WO2013030888A1

WO2013030888A1 - Display-panel device and manufacturing method therefor

Info

Publication number: WO2013030888A1
Application number: PCT/JP2011/004865
Authority: WO
Inventors: 崇大迫
Original assignee: パナソニック株式会社
Priority date: 2011-08-31
Filing date: 2011-08-31
Publication date: 2013-03-07
Also published as: CN202948928U

Abstract

The purpose of the present invention is to provide a display-panel device that has good electrical connectivity between wiring arranged on a flexible-film substrate and wiring arranged on a glass substrate. This display-panel device comprises the following: a display panel (16) that has a glass substrate (12) with a plurality of rows of panel wiring (13) arranged on a first side thereof; a flexible-film substrate (20) with a plurality of rows of substrate wiring (21) arranged on a second side thereof, said substrate wiring (21) being connected to the panel wiring (13); and an adhesive layer (30). The flexible-film substrate (20) has, on the second side thereof, dummy substrate wiring (22) outwards of the outermost of the plurality of rows of substrate wiring (21), and the glass substrate (12) has dummy panel wiring (14) opposite the dummy substrate wiring (22). The dummy substrate wiring (22) is higher than the dummy panel wiring (14).

Description

Display panel device and manufacturing method thereof

The present invention relates to a display panel device and a manufacturing method thereof.

The wiring of the pixel circuit of the display panel is on the glass substrate of the display panel and extends to the outer periphery of the display panel to constitute a terminal. This terminal is electrically connected to a corresponding terminal formed on a flexible film substrate (flexible cable) and extending from a driving IC for driving the pixel circuit by using an adhesive. The connected display panel and flexible film substrate constitute one display panel device.

However, in the display panel device, when an adhesive is applied between the glass substrate on which the terminals are formed and the flexible film substrate on which the corresponding terminals are formed, and then crimped, the adhesive flows out to the outside of the flexible film substrate, There is a problem that air bubbles are easily generated in the region where the adhesive has flowed out.

In this regard, Patent Document 1 discloses the configuration of the display panel device shown in FIG. In this configuration, a dummy electrode 104 that does not contribute to driving of the display panel is formed on the glass substrate 101 outside the

extraction electrodes

105 and 106 of the flexible cable 102. In this way, the dummy electrode 104 is provided only on the glass substrate 101 side and the height thereof is made higher than that of the extraction electrode 105, so that the anisotropic conductive adhesive 103 does not flow out of the flexible cable 102. .

Japanese Patent Laid-Open No. 10-301128 (FIG. 3)

However, the conventional technique disclosed in Patent Document 1 has the following problems.

That is, the number of wirings provided on the flexible cable 102 increases with the increase in definition of the display panel, and the number of extraction electrodes 106 increases accordingly. In the case where the display panel is an organic EL panel, a large current is used for driving, so that a power line having a large line width is provided on the flexible cable 102. Thereby, the wiring of the flexible cable 102 is arranged in the flexible cable 102 with high density. As a result, the distance between the end portion of the flexible cable 102 and the outermost wiring is shortened, and it is necessary to provide the wiring near the end portion of the flexible cable 102.

Here, in Patent Document 1, when the flexible cable 102 and the glass substrate 101 are bonded, the flexible cable 102 is pressed against the glass substrate 101. In this case, as shown in FIG. 17A, since the height of the dummy electrode 104 provided on the glass substrate 101 side is high, the anisotropic conductive adhesive 103 is anisotropically conductive from the flexible cable 102 side to the flexible cable 102 side. Adhesive adhesive 103 flows out. The leaked anisotropic conductive adhesive 103 hangs down from the flexible cable 102 side to the glass substrate 101, so that the leaked anisotropic conductive adhesive 103 becomes lumps and is solidified during pressure bonding. Thereby, a uniform force cannot be applied to the flexible cable 102. As a result, as shown in FIG. 17B, the central portion of the flexible cable 102 having flexibility is recessed, and the flexible cable 102 is deformed so that the outer side is warped as a whole. That is, a dama pushes up the end of the flexible cable 102 to deform the flexible cable 102. In particular, as described above, when the wiring is provided up to the vicinity of the end of the flexible cable 102, the action of pushing up the end of the flexible cable 102 due to lumps works strongly. Accordingly, when this dama pushes up the end of the flexible cable 102, the extraction electrode 105 on the glass substrate 101 side and the extraction electrode 106 on the flexible cable 102 side cannot be electrically connected, resulting in poor connection. . In particular, poor connection is likely to occur in a region close to a region where the anisotropic conductive adhesive 103 forms lumps.

Therefore, the present invention has been made in view of the above-described problems, and a display panel device that improves the electrical connection between wiring arranged on a flexible film substrate and wiring arranged on a glass substrate, and the display panel device An object is to provide a manufacturing method.

In order to achieve the above object, a display panel device according to the present invention includes a glass substrate in which a plurality of display pixels are provided and panel wirings connected to the display pixels are arranged in a plurality of columns on a first side. A plurality of substrate wirings facing the panel wiring and connected to the panel wiring on the second side, and the length of the second side is shorter than the length of the first side And an adhesive layer that includes conductive particles, bonds the flexible film substrate and the glass substrate, and electrically connects the opposing substrate wiring and the panel wiring with the conductive particles, The flexible film substrate has a dummy substrate wiring outside the outermost substrate wiring of the plurality of rows of substrate wirings on the second side, and the glass substrate A dummy panel wiring facing the plate wiring, a height of the dummy substrate wiring being higher than a height of the dummy panel wiring.

According to the present invention, the electrical connection between the wiring arranged on the flexible film substrate and the wiring arranged on the glass substrate can be improved.

FIG. 1 is a plan view showing an overall configuration of a display panel device according to an embodiment of the present invention. FIG. 2 is a diagram showing a detailed configuration of the display panel device of the embodiment. FIG. 3 is a cross-sectional view showing the method for manufacturing the display panel device of the embodiment. FIG. 4 is a diagram illustrating a detailed configuration of a display panel device according to Modification 1 of the embodiment. FIG. 5 is a plan view showing a detailed configuration of a display panel device according to Modification 2 of the embodiment. FIG. 6 is a plan view showing a detailed configuration of a display panel device according to Modification 3 of the embodiment. FIG. 7 is a plan view showing a detailed configuration of a display panel device according to Modification 4 of the embodiment. FIG. 8 is a plan view showing a detailed configuration of a display panel device according to Modification 4 of the embodiment. FIG. 9 is a plan view showing a detailed configuration of a display panel device according to Modification 5 of the embodiment. FIG. 10 is a plan view showing a detailed configuration of a display panel device according to Modification 5 of the embodiment. FIG. 11 is a plan view showing a detailed configuration of a display panel device of a comparative example of the embodiment. FIG. 12 is a plan view showing a detailed configuration of a display panel device of a comparative example of the embodiment. FIG. 13 is a cross-sectional view illustrating a detailed configuration of a display panel device of a comparative example of the embodiment. FIG. 14 is a plan view showing a detailed configuration of the display panel device of the embodiment. FIG. 15 is a photograph from above of the flexible film substrate in a state after the conventional flexible film substrate is connected to the glass substrate. FIG. 16 is a diagram showing the configuration of the display panel device of Patent Document 1. In FIG. FIG. 17A is a diagram illustrating a configuration of a display panel device disclosed in Patent Document 1. FIG. 17B is a diagram showing the configuration of the display panel device of Patent Document 1.

A display panel device according to one embodiment of the present invention includes a display panel including a glass substrate in which a plurality of display pixels are provided and panel wirings connected to the display pixels are arranged in a plurality of columns on a first side; A plurality of rows of substrate wirings facing the wiring and connected to the panel wiring on the second side, and the length of the second side is shorter than the length of the first side; An adhesive layer that includes particles and bonds the flexible film substrate and the glass substrate together, and electrically connects the opposing substrate wiring and the panel wiring with the conductive particles, and the flexible film substrate Has a dummy substrate wiring outside the outermost substrate wiring of the plurality of rows of substrate wirings on the second side, and the glass substrate faces the dummy substrate wiring That has a dummy panel wiring, the height of the dummy substrate wiring being higher than a height of the dummy panel wiring.

In this aspect, the flexible film substrate has a dummy substrate wiring outside the substrate wiring, while the glass substrate has a dummy panel wiring opposed to the dummy substrate wiring. Thus, when the flexible film substrate and the glass substrate are pressure-bonded and pressed from the flexible film substrate, the adhesive passes through the gap between the dummy substrate wiring and the dummy panel wiring to the outside of the dummy substrate wiring and the dummy panel wiring. Outflow is suppressed.

Also, the height of the dummy substrate wiring on the flexible film substrate is higher than the height of the dummy panel wiring on the glass substrate. As a result, when the flexible film substrate and the glass substrate are pressure-bonded, even if the adhesive passes through the gap between the dummy substrate wiring and the dummy panel wiring and flows out of the dummy substrate wiring and the dummy panel wiring, Since the height of the wiring is higher than the height of the dummy panel wiring, when pressed from the flexible film substrate, the wiring is guided to the dummy substrate wiring whose height is higher than the height of the dummy panel wiring and flows out to the surface of the glass substrate. As a result, the adhesive that has flowed out does not propagate to the flexible film substrate, but spreads along the surface of the glass substrate, thereby suppressing formation of lumps. Therefore, when the member to be pressed presses the flexible film substrate by suppressing the formation of the lumps, the member to be uniformly pressed against the flexible film substrate can be pressed. That is, the flexible film substrate can be pressed against the glass substrate with a uniform force. Therefore, it is possible to suppress deformation such that the central portion of the flexible film substrate is recessed and the outside is warped, and electrical connection between a plurality of substrate wirings arranged on the flexible film substrate and panel wirings corresponding to these substrate wirings on the glass substrate. Connection can be made satisfactorily.

The distance from the end of the first side to the dummy panel wiring may be larger than the distance from the end of the second side to the dummy substrate wiring.

According to this aspect, it is possible to form a surface region on the glass substrate that receives the adhesive flowing out through the gap between the dummy substrate wiring and the dummy panel wiring.

Further, a plurality of the flexible film substrates may be provided for the first side.

The plurality of flexible film substrates include a first flexible film substrate and a second flexible film substrate adjacent to each other, the dummy panel wiring facing the dummy substrate wiring of the first flexible film substrate, and the second flexible film substrate. The distance between the dummy substrate wiring facing the dummy substrate wiring of the film substrate is the distance between the dummy substrate wiring of the first flexible film substrate and the end of the second side of the second flexible film substrate. It may be larger.

According to this aspect, it is possible to form a surface region for receiving the adhesive flowing out through the gap between the dummy substrate wiring and the dummy panel wiring on the glass substrate between the adjacent flexible film substrates.

The plurality of rows of substrate wirings may include signal lines for supplying data signals to the display pixels.

According to this aspect, it is possible to satisfactorily connect the signal line for supplying the data signal to the display pixel and the panel wiring on the glass substrate.

The plurality of columns of substrate wirings may include gate lines that supply scanning signals to the display pixels.

According to this aspect, the electrical connection between the gate line for supplying the scanning signal to the display pixel and the panel wiring on the glass substrate can be performed satisfactorily.

Further, the plurality of rows of substrate wirings may include power supply wirings for supplying a power supply voltage to the display pixels.

At this time, the outermost substrate wiring of the plurality of rows of substrate wirings may be the power supply wiring.

Further, on the flexible film substrate, a driving circuit for driving the display pixels, a plurality of input wirings for inputting a signal to the driving circuit, and a plurality of signals for outputting a signal from the driving circuit Output wiring may be provided as the substrate wiring, and the power supply wiring may be the outermost wiring of the plurality of output wirings.

According to this aspect, it is possible to satisfactorily connect the power supply wiring for supplying the power supply voltage to the display pixel and the panel wiring on the glass substrate.

In addition, the distance from the end of the second side of the flexible film substrate to the dummy substrate wiring may be within a range of 0.15 to 2 mm.

In addition, the dummy substrate wiring may have a cutout portion, and the dummy panel wiring may have a cutout portion in a region facing the cutout portion.

According to this aspect, the flexible film substrate and the glass substrate can be pressure-bonded using the notch portions of the dummy substrate wiring and the dummy panel wiring as the alignment marks.

Further, the dummy substrate wiring may be a wiring parallel to the substrate wiring.

In addition, a display panel device according to one embodiment of the present invention includes a display panel including a glass substrate in which a plurality of display pixels are provided, and panel wirings connected to the display pixels are arranged in a plurality of columns on a first side; A plurality of rows of substrate wirings facing the panel wiring and connected to the panel wiring are arranged in a second side, and the length of the second side is shorter than the length of the first side, and a flexible film substrate, An adhesive layer that includes conductive particles, bonds the flexible film substrate and the glass substrate, and electrically connects the substrate wiring and the panel wiring facing each other with the conductive particles. The film substrate has a dummy substrate wiring outside the outermost substrate wiring of the plurality of rows of substrate wirings on the second side, and the glass substrate includes the dummy substrate wiring. Wherein the wire on opposite portions not provided.

According to this aspect, it is possible to satisfactorily connect the plurality of substrate wirings arranged on the flexible film substrate and the panel wiring on the glass substrate.

The display panel device manufacturing method according to one embodiment of the present invention includes a display including a glass substrate in which a plurality of display pixels are provided and panel wirings connected to the display pixels are arranged in a plurality of columns on a first side. A first step of preparing a panel, a second step of preparing a flexible film substrate in which a plurality of rows of substrate wirings are arranged on the second side, and the length of the second side is shorter than the length of the first side; A third step of interposing an adhesive containing conductive particles between the flexible film substrate and the glass substrate in a form in which the panel wiring and the substrate wiring face each other, and a planar surface of the pressing member Pressing against the flexible film substrate, pressing the flexible film substrate against the glass substrate using the pressing member, and further applying heat to the adhesive by the pressing member, the adhesive A fourth step of bonding the flexible film substrate and the glass substrate by solidification and forming an adhesive layer that electrically connects the substrate wiring and the panel wiring facing each other with the conductive particles; The flexible film substrate has a dummy substrate wiring outside the outermost substrate wiring of the plurality of rows of substrate wirings on the second side, and the glass substrate faces the dummy substrate wiring. The dummy substrate wiring has a height higher than that of the dummy panel wiring.

Here, in the fourth step, the adhesive may flow out to the surface of the glass substrate through the gap between the dummy substrate wiring and the dummy panel wiring by the pressing.

In the fourth step, the adhesive is guided by the dummy substrate wiring through the gap between the dummy substrate wiring and the dummy panel wiring and flows out to the surface of the glass substrate by the pressing. Also good.

In the fourth step, the adhesive may not flow out to the surface of the flexible film substrate.

Further, in the fourth step, a plurality of the flexible film substrates may be provided for the first side.

The distance from the end of the second side of the flexible film substrate to the dummy substrate wiring may be within a range of 0.15 to 2 mm.

In the fourth step, the distance from the end of the first side to the dummy panel wiring may be larger than the distance from the end of the second side to the dummy substrate wiring.

The plurality of flexible film substrates include a first flexible film substrate and a second flexible film substrate adjacent to each other, and in the fourth step, a dummy panel wiring facing the dummy substrate wiring of the first flexible film substrate; The distance between the dummy substrate wiring of the second flexible film substrate and the corresponding dummy panel wiring is the end of the second side of the second flexible film substrate and the dummy substrate of the first flexible film substrate. It may be larger than the distance to the wiring.

At this time, the outermost substrate wiring of the plurality of rows of substrate wirings may be the power supply line.

Further, the dummy substrate wiring has a cutout portion, the dummy panel wiring has a cutout portion in a region facing the cutout portion, and in the third step, the dummy substrate wiring has the cutout portion. The panel wiring and the substrate wiring may be opposed to each other using the notch and the notch of the dummy panel wiring as an alignment mark.

Hereinafter, a display panel device and a manufacturing method thereof according to embodiments of the present invention will be described with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of simplicity.

FIG. 1 is a plan view (a top view of the display panel device viewed from above) showing the overall configuration of the display panel device of the present embodiment. FIG. 2 is a diagram showing a detailed configuration of the display panel device of FIG. 2A is an enlarged plan view of the display panel device of FIG. 1 (a plan view in which part A of FIG. 1 is enlarged), and FIG. 2B is a sectional view of FIG. 2A. Yes.

This display panel device includes a plurality of display pixels, and a display panel having a glass substrate 12 in which panel wirings 13 connected to the display pixels are arranged in a plurality of rows on a first side (lower side, upper side, right side or left side). 16 and the substrate wiring 21 facing the panel wiring 13 and connected to the panel wiring 13 are arranged in a plurality of rows on the second side (side facing the glass substrate 12), and the length of the second side is the first. The

flexible film substrate

20 or 60 shorter than the length of the side and the conductive particles 31 are bonded, and the

flexible film substrate

20 or 60 and the glass substrate 12 are bonded together, and the opposing substrate wiring 21 and panel wiring 13 are connected to the conductive particles. And an adhesive layer 30 electrically connected at 31. The

flexible film substrate

20 or 60 has a dummy substrate wiring 22 outside the outermost substrate wiring 21 of the plurality of rows of substrate wirings 21 on the second side, and the glass substrate 12 is a dummy substrate wiring. The dummy panel wiring 14 is opposed to the wiring 22. The height of the dummy substrate wiring 22 is higher than the height of the dummy panel wiring 14. In FIG. 2B, the diameter of the conductive particles 31 is represented by the same size as the width of the substrate wiring 21, but is not limited thereto. Specifically, for example, the diameter of the conductive particles 31 is several μm to 5 μm, and the width of the terminal of the substrate wiring 21 is about several tens of μm.

The details of the configuration of the display panel device will be described below. Since the

flexible film substrates

20 and 60 have the same configuration and are connected to the glass substrate 12 with the same configuration, detailed description of the flexible film substrate 60 is omitted below.

The display panel 16 includes a rectangular glass substrate 12 on which the display region 10 and the wiring region 17 are formed, and a protective plate 11 such as a glass plate provided on the glass substrate 12 so as to cover the display region 10. . In the display area 10, for example, a plurality of display pixels (pixel circuits) that emit R (red), G (green), and B (blue) colors are arranged in a two-dimensional manner (matrix). The upper side and the lower side of the rectangular glass substrate 12 constitute the long side of the glass substrate 12, respectively, and the right side and the left side of the glass substrate 12 constitute the short side of the glass substrate 12, respectively.

In the wiring area 17, a plurality of panel wirings 13 and a plurality of dummy panel wirings 14 for electrically connecting the display area 10 and the plurality of flexible film substrates 20 are formed. That is, in the wiring area 17, a plurality of panel wirings 13 that transmit a drive signal for driving the display panel 16 (display area 10) and a plurality of dummy panel wirings 14 that are not connected to the display area 10 and do not transmit a driving signal. And are formed.

The plurality of panel wirings 13 are parallel to each other and run in the vertical direction (column direction) between the opposing long sides of the glass substrate 12, or run in the horizontal direction (row direction) between the opposing short sides. Is formed. In other words, the plurality of panel wirings 13 are formed to run in a direction orthogonal to the long side of the glass substrate 12 or to run in a direction orthogonal to the short side. The plurality of dummy panel wirings 14 are formed so as to be parallel to each other and to run parallel to the panel wiring 13. The plurality of panel wirings 13 are not necessarily formed in parallel to each other, and may not be formed so as to be orthogonal to the long side or the short side of the glass substrate 12.

The ends of the panel wiring 13 and the dummy panel wiring 14 are arranged side by side on the side of the glass substrate 12 facing the flexible film substrate 20. That is, the end portions of the panel wiring 13 and the dummy panel wiring 14 that run in the vertical direction are arranged side by side in the horizontal direction on the long side of the glass substrate 12. Note that, as in the present embodiment, the end portions of the panel wiring 13 and the dummy panel wiring 14 may have a wider line width than other portions. Thereby, the contact with the panel wiring 13 and the board | substrate wiring 21 can be performed favorably.

Further, the heights of the end portions of the plurality of panel wirings 13 and the plurality of dummy panel wirings 14 (height from the surface of the glass substrate 12) are set to the same height. The ends of the panel wiring 13 and the dummy panel wiring 14 constitute an input terminal.

The plurality of panel wirings 13 are formed in a portion (E in FIG. 2) facing the central portion (A in FIG. 2) of the flexible film substrate 20 in the wiring region 17 in the horizontal direction. On the other hand, the plurality of dummy panel wirings 14 are formed in portions (D in FIG. 2) that are opposed to the portions (B in FIG. 2) at both ends in the lateral direction of the flexible film substrate 20.

A plurality of flexible film substrates 20 are provided for each of the two long sides of the glass substrate 12. The upper side and the lower side of the rectangular flexible film substrate 20 constitute a short side of the flexible film substrate 20, respectively, and the right side and the left side of the flexible film substrate 20 constitute a long side of the flexible film substrate 20, respectively.

On the surface of the flexible film substrate 20, a drive circuit (drive IC) 24 that outputs a drive signal for driving the display panel 16 (display region 10) is provided. The flexible film substrate 20 constitutes a film package such as TCP (Tape Career Package) and COF (Chip On Film) together with the drive circuit 24.

The flexible film substrate 20 relays a drive signal between the display panel 16 and the drive circuit 24 and relays a control signal for controlling the drive circuit 24 between the control circuit 62 and the drive circuit 24. . On the other hand, the flexible film substrate 60 relays a control signal for controlling the drive circuit 24 between the control circuit 61 and the drive circuit 24.

The drive circuits 24 provided on the

flexible film substrates

20 and 60 may output different types of drive signals. Specifically, for example, the drive circuit 24 provided on the flexible film substrate 20 outputs a data signal such as a pixel signal as a drive signal, and the drive circuit 24 provided on the flexible film substrate 60 scans. The signal is output as a drive signal.

The flexible film substrate 20 is provided with a substrate wiring 21 and a dummy substrate wiring 22. The substrate wiring 21 includes a plurality of output wirings for electrically connecting the driving circuit 24 and the panel wiring 13 (display area 10), and an input wiring for electrically connecting the control circuit 62 and the driving circuit 24. It consists of and. That is, the substrate wiring 21 includes a plurality of input wirings that transmit control signals to the driving circuit 24 and a plurality of output wirings that transmit driving signals from the driving circuit 24. In the present embodiment, the dummy substrate wiring 22 is a wiring that is not connected to the control circuit 62 and the driving circuit 24 and does not transmit a driving signal. Note that the dummy substrate wiring 22 may be connected to the control circuit 62 and the drive circuit 24. Even in this case, the dummy substrate wiring 22 is a wiring that does not transmit a drive signal. The dummy substrate wiring 22 may transmit a signal other than the drive signal. Specifically, the dummy substrate wiring 22 is used as a test line or the like for transmitting a test signal for confirming whether a signal input to the display panel 16 is normal.

In the present embodiment, the plurality of substrate wirings 21 are formed to be parallel to each other and run in the vertical direction between the opposing short sides of the flexible film substrate 20. In other words, the plurality of substrate wirings 21 are formed to run in a direction orthogonal to the short side of the flexible film substrate 20. The plurality of dummy substrate wirings 22 are formed so as to be parallel to each other and to run parallel to the substrate wiring 21. The plurality of substrate wirings 21 are not necessarily formed in parallel to each other, and may not be formed to be orthogonal to the short side of the flexible film substrate 20.

The end portions of the substrate wiring 21 and the dummy substrate wiring 22 have a line width wider than that of other portions, and are arranged side by side on the side of the flexible film substrate 20 facing the glass substrate 12. That is, the end portion of the dummy substrate wiring 22 that runs in the vertical direction is arranged side by side in the horizontal direction on the short side of the flexible film substrate 20. End portions of the substrate wiring 21 and the dummy substrate wiring 22 constitute an output terminal.

The heights of the end portions of the plurality of substrate wirings 21 and the plurality of dummy substrate wirings 22 (heights from the surfaces of the flexible film substrates 20 and 60) are the same as the end portions of the plurality of panel wirings 13 and the plurality of dummy panel wirings 14. Higher than height. The heights of the end portions of the plurality of substrate wirings 21 and the plurality of dummy substrate wirings 22 are set to the same height.

The plurality of substrate wirings 21 are formed in the central portion (A in FIG. 2) in the horizontal direction of the flexible film substrate 20. On the other hand, the plurality of dummy substrate wirings 22 are formed on both sides of the central portion of the flexible film substrate 20, that is, on both ends in the horizontal direction (B in FIG. 2). Note that the plurality of dummy substrate wirings 22 may be formed in any region in the lateral direction of the flexible film substrate 20.

The same number of substrate wirings 21 are provided in a one-to-one correspondence with each of the plurality of panel wirings 13, and the end portions of the substrate wirings 21 face the end portions of the corresponding panel wirings 13. Located and electrically connected. Similarly, the same number of dummy substrate wirings 22 are provided in a one-to-one correspondence with each of the plurality of panel wirings 13, and the end portions of the dummy substrate wirings 22 correspond to the corresponding dummy panel wirings 14. It is located opposite to the end of the. The end portion of the dummy substrate wiring 22 may or may not be electrically connected to the corresponding end portion of the dummy panel wiring 14.

The plurality of substrate wirings 21 provided on the

flexible film substrates

20 and 60 may include wirings for supplying different types of drive signals. Specifically, for example, the plurality of substrate wirings 21 provided on the flexible film substrate 20 include signal lines for supplying data signals to the display pixels, and the plurality of substrate wirings 21 provided on the flexible film substrate 60 include: A gate line for supplying a scanning signal to the display pixel is included.

The adhesive layer 30 is an anisotropic conductive adhesive sheet (ACF) containing conductive particles 31 and is provided between the flexible film substrate 20 and the glass substrate 12. The conductive particles 31 are located between the substrate wiring 21 and the panel wiring 13 so as to be in contact with both, and electrically connect the substrate wiring 21 and the panel wiring 13. The conductive particles 31 are located between the dummy substrate wiring 22 and the dummy panel wiring 14 so as to be in contact with both, and electrically connect the dummy substrate wiring 22 and the dummy panel wiring 14.

The control circuit 62 provided in the display panel device is connected to the flexible film substrate 20 and supplies a control signal to the flexible film substrate 20. Similarly, the control circuit 61 provided in the display panel device is connected to the flexible film substrate 60 and supplies a control signal to the flexible film substrate 60.

Here, the arrangement of the panel wiring 13, the dummy panel wiring 14, the substrate wiring 21, and the dummy substrate wiring 22 will be described.

The distance from the end of each side of the glass substrate 12 to the dummy panel wiring 14 (C1 in FIG. 2) is the distance from the end of the short side of the

flexible film substrates

20 and 60 to the dummy substrate wiring 22 (C2 in FIG. 2). Larger)

In two adjacent flexible film substrates 20 among the plurality of flexible film substrates 20, the dummy panel wiring 14 facing the dummy substrate wiring 22 of one flexible film substrate 20 and the dummy substrate wiring 22 of another flexible film substrate 20. 2 (C4 in FIG. 2) is the distance between the dummy substrate wiring 22 of one flexible film substrate 20 and the end of the short side of the other flexible film substrate 20 (in FIG. 2). Larger than C5).

The distance from the end of the short side of the flexible film substrate 20 to the dummy substrate wiring 22 (C2 in FIG. 2) is a distance in the range of 0.15 to 2 mm.

FIG. 3 is a cross-sectional view (a cross-sectional view taken along the line AA ′ in FIG. 2A) showing the method for manufacturing the display panel device of the present embodiment.

Further, in the present embodiment, two dummy panel wirings 14 are arranged on both sides of the panel wiring 13, and two dummy substrate wirings 22 are arranged on both sides of the substrate wiring 21. Note that the number of dummy panel wirings 14 and dummy substrate wirings 22 is not limited to this number as long as it can be arranged.

In this display panel device manufacturing method, a first display panel 16 having a plurality of display pixels and a glass substrate 12 in which a plurality of columns of panel wirings 13 connected to the display pixels are arranged on the first side is prepared. A second step of preparing the

flexible film substrates

20 and 60 in which a plurality of rows of substrate wirings 21 are arranged on the second side, and the length of the second side is shorter than the length of the first side, and the panel wiring 13 And the substrate wiring 21 are opposed to each other, the third step of interposing the adhesive 30a containing the conductive particles 31 between the flexible film substrate 20 and the glass substrate 12, and the flat surface of the pressing member 40 is the flexible film. Press against the

substrates

20 and 60, press the

flexible film substrates

20 and 60 against the glass substrate 12 using the pressing member 40, and further press the adhesive 3 with the pressing member 40. Heat is applied to a to solidify the adhesive 30a, thereby bonding the

flexible film substrates

20 and 60 and the glass substrate 12 and electrically connecting the opposing substrate wiring 21 and panel wiring 13 with conductive particles 31. Forming a bonding layer 30 to be formed. The

flexible film substrates

20 and 60 have dummy substrate wires 22 outside the outermost substrate wires 21 of the plurality of rows of substrate wires 21 on the second side, and the glass substrate 12 is a dummy substrate wire. The dummy panel wiring 14 is opposed to the wiring 22. The height of the dummy substrate wiring 22 is higher than the height of the dummy panel wiring 14.

The details of the method for manufacturing the display panel device will be described below. Note that the

flexible film substrates

20 and 60 are pressed against the glass substrate 12 through the same process, and the adhesive 30a is solidified by applying heat to the adhesive 30a by the pressing member 40, so that the flexible film substrate 20 and Since 60 and the glass substrate 12 are bonded, only the case of the flexible film substrate 20 will be described below.

First, as shown in FIG. 3A, a glass substrate 12 is prepared in which panel wiring 13 and dummy panel wiring 14 are provided in a wiring area, and display pixels are provided in the display area. Thereafter, an adhesive 30 a is formed on the wiring region of the glass substrate 12, that is, on the periphery of the glass substrate 12 so as to cover the panel wiring 13 and the dummy panel wiring 14.

Next, as shown in FIG. 3B, a plurality of flexible films are provided on each side of the glass substrate 12 so as to face the wiring region of the glass substrate 12 and with an adhesive 30a interposed therebetween. A substrate 20 is provided. At this time, the plurality of flexible film substrates 20 are provided so that the substrate wiring 21 and the dummy substrate wiring 22 face the corresponding panel wiring 13 and the dummy panel wiring 14.

Next, as shown in FIG. 3C, the pressing member 40 is pressed against the back surface (the surface on which the substrate wiring 21 and the dummy substrate wiring 22 are not formed) of the plurality of flexible film substrates 20, and the plurality of flexible films The substrate 20 is simultaneously pressed toward the glass substrate 12. Thereby, the conductive particles 31 contained in the adhesive 30a are arranged between the substrate wiring 21 and the panel wiring 13 in a state of being in contact with both, and the substrate wiring 21 and the panel wiring 13 are electrically connected. Further, the conductive particles 31 are disposed between the dummy substrate wiring 22 and the dummy panel wiring 14 so as to be in contact with both. Although not shown, a protective sheet for protecting the flexible film substrate 20 may be interposed between the pressing member 40 and the flexible film substrate 20.

At this time, the adhesive 30 a is guided by the dummy substrate wiring 22 and flows out to the surface of the glass substrate 12 through the gap between the dummy substrate wiring 22 and the dummy panel wiring 14 due to pressing by the pressing member 40. Accordingly, the adhesive 30 a does not flow out to the surfaces of the

flexible film substrates

20 and 60.

Further, the outflow amount of the adhesive 30 a can be adjusted by the dummy substrate wiring 22 and the dummy panel wiring 14. Here, the outflow amount of the adhesive 30a increases, and the outflowing adhesive 30a becomes lumpy and rises, and the

flexible film substrates

20 and 60 cannot be pressed against the flexible film substrate 20 with a uniform force. 13 can be prevented from becoming unstable. At the same time, the amount of the adhesive 30a between the substrate wiring 21 and the panel wiring 13 is reduced, and it is possible to suppress the instability between the two.

Next, as shown in FIG. 3D, the adhesive 30 a is heated by applying heat from the back surfaces of the plurality of flexible film substrates 20 by heating by the pressing member 40, and the adhesive 30 a is cured to bond the adhesive layer. 30 is formed. Thereby, a display panel device as shown in FIG. 3E is completed.

As described above, according to the display panel device of the present embodiment, in the step of pressing the flexible film substrate 20 to the glass substrate 12, the outflow position and the outflow amount of the adhesive 30 a by the dummy substrate wiring 22 and the dummy panel wiring 14. Can be controlled. As a result, the electrical connection between the substrate wiring 21 and the panel wiring 13 can be improved.

Further, the height of the dummy substrate wiring 22 on the flexible film substrate 20 is higher than the height of the dummy panel wiring 14 on the glass substrate 12. As a result, when the flexible film substrate 20 and the glass substrate 12 are pressure-bonded, the height of the dummy substrate wiring 22 is higher than the height of the dummy panel wiring 14. Through the gap between the wiring 22 and the dummy panel wiring 14, it is guided to the dummy substrate wiring 22 that is higher than the height of the dummy panel wiring 14 and flows out to the surface of the glass substrate 12. As a result, the leaked adhesive 30a is not propagated to the flexible film substrate 20 but spreads along the surface of the glass substrate 12, thereby suppressing the formation of a dama.

(Modification 1)
FIG. 4 is a diagram showing a detailed configuration of the display panel device according to the first modification of the present embodiment. 4A is an enlarged plan view of the display panel device of FIG. 1 (a plan view in which part A of FIG. 1 is enlarged), and FIG. 4B is a sectional view of FIG. 4A. Yes.

This display panel device is different from the display panel device of the present embodiment in that the dummy panel wiring 14 is not provided on the glass substrate 12.

In this display panel device, a plurality of display pixels are provided, and the panel wiring 13 connected to the display pixels is opposed to the display wiring 16 having the glass substrate 12 arranged in a plurality of columns on the first side, and the panel wiring 13. The substrate wirings 21 connected to the panel wirings 13 are arranged in a plurality of rows on the second side, the

flexible film substrate

20 or 60 having the second side shorter than the length of the first side, and the conductive particles 31. And an adhesive layer 30 that bonds the

flexible film substrate

20 or 60 and the glass substrate 12 and electrically connects the opposing substrate wiring 21 and panel wiring 13 with the conductive particles 31. And the flexible film board |

substrate

20 or 60 has the dummy board | substrate wiring 22 in the outer side of the outermost board | substrate wiring 21 among the several rows of board | substrate wirings 21 in the 2nd edge | side. Further, the glass substrate 12 is not provided with wiring at a portion facing the dummy substrate wiring 22.

As described above, according to the display panel device of this modification, in the step of pressing the

flexible film substrates

20 and 60 to the glass substrate 12, the outflow position and the outflow amount of the adhesive 30a are controlled by the dummy substrate wiring 22. Can do. As a result, the electrical connection between the substrate wiring 21 and the panel wiring 13 can be improved.

(Modification 2)
FIG. 5 is a plan view showing a detailed configuration of a display panel device according to Modification 2 of the present embodiment. 5A is a top view of the end portion of the flexible film substrate 20 as viewed from above in the display panel device of FIG. 1, and FIG. 5B is a wiring region 17 of the glass substrate 12 in the display panel device of FIG. The top view which looked at the edge part of this from the upper direction is shown.

In this display panel device, the planar shape of a part (J in FIG. 5) of the end portion of the dummy substrate wiring 22 is different from the planar shape of the end portion of the substrate wiring 21, and a part of the end portion of the dummy panel wiring 14 ( 5 is different from the display panel device of the present embodiment in that the planar shape of K) is different from the planar shape of the end portion of the panel wiring 13.

The planar shape of a part (J in FIG. 5) of the end portion of the dummy substrate wiring 22 is different from the planar shape of the other portion of the end portion of the substrate wiring 21. That is, the planar shape of a part of the end portion of the dummy substrate wiring 22 (J in FIG. 5) is a quadrangular ring shape, while the other portion of the end portion of the dummy substrate wiring 22 is the present embodiment. Like the dummy substrate wiring 22 of the form, it has a linear shape.

The planar shape of a part (K in FIG. 5) of the end portion of the plurality of dummy panel wirings 14 is different from the planar shape of the other part of the end portion of the panel wiring 13. That is, the planar shape of a part (K in FIG. 5) of the end portions of the plurality of dummy panel wirings 14 is a quadrangular shape, whereas the other part of the end portions of the dummy panel wirings 14 is the main shape. Similar to the dummy panel wiring 14 of the embodiment, it has a linear shape.

The planar shape of a part of the end portion of the dummy substrate wiring 22 (J in FIG. 5) is different from the planar shape of a part of the end portion of the dummy panel wiring 14 (K in FIG. 5). In the state in which the

flexible film substrate

20 or 60 and the glass substrate 12 are pressure-bonded, the rectangular annular portion (J in FIG. 5) of the dummy substrate wiring 22 is the rectangular portion (K in FIG. 5) of the dummy panel wiring 14. Surrounding.

As described above, according to the display panel device of this modification, the

flexible film substrate

20 or 60 and the glass substrate 12 can be pressure-bonded using the dummy panel wiring 14 and the dummy substrate wiring 22 as alignment marks. As a result, the positional deviation between the substrate wiring 21 and the panel wiring 13 can be reduced, and the electrical connection can be further improved.

(Modification 3)
FIG. 6 is a plan view showing a detailed configuration of a display panel device according to Modification 3 of the present embodiment. 6A shows a top view of the end portion of the flexible film substrate 20 as viewed from above in the display panel device of FIG. 1, and FIG. 6B shows the wiring of the glass substrate 12 in the display panel device of FIG. The top view which looked at the edge part of the area | region 17 from upper direction is shown.

In this display panel device, a plurality of columns of substrate wirings 21 as shown in FIG. 2 include power supply wirings 23 for supplying a power supply voltage to display pixels, and a plurality of panel wirings 13 as shown in FIG. The display panel device is different from the display panel device according to the second modification of the present embodiment in that the power supply wiring 15 is included.

The outermost substrate wiring 21 of the plurality of rows of substrate wirings 21, that is, the outermost wiring of the plurality of output wirings is the power supply wiring 23. Similarly, the outermost panel wiring 13 among the plurality of rows of panel wirings 13 is the power supply wiring 15.

The power supply wiring 23 is formed to run in parallel with the dummy substrate wiring 22. The power supply wiring 15 runs parallel to the dummy panel wiring 14 and is formed between the dummy panel wirings 14.

The power supply wiring 23 is wider than the dummy substrate wiring 22 and the substrate wiring 21, and the power supply wiring 15 is wider than the dummy panel wiring 14 and the panel wiring 13.

As described above, according to the display panel device of this modification, even in the configuration including the

power supply wirings

15 and 23, the electrical connection between the substrate wiring 21 and the panel wiring 13 can be improved. At this time, since the power supply wiring 23 having a wide line width is provided on the

flexible film substrates

20 and 60, a margin portion where wirings at both ends in the lateral direction of the

flexible film substrates

20 and 60 are not formed is reduced. As a result, in the step of pressing the

flexible film substrates

20 and 60 to the glass substrate 12, the adhesive 30a easily flows out of the

flexible film substrates

20 and 60. However, since the outflow amount of the adhesive 30a can be controlled by the dummy substrate wiring 22, it is possible to prevent the electrical connection between the substrate wiring 21 and the panel wiring 13 from being defective. Therefore, this configuration is particularly useful in an organic EL panel device that requires power supply wiring.

(Modification 4)
FIG. 7 is a plan view showing a detailed configuration of a display panel device according to Modification 4 of the present embodiment. 7A shows a top view of the end portion of the flexible film substrate 20 as viewed from above in the display panel device of FIG. 1, and FIG. 7B shows the wiring of the glass substrate 12 in the display panel device of FIG. The top view which looked at the edge part of the area | region 17 from upper direction is shown.

In this display panel device, a part of the substrate wiring 21 is a power supply wiring 23 for supplying a power supply voltage to the display pixels, and a part of the panel wiring 13 is also a power supply wiring 15 correspondingly. This is different from the display panel device according to the second modification of the embodiment. Further, the shape of some end portions of the plurality of dummy substrate wirings 22 is a planar shape provided with notches (J in FIG. 7), and the shape of some end portions of the plurality of dummy panel wirings 14 is formed. The display panel device is also different from the display panel device of the second modification of the present embodiment in that it has a planar shape provided with two notches (K in FIG. 7).

As shown in FIG. 2, the outermost substrate wiring 21 of the plurality of rows of substrate wirings 21, that is, the outermost wiring of the plurality of output wirings is used as the power supply wiring 23. Similarly, the outermost panel wiring 13 of the plurality of rows of panel wirings 13 as shown in FIG.

The power supply wiring 23 runs parallel to the dummy substrate wiring 22 and is formed between two dummy substrate wirings 22 or the dummy substrate wiring 22 and the substrate wiring 21. The power supply wiring 15 runs parallel to the dummy panel wiring 14 and is formed between two dummy panel wirings 14 or the dummy panel wiring 14 and the panel wiring 13.

The dummy substrate wiring 22 has a notch (J in FIG. 7), and the dummy panel wiring 14 has a notch (FIG. 7) in a region facing the notch (J in FIG. 7) of the dummy substrate wiring 22. Of K). In the step of placing the

flexible film substrates

20 and 60 facing the glass substrate 12 (third step), the cutout portion of the dummy substrate wiring 22 (J in FIG. 7) and the cutout portion of the dummy panel wiring 14 (FIG. 7 is used as an alignment mark so that the panel wiring 13 and the substrate wiring 21 are opposed to each other. Therefore, in the state where the

flexible film substrate

20 or 60 and the glass substrate 12 are pressure-bonded, the island-shaped portion (L in FIG. 7) of the dummy substrate wiring 22 is formed in the cutout portion (J in FIG. 7) of the dummy substrate wiring 22. Is located.

power supply wirings

15 and 23, the electrical connection between the substrate wiring 21 and the panel wiring 13 can be improved.

In the display panel device according to this modification, the cutout portion of the dummy panel wiring 14 may be formed as shown in FIG. That is, the protrusions (L in FIG. 8) of the other dummy panel wirings 14 are formed so as to protrude into the notches (K in FIG. 8) of one dummy panel wiring 14 of the adjacent dummy panel wirings 14. Also good.

(Modification 5)
FIG. 9 is a plan view showing a detailed configuration of a display panel device according to Modification 5 of the present embodiment. 9A shows a top view of the end portion of the flexible film substrate 20 as viewed from above in the display panel device of FIG. 1, and FIG. 9B shows the wiring of the glass substrate 12 in the display panel device of FIG. The top view which looked at the edge part of the area | region 17 from upper direction is shown.

In this display panel device, a part of the substrate wiring 21 as shown in FIG. 2 is a power supply wiring 23 for supplying a power supply voltage to the display pixels, and a part of the panel wiring 13 as shown in FIG. Is different from the display panel device of the present embodiment in that the power supply wiring 15 is also used.

The power supply wiring 23 has a notch (J in FIG. 9) and a rectangular annular portion (M in FIG. 9) inside thereof, and the power supply wiring 15 has a notch (J in FIG. 9). ) In the region opposite to (), and has a quadrangular portion (L in FIG. 9) inside. In the step of placing the

flexible film substrates

20 and 60 facing the glass substrate 12 (third step), the cutout portion (J in FIG. 9) of the power supply wiring 23 and the cutout portion (FIG. 9 of FIG. 9). K) is used as an alignment mark, and the panel wiring 13 and the substrate wiring 21 are arranged so as to face each other. In a state in which the

flexible film substrate

20 or 60 and the glass substrate 12 are pressure-bonded, the rectangular portion (L in FIG. 9) of the power supply wiring 15 is located in the annular portion (M in FIG. 9) of the power supply wiring 23.

power supply wirings

Further, the

flexible film substrate

20 or 60 and the glass substrate 12 can be arranged using the notch portions of the

power supply wirings

15 and 23 as alignment marks. As a result, the positional deviation between the substrate wiring 21 and the panel wiring 13 can be reduced, and the electrical connection can be further improved.

In the display panel device according to this modification, the cutout portions of the

power supply wires

15 and 23 may be formed as shown in FIG. That is, a concave notch (J in FIG. 10) is formed on the side surface of the power supply wiring 23, and a concave notch (K in FIG. 10) is formed on the side surface of the power supply wiring 15. The convex portion (L in FIG. 10) of the dummy panel wiring 14 may be formed so as to protrude from the portion (K in FIG. 10). 10, the

flexible film substrate

20 or 60 and the glass substrate 12 are pressure-bonded, and the convex portion (L in FIG. 10) of the power wiring 15 is formed in the notch (J in FIG. 10) of the power wiring 23. ) Is located.

5 to 10, FIGS. 5A to 10A are top views of the end portion of the flexible film substrate 20 as viewed from above, and FIG. 5B to FIG. 10 (b) is described as a top view of the end of the wiring region 17 of the glass substrate 12 as viewed from above, but FIGS. 5 (a) to 10 (a) are wiring patterns of the glass substrate 12, 5 (b) to 10 (b) may be wiring patterns of the flexible film substrate 20. FIG.

(Comparative example)
11 and 12 are plan views (a top view of the end portion of the flexible film substrate 20 as viewed from above) showing a detailed configuration of a display panel device of a comparative example of the present embodiment. FIG. 13 is a cross-sectional view (a cross-sectional view taken along the line AA ′ in FIG. 12) showing a detailed configuration of the display panel device of this comparative example.

The display panel device of FIG. 11 is not provided with the dummy panel wiring 14 and the dummy substrate wiring 22 and has a wider blank portion where the wiring of the flexible film substrate 20 is not provided, compared to the display panel device of the present embodiment. Has a configuration. In this configuration, in the step of pressing the flexible film substrate 20 to the glass substrate 12, the adhesive flows out to the surface of the glass substrate 12 through the gap between the panel wiring 13 and the substrate wiring 21. However, since the blank portion of the flexible film substrate 20 is wide, a large amount of adhesive spreads in the blank portion, so that the height of the formed adhesive layer 30 is low. However, in this configuration, the adhesive easily flows out through the gap between the panel wiring 13 and the substrate wiring 21, and a large amount of adhesive accumulates in the margin, so that the adhesive between the substrate wiring 21 and the panel wiring 13 is retained. And the continuity between the two becomes unstable.

On the other hand, the display panel device of FIGS. 12 and 13 is different from the display panel device of the present embodiment in that the dummy panel wiring 14 and the dummy substrate wiring 22 are not provided, but the flexible film substrate 20 wiring is provided. The non-margin portion has the same size. In this configuration, since the blank portion of the flexible film substrate 20 is narrow, the amount of adhesive flowing out of the flexible film substrate 20 in the process of connecting the flexible film substrate 20 to the glass substrate 12 is large, and the adhesive layer 30 to be formed is formed. The height of becomes higher. Further, in this configuration, since the adhesive easily flows out through the gap between the panel wiring 13 and the substrate wiring 21, the adhesive that has flowed out becomes lumped outside the flexible film substrate 20, and in the crimping process, the flexible film substrate 20. Cannot be bonded in parallel with the glass substrate 12.

On the other hand, the display panel device of the present embodiment is provided with dummy substrate wirings 22 as shown in the plan view of FIG. 14 (a top view of the end portion of the flexible film substrate 20 as viewed from above). Therefore, the amount of adhesive flowing out can be controlled by the dummy substrate wiring 22, and the electrical connection between the substrate wiring 21 and the panel wiring 13 can be improved.

FIG. 15 is a photograph taken from above the flexible film substrate 20 in a state after the flexible film substrate 20 is pressure-bonded to the glass substrate 12. FIG. 15A and FIG. 15B show photographs of portions near the left end and the right end of the flexible film substrate 20 in the conventional display panel device.

15A and 15B, it can be seen that in the conventional display panel device, about 0.2 mm of adhesive flows out from the end of the flexible film substrate 20 and spreads on the surface of the glass substrate 12. Moreover, it turns out that the adhesive agent which flowed out becomes lumpy.

As described above, the display panel device and the manufacturing method thereof according to the present invention have been described based on the embodiment. However, the present invention is not limited to this embodiment. The present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention.

For example, in the above-described embodiment, the heights of the end portions of the plurality of panel wirings 13 and the plurality of dummy panel wirings 14 may not be equal to each other. Similarly, the heights of the end portions of the plurality of substrate wirings 21 and the plurality of dummy substrate wirings 22 may not be equal to each other.

When the dummy panel wiring 14 is used as a wiring for transmitting a test signal for confirming whether a signal input to the display panel 16 is normal, the dummy panel wiring 14 may be connected to the display area 10. Good. When there is no special circumstance such as using the dummy substrate wiring 22 and the dummy panel wiring 14 for wiring for transmitting a test signal, the conductive particles 31 are interposed between the dummy substrate wiring 22 and the dummy panel wiring 14. It does not have to be located in contact.

Further, the drive circuit 24 may not be mounted on the

flexible film substrate

20 or 60 but may be provided outside thereof.

In addition, although the same number of the plurality of substrate wirings 21 and dummy substrate wirings 22 are provided in a form corresponding to one-to-one with respect to the panel wiring 13 and the dummy panel wiring 14, a different number may be provided. For example, the dummy panel wiring 14 corresponding to a part of the dummy substrate wiring 22 may not be provided.

Further, only one

flexible film substrate

20 or 60 may be provided for one side of the glass substrate 12.

The present invention can be used for a display panel device and a method for manufacturing the same, and particularly for an organic EL panel device or the like.

DESCRIPTION OF SYMBOLS 10 Display area 11

Protective plate

12, 101 Glass substrate 13 Panel wiring 14

Dummy panel wiring

15, 23 Power supply wiring 16 Display panel 17

Wiring area

20, 60 Flexible film substrate 21 Substrate wiring 22 Dummy substrate wiring 24 Drive circuit 30 Adhesive layer 30a Adhesion Agent 31 Conductive particle 40

Press member

61, 62 Control circuit 102 Flexible cable 103 Anisotropic conductive adhesive 104

Dummy electrode

105, 106 Lead electrode

Claims

A display panel having a glass substrate in which a plurality of display pixels are provided and panel wiring connected to the display pixels is arranged in a plurality of rows on a first side;
A plurality of rows of substrate wirings facing the panel wiring and connected to the panel wiring are arranged in a second side, and the length of the second side is shorter than the length of the first side, and a flexible film substrate,
An adhesive layer containing conductive particles, and bonding the flexible film substrate and the glass substrate, and electrically connecting the opposing substrate wiring and the panel wiring with the conductive particles;
The flexible film substrate has a dummy substrate wiring outside the outermost substrate wiring of the plurality of rows of substrate wirings in the second side,
The glass substrate has a dummy panel wiring facing the dummy substrate wiring,
The height of the dummy substrate wiring is higher than the height of the dummy panel wiring,
Display panel device.
The distance from the end of the first side to the dummy panel wiring is larger than the distance from the end of the second side to the dummy substrate wiring.
The display panel device according to claim 1.
A plurality of the flexible film substrates are provided for the first side,
The display panel device according to claim 1.
The plurality of flexible film substrates include a first flexible film substrate and a second flexible film substrate adjacent to each other,
The distance between the dummy panel wiring facing the dummy substrate wiring of the first flexible film substrate and the dummy panel wiring facing the dummy substrate wiring of the second flexible film substrate is the distance of the first flexible film substrate Greater than the distance between the dummy substrate wiring and the end of the second side of the second flexible film substrate;
The display panel device according to claim 3.
The plurality of columns of substrate wirings include signal lines for supplying data signals to the display pixels.
The display panel device according to any one of claims 1 to 4.
The plurality of columns of substrate wirings include gate lines that supply scanning signals to the display pixels.
The display panel device according to any one of claims 1 to 4.
The plurality of columns of substrate wirings include power supply wiring for supplying a power supply voltage to the display pixels.
The display panel device according to any one of claims 1 to 4.
The outermost substrate wiring among the plurality of rows of substrate wirings is the power supply wiring.
The display panel device according to claim 7.
On the flexible film substrate, a driving circuit for driving the display pixels, a plurality of input wirings for inputting signals to the driving circuit, and a plurality of outputs for outputting signals from the driving circuit Wiring is provided as the substrate wiring,
The power supply wiring is an outermost wiring of the plurality of output wirings.
The display panel device according to claim 7 or 8.
The distance from the end of the second side of the flexible film substrate to the dummy substrate wiring is a distance within a range of 0.15 to 2 mm.
The display panel device according to any one of claims 1 to 9.
The dummy substrate wiring has a notch,
The dummy panel wiring has a notch in a region facing the notch.
The display panel apparatus of any one of Claims 1-10.
The dummy substrate wiring is a wiring parallel to the substrate wiring,
The display panel device according to claim 1.
A display panel having a glass substrate in which a plurality of display pixels are provided and panel wiring connected to the display pixels is arranged in a plurality of rows on a first side;
A plurality of rows of substrate wirings facing the panel wiring and connected to the panel wiring are arranged in a second side, and the length of the second side is shorter than the length of the first side, and a flexible film substrate,
An adhesive layer containing conductive particles, and bonding the flexible film substrate and the glass substrate, and electrically connecting the opposing substrate wiring and the panel wiring with the conductive particles;
The flexible film substrate has a dummy substrate wiring outside the outermost substrate wiring of the plurality of rows of substrate wirings in the second side,
The glass substrate is not provided with a wiring in a portion facing the dummy substrate wiring,
Display panel device.
A first step of preparing a display panel having a glass substrate provided with a plurality of display pixels and having a panel wiring connected to the display pixels arranged in a plurality of rows on a first side;
A second step of preparing a flexible film substrate in which the substrate wiring is arranged in a plurality of rows on the second side, and the length of the second side is shorter than the length of the first side;
A third step of interposing an adhesive containing conductive particles between the flexible film substrate and the glass substrate in a form in which the panel wiring and the substrate wiring face each other;
The flat surface of the pressing member is pressed against the flexible film substrate, the flexible film substrate is pressed against the glass substrate using the pressing member, and heat is applied to the adhesive by the pressing member. A fourth step of forming an adhesive layer that bonds the flexible film substrate and the glass substrate together by electrically solidifying the adhesive and electrically connects the opposing substrate wiring and the panel wiring with the conductive particles. And including
The flexible film substrate has a dummy substrate wiring outside the outermost substrate wiring of the plurality of rows of substrate wirings in the second side,
The glass substrate has a dummy panel wiring facing the dummy substrate wiring,
The height of the dummy substrate wiring is higher than the height of the dummy panel wiring,
Manufacturing method of display panel device.
In the fourth step,
The adhesive flows out to the surface of the glass substrate through the gap between the dummy substrate wiring and the dummy panel wiring due to the pressing.
The manufacturing method of the display panel apparatus of Claim 14.
In the fourth step,
The adhesive is guided by the dummy substrate wiring and flows out to the surface of the glass substrate through the gap between the dummy substrate wiring and the dummy panel wiring due to the pressing.
The manufacturing method of the display panel apparatus of Claim 14.
In the fourth step,
The adhesive does not flow out to the surface of the flexible film substrate,
The manufacturing method of the display panel apparatus of any one of Claims 14-16.
In the fourth step,
The distance from the end of the first side to the dummy panel wiring is larger than the distance from the end of the second side to the dummy substrate wiring.
The manufacturing method of the display panel apparatus of any one of Claims 14-17.
In the fourth step,
A plurality of the flexible film substrates are provided for the first side,
The manufacturing method of the display panel apparatus of any one of Claims 14-18.
The plurality of flexible film substrates include a first flexible film substrate and a second flexible film substrate adjacent to each other,
In the fourth step,
The distance between the dummy panel wiring facing the dummy substrate wiring of the first flexible film substrate and the dummy panel wiring corresponding to the dummy substrate wiring of the second flexible film substrate is the first of the second flexible film substrate. Greater than the distance between the end of the side of 2 and the dummy substrate wiring of the first flexible film substrate,
The manufacturing method of the display panel apparatus of any one of Claims 14-19.
The plurality of columns of substrate wirings include signal lines for supplying data signals to the display pixels.
The method for manufacturing a display panel device according to any one of claims 14 to 20.
The plurality of columns of substrate wirings include gate lines that supply scanning signals to the display pixels.
The method for manufacturing a display panel device according to any one of claims 14 to 20.
The plurality of columns of substrate wirings include power supply wiring for supplying a power supply voltage to the display pixels.
The method for manufacturing a display panel device according to any one of claims 14 to 20.
The outermost substrate wiring among the plurality of rows of substrate wirings is the power supply wiring.
The manufacturing method of the display panel apparatus of Claim 23.
On the flexible film substrate, a driving circuit for driving the display pixels, a plurality of input wirings for inputting signals to the driving circuit, and a plurality of outputs for outputting signals from the driving circuit Wiring is provided as the substrate wiring,
The power supply wiring is an outermost wiring of the plurality of output wirings.
The manufacturing method of the display panel apparatus of Claim 23 or Claim 24.
The distance from the end of the second side of the flexible film substrate to the dummy substrate wiring is a distance within a range of 0.15 to 2 mm.
The method for manufacturing a display panel device according to any one of claims 14 to 25.
The dummy substrate wiring has a notch,
The dummy panel wiring has a notch in a region facing the notch,
In the third step,
Using the notch portion of the dummy substrate wiring and the notch portion of the dummy panel wiring as an alignment mark, the panel wiring and the substrate wiring are opposed to each other,
The method for manufacturing a display panel device according to any one of claims 14 to 26.
The dummy substrate wiring is a wiring parallel to the substrate wiring,
The method for manufacturing a display panel device according to any one of claims 14 to 27.