US20200144221A1 - Bonding apparatus and bonding method - Google Patents
Bonding apparatus and bonding method Download PDFInfo
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- US20200144221A1 US20200144221A1 US16/573,086 US201916573086A US2020144221A1 US 20200144221 A1 US20200144221 A1 US 20200144221A1 US 201916573086 A US201916573086 A US 201916573086A US 2020144221 A1 US2020144221 A1 US 2020144221A1
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- display panel
- panel assembly
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- conductive film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
- H01L24/64—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
- H01L24/65—Structure, shape, material or disposition of the connectors prior to the connecting process
- H01L24/67—Structure, shape, material or disposition of the connectors prior to the connecting process of a plurality of connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
- H01L2224/7925—Means for applying energy, e.g. heating means
- H01L2224/793—Means for applying energy, e.g. heating means by means of pressure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
- H01L2224/862—Applying energy for connecting
- H01L2224/86201—Compression bonding
- H01L2224/86203—Thermo-compression bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
- H01L2224/868—Bonding techniques
- H01L2224/8685—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/86855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/86862—Heat curing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Definitions
- the disclosure generally relates to a bonding apparatus and a bonding method.
- a display device includes a driving circuit connected to a signal line to supply signal.
- the driving circuit is typically implemented with an integrated circuit (“IC”) chip.
- the IC chip may include or be configured with a chip-on-film (“COF”) in which a plurality of conductive lead lines are formed on an insulating film such as polyimide.
- COF may be referred to as a tape-carrier-package (“TCP”).
- TCP tape-carrier-package
- TAB tape automated bonding
- the driving circuit attached as described above is electrically connected to a signal line of the display panel assembly through the lead line of the COF.
- the lead line of the COF may include a plurality of output-side lead lines and a plurality of input-side lead lines, which are respectively connected to an output end and an input end of the IC chip.
- the signal line of the display panel assembly may include a plurality of connection pads located in the vicinity of an edge of the display panel assembly.
- the output-side lead line of the COF may be mechanically and electrically connected to the connection pad of the display panel assembly, and the input-side lead line of the COF may be connected a printed circuit board (“PCB”) for transmitting several signals to a driving IC through soldering or the like.
- An output end of the COF and the connection pad of the display panel assembly may be attached to each other through an anisotropic conductive film (“ACF”).
- ACF anisotropic conductive film
- Embodiments provide a bonding apparatus and a bonding method, which simplifies the layout of process facilities through conveyance and rotation in a tape automated bonding (“TAB”) process of a chip-on-film (“COF”).
- TAB tape automated bonding
- COF chip-on-film
- a bonding apparatus includes: an anisotropic conductive film (“ACF”) attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a COF on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed.
- ACF anisotropic conductive film
- each of the ACF attachment unit, the compression unit and the buffer unit may include a conveyor which transfers the display panel assembly in a first direction toward the compression unit from the ACF attachment unit and in a second direction toward the ACF attachment unit from the compression unit.
- the buffer unit may be disposed prior to the ACF attachment unit, and rotate the display panel assembly transferred from the ACF attachment unit by about 180 degrees and then transfer the rotated display panel assembly to the ACF attachment unit.
- the ACF attachment unit may transfer the display panel assembly, to which the first ACF is attached, to the compression unit, and attach the second ACF onto the display panel assembly rotated by the buffer unit.
- the compression unit may transfer the display panel assembly, on which the first COF is compressed, to the ACF attachment unit, and transfer the display panel assembly, on which the second COF is compressed, to an outside.
- the buffer unit may be disposed prior to the compression unit, and rotate the display panel assembly transferred from the compression unit by about 180 degrees and then retransfer the rotated display panel assembly to the compression unit.
- the ACF attachment unit may transfer the display panel assembly, to which the first ACF is attached, to the compression unit, and attach the second ACF to the display panel assembly transferred from the compression unit.
- the compression unit may transfer the display panel assembly, on which the first COF and the second COF are compressed, to the buffer unit, and convey the display panel assembly rotated in the buffer unit to the ACF attachment unit.
- the bonding apparatus may further include: a first ACF transfer unit disposed at a side of the ACF attachment unit, where the first ACF transfer unit may provide the first ACF; and a second ACF transfer unit disposed at an opposing side of the ACF attachment unit, where the second ACF transfer unit may provide the second ACF.
- the bonding apparatus may further include: a first COF transfer unit disposed at a side of the compression unit, where the first COF transfer unit may provide the first COF; and a second COF transfer unit disposed at an opposing side of the compression unit, where the second COF transfer unit may provide the second COF.
- a connection pad on the display panel assembly may be aligned adjacent to the first ACF transfer unit, and be aligned adjacent to the second ACF transfer unit when the display panel assembly is rotated by the buffer unit.
- the first COF may be electrically connected to a first connection pad on the display panel assembly
- the second COF may be electrically connected to a second connection pad on the display panel assembly
- first connection pad and the second connection pad may be connected to a first sub-pixel and a second sub-pixel, respectively.
- the first COF and the second COF may not be aligned with each other in an extending direction of a gate line.
- the compression unit may include: a preliminary compression unit which preliminarily compresses the first COF on the first ACF, and preliminary compresses the second COF on the second ACF; and a primary compression unit which primarily compresses the preliminarily compressed first COF and the preliminarily compressed second COF.
- a bonding mthod includes: a first TAB process including attaching a first ACF and a first COF onto a display panel assembly while the display panel assembly is transferred in a first direction; a retransferring process including conveying the display panel assembly in a second direction opposite to the first direction, and rotating the display panel assembly on a plane; and a second TAB process including attaching a second ACF and a second COF onto the display panel assembly while the rotated display panel assembly is retransferred in the first direction.
- the first TAB process, the retransferring process and the second TAB process may be performed by a bonding apparatus including a conveyor which conveys the display panel assembly in the first direction and the second direction.
- the retransferring process may include: retransferring, in the second direction, the display panel assembly transferred in the first direction; rotating the retransferred display panel assembly by about 180 degrees; and transferring the rotated display panel assembly in the first direction.
- the retransferring process may include: rotating the display panel assembly transferred in the first direction; and retransferring the display panel assembly in the second direction.
- a bonding method includes: a first TAB process including attaching a first ACF onto a display panel assembly in an ACF attachment unit, and compressing a first ACF on the first ACF in a compression unit, while the display panel assembly is transferred in a first direction; a retransferring process including retransferring the display panel assembly in a second direction opposite to the first direction, and rotating the display panel assembly on a plane; and a second TAB process including attaching a second ACF onto the display panel assembly in the ACF attachment unit, and compressing a second COF on the second ACF in the compression unit, while the rotated display panel assembly is transferred in the first direction.
- FIG. 1 is a plan view illustrating a display device according to an embodiment of the disclosure
- FIG. 2 is an enlarged plan view of portion A of FIG. 1 ;
- FIG. 3 is a side view of the portion A of FIG. 1 ;
- FIG. 4 is a block diagram illustrating a structure of a bonding apparatus according to an embodiment of the disclosure.
- FIG. 5 is a block diagram illustrating a structure of a bonding apparatus according to an alternative embodiment of the disclosure.
- FIGS. 6 to 9 are plan views illustrating a bonding method according to an embodiment of the disclosure.
- an expression that an element such as a layer, region, substrate or plate is placed “beneath” or “below” another element indicates not only a case where the element is placed “directly beneath” or “just below” the other element but also a case where a further element is interposed between the element and the other element.
- FIG. 1 is a plan view illustrating a display device according to an embodiment of the disclosure.
- an embodiment of the display device 1000 includes a display panel 900 and a driver 300 .
- the display panel 900 may include a thin film transistor (“TFT”) substrate 100 and a counter substrate 200 .
- the display panel 900 may include a display area DA, in which the TFT substrate 100 and the counter substrate 200 overlap each other, and a peripheral area PA, in which the TFT substrate 100 and the counter substrate 200 do not overlap each other when viewed from a plan view in a thickness direction of the display panel 900 .
- the TFT substrate 100 may include gate lines GL 1 to GLn, source lines SL 1 to SLm, and sub-pixels (or pixels) PX connected to the gate lines GL 1 to GLn and the source lines SL 1 to SLm.
- the driver 300 includes a source driving circuit 320 and a gate driving circuit 310 .
- the driver 300 is disposed in the peripheral area PA to provide a gate signal and a source signal, which are provided from a printed circuit board (“PCB”) 2000 , respectively to the gate lines GL 1 to GLn and the source lines SL 1 to SLm.
- PCB printed circuit board
- FIG. 1 shows an embodiment in which the gate driving circuit 310 is provided or formed at only one side of the display area DA.
- the gate driving circuit 310 may be provided at one side or both sides of the display area DA to be connected to the gate lines GL 1 to GLn.
- the source driving circuit 320 may be provided or formed at an upper side of the display area DA to be connected to one ends of the source lines SL 1 to SLm.
- three source driving circuits 320 and three gate driving circuit 310 may be provided as illustrated in FIG. 1 , but the disclosure is not limited thereto.
- FIG. 2 is an enlarged plan view of portion A of FIG. 1 .
- FIG. 3 is a side view of the portion A of FIG. 1 .
- an embodiment of the display device 1000 includes a display panel assembly 110 , source connection pads SP 1 and SP 2 and source driving circuits 321 and 322 .
- the display panel assembly 110 may include the TFT substrate 100 , in which at least one sub-pixel PX 1 and PX 2 is disposed, and the counter substrate 200 .
- the TFT substrate 100 may be provided in the display area DA on the counter substrate 200 .
- a plurality of sub-pixels PX 1 and PX 2 are defined or formed in the display area DA.
- the sub-pixels PX 1 and PX 2 may be connected to source lines SL 1 and SL 2 , respectively.
- a first sub-pixel PX 1 and a second sub-pixel PX 2 are disposed on different rows that do not overlap each other in a horizontal direction.
- the source connection pads SP 1 and SP 2 extending from the source lines SL 1 and SL 2 , respectively, may be disposed or formed in the peripheral area PA on the TFT substrate 100 .
- a first source connection pad SP 1 extends from a first source line SL 1 connected to the first sub-pixel PX 1
- a second source connection pad SP 2 extends from a second source line SL 2 connected to the second sub-pixel PX 2 .
- the first source connection pad SP 1 and the second source connection pad SP 2 may be disposed on different rows that do not overlap each other in a horizontal direction.
- the horizontal direction may be a direction perpendicular to an extending direction of the source lines SL 1 and SL 2 when viewed from the plan view as shown in FIG. 2 .
- the source driving circuits 321 and 322 may be formed with a chip-on-film (“COF”) that includes a base film (not shown) and a plurality of conductive lead lines (not shown) formed on the base film.
- the base film may be an insulating film including or made of polyimide or the like.
- the conductive lead lines may include or be made of a conductive material such as copper (Cu), nickel (Ni) or gold (Au).
- Some conductive lead lines (e.g., input-side lead lines) among the conductive lead lines may be electrically connected to the source lines SL 1 and SL 2 through the source connection pads SP 1 and SP 2 when the base film is attached to the source connection pads SP 1 and SP 2 .
- a conductive lead line of a first source driving circuit 321 may be electrically connected to the first source connection pad SP 1 .
- a conductive lead line of a second source driving circuit 322 may be electrically connected to the second source connection pad SP 2 .
- the second source driving circuit 322 may have an area wider than that of the first source driving circuit 321 as shown in FIG. 3 to be electrically connected to the second source connection pad SP 2 disposed on a row different from that of the first source connection pad SP 1 .
- the source driving circuits 321 and 322 extend to the outside of the TFT substrate 100 , to be adhered to the PCB 2000 .
- Some conductive lead lines e.g., output-side lead lines
- Some conductive lead lines provided at an extension part among the conductive lead lines of the source driving circuits 321 and 322 may be electrically connected to the PCB 2000 .
- the source driving circuits 321 and 322 may be attached to the source connection pads SP 1 and SP 2 through an anisotropic conductive film ACF, using a tape automated bonding (“TAB”) process.
- TAB tape automated bonding
- the anisotropic conductive film ACF may include a polymer resin PL cured by heat and conductive particles CP dispersed in the polymer resin PL.
- the conductive particles CP may include a metal such as carbon fiber, nickel (Ni), and platinum (Pt), or a compound thereof.
- the polymer resin PL may include styrene butadiene rubber, polyvinyl, butylene, epoxy resin, polyurethane, or acrylic resin.
- the anisotropic conductive film ACF is interposed between the source driving circuits 321 and 322 and the source connection pads SP 1 and SP 2 to electrically and physically connect the source driving circuits 321 and 322 to the source connection pads SP 1 and SP 2 .
- the gate driving circuit 310 of FIG. 1 may be attached onto the display panel assembly 110 , using a method identical or similar to that used for attaching the source driving circuit 320 .
- FIG. 4 is a block diagram illustrating a structure of a bonding apparatus according to an embodiment of the disclosure.
- FIG. 5 is a block diagram illustrating a structure of a bonding apparatus according to an alternative embodiment of the disclosure.
- embodiments of the bonding apparatus according to the disclosure includes a COF adhesion process unit 10 and a PCB adhesion process unit 20 .
- a gate adhesion unit 11 performs a process of adhering or connecting the gate driving circuit 310 to a gate connection pad formed on the display panel assembly 110 .
- the adhesion of the gate driving circuit 310 may be performed using a method identical or similar to that used for bonding the source driving circuit 320 , but a detailed process method is not particularly limited. Alternatively, the gate adhesion unit 11 may be omitted.
- a source adhesion unit 12 may include an ACF attachment unit 121 , a preliminary compression unit 122 , a primary compression unit 123 , a buffer unit 124 , a first ACF transfer unit 125 , a second ACF transfer unit 126 , a first COF transfer unit 127 and a second COF transfer unit 128 .
- the ACF attachment unit 121 attaches an ACF on the source connection pads SP 1 and SP 2 disposed or formed on the display panel assembly 110 .
- the ACF attachment unit 121 may receive an ACF transferred from the first ACF transfer unit 125 or the second ACF transfer unit 126 , and attach the transferred ACF onto the source connection pads SP 1 and SP 2 of the display panel assembly 110 .
- the ACF attachment unit 121 may attach a first ACF transferred from the first ACF transfer unit 125 onto the source connection pads SP 1 and SP 2 during a first TAB process which will be described later, and attach a second ACF transferred from the second ACF transfer unit 126 onto the source connection pads SP 1 and SP 2 during a second TAB process which will be described later.
- the preliminary compression unit 122 may preliminarily compress a COF defining the source driving circuits 321 and 322 on an ACF.
- the preliminary compression unit 122 may preliminarily compress, on the first ACF, a first COF for forming the first source driving circuit 321 and transferred from the first COF transfer unit 127 , and preliminarily compress, on the second ACF, a second COF for forming the second source driving circuit 322 and transferred from the second COF transfer unit 128 .
- the primary compression unit 123 may primarily compress the preliminarily compressed COF. In embodiments of the disclosure, the primary compression unit 123 may primarily compress the first COF preliminarily compressed on the first ACF, and primarily compress the second COF preliminarily compressed on the second ACF.
- the preliminary compression unit 122 and the primary compression unit 123 may include a compression head, in which a heat source is installed, and a compression tip attached to one end of the compression head to compress a COF on an ACF.
- the heat source of the compression head may be, for example, a heating coil, and heat generated from the heat source is applied to the ACF, such that bonding may be more effectively or easily performed through conductive particles in the ACF.
- the compression tip may compress the COF toward the ACF while ascending and descending through a tip lifter which may include or be configured with a cylinder or motor.
- configurations of the preliminary compression unit 122 and the primary compression unit 123 are not limited to those described above.
- the preliminary compression unit 122 and the primary compression unit 123 may not include some of the above-described components, or further include other components.
- the buffer unit 124 rotates the display panel assembly 110 by about 180 degrees during a retransferring process between the first TAB process and the second TAB process, which will be described later.
- the buffer unit 124 may include an ascending/descending member for allowing the display panel assembly 110 to ascend/descend and a rotating member for rotating the display panel assembly 110 .
- the ascending/descending member may hold the display panel assembly 110 and allow the display panel assembly 110 held by pressure of the cylinder or rotary power of the motor to ascend or descend.
- the rotating member may include, for example, a motor for rotating the display panel assembly 110 by about 180 degrees in interlock with the ascending/descending member, and the like.
- the configuration of the buffer unit 124 is not limited thereto, but the buffer unit 124 may have any component capable of rotating the display panel assembly 110 by 180 degrees such that upper and lower sides of the display panel assembly 110 are reversed.
- each of the ACF attachment unit 121 , the preliminary compression unit 122 , the primary compression unit 123 and the buffer unit 124 may include or be configured with a conveyor that accommodates the display panel assembly 110 and is transferable in both directions.
- Each of the conveyors of the ACF attachment unit 121 , the preliminary compression unit 122 , the primary compression unit 123 and the buffer unit 124 transfers (firstly transfers) the display panel assembly 110 in a first direction (i.e., a direction from the gate adhesion unit 11 to the PCB adhesion process unit 20 ) during the first TAB process and the second TAB process.
- each of the conveyors of the ACF attachment unit 121 , the preliminary compression unit 122 , the primary compression unit 123 and the buffer unit 124 retransfers (secondly transfers) the display panel assembly 110 in a second direction (i.e., a direction from the PCB adhesion process unit 20 to the gate adhesion unit 11 ) during a conveying process between the first TAB process and the second TAB process.
- a second direction i.e., a direction from the PCB adhesion process unit 20 to the gate adhesion unit 11
- the buffer unit 124 may be provided between the gate adhesion unit 11 and the ACF attachment unit 121 , but the disclosure is not limited thereto. In an alternative embodiment, the buffer unit 124 may be provided between the primary compression unit 123 and the PCB adhesion process unit 20 as shown in FIG. 5 .
- the display panel assembly 110 is transferred via the primary compression unit 123 , the preliminary compression unit 122 and the ACF attachment unit 121 during the above-described transferring process, to be transferred to the buffer unit 124 .
- the buffer unit 124 may rotate the retransferred display panel assembly 110 .
- the buffer unit 124 when the buffer unit 124 is provided between the primary compression unit 123 and the PCB adhesion process unit 20 , the buffer unit 124 rotates the display panel assembly 110 during the above-described transferring process and then retransfers the rotated display panel assembly 110 to the primary compression unit 123 . Then, the rotated display panel assembly 110 is conveyed via the primary compression unit 123 , the preliminary compression unit 122 and the ACF attachment unit 121 .
- the PCB adhesion process unit 20 performs a process of allowing the PCB to be adhered to the first COF and the second COF, which are attached onto the display panel assembly 110 transferred from the COF adhesion process unit 10 .
- the adhesion of the PCB may be performed using a method identical or similar to that used for the source driving circuit 320 , but a detailed process method is not particularly limited.
- FIGS. 6 to 9 are plan views illustrating a bonding method according to an embodiment of the disclosure.
- an embodiment of the bonding method may include a first TAB process, a retransferring process and a second TAB process.
- the display panel assembly 110 is transferred in the first direction (i.e., the direction from the gate adhesion unit 11 to the PCB adhesion process unit 20 ) during the first TAB process and the second TAB process, and is transferred in the second direction (i.e., the direction from the PCB adhesion process unit 20 to the gate adhesion unit 11 ) during the retransferring process.
- the display panel assembly 110 is transferred to the ACF attachment unit 121 in a state in which the gate driving circuit 310 is attached by the gate adhesion unit 11 as shown in FIG. 6 .
- the gate driving circuit 310 is attached to both sides of the display panel assembly 110 , but not being limited thereto. Alternatively, the gate driving circuit 310 may be attached to only one side of the display panel assembly 110 .
- the display panel assembly 110 is transferred in a state in which side surfaces, at which the source connection pads SP 1 and SP 2 are formed, are aligned adjacent to the first ACF transfer unit 125 .
- the display panel assembly 110 may be transferred to the ACF attachment unit 121 via the buffer unit 124 .
- the ACF attachment unit 121 attaches a first ACF transferred from the first ACF transfer unit 125 to the first source connection pad SP 1 on the display panel assembly 110 .
- the preliminary compression unit 122 preliminarily compresses a first COF transferred from the first COF transfer unit 127 on the first ACF, and the primary compression unit 123 primarily compresses the first COF.
- the first COF is used to form a first source driving circuit 321 , and may include a conductive lead line to be electrically connected to the first source connection pad SP 1 .
- the first COF attached on the display panel assembly 110 by such a process is illustrated in FIG. 7 .
- the retransferring process is performed after the first TAB process.
- the display panel assembly 110 is rotated and retransferred during the retransferring process.
- the display panel assembly 110 is conveyed to the buffer unit 124 via the preliminary compression unit 122 and the ACF attachment unit 121 from the primary compression unit 123 after the first COF is primarily compressed.
- the buffer unit 124 rotates the retransferred display panel assembly 110 by 180 degrees and then transfers the rotated display panel assembly 110 to the ACF attachment unit 121 .
- the display panel assembly 110 is transferred to the buffer unit 124 after the first COF is primarily compressed.
- the buffer unit 124 rotates the conveyed display panel assembly 110 by 180 degrees. Subsequently, the rotated display panel assembly 110 is retransferred to the ACF attachment unit 121 via the primary compression unit 123 and the preliminary compression unit 122 from the buffer unit 124 .
- the upper and lower sides of the display panel assembly 110 are reversed by the rotation as shown in FIG. 8 , so that the side surfaces, at which the source connection pads SP 1 and SP 2 are formed, are aligned adjacent to the second ACF transfer unit 126 .
- the second TAB process is performed after the retransferring process.
- the ACF attachment unit 121 attaches a second ACF transferred from the second ACF transfer unit 126 to the second source connection pad SP 2 on the display panel assembly 110 .
- the first ACF and the first COF, which are attached in the first TAB process, are interposed between the second ACF and the second source connection pad SP 2 .
- the preliminary compression unit 122 preliminarily compresses a second COF transferred from the second COF transfer unit 128 on the second ACF, and the primary compression unit 123 primarily compresses the preliminarily compressed second COF.
- the second COF is used to form the second source driving circuit 322 , and may include a conductive lead line to be electrically connected to the second source connection pad SP 2 .
- the second COF attached onto the display panel assembly 110 by such a process is illustrated in FIG. 9 .
- the display panel assembly 110 may be transferred to the PCB adhesion process unit 20 .
- a bonding process may be efficiently performed while not increasing the layout of bonding process facilities through two TAB processes and a retransferring process provided therebetween.
- the layout of process facilities may be reduced in a TAB process of a COF.
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Abstract
Description
- This application claims priority to Korean patent application 10-2018-0134621, filed on Nov. 5, 2018, and all the benefits accruing therefrom under 35 U.S.C. § 119, the content of which in its entirety is herein incorporated by reference.
- The disclosure generally relates to a bonding apparatus and a bonding method.
- In general, a display device includes a driving circuit connected to a signal line to supply signal. The driving circuit is typically implemented with an integrated circuit (“IC”) chip. The IC chip may include or be configured with a chip-on-film (“COF”) in which a plurality of conductive lead lines are formed on an insulating film such as polyimide. The COF may be referred to as a tape-carrier-package (“TCP”). The COF may be attached onto a display panel assembly through a tape automated bonding (“TAB”) process. The driving circuit attached as described above is electrically connected to a signal line of the display panel assembly through the lead line of the COF.
- The lead line of the COF may include a plurality of output-side lead lines and a plurality of input-side lead lines, which are respectively connected to an output end and an input end of the IC chip. The signal line of the display panel assembly may include a plurality of connection pads located in the vicinity of an edge of the display panel assembly. The output-side lead line of the COF may be mechanically and electrically connected to the connection pad of the display panel assembly, and the input-side lead line of the COF may be connected a printed circuit board (“PCB”) for transmitting several signals to a driving IC through soldering or the like. An output end of the COF and the connection pad of the display panel assembly may be attached to each other through an anisotropic conductive film (“ACF”).
- Embodiments provide a bonding apparatus and a bonding method, which simplifies the layout of process facilities through conveyance and rotation in a tape automated bonding (“TAB”) process of a chip-on-film (“COF”).
- According to an embodiment of the disclosure, a bonding apparatus includes: an anisotropic conductive film (“ACF”) attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a COF on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed.
- In an embodiment, each of the ACF attachment unit, the compression unit and the buffer unit may include a conveyor which transfers the display panel assembly in a first direction toward the compression unit from the ACF attachment unit and in a second direction toward the ACF attachment unit from the compression unit.
- In an embodiment, the buffer unit may be disposed prior to the ACF attachment unit, and rotate the display panel assembly transferred from the ACF attachment unit by about 180 degrees and then transfer the rotated display panel assembly to the ACF attachment unit.
- In an embodiment, the ACF attachment unit may transfer the display panel assembly, to which the first ACF is attached, to the compression unit, and attach the second ACF onto the display panel assembly rotated by the buffer unit.
- In an embodiment, the compression unit may transfer the display panel assembly, on which the first COF is compressed, to the ACF attachment unit, and transfer the display panel assembly, on which the second COF is compressed, to an outside.
- In an embodiment, the buffer unit may be disposed prior to the compression unit, and rotate the display panel assembly transferred from the compression unit by about 180 degrees and then retransfer the rotated display panel assembly to the compression unit.
- In an embodiment, the ACF attachment unit may transfer the display panel assembly, to which the first ACF is attached, to the compression unit, and attach the second ACF to the display panel assembly transferred from the compression unit.
- In an embodiment, the compression unit may transfer the display panel assembly, on which the first COF and the second COF are compressed, to the buffer unit, and convey the display panel assembly rotated in the buffer unit to the ACF attachment unit.
- In an embodiment, the bonding apparatus may further include: a first ACF transfer unit disposed at a side of the ACF attachment unit, where the first ACF transfer unit may provide the first ACF; and a second ACF transfer unit disposed at an opposing side of the ACF attachment unit, where the second ACF transfer unit may provide the second ACF.
- In an embodiment, the bonding apparatus may further include: a first COF transfer unit disposed at a side of the compression unit, where the first COF transfer unit may provide the first COF; and a second COF transfer unit disposed at an opposing side of the compression unit, where the second COF transfer unit may provide the second COF.
- In an embodiment, a connection pad on the display panel assembly may be aligned adjacent to the first ACF transfer unit, and be aligned adjacent to the second ACF transfer unit when the display panel assembly is rotated by the buffer unit.
- In an embodiment, the first COF may be electrically connected to a first connection pad on the display panel assembly, and the second COF may be electrically connected to a second connection pad on the display panel assembly.
- In an embodiment, the first connection pad and the second connection pad may be connected to a first sub-pixel and a second sub-pixel, respectively.
- In an embodiment, the first COF and the second COF may not be aligned with each other in an extending direction of a gate line.
- In an embodiment, the compression unit may include: a preliminary compression unit which preliminarily compresses the first COF on the first ACF, and preliminary compresses the second COF on the second ACF; and a primary compression unit which primarily compresses the preliminarily compressed first COF and the preliminarily compressed second COF.
- According to another embodiment of the disclosure, a bonding mthod includes: a first TAB process including attaching a first ACF and a first COF onto a display panel assembly while the display panel assembly is transferred in a first direction; a retransferring process including conveying the display panel assembly in a second direction opposite to the first direction, and rotating the display panel assembly on a plane; and a second TAB process including attaching a second ACF and a second COF onto the display panel assembly while the rotated display panel assembly is retransferred in the first direction.
- In an embodiment, the first TAB process, the retransferring process and the second TAB process may be performed by a bonding apparatus including a conveyor which conveys the display panel assembly in the first direction and the second direction.
- In an embodiment, the retransferring process may include: retransferring, in the second direction, the display panel assembly transferred in the first direction; rotating the retransferred display panel assembly by about 180 degrees; and transferring the rotated display panel assembly in the first direction.
- In an embodiment, the retransferring process may include: rotating the display panel assembly transferred in the first direction; and retransferring the display panel assembly in the second direction.
- According to still another embodiment of the disclosure, a bonding method includes: a first TAB process including attaching a first ACF onto a display panel assembly in an ACF attachment unit, and compressing a first ACF on the first ACF in a compression unit, while the display panel assembly is transferred in a first direction; a retransferring process including retransferring the display panel assembly in a second direction opposite to the first direction, and rotating the display panel assembly on a plane; and a second TAB process including attaching a second ACF onto the display panel assembly in the ACF attachment unit, and compressing a second COF on the second ACF in the compression unit, while the rotated display panel assembly is transferred in the first direction.
- The above and other features of the invention will become more apparent by describing in further detail exemplary embodiments thereof with reference to the accompanying drawings, in which:
-
FIG. 1 is a plan view illustrating a display device according to an embodiment of the disclosure; -
FIG. 2 is an enlarged plan view of portion A ofFIG. 1 ; -
FIG. 3 is a side view of the portion A ofFIG. 1 ; -
FIG. 4 is a block diagram illustrating a structure of a bonding apparatus according to an embodiment of the disclosure; -
FIG. 5 is a block diagram illustrating a structure of a bonding apparatus according to an alternative embodiment of the disclosure; and -
FIGS. 6 to 9 are plan views illustrating a bonding method according to an embodiment of the disclosure. - The invention now will be described more fully hereinafter with reference to the accompanying drawings, in which various embodiments are shown. This invention may, however, be embodied in many different forms, and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout.
- In the drawings, the thickness of certain lines, layers, components, elements or features may be exaggerated for clarity. It will be understood that, although the terms “first”, “second”, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Thus, a “first” element discussed below could also be termed a “second” element without departing from the teachings of the disclosure. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise.
- It will be further understood that the terms “includes” and/or “including”, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence and/or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Further, an expression that an element such as a layer, region, substrate or plate is placed “on” or “above” another element indicates not only a case where the element is placed “directly on” or “just above” the other element but also a case where a further element is interposed between the element and the other element. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present. On the contrary, an expression that an element such as a layer, region, substrate or plate is placed “beneath” or “below” another element indicates not only a case where the element is placed “directly beneath” or “just below” the other element but also a case where a further element is interposed between the element and the other element.
- The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms, including “at least one,” unless the content clearly indicates otherwise. “Or” means “and/or.” “At least one of A and B” means “A and/or B.” As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
- “About” or “approximately” as used herein is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, considering the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).
- Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
- Hereinafter, embodiments of the invention will be described in detail with reference to the accompanying drawings.
-
FIG. 1 is a plan view illustrating a display device according to an embodiment of the disclosure. - Referring to
FIG. 1 , an embodiment of thedisplay device 1000 includes adisplay panel 900 and adriver 300. Thedisplay panel 900 may include a thin film transistor (“TFT”)substrate 100 and acounter substrate 200. Thedisplay panel 900 may include a display area DA, in which theTFT substrate 100 and thecounter substrate 200 overlap each other, and a peripheral area PA, in which theTFT substrate 100 and thecounter substrate 200 do not overlap each other when viewed from a plan view in a thickness direction of thedisplay panel 900. - The
TFT substrate 100 may include gate lines GL1 to GLn, source lines SL1 to SLm, and sub-pixels (or pixels) PX connected to the gate lines GL1 to GLn and the source lines SL1 to SLm. - The
driver 300 includes asource driving circuit 320 and agate driving circuit 310. Thedriver 300 is disposed in the peripheral area PA to provide a gate signal and a source signal, which are provided from a printed circuit board (“PCB”) 2000, respectively to the gate lines GL1 to GLn and the source lines SL1 to SLm. - The
driver 300 is disposed on or adhered to the peripheral area PA of thedisplay panel 900.FIG. 1 shows an embodiment in which thegate driving circuit 310 is provided or formed at only one side of the display area DA. Alternatively, thegate driving circuit 310 may be provided at one side or both sides of the display area DA to be connected to the gate lines GL1 to GLn. Thesource driving circuit 320 may be provided or formed at an upper side of the display area DA to be connected to one ends of the source lines SL1 to SLm. - In an embodiment, three
source driving circuits 320 and threegate driving circuit 310 may be provided as illustrated inFIG. 1 , but the disclosure is not limited thereto. -
FIG. 2 is an enlarged plan view of portion A ofFIG. 1 .FIG. 3 is a side view of the portion A ofFIG. 1 . - Referring to
FIGS. 1 to 3 , an embodiment of thedisplay device 1000 includes adisplay panel assembly 110, source connection pads SP1 and SP2 andsource driving circuits - The
display panel assembly 110 may include theTFT substrate 100, in which at least one sub-pixel PX1 and PX2 is disposed, and thecounter substrate 200. TheTFT substrate 100 may be provided in the display area DA on thecounter substrate 200. - A plurality of sub-pixels PX1 and PX2 are defined or formed in the display area DA. The sub-pixels PX1 and PX2 may be connected to source lines SL1 and SL2, respectively. In an embodiment, as shown in
FIG. 2 , a first sub-pixel PX1 and a second sub-pixel PX2 are disposed on different rows that do not overlap each other in a horizontal direction. - The source connection pads SP1 and SP2 extending from the source lines SL1 and SL2, respectively, may be disposed or formed in the peripheral area PA on the
TFT substrate 100. In an embodiment, as shown inFIG. 2 , a first source connection pad SP1 extends from a first source line SL1 connected to the first sub-pixel PX1, and a second source connection pad SP2 extends from a second source line SL2 connected to the second sub-pixel PX2. In such an embodiment, the first source connection pad SP1 and the second source connection pad SP2 may be disposed on different rows that do not overlap each other in a horizontal direction. Herein, the horizontal direction may be a direction perpendicular to an extending direction of the source lines SL1 and SL2 when viewed from the plan view as shown inFIG. 2 . - The
source driving circuits - Some conductive lead lines (e.g., input-side lead lines) among the conductive lead lines may be electrically connected to the source lines SL1 and SL2 through the source connection pads SP1 and SP2 when the base film is attached to the source connection pads SP1 and SP2. In an embodiment, a conductive lead line of a first
source driving circuit 321 may be electrically connected to the first source connection pad SP1. In addition, a conductive lead line of a secondsource driving circuit 322 may be electrically connected to the second source connection pad SP2. - In an embodiment, the second
source driving circuit 322 may have an area wider than that of the firstsource driving circuit 321 as shown inFIG. 3 to be electrically connected to the second source connection pad SP2 disposed on a row different from that of the first source connection pad SP1. - The
source driving circuits TFT substrate 100, to be adhered to thePCB 2000. Some conductive lead lines (e.g., output-side lead lines) provided at an extension part among the conductive lead lines of thesource driving circuits PCB 2000. - The
source driving circuits - The anisotropic conductive film ACF may include a polymer resin PL cured by heat and conductive particles CP dispersed in the polymer resin PL. When heat and pressure are applied to the anisotropic conductive film ACF, the polymer resin PL may be melted, and the conductive particles CP may electrically connect the conductive lead lines and the source connection pads SP1 and SP2. Thus, the anisotropic conductive film ACF has both conductivity and adhesive properties. The conductive particles CP may include a metal such as carbon fiber, nickel (Ni), and platinum (Pt), or a compound thereof. In such an embodiment, the polymer resin PL may include styrene butadiene rubber, polyvinyl, butylene, epoxy resin, polyurethane, or acrylic resin.
- The anisotropic conductive film ACF is interposed between the
source driving circuits source driving circuits - In an embodiment, although not shown in the drawings, the
gate driving circuit 310 ofFIG. 1 may be attached onto thedisplay panel assembly 110, using a method identical or similar to that used for attaching thesource driving circuit 320. - Hereinafter, embodiments of a bonding apparatus and a bonding method for attaching the
source driving circuits display panel assembly 110 will be described in detail. -
FIG. 4 is a block diagram illustrating a structure of a bonding apparatus according to an embodiment of the disclosure.FIG. 5 is a block diagram illustrating a structure of a bonding apparatus according to an alternative embodiment of the disclosure. Referring toFIGS. 4 and 5 , embodiments of the bonding apparatus according to the disclosure includes a COFadhesion process unit 10 and a PCBadhesion process unit 20. - A
gate adhesion unit 11 performs a process of adhering or connecting thegate driving circuit 310 to a gate connection pad formed on thedisplay panel assembly 110. The adhesion of thegate driving circuit 310 may be performed using a method identical or similar to that used for bonding thesource driving circuit 320, but a detailed process method is not particularly limited. Alternatively, thegate adhesion unit 11 may be omitted. - A
source adhesion unit 12 may include anACF attachment unit 121, apreliminary compression unit 122, aprimary compression unit 123, abuffer unit 124, a firstACF transfer unit 125, a secondACF transfer unit 126, a firstCOF transfer unit 127 and a secondCOF transfer unit 128. - The
ACF attachment unit 121 attaches an ACF on the source connection pads SP1 and SP2 disposed or formed on thedisplay panel assembly 110. In embodiments of the disclosure, theACF attachment unit 121 may receive an ACF transferred from the firstACF transfer unit 125 or the secondACF transfer unit 126, and attach the transferred ACF onto the source connection pads SP1 and SP2 of thedisplay panel assembly 110. In one embodiment, for example, theACF attachment unit 121 may attach a first ACF transferred from the firstACF transfer unit 125 onto the source connection pads SP1 and SP2 during a first TAB process which will be described later, and attach a second ACF transferred from the secondACF transfer unit 126 onto the source connection pads SP1 and SP2 during a second TAB process which will be described later. - The
preliminary compression unit 122 may preliminarily compress a COF defining thesource driving circuits preliminary compression unit 122 may preliminarily compress, on the first ACF, a first COF for forming the firstsource driving circuit 321 and transferred from the firstCOF transfer unit 127, and preliminarily compress, on the second ACF, a second COF for forming the secondsource driving circuit 322 and transferred from the secondCOF transfer unit 128. - The
primary compression unit 123 may primarily compress the preliminarily compressed COF. In embodiments of the disclosure, theprimary compression unit 123 may primarily compress the first COF preliminarily compressed on the first ACF, and primarily compress the second COF preliminarily compressed on the second ACF. - In embodiments of the disclosure, the
preliminary compression unit 122 and theprimary compression unit 123 may include a compression head, in which a heat source is installed, and a compression tip attached to one end of the compression head to compress a COF on an ACF. The heat source of the compression head may be, for example, a heating coil, and heat generated from the heat source is applied to the ACF, such that bonding may be more effectively or easily performed through conductive particles in the ACF. The compression tip may compress the COF toward the ACF while ascending and descending through a tip lifter which may include or be configured with a cylinder or motor. - In such an embodiment, configurations of the
preliminary compression unit 122 and theprimary compression unit 123 are not limited to those described above. In embodiments, thepreliminary compression unit 122 and theprimary compression unit 123 may not include some of the above-described components, or further include other components. - The
buffer unit 124 rotates thedisplay panel assembly 110 by about 180 degrees during a retransferring process between the first TAB process and the second TAB process, which will be described later. In an embodiment, thebuffer unit 124 may include an ascending/descending member for allowing thedisplay panel assembly 110 to ascend/descend and a rotating member for rotating thedisplay panel assembly 110. In one embodiment, for example, the ascending/descending member may hold thedisplay panel assembly 110 and allow thedisplay panel assembly 110 held by pressure of the cylinder or rotary power of the motor to ascend or descend. In an embodiment, the rotating member may include, for example, a motor for rotating thedisplay panel assembly 110 by about 180 degrees in interlock with the ascending/descending member, and the like. - However, the configuration of the
buffer unit 124 is not limited thereto, but thebuffer unit 124 may have any component capable of rotating thedisplay panel assembly 110 by 180 degrees such that upper and lower sides of thedisplay panel assembly 110 are reversed. - In an embodiment, each of the
ACF attachment unit 121, thepreliminary compression unit 122, theprimary compression unit 123 and thebuffer unit 124 may include or be configured with a conveyor that accommodates thedisplay panel assembly 110 and is transferable in both directions. Each of the conveyors of theACF attachment unit 121, thepreliminary compression unit 122, theprimary compression unit 123 and thebuffer unit 124 transfers (firstly transfers) thedisplay panel assembly 110 in a first direction (i.e., a direction from thegate adhesion unit 11 to the PCB adhesion process unit 20) during the first TAB process and the second TAB process. In an embodiment, each of the conveyors of theACF attachment unit 121, thepreliminary compression unit 122, theprimary compression unit 123 and thebuffer unit 124 retransfers (secondly transfers) thedisplay panel assembly 110 in a second direction (i.e., a direction from the PCBadhesion process unit 20 to the gate adhesion unit 11) during a conveying process between the first TAB process and the second TAB process. - In an embodiment, as shown in
FIG. 4 , thebuffer unit 124 may be provided between thegate adhesion unit 11 and theACF attachment unit 121, but the disclosure is not limited thereto. In an alternative embodiment, thebuffer unit 124 may be provided between theprimary compression unit 123 and the PCBadhesion process unit 20 as shown inFIG. 5 . - In an embodiment, when the
buffer unit 124 is provided between thegate adhesion unit 11 and theACF attachment unit 121, thedisplay panel assembly 110 is transferred via theprimary compression unit 123, thepreliminary compression unit 122 and theACF attachment unit 121 during the above-described transferring process, to be transferred to thebuffer unit 124. Thebuffer unit 124 may rotate the retransferreddisplay panel assembly 110. - In such an embodiment, when the
buffer unit 124 is provided between theprimary compression unit 123 and the PCBadhesion process unit 20, thebuffer unit 124 rotates thedisplay panel assembly 110 during the above-described transferring process and then retransfers the rotateddisplay panel assembly 110 to theprimary compression unit 123. Then, the rotateddisplay panel assembly 110 is conveyed via theprimary compression unit 123, thepreliminary compression unit 122 and theACF attachment unit 121. - The PCB
adhesion process unit 20 performs a process of allowing the PCB to be adhered to the first COF and the second COF, which are attached onto thedisplay panel assembly 110 transferred from the COFadhesion process unit 10. The adhesion of the PCB may be performed using a method identical or similar to that used for thesource driving circuit 320, but a detailed process method is not particularly limited. -
FIGS. 6 to 9 are plan views illustrating a bonding method according to an embodiment of the disclosure. - Referring to
FIGS. 1 to 9 , an embodiment of the bonding method may include a first TAB process, a retransferring process and a second TAB process. Thedisplay panel assembly 110 is transferred in the first direction (i.e., the direction from thegate adhesion unit 11 to the PCB adhesion process unit 20) during the first TAB process and the second TAB process, and is transferred in the second direction (i.e., the direction from the PCBadhesion process unit 20 to the gate adhesion unit 11) during the retransferring process. - During the first TAB process, the
display panel assembly 110 is transferred to theACF attachment unit 121 in a state in which thegate driving circuit 310 is attached by thegate adhesion unit 11 as shown inFIG. 6 . In an embodiment, as shown inFIG. 6 , thegate driving circuit 310 is attached to both sides of thedisplay panel assembly 110, but not being limited thereto. Alternatively, thegate driving circuit 310 may be attached to only one side of thedisplay panel assembly 110. - The
display panel assembly 110 is transferred in a state in which side surfaces, at which the source connection pads SP1 and SP2 are formed, are aligned adjacent to the firstACF transfer unit 125. In an embodiment, when thebuffer unit 124 between thegate adhesion unit 11 and theACF attachment unit 121, thedisplay panel assembly 110 may be transferred to theACF attachment unit 121 via thebuffer unit 124. - During the first TAB process, the
ACF attachment unit 121 attaches a first ACF transferred from the firstACF transfer unit 125 to the first source connection pad SP1 on thedisplay panel assembly 110. - The
preliminary compression unit 122 preliminarily compresses a first COF transferred from the firstCOF transfer unit 127 on the first ACF, and theprimary compression unit 123 primarily compresses the first COF. The first COF is used to form a firstsource driving circuit 321, and may include a conductive lead line to be electrically connected to the first source connection pad SP1. The first COF attached on thedisplay panel assembly 110 by such a process is illustrated inFIG. 7 . - The retransferring process is performed after the first TAB process. The
display panel assembly 110 is rotated and retransferred during the retransferring process. - In an embodiment, as shown in
FIG. 4 , thedisplay panel assembly 110 is conveyed to thebuffer unit 124 via thepreliminary compression unit 122 and theACF attachment unit 121 from theprimary compression unit 123 after the first COF is primarily compressed. Thebuffer unit 124 rotates the retransferreddisplay panel assembly 110 by 180 degrees and then transfers the rotateddisplay panel assembly 110 to theACF attachment unit 121. - In an alternative embodiment, as shown in
FIG. 5 , thedisplay panel assembly 110 is transferred to thebuffer unit 124 after the first COF is primarily compressed. Thebuffer unit 124 rotates the conveyeddisplay panel assembly 110 by 180 degrees. Subsequently, the rotateddisplay panel assembly 110 is retransferred to theACF attachment unit 121 via theprimary compression unit 123 and thepreliminary compression unit 122 from thebuffer unit 124. - The upper and lower sides of the
display panel assembly 110 are reversed by the rotation as shown inFIG. 8 , so that the side surfaces, at which the source connection pads SP1 and SP2 are formed, are aligned adjacent to the secondACF transfer unit 126. - The second TAB process is performed after the retransferring process. During the second TAB process, the
ACF attachment unit 121 attaches a second ACF transferred from the secondACF transfer unit 126 to the second source connection pad SP2 on thedisplay panel assembly 110. The first ACF and the first COF, which are attached in the first TAB process, are interposed between the second ACF and the second source connection pad SP2. - The
preliminary compression unit 122 preliminarily compresses a second COF transferred from the secondCOF transfer unit 128 on the second ACF, and theprimary compression unit 123 primarily compresses the preliminarily compressed second COF. The second COF is used to form the secondsource driving circuit 322, and may include a conductive lead line to be electrically connected to the second source connection pad SP2. The second COF attached onto thedisplay panel assembly 110 by such a process is illustrated inFIG. 9 . - After the
source driving circuits display panel assembly 110 as described above, thedisplay panel assembly 110 may be transferred to the PCBadhesion process unit 20. - As described above, according to embodiments of the disclosure, a bonding process may be efficiently performed while not increasing the layout of bonding process facilities through two TAB processes and a retransferring process provided therebetween.
- Herein, the bonding process for the source driving circuit are described in detail. However, such bonding process may be applied for the gate driving circuit and PCB adhesion without departing from the technical spirit and scope of the disclosure.
- In embodiments of the bonding apparatus and the bonding method according to the disclosure, the layout of process facilities may be reduced in a TAB process of a COF.
- Exemplary embodiments of the invention have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some instances, as would be apparent to one of ordinary skill in the art as of the filing of the application, features, characteristics, and/or elements described in connection with a particular embodiment may be used singly or in combination with features, characteristics, and/or elements described in connection with other embodiments unless otherwise specifically indicated. Accordingly, it will be understood by those of skill in the art that various changes in form and details may be made without departing from the spirit and scope of the invention as set forth in the following claims.
Claims (20)
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US18/147,990 US20230133340A1 (en) | 2018-11-05 | 2022-12-29 | Bonding apparatus and bonding method |
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KR1020180134621A KR102668582B1 (en) | 2018-11-05 | Bonding apparatus and bonding method | |
KR10-2018-0134621 | 2018-11-05 |
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US18/147,990 Division US20230133340A1 (en) | 2018-11-05 | 2022-12-29 | Bonding apparatus and bonding method |
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US20200144221A1 true US20200144221A1 (en) | 2020-05-07 |
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US16/573,086 Abandoned US20200144221A1 (en) | 2018-11-05 | 2019-09-17 | Bonding apparatus and bonding method |
US18/147,990 Pending US20230133340A1 (en) | 2018-11-05 | 2022-12-29 | Bonding apparatus and bonding method |
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CN (1) | CN111146101A (en) |
Citations (2)
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US20140106484A1 (en) * | 2012-10-16 | 2014-04-17 | Samsung Display Co., Ltd. | Bonding apparatus and method for display device |
US20180082929A1 (en) * | 2017-08-01 | 2018-03-22 | Xiamen Tianma Micro-Electronics Co., Ltd. | Display panel and display device |
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KR20110129267A (en) * | 2010-05-25 | 2011-12-01 | 엘지디스플레이 주식회사 | Apparatus for manufacturing touch screen panel |
KR101396221B1 (en) * | 2012-01-06 | 2014-05-19 | 주식회사 에스에프에이 | Apparatus for bonding printed circuit on fpd panel |
JP2014068040A (en) * | 2014-01-14 | 2014-04-17 | Panasonic Corp | Electronic component mounting line and electronic component mounting method |
KR20180027692A (en) * | 2016-09-06 | 2018-03-15 | 삼성디스플레이 주식회사 | Display device |
-
2019
- 2019-09-17 US US16/573,086 patent/US20200144221A1/en not_active Abandoned
- 2019-11-05 CN CN201911068958.3A patent/CN111146101A/en active Pending
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140106484A1 (en) * | 2012-10-16 | 2014-04-17 | Samsung Display Co., Ltd. | Bonding apparatus and method for display device |
US20180082929A1 (en) * | 2017-08-01 | 2018-03-22 | Xiamen Tianma Micro-Electronics Co., Ltd. | Display panel and display device |
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US20230133340A1 (en) | 2023-05-04 |
KR20200051902A (en) | 2020-05-14 |
CN111146101A (en) | 2020-05-12 |
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