CN110993660A - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN110993660A
CN110993660A CN201911207588.7A CN201911207588A CN110993660A CN 110993660 A CN110993660 A CN 110993660A CN 201911207588 A CN201911207588 A CN 201911207588A CN 110993660 A CN110993660 A CN 110993660A
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inorganic layer
base plate
opening
substrate base
layer
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CN110993660B (en
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张国峰
王俊强
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Wuhan Tianma Microelectronics Co Ltd
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Wuhan Tianma Microelectronics Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention relates to the field of display and discloses a display panel and a display device. The display panel includes: a substrate base plate; the thin film transistor array layer comprises a first inorganic layer and a second inorganic layer, and the second inorganic layer is positioned on one side, far away from the substrate, of the first inorganic layer; the partition groove penetrates through the first inorganic layer and the second inorganic layer, the orthographic projection of an opening, positioned on the surface of the second inorganic layer close to the substrate, of the partition groove on the substrate covers the orthographic projection of an opening, positioned on the substrate, of the surface of the first inorganic layer far away from the substrate, of the substrate, and the orthographic projection of an opening, positioned on the surface of at least one inorganic layer of the thin film transistor array layer close to the substrate, of the partition groove on the substrate is larger than that of an opening, positioned on the surface of the inorganic layer far away from the substrate, of the partition groove on the substrate; and the light-emitting functional film layer is positioned on one side of the thin film transistor array layer, which is far away from the substrate base plate, and the common layer in the light-emitting functional film layer is disconnected at the partition groove.

Description

Display panel and display device
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
In the process of producing the display panel, in order to prevent moisture and oxygen from penetrating into the components to cause component failure, Thin-Film Encapsulation (TFF) is performed on the display panel, and the TFF is a technique of realizing water resistance and oxygen resistance by stacking one or more layers of inorganic materials or inorganic/organic materials.
Among the prior art, in order to improve display device's screen ratio, can adopt the mode of digging the hole at display panel's effective display area to provide for the camera and dodge the hole, however, need whole face coating by vaporization to luminous function rete, dig the side that the hole technology can lead to the rete of whole face coating by vaporization directly expose in the outside on display panel, steam and oxygen can follow and dig the hole and get into oxidation coating by vaporization layer to extend to display panel inside along the coating by vaporization layer, finally lead to the encapsulation inefficacy.
Disclosure of Invention
The invention discloses a display panel and a display device, which are used for solving the problem that water vapor or oxygen self-avoiding holes invade a vapor deposition film layer and improving the reliability of the display panel.
In order to achieve the purpose, the invention provides the following technical scheme:
the embodiment of the invention provides a display panel, which is provided with an opening area, a non-display area and a display area; the opening area penetrates through the display panel, the non-display area comprises a first non-display area, the first non-display area is positioned between the opening area and the display area, the first non-display area surrounds the opening area, and the display area surrounds the first non-display area;
the display panel includes:
a substrate base plate;
the thin film transistor array layer is positioned on one side of the substrate base plate; the thin film transistor array layer comprises an inorganic layer, the inorganic layer comprises a first inorganic layer and a second inorganic layer, and the second inorganic layer is positioned on one side, far away from the substrate, of the first inorganic layer;
the partition groove is positioned in the first non-display area and penetrates through the first inorganic layer and the second inorganic layer; wherein, the orthographic projection of the opening of the surface of the second inorganic layer close to the substrate base plate side of the partition groove on the substrate base plate covers the orthographic projection of the opening of the surface of the first inorganic layer far from the substrate base plate side of the substrate base plate, and the orthographic projection of the opening of the surface of at least one layer of the inorganic layer close to the substrate base plate side of the partition groove on the thin film transistor array layer on the substrate base plate is larger than and covers the orthographic projection of the opening of the surface of the inorganic layer far from the substrate base plate side on the substrate base plate;
the light-emitting function film layer is positioned on one side, far away from the substrate, of the thin film transistor array layer and comprises a common layer, and the common layer is positioned in the first non-display area and the display area; the common layer is disconnected at the blocking groove.
Based on the same inventive concept, an embodiment of the present invention provides a display device, including the display panel provided in the embodiment of the present invention.
The invention has the following beneficial effects:
the display panel comprises an opening area, a non-display area and a display area, wherein the opening area penetrates through the display panel, the non-display area comprises a first non-display area and a second non-display area, the second non-display area surrounds the display area, the display area surrounds the first non-display area, and the first non-display area surrounds the opening area. The first display area is provided with a partition groove for partitioning a common layer in the light-emitting functional film layer, the partition groove penetrates through a first inorganic layer and a second inorganic layer in the thin film transistor array layer, an opening of the partition groove, which is positioned on the surface of the second inorganic layer, which is close to the substrate, covers the orthographic projection of an opening of the surface of the first inorganic layer, which is far away from the substrate, on the substrate in the orthographic projection of the substrate, namely, at the contact surface of the second inorganic layer and the first inorganic layer, the opening of the partition groove, which is positioned on the surface of the second inorganic layer, is larger than or equal to the opening of the partition groove, which is positioned on the surface of the first inorganic layer, so that the partition groove is prevented from dead angles, so that the packaging layer cannot be covered and; the orthographic projection of the opening of the partition groove on the surface of one side, close to the substrate, of at least one inorganic layer of the thin film transistor array layer on the substrate is larger than and covers the orthographic projection of the opening of the partition groove on the surface of one side, far away from the substrate, of the inorganic layer on the substrate, namely in at least one inorganic layer of the thin film transistor array layer, the opening area of the partition groove on the surface of one side, close to the substrate, of the inorganic layer on the inorganic layer is larger than the opening area of the partition groove on the surface of one side, far away from the substrate, of the inorganic layer on the substrate, and the orthographic projection of the opening of the partition groove on the surface of one side, close to the substrate, of the inorganic layer on the substrate covers the orthographic projection of the opening of the partition groove on the surface of one side, far away from the substrate, of.
The public layer has a poor effect of blocking water and oxygen, and when water and oxygen in an external environment invade, the water and oxygen are easy to transmit to the inside of the display panel along the public layer, so that the public layer becomes a path for the water and oxygen to invade. In addition, the opening of the partition groove on the surface of the second inorganic layer is larger than or equal to the opening of the partition groove on the surface of the first inorganic layer, so that the partition groove can be prevented from having a deposition dead angle, and the phenomenon of package failure caused by the fact that the whole side wall of the partition groove cannot be covered when the packaging layer is formed can be reduced.
Drawings
Fig. 1 is a schematic structural diagram of a display panel provided in the related art;
fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view at cutting line DD in FIG. 2;
FIG. 4 is an enlarged view of the partition groove 3 at E in FIG. 3;
fig. 5 is a schematic structural diagram of a partition groove in a display panel according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
FIG. 7 is a diagram showing the relationship between the angle θ between the sidewall of the isolation trench and the bottom of the isolation trench and the thickness ratio a of the package layer;
fig. 8 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
fig. 13 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
fig. 14 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
fig. 15 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
fig. 16 is a schematic structural diagram of another partition groove in the display panel according to the embodiment of the invention;
fig. 17 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
fig. 18 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
fig. 19 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
fig. 20 is a schematic structural diagram of another partition groove in the display panel according to the embodiment of the invention;
fig. 21 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention;
fig. 22 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 23 is a schematic structural diagram of another display panel according to an embodiment of the present invention.
Detailed Description
At present, as shown in fig. 1, fig. 1 is a schematic structural diagram of a display panel in the related art, a display panel having a display region a with an opening region includes the display region a, the opening region C and a non-display region B located between the display region a and the opening region C, a hole digging process performed on the display panel can result in direct exposure of a light-emitting functional film 01 evaporated on the whole surface, external water and oxygen can enter the light-emitting functional film 01 in the non-display region B from the opening region C and then enter the display region a inside the display panel along the oxidized light-emitting functional film 01, and finally, the display panel is failed to be packaged.
The embodiment of the invention provides a display panel and a display device, aiming at the problem that the display panel in the related art suffers from water vapor invasion. The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 2, fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention, and the display panel according to the embodiment of the present invention has a display area AA, a non-display area BB, and an opening area CC; the opening area CC penetrates the display panel, and the non-display area BB includes a first non-display area B1 and a second non-display area B2, wherein the first non-display area B1 is located between the opening area CC and the display area AA, the second non-display area B2 is located outside the display area AA, and the second non-display area B2 surrounds the display area AA, which surrounds the first non-display area B1, and the first non-display area B1 surrounds the opening area CC;
as shown in fig. 3 and 4, fig. 3 is a sectional view of fig. 2 at a cutting line DD, and fig. 4 is an enlarged view of a partition groove 3 at E of fig. 3, and the display panel includes: the thin film transistor array substrate comprises a substrate base plate 1 and a thin film transistor array layer 2, wherein the thin film transistor array layer 2 is located on one side of the substrate base plate 1, the thin film transistor array layer 2 comprises an inorganic layer, the inorganic layer comprises a first inorganic layer 21 and a second inorganic layer 22, and the second inorganic layer 22 is located on one side, far away from the substrate base plate 1, of the first inorganic layer 21. Optionally, as shown in fig. 3, the display panel further includes a partition groove 3, the partition groove 3 is located in the first non-display region B1, and the partition groove 3 penetrates through the first inorganic layer 21 and the second inorganic layer 22; wherein, the orthographic projection of the opening of the surface of the partition groove 3, which is positioned on one side of the second inorganic layer 22 close to the substrate base plate 1, on the substrate base plate 1 covers the orthographic projection of the opening of the surface of the first inorganic layer 21, which is positioned on one side of the substrate base plate 1, on the substrate base plate 1, the orthographic projection of the opening of the surface of at least one layer of inorganic layer of the partition groove 3, which is positioned on one side of the thin film transistor array layer 2 close to the substrate base plate 1, on the substrate base plate 1 is larger than and the orthographic projection of the opening of the surface of the inorganic layer, which is positioned on one side of the; the light-emitting functional film layer 4 is located on the side, away from the substrate 1, of the thin film transistor array layer 2, the light-emitting functional film layer 4 includes a common layer 41, the common layer 41 is located in the first non-display area B1 and the display area AA, and specifically, the common layer 41 includes one or more of a hole transport layer, a hole injection layer, a light-emitting layer, an electron transport layer and an electron injection layer. Since the hole transport layer, the hole injection layer, the light emitting layer, the electron transport layer, and the electron injection layer are usually organic layers formed by organic materials, and the organic layers have poor effect of blocking water and oxygen, when water and oxygen in the external environment invade, the water and oxygen are easily transported to the inside of the display panel along the organic layers, so that the organic layers become a path for water and oxygen invasion, and the common layer 41 is disconnected at the partition groove 3 for blocking the water and oxygen path. Since the organic layer is slightly thicker than the inorganic layer, it is only necessary to use the partition grooves 3 penetrating both inorganic layers to ensure the disconnection of the common layer 41. Because the opening of the partition groove 3 on the surface of the second inorganic layer 22 is larger than or equal to the opening of the partition groove 3 on the surface of the first inorganic layer 21, the partition groove 3 can be prevented from having a deposition dead angle, and the phenomenon of package failure caused by the fact that the whole side wall of the partition groove 3 cannot be covered when a package layer is formed can be reduced; because the orthographic projection of the opening of the surface of at least one inorganic layer of the partition groove 3, which is positioned on the thin film transistor array layer 2 and is close to the substrate base plate 1, on the substrate base plate 1 is larger than and covers the orthographic projection of the opening of the surface of the inorganic layer, which is positioned on the side far away from the substrate base plate 1, on the substrate base plate 1, the common layer 41 is prevented from being deposited along the side wall of the partition groove 3, and the common layer 41 is prevented from being blocked to cause packaging failure.
Optionally, with continued reference to fig. 3 and fig. 4, the display panel further includes a thin film encapsulation layer 5, the thin film encapsulation layer 5 is located on a side of the light-emitting functional film layer 4 away from the thin film transistor array layer 2, the thin film encapsulation layer 5 at least includes an inorganic encapsulation layer, and the inorganic encapsulation layer covers the sidewall and the bottom wall of the partition groove 3.
It should be noted that the effect of blocking water and oxygen by the common layer 41 is relatively poor, when water and oxygen in an external environment invade, the water and oxygen are easily transmitted to the inside of the display panel along the common layer 41, so that the common layer 41 becomes a path for water and oxygen invasion. In addition, the opening of the partition groove on the surface of the second inorganic layer is larger than or equal to the opening of the partition groove on the surface of the first inorganic layer, so that the partition groove can be prevented from having a deposition dead angle, and the phenomenon of package failure caused by the fact that the whole side wall of the partition groove cannot be covered when the packaging layer is formed can be reduced.
It should be noted that, as shown in fig. 4 and 5, fig. 5 is a schematic structural diagram of a partition groove in a display panel according to an embodiment of the present invention, in the display panel according to the embodiment of the present invention, a first non-display area B1 separates a display area AA from an opening area CC. In order to prevent the water and oxygen from being transferred from the opening area BB to the inside of the display panel along the common layer 41, it is necessary to disconnect the opening area CC from the common layer 41 of the display area AA, thereby disconnecting the water and oxygen invasion path, specifically, the partition groove 3 is located in the first non-display area B1, and the common layer 41 in the light emitting function film layer 4 is disconnected at the partition groove 3. Generally, the thin film transistor array layer 2 is positioned on one side of the substrate base plate 1; the thin film transistor array layer 2 comprises inorganic layers, the inorganic layers comprise a first inorganic layer 21 and a second inorganic layer 22, and the second inorganic layer 22 is positioned on one side, far away from the substrate base plate 1, of the first inorganic layer 21; the partition groove 3 penetrates the first inorganic layer 21 and the second inorganic layer 22; at the contact surface between the second inorganic layer 22 and the first inorganic layer 21, the opening of the partition groove 3 on the surface of the second inorganic layer 22 is larger than or equal to the opening of the partition groove 3 on the surface of the first inorganic layer 21, so that the situation that the inorganic packaging layer cannot be covered and packaging failure occurs due to dead angles of the partition groove 3 is prevented; in at least one inorganic layer (such as the first inorganic layer 21 in fig. 4 and the second inorganic layer 22 in fig. 5) of the thin film transistor array layer 2, the opening area of the surface of the partition groove 3 on the side of the inorganic layer close to the substrate 1 is larger than the opening area of the surface of the partition groove 3 on the side of the inorganic layer far from the substrate 1, and the orthographic projection of the opening of the surface of the partition groove 3 on the side of the inorganic layer close to the substrate 1 on the substrate 1 covers the orthographic projection of the opening of the surface of the partition groove 3 on the side of the inorganic layer far from the substrate 1 on the substrate 1. The light emitting functional film layer 4 includes a common layer 41, and the common layer 41 includes one or more of a hole transport layer, a hole injection layer, a light emitting layer, an electron transport layer, and an electron injection layer. The hole transport layer, the hole injection layer, the light emitting layer, the electron transport layer and the electron injection layer are organic layers formed by organic materials generally, the organic layers have poor water and oxygen blocking effect, when water and oxygen in an external environment invade, the water and oxygen are easy to be transported to the interior of the display panel along the organic layers, and the organic layers become a water and oxygen invasion path.
Optionally, in the display panel provided in the embodiment of the present invention, an orthographic projection of the opening of the partition groove 3 on the surface of the inorganic layer on the side far from the substrate base plate 1 on the substrate base plate 1 covers an orthographic projection of the opening of the surface of the inorganic layer on the side close to the substrate base plate 1 on the substrate base plate 1. It can be understood that the orthographic projection of the opening of the partition groove 3 on the surface of at least one inorganic layer on the side far from the substrate base plate 1 on the substrate base plate 1 covers the orthographic projection of the opening of the surface of the inorganic layer on the side near to the substrate base plate 1 on the substrate base plate 1, wherein the covering can be understood as that the orthographic projection of the opening of the surface of the inorganic layer on the side far from the substrate base plate 1 on the substrate base plate 1 coincides with the orthographic projection of the opening of the surface of the inorganic layer on the side near to the substrate base plate 1 on the substrate base plate 1, that is, the orthographic projection areas of the openings of the two are equal, or the orthographic projection area of the opening of the surface of the inorganic layer on the side far from the substrate base plate 1 on the substrate base plate 1 is larger than the orthographic projection area of the opening of the surface of the.
Optionally, an orthographic projection of an opening on the surface of the inorganic layer on the side far away from the substrate base plate 1 on the substrate base plate 1 coincides with an orthographic projection of an opening on the surface of the inorganic layer on the side close to the substrate base plate 1 on the substrate base plate 1, that is, the orthographic projection areas of the openings are equal.
Referring to fig. 5, the first inorganic layer 21 is located above the substrate 1, the second inorganic layer 22 is located above the first inorganic layer 21, and at the contact surface between the second inorganic layer 22 and the first inorganic layer 21, the size of the opening of the partition groove 3 on the surface of the second inorganic layer 22 is equal to the size of the opening of the partition groove 3 on the surface of the first inorganic layer 21. The size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is smaller than the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 in the upper surface of the second inorganic layer 22 is equal to the size of the opening of the partition groove 3 in the lower surface of the second inorganic layer 22. In the etching process, the structure can effectively ensure that the openings of the two inorganic layers at the interface of the inorganic layers are the same, the side wall of the partition groove 3 has no dead angle, and when the packaging layer is deposited in the partition groove 3 of the structure, the inorganic packaging layer can be ensured to cover the side wall and the bottom wall of the partition groove 3, so that the packaging reliability is ensured, and the yield of the process is favorably improved.
As shown in fig. 6, fig. 6 is a schematic structural diagram of another partition groove in the display panel according to the embodiment of the present invention, in which the first inorganic layer 21 is located above the substrate base plate 1, the second inorganic layer 22 is located above the first inorganic layer 21, and at a contact surface between the second inorganic layer 22 and the first inorganic layer 21, an opening size of the partition groove 3 located on a surface of the second inorganic layer 22 is equal to an opening size of the partition groove 3 located on a surface of the first inorganic layer 21. The size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is equal to the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 in the upper surface of the second inorganic layer 22 is smaller than the size of the opening of the partition groove 3 in the lower surface of the second inorganic layer 22. In the etching process, the structure can effectively ensure that the openings of the two inorganic layers at the interface of the inorganic layers are the same, the side wall of the partition groove 3 has no dead angle, and when the packaging layer is deposited in the partition groove 3 of the structure, the inorganic packaging layer can be ensured to cover the side wall and the bottom wall of the partition groove 3, so that the packaging reliability is ensured, and the yield of the process is favorably improved.
Optionally, the area of the orthographic projection of the opening of the surface of the inorganic layer on the side far away from the substrate base plate 1 on the substrate base plate 1 is larger than the area of the orthographic projection of the opening of the surface of the inorganic layer on the side close to the substrate base plate 1 on the substrate base plate 1. As shown in fig. 7, fig. 7 is a graph of a relationship between an included angle θ between a sidewall of the partition groove and a bottom surface of the partition groove and a thickness ratio a of the encapsulation layer, where a is h/h0, and h is a thickness of the encapsulation layer in a direction perpendicular to θ; h0 is the thickness of the inorganic packaging layer when theta is 0 degree; i.e. a is the ratio of the thickness of the inorganic encapsulation layer to the thickness of the inorganic encapsulation layer when θ is zero degrees. As can be seen from fig. 7, when θ is 20 °, the ratio a of the thickness of the inorganic sealing layer to the thickness of the inorganic sealing layer when θ is zero is 0.2; when theta is 50 degrees, the ratio a of the thickness of the inorganic packaging layer to the thickness of the inorganic packaging layer when theta is zero is 0.3; when theta is 80 degrees, the ratio a of the thickness of the inorganic packaging layer to the thickness of the inorganic packaging layer when theta is zero is 0.4; when θ is 90 °, the ratio a of the thickness of the inorganic encapsulation layer to the thickness of the inorganic encapsulation layer when θ is zero is 0.6; therefore, an included angle theta between the side wall of the partition groove and the bottom surface of the partition groove is limited to a certain extent, if the angle is too large, the thickness of the inorganic packaging layer corresponding to the angle is too thin, and at the moment, although the packaging layer is continuous, the possibility of cracks is high, and the packaging problem still occurs.
Optionally, theta is greater than or equal to 50 degrees, the packaging layer can be ensured to be continuous in the partition groove at the moment, the thickness of the inorganic packaging layer on the side wall of the partition groove can be prevented from being too small, the situation that the inorganic packaging layer is invaded by water and oxygen is avoided, and the stability of the packaging performance is improved.
As shown in fig. 8, fig. 8 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention, in which a first inorganic layer 21 is located above a substrate base plate 1, a second inorganic layer 22 is located above the first inorganic layer 21, and at a contact surface between the second inorganic layer 22 and the first inorganic layer 21, an opening size of the partition groove 3 located on a surface of the second inorganic layer 22 is equal to an opening size of the partition groove 3 located on a surface of the first inorganic layer 21. The size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is smaller than the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 in the upper surface of the second inorganic layer 22 is larger than the size of the opening of the partition groove 3 in the lower surface of the second inorganic layer 22. This structure separates 3 lateral walls of disconnected groove and does not have the dead angle, when the 3 deposit encapsulating layers in the wall groove of this structure, can guarantee that inorganic encapsulating layer covers the lateral wall and the diapire that separate disconnected groove 3 to guarantee the reliability of encapsulation, and, this kind of structure big-end-up can increase inorganic encapsulating layer's heavy membrane homogeneity.
As shown in fig. 9, fig. 9 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention, in which a first inorganic layer 21 is located above a substrate base plate 1, a second inorganic layer 22 is located above the first inorganic layer 21, and at a contact surface between the second inorganic layer 22 and the first inorganic layer 21, an opening size of the partition groove 3 located on a surface of the second inorganic layer 22 is equal to an opening size of the partition groove 3 located on a surface of the first inorganic layer 21. The size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is larger than the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 in the upper surface of the second inorganic layer 22 is smaller than the size of the opening of the partition groove 3 in the lower surface of the second inorganic layer 22. The side wall of the partition groove 3 of the structure has no dead angle, and when an encapsulation layer is deposited on the partition groove 3 of the structure, the inorganic encapsulation layer can be ensured to cover the side wall and the bottom wall of the partition groove 3, so that the encapsulation reliability is ensured.
Optionally, in the display panel provided in the embodiment of the present invention, when the number of the first inorganic layers 21 and the second inorganic layers 22 in the inorganic layers is plural, the first inorganic layers 21 and the second inorganic layers 22 are alternately disposed in a direction perpendicular to the plane of the substrate base plate 1. In the adjacent first inorganic layer 21 and second inorganic layer 22, the partition groove may adopt the alternative embodiments of fig. 4, fig. 6, fig. 8, and fig. 9, which is specifically illustrated in fig. 10, and fig. 10 is a schematic structural diagram of another partition groove in the display panel provided in the embodiment of the present invention. The first inorganic layer 21 is located above the substrate base plate 1, the second inorganic layer 22 is located above the first inorganic layer 21, and the first inorganic layer 21 and the second inorganic layer 22 are alternately arranged from bottom to top. At the interface between the second inorganic layer 22 and the first inorganic layer 21, the size of the opening of the partition groove 3 on the surface of the second inorganic layer 22 is equal to the size of the opening of the partition groove 3 on the surface of the first inorganic layer 21. The size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is larger than the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 in the upper surface of the second inorganic layer 22 is smaller than the size of the opening of the partition groove 3 in the lower surface of the second inorganic layer 22. The side wall of the partition groove 3 of the structure has no dead angle, and when an encapsulation layer is deposited on the partition groove 3 of the structure, the inorganic encapsulation layer can be ensured to cover the side wall and the bottom wall of the partition groove 3, so that the encapsulation reliability is ensured.
Alternatively, the orthographic projection of the opening of the partition groove 3 on the surface of the first inorganic layer 21 and the second inorganic layer 22 on the side close to the substrate base plate 1 on the substrate base plate 1 is larger than and covers the orthographic projection of the opening of the partition groove 3 on the surface of the inorganic layer on the side far from the substrate base plate 1 on the substrate base plate 1.
Specifically, in the display panel provided in the embodiment of the present invention, an orthographic projection of an opening of the partition groove 3 on a surface of the first inorganic layer 21 on a side close to the substrate base plate 1 on the substrate base plate 1 is larger than and covers an opening of the partition groove 3 on a surface of the first inorganic layer 21 on a side away from the substrate base plate 1 on the substrate base plate 1, an orthographic projection of an opening of the partition groove 3 on a surface of the second inorganic layer 22 on a side close to the substrate base plate 1 on the substrate base plate 1 is larger than and covers an opening of the partition groove 3 on a surface of the second inorganic layer 22 on a side away from the substrate base plate 1 on the substrate base plate, that is, an opening size of the partition groove 3 on an upper surface (a surface on a side away from the substrate base plate) of the first inorganic layer 21 is smaller than that of an opening size of the lower surface (a surface on a side close.
Optionally, the specific structure of the partition groove 3 penetrating through the first inorganic layer 21 and the second inorganic layer 22 further includes: as shown in fig. 11, fig. 11 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention, in which a first inorganic layer 21 is located above a substrate base plate 1, a second inorganic layer 22 is located above the first inorganic layer 21, and at a contact surface between the second inorganic layer 22 and the first inorganic layer 21, an opening size of the partition groove 3 located on a surface of the second inorganic layer 22 is equal to an opening size of the partition groove 3 located on a surface of the first inorganic layer 21. The size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is smaller than the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 in the upper surface of the second inorganic layer 22 is smaller than the size of the opening of the partition groove 3 in the lower surface of the second inorganic layer 22. This structure separates 3 lateral walls of groove and does not have the dead angle, when the 3 deposit encapsulation layers in the wall groove of this structure, can guarantee that inorganic encapsulation layer covers the lateral wall and the diapire that separate groove 3 to guarantee the reliability of encapsulation, and, first inorganic layer 21 and second inorganic layer 22 all adopt the opening design of the same type (the opening is little earlier the opening size is little above the opening) and from both can adopt same etching process to form the opening of the same type in the technology, do not need the parameter modulation of going on of repetitious, simplify preparation technology.
Optionally, in the display panel provided in the embodiment of the present invention, the thin film transistor array layer 2 further includes a third inorganic layer 23; the third inorganic layer 23 is located on the side of the second inorganic layer 22 far away from the substrate base plate 1, the partition groove 3 penetrates through the third inorganic layer 23, and the orthographic projection of the opening of the partition groove 3 located on the surface of the third inorganic layer 23 close to the substrate base plate 1 on the substrate base plate 1 coincides with the orthographic projection of the opening of the surface of the second inorganic layer 22 far away from the substrate base plate 1 on the substrate base plate 1. It should be noted that, the specific structure of the partition groove 3 penetrating through the second inorganic layer 22 and the first inorganic layer 21 may adopt any one of the aforementioned alternative embodiments, and is not described herein again.
Optionally, in the display panel provided in the embodiment of the present invention, an orthographic projection of the opening of the partition groove 3 on the surface of the third inorganic layer 23 on the side close to the substrate base plate 1 on the substrate base plate 1 covers an orthographic projection of the opening of the surface of the inorganic layer on the side far from the substrate base plate 1 on the substrate base plate 1; alternatively, the orthographic projection of the opening of the surface of the partition groove 3 on the side of the third inorganic layer 23 far from the base substrate 1 on the base substrate 1 covers the orthographic projection of the opening of the surface of the third inorganic layer 23 on the side close to the base substrate 1 on the base substrate 1.
Specifically, as shown in fig. 12, fig. 12 is a schematic structural diagram of another partition groove in the display panel according to the embodiment of the present invention, in which a first inorganic layer 21 is located above a substrate base plate 1, a second inorganic layer 22 is located above the first inorganic layer 21, a third inorganic layer 23 is located above the second inorganic layer 22, and at a contact surface between the second inorganic layer 22 and the first inorganic layer 21, an opening size of the partition groove 3 located on a surface of the second inorganic layer 22 is equal to an opening size of the partition groove 3 located on a surface of the first inorganic layer 21. At the interface between the third inorganic layer 23 and the second inorganic layer 22, the size of the opening of the partition groove 3 on the surface of the second inorganic layer 22 is equal to the size of the opening of the partition groove 3 on the surface of the third inorganic layer 23. The size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is smaller than the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 on the upper surface of the second inorganic layer 22 is larger than the size of the opening of the partition groove 3 on the lower surface of the second inorganic layer 22; the size of the opening of the partition groove 3 in the upper surface of the third inorganic layer 23 is equal to the size of the opening of the partition groove 3 in the lower surface of the third inorganic layer 23. This structure separates 3 lateral walls of groove and does not have the dead angle, when the 3 deposit encapsulated layers in the wall groove of this structure, can guarantee that inorganic encapsulated layer covers the lateral wall and the diapire that separate groove 3 to guarantee the reliability of encapsulation, and, the third inorganic layer has increaseed the degree of depth that separates the groove, can further guarantee the disconnection of common layer 41, and the thickness that cuts off the groove degree of depth promptly is greater than common layer 41 just can let common layer 41 break off completely, disconnection water oxygen invasion route.
Specifically, as shown in fig. 13, fig. 13 is a schematic structural diagram of another partition groove in the display panel according to the embodiment of the present invention, in which a first inorganic layer 21 is located above a substrate base plate 1, a second inorganic layer 22 is located above the first inorganic layer 21, a third inorganic layer 23 is located above the second inorganic layer 22, and at a contact surface between the second inorganic layer 22 and the first inorganic layer 21, an opening size of the partition groove 3 located on a surface of the second inorganic layer 22 is equal to an opening size of the partition groove 3 located on a surface of the first inorganic layer 21. At the interface between the third inorganic layer 23 and the second inorganic layer 22, the size of the opening of the partition groove 3 on the surface of the second inorganic layer 22 is equal to the size of the opening of the partition groove 3 on the surface of the third inorganic layer 23. The size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is smaller than the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 on the upper surface of the second inorganic layer 22 is smaller than the size of the opening of the partition groove 3 on the lower surface of the second inorganic layer 22; the size of the opening of the partition groove 3 in the upper surface of the third inorganic layer 23 is larger than the size of the opening of the partition groove 3 in the lower surface of the third inorganic layer 23. This structure separates 3 lateral walls of groove and does not have the dead angle, when the 3 deposit encapsulating layer in the wall groove of this structure, can guarantee that inorganic encapsulating layer covers the lateral wall and the diapire that separate groove 3 to guarantee the reliability of encapsulation, and the opening type on third inorganic layer in this structure guarantees the cover homogeneity that separates the groove lateral wall when can guaranteeing inorganic layer dress deposit rete.
Optionally, in the display panel provided in the embodiment of the present invention, an orthogonal projection of an opening of the partition groove 3 on a surface of the first inorganic layer 21, the second inorganic layer 22, and the third inorganic layer 23 on a side close to the substrate 1 on the substrate 1 is larger than and covers an orthogonal projection of an opening of a surface of the inorganic layer on a side far from the substrate 1 on the substrate 1.
Specifically, as shown in fig. 14, fig. 14 is a schematic structural diagram of another partition groove in the display panel according to the embodiment of the present invention, in which a first inorganic layer 21 is located above a substrate base plate 2, a second inorganic layer 22 is located above the first inorganic layer 21, a third inorganic layer 23 is located above the second inorganic layer 22, and at a contact surface between the second inorganic layer 22 and the first inorganic layer 21, an opening size of the partition groove 3 located on a surface of the second inorganic layer 22 is equal to an opening size of the partition groove 3 located on a surface of the first inorganic layer 21. At the interface between the third inorganic layer 23 and the second inorganic layer 22, the size of the opening of the partition groove 3 on the surface of the second inorganic layer 22 is equal to the size of the opening of the partition groove 3 on the surface of the third inorganic layer 23. The size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is smaller than the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 on the upper surface of the second inorganic layer 22 is smaller than the size of the opening of the partition groove 3 on the lower surface of the second inorganic layer 22; the size of the opening of the partition groove 3 in the upper surface of the third inorganic layer 23 is smaller than the size of the opening of the partition groove 3 in the lower surface of the third inorganic layer 23. The side wall of the partition groove 3 of the structure has no dead angle, and when an encapsulation layer is deposited on the partition groove 3 of the structure, the inorganic encapsulation layer can be ensured to cover the side wall and the bottom wall of the partition groove 3, so that the encapsulation reliability is ensured. The isolation grooves 3 are formed by adopting the same opening type on the three inorganic layers and adopting the same type of opening design (the opening on the isolation grooves is small, the opening size is small firstly), and the same type of openings can be formed by adopting the same etching process in the aspect of process, so that the parameter modulation is not required to be repeated for many times, and the preparation process is simplified.
Specifically, as shown in fig. 15, fig. 15 is a schematic structural diagram of another partition groove in the display panel according to the embodiment of the present invention, in which the first inorganic layer 21 is located above the substrate base plate 1, the second inorganic layer 22 is located above the first inorganic layer 21, the third inorganic layer 23 is located above the second inorganic layer 22, and at a contact surface between the second inorganic layer 22 and the first inorganic layer 21, an opening size of the partition groove 3 located on a surface of the second inorganic layer 22 is equal to an opening size of the partition groove 3 located on a surface of the first inorganic layer 21. At the interface between the third inorganic layer 23 and the second inorganic layer 22, the size of the opening of the partition groove 3 on the surface of the second inorganic layer 22 is equal to the size of the opening of the partition groove 3 on the surface of the third inorganic layer 23. The size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is smaller than the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 on the upper surface of the second inorganic layer 22 is smaller than the size of the opening of the partition groove 3 on the lower surface of the second inorganic layer 22; the size of the opening of the partition groove 3 in the upper surface of the third inorganic layer 23 is equal to the size of the opening of the partition groove 3 in the lower surface of the third inorganic layer 23. The side wall of the partition groove 3 of the structure has no dead angle, and when an encapsulation layer is deposited on the partition groove 3 of the structure, the inorganic encapsulation layer can be ensured to cover the side wall and the bottom wall of the partition groove 3, so that the encapsulation reliability is ensured.
Optionally, in the display panel provided in the embodiment of the present invention, the thin film transistor array layer 2 further includes a fourth inorganic layer 24, where the fourth inorganic layer 24 is located on a side of the first inorganic layer 21 facing the substrate 1; the partition groove 3 partially penetrates through the fourth inorganic layer 24, an orthographic projection of an opening, positioned on the surface, far away from the substrate base plate 1, of the fourth inorganic layer 24, of the partition groove 3 on the substrate base plate 1 is overlapped with an orthographic projection of an opening, positioned on the surface, near the substrate base plate 1, of the first inorganic layer 21, of the partition groove 3 on the substrate base plate 1, and an orthographic projection of an opening, positioned on the surface, far away from the substrate base plate 1, of the fourth inorganic layer 24 on the substrate base plate 1 is larger than and covers an orthographic projection of an opening, positioned on the surface, near the substrate base plate 1, of the fourth inorganic layer 24 on the substrate base.
Specifically, as shown in fig. 16, fig. 16 is a schematic structural diagram of another partition groove in the display panel according to the embodiment of the present invention, in which a fourth inorganic layer 24 is located above a substrate base plate 1, a first inorganic layer 21 is located above the fourth inorganic layer 24, a second inorganic layer 22 is located above the first inorganic layer 21, a third inorganic layer 23 is located above the second inorganic layer 22, and at a contact surface between the first inorganic layer 21 and the fourth inorganic layer 24, an opening size of the partition groove 3 located on a surface of the fourth inorganic layer 24 is equal to an opening size of the partition groove 3 located on a surface of the first inorganic layer 21. At the interface between the second inorganic layer 22 and the first inorganic layer 21, the size of the opening of the partition groove 3 on the surface of the second inorganic layer 22 is equal to the size of the opening of the partition groove 3 on the surface of the first inorganic layer 21. At the interface between the third inorganic layer 23 and the second inorganic layer 22, the size of the opening of the partition groove 3 on the surface of the second inorganic layer 22 is equal to the size of the opening of the partition groove 3 on the surface of the third inorganic layer 23. The opening size of the partition groove 3 on the upper surface of the fourth inorganic layer 24 is smaller than the opening size of the partition groove 3 at the groove bottom in the fourth inorganic layer 22; the size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is smaller than the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 on the upper surface of the second inorganic layer 22 is larger than the size of the opening of the partition groove 3 on the lower surface of the second inorganic layer 22; the size of the opening of the partition groove 3 in the upper surface of the third inorganic layer 23 is smaller than the same size as the opening of the partition groove 3 in the lower surface of the third inorganic layer 23. The side wall of the partition groove 3 of the structure has no dead angle, and when an encapsulation layer is deposited on the partition groove 3 of the structure, the inorganic encapsulation layer can be ensured to cover the side wall and the bottom wall of the partition groove 3, so that the encapsulation reliability is ensured.
Optionally, in the display panel provided in the embodiment of the present invention, a thickness of the fourth inorganic layer 24 is greater than that of the first inorganic layer 21, and a thickness of the fourth inorganic layer 24 is greater than that of the second inorganic layer 22. Specifically, as shown in fig. 14, the first inorganic layer 21 and the second inorganic layer 22 are equal in thickness, and the fourth inorganic layer 24 is thicker than the first inorganic layer 21 or the second inorganic layer 22. By adopting the structure, the depth of the isolation groove is further increased, the fourth inorganic layer can prevent the substrate base plate from being over-etched when the inorganic layer is etched, a certain protection effect is realized on the substrate base plate, and the thickness of the fourth inorganic layer is also used for preventing the substrate base plate from being over-etched.
Optionally, in the display panel provided in the embodiment of the present invention, the thin film transistor array layer 2 further includes a fifth inorganic layer 25, where the fifth inorganic layer 25 is located on a side of the third inorganic layer 23 away from the substrate base plate 1; the partition groove 3 penetrates through the fifth inorganic layer 25, and an orthographic projection of an opening of the partition groove 3, which is positioned on the surface of the third inorganic layer 23 far away from the substrate base plate 1, on the substrate base plate 1 coincides with an orthographic projection of an opening of the fifth inorganic layer 25, which is positioned on the surface close to the substrate base plate 1, on the substrate base plate 1.
Specifically, as shown in fig. 17, fig. 17 is a schematic structural diagram of another partition groove in the display panel according to the embodiment of the present invention, in which a first inorganic layer 21 is located above a substrate base plate 1, a second inorganic layer 22 is located above the first inorganic layer 21, a third inorganic layer 23 is located above the second inorganic layer 22, and at a contact surface between the second inorganic layer 22 and the first inorganic layer 21, an opening size of the partition groove 3 located on a surface of the second inorganic layer 22 is equal to an opening size of the partition groove 3 located on a surface of the first inorganic layer 21; at the contact surface of the third inorganic layer 23 and the second inorganic layer 22, the size of the opening of the partition groove 3 on the surface of the second inorganic layer 22 is equal to the size of the opening of the partition groove 3 on the surface of the third inorganic layer 23; at the contact surface of the fifth inorganic layer 25 and the third inorganic layer 23, the size of the opening of the partition groove 3 on the surface of the fifth inorganic layer 25 is equal to the size of the opening of the partition groove 3 on the surface of the third inorganic layer 23.
Optionally, in the display panel provided in the embodiment of the present invention, an orthogonal projection of an opening of the partition groove 3 located on the surface of the fifth inorganic layer 25 away from the substrate base 1 on the substrate base 1 is smaller than an orthogonal projection of an opening located on the surface of the fifth inorganic layer 25 close to the substrate base 1 on the substrate base 1.
Specifically, with reference to fig. 17, the size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is smaller than the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 on the upper surface of the second inorganic layer 22 is smaller than the size of the opening of the partition groove 3 on the lower surface of the second inorganic layer 22; the size of the opening of the partition groove 3 on the upper surface of the third inorganic layer 23 is smaller than the size of the opening of the partition groove 3 on the lower surface of the third inorganic layer 23; the opening size of the partition groove 3 on the upper surface of the fifth inorganic layer 25 is smaller than the opening size of the partition groove 3 on the lower surface of the fifth inorganic layer 25. The side wall of the partition groove 3 of the structure has no dead angle, and when an encapsulation layer is deposited on the partition groove 3 of the structure, the inorganic encapsulation layer can be ensured to cover the side wall and the bottom wall of the partition groove 3, so that the encapsulation reliability is ensured. The isolation grooves 3 are formed by adopting the same opening types on the four inorganic layers, and the same type of openings can be formed by adopting the same etching process from the aspect of the process by adopting the same type of opening design (the openings on the upper surfaces are small, and the sizes of the openings are small first), so that the parameter modulation is not required to be repeated for many times, and the preparation process is simplified.
Optionally, in the display panel provided in the embodiment of the present invention, an orthogonal projection of the opening of the partition groove 3 located on the surface of the fifth inorganic layer 25 away from the substrate base 1 on the substrate base 1 is larger than and covers an orthogonal projection of the opening located on the surface of the fifth inorganic layer 25 close to the substrate base 1 on the substrate base 1.
Specifically, as shown in fig. 18, fig. 18 is a schematic structural diagram of another partition groove in the display panel according to the embodiment of the present invention, in which a first inorganic layer 21 is located above a substrate base plate 1, a second inorganic layer 22 is located above the first inorganic layer 21, a third inorganic layer 23 is located above the second inorganic layer 22, and at a contact surface between the second inorganic layer 22 and the first inorganic layer 21, an opening size of the partition groove 3 located on a surface of the second inorganic layer 22 is equal to an opening size of the partition groove 3 located on a surface of the first inorganic layer 21; at the contact surface of the third inorganic layer 23 and the second inorganic layer 22, the size of the opening of the partition groove 3 on the surface of the second inorganic layer 22 is equal to the size of the opening of the partition groove 3 on the surface of the third inorganic layer 23; at the contact surface of the fifth inorganic layer 25 and the third inorganic layer 23, the size of the opening of the partition groove 3 on the surface of the fifth inorganic layer 25 is equal to the size of the opening of the partition groove 3 on the surface of the third inorganic layer 23. The size of the opening of the partition groove 3 on the upper surface of the first inorganic layer 21 is smaller than the size of the opening of the partition groove 3 on the lower surface of the first inorganic layer 21; the size of the opening of the partition groove 3 on the upper surface of the second inorganic layer 22 is smaller than the size of the opening of the partition groove 3 on the lower surface of the second inorganic layer 22; the size of the opening of the partition groove 3 on the upper surface of the third inorganic layer 23 is smaller than the size of the opening of the partition groove 3 on the lower surface of the third inorganic layer 23; the size of the opening of the partition groove 3 in the upper surface of the fifth inorganic layer 25 is larger than the size of the opening of the partition groove 3 in the lower surface of the fifth inorganic layer 25. The side wall of the partition groove 3 of the structure has no dead angle, and when an encapsulation layer is deposited on the partition groove 3 of the structure, the inorganic encapsulation layer can be ensured to cover the side wall and the bottom wall of the partition groove 3, so that the encapsulation reliability is ensured. Moreover, the opening type of the fifth inorganic layer in the structure of the partition groove 3 can ensure the covering uniformity of the side wall of the partition groove when the inorganic layer is provided with a deposition film layer, the three layers of openings below the fifth inorganic layer are consistent in type, the same type of openings can be formed by adopting the same type of opening design (the upper opening is small, the opening size is small first) from the aspect of process by adopting the same etching process, repeated parameter modulation is not needed, and the preparation process is simplified.
Optionally, in the display panel provided in the embodiment of the present invention, in a direction from the substrate base plate 1 to the light emitting surface of the display panel, an included angle between the sidewall of the partition groove 3 and the bottom surface of the partition groove 3 is gradually reduced to form a gradually changing inorganic layer package structure, so as to achieve a better effect of isolating the water and oxygen path.
Specifically, referring to fig. 18, from top to bottom, the included angle between the sidewall of the partition groove 3 and the bottom surface of the partition groove 3 decreases layer by layer, and changes from an obtuse angle to an acute angle layer by layer. As shown in fig. 19, fig. 19 is a schematic structural diagram of another partition groove in a display panel according to an embodiment of the present invention, a side wall of the partition groove 3 is formed by splicing a plurality of connection surfaces, an included angle θ between the side wall of the partition groove 3 and a bottom surface of the partition groove 3 is an acute angle and gradually decreases, and θ is an acute angle1Is in the range of 80 to 90, and specifically can be: 80 °, 85 ° or 90 °; theta2Is in the range of 60 ° to 80 °, and may specifically be: 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees; theta3Is in the range of 20 ° to 50 °, and may specifically be: 20 °, 25 °, 30 °, 35 °, 40 °, 45 °, 50 °; theta4Is in the range of 0 ° to 20 °, and may specifically be: 5 °, 10 °, 15 °, 20 °. As shown in fig. 20, fig. 20 is a schematic structural view of another partition groove in the display panel according to the embodiment of the present invention, and the sidewall of the partition groove 3 isSmooth curved surface, the side wall of the partition groove 3 and the bottom surface of the partition groove 3 have an included angle theta gradually reduced. Optionally, in the display panel provided in the embodiment of the present invention, in a plane parallel to the direction in which the opening area CC points to the display area AA and perpendicular to the substrate base plate 1, the side wall of the partition groove 3 is hyperbolic.
Specifically, as shown in fig. 21, fig. 21 is a schematic structural diagram of another partition groove in the display panel according to the embodiment of the present invention, where a side wall of the partition groove 3 is hyperbolic in a direction parallel to the opening area CC and pointing to the display area AA and perpendicular to the plane of the substrate 1; from top to bottom, the included angle between the side wall of the partition groove 3 and the bottom surface of the partition groove 3 is gradually reduced, and the included angle is gradually changed from an obtuse angle to an acute angle, so that a gradually changed inorganic layer packaging structure is formed, and a better water and oxygen path isolation effect is achieved.
Optionally, in the display panel provided in the embodiment of the present invention, two or more partition grooves 3 are provided. The plurality of partition grooves 3 preferably partition the common layer 41 to block the water and oxygen invasion path.
Optionally, in the display panel provided in the embodiment of the present invention, the blocking slot 3 includes a first blocking slot 31 and a second blocking slot 32, the first blocking slot 31 is located between the second blocking slot 32 and the display area AA, and a height of the first blocking slot 31 in the first direction is greater than a height of the second blocking slot 32 in the first direction; the first direction is a direction perpendicular to the plane of the display panel.
Specifically, as shown in fig. 22, fig. 22 is a schematic structural diagram of another display panel according to an embodiment of the present invention, in which the first blocking groove 31 is located between the second blocking groove 32 and the display area, and a depth of the first blocking groove 31 near the display area AA is smaller than a depth of the second blocking groove 32 near the opening area CC. It should be noted that the second partition groove 32 with a larger depth is beneficial to breaking the inorganic layer and cutting off the water and oxygen invasion path; the shallow first isolation groove 31 is beneficial to the integrity and coverage of the packaging deposition film and the packaging performance. In addition, the first isolation groove 31 near the display area AA is shallow, because the encapsulation mainly prevents water and oxygen from entering the display area AA, the shallow groove with good encapsulation performance is near the display area AA, meanwhile, the first isolation groove 31 can also accommodate part of organic encapsulation layers in the encapsulation, so as to slow down the fluidity of the organic encapsulation layers and prevent the organic encapsulation layers from overflowing to influence the encapsulation, and as for the part of the deep groove, the path of water and oxygen invasion can be cut off as long as the common layer 41 can be cut off.
Optionally, as shown in fig. 23, fig. 23 is a schematic structural diagram of another display panel according to an embodiment of the present invention, where the first isolation groove 31 is located between the second isolation groove 32 and the display area, the second isolation grooves 32 are multiple, and the depths of the second isolation grooves 32 are gradually reduced along the direction from the opening area CC to the display area AA, and the depth of the second isolation grooves 32 is larger, which is beneficial to breaking the inorganic layer and cutting off the water and oxygen invasion path, and the integrity and coverage of the shallow package deposition film are beneficial to the package performance.
Based on the same inventive concept, the embodiment of the invention further provides a display device, which comprises the display panel provided by the embodiment of the invention. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device are understood by those skilled in the art, and are not described herein or should not be construed as limiting the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (18)

1. A display panel, characterized in that the display panel has an opening area, a non-display area and a display area; the opening area penetrates through the display panel, the non-display area comprises a first non-display area, the first non-display area is positioned between the opening area and the display area, the first non-display area surrounds the opening area, and the display area surrounds the first non-display area;
the display panel includes:
a substrate base plate;
the thin film transistor array layer is positioned on one side of the substrate base plate; the thin film transistor array layer comprises an inorganic layer, the inorganic layer comprises a first inorganic layer and a second inorganic layer, and the second inorganic layer is positioned on one side, far away from the substrate, of the first inorganic layer;
the partition groove is positioned in the first non-display area and penetrates through the first inorganic layer and the second inorganic layer; wherein, the orthographic projection of the opening of the surface of the second inorganic layer close to the substrate base plate side of the partition groove on the substrate base plate covers the orthographic projection of the opening of the surface of the first inorganic layer far from the substrate base plate side of the substrate base plate, and the orthographic projection of the opening of the surface of at least one layer of the inorganic layer close to the substrate base plate side of the partition groove on the thin film transistor array layer on the substrate base plate is larger than and covers the orthographic projection of the opening of the surface of the inorganic layer far from the substrate base plate side on the substrate base plate;
the light-emitting function film layer is positioned on one side, far away from the substrate, of the thin film transistor array layer and comprises a common layer, and the common layer is positioned in the first non-display area and the display area; the common layer is disconnected at the blocking groove.
2. The display panel according to claim 1, wherein the partition groove has an opening on a surface of at least one inorganic layer on a side away from the substrate base plate, and an orthogonal projection of the opening on the surface of the inorganic layer on a side close to the substrate base plate covers an orthogonal projection of the opening on the substrate base plate.
3. The display panel according to claim 2, wherein the first inorganic layers and the second inorganic layers are alternately arranged in a direction perpendicular to a plane of the base substrate.
4. The display panel according to claim 1, wherein an orthographic projection of an opening of the partition groove on a surface of the first inorganic layer and a surface of the second inorganic layer on a side close to the substrate base plate is larger than and covers an orthographic projection of an opening of a surface of the inorganic layer on a side far from the substrate base plate.
5. The display panel according to claim 2 or 4, wherein the thin film transistor array layer further comprises a third inorganic layer; the third inorganic layer is positioned on one side, far away from the substrate base plate, of the second inorganic layer, the partition groove penetrates through the third inorganic layer, and the orthographic projection of the opening, positioned on the surface, close to the substrate base plate, of the third inorganic layer, on the substrate base plate coincides with the orthographic projection of the opening, positioned on the surface, far away from the substrate base plate, of the second inorganic layer, on the substrate base plate.
6. The display panel according to claim 5, wherein the partition groove has an opening on a surface of the third inorganic layer on a side close to the substrate base plate, and an orthogonal projection of the opening on the surface of the third inorganic layer on a side away from the substrate base plate covers an orthogonal projection of the opening on the substrate base plate; alternatively, the first and second electrodes may be,
the orthographic projection of the opening of the partition groove on the surface of the third inorganic layer, which is far away from one side of the substrate base plate, on the substrate base plate covers the orthographic projection of the opening of the surface of the third inorganic layer, which is close to one side of the substrate base plate, on the substrate base plate.
7. The display panel according to claim 5, wherein the partition groove has a larger orthographic projection of the opening of the surface of the first inorganic layer, the second inorganic layer, and the third inorganic layer on the side close to the substrate base plate than and covering the opening of the surface of the inorganic layer on the side far from the substrate base plate.
8. The display panel according to claim 5, wherein the thin film transistor array layer further comprises a fourth inorganic layer on a side of the first inorganic layer facing the substrate base plate; the partition groove penetrates through the fourth inorganic layer, an orthographic projection of an opening, located on the surface, far away from the substrate base plate, of the fourth inorganic layer is overlapped with an orthographic projection of an opening, located on the surface, close to the substrate base plate, of the first inorganic layer, of the substrate base plate, and an orthographic projection of an opening, located on the surface, far away from the substrate base plate, of the fourth inorganic layer is larger than and covers an orthographic projection of an opening, located on the surface, close to the substrate base plate, of the fourth inorganic layer, of the substrate base plate.
9. The display panel according to claim 8, wherein the fourth inorganic layer has a thickness greater than the first inorganic layer, and wherein the fourth inorganic layer has a thickness greater than the second inorganic layer.
10. The display panel according to claim 5, wherein the thin film transistor array layer further comprises a fifth inorganic layer on a side of the third inorganic layer away from the substrate base plate; the partition groove penetrates through the fifth inorganic layer, and the orthographic projection of the opening, located on the surface, far away from the substrate base plate, of the third inorganic layer in the partition groove on the substrate base plate is superposed with the orthographic projection of the opening, located on the surface, close to the substrate base plate, of the fifth inorganic layer on the substrate base plate.
11. The display panel according to claim 10, wherein an orthographic projection of the opening of the partition groove on the surface of the fifth inorganic layer far from the substrate base plate on the substrate base plate is smaller than an orthographic projection of the opening of the fifth inorganic layer near the surface of the substrate base plate on the substrate base plate.
12. The display panel according to claim 10, wherein an orthographic projection of the opening of the partition groove on the surface of the fifth inorganic layer far from the substrate base plate on the substrate base plate is larger than and covers an orthographic projection of the opening of the fifth inorganic layer on the surface close to the substrate base plate on the substrate base plate.
13. The display panel according to claim 10 or 11, wherein an included angle between the sidewall of the partition groove and the bottom of the partition groove is gradually reduced in a direction from the substrate to the light emitting surface of the display panel.
14. The display panel according to claim 13, wherein the sidewall of the partition groove is hyperbolic in a plane parallel to a direction in which the opening area points to the display area and perpendicular to the substrate base plate.
15. The display panel of claim 1, further comprising a thin film encapsulation layer on a side of the light-emitting functional film layer away from the thin film transistor array layer, wherein the thin film encapsulation layer at least comprises an inorganic encapsulation layer, and the inorganic encapsulation layer covers the sidewalls and the bottom wall of the isolation trench.
16. The display panel according to claim 1, wherein the barrier groove is two or more.
17. The display panel according to claim 16, wherein the blocking groove comprises a first blocking groove and a second blocking groove, the first blocking groove is located between the second blocking groove and the display region, and the height of the first blocking groove in the first direction is greater than the height of the second blocking groove in the first direction; the first direction is a direction perpendicular to the plane of the display panel.
18. A display device comprising the display panel according to any one of claims 1 to 17.
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