KR20190081894A - Electrode connection structure for display panel - Google Patents

Abstract

According to the present invention, an embodiment may include a panel having a plurality of panel electrodes, a flexible substrate which is disposed on the panel and has a plurality of connection electrodes disposed to face the plurality of panel electrodes, and an adhesion layer which is disposed between the panel and the flexible substrate and includes conductive balls. Here, a receiving groove for accommodating the conductive balls is provided on the lower surface of the connection electrode, thereby preventing the conductive balls from being pushed out of the connection electrode and the panel electrode. So, connection effective area is reduced to increase resolution.

Description

[0001] ELECTRODE CONNECTION STRUCTURE FOR DISPLAY PANEL [0002]

The present invention relates to an electrode connection structure for a display panel, and more particularly to an electrode connection structure for a display panel that can improve resolution.

In general, various electronic devices such as a mobile communication terminal, a digital camera, a notebook, and a TV are provided with an image display device for displaying an image.

Various types of image display devices can be used. A liquid crystal display device, an electroluminescent display device, an electrophoretic display device, an electrowetting display device, a quantum dot display device, and the like are used depending on the implementation method of the video display device. Also, a flat panel display device, a flexible display device, a rollable display device, or the like is used depending on the form of the video display device.

Among them, the liquid crystal display device can be realized by mounting a COF (Chip on film), which is a driving IC film, on a liquid crystal panel having a liquid crystal layer formed between the array substrate and the color filter substrate.

In the mounting method of the display device, an anisotropic conductive film (hereinafter, ACF) is placed on the panel circuit electrode part of the liquid crystal panel part, and one side of the COF having the circuit pattern electrode is aligned, The other side is a form in which a printed circuit board (PCB) is subjected to heat and pressure. In order for the panel and the COF to be electrically connected, electrode pads may be disposed on the panel and the COF, respectively.

The anisotropic conductive film may be formed of an epoxy resin and includes conductive balls for electrical conduction between the panel and the COF. When an anisotropic conductive film including a conductive ball is used to connect the panel and the COF, the epoxy resin of the anisotropic conductive film is pressed and some of the conductive balls dispersed therein are used for electrical connection, Some are pushed outward in the contact area between the electrode pads and gather around the outer periphery of the electrode pads.

As described above, the conductive balls gathered around the outer circumference of the electrode pads form electrical lines, which often causes a short circuit with other neighboring electrode pads.

In general, when the COF is pressed onto the panel by using a compression bonding apparatus, the electrode pad of the COF and the electrode pad of the panel are engaged with each other, It is easy to be pushed outward.

As a result, there is a problem in that the conductive balls deviate to the outside of the electrode pads and the conductive balls are piled on the boundary surface of the electrode pads, resulting in electrical shorts, and the number of indentations in the connection region between the electrode pads is reduced.

In addition, as the conductive ball deviates from the connection region, the bonding area between the electrode pads increases, and the resolution of the panel decreases. The above-mentioned problems are not limited only to the attachment of the panel and the COF, but may occur to the flexible substrate such as the COF.

Accordingly, the inventors of the present invention have recognized that the resolution of the panel is lowered because the bonding area between the electrode pads increases as the conductive balls deviate from the connection area where the electrode pads are engaged, In the connection region provided for the display panel. In this case, the electrode pads disposed on the panel for separating the electrode pads may be referred to as panel electrodes, and the electrode pads disposed on the flexible substrate may be referred to as connection electrodes.

It is an object of the present invention to prevent the conductive balls from escaping from the connection area provided between the panel electrode and the connection electrode when the panel and the flexible substrate are pressed to prevent electrical shorts that may occur due to the bundling of the conductive balls outside the electrodes And an electrode connection structure for a display panel.

In order to achieve the above object, an embodiment according to the present invention is a flexible substrate having a panel having a plurality of panel electrodes, a flexible substrate having a plurality of connection electrodes arranged to face the plurality of panel electrodes, And an adhesive layer disposed between the flexible substrates and including conductive balls. At the lower end of the connection before the connection, a receiving groove for receiving the conductive balls may be provided. Accordingly, it is possible to increase the number of conductive balls that can be positioned between the panel electrode and the connection electrode, thereby preventing the bunching of the conductive balls, which may occur outside the panel electrode and the connection electrode, and shorting to other panel electrodes or connection electrodes .

The receiving groove may be concave in the direction of the flexible substrate.

The receiving groove may include a straight surface between the outer perimeter of the receiving horn and the lower surface of the connecting electrode. The straight surface may be in contact with the upper surface of the panel electrode.

Between the outer periphery of the receiving groove and the periphery of the lower surface of the connecting electrode, a rounded portion convex in the direction of the panel electrode may be provided. The round portion can be brought into close contact with the upper surface of the panel electrode.

The upper surface of the panel electrode may be provided with a coupling groove to be coupled with the lower surface of the connection electrode.

The upper surface of the panel electrode may further include an insertion groove which is connected to the outer periphery of the receiving groove and into which the lower surface rim of the connecting terminal is inserted.

The insertion groove may have a width set along the upper surface of the panel electrode so that the insertion groove is slidably moved in a state in which the lower surface rim of the connection terminal is in contact.

SUMMARY OF THE INVENTION The present invention has an effect of preventing electrical shots from being generated as the conductive balls are clustered outside the electrode pad by preventing the conductive balls from escaping from the connection region provided between the electrode pads of the conductive balls when the panel and the flexible substrate are compressed.

1 is a cross-sectional view showing an electrode connection structure in a display panel.
2 is a cross-sectional view showing a state in which electrode connection in the display panel is completed.
FIG. 3 is a photograph showing the shape in which the conductive balls are pushed outward between the panel electrode and the connection electrode.
Fig. 4 is a photograph showing the phenomenon that the conductive balls are bundled around the electrodes.
5 is a photograph showing indentations in the effective region of the electrode pad.
6 is a cross-sectional view illustrating an electrode connection structure for a display panel according to an embodiment of the present invention.
7 is a cross-sectional view illustrating a state in which a panel electrode and a connection electrode are attached to each other according to an embodiment of the present invention.
8 is a cross-sectional view showing a first embodiment of a receiving groove according to the present invention.
9 is a cross-sectional view showing a second embodiment of a receiving groove according to the present invention.
10 is a cross-sectional view showing a third embodiment of the receiving groove according to the present invention.
11 is a cross-sectional view showing a fourth embodiment of the receiving groove according to the present invention.
12 is a sectional view showing an example in which a coupling groove is provided in the panel electrode according to the present invention.
13 is a cross-sectional view showing an example in which another coupling groove is provided in the panel electrode according to the present invention.
14 is a cross-sectional view showing an example in which an insertion groove is further provided on the upper surface of the panel electrode according to the present invention.
15A and 15B are cross-sectional views illustrating the process of placing the rim of the lower surface of the connection terminal in the insertion groove according to the present invention.
16 is a photograph showing the indentation in the effective region between the electrodes according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings so that those skilled in the art can easily carry out the present invention.

The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

Hereinafter, the term "an upper (or lower)" or a "top (or lower)" of the substrate means that any structure is disposed or arranged in any manner, as long as any structure is provided or disposed in contact with the upper surface .

Furthermore, the present invention is not limited to a configuration that does not include any other configuration between the substrate and any configuration provided or disposed on (or under) the substrate.

Hereinafter, an electrode connection structure for a display panel according to the present invention will be described with reference to the accompanying drawings.

1 is a cross-sectional view showing an electrode connection structure in a display panel.

Referring to FIG. 1, a flexible substrate 20 such as a COF (chip on film) on which a driving IC is mounted is attached for applying a signal from the outside in order to drive the panel 10.

In this case, the flexible substrate 20 is not limited to the COF, and various types of substrates adhered to the panel 10 may be included.

The panel 10 and the flexible substrate 20 are disposed opposite to each other and the flexible substrate 20 is disposed on the upper side of the panel 10 in order to attach the flexible substrate 20 to the panel 10 as an example Explain.

The first pad electrodes 21 are arranged at intervals on the flexible substrate 20 and the second pad electrodes 11 are arranged on the panel 10 at intervals. Here, the first pad electrodes 21 and the second pad electrodes 11 are disposed so as to face each other and overlap each other.

When the first pad electrodes 21 are formed on the flexible substrate 20, a pattern of the first pad electrodes 21 is formed using a photo process. In the photolithography process, a material for forming a pad electrode is coated on the flexible substrate 20, a mask is formed by applying a photosensitive agent on the pad electrode material to form a pattern or a mask having a hole at a portion not to be patterned Followed by exposure and development to form a pattern.

In this case, the center portion of the pattern to which the photosensitive agent is applied covers the pad electrode perfectly, but the peripheral portion of the pattern to which the photosensitive agent is applied is affected by the etching solution. Accordingly, the lower surface of the first pad electrodes 21 of the flexible substrate 20 is formed in a convex shape by etching the peripheral portion more than the central portion.

An anisotropic conductive film (ACF) 30 is disposed between the flexible substrate 20 and the panel 10. The anisotropic conductive film 30 includes the conductive balls 31 and may be formed of an epoxy resin, but is not limited thereto.

2 is a cross-sectional view showing a state in which electrode connection in the display panel is completed. 3 (a) and 3 (b) are photographs showing the phenomenon that the conductive balls are pushed outward between the panel electrode and the connection electrode. In this case, the panel electrode is the second electrode pad 11, and the connection electrode is the first electrode pad 21.

<48> Referring to FIG. 2, an anisotropic conductive film 30 and a flexible substrate 20 are sequentially placed on the panel 10. For example, the flexible substrate 20 may be a chip on film (COF), a flexible printed circuit film (FPC), or the like.

Silicone rubber is placed on the flexible substrate 20 thus placed, and the flexible substrate 20 is pressed using a thermocompression bonding head of a compression bonding apparatus.

Here, the silicone rubber is a buffer material for preventing the panel 10 from being damaged by the pressing of the compression bonding apparatus. The method for pressing the flexible substrate 20 to the panel 10 is not limited thereto.

When the flexible substrate 20 is pressed and the conductive balls 31 present in the anisotropic conductive film 30 are pushed outwardly of the first electrode pad 21 and the second electrode pad 11, 21 and a second electrode pad 11 such as an address electrode of the panel 10 may be in close contact with each other. In this case, since the lower surface of the first electrode pad 21 is convex, the conductive ball 31 is more easily pushed out of the first electrode pad 21. This can be confirmed from FIG.

The first electrode pad 21 and the second electrode pad 11 may be a conductive material such as copper, but are not limited thereto. The second electrode pad 11 may be part of the address electrode. In this case, the address electrodes may be various kinds of signal lines arranged to apply electrical signals to the pixels included in the panel 10. [

A space in which the first electrode pad 21 and the second electrode pad 11 are not located is filled with epoxy resin after the pressing of the panel 10 and the flexible substrate 20, The space in which the second electrode pad 11 is located should be filled with the conductive balls 31. As a result, the panel 10 and the flexible substrate 20 are insulated by the epoxy resin, and the first electrode pad 21 and the second electrode pad 11 are electrically connected by the conductive balls 31 do. However, since the conductive balls 31 are difficult to be filled due to the convex shape of the lower surface of the first electrode pad 21, the conductive balls 31 gathered outside the first electrode pad 21 and the second electrode pad 11 31 form an electrical line to cause a short circuit with other neighboring electrode pads.

4 (a) and 4 (b) are photographs showing the phenomenon that the conductive balls are bundled around the connection electrode. FIG. 4A is a photograph showing a state in which the conductive balls 31 are gathered at the interface of the first electrode pad 21, and the first electrode pad may be short-circuited with another electrode pad as mentioned above.

5 (a) and 5 (b) are photographs showing indentations in the effective area of the electrode pad. FIG. 5B shows that the number of indentations existing in the connection region between the electrode pads is reduced.

6 is a cross-sectional view illustrating an electrode connection structure for a display panel according to an embodiment of the present invention.

6, the electrode connection structure for a display panel according to the present invention includes a panel 100, a flexible substrate 200, and an adhesion layer 300.

The panel 100 and the flexible substrate 200 are arranged to face each other along the vertical direction. The panel 100 may be disposed under the flexible substrate 200, but is not limited thereto.

A plurality of panel electrodes 110 may be spaced apart from each other on the upper surface of the panel 100. In this case, the panel electrode 110 may be the address electrode described above.

A plurality of connection electrodes 210 may be disposed on the lower surface of the flexible substrate 200 with a gap therebetween. In this case, the connecting electrode 210 may be a copper electrode, but is not limited thereto.

Here, the plurality of panel electrodes 110 may be disposed so as to correspond one-to-one with the plurality of connection electrodes 210 along the upper and lower sides.

The adhesive layer 300 disposed between the panel 100 and the flexible substrate 200 may be an anisotropic conductive film (ACF).

The conductive balls 310 may be included in the adhesion layer 300.

In addition, a receiving groove 211 may be formed on the lower surface of each of the plurality of connecting electrodes 210. The receiving groove 211 may provide a space for accommodating the conductive balls. The receiving groove 211 may be formed by adding an etching process in the process of forming the connection electrode 210.

Here, the receiving groove 211 provided on the lower surface of the connecting electrode 210 may be a concave groove in the direction of the flexible substrate 200.

The receiving groove 211 may have a concave shape along the upper side and an end of the receiving groove 211 may be connected to an outer circumferential lower surface of the connecting electrode 210.

7 is a cross-sectional view illustrating a state in which a panel electrode and a connection electrode are attached to each other according to an embodiment of the present invention.

Referring to FIG. 7, the pressing process of the panel 100 and the flexible substrate 200 will be described.

Referring to FIG. 7, the panel 100 and the flexible substrate 200 according to the present invention can be pressed together with a constant force through a compression bonding apparatus.

Here, the lower surface of each connecting electrode 210 may be in contact with the upper surface of each panel electrode 110 disposed at the lower portion thereof.

In this case, the conductive balls 310 positioned between the connection electrodes 210 and the panel electrodes 110 are electrically connected to the connection electrodes 210 and the panel electrodes 110 while the connection electrodes 210 and the panel electrodes 110 are in contact with each other. A certain number of the receiving grooves 211 may be accommodated in the receiving groove 211.

Here, the conductive balls 310 positioned on the lower surface of the connection electrode 210 are moved to the outside of the connection electrode 210 by the circumference of the accommodation groove 211 in a state of being positioned in the accommodation groove 211 Can be limited.

The conductive balls 310 positioned between the connection electrodes 210 and the panel electrodes 110 are pushed outwardly between the lower surface of the connection electrode 210 and the upper surface of the panel electrode 110, .

In addition, since the receiving groove 211 according to the present invention has a concave shape along the center of the lower surface of the connecting electrode 210 on the outer circumference of the lower surface of the connecting electrode 210, The center of which is relatively deeper than its outer perimeter.

The number of the conductive balls 310 included in the adhesive layer 300 may be more or less than the circumference of the receiving groove 211 of the connection electrode 210.

In addition, when the panel 100 and the flexible substrate 200 are bonded to each other, bonding of the conductive balls 310 to the connection electrode 210 and the panel electrode 110 can be prevented. Accordingly, the panel electrode 110 and the connection electrode 210 are electrically conducted through the conductive balls 310, and the outer side of the panel electrode 110 and the connection electrode 210 can be insulated by an epoxy resin.

8 is a cross-sectional view showing a first embodiment of a receiving groove according to the present invention.

Referring to FIG. 8, the receiving groove 212 according to the present invention is provided on the lower surface of the connecting electrode 210.

The receiving groove 212 may be formed of a straight surface 212a and a curved surface 212b.

The straight surface 212a of the receiving groove 212a may be a slope having a predetermined length along the center of the receiving groove 212 around the lower surface of the connecting electrode 210. [

The curved surface 212b is provided at the center of the receiving groove 212 and its periphery may be connected to the straight surface 212a of the receiving groove 212. [

When the connecting electrode 210 according to the present invention is in contact with the upper surface of the panel electrode 110, the straight surface 212a formed around the receiving groove 212 is formed on the upper surface of the panel electrode 110, Can be secured.

The curved surface 212a forming the central portion of the receiving groove 212 has a shape of upward trough and a certain number of the conductive balls 310 can be accommodated in the curved surface 212a.

The conductive balls 310 received in the receiving groove 212 according to the first embodiment of the present invention are supported on the upper surface of the panel electrode 110 due to the straight surface 212a, (Not shown).

9 is a cross-sectional view showing a second embodiment of a receiving groove according to the present invention.

Referring to FIG. 9, the receiving groove 213 according to the present invention is provided on the lower surface of the connecting electrode 210.

The receiving groove 213 is formed of a straight surface, but may have a triangular cross-sectional space.

The conductive balls 310 may be accommodated in the receiving groove 213, which forms a triangular cross-sectional space.

The shape of the receiving groove 213 is not limited to a triangular shape, but may be a rectangular or square shape.

10 is a cross-sectional view showing a third embodiment of the receiving groove according to the present invention.

Referring to FIG. 10, a concave receiving groove 214 may be formed on the lower surface of the connecting electrode 210 according to the present invention.

A straight surface 215 may be provided between the periphery of the receiving groove 214 and the lower surface of the connecting electrode 210.

The straight surface 215 may be substantially a portion of the lower surface of the connecting electrode 210.

Therefore, the periphery of the receiving groove 215 according to the present invention may be spaced apart from the bottom surface of the connection terminal 110 by a width corresponding to the length of the straight surface 215.

The linear surface 215 provided on the lower surface of the connection electrode 210 according to the present invention can be brought into close contact with the upper surface of the panel electrode 110.

Accordingly, the receiving groove 214 according to the third embodiment of the present invention can be hermetically sealed through the linear surface 215 to be closely contacted, and the conductive ball 310 accommodated in the receiving groove 214 can be hermetically sealed And can be safely accommodated without detachment.

11 is a cross-sectional view showing a fourth embodiment of the receiving groove according to the present invention.

11, between the outer periphery of the receiving groove 214 according to the fourth embodiment of the present invention and the periphery of the lower surface of the connecting electrode 210, a round portion 216 convex in the direction of the panel electrode is provided It is possible.

Here, the round portion 216 may be in close contact with the upper surface of the panel electrode 110.

The round portion 216 is in contact with the upper surface of the panel electrode 110 with a curvature to form a certain elasticity.

Thus, the airtightness of the receiving groove 214 according to the fourth embodiment of the present invention can be formed, and the detachment of the conductive ball 310 accommodated in the receiving groove 214 can be effectively prevented.

In addition, when the panel electrode 110 and the connection electrode 210 are in contact with each other, the conductive balls 310 located outside the lower surface of the connection electrode 210 are received by the receiving groove 214 by the round portion 216, The movement to the inside can be easily guided.

Further, round grooves are formed in the upper surface of the panel electrode 110 according to the present invention in which the round portions 216 are formed so as to be convex downward, so that a coupling force between the round portions 216 can be further secured. The round groove is formed by a concave groove and has a round portion 216 formed to be convex downwardly inserted therein, so that the coupling between the panel electrode 110 and the connection electrode 210 can be strengthened.

12 is a sectional view showing an example in which a coupling groove is provided in the panel electrode according to the present invention.

Referring to FIG. 12, a receiving groove 211 having a concave shape may be provided on a lower surface of the connecting electrode 210 according to the present invention.

A coupling groove 111 may be formed on the upper surface of the panel electrode 110 located below the connection electrode 210.

The coupling groove 111 may have a predetermined depth so that the lower surface of the coupling electrode 210 is inserted.

The engaging groove 111 may have a 'C' shape in which its cross section is opened upward.

Accordingly, when the connection electrode 210 and the panel electrode 110 are in contact with each other, the conductive balls 310 may be accommodated in the receiving groove 211 in a predetermined number.

The lower surface of the connection electrode 210 may be positioned to be inserted into the coupling groove 111 formed on the upper surface of the panel electrode 110.

Here, the outer peripheries of the coupling grooves 111 may be formed so as to surround the lower surface of the connection electrode 210.

The conductive balls 310 received in the receiving groove 211 are not separated from the coupling groove 111 and the panel electrode 110 and the connecting electrode 210 are physically coupled to each other To form a state of accomplishment.

The coupling grooves 111 may be formed by forming barrier ribs protruding upward from the rim of the upper surface of the panel electrode 110 at a predetermined height.

13 is a cross-sectional view showing an example in which another coupling groove is provided in the panel electrode according to the present invention.

Referring to FIG. 13, the coupling groove 112 according to the present invention may be formed as a concave groove downward from the upper surface of the panel electrode 110 or in the direction of the panel 100. Here, a plane 113 is provided between the outer periphery of the coupling groove 112 and the outer periphery of the upper surface of the panel electrode 110. The plane 113 is disposed at a higher position than the inner circumferential surface of the coupling groove 112 to prevent the conductive balls 310 received in the coupling groove 112 from leaking to the outside of the coupling groove 112 can do.

The curvature of the coupling groove 112 may be the same as the curvature of the receiving groove 211 according to the present invention.

In the present invention, the coupling groove 112 having a concave shape is further formed on the upper surface of the panel electrode 110, so that the accommodation space in which the conductive balls 310 are accommodated can be expanded.

14 is a cross-sectional view showing an example in which an insertion groove is further provided on the upper surface of the panel electrode according to the present invention.

Referring to FIG. 14, the upper surface of the panel electrode 110 according to the present invention may further include an insertion groove 114 into which the lower surface of the connection terminal 210 is inserted.

Here, the lower edge of the connection terminal 210 may be connected to the periphery of the receiving groove 211, and may have a downward-pointed cross-section.

Accordingly, the lower surface rim of the connection terminal 210 can be positioned in the insertion groove 114.

The insertion groove 114 may have a predetermined width along the upper surface of the panel electrode 110 so as to form a state in which a rim of the lower surface of the connection terminal 210 is inserted. Therefore, the lower edge of the connection terminal 210 can be slidably moved in contact with the bottom surface of the insertion groove 114.

15A and 15B are cross-sectional views illustrating the process of placing the lower surface rim of the connection terminal 210 in the insertion groove 114 according to the present invention.

15A and 15B, a certain number of conductive balls 310 are accommodated in the receiving groove 211 according to the present invention. In this state, the connecting electrode 210 and the panel electrode 110 are in contact with each other .

In this case, the lower surface rim of the connection terminal 210 is positioned in the insertion groove 114, and when the connection terminal 210 is closely contacted or pressed, the lower surface rim of the connection terminal 210 is inserted into the insertion groove 114 shown in Fig. As shown in Fig. 15B, at the position of the insertion groove 114 in the position shown in Fig.

The lower surface of the connection electrode 210 around the connection electrode 210 in the state of receiving the conductive ball 310 in the receiving groove 211 of the connection electrode 210 is inserted into the insertion groove 114 So that the conductive balls 310 can be safely received. In addition, the coupling force with the connection electrode 210 and the panel electrode 110 can be easily achieved.

In addition, the insertion grooves 114 formed at the rim of the upper surface of the panel electrode may be formed in a shape corresponding to the shape of the lower surface rim of the connection electrode so that they can be coupled to each other.

According to the above configurations and embodiments, in the present invention, as shown in FIG. 16, the conductive balls at the boundaries between the connection electrodes can be prevented from being bundled.

Therefore, in the present invention, it is possible to prevent the conductive balls from being separated from the effective region provided between the electrode pads when the panel and the flexible substrate are pressed, and to prevent the occurrence of electrical short-circuiting.

In addition, the number of indentations in the region where the connection electrode and the panel electrode are in contact are increased to a certain number or more, thereby reducing the contact area between the panel and the flexible substrate, increasing the number of electrodes and improving the resolution of the display panel It is possible to establish a base to be able to.

Although the embodiments of the electrode connection structure for a display panel according to the present invention have been described above, various modifications are possible within the scope of the present invention.

Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.

It is to be understood that the foregoing embodiments are illustrative and not restrictive in all respects and that the scope of the present invention is indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.

100: Panel
110: panel electrode
200: flexible substrate
210: connecting electrode
211, 212, 213, 214: receiving groove
215: straight face
216:
300: adhesive layer
310: Challenge Ball

Claims (7)

A panel having a plurality of panel electrodes;
A flexible substrate disposed on the panel and having a plurality of connection electrodes arranged to face the plurality of panel electrodes; And
An adhesive layer disposed between said panel and said flexible substrate, said adhesive layer comprising conductive balls,
On the lower surface of the connecting electrode,
And a receiving groove in which the conductive balls are accommodated,
Electrode connection structure for display panel.
The method according to claim 1,
Wherein,
And a concave shape in the direction of the flexible substrate,
Electrode connection structure for display panel.
The method according to claim 1,
Wherein,
And a straight surface between the outer periphery of the receiving groove and the lower surface of the connecting electrode,
The straight-
A plurality of panel electrodes,
Electrode connection structure for display panel.
The method according to claim 1,
Between the outer periphery of the receiving groove and the periphery of the lower surface of the connecting electrode,
A convex round portion is provided in the direction of the panel electrode,
In the round section,
A panel electrode formed on the substrate,
Electrode connection structure for display panel.
The method according to claim 1,
On the upper surface of the panel electrode,
And an engaging groove for engaging with a lower surface of the connecting electrode.
Electrode connection structure for display panel.
The method according to claim 1,
On the upper surface of the panel electrode,
And an insertion groove, which is connected to an outer periphery of the receiving groove and into which a lower edge of the connecting terminal is inserted,
Electrode connection structure for display panel.
The method according to claim 6,
The insertion groove
And a connection electrode formed on the upper surface of the panel electrode so as to be slidable in a state that the lower surface of the connection terminal is in contact with the panel electrode,
Electrode connection structure for display panel.

Images