KR20190060780A - Sealing composition for LED - Google Patents

Abstract

[PROBLEMS] To provide a sealing composition for LED, a cured product obtained by curing the composition, and an LED device in which the LED element is sealed by the cured product.
(A) A linear organopolysiloxane having three kinds of structural units represented by the following formula (1) and having at least two alkenyl groups bonded to silicon atoms in one molecule,
(R ¹ R ² R ³ SiO _1/2 ) _a (R ⁴ R ⁵ SiO _2/2 ) _b (R ⁶ ₂ SiO _2/2 ) _c (1)
(B) a linear organopolysiloxane having three kinds of structural units represented by the following formula (2) and having at least two hydrogen atoms bonded to silicon atoms in one molecule,
(R ⁷ R ⁸ R ⁹ SiO _1/2 ) _d (R ¹⁰ R ¹¹ SiO _2/2 ) _e (R ¹² ₂ SiO _2/2 ) _f (2)
And
(C) hydrosilylation reaction catalyst
, Wherein at least one of R ⁴ in the formula (1) and R ¹⁰ in the formula (2) represents a biphenylyl group.

Description

Sealing composition for LED

The present invention relates to an LED encapsulant composition, a cured product obtained by curing the composition, and an LED device encapsulated with the LED element by the cured product.

The silicone composition is used for the purpose of protecting an LED element, an electrode, a substrate, and the like in an LED device in that it forms a cured product having excellent rubber properties such as weather resistance, heat resistance, hardness and elongation. In addition, a silver or silver-containing alloy having good conductivity is used as an electrode in an LED device, and silver plating is sometimes applied to the substrate in order to improve brightness.

Generally, when a cured product made of a silicone composition has high gas permeability and is used in a high-brightness LED having a high light intensity and a large heat generation, the cured product of the silicone composition may cause discoloration of the sealing material due to corrosive gas in the environment, There is a problem in that the luminance is lowered by the light emitting diode.

Patent Document 1 discloses a diorganopolysiloxane containing (A) at least two alkenyl groups bonded to silicon atoms, (B) a SiO _4/2 unit, a Vi (R ² ) ₂ SiO _1/2 unit and a R ² ₃ SiO organopolysiloxanes of the resin structure, consisting of a _1/2 units, (C) made in containing organo hydrogen polysiloxane, and (D) the back metal metal-based catalyst containing at least two hydrogen atoms bonded to silicon atoms in a molecule An addition-curable silicone composition has been proposed.

However, this addition-curable silicone composition easily permeates the corrosive gas in the environment, and the silver plated on the electrode or the substrate is easily corroded.

Patent Document 2 discloses an organopolysiloxane represented by (A) an average unit formula, (B) a linear organopolysiloxane having at least two alkenyl groups in one molecule and not having silicon atom-bonded hydrogen atoms, (C ) An organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in one molecule, and (D) a hydrosilylation catalyst application catalyst.

The curable silicone composition described in Patent Document 2 is an organopolysiloxane having high hydrosilylation reactivity and forming a cured product having low gas permeability, a curable silicone composition having a high reactivity and forming a cured product having low gas permeability , And a cured product having low gas permeability.

However, even if the electrode or the substrate is sealed with the curable silicone composition described in Patent Document 2, the silver plating is corroded in an environment of 80 占 폚 under a sulfur atmosphere, for example, There is a problem in that the brightness of the light is reduced.

Japanese Patent Application Laid-Open No. 2000-198930 Japanese Patent Application Laid-Open No. 2014-84417

SUMMARY OF THE INVENTION An object of the present invention is to provide an LED encapsulant composition which is excellent in heat resistance and adhesion to an LED substrate and which does not corrode silver plating even under a severe environment of 80 DEG C in a sulfur atmosphere, A cured product obtained by curing the composition, and an LED device in which the LED element is sealed by the cured product.

DISCLOSURE OF THE INVENTION The inventors of the present invention have made intensive investigations to solve the above problems. As a result, they have found that (A) an encapsulating material composition for LEDs having three kinds of structural units and having at least two alkenyl groups bonded to silicon atoms in one molecule (B) a linear organopolysiloxane having three kinds of structural units and having at least two hydrogen atoms bonded to silicon atoms in one molecule, and (C) a hydrosilylation reaction catalyst. When at least one of the organopolysiloxane (A) and the organopolysiloxane (B) is constituted of an organopolysiloxane having a biphenylyl group bonded to a silicon atom when constituting the composition, an LED Sealing material has excellent heat resistance transparency and adhesion to an LED substrate and found that the silver plating does not corrode even in a severe environment of 80 deg. C under a sulfur atmosphere, thereby completing the present invention.

That is, the present invention provides, as a first aspect,

(A) a linear organopolysiloxane having three kinds of structural units represented by the following formula (1) and having at least two alkenyl groups bonded to silicon atoms in one molecule,

(R ¹ R ² R ³ SiO _1/2 ) _a (R ⁴ R ⁵ SiO _2/2 ) _b (R ⁶ ₂ SiO _2/2 ) _c (1)

(Wherein R ¹ represents an alkenyl group having 2 to 12 carbon atoms, R ² represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms, and R ³ represents an aryl group having 6 to 20 carbon atoms group or a carbon atom represents a group of atoms from 1 to 12, R ⁴ represents an aryl group or a biphenylyl of carbon atoms from 6 to 20, R ⁵ is an alkyl group of carbon atoms from 6 to 20 aryl group or a carbon atom number of 1 to 12 of the represents, two R ⁶ represents an alkyl group of carbon atoms from 6 to 20 carbon atoms or aryl group of 1 to 12, a, b and c are, respectively, 0.01≤a≤0.5, 0.01≤b≤0.7, 0.1≤c Lt; = 0.9, and a + b + c = 1.)

(B) a linear organopolysiloxane having three kinds of structural units represented by the following formula (2) and having at least two hydrogen atoms bonded to silicon atoms in one molecule,

(R ⁷ R ⁸ R ⁹ SiO _1/2 ) _d (R ¹⁰ R ¹¹ SiO _2/2 ) _e (R ¹² ₂ SiO _2/2 ) _f (2)

(Wherein R ⁷ represents a hydrogen atom, R ⁸ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms, R ⁹ represents an aryl group having 6 to 20 carbon atoms, R ¹¹ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms and R ¹² represents an alkyl group having 1 to 12 carbon atoms; R ¹⁰ represents an aryl group or a biphenyl group having 6 to 20 carbon atoms; R ¹¹ denotes an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms; D, e and f each represent an integer of 0.01? D? 0.5, 0.01? E? 0.7, 0.1? F? 0.9, and d + e + f = 1.)

And

(C) hydrosilylation reaction catalyst

, And at least one of R ⁴ in the formula (1) and R ¹⁰ in the formula (2) represents a biphenylyl group.

In the present invention, an aryl group having 6 to 20 carbon atoms is defined as not including a biphenyl group and a terphenyl group.

As a second aspect, the sealing composition for LED according to the first aspect is characterized in that R ⁴ in the formula (1) represents a phenyl group or a biphenylyl group.

As a third aspect, the encapsulating composition for LED described in the first or second aspect, wherein R ¹⁰ in the formula (2) represents a phenyl group or a biphenylyl group.

As a fourth aspect, the present invention relates to an encapsulating material composition for LED according to any one of the first to third aspects, further comprising (D) an adhesion-imparting agent.

As a fifth aspect, the present invention relates to a cured product obtained from the sealing composition for LED according to any one of the first to fourth aspects.

As a sixth aspect, the present invention relates to an LED device in which an LED element is sealed by the cured product described in the fifth aspect.

INDUSTRIAL APPLICABILITY The sealing composition for LED of the present invention is characterized in that it forms a cured product having excellent heat resistance transparency, sulfide resistance and adhesion. Further, the LED element encapsulated with the cured product obtained from the encapsulating material composition for LED of the present invention is characterized by high reliability.

The sealing composition for LED of the present invention will be described in detail.

The straight-chain organopolysiloxane of component (A) has three kinds of structural units represented by the following formula (1) and has at least two alkenyl groups bonded to silicon atoms in one molecule.

(R ¹ R ² R ³ SiO _1/2 ) _a (R ⁴ R ⁵ SiO _2/2 ) _b (R ⁶ ₂ SiO _2/2 ) _c (1)

In the formula, R ¹ represents an alkenyl group having 2 to 12 carbon atoms, and examples of the alkenyl group include vinyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, A dodecenyl group is exemplified, preferably a vinyl group. R ² represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms, and when R ² represents an aryl group, examples of the aryl group include a phenyl group, a tolyl group, a xylyl group, a naphthyl group, Phenanthryl group, pyrenyl group, and groups obtained by substituting the hydrogen atoms of these aryl groups with alkyl groups such as methyl group and ethyl group, alkoxy groups such as methoxy group and ethoxy group, or halogen atoms such as chlorine atom and bromine atom, Is a phenyl group. When R ² represents an alkyl group, the alkyl group is exemplified by methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl , Preferably a methyl group. R ³ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms; and when R ³ represents an aryl group, examples of the aryl group include a phenyl group, a tolyl group, a xylyl group, a naphthyl group, Phenanthryl group, pyrenyl group, and groups obtained by substituting the hydrogen atoms of these aryl groups with alkyl groups such as methyl group and ethyl group, alkoxy groups such as methoxy group and ethoxy group, or halogen atoms such as chlorine atom and bromine atom, Is a phenyl group. When R ³ represents an alkyl group, the alkyl group is exemplified by methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl , Preferably a methyl group. R ⁴ represents an aryl group or a biphenyl group having 6 to 20 carbon atoms, and examples of the aryl group include a phenyl group, a tolyl group, a xylyl group, a naphthyl group, an anthracenyl group, a phenanthryl group, a pyrenyl group, A hydrogen atom is substituted with an alkyl group such as a methyl group or an ethyl group, an alkoxy group such as a methoxy group or an ethoxy group, or a halogen atom such as a chlorine atom or a bromine atom. From the viewpoint of preventing discoloration of the sealing material due to corrosive gas in the environment and reduction in luminance due to corrosion of silver plated on the electrode or the substrate, a biphenyl group is preferable as R ⁴ . R ⁵ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms, and when R ⁵ represents an aryl group, examples of the aryl group include a phenyl group, a tolyl group, a xylyl group, a naphthyl group, Phenanthryl group, pyrenyl group, and groups obtained by substituting the hydrogen atoms of these aryl groups with alkyl groups such as methyl group and ethyl group, alkoxy groups such as methoxy group and ethoxy group, or halogen atoms such as chlorine atom and bromine atom, Is a phenyl group. When R ⁵ represents an alkyl group, examples of the alkyl group include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl , Preferably a methyl group. R ⁶ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms; and when R ⁶ represents an aryl group, examples of the aryl group include a phenyl group, a tolyl group, a xylyl group, a naphthyl group, Phenanthryl group, pyrenyl group, and groups obtained by substituting the hydrogen atoms of these aryl groups with alkyl groups such as methyl group and ethyl group, alkoxy groups such as methoxy group and ethoxy group, or halogen atoms such as chlorine atom and bromine atom, Is a phenyl group. When R ⁶ represents an alkyl group, the alkyl group is exemplified by methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl , Preferably a methyl group.

In the formula, a, b and c are numbers satisfying 0.01? A? 0.5, 0.01 b? 0.7, 0.1 c? 0.9, and a + b + c = B is a number satisfying 0.02? A? 0.5, 0.1? B? 0.6, 0.1? C? 0.8 and a + b + c = 1, more preferably 0.05? A? 0.5, 0.2 b? ? C? 0.7, and a + b + c = 1. This is because if the value of a is less than the lower limit of the above range, the strength of the cured product is not sufficiently obtained and the gas resistance of the cured product is lowered. If the value is larger than the upper limit of the above range, the cured product is decomposed. When a is within the above range, the cured product has sufficient strength and the gas resistance of the cured product becomes good. If b is less than the lower limit of the above range, the gas resistance of the cured product is lowered. If the value is larger than the upper limit of the above range, the cured product becomes whitish. When b is within the above range, the gas resistance of the cured product becomes good, and a transparent cured product is obtained. If c is less than the lower limit of the above range, the crack resistance of the cured product is deteriorated. If it is larger than the upper limit of the above range, the gas resistance of the cured product is lowered. When c is within the above range, there is crack resistance and the gas resistance of the cured product is high.

On the other hand, the straight-chain organopolysiloxane of component (A) may further have a siloxane unit represented by SiO _4/2 within the range not impairing the object of the present invention. The organopolysiloxane may have an alkoxy group bonded to a silicon atom such as a methoxy group, an ethoxy group or a propoxy group, or a hydroxyl group bonded to a silicon atom bond, as long as the object of the present invention is not impaired.

As a method for synthesizing the organopolysiloxane of the component (A), for example,

(I): R ¹ R ² R ³ SiX ¹

A silane compound represented by the formula

(II): ???????? R ⁴ R ⁵ Si (X ² ) ₂ ?????

A silane compound represented by the formula

(III): ???????? R ⁶ ₂ Si (X ³ ) ₂ ?????

Is subjected to a hydrolysis / condensation reaction in the presence of an acid or an alkali.

(I): R ¹ R ² R ³ SiX ¹

Is a raw material for introducing a siloxane unit represented by the formula: R ¹ R ² R ³ SiO _1/2 into an organopolysiloxane. In the general formula (I), R ¹ represents an alkenyl group of carbon atoms 2 - 12, R ² represents an alkyl group having carbon atoms 6 to 20 aryl group or a carbon atom number of 1 to 12 of, R ³ is a carbon atom number of 6 to An aryl group having 1 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms. In the formula, X ¹ represents an alkoxy group, an acyloxy group, a hydroxyl group or an -OSiR ¹ R ² R ³ group. When X ¹ represents an alkoxy group, examples of the alkoxy group include a methoxy group, an ethoxy group and a propoxy group. When X ¹ represents an acyloxy group, an acetoxy group is exemplified as the acyloxy group.

Examples of such silane compounds include alkoxysilanes such as dimethylvinylmethoxysilane, dimethylvinylethoxysilane, methylphenylvinylmethoxysilane and methylphenylvinylethoxysilane, acetoxy silanes such as dimethylvinylacetoxysilane and methylphenylvinylacetoxysilane, , Dimethylvinylhydroxysilane, hydroxysilane such as methylphenylvinylhydroxysilane, and 1,3-divinyl-1,1,3,3-tetramethyldisiloxane.

(II): ???????? R ⁴ R ⁵ Si (X ² ) ₂ ?????

Is a raw material for introducing a siloxane unit represented by the formula: R ⁴ R ⁵ SiO _2/2 into an organopolysiloxane. In the general formula (II), R ⁴ represents an aryl group or a biphenyl group having 6 to 20 carbon atoms, and R ⁵ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms. In the formula, X ² represents an alkoxy group, an acyloxy group or a hydroxyl group. When X ² represents an alkoxy group, examples of the alkoxy group include methoxy group, ethoxy group and propoxy group. When X ² represents an acyloxy group, examples of the acyloxy group include an acetoxy group.

Examples of the silane compound include methylphenyldimethoxysilane, methylphenyldiethoxysilane, ethylphenyldimethoxysilane, ethylphenyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, methylbiphenyldimethoxysilane, methylbis Alkenyloxysilanes such as methylphenyldiacetoxysilane, ethylphenyldiacetoxysilane, diphenyldiacetoxysilane, methylbiphenylsilane, methylphenyldiacetoxysilane, phenylphenyldiacetoxysilane, phenylphenyldiethoxysilane, phenylphenyldimethoxysilane, phenylphenyldiethoxysilane, Diacetoxysilane, phenylphenyldiacetoxysilane, and other acetoxysilanes, such as methylphenyl dihydroxysilane, ethylphenyl dihydroxy silane, diphenyl dihydroxy silane, methyl biphenyllydihydroxy silane, phenyl biphenyl And hydroxysilanes such as lidylhydroxysilane.

(III): ???????? R ⁶ ₂ Si (X ³ ) ₂ ?????

Is a raw material for introducing a siloxane unit represented by the formula: R ⁶ ₂ SiO _2/2 into an organopolysiloxane. In the general formula (III), R ⁶ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms, and X ³ represents an alkoxy group, an acyloxy group, a halogen atom or a hydroxyl group. When X ³ represents an alkoxy group, examples of the alkoxy group include a methoxy group, an ethoxy group and a propoxy group. When X ³ represents an acyloxy group, examples of the acyloxy group include an acetoxy group.

Examples of the silane compound include alkoxysilanes such as dimethyldimethoxysilane, dimethyldiethoxysilane, diphenyldimethoxysilane and diphenyldiethoxysilane, acetoxysilane such as dimethyldiacetoxysilane and diphenyldiacetoxysilane, Dimethyldihydroxysilane, diphenyldihydroxysilane, and the like.

The linear organopolysiloxane of component (A) can be obtained by reacting a silane compound (I), a silane compound (II), a silane compound (III) and, if necessary, other silane compounds, cyclic silicone compounds, Or a hydrolysis / condensation reaction in the presence of an alkali.

Examples of the acid usable herein include hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polycarboxylic acid, trifluoromethanesulfonic acid and ion exchange resins. Examples of the alkali that can be used include inorganic alkalis such as potassium hydroxide and sodium hydroxide, organic bases such as triethylamine, diethylamine, monoethanolamine, diethanolamine, triethanolamine, aqueous ammonia, tetramethylammonium hydroxide, tetrabutylammonium hydroxide Oxides, alkoxysilanes having an amino group, aminopropyltrimethoxysilane, and the like.

In the above-mentioned preparation method, an organic solvent may be used. Examples of the organic solvent that can be used include ethers, ketones, alcohols, acetates, aromatic or aliphatic hydrocarbons,? -Butyrolactone, and mixtures of two or more thereof. Preferred organic solvents include diethyl ether, diisopropyl ether, tetrahydrofuran, 1,4-dioxane, acetone, methyl ethyl ketone, methyl isobutyl ketone, methanol, ethanol, isopropanol, propylene glycol monomethyl ether, propylene Propylene glycol monopropyl ether, propylene glycol monobutyl ether, propylene glycol mono-t-butyl ether,? -Butyrolactone, pentane, hexane, heptane, toluene, xylene, .

In the preparation method, it is preferable to add water or a mixture of water and alcohols to accelerate the hydrolysis / condensation reaction of the respective components. As the alcohols, methanol, ethanol and isopropanol are preferable. This reaction is promoted by heating, and when an organic solvent is used, the reaction is preferably carried out at the reflux temperature.

The straight-chain organopolysiloxane of the component (B) has three kinds of structural units represented by the following formula (2) and has at least two hydrogen atoms bonded to silicon atoms in one molecule.

(R ⁷ R ⁸ R ⁹ SiO _1/2 ) _d (R ¹⁰ R ¹¹ SiO _2/2 ) _e (R ¹² ₂ SiO _2/2 ) _f (2)

In the formula, R ⁷ represents a hydrogen atom. R ⁸ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms; when R ⁸ represents an aryl group, the aryl group is preferably a phenyl group, a tolyl group, a xylyl group, a naphthyl group, Phenanthryl group, pyrenyl group, and groups obtained by substituting the hydrogen atoms of these aryl groups with alkyl groups such as methyl group and ethyl group, alkoxy groups such as methoxy group and ethoxy group, or halogen atoms such as chlorine atom and bromine atom, Is a phenyl group. When R ⁸ represents an alkyl group, the alkyl group is exemplified by methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl , Preferably a methyl group. R ⁹ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms; when R ⁹ represents an aryl group, the aryl group may be a phenyl group, a tolyl group, a xylyl group, a naphthyl group, Phenanthryl group, pyrenyl group, and groups obtained by substituting the hydrogen atoms of these aryl groups with alkyl groups such as methyl group and ethyl group, alkoxy groups such as methoxy group and ethoxy group, or halogen atoms such as chlorine atom and bromine atom, Is a phenyl group. When R ⁹ represents an alkyl group, the alkyl group is exemplified by methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl , Preferably a methyl group. R ¹⁰ represents an aryl group or a biphenyl group having 6 to 20 carbon atoms, and examples of the aryl group include a phenyl group, a tolyl group, a xylyl group, a naphthyl group, an anthracenyl group, a phenanthryl group, a pyrenyl group, A hydrogen atom is substituted with an alkyl group such as a methyl group or an ethyl group, an alkoxy group such as a methoxy group or an ethoxy group, or a halogen atom such as a chlorine atom or a bromine atom. From the viewpoint of preventing discoloration of the encapsulating material due to corrosive gas in the environment and reduction in luminance due to corrosion of the silver plated on the electrode or the substrate, a biphenyl group is preferable as R ¹⁰ . R ¹¹ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms, and when R ¹¹ represents an aryl group, examples of the aryl group include a phenyl group, a tolyl group, a xylyl group, a naphthyl group, Phenanthryl group, pyrenyl group, and groups obtained by substituting the hydrogen atoms of these aryl groups with alkyl groups such as methyl group and ethyl group, alkoxy groups such as methoxy group and ethoxy group, or halogen atoms such as chlorine atom and bromine atom, Is a phenyl group. When R ¹¹ represents an alkyl group, the alkyl group is exemplified by methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl , Preferably a methyl group. R ¹² represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms; when R ¹² represents an aryl group, examples of the aryl group include a phenyl group, a tolyl group, a xylyl group, a naphthyl group, Phenanthryl group, pyrenyl group, and groups obtained by substituting the hydrogen atoms of these aryl groups with alkyl groups such as methyl group and ethyl group, alkoxy groups such as methoxy group and ethoxy group, or halogen atoms such as chlorine atom and bromine atom, Is a phenyl group. When R ¹² represents an alkyl group, the alkyl group is exemplified by methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl , Preferably a methyl group.

D, e and f are numbers satisfying 0.01? D? 0.5, 0.01? E? 0.7, 0.1? F? 0.9 and d + e + f = 1, D is a number satisfying 0.02? D? 0.5, 0.1? E? 0.6, 0.1? F? 0.8 and d + e + f = 1, more preferably 0.05? D? 0.5, 0.2? E? ? F? 0.7, and d + e + f = 1. This is because if d is less than the lower limit of the above range, the strength of the cured product is not sufficiently obtained and the gas resistance of the cured product is lowered. On the other hand, when the upper limit of the above range is exceeded, the cured product is withdrawn. When d is within the above range, the cured product has a sufficient strength and the gas resistance of the cured product becomes good. If e is less than the lower limit of the above range, the gas resistance of the cured product is lowered, and if it exceeds the upper limit of the above range, the cured product becomes whitish. When e is within the above range, the gas resistance of the cured product becomes good, and a transparent cured product is obtained. If f is less than the lower limit of the above range, crack resistance of the cured product is deteriorated. If f is larger than the upper limit of the above range, gas resistance of the cured product is lowered. When f is within the above range, there is crack resistance and the gas resistance of the cured product is high.

On the other hand, the organopolysiloxane of the component (B) may have a siloxane unit represented by SiO _4/2 within the range not impairing the object of the present invention. The organopolysiloxane may also have a silicon atom-bonded alkoxy group such as a methoxy group, an ethoxy group or a propoxy group, or a hydroxyl group bonded to a silicon atom, so long as the object of the present invention is not impaired.

As a method for synthesizing an organopolysiloxane of component (B), for example,

(IV): ???????? R ⁷ R ⁸ R ⁹ SiX ¹ ?????

A silane compound represented by the formula

(V): ???????? R ¹⁰ R ¹¹ Si (X ² ) ₂ ?????

A silane compound represented by the formula

General formula _{^{(VI): R 12 2 Si}} (X 2) 2

Is subjected to a hydrolysis / condensation reaction in the presence of an acid or an alkali.

(IV): ???????? R ⁷ R ⁸ R ⁹ SiX ¹ ?????

Is a raw material for introducing a siloxane unit represented by the formula: R ⁷ R ⁸ R ⁹ SiO _1/2 into an organopolysiloxane. In the general formula (IV), R ⁷ is a hydrogen atom, R ⁸ represents an alkyl group of carbon atoms from 6 to 20 aryl group or a carbon atom number of 1 to 12 in, R ⁹ is an aryl group, or the carbon source of carbon atoms from 6 to 20 And X ¹ represents an alkoxy group, an acyloxy group, a hydroxyl group or an -OSiR ⁷ R ⁸ R ⁹ group. When X ¹ represents an alkoxy group, examples of the alkoxy group include a methoxy group, an ethoxy group and a propoxy group. When X ¹ represents an acyloxy group, examples of the acyloxy group include an acetoxy group.

Examples of the silane compound include alkoxysilanes such as dimethylmethoxysilane, dimethylethoxysilane, methylphenylmethoxysilane and methylphenylethoxysilane, acetoxysilane such as dimethylethoxysilane and methylphenylethoxysilane, dimethylhydroxysilane, Methylphenylhydroxysilane and the like, and 1,1,3,3-tetramethyldisiloxane.

(V): ???????? R ¹⁰ R ¹¹ Si (X ² ) ₂ ?????

Is a raw material for introducing a siloxane unit represented by the formula: R ¹⁰ R ¹¹ SiO _2/2 into an organopolysiloxane. R ¹¹ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms, and X ² represents an alkyl group having 1 to 12 carbon atoms. In the general formula (V), R ¹⁰ represents an aryl group or a biphenyl group having 6 to 20 carbon atoms, An alkoxy group, an acyloxy group, or a hydroxyl group. When X ² represents an alkoxy group, examples of the alkoxy group include a methoxy group, an ethoxy group and a propoxy group. When X ² represents an acyloxy group, examples of the acyloxy group include an acetoxy group.

Examples of the silane compound include methylphenyldimethoxysilane, methylphenyldiethoxysilane, ethylphenyldimethoxysilane, ethylphenyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, methylbiphenyldimethoxysilane, methylbis Alkenyloxysilanes such as methylphenyldiacetoxysilane, ethylphenyldiacetoxysilane, diphenyldiacetoxysilane, methylbiphenylsilane, methylphenyldiacetoxysilane, phenylphenyldiacetoxysilane, phenylphenyldiethoxysilane, phenylphenyldimethoxysilane, phenylphenyldiethoxysilane, Diacetoxysilane, phenylphenyldiacetoxysilane, and other acetoxysilanes, such as methylphenyl dihydroxysilane, ethylphenyl dihydroxy silane, diphenyl dihydroxy silane, methyl biphenyllydihydroxy silane, phenyl biphenyl And hydroxysilanes such as lidylhydroxysilane.

General formula _{^{(VI): R 12 2 Si}} (X 2) 2

Silane compounds represented by is, the organopolysiloxane, the formula: is a raw material for introducing a siloxane unit represented by R ¹² ₂ SiO _2/2. In the formula (VI), R ¹² represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms, and X ² represents an alkoxy group, an acyloxy group or a hydroxyl group. When X ² represents an alkoxy group, examples of the alkoxy group include a methoxy group, an ethoxy group and a propoxy group. When X ² represents an acyloxy group, examples of the acyloxy group include an acetoxy group.

Examples of the silane compound include alkoxysilanes such as dimethyldimethoxysilane, dimethyldiethoxysilane, diphenyldimethoxysilane and diphenyldiethoxysilane, acetoxysilane such as dimethyldiacetoxysilane and diphenyldiacetoxysilane, Dimethyldihydroxysilane, diphenyldihydroxysilane, and the like.

The organopolysiloxane of the component (B) can be obtained by reacting the silane compound (IV), the silane compound (V), the silane compound (VI) and, if necessary, further silane compounds, cyclic silicone compounds or silane oligomers, And a hydrolysis / condensation reaction.

Examples of the acid usable herein include hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polycarboxylic acid, trifluoromethanesulfonic acid and ion exchange resins.

(R ⁴ ) of the silane compound represented by the general formula (II) used in the synthesis of the straight-chain organopolysiloxane of the component (A) and the general At least one of R ¹⁰ in the silane compound represented by the formula (V) represents a biphenyl group.

In the above-mentioned preparation method, an organic solvent may be used. Examples of the organic solvent that can be used include ethers, ketones, alcohols, acetates, aromatic hydrocarbons, aliphatic hydrocarbons,? -Butyrolactone, and mixtures of two or more thereof. Preferred organic solvents include diethyl ether, diisopropyl ether, tetrahydrofuran, 1,4-dioxane, acetone, methyl ethyl ketone, methyl isobutyl ketone, methanol, ethanol, isopropanol, propylene glycol monomethyl ether, propylene Propylene glycol monopropyl ether, propylene glycol monobutyl ether, propylene glycol mono-t-butyl ether,? -Butyrolactone, pentane, hexane, heptane, toluene, xylene, .

In the preparation method, it is preferable to add water or a mixture of water and alcohols to accelerate the hydrolysis / condensation reaction of the respective components. As the alcohols, methanol, ethanol and isopropanol are preferable. This reaction is promoted by heating, and when an organic solvent is used, the reaction is preferably carried out at the reflux temperature.

In the present composition, the content of the component (B) is such that the amount of the silicon atom-bonded hydrogen atoms in the component is in the range of 0.1 to 5 moles per mole of the alkenyl group in the component (A) 2 moles. This is because if the content of the component (B) is less than the lower limit of the above range, the composition is not sufficiently cured. If the content is larger than the above range, the cured product may adversely affect the heat resistance and transparency of the cured product, And can not be used as an encapsulant for LED. Within this range, the composition sufficiently cures and exhibits sufficient sulfide resistance, so that the reliability of the LED device manufactured using the composition of the present invention is improved.

The component (C) is a hydrosilylation catalyst for promoting curing of the composition, and examples thereof include platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts. Particularly, the component (C) is preferably a platinum-based catalyst in that the curing of the composition can be markedly promoted. Examples of the platinum-based catalyst include platinum fine powder, chloroplatinic acid, alcoholic solution of chloroplatinic acid, platinum-alkenylsiloxane complex, platinum-olefin complex, and platinum-carbonyl complex, and preferably platinum-alkenylsiloxane complex to be.

Further, in the present composition, the content of the component (C) is an amount effective to promote curing of the composition. Specifically, the content of the component (C) is preferably such that the amount of the catalyst metal (C) in the component (C) relative to the total amount of 100 parts by mass of the components (A) Is preferably in the range of 0.000001 to 0.05 part by mass, more preferably in the range of 0.000001 to 0.03 part by mass, and particularly preferably in the range of 0.000001 to 0.01 part by mass.

In the present invention, it is preferable that an organopolysiloxane having a biphenylyl group in either or both of the organopolysiloxane of the component (A) and the organopolysiloxane of the component (B) is contained. When an organopolysiloxane having a biphenylyl group is included, the sulfide resistance of the cured product of the present composition is remarkably improved.

In the present invention, (D) an adhesion-imparting agent may be contained in order to improve the adhesiveness of the cured product to the substrate which is in contact during the curing. As the component (D), an organosilicon compound having at least one alkoxy group bonded to a silicon atom in one molecule is preferable. As the alkoxy group, a methoxy group, an ethoxy group, a propoxy group, a butoxy group and a methoxyethoxy group are exemplified, and a methoxy group is particularly preferable from the viewpoint of excellent adhesiveness to a substrate. Examples of the group other than the alkoxy group bonded to the silicon atom of the organosilicon compound include a substituted or unsubstituted monovalent hydrocarbon group such as an alkyl group, an alkenyl group, an aryl group, an aralkyl group and a halogenated alkyl group, a 3-glycidoxypropyl group Epoxycyclohexyl) ethyl group, and 3- (3,4-epoxycyclohexyl) propyl group; a glycidoxyalkyl group such as 2- (3,4-epoxycyclohexyl) And an oxiranylalkyl group such as an 8-oxiranyloxyl group; an alkyl group-containing monovalent organic group such as a 3-methacryloxypropyl group; and a hydrogen atom. The organosilicon compound preferably has an alkenyl group bonded to a silicon atom or a hydrogen atom bonded to a silicon atom. It is also preferable that the organosilicon compound has at least one epoxy group-containing monovalent organic group in one molecule in view of being able to impart good adhesiveness to various substrates. Examples of such organosilicon compounds include organosilane compounds, organosiloxane oligomers, and alkyl silicates. The molecular structure of the organosiloxane oligomer or alkyl silicate is exemplified by linear, branched, straight-chain, branched, cyclic, and meso structures, and particularly preferred is linear, branched or delocalized. Examples of such organic silicon compounds include silane compounds such as 3-glycidoxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane and 3-methacryloxypropyltrimethoxysilane, A siloxane compound having at least one silicon atom bonded alkenyl group or silicon atom bonded hydrogen atom and at least one silicon atom bonded alkoxy group in one molecule, a silane compound having at least one silicon atom bonded alkoxy group, or a silane compound having at least one silicon atom bonded alkoxy group, A mixture of a siloxane compound having at least one bonded hydroxyl group and at least one silicon-bonded alkenyl group, methyl polysilicate, ethyl polysilicate, and epoxy group-containing ethyl polysilicate.

In the present composition, the content of the component (D) is not limited, but the total amount of the components (A), (B) and (C) Is preferably in the range of 0.01 to 10 parts by mass relative to the part of the resin.

In the present invention, as other optional components, 3-butyne-2-ol, 2-methyl-3-butyne- 3-ol, 3-methyl-1-pentyn-3-ol, 3-ethyl- 3-ol, 3-ethyl-1-heptyn-3-ol, 1-ethynyl- -Alkyne compounds such as cyclohexanol, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,5 , Silane compounds such as 7-tetrahexenylcyclotetrasiloxane, and reaction inhibitors such as benzotriazole. In the present composition, the content of the reaction inhibitor is not limited, but is preferably in the range of 0.01 to 5 parts by mass based on 100 parts by mass of the total of the components (A), (B) and (C).

In the present invention, a phosphor may be contained as another arbitrary component. This phosphor can be obtained by mixing yellow, red, green and blue light emitting phosphors which are widely used for LEDs and which are composed of oxide-based fluorescent material, oxynitride-based fluorescent material, nitride-based fluorescent material, sulfide- . The oxide-based fluorescent material is preferably at least one selected from the group consisting of yttrium, aluminum, garnet YAG green-yellow light-emitting fluorescent material containing cerium ions, terbium, aluminum, garnet-based TAG yellow light-emitting fluorescent material containing cerium ion, Based green to yellow light-emitting phosphors. Examples of the oxynitride-based fluorescent material include silicon, aluminum, oxygen and nitrogen-based sialon red to green luminescent fluorescent materials containing europium ions. Examples of the nitride-based fluorescent substance include calcium, strontium, aluminum, silicon, and nitrogen-based cathode-based (CASN and S-CASN) red luminescent phosphors including europium ions. As the sulfide-based fluorescent material, a ZnS-based green coloring fluorescent material containing copper ion or aluminum ion is exemplified. As the oxalate-based fluorescent material, a Y ₂ O ₂ S-based red-emitting fluorescent material containing europium ions is exemplified. These phosphors may be used alone or in combination of two or more. In the present composition, the content of the phosphor is not particularly limited, but is preferably within a range of 1 to 20 parts by mass based on 100 parts by mass of the total of the components (A), (B) and (C).

The encapsulating material composition for LED of the present invention may contain, in addition to the above-mentioned components, an additive if necessary insofar as the objects and effects of the present invention are not impaired. Examples of the additive include inorganic fillers, antioxidants, ultraviolet absorbers, heat stabilizers, dispersants, antistatic agents, polymerization inhibitors, antifoaming agents, solvents, inorganic phosphors, radical inhibitors, surfactants, , Metal deactivating agents are exemplified, and various additives are not particularly limited.

The organosiloxane of the component (A), the organopolysiloxane of the component (B) and the hydrosilylation reaction catalyst of the component (C) refer to a solution containing one or more of these components And a plurality of liquids may be mixed immediately before use to prepare the sealing composition for LED according to the present invention. For example, a first liquid containing the organopolysiloxane of the component (A) and a second liquid containing the organopolysiloxane of the component (B) are each prepared, and the first liquid and the second liquid It is also possible to prepare the encapsulating material composition for LED according to the present invention. At least one of the first liquid and the second liquid includes the hydrosilylation reaction catalyst of the component (C). It is preferable that the first liquid contains a hydrosilylation reaction catalyst. This two-part solution improves the storage stability.

The encapsulating material composition for LED of the present invention can be cured by heating. The temperature for curing the sealing composition for LED of the present invention is preferably about 80 캜 to 200 캜. The method of the heat treatment is not particularly limited, but a method of performing the heat treatment using a hot plate or an oven under an appropriate atmosphere, that is, in an inert gas such as air, nitrogen, or vacuum, may be exemplified.

The encapsulant composition for LED of the present invention can be used for LED encapsulation. The LED element to which the encapsulant composition for LED of the present invention can be applied is not particularly limited. The method for applying the encapsulant composition for LED of the present invention to an LED element is not particularly limited. The encapsulating material composition for LED of the present invention can be used, for example, as an optical lens in addition to an LED encapsulating material.

Example

The properties of the cured product obtained from the sealing composition for LED of the present invention were measured as follows.

(Preparation of Cured Product)

In order to evaluate the heat-resistant transparency of the cured product obtained from the sealing composition for LED, the sealing composition for LED of the present invention was baked in an oven at 100 DEG C for 1 hour and then baked at 150 DEG C for 3 hours, Thereby producing a cured product having a thickness of 1 mm. In order to evaluate the sulfide resistance of the cured product obtained from the encapsulant composition for LED, the LED encapsulant composition of the present invention was applied to an LED substrate provided with silver-plated electrodes, baked in an oven at 100 ° C for 1 hour, And baked for 3 hours to fabricate an LED device.

(Heat resistance transparency test)

The ultraviolet absorption spectrum of the obtained cured product was measured using a UV-3100PC manufactured by Shimadzu Corporation, and the transmittance at a wavelength of 450 nm was measured. After the measurement, the cured product was heated in a convection oven (in air) set at 150 캜 for 1000 hours. The transmittance of the cured product after heating was measured. When the transmittance was 90% or more, it was evaluated as having high transparency even after the heat treatment at the time of forming the cured product. Transmittance of less than 90% and that which was cracked during the evaluation of the heat-resistant transparency test were evaluated as having no heat-resistant transparency and evaluated as "x".

(Sulfation resistance test)

The prepared LED device was placed in an oven under a sulfur atmosphere at 80 DEG C, and after 24 hours, the silver electrode was observed under a microscope. &Quot; o " when no discoloration was observed on the silver electrode, and " X " when the silver electrode was changed to black. Further, when the encapsulating composition for LED was cured, when the cured product was uncured, when the cured product was cracked, and when the cured product was opaque, it was judged to be unmeasurable and was judged as "-".

(Adhesion test)

After the sulfide resistance test, the cured product formed in the produced LED device was confirmed by a microscope. When the peeling of the cured product was not confirmed with the silver electrode, it was evaluated as " Good " as being excellent in adhesion, and when the peeling was confirmed, it was evaluated as " When the composition was cured, when the cured product was uncured, when the cured product was cracked, and when the cured product was opaque, it was judged unmeasurable and evaluated as "-".

The following reagents were used in the preparation examples and examples.

Magnesium cutting pieces (manufactured by Kanto Chemical Co., Ltd.)

4-bromobiphenyl (manufactured by Tokyo Chemical Industry Co., Ltd.)

Tetrahydrofuran (manufactured by Junsei Chemical Co., Ltd.)

Toluene (manufactured by Junsei Chemical Co., Ltd.)

Trifluoromethanesulfonic acid (manufactured by Tokyo Chemical Industry Co., Ltd.)

Phenyltrimethoxysilane (manufactured by Tokyo Chemical Industry Co., Ltd.)

Methyltrimethoxysilane (manufactured by Tokyo Chemical Industry Co., Ltd.)

1,3-divinyl-1,1,3,3-tetramethyldisiloxane (manufactured by Tokyo Chemical Industry Co., Ltd.)

Diphenyldimethoxysilane (manufactured by Tokyo Chemical Industry Co., Ltd.)

Dimethyldimethoxysilane (manufactured by Tokyo Chemical Industry Co., Ltd.)

1,1,3,3-tetramethyldisiloxane (manufactured by Tokyo Chemical Industry Co., Ltd.)

1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex (manufactured by Sigma-Aldrich)

Hereinafter, the present invention will be described in more detail with reference to Production Examples and Examples. The present invention is not limited to the following production examples and examples.

≪ Preparation Example 1 &

Synthesis of biphenyl-phenyldimethoxysilane

15.47 g (0.472 mol) of magnesium cutting flakes was charged into a 1 L reaction flask equipped with a condenser, and nitrogen in the flask was replaced with nitrogen using a nitrogen balloon. Then, a mixture of 100.00 g (0.429 mol) of 4-bromobiphenyl and 382 g of tetrahydrofuran was added dropwise at room temperature (approximately 23 占 폚 for 1 hour, and stirred for another 60 minutes to prepare a Grignard reagent.

93.57 g (0.472 mol) of phenyltrimethoxysilane and 191 g of tetrahydrofuran were fed into a 2 L reaction flask, and nitrogen in the flask was replaced with nitrogen using a nitrogen balloon. The Grignard reagent was added dropwise at room temperature for 30 minutes and further stirred at room temperature for 24 hours. From this reaction mixture, tetrahydrofuran was distilled off under reduced pressure using this distributor. To the obtained residue, 500 g of hexane was added, and the mixture was stirred at room temperature for 60 minutes. After the soluble matter was extracted, the insoluble matter was filtered off. 500 g of hexane was again added to the insolubles, and the insolubles were filtered off. The respective filtrates were mixed, and hexane was distilled off under reduced pressure using this distributor to obtain a crude product. The crude product was distilled under reduced pressure to obtain 67.4 g (yield: 49%) of the objective biphenylphenyldimethoxysilane.

≪ Preparation Example 2 &

Synthesis of biphenylmethyldimethoxysilane

15.47 g (0.472 mol) of magnesium cutting flakes was charged into a 1 L reaction flask equipped with a condenser, and nitrogen in the flask was replaced with nitrogen using a nitrogen balloon. Then, a mixture of 100.00 g (0.429 mol) of 4-bromobiphenyl and 382 g of tetrahydrofuran was added dropwise at room temperature (approximately 23 占 폚 for 1 hour, and stirred for another 60 minutes to prepare a Grignard reagent.

93.57 g (0.472 mol) of methyltrimethoxysilane and 191 g of tetrahydrofuran were fed into a 2 L reaction flask, and nitrogen in the flask was replaced with nitrogen using a nitrogen balloon. The Grignard reagent was added dropwise at room temperature for 30 minutes and further stirred at room temperature for 24 hours. From this reaction mixture, tetrahydrofuran was distilled off under reduced pressure using this distributor. To the obtained residue, 500 g of hexane was added, and the mixture was stirred at room temperature for 60 minutes to extract the soluble matter, followed by filtering off the insoluble matter. 500 g of hexane was again added to the insolubles, and the insolubles were filtered off. The respective filtrates were mixed, and hexane was distilled off under reduced pressure using this distributor to obtain a crude product. The crude product was distilled under reduced pressure to obtain 82.2 g (yield: 76%) of the objective biphenylmethyldimethoxysilane.

≪ Synthesis Example 1 &

18.64 g (0.10 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 103.36 g (0.40 mol) of biphenylmethyldimethoxysilane, 122.19 g of diphenyldimethoxysilane g) and 244 g of toluene were mixed. Then, 32.44 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added, and the mixture was heated under reflux for 1 hour. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resulting salt was filtered off and the low boiling point product was removed by heating under reduced pressure to obtain 199 g of an organopolysiloxane (P-1) (yield: 98%).

≪ Synthesis Example 2 &

18.64 g (0.10 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 103.36 g (0.40 mol) of biphenylmethyldimethoxysilane, 60.11 g of dimethyldimethoxysilane (0.50mol) and 182g of toluene were mixed. Then, 32.44g (1.80mol) of water and 0.75g (5mmol) of trifluoromethanesulfonic acid were added and refluxed for 1 hour. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resultant salt was filtered off and the low boiling point product was removed by heating under reduced pressure to obtain 138 g of the organopolysiloxane (P-2) (yield: 98%).

≪ Synthesis Example 3 &

18.64 g (0.10 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 128.18 g (0.40 mol) of biphenylylphenyldimethoxysilane, 122.19 g of diphenyldimethoxysilane g) and 269 g of toluene were mixed. Then, 32.44 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added, and the mixture was heated under reflux for 1 hour. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resultant salt was filtered off and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 233 g of an organopolysiloxane (P-3) (yield: 98%).

≪ Synthesis Example 4 &

18.64 g (0.10 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 128.18 g (0.40 mol) of biphenylsilylphenyldimethoxysilane, 60.11 g of dimethyldimethoxysilane (0.50 mol) of triethylamine and 207 g of toluene were mixed. Then, 32.44 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added and refluxed for 1 hour. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resultant salt was filtered off and the low boiling point product was removed from the resulting clear solution by heating under reduced pressure to obtain 207 g of an organopolysiloxane (P-4) (yield: 98%).

≪ Synthesis Example 5 &

To the reaction vessel, 18.64 g (0.10 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 51.68 g (0.20 mol) of biphenylmethyldimethoxysilane, (1.80mol) of water and 0.75g (5mmol) of trifluoromethanesulfonic acid were charged into a flask equipped with a stirrer, a reflux condenser and a thermometer, And the mixture was heated under reflux for 1 hour. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resultant salt was filtered off and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 211 g of an organopolysiloxane (P-5) (yield: 98%).

≪ Synthesis Example 6 &

1.86 g (0.01 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 103.36 g (0.40 mol) of biphenylmethyldimethoxysilane, 61.09 g of diphenyldimethoxysilane 30 g (0.25 mol) of dimethyldimethoxysilane and 226 g of toluene were mixed. Then, 32.44 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added and heated for 1 hour And reflux was carried out. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resulting salt was filtered off and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 180 g of an organopolysiloxane (P-6) (yield: 98%).

≪ Synthesis Example 7 &

55.92 g (0.30 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 77.52 g (0.30 mol) of biphenylylmethyldimethoxysilane, 61.09 g of diphenyldimethoxysilane 28.06 g (1.60 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added to the mixture, and the mixture was heated for 1 hour And reflux was carried out. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resulting salt was filtered off and the low boiling point product was removed from the resulting clear solution by heating under reduced pressure to obtain 184 g of an organopolysiloxane (P-7) (yield: 98%).

≪ Synthesis Example 8 &

18.64 g (0.10 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 25.84 g (0.10 mol) of biphenylmethyldimethoxysilane, and 97.75 g of diphenyldimethoxysilane , 32.09 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added to the mixture, and the mixture was heated for 1 hour And reflux was carried out. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. After the resulting salt was filtered off, the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 146 g of an organopolysiloxane (P-8) (yield: 98%).

≪ Synthesis Example 9 &

18.64 g (0.10 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 180.87 g (0.70 mol) of biphenylylmethyldimethoxysilane, and diphenyldimethoxysilane 36.66 36.04g (2.00mol) of water and 0.75g (5mmol) of trifluoromethanesulfonic acid were added to the mixture, and the mixture was heated for 1 hour And reflux was carried out. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resulting salt was filtered off, and the low boiling point product was removed by heating under reduced pressure to obtain 204 g of an organopolysiloxane (P-9) (yield: 98%).

≪ Synthesis Example 10 &

18.64 g (0.10 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 32.05 g (0.10 mol) of biphenylsilylphenyldimethoxysilane, 97.75 g of diphenyldimethoxysilane (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were charged, and the mixture was heated for 1 hour, And reflux was carried out. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resulting salt was filtered off and the low boiling point product was removed by heating under reduced pressure to obtain 152 g of an organopolysiloxane (P-10) (yield: 98%).

≪ Synthesis Example 11 &

18.64 g (0.10 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 224.32 g (0.70 mol) of biphenylsilylphenyldimethoxysilane, and 0.45 mol of diphenyldimethoxysilane 36.66 36.04g (2.00mol) of water and 0.75g (5mmol) of trifluoromethanesulfonic acid were added to the mixture, and the mixture was heated for 1 hour And reflux was carried out. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resultant salt was filtered off and the low boiling point product was removed from the resulting clear solution by heating under reduced pressure to obtain 247 g of an organopolysiloxane (P-11) (yield: 98%).

≪ Synthesis Example 12 &

To the reaction vessel, 46.60 g (0.25 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 192.27 g (0.60 mol) of biphenylsilylphenyldimethoxysilane, (0.075 mol) of dimethyldimethoxysilane, 9.02 g (0.075 mol) of dimethyldimethoxysilane and 229 g of toluene were mixed and 27.03 g (1.50 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were charged. And reflux was carried out. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resulting salt was filtered off and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 191 g of an organopolysiloxane (P-12) (yield: 98%).

≪ Synthesis Example 13 &

9.32 g (0.05 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 64.09 g (0.20 mol) of biphenylsilylphenyldimethoxysilane, 18.33 g of diphenyldimethoxysilane (1.90 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added to the mixture, and the mixture was heated for 1 hour, And reflux was carried out. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resulting salt was filtered off and the low boiling point product was removed by heating under reduced pressure to obtain 105 g of an organopolysiloxane (P-13) (yield: 98%).

≪ Synthesis Example 14 &

18.64 g (0.10 mol) of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 109.97 g (0.45 mol) of diphenyldimethoxysilane, 54.10 g (0.45 mol) of dimethyldimethoxysilane, mol) and 183 g of toluene were mixed. Then, 34.24 g (1.90 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added and refluxed for 1 hour. Thereafter, heating atmospheric pressure raising was carried out until the temperature reached 85 캜. Subsequently, 0.056 g (1.0 mmol) of potassium hydroxide was added, and the mixture was heated at normal pressure until the reaction temperature became 120 ° C, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, and 0.30 g (0.50 mmol) of acetic acid was added thereto to carry out a neutralization reaction. The resulting salt was filtered off and the low boiling point product was removed from the resulting clear solution by heating under reduced pressure to obtain 138 g of an organopolysiloxane (P-14) (yield: 98%).

≪ Synthesis Example 15 &

To the reaction vessel, 13.43 g (0.10 mol) of 1,1,3,3-tetramethyldisiloxane, 103.36 g (0.40 mol) of biphenylmethyldimethoxysilane, 122.19 g (0.50 mol) of diphenyldimethoxysilane, , 32.44 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were charged, heated atmospheric pressure was stirred until the reaction temperature reached 120 ° C., and the reaction was carried out at this temperature for 6 hours . The mixture was cooled to room temperature, water was added, and the mixture was stirred. The water layer was removed, and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 194 g of an organopolysiloxane (P-15) (yield: 98%).

≪ Synthesis Example 16 &

(0.10 mol) of 1,1,3,3-tetramethyldisiloxane, 103.36 g (0.40 mol) of biphenylmethyldimethoxysilane, 60.11 g (0.50 mol) of dimethyldimethoxysilane and 177 g , 32.44 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added, and the mixture was heated under reflux for 1 hour. The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The water layer was removed and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 133 g (yield: 98%) of organopolysiloxane (P-16).

≪ Synthesis Example 17 &

To the reaction vessel, 13.43 g (0.10 mol) of 1,1,3,3-tetramethyldisiloxane, 128.18 g (0.40 mol) of biphenylylphenyldimethoxysilane, 122.19 g (0.50 mol) of diphenyldimethoxysilane, , 32.44 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added, and the mixture was heated under reflux for 1 hour. The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The water layer was removed and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 218 g of an organopolysiloxane (P-17) (yield: 98%).

≪ Synthesis Example 18 &

To the reaction vessel were added 13.43 g (0.10 mol) of 1,1,3,3-tetramethyldisiloxane, 128.18 g (0.40 mol) of biphenylphenyldimethoxysilane, 60.11 g (0.50 mol) of dimethyldimethoxysilane and 202 g , 32.44 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added, and the mixture was heated under reflux for 1 hour. The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The aqueous layer was removed, and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 157 g of an organopolysiloxane (P-18) (yield: 98%).

≪ Synthesis Example 19 &

13.43 g (0.10 mol) of 1,1,3,3-tetramethyldisiloxane, 51.68 g (0.20 mol) of biphenylmethyldimethoxysilane, 64.09 g (0.20 mol) of biphenylphenyldimethoxysilane, , 122.19 g (0.50 mol) of diphenyldimethoxysilane and 220 g of toluene were mixed. Then, 32.44 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were charged and refluxed for 1 hour . The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The water layer was removed, and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 175 g of an organopolysiloxane (P-19) (yield: 98%).

≪ Synthesis Example 20 &

To the reaction vessel, 1.34 g (0.010 mol) of 1,1,3,3-tetramethyldisiloxane, 103.36 g (0.40 mol) of biphenylmethyldimethoxysilane, 61.09 g (0.25 mol) of diphenyldimethoxysilane, (0.25 mol) of trimethoxysilane and 196 g of toluene were mixed. Then, 32.44 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added and refluxed for 1 hour. The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The aqueous layer was removed, and the low-boiling substance was removed from the obtained transparent solution by heating under reduced pressure to obtain 151 g (yield: 98%) of organopolysiloxane (P-20).

≪ Synthesis Example 21 &

(0.30 mol) of 1,1,3,3-tetramethyldisiloxane, 77.52 g (0.30 mol) of biphenylmethyldimethoxysilane, 61.09 g (0.25 mol) of diphenyldimethoxysilane, (0.25 mol) of trimethoxysilane and 209 g of toluene were mixed. Then, 28.83 g (1.60 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added and refluxed for 1 hour. The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The water layer was removed, and the low-boiling substance was removed from the resulting transparent solution by heating under reduced pressure to obtain 169 g (yield: 98%) of organopolysiloxane (P-21).

≪ Synthesis Example 22 >

(0.10 mol) of 1,1,3,3-tetramethyldisiloxane, 25.84 g (0.10 mol) of biphenylmethyldimethoxysilane, 97.75 g (0.40 mol) of diphenyldimethoxysilane, (0.40 mol) of trimethoxysilane and 185 g of toluene were mixed. Then, 32.44 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added and refluxed for 1 hour. The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The water layer was removed, and the low-boiling substance was removed from the resulting transparent solution by heating under reduced pressure to obtain 141 g (yield: 98%) of organopolysiloxane (P-22).

≪ Synthesis Example 23 >

To the reaction vessel, 13.43 g (0.10 mol) of 1,1,3,3-tetramethyldisiloxane, 180.87 g (0.70 mol) of biphenylmethyldimethoxysilane, 36.66 g (0.15 mol) After mixing 18.03 g (0.15 mol) of dimethoxysilane and 249 g of toluene, 36.04 g (2.00 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added and refluxed for 1 hour. The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The water layer was removed, and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 199 g of an organopolysiloxane (P-23) (yield: 98%).

≪ Synthesis Example 24 &

(0.10 mol) of 1,1,3,3-tetramethyldisiloxane, 32.05 g (0.10 mol) of biphenylphenyldimethoxysilane, 97.75 g (0.40 mol) of diphenyldimethoxysilane, (0.40 mol) of trimethoxysilane and 191 g of toluene were mixed. Then, 32.44 g (1.80 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added and refluxed for 1 hour. The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The water layer was removed and the low-boiling substance was removed from the resulting transparent solution by heating under reduced pressure to obtain 147 g (yield: 98%) of organopolysiloxane (P-24).

≪ Synthesis Example 25 >

To the reaction vessel, 13.43 g (0.10 mol) of 1,1,3,3-tetramethyldisiloxane, 224.32 g (0.70 mol) of biphenylsilylphenyldimethoxysilane, 36.66 g (0.15 mol) of diphenyldimethoxysilane, After mixing 18.03 g (0.15 mol) of dimethoxysilane and 292 g of toluene, 36.04 g (2.00 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added and refluxed for 1 hour. The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The water layer was removed and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 241 g of an organopolysiloxane (P-25) (yield: 98%).

≪ Synthesis Example 26 &

To the reaction vessel were added 33.58 g (0.25 mol) of 1,1,3,3-tetramethyldisiloxane, 192.27 g (0.60 mol) of biphenylphenyldimethoxysilane, 18.33 g (0.075 mol) of diphenyldimethoxysilane, (0.075 mol) of trimethoxysilane and 216 g of toluene were mixed. Then, 27.03 g (1.50 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added and refluxed for 1 hour. The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The water layer was removed, and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 178 g of an organopolysiloxane (P-26) (yield: 98%).

≪ Synthesis Example 27 >

To the reaction vessel were added 6.72 g (0.05 mol) of 1,1,3,3-tetramethyldisiloxane, 64.09 g (0.20 mol) of biphenylsilylphenyldimethoxysilane, 18.33 g (0.075 mol) of diphenyldimethoxysilane, (0.75 mol) of trimethoxysilane and 149 g of toluene were mixed. Then, 34.24 g (1.90 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added and heated under reflux for 1 hour. The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The water layer was removed, and the low boiling point product was removed from the obtained transparent solution by heating under reduced pressure to obtain 103 g (yield: 98%) of organopolysiloxane (P-27).

≪ Synthesis Example 28 >

13.43 g (0.10 mol) of 1,1,3,3-tetramethyldisiloxane, 109.97 g (0.45 mol) of diphenyldimethoxysilane, 54.10 g (0.45 mol) of dimethyldimethoxysilane and 177 g of toluene were mixed in a reaction vessel Then, 34.24 g (1.90 mol) of water and 0.75 g (5 mmol) of trifluoromethanesulfonic acid were added and refluxed for 1 hour. The reaction was heated at normal pressure until the reaction temperature became 120 캜, and the reaction was carried out at this temperature for 6 hours. The mixture was cooled to room temperature, water was added, and the mixture was stirred. The water layer was removed, and the low boiling point product was removed from the resulting transparent solution by heating under reduced pressure to obtain 133 g (yield: 98%) of organopolysiloxane (P-28).

≪ Example 1 >

(10 g) of the organopolysiloxane P-1 as the component (A), the organopolysiloxane P-15 (10 g) as the component (B) and the 1,3-divinyl-1,1,3,3- A tetramethyldisiloxane complex (an amount such that the platinum metal was 10 ppm by weight based on the entire composition) was mixed to obtain an encapsulant composition for LED.

≪ Example 2 >

(10 g) of organopolysiloxane P-2 as component (A), 10 g of organopolysiloxane P-16 as component (B) and 1, 3-divinyl-1,1,3,3- A tetramethyldisiloxane complex (an amount such that the platinum metal was 10 ppm by weight based on the entire composition) was mixed to obtain an encapsulant composition for LED.

≪ Example 3 >

(10 g) of organopolysiloxane P-3 as component (A), 10 g of organopolysiloxane P-17 as component (B) and 1, 3-divinyl-1,1,3,3- A tetramethyldisiloxane complex (an amount such that the platinum metal was 10 ppm by weight based on the entire composition) was mixed to obtain an encapsulant composition for LED.

<Example 4>

(10 g) of the organopolysiloxane P-4 as the component (A), 10 g of the organopolysiloxane P-18 as the component (B) and 1, 3-divinyl- A tetramethyldisiloxane complex (an amount such that the platinum metal was 10 ppm by weight based on the entire composition) was mixed to obtain an encapsulant composition for LED.

&Lt; Example 5 >

(10 g) of organopolysiloxane P-5 as component (A), 10 g of organopolysiloxane P-19 as component (B) and 1, 3-divinyl-1,1,3,3- A tetramethyldisiloxane complex (an amount such that the platinum metal was 10 ppm by weight based on the entire composition) was mixed to obtain an encapsulant composition for LED.

&Lt; Example 6 >

10 g of organopolysiloxane P-1 as component (A), 10 g of organopolysiloxane P-28 as component (B) and 1, 3-divinyl-1,1,3,3- A tetramethyldisiloxane complex (an amount such that the platinum metal was 10 ppm by weight based on the entire composition) was mixed to obtain an encapsulant composition for LED.

&Lt; Example 7 >

(10 g) of organopolysiloxane P-14 as component (A), 10 g of organopolysiloxane P-15 as component (B) and 1, 3-divinyl-1,1,3,3- A tetramethyldisiloxane complex (an amount such that the platinum metal was 10 ppm by weight based on the entire composition) was mixed to obtain an encapsulant composition for LED.

&Lt; Comparative Example 1 &

10 g of organopolysiloxane P-14 as component (A), 10 g of organopolysiloxane P-28 as component (B) and 1, 3-divinyl-1,1,3,3- And a tetramethyldisiloxane complex (amount in which platinum metal is 10 ppm by weight based on the total composition) were mixed to obtain a composition.

The results are shown in Tables 1 and 2.

[Table 1]

[Table 2]

As shown in Table 1, all of the cured products obtained from the sealing compositions for LEDs prepared in Examples 1 to 7 had heat resistance and transparency, showed high resistance to sulfurization, and showed no discoloration of the silver substrate. In addition, high adhesion to the LED substrate was exhibited.

On the other hand, as shown in Table 2, the cured product obtained from the composition prepared in Comparative Example 1 did not satisfy all of heat resistance transparency, sulphide resistance and adhesion.

Specifically, in Comparative Example 9 using a polyorganosiloxane containing no biphenylyl group, the sulfide resistance was insufficient. Therefore, it was judged that it could not be used as a sealant composition for LED.

From the above results, it can be seen that the encapsulating composition for LED of the present invention has high heat resistance and high sulfidation resistance, so that it does not corrode the silver plating electrode of the LED substrate and exhibits high adhesiveness to the LED substrate. As an encapsulant of the LED element in the light emitting diode.

Industrial availability

INDUSTRIAL APPLICABILITY The encapsulating composition for LED of the present invention has heat resistance transparency and high sulfidation resistance so that it does not corrode the silver plating electrode of the LED substrate and exhibits high adhesion to the LED substrate, Or as a protective agent for the silver electrode of the liquid crystal end portion or the silver plating of the substrate.

Claims (6)

(A) a linear organopolysiloxane having three kinds of structural units represented by the following formula (1) and having at least two alkenyl groups bonded to silicon atoms in one molecule,
(R ¹ R ² R ³ SiO _1/2 ) _a (R ⁴ R ⁵ SiO _2/2 ) _b (R ⁶ ₂ SiO _2/2 ) _c (1)
(Wherein R ¹ represents an alkenyl group having 2 to 12 carbon atoms, R ² represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms, and R ³ represents an aryl group having 6 to 20 carbon atoms group or a carbon atom represents a group of atoms from 1 to 12, R ⁴ represents an aryl group or a biphenylyl of carbon atoms from 6 to 20, R ⁵ is an alkyl group of carbon atoms from 6 to 20 aryl group or a carbon atom number of 1 to 12 of the represents, two R ⁶ represents an alkyl group of carbon atoms from 6 to 20 carbon atoms or aryl group of 1 to 12, a, b and c are, respectively, 0.01≤a≤0.5, 0.01≤b≤0.7, 0.1≤c Lt; = 0.9, and a + b + c = 1.)
(B) a linear organopolysiloxane having three kinds of structural units represented by the following formula (2) and having at least two hydrogen atoms bonded to silicon atoms in one molecule
(R ⁷ R ⁸ R ⁹ SiO _1/2 ) _d (R ¹⁰ R ¹¹ SiO _2/2 ) _e (R ¹² ₂ SiO _2/2 ) _f (2)
(Wherein R ⁷ represents a hydrogen atom, R ⁸ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms, R ⁹ represents an aryl group having 6 to 20 carbon atoms, R ¹¹ represents an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms and R ¹² represents an alkyl group having 1 to 12 carbon atoms; R ¹⁰ represents an aryl group or a biphenyl group having 6 to 20 carbon atoms; R ¹¹ denotes an aryl group having 6 to 20 carbon atoms or an alkyl group having 1 to 12 carbon atoms; D, e and f each represent an integer of 0.01? D? 0.5, 0.01? E? 0.7, 0.1? F? 0.9, and d + e + f = 1.)
And
(C) hydrosilylation reaction catalyst
, Wherein at least one of R ⁴ in the formula (1) and R ¹⁰ in the formula (2) represents a biphenylyl group. The method according to claim 1,
Wherein R ⁴ in the formula (1) represents a phenyl group or a biphenylyl group. 3. The method according to claim 1 or 2,
Wherein R ¹⁰ in the formula (2) represents a phenyl group or a biphenylyl group. 4. The method according to any one of claims 1 to 3,
Further comprising (D) an adhesion-imparting agent. A cured product obtained from the encapsulating material composition for LED according to any one of claims 1 to 4. An LED device sealed with an LED element by the cured product of claim 5.