KR20190062476A - Conductive film, touch panel and image display device - Google Patents

Abstract

According to one aspect of the present invention, there is provided a light-transmissive conductive film (10) comprising a light-transmitting base material (11) and a conductive part (13) provided on one side of the light- A light transmitting resin 15 and a plurality of conductive fibers 16 disposed in the light transmitting resin 15 so that the conductive portions 13 are electrically connected to the surface 13A of the conductive portions 13 And the conductive fibers 16 are distributed as a whole from the position HL of half the thickness of the conductive portion 13 in the conductive portion 13 to the side of the transparent base member 11, The conductive film 10 has a surface resistance value of 200? /? Or less and a haze value of the conductive film 10 of 5% or less.

Description

Conductive film, touch panel and image display device

[Reference of Related Application]

Japanese Patent Application No. 2016-195231 (filed on September 30, 2016), Japanese Patent Application No. 2016 (Japanese Patent Application No. 2016-195230) filed on September 30, Japanese Patent Application No. 2016-195234 filed on September 30, 2016, and Japanese Patent Application No. 2017-74413 filed on April 4, 2017 (filed on September 30, 2016) The disclosure of which is incorporated herein by reference in its entirety.

The present invention relates to a conductive film, a touch panel, and an image display device.

2. Description of the Related Art In recent years, an image display device such as a smart phone or a tablet terminal is provided with a touch panel capable of directly inputting information by touching an image display surface with a finger or the like.

The touch panel usually includes a conductive film having a conductive portion on a light-transmitting substrate. Indium tin oxide (ITO) is mainly used as the conductive material of the conductive portion in the light-transmitting conductive film. However, since ITO has no flexibility, when a flexible substrate is used as a light-transmitting substrate, cracks tend to occur in the conductive portion.

For this reason, at present, it has been studied to use metal nanowires such as silver nanowires as a conductive material constituting a conductive portion instead of ITO (see, for example, International Publication No. 2013/118643).

(1) At present, it is desired to realize a further low haze value and a low surface resistance value in a conductive film using a metal nanowire as a conductive material. Here, increasing the content of the metal nanowires in the conductive portion tends to lower the surface resistance value. Therefore, in order to realize the low surface resistance value, it is also conceivable to increase the content of the metal nanowires. However, If the content is increased, the haze value becomes larger. For this reason, a conductive film having a low haze value and a low surface resistance value has not yet been obtained.

Further, if many metal nanowires are exposed on the surface of the conductive portion, there is a fear that the metal nanowires react with sulfur, oxygen and / or halogen in the air to lower the conductivity.

(2) As described above, it is desired to realize a further low haze value and a low surface resistance value in a conductive film using a metal nanowire as a conductive material. However, when a conductive film is formed using a metal nanowire , The electric resistance value becomes different depending on the direction or place in the plane of the conductive portion. When the conductive film is used as the sensor electrode of the touch panel, restrictions on the design of the electrode pattern and the IC chip are likely to be imposed if the electric resistance value differs depending on the direction or place in the plane of the conductive part. And waste is likely to occur.

(3) As described above, it is desired to realize a further low haze value and a low surface resistance value in the conductive film using the metal nanowire as the conductive material. However, in the light-transmitting resin base material, A base layer is often provided for improving the adhesion of the coating layer, preventing clinging at the time of winding, and / or suppressing cratering of the coating liquid at the time of forming another layer.

However, when the conductive part is formed on the surface of the ground layer by using the metal nanowire-containing composition containing the metal nanowire and the dispersion medium, the degree varies depending on the kind of the dispersion medium in the dispersion or the like, The metal nanowires also enter the underlayer due to the penetration of the dispersion medium into the underlayer, and the surface resistance value may increase. In this state, when a low surface resistance value is desired, a large amount of metal nanowires are required, which may raise the haze value.

On the other hand, when a layer in which the dispersion medium does not penetrate is provided on the light-transmitting resin base material in order to suppress the entry of the metal nanowires into the base layer, a layer having a high hardness, specifically, a hard coat layer is generally formed , If the hard coat layer is formed on the light-transmitting resin base material, the flexibility is lost, so that when the conductive film is folded, cracks may be generated in the conductive film.

(4) As described above, it is desired to realize a further low haze value and a low surface resistance value in the conductive film using the metal nanowire as the conductive material. However, there is a case where flexible property at a foldable level is also required have. However, in a conductive film using metal nanowires, a hard coat layer for imparting hardness is often provided between the light-transmitting substrate and the conductive portion. Therefore, when the conductive film is folded, the conductive film (particularly, the hard coat layer) Cracks may occur, and if cracks are generated in the conductive film, the resistance value of the conductive portion may increase.

In addition, when the conductive film is used for the touch panel, wiring closely adhered to the conductive portion of the conductive film exists on the side of the bezel portion of the touch panel. This wiring is generally formed using a conductive paste (for example, silver paste). Depending on the kind of the conductive paste, the adhesion between the conductive film and the wiring made of the cured conductive paste may deteriorate. , And a conductive film exhibiting excellent adhesion regardless of the kind of conductive paste have been desired.

The present invention has been made in order to solve the above problems. (1) a conductive film capable of realizing a low haze value and a low surface resistance value and capable of suppressing a decrease in conductivity due to a reaction with a substance in an atmosphere in a conductive fiber, (2) (3) It is possible to realize a low haze value and a low surface resistance value, and also to realize a flexible property (4) a conductive film which is capable of realizing a low haze value and a low surface resistance value and which is flexible and capable of widening the choice of the conductive paste, and a touch panel and an image display device And to provide the above-mentioned objects.

According to a first aspect of the present invention, there is provided a light-transmissive conductive film comprising a light-transmitting base material and a conductive portion provided on one side of the light-transmitting base material, wherein the conductive portion is composed of a light- Wherein the conductive part is electrically conductive from the surface of the conductive part, and the conductive fiber as a whole is arranged in the conductive part from a position half of the thickness of the conductive part to the side of the light- And a surface resistance value of the conductive part is 200? /? Or less, and a haze value of the conductive film is 5% or less.

According to a second aspect of the present invention, there is provided a light-transmissive conductive film comprising a light-transmitting substrate and a conductive portion provided on one side of the light-transmitting substrate, wherein the conductive portion is composed of a light- And the electric resistance values in six directions are measured at predetermined angles every 30 degrees including the arbitrary direction with respect to an arbitrary direction in the plane of the surface of the conductive portion, The ratio of the electric resistance value in the second direction to the electric resistance value in the first direction is set to 1 when the direction in which the electric resistance value is obtained is referred to as a first direction and the direction perpendicular to the first direction is referred to as a second direction, Or more and less than 2, a surface resistance value of the conductive portion is 200? /? Or less, and a haze value of the conductive film is 5% or less.

According to a third aspect of the present invention, there is provided a light-transmissive conductive film comprising a light-transmitting resin base material and a conductive portion provided on at least one side of the light-transmissive resin base material, wherein the conductive portion is composed of a light- Wherein the conductive portion is electrically conductive from the surface of the conductive portion, the conductive portion is provided directly on at least one surface of the light-transmitting resin base, and the surface resistance value of the conductive portion is Or less, and a haze value of the conductive film is 5% or less.

According to a fourth aspect of the present invention, there is provided a light-transmissive conductive film comprising a light-transmitting resin base material and a base layer and a conductive part in this order on at least one side of the light-transmissive resin base material, wherein the conductive part is disposed in a light- Wherein the base layer is provided directly on at least one surface of the light-transmitting resin base material, the conductive portion is provided directly on the base layer, and the surface resistance value of the conductive portion is 200? /? Or less and a haze value of the conductive film is 5% or less.

In the second to fourth conductive films, it is preferable that the conductive portion does not include particles having a particle diameter exceeding the film thickness of the light-transmitting resin.

In the second to fourth conductive films, it is preferable that the conductive portion does not include particles.

In the third and fourth conductive films, the electric resistance values in six directions are measured at predetermined sizes for every 30 ° in the arbitrary direction in the surface of the conductive portion including the arbitrary direction And a direction in which the lowest electric resistance value is obtained is referred to as a first direction and a direction orthogonal to the first direction is defined as a second direction, an electric resistance in the second direction with respect to an electric resistance value in the first direction Value may be 1 or more and less than 2.

In the first, third, and fourth conductive films, the electric resistance values in six directions for every 30 占 including the arbitrary direction with respect to an arbitrary direction in the plane on the surface of the conductive portion are respectively set to predetermined And a direction in which the lowest electric resistance value is obtained is referred to as a first direction and a direction orthogonal to the first direction is referred to as a second direction, The ratio of the electric resistance value may be 2 or more.

In the first to fourth conductive films, the total light transmittance of the conductive film may be 80% or more.

In the first to fourth conductive films, the conductive fibers may be one or more kinds of fibers selected from the group consisting of conductive carbon fibers, metal fibers, and metal-coated synthetic fibers.

In the first, third and fourth conductive films, the conductive fibers may have a fiber diameter of 200 nm or less and a fiber length of 1 탆 or more.

In the fourth conductive film, the conductive fibers may have a fiber diameter of 200 nm or less and a fiber length of 10 mu m or more and less than 30 mu m.

In the second to fourth conductive films, the conductive fibers as a whole may be unevenly distributed from the position of one half of the thickness of the conductive portion in the conductive portion to the side of the light-transmitting resin base material.

According to another aspect of the present invention, there is provided a touch panel comprising the conductive film.

According to another aspect of the present invention, there is provided an image display apparatus including the touch panel.

According to another aspect of the present invention, there is provided a process for producing a conductive film, comprising the steps of: a light-transmissive substrate; and a conductive portion provided on at least one side of the light-transmissive substrate, A step of applying a conductive fiber-containing composition containing a conductive fiber and an organic dispersion medium to a surface side of the conductive fiber and drying the conductive fiber-containing composition; and disposing the conductive fiber on the one surface side; And a step of covering the substrate with a light-transmitting resin.

According to another aspect of the present invention, there is provided a process for producing the conductive film, wherein a conductive fiber-containing composition containing conductive fibers and an organic dispersion medium is directly applied to at least one surface of the light- A step of disposing the conductive fibers directly; and a step of covering the conductive fibers with a light-transmitting resin after directly arranging the conductive fibers on the one surface.

According to another aspect of the present invention, there is provided a method for producing the conductive film, comprising the steps of: forming a light-transmitting resin base material on a surface of the base layer in a laminate having a base layer directly provided on at least one side of the light- Directly applying the conductive fiber-containing composition containing the conductive fibers and the dispersion medium, and drying the conductive fiber-containing composition to directly lay the conductive fibers on the surface of the ground layer; and after directly arranging the conductive fibers on the surface of the ground layer, And the conductive fiber is covered with a light-transmitting resin.

According to the conductive film of the first aspect of the present invention, the conductive portion includes a light-transmitting resin and a plurality of conductive fibers disposed in the light-transmitting resin, wherein the conductive portion is electrically conductive from the surface of the conductive portion, And the conductive fiber has a surface resistance value of 200? / Square or less and a haze value of the conductive film of 5% or less, It is possible to realize a low haze value and a low surface resistance value and to suppress a decrease in conductivity due to a reaction with a substance in an atmosphere in the conductive fiber. According to the second aspect of the present invention, on the surface of the conductive portion, electrical resistances in six directions are measured for every 30 占 including arbitrary directions with respect to an arbitrary direction in the plane, And a ratio of an electrical resistance value in the second direction to an electrical resistance value in the first direction is set to be smaller than a ratio of an electrical resistance value in the first direction to a second direction, , And the haze value of the conductive film is 5% or less. Thus, a low haze value and a low surface resistance value can be realized, and in the conductive portion, The difference in electric resistance value depending on the in-plane direction of the conductive film can be reduced. According to the third aspect of the present invention, since the conductive portion is provided directly on at least one side of the light-transmitting resin base material, the surface resistance value of the conductive portion is 200? /? Or less and the haze value of the conductive film is 5% Value and a low surface resistance value can be realized, and a conductive film having flexibility can be provided. According to a fourth aspect of the present invention, there is provided a method for producing a conductive film, wherein the ground layer is provided directly on at least one side of the light-transmitting resin base, the conductive portion is provided directly on the ground layer, the surface resistance value of the conductive portion is 200? The haze value of the conductive paste is 5% or less. Thus, it is possible to provide a conductive film which can realize a low haze value and a low surface resistance value, has flexibility, and can broaden the selection of the conductive paste. Further, according to the touch panel and the image display apparatus of another aspect of the present invention, a touch panel and an image display apparatus provided with such a conductive film can be provided.

1 is a schematic configuration diagram of a conductive film according to the first embodiment.
2 is a partially enlarged view of the conductive film shown in Fig.
3 is a layout diagram of a sample when a sample is cut from the conductive film according to the embodiment.
Fig. 4 is a sample plan view when the electric resistance value is measured. Fig.
5 is a schematic configuration diagram of another conductive film according to the first embodiment.
6 is a schematic plan view of the conductive film shown in Fig.
7 is an enlarged view of a part of the conductive film shown in Fig.
8 is a schematic configuration diagram of another conductive film according to the first embodiment.
9 is a partially enlarged view of the conductive film shown in Fig.
10 is a diagram schematically showing a manufacturing process of the conductive film according to the first embodiment.
11 is a diagram schematically showing a manufacturing process of a conductive film according to the first embodiment.
Fig. 12 is a diagram schematically showing a manufacturing process of the conductive film according to the first embodiment.
13 is a schematic configuration diagram of an image display apparatus according to the first embodiment.
14 is a schematic plan view of the touch panel according to the first embodiment.
15 is a partially enlarged view of the conductive film on the display panel side shown in Fig.
16 is a schematic configuration diagram of a conductive film according to the second embodiment.
17 is an enlarged view of a part of the conductive film shown in Fig.
18 is a schematic configuration diagram of another conductive film according to the second embodiment.
19 is a partially enlarged view of the conductive film shown in Fig.
20 is a schematic configuration diagram of an image display apparatus according to the second embodiment.
21 is a schematic configuration diagram of a conductive film according to the third embodiment.
22 is a partially enlarged view of the conductive film shown in Fig.
23 is a diagram schematically showing a state of a folding test.
24 is a schematic configuration diagram of another conductive film according to the third embodiment.
25 is a partially enlarged view of the conductive film shown in Fig.
26 is a diagram schematically showing a manufacturing process of a conductive film according to the third embodiment.
Fig. 27 is a diagram schematically showing a manufacturing process of a conductive film according to the third embodiment.
28 is a schematic configuration diagram of an image display apparatus according to the third embodiment.
29 is a schematic configuration diagram of a conductive film according to the fourth embodiment.
30 is a partially enlarged view of the conductive film shown in Fig.
31 is a schematic configuration diagram of another conductive film according to the fourth embodiment.
32 is a partially enlarged view of the conductive film shown in Fig.
FIG. 33 is a diagram schematically showing a manufacturing process of the conductive film according to the fourth embodiment. FIG.
34 is a diagram schematically showing a manufacturing process of the conductive film according to the fourth embodiment.
35 is a schematic configuration diagram of an image display apparatus according to the fourth embodiment.

[First Embodiment]

Hereinafter, a conductive film, a touch panel, and an image display device according to a first embodiment of the present invention will be described with reference to the drawings. In the present specification, " light transmittance " means a property of transmitting light. The " light transmittance " does not necessarily mean transparency, and may be semitransparent. Fig. 1 is a schematic structural view of a conductive film according to the present embodiment, and Fig. 2 is a partially enlarged view of the conductive film shown in Fig. Fig. 3 is a sample layout diagram when a sample is cut from the conductive film according to the embodiment, and Fig. 4 is a sample plan view when measuring the electric resistance value. 5 is a schematic plan view of another conductive film according to the present embodiment, FIG. 6 is a schematic plan view of the conductive film shown in FIG. 5, and FIG. 7 is a partially enlarged view of the conductive film shown in FIG. And Fig. 9 is a partially enlarged view of the conductive film shown in Fig. Figs. 10 to 12 are diagrams schematically showing a manufacturing process of the conductive film according to the present embodiment.

<<< Conductive Film >>>

The conductive film 10 shown in Fig. 1 has a light-permeable substrate 11, a light-transparent functional layer 12 provided on at least one side of the light-transparent substrate 11, And a conductive part 13 provided on the surface of the layer 12 opposite to the surface on the light-transmissive base material 11 side and patterned. It is to be noted that the conductive film 10 may be provided with the light-transmitting base material 11 and the conductive part 13 and may not be provided with the light-transmitting functional layer 12. By not providing the light-transmitting functional layer 12, the flexibility can be improved. The light-transmitting functional layer 12 is provided between the light-transmitting substrate 11 and the conductive portion 13, but the light-transmitting functional layer is not provided between the light-transmitting substrate 11 and the conductive portion 13, Transmissive base material 11 may be provided on the surface opposite to the surface on the side of the conductive portion 13 of the light-transmissive base material 11 and between the light-transmissive base material 11 and the conductive portion 13, Or may be provided on both sides of the surface on the side opposite to the surface on the side of the substrate 13. In the conductive film 10 shown in Fig. 1, the conductive portions 13 are provided only on one side, but conductive portions may be provided on both sides of the conductive film.

The conductive portion 13 shown in Fig. 1 is a film in a non-patterned state, that is, a so-called solid film. The surface 10A of the conductive film 10 is composed of the surface 13A of the conductive portion 13.

The haze value (total haze value) of the conductive film 10 is 5% or less. If the haze value of the conductive film 10 exceeds 5%, the optical performance may be insufficient. The haze value can be measured using a haze meter (product name: &quot; HM-150 &quot;, manufactured by Murakami Shikisai Jigu Kenkyujo Co., Ltd.) in accordance with JIS K7136: 2000. The haze value is a value measured on the entire conductive film. The haze value is set to 50 mm x 100 mm, and then the conductive portion side is set to the non-light source side in the state of no curls or wrinkles and no fingerprints or dusts (This is not necessarily the case when a conductive portion is formed on both sides), and is an arithmetic mean value of values obtained by measuring three times with respect to one conductive film. In the present specification, &quot; three times of measurement &quot; means not three times of measurement at the same place but three other places of measurement. In the conductive film 10, the surface 10A seen by the eyes is flat, and the layer to be laminated such as the conductive portion 13 is also flat, and the variation of the film thickness also converges within a range of +/- 10%. Therefore, it is considered that by measuring the haze value at three different places of the cut conductive film, the average value of the haze value of the entire in-plane haze of the substantially conductive film is obtained. Further, when the conductive film can not be cut to the above-mentioned size, for example, HM-150 requires a sample having a diameter of 21 mm or more because the opening at the time of measurement is 20 mmφ. Therefore, the conductive film may be suitably cut with a size of 22 mm x 22 mm or more. When the size of the conductive film is small, the measurement point is set to three points by slightly shifting in the range where the light source spot does not deviate, or by changing the angle. The haze value of the conductive film 10 is preferably 3% or less, 2% or less, 1.5% or less, 1.2% or less, or 1.1% or less. The fluctuation of the obtained haze value is within ± 10% even if the measurement object is long by 1 m × 3000 m or about 5 inches by the size of a smartphone. If the measurement range is the above preferable range, easy. The conductive part of the conductive film 10 is not patterned but the total light transmittance is 5% or less even if the conductive film has the patterned conductive part, and 3% or less, 2% or less, 1.5% or less, 1.2% or less , And 1.1% or less (the smaller the number is, the more preferable). Further, even in the case of a multilayered structure in which a plurality of layers such as a touch panel sensor on which a conductive film is mounted, the haze value is preferably as described above.

The total light transmittance of the conductive film 10 is preferably 80% or more. If the total light transmittance of the conductive film is less than 80%, the optical performance may be insufficient. The total light transmittance can be measured by using a haze meter (product name: &quot; HM-150 &quot;, manufactured by Murakami Shikisai Jigzu Kenkyujo Co., Ltd.) in accordance with JIS K7361-1: 1997. The total light transmittance was a value measured on the entire conductive film and was cut to a size of 50 mm x 100 mm. Thereafter, the conductive part side was set to be the light source side without curls or wrinkles, (Not necessarily when the conductive parts are formed on both sides), and is an arithmetic mean value of the values obtained by measuring three times with respect to one conductive film. In the conductive film 10, the surface 10A seen by the eyes is flat, and the layer to be laminated such as the conductive portion 13 is also flat, and the variation of the film thickness also converges within a range of +/- 10%. Therefore, it is considered that by measuring the total light transmittance of the other three places of the cut conductive film, the average value of the total light transmittance of the entire in-plane of the substantially conductive film is obtained. Further, when the conductive film can not be cut to the above-mentioned size, for example, HM-150 requires a sample having a diameter of 21 mm or more because the opening at the time of measurement is 20 mmφ. Therefore, the conductive film may be suitably cut with a size of 22 mm x 22 mm or more. When the size of the conductive film is small, the measurement points are set to three points by slightly shifting or changing the angle in the range where the light source spot does not deviate. The total light transmittance of the conductive film 10 is more preferably not less than 85%, not less than 88% and not less than 89% (more preferably, the larger the numerical value is). Although the conductive part of the conductive film 10 is not patterned, the total light transmittance is preferably 80% or more, 85% or more, 88% or more, or 89% or more in order of the conductive film having the patterned conductive part Is preferable. The fluctuation of the total light transmittance obtained is within ± 10% even if the object to be measured is 1 m × 3000 m or about 5 inches of the size of a smartphone, and when it is in the above preferable range, a lower haze and a lower resistance value are obtained It is easy to get rid of. Further, it is preferable that the total light transmittance as described above is also the total light transmittance as a whole of a laminated body in which a plurality of layers such as a touch panel sensor with a conductive film are stacked.

The use of the conductive film of the present invention including the conductive film 10 and the conductive films 20, 30, 100, 110, 150, 160, 250 and 260 to be described later is not particularly limited, It may be used for various purposes. The conductive film of the present invention can be applied to various types of display devices such as an image display device (including a smart phone, a tablet terminal, a wearable terminal, a personal computer, a television, a digital signage, a public information display (PID) It may be used for electric appliances and windows used in houses and cars (including electric cars and vehicle-type construction machines, including all cars). Particularly, the conductive film of the present invention can be suitably used in a part where transparency is emphasized. In addition, the conductive film of the present invention can be suitably used not only in technical aspects such as transparency, but also in electrical products requiring designability and design. Specific examples of the use of the conductive film of the present invention include a defroster, an antenna, a solar cell, an audio system, a speaker, an electric fan, an electronic blackboard, and a carrier film for semiconductor.

The conductive film of the present invention may be cut to a desired size, but may be rolled. When the conductive film of the present invention is cut to a desired size, the size of the conductive film is not particularly limited and is appropriately determined according to the size of the display surface of the image display apparatus. Specifically, the size of the conductive film may be, for example, 5 inches or more and 500 inches or less. The term &quot; inches &quot; in the present specification means a length of a diagonal line when the conductive film is a quadrangle, a diameter when the conductive film is circular, and an average value of a sum of a short diameter and a long diameter when the conductive film is elliptical do. Here, when the conductive film is a quadrangle, the aspect ratio of the conductive film when determining the inch is not particularly limited as long as it does not cause a problem as a display screen of the image display apparatus. For example, vertical: horizontal = 1: 1, 4: 3, 16:10, 16: 9, 2: 1, and the like. However, in particular, in the case of on-vehicle use or digital signage having rich design properties, the aspect ratio is not limited to this aspect ratio. If the size of the conductive film 10 is large, it is cut at a suitable size such as A4 size (210 mm x 297 mm) or A5 size (148 mm x 210 mm) at an arbitrary position and then cut to the size of each measurement item .

<< Light-transmitting substrate >>

The light-transmitting base material (11) is not particularly limited as long as it has light transmittance. For example, the constituent material of the light-transmitting base material 11 may be a polyolefin resin, a polycarbonate resin, a polyacrylate resin, a polyester resin, an aromatic polyether ketone resin, a polyether sulfone resin, A polyimide resin, a polyamide resin, or a polyamide-imide resin. The light-transmitting base material tends to be scratched because it comes into contact with the coating device when coating the light-transmitting functional layer or the like. However, since the light-transmitting base material made of a polyester resin hardly causes scratches even when it comes into contact with the coating device, Permeable base material other than the polyester-based resin is superior to the light-transmissive base material in terms of heat resistance, barrier property and water resistance, the polyester-based resin is preferable, and among these, Among them, a polyimide-based resin and a polyamide-based resin are preferable in terms of flexibility.

Examples of the polyolefin-based resin include resins containing at least one of polyethylene, polypropylene, and cyclic polyolefin-based resins. Examples of the cyclic polyolefin-based resin include those having a norbornene skeleton.

Examples of polycarbonate resins include aromatic polycarbonate resins based on bisphenols (such as bisphenol A) and aliphatic polycarbonate resins such as diethylene glycol bisallylcarbonate.

Examples of the polyacrylate resin include poly (methyl meth) acrylate based, poly (meth) acrylate based, and (meth) acrylate methyl- (meth) acrylate butyl copolymer.

Examples of the polyester-based resin include resins containing at least one of polyethylene terephthalate (PET), polypropylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate (PEN) as constituent components.

Examples of the aromatic polyether ketone resin include polyether ether ketone (PEEK) and the like.

The polyimide resin is obtained by reacting a tetracarboxylic acid component and a diamine component. It is preferable that a polyamic acid is obtained by polymerization of a tetracarboxylic acid component and a diamine component and is imidized. The imidization may be performed by thermal imidization or by chemical imidization. It is also possible to produce by thermal imidization and chemical imidization. The polyimide-based resin may be an aliphatic polyimide-based resin, but is preferably an aromatic-based polyimide resin containing an aromatic ring. The aromatic polyimide resin contains an aromatic ring in at least one of the tetracarboxylic acid component and the diamine component. As specific examples of the tetracarboxylic acid component, tetracarboxylic acid dianhydride is suitably used, and these may be used alone or in admixture of two or more. Diamines in which some or all of the aromatic ring hydrogen atoms of the diamine are substituted with substituents selected from a fluoro group, a methyl group, a methoxy group, a trifluoromethyl group or a trifluoromethoxy group can also be used. These may be used alone or in combination of two or more.

(I) fluorine atoms, (ii) aliphatic rings and (iii) aromatic rings, among the aromatic conjugated dienes, in order to improve the light transmittance and improve the rigidity of the polyimide resin. And a linking group which is bonded to the polyimide-based resin, and more preferably a polyimide-based resin containing at least one of (i) and (iii). When an aromatic ring is contained in the polyimide resin, the orientation property is enhanced and the rigidity is improved. However, the transmittance tends to decrease due to the absorption wavelength of the aromatic ring. When the polyimide-based resin contains (i) a fluorine atom, the light transmittance is improved in that the electron state in the polyimide skeleton can be made difficult to transfer. When the polyimide-based resin (ii) contains an aliphatic ring, the light transmittance is improved in that the transfer of charges in the skeleton can be inhibited by breaking the conjugate of? Electrons in the polyimide skeleton. In the case where the polyimide-based resin includes (iii) a linking group which cleaves an electron conjugate between aromatic rings, it is possible to inhibit the movement of charges in the framework by interrupting conjugation of? Electrons in the polyimide skeleton The light transmittance is improved from the point. Examples of the linking group for cleaving the electron conjugate between these aromatic rings include an ether bond, a thioether bond, a carbonyl bond, a thiocarbonyl bond, an amide bond, a sulfonyl bond and a sulfinyl bond, And a divalent linking group such as an alkylene group.

Among them, a polyimide-based resin containing an aromatic ring and containing a fluorine atom is preferably used because it improves light transmittance and improves rigidity. The content of fluorine atoms in the polyimide resin containing fluorine atoms is preferably such that the ratio of the number of fluorine atoms (F) to the number of carbon atoms (C) measured by X-ray photoelectron spectroscopy on the surface of the polyimide resin F / C) is preferably 0.01 or more, more preferably 0.05 or more. On the other hand, if the content of fluorine atoms is too high, the inherent heat resistance of the polyimide resin may deteriorate, and the ratio (F / C) of the number of fluorine atoms (F) to the number of carbon atoms 1 or less, and more preferably 0.8 or less. Here, the above ratio by measurement of X-ray photoelectron spectroscopy (XPS) can be obtained from the value of atomic% of each atom measured by using an X-ray photoelectron spectrometer (for example, Thermo Scientific Co., Ltd. Theta Probe).

Further, it is preferable that a polyimide resin in which at least 70% of the hydrogen atoms bonded to the carbon atoms contained in the polyimide resin is a hydrogen atom directly bonding to the aromatic ring is preferable because it improves the light transmittance, Is preferably used. The ratio of the number of hydrogen atoms (number) directly bonded to the aromatic ring in the total number of hydrogen atoms bonded to carbon atoms contained in the polyimide resin is preferably 80% or more, more preferably 85% or more desirable. In the case where at least 70% of the hydrogen atoms bonded to the carbon atoms contained in the polyimide are polyimide which is a hydrogen atom directly bonded to the aromatic ring, even if the polyimide is subjected to a heating step in the air, Even if stretching is carried out, it is preferable that the optical properties, particularly the total light transmittance and the yellow index (YI), are small. When at least 70% of the hydrogen atoms bonded to the carbon atoms contained in the polyimide resin are polyimides which are hydrogen atoms directly bonded to aromatic rings, the reactivity with oxygen is low, so that the chemical structure of the polyimide resin Will be difficult to change. A base made of a polyimide-based resin is often used for a device requiring a processing step accompanied by heating by taking advantage of its high heat resistance, but it is preferable that 70% or more of hydrogen atoms bonding to carbon atoms contained in the polyimide- And a hydrogen atom directly bonded to the aromatic ring, there is no need to carry out these subsequent steps in an inert atmosphere in order to maintain transparency, so that it is possible to suppress the facility cost and the cost for controlling the atmosphere There are advantages. Here, the ratio of the number of hydrogen atoms (number) directly bonded to the aromatic ring in the total number of hydrogen atoms (number of atoms) bonded to the carbon atoms contained in the polyimide resin is determined by high-performance liquid chromatography, gas chromatograph Mass spectrometry and NMR. For example, the sample is decomposed with an alkali aqueous solution or supercritical methanol, and the obtained degradation product is separated by high performance liquid chromatography. The qualitative analysis of each of the separated peaks is carried out using a gas chromatograph mass spectrometer and NMR , And the ratio of the number of hydrogen atoms (number) directly bonded to the aromatic ring in the total number of hydrogen atoms (number) contained in the polyimide can be determined by quantitative determination using high performance liquid chromatography.

The polyimide resin is preferably at least one selected from the group consisting of a structure represented by the following general formula (1) and a general formula (3) shown below from the viewpoint of improving the light transmittance and further improving the rigidity It is preferable to have one kind of structure.

In the above general formula (1), R ¹ is a tetravalent group which is a tetracarboxylic acid residue, R ² is a trans-cyclohexanediamine residue, trans-1,4-bismethylenecyclohexanediamine residue, A diaminodiphenylsulfone residue, a 3,4'-diaminodiphenylsulfone residue, and a divalent group represented by the following general formula (2). n represents the number of repeating units, and is 1 or more. In the present specification, the term "tetracarboxylic acid residue" refers to a residue derived from a tetracarboxylic acid excluding four carboxyl groups, and exhibits the same structure as the residue except for the acid dianhydride structure from the tetracarboxylic dianhydride. The term &quot; diamine residue &quot; refers to a residue obtained by removing two amino groups from a diamine.

In the general formula (2), R ³ and R ⁴ each independently represent a hydrogen atom, an alkyl group or a perfluoroalkyl group.

In the above general formula (3), R ⁵ represents a cyclohexanetetracarboxylic acid residue, a cyclopentanetetracarboxylic acid residue, a dicyclohexane-3,4,3 ', 4'-tetracarboxylic acid residue, 4 '- (hexafluoroisopropylidene) diphthalic acid residue, and R ⁶ represents a divalent group which is a diamine residue. n 'represents the number of repeating units, and is 1 or more.

In the general formula (1), R ¹ is a tetracarboxylic acid residue and may be a residue other than an acid dianhydride structure from a tetracarboxylic acid dianhydride such as those exemplified above. Among them, R ¹ in the general formula (1) is preferably 4,4 '- (hexafluoroisopropylidene) diphthalic acid residue, 3,3 ', 4,4'-biphenyltetracarboxylic acid residue, pyromellitic acid residue, 2,3', 3,4'-biphenyltetracarboxylic acid residue, 3,3 ', 4,4'-benzophenone A tetracarboxylic acid residue, a 3,3 ', 4,4'-diphenylsulfone tetracarboxylic acid residue, a 4,4'-oxydiphthalic acid residue, a cyclohexanetetracarboxylic acid residue and a cyclopentanetetracarboxylic acid residue And at least one member selected from the group consisting of 4,4'- (hexafluoroisopropylidene) diphthalic acid residue, 4,4'-oxydiphthalic acid residue, and 3,3 '4,4'-diphenylsulfone tetracarboxylic acid residue, and 4,4'-diphenylsulfone tetracarboxylic acid residue.

In the case of R ¹ , it is preferable that the above-mentioned suitable residues are contained in a total amount of 50 mol% or more, more preferably 70 mol% or more, further preferably 90 mol% or more.

Also, it is preferable that, as R ¹ , a group selected from the group consisting of 3,3 ', 4,4'-biphenyltetracarboxylic acid residue, 3,3', 4,4'-benzophenonetetracarboxylic acid residue and pyromellitic acid residue A tetracarboxylic acid residue group (group A) suitable for improving rigidity such as at least one kind selected from the group consisting of 4,4 '- (hexafluoroisopropylidene) diphthalic acid residue, 2,3', 3,4 '-Biphenyltetracarboxylic acid residue, 3,3', 4,4'-diphenylsulfonetetracarboxylic acid residue, 4,4'-oxydiphthalic acid residue, cyclohexanetetracarboxylic acid residue, and cyclopentanetetra (Group B) suitable for improving transparency such as at least one kind selected from the group consisting of carboxylic acid residues and the like.

In this case, the content ratio of the tetracarboxylic acid residue group (group A) suitable for improving the rigidity and the tetracarboxylic acid residue group (group B) suitable for improving transparency is preferably in the range The amount of the tetracarboxylic acid residue group (group A) suitable for improving the rigidity is preferably 0.05 mol or more and 9 mol or less, more preferably 0.1 mol or more and 5 mol or less, per mol of the carboxylic acid residue group (Group B) More preferably 0.3 mol or more and 4 mol or less.

As R ² in the above general formula (1), among them, 4,4'-diaminodiphenylsulfone residue, 3,4'-diaminodiphenylsulfone residue, 4,4'-diaminodiphenylsulfone residue and the like are preferable from the viewpoints of improving light transmittance and improving rigidity. Phenylsulfone residue, and a divalent group represented by the above-mentioned general formula (2), and further, a 4,4'-diaminodiphenylsulfone residue, a 3,4,4-diaminodiphenylsulfone residue, -Diaminodiphenylsulfone residue and at least one divalent group selected from the group consisting of divalent groups represented by the above general formula (2) in which R 3 and R 4 are perfluoroalkyl groups.

The R ⁵ in the general formula (3) is preferably 4,4 '- (hexafluoroisopropylidene) diphthalic acid residue, 3,3' (hexafluoroisopropylidene) diphthalic acid residue in view of improving light transmittance and improving rigidity ', A 4,4'-diphenylsulfone tetracarboxylic acid residue and an oxydiphthalic acid residue.

In R ⁵ , it is preferable that these suitable residues are contained in an amount of 50 mol% or more, more preferably 70 mol% or more, further preferably 90 mol% or more.

R ⁶ in the general formula (3) is a diamine residue and may be a residue other than two amino groups from the diamine as illustrated above. As the R 6 in the general formula (3), among them, 2,2'-bis (trifluoromethyl) benzidine residue, bis [4- (4 (4-aminophenoxy) phenyl] hexafluoropropane residue, bis [4- (4-aminophenoxy) (Trifluoromethyl) diphenyl ether residue, 1,4-bis [4-amino-2- (tri (aminophenoxy) phenyl] sulfone residue, 4,4'- (Trifluoromethyl) phenoxy] benzene residue, 2,2-bis [4- (4-amino-2-trifluoromethylphenoxy) phenyl] hexafluoropropane residue, 4,4'- (Trifluoromethyl) diphenyl ether residue, a 4,4'-diaminobenzanilide residue, an N, N'-bis (4-aminophenyl) terephthalamide residue and a 9,9- And at least one divalent group selected from the group consisting of (Trifluoromethyl) benzidine residue, bis [4- (4-aminophenoxy) phenyl] sulfone residue and 4,4'-diaminodiphenyl sulfone residue And at least one kind of divalent group selected from the group consisting of

In R ⁶ , the total number of such suitable residues is preferably at least 50 mol%, more preferably at least 70 mol%, even more preferably at least 90 mol%.

Examples of R ⁶ include a bis [4- (4-aminophenoxy) phenyl] sulfone residue, a 4,4'-diaminobenzanilide residue, an N, N'- A diamine residue group (group C) suitable for improving rigidity such as at least one member selected from the group consisting of phenylenediamine residue, metaphenylenediamine residue and 4,4'-diaminodiphenylmethane residue, Bis [4- (4-aminophenoxy) phenyl] hexafluoropropane residue, bis [trifluoromethyl] benzylidene group, 4,4'-diaminodiphenylsulfone residue, 2,2- (4-aminophenoxy) phenyl] sulfone residue, 4,4'-diamino-2,2'-bis (trifluoromethyl) diphenyl ether residue, 1,4- (Trifluoromethyl) phenoxy] benzene residue, 2,2-bis [4- (4-amino-2-trifluoromethylphenoxy) phenyl] hexafluoropropane residue, 4,4'-diamino -2- (trifluoromethyl) diphenyl ether residue and (Group D) suitable for improving the transparency such as at least one kind selected from the group consisting of 9,9-bis (4-aminophenyl) fluorene residues.

In this case, the content ratio of the diamine residue group (group C) suitable for improving the rigidity and the diamine residue group (group D) suitable for improving transparency can be selected from a diamine residue group (group D) suitable for improving transparency, (Group C) suitable for improving the rigidity is preferably 0.05 mol or more and 9 mol or less, more preferably 0.1 mol or more and 5 mol or less, and more preferably 0.3 mol or more and 4 mol or less desirable.

In the structures represented by the general formula (1) and the general formula (3), n and n 'each independently represent the number of repeating units, and are at least 1. The number n of the repeating units in the polyimide may be appropriately selected according to the structure and is not particularly limited, as it indicates a preferable glass transition temperature described later. The average number of repeating units is usually from 10 to 2000, preferably from 15 to 1000.

The polyimide resin may also include a polyamide structure in a part thereof. Examples of the polyamide structure which may be contained include a polyamideimide structure containing a tricarboxylic acid residue such as trimellitic anhydride and a polyamide structure containing a dicarboxylic acid residue such as terephthalic acid .

From the viewpoint of heat resistance, the polyimide-based resin preferably has a glass transition temperature of 250 DEG C or higher, more preferably 270 DEG C or higher. On the other hand, from the viewpoints of ease of stretching and reduction in bake temperature, the glass transition temperature is preferably 400 캜 or lower, and more preferably 380 캜 or lower.

Specifically, examples of the polyimide-based resin include compounds having a structure represented by the following formula. In the formula, n is a repeating unit and represents an integer of 2 or more.

The weight average molecular weight of the polyimide resin is preferably in the range of 3000 to 500,000, more preferably in the range of 5,000 to 300,000, and still more preferably in the range of 10,000 to 200,000. When the weight average molecular weight is 3,000 or more, sufficient strength can be obtained. When the weight average molecular weight is 500,000 or less, increase in viscosity can be suppressed and deterioration of solubility can be suppressed. Therefore, Can be obtained. In the present specification, the "weight average molecular weight" is a polystyrene reduced value measured by gel permeation chromatography (GPC).

Of the above polyimide-based resins, polyimide-based resins or polyamide-based resins having a structure in which charge transfer is difficult to occur in molecules or between molecules in view of excellent transparency are preferable, (11), polyimide resins having an alicyclic structure such as the formulas (13) to (16).

In the fluorinated polyimide resins represented by the above formulas (4) to (11), since they have a fluorinated structure, they have a high heat resistance and are colored by heat at the time of production of a polyimide film made of a polyimide resin And therefore, it has excellent transparency.

The polyamide-based resin is a concept including not only an aliphatic polyamide but also an aromatic polyamide (aramid). The polyamide-based resin generally has a skeleton represented by the following formulas (21) and (22), and examples of the polyamide-based resin include a compound represented by the following formula (23). In the formula, n is a repeating unit and represents an integer of 2 or more.

A commercially available substrate of a polyimide resin or a polyamide resin represented by the above formulas (4) to (20) and (23) may be used. Examples of commercial products of the above-mentioned polyimide-based resin include neopollum of Mitsubishi Gas Chemical Co., Ltd., and commercially available products of the above-mentioned polyamide-based resin include, for example, .

The substrate made of the polyimide resin or the polyamide resin represented by the above-mentioned formulas (4) to (20) and (23) may be synthesized by a known method. For example, a method for synthesizing a polyimide resin represented by the above formula (4) is described in Japanese Patent Laid-Open No. 2009-132091. Specifically, a method for producing a polyimide resin represented by the formula (24) Can be obtained by reacting hexafluoropropylidene bisphthalic acid dianhydride (FPA) with 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl (TFDB).

The weight average molecular weight of the polyimide resin or polyamide resin is preferably in the range of 3000 to 500,000, more preferably in the range of 5,000 to 300,000, and more preferably in the range of 10,000 to 200,000 desirable. When the weight average molecular weight is less than 3,000, sufficient strength may not be obtained. When the number average molecular weight is more than 5,000, the viscosity increases and the solubility decreases. Thus, a substrate having a smooth surface and uniform thickness may not be obtained . In the present specification, the "weight average molecular weight" is a polystyrene reduced value measured by gel permeation chromatography (GPC).

Of the polyimide-based resin and polyamide-based resin, a polyimide-based resin or a polyamide-based resin having a structure in which charge transfer is not easily caused in the molecule or between molecules in view of excellent transparency is preferable. Specifically, A fluorinated polyimide resin such as the above formulas (4) to (11), a polyimide resin having an alicyclic structure such as the above formulas (13) to (16), a polyamide resin having a halogen group such as the formula (23) Resin.

Further, fluorinated polyimide-based resins such as the above-mentioned formulas (4) to (11) have high heat resistance because they have a fluorinated structure, and even when they are colored by heat at the time of production of a substrate made of a polyimide- It has excellent transparency.

The light-transmitting substrate 11 is preferably made of a fluorinated polyimide resin represented by the above formulas (4) to (11) or a polyamide resin having a halogen group such as the formula (23) It is preferable to use a substrate. Among them, it is more preferable to use a substrate made of a polyimide resin represented by the above formula (4) in view of being able to impart a very good hardness.

The thickness of the light-permeable substrate 11 is not particularly limited, but may be in the range of 3 탆 to 500 탆, and the lower limit of the thickness of the light-transmitting substrate 11 is preferably 10 탆 or more, (The larger the number is, the more preferable). The upper limit of the thickness of the light-transmitting base material 11 is preferably 250 탆 or less, 100 탆 or less, 80 탆 or less, 60 탆 or less, and 40 탆 or less in this order. The thickness of the light-transmitting base material can be measured by the same method as that for measuring the film thickness of the conductive portion described later.

In order to improve the adhesiveness, the surface of the light-transmitting substrate 11 may be subjected to physical treatment such as corona discharge treatment and oxidation treatment. The light-transmitting base material 11 may be provided on at least one side thereof with a crater ring of a coating liquid for preventing sticking at the time of winding and / or forming another layer so as to improve adhesion with other layers It may be a layer having a foundation layer for suppressing it. In this specification, however, the base layer present on at least one side of the light-transmitting base material and in contact with the light-transmitting base material constitutes a part of the light-transmitting base material and is not included in the light-transmitting functional layer.

The underlayer includes, for example, an anchor or a primer agent. Examples of the anchor and the primer include polyurethane resins, polyester resins, polyvinyl chloride resins, polyvinyl acetate resins, vinyl chloride-vinyl acetate copolymers, acrylic resins, polyvinyl alcohol resins, polyvinyl acetal resins , Copolymers of ethylene and vinyl acetate or acrylic acid, copolymers of ethylene and styrene and / or butadiene, thermoplastic resins such as olefin resins and / or modified resins thereof, polymers of ionizing radiation polymerizable compounds and polymers of thermosetting compounds Or the like can be used.

As described above, the base layer may contain particles such as lubricant for preventing sticking at the time of winding. The particles include silica particles and the like.

<< Light-transmitting functional layer >>

The light-transmitting functional layer 12 is disposed between the light-transmitting base material 11 and the conductive portion 13. The &quot; light-transmitting functional layer &quot; in this specification is intended to exhibit a certain function in a light-transmissive conductive film. Specifically, examples of the light-transmitting functional layer include layers for exhibiting a hard coating function, a refractive index adjusting function, and / or a color tone adjusting function. The light-transmitting functional layer may be not only a single layer but also a laminate of two or more layers. In the case where two or more light-transmitting functional layers are stacked, the functions of the respective layers may be the same, but they may be different. In the present embodiment, the case where the light-transmitting functional layer 12 is a layer exhibiting a hard coating function, that is, a hard coating layer will be described.

Since the light-transmitting functional layer 12 functions as a hard coating layer as described above, the light-transmitting functional layer 12 is formed to have a "H" value in a pencil hardness test (4.9 N load) prescribed in JIS K5600-5-4: &Quot; or more. When the pencil hardness is set to &quot; H &quot; or higher, the conductive film 10 becomes rigid and durability can be improved. The upper limit of the pencil hardness of the surface 13A of the conductive portion 13 is preferably about 4H from the viewpoint of preventing toughness and curling of the light-transmitting functional layer.

The film thickness of the light-transmitting functional layer 12 is preferably 0.5 탆 or more and 15 탆 or less. If the film thickness of the light-transmitting functional layer 12 is within this range, desired hardness can be obtained. The film thickness of the light-transmitting functional layer can be measured by the same method as the measuring method of the film thickness of the conductive portion described later. The lower limit of the film thickness of the light-transmitting functional layer 12 is more preferably in the order of 1 占 퐉 or more, 1.5 占 퐉 or more and 2 占 퐉 or more from the viewpoint of suppressing the generation of curls. The upper limit of the film thickness of the light-transmitting functional layer 12 is more preferably in the order of 12 탆 or less, 10 탆 or less, 7 탆 or less and 5 탆 or less in order to suppress breakage of the light-transmitting functional layer ( The smaller the number, the better.

The light-transmitting functional layer 12 can be composed of at least a light-transmitting resin. Further, the light-transmitting functional layer 12 may contain inorganic particles, organic particles and a leveling agent in addition to the light-transmitting resin.

&Lt; Transparent resin >

The light-transmitting resin in the light-transmitting functional layer 12 includes a polymer (cured product, crosslinked product) of a polymerizable compound. The light-transmitting resin may contain, in addition to the polymer of the polymerizable compound, a solvent-drying resin. Examples of the polymerizable compound include an ionizing radiation polymerizable compound and / or a heat-polymerizable compound.

The ionizing radiation-polymerizing compound has at least one ionizing radiation-polymerizable functional group in one molecule. The "ionizing radiation-polymerizable functional group" in the present specification is a functional group capable of undergoing polymerization reaction by irradiation with ionizing radiation. Examples of the ionizing radiation polymerizable functional group include ethylenic unsaturated groups such as (meth) acryloyl group, vinyl group and allyl group. The term "(meth) acryloyl group" is meant to include both of "acryloyl group" and "methacryloyl group". Examples of the ionizing radiation to be irradiated when the ionizing radiation polymerizable compound is polymerized include visible light, ultraviolet light, X-ray, electron beam,? -Ray,? -Ray and? -Ray.

Examples of the ionizing radiation polymerizable compound include an ionizing radiation polymerizable monomer, an ionizing radiation polymerizing oligomer, or an ionizing radiation polymerizing prepolymer, and they can be suitably adjusted and used. As the ionizing radiation-polymerizing compound, a combination of an ionizing radiation-polymerizable monomer and an ionizing radiation-polymerizing oligomer or an ionizing radiation-polymerizing prepolymer is preferable.

Examples of ionizing radiation polymerizable monomers include monomers containing a hydroxyl group such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and 2-ethylhexyl (meth) Acrylates such as ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, tetramethylene glycol di (Meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tri (meth) acrylate, (Meth) acrylate esters such as pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate and glycerol (meth) The can.

As the ionizing radiation polymerizable oligomer, a polyfunctional oligomer having a bifunctionality or more is preferable, and a polyfunctional oligomer having an ionizing radiation polymerizable functional group having three (trifunctional) or more is preferable. Examples of the polyfunctional oligomer include polyester (meth) acrylate, urethane (meth) acrylate, polyester-urethane (meth) acrylate, polyether (Meth) acrylate, isocyanurate (meth) acrylate, and epoxy (meth) acrylate.

The ionizing radiation polymerizable prepolymer has a weight average molecular weight of more than 10,000 and preferably has a weight average molecular weight of 10,000 or more and 80,000 or less and more preferably 10,000 or more and 40,000 or less. When the weight-average molecular weight exceeds 80,000, the viscosity of the composition is too high, which results in deterioration of the application efficiency of the coating, and the appearance of the resultant light-transmitting resin may be deteriorated. Examples of the polyfunctional prepolymer include urethane (meth) acrylate, isocyanurate (meth) acrylate, polyester-urethane (meth) acrylate and epoxy (meth) acrylate.

The thermosetting compound has at least one thermosetting functional group in one molecule. The "thermosetting functional group" in the present specification is a functional group capable of undergoing polymerization reaction with the same functional group or with another functional group by heating. Examples of the thermosetting functional group include a hydroxyl group, a carboxyl group, an isocyanate group, an amino group, a cyclic ether group and a mercapto group.

The heat-polymerizable compound is not particularly limited, and examples thereof include an epoxy compound, a polyol compound, an isocyanate compound, a melamine compound, a urea compound, and a phenol compound.

The solvent-drying resin is a film-like resin such as a thermoplastic resin, which is formed by simply drying a solvent added to adjust the solid content at the time of coating. When a solvent drying type resin is added, coating defects on the coating surface of the coating liquid can be effectively prevented when the light-transmitting functional layer 12 is formed. The solvent-drying resin is not particularly limited, and a thermoplastic resin can be generally used.

Examples of the thermoplastic resin include a styrene resin, a (meth) acrylic resin, a vinyl acetate resin, a vinyl ether resin, a halogen-containing resin, an alicyclic olefin resin, a polycarbonate resin, Amide-based resins, cellulose derivatives, silicone-based resins, and rubber or elastomer.

The thermoplastic resin is preferably amorphous and soluble in an organic solvent (in particular, a common solvent capable of dissolving a plurality of polymers or curable compounds). Particularly, styrene resins, (meth) acrylic resins, alicyclic olefin resins, polyester resins, cellulose derivatives (such as cellulose esters) and the like are preferable from the viewpoint of transparency and weather resistance.

<Inorganic Particles>

Inorganic particles, a component for improving the mechanical strength and the pencil strength of the light-transmissive functional layer 12, inorganic particles such as silica (SiO ₂₎ particles, alumina particles, titania particles, tin oxide particles, antimony-doped Tin oxide (abbreviated as ATO) particles, zinc oxide particles, and the like. Of these, silica particles are preferable from the viewpoint of higher hardness. Examples of the silica particles include spherical silica particles and modified silica particles, and among these, a modified silica particle is preferable. "Spherical particle" in the present specification means, for example, a particle of a sphericity type, an elliptic spherical shape, etc., and the term "differentiated particle" means a particle having a shape having random irregularities of potato shape on its surface. Since the surface area of the above-mentioned releasing particles is larger than that of the spherical particles, the contact area with the above-mentioned polymerizable compound or the like is increased by containing such a releasing particle, and the pencil hardness of the light- have. Whether or not the silica particles contained in the light-transmitting functional layer 12 is a modified silica particle can be confirmed by observing the cross section of the light-transmitting functional layer 12 with a transmission electron microscope (TEM) or a scanning transmission electron microscope (STEM) have. In the case of using the spherical silica particles, the smaller the particle diameter of the spherical silica particles, the higher the hardness of the light-transmitting functional layer. On the other hand, the modified silica particles can achieve hardness equivalent to that of the spherical silica, even if they are not as small as spherical silica particles having the smallest particle diameters available on the market.

The average primary particle diameter of the modified silica particles is preferably 1 nm or more and 100 nm or less. Even when the average primary particle diameter of the modified silica particles is in this range, it is possible to achieve hardness equivalent to that of spherical silica having an average primary particle diameter of 1 nm or more and 45 nm or less. The average primary particle diameter of the releasable silica particles can be measured by measuring the maximum value (long diameter) of the distance between two points on the outer circumference of the particle from the image of the cross section of the light-transmitting functional layer photographed using a transmission electron microscope (TEM) or a scanning transmission electron microscope (STEM) And a minimum value (short diameter) are measured, and the particle diameter is averaged to obtain an arithmetic average value of the particle diameters of 20 particles. The average particle diameter of the spherical silica particles was measured using a transmission electron microscope (TEM) or a scanning transmission electron microscope (STEM) to measure the particle diameters of 20 particles from the cross-sectional images taken at a magnification of 10000 to 1000000 And an arithmetic average value of the particle diameters of 20 particles is used. When photographing a sectional photograph using a scanning transmission electron microscope (STEM) (product name: S-4800 (TYPE2), Hitachi High Technologies), the detector (selection signal) is set to "TE" 30 kV &quot;, and emission is &quot; 10 mu A &quot;. As to the photographing conditions of the cross-sectional photograph by other STEM, the following conditions can be referred to. The average primary particle diameter can also be calculated by binarizing the image data described later.

The content of the inorganic particles in the light-transmitting functional layer 12 is preferably 20 mass% or more and 70 mass% or less. When the content of the inorganic particles is less than 20 mass%, it becomes difficult to ensure sufficient hardness. When the content of the inorganic particles exceeds 70 mass%, the filling rate becomes too high and the adhesion between the inorganic particles and the resin component deteriorates, But rather lowers the hardness of the light-transmitting functional layer.

As the inorganic particles, it is preferable to use inorganic particles (reactive inorganic particles) having a photopolymerizable functional group on the surface. The inorganic particles having a photopolymerizable functional group on the surface thereof can be produced by surface-treating inorganic particles with a silane coupling agent or the like. Examples of the method of treating the surface of the inorganic particles with the silane coupling agent include a dry method of spraying a silane coupling agent on the inorganic particles and a wet method of dispersing the inorganic particles in a solvent and then adding a silane coupling agent to react them.

<Organic Particles>

The organic particles are also components for improving the mechanical strength and the pencil hardness of the light-transmitting functional layer 12, and examples of the organic particles include plastic beads. Specific examples of the plastic beads include polystyrene beads, melamine resin beads, acrylic beads, acryl-styrene beads, silicone beads, benzoguanamine beads, benzoguanamine-formaldehyde condensed beads, polycarbonate beads, have.

<< Conductive parts >>

The conductive portion 13 includes a light-transmitting resin 15 and a plurality of conductive fibers 16 disposed in the light-transmitting resin 15, as shown in Fig. "Conductive part" in the present specification means a layer containing conductive fibers when a cross section is observed using a scanning transmission electron microscope (STEM) or a transmission electron microscope (TEM). If it is difficult to confirm the interface of the conductive portion, a pre-treatment generally used in electron microscopic observation such as formation of a metal layer of Pt-Pd or Au on the surface of the conductive portion by the sputtering method may be performed. Further, when the dyeing treatment such as osmium tetroxide, ruthenium tetroxide or tungstophthalic acid is performed, the interface between the organic layers becomes easy to see. Therefore, after the entire conductive film is embedded in the resin, the dyeing treatment may be performed. The term &quot; conductive fiber &quot; in the present specification means a conductive fiber having a shape sufficiently long in comparison with a thickness (for example, diameter) of a length. For example, . The term &quot; conductive part &quot; means a part including a light-transmitting resin and a plurality of conductive fibers disposed in the light-transmitting resin and capable of conducting from the surface, and includes a concept including both of a layered structure and a layered structure to be. 3, the light-transmissive resin 15 of the conductive portion 13 may be connected to the light-transmissive resin 15 of the non-conductive portion 15. As shown in Fig. The conductive portion 13 preferably further includes a reaction inhibitor present in the light-transmitting resin 15.

The conductive portion 13 is electrically conductible from the surface 13A of the conductive portion 13. Whether or not the conductive portion is electrically conductive from the surface of the conductive portion can be determined by measuring the surface resistance value of the conductive portion. The method of measuring the surface resistance value of the conductive portion will be described later, and thus the description thereof will be omitted. If the arithmetic average value of the surface resistance values of the conductive portions is less than 1 x 10 ⁶ ? / Square, it can be judged that electrical conduction is obtained from the surface of the conductive portion. As described later, most of the conductive fibers 16 exist on the side of the light-transmitting base material 11 at half the position HL of the film thickness of the conductive parts 13, while the other conductive fibers 16 are light- Is present on the side of the surface 13A from the position HL which is half the film thickness of the conductive portion 13 by being superimposed on the conductive fiber 16 existing on the side of the base material 11, The conductive portion 13 is electrically conductible from the surface 13A because the conductive portion 13 is also present in the conductive portion 13A.

2, the conductive fibers 16 are arranged on the side of the light-transmitting base material 11 at a position HL which is half the film thickness of the conductive portions 13 (the light-transmitting resin 15) It is ubiquitous. Whether or not the conductive fiber 16 is unevenly distributed toward the light transmitting base 11 side than the position HL of the half of the film thickness of the conductive portion 13 can be judged as follows. First, a sample for cross section observation is prepared from a conductive film. Specifically, a conductive film cut into 2 mm x 5 mm is placed in a silicone-based foaming board, an epoxy resin is introduced, and the entire conductive film is embedded in the resin. Thereafter, the formed resin is allowed to stand at 65 占 폚 for 12 hours or longer to be cured. Thereafter, using an ultra-microtome (product name: Ultra Microtom EM UC7, manufactured by Leica Microsystems), the delivery thickness is set to 100 nm, and an ultra slim piece is produced. The prepared thin section is sampled with a mesh 150 having a colloid membrane to prepare a STEM sample. If conduction can not be obtained in this sample, it may be difficult to observe an observation image by STEM. Therefore, it is preferable to sputter Pt-Pd for about 20 seconds. The sputtering time can be appropriately adjusted, but it is necessary to be careful because the sputtered metal is small in 10 seconds and too much in 100 seconds, so that the sputtered metal becomes a particle-like foreign substance. Thereafter, a cross-sectional picture of the conductive part of the STEM sample is photographed using a scanning transmission electron microscope (STEM) (product name: S-4800 (TYPE2), manufactured by Hitachi High-Technologies Corporation). At the time of photographing of this cross-sectional photograph, the focus was adjusted to 5,000 to 200,000 times with respect to the magnification at which the detector (selection signal) was set to "TE", the acceleration voltage was set at 30 kV and the emission was set at 10 μA, And brightness are appropriately adjusted so that each layer can be discriminated. The preferable magnification is 10,000 to 100,000 times, more preferably 10,000 to 50,000 times, most preferably 2.5 to 50,000 times. Further, at the time of photographing the cross-sectional photograph, the aperture may be set to 3, the objective lens iris may be set to 3, and the W. D. may be set to 8 mm. Then, the above-mentioned cross-sectional photographs taken at 10 places are prepared. After photographing a cross section of the conductive section, the position of half of the film thickness of the conductive section in each cross section photograph is obtained. Then, it is judged whether or not the conductive fibers shown in the cross-sectional photograph are present on the side of the light-transmitting substrate from this half position. Specifically, first, in the cross-sectional photograph of the conductive portion in the electron microscope, the conductive fibers are printed in a darker color (for example, black) than the light-transmissive resin, Can be confirmed. On the other hand, when this cross-sectional photograph is enlarged, a pixel appears. The number of pixels in which the conductive fibers positioned on the light-transmitting base material side are displayed from the half position, and the number of pixels in which the conductive fibers located on the light- The number of pixels in which the conductive fibers positioned on the surface side of the conductive portion are displayed is counted so that the conductive fibers located on the side of the light transmitting substrate are displayed from the half position relative to the total number of pixels in which the conductive fibers are displayed The ratio of the number of pixels is obtained. Here, in the case where the pixel on which the conductive fiber is displayed extends over the half position, in each pixel, a portion existing on the side of the light-transmitting base material from the half position and a portion existing on the surface side of the conductive portion from this portion , And divides one pixel based on the area ratio of the divided portion. The proportion of the conductive fibers positioned on the side of the light-transmitting substrate from the half of the film thickness of the conductive portion and the ratio of the conductive fibers located on the side of the light-transmitting substrate is 55% or more. It is judged that the film is localized to the side of the light-transmitting substrate from the half of the film thickness. This abundance ratio is the arithmetic mean value of abundance ratios obtained from each cross-sectional photograph. In addition, when the surface resistance value is low, since the conductive fibers are uniformly present in the conductive portion, even if the existence ratio of the conductive fibers is determined using the cross-sectional photograph of a part of the conductive portion, Of the total population. The presence ratio of the conductive fibers located on the side of the light-transmitting substrate from the half of the film thickness of the conductive portion obtained from the cross-sectional photograph is preferably 70% or more, and more preferably 80% or more.

Whether or not the conductive fiber 16 is unevenly distributed toward the light-transmitting base material 11 side than the position HL of the half of the film thickness of the conductive portion 13 can be judged as follows. First, a first sample in which a metal layer of Pt-Pd, Pt or Au is formed on the surface of the conductive part of the conductive film by a sputtering method, and a second sample in which a metal layer is not formed on the surface of the conductive film are prepared. Then, using the first sample, the film thickness of the conductive portion 13 is measured by a measuring method to be described later. In addition, a cross-sectional photograph of the conductive portion was photographed using the second sample, and the cross-sectional photograph data was read by the image analysis and measurement software (product name: "WinROOF Version 7.4", manufactured by Mathani Shoji Co., Ltd.) And binarization processing is performed. Since the STEM observation gives contrast by the difference in the transmission of electron beams, a metal having a higher density is difficult to transmit an electron beam, and therefore, a black system is used, and an organic material having a density lower than that of a metal becomes a white system. , And the part from the white to the gray rather than the black part can be judged as the light-transmitting resin. Therefore, when the proportion of the black portion in the region on the light-transmitting substrate side from the half of the film thickness of the conductive portion is larger than the proportion of the black portion in the region on the surface side of the conductive portion from the half position, It can be judged that the fiber 16 is localized to the side of the transparent base material 11 with respect to the position HL of the half of the thickness of the conductive part 13. The extraction of the black portion can be performed by the luminance. In addition, the measurement of the area can be performed only by automatic area measurement in that the contrast is clearly different between metals and organic materials.

The area measurement by the binarization processing is performed by the following procedure. First, an image of a sectional photograph is read by the software, and is called by a software image window. Then, in the image window, from the region ROI (processing range) to be subjected to the image processing, half of the film thickness is selected from the bottom and the top, respectively, and each region is binarized to calculate the total area of the conductive fibers. The processing range is set by selecting a rectangular ROI button to be drawn from the image tool bar and setting a rectangular ROI in the image window. In the software, the measured values are outputted in pixel units, but the measured values can be converted into actual lengths by calibration and output. In calculating the area ratio, it is not necessary to convert the conductive fiber to the actual length in order to judge whether or not the conductive fiber is unevenly distributed to the light-transmitting substrate side. However, in the conductive film, the surface resistance value, haze, Calibration is performed. Since the STEM image has a scale display, the STEM image can be calibrated in the ROI area. Specifically, a line corresponding to the scale length of the STEM image is drawn using the line ROI button from the image tool bar, a calibration dialog is displayed, the set line is checked, and the length corresponding to the scale of the STEM image and the unit . In the binarization process, the partial region of the conductive fiber to be measured and the other region are separated. More specifically, binarization by two threshold values is selected from the binarization processing menu. Since the conductive fibers are dense and appear black and the other portions appear white to gray, the two concentrations (brightness) threshold values are properly input (for example, 0 and 80) . When the conductive fibers of the actual STEM image do not coincide with the conductive fibers of the binarization-processed image in which the two-color display (the conductive fiber becomes green, etc.) due to the threshold value, the value of the threshold value is appropriately changed, Modify it until it is close to the image. For example, the difference between the STEM image and the binarized image is appropriately corrected by selecting hole filling or erasing from the binarization processing menu. Compared with the conductive fibers, if the coloring of the electrically conductive fibers to be binarized is insufficient, the filling of the holes and, conversely, the extra colored portions are eliminated. In addition, the hole filling and deleting can fill or delete the extraction area by setting the threshold value of the area. If you click the part you want to delete, you get a threshold for deleting it. In addition, the STEM image and the binarized image are corrected and matched as much as possible in the items in the binarization processing menu as necessary. It is also possible to manually delete unnecessary portions of the binarized image by using the eraser tool button. It is also possible to manually paint on a window using a pen tool button to perform color correction. When this operation is completed, the shape feature of the measurement menu is selected, and the area of the item to be measured is selected. The area of each conductive fiber is measured, and the total value and the like can be measured. By the above operation, the total area and the total area below from the half of the conductive layer film thickness are respectively measured, and furthermore, the area of the lower area ROI and the area of the upper area ROI from half of the film thickness are measured manually And the ratio is calculated. Manual measurement can be performed by selecting measurement of line length during manual measurement from the measurement menu, and selecting all measurement items of line length. Line length By properly using the tools in the tool palette, you can measure the line and drag the point and the end point with the mouse and calculate the ROI area. In addition, the contents of the above work shall conform to the WinROOF Version 7.4 User's Manual.

The surface resistance value of the conductive portion 13 is 200? /? Or less. When the surface resistance value of the conductive part 13 exceeds 200? / ?, there is a possibility that a problem such as a slow response speed is caused particularly in the use of a touch panel. The surface resistance value of the conductive portion 13 is a surface resistance value of the surface 13A of the conductive portion 13. [ The surface resistance value was measured using a contact type resistivity meter (product name: Loresta AX MCP-T370 type, manufactured by Mitsubishi Chemical Analytek Co., Ltd., terminal shape (manufactured by Mitsubishi Chemical) according to JIS K7194: 1994 : ASP probe) and non-destructive (eddy current method) resistivity meter (product name: EC-80P, manufactured by Napson Co., Ltd., URL: https://www.napson.co.jp/wp/wp-content/uploads/2016/ 08 / Napson_EC80P_replet_160614.pdf>), it is preferable to measure using a non-destructive resistivity meter in that it can be accurately measured regardless of the thickness of the conductive portion. The probe of the non-destructive resistivity meter can be measured only by making a simple contact with the sample, and it is possible to measure an arbitrary place without damaging the sample. In that sense, it is sometimes referred to as non-contact type. The measurement of the surface resistance value of the conductive part by the non-destructive resistivity meter is carried out by disposing a conductive film cut into a size of 80 mm x 50 mm on a flat glass plate so that the conductive part side is on the upper surface and the probe is brought into contact with the conductive part. To measure the surface resistance value using the EC-80P, select SW2 and select the sheet resistance measurement Ω / □ for mode M-H. Further, the probe type can be easily changed according to the measurement range. In the present embodiment, a probe having a measurement range of 10 to 1000 OMEGA / &amp; squ &amp; and a probe having a range of 0.5 to 10 OMEGA / &amp; squ &amp; is used. Further, it is possible to measure the same with EC-80P-PN (manufactured by NAPSON) instead of EC-80P. In the case of this model, P / N may be selected as P. The measurement of the surface resistance value of the conductive part by the contact type resistivity meter was carried out as follows. The conductive film cut into a size of 80 mm x 50 mm was placed on a flat glass plate so that the conductive part side was the upper surface. And all the electrode pins are uniformly pressed against the conductive parts. When measuring the surface resistance value by the contact type resistivity meter, the mode for measuring the sheet resistance, Ω / □, is selected. Thereafter, when the start button is pressed and held, the measurement result is displayed. The surface resistance value is measured in an environment of 23 ° C and a relative humidity of 55% regardless of the type of the resistivity meter. In measuring the surface resistance value, a conductive film is disposed on a horizontal table regardless of the type of the resistivity meter, and measurement is performed in a uniform planar state. However, the conductive film is unable to maintain a flat state , The conductive film is to be attached to a glass plate with a tape or the like. The measurement points are set at three central portions of the conductive film, and the surface resistance value is an arithmetic mean value of the surface resistance values at three points. According to JIS K7194: 1994, the measurement point is 1 point, 5 points, or 9 points. However, when the conductive film is actually cut into a size of 80 mm x 50 mm and measured as shown in Fig. 5 of JIS K7194: 1994, May become unstable. Therefore, unlike JIS K7194: 1994, measurement points are measured at three locations in the central part of the conductive part. For example, it is preferable that the position of 1, the position between 1 and 7 (preferably close to 1) and the position between 1 and 9 of JIS K7194: 1994 (preferably at 1 Close position). It is preferable that the surface resistance value is measured near the center of the sample. Iscadaichi et al., "Measurement of Resistivity of Conductive Thin Films by 4-Probe Method", Tokyo Institute of Electronics Information and Communication Society, 2008 < //www.ieice.org/tokyo/gakusei/kenkyuu/14/pdf/120.pdf>. The lower limit of the surface resistance value of the conductive film 10 is preferably in the order of 1 Ω / □ or more, 5 Ω / □ or more and 10 Ω / □ or less (preferably, the larger the value is) The upper limit is more preferably 100 Ω / □ or less, 70 Ω / □ or less, 60 Ω / □ or less, and 50 Ω / □ or less (the smaller the number is, the better).

It is preferable that the film thickness of the conductive portion 13 is less than 300 nm. When the thickness of the conductive part 13 is 300 nm or more, the thickness of the light-transmitting resin 15 becomes too thick, so that all of the conductive fibers are buried in the light-transmitting resin, So that electrical conduction from the surface of the conductive part may not be obtained. As the film thickness of the conductive portion increases, the overlapping portions of the conductive fibers increase, so that it is possible to achieve a low surface resistance value of 1? /? Or more and 10? /? Or less. However, if the conductive fibers are overlapped too much, Sometimes it becomes difficult. Therefore, the film thickness is preferably 300 nm or less. In addition, as long as the low surface resistance value can be maintained, the conductive part is preferably a thin film in terms of optical properties and thinning. The upper limit of the film thickness of the conductive portion 13 is preferably 145 nm, 140 nm or less, 120 nm or less, 110 nm or less, 80 nm or less, or 50 nm or less in order from the viewpoints of achieving thinning or obtaining good optical characteristics such as low haze value. (The smaller the number is, the more preferable). The lower limit of the film thickness of the conductive portion 13 is preferably 10 nm or more. If the film thickness of the conductive portion is less than 10 nm, the film thickness of the light-transmitting resin 15 becomes too small, which may cause the conductive fibers to be separated from the conductive portion, the durability of the conductive portion to deteriorate, and the scratch resistance to deteriorate. In order to prevent instability such as easy disconnection of the conductive fiber, it is preferable that the fiber diameter of the conductive fiber is somewhat large. It is considered that the fiber diameter capable of stably maintaining the shape of the conductive fiber is 10 nm or more or 15 nm or more. On the other hand, in order to obtain stable electrical conduction, it is preferable that two or more conductive fibers overlap with each other, so that the lower limit of the film thickness of the conductive portion 13 is more preferably 20 nm or more or 30 nm or more.

The film thickness of the conductive portion 13 was measured at 10 positions at random from the cross-sectional photographs of the conductive portions photographed using a scanning transmission electron microscope (STEM) or a transmission electron microscope (TEM) The arithmetic average value is used. A specific method of photographing a sectional photograph will be described below. First, a sample for cross section observation is prepared from the conductive film in the same manner as described above. If conduction can not be obtained in this sample, it may be difficult to observe an observation image by STEM. Therefore, it is preferable to sputter Pt-Pd for about 20 seconds. The sputtering time can be appropriately adjusted, but it is necessary to be careful because the sputtered metal is small in 10 seconds and too much in 100 seconds, so that the sputtered metal becomes a foreign particle image. Thereafter, a cross-sectional photograph of the STEM sample is taken using a scanning transmission electron microscope (STEM) (product name: S-4800 (TYPE2), manufactured by Hitachi High-Technologies Corporation). At the time of photographing the cross section photograph, the STEM observation is carried out with the detector (selection signal) set to "TE", the acceleration voltage set to "30 kV", and the emission set to "10 μA". As for the magnification, adjust the focus to adjust the contrast and brightness to 5,000 to 200,000 times while observing that each layer can be discriminated. The preferable magnification is 10,000 to 100,000 times, more preferably 10,000 to 50,000 times, most preferably 2.5 to 50,000 times. Further, at the time of photographing the cross-sectional photograph, the aperture may be set to 3, the objective lens iris may be set to 3, and the W. D. may be set to 8 mm. When measuring the film thickness of the conductive portion, it is important that the interface contrast between the conductive portion and another layer (a light-transmitting functional layer or a molded resin, etc.) can be observed as clearly as possible when observing the cross section. For example, in the observation of the interface due to the lack of contrast, pretreatment generally used in electron microscopic observation such as formation of a metal layer of Pt-Pd, Pt, Au or the like on the surface of the conductive portion by sputtering may be performed. Further, when dyeing treatment such as osmium tetroxide, ruthenium tetraoxide or tungstic acid is performed, the interface between the organic layers becomes easy to see, so that the dyeing treatment may be performed. In addition, there is a case where the contrast at the interface is difficult to know at a high magnification. In that case, the low magnification is also observed at the same time. For example, an average arithmetic average value of the magnification composition is observed at a magnification of 2.5 times or more, such as 50,000 times, 50,000 times, or 100,000 times, and the average value is taken as the value of the thickness of the conductive portion.

The conductive part 13 is formed by applying a conductive fiber-containing composition containing the conductive fiber 16 as described below, and a light-transmitting resin composition containing a polymerizable compound to be a light- For example, when a conductive part is formed by applying a conductive fiber-containing composition containing conductive fibers and drying the conductive part, the thickness of the conductive part is set to be not less than the thickness of the conductive fiber-containing composition (See, for example, <URL: https://www.nipponpaint.co.jp/biz1/large/pdf/tech04.pdf>) from the application amount using the following formula.

(G / m &lt; 2 &gt;) of the conductive fiber-containing composition for forming a conductive portion for obtaining T (mu m), dp is a dry coating thickness Ds is the specific gravity of the volatile content of the conductive fiber-containing composition, and NV is the non-volatile content (weight ratio) of the conductive fiber-containing composition.

It is preferable that the conductive portion 13 does not contain particles such as inorganic particles having a particle diameter exceeding the thickness of the light-transmitting resin 15. [ If the conductive part includes such particles, the particles protrude from the surface of the light-transmitting resin, and the film thickness of the conductive part becomes large. Here, in the case where particles protrude from the surface of the light-transmitting resin, the thickness of the conductive portion is set to a distance from the surface of the conductive portion to the apex of the particle to the light-transmitting substrate side. It is more preferable that the conductive portion 13 does not include the particles themselves such as inorganic particles without regard to the particle size. However, for example, when any of the residues of the metal-based nuclear particles obtained in the intermediate step for forming the conductive fiber 16 or any material is modified in the conductive fiber itself, it can be regarded as a part of the conductive fiber, These are not included in the particle.

The conductive portion 13 preferably has a Martens hardness of 970 N / mm2 or more and 1050 N / mm2 or less at a position where the amount of indentation from the surface 13A is 10 nm. The conductive portion 13 preferably has a Martens hardness of 130 N / mm &lt; 2 &gt; to 300 N / mm &lt; 2 &gt; at a position where the amount of indentation from the surface 13A is 100 nm. Generally, when measuring with a microhardness tester, the amount of indentation within 10% of the film thickness of the object to be measured is preferable. That is, in the present embodiment, the Martens hardness at the position of 10 nm is hardly influenced by the lower layer than the conductive portion and means the hardness of the conductive portion itself. Normally, in the state of the product, not only the conductive part but also various layers such as a substrate are laminated thereunder. However, the martens hardness at the position of 100 nm means the hardness as a film required for a product. Even if any layer is placed under the conductive part, if the Martens hardness is satisfied, the conductive film is less likely to be bent or cracked.

If the Martens hardness at the position where the pressing amount is 10 nm in the conductive portion 13 is less than 970 N / mm 2, cracks are easily generated in the manufacturing process of the conductive film. If it exceeds 1050 N / The etching rate at the time of patterning the portion becomes slow, and there is a fear that a crack is generated in the bending. The lower limit of the Martens hardness at the position where the pressing amount is 10 nm in the conductive portion 13 is more preferably 980 N / mm 2 or more, 1000 N / mm 2 or more and 1015 N / mm 2 or more in order (more preferably, The upper limit of the hardness of the martens at the position where the press-in amount is 10 nm is more preferably 1040 N / mm2 or less, 1030 N / mm2 or less, and 1020 N / mm2 or less. If the hardness of the Martens hardness at the position where the indentation amount is 100 nm is less than 130 N / mm &lt; 2 &gt;, the conductive film tends to bend. If the hardness exceeds 150 N / mm &lt; 2 &gt; The lower limit of the Martens hardness at the position where the pressing amount is 100 nm in the conductive portion 13 is more preferably 140 N / mm 2 or more, 150 N / mm 2 or more and 170 N / mm 2 or more (more preferably, The upper limit of the hardness of the martens at the position where the press-in amount is 100 nm is more preferably 280 N / mm 2 or less, 250 N / mm 2 or less, and 200 N / mm 2 or less.

In the present invention, the Martens hardness at which the indentation amount is 10 nm or 100 nm preferably satisfies at least one of them. By satisfying both of them, balance of physical properties such as bending and cracking becomes good as described above. It is also important that the Martens hardness is not too low and not too high. For example, in order to prevent the occurrence of scratches easily in the manufacturing process of the conductive film, a certain degree of hardness is required. In the case of patterning the conductive portion, an etching process is performed. This process includes dry etching by laser or the like and wet etching by immersion in an etching liquid by a general photolithography method. In either case, if the hardness is too high, the etching rate is slowed, and it takes time to process. Therefore, the upper limit of the Martens hardness is required.

The martens hardness with the indentation amount of 10 nm or 100 nm from the surface in the conductive portion is measured by the following method. First, a conductive film cut into a size of 20 mm x 20 mm is fixed to a commercially available slide glass with the conductive part side on the upper side through an adhesive resin (trade name: AARON ALPHA (registered trademark), manufactured by TOAGOSEI CO., LTD.). Specifically, the above adhesive resin is dropped into the center of a slide glass 1 (product name: "Slide glass (cut type) 1-9645-11", manufactured by Asuzon Co., Ltd.). At this time, one drop is applied so that the adhesive resin is not spread out and the adhesive resin is not ejected from the conductive film when the film is pushed as described later. Thereafter, the conductive film cut into the above-mentioned size is brought into contact with the slide glass so that the conductive part side becomes the upper face and the adhesive resin is located at the center part of the conductive film, and the adhesive resin is pressed between the slide glass 1 and the conductive film, do. Then, another new slide glass 2 is placed on the conductive film to obtain a laminated body of the slide glass 1 / the adhesive resin / the conductive film / the slide glass 2. Subsequently, a weight of 30 g or more and 50 g is placed on the slide glass 2, and left at room temperature for 12 hours in this state. Thereafter, the weight and the slide glass 2 are peeled off, and this is used as a sample for measurement. Further, the four corners of the conductive film fixed with the adhesive resin may be further fixed with a tape (product name: &quot; Cellotape (registered trademark) &quot; The sample for measurement is fixed to a measurement stage of a microhardness tester (product name: PICODENTOR HM500, manufactured by Fisher Instruments, ISO 14577-1, ASTM E2546, or the like) provided parallel to the vibration damping table. This fixing can be carried out by fixing the four sides of the slide glass 1 with a tape (product name: "CELLOTAPE (registered trademark), niche reflector" or the like), and the measurement sample does not move. After fixing the measurement sample to the measurement stage of the microhardness tester, the measurement was carried out under the following measurement conditions: a 10-nm indentation amount of the surface of the conductive portion, and a 10- The martens hardness is an arithmetic mean value of the obtained hardnesses of five points measured at arbitrary five points in the vicinity of the center of the surface of the conductive portion of the measurement sample (region where the adhesive resin is present) The arbitrary five points to be measured were observed at a conductive part at a magnification of 50 to 500 times using a microscope attached with a Picodenter HM500 and conductive fibers were superimposed in the conductive part A portion having a convex structure and a portion having an extreme concave structure on the contrary are preferably avoided and a portion having a flatness as much as possible is selected from the conductive portion of the patterned conductive film. When calculating the Martens hardness, it is automatically calculated by selecting &quot; HM &quot; (Martens Hardness) as the type of hardness to be measured with the Picodenter HM500.

(Measuring conditions)

· Indenter shape: Vickers (square-pyramid diamond indenter) (square angle horn with 136 ° of facing angle at the tip)

· Load control system: Up to 40mN

· Increase time of load: 20 seconds

Creep time: 5 seconds

· Load removal time: 20 seconds

(At the time of measurement of the martens hardness at the indentation amount of 10 nm), 100 nm (at the measurement of the martens hardness at the indentation amount of 100 nm)

· Temperature during measurement: 25 ℃

· Humidity at measurement: 50%

The profile of the measurement is 20 seconds, load from 0 mN to 40 mN is loaded, 40 mN is maintained for 5 seconds, and then 20 mn to 40 mN to 0 mN.

When the conductive film 10 is used for the sensor electrode of the touch panel, the surface 13A of the conductive portion 13 is formed in the six directions including the arbitrary direction in the plane, And a direction in which the lowest electric resistance value is obtained is referred to as a first direction and a direction orthogonal to the first direction is referred to as a second direction, the electric resistance value in the first direction (Hereinafter, this ratio is referred to as &quot; ratio of electric resistance value &quot;) is preferably 1 or more and less than 2. The ratio of the electric resistance value can be obtained, for example, as follows. First, as shown in Fig. 2, an arbitrary direction AD is determined in the plane of the conductive portion 13, and a predetermined direction 6 in every 6 [deg.] Every 30 [deg. (For example, a sample S having a size of 110 mm long × 5 mm wide (the size of the sample S excluding the silver paste 17 described later is 100 mm long × 5 mm wide)) is cut out from the conductive film 10. When the sample S is cut, the portion to be provided with the silver paste is taken into consideration and cut to a length of about 10 mm. After the sample S is cut out from the conductive film 10, as shown in Fig. 3, on both end portions in the long-side direction of each sample S (for example, a portion having a length of 5 mm and a width of 5 mm) (Product name &quot; DW-520H-14 &quot;, Toyobo Co., Ltd.) so as to have a film thickness after curing of not less than 5 탆 and not more than 10 탆, and heated at 130 캜 for 30 minutes And a sample S provided with silver paste 17 cured at both ends is obtained. Further, the distance between the silver pastes 17 (the distance of the portion where the silver paste 17 is not provided) is a measurement distance (for example, 100 mm) of the electrical resistance value in each sample S, The distance is constant between each sample S. The recommended aspect ratio except for the silver paste 17 is 20: 1. However, when only a small sample can be prepared, the recommended aspect ratio excluding the silver paste 17 can be reduced to 10: 1, A sample having a size of 5 mm in width (the size of the sample excluding the silver paste 17 is 50 mm in length x 5 mm in width) may be used. In the present embodiment, the sample S is sampled from six directions every 30 degrees with respect to an arbitrary direction AD, but when the angle to a straight line parallel to an arbitrary direction AD is different, . The electrical resistance value of each sample S provided with the silver paste 17 cured at both ends was measured using a tester (product name: Digital M? Hiteter 3454-11, manufactured by Hioki Denki Co., Ltd.) do. Specifically, Digital MΩ HiteSter 3454-11 has a black probe terminal and a red probe terminal (both pin types). First, insert the black probe terminal into the EARTH jack and insert the red probe terminal into the LINE jack . Then set the jog dial to "Ω" and press the MEASURE LOCK / STOP button for 2 seconds. As a result, the electrical resistance value can be automatically measured every time the probe terminal is installed. In this state, the red probe terminal is brought into contact with the cured silver paste 17 provided at one end, and the black probe terminal is brought into contact with the cured silver paste 17 provided at the other end, and the electric resistance value is measured. The electric resistance value is measured in an environment of 23 캜 and a relative humidity of 55%. In addition, when there is a coating failure of the silver paste, the measurement result of the electrical resistance value may become unstable and may have an apparently different outlier than the assumed resistance value. Therefore, It is preferable that the heat treatment is performed while the silver paste is thickly coated so as to have a thickness of 10 mu m. Then, among the samples S cut out from the conductive film 10, a sample S having the lowest electric resistance value is found. A sample S cut out from a second direction orthogonal to the first direction is searched for when the direction in which the sample S having the lowest electrical resistance value is cut is referred to as a first direction, The ratio of the electrical resistance value of the sample S cut out from the direction is obtained. The ratio of the electrical resistance value is the arithmetic mean value of the values obtained by three measurements. The upper limit of the ratio of the electric resistance value is preferably 1.8 or less, 1.5 or less, or 1.3 or less (the smaller the value is, the more preferable). By setting this range, a uniform resistance value can be obtained in the plane. A product using a conductive film (for example, a smart phone) has a small area. However, if there is a variation in the plane of one object, a problem arises in the operation of the display image or the touch panel, so that it can be prevented.

In the case where the conductive portion is patterned such as the conductive portions 22 and 31 to be described later and formed of a plurality of wirings, for example, the ratio of the electric resistance value can be obtained as follows. First, six arbitrary measurement regions are set in the plane of the conductive film. The six measurement areas have the same size (the same length) and are spaced apart from each other. In the six measurement regions, for example, the measurement region is located in the first edge portion located in the direction in which the respective wirings of the conductive film extend, in the direction in which the wirings extend, And three positions are set on the second frame side opposite to the first frame side. Specifically, the measurement region is formed so that two of three portions on the first edge side and two portions out of the three portions on the second edge side are located in the vicinity of the four corners of the conductive film, and one of the three portions on the first edge side And the remaining one of the three portions on the second frame side is located at the central portion. Then, silver paste (product name "DW-520H-14", Toyobo Co., Ltd.) is cured at a thickness of 5 탆 to 10 탆 outside the both ends located in the extending direction of the wiring in each region, And is heated at 130 占 폚 for 30 minutes to cure the silver paste. The distance (measured length) between the cured silver pastes located outside the opposite ends of each region is set to be the same in each region, and the width of the silver paste is set to 10 mm or less in total of both ends. Then, the probe terminals of a tester (product name: Digital M? Hiteter 3454-11, manufactured by Hioki Denki Co., Ltd.) were brought into contact with each of the cured silver pastes located outside the opposite ends of each region, Measure the value. For example, when using Digital MΩ Hitester 3454-11 as a tester, Digital MΩ Hitester 3454-11 has two probe terminals (red probe terminal and black probe terminal, both pin type) Is brought into contact with a silver paste located on one end outer side of the measurement region and the black probe terminal is brought into contact with a cured silver paste located outside the other end of the measurement region to measure the line resistance value. Then, the ratio of the electrical resistance value is obtained by obtaining the ratio of the highest line resistance value to the lowest line resistance value among the six measurement regions. Although a line width of a conductive part is very narrow in a 5 inch smart phone or the like, by providing a silver paste on a conductive part (wiring), a line resistance value can be measured even in a conductive part having a narrow line width.

In the case of a small product such as a smart phone of 5 inches or the like, the line resistance value is measured in the order of micrometers at a narrow line width. In this case, the measurement area is set to a line range as long as possible regardless of the aspect ratio. If the conductive film is a vertically elongated rectangular shape, it is preferable to set the measurement region so that the measurement length is approximately half of the long side of the conductive film. On the other hand, in the case of a product having a size of 20 inches or more, the line width is a mm order even in a narrow portion, and in this case, it is desirable to set the measurement region at an aspect ratio of 1:20.

In the case of measuring the electric resistance value or the surface resistance value from the product, it is sufficient to carry out the pre-treatment at a time or less. It is not limited to the following method, but it is important that it does not affect the conductive fiber. That is, in the case where the conductive part is already clearly visible and it can be assumed that the adhesive layer is extremely thin, the film can be measured as it is. However, it is preferable to perform the pretreatment so as to be as thin as possible. For example, when the conductive film is used as a sensor of a touch panel, a cover film or glass is present on the conductive film through the adhesive layer. Therefore, first, the cover film or the cover glass is peeled by inserting the cutter blade at the end. If it can not be easily peeled off, it is not forcibly peeled off and is transferred to the next step. Subsequently, the substrate is immersed in hot water at 40 DEG C for 10 seconds and taken out is repeated three times. Thereafter, the peeling state of the adhesive layer is confirmed with a cutter or the like, and in some cases, the substrate is immersed in hot water at 40 ° C for 10 seconds and taken out is further repeated three times. Thereafter, the pressure-sensitive adhesive layer is peeled off with a tool (thin and flat, but not blade-like) which will not easily scratch the conductive part. Further, even if the entire surface can not be peeled off, it is only necessary that the peeling can be performed at the part to be measured. This preprocessing can also be used for measurements other than electrical resistance or surface resistance.

On the other hand, in the case of obtaining a conductive film having a lower electrical resistance value in a specific direction, the surface 31A of the conductive portion 31 may be inclined at an angle of 30 deg. It is preferable that the electric resistance value ratio is 2 or more when the electric resistance values in the six directions are respectively measured by a predetermined size. The ratio of the electrical resistance value is the arithmetic mean value of the values obtained by three measurements. The lower limit of the ratio of the electric resistance value is more preferably 3 or more. The upper limit of the ratio of the electric resistance value is preferably 10 or less and 8 or less in order from the viewpoint of the uniformity of the resistance value in the plane.

The conductive part having such an electric resistance value ratio of 1 or more, or less than 2 or 2 or more, may be used, for example, as the conductive fiber, the fiber length of the conductive fiber, the type and thickness of the resin constituting the organic protective layer described later, and / And it is possible to obtain by appropriately adjusting it.

&Lt; Transparent resin >

The light-transmitting resin 15 covers the conductive fibers 16 in order to prevent the conductive fibers 16 from separating from the conductive parts 13 and to improve the durability and scratch resistance of the conductive parts 13 And covers the conductive fiber 16 to such an extent that electrical conduction can be obtained from the surface 13A of the conductive portion 13. Specifically, as described above, if some of the conductive fibers are not exposed on the surface of the conductive portion, there is a fear that electrical conduction can not be obtained from the surface of the conductive portion. Therefore, the light- It is preferable that the conductive fibers 16 are covered so as to be exposed from the surface 13A of the conductive portion 13. [ In order to cover the conductive fiber 16 with the light-transmitting resin 15 such that some of the conductive fibers 16 are exposed on the surface 13A of the conductive portion 13, the thickness of the light- .

The thickness of the light-transmitting resin 15 is preferably less than 300 nm from the viewpoint of thinning. The film thickness of the light-transmitting resin 15 can be measured by the same method as the method of measuring the film thickness of the conductive portion 13. The upper limit of the film thickness of the light-transmitting resin 15 is more preferably 145 nm or less, 140 nm or less, 120 nm or less, 110 nm or less, 80 nm or less, or 50 nm or less. The lower limit of the film thickness of the light-transmitting resin 15 is preferably 10 nm or more.

The light transmitting resin 15 is not particularly limited as long as it is a resin having light transmittance, and examples of the light transmitting resin include a polymer of a polymerizable compound and a thermoplastic resin. The polymerizable compound may be the same as the polymerizable compound described in the column of the light-transmitting functional layer 12, and thus the description thereof will be omitted.

<Reaction inhibitor>

The reaction inhibitor is intended to suppress the deterioration of conductivity due to the reaction of the conductive fiber 16 and the substance in the atmosphere after application of the composition for light transmitting resin. Examples of the reaction inhibitor include nitrogen-containing compounds such as benzoazole-based compounds, triazole-based compounds, tetrazole-based compounds, isocyanuric acid-based compounds and aniline-based compounds. Examples of the nitrogen-containing compound used as the reaction inhibitor include 1-aminobenzoazole, 5-methylbenzotriazole, 1,2,3-benzotriazole, 1-methyl-1H- tetrazol- -tocopherol, 1-octadecanethiol, 2-mercapto-5- (trifluoromethyl) pyridine, diallyl isocyanurate, diallylpropyl isocyanurate, 6-anilino- Triazine-2,4-dithiol, thiocyanuric acid, 3,5-dimethyl-1H-1,2,4-triazole, 4- (1,2,4-triazol- , 6- (dibutylamino) -1,3,5-triazine-2,4-dithiol, 4- (1,2,4-triazol-1-yl) aniline, 2-methylthio-benzothiazole 1-phenyl-5-mercapto-1H-tetrazole, 5-mercapto-1-methyltetrazole, 5- (methylthio) (2-dimethylaminoethyl) -5-mercaptotetrazole, 1- (2-dimethylaminoethyl) -5-mercaptotetrazole, 1- Sol, 3-amino-5-mercapto-1,2,4-triazole, 3,5-di There may be mentioned diamino-1,2,4-triazole.

The content of the reaction inhibitor in the conductive portion 13 is preferably 0.01 mass% or more and 10 mass% or less. If the content of the reaction inhibitor is less than 0.01% by mass, the conductive fiber may react with the substance in the atmosphere, and the conductivity may be lowered. The reaction inhibitor reacts with the surface of the conductive fiber to deactivate the surface of the conductive fiber to produce a state in which the conductive fiber is difficult to react with the substance in the atmosphere. When the content of the reaction inhibitor exceeds 10% by mass, The reaction with the reaction inhibitor in the conductive fiber progresses not only to the surface of the conductive fiber but also to the inside of the conductive fiber.

&Lt; Conductive fiber &

The conductive fibers 16 are located on the side of the light transmitting base material 11 at a position half the position HL of the thickness of the conductive parts 13 but are electrically conductive from the surface 13A of the conductive parts 13, The conductive fibers 16 are in contact with each other in the thickness direction of the conductive portion 13. [

The conductive fibers 16 are brought into contact with each other in the planar direction (two-dimensional direction) of the conductive portion 13 on the side of the light transmitting base 11 with respect to the position HL of the half of the film thickness of the conductive portion 13, Structure) is preferably formed. By forming the network structure of the conductive fibers 16, even a small amount of the conductive fibers 16 can efficiently form a conductive path.

It is preferable that some of the conductive fibers 16 are exposed to the surface 13A of the conductive portion 13. [ In the present specification, &quot; some of the conductive fibers are exposed on the surface of the conductive portion &quot; means that a part of the conductive fibers is exposed to such an extent that the conductive fibers are fixed to the conductive portion. When the conductive fibers protrude from the surface of the conductive portion Are also included. Electrical conduction can not be obtained from the surface of the conductive portion unless some of the conductive fibers are exposed on the surface of the conductive portion. As a result, electrical conduction is obtained from the surface 13A of the conductive portion 13 It can be determined that some conductive fibers 16 are exposed on the surface 13A of the conductive portion 13 on the ground.

The conductive fiber 16 preferably has a fiber diameter of 200 nm or less. If the fiber diameter of the conductive fiber exceeds 200 nm, the haze value of the conductive film may increase, or the light transmission performance may become insufficient. A more preferable lower limit of the fiber diameter of the conductive fiber 16 is 10 nm or more from the viewpoint of conductivity of the conductive portion 13 and a more preferable range of the fiber diameter of the conductive fiber 16 is 15 nm or more and 50 nm or less. The diameter of the conductive fibers 16 is most preferably 30 nm or less.

The fiber diameter of the conductive fiber 16 is 50 times to 100,000 times to 200,000 times by using a transmission electron microscope (TEM) (trade name: H-7650, manufactured by Hitachi High Technologies) The fiber diameter of 100 strands of conductive fibers is measured on the imaging screen by software, and the arithmetic mean value is obtained. When the fiber diameter was measured using the H-7650, the acceleration voltage was set to 100 kV, the emission current to 10 A, the convergence lens iris to 1, the objective lens iris to 0, HC &quot;, and Spot is &quot; 2 &quot;. It is also possible to measure the fiber diameter of the conductive fiber by using a scanning transmission electron microscope (STEM) (product name: S-4800 (TYPE2) manufactured by Hitachi High-Technologies Corporation). When STEM is used, 50 fibers are taken at 100,000 to 200,000 times, fiber diameters of 100 strands of conductive fibers are measured on an imaging screen by software with STEM, and the fiber diameter of the conductive fibers is obtained as an arithmetic mean value . When the fiber diameter is measured using the S-4800 (TYPE2), the signal selection is set to "TE", the acceleration voltage is set to "30 kV", the emission current is set to 10 μA, the probe current is set to "Norm" Quot ;, &quot; UHR &quot;, condenser lens 1 to 5.0, WD to 8 mm, and Tilt to 0 DEG.

In measuring the fiber diameter of the conductive fiber 16, a measurement sample prepared by the following method is used. Here, for the TEM measurement, it is important to reduce the concentration of the conductive fiber-containing composition as much as possible so that the conductive fibers do not overlap as much as possible for a high magnification. Concretely, it is preferable to dilute the conductive fiber-containing composition to 0.05% by mass or less, or to 0.2% by mass or less of the solid content, of the conductive fiber with water or alcohol in accordance with the dispersion medium of the composition. One droplet of this diluted conductive fiber-containing composition was dropped onto a grid mesh provided with a carbon support film for observation of TEM or STEM, and dried at room temperature, and observed under the above-described conditions to obtain observation image data. Based on this, an arithmetic average value is obtained. As the grid mesh provided with the carbon support film, a Cu grid type number &quot;# 10-1012 Elastic Carbon ELS-C10 STEM Cu100P Grid Specification &quot; is preferable, and the grid mesh is suitable for high magnification because it is strong against the electron beam irradiation amount and has better electron beam transmittance than the plastic support film , And strong against an organic solvent. In addition, at the time of dropping, since the grid mesh is so small that it is difficult to drop it, it may be dropped by placing the grid mesh on the slide glass.

The fiber diameter may be obtained by actual measurement based on photographs, or may be calculated by binarization processing based on image data. In actual measurement, a photograph may be printed and appropriately enlarged. At that time, the conductive fiber has a darker black density than other components. The measuring point is measured as the starting point and the end point outside the outline. The concentration of the conductive fiber is determined by the ratio of the mass of the conductive fiber to the total mass of the conductive fiber-containing composition, and the solid content is determined based on the total mass of the conductive fiber- And other additive).

The conductive fiber 16 preferably has a fiber length of 1 탆 or more. If the fiber length of the conductive fiber 16 is less than 1 占 퐉, the conductive layer having sufficient conductive performance may not be formed, and there is a concern that cohesion may occur to increase the haze value and deteriorate the light transmission performance . The upper limit of the fiber length of the conductive fiber 16 may be 500 μm or less, 300 μm or less, or 30 μm or less, and the lower limit of the fiber length of the conductive fiber 16 may be 3 μm or more or 10 μm or more.

If the fiber length of the conductive fiber 16 is 30 탆 or more, the conductive fibers tend to be arranged along the MD direction described later, so that the difference in electric resistance value depending on the in-plane direction tends to increase. Therefore, in the case of obtaining a conductive part having an electrical resistance value ratio of 1 or more and less than 2, for example, the fiber length of the conductive fiber 16 is preferably 1 μm or more and less than 30 μm, and in the case of obtaining a conductive part having an electrical resistance value ratio of 2 or more , For example, the conductive fiber 16 preferably has a fiber length of 30 탆 or more. The lower limit of the fiber length of the conductive fiber 16 in the case of obtaining a conductive portion having an electric resistance value ratio of 1 or more and less than 2 is preferably 10 占 퐉 or more from the viewpoint of obtaining a low surface resistance value, and the upper limit is preferably 20 占 퐉 or less.

The fiber length of the conductive fiber 16 is preferably 500 to 20,000 to 10,000 times by using a SEM function of a scanning electron microscope (SEM) (product name: S-4800 (TYPE2), manufactured by Hitachi High- And the fiber length of the 100-strand conductive fibers is measured on the imaging screen by the supplied software, and the arithmetic average value of the fiber lengths of the 100-strand conductive fibers is obtained. When measuring the fiber length using the S-4800 (TYPE2), the signal selection was set to "SE", the acceleration voltage was set to "3 kV" and the emission current was set to 10 μA to 20 μA , The SE detector is set to "mixed", the probe current is set to "Norm", the focus mode is set to "UHR", the condenser lens 1 is set to "5.0", the WD is set to "8 mm", and the tilt is set to "30 °". Also, at the SEM observation, the TE detector is not used, so the TE detector must be removed before the SEM observation. The S-4800 can select the STEM function and the SEM function, but when measuring the fiber length, the SEM function is used.

In measuring the fiber length of the conductive fiber 16, a measurement sample prepared by the following method is used. First, a conductive fiber-containing composition was applied to an untreated surface of a polyethylene terephthalate (PET) film having a thickness of 50 탆 in a size of B5 to give a coating amount of 10 mg / m 2, the dispersion medium was dried, conductive fibers were disposed on the surface of the PET film, A film is produced. The conductive film is cut to a size of 10 mm x 10 mm at the center of the conductive film. Then, the cut conductive film was applied to a SEM sample table (model number &quot; 728-45 &quot;, manufactured by Nisshin EM Co., Ltd., slant type sample stand 45 °, 15 mm x 10 mm M4 aluminum) And flattened with respect to the surface. Further, Pt-Pd is sputtered for 20 seconds to 30 seconds to obtain conduction. If there is no suitable sputtering film, the image may be hard to see. In that case, adjust it appropriately.

The fiber length may be obtained by actual measurement based on photographs, or may be calculated by binarization processing based on image data. In the case of actual measurement based on a photograph, it shall be performed by the same method as described above.

The conductive fibers 16 are preferably at least one kind of fiber selected from the group consisting of metal fibers such as conductive carbon fibers and metal nanowires, metal-coated organic fibers, metal-coated inorganic fibers and carbon nanotubes.

Examples of the conductive carbon fiber include vapor-grown carbon fiber (VGCF), carbon nanotube, wire cup, wire wall and the like. These conductive carbon fibers may be used alone or in combination of two or more.

As the metal fiber, for example, a fiber produced by a drawing method or a cutting method in which a thin and long stretch of stainless steel, iron, gold, silver, aluminum, nickel, titanium or the like is used can be used. These metal fibers may be used alone or in combination of two or more. The metal fiber is preferably a metal nanowire having a fiber diameter of 200 nm or less, preferably 50 nm or less, more preferably 30 nm or less, and a fiber length of 1 탆 or more, preferably 15 탆 or more, and more preferably 20 탆 or more Do.

Examples of the metal-coated synthetic fibers include fibers in which acrylic fiber is coated with gold, silver, aluminum, nickel, titanium, or the like. These metal-coated synthetic fibers may be used alone or in combination of two or more.

<< Other conductive films >>

The conductive film 10 shown in Fig. 1 is a film in which the conductive parts 13 are not patterned, that is, a so-called solid film. Depending on the application, the conductive parts may be patterned. Specifically, the conductive film has a plurality of conductive portions 22 as shown in Figs. 5 to 7 and a conductive layer 21 composed of a non-conductive portion 23 located between the conductive portions 22 Or may be a conductive film 30 having a plurality of conductive portions 31 and a plurality of voids 32 existing between the conductive portions 31. The conductive films 30 may be formed of a conductive film. The surface 20A of the conductive film 20 is composed of the surface 22A of the conductive part 22 and the surface 23A of the non-conductive part 23, And a surface of the conductive portion 31 and one surface of the light-transmitting functional layer. The physical properties of the conductive films 20 and 30 are the same as those of the conductive film 10. 5 to 9, members having the same reference numerals as those in Figs. 1 and 2 are the same as members shown in Figs. 1 and 2, and therefore, explanation thereof will be omitted.

<Conductive part>

The conductive portions 22 and 31 are the same as the conductive portion 13 except that they are patterned. 7 and 9, the conductive parts 22 and 31 include a light-transmitting resin 15 and a plurality of conductive fibers 16 disposed in the light-transmitting resin 15 . The conductive portions 22 and 31 are electrically conductive from the surface. As shown in Figs. 7 and 9, in the conductive portions 22 and 31, the conductive fibers 16 are located on the side of the light transmitting base 11 with respect to the position HL at half the thickness of the conductive portions 22 and 23 . Other configurations, materials, and physical properties of the conductive parts 22 and 31 are the same as those of the conductive part 13.

The conductive portion 22 functions as an electrode in the X direction in, for example, the projection-type capacitive touch panel, and includes a plurality of sensor portions 22B extending in the X direction as shown in Fig. 6, And a terminal portion (not shown) connected to each sensor portion 22B. Each sensor portion 22B is provided in a rectangular active area which is an area where the touch position can be detected, and the terminal portion is provided in a non-active area which is adjacent to the active area and which is an area surrounding the active area in all directions .

Each sensor portion 22B has a linear portion 22C and a bulged portion 22D extending from the line portion 22C. In Fig. 6, the line portion 22C extends linearly along the direction intersecting the arrangement direction of the sensor portion 22B. The bulging portion 22D is a portion bulging from the line portion 22C along the surface of the light-transmitting functional layer 12. [ Therefore, the width of each sensor portion 22B is thick in the portion where the bulging portion 22D is provided. In the present embodiment, the bulged portion 22D has an outer contour of a substantially square shape in plan view. Further, the swollen portion 22D is not limited to a substantially square shape in plan view, but may be a diamond shape or a stripe shape.

The surface resistance value (? /?) Of the conductive parts 22 and 31 can be measured at a part where the area of the conductive parts 22 and 31 is large (such as a bezel part of the product). The surface resistance value of each of the conductive parts 22 and 31 may vary depending on the shape and size of the patterned conductive parts 22 and 31. However, the resistance value of the conductive parts 22 and 31 may be changed according to JIS K7194: 1994 Method (trade name: Loresta AX MCP-T370 type, manufactured by Mitsubishi Chemical Analytek Co., Ltd.). However, if the conductive parts 22 and 31 are of such a shape or size as to be able to measure the surface resistance value using a non-destructive (thin-film) resistivity meter (product name: EC-80P, The surface resistance value may be measured using a resistivity meter. The method of measuring the surface resistance value of the conductive parts 22 and 31 by the contact type resistivity meter and the method of measuring the surface resistance value of the conductive parts 22 and 31 by the non- The method of measuring the surface resistance value of the conductive part 13 by the non-destructive resistivity meter and the method of measuring the surface resistance value of the conductive part 13 by the non-destructive resistivity meter will not be described here. The terminal shape of the Loresta AX MCP-T370 type is generally an ASP probe (four pins, a pin-to-pin distance of 5 mm, and a pin end curvature radius of 0.37 mm). When the samples obtained from the conductive parts 22 and 31 are small , A PSP probe (four pins, a pin-to-pin distance of 1.5 mm, a pin end curvature radius of 0.26 mm) and a TFP probe (four pins, pin spacing 1 mm, pin end curvature radius 0.04 mm) are preferably used.

<Non-Allocation>

The non-conductive portion 23 is a portion located between the conductive portions 22 and not exhibiting conductivity. As shown in Fig. 7, the non-conductive portion 23 does not substantially contain the conductive fibers 16. [ The phrase &quot; non-conductive parts substantially do not include conductive fibers &quot; in this specification means that even when metal ions are precipitated on the non-conductive part side due to migration of metal ions in the conductive parts, Which means that it may contain some conductive fibers as long as no short circuit occurs. It is preferable that the non-conductive portion 23 does not include the conductive fiber 16 at all. When the conductive fibers 16 are removed from the non-conductive portion 23 by sublimating the conductive fibers 16 with laser light or by wet etching by photolithography as described later, However, this conductive material is not considered to be a conductive fiber since it is not a fibrous material.

Since the film thickness of the non-conductive portion 23 is formed integrally with the conductive portion 21, the film thickness of the non-conductive portion 23 is less than 300 nm even when the base layer or the light-transmitting functional layer is provided or not provided on the light- . The "non-conductive portion film thickness" in this specification refers to a thickness of a non-conductive portion directly on a base portion (a light-transmitting substrate, a base layer, a light-transmitting functional layer, etc.) And means a portion in which it is stacked. The upper limit of the film thickness of the non-conductive portion 23 is more preferably 145 nm or less, 140 nm or less, 120 nm or less, 110 nm or less, 80 nm or less, 50 nm or less, 30 nm or less and 10 nm or less. The lower limit of the film thickness of the non-conductive portion 23 is preferably 10 nm or more. The film thickness of the non-conductive portion 23 is measured by the same method as the film thickness of the conductive portion 22.

As shown in Fig. 7, the non-conductive portion 23 is formed of a light-transmitting resin 15. Fig. The non-conductive portion 23 may be formed by sublimating the conductive fibers 16 and may have a hollow portion 23B in which the conductive fibers are not present. In this case, when the non-conductive portion 23 is formed, the conductive fiber 16 breaks over the region to be non-conductive portion 23 by sublimation and is discharged to the outside, so that the surface of the non-conductive portion 23 is roughened. The light-transmissive resin 15 of the non-conductive portion 23 is the same as the light-transmissive resin 15 of the conductive portion 13, and thus the description thereof is omitted here.

&Lt; Method for producing conductive film &gt;

The conductive film 10 can be manufactured, for example, as follows. First, as shown in Fig. 10 (A), a composition for a light-transmitting functional layer is coated on one side of a light-transmitting substrate 11 and dried to form a coating film 35 of a composition for a light-transmitting functional layer.

The composition for a light-transmitting functional layer contains a polymerizable compound, but if necessary, the inorganic particles, the leveling agent, a solvent, and a polymerization initiator may be added. The composition for a light-transmitting functional layer may contain conventionally known dispersants, surfactants, silane coupling agents, thickeners, thickeners, and the like in accordance with the purpose of increasing the hardness of the light-transmitting functional layer, suppressing curing shrinkage, A colorant, a colorant (pigment, dye), a defoaming agent, a flame retardant, an ultraviolet absorber, an adhesion-imparting agent, a polymerization inhibitor, an antioxidant, a surface modifier, and a lubricant may be added.

<Solvent>

Examples of the solvent include alcohols (methanol, ethanol, propanol, isopropanol, n-butanol, s-butanol, t-butanol, benzyl alcohol, PGME, ethylene glycol and the like), ketones (acetone, methyl ethyl ketone Dihexane, dioxolane, diisopropyl ether dioxane, tetrahydrofuran and the like), aliphatic (aliphatic) alcohols such as benzene, toluene and xylene, aliphatic alcohols such as cyclohexanone, methyl isobutyl ketone, diacetone alcohol, cycloheptanone, Examples of the organic solvent include hydrocarbons such as hexane, alicyclic hydrocarbons such as cyclohexane, aromatic hydrocarbons such as toluene and xylene, halogenated carbons such as dichloromethane and dichloroethane, esters such as methyl formate, methyl acetate, (Such as propyl acetate, propyl acetate, butyl acetate and ethyl lactate), cellosolve (methyl cellosolve, ethyl cellosolve and butyl cellosolve), cellosolve acetates, sulfoxides (Dimethylformamide, di Methyl acetamide, etc.) or mixtures thereof.

<Polymerization Initiator>

The polymerization initiator is a component which is decomposed by light or heat to generate radicals to initiate or advance the polymerization (crosslinking) of the polymerizable compound. The polymerization initiator used in the composition for the light-transmitting functional layer may be a photopolymerization initiator (for example, a photo radical polymerization initiator, a photo cation polymerization initiator, a photo anion polymerization initiator), a thermal polymerization initiator A polymerization initiator, a thermal anion polymerization initiator), or a mixture thereof.

Examples of the photo radical polymerization initiator include benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin ether compounds, thioxanthone, and the like .

IRGACURE 389, IRGACURE 379, IRGACURE 651, IRGACURE 819, IRGACURE 897, IRGACURE 2959, IRGACURE OXE01, lucylline TPO (all manufactured by BASF Japan), NCI-930 (manufactured by ADEKA), and the like, SPEEDCURE EMK (manufactured by Nippon Seibu Heavy Co., Ltd.), benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether (all manufactured by Tokyo Kasei Kogyo Co., Ltd.).

Examples of the photo cationic polymerization initiator include aromatic diazonium salts, aromatic iodonium salts and aromatic sulfonium salts. Examples of commercially available photocationic polymerization initiators include ADEKA OPTOMER SP-150 and ADEKA OPTOMER SP-170 (all manufactured by ADEKA).

Examples of the thermal radical polymerization initiator include peroxides and azo compounds. Among them, a polymeric azo initiator comprising a polymeric azo compound is preferable. Examples of the polymeric azo initiator include those having a structure in which a plurality of units such as polyalkylene oxides and polydimethylsiloxanes are bonded through an azo group.

Examples of the polymeric azo initiator having a structure in which a plurality of units such as polyalkylene oxide are bonded through the azo group include polycondensates of 4,4'-azobis (4-cyanopentanoic acid) and polyalkylene glycols, , Polycondensation products of 4'-azobis (4-cyanopentanoic acid) and polydimethylsiloxane having a terminal amino group, and the like.

Examples of the peroxide include ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, peroxy ester, diacyl peroxide, peroxydicarbonate, and the like.

V-30, V-501, V-601, VPE-0201, VPE (all nitrile-like agents), commercially available products of commercially available thermal radical polymerization initiators include perbutyl O, perhexyl O, perbutyl PV -0401, and VPE-0601 (all manufactured by Wako Pure Chemical Industries, Ltd.).

Examples of the thermal cationic polymerization initiator include various onium salts such as quaternary ammonium salts, phosphonium salts, sulfonium salts and the like. Examples of commercially available thermal cationic polymerization initiators include Adekaoffton CP-66, Adekaoffton CP-77 (all of which are manufactured by ADEKA), Sunaid SI-60L, Sunaid SI-80L, SI-100L (all manufactured by SANSHIN KAGAKU KOGYO CO., LTD.), And CI series (manufactured by NIPPON SODA CO., LTD.).

The content of the polymerization initiator in the composition for a light-transmitting functional layer is preferably 0.5 parts by mass or more and 10.0 parts by mass or less based on 100 parts by mass of the polymerizable compound. When the content of the polymerization initiator is within this range, it is possible to sufficiently maintain the hard coating performance and inhibit curing inhibition.

Examples of the method for applying the composition for a light-transmitting functional layer include known coating methods such as spin coating, dipping, spraying, slide coating, bar coating, roll coating, gravure coating and die coating.

10 (B), the coating film 35 is cured by irradiating or heating the coating film 35 with light such as ultraviolet light to polymerize (crosslink) the polymerizable compound to form a light- Layer 12 is formed.

When ultraviolet rays are used as the light for curing the composition for a light-transmitting functional layer, ultraviolet rays emitted from an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a carbon arc, a xenon arc or a metal halide lamp can be used. As the wavelength of ultraviolet rays, a wavelength range of 190 to 380 nm can be used. Specific examples of the electron beam source include various types of electron beam accelerators such as a Cocloth Walton type, a Vandagraf type, a resonant transformer type, an insulating core transformer type, or a linear type, a dinamitron type, and a high frequency type.

After the light-transmitting functional layer 12 is formed on the light-transmitting substrate 11, the conductive fibers 16 (16) are formed on the surface of the light-transmitting functional layer 12 opposite to the surface on the light- ) And an organic dispersion medium are coated and dried to dispose a plurality of conductive fibers 16 on the light-transmitting functional layer 12 as shown in Fig. 11 (A). The organic-based dispersion medium may contain less than 10% by mass of water. In addition to the conductive fibers 16 and the organic dispersion medium, the conductive fiber-containing composition may contain a resin component comprising thermoplastic resin or polymerizable compound. However, if the content of the resin component in the conductive fiber-containing composition is too large, the resin component enters between the conductive fibers, and the conduction of the conductive portion deteriorates, so that it is necessary to control the content of the resin component. The term &quot; resin component &quot; in this specification means a resin component (resin component) formed in the vicinity of the conductive fiber during the synthesis of the conductive fiber, such as for preventing the self-adhesion of the conductive fibers covering the conductive fiber, (For example, polyvinyl pyrrolidone and the like) constituting the organic protective layer), as well as components that can be polymerized to form a resin, such as a polymerizable compound. The resin component in the conductive fiber-containing composition constitutes a part of the light-transmitting resin 15 after the conductive part 13 is formed.

The organic-based dispersion medium is not particularly limited, but is preferably a hydrophilic organic dispersion medium. Examples of the organic-based dispersion medium include saturated hydrocarbons such as hexane; Aromatic hydrocarbons such as toluene and xylene; Alcohols such as methanol, ethanol, propanol and butanol; Ketones such as acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone, and diisobutyl ketone; Esters such as ethyl acetate and butyl acetate; Ethers such as tetrahydrofuran, dioxane and diethyl ether; Amides such as N, N-dimethylformamide, N-methylpyrrolidone (NMP) and N, N-dimethylacetamide; And halogenated hydrocarbons such as ethylene chloride and chlorobenzene. Of these, alcohols are preferable from the viewpoint of stability of the conductive fiber-containing composition.

Examples of the thermoplastic resin that may be contained in the conductive fiber-containing composition include an acrylic resin; Polyester-based resins such as polyethylene terephthalate; Aromatic resins such as polystyrene, polyvinyl toluene, polyvinyl xylene, polyimide, polyamide, and polyamideimide; Polyurethane resins; Epoxy resin; Polyolefin resin; Acrylonitrile-butadiene-styrene copolymer (ABS); Cellulose based resin; Polyvinyl chloride resins; Polyacetate-based resin; Polynorbornene-based resins; Synthetic rubber; Fluorine-based resins, and the like.

The polymerizable compound which may be contained in the conductive fiber-containing composition may be the same as the polymerizable compound described in the column of the light-transmitting functional layer 12, and thus the description thereof will be omitted here.

After arranging a plurality of conductive fibers 16 on the light-transmitting functional layer 12, a composition for a light-transmitting resin containing a polymerizable compound and a solvent is applied and dried, Thereby forming a coating film 36 of a composition for a light-transmitting resin as described above. The composition for a light-transmitting resin includes a polymerizable compound and a solvent, but in addition, a polymerization initiator and the reaction inhibitor may be added, if necessary. Here, although it is possible to add the reaction inhibitor to the conductive fiber-containing composition, if the reaction inhibitor is added to the conductive fiber-containing composition, the surface of the conductive fiber is covered with the reaction inhibitor before the conductive fiber forms a network structure, The conductivity may be deteriorated. Therefore, it is preferable to add the reactive inhibitor to the light-transmitting resin composition.

Then, as shown in Fig. 12A, the coating film 36 is cured by irradiating ionizing radiation such as ultraviolet rays to the coating film 36 to polymerize (crosslink) the polymerizable compound to form the light-transmitting resin 15 ).

In the conductive film 10 shown in Fig. 1, since the conductive portion 13 is a solid film, the conductive film 10 is obtained in the above process. Since the conductive film 20 shown in Fig. 5 is patterned, the patterning step will be described below.

A laser beam (for example, an infrared laser) is irradiated to a region to be a non-conductive portion 23 as shown in FIG. 12 (B) 13 are patterned. When the region to be non-conductive portion 23 is irradiated with the laser beam, the conductive fiber 16 included in this region sublimates by the heat of the laser beam. The sublimed conductive fibers 16 break through the light-transmitting resin 15 and are emitted to the outside of the light-transmitting resin 15. Thereby, the conductive film 10 having the conductive parts 13 and the non-conductive parts 23 shown in Fig. 1 can be obtained. In this case, the conductive part 13 is patterned by irradiating laser light. However, the conductive fiber 16 can also be removed from the area to be made the non-conductive part 23 by photolithography, Patterning of the conductive parts 13 may be performed.

According to the present embodiment, the conductive fibers 16 in the conductive parts 13, 22, and 31 are made to have a light transmittance (light transmittance) that is half the thickness HL of the conductive parts 13, 22, The contact points of the conductive fibers 16 can be increased. Thus, even when the content of the conductive fiber 16 is small, electrical conduction from the surface 13A of the conductive portion 13 or the surfaces of the conductive portions 22 and 31 can be ensured, It is possible to realize a low surface resistance value. In addition, since the content of the conductive fiber 16 can be reduced, a low haze value of 5% or less can be realized.

According to the present embodiment, the conductive fibers 16 in the conductive portions 13, 22, and 31 are entirely made of the conductive fibers 16 as the entire conductive fibers 16, The conductive portions 13, 22, and 31 are formed so as to be located on the side of the light transmitting base material 11 more than the position HL of half the film thickness of the conductive portions 13, 22, and 31, A low haze value of 5% or less and a low surface resistance value of 200 Ω / □ or less can be realized even when the film thickness is made thinner than 300 nm or extremely thinner than 145 nm.

According to the present embodiment, the conductive fibers 16 are distributed on the side of the light-transmitting base material 11 with respect to the positions HL of the conductive portions 13, 22, 31 half the thickness of the conductive portions 13, 22, 31 Therefore, most of the conductive fibers 16 are covered with the light-transmitting resin 15. As a result, it is possible to suppress the decrease in the conductivity of the conductive fiber 16 due to the reaction of the atmosphere with air, sulfur, oxygen, and / or halogen.

According to the present embodiment, the conductive fibers 16 are distributed on the side of the light-transmitting base material 11 with respect to the positions HL of the conductive portions 13, 22, 31 half the thickness of the conductive portions 13, 22, 31 Therefore, it is possible to obtain a surface resistance value as good as possible with a minimum of conductive fibers. Further, if the conductive fibers 16 are so localized, the optical characteristics of a lower haze value can be obtained. The reason why the conductive fibers 16 are unevenly distributed is that it is easier to adjust the hardness of the martens than when the conductive fibers 16 are in a dispersed state. In addition, since the conductive fibers 16 are present in the light-transmitting resin 15 in a dense manner, the hardness can be increased. Further, when considering the composition of the light-transmitting resin 15, Can be obtained. Further, when the Martens hardness is appropriate, flexibility in folding or rolling can be improved. That is, by combining the respective characteristics of the present invention, properties according to necessity can be imparted to various uses.

Even in the case of a conventional conductive film, there is a conductive film comprising a conductive part, a light-transmitting resin and conductive fibers arranged in the light-transmitting resin. In the conductive part of the conductive film, however, conductive fibers and conductive fibers Containing composition is used to form a conductive part. Here, in the conductive fiber-containing composition used in the conventional conductive portion, an aqueous dispersion medium is mainly used as the dispersion medium. In the present specification, the term "aqueous dispersion medium" means a dispersion medium in which the concentration of water in the dispersion medium is 10% by mass or more. In the case of using an aqueous dispersion medium, the content of the resin component in the conductive fiber-containing composition is increased from the viewpoints of storage stability and coating film uniformity upon application. Therefore, even if a conductive part is formed by using the conductive fiber-containing composition, it is currently impossible to distribute the conductive fiber as a whole of the conductive fiber from the half of the thickness of the conductive part to the side of the light- On the other hand, when an organic-based dispersion medium is used as the dispersion medium, the coating film uniformity upon application is excellent, so that the content of the resin content can be reduced. In the present embodiment, even when the organic-based dispersion medium is used as the dispersion medium of the conductive fiber-containing composition and the resin fiber content is not contained in the conductive fiber-containing composition or the resin fiber content is included, the content of the resin fiber content is reduced, The conductive fibers 16 can be distributed to the side of the light transmitting base material 11 more than the position HL of the half of the thickness of the conductive portions 13, 22 and 31 in the conductive portions 13, 22 and 31, The thickness of the portions 13, 22, and 31 can be made thinner than 300 nm, and the thickness can be extremely reduced to 145 nm or less.

When the conductive film is formed using the conductive fiber, there is a possibility that the electric resistance value becomes different depending on the direction in the plane of the conductive portion. There is a fear that the design of the electrode pattern must be changed when the conductive film is used as the sensor electrode of the touch panel. Further, there is a restriction on the chamfering, Waste is likely to occur. The present inventors have found that when a conductive part including conductive fibers is formed on a light-transmitting substrate in a coating method (in particular, a roll-to-roll method), conductive fibers are arranged along the flow direction (MD direction) of the light- The electric resistance value in the MD direction is lowered while the electric resistance value in the direction (TD direction) perpendicular to the MD direction in the surface of the conductive portion tends to become higher than the electric resistance value in the MD direction. , It is found that a difference in electric resistance value depending on the in-plane direction occurs. The first direction, which is the direction in which the electrical resistance value is the lowest, is likely to be less than 30 degrees in the MD direction or the MD direction, though it may vary depending on the determination method of an arbitrary direction AD. Therefore, when the first direction is the MD direction, the second direction orthogonal to the first direction is the TD direction. According to the present embodiment, the conductive portion 13 is directly provided on the light-transmitting base 11 by the coating and spreading method. However, if the electrical resistance value ratio of the conductive portion 13 is less than 1 and less than 2 , It is possible to reduce the difference in electric resistance value depending on the in-plane direction of the conductive portion 13. As a result, when the conductive film is used for the sensor electrode of the touch panel, restrictions on the electrode pattern and the IC chip are reduced, and restrictions on chamfering are reduced.

On the other hand, the use of image display apparatuses has been gradually expanded, and image display apparatuses of various shapes (for example, elongated shapes) have been developed. Depending on the shape of the image display apparatus, it may be preferable to conduct a large amount of electric current mainly in a specific direction without being uniform in the two-dimensional direction. For this reason, the electric resistance value of the conductive film embedded in the image display device in a specific direction in the plane may be low, and the electric resistance value in the other direction may be high. According to the present embodiment, when the electrical resistance value ratio in the conductive portion 13 is 2 or more, the electrical resistance value is high in the second direction, but the electrical resistance value is low in the first direction . Therefore, it is possible to provide the conductive film 30 having a lower electric resistance value in a specific direction (first direction).

According to the present embodiment, since the light-transmitting resin 15 of the conductive portions 13, 22, and 31 contains the reaction inhibitor, the conductive fibers (for example, 16 can be further suppressed.

When the conductive film is embedded in the image display apparatus, the conductive portion is brought into contact with the light-transmitting adhesive layer. However, in the state where the conductive portion is in contact with the light-transmitting adhesive layer, Sensitive adhesive layer is left under an environment of 85% relative humidity or higher in a high-temperature and high-humidity environment for 240 hours, depending on the type of the light-transmitting adhesive layer, the conductive fibers may be contained in the light- An additive added to the acid component or the adhesive layer constituting the adhesive layer itself) and the surface resistance value of the conductive portion may rise. In contrast, according to the present embodiment, since the reaction inhibitor is contained in the conductive portions 13, 22, and 31, the heat and humidity resistance test is performed in the state that the conductive portions 13, 22, and 31 are in contact with the light- The reaction of the conductive fiber 16 with the components in the light-transmitting adhesive layer can be suppressed. This makes it possible to widen the selection of the light-transmitting adhesive layer.

The use of the conductive film according to the present embodiment is not particularly limited, but it can be used in an image display apparatus provided with a touch panel. Further, the conductive film can be used, for example, as an electromagnetic wave shield. Fig. 13 is a schematic plan view of the image display apparatus according to the present embodiment, Fig. 14 is a schematic plan view of the touch panel according to the present embodiment, Fig. 15 is a partial enlargement .

<<< Image display device >>>

13, the image display device 40 mainly includes a display panel 50 for displaying an image, a backlight device 60 disposed on the back side of the display panel 50, A touch panel 70 disposed closer to the observer than the touch panel 50 and a light permeable adhesive layer 90 interposed between the display panel 50 and the touch panel 70. [ The image display apparatus 40 is provided with the backlight device 60 and the backlight device 60 may be provided depending on the type of the display panel (display element). In this embodiment, the display panel 50 is a liquid crystal display panel, It may not be provided.

<< Display panel >>

13, the display panel 50 includes a protective film 51 such as a triacetylcellulose film (TAC film) or a cycloolefin polymer film, a polarizer (not shown) 52, a protective film 53, a light-transmitting adhesive layer 54, a display element 55, a light-transmitting adhesive layer 56, a protective film 57, a polarizer 58 and a protective film 59 And has a laminated structure. The display panel 50 may be provided with the display element 55 and may not be provided with the protective film 51 or the like.

The display element 55 is a liquid crystal display element. However, the display element 55 is not limited to the liquid crystal display element but may be a display element using, for example, an organic light emitting diode (OLED), an inorganic light emitting diode, and / or a quantum dot light emitting diode (QLED). The liquid crystal display element is formed by arranging a liquid crystal layer, an orientation film, an electrode layer, a color filter, and the like between two glass substrates.

<< Backlight device >>

The backlight device 60 illuminates the display panel 50 from the rear side of the display panel 50. [ As the backlight device 60, a known backlight device may be used, and the backlight device 60 may be either an edge light type or a direct-type backlight device.

<< Touch panel >>

The touch panel 70 includes a conductive film 80, a conductive film 20 disposed on the observer side of the conductive film 80, and a light-transmissive cover 70 such as a cover glass disposed on the observer side of the conductive film 20, Transparent adhesive layer 72 interposed between the conductive film 80 and the conductive film 10 and a light-permeable adhesive layer 72 interposed between the conductive film 20 and the light- Layer 73 as shown in Fig.

&Lt; Conductive film &

The conductive film 80 has substantially the same structure as the conductive film 20. 13, the conductive film 80 includes a light-transmitting base material 81, a light-transmitting functional layer 82 provided on one side of the light-transmitting base material 81, and a light- 82 provided on a surface opposite to the surface on the side of the light-transmitting base material 81, and provided with patterned conductive portions 84. The conductive portion 84 is a part of the conductive layer 83. The conductive layer 83 is composed of a plurality of conductive portions 84 and a non-conductive portion 85 positioned between the conductive portions 84. The light-permeable base material 81 is the same as the light-transparent base material 11 and the light-permeable functional layer 82 is the same as the light-transparent functional layer 82, so the description thereof is omitted here.

(Conductive portion and non-conductive portion)

The conductive portion 84 has the same structure as the conductive portion 22. That is, as shown in Fig. 15, the conductive portion 84 is composed of the light-transmitting resin 86 and the conductive fiber 87. The non-conductive portion 85 is made of the light-transmitting resin 86, and substantially does not contain the conductive fiber 87. The non-conductive portion 85 shown in Fig. 15 has a cavity 85A in the light-transmissive resin 86 like the non-conductive portion 23. As shown in Fig. The conductive fibers 87 are located on the side of the light transmitting base material 81 at a position HL which is half the film thickness of the conductive parts 84 and are electrically conductive from the surface 84A of the conductive parts 84 .

The conductive portion 84 functions as an electrode in the Y direction in the projection type capacitive touch panel. As shown in Fig. 14, the conductive portion 84 includes a plurality of sensor portions 84B, And a terminal portion (not shown) connected thereto. The sensor portion 84B has the same structure as the sensor portion 84B, but extends in the Y direction. The conductive portion 84 has the same structure as that of the conductive portion 13, but the conductive portion 84 does not necessarily have to have the same structure as the conductive portion 22.

&Lt; Light-permeable adhesive layer &

Examples of the light-transmitting adhesive layers 72 and 73 include adhesive sheets such as OCA (Optical Clear Adhesive). Instead of the light-transmitting adhesive layers 72 and 73, a light-transmitting adhesive layer may be used.

<< Light-permeable adhesive layer >>

The light-permeable adhesive layer 90 is interposed between the display panel 50 and the touch panel 70 and also adhered to both the display panel 50 and the touch panel 70. Thereby, the display panel 50 and the touch panel 70 are fixed. The light-permeable adhesive layer 90 is composed of a liquid curable composition for a curable adhesive layer containing a polymerizable compound such as, for example, OCR (Optically Clear Resin).

The thickness of the light-permeable adhesive layer 90 is preferably 10 탆 or more and 150 탆 or less. If the thickness of the light-transmissive adhesive layer is less than 10 mu m, the thickness of the light-transmissive adhesive layer tends to be too small, It enters too much. The film thickness of the light-permeable adhesive layer is determined as an arithmetic mean value of the film thicknesses at ten positions measured at 10 positions randomly from the cross-sectional photograph of the light-transmitting adhesive layer photographed using an optical microscope. Instead of the light-transmitting adhesive layer 90, a light-transmitting adhesive layer may be used.

[Second Embodiment]

Hereinafter, a conductive film, a touch panel, and an image display device according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 16 is a schematic structural view of the conductive film according to the present embodiment, Fig. 17 is a partially enlarged view of the conductive film shown in Fig. 16, Fig. 18 is a schematic structural view of another conductive film according to this embodiment, 19 is a partially enlarged view of the conductive film shown in Fig.

<<< Conductive Film >>>

The conductive film 100 shown in Fig. 16 has a light-transmissive substrate 101, a light-transmissive functional layer 102 provided on one side of the light-transmissive substrate 101, And a conductive portion 103 provided on a surface of the base 102 opposite to the surface on the side of the light-transparent base 101. [ It is to be noted that the conductive film 100 may be provided with the light-transmitting base material 101 and the conductive portion 103 and may not be provided with the light-transmitting functional layer 102. Permeable functional layer 102 is provided between the light-transmissible base 101 and the conductive portion 103. The light-transmissive functional layer is provided between the light-transmissive base 101 and the conductive portion 103, Transmissive base material 101 may be provided on the surface opposite to the surface on the side of the conductive portion 103 side and may be provided between the light-transmissive base material 101 and the conductive portion 103 and between the light- Or may be provided on both sides of the surface on the side opposite to the surface on the side of the conductive portion 103 in the case of FIG. In the conductive film 100 shown in Fig. 16, the conductive portions 103 are provided only on one side, but conductive portions may be provided on both sides of the conductive film.

The haze value (total haze value) of the conductive film 100 is 5% or less for the same reason as that described in the column of the conductive film 10. The haze value of the conductive film (100) can be measured by the same method as the haze value of the conductive film (10). The haze value of the conductive film 100 is preferably 3% or less, 2% or less, 1.5% or less, 1.2% or less, or 1.1% or less.

The total light transmittance of the conductive film 100 is preferably 80% or more for the same reason as that described in the column of the conductive film 10. The total light transmittance of the conductive film 100 can be measured by the same method as the total light transmittance of the conductive film 10. The total light transmittance of the conductive film 10 is more preferably not less than 85%, not less than 88% and not less than 89% (more preferably, the larger the numerical value is).

<< Light-transmitting resin base material >>

The light-transmitting substrate 101 is not particularly limited as long as it is a substrate made of a resin having light transmittance. The light-transmitting base material 101 is the same as the light-transmitting base material 11. Therefore, the constituent material and thickness of the light-transmitting base material 101 are the same as the constituent material and thickness of the light-transmitting base material 11. The light-transmitting base material 101 is the same as the light-transmitting base material 11, and therefore a description thereof will be omitted.

<< Light-transmitting functional layer >>

The light-transmitting functional layer 102 is disposed between the light-transmitting base 101 and the conductive portion 103. The light-transmitting functional layer 102 is the same as the light-transmitting functional layer 12. The specific examples of the light-transmitting functional layer 102, the pencil hardness, the film thickness, the constituent materials and the additives are the same as the specific examples of the light-transmitting base 11, the pencil hardness, the film thickness, the constituent materials and the additives. Since the light-transmitting functional layer 102 is the same as the light-transmitting functional layer 12, a description thereof will be omitted here.

<< Conductive parts >>

The surface 103A of the conductive portion 103 constitutes the surface 100A of the conductive film 100. [ The conductive portion 103 includes a light-transmitting resin 104 and a plurality of conductive fibers 105 disposed in the light-transmitting resin 104, as shown in Fig. The conductive portion 103 preferably further includes a reaction inhibitor present in the light-transmitting resin 104.

The electric resistance value in the six directions is measured at a predetermined size every 30 degrees including the arbitrary direction in an arbitrary direction in the surface 103A of the conductive portion 103 and the lowest electric resistance value (Hereinafter referred to as &quot; ratio of electrical resistance in the first direction to electrical resistance in the second direction &quot;) is defined as a first direction, and a direction orthogonal to the first direction is referred to as a second direction Quot; ratio of electric resistance value &quot;) is 1 or more and less than 2. The ratio of the electrical resistance values can be obtained by the same method as the method of measuring the electrical resistance values described in the column of the conductive portions 13. The upper limit of the ratio of the electric resistance value is preferably 1.8 or less, 1.5 or less, 1.3 or less, or 1.2 or less (the smaller the number is, the more preferable).

The conductive portion 103 having such an electric resistance value ratio of 1 or more and less than 2, for example, can be formed by, for example, adjusting the fiber length of the conductive fiber 105 to be described later, the type and thickness of the resin constituting the organic protective layer Containing composition according to the present invention.

The conductive portion 103 is electrically conductible from the surface 103A of the conductive portion 103. [ Whether or not the conductive portion is electrically conductive from the surface of the conductive portion can be determined by measuring the surface resistance value of the conductive portion 103 as in the case of the conductive portion 13. A method of measuring the surface resistance value of the conductive portion 103 and a criterion for determining whether or not the conductive portion 103 is electrically conductive from the surface 103A of the conductive portion 103 can be determined by using the surface described in the column of the conductive portion 13 The method of measuring the resistance value, and the judgment standard, and thus the description thereof will be omitted here. As described later, most of the conductive fibers 105 exist on the side of the light-transmitting base material 101 at a position HL which is half of the film thickness of the conductive parts 103. The other conductive fibers 105 are light- Is present on the side of the surface 103A from the position HL which is half the film thickness of the conductive part 103 by being superimposed on the conductive fiber 105 existing on the side of the base 101, And therefore, the conductive portion 103 is electrically conductive from the surface 103A.

It is preferable that the conductive fiber 105 is located on the side of the light transmitting base 101 at a position HL which is half the film thickness of the conductive portion 103 as shown in Fig. Whether or not the conductive fiber 105 is unevenly distributed on the side of the light transmitting base material 101 with respect to the half position HL of the film thickness of the conductive portion 103 is determined by the determination method described in the column of the conductive portion 13, Description thereof will be omitted. Further, the presence ratio of the conductive fibers positioned on the light-transmitting substrate side from the half of the film thickness of the conductive portion obtained from the cross-sectional photograph taken by using the scanning transmission electron microscope (STEM) or the transmission electron microscope (TEM) is 70% , And 80% or more (the larger the number is, the more preferable).

The surface resistance value of the conductive portion 103 is 200? /? Or less for the same reason as described in the column of the conductive portion 13. The surface resistance value of the conductive portion 103 is a surface resistance value of the surface 103A of the conductive portion 103. [ The surface resistance value of the conductive portion 103 can be measured by the same method as the surface resistance value of the conductive portion 13. The lower limit of the surface resistance value of the conductive portion 103 is preferably in the order of 1? / Square, 5? / Square and 10? / Square or more The upper limit is more preferably 100 Ω / □ or less, 70 Ω / □ or less, 60 Ω / □ or less, and 50 Ω / □ or less (the smaller the number is, the better).

The thickness of the conductive portion 103 is preferably less than 300 nm from the viewpoint of thinning. The film thickness of the conductive portion 103 can be measured by the same method as the film thickness of the conductive portion 13. The upper limit of the film thickness of the conductive portion 103 is more preferably 145 nm or less, 140 nm or less, 120 nm or less, 110 nm or less, 80 nm or less, and 50 nm or less. The lower limit of the film thickness of the conductive portion 103 is preferably 10 nm or more for the same reason as described in the column of the conductive portion 13.

The conductive portion 103 preferably has a Martens hardness of 970 N / mm 2 to 1050 N / mm 2 at a position where the amount of indentation from the surface 103 A is 10 nm, for the same reason as described in the column of the conductive portion 13 Do. The lower limit of the Martens hardness at the position where the press-in amount of the conductive portion 103 is 10 nm is more preferably 980 N / mm2 or more, 1000 N / mm2 or more and 1015 N / mm2 or more in order (preferably, The upper limit of the hardness of the martensite at the position where the amount is 10 nm is more preferably 1040 N / mm 2 or less, 1030 N / mm 2 or less, and 1020 N / mm 2 or less.

The conductive portion 103 preferably has a Martens hardness of 130 N / mm &lt; 2 &gt; or more and 300 N / mm &lt; 2 &gt; or less at a position where the amount of indentation from the surface 103A is 100 nm, for the same reason as described in the column of the conductive portion 13 Do. The lower limit of the Martens hardness at the position where the indentation depth of the conductive portion 103 is 100 nm is more preferably in the order of 140 N / mm 2 or more, 150 N / mm 2 or more and 170 N / mm 2 or more (preferably, The upper limit of the hardness of the martensite at the position where the amount is 100 nm is more preferably 280 N / mm 2 or less, 250 N / mm 2 or less, and 200 N / mm 2 or less.

&Lt; Transparent resin >

The light-transmitting resin 104 prevents the conductive fibers 105 from separating from the conductive parts 103 and improves the durability and scratch resistance of the conductive parts 103, as in the case of the light- The conductive fiber 105 is covered so that electric conduction can be obtained from the surface 103A of the conductive portion 103. In this embodiment, The light-transmitting resin (104) is the same as the light-transmitting resin (15). Therefore, the film thickness and constituent material of the light-transmitting resin 104 are the same as those of the light-transmitting resin 15 and the constituent material. Since the light-transmitting resin 104 is the same as the light-transmitting resin 15, the description thereof will be omitted here.

<Reaction inhibitor>

The reaction inhibitor is intended to suppress the decrease in conductivity due to the reaction of the conductive fiber 105 with the substance in the atmosphere after application of the composition for light-transmitting resin. The reaction inhibitor and its content are the same as those of the reaction inhibitor and the content thereof described in the first embodiment, and thus the description thereof will be omitted here.

&Lt; Conductive fiber &

The conductive fiber 105 is electrically conductive from the surface 103A of the conductive portion 103 when the conductive fiber 105 is localized on the side of the light transmitting base material 101 at a position HL which is half the film thickness of the conductive portion 103 Therefore, the conductive fibers 105 are in contact with each other in the thickness direction of the conductive portion 103.

The conductive fibers 105 are brought into contact with each other at the side of the light transmitting base material 101 at a position HL which is half the film thickness of the conductive parts 103 so that the network structure Structure) is preferably formed. By forming the network structure of the conductive fibers 105, even a small amount of the conductive fibers 105 can efficiently form a conductive path.

It is preferable that some of the conductive fibers 105 are exposed on the surface 103A of the conductive portion 103. [ It can be judged that some of the conductive fibers 105 are exposed on the surface 103A of the conductive portion 103 when electrical conduction is obtained from the surface 103A of the conductive portion 103 by the above measurement method .

The fiber diameter of the conductive fiber 105 is preferably 200 nm or less for the same reason as described for the conductive fiber 16. A more preferable lower limit of the fiber diameter of the conductive fiber 105 is 10 nm or more from the viewpoint of conductivity of the conductive portion 103 and a more preferable range of the fiber diameter of the conductive fiber 105 is 15 nm or more and 180 nm or less. The fiber diameter of the conductive fiber 105 can be obtained by the same method as the fiber diameter of the conductive fiber 16.

The fiber length of the conductive fiber 105 is preferably 1 m or more and less than 30 m. If the fiber length of the conductive fiber 105 is less than 1 占 퐉, the surface resistance value becomes high, so that there is a possibility that a conductive part having sufficient conductivity can not be formed. It is also conceivable to increase the addition amount of the conductive fibers less than 1 占 퐉 in order to lower the surface resistance value. However, when the amount of the conductive fibers to be added is increased, the surface resistance value decreases. However, There is a possibility of causing it. If the fiber length of the conductive fiber 105 is 30 占 퐉 or more, it is easy to arrange the conductive fibers along the MD direction to be described later, so that the difference in electric resistance value depending on the in-plane direction tends to increase, There is a fear that it becomes difficult to apply the conductive part when forming the conductive part. The lower limit of the fiber length of the conductive fiber 105 is preferably 10 mu m or more, and the upper limit is preferably 20 mu m or more. The fiber length of the conductive fiber 105 can be obtained by the same method as the fiber length of the conductive fiber 16.

The fibers constituting the conductive fibers 105 are the same as the fibers constituting the conductive fibers 16, and thus the description thereof is omitted here.

<< Other conductive films >>

The conductive film 100 shown in Fig. 16 is a film in which the conductive portion 103 is not patterned, that is, a so-called solid film, but the conductive portion may be patterned depending on the application. Concretely, the conductive film is a conductive film having conductivity (112) including a plurality of conductive portions 112 and a conductive layer 111 composed of a non-conductive portion 113 located between the conductive portions 112 as shown in Fig. 18 The film 110 may be a conductive film having a plurality of conductive portions and a gap existing between the conductive portions as in Fig. The surface 110A of the conductive film 110 is composed of the surface 112A of the conductive portion 112 and the surface 113A of the non-conductive portion 113, and the surface of the conductive film having voids between the conductive portions Is composed of the surface of the conductive portion and one surface of the light-transmitting functional layer. The physical property values of the conductive film 110 and the conductive film having a gap between the conductive portions are the same as those of the conductive film 100. [ In Fig. 18, the members denoted by the same reference numerals as those in Fig. 16 are the same as the members shown in Fig. 16, and a description thereof will be omitted.

<Conductive part>

The conductive portion 112 is the same as the conductive portion 103 except that it is patterned. 19, the conductive portion 112 includes a light-transmitting resin 104 and a plurality of conductive fibers 105 disposed in the light-transmitting resin 104. In this case, The conductive portion 112 is electrically conductive from the surface 112A. It is preferable that the conductive fiber 105 is located on the side of the light transmitting base material 101 at a position HL which is half the film thickness of the conductive portion 112 as shown in Fig. Other configurations, materials, physical values, etc. of the conductive portion 112 are the same as those of the conductive portion 10, and thus the description thereof will be omitted here.

<Non-Allocation>

The non-conductive portion 113 is a portion located between the conductive portions 112 and not exhibiting conductivity. As shown in Fig. 19, the non-conductive portion 113 does not substantially contain the conductive fibers 105. [

Since the non-conductive portion 113 is formed integrally with the conductive portion 112, it is preferable that the non-conductive portion 113 has a thickness of less than 300 nm. The upper limit of the film thickness of the non-conductive portion 23 is more preferably 145 nm or less, 140 nm or less, 120 nm or less, 110 nm or less, 80 nm or less, and 50 nm or less. The lower limit of the film thickness of the non-conductive portion 23 is preferably 10 nm or more. The film thickness of the non-conductive portion 113 is measured by the same method as the film thickness of the conductive portion 103. [

As shown in Fig. 19, the non-conductive portion 113 is formed of a light-transmitting resin 104. [ The non-conductive portion 113 may be formed by sublimating the conductive fibers 105, and may have a cavity 113B in which no conductive fibers are present. In this case, when the non-conductive part 113 is formed, the conductive fiber 105 breaks over the area to be non-conductive part 113 by sublimation and is discharged to the outside, so that the surface 113A of the non-conductive part 113 is roughened do. The light-transmissive resin 104 of the non-conductive portion 113 is the same as the light-transmissive resin 104 of the conductive portion 103, and thus the description thereof is omitted here.

&Lt; Method for producing conductive film &gt;

The conductive film 100 can be manufactured, for example, as follows. First, a composition for a light-transmitting functional layer is applied to one surface of a light-transmitting substrate 11 and dried to form a coating film of a composition for a light-transmitting functional layer. The composition for a light-transmitting functional layer is the same as the composition for a light-transmitting functional layer used in the first embodiment, and thus the description thereof is omitted here.

Subsequently, the coating film is cured by irradiating the coating film with ionizing radiation such as ultraviolet rays or by heating to polymerize (crosslink) the polymerizable compound to form the light-transmitting functional layer 102.

After the light-transmitting functional layer 102 is formed on the light-transmitting substrate 101, the conductive fibers 105 (105) are formed on the surface of the light-transmitting functional layer 102 opposite to the surface on the light- ) And an organic dispersion medium are coated and dried to dispose a plurality of conductive fibers 105 on the light-transmitting functional layer 102. The conductive fiber-containing composition is the same as the conductive fiber-containing composition used in the first embodiment, and thus the description thereof is omitted here.

After a plurality of conductive fibers 105 are disposed on the light-transmitting functional layer 102, a composition for a light-transmitting resin containing a polymerizable compound and a solvent is applied on the conductive fibers 105 and dried to form a light- Thereby forming a coating film of the composition for a resin. The composition for a light-transmitting resin is the same as the composition for a light-transmitting resin used in the first embodiment, and thus a description thereof will be omitted here.

Subsequently, the coating film is irradiated with ionizing radiation such as ultraviolet rays to polymerize (crosslink) the polymerizable compound to cure the coating film, thereby forming the light-transmitting resin 104. Thereby, the conductive film 10 shown in Fig. 16 can be obtained. Since the conductive film 110 shown in Fig. 18 is patterned, laser light (for example, an infrared laser) is irradiated to the region to be non-conductive portion 113, for example, as in the first embodiment , And the conductive portion 112 are patterned.

According to the present embodiment, the conductive portions 103 and 112 are formed on the light-transmitting base material 101 in accordance with the application method. However, when the electrical resistance value ratio of the conductive portions 103 and 112 is 1 to less than 2 The difference in electric resistance value depending on the in-plane directions of the conductive portions 103 and 112 can be reduced for the same reason as described in the first embodiment. Thus, when the conductive film is used for the sensor electrode of the touch panel, there is no need to change the pattern design of the sensor electrode of the touch panel due to the restriction of the electrode pattern or the IC chip.

The conductive fiber 105 in the conductive portions 103 and 112 in the conductive portions 103 and 112 is positioned at a position HL which is half the film thickness of the conductive portions 103 and 112 as the entire conductive fiber 105. [ The contact points between the conductive fibers 105 can be increased. Thus, even when the content of the conductive fiber 105 is small, the surfaces 103A and 112A of the conductive portion 103 are exposed through the conductive fibers 105 exposed on the surfaces 103A and 112A of the conductive portions 103 and 112, , It is possible to realize a lower surface resistance value. Further, since the content of the conductive fiber 105 can be reduced, a low haze value of 5% or less can be realized.

According to the present embodiment, the conductive fibers 105 in the conductive portions 103 and 112 are electrically connected to the conductive portions 105 as the entire conductive fibers 105. As a result, The contact points of the conductive fibers 105 are increased so that the film thicknesses of the conductive parts 103 and 112 are set to be smaller than the film thickness of the conductive parts 103 and 112 A low haze value of 5% or less and a low surface resistance value of 200? /? Or less can be realized even when the thickness is reduced to less than 300 nm or to an extremely small thickness of 145 nm or less.

According to the present embodiment, when the conductive fiber 105 is located on the side of the light-transmitting base material 101 at a position HL which is half the thickness of the conductive portion 103 in the conductive portion 103, the conductive fiber 105 Is covered with the light-transmitting resin 104. The light- As a result, corrosion of the conductive fibers 105 due to sulfur or oxygen in the air can be reduced.

The conductive fiber 105 in the conductive portions 103 and 112 in the conductive portions 103 and 112 is positioned at a position HL which is half the film thickness of the conductive portions 103 and 112 as the entire conductive fiber 105. [ It is possible to obtain a surface resistance value as good as possible with a minimum of conductive fibers. Further, if the conductive fiber 105 is so localized, a lower haze value optical characteristic can be obtained. The reason why the conductive fibers 105 are localized is that it is easier to adjust the hardness of the martens than when the conductive fibers 105 are in a dispersed state. Further, since the conductive fiber 105 is present in the light-transmitting resin 104 in a dense manner, the hardness can be increased. Further, when the composition of the light-transmitting resin 104 is considered, Can be obtained. Further, when the Martens hardness is appropriate, flexibility in folding or rolling can be improved.

In the present embodiment, even when the organic-based dispersion medium is used as the dispersion medium of the conductive fiber-containing composition and the resin fiber content is not contained in the conductive fiber-containing composition or the resin fiber content is included, the content of the resin fiber content is reduced, The conductive fibers 105 in the conductive portions 103 and 112 are located on the side of the light transmitting base material 101 with respect to the position HL at half the thickness of the conductive portions 103 and 112 in the conductive portions 103 and 112 for the same reason as described in the first embodiment. .

According to the present embodiment, since the light-transmitting resin 104 of the conductive portions 103 and 112 contains the reaction inhibitor, the conductive fibers 105 due to reaction with sulfur, oxygen, and / It is possible to further suppress the deterioration of the conductivity of the capacitor.

According to the present embodiment, since the reaction inhibiting agent is contained in the conductive portions 103 and 112, in the state in which the light-transmitting adhesive layer is in contact with the conductive portions 103 and 112 for the same reason as described in the first embodiment, The reaction between the conductive fiber 105 and the component in the light-transmitting adhesive layer can be suppressed even when the thermal test is performed. This makes it possible to widen the selection of the light-transmitting adhesive layer.

According to the present embodiment, since the conductive fiber 105 is used, it is possible to provide the conductive film 10 which is unlikely to be broken even when it is bent, unlike ITO. For this reason, it is also possible to use the conductive films 100 and 110 by being foldable (foldable) or embedded in an image display device.

In the above description, the conductive films 100 and 110 are described. However, the conductive film having a gap between the conductive parts can have the same effect as the conductive films 100 and 110.

The conductive film 100 of the present embodiment can be used, for example, in an image display apparatus. 20 is a schematic configuration diagram of an image display apparatus according to the present embodiment. In Fig. 20, the members having the same reference numerals as those in Fig. 13 are the same as the members shown in Fig. 13, and a description thereof will be omitted.

<<< Image display device >>>

20, the image display apparatus 120 mainly includes a display panel 50 for displaying an image, a backlight device 60 disposed on the back side of the display panel 50, A touch panel 130 disposed closer to the observer than the touch panel 50 and a light transmissive adhesive layer 90 interposed between the display panel 50 and the touch panel 130. The image display apparatus 40 is provided with the backlight device 60 and the backlight device 60 may be provided depending on the type of the display panel (display element). In this embodiment, the display panel 50 is a liquid crystal display panel, It may not be provided.

<< Touch panel >>

The touch panel 130 includes a conductive film 140 and a conductive film 110 disposed on the observer side of the conductive film 140 and a light transmitting cover 110 such as a cover glass disposed on the observer side of the conductive film 110. [ Transparent adhesive layer 72 interposed between the conductive film 140 and the conductive film 110 and a light-permeable adhesive layer 72 interposed between the conductive film 110 and the light- Layer 73 as shown in Fig.

&Lt; Conductive film &

The conductive film 140 has substantially the same structure as that of the conductive film 110. 20, the conductive film 140 includes a light-transmitting base material 141, a light-transmitting functional layer 142 provided on one side of the light-transmitting base material 141, and a light- 142 provided on the surface opposite to the surface on the side of the light-transmitting base material 141 and having a patterned conductive portion 134. [ The conductive portion 134 is a part of the conductive layer 143. The conductive layer 143 is composed of a plurality of conductive portions 134 and a non-conductive portion 135 located between the conductive portions 134. The light-transmissive base layer 141 is the same as the light-transmissive base layer 101 and the light-transmissive function layer 142 is the same as the light-transmissive function layer 102, and thus the description thereof is omitted here.

(Conductive portion and non-conductive portion)

The conductive portion 134 has the same structure as the conductive portion 112. That is, as shown in Fig. 20, the conductive portion 134 is composed of a light-transmitting resin and conductive fibers. The non-conductive portion 135 is made of a light-transmitting resin and does not substantially contain conductive fibers. The conductive fibers in the conductive section 134 are distributed on the side of the light transmitting base material 141 at a position HL which is half the film thickness of the conductive section 134 and electrically connected to the surface 144A of the conductive section 134 It is possible to conduct. The conductive portion 134 has the same structure as that of the conductive portion 112, but the conductive portion 134 does not necessarily have to have the same structure as the conductive portion 112.

The conductive portion 112 of the conductive film 110 functions as an electrode in the X direction in the projection type capacitance type touch panel and the conductive portion 134 of the conductive film 140 functions as a projection- And functions as an electrode in the Y direction in the touch panel. In plan view, it is the same as in Fig.

In the above embodiment, the conductive film used for the touch panel application is described, but the use of the conductive film is not particularly limited. For example, the conductive films 100 and 110 may be used as a connection with an IC chip or a wiring.

[Third embodiment]

Hereinafter, a conductive film, a touch panel, and an image display device according to a third embodiment of the present invention will be described with reference to the drawings. Fig. 21 is a schematic configuration diagram of the conductive film according to the present embodiment, Fig. 22 is a partially enlarged view of the conductive film shown in Fig. 21, and Fig. 23 is a diagram schematically showing a state of a folding test. Fig. 24 is a schematic structural view of another conductive film according to the present embodiment, and Fig. 25 is a partially enlarged view of the conductive film shown in Fig. Figs. 26 and 27 are diagrams schematically showing a manufacturing process of the conductive film according to the present embodiment.

<<< Conductive Film >>>

The conductive film 150 shown in Fig. 21 is provided with a light-transmitting resin base 151 and a conductive portion 152 provided directly on one surface 151A of the light-transmitting resin base 151 . The surface 150A of the conductive film 150 is composed of the surface 152A of the conductive portion 152. [

The conductive film 150 further includes a ground layer 153 directly provided on the other surface 151B which is a surface opposite to the one surface 151A of the light-transmitting resin base 151. [ Although the conductive portion 152 shown in Fig. 21 is provided only on one surface 151A of the light-transmitting resin base material 151, the conductive portion is provided on the other surface 151B of the light- do. In this case, it is preferable that the base layer 153 is not provided and the conductive portion is provided directly on the other surface 151B of the light-transmitting resin base material 151. [ In the case of forming the conductive parts on both sides of the light-transmitting resin base material, the conductive parts may be directly provided on one side of the light-transmitting resin base material, and the conductive parts need not necessarily be directly provided on the other side of the light-

The haze value (total haze value) of the conductive film 150 is 5% or less for the same reason as explained in the column of the conductive film 10. The haze value of the conductive film 150 can be measured by the same method as the haze value of the conductive film 10. The haze value of the conductive film 150 is more preferably 3% or less, 2% or less, 1.5% or less, 1.2% or less, or 1.1% or less.

It is preferable that the total light transmittance of the conductive film 150 is 80% or more for the same reason described in the column of the conductive film 10. The total light transmittance of the conductive film 150 can be measured by the same method as the total light transmittance of the conductive film 10. The total light transmittance of the conductive film 150 is preferably 85% or more, 88% or more, and 89% or more (preferably, the larger the numerical value is).

The conductive film 150 has flexibility. Therefore, even when the 180 ° folding test is repeated 100,000 times so that the interval between the opposite sides of the conductive film 150 is 3 mm with respect to the conductive film 150, the conductive portions 150 of the conductive film 150 before and after the folding test The electrical resistance value ratio of the surface 152A of the conductive film 152 of the conductive film 150 before and after the folding test is preferably 3 or less, The electrical resistance value ratio on the surface 152A is more preferably 3 or less and the electric resistance value on the surface 152A of the conductive portion 152 of the conductive film 150 before and after the folding test It is more preferable that the resistance value ratio is 3 or less. When the electric resistance value ratio of the surface of the conductive part of the conductive film before and after the folding test is more than 3 when the folding test is repeated 100,000 times on the conductive film, cracks or the like may occur in the conductive film, The flexibility of the film becomes insufficient. Here, when a crack or the like is generated in the conductive film by the folding test, the electrical conductivity of the conductive film is lowered. Therefore, the electric resistance value on the surface of the conductive portion of the conductive film after the folding test Is higher than the electric resistance value of the battery. Therefore, it is possible to determine whether or not cracks or the like have occurred in the conductive film by obtaining the ratio of the electric resistance value on the surface of the conductive portion of the conductive film before and after the folding test. When the hard coating layer is provided between the light-transmitting resin base material and the conductive portion, if the folding test is repeated the above-described number of times, the hard coating layer is broken by the folding test, and the surface of the conductive portion of the conductive film after the folding test It is highly likely that the ratio of the electric resistance value of the conductive film is more than 3. In any case, the ratio of the electric resistance value on the surface 152A of the conductive portion 152 of the conductive film 150 before and after the folding test is more preferably 1.5 or less . The folding test may be performed so that the conductive film 150 is folded so that the conductive portion 152 is inwardly or the conductive film 150 is folded outward so that the conductive portion 152 is outward. , And the electrical resistance value ratio on the surface 152A of the conductive portion 152 of the conductive film 150 before and after the folding test is preferably 3 or less.

Specifically, first, a sample identical to the sample produced when measuring the electric resistance value described in the first embodiment is produced. Specifically, in the same manner as the conductive film 30 shown in Fig. 8, an arbitrary direction AD is determined in the plane of the conductive portion 152 from the conductive film 150 before the folding test, A sample S having a predetermined size in six directions (for example, a rectangle of 125 mm long x 50 mm wide) is cut out every 30 degrees including this arbitrary direction. If the sample can not be cut with a size of 125 mm x 50 mm in length, the sample may be cut to a size of, for example, 110 mm long x 50 mm wide. After six samples S were cut out from the conductive film before the folding test, the electrical resistance value of the surface of the conductive portion was measured in each sample S before the folding test. Specifically, as in the case of FIG. 9, the measurement distance of the electrical resistance value is prevented from varying on both end portions in the long-side direction of each sample S (for example, a portion having a length of 10 mm and a width of 50 mm) A silver paste (product name "DW-520H-14", product of Toyo Boso Co., Ltd.) was applied and heated at 130 ° C for 30 minutes to prepare silver pastes cured at both ends of each sample. In this state, The resistance value is measured using a tester (product name: Digital MΩ Hitester 3454-11, manufactured by Hioki Denki Co., Ltd.). In measuring the electrical resistance value, the probe terminals of the tester are brought into contact with the respective cured silver pastes provided at both ends. In each sample before the folding test, the electrical resistance value of the surface 152A of the conductive portion 152 is measured, and then the sample S showing the lowest electric resistance value among the samples S is selected. Then, the selected sample S is subjected to a folding test.

The folding test is carried out as follows. As shown in Fig. 23A, in the folding test, first, the side S1 of the selected sample S and the side S2 opposite to the side S1 are fixed to the fixing portion 156 arranged in parallel. Further, as shown in Fig. 23 (A), the fixing portion 156 is slidable in the horizontal direction.

Subsequently, as shown in Fig. 23 (B), the center portion S3 of the sample S is folded so as to be folded by moving the fixing portions 156 close to each other, and as shown in Fig. 23 (C) , The fixing portion 156 is moved to a position where the distance between the opposing two side portions S1 and S2 fixed by the fixing portion 156 of the sample S is 3 mm and then the fixing portion 156 is moved in the reverse direction, Eliminate strain.

As shown in FIGS. 23A to 23C, by moving the fixing portion 156, the sample S can be folded 180 ° to the central portion S3. In addition, a folding test is performed so that the bent portion S4 of the sample S does not come out from the lower end of the fixing portion 156, and the interval when the fixing portion 156 closest is controlled to be 3 mm, The interval between the side edges S1 and S2 can be 3 mm. In this case, the outer diameter of the bent portion S4 is regarded as 3 mm. Since the thickness of the sample S is sufficiently small in comparison with the interval (3 mm) of the fixing portions 156, the result of the folding test of the sample S is regarded as not being affected by the difference in thickness of the sample S .

After performing the folding test, the electrical resistance value of the surface of the conductive portion is measured in the same manner as the sample S before the folding test in the sample S after the folding test. Then, the ratio of the electrical resistance value of the sample S after the folding test to the electrical resistance value of the sample S before the selected folding test (the electrical resistance value of the sample before the selected folding test / the sample electrical resistance value after the folding test) is obtained. The ratio of the electric resistance values is an arithmetic mean value of the values obtained by three measurements.

<< Light-transmitting resin base material >>

The light-transmitting resin base material 151 is not particularly limited as long as it is a base made of a resin having light transmittance. The light-transmitting resin constituting the light-transmitting resin base material 151 may be the same as the light-transmitting resin described in the column of the light-transmitting base material 11. The thickness of the light-transmitting resin base material 151 is the same as the thickness of the light-transmitting base material 11. It is to be noted that the light-transmitting resin base material may be provided with a base for suppressing the clattering of the coating liquid forming the other layer and / or for preventing adherence during winding and / Quot ;, but the &quot; light-transmitting resin substrate &quot; in the present embodiment is used in the meaning that it does not include a ground layer. Further, the light-transmitting resin base material 151 may be subjected to physical treatment such as corona discharge treatment, oxidation treatment or the like on the surface thereof in order to improve the adhesiveness.

<< Conductive parts >>

The conductive portion 152 is provided directly on one surface 151A of the light-transmitting resin base 151. [ In this case, &quot; directly provided &quot; means that the conductive part directly contacts one surface of the light-transmitting resin base material. That is, the base layer is not present between the light-transmitting resin base material 151 and the conductive portion 152. Whether or not the conductive portion is provided directly on one side of the light-transmitting resin base material or whether or not the base layer is present between the light-transmitting resin base material and the conductive portion is determined by a scanning electron microscope (SEM), a scanning transmission electron microscope Can be confirmed by observing a cross section around the interface between the light-transmitting resin base material and the conductive portion at a rate of 1,000 to 500,000 times using a transmission electron microscope (TEM). Further, since the base layer may contain particles such as lubricant for preventing sticking at the time of winding, even if particles are present between the light-transmitting resin base material and the conductive part, it is judged that this base layer is the base layer . In this case, measurement conditions such as the film thickness of the conductive portion 13 can be used as the measurement conditions by the electron microscope.

The conductive portion 152 includes a light transmitting resin 154 and a plurality of conductive fibers 155 disposed in the light transmitting resin 154 as shown in Fig. The conductive portion 152 preferably further includes a reaction inhibitor present in the light-transmitting resin 154.

The conductive portion 152 is electrically conductive from the surface 152A. Whether or not the conductive portion 152 is electrically conductive from the surface 152A of the conductive portion 152 can be determined by measuring the surface resistance value of the conductive portion 152 as in the case of the conductive portion 13 Do. A method for measuring the surface resistance value of the conductive portion 152 and a criterion for determining whether the conductive portion 152 is electrically conductive from the surface 152A of the conductive portion 152 The method of measuring the resistance value, and the judgment standard, and thus the description thereof will be omitted here. As described later, most of the conductive fibers 155 exist on the side of the light-transmitting resin base material 151 at a position HL which is half the film thickness of the conductive parts 152, but other conductive fibers 155 Is present on the surface 152A side from the position HL which is half the film thickness of the conductive portion 152 by overlapping on the conductive fiber 155 existing on the side of the light transmitting resin base material 151 and the conductive portion 152 The conductive portion 152 is electrically conductible from the surface 152A because the conductive portion 152 is also present on the surface 152A.

It is preferable that the conductive fibers 155 are distributed on the side of the light transmitting resin base material 151 at a position HL which is half the film thickness of the conductive parts 152 as shown in Fig. Whether or not the conductive fiber 155 is unevenly distributed on the side of the light-transmitting resin base material 151 than the position HL of the half of the thickness of the conductive part 152 is determined by the determination method described in the column of the conductive part 13, Description thereof will be omitted. Further, the presence ratio of the conductive fibers positioned on the light-transmitting substrate side from the half of the film thickness of the conductive portion obtained from the cross-sectional photograph taken by using the scanning transmission electron microscope (STEM) or the transmission electron microscope (TEM) is 70% , And more preferably 80% or more.

The surface resistance value of the conductive portion 152 is 200? /? Or less for the same reason as that described in the column of the conductive portion 13. The surface resistance value of the conductive portion 152 is the surface resistance value of the surface 152A of the conductive portion 152. [ The surface resistance value of the conductive portion 152 can be measured by the same method as the surface resistance value of the conductive portion 13. The lower limit of the surface resistance value of the conductive portion 152 is preferably in the order of 1? / Square, 5? / Square and 10? / Square or more The upper limit is more preferably 100 Ω / □ or less, 70 Ω / □ or less, 60 Ω / □ or less, and 50 Ω / □ or less (the smaller the number is, the better).

The thickness of the conductive portion 152 is preferably less than 300 nm from the viewpoint of thinning. The upper limit of the film thickness of the conductive portion 152 is more preferably 145 nm or less, 140 nm or less, 120 nm or less, 110 nm or less, 80 nm or less, and 50 nm or less. The lower limit of the film thickness of the conductive portion 152 is preferably 10 nm or more for the same reason as described in the column of the conductive portion 13. The film thickness of the conductive portion 152 can be measured by the same method as the film thickness of the conductive portion 13.

The conductive part 152 preferably has a Martens hardness of 970 N / mm &lt; 2 &gt; or more and 1050 N / mm &lt; 2 &gt; or less at a position where the amount of indentation from the surface 152A is 10 nm, for the same reason as described in the column of the conductive part 13 Do. More preferably, the lower limit of the hardness of the Martens hardness at the position where the press-in amount of the conductive portion 152 is 10 nm is more preferably 980 N / mm 2 or more, 1000 N / mm 2 or more and 1015 N / The upper limit of the hardness of the martensite at the position where the amount is 10 nm is more preferably 1040 N / mm 2 or less, 1030 N / mm 2 or less, and 1020 N / mm 2 or less.

The conductive part 152 preferably has a Martens hardness of 130 N / mm 2 to 300 N / mm 2 at a position where the amount of indentation from the surface 152 A is 100 nm, for the same reason as described in the column of the conductive part 13 Do. The lower limit of the Martens hardness at the position where the pressing amount of the conductive portion 152 is 100 nm is more preferably in the order of 140 N / mm 2 or more, 150 N / mm 2 or more and 170 N / mm 2 or more (more preferably, The upper limit of the hardness of the martensite at the position where the amount is 100 nm is more preferably 280 N / mm 2 or less, 250 N / mm 2 or less, and 200 N / mm 2 or less.

When the conductive film 150 is used for the sensor electrode of the touch panel, the surface 152A of the conductive portion 152 is formed in the surface of the conductive portion 152 in the six directions every 30 DEG And a direction in which the lowest electric resistance value is obtained is referred to as a first direction and a direction orthogonal to the first direction is referred to as a second direction, the electric resistance value in the first direction (Hereinafter, this ratio is referred to as &quot; ratio of electric resistance value &quot;) is preferably 1 or more and less than 2. The ratio of the electrical resistance values can be obtained by the same method as the method of measuring the electrical resistance values described in the column of the conductive portions 13. The upper limit of the ratio of the electric resistance value is preferably 1.8 or less, more preferably 1.5 or less, and most preferably 1.3 or less.

On the other hand, in the case of obtaining a conductive film having a lower electrical resistance value in a specific direction, the surface 31A of the conductive portion 31 may be inclined at an angle of 30 deg. It is preferable that the electric resistance value ratio is 2 or more when the electric resistance values in the six directions are respectively measured by a predetermined size. The ratio of the electrical resistance value is the arithmetic mean value of the values obtained by three measurements. The lower limit of the ratio of the electric resistance value is more preferably 3 or more. The upper limit of the ratio of the electric resistance value is preferably 10 or less and 8 or less in order from the viewpoint of the uniformity of the resistance value in the plane.

The conductive part having such an electric resistance value ratio of 1 or more, or less than 2 or 2 or more, may be used, for example, as the conductive fiber, the fiber length of the conductive fiber, the type and thickness of the resin constituting the organic protective layer described later, and / And it is possible to obtain by appropriately adjusting it.

&Lt; Transparent resin >

The light transmitting resin 154 prevents the conductive fibers 155 from separating from the conductive parts 152 and improves the durability and scratch resistance of the conductive parts 152 in the same manner as the light transmitting resin 15 The conductive fiber 155 is covered with the surface 152A of the conductive portion 152 so that electrical conduction can be obtained.

The light-transmitting resin (154) is the same as the light-transmitting resin (15). Therefore, the film thickness and the constituent material of the light-transmitting resin 154 are the same as those of the light-transmitting resin 15 and the constituent material. Since the light-transmitting resin 154 is the same as the light-transmitting resin 15, description thereof will be omitted here. The conductive part 152 is provided directly on one surface 151A of the light-transmitting resin base 151 and the refractive index of the light-transmitting resin 154 is lower than the refractive index of the light-transmitting resin base 151, When the thickness of the transparent resin 154 is 60 nm or more and 130 nm or less, the conductive part 152 substantially exhibits the same effect as the low refractive index layer of the antireflection film, and the surface of the conductive part 152 152A can be lowered. Thereby, the total light transmittance can be improved and the reflection Y value can be lowered. In this case, the maximum value of the difference in refractive index between the light-transmitting resin 154 and the light-transmitting resin base 151 is preferably 0.05 or more.

<Reaction inhibitor>

The reaction inhibitor is intended to suppress the decrease in conductivity due to the reaction of the conductive fiber 15 with the substance in the atmosphere after application of the composition for light transmitting resin. The reaction inhibitor and its content are the same as those of the reaction inhibitor and the content thereof described in the first embodiment, and thus the description thereof will be omitted here.

&Lt; Conductive fiber &

When the conductive fiber 155 is unevenly distributed on the side of the light-transmitting resin base material 151 with respect to the position HL which is half the film thickness of the conductive part 152, the conductive fiber 152 is electrically conductive from the surface 152A of the conductive part 152 The conductive fibers 155 are in contact with each other in the thickness direction of the conductive portion 152.

The conductive fibers 155 are brought into contact with each other in the planar direction (two-dimensional direction) of the conductive portions 152 on the side of the light-transmitting resin base material 151 with respect to the position HL of the half of the film thickness of the conductive portions 152, A mesh structure) is preferably formed. By forming the network structure of the conductive fibers 155, a conductive path can be efficiently formed even with a small amount of the conductive fibers 155.

It is preferable that some of the conductive fibers 155 are exposed on the surface 152A of the conductive portion 152. [ It can be determined that some conductive fibers 155 are exposed on the surface 152A of the conductive portion 152 when electrical conduction is obtained from the surface 152A of the conductive portion 152 by the above measurement method .

The fiber diameter of the conductive fiber 155 is preferably 200 nm or less for the same reason as described for the conductive fiber 16. A more preferable lower limit of the fiber diameter of the conductive fiber 155 is 10 nm or more from the viewpoint of the conductivity of the conductive portion 152 and a more preferable range of the fiber diameter of the conductive fiber 155 is 15 nm or more and 180 nm or less. The fiber diameter of the conductive fiber 155 can be obtained by the same method as the fiber diameter of the conductive fiber 16.

The fiber length of the conductive fiber 155 is preferably 1 占 퐉 or more for the same reason as that described for the conductive fiber 16. The upper limit of the fiber length of the conductive fiber 155 may be 500 탆 or less, 300 탆 or 30 탆 or less, and the lower limit of the fiber length of the conductive fiber 155 may be 3 탆 or more or 10 탆 or more. The fiber length of the conductive fiber 155 can be obtained by the same method as the fiber length of the conductive fiber 16.

For example, in the case of obtaining a conductive portion having an electric resistance value ratio of 1 or more and 2 or less, the conductive fiber 155 preferably has a fiber length of less than 1 탆 and less than 30 탆, like the conductive fiber 16, For example, the conductive fiber 155 preferably has a fiber length of 30 mu m or more. The lower limit of the fiber length of the conductive fiber 155 in the case of obtaining the conductive portion having the electrical resistance value ratio of 1 or more and less than 2 is preferably 10 占 퐉 or more from the viewpoint of obtaining a low surface resistance value and the upper limit is preferably 20 占 퐉 or less.

The fibers constituting the conductive fibers 155 are the same as the fibers constituting the conductive fibers 16, and thus the description thereof will be omitted.

<< Ground Floor >>

The underlayer 153 is a layer for preventing clattering of the coating liquid forming the other layer and / or preventing the clinging at the time of winding to improve adhesion with other layers. The base layer 153 includes, for example, an anchor agent or a primer agent. Examples of the anchor and the primer include polyurethane resins, polyester resins, polyvinyl chloride resins, polyvinyl acetate resins, vinyl chloride-vinyl acetate copolymers, acrylic resins, polyvinyl alcohol resins, polyvinyl acetal resins , A copolymer of ethylene with vinyl acetate or acrylic acid, a copolymer of ethylene with styrene and / or butadiene, a thermoplastic resin such as olefin resin and / or a modified resin thereof, a polymer of ionizing radiation polymerizable compound and a polymer of thermosetting compound Or the like can be used.

The base layer 153 may contain particles such as lubricant for preventing clinging at the time of winding as described above. The particles include silica particles and the like.

The film thickness of the ground layer 153 is preferably 10 nm or more and 1 占 퐉 or less. If the film thickness of the ground layer is less than 10 nm, the function of the ground layer may become insufficient. If the film thickness of the ground layer is more than 1 탆, there is a fear of optical influence or adhesion There is a possibility that it can not be done. The film thickness of the foundation layer 153 is preferably 1000 to 500,000 times (preferably, 25,000 to 50,000 times) using a scanning electron microscope (SEM), a scanning transmission electron microscope (STEM) or a transmission electron microscope From the cross-sectional photograph of the photographed underlayer, the thickness is measured at 10 locations at random, and the arithmetic average value of the measured thicknesses at 10 locations is taken. The lower limit of the film thickness of the ground layer 153 is more preferably 30 nm or more, and the upper limit thereof is more preferably 150 nm or less. The film thickness of the ground layer 153 can be measured by the same method as the film thickness of the conductive portion 13.

<< Other conductive films >>

The conductive film 150 shown in Fig. 21 is a film in which the conductive portions 152 are not patterned, that is, a so-called solid film, but the conductive portions may be patterned depending on the application. Concretely, the conductive film is a conductive film having conductivity (162) including a plurality of conductive portions (162) and a conductive layer (161) composed of non-conductive portions (163) The film 160 may be a conductive film having a plurality of conductive portions and a gap existing between the conductive portions, as in Fig. The surface 160A of the conductive film 160 is composed of the surface 162A of the conductive portion 162 and the surface 163A of the non-conductive portion 163, and the surface of the conductive film having a gap between the conductive portions , And a surface of the conductive portion and one surface of the light-transmitting resin base material. The physical property values of the conductive film 160 and the conductive film having a gap between the conductive portions are equal to those of the conductive film 150 and the like. In Fig. 24, the members having the same reference numerals as those in Fig. 21 are the same as the members shown in Fig. 21, and the description thereof will be omitted.

<Conductive part>

The conductive portion 162 is the same as the conductive portion 152 except that it is patterned. That is, the conductive portion 162 is provided directly on one surface 151A of the light-transmitting resin base 151. [ 25, the conductive portion 162 includes a light-transmissive resin 154 and a plurality of conductive fibers 155 disposed in the light-transmissive resin 154. As shown in Fig. The conductive portion 162 is electrically conductive from the surface 162A. It is preferable that the conductive fibers 165 are distributed on the side of the light transmitting resin base material 151 more than a position HL which is half the film thickness of the conductive parts 162 as shown in Fig. Other configurations, materials, physical values, etc. of the conductive portion 162 are the same as those of the conductive portion 152, and therefore, a description thereof will be omitted.

<Non-Allocation>

The non-conductive portion 163 is a portion located between the conductive portions 162 and not exhibiting conductivity. As shown in Fig. 25, the non-conductive portion 163 does not substantially contain the conductive fibers 155. [ It is preferable that the non-conductive portion 163 contains no conductive fibers 155 at all.

Since the non-conductive portion 163 is formed integrally with the conductive portion 1622, the non-conductive portion 163 preferably has a thickness of less than 300 nm. The upper limit of the film thickness of the non-conductive portion 163 is more preferably 145 nm or less, 140 nm or less, 120 nm or less, 110 nm or less, 80 nm or less, and 50 nm or less. The lower limit of the thickness of the non-conductive portion 163 is preferably 10 nm or more. The film thickness of the non-conductive portion 163 is measured by the same method as the film thickness of the conductive portion 13.

As shown in Fig. 25, the non-conductive portion 163 is formed of a light-transmitting resin 154. [ The non-conductive portion 163 may be formed by sublimating the conductive fibers 155, and may have a hollow portion 163B in which the conductive fibers are not present. In this case, when the non-conductive part 163 is formed, the conductive fiber 155 breaks over the area to be made the non-conductive part 163 by sublimation and is discharged to the outside, so that the surface 163A of the non-conductive part 163 is roughened do. The light-transmitting resin 154 of the non-conductive portion 163 is the same as the light-transmissive resin 154 of the conductive portion 162, and thus the description thereof is omitted here.

&Lt; Method for producing conductive film &gt;

The conductive film 160 can be manufactured, for example, as follows. First, as shown in Fig. 26 (A), a light-transmitting resin substrate 151 (Fig. 26A) in which a base layer is not formed on one side 151A and a base layer 153 is formed on the other side 151B ). Further, a light-transmitting resin base material having no undercoat layer on both sides may be prepared.

Then, the conductive fiber-containing composition containing the conductive fiber 155 and the organic-based dispersion medium is directly applied to one side 151A of the light-transmitting resin base material 151 and dried to form the conductive fiber 155 as shown in Fig. A plurality of conductive fibers 155 are directly disposed on one surface 151A of the light-transmitting resin base material 151. [ The conductive fiber-containing composition is the same as the conductive fiber-containing composition used in the first embodiment, and thus the description thereof is omitted here.

After a plurality of conductive fibers 155 are directly disposed on one surface 151A of the light-transmitting resin base material 151, a composition for a light-transmitting resin containing a polymerizable compound and a solvent is applied and dried, (C), a coating film 157 of a composition for a light-transmitting resin is formed. The composition for a light-transmitting resin is the same as the composition for a light-transmitting resin used in the first embodiment, and thus a description thereof will be omitted here.

Then, as shown in Fig. 27A, the coating film 157 is cured by irradiating ionizing radiation such as ultraviolet rays to the coating film 157 to polymerize (crosslink) the polymerizable compound to form the light-transmitting resin 154 ).

In the conductive film 150 shown in Fig. 21, since the conductive portion 31 is a solid film, the conductive film 150 is obtained in the above process. Since the conductive film 160 shown in Fig. 23 is patterned, as in the case of the first embodiment, for example, as shown in Fig. 27 (B), the region to be non- And then irradiating light (for example, an infrared laser) to pattern the conductive portion 162.

According to this embodiment, the conductive portions 152 and 162 are provided directly on one surface 151A of the light-transmitting resin base 151, that is, between the light-transmitting resin base 151 and the conductive portions 152 and 162 The conductive fiber 155 does not enter the ground layer because there is no ground layer. Therefore, it is difficult for the conductive fibers 155 to spread in the thickness direction of the conductive films 150 and 160, and the number of contacts of the conductive fibers 155 increases. Thereby, a low surface resistance value can be realized. In addition, since the number of contacts of the conductive fibers 155 can be increased, the content of the conductive fibers 155 can be reduced, whereby a low haze value of 5% or less can be realized.

The conductive fibers 155 and the conductive fibers 155 are electrically connected to the conductive portions 155 as the entire conductive fibers 155. In this case, Permeable resin substrate 151 side is larger than the position HL of half the film thickness of the conductive parts 152 and 162, the contact points of the conductive fibers 155 are increased, Can be realized with a low haze value of 5% or less and a low surface resistance value of 200? /? Or less even when the thickness is made thinner than 300 nm or extremely thinner than 145 nm.

According to the present embodiment, since the conductive portions 152 and 162 are provided directly on one surface 151A of the light-transmitting resin base 151 in the conductive films 150 and 160, the light- And the conductive portions 152 and 162, and thus the flexibility is excellent.

According to the present embodiment, the conductive fibers 155 in the conductive portions 152 and 162 are arranged in positions corresponding to the positions HL of the conductive fibers 152 and 162 which are half the film thickness of the conductive fibers 155 as the entire conductive fibers 155 The contact points of the conductive fibers 155 can be increased. Thereby, even when the content of the conductive fiber 155 is small, electrical conduction from the surfaces 152A and 162A of the conductive parts 152 and 162 can be ensured, so that a lower surface resistance value can be realized Do. Further, since the content of the conductive fiber 155 can be reduced, a lower haze value can be realized. Since the conductive fibers 155 are located on the side of the light-transmitting resin base material 151 more than the position HL of the conductive portions 152 and 162 which are half the film thickness of the conductive portions 152 and 162, Is covered with the light-transmitting resin 154. This makes it possible to suppress a decrease in the conductivity of the conductive fiber 155 due to the reaction of the air in the atmosphere with sulfur, oxygen, and / or halogen.

In the present embodiment, even when the organic-based dispersion medium is used as the dispersion medium of the conductive fiber-containing composition and the resin fiber content is not contained in the conductive fiber-containing composition or the resin fiber content is included, the content of the resin fiber content is reduced, It is preferable that the conductive fibers 155 in the conductive portions 152 and 162 are positioned closer to the light transmitting resin base 151 than the position HL at half the film thickness of the conductive portions 152 and 162 in the conductive portions 152 and 162 for the same reason described in the first embodiment Can be ubiquitous.

According to the present embodiment, the conductive portion 152 is directly provided on one surface 151A of the light-transmitting resin base 151 by the coating construction method. However, when the electrical resistance value ratio in the conductive portion 152 is 1 The difference in electric resistance value depending on the in-plane direction of the conductive portion 152 can be reduced for the same reason as explained in the first embodiment. As a result, when the conductive film is used for the sensor electrode of the touch panel, restrictions on the electrode pattern and the IC chip are reduced, and restrictions on chamfering are reduced.

According to the present embodiment, when the electrical resistance value ratio of the conductive portion 152 is 2 or more, the electrical resistance value is high in the second direction, but the electrical resistance value is low in the first direction . Therefore, for the same reason described in the first embodiment, it is possible to provide the conductive film 10 having a lower electric resistance value in a specific direction (first direction).

According to the present embodiment, since the light-transmitting resin 154 of the conductive portions 152 and 162 contains the reaction inhibitor, the same effects as those described in the first embodiment can be obtained. The lowering of the conductivity of the conductive fiber 155 due to the reaction with the halogen can be further suppressed.

According to the present embodiment, the conductive fibers 155 in the conductive portions 152 and 162 are arranged in positions corresponding to the positions HL of the conductive fibers 152 and 162 which are half the film thickness of the conductive fibers 155 as the entire conductive fibers 155 ) Side, it is possible to obtain a surface resistance value as good as possible with a minimum of conductive fibers. Further, if the conductive fibers 155 are so localized, optical characteristics with lower haze value can be obtained. The reason that the conductive fibers 155 are localized is that the hardness of the martens can be more easily adjusted than in the case of being in the dispersed state. In addition, since the conductive fiber 155 is present in the light-transmitting resin 154 in a dense manner, it is possible to increase the hardness. Further, when considering the composition of the light-transmitting resin 154, Can be obtained. Further, when the Martens hardness is appropriate, flexibility in folding or rolling can be improved.

According to the present embodiment, since the reaction inhibitor is contained in the conductive portion 152, in the state in which the light-permeable adhesive layer is in contact with the conductive portions 152 and 162 for the same reason as described in the first embodiment, The reaction between the conductive fibers 155 and the components in the light-transmitting adhesive layer can be suppressed. This makes it possible to widen the selection of the light-transmitting adhesive layer.

Although the conductive films 150 and 160 have been described above, the same effects as those of the conductive films 150 and 160 can be obtained for the conductive film having the gap between the conductive parts.

The use of the conductive film according to the present embodiment is not particularly limited, but it can be used in an image display apparatus provided with a touch panel. Further, the conductive film can be used, for example, as an electromagnetic wave shield. 28 is a schematic configuration diagram of an image display apparatus according to the present embodiment. In Fig. 28, the members denoted by the same reference numerals as those in Fig. 13 are the same as the members shown in Fig. 13, and a description thereof will be omitted.

<<< Image display device >>>

28, the image display apparatus 170 mainly includes a display panel 180 for displaying an image, a touch panel 190 disposed closer to the observer than the display panel 180, Transmissive adhesive layer 90 interposed between the display panel 180 and the touch panel 190. The light- In the present embodiment, the image display apparatus 170 does not have a backlight device because the display panel 180 is an organic light emitting diode (OLED) panel. However, depending on the type of display panel .

<< Display panel >>

Since the display panel 180 is an organic light emitting diode (OLED) panel as described above, the display panel 180 includes an organic light emitting diode as a display element. The display panel may be a liquid crystal display panel, an inorganic light emitting diode panel, or a quantum dot light emitting diode (QLED) panel.

<< Touch panel >>

The touch panel 190 includes a conductive film 200 and a conductive film 160 disposed on the observer side of the conductive film 200 and a light transmitting cover 160 such as a cover glass disposed on the observer side of the conductive film 160. [ A light transmitting adhesive layer 72 interposed between the conductive film 200 and the conductive film 160 and a light transmitting adhesive layer 72 interposed between the conductive film 160 and the light transmitting cover member 71, Layer 73 as shown in Fig.

&Lt; Conductive film &

The conductive film 200 has almost the same structure as that of the conductive film 160. 28, the conductive film 200 is provided directly on the surface 201A of the light-transmissive resin base material 201 and the patterned conductive parts (not shown) 203, respectively. The conductive portion 203 shown in FIG. 28 is a part of the conductive layer 202. The conductive layer 202 is composed of a plurality of conductive portions 203 and a nonconductive portion 204 located between the conductive portions 203. The conductive film 200 further includes a ground layer 205 directly provided on the other surface 201B of the light-transmitting resin base material 201. [ Since the light-transmitting resin base material 201 and the ground layer 205 are the same as the light-transmitting resin base material 151 and the ground layer 153, their explanation is omitted here.

(Conductive portion and non-conductive portion)

The conductive portion 203 has the same structure as that of the conductive portion 162. That is, the conductive portion 203 is composed of a light-transmitting resin and conductive fibers. The non-conductive part 204 is made of a light-transmitting resin and does not substantially contain conductive fibers. The conductive portion 203 is electrically conductive from the surface of the conductive portion 203. It is also preferable that the conductive fibers in the conductive portion 203 are localized on the side of the light-transmitting resin base material 201 at a position HL which is half the film thickness of the conductive portion 203. [ Although the conductive portion 203 has the same structure as that of the conductive portion 162, the conductive portion 203 does not necessarily have to have the same structure as the conductive portion 162.

The conductive portion 162 of the conductive film 160 functions as an electrode in the X direction in the projection type capacitance type touch panel and the conductive portion 203 of the conductive film 200 functions as a projection- And functions as an electrode in the Y direction in the touch panel, and is the same as in Fig. 14 in plan view.

[Fourth Embodiment]

Hereinafter, a conductive film, a touch panel, and an image display device according to a fourth embodiment of the present invention will be described with reference to the drawings. Fig. 29 is a schematic structural view of the conductive film according to the fourth embodiment, Fig. 30 is a partially enlarged view of the conductive film shown in Fig. 29, and Fig. 31 is a schematic structural view of another conductive film according to the fourth embodiment And Fig. 32 is an enlarged view of a part of the conductive film shown in Fig. Figs. 33 and 34 are diagrams schematically showing a manufacturing process of the conductive film according to the present embodiment.

<<< Conductive Film >>>

29, the conductive film 250 has light transmittance and also has a base layer 252 and a conductive portion 254 on one side 251A side of the light-transmitting resin base material 251 in this order And the base layer 253 is provided on the other surface 251B side. More specifically, the conductive film 250 includes a light-transmitting resin base material 251, a ground layer 252 directly provided on one side 251A of the light-transmitting resin base material 251, a light-transmitting resin base material 251, The base layer 252 directly provided on the other side 251B of the base layer 252 and the side of the base layer 252 on the side of the light transmitting resin base 251 (Hereinafter, this surface will be referred to as the &quot; other surface of the base layer &quot;) 252B on the side of the conductive portion 254 opposite to the conductive portion 252A. The surface 250A of the conductive film 250 is composed of the surface 254A of the conductive portion 254. [ In addition, the conductive film 250 may not be provided with the ground layer 253.

29 is provided only on the other surface 252B of the base layer 252. The conductive portion is formed on the surface of the base layer 253 on the side of the light-transmitting resin base material 251 May be provided on the opposite side. In the case of forming a conductive part on both sides of the light-transmitting resin base material, it is sufficient that the conductive part is directly provided on the surface of the one base layer opposite to the surface of the light-transmitting resin base material side, The conductive portion may not be directly provided on the surface opposite to the surface on the substrate side.

The haze value (total haze value) of the conductive film 250 is 5% or less for the same reason as that described in the column of the conductive film 10. The haze value of the conductive film 250 can be measured by the same method as the haze value of the conductive film 10. The haze value of the conductive film 250 is preferably 3% or less, 2% or less, 1.5% or less, 1.2% or less, or 1.1% or less.

It is preferable that the total light transmittance of the conductive film 250 is 80% or more for the same reason described in the column of the conductive film 10. The total light transmittance of the conductive film 250 can be measured by the same method as the total light transmittance of the conductive film 10. [ The total light transmittance of the conductive film 250 is more preferably 85% or more, 88% or more, and 89% or more (more preferred).

The conductive film 250 has flexibility. Therefore, in the same manner as explained in the section of the conductive film 150, the conductive film 250 is folded 180 degrees so that the distance between the opposite sides of the conductive film 10 is 3 mm, It is preferable that the electric resistance value ratio described later on the surface 254A of the conductive portion 254 of the conductive film 250 before and after the folding test is 3 or less even when the test (folding test) is repeated 100,000 times, Even when the test is repeated 200,000 times, it is more preferable that the electric resistance value ratio on the surface 254A of the conductive portion 254 of the conductive film 250 before and after the folding test is 3 or less, , It is more preferable that the electrical resistance value ratio of the surface 254A of the conductive portion 254 of the conductive film 250 before and after the folding test is 3 or less. When the hard coating layer is provided between the light-transmitting resin base material and the conductive portion, if the folding test is repeated the above-described number of times, the hard coating layer is broken by the folding test, and the surface of the conductive portion of the conductive film after the folding test It is highly likely that the ratio of the electric resistance value of the conductive film is more than 3. In any case, the ratio of the electric resistance value on the surface 254A of the conductive portion 254 of the conductive film 250 before and after the folding test is more preferably 1.5 or less . The folding test may be performed so that the conductive film 250 is folded so that the conductive portion 254 is inwardly or the conductive film 250 is folded so that the conductive portion 254 is outwardly. , And the electric resistance value ratio at the surface 254A of the conductive portion 254 of the conductive film 250 before and after the folding test is preferably 3 or less. The measurement and the folding test of the electric resistance value are performed in the same manner as the measurement and the folding test of the electric resistance value described in the column of the conductive film 150.

<< Light-transmitting resin base material >>

The light-transmitting resin base material 251 is not particularly limited as long as it is a base made of a resin having light transmittance. The light-transmitting resin constituting the light-transmitting resin base material 251 is the same as the light-transmitting resin described in the column of the light-transmitting base material 11. The thickness of the light-transmitting resin base material (251) is the same as the thickness of the light-transmitting base material (11). It is to be noted that the light-transmitting resin base material may be provided with a base for suppressing the clattering of the coating liquid forming the other layer and / or for preventing adherence during winding and / Quot ;, but the &quot; light-transmitting resin substrate &quot; in the present embodiment is used in the meaning that it does not include a ground layer. Further, the light-transmitting resin base material 251 may be subjected to physical treatment such as corona discharge treatment and oxidation treatment on the surface thereof in order to improve the adhesiveness.

<< Ground Floor >>

The undercoat layers 252 and 253 are layers for suppressing clattering of the coating liquid forming the other layer and / or preventing the clinging at the time of winding to improve adhesion with other layers. The base layer 252 is provided directly on one surface 251A of the light-transmitting resin base material 251 and the base layer 253 is provided directly on the other surface 251B of the light-transmitting resin base material 251 . In this case, "directly provided" means that the ground layer directly contacts one surface or the other surface of the light-transmitting resin base material. That is, no other layer exists between the light-transmitting resin base material 251 and the ground layers 252 and 253. Whether or not the ground layer is provided directly on one surface or the other surface of the light-transmitting resin base material or whether or not another layer exists between the light-transmitting resin base material and the ground layer is determined by a scanning electron microscope (SEM) Transmission electron microscope (STEM) or a transmission electron microscope (TEM), by observing a cross section around the interface between the light-transmitting resin base material and the conductive portion at 1,000 to 5,000,000 times. Further, since the base layer may contain particles such as lubricant for preventing sticking at the time of winding, even if particles are present between the light-transmitting resin base material and the conductive part, it is judged that this base layer is the base layer . In this case, measurement conditions such as the film thickness of the conductive portion 13 can be used as the measurement conditions by the electron microscope.

It is preferable that the ground layer 252 does not substantially contain the conductive fiber 256 to be described later. In this case, &quot; the base layer substantially does not contain conductive fibers &quot; means that the conductive fibers may be slightly contained if the surface resistance value of the surface of the conductive parts is 1000? /? Or less. More preferably, the ground layer 252 does not include the conductive fibers 16 at all. Whether or not the ground layer 252 does not include the conductive fibers 256 can be determined by using a scanning electron microscope (SEM), a scanning transmission electron microscope (STEM), or a transmission electron microscope (TEM) And observing a cross section around the interface between the conductive layer and the conductive layer. In order to substantially not include the conductive fiber 256 in the ground layer 252, it can be achieved by using a dispersion medium of a conductive fiber-containing composition to be described later that hardly penetrates the ground layer 252. In this case, measurement conditions such as the film thickness of the conductive portion 13 can be used as the measurement conditions by the electron microscope.

The base layers 252 and 253 include, for example, an anchor agent or a primer agent. The anchor or primer agent is the same as the anchor agent or the primer agent described in the section of the underlayer, so that the explanation is omitted here.

The base layers 252 and 253 may contain particles such as lubricants in order to prevent the base layers 252 and 253 from sticking to each other at the time of winding as described above. The particles include silica particles and the like.

It is preferable that the film thicknesses of the ground layers 252 and 253 are 10 nm or more and 1 μm or less for the same reason as explained in the column of the ground layer 153. The film thicknesses of the base layers 252 and 253 are measured by the same method as the film thickness of the base layer 153. [ The lower limit of the film thickness of the ground layers 252 and 253 is more preferably 30 nm or more, and the upper limit is more preferably 150 nm or less.

<< Conductive parts >>

The conductive portion 254 is provided directly on the ground layer 252. In this case, &quot; directly provided &quot; means that the conductive part is in direct contact with the ground layer. That is, no other layer is present between the ground layer 252 and the conductive portion 254. Whether or not the conductive portion is provided directly on the ground layer or whether another layer exists between the ground layer and the conductive portion can be determined by a scanning electron microscope (SEM), a scanning transmission electron microscope (STEM), or a transmission electron microscope Can be confirmed by observing a cross section around the interface between the ground layer and the conductive portion at 1000 to 500000 times. In this case, measurement conditions such as the film thickness of the conductive portion 13 can be used as the measurement conditions by the electron microscope.

The conductive portion 254 includes a light transmitting resin 255 and a plurality of conductive fibers 256 disposed in the light transmitting resin 255 as shown in Fig. The conductive portion 254 preferably further includes a reaction inhibitor present in the light-transmitting resin 15.

The conductive portion 254 is electrically conductive from the surface 254A. Whether or not the conductive portion 254 is electrically conductive from the surface 254A of the conductive portion 254 is determined by measuring the surface resistance value of the conductive portion 254 in the same manner as in the case of the conductive portion 13 It is possible. The method for measuring the surface resistance value of the conductive portion 254 and the criteria for determining whether the conductive portion 254 is electrically conductive from the surface 254A of the conductive portion 254 can be determined by using the surface described in the column of the conductive portion 13 The method of measuring the resistance value, and the judgment standard, and thus the description thereof will be omitted here. As described later, most of the conductive fibers 256 exist on the side of the light-transmitting resin base material 251 at half the thickness HL of the conductive portions 254, Is present on the surface 254A side from the position HL at a half of the film thickness of the conductive portion 254 by being overlapped on the conductive fiber 256 existing on the side of the transparent resin substrate 251, The conductive portion 254 is electrically conductive from the surface 254A because the conductive portion 254 is also present on the surface 254A of the conductive portion 254A.

It is preferable that the conductive fibers 256 are localized on the side of the light transmitting resin base material 251 with respect to the position HL which is half the film thickness of the conductive portion 254 as shown in Fig. Whether or not the conductive fiber 256 is unevenly distributed toward the light transmitting resin base material 251 side than the position HL of the half of the film thickness of the conductive portion 254 is determined by the determination method described in the column of the conductive portion 13, Description thereof will be omitted. Further, the presence ratio of the conductive fibers positioned on the light-transmitting substrate side from the half of the film thickness of the conductive portion obtained from the cross-sectional photograph taken by using the scanning transmission electron microscope (STEM) or the transmission electron microscope (TEM) is 70% , And more preferably 80% or more.

The surface resistance value of the conductive portion 254 is 200? /? Or less for the same reason as described in the column of the conductive portion 13. The surface resistance value of the conductive portion 254 is the surface resistance value of the surface 254A of the conductive portion 254. [ The surface resistance value of the conductive portion 254 can be measured by the same method as the surface resistance value of the conductive portion 13. The lower limit of the surface resistance value of the conductive portion 254 is preferably in the order of 1? / Square, 5? / Square and 10? / Square or more The upper limit is more preferably 100 Ω / □ or less, 70 Ω / □ or less, 60 Ω / □ or less, and 50 Ω / □ or less (the smaller the number is, the better).

The thickness of the conductive portion 254 is preferably less than 300 nm from the viewpoint of thinning. The upper limit of the film thickness of the conductive portion 254 is more preferably 145 nm or less, 140 nm or less, 120 nm or less, 110 nm or less, 80 nm or less, and 50 nm or less. The lower limit of the film thickness of the conductive portion 254 is preferably 10 nm or more for the same reason as described in the column of the conductive portion 13. The film thickness of the conductive portion 254 can be measured by the same method as the film thickness of the conductive portion 13.

It is preferable that the conductive portion 254 has a Martens hardness of 970 N / mm 2 or more and 1050 N / mm 2 or less at a position where the amount of indentation from the surface 254 A is 10 nm for the same reason as described in the column of the conductive portion 13 . The lower limit of the hardness of the martens at the position where the press-in amount of the conductive portion 254 is 10 nm is more preferably 980 N / mm2 or more, 1000 N / mm2 or more and 1015 N / mm2 or more in order (preferably, The upper limit of the hardness of the martensite at the position where the amount is 10 nm is more preferably 1040 N / mm 2 or less, 1030 N / mm 2 or less, and 1020 N / mm 2 or less.

The conductive portion 254 preferably has a Martens hardness of 130 N / mm 2 to 300 N / mm 2 at a position where the amount of indentation from the surface 254 A is 100 nm, for the same reason as described in the column of the conductive portion 13 Do. The lower limit of the Martens hardness at the position where the pressing amount of the conductive portion 254 is 100 nm is more preferably in the order of 140 N / mm 2 or more, 150 N / mm 2 or more and 170 N / mm 2 or more (preferably, The upper limit of the hardness of the martensite at the position where the amount is 100 nm is more preferably 280 N / mm 2 or less, 250 N / mm 2 or less, and 200 N / mm 2 or less.

When the conductive film 250 is used for the sensor electrode of the touch panel, the surface 254A of the conductive portion 254 is formed in the surface 254A of the conductive portion 254 in six directions every 30 degrees including an arbitrary direction And a direction in which the lowest electric resistance value is obtained is referred to as a first direction and a direction orthogonal to the first direction is referred to as a second direction, the electric resistance value in the first direction (Hereinafter, this ratio is referred to as &quot; ratio of electric resistance value &quot;) is preferably 1 or more and less than 2. The ratio of the electrical resistance values can be obtained by the same method as the method of measuring the electrical resistance values described in the column of the conductive portions 13. The upper limit of the ratio of the electric resistance value is preferably 1.8 or less, 1.5 or less, or 1.3 or less (the smaller the value is, the more preferable).

On the other hand, in the case where a conductive film having a lower electric resistance value in a specific direction is obtained, the surface 254A of the conductive portion 254 may be formed so as to be inclined at an angle of 30 deg. It is preferable that the electric resistance value ratio is 2 or more when the electric resistance values in the six directions are respectively measured by a predetermined size. The ratio of the electrical resistance value is the arithmetic mean value of the values obtained by three measurements. The lower limit of the ratio of the electric resistance value is more preferably 3 or more. The upper limit of the ratio of the electric resistance value is preferably 10 or less and 8 or less in order from the viewpoint of the uniformity of the resistance value in the plane.

The conductive part having such an electric resistance value ratio of 1 or more, or less than 2 or 2 or more, may be used, for example, as the conductive fiber, the fiber length of the conductive fiber, the type and thickness of the resin constituting the organic protective layer described later, and / And it is possible to obtain by appropriately adjusting it.

&Lt; Transparent resin >

The light-transmitting resin 255 prevents the conductive fibers 256 from separating from the conductive parts 254 and improves the durability and scratch resistance of the conductive parts 254, similarly to the light- The conductive fiber 256 is covered so that electric conduction can be obtained from the surface 254A of the conductive portion 254. In this embodiment,

The light-transmitting resin 255 is the same as the light-transmitting resin 15. Therefore, the film thickness and constituent material of the light-transmitting resin 255 are the same as those of the light-transmitting resin 15 and the constituent material. Since the light transmitting resin 255 is the same as the light transmitting resin 15, the description thereof is omitted here.

<Reaction inhibitor>

The reaction inhibitor is intended to suppress the decrease in conductivity due to the reaction of the conductive fibers 256 with the substance in the atmosphere after application of the composition for light-transmitting resin. The reaction inhibitor and its content are the same as those of the reaction inhibitor and the content thereof described in the first embodiment, and thus the description thereof will be omitted here.

&Lt; Conductive fiber &

When the conductive fiber 256 is localized to the side of the light-transmitting resin base material 251 at a position half of the thickness HL of the conductive portion 254, the conductive fiber 254 is electrically conductive from the surface 254A of the conductive portion 254 The conductive fibers 256 are in contact with each other in the thickness direction of the conductive portion 254. [

The conductive fibers 256 are brought into contact with each other in the planar direction (two-dimensional direction) of the conductive portion 254 on the light-transmitting resin base material 251 side than the position HL of the half of the film thickness of the conductive portion 254, A mesh structure) is preferably formed. By forming the network structure of the conductive fibers 256, even a small amount of the conductive fibers 256 can efficiently form a conductive path.

It is preferred that some of the conductive fibers 256 are exposed on the surface 254A of the conductive portion 254. It can be determined that some of the conductive fibers 256 are exposed on the surface 254A of the conductive portion 254 when electrical conduction is obtained from the surface 254A of the conductive portion 254 by the above measurement method .

The diameter of the conductive fibers 256 is preferably 200 nm or less for the same reason as that described for the conductive fibers 16. A more preferable lower limit of the fiber diameter of the conductive fiber 256 is 10 nm or more from the viewpoint of conductivity of the conductive portion 13 and a more preferable range of the fiber diameter of the conductive fiber 256 is 15 nm or more and 180 nm or less. The fiber diameter of the conductive fiber 256 can be obtained by the same method as the fiber diameter of the conductive fiber 16.

The fiber length of the conductive fibers 256 is preferably 1 占 퐉 or more for the same reason as described for the conductive fibers 16. The upper limit of the fiber length of the conductive fiber 256 may be 500 μm or less, 300 μm or less, or 30 μm or less, and the lower limit of the fiber length of the conductive fiber 256 may be 3 μm or more or 10 μm or more . The fiber length of the conductive fiber 256 can be obtained by the same method as the fiber length of the conductive fiber 16.

In the case of obtaining a conductive part having an electric resistance value ratio of not less than 1 and less than 2, for example, the conductive fiber 256 preferably has a fiber length of less than 1 탆 and less than 30 탆, like the conductive fiber 16, For example, the fiber length of the conductive fiber 256 is preferably 30 mu m or more. The lower limit of the fiber length of the conductive fiber 256 in the case of obtaining the conductive part having the electrical resistance value ratio of 1 or more and less than 2 is preferably 10 占 퐉 or more from the viewpoint of obtaining the low surface resistance value and the upper limit is preferably 20 占 퐉 or less.

The fibers constituting the conductive fibers 256 are the same as the fibers constituting the conductive fibers 16, and thus the description thereof is omitted here.

<< Other conductive films >>

The conductive film shown in Fig. 29 is a film in which the conductive portion 254 is not patterned, that is, a so-called solid film, but the conductive portion may be patterned depending on the use. Specifically, the conductive film is a conductive film having a conductive layer 261 composed of a plurality of conductive portions 262 and a non-conductive portion 263 located between the conductive portions 262, as shown in Fig. 31 Or may be a conductive film having a plurality of conductive portions and voids existing between the conductive portions, as in Fig. The surface 260A of the conductive film 260 is composed of the surface 262A of the conductive portion 262 and the surface 263A of the non-conductive portion 263, and the surface of the conductive film having a gap between the conductive portions , And a surface of the conductive portion and one surface of the light-transmitting resin base material. The physical property values of the conductive film 260 and the conductive film having a gap between the conductive portions are equal to those of the conductive film 250 and the like. In Fig. 31, the members having the same reference numerals as those in Fig. 29 are the same as the members shown in Fig. 29, and the description thereof will be omitted.

<Conductive part>

The conductive portion 262 is the same as the conductive portion 254 except that it is patterned. That is, the conductive portion 262 is provided directly on the other surface 252B of the base layer 252. [ 32, the conductive portion 262 includes a light-transmitting resin 255 and a plurality of conductive fibers 256 disposed in the light-transmitting resin 255. [ The conductive portion 262 is electrically conductive from the surface 262A. It is preferable that the conductive fiber 256 is localized on the side of the light transmitting resin base material 251 with respect to the position HL which is half the film thickness of the conductive part 262 as shown in Fig. Other configurations, materials, physical values, and the like of the conductive portion 262 are the same as those of the conductive portion 254, and a description thereof will be omitted here.

<Non-Allocation>

The non-conductive portion 263 is a portion located between the conductive portions 262 and also showing no conductivity. As shown in Fig. 32, the non-conductive portion 263 does not substantially contain the conductive fibers 256. [

Since the non-conductive portion 263 is formed integrally with the conductive portion 262, it is preferable that the non-conductive portion 263 is less than 300 nm. The upper limit of the film thickness of the non-conductive portion 263 is more preferably 145 nm or less, 140 nm or less, 120 nm or less, 110 nm or less, 80 nm or less, and 50 nm or less. The lower limit of the thickness of the non-conductive portion 263 is preferably 10 nm or more. The film thickness of the non-conductive portion 263 is measured by the same method as the film thickness of the conductive portion 13.

As shown in Fig. 32, the non-conductive portion 263 is formed of a light-transmitting resin 255. Fig. The non-conductive portion 263 may be formed by sublimating the conductive fibers 256, and may have a hollow portion 263B in which no conductive fibers are present. In this case, at the time of forming the non-conductive portion 263, the conductive fiber 256 breaks through the region to be non-conductive portion 23 by sublimation and is discharged to the outside, so that the surface 263A of the non-conductive portion 263 is roughened do. The light transmitting resin 255 of the non-conductive portion 263 is the same as the light transmitting resin 255 of the conductive portion 254, and thus the description thereof is omitted here.

&Lt; Method for producing conductive film &gt;

The conductive film 250 can be manufactured, for example, as follows. First, as shown in Fig. 33 (A), a base layer 252 is formed on one surface 251A and a base layer 253 is formed on the other surface 251B. (251). Further, a light-transmitting resin base material in which a base layer is formed on one side and a base layer is not formed on the other side may be prepared.

Next, the conductive fiber-containing composition including the conductive fiber 256 and the dispersion medium is directly applied to the other side 252B of the ground layer 252 and dried to form the lower layer 252B as shown in Fig. A plurality of conductive fibers 256 are directly disposed on the other surface 252B of the layer 252. [ The conductive fiber-containing composition is the same as the conductive fiber-containing composition used in the first embodiment, and thus the description thereof is omitted here.

A plurality of conductive fibers 256 are directly disposed on the other surface 252B of the foundation layer 252 and then a composition for a light transmitting resin containing a polymerizable compound and a solvent is applied and dried to form A coating film 257 of a composition for a light-transmitting resin is formed as shown in Fig. The composition for a light-transmitting resin is the same as the composition for a light-transmitting resin used in the first embodiment, and thus a description thereof will be omitted here.

34 (A), the coating film 257 is cured by irradiating the coating film 257 with ionizing radiation such as ultraviolet rays to polymerize (crosslink) the polymerizable compound to form the light-transmitting resin 255 ).

In the conductive film 250 shown in Fig. 29, since the conductive portion 254 is a solid film, in the above process, the conductive film 250 is obtained. The conductive film 260 shown in Fig. 31 is patterned, and therefore, as in the first embodiment, for example, as shown in Fig. 34 (B) And then irradiating light (for example, an infrared laser) to pattern the conductive portion 262.

According to the present embodiment, the ground layer 252 is provided directly on one surface 251A of the light-transmitting resin base material 251 and the conductive portions 254 and 262 are formed on the other surface 252B of the base layer 252 The hard coat layer is not provided between the light-transmitting resin base material 251 and the ground layer 252 and between the ground layer 252 and the conductive parts 254 and 262. Thereby, the flexibility is excellent. Further, since the conductive portions 254 and 262 are provided directly on the other surface 252B of the base layer 252, the interlayer adhesion is excellent and the interlayer delamination is generated as compared with the case where the conductive portion is provided directly on the light- It is difficult to do. Therefore, even when wiring is formed by using various conductive pastes (for example, silver paste) on the surfaces 254A and 262A of the conductive portions 254 and 262, the conductive portions 254 and 262, It is difficult to peel off from the surfaces 254A and 262A of the semiconductor device. Thereby, the choice of the conductive paste can be widened. Examples of the silver paste include DW-520H-14, DW-520H-18 and DW-520H-19 of TOYO BOSSA Corporation and PA-LTP-AW03 manufactured by PHOENIX MATERIAL.

According to the present embodiment, the conductive fibers 256 in the conductive portions 254 and 262 are disposed on the light transmitting resin base material 251 so as to cover the positions HL of half the film thickness of the conductive portions 254 and 262, The contact points of the conductive fibers 256 can be increased. Thereby, even when the content of the conductive fiber 256 is small, electrical conduction from the surfaces 254A and 262A of the conductive parts 254 and 262 can be ensured, so that a low haze value of 5% or less can be realized . When the conductive part is formed on the surface of the ground layer, the conductive fiber tends to enter the ground layer and the surface resistance value tends to rise. However, since the content of the conductive fiber 256 can be reduced, Can be realized.

According to the present embodiment, the conductive fibers 256 in the conductive portions 254 and 262 are electrically connected to the conductive portions 256 as the entire conductive fibers 256, Permeable resin base material 251 side than the position HL of half the film thickness of the conductive parts 254 and 262, the contact points of the conductive fibers 256 are increased, A low haze value of 5% or less and a low surface resistance value of 200? /? Or less can be realized even when the thickness is reduced to less than 300 nm or to an extremely small thickness of 145 nm or less.

According to the present embodiment, since the conductive fibers 256 are localized to the side of the light-transmitting resin base material 251 with respect to the position HL of the half of the thickness of the conductive parts 254 and 262 in the conductive parts 254 and 262, (256) is covered by the light-transmitting resin (255). As a result, it is possible to suppress the lowering of the conductivity of the conductive fiber 256 due to the reaction with the sulfur, oxygen, and / or halogen in the atmospheric air.

According to the present embodiment, since the conductive fibers 256 are localized in the conductive portions 254 and 262 toward the light-transmitting resin base material 251 side than the positions HL of half the thickness of the conductive portions 254 and 262, Of the conductive fiber, and the surface resistance value can be as good as possible. Further, if the conductive fibers 256 are so unevenly distributed, optical characteristics with a lower haze value can be obtained. The reason why the conductive fibers 256 are unevenly distributed is that it is easier to adjust the hardness of the martens than when the conductive fibers 256 are in a dispersed state. In addition, since the conductive fibers 256 are present in the light-transmitting resin 254 in a dense manner, the hardness can be increased. Further, when considering the composition of the light-transmitting resin 254, Can be obtained. Further, when the Martens hardness is appropriate, flexibility in rolling or rolling can be improved.

In the present embodiment, even when the organic-based dispersion medium is used as the dispersion medium of the conductive fiber-containing composition and the resin fiber content is not contained in the conductive fiber-containing composition or the resin fiber content is included, the content of the resin fiber content is reduced, It is preferable that the conductive fibers 256 in the conductive parts 254 and 262 are positioned closer to the light transmitting resin base material 251 than the position HL of half the film thickness of the conductive parts 254 and 262 in the conductive parts 254 and 262 for the same reason as described in the first embodiment Can be ubiquitous.

The conductive portion 254 is directly provided on the other surface 252B of the base layer 252 by the coating and spreading method and the electric resistance value ratio of the conductive portion 254 is not less than 1 2, the difference in electric resistance value depending on the in-plane direction of the conductive portion 254 can be reduced for the same reason as explained in the first embodiment. As a result, when the conductive film is used for the sensor electrode of the touch panel, restrictions on the electrode pattern and the IC chip are reduced, and restrictions on chamfering are reduced.

According to the present embodiment, when the electrical resistance value ratio of the conductive portion 254 is 2 or more, the electrical resistance value is high in the second direction. However, in the first direction, the electrical resistance value is low . Therefore, for the same reason as explained in the first embodiment, it is possible to provide the conductive film 250 having a lower electric resistance value in a specific direction (first direction).

According to the present embodiment, since the light-transmitting resin 255 of the conductive parts 254 and 262 contains the reaction inhibitor, the same effects as those of the first embodiment can be obtained, Or the lowering of the conductivity of the conductive fiber 256 due to the reaction with the halogen can be further suppressed.

According to the present embodiment, since the reaction suppressing agent is contained in the conductive portion 254, in the state in which the light-transmitting adhesive layer is in contact with the conductive portions 254 and 262 for the same reason as explained in the first embodiment, Even when the test is performed, the reaction of the conductive fibers 256 with the components in the light-transmitting adhesive layer can be suppressed. This makes it possible to widen the selection of the light-transmitting adhesive layer.

Although the conductive films 250 and 260 have been described above, the same effects as those of the conductive films 250 and 260 can be obtained even for the conductive film having a gap between the conductive portions.

The use of the conductive film according to the present embodiment is not particularly limited, but it can be used in an image display apparatus provided with a touch panel. Further, the conductive film can be used, for example, as an electromagnetic wave shield. 35 is a schematic configuration diagram of an image display apparatus according to the present embodiment. In Fig. 35, the members denoted by the same reference numerals as those in Fig. 28 are the same as the members shown in Fig. 28, and a description thereof will be omitted.

<<< Image display device >>>

35, the image display device 270 mainly includes a display panel 180 for displaying an image, a touch panel 280 disposed on the observer side of the display panel 180, And a light-permeable adhesive layer 90 interposed between the touch panel 180 and the touch panel 280.

<< Touch panel >>

The touch panel 280 includes a conductive film 290 and a conductive film 260 disposed on the observer side of the conductive film 290 and a light transmitting cover 260 such as a cover glass disposed on the observer side of the conductive film 260. [ A light-transmissive adhesive layer 72 interposed between the conductive film 290 and the conductive film 260 and a light-transmissive adhesive layer 72 interposed between the conductive film 260 and the light- And a transparent adhesive layer (73).

&Lt; Conductive film &

The conductive film 290 has almost the same structure as the conductive film 260. 35, the conductive film 290 includes a light-transmitting resin base material 291, a ground layer 292 directly provided on one surface 291A of the light-transmitting resin base material 291, The base layer 293 directly provided on the other surface 291B of the transparent resin base material 291 and the surface 292A opposite to the surface 292A side of the base resin layer 292 in the base layer 292 292B, and also has a patterned conductive portion 295. The conductive portions 295, The conductive portion 295 shown in FIG. 35 is a part of the conductive layer 294. The conductive layer 294 is composed of a plurality of conductive portions 295 and a non-conductive portion 296 located between the conductive portions 295. The light-transmitting resin base material 291 and the ground layers 292 and 293 are similar to the light-transmitting resin base material 251 and the ground layers 252 and 253, and therefore the description thereof is omitted here.

(Conductive portion and non-conductive portion)

The conductive portion 295 has the same structure as the conductive portion 262. That is, the conductive portion 295 is made of a light-transmitting resin and conductive fibers. The non-conductive portion 296 is made of a light-transmitting resin and does not substantially contain conductive fibers. The conductive portion 295 is electrically conductive from the surface 295A of the conductive portion 295. [ It is also preferable that the conductive fibers in the conductive portions 295 are localized on the side of the light-transmitting resin base 291 with respect to the position HL of the half of the thickness of the conductive portions 295. The conductive portion 295 may have a structure similar to that of the conductive portion 262, though the conductive portion 295 has the same structure as the conductive portion 262. [

The conductive portion 262 of the conductive film 260 functions as an electrode in the X direction in the projection type capacitive touch panel and the conductive portion 295 of the conductive film 290 functions as a projection- And functions as an electrode in the Y direction in the touch panel, and is similar to Fig. 13 in plan view.

Example

In order to explain the present invention in detail, the present invention will be described with reference to the following examples, but the present invention is not limited to these examples.

&Lt; Preparation of composition for hard coat layer >

First, each component was compounded so as to have the composition shown below to obtain a composition 1 for a hard coat layer.

(Composition 1 for hard coat layer)

A mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (trade name: KAYARAD-PET-30, manufactured by Nippon Kayaku Co., Ltd.): 30 parts by mass

Polymerization initiator (product name: Irgacure (184), manufactured by BASF Japan): 1.5 parts by mass

Methyl ethyl ketone (MEK): 50 parts by mass

Cyclohexanone: 18.5 parts by mass

&Lt; Preparation of silver nanowire-containing composition >

(Silver nanowire-containing composition 1)

(EG) was used as a reducing agent and polyvinylpyrrolidone (PVP: average molecular weight: 1.3 million, manufactured by Aldrich) was used as a form controlling agent and a protective colloid agent. To prepare a silver nanowire-containing composition.

1. Nucleation process

2.0 mL of an EG solution of silver nitrate (silver nitrate silver concentration: 1.0 mol / L) was added at a constant flow rate over 1 minute while stirring 100 mL of the EG solution held at 160 캜 in the reaction vessel. Thereafter, silver ions were reduced while maintaining at 160 캜 for 10 minutes to form silver nuclear particles. The reaction solution had a yellow color derived from the absorption of surface plasmon in nano-sized silver fine particles, and it was confirmed that silver fine particles (nuclear particles) were formed by reducing silver ions. Subsequently, 10.0 mL of PVP EG solution (PVP concentration: 3.0 x 10 ^-1 mol / L) was added at a constant flow rate over 10 minutes.

2. Particle growth process

The reaction solution containing the nuclear particles after completion of the nucleation process was maintained at 160 캜 with stirring and 100 mL of an EG solution of silver nitrate (silver nitrate concentration: 1.0 x 10 ^-1 mol / L) and an EG solution of PVP PVP concentration: 3.0 x 10 &lt; ^-1 &gt; mol / L) was added over 120 minutes at a constant flow rate using the double jet method. The reaction solution was collected every 30 minutes in this particle growth step and confirmed by an electron microscope. As a result, the nuclei formed in the nucleus formation step were grown in the form of a wire with the elapse of time, and new fine particles Was not seen. The fiber diameter and the fiber length of the finally obtained silver nanowire were measured. The fiber diameter of the silver nanowire was 30 nm and the fiber length was 15 m.

3. Demineralized water washing process

After the reaction liquid after completion of the grain growth process was cooled to room temperature, it was subjected to desalination water treatment using an ultrafiltration membrane having a cut-off molecular weight of 0.2 占 퐉, and the solvent was replaced with ethanol. Then, the liquid amount was concentrated to 100 mL to obtain a silver nanowire dispersion liquid. Finally, the silver nanowire-containing composition 1 was obtained by diluting it with ethanol so that the silver nanowire concentration became 0.1 mass%.

When the fiber diameter and the fiber length of the silver nanowire in the nanowire-containing composition 1 were measured, the silver nanowire had a fiber diameter of 30 nm and a fiber length of 15 mu m. The fiber diameter of the silver nanowires was 50 images picked up at 100,000 to 200,000 times using a transmission electron microscope (TEM) (product name: &quot; H-7650 &quot;, Hitachi High Technologies) , The fiber diameters of 100 strands of the conductive fibers were measured, and their arithmetic mean values were obtained. In measuring the fiber diameter, the acceleration voltage was set to 100 kV, the emission current to 10 A, the focusing lens aperture to 1, the objective lens iris to 0, the observation mode to HC and the spot to 2 " The fiber length of the silver nanowire was measured using a scanning electron microscope (SEM) (product name: S-4800 (TYPE2), manufactured by Hitachi High Technologies) at 500,000 to 2,000,000 times of 100 silver nanowires The fiber length was measured, and the fiber length arithmetic average value of the 100-strand silver nanowires was obtained. In measuring the fiber length, the signal selection was set to "SE", the acceleration voltage was set to "3 kV", the emission current was set to "10 μA", and the SE detector was set to "mixed". The fiber length of the silver nanowires was measured using a SEM function of a scanning electron microscope (SEM) (product name "S-4800 (TYPE2)", Hitachi High Technologies) On the imaging screen by software, the fiber length of 100 strands of silver nanowires was measured, and the arithmetic average of fiber lengths of the 100 strands of silver nanowires was obtained. In the measurement of the fiber length, a signal band of "SE", an acceleration voltage of "3 kV", an emission current of "10 μA to 20 μA", an SE detector " The current was set to "Norm", the focus mode was set to "UHR", the condenser lens 1 was set to "5.0", the WD was set to "8 mm", and the tilt was set to "30 °". Also, the TE detector was omitted beforehand. In measuring the fiber diameter of the nanowire, a measurement sample prepared by the following method was used. First, silver nanowire-containing composition 1 was diluted with ethanol to a silver nanowire concentration of 0.05 mass% or less in accordance with the dispersion medium of the composition. Further, one drop of the diluted silver nanowire-containing composition 1 was dropped onto a grid mesh ("# 10-1012 Elastic carbon ELS-C10 STEM Cu100P grid specification") having a carbon support film for observing TEM or STEM, Dried at room temperature, and observed under the above-mentioned conditions to obtain observed image data. Based on this, an arithmetic mean value was obtained. In measuring the fiber length of the nanowire, a measurement sample prepared by the following method was used. First, the silver nanowire-containing composition 1 was applied to the untreated surface of a 50 탆 -thick polyethylene terephthalate (PET) film having a thickness of 50 탆 so as to have a coating amount of 10 mg / m 2 and the dispersion medium was dried to dispose conductive fibers on the surface of the PET film , Thereby producing a conductive film. The conductive film was cut to a size of 10 mm x 10 mm at the center of the conductive film. Then, this cut conductive film was applied to a SEM sample table (model number &quot; 728-45 &quot;, manufactured by Nisshin EM Co., Ltd., inclined sample stand (45 °, 15 mm x 10 mm M4 aluminum) Pt-Pd was sputtered for 20 seconds to 30 seconds to obtain conduction. The fiber diameters and fiber lengths of the following silver nanowires were also determined in the same manner.

(Silver nanowire-containing composition 2)

(Manufactured by Nippon Kayaku Co., Ltd.) and 0.1 part by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (product name &quot; KAYARAD PET-30 &quot;, manufactured by Nippon Kayaku Co., , Manufactured by BASF Co., Ltd.) was added, and silver nanowire-containing composition 2 was obtained in the same manner as silver nanowire-containing composition 1 except that the silver nanowire was diluted with ethanol so that the silver nanowire concentration became 0.1 mass%.

(Silver nanowire-containing composition 3)

Silver Nanowire-containing Composition 3 was obtained in the same manner as Silver Nanowire-containing Composition 1 except that the silver nanowire dispersion was diluted with ethanol so that the silver nanowire concentration was 0.2 mass%.

(Silver nanowire-containing composition 4)

The silver nanowire-containing composition 4 was obtained in the same manner as in the silver nanowire-containing composition 2 except that the silver nanowire dispersion was diluted with ethanol so that the silver nanowire concentration was 0.2 mass%.

(Silver nanowire-containing composition 5)

The silver nanowire-containing composition 5 was obtained in the same manner as the silver nanowire-containing composition 1 except that the silver nanowire having a fiber length of 40 m was obtained by lengthening the reaction time of the grain growth process.

(Silver nanowire-containing composition 6)

1 part by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (trade name: KAYARAD PET-30, available from Nippon Kayaku Co., Ltd.) and a polymerization initiator (product name: Irgacure 184) , Manufactured by BASF Co., Ltd.) was added to the silver nanowire-containing composition 1, thereby obtaining a silver nanowire-containing composition 6 having a silver nanowire concentration of 0.1 mass%.

(Silver nanowire-containing composition 7)

1 part by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (trade name: KAYARAD PET-30, available from Nippon Kayaku Co., Ltd.) and a polymerization initiator (product name: Irgacure 184) , Manufactured by BASF Co., Ltd.) was added, and silver nanowire-containing composition 7 was obtained in the same manner as Silver nanowire-containing composition 1 except that the silver nanowire concentration was diluted with ethanol so that the silver nanowire concentration became 0.2 mass%.

(Silver nanowire-containing composition 8)

1 part by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (trade name: KAYARAD PET-30, available from Nippon Kayaku Co., Ltd.) and a polymerization initiator (product name: Irgacure 184) , Manufactured by BASF Co., Ltd.) was added, and silver nanowire-containing composition 8 was obtained in the same manner as Silver nanowire-containing composition 1 except that the silver nanowire was diluted with ethanol so that the concentration of silver nanowires was 1 mass%.

(Silver nanowire-containing composition 9)

Containing composition 9 (a) was prepared in the same manner as in the silver nanowire-containing composition 1 except that the silver nanowire dispersion was diluted with ethanol and isopropyl alcohol (IPA) so that the concentration of the silver nanowire became 0.1 mass% . The proportion of IPA was 30% by mass of the entire composition.

(Silver nanowire-containing composition 10)

The silver nanowire-containing composition 10 was obtained in the same manner as the silver nanowire-containing composition 9, except that the silver nanowire having a fiber length of 25 mu m was obtained by lengthening the reaction time of the grain growth process.

(Silver nanowire-containing composition 11)

The silver nanowire-containing composition 11 was obtained in the same manner as the silver nanowire-containing composition 9, except that the silver nanowire having a fiber length of 10 μm was obtained by shortening the reaction time of the grain growth process.

(Silver nanowire-containing composition 12)

Containing composition 9, except that the number of times of the desalting and washing treatment was increased and the amount of polyvinylpyrrolidone was reduced to be smaller than the amount of polyvinylpyrrolidone in the silver nanowire-containing composition 1, To obtain the nanowire-containing composition 12.

(Silver nanowire-containing composition 13)

As in the silver nanowire-containing composition 9, except that anion was used instead of isopropyl alcohol (IPA), and the reaction time of the grain growth process was lengthened to obtain silver nanowires having a fiber length of 25 mu m, silver nanowires Thereby obtaining a wire-containing composition 13. The proportion of the anion was 30% by mass of the entire composition.

(Silver nanowire-containing composition 14)

A silver nanowire-containing composition 14 was obtained in the same manner as the silver nanowire-containing composition 9, except that the silver nanowire having a fiber length of 5 m was obtained by shortening the reaction time of the grain growth process.

(Silver nanowire-containing composition 15)

A silver nanowire-containing composition 15 was obtained in the same manner as the silver nanowire-containing composition 9, except that the silver nanowire having a fiber length of 40 m was obtained by lengthening the reaction time of the grain growth process.

(Silver nanowire-containing composition 16)

Like the composition 9 containing silver nanowires, except that the number of times of desalting and washing treatment was reduced and the amount of polyvinylpyrrolidone was made larger than the amount of polyvinylpyrrolidone in the silver nanowire-containing composition 1, To obtain a nanowire-containing composition 16.

(Silver nanowire-containing composition 17)

Silver nanowire-containing composition 17 was obtained in the same manner as Silver nanowire-containing composition 9 except that the silver nanowire dispersion was diluted with ethanol and isopropyl alcohol so that the silver nanowire concentration was 0.2 mass%.

(Silver nanowire-containing composition 18)

A silver nanowire-containing composition 18 was obtained in the same manner as in the silver nanowire-containing composition 9 except that ethanol was used in place of ethanol and isopropyl alcohol.

(Silver nanowire-containing composition 19)

Except that silver nanowire-containing composition 1 and silver nanowire-containing composition 1 were diluted with ethanol and ananone so that the silver nanowire concentration became 0.1 mass% and the solvent ratio of the diluted anon was 30 mass% instead of ethanol. Similarly, silver nanowire-containing composition 19 was obtained.

(Silver nanowire-containing composition 20)

(Manufactured by Nippon Kayaku Co., Ltd.) and 0.1 part by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (product name &quot; KAYARAD PET-30 &quot;, manufactured by Nippon Kayaku Co., , Manufactured by BASF Co., Ltd.) was added, and silver nanowire-containing composition 19 (manufactured by BASF) was further diluted with ethanol and anion so that the concentration of silver nanowires became 0.1 mass% and the dilution of ananone solvent became 30 mass% , A silver nanowire-containing composition 20 was obtained.

(Silver nanowire-containing composition 21)

Silver nanowire dispersion was diluted with ethanol and anion such that the silver nanowire concentration was 0.2 mass% and the diluted ananine solvent ratio was 30 mass%. In the same manner as the silver nanowire-containing composition 19, silver nanowires A wire-containing composition 21 was obtained.

(Silver nanowire-containing composition 22)

Silver nanowire dispersion liquid was prepared in the same manner as silver nanowire-containing composition 20 except that silver nanowire concentration was 0.2 mass% and diluted with ethanol and anion so that the solvent ratio of diluted anan was 30 mass% A wire-containing composition 22 was obtained.

(Silver nanowire-containing composition 23)

A silver nanowire-containing composition 23 was obtained in the same manner as the silver nanowire-containing composition 19, except that the silver nanowire having a fiber length of 40 m was obtained by lengthening the reaction time of the grain growth process.

&Lt; Composition for light transmitting resin &

Each component was blended so as to obtain the composition shown below to obtain a composition 1 for a light-transmitting resin.

(Composition 1 for light transmitting resin)

5 parts by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (trade name: KAYARAD-PET-30, available from Nippon Kayaku Co., Ltd.)

- 0.25 parts by mass of a polymerization initiator (product name: Irgacure (184), manufactured by BASF Japan)

Methyl ethyl ketone (MEK): 70 parts by mass

Cyclohexanone: 24.75 parts by mass

(Composition 2 for a light-transmitting resin)

5 parts by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (trade name: KAYARAD-PET-30, available from Nippon Kayaku Co., Ltd.)

· 2-Methylthio-benzothiazole (manufactured by Tokyo Kasei Kogyo Co., Ltd.): 0.1 part by weight

- 0.25 parts by mass of a polymerization initiator (product name: Irgacure (184), manufactured by BASF Japan)

Methyl ethyl ketone (MEK): 70 parts by mass

Cyclohexanone: 24.75 parts by mass

&Lt; Example A and Comparative Example A &gt;

<Example A1>

First, a 50 占 퐉 thick polyethylene terephthalate film (trade name: Cosmo Shine A4100, Toyobo Co., Ltd.) having a base layer on one surface as a light-transmitting substrate was prepared, and the hard coat layer composition 1 was coated on the underlayer side of the polyethylene terephthalate film To form a coating film. Subsequently, dry air at 50 DEG C was passed through the formed coating film at a flow rate of 0.5 m / s for 15 seconds, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s and dried to evaporate the solvent in the coating film , And ultraviolet rays were irradiated so that the accumulated light quantity became 100 mJ / cm &lt; 2 &gt; to harden the coating film, thereby forming a hard coat layer having a thickness of 2 m as the light-transmitting functional layer.

After forming the hard coat layer, the silver nanowire-containing composition 1 was applied on the untreated surface of the polyethylene terephthalate film opposite to the side where the hard coat layer was formed so as to be 10 mg / m 2. Subsequently, dry air at 50 캜 was flown at a flow rate of 0.5 m / s for 15 seconds to the applied silver nanowire-containing composition 1, and then dried air at 70 캜 was flown at a flow rate of 10 m / s for 30 seconds, The dispersion medium in the wire-containing composition 1 was evaporated to place silver nanowires on the surface of the hard coat layer.

Subsequently, the above-mentioned composition 1 for a light-transmitting resin was coated so as to cover the silver nanowires to form a coating film. Then, dry air at 50 DEG C was passed through the formed coating film at a flow rate of 0.5 m / s for 15 seconds, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s and dried to evaporate the solvent in the coating film And the ultraviolet rays are irradiated so as to have an integrated light amount of 100 mJ / cm 2 to cure the coating film to form a light transmitting resin having a film thickness of 100 nm, and a 100 nm thick conductive film made of silver nanowires arranged in the light transmitting resin and the light transmitting resin Thereby obtaining a conductive film. In addition, the conductive portion according to Example A1 was a non-patterned solid film type.

The film thickness of the conductive portion according to Example A1 was determined by randomly measuring the thickness of 10 portions from the cross-sectional photograph of the conductive portion photographed using a scanning transmission electron microscope (STEM) or a transmission electron microscope (TEM) As the mean value. The photographing of the specific cross-sectional photograph was performed by the following method. First, a sample for cross section observation was prepared from the conductive film. Specifically, a conductive film cut into 2 mm x 5 mm was placed in a silicone-based foaming plate, and an epoxy resin was introduced, and the entire conductive film was embedded in a resin. Thereafter, the formed resin was allowed to stand at 65 캜 for 12 hours or more and cured. Thereafter, using an ultra-microtome (trade name: Ultra Microtom EM UC7, manufactured by Leica Microsystems), the delivery thickness was set to 100 nm, and an ultra slim piece was produced. The prepared thin section was sampled with a mesh 150 having a colloid membrane to prepare a STEM sample. Thereafter, a cross-sectional photograph of a sample for STEM was taken using a scanning transmission electron microscope (STEM) (product name: S-4800 (TYPE2), manufactured by Hitachi High Technologies). At the time of photographing the cross section photograph, the detector (selection signal) was set to "TE", the acceleration voltage was set to 30 kV, and the emission was set to 10 μA. As for the magnification, the focus was adjusted to suitably adjust the contrast and brightness to 5000 to 200,000 times while observing whether or not each layer could be discriminated. A preferable magnification is 10,000 to 50,000 times, and more preferably, 25,000 to 40,000 times. If the magnification is too high, the pixel at the layer interface becomes rough and becomes difficult to understand. Therefore, it is better not to increase the magnification in the film thickness measurement. Further, at the time of photographing a cross-sectional photograph, the aperture was set to be 3, the objective lens aperture to 3, and the W.D. to 8 mm. In all of the examples and comparative examples as well as the example A1, the film thickness of the conductive part was measured by this method.

&Lt; Example A2 >

In Example A2, a conductive film was obtained in the same manner as in Example A1 except that the composition for light-transmitting resin 2 was used instead of the composition for light-transmitting resin 1.

<Example A3>

In Example A3, a silver nanowire-containing composition 2 was used in place of the silver nanowire-containing composition 1, and the coating amount of the composition for a light-transmitting resin was adjusted so that the thickness of the entire conductive portion was 100 nm. , A conductive film was obtained. Further, when silver nanowire-containing composition 2 was applied and dried, a coating film containing silver nanowires and resin components was formed.

<Example A4>

In Example A4, a conductive film was obtained in the same manner as in Example A1 except that silver nanowire-containing composition 3 was used instead of silver nanowire-containing composition 1.

<Example A5>

In Example A5, a silver nanowire-containing composition 4 was used in place of the silver nanowire-containing composition 1, and the coating amount of the composition for a light-transmitting resin was adjusted so that the thickness of the entire conductive portion was 100 nm. , A conductive film was obtained. Further, when the silver nanowire-containing composition 4 was applied and dried, a coating film containing silver nanowires and resin components was formed.

<Example A6>

In Example A6, a 50 占 퐉 thick polyethylene terephthalate film (trade name: Cosmo Shine A4300, available from Toyobo Co., Ltd.) having undercoat layers on both sides as a light-transmitting substrate was prepared, and on one side of the polyethylene terephthalate film, Coating Layer Composition 1 was applied to form a coating film. Subsequently, dry air at 50 DEG C was passed through the formed coating film at a flow rate of 0.5 m / s for 15 seconds, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s and dried to evaporate the solvent in the coating film , And ultraviolet rays were irradiated so that the accumulated light quantity became 100 mJ / cm &lt; 2 &gt; to harden the coating film, thereby forming a hard coat layer having a thickness of 2 m as the light-transmitting functional layer. Subsequently, a hard coat layer was formed on the other underlayer side of the polyethylene terephthalate film in the same manner as described above, and a film having a hard coat layer on both sides was produced. Then, the silver nanowire-containing composition 1 was applied onto the hard coat layer formed on the other ground layer side, and a conductive portion having a thickness of 100 nm was formed in the same manner as in Example A1, thereby obtaining a conductive film. In addition, the conductive part according to Example A6 was a solid film type that was not patterned.

<Example A7>

In Example A7, a silver nanowire-containing composition 2 was used in place of the silver nanowire-containing composition 1, and the coating amount of the composition for a light-transmitting resin was adjusted so that the thickness of the entire conductive portion was 100 nm. , A conductive film was obtained. Further, when silver nanowire-containing composition 2 was applied and dried, a coating film containing silver nanowires and resin components was formed.

<Example A8>

In Example A8, a conductive film was obtained in the same manner as in Example A6 except that silver nanowire-containing composition 3 was used instead of silver nanowire-containing composition 1.

<Example A9>

In Example A9, a silver nanowire-containing composition 4 was used in place of the silver nanowire-containing composition 1, and the coating amount of the composition for a light-transmitting resin was adjusted so that the thickness of the entire conductive portion was 100 nm. , A conductive film was obtained. Further, when the silver nanowire-containing composition 4 was applied and dried, a coating film containing silver nanowires and resin components was formed.

<Example A10>

In Example A10, a conductive film was obtained in the same manner as in Example A1 except that silver nanowire-containing composition 5 was used instead of silver nanowire-containing composition 1.

&Lt; Comparative Example A1 &

In Comparative Example A1, a conductive film was obtained in the same manner as in Example A1 except that the silver nanowire-containing composition 6 was used instead of the silver nanowire-containing composition 1.

&Lt; Comparative Example A2 >

In Comparative Example A2, a conductive film was obtained in the same manner as in Example A1, except that the silver nanowire-containing composition 7 was used instead of the silver nanowire-containing composition 1.

&Lt; Comparative Example A3 &

In Comparative Example A3, a conductive film was obtained in the same manner as in Example A1 except that the silver nanowire-containing composition 8 was used instead of the silver nanowire-containing composition 1.

&Lt; Comparative Example A4 >

In Comparative Example A4, a conductive film was obtained in the same manner as in Example A6 except that silver nanowire-containing composition 6 was used instead of silver nanowire-containing composition 1.

&Lt; Comparative Example A5 &

In Comparative Example A5, a conductive film was obtained in the same manner as in Example A1 except that no light-transmitting resin was formed.

&Lt; Comparative Example A6 &

In Comparative Example A6, a conductive film was obtained in the same manner as in Example A1 except that the thickness of the light-transmitting resin was changed from 100 nm to 50 nm.

&Lt; Comparative Example A7 &

In Comparative Example A7, a conductive film was obtained in the same manner as in Example A1 except that the thickness of the light-transmitting resin was changed from 100 nm to 400 nm.

<Evaluation of ubiquitous silver nanowires>

In the conductive films according to Examples A1 to A10 and Comparative Examples A1 to A4, A6 and A7, the silver nanowires are distributed as a whole from the half of the thickness of the conductive portion in the conductive portion to the polyethylene terephthalate film side . Specifically, first, a sample for observation of a cross section was produced from a conductive film. Specifically, a conductive film cut into 2 mm x 5 mm was placed in a silicone-based foaming plate, and an epoxy resin was introduced, and the entire conductive film was embedded in a resin. Thereafter, the formed resin was allowed to stand at 65 캜 for 12 hours or more and cured. Thereafter, using an ultra-microtome (trade name: Ultra Microtom EM UC7, manufactured by Leica Microsystems), the delivery thickness was set to 100 nm, and an ultra slim piece was produced. The prepared thin section was sampled with a mesh (150 mesh) equipped with a colloid membrane to prepare a STEM sample. Thereafter, a cross-sectional photograph of a sample for STEM was taken using a scanning transmission electron microscope (STEM) (product name: S-4800 (TYPE2), manufactured by Hitachi High Technologies). At the time of photographing of this cross-sectional photograph, the focus is adjusted at 5000 to 200,000 times for the magnification for performing STEM observation with the detector (selection signal) being "TE", the acceleration voltage at 30 kV, and the emission current at 10 μA , And contrast and brightness were appropriately adjusted so that each layer could be discriminated. A preferable magnification is 10,000 to 100,000 times, more preferably 1 to 10,000 times, and most preferably 2.5 to 50,000 times. Further, at the time of photographing the sectional photograph, the aperture was set to "beam monitor aperture 3", the objective lens aperture was set to "3", and the W.D. was set to "8 mm". Then, the cross-sectional photographs of the 10 photographs thus prepared were prepared. Then, the cross-sectional photographs are enlarged to the pixel level. In each cross-sectional photograph, the number of pixels in which the silver nanowires located on the polyethylene terephthalate film side are displayed from the half of the film thickness of the conductive portion and the film thickness The silver nanowires located on the surface side of the conductive part from the half position of the silver nanowire are counted and the silver nanowires are positioned on the polyethylene terephthalate film side from the half position with respect to the total number of pixels on which silver nanowires are displayed The ratio of the number of pixels in which the silver nanowires are displayed is obtained. In the case where the pixel on which the silver nanowire is displayed extends over the half position, a portion existing on the side of the polyethylene terephthalate film from the half position and a portion on the side of the surface of the conductive portion And one pixel is divided based on the area ratio of the divided portion. Then, the ratio obtained from each cross-sectional photograph is obtained as the ratio of the conductive fibers located on the polyethylene terephthalate film side from the half of the film thickness of the conductive portion, and the arithmetic average value of the existing ratio obtained from each cross- And when the average value was 55% or more, it was assumed to be localized on the side of the polyethylene terephthalate film. In addition, the conductive film of Comparative Example A5 was not provided with a light-transmitting resin and thus was not evaluated.

<Total light transmittance measurement>

The conductive films according to Examples A1 to A10 and Comparative Examples A1 to A7 were subjected to measurement in accordance with JIS K7361-1: 1997 using a haze meter (product name &quot; HM-150 &quot;, product of Murakami Shikisai Gijutsu Kenkyujo Co., And the light transmittance was measured. The total light transmittance was a value measured on the entire conductive film and was cut to a size of 50 mm x 100 mm. Thereafter, the conductive part side was set to be the light source side without curling or wrinkling, And an arithmetic average value of the values obtained by three measurements of one conductive film was also used.

<Haze measurement>

In the conductive films according to Examples A1 to A10 and Comparative Examples A1 to A7, a conductive film was produced in accordance with JIS K7136: 2000 using a haze meter (product name: &quot; HM-150 &quot;, product of Murakami Shikisai Gijutsu Kenkyujo Co., And the haze value (total haze value) was measured. The haze value is a value measured on the entire conductive film and is cut to a size of 50 mm x 100 mm. Thereafter, the conductive part side is provided on the side of the non-light source side without curling or wrinkling, , And an arithmetic mean value of values obtained by measuring three times with respect to one conductive film.

&Lt; Measurement of surface resistance value &

In the conductive films according to Examples A1 to A10 and Comparative Examples A1 to A7, a contact type resistivity meter (trade name: Loresta AX MCP (trade name), manufactured by Tokyo Kasei Kogyo Co., Ltd.) conforming to JIS K7194: 1994 -T370 type, manufactured by Mitsubishi Chemical Corporation, terminal shape: ASP probe) was used to measure the surface resistance value of the conductive part. The measurement of the surface resistance value by the contact type resistivity meter was carried out by placing the conductive film cut into a size of 80 mm x 50 mm on a flat glass plate and placing the conductive part on the upper surface side so that the conductive film was in a uniform plane state, Was placed at the center of the conductive portion, and all the electrode pins were uniformly pressed to the conductive portion. In measurement by the contact type resistivity meter, Ω / □, which is a mode for measuring the sheet resistance, was selected. Thereafter, the start button was pressed and held, and measurement results were obtained. Further, when the film thickness of the light-transmitting resin is large, the resistance value may become extremely large when the surface resistance value is measured by the resistivity meter. In this case, it is impossible to distinguish whether the light-transmitting resin has poor conductivity between the silver nanowires and whether conduction from the surface of the conductive part is not taken. For this reason, the surface resistance value of the conductive part was also measured with an non-destructive resistivity meter (product name: EC-80P, manufactured by Nippon Co., Ltd.) using an eddy current method. The measurement of the surface resistance value by the non-destructive resistivity meter was carried out by arranging a conductive film cut into a size of 80 mm x 50 mm on a flat glass plate so that the conductive portion side was the upper surface and the conductive film was in a flat plane state, . In measurement by the non-destructive resistivity meter, SW2 is selected and a sheet resistance measurement Ω / □ of the mode MH is selected. A probe having a measurement range of 10 to 1000 Ω / □ and a probe of 0.5 to 10 Ω / □ Respectively. The surface resistance value was measured at three points in the central portion of the conductive film, and the surface resistance value was an arithmetic mean value of the surface resistance values at three points. The surface resistance was measured in an environment of 23 캜 and a relative humidity of 55% regardless of the type of the resistivity meter. The resistance value was measured by using a conductive film which was not subjected to the following test.

&Lt; Absence test >

In the conductive films according to Examples A1 to A10 and Comparative Examples A1 to A7, a standing test was performed to leave a conductive film in air at room temperature. Specifically, in order to accelerate the evaluation, a pressure-sensitive adhesive tape (product number "7210F" manufactured by Nitto Denko Co., Ltd., 24 mm width) containing a large amount of sulfur component was laminated on a polyethylene terephthalate film (product name "A4300" And the adhesive tape side was placed so as to be in contact with the conductive portion, and left in this state for one week. The position of the adhesive tape was arranged so as to be located at the center of 80 mm x 50 mm which was later cut out. In the conductive films according to Examples A1 to A10 and Comparative Examples A1 to A6, under the environment of 23 deg. C and a relative humidity of 55%, before and after the standing test, the conductive films were cut out in the size of 80 mm x 50 mm (Trade name: "Loresta AX MCP-T370" manufactured by Mitsubishi Chemical Corporation, manufactured by Mitsubishi Kagaku Analytec Co., Ltd.) in accordance with JIS K7194: 1994 (Resistance test method of 4-probe method of conductive plastic) The surface resistance value (unit: Ω / □) was measured by using a surface roughness measuring device (shape: ASP probe), and the degree of surface resistance after the test was compared with the surface resistance value before the test was evaluated. The thickness of the light-transmitting resin is large, and therefore, when the surface resistance value of the conductive part is measured by the contact type resistivity meter, the surface resistance value is covered too much, The non-destructive resistivity meter (product name &quot; EC-80P &quot;, manufactured by Nippon Co., Ltd.) using the eddy current method is used instead of the contact type resistivity meter because there is a possibility that the rate of increase of the surface resistance value after the non- And the surface resistances of the respective conductive portions before and after the stationary test were measured and evaluated in the same manner as described above. In the Loresta AX MCP-T370 type, the probe had a surface resistance value of 0.01? /? , And when the surface resistance value is less than or equal to 0.5? /? And less than 10? / ?, select "Middle", and the surface resistance value is not less than 10? /? , &Quot; SuperHigh &quot; is selected when the surface resistance value is 1000 Ω / □ or more and 3000 Ω / □ or less. In the EC-80P, the probe has a measurement range of 10 To 1000 OMEGA / &amp; squ &amp; The rising rate of the surface resistance value is defined as the rate of increase of the surface resistance value by A and the surface resistance value of the conductive portion before the neutralization test B &quot;, and the surface resistance value of the conductive portion after the test was &quot; C &quot;. The surface resistance value B before the neutralization test and the surface resistance value C after the neutralization test were measured at three central portions of the conductive part in the cut conductive film and the surface resistance value was calculated by the arithmetic average value of the three surface resistance values Respectively. The surface resistance value B before the abandonment test was obtained by randomly measuring the surface resistance value of the surface of the conductive portion before the abandonment test at 10 points and using the arithmetic mean value of the measured surface resistance values at 10 points, As for the value C, the surface resistance value of the surface of the conductive portion after the neutralization test was randomly measured at 10 points, and the arithmetic average value of the surface resistances of the 10 points was used.

A = (C-B) / B x 100

?: The rise rate of the surface resistance value after the test for the surface resistance before the neutralization test in the conductive part was within 10%.

?: The rise rate of the surface resistance value after the test for the surface resistance value before the neutralization test in the conductive portion exceeded 10% and was within 50%.

X: Increase rate of the surface resistance value after the standing test against the surface resistance value before the standing test in the conductive portion exceeded 50%.

&Lt; Measurement of hardness of Martens &

In the conductive films according to Examples A1 to A7 and Comparative Examples A1 to A7, the martens hardness of the conductive portion at the position where the pressing amount from the surface of the conductive portion was 10 nm and the pressing amount of the conductive portion at the position of 100 nm from the surface of the conductive portion Martens hardness were measured. Specifically, first, a conductive glass film cut into a size of 20 mm x 20 mm was placed on a slide glass commercially available on the side of the conductive part with an adhesive resin (trade name: AARON ALPHA (registered trademark) Respectively. Specifically, the above-mentioned adhesive resin was dripped onto the center of a slide glass 1 (product name: "Slide glass (cut type 1-9645-11)" manufactured by Asuzon Co., Ltd.). At this time, the adhesive resin was not painted and expanded, and as described later, one drop was added so that the adhesive resin did not come out from the conductive film when the paste was spread. Thereafter, the conductive film cut into the above-mentioned size is brought into contact with the slide glass so that the conductive part is on the upper face and the adhesive resin is positioned on the center part of the conductive film, and the adhesive resin is spread between the slide glass 1 and the conductive film, Respectively. Then, a new slide glass 2 with a star was placed on the conductive film to obtain a laminated body of slide glass 1 / adhesive resin / conductive film / slide glass 2. Subsequently, a weight of 30 g to 50 g was placed on the slide glass 2, and left at room temperature for 12 hours in this state. Thereafter, the weights and the slide glass 2 were separated and used as measurement samples. The sample for measurement was fixed to a measuring stage of a microhardness tester (product name: PICODENTOR HM500, manufactured by Fisher Instruments, ISO 14577-1, ASTM E2546, manufactured in accordance with ASTM E2546) provided parallel to the anti-vibration table. This fixation was carried out by attaching a tape (product name: "CELLOTAPE (registered trademark), Nichi reflector") to the four sides of the slide glass 1. After the measurement sample was fixed on the measurement stage of the microhardness tester, And the hardness of the martens at a position of 100 nm were respectively measured. The hardness of the martens was measured by measuring arbitrary five points near the center of the surface of the conductive portion of the measurement sample (region where the adhesive resin exists) The arbitrary five points to be measured were observed by observing the conductive parts at a magnification of 50 to 500 times using a microscope equipped with a Picodenter HM500 and the conductive fibers were overlapped in the conductive parts A portion having an extreme convex structure and a portion having an extreme concave structure are avoided and a portion having a flatness as much as possible is selected. As above, when calculating the Martens hardness, the hardness of the type you wish to measure the Pico indenter HM500 selected the Martens hardness "HM".

(Measuring conditions)

· Indenter shape: Vickers (square-pyramid diamond indenter) (square angle horn with 136 ° of facing angle at the tip)

· Load control system: Up to 40mN

· Increase time of load: 20 seconds

Creep time: 5 seconds

· Load removal time: 20 seconds

(At the time of measurement of the martens hardness at the indentation amount of 10 nm), 100 nm (at the measurement of the martens hardness at the indentation amount of 100 nm)

· Temperature during measurement: 25 ℃

· Humidity at measurement: 50%

The profile of the measurement was 20 seconds, loaded from 0 mN to 40 mN, held at 40 mN for 5 seconds, and then returned from 40 mN to 0 mN after 20 seconds.

&Lt; Measurement of Ratio of Electrical Resistance Value &

In a plane of the conductive films according to Examples A1 to A10, an arbitrary direction was determined, and rectangular samples having a length of 110 mm in length and a width of 5 mm in 6 directions every 30 degrees including the arbitrary direction in the arbitrary direction were electrically conductive I cut it out of the film. After the sample was cut out from the conductive film, silver paste (product name "DW-520H-14", Toyobo Co., Ltd.) was cured at a thickness of 5 μm or more and 10 μm or more Mu m or less and heated at 130 DEG C for 30 minutes to obtain a sample provided with silver paste cured at both ends. The measurement distance of the electric resistance value in each sample provided with the silver paste cured at both ends was made constant at 100 mm. Then, the electrical resistance value of each sample provided with the silver paste cured at both ends was measured using a tester (product name: Digital MΩ Hitester3454-11, manufactured by Hioki Denki Co., Ltd.). Specifically, since Digital MΩ Hitester 3454-11 has two probe terminals (a red probe terminal and a black probe terminal, both of which are in the form of a pin), the red probe terminal is brought into contact with the cured silver paste provided at one end, The black probe terminal was brought into contact with the cured silver paste provided at the other end to measure the electrical resistance value. A sample having the lowest electric resistance value among the samples cut out from these six directions was found. When the sample is said to be cut out from the first direction of the conductive film, a sample cut out from a second direction orthogonal to the first direction is sought, and the electric resistance of the sample cut out from the second direction is compared with the electric resistance value of the sample cut out from the first direction. The ratio of the resistance value was obtained. The electrical resistance value was measured in an environment of 23 캜 and a relative humidity of 55%. The ratio of the electrical resistance values was an arithmetic mean value of the values obtained by three measurements.

The results are shown in Tables 1 and 2 below.

In the conductive films of Comparative Examples A1, A2, and A4, since the silver nanowires were not localized to the polyethylene terephthalate film side from the half of the film thickness of the conductive portion, the haze value was low but the surface resistance value was high . This is presumably because the resin content in the conductive fiber-containing composition is large, and the resin component enters between the silver nanowires. In addition, the rate of increase in the surface resistance value after the test for the surface resistance before the abandonment test was large. It is considered that this is because the film thickness of the light-transmitting resin is thin, so that the nanowire reacts with sulfur, oxygen, and / or halogen in the air to lower the conductivity.

In the conductive film of Comparative Example A3, since the content of the silver nanowires was increased although the resin content in the conductive fiber-containing composition was increased, the silver nanowires were localized to the polyethylene terephthalate film side from the half of the film thickness of the conductive portion , And the surface resistance value was also low. However, since the silver nanowire content was increased, the haze value was high. In addition, the rate of increase in the surface resistance value after the test for the surface resistance before the abandonment test was large.

In the conductive films of Comparative Examples A5 and A6, since the thickness of the light-transmitting resin or the light-transmitting resin is thin, the silver nanowires are distributed to the polyethylene terephthalate film side from the half of the film thickness of the conductive portion And the rate of increase of the surface resistance value after the test for the surface resistance value before the standing test was extremely large.

In the conductive film of Comparative Example A7, the silver nanowires were localized to the polyethylene terephthalate film side from the half of the film thickness of the conductive portion. However, since the film thickness of the light-transmitting resin was large, the conduction from the surface of the conductive portion was secured I could not. For this reason, although the haze value was low, the surface resistance value was extremely high.

On the contrary, in the conductive films according to Examples A1 to A10, the silver nanowires were localized to the polyethylene terephthalate film side from the half of the film thickness of the conductive portion, and conduction from the surface of the conductive portion was ensured, The haze value was low, and the surface resistance value was also low. Further, in the conductive films of Examples 1 to 8, since the rate of increase of the surface resistance value after the test for the surface resistance before the neutralization test was small, the metal nanowires reacted with sulfur, oxygen, and / Can be suppressed and deterioration of conductivity in the conductive portion can be suppressed.

In the conductive films according to Examples A1 and A2, a conductive adhesive film (trade name: "OCA8146-2", manufactured by 3M Co., Ltd.) was pasted on the surface of the conductive portion and the conductive film was placed in an environment of 85 ° C. and 85% The surface resistance value of the conductive part of the conductive part after the resistance to humidity and humidity was 10% with respect to the surface resistance value before the resistance to moisture and humidity. In the conductive film of Example A2, the rate of increase of the surface resistance value after the resistance to humidity and humidity test with respect to the surface resistance value before the resistance to humidity and humidity test in the conductive portion was 5%. The surface resistance value and the rate of increase of the surface resistance value were obtained by the same method as the rate of increase of the surface resistance value and the surface resistance value in the above-mentioned stand-by test.

Samples of 5.5 inches (length 16: width = 9) were formed in a rectangular shape in which conductive portions of the conductive films of Examples A1 to A10 were patterned and the surface resistance value was measured in the bezel portion by the procedure described in the above- The surface resistance value was 40? /? To 60? /?, And the line resistance value was measured at six places by the procedure described in the above embodiment, and the ratio of the electric resistance value was found to be 1.21 to 1.35 .

&Lt; Example B and Comparative Example B &gt;

&Lt; Example B1 >

First, a 50 占 퐉 thick polyethylene terephthalate film (trade name: Cosmo Shine A4100, Toyobo Co., Ltd.) having a base layer on one surface as a light-transmitting substrate was prepared, and the hard coat layer composition 1 was coated on the underlayer side of the polyethylene terephthalate film To form a coating film. Subsequently, dry air at 50 DEG C was passed through the formed coating film at a flow rate of 0.5 m / s for 15 seconds, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s and dried to evaporate the solvent in the coating film , And ultraviolet rays were irradiated so that the accumulated light quantity became 100 mJ / cm &lt; 2 &gt; to harden the coating film, thereby forming a hard coat layer having a thickness of 2 m as the light-transmitting functional layer.

After forming the hard coat layer, the silver nanowire-containing composition 1 was applied on the untreated surface of the polyethylene terephthalate film opposite to the side where the hard coat layer was formed so as to be 10 mg / m 2. Next, the applied silver nanowire-containing composition 9 was passed through the dried air at 50 DEG C for 15 seconds at a flow rate of 0.5 m / s, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s, The dispersion medium in the wire-containing composition 9 was evaporated to place silver nanowires on the surface of the hard coat layer.

Subsequently, the above-mentioned composition 1 for a light-transmitting resin was coated so as to cover the silver nanowires to form a coating film. Then, dry air at 50 DEG C was passed through the formed coating film at a flow rate of 0.5 m / s for 15 seconds, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s and dried to evaporate the solvent in the coating film And the ultraviolet rays are irradiated so as to have an integrated light amount of 100 mJ / cm 2 to cure the coating film to form a light transmitting resin having a film thickness of 100 nm, and a 100 nm thick conductive film made of silver nanowires arranged in the light transmitting resin and the light transmitting resin Thereby obtaining a conductive film. In addition, the conductive portion according to Example B1 was a solid film type that was not patterned.

&Lt; Example B2 >

In Example B2, a conductive film was obtained in the same manner as in Example B1, except that the composition for light-transmitting resin 2 was used instead of the composition for light-transmitting resin 1.

&Lt; Example B3 >

In Example B3, a conductive film was obtained in the same manner as in Example B1, except that the silver nanowire-containing composition 10 was used instead of the silver nanowire-containing composition 9.

&Lt; Example B4 >

In Example B4, a conductive film was obtained in the same manner as in Example B1 except that silver nanowire-containing composition 11 was used instead of silver nanowire-containing composition 9.

&Lt; Example B5 &

In Example B5, a conductive film was obtained in the same manner as in Example B1, except that the silver nanowire-containing composition 12 was used instead of the silver nanowire-containing composition 9.

<Example B6>

In Example B6, a conductive film was obtained in the same manner as in Example B1, except that the application temperature of the silver nanowire-containing composition 9 was changed to all the drying temperatures of 40 占 폚.

<Example B7>

In Example B7, a conductive film was obtained in the same manner as in Example B1 except that the silver nanowire-containing composition 13 was used instead of the silver nanowire-containing composition 9.

<Example B8>

In Example (8), a conductive film was obtained in the same manner as in Example B1 except that silver nanowire-containing composition 14 was used instead of silver nanowire-containing composition 9.

&Lt; Comparative Example B1 >

In Comparative Example B1, a conductive film was obtained in the same manner as in Example B1, except that the silver nanowire-containing composition 15 was used instead of the silver nanowire-containing composition 9.

&Lt; Comparative Example B2 &

In Comparative Example B2, a conductive film was obtained in the same manner as in Example B1 except that the silver nanowire-containing composition 16 was used instead of the silver nanowire-containing composition 9.

&Lt; Comparative Example B3 >

In Comparative Example B3, the silver nanowire-containing composition 17 was used in place of the silver nanowire-containing composition 9, and the amount of the silver nanowire-containing composition 17 was changed to 5 mg / m &lt; 2 & A film was obtained.

&Lt; Comparative Example B4 &

In Comparative Example B4, a conductive film was obtained in the same manner as in Example B1 except that the silver nanowire-containing composition 18 was used in place of the silver nanowire-containing composition 9.

&Lt; Comparative Example B5 &

In Comparative Example B5, a conductive film was obtained in the same manner as in Example B1, except that the application temperature of the silver nanowire-containing composition 9 was changed to 100 deg.

&Lt; Measurement of Ratio of Electrical Resistance Value &

The ratio of the electric resistance value was measured under the same measurement conditions as in Example A within the plane of the conductive film of Examples B1 to B8 and Comparative Examples B1 to B5 and the ratio of the electric resistance value of the sample cut out from the first direction And the ratio of the electric resistance value of the sample cut out from the second direction was obtained.

<Evaluation of ubiquitous silver nanowires>

In the conductive films according to Examples B1 to B8 and Comparative Examples B1 to B5, under the same conditions as in Example A, silver nanowires were formed as a whole from a position half the film thickness of the conductive portion in the conductive portion, It was examined whether or not it was localized to the phthalate film side.

<Total light transmittance measurement>

With respect to the conductive films of Examples B1 to B8 and Comparative Examples B1 to B5, the total light transmittance was measured under the same measurement conditions as in Example A.

<Haze measurement>

In the conductive films according to Examples B1 to B8 and Comparative Examples B1 to B5, the haze value (total haze value) of the conductive film was measured under the same measurement conditions as in Example A.

&Lt; Measurement of surface resistance value &

In the conductive films according to Examples B1 to B8 and Comparative Examples B1 to B5, the resistance value of the surface of the conductive portion was measured under the same measurement conditions as in Example A.

&Lt; Absence test >

In the conductive films according to Examples B1 to B8 and Comparative Examples B1 to B5, the test was carried out under the same conditions as in Example A, and the surface resistance value before the test was measured in the same manner as in Example A1. The degree of increase in the surface resistance value was evaluated. The evaluation criteria were as follows.

?: The rise rate of the surface resistance value after the test for the surface resistance before the neutralization test in the conductive part was within 10%.

?: The rise rate of the surface resistance value after the test for the surface resistance value before the neutralization test in the conductive portion exceeded 10% and was within 50%.

X: Increase rate of the surface resistance value after the standing test against the surface resistance value before the standing test in the conductive portion exceeded 50%.

&Lt; Measurement of hardness of Martens &

In the conductive films according to Examples B1 to B8 and Comparative Examples B1 to B5, the martens hardness of the conductive portion at the position where the amount of indentation from the surface of the conductive portion was 10 nm and the surface roughness The hardness of the Martens hardness of the conductive part at the position where the indentation amount of 100 nm was measured.

The results are shown in Tables 3 and 4 below.

As shown in Table 3, in the conductive film of Comparative Example B1, since the electric resistance value ratio was 2 or more, the difference in electric resistance value depending on the in-plane direction of the conductive portion was not reduced. This is because silver nanowires tend to be aligned in some direction immediately after application of the silver nanowire-containing composition and are relaxed during the drying process, but because the silver nanowire fiber length is too long, during drying, It is thought that the arrangement of the wires is not solved.

In the conductive film of Comparative Example B2, since the electric resistance value ratio was 2 or more, the difference in the electric resistance value depending on the in-plane direction of the conductive portion was not reduced. This is presumably because the amount of polyvinylpyrrolidone was too large, and therefore, the arrangement of silver nanowires was not solved during thickening at the initial stage of drying and during drying.

In the conductive film of Comparative Example B3, since the electric resistance value ratio was 2 or more, the difference in the electric resistance value depending on the in-plane direction of the conductive portion was not reduced. This is presumably because the concentration of silver nanowires in the silver nanowire-containing composition was high and the amount of coating was small, so that drying was quick and the arrangement of silver nanowires was not eliminated during drying.

In the conductive film of Comparative Example B4, since the electric resistance value ratio was 2 or more, the difference in the electric resistance value depending on the in-plane direction of the conductive portion was not reduced. This is presumably because the ethanol was faster in drying than in the case of containing isopropyl alcohol and the arrangement of silver nanowires was not eliminated during drying.

In the conductive film of Comparative Example B5, since the electric resistance value ratio was 2 or more, the difference in electric resistance value depending on the in-plane direction of the conductive portion was not reduced. This is probably due to the fact that the drying temperature was too high and the drying was quick and the arrangement of the silver nanowires was not eliminated during drying.

On the contrary, as shown in Table 3, in the conductive films according to Examples B1 to B8, since the electric resistance value ratio was 1 or more and less than 2, the difference in electric resistance value depending on the in- The surface resistance was also low. Further, in the conductive film according to Example B8, the reason why the surface resistance value was high is considered to be that the fiber length of the silver nanowire was too short.

In the conductive films of Examples B1 and B2, a conductive adhesive film (product name: "OCA8146-2" manufactured by 3M Co., Ltd.) was pasted on the surface of the conductive portion and the conductive film was placed in an environment of 85 ° C. and 85% The surface resistance value of the conductive part of the conductive part after the resistance to moisture and humidity was 10% with respect to the surface resistance value before the resistance to moisture and humidity. In the conductive film of Example B2, the rate of increase of the surface resistance value after the resistance to humidity and humidity test with respect to the surface resistance value before the resistance to humidity and humidity test in the conductive portion was 5%. The surface resistance value and the rate of increase of the surface resistance value were obtained by the same method as the rate of increase of the surface resistance value and the surface resistance value in the above-mentioned stand-by test.

Samples of 5.5 inches (length 16: width = 9) in a rectangular shape obtained by patterning the conductive portions of the conductive films of Examples B1 to B8 were prepared and the surface resistance value was measured at the bezel portion by the procedure described in the above embodiment. The surface resistance value was 40? /? To 60? /?, And the line resistance value was measured at six places by the procedure described in the above embodiment, and the ratio of the electric resistance value was found to be 1.21 to 1.35 .

&Lt; Example C and Comparative Example C &gt;

&Lt; Example C1 >

First, a polyethylene terephthalate film (trade name: Cosmo Shine A4100, manufactured by Toyobo Co., Ltd.) having a thickness of 50 占 퐉 as a light-transmitting resin substrate having a base layer formed on one side thereof was prepared. On the surface of the polyethylene terephthalate film , The silver nanowire-containing composition 19 was applied directly to a concentration of 10 mg / m 2. Subsequently, dry air at 50 캜 was flown at a flow rate of 0.5 m / s for 15 seconds to the applied silver nanowire-containing composition 1, and then dried air at 70 캜 was flown at a flow rate of 10 m / s for 30 seconds, The silver nanowires were directly placed on the surface of the polyethylene terephthalate film on which the ground layer was not formed by evaporating the dispersion medium in the wire-containing composition 19.

Subsequently, the above-mentioned composition 1 for a light-transmitting resin was coated so as to cover the silver nanowires to form a coating film. Then, dry air at 50 DEG C was passed through the formed coating film at a flow rate of 0.5 m / s for 15 seconds, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s and dried to evaporate the solvent in the coating film And the ultraviolet light was irradiated so that the accumulated light amount became 100 mJ / cm 2 to cure the coating film to form a light transmitting resin having a film thickness of 100 nm. On the surface of the polyethylene terephthalate film on which the ground layer was not formed, a light- To obtain a conductive film directly provided with a conductive portion having a thickness of 100 nm made of silver nanowires arranged in the resin. In addition, the conductive part according to the embodiment (1) was a solid film type without patterning.

&Lt; Example C2 >

In Example C2, a conductive film was obtained in the same manner as in Example C1 except that the composition for light-transmitting resin 2 was used instead of the composition for light-transmitting resin 1.

&Lt; Example C3 >

In Example C3, except that the silver nanowire-containing composition 20 was used instead of the silver nanowire-containing composition 19 and the coating amount of the light-transmitting resin composition 1 was adjusted so that the thickness of the entire conductive portion was 100 nm, (1), a conductive film was obtained. Further, when the silver nanowire-containing composition 20 was applied and dried, a coating film containing silver nanowires and resin components was formed.

&Lt; Example C4 >

In Example C4, a conductive film was obtained in the same manner as in Example C1 except that the silver nanowire-containing composition 21 was used instead of the silver nanowire-containing composition 19.

&Lt; Example C5 >

In Example C5, except that silver nanowire-containing composition 22 was used in place of silver nanowire-containing composition 19, and the coating amount of the composition for light-transmitting resin was adjusted so that the thickness of the entire conductive portion was 100 nm, , A conductive film was obtained. Further, when the silver nanowire-containing composition 22 was applied and dried, a coating film containing silver nanowires and a resin component was formed.

&Lt; Example C6 >

In Example C6, a conductive film was obtained in the same manner as in Example C1 except that the silver nanowire-containing composition 23 was used instead of the silver nanowire-containing composition 19.

&Lt; Example C7 &

In Example C7, in place of the polyethylene terephthalate film, in the same manner as in Example C1, except that a cycloolefin polymer base (product name: "ZF-16", manufactured by Nippon Zeon Co., Ltd.) To obtain a conductive film.

<Example C8>

In Example C8, in place of the polyethylene terephthalate film, in each of Examples C1 and C2, except that a polycarbonate substrate (trade name: "C110-100" Similarly, a conductive film was obtained.

&Lt; Comparative Example C1 &

In Comparative Example C1, the thickness of a light-transmitting resin base material having a base layer on both sides instead of a 50 占 퐉 -thick polyethylene terephthalate film (trade name: Cosmo Shine A4100, manufactured by Toyobo Co., Ltd.) as a light- Except that a silver nano wire-containing composition 19 was applied to a surface of a polyethylene terephthalate film (trade name: Cosmo Shine A4300, manufactured by Toyobo Co., Ltd.) having a thickness of 50 μm and a base layer on one side of the polyethylene terephthalate film was coated, , A conductive film was obtained.

&Lt; Comparative Example C2 >

In Comparative Example C2, a conductive film was obtained in the same manner as in Comparative Example C1, except that the silver nanowire-containing composition 20 was used instead of the silver nanowire-containing composition 19.

&Lt; Comparative Example C3 &

In Comparative Example C3, a conductive film was obtained in the same manner as in Comparative Example (1) except that the silver nanowire-containing composition 21 was used instead of the silver nanowire-containing composition 19.

&Lt; Comparative Example C4 >

In Comparative Example C4, a conductive film was obtained in the same manner as in Comparative Example (1) except that the silver nanowire-containing composition 22 was used instead of the silver nanowire-containing composition 19.

&Lt; Comparative Example C5 &

In Comparative Example C5, a conductive film was obtained in the same manner as in Comparative Example C1, except that a light-transmitting resin was not formed.

&Lt; Comparative Example C6 >

In Comparative Example C6, a conductive film was obtained in the same manner as in Comparative Example C1, except that the film thickness of the light-transmitting resin was changed from 100 nm to 400 nm.

&Lt; Comparative Example C7 &

First, a polyethylene terephthalate film (trade name: Cosmo Shine A4300, Toyobo Co., Ltd.) having a thickness of 50 占 퐉 as a light-transmitting resin substrate having undercoat layers on both surfaces thereof was prepared. On one surface of the polyethylene terephthalate film, The hard coat layer composition 1 was applied to form a coating film. Subsequently, dry air at 50 DEG C was passed through the formed coating film at a flow rate of 0.5 m / s for 15 seconds, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s and dried to evaporate the solvent in the coating film , And ultraviolet rays were irradiated so that the accumulated light quantity became 100 mJ / cm 2 to cure the coating film, thereby forming a hard coating layer having a thickness of 2 탆.

After the hard coat layer was formed, the silver nanowire-containing composition 19 was directly applied to the surface of the hard coat layer so as to be 10 mg / m 2. Subsequently, dry air at 50 캜 was flown at a flow rate of 0.5 m / s for 15 seconds to the coated silver nanowire-containing composition 19, and then dried air at 70 캜 was flown at a flow rate of 10 m / s for 30 seconds, The dispersion medium in the wire-containing composition 1 was evaporated to place silver nanowires on the surface of the hard coat layer.

Subsequently, the above-mentioned composition 1 for a light-transmitting resin was coated so as to cover the silver nanowires to form a coating film. Then, dry air at 50 DEG C was passed through the formed coating film at a flow rate of 0.5 m / s for 15 seconds, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s and dried to evaporate the solvent in the coating film Permeable resin having a thickness of 100 nm was formed by irradiating ultraviolet rays with a cumulative light amount of 100 mJ / cm &lt; 2 &gt; to cure the coating film, and a film thickness of silver nanowires disposed in the light- A conductive film having a conductive portion of 100 nm was obtained. In addition, the conductive part of Comparative Example C7 and the non-patterned solid film type were used.

&Lt; Measurement of surface resistance value &

In the conductive films according to Examples C1 to C8 and Comparative Examples C1 to C7, the resistance value of the surface of the conductive portion was measured under the same measurement conditions as in Example A.

<Total light transmittance measurement>

With respect to the conductive films of Examples C1 to C8 and Comparative Examples C1 to C7, the total light transmittance was measured under the same measurement conditions as in Example A. [

<Haze measurement>

In the conductive films according to Examples C1 to C8 and Comparative Examples C1 to C7, the haze value (total haze value) of the conductive film was measured under the same measurement conditions as in Example A.

<Evaluation of ubiquitous silver nanowires>

In the conductive films of Examples C1 to C8 and Comparative Examples C1 to C4, C6, and C7, the silver nanowires as a whole under the same conditions as those of Example A were formed to have a thickness of To a substrate side such as a polyethylene terephthalate film. In addition, the conductive film of Comparative Example C5 was not provided with a light-transmitting resin and thus was not evaluated.

<Evaluation of Flexibility>

In the conductive films according to Examples C1 to C8 and Comparative Examples C1 to C7, a folding test was conducted to evaluate the flexibility. Specifically, first, an arbitrary direction is determined in the plane of the conductive portion of the conductive film, and a rectangular sample of 125 mm long × 50 mm wide in six directions every 30 ° in any arbitrary direction Six sheets were cut out from the conductive film. After the sample was cut out from the conductive film, silver paste (product name: DW-520H-14, manufactured by Toyobo Co., Ltd.) was applied to a portion of 10 mm in length and 50 mm in width on both ends of each long side surface of each sample. And a sample having a silver paste cured at both ends was obtained. In addition, the measurement distance of the electrical resistance value in each sample provided with the silver paste cured at both ends was made constant at 105 mm. Then, the electrical resistance value of each sample provided with the silver paste cured at both ends was measured using a tester (product name: Digital MΩ Hitester 3354-11, manufactured by Hioki Denki Co., Ltd.). Specifically, since Digital MΩ Hitester 3454-11 has two probe terminals (a red probe terminal and a black probe terminal, both of which are in the form of a pin), the red probe terminal is brought into contact with the cured silver paste provided at one end, The black probe terminal was brought into contact with the cured silver paste provided at the other end to measure the electrical resistance value. Then, a sample having the lowest electric resistance value was selected from the samples cut out from these six directions. Thereafter, the short side (50 mm) side of the selected sample was fixed to the durability testing machine (product name "DLDMLH-FS", manufactured by Yuasa System Instruments Co., Ltd.) (The test of folding the surface of the conductive part on the side of the conductive part by 180 占 (the test of folding the conductive part to be inward and the base to be outward) to be 10 (the outside of the bent part is 3.0 mm) . After performing the folding test, the electrical resistance value of the surface of the conductive portion was measured in the same manner as the sample before the folding test in the sample after the folding test. Then, the ratio of the electrical resistance value (the electrical resistance value of the sample before the selected folding test / the sample electrical resistance value after the folding test) as the ratio of the sample electrical resistance value after the folding test to the electrical resistance value of the sample before the selected folding test was obtained. Further, a new sample, which was cut from the conductive film according to Examples and Comparative Examples in the same manner as described above and was similarly measured by measuring the electric resistance value, was placed on the durability testing machine in the same manner as described above, ° The folding test (the test of folding the conductive part to the outer side and the base to make the inner side) was performed 100,000 times. Similarly, the electrical resistance value of the surface of the sample conductive part after the folding test was measured. Then, the result of the folding test was evaluated as flexibility based on the following criteria. The ratio of the electric resistance values was an arithmetic mean value of the values obtained by three measurements.

?: In any of the folding tests, the electrical resistance value ratio was 1.5 or less.

?: In any of the folding tests, the electrical resistance value ratio exceeded 1.5 and was 3 or less.

X: The electrical resistance value ratio exceeded 3 in any of the folding tests.

&Lt; Measurement of Ratio of Electrical Resistance Value &

The ratio of the electrical resistance value was measured under the same measurement conditions as in Example A and the electrical resistance of the sample cut out from the second direction with respect to the electrical resistance value of the sample cut out from the first direction .

&Lt; Absence test >

In the conductive films according to Examples C1 to C8 and Comparative Examples C1 to C7, the test was carried out under the same conditions as in Example A, and in the same manner as in Example A, The degree of increase in the surface resistance value was evaluated. The evaluation criteria were as follows.

?: The rise rate of the surface resistance value after the test for the surface resistance before the neutralization test in the conductive part was within 10%.

?: The rise rate of the surface resistance value after the test for the surface resistance value before the neutralization test in the conductive portion exceeded 10% and was within 50%.

X: Increase rate of the surface resistance value after the standing test against the surface resistance value before the standing test in the conductive portion exceeded 50%.

&Lt; Measurement of hardness of Martens &

In the conductive films according to Examples C1 to C8 and Comparative Examples C1 to C7, the martens hardness of the conductive portion at the position where the amount of indentation from the surface of the conductive portion was 10 nm and the hardness of the conductive portion The hardness of the Martens hardness of the conductive part at the position where the indentation amount of 100 nm was measured.

The results are shown in Tables 5 and 6 below.

As shown in Table 5, in the conductive films of Comparative Examples C1 to C6, since the ground layer was provided between the base material such as the polyethylene terephthalate base material and the conductive portion, the surface resistance value was high. This is thought to be due to the fact that silver nanowires have entered the underlayer.

In the conductive film of Comparative Example C7, since the hard coat layer was provided between the base material such as the polyethylene terephthalate base material and the conductive portion, the flexibility was poor and the electrical resistance value ratio before and after the folding test was high. This is considered to be because cracks or fractures occur in the conductive film by the folding test, and the conductivity is lowered.

On the contrary, as shown in Table 5, in the conductive films according to Examples C1 to C8, the conductive part was directly provided on the surface of the substrate such as the polyethylene terephthalate substrate, and the surface resistance value was low. In addition, since no hard coat layer was provided between the substrate and the conductive portion, good flexibility was obtained.

In the conductive films according to Examples C1 and C2, a conductive adhesive film (product name: "OCA8146-2", manufactured by 3M Co., Ltd.) was pasted on the surface of the conductive portion and the conductive film was placed in an environment of 85 ° C. and 85% The resistance value of the surface resistance value after the resistance to humidity and humidity was 10% with respect to the surface resistance value before the resistance to humidity and humidity test in the conductive part in the conductive film of Example C1 was 10% In the conductive film of Example C2, the rate of increase of the surface resistance value after the resistance to humidity and humidity test with respect to the surface resistance value before the resistance to humidity and humidity test in the conductive portion was 5%. The surface resistance value and the rate of increase of the surface resistance value were obtained by the same method as the rate of increase of the surface resistance value and the surface resistance value in the above-mentioned stand-by test.

Samples having a rectangular shape of 5.5 inches (length 16: width = 9) were formed by patterning the conductive portions of the conductive films of Examples C1 to C8 and the surface resistance value was measured at the bezel portion by the procedure described in the above embodiment. The surface resistance value was 40? /? To 60? /?, And the line resistance value was measured at six places by the procedure described in the above embodiment, and the ratio of the electric resistance value was found to be 1.21 to 1.35 .

&Lt; Example D and Comparative Example D &gt;

<Example D1>

First, a polyethylene terephthalate film (trade name: Cosmo Shine A4300, Toyobo Co., Ltd.) having a thickness of 50 占 퐉 as a light-transmitting resin substrate having undercoat layers on both surfaces thereof was prepared. On one surface of the polyethylene terephthalate film, Was directly applied with the nanowire-containing composition 1 to be 10 mg / m ² . Subsequently, dry air at 50 캜 was flown at a flow rate of 0.5 m / s for 15 seconds to the applied silver nanowire-containing composition 1, and then dried air at 70 캜 was flown at a flow rate of 10 m / s for 30 seconds, The silver nanowires were directly placed on the surface of the polyethylene terephthalate film on which the ground layer was formed by evaporating the dispersion medium in the wire-containing composition 1.

Subsequently, the above-mentioned composition 1 for a light-transmitting resin was coated so as to cover the silver nanowires to form a coating film. Then, dry air at 50 DEG C was passed through the formed coating film at a flow rate of 0.5 m / s for 15 seconds, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s and dried to evaporate the solvent in the coating film Permeable resin having a thickness of 100 nm was formed by irradiating ultraviolet rays with an accumulated light quantity of 100 mJ / cm &lt; ² &gt; so as to cure the coating film. On the surface of the polyethylene terephthalate film on which the underlayer was formed, To thereby obtain a conductive film directly provided with a conductive portion having a thickness of 100 nm made of silver nanowires. In addition, the conductive part according to the embodiment D1 was a solid film type that was not patterned.

&Lt; Example D2 >

In Example D2, a conductive film was obtained in the same manner as in Example D1 except that the composition for light-transmitting resin 2 was used in place of the composition for light-transmitting resin 1.

&Lt; Example D3 >

In Example D3, the silver nanowire-containing composition 2 was used in place of the silver nanowire-containing composition 1, and the coating amount of the light-transmitting resin composition 1 was adjusted so that the thickness of the entire conductive portion was 100 nm. A conductive film was obtained in the same manner as in D1. Further, when silver nanowire-containing composition 2 was applied and dried, a coating film containing silver nanowires and resin components was formed.

<Example D4>

In Example D4, a conductive film was obtained in the same manner as in Example D1 except that silver nanowire-containing composition 3 was used instead of silver nanowire-containing composition 1.

<Example D5>

In Example D5, a silver nanowire-containing composition 4 was used in place of the silver nanowire-containing composition 1, and the coating amount of the composition for a light-transmitting resin was adjusted so that the thickness of the entire conductive portion was 100 nm. , A conductive film was obtained. Further, when the silver nanowire-containing composition 4 was applied and dried, a coating film containing silver nanowires and resin components was formed.

<Example D6>

In Example D6, a conductive film was obtained in the same manner as in Example D1 except that silver nanowire-containing composition 5 was used instead of silver nanowire-containing composition 1.

<Example D7>

In Example D7, a conductive film was obtained in the same manner as in Example D1, except that silver nanowire-containing composition 19 was used instead of silver nanowire-containing composition 1.

&Lt; Comparative Example D1 >

First, a polyethylene terephthalate film (trade name: Cosmo Shine A4300, Toyobo Co., Ltd.) having a thickness of 50 占 퐉 as a light-transmitting resin substrate having undercoat layers on both surfaces thereof was prepared. On one surface of the polyethylene terephthalate film, The hard coat layer composition 1 was applied to form a coating film. Subsequently, dry air at 50 DEG C was passed through the formed coating film at a flow rate of 0.5 m / s for 15 seconds, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s and dried to evaporate the solvent in the coating film , And ultraviolet rays were irradiated so that the accumulated light quantity became 100 mJ / cm &lt; ² &gt; to cure the coating film, thereby forming a hard coat layer having a thickness of 2 m.

After the formation of the hard coat layer, the silver nanowire-containing composition 1 was directly applied to the surface of the hard coat layer so as to be 10 mg / m ² . Subsequently, dry air at 50 캜 was flown at a flow rate of 0.5 m / s for 15 seconds to the applied silver nanowire-containing composition 1, and then dried air at 70 캜 was flown at a flow rate of 10 m / s for 30 seconds, The dispersion medium in the wire-containing composition 1 was evaporated to place silver nanowires on the surface of the hard coat layer.

Subsequently, the above-mentioned composition 1 for a light-transmitting resin was coated so as to cover the silver nanowires to form a coating film. Then, dry air at 50 DEG C was passed through the formed coating film at a flow rate of 0.5 m / s for 15 seconds, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s and dried to evaporate the solvent in the coating film Permeable resin having a film thickness of 100 nm was formed by irradiating ultraviolet rays with a cumulative light amount of 100 mJ / cm &lt; ² &gt; to cure the coating film, and a film made of silver nanowires disposed in the light- Thereby obtaining a conductive film having a conductive portion with a thickness of 100 nm. In addition, the conductive portion relating to Comparative Example D1 was a non-patterned solid film type.

&Lt; Comparative Example D2 &

In Comparative Example D2, a conductive film was obtained in the same manner as in Comparative Example D1 except that the silver nanowire-containing composition 2 was used instead of the silver nanowire-containing composition 1.

&Lt; Comparative Example D3 >

In Comparative Example D3, a conductive film was obtained in the same manner as in Comparative Example D1 except that the silver nanowire-containing composition 3 was used instead of the silver nanowire-containing composition 1.

&Lt; Comparative Example D4 &

In Comparative Example D4, a conductive film was obtained in the same manner as in Comparative Example D1 except that the silver nanowire-containing composition 4 was used instead of the silver nanowire-containing composition 1.

&Lt; Comparative Example D5 &

In Comparative Example D5, a conductive film was obtained in the same manner as in Comparative Example D1, except that a light-transmitting resin was not formed.

&Lt; Comparative Example D6 >

In Comparative Example D6, a conductive film was obtained in the same manner as in Comparative Example D1, except that the film thickness of the light-transmitting resin was changed from 100 nm to 400 nm.

&Lt; Comparative Example D7 &

First, a polyethylene terephthalate film (trade name: Cosmo Shine A4100, manufactured by Toyobo Co., Ltd.) having a thickness of 50 占 퐉 as a light-transmitting resin substrate having a base layer formed on one side thereof was prepared. On the surface of the polyethylene terephthalate film , The silver nanowire-containing composition 1 was directly applied to be 10 mg / m ² . Subsequently, dry air at 50 캜 was flown at a flow rate of 0.5 m / s for 15 seconds to the applied silver nanowire-containing composition 1, and then dried air at 70 캜 was flown at a flow rate of 10 m / s for 30 seconds, By evaporating the dispersion medium in the wire-containing composition 1, silver nanowires were directly placed on the surface of the polyethylene terephthalate film on which the ground layer was not formed.

Subsequently, the above-mentioned composition 1 for a light-transmitting resin was coated so as to cover the silver nanowires to form a coating film. Then, dry air at 50 DEG C was passed through the formed coating film at a flow rate of 0.5 m / s for 15 seconds, and then dried at 70 DEG C for 30 seconds at a flow rate of 10 m / s and dried to evaporate the solvent in the coating film Then, ultraviolet light was irradiated so that the accumulated light amount became 100 mJ / cm ² to cure the coating film, thereby forming a light transmitting resin having a film thickness of 100 nm. On the surface of the polyethylene terephthalate film on which the ground layer was not formed, A conductive film directly provided with a conductive portion made of silver nanowires arranged in the light-transmitting resin was obtained. In addition, the conductive portion according to Comparative Example D7 was a solid film type without patterning.

<Evaluation of Flexibility>

The electrical resistance values of the conductive films of Examples D1 to D7 and Comparative Examples D1 to D7 were measured under the same measurement conditions as in Example C by performing a folding test. Flexibility was evaluated in the same manner as in Example C. The evaluation criteria were as follows.

?: In any of the folding tests, the electrical resistance value ratio was 1.5 or less.

?: In any of the folding tests, the electrical resistance value ratio exceeded 1.5 and was 3 or less.

X: The electrical resistance value ratio exceeded 3 in any of the folding tests.

<Adhesion Test>

In the conductive films of Examples D1 to D7 and Comparative Examples D1 to D7, the adhesion of the cured silver paste was evaluated. Specifically, first, the conductive films according to Examples D1 to D7 and Comparative Examples D1 to D7 were cut into a size of 150 mm × 150 mm, respectively, and three conductive films of this size were prepared. In the first conductive film, Silver paste 2 (product name &quot; DW-520H-19 &quot;) was applied to the surface of the conductive part of the second electroconductive film by the screen printing method, Ltd.) was applied by a screen printing method, and silver paste 3 (product name: DW-520H-18, Toyobo Co., Ltd.) was applied to the surface of the conductive part by a screen printing method in the third conductive film. After the silver paste was applied to the surface of the conductive part, the silver paste coated with silver paste was heated at 130 캜 for 30 minutes to form a cured silver paste having a thickness of 7 탆 on the surface of the conductive part of the conductive film . The cross-cut test was performed on the conductive film on which the cured silver paste was formed under the environment of 23 ° C and 55% relative humidity, respectively, and the adhesion between the conductive film and the cured silver paste was evaluated. Specifically, the cured silver paste formed on the conductive portion was cut into cut-board eyes of 10 squares x 10 squares in the direction orthogonal to each other at intervals of 1 mm using a cutter knife. The cut wound penetrates through the cured silver paste and is deep enough to reach the polyethylene terephthalate film. An adhesive tape (model number &quot; No.405 &quot;, Nichiree Reflector, 24 mm width) was pasted on the surface of the cured silver paste on which the checkerboard eyes were formed so as to cover all of the checkerboards and one end of the attached adhesive tape was gripped , And was kept in a substantially perpendicular direction to the surface of the cured silver paste to be momentarily peeled off. This adhesive tape was repeatedly applied and peeled five times in succession, and the adhesiveness was evaluated by the number of coating films remaining on the checkerboard after repeating this five times. The evaluation results were as follows. In addition, when the number of the remaining portions was 100, that is, when there was no dropout, 100/100 was indicated.

O: 100/100

?: 80/100 to 99/100

X: 0/100 to 79/100

&Lt; Measurement of surface resistance value &

In the conductive films according to Examples D1 to D7 and Comparative Examples D1 to D7, the resistance value of the surface of the conductive portion was measured under the same measurement conditions as in Example A.

<Total light transmittance measurement>

With respect to the conductive films of Examples D1 to D7 and Comparative Examples D7 to D7, the total light transmittance was measured under the same measurement conditions as in Example A. [

<Haze measurement>

In the conductive films according to Examples D1 to D7 and Comparative Examples C1 to C7, the haze value (total haze value) of the conductive film was measured under the same measurement conditions as in Example A.

<Evaluation of ubiquitous silver nanowires>

In the conductive films according to Examples D1 to D7 and Comparative Examples D1 to D4, D6 and D7, the silver nanowires as a whole under the same conditions as in Example A, To a substrate side such as a polyethylene terephthalate film. In addition, the conductive film of Comparative Example D5 did not include a light-transmitting resin and was not evaluated.

&Lt; Measurement of Ratio of Electrical Resistance Value &

The ratio of the electric resistance value was measured under the measurement conditions similar to those in Example A within the plane of the conductive film of Examples D1 to D7 and the ratio of the electric resistance value of the sample cut out from the first direction to the electric resistance value of the sample Was calculated.

&Lt; Absence test >

In the conductive films according to Examples D1 to D7 and Comparative Examples D1 to D7, the test was carried out under the same conditions as in Example A, and the surface resistance value before the test was measured in the same manner as in Example A, The degree of increase in the surface resistance value was evaluated. The evaluation criteria were as follows.

?: The rise rate of the surface resistance value after the test for the surface resistance before the neutralization test in the conductive part was within 10%.

?: The rise rate of the surface resistance value after the test for the surface resistance value before the neutralization test in the conductive portion exceeded 10% and was within 50%.

X: Increase rate of the surface resistance value after the standing test against the surface resistance value before the standing test in the conductive portion exceeded 50%.

&Lt; Measurement of hardness of Martens &

In the conductive films according to Examples D1 to D7 and Comparative Examples D1 to D7, the martens hardness of the conductive portion at the position where the amount of indentation from the surface of the conductive portion was 10 nm and the hardness of the conductive portion were measured from the surface of the conductive portion The hardness of the Martens hardness of the conductive part at the position where the indentation amount of 100 nm was measured.

The results are shown in Tables 7 to 9 below.

As shown in Table 7, in the conductive films of Comparative Examples D1 to D6, since the hard coat layer was provided between the ground layer and the conductive portion, flexibility was deteriorated. On the other hand, as shown in Table 7, in the conductive films according to Examples D1 to D7, since the conductive portions were provided directly on the surface of the ground layer, good flexibility was obtained.

Further, as shown in Table 7, in the conductive film of Comparative Example D7, since the conductive portion was directly provided on the polyethylene terephthalate film, the adhesion to the cured silver pastes 1 and 2 was excellent. However, Adhesion to paste 3 was poor. On the contrary, in the conductive films according to Examples D1 to D7, since the conductive portions were directly provided on the surface of the ground layer, the adhesiveness to all of the cured silver pastes 1 to 3 was excellent.

Further, in Comparative Example D6, the surface resistance value measured by the contact type resistivity meter was high because the thickness of the light-transmitting resin was too thick. In Example D7, the surface resistance value was relatively high , Because Anon is a dispersion medium penetrating into the ground layer, it is thought that silver nanowires have entered the ground layer due to the influence of Anon.

In the conductive films according to Examples D1 and D2, a conductive adhesive film (trade name: "OCA8146-2" manufactured by 3M Co., Ltd.) was pasted on the surface of the conductive portion and the conductive film was placed in an environment of 85 ° C. and 85% The surface resistance value of the conductive part of the conductive part after the humidity and humidity resistance test was 10% with respect to the surface resistance value before the humidity and humidity resistance test in the conductive part was 10% In the conductive film of Example D2, the rate of increase of the surface resistance value after the resistance to humidity and humidity test with respect to the surface resistance value before the resistance to humidity and humidity test in the conductive portion was 5%. The surface resistance value and the rate of increase of the surface resistance value were obtained by the same method as the rate of increase of the surface resistance value and the surface resistance value in the above-mentioned stand-by test.

Samples of 5.5 inches (length 16: width = 9) in a rectangular shape obtained by patterning the conductive portions of the conductive films of Examples D1 to D7 were prepared and the surface resistance value was measured at the bezel portion by the procedure described in the above embodiment. The surface resistance value was 40? /? To 60? /?, And the line resistance value was measured at six places by the procedure described in the above embodiment, and the ratio of the electric resistance value was found to be 1.21 to 1.35 .

10, 20, 30, 80, 100, 110, 140, 150, 160, 200, 250, 260,
10A, 20A, 30A, 100A, 110A, 140A, 150A, 160A, 250A, 260A:
11, 81, 101, 141: light-transmitting substrate
12, 82, 102, 142: light-transmitting functional layer
13, 22, 31, 84, 103, 112, 144, 152, 162, 203, 254, 262, 295:
15, 86, 104, 154, 255: light transmitting resin
16, 87, 105, 155, 256: Conductive fiber
21, 83, 111, 143, 161, 202, 261, 294:
40, 120, 170, 270: image display device
50, 180: Display panel
55: display element
70, 130, 190, 280: Touch panel
151, 201, 251, 291: light-transmitting resin substrate

Claims (14)

A light-transmissive conductive film comprising a light-transmitting substrate and a conductive portion provided on at least one side of the light-transmitting substrate,
Wherein the conductive portion includes a light-transmitting resin and a plurality of conductive fibers disposed in the light-transmitting resin,
The conductive portion being electrically conductive from the surface of the conductive portion,
The conductive fibers as a whole are unevenly distributed from the position of one half of the thickness of the conductive portion to the side of the light-transmitting substrate in the conductive portion,
The surface resistance value of the conductive portion is 200? /? Or less,
Wherein the haze value of the conductive film is 5% or less. A light-transmissive conductive film comprising a light-transmitting substrate and a conductive portion provided on one side of the light-transmitting substrate,
Wherein the conductive portion includes a light-transmitting resin and a plurality of conductive fibers disposed in the light-transmitting resin,
On the surface of the conductive part, the electric resistance values in six directions are measured for every 30 degrees including the arbitrary direction with respect to an arbitrary direction, and the direction in which the lowest electric resistance value is obtained is And a ratio of an electrical resistance value in a second direction to an electrical resistance value in the first direction is less than 1 and less than 2,
The surface resistance value of the conductive portion is 200? /? Or less,
Wherein the haze value of the conductive film is 5% or less. A light-transmissive conductive film comprising a light-transmitting resin base material and a conductive portion provided on at least one side of the light-transmissive resin base material,
Wherein the conductive portion includes a light-transmitting resin and a plurality of conductive fibers disposed in the light-transmitting resin,
Wherein the conductive portion is electrically conductive from the surface of the conductive portion,
The conductive part is provided directly on at least one surface of the light-transmitting resin base material,
The surface resistance value of the conductive portion is 200? /? Or less,
Wherein the haze value of the conductive film is 5% or less. A light-transmissive conductive film comprising a light-transmitting resin base material on at least one side thereof, a base layer and a conductive portion in this order,
Wherein the conductive portion includes a light-transmitting resin and a plurality of conductive fibers disposed in the light-transmitting resin,
Wherein the base layer is provided directly on at least one surface of the light-transmitting resin base material,
Wherein the conductive portion is directly provided on the ground layer,
The surface resistance value of the conductive portion is 200? /? Or less,
Wherein the haze value of the conductive film is 5% or less. The conductive film according to any one of claims 1 to 4, wherein the conductive portion does not include particles having a particle diameter exceeding a thickness of the light-transmitting resin. 5. The conductive film according to any one of claims 1 to 4, wherein the conductive portion does not include particles. The method according to claim 3 or 4, wherein electric resistance values in six directions are measured for each of the 30 degrees, including the arbitrary direction, in a predetermined direction on the surface of the conductive portion , A direction in which the lowest electric resistance value is obtained is referred to as a first direction, and a direction orthogonal to the first direction is referred to as a second direction, the electric resistance value in the second direction with respect to the electric resistance value in the first direction Of the conductive film is not less than 1 and not more than 2. The conductive member according to any one of claims 1, 3, and 4, wherein the surface of the conductive portion has an electric resistance value in six directions every 30 占 including the arbitrary direction with respect to an arbitrary direction And a direction in which the lowest electric resistance value is obtained is referred to as a first direction and a direction orthogonal to the first direction is referred to as a second direction, And the ratio of the electric resistance value in the second direction is 2 or more. The conductive film according to any one of claims 1 to 4, wherein the conductive film has a total light transmittance of 80% or more. The conductive film according to any one of claims 1 to 4, wherein the conductive fiber is at least one fiber selected from the group consisting of conductive carbon fibers, metal fibers and metal-coated synthetic fibers. The conductive film according to any one of claims 1, 3, and 4, wherein the conductive fiber has a fiber diameter of 200 nm or less and a fiber length of 1 mu m or more. The conductive film according to claim 2, wherein the conductive fiber has a fiber diameter of 200 nm or less and a fiber length of 1 mu m or more and less than 30 mu m. A touch panel comprising the conductive film according to any one of claims 1 to 4. An image display apparatus comprising the touch panel according to claim 13.

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