KR20190135196A - Light emitting device package and method of producing the same - Google Patents

Abstract

According to an embodiment of the present invention, a light emitting device package comprises: a light emitting device including first and second bonding parts; a molding part for surrounding the light emitting device; and a body part disposed on a side surface of the molding part, and separated from the light emitting device. The first and second bonding parts are exposed from a rear surface of the molding part. The body part includes a first body part disposed on a first side surface of the molding part and a second body part disposed on a second side surface facing the first side surface of the molding part. The first and second body parts include a concave part provided on a rear surface of each of the first and second body parts. The concave part is concave toward an upper surface from the rear surface of each of the first and second body parts. In addition, a method for manufacturing the light emitting device package comprises the following steps of: disposing a light emitting device including first and second bonding parts on a substrate; forming a molding part on the substrate and the light emitting device; forming a pattern on the molding part; and forming a body part on the pattern. In the step of forming the body part, a concave part is formed on an upper surface of the body part, and the concave part is concave toward a rear surface from the upper surface of the body part.

Description

LIGHT EMITTING DEVICE PACKAGE AND METHOD OF PRODUCING THE SAME}

An embodiment relates to a light emitting device package and a method of manufacturing the same.

A semiconductor device including a compound such as GaN, AlGaN, etc. has many advantages, such as having a wide and easy to adjust band gap energy, and can be used in various ways as a light emitting device, a light receiving device, and various diodes.

In particular, light emitting devices such as light emitting diodes or laser diodes using Group 3-Group 5 or Group 2-6 compound semiconductor materials have been developed using thin film growth technology and device materials. There is an advantage that can implement light of various wavelength bands such as green, blue and ultraviolet. In addition, a light emitting device such as a light emitting diode or a laser diode using a group 3 to 5 or 2 to 6 group compound semiconductor material may implement a white light source having high efficiency by using a fluorescent material or combining colors. Such a light emitting device has advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps.

In addition, when a light-receiving device such as a photodetector or a solar cell is also fabricated using a Group 3-5 Group 2 or Group 6 compound semiconductor material, development of device materials absorbs light in various wavelength ranges to generate a photocurrent. As a result, light in various wavelengths can be used from gamma rays to radio wavelengths. In addition, such a light receiving device has the advantages of fast response speed, safety, environmental friendliness and easy control of the device material, so that it can be easily used in power control or microwave circuits or communication modules.

Therefore, the semiconductor device may replace a light emitting diode backlight, a fluorescent lamp, or an incandescent bulb, which replaces a cold cathode tube (CCFL) constituting a backlight module of an optical communication means, a backlight of a liquid crystal display (LCD) display device. Applications are expanding to include white light emitting diode lighting devices, automotive headlights and traffic lights, and sensors that detect gas or fire. In addition, the semiconductor device may be extended to high frequency application circuits, other power control devices, and communication modules.

The light emitting device (Light Emitting DeVice) can be provided as a pn junction diode of the characteristic that the electrical energy is converted to light energy using, for example, Group 3-5 elements or Group 2-6 elements on the periodic table. Various wavelengths can be realized by adjusting the composition ratio.

For example, nitride semiconductors are receiving great attention in the field of optical devices and high power electronic devices due to their high thermal stability and wide bandgap energy. In particular, ultraviolet (UV) light emitting devices, blue light emitting devices, green light emitting devices, yellow light emitting devices, and red light emitting devices using nitride semiconductors are commercially used and widely used.

For example, in the case of an ultraviolet light emitting device, a light emitting diode which emits light distributed in a wavelength range of 200 nm to 400 nm, and is used in the wavelength band, for short wavelengths, for sterilization and purification, and for long wavelengths, an exposure machine or a curing machine. Can be used.

 Ultraviolet rays can be classified into UV-A (315nm ~ 400nm), UV-B (280nm ~ 315nm), and UV-C (200nm ~ 280nm) in order of long wavelength. The UV-A (315nm ~ 400nm) area is applied to various fields such as industrial UV curing, printing ink curing, exposure machine, forgery discrimination, photocatalyst sterilization, special lighting (aquarium / agriculture, etc.), and UV-B (280nm ~ 315nm). ) Area is used for medical purposes, UV-C (200nm ~ 280nm) area is applied to air purification, water purification, sterilization products.

Meanwhile, as a light emitting device capable of providing high output is required, research on a light emitting device capable of increasing output by applying a high power source is being conducted.

In addition, in the light emitting device package, research has been conducted on ways to improve optical characteristics by improving the directivity angle and luminous flux and to improve the brightness at the package stage.

In addition, in manufacturing a light emitting device package, research has been conducted on a method for reducing manufacturing cost and improving manufacturing yield through structural change.

The embodiment is to provide a light emitting device package and a method of manufacturing the same that can improve the luminous flux and have various directing angles.

In addition, the embodiment can improve the reliability between the light emitting device package and the circuit board, and to provide a light emitting device package and a method of manufacturing the same that can prevent the tilt (tilt).

In addition, the embodiment is to provide a light emitting device package and a method of manufacturing the same that can omit a separate reflector and can reflect the light emitted from the light emitting device at various angles.

The light emitting device package according to the embodiment includes a light emitting device including first and second bonding parts, a molding part surrounding the light emitting device, a body part disposed on a side of the molding part and spaced apart from the light emitting device, And a second bonding portion is exposed from the rear surface of the molding portion, and the body portion is disposed on a first side of the molding portion and a second side facing the first side of the molding portion. A body portion, wherein the first and second body portions include a recess provided on a rear surface of each of the first and second body portions, and the recess portion faces upward from a rear surface of each of the first and second body portions. Concave in the direction.

In addition, the method of manufacturing a light emitting device package according to the embodiment, disposing a light emitting device comprising a first and second bonding portion on the substrate, forming a molding on the substrate and the light emitting device, the molding part And forming a body portion on the pattern, wherein in the forming of the body portion, a concave portion is formed on an upper surface of the body portion, and the concave portion faces the rear surface from an upper surface of the body portion. Concave in the direction.

The light emitting device package according to the embodiment may include a body portion having an inclination angle, thereby improving the luminous flux of the light emitting device package. In addition, the inclination angle of the body portion can be easily controlled, and the light emitting device package may have various directing angles.

In addition, the body portion of the light emitting device package may include a material capable of reflecting light emitted from the light emitting device. Accordingly, the separate reflector can be omitted, thereby reducing the weight and volume of the package.

In addition, the body portion of the light emitting device package may include a recess, and when the package is disposed on a substrate, a resin may be disposed in a part or the entire area of the recess. Accordingly, the light emitting device package can be prevented from being tilted, and light can be emitted uniformly in an upward direction.

In addition, the light emitting device package may include first and second body parts facing each other, and the bias angle of the first and second body parts may be adjusted to compensate for a biased arrangement of the light emitting devices.

In addition, the embodiment may simultaneously manufacture a plurality of light emitting device packages including a body portion. That is, the embodiment can simplify the manufacturing process of the light emitting device package, thereby reducing the overall manufacturing time and cost of the package, thereby improving process efficiency.

1 is an exploded perspective view of a light emitting device package according to a first embodiment.
2 is a plan view of a light emitting device package according to the first embodiment.
3 is a rear view of the light emitting device package according to the first embodiment.
4 is a cross-sectional view taken along line AA ′ of FIG. 2.
5 is a plan view of a light emitting device package according to a second embodiment.
FIG. 6 is a cross-sectional view taken along line BB ′ of FIG. 5.
7 is a cross-sectional view of a light emitting device package according to a third embodiment.
8 is a cross-sectional view of a light emitting device package according to a fourth embodiment.
9 is an exploded perspective view of a light emitting device package according to a fifth embodiment.
10 is a plan view of a light emitting device package according to a fifth embodiment.
11 is another plan view of the light emitting device package according to the fifth embodiment.
12 is a plan view of a light emitting device package according to a sixth embodiment.
13 is a diagram illustrating an example of a module in which a light emitting device package according to an embodiment is disposed on a circuit board.
14 is a side cross-sectional view of a light emitting device according to the embodiment.
15 to 20 are views illustrating a method of manufacturing a light emitting device package according to the embodiment.

Embodiments of the invention will be described with reference to the accompanying drawings. In the description of an embodiment of the invention, each layer (film), region, pattern or structures may be “on / over” or “under” the substrate, each layer (film), region, pad or pattern. "On / over" and "under" are defined as being "directly" or "indirectly" through another layer. It includes everything. In addition, the reference to the top / top or bottom of each layer will be described based on the drawings, but embodiments are not limited thereto.

A semiconductor device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present invention, the device may include a semiconductor device or a light emitting device that emits light of ultraviolet, infrared, or visible light. Hereinafter, an example of a semiconductor device will be described based on a case where a light emitting device is applied, and the package or light source device to which the light emitting device is applied may include a non-light emitting device such as a Zener diode or a sensing device that monitors a wavelength or heat. Can be. Hereinafter, a description will be given based on a case where a light emitting device is applied as an example of a semiconductor device, and the light emitting device package will be described in detail.

Before describing the light emitting device package according to the embodiment, the first direction may be the x-axis direction shown in the drawings, and the second direction may be the y-axis direction shown in the drawings. In addition, the first direction and the second direction may be directions crossing each other, for example, a direction perpendicular to each other. In addition, the third direction may be a direction crossing the x-axis and the y-axis in the z-axis direction illustrated in the drawings, and may be a direction orthogonal to one another.

1 to 4 are diagrams illustrating a light emitting device package according to the first embodiment. In detail, FIG. 1 is a perspective view of a light emitting device package according to a first embodiment, FIG. 2 is a plan view of a light emitting device package according to a first embodiment, and FIG. 3 is a rear view of the light emitting device package according to a first embodiment. 4 is a cross-sectional view taken along line AA ′ of FIG. 2.

1 to 4, the light emitting device package 1000 according to the first embodiment may include a light emitting device 500, a molding part 300, and a body part 100. In detail, the light emitting device package 1000 may include a light emitting device 500, a molding part 300 surrounding the light emitting device 500, and a body part 100 disposed on a side surface of the molding part 300. .

The light emitting device 500 may include a substrate 501, a light emitting structure 520, a first bonding part 510, and a second bonding part 520.

The substrate 501 may be formed of an insulating material or a semiconductor material as a light transmitting layer. In addition, an uneven pattern may be formed on a surface of the substrate 501.

The light emitting structure 520 may include a compound semiconductor. For example, the light emitting structure 520 may be provided as, for example, a group 2-6 or 3-5 compound semiconductor.

The light emitting structure 520 may include a first conductive semiconductor layer 521, an active layer 522, and a second conductive semiconductor layer 523. The first conductivity-type semiconductor layer 521 and the second conductivity-type semiconductor layer 523 may be implemented as at least one of a compound semiconductor of Group 3-Group 5 or Group 2-6. In addition, the active layer 522 may be implemented with a compound semiconductor. The active layer 522 may be implemented by at least one of compound semiconductors of Groups 3-5 or 2-6, for example.

The light emitting device 500 may include one or a plurality of light emitting cells therein. The light emitting cell may include at least one of an n-p junction, a p-n junction, an n-p-n junction, and a p-n-p junction. The plurality of light emitting cells may be connected in series with each other in one light emitting device. Accordingly, the light emitting device 500 may have one or a plurality of light emitting cells, and when n light emitting cells are disposed in one light emitting device, the light emitting device 500 may be driven at a driving voltage of n times. For example, when the driving voltage of one light emitting cell is 3V and two light emitting cells are arranged in one light emitting device, each light emitting device may be driven at a driving voltage of 6V. Alternatively, when the driving voltage of one light emitting cell is 3V and three light emitting cells are arranged in one light emitting device, each light emitting device may be driven at a driving voltage of 9V. The number of light emitting cells disposed in the light emitting device 500 may be one or two to five. The light emitting device 500 will be described in more detail with reference to FIG. 9 to be described later.

The light emitting device 500 may have a length in a first direction and a second direction. The length of the first direction of the light emitting device 500 may be the same as or different from the length of the second direction. For example, when the length of the first direction of the light emitting device package 1000 is longer than the length of the second direction, the length of the first direction of the light emitting device 500 may be longer than the length of the second direction.

The first bonding portion 510 may be electrically connected to the first conductive semiconductor layer 521, and the second bonding portion 520 may be electrically connected to the second conductive semiconductor layer 523. have. The first bonding part 510 and the second bonding part 520 may have at least one of a top view shape having a circular shape, an elliptic shape, a polygonal shape, an atypical shape having a straight line and a curved line.

The first bonding part 510 and the second bonding part 520 may be spaced apart from each other. Accordingly, a gap may be formed between the first bonding portion 510 and the second bonding portion 520. The first bonding part 510 may be disposed at a position overlapping with the light emitting device 500 in a vertical direction. The second bonding part 520 may be disposed at a position overlapping with the light emitting device 500 in the vertical direction.

The first bonding part 510 and the second bonding part 520 may include a conductive material. For example, the first bonding portion 510 and the second bonding portion 520 may include titanium (Ti), aluminum (Al), indium (In), iridium (Ir), tantalum (Ta), and palladium ( Pd), cobalt (Co), chromium (Cr), magnesium (Mg), zinc (Zn), nickel (Ni), silicon (Si), germanium (Ge), silver (Ag), silver alloy (Ag alloy) , Gold (Au), Hafnium (Hf), Platinum (Pt), Ruthenium (Ru), Rhodium (Rh), ZnO, IrO _x , RuO _x , NiO, RuO _x / ITO, Ni / IrO _x / Au, Ni / It may be formed in a single layer or multiple layers using one or more materials or alloys selected from the group containing IrO _x / Au / ITO. That is, the first bonding portion 510 and the second bonding portion 520 may be electrodes or pads. Accordingly, the light emitting device 500 may be driven by driving power supplied through the first bonding unit 510 and the second bonding unit 520. In addition, the light emitted from the light emitting device 500 may be extracted in an upward direction.

The length of each of the first bonding part 510 and the second bonding part 520 in the first direction may be shorter than the length of the first direction of the light emitting device 500. In addition, the length of each of the first bonding part 510 and the second bonding part 520 in the second direction may be shorter or equal to the length of the second direction of the light emitting device 500.

The molding part 300 may be disposed on the light emitting device 500. The molding part 300 may include an insulating material. In addition, the molding part 300 may include wavelength conversion means for receiving the light emitted from the light emitting device 500 and providing the wavelength-converted light. For example, the molding part 300 may be at least one selected from the group including phosphors, quantum dots, and the like. The light emitting device 500 may emit light of yellow, blue, green, red, white, infrared or ultraviolet light. The phosphor or quantum dot may emit light of blue, green, and red. The molding part 300 may not be formed.

The phosphor disposed inside or below the molding part 300 may include a phosphor of a fluoride compound, and may include, for example, at least one of an MGF phosphor, a KSF phosphor, or a KTF phosphor. The phosphor may emit light of different peak wavelengths, and the light emitted from the light emitting device may emit light of different yellow and red colors or different red peak wavelengths. One kind of the phosphor may include a red phosphor. The red phosphor may have a wavelength range of 610 nm to 650 nm, and the wavelength may have a half width of less than 10 nm. The red phosphor may include a fluoride phosphor. The fluorite-based phosphor is KSF red K ₂ SiF ₆ : Mn ⁴⁺ , K ₂ TiF ₆ : Mn ⁴⁺ , NaYF ₄ : Mn ⁴⁺ , NaGdF ₄ : Mn ⁴⁺ , K ₃ SiF =: Mn ⁴⁺ It may include at least one of. For example, the KSF-based phosphor may have a composition formula of K _a Si _1-c F _b : Mn ⁴⁺ _c , wherein a is 1 ≦ a ≦ 2.5, b is 5 ≦ b ≦ 6.5, and c is 0.001 ≦ c <0.1 may be satisfied. In addition, the fluorite-based red phosphor may further include an organic coating on the surface of the fluoride or Mn-containing fluoride or the surface of the fluoride coating does not contain Mn in order to improve the reliability at high temperature / high humidity. Unlike the other phosphors, the above-described fluerite-based red phosphor may implement a narrow width of 10 nm or less, and thus may be utilized in a high resolution device.

The phosphor composition according to the embodiment should basically conform to stoichiometry, and each element may be substituted with another element in each group on the periodic table. For example, Sr may be substituted with Ba, Ca, Mg, or the like of the alkaline earth (II) group, and Y may be substituted with Tb, Lu, Sc, Gd, etc. of the lanthanide series. In addition, the active agent Eu, etc. may be substituted by Ce, Tb, Pr, Er, Yb, etc. according to a desired energy level, and an active agent alone or a deactivator may be additionally applied to modify properties.

The quantum dot phosphor may include a II-VI compound or a III-V compound semiconductor, and may emit red light. The quantum dots are, for example, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS ₂ , Such as CuInSe ₂ and the like, and combinations thereof.

The molding part 300 may have a length in a first direction and a second direction. For example, the molding part 300 may have a polygonal shape when viewed in a plan view. In detail, the molding part 300 may have a rectangular shape. The length of the first direction of the molding part 300 may be longer than the length of the first direction of the light emitting device 500. The length in the second direction of the molding part 300 may be longer than the length in the second direction of the light emitting device 500. A length in the third direction of the molding part 300 may be longer than a length in the third direction of the light emitting device 500. Accordingly, the molding part 300 may be disposed to surround the light emitting device 500. The molding part 300 may be disposed in contact with at least one surface of the upper surface and the plurality of side surfaces of the light emitting device 500. For example, the molding part 300 may be disposed to surround the top and side surfaces of the light emitting device 500, and may be spaced apart from the rear surface of the light emitting device 500. Accordingly, the back surface of the light emitting device 500 may be exposed from the molding part 300. In addition, the first bonding part 510 and the second bonding part 520 may be exposed from the rear surface of the molding part 300.

In detail, the first bonding portion 510 and the second bonding portion 520 may protrude from the rear surface of the molding portion 300. The rear surface of the molding part 300 may be located above the rear surface of the first and second bonding parts 510 and 520 in the vertical direction. In addition, the rear surface of the molding part 300 may be disposed on the same plane as the rear surface of the light emitting device 500. In addition, the back surface of the molding part 300 may be disposed on the same plane as the top surface of the first bonding part 510 and / or the second bonding part 520. Accordingly, the entire rear surface of the light emitting device 500 may be exposed from the molding part 300, and the molding part 300 may include the first bonding part 510 and the second bonding part 520. It may be spaced apart from.

The molding part 300 may include a plurality of side surfaces. For example, when the molding part 300 is a quadrangle when viewed in plan view, the molding part 300 may include first to fourth side surfaces S1, S2, S3, and S4. In detail, the molding part 300 includes a first side surface S1, a second side surface S2 facing the first side surface S1, and a first connection portion connecting the first and second side surfaces S1 and S2. It may include a third side (S3) and the fourth side (S4). The third side surface S3 and the fourth side surface S4 may be side surfaces facing each other. Side surfaces S1, S2, S3, and S4 of the molding part 300 may have an inclination angle with respect to the rear surface of the molding part 300. For example, the inclination angle between each side of the molding part 300 and the back surface of the molding part 300 may be vertical.

The distance between the first side surface S1 and the second side surface S2 may be the same as or different from the distance between the third side surface S3 and the fourth side surface S4. For example, the distance between the first side surface S1 and the second side surface S2 may be longer than or equal to the distance between the third side surface S3 and the fourth side surface S4.

In addition, the distance between each side of the molding unit 300 and the light emitting device 500 may be the same or different from each other. For example, a distance between the light emitting device 500 and the first side surface S1 may correspond to a distance between the light emitting device 500 and the second side surface S2. In addition, the distance between the light emitting device 500 and the third side surface S3 may correspond to the distance between the light emitting device 500 and the fourth side surface S4. In addition, the distance between the light emitting device 500 and the first side surface S1 is a distance between the light emitting device 500 and the third side surface S3, and the light emitting device 500 and the fourth side surface S4. May be greater than the distance between.

The body part 100 may be disposed on the molding part 300. The body portion 100 may be a resin material or an insulating resin material. The body portion 100 is polyphthalamide (PPA: Polyphthalamide), PCT (Polychloro Tri phenyl), LCP (Liquid Crystal Polymer), PA9T (Polyamide9T), silicone, epoxy, epoxy molding compound (EMC: Epoxy molding compound), It may be formed of at least one selected from the group consisting of silicon molding compound (SMC), ceramic, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ) and the like. The body portion 100 may be white or black. For example, when the body part is a white material, the body part 100 may include white silicone, and when the body material is black, carbon black, iron oxide, titanium oxide, chromium, silver fine particles, etc. may be included. Can be. When the body part 100 is made of a white material, the light emitted from the light emitting device 500 may be reflected, thereby improving light reflection efficiency. In addition, when the body portion 100 is a black material can absorb the light can improve the contrast characteristics.

The body part 100 may be formed of a resin material, and may include a filler of a high refractive material such as TiO ₂ and SiO ₂ therein. The body portion 100 may be formed of a thermoplastic resin, and the thermoplastic resin is a material that hardens when heated and is hardened again when cooled, so that the body portion 100 may buffer when expanded or contracted by heat. Can be.

In addition, when the body part 100 performs the buffering function, it is possible to prevent the conductive parts such as solder paste, Ag paste, and SAC (Sn-Ag-Cu) paste from being damaged. In the package, a coefficient of thermal expansion (CTE) according to thermal expansion and contraction may be greater in the first direction than in the second direction. The body portion 100 according to the embodiment may preferably include a PCT or PPA material, the PCT or PPA material is a high melting point and a thermoplastic resin.

The height of the body part 100 may correspond to the height of the molding part 300. For example, the vertical maximum height of the body part 100 may correspond to the height of the molding part 300. In addition, the body part 100 may be disposed on the side surface of the molding part 300. The body part 100 may directly contact the side surface of the molding part 300. The inner side surface of the body portion 100 in direct contact with the side surface of the molding part 300 may have the same planar area as the side surface of the molding part 300.

The body part 100 may include a plurality of body parts disposed on the side surface of the molding part 300. For example, the body portion 100 is disposed on the first body portion 110 and the second side surface S2 of the molding portion 300 disposed on the first side surface S1 of the molding portion 300. It may include a second body portion 120 disposed in. In this case, the third side surface S3 and the fourth side surface S4 of the molding part 300 may be open regions where the body portion 100 is not disposed.

The first body part 110 may directly contact the first side surface S1 of the molding part 300. The first body part 110 may have a length corresponding to the molding part 300. For example, the second direction length of the first body part 110 may correspond to the second direction length of the molding part 300. In detail, the length in the second direction of the first body part 110 may correspond to the length in the second direction of the first side surface S1. In addition, a third direction length of the first body part 110 may correspond to a third direction length of the molding part 300. In detail, the third direction length of the first body part 110 may correspond to the third direction length of the first side surface S1. Accordingly, the upper surface of the first body portion 110 may be disposed on the same plane as the upper surface of the molding portion 300.

The first body part 110 may have an inclination angle corresponding to the side surface of the molding part 300. For example, when the first side surface S1 of the molding part 300 and the rear surface of the molding part 300 form a vertical direction, the first inner side surface of the first body part 110 is the molding part. It may be formed perpendicular to the back of the (300).

The second body part 120 may directly contact the second side surface S2 of the molding part 300. The second body part 120 may have a length corresponding to that of the molding part 300. For example, the second direction length of the second body part 120 may correspond to the second direction length of the molding part 300. In detail, the length of the second direction of the second body part 120 may correspond to the length of the second direction of the second side surface S2. That is, the lengths of the first body part 110 and the second body part 120 in the second direction may be the same. In addition, the third direction length of the second body portion 120 may correspond to the third direction length of the molding part 300. In detail, the third direction length of the first body part 110 may correspond to the third direction length of the second side surface S2. That is, lengths of the first body part 110 and the second body part 120 in the third direction may be the same. Accordingly, the upper surface of the second body portion 120 may be disposed on the same plane as the upper surface of the molding portion 300.

The second body part 120 may have an inclination angle corresponding to the side surface of the molding part 300. For example, when the second side surface S2 of the molding part 300 and the rear surface of the molding part 300 form a vertical direction, the second inner side surface of the second body part 120 is the molding part. It may be formed perpendicular to the back of the (300). That is, the second inner side surface of the second body portion 120 may have the same inclination angle as the first inner side surface of the first body portion 110. In addition, the distance between the first body portion 110 and the second body portion 120 may be constant. The distance between the first body part 110 and the second body part 120 may be constant without changing even when moving from the rear surface of the molding part 300 to the upper surface direction. That is, the first body portion 110 and the second body portion 120 may be parallel to each other. In detail, the inner surface of the first body portion 110 and the inner surface of the second body portion 120 are perpendicular to the rear surface of the molding portion 300 to form the first body portion 110 and The second body portion 120 may be parallel to each other while maintaining a constant interval.

The width of the body portion 100 may be uniform. For example, the width of the body portion 100 may correspond to the rear region and the upper region. That is, the width of the body portion 100 may be constant without changing toward the upper surface from the rear surface of the body portion 100.

The body portion 100 may be spaced apart from the light emitting device 500. For example, the first body part 110 and the second body part 120 may be spaced apart from the light emitting device 500. In detail, the light emitting device 500 may be spaced apart from the first inner surface of the first body portion 110 by a distance defined by a first distance d1. In addition, the light emitting device 500 may be spaced apart from the second inner side surface of the second body portion 120 by a distance defined by a second distance d2. The first and second intervals d1 and d2 may correspond to the distance between the light emitting device 500 and the first and second side surfaces S1 and S2 of the molding part 300.

The first interval d1 and the second interval d2 may correspond to each other. The first interval d1 and the second interval d2 may be about 15 μm to about 220 μm. In detail, the intervals d1 and d2 may be about 20 μm to about 200 μm. In more detail, the intervals d1 and d2 may be about 30 μm to about 150 μm. When the distances d1 and d2 are less than about 15 μm, the distance between the light emitting device 500 and the body part 100 may be too close to effectively reflect light emitted from the light emitting device 500. When the distances d1 and d2 exceed about 220 μm, the distance between the light emitting device 500 and the body part 100 may be too far, so that the effect of the body part 100 may be insignificant. Therefore, it may be preferable that the first interval d1 and the second interval d2 satisfy the above-described range.

The body portion 100 may include a concave portion 150. The rear surface of the body portion 100 may include a concave portion. The body portion 100 may include a concave portion 150 that is concave in a direction from the rear surface of the body portion 100 toward the upper surface. The concave portion 150 may be located at an upper portion in the vertical direction than the rear surface of the molding portion 300.

The width of the recess 150 may be less than or equal to the width of the body portion 100. In detail, the length of the first direction of the concave portion 150 may be less than or equal to the length of the first direction of the body portion 100.

When the width of the concave portion 150 is smaller than the width of the body portion 100, the end of the concave portion 150 may be disposed on the same line as the rear surface of the body portion 100. Alternatively, when the width of the concave portion 150 is the same as the width of the body portion 100, the end of the concave portion 150 may be disposed on the same line as the end of the molding portion 300.

The length of the second direction of the concave portion 150 may be the same as the length of the second direction of the body portion 100. That is, the concave portion 150 may be formed in the entire rear surface area of the body portion 100. The concave portion 150 may be formed extending in the second direction on the entire rear surface of the body portion 100.

The depth of the recess 150 may be smaller than the height of the light emitting device 500. In addition, the depth of the recess 150 may change as the distance from the light emitting device 500 increases. For example, the depth of the concave portion 150 may increase as the distance from the light emitting device 500 increases. That is, the depth of the concave portion 150 may have a minimum value in the region closest to the light emitting device 500 and the molding portion 300. In addition, the depth of the concave portion 150 may have a maximum value in an edge region farthest from the light emitting device 500 and the molding portion 300.

The depth h1 of the recess 150 may be about 10 μm to about 70 μm. In detail, the depth h1 of the recess 150 may be about 15 μm to about 65 μm. Preferably, the depth of the recess 150 may be about 20㎛ to about 60㎛. When the depth h1 of the recess 150 is less than about 10 μm, the reliability of the light emitting device package 1000 may be reduced, and the depth h1 of the recess 150 may exceed about 70 μm. In this case, the overall volume of the light emitting device package 1000 may increase. Therefore, the depth h1 of the recess 150 preferably satisfies the above-described range.

The recess 150 may include a first recess 151 and a second recess 152. The first concave portion 151 may be provided on the rear surface of the first body portion 110. The first concave portion 151 may be concave in a direction from the rear surface of the first body portion 110 toward the upper surface. In addition, the second concave portion 152 may be provided on the rear surface of the second body portion 120. The second concave portion 152 may be concave in a direction from the rear surface of the second body portion 120 toward the upper surface.

The first concave portion 151 and the second concave portion 152 may have a corresponding shape. For example, the length of the first recess 151 in the first direction may correspond to the length of the second recess 152 in the first direction. In addition, the length of the first concave portion 151 in the second direction may correspond to the length of the second concave portion 152 in the second direction. In addition, the depth of the first recess 151 may correspond to the depth of the second recess 152. Here, the corresponding may mean that the first concave portion 151 and the second concave portion 152 are identical to each other within a range satisfying an error range on a process of forming the concave portion 151.

Alternatively, the first concave portion 151 may have a shape different from that of the second concave portion 152. For example, the length of the first recess 151 in the first direction may correspond to the length of the second recess 152 in the first direction. In addition, the length of the first concave portion 151 in the second direction may correspond to the length of the second concave portion 152 in the second direction. In addition, the depth of the first concave portion 151 may be different from the depth of the second concave portion 152. For example, the depth of the first recess 151 may be deeper than the depth of the second recess 152. That is, the rear surface of the first concave portion 151 may be located above the rear surface of the second concave portion 152 in the vertical direction.

That is, the embodiment can effectively emit the light emitted from the light emitting device 500 to the top. In detail, as the body part 100 reflecting the light is disposed on the side surface of the molding part 300, the light emitted from the light emitting device 500 may be reflected upward. Accordingly, the embodiment can improve the luminous flux of the light emitting device package.

A light emitting device package according to a second embodiment will be described with reference to FIGS. 5 and 6. In the description of the light emitting device package according to the second embodiment, the description of the same or similar components as those of the light emitting device package according to the first embodiment will be omitted, and the same reference numerals will be given to the same and similar components.

5 is a plan view of a light emitting device package 1100 according to the second embodiment, and FIG. 6 is a cross-sectional view taken along line BB ′ of FIG. 5.

5 and 6, the molding part 300 may have a polygonal shape when viewed in a plan view. For example, the molding part 300 may have a rectangular shape. The molding part 300 may include a plurality of side surfaces. For example, the molding part 300 connects a first side surface S1, a second side surface S2 facing the first side surface S1, and the first and second side surfaces S1 and S2. The third side surface S3 and the fourth side surface S4 may be included. Side surfaces S1, S2, S3, and S4 of the molding part 300 may have an inclination angle with respect to the rear surface of the molding part 300.

The first side surface S1 may have a first inclination angle θ1 with respect to the rear surface of the molding part 300, and the second side surface S2 may have a second inclination angle with respect to the rear surface of the molding part 300. may have θ2. In addition, each of the third side surface S3 and the fourth side surface S4 may have a third inclination angle θ3 and a fourth inclination angle θ4 with respect to the rear surface of the molding part 300.

The first inclination angle θ1 may correspond to the second inclination angle θ2. For example, the first inclination angle θ1 and the second inclination angle θ2 may be about 125 degrees to about 145 degrees. In detail, the first and second inclination angles θ1 and θ2 may be about 130 degrees to about 140 degrees. That is, the first side surface S1 and the second side surface S2 may be obtuse angles with respect to the rear surface of the molding part 300. When the first and second inclination angles θ1 and θ2 are less than about 125 degrees or more than about 145 degrees, the efficiency of reflecting light emitted from the light emitting device 500 in an upward direction may be reduced. Accordingly, the first and second inclination angles θ1 and θ2 preferably satisfy the above-described range. In addition, the first inclination angle θ1 and the second inclination angle θ2 may have different inclination angles within the above-described range. For example, although not illustrated, the first inclination angle θ1 may be greater than the second inclination angle θ2.

The third inclination angle θ3 and the fourth inclination angle θ4 may correspond to each other. For example, each of the third tilt angle θ3 and the fourth tilt angle θ4 may be about 90 degrees. That is, the third side surface S3 and the fourth side surface S4 may be perpendicular to the rear surface of the molding part 300.

The distance between the side surface of the molding part 300 and the light emitting device may be the same or different. For example, the distance between the light emitting device 500 and the first side surface S1 of the molding part 300 may correspond to the distance between the light emitting device 500 and the second side surface S2. In addition, the distance between the light emitting device 500 and the third side surface S3 may correspond to the distance between the light emitting device 500 and the fourth side surface S4. In addition, the distance between the light emitting device 500 and the first side surface S1 may be longer or equal to or shorter than the distance between the light emitting device 500 and the third side surface S3. In other words, the distance may vary with the first inclination angle θ1 and the second inclination angle θ2.

The body part 100 may be disposed on a side surface of the molding part 300. The body part 100 may directly contact the side surface of the molding part 300. The body part 100 may include a plurality of body parts disposed on the side surface of the molding part 300. For example, the body portion 100 is disposed on the first body portion 110 and the second side surface S2 of the molding portion 300 disposed on the first side surface S1 of the molding portion 300. It may include a second body portion 120 disposed in. In this case, the third side surface S3 and the fourth side surface S4 of the molding part 300 may be open regions where the body portion 100 is not disposed.

The first body part 110 may directly contact the first side surface S1 of the molding part 300. The first body part 110 may have a length corresponding to the molding part 300. For example, the second direction length of the first body part 110 may correspond to the second direction length of the molding part 300. In detail, the length in the second direction of the first body part 110 may correspond to the length in the second direction of the first side surface S1. In addition, a third direction length of the first body part 110 may correspond to a third direction length of the molding part 300. In detail, the third direction length of the first body part 110 may correspond to the third direction length of the first side surface S1. Accordingly, the upper surface of the first body portion 110 may be disposed on the same plane as the upper surface of the molding portion 300.

The first body part 110 may have an inclination angle corresponding to the side surface of the molding part 300. For example, when the first side surface S1 of the molding part 300 has the first inclination angle θ1, the first inner side surface of the first body part 110 may have the first inclination angle θ1. Can have In detail, the first inner side surface of the first body portion 110 may have a first inclination angle θ1 with respect to the rear surface of the molding portion 300. In addition, the inclination angle between the upper surface of the first body portion 110 and the first inner surface may be an inclination of the first inclination angle θ1, and may have an inclination angle corresponding to the first inclination angle θ1. In addition, the outer surface of the first body portion 110 may be perpendicular to the upper surface of the first body portion 110. Here, the outer surface of the first body portion 110 may be a surface facing the first inner surface.

The second body part 120 may directly contact the second side surface S2 of the molding part 300. The second body part 120 may have a length corresponding to that of the molding part 300. For example, the second direction length of the second body part 120 may correspond to the second direction length of the molding part 300. In detail, the length of the second direction of the second body part 120 may correspond to the length of the second direction of the second side surface S2. In addition, the third direction length of the second body portion 120 may correspond to the third direction length of the molding part 300. In detail, the third direction length of the second body portion 120 may correspond to the third direction length of the second side surface S2. Accordingly, the upper surface of the second body portion 120 may be disposed on the same plane as the upper surface of the molding portion 300.

The second body part 120 may have an inclination angle corresponding to the side surface of the molding part 300. For example, when the second side surface S2 of the molding part 300 has the second inclination angle θ2, the second inner side surface of the second body part 120 may have the second inclination angle θ2. Can have In detail, the second inner side surface of the second body portion 120 may have a second inclination angle θ2 with respect to the rear surface of the molding portion 300. In addition, the inclination angle between the upper surface of the second body portion 120 and the second inner surface may be an inclination of the second inclination angle θ2, and may have an inclination angle corresponding to the second inclination angle θ2. In addition, the outer surface of the second body portion 120 may be perpendicular to the upper surface of the second body portion 120. Here, the outer surface of the second body portion 120 may be a surface facing the second inner surface.

The width of the body portion 100 may vary. For example, the width of the body portion 100 may change from the rear surface of the body portion 100 toward the upper surface direction. In detail, the width of the body portion 100 may be smaller toward the upper surface from the rear surface of the body portion 100.

The first body part 110 and the second body part 120 may be spaced apart from each other. The first body 110 may be spaced apart from the second body 120 by a predetermined distance. An interval between the first body part 110 and the second body part 120 may vary. For example, each of the first body part 110 and the second body part 120 has the above-described inner side surface, and thus, between the first body part 110 and the second body part 120. The interval can increase. In detail, the distance between the first body part 110 and the second body part 120 may increase in an upward direction from the rear surface of the molding part 300.

The body portion 100 may be spaced apart from the light emitting device 500. For example, the first body part 110 and the second body part 120 may be spaced apart from the light emitting device 500. In detail, the light emitting device 500 and the first inner surface may be spaced apart by a distance defined by a first interval d1. In addition, the light emitting device 500 and the second inner surface may be spaced apart by a distance defined by a second interval d2. The first interval d1 and the second interval d2 may correspond to the distance between the first side surface S1 and the second side surface S2 of the molding part 300 in the light emitting device 500. have.

The first interval d1 and the second interval d2 may be about 15 μm to about 220 μm. In detail, the intervals d1 and d2 may be about 20 μm to about 200 μm. In more detail, the intervals d1 and d2 may be about 30 μm to about 150 μm. When the distances d1 and d2 are less than about 15 μm, the distance between the light emitting device 500 and the body part 100 may be too close to effectively reflect light emitted from the light emitting device 500. When the distances d1 and d2 exceed about 220 μm, the distance between the light emitting device 500 and the body part 100 may be too far, so that the effect of the body part 100 may be insignificant. Therefore, it may be preferable that the first interval d1 and the second interval d2 satisfy the above-described range.

The first interval d1 and the second interval d2 may correspond to each other. In detail, the first interval d1 and the second interval d2 may have the same interval as each other within the above-described range. For example, the first interval d1 and the second interval may correspond to each other at the same height (z-axis) from the rear surface of the molding part 300.

Alternatively, the first interval d1 and the second interval d2 may be different from each other. In detail, the first interval d1 and the second interval d2 may have different intervals within the above-described range. For example, although not shown in the drawing, the first interval d1 may be greater than the second interval d2 at the same height (z-axis) in the same vertical direction from the rear surface of the molding part 300. That is, the light emitted from the light emitting device 500 may be biased in a specific direction by adjusting the distance between the light emitting device 500 and the body part 100 and the inclination angle of the body part 100. Therefore, the biased arrangement of the light emitting device can be compensated, thereby improving the light efficiency.

The body portion 100 may include a concave portion 150. The body portion 100 may include a concave portion 150 that is concave in an upward direction from a lower surface of the body portion 100. The depth of the recess 150 may be smaller than the height of the light emitting device 500. In addition, the depth h1 of the concave portion 150 may be deeper as it moves away from the light emitting device 500. For example, the depth h1 of the concave portion 150 may have a minimum value in a region closest to the light emitting device 500 and the molding portion 300. In addition, the depth h1 of the concave portion 150 may have a maximum value at an edge region farthest from the light emitting device 500 and the molding portion 300.

The recess 150 may include a first recess 151 and a second recess 152. The concave portion 150 includes a first concave portion 151 formed on the rear surface of the first body portion 110 and a second concave portion 152 formed on the rear surface of the second body portion 120. can do. The first concave portion 151 may be concave in a direction from the rear surface of the first body portion 110 toward the upper surface. In addition, the second concave portion 152 may be formed of the second body portion 120. The direction from the back toward the top may be concave in the direction. The depth of the first concave portion 151 and the second concave portion 152 may be about 10㎛ to about 70㎛. In detail, the depth h1 of the recess 150 may be about 15 μm to about 65 μm. Preferably, the depth of the recess 150 may be about 20㎛ to about 60㎛. When the depth h1 of the recess 150 is less than about 10 μm, the reliability of the light emitting device package 1100 may be reduced, and the depth h1 of the recess 150 may exceed about 70 μm. In this case, the overall volume of the light emitting device package 1100 may increase. Therefore, the depth h1 of the recess 150 preferably satisfies the above-described range. The first concave portion 151 and the second concave portion 152 may have a corresponding shape. In detail, when the first inclination angle θ1 and the second inclination angle θ2 correspond to each other and the first interval d1 and the second interval d2 correspond to each other, the first concave portion 151 And the second concave portion 152 may have a corresponding shape. Alternatively, when the inclination angles θ1 and θ2 and / or the intervals d1 and d2 are different from each other, the first concave portion 151 and the second concave portion 152 may have different shapes from each other. Can be. In this case, the depths of the first concave portion 151 and the second concave portion 152 may be different from each other.

That is, the embodiment can effectively emit the light emitted from the light emitting device 500 to the top. In detail, the side of the molding part 300 has the above-described inclination angle, and as the body part 100 is disposed at the inclination angle on the side of the molding part 300, the light can be effectively reflected upward. Accordingly, the light output of the light emitting device package can be improved. In addition, the light emitting device package according to the embodiment may have various irradiation angles by controlling the inclination angle.

A light emitting device package according to a third embodiment will be described with reference to FIG. 7. In the description of the light emitting device package according to the third embodiment, the description of the same or similar components to those of the light emitting device packages according to the first and second embodiments described above will be omitted, and the same reference numerals will be given to the same and similar components.

7 is a cross-sectional view of a light emitting device package 1200 according to the third embodiment. Referring to FIG. 7, the molding part 300 may have a polygonal shape when viewed in a plan view. For example, the molding part 300 may have a rectangular shape. The height of the molding part 300 may be higher than the height of the body part 100. In detail, the third direction length of the molding part 300 may be longer than the third direction length of the body part 100. Accordingly, the upper surface of the molding part 300 may be located above the upper surface of the body portion 100 in the vertical direction.

In addition, the molding part 300 may be disposed on an upper surface of the body part 100. The molding part 300 may directly contact the upper surface of the body part 100. The molding part 300 may directly contact the entire upper surface area of the body part 100. Side surfaces of the molding part 300 may be disposed on the same plane as the outer surface of the body portion 100. In addition, the upper surface of the molding part 300 may be parallel to the upper surface of the body portion (100).

The molding part 300 may include a side surface corresponding to the body part 100. For example, the molding part 300 may include a first side face S1 facing the first body part 110 and a second side face S2 facing the second body part 120. have.

The first side surface S1 may have a shape corresponding to the first body portion 110. In detail, the first side surface S1 may have a shape corresponding to the first inner side surface of the first body portion 110 facing the first side surface S1. The first side surface S1 may have a planar area corresponding to the first inner surface. The first side surface S1 may directly contact the first inner surface.

The second side surface S2 may have a shape corresponding to the second body portion 120. In detail, the second side surface S2 may have a shape corresponding to the second inner side surface of the second body portion 120 facing the second side surface S2. The second side surface S2 may have a planar area corresponding to the second inner side surface. The second side surface S2 may directly contact the second inner side surface.

The body portion 100 may include a concave portion 150 that is concave in an upward direction from a lower surface of the body portion 100. The depth h1 of the concave portion 150 may be deeper as it moves away from the light emitting device 500. For example, the depth h1 of the concave portion 150 may have a minimum value in a region closest to the light emitting device 500 and the molding portion 300. In addition, the depth h1 of the concave portion 150 may have a maximum value at an edge region farthest from the light emitting device 500 and the molding portion 300.

The recess 150 may include a first recess 151 and a second recess 152. The concave portion 150 includes a first concave portion 151 formed on the rear surface of the first body portion 110 and a second concave portion 152 formed on the rear surface of the second body portion 120. can do. The first concave portion 151 may be concave in a direction from the rear surface of the first body portion 110 toward the upper surface. In addition, the second concave portion 152 may be concave in a direction from the rear surface of the second body portion 120 toward the upper surface. The depth of the first concave portion 151 and the second concave portion 152 may be about 10㎛ to about 70㎛. In detail, the depth h1 of the recess 150 may be about 15 μm to about 65 μm. Preferably, the depth of the recess 150 may be about 20㎛ to about 60㎛. When the depth h1 of the recess 150 is less than about 10 μm, the reliability of the light emitting device package 1200 may be reduced, and the depth h1 of the recess 150 may exceed about 70 μm. In this case, the overall volume of the light emitting device package 1200 may increase. Therefore, the depth h1 of the recess 150 preferably satisfies the above-described range.

That is, the embodiment can effectively emit the light emitted from the light emitting device 500 to the top. In detail, the side surface of the molding part 300 has the inclination angle described above, and as the body part 100 is disposed on the side surface of the molding part 300, light may be effectively reflected. In addition, the molding part 300 including the wavelength conversion means may be further disposed on the body portion 100. Accordingly, the light output of the light emitting device package can be improved.

A light emitting device package according to a fourth embodiment will be described with reference to FIG. 8. In the description of the light emitting device package according to the fourth embodiment, the description of the same or similar components to those of the light emitting device packages according to the first to third embodiments will be omitted, and the same reference numerals are assigned to the same or similar components.

8 is a cross-sectional view of a light emitting device package 1300 according to the fourth embodiment. Referring to FIG. 8, the molding part 300 may have a polygonal shape when viewed in a plan view. For example, the molding part 300 may have a rectangular shape. The height of the molding part 300 may be higher than the height of the body part 100. In detail, the third direction length of the molding part 300 may be longer than the third direction length of the body part 100. Accordingly, the upper surface of the molding part 300 may be located above the upper surface of the body portion 100 in the vertical direction.

In addition, the molding part 300 may be disposed on an upper surface of the body part 100. The molding part 300 may directly contact the upper surface of the body part 100. The molding part 300 may directly contact the entire upper surface area of the body part 100. Side surfaces of the molding part 300 may be disposed on the same plane as the outer surface of the body portion 100.

The upper surface of the body portion 100 may be inclined with respect to the upper surface of the molding portion 300. In detail, the upper surface of the first body portion 110 may have a first inner side surface and a fifth inclination angle θ5 of the first body portion 110. In addition, an upper surface of the second body portion 120 may have a second inner side surface and a fifth inclination angle θ5 of the second body portion 120.

That is, the rear surface of the molding part 300 and the first side surface S1 of the molding part 300 may have a first inclination angle θ1, and the first inner surface of the first body part 110 may be formed. The upper surface of the first body portion 110 may have a fifth inclination angle. In addition, the rear surface of the molding part 300 and the second side surface S2 of the molding part 300 may have a second inclination angle θ2, and a second inner side surface of the second body part 120. The upper surface of the second body portion 120 may have a fifth inclination angle.

The fifth inclination angle θ5 may be greater than the inclination angle between the rear surface and the side surface of the molding part 300. For example, the fifth inclination angle θ5 may be greater than the first inclination angle θ1 and the second inclination angle θ2. Accordingly, the upper surface of the body portion 100 may not be parallel to the upper surface of the molding portion 300. In addition, the distance between the upper surface of the body portion 100 and the upper surface of the molding portion 300 may be closer to the edge region of the light emitting device.

The body portion 100 may include a concave portion 150 that is concave in an upward direction from a lower surface of the body portion 100. The depth h1 of the concave portion 150 may be deeper as it moves away from the light emitting device 500. For example, the depth h1 of the concave portion 150 may have a minimum value in a region closest to the light emitting device 500 and the molding portion 300. In addition, the depth h1 of the concave portion 150 may have a maximum value at an edge region farthest from the light emitting device 500 and the molding portion 300.

The recess 150 may include a first recess 151 and a second recess 152. The concave portion 150 includes a first concave portion 151 formed on the rear surface of the first body portion 110 and a second concave portion 152 formed on the rear surface of the second body portion 120. can do. The first concave portion 151 may be concave in a direction from the rear surface of the first body portion 110 toward the upper surface. In addition, the second concave portion 152 may be concave in a direction from the rear surface of the second body portion 120 toward the upper surface. The depth of the first concave portion 151 and the second concave portion 152 may be about 10㎛ to about 70㎛. In detail, the depth h1 of the recess 150 may be about 15 μm to about 65 μm. Preferably, the depth of the recess 150 may be about 20㎛ to about 60㎛. When the depth h1 of the recess 150 is less than about 10 μm, the reliability of the light emitting device package 1300 may be reduced, and the depth h1 of the recess 150 may exceed about 70 μm. In this case, the overall volume of the light emitting device package 1300 may increase. Therefore, the depth h1 of the recess 150 preferably satisfies the above-described range.

Accordingly, the light emitting device package 1300 according to the embodiment may emit light at various angles. In detail, the light emitted from the light emitting device 500 may be effectively emitted upward. In addition, as the upper surface of the body portion 100 has a fifth inclination angle θ5, the irradiation angle of the light emitting device 500 may be widened and light may be emitted at various angles.

A light emitting device package according to a fifth embodiment will be described with reference to FIGS. 9 through 11. In the description of the light emitting device package according to the fifth embodiment, the description of the same or similar components as those of the light emitting device packages according to the first to fourth embodiments will be omitted, and the same reference numerals are assigned to the same or similar components.

9 is an exploded perspective view of the light emitting device package 1400 according to the fifth embodiment, and FIGS. 10 and 11 are plan views of the light emitting device package 1400 according to the fifth embodiment.

9 to 11, the molding part 300 may have a polygonal shape when viewed in a plan view. For example, the molding part 300 may have a rectangular shape. The molding part 300 may include a plurality of side surfaces. For example, the molding part 300 connects a first side surface S1, a second side surface S2 facing the first side surface S1, and the first and second side surfaces S1 and S2. The third side surface S3 and the fourth side surface S4 may be included. The first side surface S1 and the second side surface S2 may be sides facing in the first direction, and the third side surface S3 and the fourth side surface S4 may face in the second direction. Can be.

Side surfaces S1, S2, S3, and S4 of the molding part 300 may have an inclination angle with respect to the rear surface of the molding part 300. In detail, the first side surface S1 may have a first inclination angle θ1 with respect to the rear surface of the molding part 300, and the second side surface S2 may be formed with respect to the rear surface of the molding part 300. It may have two inclination angles θ2. In addition, each of the third side surface S3 and the fourth side surface S4 may have a third inclination angle θ3 and a fourth inclination angle θ4 with respect to the rear surface of the molding part 300.

The body part 100 may be disposed on a side surface of the molding part 300. The body part 100 may directly contact the side surface of the molding part 300. The inner side surface of the body portion 100 in direct contact with the side surface of the molding part 300 may have the same planar area as the side surface of the molding part 300.

The body part 100 may include a plurality of body parts respectively disposed on the side surfaces of the molding part 300. For example, the body portion 100 may include a first body portion 110 disposed on the first side surface S1, a second body portion 120 disposed on the second side surface S2, and It may include a third body portion 130 disposed on the third side surface S3 and a fourth body portion 140 disposed on the fourth side surface S4. The first to fourth body parts 110, 120, 130, and 140 may be integrally formed.

Referring to FIG. 10, the first to fourth inclination angles θ1, θ2, θ3, and θ4 may correspond to each other. For example, each of the first to fourth inclination angles θ1, θ2, θ3, and θ4 may be about 90 degrees. That is, the first to fourth side surfaces S1, S2, S3, and S4 may be perpendicular to the rear surface of the molding part 300.

The body part 100 may have an inclination angle corresponding to the side surface of the molding part 300. In detail, the inner surface of the body portion 100 may have an inclination angle corresponding to the side surface of the molding portion 300. That is, the inner surface of the body portion 100 may be perpendicular to the rear surface of the molding portion 300.

The distance between the first body part 110 and the second body part 120 may be longer than or equal to the distance between the third body part 130 and the fourth body part 140. For example, if the length of the first direction of the light emitting device 500 is longer than the length of the second direction, the distance between the first body portion 110 and the second body portion 120 is the third It may be longer than the distance between the body portion 130 and the fourth body portion 140.

In addition, referring to FIG. 11, the first to fourth inclination angles θ1, θ2, θ3, and θ4 of the molding part 300 may be obtuse angles. In this case, the first to fourth inclination angles θ1, θ2, θ3, and θ4 may correspond to each other.

The body part 100 may have an inclination angle corresponding to the side surface of the molding part 300. In detail, the inner surface of the body portion 100 may have an inclination angle corresponding to the side surface of the molding portion 300. Accordingly, the inclination angles between the upper and inner surfaces of the first to fourth body parts 140 may correspond to each other.

Alternatively, the first inclination angle θ1 may correspond to the second inclination angle θ2, and the third inclination angle θ3 and the fourth inclination angle θ4 may correspond to each other. In this case, the third inclination angle θ3 and the fourth inclination angle θ4 may be different from the first inclination angle θ1 and the second inclination angle θ2. Accordingly, the body parts facing each other may have inclination angles corresponding to each other, and the inclination parts not facing each other may have different inclination angles. For example, when the distance between the light emitting device 500 and the first body portion 110 is smaller than the distance between the light emitting device 500 and the third body portion 130, the first inclination angle ( θ1 may be greater than the third inclination angle θ3. Accordingly, the light emitted from the light emitting device 500 can be effectively reflected upward, thereby improving luminous efficiency.

In addition, the body portion 100 may include a concave portion. The recess may be provided on the rear surface of the body portion 100. The concave portion may be concave in a direction from the rear surface of the body portion 100 toward the upper surface. For example, a first concave portion may be provided on a rear surface of the first body portion 110, and the first concave portion may be concave in a direction from the rear surface of the first body portion 110 toward the upper surface. A second concave portion may be provided on a rear surface of the second body portion 120, and the second concave portion may be concave in a direction from the rear surface of the second body portion 120 toward the upper surface. A third recess may be provided on a rear surface of the third body portion 130, and the third recess may be recessed in a direction from the rear surface of the third body portion 130 toward the upper surface. A fourth concave portion may be provided on the rear surface of the fourth body portion 140, and the fourth concave portion may be concave in a direction toward the upper surface from the rear surface of the fourth body portion 140.

The depth of the first to fourth concave portions may become deeper as the distance from the light emitting device 500 increases. In addition, a depth of each of the first to fourth recesses may have a minimum value in a region closest to the molding part 300.

The depth of the first to fourth recesses may be about 10 μm to about 70 μm. In detail, the depth of the recess may be about 15 μm to about 65 μm. Preferably, the depth of the recess may be about 20㎛ to about 60㎛. If the depth of the recess is less than about 10㎛ the reliability of the light emitting device package 1400 may be lowered, and if the depth of the recess exceeds about 70㎛ the overall volume of the light emitting device package 1400 may increase Can be. Therefore, the depth of the recess preferably satisfies the above-described range.

Accordingly, the light emitting device package according to the embodiment can effectively emit the light emitted from the light emitting device 500 by the first to fourth body portion. In addition, when the light emitting device package is disposed on the circuit board, the light emitting device package may be prevented from being tilted by the first to fourth concave portions, and the coupling force with the circuit board may be improved. .

A light emitting device package according to a sixth embodiment will be described with reference to FIG. 12. In the description of the light emitting device package according to the sixth embodiment, the description of the same or similar components to those of the light emitting device packages according to the first to fifth embodiments will be omitted, and the same reference numerals will be given to the same or similar components.

12 is a plan view of a light emitting device package according to a sixth embodiment. Referring to FIG. 12, the molding part 300 may be circular when viewed in a plan view. The molding part 300 may be disposed to surround the light emitting device 500. The molding part 300 may be disposed to surround the top and side surfaces of the light emitting device 500.

Side surfaces of the molding part 300 may include a plurality of regions. For example, side surfaces of the molding part 300 are first and second regions R1 and R2 at positions corresponding to the first and second side surfaces facing each other in the first direction in the light emitting device 500, respectively. ) May be included. In addition, side surfaces of the molding part 300 may include third and fourth regions R3 and R4 at positions corresponding to the third and fourth sides facing each other in the second direction in the light emitting device 500, respectively. It may include. Here, the first to fourth regions R1, R2, R3, and R4 may be regions corresponding to four fan-shaped arcs having a central angle of 90 degrees when the molding portion 300 is viewed in a plan view.

The side surface of the molding part 300 may be inclined with respect to the rear surface of the molding part 300. For example, the side surface of the molding part 300 may have an angle of inclination with respect to the rear surface of the molding part 300 and the angle of inclination may be about 125 degrees to about 145 degrees.

The body part 100 may be disposed on a side surface of the molding part 300. For example, the body portion 100 may be disposed on the first to fourth regions R1, R2, R3, and R4. In detail, the body portion 100 includes a first body portion 110 disposed on the first region R1, a second body portion 120 disposed on the second region R2, and the third portion. It may include a third body portion 130 disposed on the region (R3) and a fourth body portion 140 disposed on the fourth region (R4). The first to fourth body parts 110, 120, 130, and 140 may be integrally formed to surround side surfaces of the molding part 300. In detail, when viewed in a plan view, the body part 100 may have a circular shape and may be disposed to surround the entire side surface of the molding part 300. The upper surface of the body portion 100 may be disposed on the same plane as the upper surface of the body portion 100.

In addition, the inner surface of the body portion 100 may be in contact with the side surface of the molding portion (300). Accordingly, the inner surface of the body portion 100 may have an inclination angle with the rear surface of the molding portion 300. That is, the inner surface of the body portion 100 may have an inclination angle corresponding to the side surface of the molding portion 300, the inclination angle may be about 125 degrees to about 145 degrees. In detail, the inclination angle may be about 130 degrees to about 140 degrees. When the inclination angle is less than about 125 degrees or more than about 145 degrees, the efficiency of reflecting light emitted from the light emitting device 500 in an upward direction may be deteriorated. Therefore, the inclination angle preferably satisfies the above-described range.

The body portion 100 may be spaced apart from the light emitting device 500. An interval between the body part 100 and the light emitting device 500 may be about 15 μm to about 220 μm. In detail, the interval may be about 20 μm to about 200 μm. In more detail, the interval may be about 30 μm to about 150 μm. When the spacing is less than about 15 μm, the spacing between the light emitting device 500 and the body part 100 may be too close to effectively reflect light emitted from the light emitting device 500, and the spacing may be about 220. When the thickness exceeds the distance between the light emitting device 500 and the body portion 100 is too far, the effect of the body portion 100 may be insignificant. Therefore, it may be preferable that the interval satisfies the above-described range.

In addition, although not shown in the drawings, the back of the body portion 100 may include the above-mentioned concave portion. In this case, the depth of the concave portion may be deeper as it moves away from the light emitting device, and may have the above-described depth.

Therefore, the embodiment can effectively reflect the light emitted from the light emitting device 500 upwards. Accordingly, the light output of the light emitting device package can be improved. In addition, light can be emitted at various irradiation angles.

FIG. 13 is a diagram illustrating an example of a module in which a light emitting device package is disposed on a circuit board.

Referring to FIG. 13, in the light source module according to the embodiment, one or more light emitting devices may be disposed on the circuit board 700.

The light emitting device package may be disposed on the circuit board 700. The circuit board 700 may be provided with a power supply circuit for controlling the driving of the light emitting device 500.

The circuit board 700 may be a printed circuit board (PCB). The circuit board 700 may include at least one of a resin PCB, a metal core PCB (MCPCB, a metal core PCB), a flexible PCB (FPCB, flexible PCB), a rigid PCB, a ceramic, and an epoxy molding compound (EMC). It may also include. For example, the circuit board 700 may be an epoxy molding compound (EMC) including carbon. Accordingly, the circuit board 700 may be black and rigidity may be improved by the carbon.

The circuit board 700 may include an insulating layer or a protective layer on a resin or metal base layer, and may include a plurality of pads exposed from the insulating layer or the protective layer. The pad may electrically connect one or a plurality of light emitting device packages, and may connect the protection device 600 disposed on the circuit board 700. The insulating layer or the protective layer may be a solder resist material or a resin material.

The pad may include at least one material selected from the group consisting of Ti, Cu, Ni, Au, Cr, Ta, Pt, Sn, Ag, P, Fe, Sn, Zn, Al, or an alloy thereof.

The pad may include a first pad 711 and a second pad 712. The pad may include a first pad 711 and a second pad 712 spaced apart from each other. The first pad 711 may be disposed at a position corresponding to the first bonding portion 510 in a vertical direction (third direction). The second pad 712 may be disposed at a position corresponding to the second bonding part 520 in a vertical direction (third direction).

The first pad 711 may be electrically connected to the first bonding part 510, and the second pad 712 may be electrically connected to the second bonding part 520. In addition, a first conductive portion 731 may be disposed between the first pad 711 and the first bonding portion 510, and may be disposed between the second pad 712 and the second bonding portion 520. The second conductive portion 732 may be disposed.

The first and second conductive parts 731 and 732 are made of a liquid material and are positioned on the first pad 711 and the second pad 712 of the circuit board 700 and then the circuit board 700. The light emitting device 500 aligned on the () is combined.

The protection device 600 may be further disposed on the circuit board 700. The protection device 600 may be spaced apart from the light emitting device package. The protection device 600 may be disposed adjacent to the light emitting device package. The protection device 600 may be disposed by flip bonding to the circuit board 700. The protection device 600 may be disposed on the third pad 713 of the circuit board 700. The protection device 600 may be disposed at a position corresponding to the third pad 713 in a vertical direction. The third pad 713 may include the same material as the first and second pads 711 and 712. A third conductive part 733 may be disposed between the third pad 713 and the protection device 600. The third conductive portion 733 may include the same material as the first and second conductive portions 731 and 732.

The protection device 600 may include at least one of a thyristor, a zener diode, a transient voltage suppression (TVS), and the like. The protection device 600 may protect the light emitting device 500 from an electro static discharge (ESD). The protection device 600 may be connected to the connection circuit of the light emitting device 500 in parallel to protect the light emitting device 500.

The first resin 200 may be disposed on the protection device 600. The first resin 200 is polyphthalamide (PPA), polychloro triphenyl (PCT), liquid crystal polymer (LCP), polyamide 9T (PA9T), silicone, epoxy, epoxy molding compound (EMC) , At least one selected from the group consisting of silicon molding compound (SMC), ceramic, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ), and the like. In addition, when the first resin 200 includes a reflective function, the first resin 200 may include white silicone. In addition, the first resin 200 may include the same material as the body portion 100.

The first resin 200 may be disposed to surround the protective device 600. The first resin 200 may be disposed to surround the upper surface of the circuit board 700 and the exposed surface of the protection device 600. For example, the first resin 200 may be disposed to surround upper and side surfaces of the protective device 600. Accordingly, the protection device 600 may be sealed by the first resin 200 and may be embedded in the first resin 200. That is, since the first resin 200 surrounds the protective device 600 with the material of the body part 100, the light of the light emitting device 500 is reduced by the protective device 600. Can be.

In addition, the upper surface of the first resin 200 may be disposed on the same plane as the upper surface of the body portion 100 and the molding portion 300. Accordingly, the light emitted from the light emitting device 500 can be effectively reflected upward.

In addition, the first resin 200 may include a first sub resin 210. In detail, the first resin 200 may further include a first sub resin 210 disposed in the recess 150 of the light emitting device package. For example, when the protection device 600 is disposed in parallel with the first body part 110, the first resin 200 may be disposed in parallel with the first body part 110. The first resin 200 may directly contact the first body portion 110. In addition, the first sub resin 210 may be disposed in the first recess 151. The first sub resin 210 may directly contact a partial region or the entire region of the first recess 151. In addition, the first sub resin 210 may have a length in a first direction (x-axis) longer than a length in a first direction of the first body part 110. Accordingly, the first sub resin 210 may directly contact the rear surface of the molding part 300 and the upper surface of the circuit board 700.

That is, the first resin 200 may include the same material as the body portion 100 and may be firmly coupled to the body portion 100. In addition, the first resin 200 may include a first sub resin 210 disposed on the recess 150, and the first sub resin 210 may be a part of the recess 150. Alternatively, the light emitting device package may be prevented from being tilted as it is disposed in the entire area, and may be firmly coupled to the circuit board 700. In addition, the first sub resin 210 may be disposed on the rear surface of the molding part 300 to reflect light emitted from the light emitting device 500 in an upward direction, thereby improving light efficiency. .

In addition, although not shown in the drawing, it may further include a second resin disposed in parallel with the second body portion 120, the second resin and the partial region or the entire region of the second recessed portion 152 and It may further include a second sub resin in direct contact.

In addition, although not shown in the drawings, when the body portion 100 includes the first to fourth body portions 140 as in the fifth embodiment, a third resin disposed side by side with the third body portion 130. And a fourth resin disposed side by side with the fourth body portion 140. In addition, the third resin may further include a third sub resin contacting the partial region or the entire region of the third recessed portion 150, and the fourth resin may be a part of the fourth recessed portion 150. It may further include a fourth sub resin in contact with the region or the entire region. Accordingly, the light emitting device package may be prevented from being tilted and may be firmly coupled to the circuit board 700. In addition, the first to fourth sub resins may be disposed on the rear surface of the molding part 300 through the recesses to effectively reflect the light emitted from the light emitting device 500 in the upper direction.

14 is a side sectional view showing an example of a light emitting device according to the embodiment.

Referring to FIG. 14, the light emitting device 500 conceptually illustrates only a relative arrangement relationship between the first electrode 550 and the second electrode 570. The first electrode 550 may include a first bonding part 551 and a first branch electrode 553. The second electrode 570 may include a second bonding part 571 and a second branch electrode 573. The first bonding part 551 may correspond to the first bonding part 510 described above, and the second bonding part 571 may correspond to the second bonding part 520 described above.

The light emitting device 500 may include a light emitting structure 520 disposed on the substrate 501. The substrate 501 may be formed of an insulating material or a semiconductor material as a light transmitting layer. The substrate 501 may be selected from a group including sapphire substrate (Al ₂ O ₃ ), SiC, GaAs, GaN, ZnO, Si, GaP, InP, Ge. For example, the substrate 501 may be provided as a patterned sapphire substrate (PSS) having an uneven pattern formed on an upper surface thereof.

The light emitting structure 520 may include a compound semiconductor. The light emitting structure 520 may be provided as, for example, a Group 2-6 or Group 3-5 compound semiconductor. For example, the light emitting structure 520 includes at least two elements selected from aluminum (Al), gallium (Ga), indium (In), phosphorus (P), arsenic (As), and nitrogen (N). Can be provided.

The light emitting structure 520 may include a first conductive semiconductor layer 521, an active layer 522, and a second conductive semiconductor layer 523. The active layer 522 may be disposed between the first conductivity type semiconductor layer 521 and the second conductivity type semiconductor layer 523. For example, the active layer 522 may be disposed on the first conductive semiconductor layer 521, and the second conductive semiconductor layer 523 may be disposed on the active layer 522.

The first conductivity-type semiconductor layer 521 and the second conductivity-type semiconductor layer 523 may be implemented as at least one of a compound semiconductor of Group 3-Group 5 or Group 2-6. The first and second conductivity-type semiconductor layers are formed of a semiconductor material having, for example, a composition formula of In _x Al _y Ga _1-xy N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ x + y ≦ 1). Can be. For example, the first conductive semiconductor layer 521 and the second conductive semiconductor layer 523 include GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, and the like. It may include at least one selected from the group. The first conductive semiconductor layer 521 may be an n-type semiconductor layer doped with an n-type dopant such as Si, Ge, Sn, Se, or Te. The second conductive semiconductor layer 523 may be a p-type semiconductor layer doped with p-type dopants such as Mg, Zn, Ca, Sr, and Ba. Alternatively, the first conductivity type semiconductor layer 521 may be provided as a p-type semiconductor layer, and the second conductivity type semiconductor layer 523 may be provided as an n-type semiconductor layer.

The active layer 522 may be implemented with a compound semiconductor. The active layer 522 may be implemented by at least one of compound semiconductors of Groups 3-5 or 2-6, for example. When the active layer 522 has a multi-well structure, the active layer 522 may include a plurality of well layers and a plurality of barrier layers that are alternately arranged, and In _x Al _y Ga _1-xy N (0 It can be arranged in a semiconductor material having a composition formula of ≤ x ≤ 1, 0 ≤ y ≤ 1, 0 ≤ x + y ≤ 1). For example, the active layer 522 includes InGaN / GaN, GaN / AlGaN, AlGaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, AlGaAs / GaAs, InGaAs / GaAs, InGaP / GaP, AlInGaP / InGaP, InP / GaAs. It may include at least one selected from the group.

The first electrode 550 may be electrically connected to the second conductivity type semiconductor layer 523. The first branch electrode 553 may be branched from the first bonding part 551. The first branch electrode 553 may include a plurality of branch electrodes branched from the first bonding part 551. The second electrode 570 may include a second bonding part 571 and a second branch electrode 573. The second electrode 570 may be electrically connected to the first conductivity type semiconductor layer 521. The second branch electrode 573 may be branched from the second bonding part 571. The second branch electrode 573 may include a plurality of branch electrodes branched from the second bonding part 571.

The first branch electrode 553 and the second branch electrode 573 may be alternately arranged in a finger shape. Power supplied through the first bonding portion 551 and the second bonding portion 571 by the first branch electrode 553 and the second branch electrode 573 to the entire light emitting structure 520. It can be spread and provided.

The first electrode 550 and the second electrode 570 may be formed in a single layer or a multilayer structure. For example, the first electrode 550 and the second electrode 570 may be ohmic electrodes. For example, the first electrode 550 and the second electrode 570 are ZnO, IrO _x , RuO _x , NiO, RuO _x / ITO, Ni / IrO _x / Au, and Ni / IrO _x / Au / It may be an alloy of at least one of ITO, Ag, Ni, Cr, Ti, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf or two or more of these materials.

Meanwhile, a protective layer may be further provided on the light emitting structure 520. The protective layer may be provided on an upper surface of the light emitting structure 520. In addition, the protective layer may be provided on the side surface of the light emitting structure 520. The protective layer may be provided to expose the first bonding portion 551 and the second bonding portion 571. In addition, the protective layer may be selectively provided on the circumference and the lower surface of the substrate 501. For example, the protective layer may be provided as an insulating material. For example, the protective layer may be formed of at least one material selected from the group comprising Si _x O _y , SiO _x N _y , Si _x N _y , and Al _x O _y .

In the light emitting device 500 according to the embodiment, the light generated by the active layer 522 may emit light in six surface directions of the light emitting device. Light generated by the active layer 522 may be emitted in six surface directions through the top, bottom, and four side surfaces of the light emitting device.

The light emitting device 500 has been described as having a light emitting cell. When the light emitting cell includes the light emitting structure, the driving voltage of the light emitting device may be a voltage applied to one light emitting cell. As an example of the light emitting device 500 according to the embodiment, it may include a light emitting device having two or three or more light emitting cells. Accordingly, a high voltage light emitting device package can be provided.

15 to 20 are views illustrating a method of manufacturing a light emitting device package according to an embodiment.

15 to 20, a method of manufacturing a light emitting device package according to an embodiment may include disposing a light emitting device 500, forming a molding part 300, forming a pattern P, and a body. It may include forming a portion (100).

First, referring to FIG. 15, the disposing of the light emitting device 500 may include disposing at least one light emitting device 500 on the first support sheet 10. For example, the first support sheet 10 may include silicon (Si) and may be an adhesive film for fixing the light emitting device 500. In the disposing of the light emitting device 500, the light emitting device 500 may include a first bonding part 510 and a second bonding part 520 facing the first support sheet 10. In addition, the first bonding portion 510 and the second bonding portion 520 may be inserted and disposed from the surface of the first support sheet 10. In detail, a surface of the first support sheet 10 may have a recess formed by the pressure of the first and second bonding parts 510 and 520 protruding from the light emitting device 500. And the second bonding portions 510 and 520 may be disposed in the concave portion. Accordingly, the back surface of the light emitting device 500 may be disposed on the same plane as the top surface of the first support sheet 10.

Subsequently, the forming of the molding part 300 may be performed. The forming of the molding part 300 may be a step of forming the molding part 300 on the first support sheet 10 and the light emitting device 500. The molding part 300 may be formed to surround the top and side surfaces of the light emitting device 500.

The molding part 300 may include an insulating material. In addition, the molding part 300 may include wavelength conversion means for receiving the light emitted from the light emitting device 500 and providing the wavelength-converted light. For example, the molding part 300 may include at least one wavelength converting means selected from the group including phosphors, quantum dots, and the like.

After forming the molding part 300, the first support sheet 10 may be removed. Accordingly, the molding part 300 may not be formed on the first bonding part 510 and the second bonding part 520, and may be formed on the rear surface of the light emitting device 500 and the first and second parts. The bonding parts 510 and 520 may be exposed to the outside. In addition, the step of hardening the molding part 300 may be further performed after the forming of the molding part 300.

Subsequently, the step of forming the pattern P may proceed. 16 to 18, the forming of the pattern P may be a step of forming the pattern P in the molding part 300. The preliminary light emitting device manufactured by forming the molding part 300 may be disposed on the second support sheet 20. The second support sheet 20 may include silicon (Si) and may be an adhesive film for fixing the light emitting device 500 and the molding part 300. The upper surface of the molding part 300 may be disposed to face the upper surface of the second support sheet 20. That is, the upper and lower surfaces of the preliminary light emitting device package may be inverted and disposed on the second support sheet 20.

In the forming of the pattern P, a pattern P may be formed in the molding part 300. The forming of the pattern P may be a step of forming the pattern P in one direction. In detail, the step may be a step of forming the pattern (P) in one direction to form the body portion 100 to be described later on the two sides of the molding portion 300 as in the first to fourth embodiments. In addition, the forming of the pattern P may be a step of forming the pattern P in one direction and the other direction perpendicular to the one direction. In detail, the step may be a step of forming the pattern (P) in one direction and the other direction to form the body portion 100 to be described later on the four sides of the molding portion 300 as in the fifth embodiment.

The step may be a step of physically forming a pattern P on the molding part 300 using a blade or the like. At this time, the end of the blade may have a variety of forms. In addition, the pattern P may be formed at various depths through the blade. For example, the end of the blade may be straight in cross section. In addition, the depth of the pattern P may correspond to the thickness of the molding part 300. Accordingly, the side surface of the molding part 300 may be perpendicular to the rear surface of the molding part 300 as in the first embodiment of FIG. 4. As another example, the end of the blade may be V-shaped in cross section. In addition, the depth of the pattern P may correspond to the thickness of the molding part 300. Accordingly, the side surface of the molding part 300 may form an angle with the rear surface of the molding part 300 as in the second embodiment of FIG. 6. As another example, an end of the blade may be V-shaped, and the depth of the pattern P may be smaller than the thickness of the molding part 300. Accordingly, the side surface of the molding part 300 may form an angle with the rear surface of the molding part 300 as in the third embodiment of FIG. 7, and may cover the top surface of the body part 100. As another example, the end of the blade may be V-shaped in cross section. In addition, the depth of the pattern P may be smaller than the thickness of the molding part 300. At this time, the end of the blade may be a plurality of V-shaped cross-section having different angles. Accordingly, the side surface of the molding part 300 may have a plurality of inclination angles as in the fourth embodiment of FIG. 8, and may be disposed covering the upper surface of the body part 100.

Subsequently, the forming of the body part 100 may be performed. Referring to FIG. 19, the forming of the body part 100 may be a step of filling the body part 100 in the pattern P. Referring to FIG.

The body portion 100 may include a resin material or an insulating resin material. The body portion 100 may be a white material. For example, when the body part is a white material, the body part 100 may include white silicone. When the body part 100 is made of a white material, the light emitted from the light emitting device 500 may be reflected, thereby improving light reflection efficiency. In addition, the body portion 100 may include a filler of a high refractive material such as TiO 2 and SiO 2 therein.

In addition, a concave portion 150 may be formed on an upper surface of the body portion 100 in the forming of the body portion 100. For example, the concave portion 150 may be formed on the upper surface of the body portion 100 in a direction toward the rear surface from the upper surface of the body portion 100. The depth h1 of the recess 150 may be about 10 μm to about 70 μm. In detail, the depth h1 of the recess 150 may be about 15 μm to about 65 μm. Preferably, the depth of the recess 150 may be about 20㎛ to about 60㎛. When the depth h1 of the recess 150 is less than about 10 μm, the reliability of the light emitting device package may be lowered. When the depth h1 of the recess 150 exceeds about 70 μm, the light emission is performed. The overall volume of the device package can be increased. Therefore, the depth h1 of the recess 150 preferably satisfies the above-described range. After forming the body portion 100, the step of curing the body portion 100 may be further performed.

Subsequently, the cutting of the body portion 100 may proceed. Referring to FIG. 20, before the cutting of the body part 100, the second support sheet 20 may be removed, and the preliminary light emitting device package may be disposed on the third support sheet by inverting an upper surface and a lower surface thereof. Can be. Thereafter, the body portion 100 may be cut along the cutting line C / L. Accordingly, the plurality of light emitting device packages may be manufactured. Alternatively, although not shown in the drawing, the cutting step may be directly cut without removing the second support sheet 20 and vertically inverting the preliminary light emitting device package, thereby manufacturing a plurality of light emitting device packages. That is, in the state of FIG. 19, cutting may be performed by adding the cutting line C / L of FIG. 20 to manufacture a plurality of light emitting device packages.

That is, the embodiment may simultaneously manufacture a plurality of light emitting device packages including the body part 100. In addition, the distance and angle of the body portion can be easily adjusted during the process to improve the luminous flux of the light emitting device package. In addition, by simplifying the manufacturing process of the light emitting device package it is possible to reduce the overall manufacturing time and cost of the package and to improve the process efficiency.

Through the following examples and comparative examples will be described in more detail the operation and effect of the present invention.

Example 1

A molding part surrounding the light emitting device was formed on the light emitting device by the above-described manufacturing method. At this time, the molding part was formed to have a rectangular shape when viewed in plan. Subsequently, a first body portion and a second body portion were formed on the first side and the second side of the molding part. On the third side and the fourth side of the molding part, the body part was formed as an open area without forming a body part.

In this case, the first side of the molding part is formed to have an inclination angle (first inclination angle) of about 138.1 degrees with the rear surface of the molding part, and the second side has an inclination angle (second inclination angle) of about 138.1 degrees with the back surface of the molding part. It was formed to. Accordingly, the rear surface of the first body portion and the molding portion, and the rear surface of the second body portion and the molding portion are formed to have an inclination angle of about 138.1 degrees. In addition, the gap between the light emitting element and the first body portion (first interval) and the distance between the light emitting element and the second body portion (second interval) is formed to have about 20㎛.

Subsequently, the luminous flux of the light emitting device package according to the embodiment was measured.

Example 2

The first inclination angle and the second inclination angle were formed to have about 137 degrees, so that the rear surface of the first body portion and the molding portion and the rear surface of the second body portion and the molding portion had an inclination angle of about 137 degrees. In addition, a light emitting device package was manufactured in the same manner as in Example 1, except that the first and second intervals were formed to have about 50 μm.

Subsequently, the luminous flux of the light emitting device package according to the embodiment was measured.

Example 3

The first inclination angle and the second inclination angle were formed to have about 135 degrees, so that the rear surface of the first body portion and the molding portion and the rear surface of the second body portion and the molding portion had an inclination angle of about 135 degrees. In addition, a light emitting device package was manufactured in the same manner as in Example 1, except that the first and second intervals were about 100 μm.

Subsequently, the luminous flux of the light emitting device package according to the embodiment was measured.

Example 4

The first inclination angle and the second inclination angle were formed to have about 130.6 degrees, and the rear surface of the first body portion and the molding portion and the rear surface of the second body portion and the molding portion were formed to have an inclination angle of about 130.6 degrees. In addition, a light emitting device package was manufactured in the same manner as in Example 1, except that the first and second intervals were about 200 μm.

Subsequently, the luminous flux of the light emitting device package according to the embodiment was measured.

Comparative Example 1

The first inclination angle and the second inclination angle were formed to have about 90 degrees, so that the rear surface of the first body portion and the molding portion and the rear surface of the second body portion and the molding portion had an inclination angle of about 90 degrees. In addition, a light emitting device package was manufactured in the same manner as in Example 1, except that the first and second intervals were about 20 μm.

Tilt angle of the body Gap between the light emitting element and the body Beam (%) First inclination angle
(°, degree) Second inclination angle
(°, degree) 1st thickness
(Μm) 2nd thickness
(Μm) Example 1 138.1 138.1 20 20 105 Example 2 137 137 50 50 107 Example 3 135 135 100 100 106.5 Example 3 130.6 130.6 200 200 105.6 Comparative Example 1 90 90 20 20 100

In Table 1, the luminous fluxes of Examples 1 to 4 may mean that the ratio of luminous flux values when the luminous flux value of Comparative Example 1 is 100% is expressed as a percentage (%).

Referring to Table 1, the light emitting device package according to the embodiment may include a body portion having an inclination angle of about 125 degrees to about 145 degrees. In detail, the light emitting device package may be about 130 degrees to about 140 degrees. In addition, the distance between the light emitting device and the body portion may be about 15㎛ to about 220㎛. In detail, the distance between the light emitting device and the body portion may be about 20 μm to about 200 μm.

Referring to Table 1, it can be seen that the light emitting device package according to the embodiment has an improved luminous flux than the light emitting device package according to the comparative example. In detail, referring to Example 1 and Comparative Example 1 having the same spacing between the light emitting element and the body portion, it can be seen that the luminous flux is improved by about 5% as the body portion has an inclination angle. In addition, it can be seen that the inclination angle is about 137 degrees among the above-mentioned ranges, and when the interval satisfies about 50 μm among the above-mentioned ranges, it has the most improved luminous flux value.

That is, the light emitting device package according to the embodiment has a gap between the above-described light emitting device and the body portion, and as the body portion has the aforementioned inclination angle, it is possible to effectively reflect the light emitted from the light emitting device in the upward direction and more improved luminous flux Can have

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (11)

A light emitting device including first and second bonding parts;
A molding part surrounding the light emitting device; And
A body part disposed on a side of the molding part and spaced apart from the light emitting device;
The first and second bonding portions are exposed from the rear surface of the molding portion,
The body portion includes a first body portion disposed on a first side of the molding portion and a second body portion disposed on a second side facing the first side of the molding portion,
The first and second body parts, including a recess provided on the back of each of the first and second body parts,
The concave portion recessed in the direction toward the upper surface from the back surface of each of the first and second body portion package. The method of claim 1,
The upper surface of the molding portion is disposed on the same plane as the upper surface of the body portion,
The back surface of the molding portion is a light emitting device package located below the recess in a vertical direction. The method of claim 1,
The concave portion is deeper away from the light emitting device is a light emitting device package. The method of claim 1,
The concave portion has a depth of 20㎛ 60㎛ light emitting device package. The method of claim 1,
The body portion includes an inner surface in contact with the molding portion,
The inclination angle between the inner surface of the body portion and the rear surface of the molding portion, 130 to 140 degrees light emitting device package. The method of claim 5,
The distance between the inner surface of the body portion and the light emitting device, the light emitting device package increases as the distance from the back surface of the molding. The method of claim 5,
The interval between the inner surface of the body portion and the light emitting device, the light emitting device package is 15㎛ to 220㎛. The method of claim 1,
The body portion includes an inner surface in contact with the molding portion,
The inner surface of the body portion and the back of the molding portion is a vertical light emitting device package. The method of claim 1,
When viewed in plan, the molding part has a rectangular shape,
The molding part further includes third and fourth side surfaces connecting the first and second side surfaces,
The body portion further comprises a third body portion disposed on the third side and a fourth body portion disposed on the fourth side. The method of claim 9,
The first to fourth body parts are integrally formed light emitting device package. Disposing a light emitting device including first and second bonding parts on a substrate;
Forming a molding part on the substrate and the light emitting device;
Forming a pattern on the molding part; And
Forming a body portion on the pattern;
In the step of forming the body portion, a concave portion is formed on the upper surface of the body portion, the concave portion is a manufacturing method of the light emitting device package concave in the direction toward the rear surface from the upper surface.

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