cleaning liquid of the substrate cleaning nozzle 10 ″ according to the third preferred embodiment of the present invention having the above-described configuration will be described with reference to FIGS. 13A, 13B, and 18D.

However, in the following description, the cleaning liquid is supplied through the first main hole 110, and the cleaning liquid is introduced into the substrate cleaning nozzle 10 ″, and the substrate cleaning nozzle 10 is passed through the second main hole 120. ") It demonstrates based on outflow of the washing | cleaning liquid inside.

FIG. 13A illustrates an internal flow path of a substrate cleaning nozzle according to a third exemplary embodiment of the present invention, and FIG. 13B illustrates a flow of the cleaning liquid of FIG. 13A.

First, the cleaning liquid is supplied through the first main hole 110, and the cleaning liquid is supplied through the plurality of first discharge holes 210, the plurality of second discharge holes 220, and the plurality of third discharge holes 230. The flow through which the cleaning liquid is discharged will be described.

When the cleaning liquid is supplied through the first main hole 110, the supplied cleaning liquid flows along the first upper and lower flow passage 111, and then flows to the connection portion between the first upper and lower flow passage 111 and the first connection passage 131. Done. In this case, the connecting portion of the first up and down flow passage 111 and the first connection flow passage 131 means a portion in which the first up and down flow passage 111 and the first connection flow passage 131 are vertically connected to each other.

As shown in FIGS. 13A and 13B, the cleaning liquid flowing to the connection portion between the first upper and lower flow passages 111 and the first connection passage 131 is in the A direction (outward direction) and the B direction on the first connection passage 131. It branches in two directions (inward direction) and flows. In this case, the A direction and the B direction are opposite to each other based on the connecting portion of the first up and down flow path 111 and the first connection flow path 131.

In other words, the cleaning liquid flowing into the first connection passage 131 through the first main hole 110 is branched and flows into the first and second passages 130 and 140, respectively. Directions of the cleaning liquid branched to each other, i.e., the A direction and the B direction are opposite to each other based on the connection portions of the first upper and lower flow passages 111 and the first connection passages 131.

The cleaning liquid branched in the A direction flows into the first channel 130 through the first connection channel 131, and then branches into two branches in the A1 direction and the A2 direction along the circumferential direction of the first channel 130. do.

The cleaning liquid branched in the A1 and A2 directions flows through the substrate cleaning nozzles 10 ″ through the plurality of first discharge holes 210 provided in the bottom surface of the first flow path 130 by ultrasonic vibration of the piezoelectric element. Is discharged to the outside.

The cleaning liquid branched in the B direction flows through the first connection channel 131 to the second channel 140, and then flows in three directions in the B1 direction, the B2 direction, and the C direction along the circumferential direction of the second channel 140. Branch and flow.

The cleaning liquid branched in the B1 direction and the B2 direction flows through the plurality of second discharge holes 220 provided in the bottom surface of the second flow path 140 by ultrasonic vibration of the piezoelectric element. Is discharged to the outside.

After the cleaning liquid flowing in the C direction flows along the third connection channel 141, the washing liquid is branched into two branches in the C1 direction and the C2 direction along the circumferential direction of the third channel 150.

The cleaning liquid branched in the C1 direction and the C2 direction flows through the plurality of third discharge holes 230 provided in the bottom surface of the third flow path 150 by ultrasonic vibration of the piezoelectric element. Is discharged to the outside.

Hereinafter, the flow through which the cleaning liquids of the first and second flow paths 130 and 140 flow out of the substrate cleaning nozzle 10 ″ through the second main hole 120 will be described.

When the external suction device (not shown) in communication with the second main hole 120 is operated, the cleaning liquid near the second connection passage 132 among the cleaning liquids existing inside the first passage 130 may be a first liquid. As shown in FIGS. 13A and 13B, the cleaning liquid present in the right inner region of the flow path 130 flows in the D direction through the two branches of the D1 direction and the D2 direction on the first flow path 130, thereby providing a second connection flow path. 132 flows into.

Among the cleaning liquids present in the first passage 130, the cleaning liquid far away from the second connection passage 132, that is, the cleaning liquid existing in the left inner region of the first passage 130 may be disposed in the first passage 130. After flowing in the direction opposite to A1 and the direction A2 along, it flows into the first connection channel 131. The washing liquid introduced into the first connection channel 131 flows along the first connection channel 131 in the opposite direction to the A direction and the B direction, and then branches into the B1 direction, the B2 direction, and the C direction.

Among these, the cleaning liquid introduced into the second flow path 140 through the B1 direction and the B2 direction flows along the circumferential direction of the second flow path 140, and then flows in the E direction through the two branches of the E1 direction and the E2 direction, It flows into the second connection passage 132. The cleaning liquid introduced into the second connection passage 132 flows out of the substrate cleaning nozzle 10 through the second upper and lower passage 121 and the second main hole 120.

The cleaning liquid flowing in the C direction is branched into two branches in the C1 direction and the C2 direction, flows in the circumferential direction of the third flow path 150, and then flows in the F direction through the two branches in the F1 direction and the F2 direction, thereby providing a fourth connection. It flows into the flow path 142. Thereafter, the cleaning liquid flows in the E direction, thereby flowing into the second connection passage 132, and thus the cleaning liquid flowing into the second connection passage 132 is the second upper and lower passage 121 and the second main hole 120. Through the outflow to the substrate cleaning nozzle 10.

Among the cleaning liquids present in the second flow passage 140, the cleaning liquid near the second connection flow passage 132, that is, the cleaning liquid existing in the right inner region of the second flow passage 140, is E1 on the second flow passage 140. It flows in the E direction through the bifurcation direction and E2 direction, thereby entering the second connection flow path (132).

Among the cleaning liquids existing in the second flow passage 140, the cleaning liquid far away from the second connection passage 132, that is, the cleaning liquid existing in the left inner region of the second flow passage 140, is formed in the second flow passage 140. After flowing in the direction opposite to B1 and the direction B2 along, it flows into the third connection channel 141. The cleaning liquid introduced into the third connection channel 141 flows along the third connection channel 141 in the C direction, and then branches into two branches in the C1 direction and the C2 direction.

The cleaning liquid introduced into the third flow path 150 through the C1 direction and the C2 direction flows along the circumferential direction of the third flow path 150, and then flows in the F direction through the bifurcation of the F1 direction and the F2 direction and thus, the fourth flow path. It flows into the connecting passage 142. Thereafter, the cleaning liquid flows in the E direction, thereby flowing into the second connection passage 132, and thus the cleaning liquid flowing into the second connection passage 132 is the second upper and lower passage 121 and the second main hole 120. Through the outflow to the substrate cleaning nozzle 10.

Due to the structure of the internal flow path as described above and the flow of the cleaning liquid, the substrate cleaning nozzle 10 "according to the third preferred embodiment of the present invention has the following effects.

The cleaning liquids supplied into the substrate cleaning nozzle 10 ″ through the first main hole 110 and the first upper and lower flow passages 111 are different from each other on the first connection passage 131, that is, in the A direction (outside). Direction) and B direction (inner direction) and flows into each of the first flow path 130, the second flow path 140, and the third flow path 150, so that the flow pressure of the cleaning liquid is not concentrated inwardly and evenly. By diffusion, deformation of the second channel 140 and the third channel 150 can be minimized.

Minimization of the deformation of the second channel 140 and the third channel 150 can be seen in FIG. 18D.

As shown in FIG. 18D, the internal flow paths of the substrate cleaning nozzle 10 ″, that is, the first flow path 130, the second flow path 140, and the third flow path 150 are uniformly deformed. Therefore, it can be confirmed that the deformation is not concentrated only in the second passage 140 and the third passage 150.

In other words, as the flow pressure applied to the second passage 140 or the third passage 150 decreases, the deformation of the second passage 140 or the third passage 150 is minimized, and further, the second passage Damage and leakage of the 140 and the third passage 150 can be effectively prevented.

The even distribution of the flow pressure applied to the internal flow paths of the substrate cleaning nozzle 10 ″ as described above contributes to the high pressure resistance characteristic of the substrate cleaning nozzle 10 ″.

The high pressure resistance characteristics can achieve high discharge pressure performance at a high supply pressure, or ensure uniformity of the cleaning liquid discharged to the first to third discharge holes 210, 220, and 230, thereby achieving discharge of the cleaning liquid without dead zones. Can be. In addition, due to the high withstand voltage characteristics, not only the passage passage inside the substrate cleaning nozzle 10 ″ can be prevented, but also the joining portions of the first and second bodies 100 and 200 can be prevented from being broken.

In the substrate cleaning nozzle 10 ″ according to the third exemplary embodiment of the present invention, the relationship between the first passage 130, the second passage 140, and the third passage 150 is “first passage 130. ) Volume: the volume of the second channel 140 + the volume of the third channel 150 = 1: 1 'condition is preferably satisfied.

For example, the relationship between the first passage 130, the second passage 140, and the third passage 150 is 'volume of the first passage 130: volume of the second passage 140: third passage 150'. Volume = 3: 2: 1 'relationship can be satisfied.

As such, when the ratio of the sum of the volume of the first channel 130, the volume of the second channel 140, and the volume of the third channel 150 becomes 1: 1, the direction A and B in the first connection channel 131 are obtained. The ratio of the flow amount of the washing liquid which flows bifurcated in two directions may be close to 1: 1. Therefore, a uniform amount of the cleaning liquid may flow in the first flow passage 130 and the second and third flow passages 140 and 150, and thus, the plurality of first discharge holes 210 of the first flow passage 130. The uniformity of the discharge amount of the cleaning liquid discharged through the cleaning liquid discharged through the plurality of second and third discharge holes 220 and 230 of the second and third flow paths 140 and 150 may be ensured. The uniformity of the discharge amount can prevent the dead zone from being generated during substrate cleaning.

The number of the plurality of first discharge holes 210, the plurality of second discharge holes 220, and the plurality of third discharge holes, together with the volume conditions of the first flow path 130 and the second flow path 140 described above ( The sum of the number of 230) is preferably formed in the same number. In other words, it is preferable to satisfy the relationship 'Number of the plurality of first discharge holes 210: Number of the plurality of second discharge holes 220 + Number of the plurality of third discharge holes 230 = 1: 1'. Do.

This is because, as the sum of the number of the first discharge holes 210 and the number of the second and third discharge holes 220 and 230 becomes equal, the uniformity of the above-described discharge amount can be more effectively achieved.

The substrate cleaning nozzle 10 ″ according to the third exemplary embodiment of the present invention has one flow path having a plurality of discharge holes, that is, a plurality of substrates, compared to the substrate cleaning nozzle 10 according to the first embodiment. Since the third flow path 150 having the third discharge hole 230 is added, it is possible to achieve a precise arrangement of the discharge holes, thereby preventing the dead area of the substrate from being generated.

In the above description, the first to third flow paths 130, 140, and 150 and the first to fourth connection flow paths 131, 132, 141, and 142 are formed on the bottom surface of the first body 100 ″. Although described above, the first to third flow paths 130, 140, and 150 and the first to fourth connection flow paths 131, 132, 141, and 142 are formed on the lower surface of the first body 100 ″ and the second body 200 ″. It may be formed on at least one of the upper surface of the).

Substrate cleaning nozzle 10 "'according to the fourth embodiment of the present invention

Hereinafter, a substrate cleaning nozzle 10 ″ ′ according to a fourth exemplary embodiment of the present invention will be described with reference to FIGS. 14 and 15.

FIG. 14 is a bottom view illustrating a bottom surface of a first body of a substrate cleaning nozzle according to a fourth preferred embodiment of the present invention, and FIG. 15 is a second view of the substrate cleaning nozzle according to a fourth preferred embodiment of the present invention. It is a top view which shows the upper surface of a body.

14 and 15, in the substrate cleaning nozzle 10 ″ ′ according to the fourth exemplary embodiment of the present invention, a plurality of grooves 160 are formed on the bottom surface of the first body 100 ″ ′. A plurality of protrusions 260 are formed on the upper surface of the second body 200 ′ ′ to correspond to the plurality of grooves 160 and inserted into the plurality of grooves 160, respectively.

In other words, the substrate cleaning nozzle 10 "'according to the fourth preferred embodiment of the present invention is the first body 100" of the substrate cleaning nozzle 10 "according to the third preferred embodiment of the present invention described above. A plurality of grooves 160 are additionally formed on the bottom of the bottom surface, and a plurality of protrusions 260 are additionally formed on the top surface of the second body 200 ″.

As shown in FIG. 14, the plurality of grooves 160 are formed on the lower surface of the first body 100 ″ ′ and serve to provide a space into which the plurality of protrusions 260 are inserted.

The plurality of grooves 160 may include a first groove 161 formed outside the first channel 130, and second and third grooves 162 positioned between the first channel 130 and the second channel 140. 163, the fourth and fifth grooves 164 and 165 positioned between the second passage 140 and the third passage 150, and the sixth groove 166 formed inside the third passage 150. It may be configured to include.

The first groove 161 has a circular shape having a larger diameter than the first passage 130 and is formed to surround the first passage 130.

The center point of the first groove 161 may be formed to be the same as the center point of the first to third flow paths 130, 140, and 150. In other words, the first grooves 161 and the first to third flow paths 130, 140, and 150 may be concentric circles having the same center point.

A first fusion groove 161a into which the first fusion mountain 261a of the first protrusion 261 to be described later is inserted may be formed in the first groove 161.

The first fusion groove 161a is preferably formed at the center of the first groove 161.

The second groove 162 may be formed to be positioned in the front direction of the first and second connection passages 131 and 132 between the first and second passages 130 and 140. In other words, the second groove 162 is formed to surround the front region, that is, a partial region of the second passage 140.

The third groove 163 may be formed to be located in the rear direction of the first and second connection passages 131 and 132 between the first and second passages 130 and 140. In other words, the third groove 163 is formed to surround the rear region, that is, the remaining region of the second passage 140.

The fourth groove 164 may be formed to be located in the front direction of the third and fourth connection passages 141 and 142 between the second and third passages 140 and 150. In other words, the fourth groove 164 is formed to surround the front region, that is, a partial region of the third passage 150.

The fifth groove 165 may be formed to be positioned in the rear direction of the third and fourth connection passages 141 and 142 between the second and third passages 140 and 150. In other words, the fourth groove 164 is formed to surround the rear region, that is, the partial region of the third passage 150.

The sixth groove 166 has a circular shape having a diameter smaller than that of the third flow path 150 and is formed to be surrounded by the third flow path 150.

The center point of the sixth groove 166 may be formed to be the same as the center point of the first to third flow paths 130, 140, and 150. In other words, the fourth groove 164 and the first to third flow paths 130, 140, and 150 may be concentric circles having the same center point.

A second fusion groove 166a into which the second fusion acid 266a of the sixth protrusion 266 is inserted may be formed in the sixth groove 166.

The second fusion groove 166a is preferably formed at the center of the sixth groove 166.

As shown in FIG. 15, the plurality of protrusions 260 are formed on the upper surface of the second body 200, and the plurality of grooves 160 when the first and second bodies 100 ″ ′ and 200 ″ ′ are combined. It is inserted into each.

The plurality of protrusions 260 may include first and second protrusions 261 formed on the outer side of the circular shape formed by the plurality of first discharge holes 210 and circular shapes and the plurality of first discharge holes 210. The second and third protrusions 262 and 263 positioned between the circular shapes formed by the two second discharge holes 220, and the circular shapes and the plurality of third discharge holes formed by the plurality of second discharge holes 220. Fourth and fifth projections 264 and 265 positioned between the circular shapes formed by the 230 and the sixth projections 266 formed inside the circular shapes formed by the plurality of third discharge holes 230 are formed. It can be configured to include.

The first protrusion 261 has a circular shape having a larger diameter than the circular shape formed by the plurality of first discharge holes 210 and surrounds the circular shape formed by the plurality of first discharge holes 210. Is formed. The first protrusion 261 is formed at a position corresponding to the first groove 161 to be inserted into the first groove 161 when the first and second bodies 100 and 200 are coupled.

A first fusion acid 261a is formed on an upper surface of the first protrusion 261, and the first fusion acid 261a has a smaller width than the first projection 261 and protrudes upward. The first fusion acid 261a is inserted into the first fusion groove 161a of the first groove 161.

The first protrusion 261 has a circular shape formed at a plurality of first discharge holes 210, a circular shape formed at a plurality of second discharge holes 220, and a plurality of third discharge holes 230. It may be formed to be the same as the center point of the circular shape to be formed. In other words, the first protrusion 261, the circular shape formed by the plurality of first discharge holes 210, the circular shape formed by the plurality of second discharge holes 220 and the plurality of third discharge holes 230 are The circular shape to be formed may be concentric circles having the same center point.

The second protrusion 262 may be formed to be located in a forward direction between a circular shape formed by the plurality of first discharge holes 210 and a circular shape formed by the plurality of second discharge holes 220. In other words, the second protrusion 262 is formed to surround a circular front region, that is, a partial region, formed by the plurality of second discharge holes 220.

The second protrusion 262 is formed at a position corresponding to the second groove 162 to be inserted into the second groove 162 when the first and second bodies 100 "'and 200"' are coupled.

The third protrusion 263 may be formed to be located in the rear direction between the circular shape formed by the plurality of first discharge holes 210 and the circular shape formed by the plurality of second discharge holes 220. In other words, the third protrusion 263 is formed to surround a circular rear region formed by the plurality of second discharge holes 220, that is, the remaining region.

The third protrusion 263 is formed at a position corresponding to the third groove 163 to be inserted into the third groove 163 when the first and second bodies 100 "'and 200"' are coupled.

The fourth protrusion 264 may be formed in a forward direction between a circular shape formed by the plurality of second discharge holes 220 and a circular shape formed by the plurality of third discharge holes 230. In other words, the fourth protrusion 264 is formed to surround a circular front region, that is, a partial region formed by the plurality of third discharge holes 230.

The fourth protrusion 264 is formed at a position corresponding to the fourth groove 164 to be inserted into the fourth groove 164 when the first and second bodies 100 "'and 200"' are coupled.

The fifth protrusion 265 may be formed in a rear direction between a circular shape formed by the plurality of second discharge holes 220 and a circular shape formed by the plurality of third discharge holes 230. In other words, the fifth protrusion 265 is formed to surround a circular rear region formed by the plurality of third discharge holes 230, that is, the remaining region.

The fifth protrusion 265 is formed at a position corresponding to the fifth groove 165 to be inserted into the fifth groove 165 when the first and second bodies 100 "'and 200"' are coupled.

The sixth protrusion 266 has a circular shape having a diameter smaller than the circular shape formed by the plurality of third discharge holes 230 and is formed to be surrounded by the circular shape formed by the plurality of second discharge holes 220. do. The sixth protrusion 266 is formed at a position corresponding to the sixth groove 166 to be inserted into the sixth groove 166 when the first and second bodies 100 "'and 200"' are coupled.

A second fusion acid 266a is formed on the top surface of the sixth protrusion 266, and the second fusion acid 266a has a smaller width than the sixth protrusion 266 and protrudes upward. The second fusion acid 266a is inserted into the second fusion groove 166a of the sixth groove 166.

The sixth protrusion 266 has a circular shape formed at a plurality of first discharge holes 210, a circular shape formed at a plurality of second discharge holes 220, and a plurality of third discharge holes 230. It may be formed to be the same as the center point of the circular shape to be formed. In other words, the sixth protrusion 266, the circular shape formed by the plurality of first discharge holes 210, the circular shape formed by the plurality of second discharge holes 220, and the plurality of third discharge holes 230 may be formed. The circular shape to be formed may be concentric circles having the same center point.

The substrate cleaning nozzle 10 ″ ′ according to the fourth embodiment of the present invention having the above-described configuration may be formed when the first body 100 ″ ′ and the second body 200 ″ ′ are made of a resin material. 1, 2 body (100, 200) of the coupling may be made by ultrasonic fusion, detailed description thereof will be omitted because it was described above.

When the first body 100 "'and the second body 200"' are joined by ultrasonic fusion, the second fusion of the first fusion mountain 261a and the sixth protrusion 266 of the first protrusion 261 is performed. Each of the mountains 266a is melted in the first fusion groove 161a of the first groove 161 and the second fusion groove 166a of the sixth groove 166, and thereby, the first and second bodies 100. "', 200"') may be combined. In other words, the insertion surface of the first and second fusion acids 261a and 266a inserted into each of the first and second fusion grooves 161a and 166a may be a bonding surface or a bonding surface.

In the above-described first groove 161, the first protrusion 261, the sixth groove 166, and the sixth protrusion 266, the first and second fusion acids 261a and 266a are respectively the first and second fusion grooves ( It is inserted into the 161a, 166a and ultrasonically fused, thereby functioning to join the first and second bodies 100 "', 200"'.

The second to fourth grooves 162, 163, and 164 and the second to fourth protrusions 262, 263, and 264 have the second to fourth grooves 262, 263, and 264, respectively. 162, 163, and 164, the first body 100 ″ ′ and the second body 200 ″ ′ are aligned.

As described above, when the first and second bodies 100 "'and 200"' of the substrate cleaning nozzle 10 "'according to the fourth embodiment of the present invention are coupled to each other by ultrasonic welding, the first to the second The three flow paths 130, 140, and 150 and the first to fourth connection flow paths 131, 132, 141, and 142 are positioned between the plurality of grooves 160 and the plurality of protrusions 260.

In detail, the first passage 130 may include a portion in which the first groove 161 and the second protrusion 262 are coupled, a portion in which the second groove 162 and the second protrusion 262 are coupled to each other, The third groove 163 and the third protrusion 263 is located between the combined portion.

The second flow path 140 is between the second groove 162, the portion where the second protrusion 262 is coupled and the fourth groove 164, the portion where the fourth protrusion 264 is coupled, and the third groove 163. The third protrusion 263 is coupled between the portion where the fifth groove 165 and the fifth protrusion 265 are coupled.

The third flow path 150 includes a fourth groove 164, a portion where the fourth protrusion 264 is coupled, and a fifth groove 165, a portion where the fifth protrusion 265 is coupled with the sixth groove 166, The sixth protrusion 266 is positioned between the coupled portions.

The first and second connection passages 131 and 132 are provided between a portion in which the second groove 162 and the second protrusion 262 are coupled, and a portion in which the third groove 163 and the third protrusion 263 are coupled to each other. Located.

The third and fourth connection passages 141 and 142 are provided between a portion in which the fourth groove 164 and the fourth protrusion 264 are coupled, and a portion in which the fifth groove 165 and the fifth protrusion 265 are coupled to each other. Located.

The substrate cleaning nozzle 10 ′ ′ according to the fourth preferred embodiment of the present invention described above has the same effect as the substrate cleaning nozzle 10 ′ according to the second preferred embodiment of the present invention described above.

Since the first to third flow paths 130, 140, and 150 and the first to fourth connection flow paths 131, 132, 141, and 142 are positioned between the plurality of grooves 160 and the plurality of protrusions 260, When the plurality of grooves 160 and the plurality of protrusions 260 are coupled by ultrasonic welding, the inner flow paths are positioned inside the coupling portion. Therefore, it is possible to effectively prevent the cleaning liquid from leaking out of the inner flow paths.

In addition, a first fusion acid 261a is formed in the first protrusion 261 that is the outermost side of the inner flow paths, and a second fusion acid 266a is formed in the sixth protrusion 266 that is the innermost side. The effect of confining the flow paths at the outermost and innermost sides can be achieved, thereby effectively preventing the cleaning liquid from leaking from the inner flow paths.

In the above description, a plurality of grooves 160 are formed on the lower surface of the first body 100 "'and a plurality of protrusions 260 are formed on the upper surface of the second body 200"'. The plurality of grooves 160 are formed on any one of a lower surface of the first body 100 "'and an upper surface of the second body 200"', and the plurality of protrusions 260 are formed on the first body 100 "'. ) May be formed on the other one of the lower surface and the upper surface of the second body 200 "'.

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art various modifications of the present invention without departing from the spirit and scope of the present invention described in the claims below. Or it may be modified.

10, 10 ', 10 ", 10"': nozzle for cleaning substrate
100, 100 ', 100 ", 100"': first body
101: hollow 110: first main hole
111: first and second euros 120: second main hall
121: second and second euros 130: first euro
131: first connection channel 132: second connection channel
140: second euro 141: third connection euro
142: fourth connection euro 150: third euro
160: home 161: first home
161a: first fusion groove 162: second groove
163: third groove 164: fourth groove
164a, 166a: second fusion groove 165: fifth groove
166: sixth groove
200, 200 ', 200 ", 200"': second body
210: first discharge hole 210a: first discharge hole upper region
210b: lower area of the first discharge hole 210c: center area of the first discharge hole
220: second discharge hole 220a: second discharge hole upper region
220b: lower area of the second discharge hole 220c: center area of the second discharge hole
230: third discharge hole
260: protrusion 261: first protrusion
261a: first molten acid 262: second projection
263: third projection 264: fourth projection
264a and 266a: second melted acid 265: fifth protrusion
266: sixth projection

Claims (11)

A first flow passage provided with a first discharge hole;
A second flow passage provided with a second discharge hole and positioned inside the first flow passage;
A first connection channel connecting the first channel and the second channel; And
And a first up and down flow path connected to a first main hole through which a cleaning liquid flows in or out, and provided on the first connection flow path. The method of claim 1,
And the first flow path and the second flow path have a circular shape having the same center point. The method of claim 1,
A nozzle for cleaning a substrate, which satisfies the condition 'volume of the first flow passage: volume of the second flow passage = 1: 1'. The method of claim 1,
A second connection channel connecting the first channel and the second channel and positioned symmetrically with the first connection channel based on a center point of the first channel; And
And a second vertical flow passage connected to a second main hole through which a cleaning liquid flows in or out, and provided on the second connection flow passage. The method of claim 1,
A third flow passage having a plurality of third discharge holes and positioned inside the second flow passage; And
And a third connection channel connecting the second channel and the third channel to be in line with the first channel. The method of claim 5,
A nozzle for cleaning a substrate, which satisfies the condition 'volume of the first flow path: volume of the second flow path + volume of the third flow path = 1: 1'. The method of claim 5,
A second connection channel connecting the first channel and the second channel and positioned symmetrically with the first connection channel based on a center point of the first channel; And
A second vertical flow passage connected to a second main hole through which a cleaning liquid flows in or out, and provided on the second connection flow passage; And
A fourth connection channel connecting the second channel and the third channel, positioned symmetrically with the third connection channel with respect to the center point of the second channel, and located in a line with the second connection channel; Substrate cleaning nozzle comprising a. The method of claim 7, wherein
The first passage, the second passage and the third passage have a circular shape having the same center point,
And the first to fourth connection flow paths are located on a straight line passing through the center point. The method of claim 1,
First body;
A second body coupled to a lower portion of the first body such that a lower surface of the first body and an upper surface thereof contact each other;
A plurality of grooves formed on any one of a lower surface of the first body and an upper surface of the second body; And
A plurality of protrusions formed on the other surface of the lower surface of the first body or the upper surface of the second body and formed to correspond to the plurality of grooves and inserted into each of the plurality of grooves;
The first flow path, the second flow path and the first connection flow path are provided on at least one of the lower surface of the first body and the upper surface of the second body, the first flow path, the second flow path and the first flow path The connection passage is a substrate cleaning nozzle, characterized in that located between the plurality of grooves and the portion where the plurality of projections are coupled. A first flow passage provided with a first discharge hole;
A second flow passage provided with a second discharge hole and positioned inside the first flow passage;
A first connection channel connecting the first channel and the second channel; And
It includes; First up and down flow passage connected to the first main hole in which the cleaning liquid is introduced;
The cleaning liquid flowing into the first connection channel through the first main hole flows by branching into the first and second flow paths, respectively, and the direction of the cleaning liquid branching and flowing into the first and second flow paths is the first vertical flow path. And nozzles in opposite directions with respect to the connection part of the first connection channel. A first flow passage provided with a first discharge hole;
A second flow passage provided with a second discharge hole and positioned inside the first flow passage;
First and second connection passages connecting the first channel and the second channel and symmetrically positioned with respect to the center point of the first channel;
A first vertical flow passage connected to the first main hole into which the cleaning liquid flows; And
And a second vertical flow passage connected to the second main hole through which the cleaning liquid flows out.
The cleaning liquid flowing into the first connection channel through the first main hole flows by branching into the first and second flow paths, respectively, and the direction of the cleaning liquid branching and flowing into the first and second flow paths is the first vertical flow path. Opposite to each other based on the connection part of the first connection channel,
The cleaning liquid flowing out to the second main hole through the second connection channel flows from the first and second channels to the second connection channel, and the direction of the cleaning liquid flowing from each of the first and second channels is the second. The nozzle for cleaning the substrate, characterized in that the opposite direction with respect to the connecting portion of the up and down flow path and the second connection flow path.

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