KR20190030951A - Display device - Google Patents

Abstract

The present invention provides a display device confirming an application position of an encapsulation layer for preventing the reliability and quality degradation, and comprising: a first substrate including a display region in which pixels are disposed, and a non-display region surrounding the display region; a planarizing film disposed on the first substrate; an anode electrode disposed on the planarizing film; a bank disposed on the anode electrode; an encapsulation layer disposed on the bank and covering the display region; and a dam disposed in the non-display region surrounding the display region. At least one bank groove is provided on the bank adjacent to the dam.

Description

Display device {DISPLAY DEVICE}

The present invention relates to a display device.

As the information society develops, there is a growing demand for display devices for displaying images. In recent years, various display devices such as a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting display (OLED) have been used.

Of the display devices, the organic light emitting display device is a self-emitting type, and has a better viewing angle and contrast ratio than a liquid crystal display device (LCD), does not require a separate backlight and is lightweight and thin, . In addition, the organic light emitting display device is capable of being driven by a DC low voltage, has a high response speed, and is particularly advantageous in manufacturing cost.

However, the organic light emitting display device includes an organic light emitting element in each pixel, and the organic light emitting element is easily deteriorated by external factors such as moisture and oxygen. In order to prevent this, the organic light emitting display device forms an encapsulating layer covering the planarizing film, the banks and the like so that external moisture and oxygen are not penetrated into the organic light emitting device.

The sealing layer sequentially stacks at least one inorganic film and at least one organic film to prevent oxygen or moisture from permeating the organic light emitting layer and the electrode.

On the other hand, the organic film is formed so as to cover the bank of the organic light emitting display. If the organic film does not cover a part of the bank, it is possible to compensate for defects or steps that may occur in the first inorganic film formation I can not. If the organic film fails to compensate for defects or steps of the first inorganic film, defects or steps may also occur in the second inorganic film disposed on the organic film, It can be a path.

Therefore, the coating position of the organic film may affect the reliability of the organic light emitting display, but it is difficult to confirm the position of the end where the organic film is applied.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is a general object of the present invention to provide a display device which confirms an application position of an encapsulation layer and prevents reliability and quality from deteriorating.

According to an aspect of the present invention, there is provided a display device including a first substrate including a display region in which pixels are disposed, and a non-display region surrounding the display region, a planarization film disposed on the first substrate, A bank disposed on the anode electrode, an encapsulating layer disposed on the bank and covering the display region, and a dam disposed in the non-display region surrounding the display region, wherein at least one The present invention also provides a display device in which bank grooves are provided.

The display device according to the embodiment of the present invention can confirm the organic film application position of the sealing layer by providing bank grooves at the top of the bank adjacent to the dam.

The display device according to an exemplary embodiment of the present invention can prevent formation of moisture permeation path in the sealing layer by forming a step on the top of the bank by checking whether the organic film covers the bank, Can be prevented from deteriorating.

The effects obtained in the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description .

1 is a perspective view showing a display device according to an embodiment of the present invention.
2 is a cross-sectional view schematically showing one side of the display panel of Fig.
FIG. 3 is a plan view schematically showing a first substrate according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view showing an example of II-II 'of FIG.
FIG. 5 is an enlarged view of a region B in FIG. 3, and is a plan view showing a bank groove according to the first embodiment of the present invention.
FIG. 6 is an enlarged view of a region B in FIG. 3, and is a plan view showing a bank groove according to a second embodiment of the present invention.

The meaning of the terms described herein should be understood as follows.

The word " first, "" second," and the like, used to distinguish one element from another, are to be understood to include plural representations unless the context clearly dictates otherwise. The scope of the right should not be limited by these terms. It should be understood that the terms "comprises" or "having" does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof. It should be understood that the term "at least one" includes all possible combinations from one or more related items. For example, the meaning of "at least one of the first item, the second item and the third item" means not only the first item, the second item or the third item, but also the second item and the second item among the first item, Means any combination of items that can be presented from more than one. The term "on" means not only when a configuration is formed directly on top of another configuration, but also when a third configuration is interposed between these configurations.

Hereinafter, preferred embodiments of the display device according to the present invention will be described in detail with reference to the accompanying drawings. In the drawings, like reference numerals are used to denote like elements throughout the drawings, even if they are shown on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a display device according to an embodiment of the present invention.

1, a display device 100 according to an exemplary embodiment of the present invention includes a display panel 110, a gate driver 120, a source driver integrated circuit (IC) 130, A flexible film 140, a circuit board 150, and a timing control unit 160. [

The display panel 110 includes a first substrate 111 and a second substrate 115. The second substrate 115 may be an encapsulating substrate. The first substrate 111 and the second substrate 115 may be plastic or glass.

remind On one side of the first substrate 111 facing the second substrate 115, gate lines, data lines, and pixels are formed. The pixels are provided in an area defined by the intersection structure of the gate lines and the data lines.

Each of the pixels may include an organic light emitting element having a thin film transistor and an anode electrode, an organic light emitting layer, and a cathode electrode. Each of the pixels supplies a predetermined current to the organic light emitting element in accordance with the data voltage of the data line when the gate signal is inputted from the gate line by using the thin film transistor. Thus, the organic light emitting element of each of the pixels can emit light with a predetermined brightness according to a predetermined current. A detailed description of the structure of each of the pixels will be described later with reference to FIG.

1, the display panel 110 can be divided into a display area DA for displaying an image and a non-display area NDA for not displaying an image. Gate lines, data lines, and pixels may be formed in the display area DA. A gate driver 120 and pads may be formed in the non-display area NDA.

remind The gate driver 120 supplies the gate signals to the gate lines according to the gate control signal input from the timing controller 160. The gate driver 120 may be formed in a non-display area DA on one side or both sides of the display area DA of the display panel 110 in a gate driver in panel (GIP) manner. Alternatively, the gate driver 120 may be formed of a driving chip and mounted on a flexible film, and may be formed in a non-display area DA on one side or both sides of the display area DA of the display panel 110 by TAB (tape automated bonding) As shown in FIG.

remind The source driver IC 130 receives the digital video data and the source control signal from the timing controller 160. The source driver IC 130 converts the digital video data into analog data voltages according to the source control signal and supplies the analog data voltages to the data lines. When the source drive IC 130 is fabricated from a driving chip, the source drive IC 130 may be mounted on the flexible film 140 using a chip on film (COF) method or a chip on plastic (COP) method.

Pads such as data pads may be formed in the non-display area NDA of the display panel 110. [ Wires connecting the pads and the source drive IC 130 and wirings connecting the pads and the wirings of the circuit board 150 may be formed in the flexible film 140. The flexible film 140 is adhered to the pads using an anisotropic conducting film, whereby the pads and the wirings of the flexible film 140 can be connected.

remind The circuit board 150 may be attached to the flexible films 140. The circuit board 150 may be implemented with a plurality of circuits implemented with driving chips. For example, the timing control unit 160 may be mounted on the circuit board 150. [ The circuit board 150 may be a printed circuit board or a flexible printed circuit board.

remind The timing controller 160 receives digital video data and a timing signal from an external system board through a cable of the circuit board 150. [ The timing control unit 160 generates a gate control signal for controlling the operation timing of the gate driving unit 120 and a source control signal for controlling the source drive ICs 130 based on the timing signal. The timing controller 160 supplies a gate control signal to the gate driver 120 and a source control signal to the source driver ICs 130. [

2 is a cross-sectional view schematically showing one side of the display panel of Fig.

Referring to FIG. 2, the display panel 110 includes a first substrate 111, a second substrate 115, a thin film transistor layer 10 disposed between the first and second substrates 111 and 115, A light emitting element layer 20, and an encapsulation layer 30.

The first substrate 111 may be a plastic film or a glass substrate.

The thin film transistor layer 10 is disposed on the first substrate 111. The thin film transistor layer 10 may include gate lines, data lines, and thin film transistors. Each of the thin film transistors includes a gate electrode, a semiconductor layer, and source and drain electrodes. When the gate driver is formed by a gate driver in panel (GIP) scheme, the gate driver may be formed together with the thin film transistor layer 10.

On the thin film transistor layer 10, the organic light emitting element layer 20 is disposed. The organic light emitting device layer 20 includes an anode electrode, an organic light emitting layer, a cathode electrode, and a bank. Each of the organic light emitting layers may include a hole transporting layer, an organic light emitting layer, and an electron transporting layer. In this case, when a voltage is applied to the anode electrode and the cathode electrode, holes and electrons move to the light emitting layer through the hole transporting layer and the electron transporting layer, respectively. Since the pixels P are provided in the region where the organic light emitting device layer 20 is disposed, the region where the organic light emitting device layer 20 is disposed may be defined as a display region. The peripheral area of the display area can be defined as a non-display area.

The encapsulation layer 30 is disposed on the organic light emitting element layer 20. The sealing layer 30 serves to prevent penetration of oxygen or moisture into the organic light emitting element layer 20. The sealing layer 30 may comprise at least one organic film and an inorganic film.

Hereinafter, the sealing layer 30 according to an embodiment of the present invention will be described in more detail with reference to FIGS. 3 and 4. FIG.

FIG. 3 is a plan view schematically showing a first substrate according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view showing an example of II-II 'of FIG.

3 and 4, the first substrate 111 is divided into a display area DA and a non-display area NDA, and a non-display area NDA has a groove area BH HA and a dam (DAM) may be formed.

A thin film transistor layer 10, an organic light emitting element layer 20, and an encapsulation layer 30 are formed in a display region DA of the first substrate 111. [

The thin film transistor layer 10 includes thin film transistors 210, a gate insulating layer 220, an interlayer insulating layer 230, a protective layer 240, and a planarization layer 250.

A buffer film 112 is disposed on one surface of the first substrate 111. The buffer layer 112 is disposed on one surface of the first substrate 111 to protect the thin film transistors 210 and the organic light emitting devices 260 from moisture penetrating through the first substrate 111, do. One surface of the first substrate 111 may be a surface facing the second substrate 115. The buffer film 112 may be formed of a plurality of alternately stacked inorganic films. For example, the buffer film 112 may be formed of multiple films in which one or more inorganic films of a silicon oxide film (SiOx), a silicon nitride film (SiNx), and SiON are alternately stacked. The buffer film 112 may be omitted.

The thin film transistor 210 is disposed on the buffer film 112. The thin film transistor 210 includes an active layer 211, a gate electrode 212, a source electrode 213 and a drain electrode 214. 4 illustrates that the thin film transistor 210 is formed in a top gate manner in which the gate electrode 212 is located above the active layer 211. However, the present invention is not limited thereto. That is, the thin film transistors 210 may be formed by a bottom gate method in which the gate electrode 212 is located under the active layer 211 or a bottom gate method in which the gate electrode 212 is formed on the upper and lower portions of the active layer 211, And may be formed in a double gate manner.

The active layer 211 is disposed on the buffer layer 112. The active layer 211 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light shielding layer for shielding external light incident on the active layer 211 may be disposed between the buffer layer 112 and the active layer 211.

The gate insulating layer 220 may be disposed on the active layer 211. The gate insulating film 220 may be formed of an inorganic film, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multilayer thereof.

The gate electrode 212 and the gate line may be disposed on the gate insulating layer 220. The gate electrode 212 and the gate line may be formed of any one of Mo, Al, Cr, Au, Ti, Ni, Ne, Or a single layer or multiple layers of one or more of these alloys.

The interlayer insulating layer 230 may be disposed on the gate electrode 212 and the gate line. The interlayer insulating film 230 may be formed of an inorganic film, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multilayer film thereof.

The source electrode 213, the drain electrode 214, and the data line may be disposed on the interlayer insulating layer 230. Each of the source electrode 213 and the drain electrode 214 may be connected to the active layer 211 through a contact hole passing through the gate insulating film 220 and the interlayer insulating film 230. The source electrode 213, the drain electrode 214 and the data line may be formed of a metal such as molybdenum (Mo), aluminum (Al), chrome (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium And copper (Cu), or an alloy thereof.

The protective film 240 for insulating the thin film transistor 210 may be disposed on the source electrode 213, the drain electrode 214, and the data line. The protective film 240 may be formed of an inorganic film, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multilayer film thereof.

The planarization layer 250 may be disposed on the passivation layer 240 to flatten a step due to the thin film transistor 210. The planarization layer 250 may be formed of an organic layer such as an acryl resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. have.

On the thin film transistor layer 10, the organic light emitting element layer 20 is disposed. The organic light emitting device layer 20 includes the organic light emitting devices 260 and the bank 270.

The organic light emitting device 260 and the bank 270 are disposed on the planarizing film 250. The organic light emitting device 260 includes an anode electrode 261, an organic light emitting layer 262, and a cathode electrode 263.

remind The anode electrode 261 may be disposed on the planarizing film 250. The anode electrode 261 according to an exemplary embodiment of the present invention includes a first anode electrode 261a disposed in the pixel P of the display region DA and a second anode electrode 261b spaced apart from the first anode electrode 261a, And a second anode electrode 261b disposed on the second electrode 261b.

The first anode electrode 261a is connected to the source electrode 213 of the thin film transistor 210 through a contact hole passing through the protective film 240 and the planarization film 250. [ The first anode electrode 261a is formed of a laminated structure of aluminum and titanium (Ti / Al / Ti), a laminated structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, APC / ITO). ≪ / RTI > The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

The second anode electrode 261b may be disposed at an upper end of the planarization layer 250 away from the first anode electrode 261a and may extend to a lower portion of the dam (DAM). The second anode electrode 261b is made of the same material as the first anode electrode 261a.

The bank 270 may be disposed on the planarization layer 250 and the anode electrode 261. The bank 270 according to an exemplary embodiment of the present invention includes a first bank 270a partitioning the pixels P of the display area DA and a second bank 270b disposed in the non-display area NDA .

The first bank 270a may be arranged to cover the edge of the anode electrode 261 on the planarization layer 250 to partition the pixels P. [ That is, the first bank 270a serves as a pixel defining layer for defining the pixels P. The first bank 270a may be formed of an organic film such as an acryl resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin .

The second bank 270b is disposed in the groove region HA of the non-display region NDA and is disposed on the planarization layer 250 and the second anode electrode 261b. The second bank 270b is made of the same material as the first bank 270a. The second bank 270b according to an exemplary embodiment of the present invention is provided with at least one bank groove BH. The bank groove BH has a depression on the upper surface of the second bank 270b and forms a step on the upper end of the second bank 270b. The bank grooves BH may be formed of a cylinder or a polygonal column. This bank groove BH allows the position of the organic film 282 to be coated on the sealing layer 30 formed on the upper side to be confirmed by the step difference. More specifically, when the organic film 282 of the sealing layer 30 is applied to the upper end of the second bank 270b, the bank grooves BH are provided at the upper end of the second bank 270b, It can be known that the organic film 282 is not applied and that the organic film 282 is applied when the level difference is not confirmed.

As described above, the display device 100 according to the embodiment of the present invention has bank grooves BH at the upper end of the bank 270 adjacent to the dam DAM, so that the organic film 282 of the sealing layer 30, . Therefore, in the display device 100 according to the embodiment of the present invention, a step is formed at the top of the bank 270 by checking whether the organic film 282 covers the bank 270, It is possible to prevent the formation of the moisture-permeation path and to prevent the reliability and the quality from deteriorating.

The organic light emitting layer 262 is disposed on the anode electrode 261 and the bank 270. The organic light emitting layer 262 may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer. In this case, when a voltage is applied to the anode electrode 261 and the cathode electrode 263, holes and electrons move to the light emitting layer through the hole transporting layer and the electron transporting layer, respectively.

The organic light emitting layer 262 may be a white light emitting layer that emits white light. In this case, the organic light emitting layer 262 may be disposed so as to cover the first anode electrode 261a and the bank 270. A color filter (not shown) may be disposed on the second substrate 115.

Alternatively, the organic light emitting layer 262 may include a red light emitting layer for emitting red light, a green light emitting layer for emitting green light, or a blue light emitting layer for emitting blue light. In this case, the organic light emitting layer 262 may be disposed in a region corresponding to the anode electrode 261, and the color filter may not be disposed on the second substrate 115.

The cathode electrode 263 is disposed on the organic light emitting layer 262. The cathode electrode 263 may be formed of a transparent conductive material such as ITO or IZO or a magnesium (Mg) conductive material capable of transmitting light, , Silver (Ag), or a semi-transmissive conductive material such as an alloy of magnesium (Mg) and silver (Ag). A capping layer may be disposed on the cathode electrode 263.

The sealing layer 30 may be extended to the display area DA of the first substrate 111 as well as to the non-display area NDA on the organic light emitting device layer 20. [

The sealing layer 30 is disposed on the bank 270 and covers the display area DA to prevent oxygen or moisture from penetrating the organic light emitting layer 262 and the cathode electrode 263 . For this purpose, the encapsulation layer 30 may comprise at least one inorganic film and at least one organic film. For example, the sealing layer 30 may include a first inorganic film 281, an organic film 282, and a second inorganic film 283.

The first inorganic film 281 may be disposed on the cathode electrode 263. The first inorganic film 281 may be disposed so as to cover the cathode electrode 263. Specifically, the first inorganic film 281 covers the cathode electrode 262 and the first bank 270a in the display region DA and extends to the non-display region NDA to form the second bank 270b, 2 anode electrode 261b, a dam (DAM), and a protective film 240. [ The first inorganic film 281 may have a stepped portion according to a structure disposed under the first inorganic film 281, and a defect may occur.

The organic film 282 is disposed on the first inorganic film 281 to compensate for defects and steps that may occur in the first inorganic film 281. [ The organic film 282 prevents particles from penetrating the first inorganic film 281 and into the organic light emitting layer 262 and the cathode electrode 263 and can be formed to a sufficient thickness have.

The first inorganic film 281 and the organic film 282 may be provided in the bank groove BH as well. The first inorganic film 281 is formed along the step of the bank grooves BH provided in the second bank 270b. The organic film 282 is formed in the bank trench BH such that the step of the bank trench BH is eliminated. In the case where the organic film 282 is formed so as to fill the bank trench BH, the step of the bank trench BH is not confirmed by an optical microscope or the like, so that the application position of the organic film 282 can be confirmed.

The second inorganic film 283 may be disposed on the organic film 282. The second inorganic film 283 may be disposed so as to cover the organic film 282. Specifically, the second inorganic film 283 covers the organic film 282 in the display area DA and extends to the non-display area NDA to cover the dam DAM and the first inorganic film 281 . The second inorganic film 283 does not have a defect or a step due to the organic film 282 disposed at the lower portion thereof, It is possible to prevent the reliability and the quality from deteriorating.

Each of the first and second inorganic films 281 and 283 may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. The organic layer 282 may be formed of an acryl resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

remind The dam DAM is disposed in the non-display area NDA to block the flow of the organic film 282 constituting the sealing layer 30. More specifically, the dam DAM is disposed to surround the outer periphery of the display area DA to block the flow of the organic film 282 constituting the sealing layer 30. The dam DAM is disposed in the non-display area NDA to cover the organic film 282 so that the organic film 282 constituting the sealing layer 30 can not penetrate into the pad (not shown) exposed by the contact hole. Can be blocked. Thus, the dam (DAM) can prevent the organic film 282 from being exposed to the outside of the display device or from penetrating into the pad.

The dam (DAM) according to one embodiment of the present invention includes an inner dam (ID) and an outer dam (OD).

The internal dam ID is disposed adjacent to the display area DA and is disposed so as to surround the outer periphery of the display area DA to primarily block the flow of the organic film 282 constituting the sealing layer 30 . The internal dam ID is disposed between the display area DA and the pad area PA so that the flow of the organic film 282 is prevented from being affected by the organic film 282, .

The external dam (OD) is disposed so as to surround the outer perimeter of the inner dam (ID), and is spaced apart from the inner dam (ID) and arranged side by side. At this time, the interval between the external dam (OD) and the internal dam (ID) is about 30 to 40 um, but the present invention is not limited thereto. The external dam (OD) can secondarily block the organic film (282) flowing over to the outside of the internal dam (ID). Also, the height of the outer dam OD may be higher than the height of the inner dam ID. Thus, the inner dam (ID) and the outer dam (OD) can more effectively block the organic film 282 from being exposed to the outside of the display device 100 or from penetrating the exposed pad.

The inner dam ID according to an example of the present invention includes a first inner dam ID1 disposed on the protective film 240 and a second inner dam ID2 disposed on the first inner dam ID1 . The outer dam OD according to an exemplary embodiment of the present invention includes a first outer dam OD1 disposed on the protective film 240, a second outer dam OD2 disposed on the first outer dam OD1, , And a third outer dam (OD3) disposed on the second outer dam (OD2). At this time, the first external dam OD1 may be formed of the same material as the flattening film 250. [ The first inner dam ID1 and the second outer dam OD2 have the same material and can be formed of the same material as the bank 270. [ The second inner dam ID2 and the third outer dam OD3 have the same material and may be formed of the same material as a spacer (not shown) disposed on the bank 270. [ Therefore, the dam (DAM) according to an example of the present invention can be formed at the same time when forming the planarization film 250, the bank 27, and the spacer, and can be formed without any additional process.

FIG. 5 is an enlarged view of a region B in FIG. 3, and is a plan view showing a bank groove according to the first embodiment of the present invention. The display device 100 shown in Fig. 5 is the same as the display device 100 described above with reference to Figs. 3 and 4, except for the bank grooves BH and the anode holes AH. Accordingly, only the bank trench BH and the anode hole AH will be described in the following description, and a duplicate description of the same structure will be omitted.

Referring to FIG. 5, a display device 100 according to an exemplary embodiment of the present invention includes a bank groove BH and an anode hole AH.

The bank groove BH according to the first embodiment of the present invention is provided in the groove area HA of the non-display area NDA. At least one bank groove BH according to the first embodiment of the present invention is provided so as to have a step on the upper surface of the second bank 270b. Although a plurality of bank grooves BH are regularly arranged in FIG. 5, the present invention is not limited thereto and may be provided at the end of the second bank 270b adjacent to the dam DAM. Although the bank grooves BH are shown in a rectangular shape in FIG. 5, the present invention is not limited thereto. When the second bank 270b is viewed down the first substrate 111, And may have a shape such as a cylinder or a polygonal column.

The anode hole AH according to the first embodiment of the present invention is provided in the groove area HA of the non-display area NDA. At least one or more anode holes AH according to the first embodiment of the present invention are provided so as to pass through the second anode electrode 261b. Although a plurality of anode holes AH are regularly arranged in FIG. 5, the present invention is not limited thereto. Although the bank grooves BH are shown in a rectangular shape in FIG. 5, the present invention is not limited thereto. When the second bank 270b is viewed down the first substrate 111, And may have a shape such as a cylinder or a polygonal column. The anode hole AH serves as a passage for removing impurities or fumes generated in the planarization layer 250 formed under the second anode electrode 261b.

In this manner, the bank grooves BH according to the first embodiment of the present invention can be overlapped with the anode holes AH. At this time, the bank grooves BH according to the first embodiment of the present invention may be smaller than the anode holes AH. For example, when the size of the anode hole AH is 15 × 15 μm, the size of the bank groove BH may be 10 × 10 μm. The size of the bank grooves BH is smaller than the size of the anode holes AH so that even if the bank grooves BH and the anode holes AH overlap,

As described above, the display device 100 according to the first embodiment of the present invention is provided with the bank grooves BH at the upper ends of the banks 270 adjacent to the dam DAM to apply the organic film 282 of the sealing layer 30 You can check the location. Therefore, in the display device 100 according to the first embodiment of the present invention, a step is formed at the upper end of the bank 270 by checking whether the organic film 282 covers the bank 270, Moisture permeation path can be prevented from being formed, and reliability and quality of the display device 100 can be prevented from deteriorating.

FIG. 6 is an enlarged view of a region B in FIG. 3, and is a plan view showing a bank groove according to a second embodiment of the present invention. The display device 100 shown in Fig. 6 is the same as the display device 100 described above with reference to Fig. 5, except for the bank grooves BH. Accordingly, in the following description, only the bank groove BH will be described, and redundant description of the same configuration will be omitted.

The bank groove BH according to the second embodiment of the present invention is provided in the groove area HA of the non-display area NDA. At least one bank groove BH according to the second embodiment of the present invention is provided so as to have a step on the upper surface of the second bank 270b. Although a plurality of bank grooves BH are regularly arranged in FIG. 6, the present invention is not limited thereto and may be provided at the end of the second bank 270b adjacent to the dam DAM. In addition, although the bank grooves BH are shown in a circular shape in FIG. 6, the present invention is not limited thereto and has a shape different from that of the anode holes AH. Since the bank grooves BH according to the second embodiment of the present invention have a different form from the anode holes AH, it is easy to distinguish the anode grooves AH from the anode holes AH when checking the organic film application position through an optical microscope or the like. In addition, the bank grooves BH according to the second embodiment of the present invention are provided so as not to overlap with the anode holes AH, and are easily distinguishable from the anode holes AH.

As described above, the display device 100 according to the first embodiment of the present invention is provided with the bank grooves BH at the upper ends of the banks 270 adjacent to the dam DAM to apply the organic film 282 of the sealing layer 30 You can check the location. Therefore, in the display device 100 according to the first embodiment of the present invention, a step is formed at the upper end of the bank 270 by checking whether the organic film 282 covers the bank 270, Moisture permeation path can be prevented from being formed, and reliability and quality of the display device 100 can be prevented from deteriorating.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of protection of the present invention should be construed according to the claims, and all technical ideas within the scope of equivalents should be interpreted as being included in the scope of the present invention.

100: display device 110: display panel
111: first substrate 115: second substrate
120: Gate driver 130: Source drive IC
140: flexible film 150: circuit board
160: timing control section 10: thin film transistor layer
20: organic light emitting element layer 30: sealing layer
210: thin film transistor 211: active layer
212: gate electrode 213: source electrode
214: drain electrode 220: gate insulating film
230: interlayer insulating film 240: protective film
250: planarization film 260: organic light emitting element
261: anode electrode 262: organic light emitting layer
263: cathode electrode 270:
BH: Bank home AH: Anode hole
281: first inorganic film 282: organic film
283: Second inorganic film DAM: Dam
ID: Internal dam OD: External dam

Claims (11)

A first substrate including a display region in which pixels are arranged, and a non-display region surrounding the display region;
A planarization film disposed on the first substrate;
An anode electrode disposed on the planarization film;
A bank disposed on the anode electrode;
A sealing layer disposed on the bank and covering the display region; And
And a dam surrounding the display area and disposed in the non-display area,
And at least one bank groove is provided on the bank disposed in the non-display region. The method according to claim 1,
Wherein the sealing layer includes a first inorganic film and an organic film, and the first inorganic film and the organic film are provided in the bank groove. The method according to claim 1,
Wherein the bank grooves are cylindrical or polygonal. The method according to claim 1,
At least one anode hole is formed in the anode electrode,
Wherein the size of the bank groove is smaller than the size of the anode hole. The method according to claim 1,
At least one anode hole is formed in the anode electrode,
And the bank grooves overlap the anode holes. The method according to claim 1,
At least one anode hole is formed in the anode electrode,
Wherein the anode hole and the bank groove have different shapes. The method according to claim 1,
The encapsulation layer may be formed,
A first inorganic film disposed on the bank;
An organic film disposed on the first inorganic film; And
And a second inorganic film disposed on the organic film,
And the second inorganic film extends to the upper portion of the dam. The method according to claim 1,
In the dam,
An inner dam disposed adjacent to the display area; And
And an outer dam disposed at an outer periphery of the inner dam,
Wherein the height of the outer dam is higher than the height of the inner dam. The method according to claim 1,
In the dam,
An inner dam disposed adjacent to the display area; And
And an outer dam disposed at an outer periphery of the inner dam,
Wherein the inner dam includes a first inner dam and a second inner dam disposed on the first inner dam,
Wherein the outer dam includes a first outer dam, a second outer dam disposed on the first outer dam, and a third outer dam disposed on the second outer dam,
Wherein the first inner dam and the second outer dam have the same material. 10. The method of claim 9,
Wherein the second inner dam and the third outer dam have the same material. 10. The method of claim 9,
Wherein the first internal dam and the bank have the same material.

Images