KR20190143364A - 칩의 제조 방법 - Google Patents

칩의 제조 방법 Download PDF

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Publication number
KR20190143364A
KR20190143364A KR1020190063226A KR20190063226A KR20190143364A KR 20190143364 A KR20190143364 A KR 20190143364A KR 1020190063226 A KR1020190063226 A KR 1020190063226A KR 20190063226 A KR20190063226 A KR 20190063226A KR 20190143364 A KR20190143364 A KR 20190143364A
Authority
KR
South Korea
Prior art keywords
workpiece
chip
holding
region
modified layer
Prior art date
Application number
KR1020190063226A
Other languages
English (en)
Korean (ko)
Inventor
요시아키 요도
진얀 자오
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20190143364A publication Critical patent/KR20190143364A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020190063226A 2018-06-20 2019-05-29 칩의 제조 방법 KR20190143364A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018117127A JP7102065B2 (ja) 2018-06-20 2018-06-20 チップの製造方法
JPJP-P-2018-117127 2018-06-20

Publications (1)

Publication Number Publication Date
KR20190143364A true KR20190143364A (ko) 2019-12-30

Family

ID=69096967

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190063226A KR20190143364A (ko) 2018-06-20 2019-05-29 칩의 제조 방법

Country Status (4)

Country Link
JP (1) JP7102065B2 (zh)
KR (1) KR20190143364A (zh)
CN (1) CN110690172B (zh)
TW (1) TWI800658B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022096455A (ja) * 2020-12-17 2022-06-29 株式会社ディスコ ウエーハの生成装置
JP2022117116A (ja) * 2021-01-29 2022-08-10 株式会社ディスコ 剥離装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523775B2 (zh) * 1972-07-08 1977-01-29
JP2005135964A (ja) * 2003-10-28 2005-05-26 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2005342760A (ja) 2004-06-03 2005-12-15 Disco Abrasive Syst Ltd レーザー加工装置
JP2007141998A (ja) * 2005-11-16 2007-06-07 Denso Corp 半導体チップの製造装置及び半導体チップの製造方法
TWI283023B (en) * 2005-12-23 2007-06-21 Advanced Semiconductor Eng Wafer level packaging process
JP2008153420A (ja) 2006-12-18 2008-07-03 Seiko Epson Corp 基材の分割方法、液滴吐出ヘッドの製造方法、半導体装置の製造方法、基板の製造方法、及び電気光学装置の製造方法
JP6154121B2 (ja) 2012-12-06 2017-06-28 リンテック株式会社 割断装置及び割断方法
JP2014199834A (ja) 2013-03-29 2014-10-23 株式会社ディスコ 保持手段及び加工方法
JP2014236034A (ja) 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法
JP6382568B2 (ja) * 2014-05-09 2018-08-29 株式会社ディスコ レーザー加工装置
JP6710463B2 (ja) * 2016-10-11 2020-06-17 株式会社ディスコ ウェーハの加工方法

Also Published As

Publication number Publication date
TWI800658B (zh) 2023-05-01
JP2019220581A (ja) 2019-12-26
TW202002057A (zh) 2020-01-01
JP7102065B2 (ja) 2022-07-19
CN110690172B (zh) 2024-05-14
CN110690172A (zh) 2020-01-14

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A201 Request for examination
E902 Notification of reason for refusal