KR20210080891A - Display device, manufacturing apparatus and manufacturing method thereof - Google Patents

Abstract

Embodiments of the present invention relate to a display device, and a manufacturing apparatus and a manufacturing method thereof, which can improve electrical connectivity between a conductive lead line of a chip-on-film and a data connection pad of a display panel assembly. The display device includes: a display panel including a plurality of connection pads and a first alignment key; a flexible film including a plurality of conductive lead lines and a second alignment key; and an adhesive agent interposed between the display panel and the flexible film and including a plurality of conductive particles. Some of the plurality of conductive particles constitute a plurality of conductive particle groups disposed to correspond to the plurality of connection pads and the plurality of conductive lead lines, and the remainder of the plurality of conductive particles constitutes a third alignment key.

Description

A display device, its manufacturing apparatus, and manufacturing method TECHNICAL FIELD

The present invention relates to a display device, an apparatus for manufacturing the same, and a manufacturing method thereof.

Recently, as an adhesive for physically and electrically connecting electronic components, an anisotropic conductive film (ACF) has been used. When an anisotropic conductive film is interposed between electronic components and the electrode portions are thermocompressed, conductive particles are interposed between the electrodes of the electronic components to be electrically connected, and the electronic components can be physically bonded while maintaining insulation in the remaining areas. have.

Embodiments provide a display device in which a display panel and a chip-on film are attached using an anisotropic conductive film (ACF) in which a plurality of conductive particles are disposed in a pattern corresponding to the shape of a data connection pad and a conductive lead line; A manufacturing apparatus and manufacturing method thereof are provided.

Embodiments provide a display device in which a display panel and a chip-on film are attached using an anisotropic conductive film in which conductive particles for an alignment key are formed in order to correctly align a plurality of patterned conductive particles, data connection pads, and conductive lead lines; A manufacturing apparatus and manufacturing method thereof are provided.

A display device according to an exemplary embodiment includes a display panel including a plurality of connection pads and a first alignment key, a flexible film including a plurality of conductive lead lines and a second alignment key, and a space between the display panel and the flexible film a group of a plurality of conductive particles interposed in and including an adhesive including a plurality of conductive particles, wherein some of the plurality of conductive particles are disposed to correspond to the plurality of connection pads and the plurality of conductive lead lines constituting them, and the remaining part of the plurality of conductive particles may constitute a third alignment key.

The adhesive may include an anisotropic conductive film in which the plurality of conductive particles are dispersed in a polymer resin, a first non-conductive film disposed between the anisotropic conductive film and the flexible film, and a first non-conductive film disposed between the anisotropic conductive film and the display panel. 2 may include a non-conductive film.

Each of the plurality of conductive particle groups may include two or more conductive particles, and may be disposed between one connection pad and one conductive lead line facing the one connection pad.

The third sort key may be aligned with the first sort key and the second sort key.

The relative positions of the plurality of conductive particle groups with respect to the third alignment key, the relative positions of the plurality of connection pads with respect to the first alignment key, and the relative positions of the conductive lead lines with respect to the second alignment key are the same. can be set.

The adhesive according to an embodiment includes an anisotropic conductive film including conductive particles dispersed in a polymer resin, a first non-conductive film disposed under the anisotropic conductive film, and a second non-conductive film disposed on the anisotropic conductive film. Including a film, the anisotropic conductive film may include a plurality of first conductive particle groups in which the conductive particles are disposed in a first pattern and a second conductive particle group in which the conductive particles are disposed in a second pattern .

The second group of conductive particles may be aligned with a first alignment key of the display panel to which the adhesive is attached and a second alignment key of the flexible film to which the adhesive is attached.

The first conductive particle group may be disposed at a predetermined relative position with respect to the second conductive particle group.

The relative positions are the same as the relative positions of the connection pads of the display panel with respect to the first alignment key of the display panel and the relative positions of the conductive lead lines of the flexible film with respect to the second alignment key of the flexible film. can be set.

According to an exemplary embodiment, an apparatus for manufacturing a display device includes an adhesive unit for bonding an adhesive on a plurality of connection pads of a display panel, a pressing unit for pressing a flexible film having a plurality of conductive lead lines formed on the adhesive, and the adhesive; A PCB bonding process unit for attaching a printed circuit board to the flexible film, wherein the adhesive comprises a plurality of conductive particle groups each having a plurality of conductive particles arranged in a first pattern and a plurality of conductive particles arranged in a second pattern It may include a sort key composed of particles.

The bonding unit may include, after aligning the alignment key of the adhesive with the first alignment key formed on the display panel, attaching the adhesive to the plurality of connection pads, wherein the first alignment key and the alignment key are According to the alignment, the plurality of conductive particle groups and the plurality of connection pads may be aligned.

The pressing unit, after aligning the alignment key of the adhesive and the second alignment key formed on the flexible film, pressing the flexible film on the adhesive, as the second alignment key and the alignment key are aligned , the plurality of conductive particle groups and the plurality of conductive lead lines may be aligned.

According to an embodiment, a display device using an adhesive including an alignment key including a plurality of conductive particle groups each having a plurality of conductive particles arranged in a first pattern and a plurality of conductive particles arranged in a second pattern, according to an embodiment The manufacturing method may include aligning a first alignment key formed on a display panel with the alignment key of the adhesive, attaching the adhesive on the display panel, and aligning the adhesive with a second alignment key formed on a flexible film It may include aligning the keys and pressing the flexible film onto the adhesive.

The display device, the manufacturing apparatus, and the manufacturing method according to the embodiments may improve electrical connectivity between the conductive lead line of the chip on film and the data connection pad of the display panel assembly.

In addition, the display device, the manufacturing apparatus, and the manufacturing method according to the embodiments may prevent a short circuit between the data connection pads due to aggregation of conductive particles in the adhesive.

1 is a plan view of a display device according to an exemplary embodiment.
FIG. 2 is an enlarged plan view of area AA of FIG. 1 .
FIG. 3 is a cross-sectional view taken along line II′ of FIG. 2 .
4 is a cross-sectional view of an adhesive according to an embodiment.
5 is a view showing the structure of the conductive particles shown in FIG.
6 is a cross-sectional view of an adhesive according to another embodiment.
It is a figure for demonstrating arrangement|positioning of an electrically-conductive particle.
8 is a plan view of an anisotropic conductive film according to an exemplary embodiment.
9 is a plan view of an anisotropic conductive film according to another exemplary embodiment.
10 is a plan view of an anisotropic conductive film according to another embodiment.
11 is a block diagram illustrating a structure of a bonding apparatus according to an exemplary embodiment.
12 to 17 are diagrams for explaining a bonding method according to an embodiment.

Since the present invention can have various changes and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

In describing each figure, like reference numerals have been used for like elements. In the accompanying drawings, the dimensions of the structures are enlarged than the actual size for clarity of the present invention. Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In this application, "includes." Or "have." The term such as is intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and is intended to indicate that one or more other features or numbers, steps, operation, component, part or It should be understood that it does not preclude the possibility of the existence or addition of combinations thereof. Also, when a part of a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where it is "directly on" another part, but also the case where another part is in the middle. In addition, in the present specification, when a portion such as a layer, film, region, or plate is formed on another portion, the formed direction is not limited only to the upper direction, and includes those formed in the side or lower direction. Conversely, when a part of a layer, film, region, plate, etc. is said to be “under” another part, this includes not only cases where it is “directly under” another part, but also a case where another part is in between.

1 is a plan view of a display device according to an exemplary embodiment.

Referring to FIG. 1 , a display device 1 includes a printed circuit board (PCB) 100 , a display panel 200 , and a driving unit 300 .

The printed circuit board 100 may provide various control signals and/or power to the drivers 300 . For example, the printed circuit board 100 may include a timing control unit 110 , a power supply unit 120 , and the like.

The timing controller 110 may receive an image signal and a control signal from the outside. The image signal may include a plurality of grayscale data. The control signal may include, for example, a horizontal synchronization signal, a vertical synchronization signal, and a main clock signal.

The timing controller 110 may process the image signal and the control signal to suit the operating conditions of the display panel 200 to generate and output image data, a gate driving control signal, a data driving control signal, and a power supply control signal. .

The power supply unit 120 may generate a voltage to be provided to the pixels PX and the driver 300 based on the power supply control signal. The voltage may include, for example, a high potential driving voltage, a low potential driving voltage, and a voltage for driving the driving unit 300 . The power supply 120 may provide the generated voltage to the pixels PX and the driver 300 .

The display panel 200 may be implemented in various forms. For example, the display panel 200 may be implemented in a rectangular plate shape. However, the present embodiment is not limited thereto, and the display panel 200 may have various shapes such as a square, a circle, an ellipse, and a polygon, and may have a shape in which some corners are treated as curved surfaces or a thickness changes in at least one region. Also, all or part of the display panel 200 may have flexibility.

The display panel 200 includes a lower substrate 220 and an upper substrate 210 . The display panel 200 includes a display area DA in which the lower substrate 220 and the upper substrate 210 overlap and a non-display area NDA in which the lower substrate 220 and the upper substrate 210 do not overlap. can be made with The display area DA is an area in which the pixels PX are disposed and may be referred to as an active area. The non-display area NDA may be disposed around the display area DA. For example, the non-display area NDA may be disposed along the edge of the display area DA. The non-display area NDA may comprehensively mean an area other than the display area DA on the display panel 200 , and may be referred to as a non-active area.

Gate lines GL1 to GLn, data lines DL1 to DLm, and pixels PX connected to the gate lines GL1 to GLn and the data lines DL1 to DLm are formed on the lower substrate 220 . can be Power lines (not shown) may be further formed on the lower substrate 220 .

A plurality of data connection pads (not shown) may be provided on the lower substrate 220 . The data connection pads are not covered by the insulating layer and are exposed to the outside of the lower substrate 220 to be electrically connected to the printed circuit board 100 and the data driver 320 .

The driver 300 includes a gate driver 310 and a data driver 320 .

The gate driver 310 may be connected to the pixels PX of the display area DA through the plurality of gate lines GL1 to GLn. The gate driver 310 may generate gate signals based on a gate driving control signal supplied from the timing controller. The gate driver 310 may provide the generated gate signals to the pixels PX through the plurality of gate lines GL1 to GLn.

In an embodiment, the gate driver 310 may be configured as an in-panel method integrally formed with the display panel 200 . In this embodiment, the gate driver 310 may be disposed adjacent to one side or both sides of the display area DA in the non-display area NDA. The gate driver 310 may be formed as a gate in panel (GIP) in the non-display area NDA of the display panel 200 as shown in FIG. 1 . However, in another embodiment, the gate driver 310, like the data driver 320 to be described later, is manufactured as an integrated circuit chip, mounted on a flexible film, etc., and placed in the non-display area NDA through a Tape Automated Bonding (TAB) process. can be attached.

The data driver 320 may be connected to the pixels PX of the display area DA through a plurality of data lines DL1 to DLm. The data driver 320 may generate data signals based on image data output from the timing controller and a data driving control signal. The data driver 320 may provide the generated data signals to the pixels PX through the plurality of data lines DL1 to DLm.

In an embodiment, the data driver 320 may be manufactured using an integrated circuit chip (IC chip). The integrated circuit chip may be mounted on a flexible film in which a plurality of conductive lead lines are formed on an insulating film, such as polyimide, to constitute a Chip On Film (COF). Such a chip-on-film may be referred to as a tape carrier package (TCP).

One side of the chip-on film is attached to the display panel 200 through an adhesive or the like, and the other side is attached to the printed circuit board 100 through soldering or the like. Components (eg, the timing control unit 110 , the power supply unit 120 ), the data driver 30 , and the display panel 200 on the printed circuit board 100 through the lead lines formed on the flexible film 500 . Components (eg, the gate driver 310 , the pixels PXs, the gate lines GL1 to GLn, and the data lines DL1 to DLm) may be electrically connected to each other.

Each pixel PX may be electrically connected to a corresponding gate line and data line. The pixels PX may emit light with luminance corresponding to the gate signal and the data signal supplied through the gate lines GL1 to GLn and the data lines DL1 to DLm.

Each pixel PX may display any one of the first to third colors. In an embodiment, each pixel PX may display any one of red, green, and blue. In another embodiment, each pixel PX may display any one of cyan, magenta, and yellow. In various embodiments, the pixels PX may be configured to display any one of four or more colors. For example, each pixel PX may display any one of red, green, blue, and white.

FIG. 2 is an enlarged plan view of area AA of FIG. 1 , and FIG. 3 is a cross-sectional view taken along line II′ of FIG. 2 .

1 to 3 , the display device 1 may include a display panel 200 and a driver 300 .

The display panel 200 includes a lower substrate 220 and an upper substrate 210 . In the lower substrate 220 , a plurality of signal lines DL1 , DL2 , and GL1 are formed in the non-display area NDA, and a plurality of pixels PX1 and PX2 are formed in the display area DA. The upper substrate 210 may cover the pixels PX1 and PX2 .

A pad area is provided in the non-display area NDA of the lower substrate 220 . Data connection pads SP1 and SP2 respectively extending from the data lines DL1 and DL2 are formed in the pad area. In the illustrated embodiment, the first data connection pad SP1 extends from the first data line DL1 connected to the first pixel PX1 , and the second data connection pad SP2 includes the second pixel PX2 . It extends from the second data line DL2 connected to .

The data driver 320 may be mounted on a flexible film 500 including a base film and a plurality of conductive lead lines LL1 and LL2 formed on the base film to form a chip-on-film. The base film may be an insulating film composed of polyimide or the like. The conductive lead lines LL1 and LL2 may be formed of a conductive material such as copper (Cu), nickel (Ni), and gold (Au).

One side of the flexible film 500 is attached to the lower substrate 220 of the display panel 200 . When the base film of the flexible film 500 is attached to the lower substrate 220 , some of the conductive lead lines LL1 and LL2 (ie, input-side lead lines) are electrically connected to the data connection pads SP1 and SP2. can be connected to

The opposite side of the flexible film 500 is connected to the printed circuit board 100 . In this case, other portions (ie, output-side lead lines) of the conductive lead lines LL1 and LL2 may be electrically connected to the printed circuit board 100 .

The flexible film 500 may be attached to the lower substrate 220 through a TAB process using the adhesive 600 . The adhesive 600 may include an anisotropic conductive film (ACF) in which conductive particles (CP) are dispersed in a polymer resin. When heat and pressure are applied to the anisotropic conductive film during the TAB process, the polymer resin is melted and the conductive particles CP may electrically connect the conductive lead lines LL1 and LL2 and the data connection pads SP1 and SP2, respectively. .

Hereinafter, a more specific configuration of the adhesive 600 will be described.

4 is a cross-sectional view of an adhesive according to an embodiment, and FIG. 5 is a view showing the structure of the conductive particles shown in FIG. 4 . 6 is a cross-sectional view of an adhesive according to another embodiment, and FIG. 7 is a view for explaining the arrangement of conductive particles. 8 is a plan view of an adhesive according to an exemplary embodiment, FIG. 9 is a plan view of an adhesive according to another exemplary embodiment, and FIG. 10 is a plan view of an anisotropic conductive film according to another exemplary embodiment.

Referring first to FIG. 4 , an adhesive 600 according to an embodiment may include an anisotropic conductive film (ACF) and a non-conductive film (NCF).

The anisotropic conductive film ACF may include a polymer resin PL that is cured by heat and conductive particles CP dispersed in the polymer resin PL. Polymer resin (PL) is styrene butadiene rubber (Styrene Butadiene Rubber), polyvinyl (Polyvinyl), butylene (Butylene), epoxy resin (Epoxy Resin), polyurethane (Polyurethane) and polymers such as acrylic resin (Acrylic Resin) polymer).

The conductive particles (CP) are particles with a size of several hundred nanometers whose surface is insulated. Referring to FIG. 5 , the conductive particles CP include a first insulating layer PO1 , a first conductive layer ML1 surrounding the first insulating layer PO1 , and a second conductive layer ML1 surrounding the first conductive layer ML1 . It may include the conductive layer ML2 and the second insulating layer PO2 surrounding the second conductive layer ML2. The first conductive layer ML1 and the second conductive layer ML2 of the conductive particles CP may be formed of a metal such as nickel, gold, platinum, or a compound thereof. The first insulating layer PO1 and the second insulating layer PO2 may be made of a polymer such as styrene or acrylic. The conductive particles CP may have a particle diameter of 1 to 10 μm, preferably 2 to 5 μm. The content of the conductive particles (CP) may be 1 to 30 parts by weight based on 100 parts by weight of the entire anisotropic conductive film (ACF).

When the layer thickness of the polymer resin PL increases, when the lower substrate 220 and the flexible film 500 are attached to the lower substrate 220 using the adhesive 600, the conductive particles CP are attached to the data connection pads SP1 and SP2. It is not easily pressurized, and the conductive particles CP may easily move to an unwanted position by the flow of the polymer resin PL. Conversely, when the layer thickness of the polymer resin PL is too small, it is difficult to fix the conductive particles CP at a predetermined position by the polymer resin PL.

Therefore, in order to prevent unnecessary movement of the conductive particles CP and to improve the conductive particles CP trapping properties at a required position, the thickness of the polymer resin PL can be appropriately selected. For example, the thickness of the polymer resin PL may be set to 0.3 to 3 times the particle diameter of the conductive particles CP.

When the thickness of the polymer resin PL is larger than the diameter of the conductive particles CP, the conductive particles CP are completely embedded in the polymer resin PL. Conversely, when the thickness of the polymer resin PL is smaller than the diameter of the conductive particles CP, at least one region of the conductive particles CP may protrude from the surface of the polymer resin PL.

When heat and pressure are applied to the anisotropic conductive film ACF, the polymer resin PL is melted and the second insulating layer PO2 of the conductive particles CP bursts to expose the second conductive layer ML2 inside. . The exposed second conductive layer ML2 may be connected to the conductive lead lines LL1 and LL2 and the data connection pads SP1 and SP2 to electrically connect them. Accordingly, the anisotropic conductive film (ACF) may have both conductivity and adhesiveness.

The first non-conductive film NCF1 is disposed on one side, for example, an upper portion of the anisotropic conductive film ACF. The second non-conductive film NCF2 is disposed on the other side, for example, under the anisotropic conductive film ACF. In various embodiments, at least one of the first non-conductive film NCF1 and the second non-conductive film NCF2 may be omitted.

The first and second non-conductive films NCF1 and NCF2 are non-conductive, that is, an adhesive material having insulation, and may include at least one of a thermosetting resin and a thermoplastic resin. Thermosetting resin, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin, phenol resin, urea resin, melamine resin, unsaturated polyester resin, resorcinol resin, etc., but limited thereto doesn't happen Examples of the thermoplastic resin include, but are not limited to, saturated polyester resin, vinyl resin, acrylic resin, polyolefin resin, polyvinyl acetate (PVA) resin, polycarbonate resin, cellulose resin, ketone resin, and styrene resin.

In general, the conductive particles CP are randomly disposed in the anisotropic conductive film ACF. Accordingly, a relatively large amount of the conductive particles CP may be distributed in a portion of the anisotropic conductive film ACF, and a relatively small amount of the conductive particles CP may be distributed in another portion of the anisotropic conductive film ACF. When the anisotropic conductive film ACF is pressed, if the conductive particles CP between the data connection pads SP1 and SP2 and the conductive lead lines LL1 and LL2 are significantly less or not present, the data connection pads SP1, SP2) and the conductive lead lines LL1 and LL2 are not electrically connected. Conversely, when the anisotropic conductive film ACF is pressed, aggregation of the conductive particles CP occurs in a region where the conductive particles CP are remarkably distributed, and between adjacent data connection pads SP1 and SP2 and/or Alternatively, an electrical short may occur between the adjacent conductive lead lines LL1 and LL2.

In the present embodiment, in order to prevent the display device 1 from being defective due to the non-uniform distribution of the conductive particles CP, the conductive particles CP are formed on the data connection pads SP1 and SP2 and the conductive lead lines LL1 , It is arranged (patterned) in a pattern corresponding to the shape of LL2). Specifically, as shown in FIG. 7 , the conductive particles CP in the anisotropic conductive film ACF have the shape, size, and shape of the data connection pads SP1 and SP2 and the conductive lead lines LL1 and LL2 , It is selectively disposed in areas corresponding to the location.

The pattern of the conductive particles CP may include a plurality of conductive particle groups including two or more conductive particles CP, and the conductive particle groups may be respectively disposed in a set region (position). The position set here corresponds to both the data connection pads SP1 and SP2 and the conductive lead lines LL1 and LL2, and the data connection pads SP1 and SP2 and the conductive lead lines LL1 and LL2 They may be overlapping regions. According to the above, one group of conductive particles may be disposed between one data connection pad and one conductive lead line corresponding thereto.

In this embodiment, the size of the conductive particle groups may be the same as or smaller than the size of the data connection pads SP1 and SP2 , the conductive lead lines LL1 and LL2 , and/or regions where they overlap. In this case, the shape of the conductive particle groups may be the same as the shape of the connection pads SP1 , SP2 , the conductive lead lines LL1 , LL2 , and/or the regions in which they overlap, or may be configured to be accommodated in the shape. In addition, the spacing between the conductive particle groups may correspond to the spacing between the connection pads SP1 and SP2 , the conductive lead lines LL1 and LL2 , and/or regions in which they overlap. In one group of conductive particles, the conductive particles CP may be regularly or irregularly arranged.

In FIGS. 8 and 9 , one conductive particle group includes seven conductive particles CP and is configured to have a circular shape. However, the present embodiment is not limited thereto, and the conductive particle group may be composed of more or fewer conductive particles (CP) than shown, and the conductive particle group has a polygonal shape such as a triangle, a square, a hexagon, and the like. It may be oval, or the like.

The anisotropic conductive film ACF having the patterned conductive particles CP attaches the conductive particles CP in a required pattern on a transfer paper having a slight adhesive component, and the conductive particles CP are attached thereto. It may be manufactured by transferring the conductive particles CP into the polymer resin PL by pressing the polymer resin PL on the transfer paper. Here, "weak adhesion" means, when transferring the conductive particles CP on the polymer resin PL, between the transfer paper and the conductive particles CP rather than the adhesive force between the polymer resin PL and the conductive particles CP. It means that the adhesive strength is weak. However, the method for manufacturing the anisotropic conductive film (ACF) is not limited to the above, and as long as the conductive particles (CP) can be disposed and fixed in the polymer resin (PL) in a required pattern, various process methods can be used to prepare the anisotropic conductive film (ACF). ) can be prepared.

When the adhesive 600 having the above-described anisotropic conductive film ACF is attached to the lower substrate 220 of the display panel 200 , the data connection pads SP1 and SP2 and the conductive particle groups should be aligned with each other. . Similarly, when attaching the flexible film 500 on the adhesive 600 , the conductive particle groups and the conductive lead lines LL1 and LL2 should be aligned with each other.

For correct alignment between the data connection pads SP1 and SP2, the conductive particle groups and the conductive lead lines LL1 and LL2, in this embodiment, the lower substrate 220, the adhesive 600 and the flexible film ( 500), align keys (AKa, AK, AKb) may be formed. For example, a first alignment key AKa is formed on the lower substrate 220 of the display panel 50 , a second alignment key AKb is formed on the flexible film 500 , and a second alignment key AKb is formed on the adhesive 600 . 3 An alignment key AK may be formed.

The first and second alignment keys AKa and AKb formed on the lower substrate 220 and the flexible film 500 are printed, transferred, or etched on any layer of the lower substrate 220 and the flexible film 500 . It can be formed in such a way as to The types and forming methods of the first and second alignment keys AKa and AKb formed on the lower substrate 220 and the flexible film 500 are not particularly limited.

Positions of the data connection pads SP1 and SP2 may be determined to correspond to positions of the first alignment keys AKa formed on the lower substrate 220 . Or vice versa. Similarly, the positions of the conductive lead lines LL1 and LL2 may be determined to correspond to the positions of the second alignment keys AKb formed on the flexible film 500 . Or, vice versa.

In an embodiment, the third alignment key AK of the adhesive 600 may be formed in the anisotropic conductive film ACF. Some of the conductive particles CP in the anisotropic conductive film ACF constitute the aforementioned groups of conductive particles that are patterned to correspond to the data connection pads SP1 and SP2 and the conductive lead lines LL1 and LL2. The remaining part of the conductive particles CP may constitute the third alignment key AK.

In this embodiment, the conductive particles CP in contact with the data connection pads SP1 and SP2 and the conductive lead lines LL1 and LL2 are disposed in the pad contact area PA of the anisotropic conductive film ACF, The conductive particles CP for the third alignment key AK may be disposed in the alignment key area KA adjacent to the pad contact area PA. In an embodiment, the alignment key area KA may be disposed on one side or both sides of the pad contact area PA, or may be disposed to surround the pad contact area PA.

The alignment key area KA may be set as an area corresponding to the first and second alignment keys AKa and AKb provided on the lower substrate 220 and the flexible film 500 . In the alignment key area KA, the third alignment key AK corresponds to the first alignment key AKa provided on the lower substrate 220 and the second alignment key AKb provided on the flexible film 500 . placed in position

The positions of the conductive particle groups may be determined corresponding to the positions of the third alignment keys AK disposed on the anisotropic conductive film ACF. Or vice versa. The relative positions (vectors) of the conductive particle groups with respect to the third alignment key AK are the relative positions of the data connection pads SP1 and SP2 with respect to the first alignment key AKa, and the second alignment key AKb. It is the same as the relative positions of the conductive lead lines LL1 and LL2.

One or more third alignment keys AK may be provided in the anisotropic conductive film ACF. Each third alignment key AK may be composed of a group of conductive particles including two or more conductive particles CP. Here, the group of conductive particles constituting the third alignment key AK may be another pattern having a shape different from that of the group of conductive particles disposed in the pad contact area PA. For example, in the illustrated embodiment, each of the conductive particle groups of the pad connection area PA has a rectangular shape, and the conductive particle group of the alignment key area PA has a cross shape. However, this embodiment is not limited thereto, and in various embodiments, the group of conductive particles constituting the third alignment key AK may have the same shape as the group of conductive particles disposed in the pad contact area PA.

Meanwhile, the shape of the third alignment key AK is not limited to the illustrated cross shape. The shape of the third alignment key AK may be an arbitrary figure formed of a plurality of corners, a plurality of vertices, and a plurality of straight lines or corners connecting them, or a circular or oval shape.

When the adhesive 600 is attached on the lower substrate 220 of the display panel 200 , the first alignment key AKa formed on the lower substrate 220 and the third alignment key AKa formed on the anisotropic conductive film ACF AK) are aligned with each other. Thereafter, the adhesive 600 is pressed and completely attached to the lower substrate 220 . Then, the data connection pads SP1 and SP2 formed on the lower substrate 220 and the conductive particle groups formed in the pad contact area PA of the anisotropic conductive film ACF are in 1:1 contact.

Thereafter, when the flexible film 500 is attached on the adhesive 600 , the third alignment key AK formed on the adhesive 600 and the second alignment key AKb formed on the flexible film 500 are aligned with each other. do. Then, the flexible film 500 is pressed and completely adhered to the adhesive 600 . Then, the conductive lead lines LL1 and LL2 formed on the flexible film 500 and the conductive particle groups formed on the pad contact area PA of the anisotropic conductive film ACF are in 1:1 contact.

As a result, the data connection pads SP1 and SP2 and the conductive lead lines LL1 and LL2 are electrically connected through conductive particle groups. Since the conductive particle groups are disposed only in regions corresponding to the data connection pads SP1 and SP2 and the conductive lead lines LL1 and LL2, the data connection pads SP1 and SP2 and the conductive lead lines LL1 and LL2 ) can be effectively formed, and an electrical short can be prevented between the data connection pads SP1 and SP2 and between the conductive lead lines LL1 and LL2.

Meanwhile, as described above, when the third alignment key AK is configured using conductive particles CP in the anisotropic conductive film ACF, the third alignment key AK is the same as the conductive particles CP. It can be formed through one process. That is, since a separate process for forming the third alignment key AK is not required, the process may be simplified.

However, the present embodiment is not limited thereto. That is, in various embodiments, the third alignment key AK is formed on any one of the non-conductive films NCF1 and NCF2 as shown in FIG. 9 , or an adhesive as shown in FIG. 10 . It may be formed on one surface of 600 . In this embodiment, since the third alignment key AK is disposed adjacent to the upper surface of the adhesive 600 , it may be better recognized during alignment. In the embodiment shown in FIG. 10 , as the non-conductive films NCF1 and NCF2 and the anisotropic conductive film ACF melt when the adhesive 600 is pressed, they are depressed into them, thereby increasing the adhesive strength of the adhesive 600 . may not interfere. 9 and 10 , the third alignment key AK may be formed of conductive particles CP or other colored materials.

Hereinafter, a bonding apparatus and method for attaching the flexible film 500 to the display panel 200 using the adhesive 600 as described above will be described in detail.

11 is a block diagram illustrating a structure of a bonding apparatus according to an embodiment, and FIGS. 12 to 17 are diagrams for explaining a bonding method according to an embodiment. The bonding apparatus illustrated in FIG. 11 is a part of a manufacturing apparatus for manufacturing the display device 1 of FIG. 1 , and may be configured to perform a bonding process that is a part of the manufacturing process of the display device 1 .

Referring to FIG. 11 , a bonding apparatus according to an embodiment may include a COF bonding process unit 10 and a PCB bonding process unit 20 .

The COF bonding process unit 10 performs a process of attaching the flexible film 500 (ie, chip-on-film) on which the data driver 320 is mounted on the display panel 200 . The COF bonding process unit 10 may include a buffer unit 11 , an adhesive unit 12 , a pressure bonding unit 13 , a main compression bonding unit 14 , an ACF conveying unit 15 , and a COF conveying unit 16 .

The buffer unit 11 , the bonding unit 12 , the pressure bonding unit 13 , and the main compression bonding unit 14 may each be configured as a conveyor that accommodates the display panel 200 and is provided to be transportable in both directions. Each of the conveyors of the buffer unit 11 , the bonding unit 12 , the pressure bonding unit 13 and the main crimping unit 14 moves from the buffer unit 11 to the PCB bonding unit 20 during the TAB process in the direction of the display panel ( 200) is transferred.

First, the display panel 200 may be seated on the buffer unit 11 . The display panel 200 on the buffer unit 11 may be transferred to the adhesive unit 12 by a conveyor.

As shown in FIG. 12 , the display panel 200 may include a plurality of data connection pads SP formed on the lower substrate 220 . Also, the display panel 200 may include at least one first alignment key AKa formed on the lower substrate 220 . The data connection pads SP and the first alignment key AKa may have a predetermined relative arrangement relationship. The display panel 200 is seated on the buffer unit 11 with the data connection pads SP and the first alignment key AKa exposed at the top, and aligned adjacent to the adhesive transfer unit 15 .

The adhesive part 12 attaches the adhesive 600 to one side of the lower substrate 220 . In an embodiment, the adhesive part 12 may attach the adhesive 600 transferred from the adhesive transport part 15 to the data connection pads SP of the lower substrate 220 .

As described with reference to FIG. 4 , the adhesive 600 includes an anisotropic conductive film ACF and non-conductive films NCF1 and NCF2 having patterned conductive particle groups and a third alignment key AK. The patterned conductive particles CP and the third alignment key AK have the same relative arrangement relationship as the data access pads SP and the first alignment key AKa formed on the lower substrate 220 .

Referring to FIG. 13 , the third alignment key AK of the adhesive 600 and the first alignment key AKa of the lower substrate 220 are aligned. Then, the patterned conductive particle groups of the adhesive 600 and the data connection pads SP may be aligned 1:1. Thereafter, the adhesive 600 is attached on the data connection pads SP as shown in FIG. 14 .

The pressure bonding unit 13 may pressure bonding one side of the flexible film 500 onto the adhesive 600 . In an embodiment, the pressure bonding unit 13 receives the flexible film 500 on which the data driving unit 320 is mounted from the COF conveying unit 16 and press-bonds the conveyed flexible film 500 onto the adhesive 600 . can do.

As shown in FIG. 15 , the flexible film 500 may include a plurality of lead lines LL. In addition, the flexible film 500 may include at least one second alignment key AKb. The lead line LL and the second alignment key AKb may have the same relative arrangement relationship between the patterned conductive particles CP and the third alignment key AK.

Referring to FIG. 15 , the second alignment key AKb of the flexible film 500 and the third alignment key AK of the adhesive 600 are aligned. Then, the patterned conductive particle groups of the adhesive 600 and the conductive lead lines LL may be aligned 1:1. Thereafter, the flexible film 500 is press-bonded onto the adhesive 600 as shown in FIG. 16 .

The main compression unit 14 may perform main compression bonding of the press-bonded flexible film 500 . The flexible film 500 and the adhesive 600, and the adhesive 600 and the lower substrate 220 may be physically and completely attached to each other by the main compression bonding.

In an embodiment, the main compression unit 14 may include a compression head to which a heat source is installed, and a compression tip attached to one end of the compression head to compress the flexible film 500 on the adhesive 600 . The compression tip may be raised and lowered through a tip lifting unit composed of a cylinder or a motor to press the chip-on-film toward the anisotropic conductive film.

The compression head may include a heat source. The heat source of the pressing head may be, for example, a heating coil. Heat generated from the heat source is applied to the adhesive 600 to partially melt the polymer resin PL and the non-conductive film NCF of the anisotropic conductive film ACF. The molten polymer resin (PL) and the non-conductive film (NCF) have adhesive properties to enable bonding between the flexible film 500 and the lower substrate 220 .

In various embodiments, the configuration of the main compression unit 14 is not limited to the above. Depending on the implementation, the main compression unit 14 may not include some of the above-described components, or may further include other components.

Referring to FIG. 17 , as the conductive particles CP are patterned to correspond to the shapes of the data connection pads SP and the conductive lead lines LL on the anisotropic conductive film ACF, the data connection pads SP and The conductive particles CP may be interposed only between the conductive lead lines LL, thereby improving electrical connectivity between the data connection pads SP and the conductive lead lines LL. In addition, an electrical short between the data connection pads SP and an electrical short between the conductive lead lines LL can be prevented.

The PCB bonding process unit 20 performs a process of bonding the printed circuit board 100 to the flexible film 500 of the display panel 200 transferred from the COF bonding unit 10 . The adhesion of the printed circuit board 100 may be performed, for example, by a soldering process, but a specific process method thereof is not particularly limited.

Those of ordinary skill in the art to which the present invention pertains will understand that the present invention may be embodied in other specific forms without changing the technical spirit or essential features thereof. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims to be described later rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are interpreted as being included in the scope of the present invention. should be

1: display device
100: printed circuit board
200: display panel
300: drive unit
500: flexible film
600: adhesive

Claims (13)

a display panel including a plurality of connection pads and a first alignment key;
a flexible film comprising a plurality of conductive lead lines and a second alignment key; and
an adhesive interposed between the display panel and the flexible film and including a plurality of conductive particles;
Some of the plurality of conductive particles constitute a plurality of groups of conductive particles disposed to correspond to the plurality of connection pads and the plurality of conductive lead lines,
A remaining portion of the plurality of conductive particles constitutes a third alignment key. According to claim 1, wherein the adhesive,
an anisotropic conductive film in which the plurality of conductive particles are dispersed in a polymer resin;
a first non-conductive film disposed between the anisotropic conductive film and the flexible film; and
and a second non-conductive film disposed between the anisotropic conductive film and the display panel. According to claim 2, Each of the plurality of conductive particle groups,
A display device comprising two or more conductive particles and disposed between one connection pad and one conductive lead line facing the one connection pad. According to claim 1, wherein the third sort key,
aligned with the first alignment key and the second alignment key. According to claim 1,
The relative positions of the plurality of conductive particle groups with respect to the third alignment key, the relative positions of the plurality of connection pads with respect to the first alignment key, and the relative positions of the conductive lead lines with respect to the second alignment key are the same. set, display device. an anisotropic conductive film including conductive particles dispersed in a polymer resin;
a first non-conductive film disposed under the anisotropic conductive film; and
A second non-conductive film disposed on the anisotropic conductive film,
The anisotropic conductive film,
a plurality of first conductive particle groups in which the conductive particles are disposed in a first pattern; and
An adhesive comprising a second group of conductive particles in which the conductive particles are arranged in a second pattern. According to claim 6, The second group of conductive particles,
The adhesive is aligned with the first alignment key of the display panel to which the adhesive is attached and the second alignment key of the flexible film to which the adhesive is attached. According to claim 7, The first conductive particle groups,
Adhesive, which is disposed at a predetermined relative position with respect to the second group of conductive particles. The method of claim 8, wherein the relative position,
and the relative positions of the connection pads of the display panel with respect to the first alignment key of the display panel and the relative positions of the conductive lead lines of the flexible film with respect to the second alignment key of the flexible film are set to be the same. An apparatus for manufacturing a display device, comprising:
an adhesive unit for bonding an adhesive on the plurality of connection pads of the display panel;
a pressing unit for pressing a flexible film having a plurality of conductive lead lines formed on the adhesive; and
Including a PCB bonding process unit for attaching a printed circuit board to the flexible film,
The adhesive is
a plurality of conductive particle groups each having a plurality of conductive particles arranged in a first pattern; and
An apparatus comprising an alignment key comprised of a plurality of conductive particles arranged in a second pattern. The method of claim 10, wherein the adhesive portion,
After aligning the first alignment key formed on the display panel and the alignment key of the adhesive, the adhesive is attached to the plurality of connection pads;
As the first alignment key and the alignment key are aligned, the plurality of conductive particle groups and the plurality of connection pads are aligned. 12. The method of claim 11, wherein the compression portion,
After aligning the alignment key of the adhesive and the second alignment key formed on the flexible film, pressing the flexible film on the adhesive,
As the second alignment key and the alignment key are aligned, the plurality of conductive particle groups and the plurality of conductive lead lines are aligned. A method of manufacturing a display device using an adhesive comprising: an alignment key composed of a plurality of conductive particle groups each having a plurality of conductive particles arranged in a first pattern and a plurality of conductive particles arranged in a second pattern, the method comprising:
aligning the first alignment key formed on the display panel with the alignment key of the adhesive;
attaching the adhesive on the display panel;
aligning the second alignment key formed on the flexible film with the alignment key of the adhesive; and
and pressing the flexible film on the adhesive.

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