KR20210080893A - Adhesive film and display device, manufacturing apparatus and manufacturing method thereof - Google Patents

Abstract

The present disclosure relates to a display device, AND a manufacturing device and a manufacturing method thereof. According to an embodiment of the present invention, the display device comprises: a display panel on which a plurality of connection pads are formed; a flexible film disposed on the display panel and having conductive lead lines facing each of the plurality of connection pads; and an adhesive interposed between the display panel and the flexible film in which at least one first particle and at least one second particle are disposed, wherein the first particle is a conductor including a conductive layer, and the second particle is a non-conductor.

Description

Adhesive and display device, its manufacturing apparatus, and manufacturing method TECHNICAL FIELD

The present invention relates to a display device, an apparatus for manufacturing the same, and a manufacturing method thereof.

Recently, as an adhesive for physically and electrically connecting electronic components, an anisotropic conductive film (ACF) has been used. When an anisotropic conductive film is interposed between electronic components and the electrode portion is thermocompressed, particles are interposed between the electrodes of the electronic component to be electrically connected, and the electronic component can be physically bonded while maintaining insulation in the remaining area. .

The above-mentioned background art is technical information possessed by the inventor for derivation of the present invention or acquired in the process of derivation of the present invention, and cannot necessarily be said to be a known technique disclosed to the general public prior to the filing of the present invention.

Embodiments provide a display device in which electrical connectivity between a lead line of a chip-on film and a data connection pad of a display panel assembly is improved by using an adhesive including a patterned non-conductive film (Non-conductive Film; 1), and an apparatus for manufacturing and manufacturing the same provide a way

As a means for solving the above problems, the present invention has an embodiment characterized by the following.

A display device according to an embodiment includes a display panel on which a plurality of connection pads are formed; a flexible film disposed on the display panel and having conductive lead lines facing each of the plurality of connection pads; and an adhesive interposed between the display panel and the flexible film in which at least one first particle and at least one second particle are disposed. Including, wherein the first particle is a conductor including a conductive layer, the second particle is characterized in that the non-conductor.

In the first region of the adhesive, a density of first particles is greater than a density of second particles, and the first region is a region interposed between the connection pads and the conductive lead lines.

In the second region that is the remaining region other than the first region of the adhesive, the density of the first particles is smaller than the density of the second particles.

The first particle density in the first region of the adhesive is less than the second particle density in the second region of the adhesive.

The adhesive may include an anisotropic conductive film in which the first particles and the second particles are dispersed in a polymer resin; A non-conductive film comprising an adhesive material having insulating properties, wherein the non-conductive film includes: a first non-conductive film disposed on one side of the anisotropic conductive film; and a second non-conductive film disposed on the other side of the anisotropic conductive film.

The gaps between the plurality of connection pads and the gaps between the conductive lead lines are filled with at least one of the polymer resin and the non-conductive film.

The adhesive according to an embodiment may include an anisotropic conductive film including at least one first particle and at least one second particle dispersed and disposed in a polymer resin; a first non-conductive film disposed on one side of the anisotropic conductive film; and a second non-conductive film disposed on the other side of the anisotropic conductive film, wherein the first particle is a conductor including a conductive layer, and the second particle is a non-conductor.

The first particles are disposed in a first region of the anisotropic conductive film, and the second particles are disposed in a second region of the anisotropic conductive film.

The first region may be a region where connection pads of the display panel to which the adhesive is attached and conductive lead lines of the flexible film to which the adhesive is attached are attached.

The density of the first particles is characterized in that smaller than the density of the second particles.

According to an exemplary embodiment, an apparatus for manufacturing a display device includes an adhesive unit for bonding an adhesive on a plurality of connection pads of a display panel; a pressing unit for pressing a flexible film having a plurality of conductive lead lines formed on the adhesive; and a PCB bonding process unit for attaching a printed circuit board to the flexible film, wherein the adhesive includes at least one first particle dispersed in a first area in a polymer resin and dispersed in a second area in the polymer resin an anisotropic conductive film comprising at least one second particle; Including, wherein the first particle is a conductor including a conductive layer, the second particle is characterized in that the non-conductor.

The adhesive part may attach the adhesive on the plurality of connection pads after aligning the first region with the plurality of connection pads.

The compression unit may press the flexible film onto the adhesive after aligning the plurality of conductive lead lines in the first region.

According to an exemplary embodiment, a method of manufacturing a display device using an adhesive may include aligning a first area with a plurality of connection pads formed on a display panel; adhering an adhesive onto the plurality of connection pads; aligning a plurality of conductive lead lines formed on a flexible film in the first region; and pressing the flexible film onto the adhesive. It is characterized in that it includes.

The display device, the manufacturing apparatus, and the manufacturing method according to the embodiments may improve electrical connectivity between the lead line of the chip-on-film and the data connection pad of the display panel assembly.

In addition, the display device, the manufacturing apparatus thereof, and the manufacturing method according to the embodiments may reduce the cost of the adhesive and prevent a short circuit between the data connection pads due to aggregation of particles.

1 is a plan view of a display device according to an exemplary embodiment.
FIG. 2 is a circuit diagram illustrating an exemplary embodiment of the sub-pixel shown in FIG. 1 .
FIG. 3 is an enlarged plan view of area AA of FIG. 1 , and FIG. 4 is a cross-sectional view taken along line II′ of FIG. 3 .
5 is a cross-sectional view of an adhesive according to an embodiment of the present invention.
6 is a block diagram illustrating a structure of a bonding apparatus according to an exemplary embodiment.
7 to 8 are diagrams for explaining a bonding process according to the embodiment of FIG. 5 .
9 is a cross-sectional view of a particle according to an embodiment of the present invention.
10A is a perspective view of an adhesive according to an embodiment of the present invention, and FIG. 10B is a cross-sectional view.
11 is a cross-sectional view of an adhesive according to another embodiment of the present invention.
12 to 18 are views for explaining a bonding process using the adhesive according to the embodiment of FIG. 11 .

Since the present invention can have various changes and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

In describing each figure, like reference numerals have been used for like elements. In the accompanying drawings, the dimensions of the structures are enlarged than the actual size for clarity of the present invention. Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In this application, "includes." Or "have." The term such as is intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and is intended to indicate that one or more other features or numbers, steps, operation, component, part or It should be understood that it does not preclude the possibility of the existence or addition of combinations thereof. Also, when a part of a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where it is "directly on" another part, but also the case where another part is in the middle. In addition, in the present specification, when a portion such as a layer, film, region, or plate is formed on another portion, the formed direction is not limited only to the upper direction, and includes those formed in the side or lower direction. Conversely, when a part of a layer, film, region, plate, etc. is said to be “under” another part, this includes not only cases where it is “directly under” another part, but also a case where another part is in between.

1 is a plan view of a display device according to an exemplary embodiment.

Referring to FIG. 1 , a display device 1 includes a printed circuit board (PCB) 100 , a display panel 200 , and a driving unit 300 .

The printed circuit board 100 may provide various control signals and/or power to the drivers 300 .

The timing controller 110 may process the image signal and the control signal to suit the operating conditions of the display panel 200 to generate and output image data, a gate driving control signal, a data driving control signal, and a power supply control signal. .

The power supply unit 120 may generate a voltage to be provided to the pixels PX and the driver 300 based on the power supply control signal. The voltage may include, for example, a high potential driving voltage, a low potential driving voltage, and a voltage for driving the driving unit 300 . The power supply 120 may provide the generated voltage to the pixels PX and the driver 300 .

The display panel 200 includes a lower substrate 220 and an upper substrate 210 . The display panel 200 includes a display area DA in which the lower substrate 220 and the upper substrate 210 overlap and a non-display area NDA in which the lower substrate 220 and the upper substrate 210 do not overlap. can be made with The display area DA is an area in which the pixels PX are disposed and may be referred to as an active area. The non-display area NDA may be disposed around the display area DA. For example, the non-display area NDA may be disposed along the edge of the display area DA. The non-display area NDA may comprehensively mean an area other than the display area DA on the display panel 200 , and may be referred to as a non-active area.

Gate lines GL1 to GLn, data lines DL1 to DLm, and pixels PX connected to the gate lines GL1 to GLn and the data lines DL1 to DLm are formed on the lower substrate 220 . can be Power lines (not shown) may be further formed on the lower substrate 220 .

A plurality of data connection pads (not shown) may be provided on the lower substrate 220 . The data connection pads are not covered by the insulating layer and are exposed to the outside of the lower substrate 220 to be electrically connected to the printed circuit board 100 and the data driver 320 .

The driver 300 includes a gate driver 310 and a data driver 320 .

The gate driver 310 may be connected to the pixels PX of the display area DA through the plurality of gate lines GL1 to GLn. The gate driver 310 may generate gate signals based on a gate driving control signal supplied from the timing controller. The gate driver 310 may provide the generated gate signals to the pixels PX through the plurality of gate lines GL1 to GLn.

The data driver 320 may be connected to the pixels PX of the display area DA through a plurality of data lines DL1 to DLm. The data driver 320 may generate data signals based on image data output from the timing controller and a data driving control signal. The data driver 320 may provide the generated data signals to the pixels PX through the plurality of data lines DL1 to DLm.

In an embodiment, the data driver 320 may be manufactured using an integrated circuit chip (IC chip). The integrated circuit chip may be mounted on a flexible film in which a plurality of conductive lead lines are formed on an insulating film, such as polyimide, to constitute a Chip On Film (COF). Such a chip-on-film may be referred to as a tape carrier package (TCP).

One side of the chip-on film is attached to the display panel 200 through an adhesive or the like, and the other side is attached to the printed circuit board 100 through soldering or the like. Components (eg, the timing control unit 110 , the power supply unit 120 ), the data driver 30 , and the display panel 200 on the printed circuit board 100 through the lead lines formed on the flexible film 500 . Components (eg, the gate driver 310 , the pixels PXs, the gate lines GL1 to GLn, and the data lines DL1 to DLm) may be electrically connected to each other.

Each pixel PX may be electrically connected to a corresponding gate line and data line. The pixels PX may emit light with luminance corresponding to the gate signal and the data signal supplied through the gate lines GL1 to GLn and the data lines DL1 to DLm.

Each pixel PX may display any one of the first to third colors.

FIG. 2 is a circuit diagram illustrating an exemplary embodiment of the sub-pixel shown in FIG. 1 .

FIG. 2 illustrates the sub-pixel sPij connected to the i-th gate line GLi and the j-th data line DLj as an example.

Referring to FIG. 2 , the sub-pixel sP includes a switching transistor ST, a driving transistor DT, a storage capacitor Cst, and a light emitting device LD.

The first electrode (eg, the source electrode) of the switching transistor ST is electrically connected to the j-th data line DLj, and the second electrode (eg, the drain electrode) is connected to the first node N1 and electrically connected. The gate electrode of the switching transistor ST is electrically connected to the i-th gate line GLi. The switching transistor ST is turned on when the gate signal of the gate-on level is applied to the i-th gate line GLi and transfers the data signal applied to the j-th data line DLj to the first node N1 . .

A first electrode of the storage capacitor Cst may be electrically connected to the first node N1 , and a second electrode may be configured to receive the high potential driving voltage ELVDD. The storage capacitor Cst may be charged with a voltage corresponding to a difference between the voltage applied to the first node N1 and the high potential driving voltage ELVDD.

The first electrode (eg, the source electrode) of the driving transistor DT is configured to receive the high potential driving voltage ELVDD, and the second electrode (eg, the drain electrode) of the light emitting element LD is electrically connected to one electrode (eg, an anode electrode). The gate electrode of the driving transistor DT is electrically connected to the first node N1 . The driving transistor DT is turned on when a gate-on level voltage is applied through the first node N1 , and controls the amount of driving current flowing through the light emitting device LD in response to the voltage applied to the gate electrode. can

The light emitting element LD outputs light corresponding to the driving current. The light emitting device LD may output light corresponding to any one of red, green, blue, and white. Hereinafter, the technical idea of the present embodiment will be described with reference to an embodiment in which the light emitting device LD is configured of an organic light emitting diode.

In the present embodiment, the structure of the sub-pixels sP is not limited to that illustrated in FIG. 2 . According to an embodiment, the sub-pixels sP are configured to compensate the threshold voltage of the driving transistor DT or initialize the voltage of the gate electrode of the driving transistor DT and/or the voltage of the anode electrode of the light emitting device LD. It may further include at least one element.

2 illustrates an example in which the switching transistor ST and the driving transistor DT are NMOS transistors, but the present embodiment is not limited thereto.

FIG. 3 is an enlarged plan view of area AA of FIG. 1 , and FIG. 4 is a cross-sectional view taken along line II′ of FIG. 3 .

1 to 4 together, the display device 1 may include a display panel 200 and a driver 300 .

The display panel 200 includes a lower substrate 220 and an upper substrate 210 . In the lower substrate 220 , a plurality of signal lines DL1 , DL2 , and GL1 are formed in the non-display area NDA, and a plurality of pixels PX1 and PX2 are formed in the display area DA. The upper substrate 210 may cover the pixels PX1 and PX2 .

A pad area is provided in the non-display area NDA of the lower substrate 220 . Data connection pads SP1 and SP2 respectively extending from the data lines DL1 and DL2 are formed in the pad area. In the illustrated embodiment, the first data connection pad SP1 extends from the first data line DL1 connected to the first pixel PX1 , and the second data connection pad SP2 includes the second pixel PX2 . It extends from the second data line DL2 connected to .

The data driver 320 may be mounted on a flexible film 500 including a base film and a plurality of conductive lead lines LL1 and LL2 formed on the base film to form a chip-on-film. The base film may be an insulating film composed of polyimide or the like. The conductive lead lines LL1 and LL2 may be formed of a conductive material such as copper (Cu), nickel (Ni), and gold (Au).

One side of the flexible film 500 is attached to the lower substrate 220 of the display panel 200 . When the base film of the flexible film 500 is attached to the lower substrate 220 , some of the conductive lead lines LL1 and LL2 (ie, input-side lead lines) are electrically connected to the data connection pads SP1 and SP2. can be connected to

The opposite side of the flexible film 500 is connected to the printed circuit board 100 . In this case, other portions (ie, output-side lead lines) of the conductive lead lines LL1 and LL2 may be electrically connected to the printed circuit board 100 .

The flexible film 500 may be attached to the lower substrate 220 through a TAB process using the adhesive 600 . The adhesive 600 may include an anisotropic conductive film (ACF) in which particles CP are dispersed in a polymer resin. The particle CP may be composed of a conductor. When heat and pressure are applied to the anisotropic conductive film during the TAB process, the polymer resin is melted and the particles CP may electrically connect the conductive lead lines LL1 and LL2 and the data connection pads SP1 and SP2, respectively.

Hereinafter, a more specific configuration of the adhesive 600 will be described.

<Adhesive. Example 1>

5 is a cross-sectional view of an adhesive according to an embodiment of the present invention.

The adhesive 600 according to an embodiment may include a second non-conductive film NCF2 , an anisotropic conductive film ACF, and a first non-conductive film NCF1 .

The anisotropic conductive film ACF may include a polymer resin PL that is cured by heat and particles CP dispersed in the polymer resin PL. Polymer resin (PL) is styrene butadiene rubber (Styrene Butadiene Rubber), polyvinyl (Polyvinyl), butylene (Butylene), epoxy resin (Epoxy Resin), polyurethane (Polyurethane) and polymers such as acrylic resin (Acrylic Resin) polymer).

The adhesive 600 may be divided into a first region 610 and a second region 620 . The first region 610 is a region where connection pads of the display panel and conductive lead lines of the flexible film are bonded, and the second region 620 is a region other than the first region. In the first embodiment shown in FIG. 5 , the particles CP have uniform density and are uniformly distributed in the first region 610 and the second region 620 of the adhesive. Also, in the first embodiment, the particles CP are composed of a single type, unlike the second and third embodiments to be described later.

The particle CP is a particle having a size of several hundred nanometers, and may be composed of a conductor including a conductive layer on the surface. The particles (CP) may be composed of several layers. For example, the particles CP may include an insulating layer and a conductive layer surrounding the insulating layer. The conductive layer of the particles CP may be formed of a metal such as nickel, gold, platinum, or a compound thereof. The insulating layer may be formed of a polymer such as styrene or acrylic. The particle diameter of the particles CP is 1 to 10 μm, preferably 2 to 5 μm. The content of the particles (CP) may be 1 to 30 parts by weight based on 100 parts by weight of the entire anisotropic conductive film (ACF).

When heat and pressure are applied to the anisotropic conductive film ACF, the polymer resin PL is melted and the particles CP become flowable in the polymer resin PL. The flowable particle CP may be connected to the conductive lead lines LL1 and LL2 and the data connection pads SP1 and SP2 to electrically connect them. Accordingly, the anisotropic conductive film (ACF) may have both conductivity and adhesiveness.

The particles CP may be randomly disposed in the anisotropic conductive film ACF. Accordingly, a relatively large amount of the particles CP may be distributed in a portion of the anisotropic conductive film ACF, and a relatively small amount of the particles CP may be distributed in another portion of the anisotropic conductive film ACF. When the anisotropic conductive film ACF is pressed, if the particles CP between the data connection pads SP1 and SP2 and the conductive lead lines LL1 and LL2 are significantly less or no particles exist, the data connection pads SP1 and SP2 ) and the conductive lead lines LL1 and LL2 are not electrically connected correctly. Conversely, when the anisotropic conductive film ACF is pressed, aggregation of the particles CP occurs in a region where the particles CP are remarkably distributed, and/or between and/or adjacent to the adjacent data connection pads SP1 and SP2. An electrical short may occur between the conductive lead lines LL1 and LL2.

In order to solve this problem, in the embodiment of FIG. 5 , the particles CP are uniformly distributed in the anisotropic conductive film ACF.

However, even when the particles CP are uniformly disposed in the anisotropic conductive film ACF as shown in FIG. 5 , electrical power is generated between adjacent data connection pads SP1 and SP2 and/or between adjacent conductive lead lines LL1 and LL2 . The problem of short circuits is not sufficiently solved. In addition, the problem of poor connection between the conductive lead lines respectively connected to the connection pads (eg, the connection between SP1 and LL1 and the connection between SP2 and LL2) is not sufficiently solved. These problems will be described later with reference to FIGS. 6 to 8 . And second and third embodiments for improving this will be described later with reference to FIGS. 9 to 18 .

6 is a block diagram illustrating a structure of a bonding apparatus according to an exemplary embodiment.

7 to 8 are diagrams for explaining a bonding process according to the embodiment of FIG. 5 .

Referring to FIG. 6 , a bonding apparatus according to an embodiment may include a COF bonding process unit 10 and a PCB bonding process unit 20 .

The COF bonding process unit 10 performs a process of attaching the flexible film 500 (ie, chip-on-film) on which the data driver 320 is mounted on the display panel 200 . The COF bonding process unit 10 may include a buffer unit 11 , an adhesive unit 12 , a pressure bonding unit 13 , a main compression bonding unit 14 , an ACF conveying unit 15 , and a COF conveying unit 16 .

The buffer unit 11 , the bonding unit 12 , the pressure bonding unit 13 , and the main compression bonding unit 14 may each be configured as a conveyor that accommodates the display panel 200 and is provided to be transportable in both directions. Each of the conveyors of the buffer unit 11 , the bonding unit 12 , the pressure bonding unit 13 and the main crimping unit 14 moves from the buffer unit 11 to the PCB bonding unit 20 during the TAB process in the direction of the display panel ( 200) is transferred.

First, the display panel 200 may be seated on the buffer unit 11 . The display panel 200 on the buffer unit 11 may be transferred to the adhesive unit 12 by a conveyor.

The display panel 200 may include a plurality of data connection pads SP formed on the lower substrate 220 . The display panel 200 is seated on the buffer unit 11 in a state in which the data connection pads SP are exposed upward and aligned adjacent to the adhesive transfer unit 15 .

The adhesive part 12 attaches the adhesive 600 to one side of the lower substrate 220 . In an embodiment, the adhesive part 12 may attach the adhesive 600 transferred from the adhesive transport part 15 to the data connection pads SP of the lower substrate 220 .

The pressure bonding unit 13 may pressure bonding one side of the flexible film 500 onto the adhesive 600 . The flexible film 500 may constitute a chip-on-film by mounting the data driver 320 . In an embodiment, the pressure bonding unit 13 receives the flexible film 500 on which the data driving unit 320 is mounted from the COF conveying unit 16 and press-bonds the conveyed flexible film 500 onto the adhesive 600 . can do.

The main compression unit 14 may perform main compression bonding of the press-bonded flexible film 500 . The flexible film 500 and the adhesive 600, and the adhesive 600 and the lower substrate 220 may be physically and completely attached by the main compression bonding.

In an embodiment, the main compression unit 14 may include a compression head to which a heat source is installed, and a compression tip attached to one end of the compression head to compress the flexible film 500 on the adhesive 600 . The compression tip may be raised and lowered through a tip lifting unit composed of a cylinder or a motor to press the chip-on-film toward the anisotropic conductive film.

The compression head may include a heat source. The heat source of the pressing head may be, for example, a heating coil. Heat generated from the heat source is applied to the adhesive 600 to partially melt the polymer resin PL and the non-conductive films NCF1 and NCF2 of the anisotropic conductive film ACF. The molten polymer resin PL and the non-conductive films NCF1 and NCF2 have adhesive properties to enable bonding between the flexible film 500 and the lower substrate 220 .

In various embodiments, the configuration of the main compression unit 14 is not limited to the above. Depending on the implementation, the main compression unit 14 may not include some of the above-described components, or may further include other components.

When pressed in the downward direction by the main pressure bonding unit 14, the polymer resin PL of the non-conductive films NCF1 and NCF2 and the anisotropic conductive film ACF is melted. At this time, as shown in FIG. 7 , the connection pad in the first region 610 to which the conductive lead lines (eg, the connection between SP1 and LL1 and the connection between SP2 and LL2) respectively connected to the connection pads are connected. Due to the pressing pressure of SP and the conductive lead line LL, the particles CP of the first region 610 _{receive a force F 12 in} the direction of the second region 620 , and the second region 620 . ), which causes a push-up phenomenon.

Due to this pushing phenomenon, as shown in FIG. 8 , the density of the particles CP in the first region 610 is decreased, and the density of the particles CP in the second region 620 is unnecessarily increased. Due to the low density of the particles CP in the first region 610 , a connection failure may occur between conductive lead lines (eg, SP1 and LL1 connection, SP2 and LL2 connection) respectively connected to the connection pads. have. In addition, in the second region 620 , each of the adjacently disposed connection pads (for example, the connection between SP1 and SP2) and each of the adjacently disposed conductive lead lines due to the particles CP having an unnecessarily increased density (For example, the connection between LL1 and LL2) may be electrically connected to cause a short circuit failure.

9 is a cross-sectional view of a particle according to an embodiment of the present invention.

The first particle CP1 may be formed of a conductor including a conductive layer. As illustrated in FIG. 9A , the first particle CP1 may include an insulating layer PO and a conductive layer ML surrounding the insulating layer PO. The conductive layer ML of the particles CP may be formed of a metal such as nickel, gold, platinum, or a compound thereof. The insulating layer PO may be made of a polymer such as styrene or acrylic.

Meanwhile, the second particle CP2 does not include a conductive layer. That is, the second particle CP2 may be composed of only the insulating layer PO, and may be composed of a non-conductor.

In Example 1 ( FIGS. 5 and 7 to 8 ), each of the connection pads (eg, of SP1 and SP2 ) disposed adjacent to each other due to the particles CP having an unnecessarily increased density in the second region 620 . connection) and each of the adjacent conductive lead lines (eg, the connection between LL1 and LL2) are electrically connected to each other to cause a short circuit defect. In addition, since the particles CP included in the second region 620 only cause short-circuit failure when formed of a conductor, it is preferable to be formed of a non-conductor. In addition, since particles composed of a conductor include a conductive layer, there is a disadvantage in that the price is relatively high compared to particles composed of a non-conductor.

Therefore, when the particles CP included in the second region 620 of the adhesive are composed of a non-conductive material, short defects in the second region 620 can be prevented as well as the manufacturing cost of the adhesive. can save

<Adhesive, second embodiment>

10A is a perspective view of an adhesive according to an embodiment of the present invention, and FIG. 10B is a cross-sectional view.

Referring to FIGS. 10 a and b, the adhesive according to an embodiment of the present invention is anisotropic comprising at least one first particle (CP1) and at least one second particle (CP2) dispersed in a polymer resin. conductive film (ACF); a first non-conductive film (NCF1) disposed on an upper side of the anisotropic conductive film (ACF); and a second non-conductive film NCF2 disposed under the anisotropic conductive film ACF. In addition, the first particle CP1 is a conductor including a conductive layer, and the second particle CP2 is a non-conductor.

The first particle CP1, which is a conductor, is disposed in the first region 610 of the anisotropic conductive film, and the second particle CP2, which is a non-conductor, is disposed in the second region 620 of the anisotropic conductive film.

Accordingly, in the second embodiment, even if the density of the second particles CP2 is increased in the second region 620 , since the second particles CP2 are non-conductive, each of the adjacently disposed connection pads (eg, SP1 ) and SP2) and each of the adjacent conductive lead lines (eg, the connection between LL1 and LL2) are electrically connected to prevent a short circuit from occurring. In addition, the non-conductive second particle CP2 disposed in the second region 620 has a lower price than the first particle CP1 , so that the manufacturing cost of the adhesive is reduced.

<Adhesive, Third Example>

11 is a cross-sectional view of an adhesive according to another embodiment of the present invention.

In the third embodiment shown in FIG. 11 , unlike the second embodiment of FIG. 10 , the density d11 of the first particles CP1 disposed in the first region 610 of the adhesive 600 is the second region 620 . ) is characterized in that it is smaller than the density d22 of the second particles CP2 disposed in the .

d11 < d22

d11: the density of the first particles in the first region.

d22: the density of the second particles in the second region.

As shown in FIG. 11 , three first particles CP1 are disposed in the first region 610 of the adhesive 600 . In contrast, five second particles CP2 are disposed in the second region 620 of the adhesive 600 . That is, in the third embodiment shown in FIG. 11 , in the adhesive 600 , the density d11 of the first particles CP1 disposed in the first area 610 is the second area disposed in the second area 620 . It is characterized in that it is smaller than the density d22 of the particles CP2. As described above, by arranging the density d11 of the first particle CP1 and the density d22 of the second particle CP2 to be small, the first particle CP1 composed of a conductor in the first region 610 is bonded during the bonding process. It is possible to prevent the first particle CP1 from being separated into the second region 620 due to the pushing phenomenon. Accordingly, it is possible to prevent a connection failure of conductive lead lines (eg, a connection between SP1 and LL1 and a connection between SP2 and LL2 ) respectively connected to the connection pads in the first region 610 . The details thereof will be described with reference to FIGS. 12 to 18 .

12 to 18 are views for explaining a bonding process using the adhesive according to the embodiment of FIG. 11 .

The bonding process may be performed using the bonding apparatus shown in FIG. 6 .

12 shows that the display panel 200 on the buffer unit 11 is transferred to the bonding unit 12 by the conveyor of the bonding apparatus. As shown in FIG. 12 , the display panel 200 may include a plurality of data connection pads SP formed on the lower substrate 220 . In the display panel 200 , the data connection pads SP are exposed at the top.

13 illustrates an operation of aligning the positions of the adhesive 600 and the display panel 200 . In detail, the first area 610 of the adhesive 600 is arranged to correspond to the positions of the data connection pads SP of the lower substrate 220 of the display panel 200 .

14 shows that the adhesive part 12 attaches the lower surface (ie, the surface exposed to the outside) of the second non-conductive film NCF2 on the data connection pads SP. However, this embodiment is not limited thereto, and in another embodiment, the adhesive part 12 may attach the upper surface (ie, the surface exposed to the outside) of the first non-conductive film NCF1 to the data connection pads SP1 and SP2. It can also be attached on top.

15 illustrates a step of aligning the positions of the adhesive 600 , the display panel 200 , and the flexible film 500 . In detail, the first area 610 of the adhesive 600 is arranged to correspond to the positions of the data connection pads SP of the lower substrate 220 of the display panel 200 . In addition, positions of the plurality of conductive lead lines LL formed on the flexible film 500 are aligned to correspond to the first region 610 of the adhesive 600 . Thereafter, the flexible film 500 is press-bonded onto the adhesive 600 as shown in FIG. 16 .

FIG. 17 shows a process in which the main compression unit 14 is press-bonded to the flexible film 500 . The flexible film 500 and the adhesive 600, and the adhesive 600 and the lower substrate 220 may be physically and completely attached to each other by the main compression bonding.

In an embodiment, the main compression unit 14 may include a compression head to which a heat source is installed, and a compression tip attached to one end of the compression head to compress the flexible film 500 on the adhesive 600 . The compression tip may be raised and lowered through a tip lifting unit composed of a cylinder or a motor to press the chip-on-film toward the anisotropic conductive film.

The compression head may include a heat source. The heat source of the pressing head may be, for example, a heating coil. Heat generated from the heat source is applied to the adhesive 600 to partially melt the polymer resin PL and the non-conductive films NCF1 and NCF2 of the anisotropic conductive film ACF. The molten polymer resin PL and the non-conductive films NCF1 and NCF2 have adhesive properties to enable bonding between the flexible film 500 and the lower substrate 220 .

In various embodiments, the configuration of the main compression unit 14 is not limited to the above. Depending on the implementation, the main compression unit 14 may not include some of the above-described components, or may further include other components.

When pressed in the downward direction by the main pressure bonding unit 14, the polymer resin PL of the non-conductive films NCF1 and NCF2 and the anisotropic conductive film ACF is melted. At this time, as shown in FIG. 17 , the connection pad in the first region 610 to which the conductive lead lines respectively connected to the connection pads (eg, connection of SP1 and LL1, connection of SP2 and LL2) are connected. Due to the pressing pressure of SP and the conductive lead line LL, the first particle CP1 of the first region 610 receives a force F _{12 in} the direction of the second region 620 .

Meanwhile, in the third embodiment, the adhesive 600 has a density d11 of the first particles CP1 disposed in the first region 610 and a density d22 of the second particles CP2 disposed in the second region 620 . placed smaller. Due to the high density of the second particles CP2 included in the second region 620 , when the first particles CP1 of the first region 610 try to move to the second region 620 , the A force (F ₂₁ ) is generated.

Therefore, unlike the first and second embodiments, in the third embodiment, when pressed in the downward direction by the main compression unit 14 , the first particles CP1 are pushed in the direction of the second region 620 . Because not only receives (F ₁₂ ), but also receives a force F ₂₁ , which prevents movement to the second region 620 , the first particle CP1 leaves the first region 610 in the present compression process. Without it, you can stay in place.

Accordingly, in the third embodiment, since the first particle CP1 is prevented from being pushed during the compression process, conductive lead lines (eg, conductive lead lines connected to the connection pads in the first region 610 ) respectively. For example, the connection between SP1 and LL1 and the connection between SP2 and LL2) have the effect of preventing a connection failure.

18 illustrates a display device in which a bonding process is completed using an adhesive according to the third exemplary embodiment.

In the display device in which the bonding process is completed, the adhesive 600 is composed of a first particle CP1 that is a conductor including a conductive layer, and a second particle CP2 that is a non-conductor.

First particles CP1 in the first region 610 of the adhesive 600 interposed between the connection pads SP formed on the lower substrate 220 of the display panel and the conductive lead lines LL formed on the flexible film It is characterized in that the density d11 of the second particle CP2 is larger than the density d12 of the second particle CP2.

d11 > d12

d11: the density of the first particles in the first region.

d12: the density of the second particles in the first region.

In addition, in the second region 620 , which is the remaining region other than the first region 610 , a density d21 of the first particles CP1 is arranged to be smaller than a density d22 of the second particles CP2 .

d21 < d22

d21: density of the first particles in the second region.

d22: the density of the second particles in the second region.

In addition, it is characterized in that the density d11 of the first particles CP1 in the first region 610 is smaller than the density d22 of the second particles CP2 in the second region 620 .

d11 < d22

It should be understood that the embodiments described above are illustrative in all respects and not restrictive. The scope of the present invention is indicated by the following claims rather than the above detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the claims of the present invention. .

1: display device
100: printed circuit board
200: display panel
300: drive unit
500: flexible film
600: adhesive

Claims (14)

a display panel on which a plurality of connection pads are formed;
a flexible film disposed on the display panel and having conductive lead lines facing each of the plurality of connection pads; and
an adhesive interposed between the display panel and the flexible film, in which at least one first particle and at least one second particle are disposed; including,
The display device of claim 1, wherein the first particle is a conductor including a conductive layer, and the second particle is a non-conductor.
According to claim 1,
the display device
In the first region of the adhesive, the density of the first particles is greater than the density of the second particles;
The display device of claim 1, wherein the first region is a region interposed between the connection pads and the conductive lead lines.
3. The method of claim 2,
the display device
in the second region of the adhesive, the density of the first particles is less than the density of the second particles;
and the second area is a remaining area other than the first area.
According to claim 1,
the display device
the first particle density in the first region of the adhesive is less than the second particle density in the second region of the adhesive;
the first region is a region interposed between the connection pads and the conductive lead lines;
and the second area is a remaining area other than the first area.
According to claim 1,
The adhesive is
an anisotropic conductive film in which the first particles and the second particles are dispersed in a polymer resin; and
Including a non-conductive film composed of an adhesive material having insulation,
The non-conductive film,
a first non-conductive film disposed on one side of the anisotropic conductive film; and
and a second non-conductive film disposed on the other side of the anisotropic conductive film.
6. The method of claim 5,
and gaps between the plurality of connection pads and gaps between the conductive lead lines are filled by at least one of the polymer resin and the non-conductive film.
An anisotropic conductive film comprising at least one first particle and at least one second particle dispersed and disposed in a polymer resin;
a first non-conductive film disposed on one side of the anisotropic conductive film; and
A second non-conductive film disposed on the other side of the anisotropic conductive film,
The first particle is a conductor including a conductive layer, the second particle is an adhesive, characterized in that the non-conductor.
8. The method of claim 7,
The first particles are disposed in a first region of the anisotropic conductive film,
The second particle is an adhesive, characterized in that disposed in the second region of the anisotropic conductive film.
9. The method of claim 8,
the first area
and an area in which connection pads of the display panel to which the adhesive is attached and conductive lead lines of the flexible film to which the adhesive is attached are attached.
9. The method of claim 8,
The adhesive, characterized in that the density of the first particles is less than the density of the second particles.
An apparatus for manufacturing a display device, comprising:
an adhesive unit for bonding an adhesive on the plurality of connection pads of the display panel;
a pressing unit for pressing a flexible film having a plurality of conductive lead lines formed on the adhesive; and
Including a PCB bonding process unit for attaching a printed circuit board to the flexible film,
The adhesive is
an anisotropic conductive film comprising at least one first particle dispersedly disposed in a first region in a polymer resin and at least one second particle dispersedly disposed in a second region in the polymer resin; including,
wherein the first particle is a conductor comprising a conductive layer and the second particle is a non-conductor.
12. The method of claim 11,
The adhesive part,
attaching the adhesive onto the plurality of connection pads after aligning the first region with the plurality of connection pads.
13. The method of claim 12,
The compression unit,
after aligning the plurality of conductive lead lines to the first region, pressing the flexible film onto the adhesive.
An anisotropic conductive film comprising at least one first particle dispersedly disposed in a first region in a polymer resin, and at least one second particle dispersedly disposed in a second region in a polymer resin, wherein the first particle is a conductor including a conductive layer, and the second particle is a method of manufacturing a display device using an adhesive that is a non-conductor,
aligning the first area with a plurality of connection pads formed on a display panel;
attaching the adhesive onto the plurality of connection pads;
aligning a plurality of conductive lead lines formed on a flexible film in the first region; and
compressing the flexible film onto the adhesive; A method of manufacturing a display device comprising:

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