KR102662413B1 - Electrode connection structure for display panel - Google Patents

Abstract

Embodiments according to the present invention include a panel having a plurality of panel electrodes, a flexible substrate disposed on the panel, a plurality of connection electrodes disposed to face the plurality of panel electrodes, and a conductive substrate disposed between the panel and the flexible substrate. It may include an adhesion layer containing balls. Here, by providing a receiving groove in which the conductive balls are accommodated on the lower surface of the connection electrode, the conductive balls are prevented from being pushed out of the connection electrode and the panel electrode, thereby reducing the effective connection area and increasing resolution.

Description

Electrode connection structure for display panel {ELECTRODE CONNECTION STRUCTURE FOR DISPLAY PANEL}

The present invention relates to an electrode connection structure for a display panel, and more specifically, to an electrode connection structure for a display panel that can improve resolution.

In general, various electronic devices such as mobile communication terminals, digital cameras, laptops, and TVs are equipped with video display devices to display images.

Various types of video display devices can be used. Depending on the implementation method of the image display device, a liquid crystal display device, an electroluminescence display device, an electrophoresis display device, an electrowetting display device, a quantum dot display device, etc. are used. Additionally, depending on the type of image display device, flat display devices, flexible display devices, rollable display devices, etc. are used.

Among these, the liquid crystal display device can be implemented by mounting a driving IC film, COF (Chip on film), on a liquid crystal panel having a liquid crystal layer formed between an array substrate and a color filter substrate.

In the display device mounting method, an anisotropic conductive film (ACF) is placed on the panel circuit electrode part of the liquid crystal panel part, one side of the COF with the circuit pattern electrode is aligned, and heat and pressure are applied to compress and fit. The other side is pressed by applying heat and pressure to a printed circuit board (PCB). In order for the panel and the COF to be electrically connected, electrode pads may be disposed on the panel and the COF, respectively.

The anisotropic conductive film may be formed of epoxy resin and includes conductive balls for electrical connection between the panel and the COF. When connecting a panel and a COF using an anisotropic conductive film containing conductive balls, the epoxy resin of the anisotropic conductive film is pressed when the panel and the COF are pressed, and some of the conductive balls dispersed inside are used for electrical connection, but the remaining Some are pushed outward from the contact area between the electrode pads and gather around the outer periphery of the electrode pads.

In this way, the conductive balls gathered around the outer circumference of the electrode pads form an electrical line, which often causes a short circuit with other neighboring electrode pads.

In addition, since the lower surface of the COF is generally manufactured in a downwardly convex shape during the manufacturing process, when the COF is pressed to the panel using a pressing device, the electrode pad of the COF and the electrode pad of the panel engage and the conductive ball becomes the electrode pad. It's easy to get pushed out of the field.

Accordingly, there is a problem that the conductive balls deviate to the outside of the electrode pads, causing the conductive balls to aggregate at the interface of the electrode pads, causing an electrical short, and the number of indentations in the connection area between the electrode pads is reduced.

Additionally, as the conductive ball deviates from the connection area, the bonding area between electrode pads increases, causing a problem that the resolution of the panel decreases. The problems mentioned above are not limited to the attachment of the panel and the COF, but can also occur on flexible substrates such as COF.

Accordingly, the inventors of the present invention recognized the problem that as the conductive ball deviates from the connection area where the electrode pads are engaged, the bonding area between the electrode pads increases and the resolution of the panel decreases, and the conductive ball is connected between the electrode pads. An electrode connection structure for a display panel that can be accommodated in a provided connection area has been invented. In this case, in order to distinguish between the electrode pads, the electrode pad disposed on the panel may be referred to as a panel electrode, and the electrode pad disposed on the flexible substrate may be referred to as a connection electrode.

The purpose of the present invention is to prevent the conductive balls from escaping from the connection area provided between the panel electrodes and the connection electrodes when the panel and the flexible substrate are pressed, thereby preventing electrical shorts that may occur due to the phenomenon of the conductive balls clumping together on the outside of the electrodes. The goal is to provide an electrode connection structure for a display panel that can be used.

In order to achieve the above-described object, an embodiment according to the present invention includes a panel having a plurality of panel electrodes, a flexible substrate disposed on the panel and having a plurality of connection electrodes arranged to face the plurality of panel electrodes, and a panel It is disposed between flexible substrates and includes an adhesion layer including conductive balls. In addition, at the bottom of the connection front, a receiving groove may be provided to accommodate challenge balls. Accordingly, by increasing the number of conductive balls that can be located between the panel electrode and the connection electrode, it is possible to prevent aggregation of the conductive balls that may occur outside the panel electrode and the connection electrode or short circuit with other panel electrodes or connection electrodes. .

The receiving groove may have a concave shape in the direction of the flexible substrate.

The receiving groove may include a straight surface between the outer circumference of the receiving horn and the circumference of the lower surface of the connection electrode. And, the straight surface may be in contact with the upper surface of the panel electrode.

A round portion convex in the direction of the panel electrode may be provided between the outer circumference of the receiving groove and the circumference of the lower surface of the connection electrode. Additionally, the round portion may be in close contact with the upper surface of the panel electrode.

A coupling groove coupled to the lower surface of the connection electrode may be provided on the upper surface of the panel electrode.

An insertion groove may be further provided on the upper surface of the panel electrode, connected to the outer circumference of the receiving groove, and into which the lower surface edge of the connection terminal is inserted.

The insertion groove may have a width set along the upper surface of the panel electrode so that it can be slidably moved while the lower surface edge of the connection terminal is in contact.

The present invention has the effect of preventing electric shorts from occurring due to the conductive balls clumping on the outside of the electrode pads by preventing them from escaping from the connection area provided between the electrode pads of the conductive balls when the panel and the flexible substrate are pressed together.

1 is a cross-sectional view showing an electrode connection structure in a display panel.
Figure 2 is a cross-sectional view showing a state in which electrode connection in the display panel is completed.
Figure 3 is a photograph showing the conductive balls being pushed outward between the panel electrode and the connection electrode.
Figure 4 is photos showing the phenomenon of conductive balls clumping together around electrodes.
Figure 5 is photos showing indentations in the effective area of the electrode pad.
Figure 6 is a cross-sectional view showing an electrode connection structure for a display panel according to an embodiment of the present invention.
Figure 7 is a cross-sectional view showing a state in which a panel electrode and a connection electrode are attached to each other according to an embodiment of the present invention.
Figure 8 is a cross-sectional view showing a first embodiment of the receiving groove according to the present invention.
Figure 9 is a cross-sectional view showing a second embodiment of the receiving groove according to the present invention.
Figure 10 is a cross-sectional view showing a third embodiment of the receiving groove according to the present invention.
Figure 11 is a cross-sectional view showing a fourth embodiment of the receiving groove according to the present invention.
Figure 12 is a cross-sectional view showing an example in which a coupling groove is provided in the panel electrode according to the present invention.
Figure 13 is a cross-sectional view showing an example in which another coupling groove is provided in the panel electrode according to the present invention.
Figure 14 is a cross-sectional view showing an example in which an insertion groove is further provided on the upper surface of the panel electrode according to the present invention.
Figures 15a and 15b are cross-sectional views showing the process in which the edge of the lower surface of the connection terminal according to the present invention is positioned in the insertion groove.
Figure 16 is a photograph showing indentations in the effective area between electrodes according to the present invention.

Hereinafter, with reference to the drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention.

The present invention may be implemented in many different forms and is not limited to the embodiments described herein.

In order to clearly explain the present invention, parts that are not relevant to the description are omitted, and identical or similar components are given the same reference numerals throughout the specification.

Hereinafter, the “top (or bottom)” of the substrate or the provision or arrangement of any component on the “top (or bottom)” of the substrate means that any component is provided or disposed in contact with the upper (or lower) surface of the substrate. means that

Additionally, it is not limited to not including other components between the substrate and any components provided or disposed on (or under) the substrate.

Hereinafter, the electrode connection structure for a display panel of the present invention will be described with reference to the attached drawings.

1 is a cross-sectional view showing an electrode connection structure in a display panel.

Referring to FIG. 1, a flexible substrate 20 such as a chip on film (COF) on which a driving IC is mounted is attached to apply a signal from the outside to drive the panel 10.

In this case, the flexible substrate 20 is not limited to COF and may include various types of substrates attached to the panel 10.

In order to attach the flexible substrate 20 to the panel 10, the panel 10 and the flexible substrate 20 are placed facing each other, and the flexible substrate 20 is located on the top of the panel 10. Explain.

First pad electrodes 21 are arranged at intervals on the flexible substrate 20, and second pad electrodes 11 are arranged at intervals on the panel 10. Here, the first pad electrodes 21 and the second pad electrodes 11 are arranged to overlap and face each other.

When forming the first pad electrodes 21 on the flexible substrate 20, the pattern of the first pad electrodes 21 is formed using a photo process. The photo process applies a material to form a pad electrode on the flexible substrate 20, and applies a photoresistant on the pad electrode material to use a mask with holes formed in the area where the pattern is to be formed or the area where the pattern will not be formed. Exposed and developed to form a pattern.

In this case, the central part of the pattern where the photoresistant is applied completely covers the pad electrode, but the peripheral part of the pattern where the photoresistant is applied is affected by the etching solution. Accordingly, the lower surface of the first pad electrodes 21 of the flexible substrate 20 is formed in a convex shape by etching the peripheral portion more than the central portion.

Additionally, an anisotropic conductive film (ACF) 30 is disposed between the flexible substrate 20 and the panel 10. The anisotropic conductive film 30 includes conductive balls 31 and may be formed of epoxy resin, but is not limited thereto.

Figure 2 is a cross-sectional view showing a state in which electrode connection in the display panel is completed. Figures 3 (a) and (b) are photographs showing the phenomenon of conductive balls being pushed outward between the panel electrode and the connection electrode. In this case, the panel electrode refers to the second electrode pad 11, and the connection electrode refers to the first electrode pad 21.

<48> Referring to FIG. 2, the anisotropic conductive film 30 and the flexible substrate 20 are sequentially placed on the panel 10. For example, the flexible substrate 20 may be a Chip On Film (COF), a Flexible Printed Circuit Film (FPC), or the like.

A silicone rubber is placed on the flexible substrate 20 seated in this way, and the flexible substrate 20 is pressed using the thermal compression head of the compression device.

Here, the silicone rubber is a cushioning material to prevent the panel 10 from being damaged by the pressure of the pressing device. The method for pressing the flexible substrate 20 to the panel 10 is not limited to this.

Accordingly, as the flexible substrate 20 is pressed, the conductive ball 31 present in the anisotropic conductive film 30 is pushed to the outside of the first electrode pad 21 and the second electrode pad 11, thereby forming the first electrode pad ( 21) and the second electrode pad 11, such as the address electrode of the panel 10, may be in close contact. In this case, since the lower surface of the first electrode pad 21 is convex, the conductive ball 31 is more easily pushed to the outside of the first electrode pad 21. This can be confirmed through Figure 3.

The first electrode pad 21 and the second electrode pad 11 may be made of a conductive material such as copper, but are not limited thereto. And, the second electrode pad 11 may be a part of the address electrode. In this case, the address electrode may be various types of signal wires arranged to apply electric signals to the pixels included in the panel 10.

After the panel 10 and the flexible substrate 20 are pressed, the space where the first electrode pad 21 and the second electrode pad 11 are not located is filled with epoxy resin, and the first electrode pad 21 and The space where the second electrode pad 11 is located must be filled with conductive balls 31. Accordingly, the panel 10 and the flexible substrate 20 are insulated by epoxy resin, and the first electrode pad 21 and the second electrode pad 11 are electrically connected by conductive balls 31. do. However, because it is difficult to fill the conductive balls 31 due to the convex shape of the lower surface of the first electrode pad 21, the conductive balls (31) gathered on the outside of the first electrode pad 21 and the second electrode pad 11 31) may form an electrical line and cause a short circuit with other neighboring electrode pads.

Figures 4 (a) and (b) are photographs showing the phenomenon of conductive balls clumping together around the connection electrode. Figure 4A is a photograph showing the state in which the conductive balls 31 are clustered at the boundary surface of the first electrode pad 21. As mentioned, the first electrode pad may be short-circuited with another electrode pad.

And, Figures 5 (a) and (b) are photographs showing indentations in the effective area of the electrode pad. Figure 5B shows that the number of indentations present in the connection area between electrode pads has been reduced.

Figure 6 is a cross-sectional view showing an electrode connection structure for a display panel according to an embodiment of the present invention.

Referring to FIG. 6, the electrode connection structure for a display panel of the present invention includes a panel 100, a flexible substrate 200, and an adhesion layer 300.

The panel 100 and the flexible substrate 200 are arranged to face each other along the top and bottom. The panel 100 may be disposed below the flexible substrate 200, but is not limited thereto.

A plurality of panel electrodes 110 may be disposed on the upper surface of the panel 100 at intervals from each other. In this case, the panel electrode 110 may be the address electrode described above.

A plurality of connection electrodes 210 may be disposed on the lower surface of the flexible substrate 200 at intervals from each other. In this case, the connection electrode 210 may be a copper electrode, but is not limited thereto.

Here, the plurality of panel electrodes 110 may be arranged in one-to-one correspondence with the plurality of connection electrodes 210 along the top and bottom.

The attachment layer 300 disposed between the panel 100 and the flexible substrate 200 may be an anisotropic conductive film (ACF).

Conductive balls 310 may be included inside the attachment layer 300.

Additionally, a receiving groove 211 may be provided on the lower surface of each of the plurality of connection electrodes 210. The receiving groove 211 may provide a space for receiving challenge balls. The receiving groove 211 may be formed by adding an etching process to the process of forming the connection electrode 210.

Here, the receiving groove 211 provided on the lower surface of the connecting electrode 210 may be formed as a concave groove in the direction of the flexible substrate 200.

The receiving groove 211 has a concave shape along the top, and the end of the receiving groove 211 may be connected to the lower surface of the outer circumference of the connecting electrode 210.

Figure 7 is a cross-sectional view showing a state in which a panel electrode and a connection electrode are attached to each other according to an embodiment of the present invention.

Referring to FIG. 7, the pressing process of the panel 100 and the flexible substrate 200 will be described.

Referring to FIG. 7, the panel 100 and the flexible substrate 200 according to the present invention can be pressed to each other with a certain force using a pressing device.

Here, the lower surface of each connection electrode 210 may be in contact with the upper surface of each panel electrode 110 disposed below.

In this case, the conductive balls 310 located between each connection electrode 210 and the panel electrode 110 are in contact with the connection electrode 210 and the panel electrode 110, and the lower surface of the connection electrode 210 It can be accommodated in a certain number of receiving grooves 211 provided in .

Here, the conductive balls 310 located on the lower surface of the connecting electrode 210 are located in the receiving groove 211 and are moved to the outside of the connecting electrode 210 by the circumference of the receiving groove 211. This may be limited.

Accordingly, the conductive balls 310 located between each connection electrode 210 and the panel electrode 110 move while being pushed outward between the lower surface of the connection electrode 210 and the upper surface of the panel electrode 110. It may not work.

In addition, since the receiving groove 211 according to the present invention forms a concave shape along the center of the lower surface of the connecting electrode 210 at the outer circumference of the lower surface of the connecting electrode 210, the lower surface of the connecting electrode 210 The center of forms a relatively deeper valley than the outer circumference.

Accordingly, a greater number of conductive balls 310 included in the attachment layer 300 may be accommodated or gathered in the center of the receiving groove 211 of the connection electrode 210 than around the circumference thereof.

Additionally, when the panel 100 and the flexible substrate 200 are pressed and bonded to each other, it is possible to prevent the conductive balls 310 from clumping around the connection electrode 210 and the panel electrode 110. Accordingly, the panel electrode 110 and the connection electrode 210 are electrically connected through the conductive balls 310, and the outer portions of the panel electrode 110 and the connection electrode 210 may be insulated by epoxy resin.

Figure 8 is a cross-sectional view showing a first embodiment of the receiving groove according to the present invention.

Referring to Figure 8, the receiving groove 212 according to the present invention is provided on the lower surface of the connection electrode 210.

The receiving groove 212 may be composed of a straight surface 212a and a curved surface 212b.

The straight surface 212a of the receiving groove 212a may be formed as an inclined surface having a certain length along the center of the receiving groove 212 around the lower surface of the connection electrode 210.

In addition, the curved surface 212b is provided at the center of the receiving groove 212, and its circumference may be connected to the straight surface 212a of the receiving groove 212.

Accordingly, when the connection electrode 210 according to the present invention is in contact with the upper surface of the panel electrode 110, the straight surface 212a formed around the receiving groove 212 is constant on the upper surface of the panel electrode 110. support can be secured.

In addition, the curved surface 212a forming the central portion of the receiving groove 212 has an upward valley shape, so that a certain number of conductive balls 310 can be accommodated therein.

Accordingly, the conductive balls 310 accommodated inside the receiving groove 212 according to the first embodiment of the present invention are supported on the upper surface of the panel electrode 110 by the straight surface 212a, thereby forming the receiving groove. It can also be prevented from leaving outside of (212).

Figure 9 is a cross-sectional view showing a second embodiment of the receiving groove according to the present invention.

Referring to Figure 9, the receiving groove 213 according to the present invention is provided on the lower surface of the connection electrode 210.

The receiving groove 213 is made of a straight surface, but may also form a triangular cross-sectional space.

Conductive balls 310 may be accommodated inside the receiving groove 213 forming a triangular cross-sectional space.

Additionally, the shape of the receiving groove 213 is not limited to a triangular shape, and may also be rectangular or square.

Figure 10 is a cross-sectional view showing a third embodiment of the receiving groove according to the present invention.

Referring to FIG. 10, a concave receiving groove 214 may be provided on the lower surface of the connection electrode 210 according to the present invention.

A straight surface 215 may be provided between the circumference of the receiving groove 214 and the circumference of the lower surface of the connection electrode 210.

The straight surface 215 may be substantially a part of the lower surface of the connection electrode 210.

Accordingly, the circumference of the receiving groove 215 according to the present invention may be spaced apart from the circumference of the lower surface of the connection terminal 110 by a width corresponding to the length formed by the straight surface 215.

Through the above configuration, the straight surface 215 provided on the lower surface of the connection electrode 210 according to the present invention can be in close contact with the upper surface of the panel electrode 110.

Accordingly, the receiving groove 214 according to the third embodiment of the present invention can be airtight through the straight surface 215 in close contact, and the conductive ball 310 accommodated inside the receiving groove 214 is exposed to the outside. A state of safe acceptance can be achieved without deviation.

Figure 11 is a cross-sectional view showing a fourth embodiment of the receiving groove according to the present invention.

Referring to FIG. 11, a round portion 216 convex in the direction of the panel electrode is provided between the outer circumference of the receiving groove 214 according to the fourth embodiment of the present invention and the circumference of the lower surface of the connection electrode 210. It may be possible.

Here, the round portion 216 may be in close contact with the upper surface of the panel electrode 110.

The round portion 216 may form a certain degree of elasticity by being in curvature and contact with the upper surface of the panel electrode 110.

As a result, the airtightness of the receiving groove 214 according to the fourth embodiment of the present invention can be established, and the separation of the conductive ball 310 accommodated inside the receiving groove 214 can be effectively prevented.

In addition, when the panel electrode 110 and the connection electrode 210 are in contact with each other, the conductive balls 310 located outside the lower surface of the connection electrode 210 are formed into the receiving groove 214 by the round portion 216. Movement inward may be easily guided.

In addition, a round groove into which the round portion 216, which is convexly formed along the bottom, is inserted is further formed on the upper surface of the panel electrode 110 according to the present invention, so that the bonding force between them can be further secured. The round groove is made of a concave groove with a round portion 216 convexly formed along the lower side inserted therein, and can strengthen the coupling between the panel electrode 110 and the connection electrode 210.

Figure 12 is a cross-sectional view showing an example in which a coupling groove is provided in the panel electrode according to the present invention.

Referring to FIG. 12, a concave receiving groove 211 may be provided on the lower surface of the connection electrode 210 according to the present invention.

A coupling groove 111 may be provided on the upper surface of the panel electrode 110 located below the connection electrode 210.

The coupling groove 111 may have a depth set so that the lower surface of the connection electrode 210 is inserted.

The coupling groove 111 may be formed in a ‘ㄷ’ shape with its cross section open upward.

Accordingly, when the connection electrode 210 and the panel electrode 110 contact each other, a certain number of conductive balls 310 can be accommodated inside the receiving groove 211.

Additionally, the lower surface of the connection electrode 210 may be positioned to be inserted into the coupling groove 111 formed on the upper surface of the panel electrode 110.

Here, the outer circumference of the coupling groove 111 may be combined in a shape that surrounds the lower surface of the connection electrode 210.

Accordingly, the conductive balls 310 accommodated inside the receiving groove 211 do not fall out of the coupling groove 111, and the panel electrode 110 and the connecting electrode 210 maintain a physical bonding force with each other. Achieve a state of being achieved.

Additionally, the coupling groove 111 may be implemented by forming a partition wall that protrudes upward from the edge of the upper surface of the panel electrode 110 at a certain height.

Figure 13 is a cross-sectional view showing an example in which another coupling groove is provided in the panel electrode according to the present invention.

Referring to FIG. 13, the coupling groove 112 according to the present invention may be formed as a concave groove downward from the upper surface of the panel electrode 110 or toward the panel 100. Here, a plane 113 is provided between the outer circumference of the coupling groove 112 and the outer circumference of the upper surface of the panel electrode 110. The plane 113 is disposed at a higher position than the inner peripheral surface of the coupling groove 112 to prevent the conductive balls 310 accommodated inside the coupling groove 112 from leaking to the outside of the coupling groove 112. can do.

The curvature of the coupling groove 112 may be the same as the curvature of the receiving groove 211 according to the present invention.

In the present invention, there is an advantage in that the receiving space in which the conductive balls 310 are accommodated can be expanded by further forming a concave coupling groove 112 on the upper surface of the panel electrode 110.

Figure 14 is a cross-sectional view showing an example in which an insertion groove is further provided on the upper surface of the panel electrode according to the present invention.

Referring to FIG. 14, an insertion groove 114 into which the lower surface edge of the connection terminal 210 is inserted may be further provided on the upper surface of the panel electrode 110 according to the present invention.

Here, the edge of the lower surface of the connection terminal 210 is connected to the circumference of the receiving groove 211, so that it can form a cross-section that is pointed downward.

Accordingly, the lower surface edge of the connection terminal 210 may be located in the insertion groove 114.

The insertion groove 114 may have a width set along the upper surface of the panel electrode 110 so that the edge of the lower surface of the connection terminal 210 is inserted. Accordingly, the lower surface edge of the connection terminal 210 can be slidably moved in contact with the bottom surface of the insertion groove 114.

Figures 15a and 15b are cross-sectional views showing the process in which the lower surface edge of the connection terminal 210 according to the present invention is positioned in the insertion groove 114.

Referring to FIGS. 15A and 15B, a certain number of conductive balls 310 are accommodated in the receiving groove 211 according to the present invention, and in this state, the connection electrode 210 and the panel electrode 110 are in contact with each other. It can be.

In this case, the lower surface border of the connection terminal 210 is located in the insertion groove 114, and when they are gradually brought into close contact or pressed together, the lower surface border of the connection terminal 210 becomes the insertion groove 114 shown in FIG. 15A. It can be pressed and coupled while moving to the outside of the insertion groove 114 as shown in Figure 15b.

In the present invention, when the conductive ball 310 is accommodated in the receiving groove 211 of the connecting electrode 210, the circumference of the connecting electrode 210 and the edge of the lower surface of the connecting electrode 210 are inserted into the insertion groove 114. The conductive balls 310 can be safely accommodated by being moved and compressed. Additionally, coupling force between the connection electrode 210 and the panel electrode 110 can be easily achieved.

Additionally, the insertion groove 114 formed on the edge of the upper surface of the panel electrode may be formed in a shape corresponding to the shape of the edge of the lower surface of the connection electrode, so that they can be coupled to each other.

According to the above configuration and embodiments, in the present invention, as shown in FIG. 16, it is possible to prevent the conductive balls at the boundary between each connection electrode from clumping.

Therefore, in the present invention, when the panel and the flexible substrate are pressed, the conductive balls are prevented from moving out of the effective area provided between the electrode pads and clumping occurs on the outside of the electrode pads, and the resulting electrical short can be prevented.

In addition, by increasing the number of indentations in the area where the connection electrode and the panel electrode are in contact to a certain number or more, the contact area between the panel and the flexible substrate is reduced, increasing the number of electrodes, thereby improving the resolution of the display panel. A foundation can be laid.

Above, specific embodiments of the electrode connection structure for a display panel of the present invention have been described, but various implementation modifications are possible without departing from the scope of the present invention.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the claims and equivalents thereof as well as the claims described later.

That is, the above-described embodiments should be understood in all respects as illustrative and not restrictive, and the scope of the present invention is indicated by the claims to be described later rather than the detailed description, and the meaning and scope of the claims and All changes or modified forms derived from the equivalent concept should be construed as falling within the scope of the present invention.

100: panel
110: panel electrode
200: Flexible substrate
210: connection electrode
211, 212, 213, 214: Acceptance home
215: straight side
216: round part
300: Adhesion layer
310: Challenge ball

Claims (10)

A panel having a plurality of panel electrodes;
a flexible substrate disposed on the panel and having a plurality of connection electrodes disposed to face the plurality of panel electrodes; and
An adhesion layer disposed between the panel and the flexible substrate and including conductive balls,
On the lower surface of the connection electrode,
A receiving groove in which the challenge balls are accommodated is provided,
The receiving groove is composed of a straight surface and a curved surface, and the straight surface is made of an inclined surface having a certain length along the center of the receiving groove around the lower surface of the connection electrode, and the curved surface is located at the center of the receiving groove. An electrode connection structure for a display panel provided, the perimeter of which is connected to the straight surface.
According to clause 1,
The receiving groove is,
Consisting of a concave shape in the direction of the flexible substrate,
Electrode connection structure for display panel.
delete delete delete delete delete A panel having a plurality of panel electrodes;
a flexible substrate disposed on the panel and having a plurality of connection electrodes disposed to face the plurality of panel electrodes; and
An adhesion layer disposed between the panel and the flexible substrate and including conductive balls,
On the lower surface of the connection electrode,
A receiving groove in which the challenge balls are accommodated is provided,
The receiving groove is made of a straight surface and forms a triangular cross-sectional space,
Electrode connection structure for display panel.
A panel having a plurality of panel electrodes;
a flexible substrate disposed on the panel and having a plurality of connection electrodes disposed to face the plurality of panel electrodes; and
An adhesion layer disposed between the panel and the flexible substrate and including conductive balls,
A receiving groove in which the conductive balls are accommodated is provided on the lower surface of the connection electrode,
A coupling groove is provided on the panel electrode,
The coupling groove is formed as a concave groove from the upper surface of the panel electrode downward or toward the panel,
A plane is provided between the outer circumference of the coupling groove and the outer circumference of the upper surface of the panel electrode,
The plane is disposed at a higher position than the inner peripheral surface of the coupling groove,
Electrode connection structure for display panel.
A panel having a plurality of panel electrodes;
a flexible substrate disposed on the panel and having a plurality of connection electrodes disposed to face the plurality of panel electrodes; and
An adhesion layer disposed between the panel and the flexible substrate and including conductive balls,
On the lower surface of the connection electrode,
A receiving groove in which the challenge balls are accommodated is provided,
An insertion groove is provided on the upper surface of the panel electrode, which is connected to the outer circumference of the receiving groove and into which the edge of the lower surface of the connecting electrode is inserted,
The insertion groove has a width set along the upper surface of the panel electrode so that it can be slidably moved while the edge of the lower surface of the connection electrode is in contact,
Electrode connection structure for display panel.

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