KR20190027149A - Automatic inspection system of soldering state of Voice Coil Motor type lens actuator and High Temperature Co-fired Ceramic board - Google Patents

Abstract

The present invention relates to a soldering condition automatic inspection system, which comprises: a tray conveying unit conveying a conveyance tray having a plurality of camera modules in which a VCM type lens actuator and an HTCC substrate are soldered; a camera module pickup unit sequentially picking up the camera modules mounted on the conveyance tray and moving the camera modules to an inspection area; a soldering condition inspecting unit inspecting the soldering condition of the camera modules located in the inspection area by simultaneously using a vision inspection camera and a laser displacement sensor; and a carrier conveying unit conveying a carrier loaded with the camera modules which have been inspected by the soldering condition inspecting unit.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an automatic inspection system for a solder joint of a VCM type lens actuator and an HTCC substrate,

The present invention relates to a camera module inspecting system, and more particularly, to a VCM type lens actuator and an automatic soldering state inspection system of an HTCC substrate.

1 is a view showing a structure of a camera module mounted on a portable device.

Referring to FIG. 1, the camera module is composed of various components such as a lens module and an auto focus (AF) actuator. As the performance and size of the camera module become smaller and smaller, the camera module manufacturing process is becoming more highly integrated and highly precise.

Particularly, the AF actuator is a drive unit which moves the lens mounted on the inside up and down to precisely align the focusing of the subject. In the past, an encoder (Encoder) method and a piezo (piezo) The VCM (Voice Coil Motor) method is applied in most camera module markets based on low cost through configuration.

FIG. 2 is a block diagram of a camera module equipped with an auto focus (AF) actuator of VCM (Voice Coil Motor) type.

Referring to FIG. 2, the camera module includes a VCM type lens driving unit (AF actuator) for moving the lens up and down, an image sensor disposed under the lens driving unit, and a HTCC (High Temperature Co-fired Ceramic) .

The lens actuator, that is, the VCM (Voice Coil Motor) type auto focus actuator, is composed of a leaf spring, a lens barrel, a coil, a magnet and a bobbin. fired Ceramic substrate and soldering process.

The VCM (Voice Coil Motor) type lens driving unit is a type of small electric actuator and can be driven with low responsiveness, linearity, small size, and is used for small electronic apparatuses and precision control applications.

A common voice coil motor (VCM) is a structure in which a magnetic circuit is formed of a soft magnetic steel and a permanent magnet, and a coil is placed in an airgap in a magnetic circuit. The operation of the voice coil motor (VCM) is operated by a Lorentz force generated when a current flows through a coil in a magnetic field formed by a magnet.

3 is a view showing a structure of a camera module including a VCM (Voice Coil Motor) type lens driving unit and an HTCC (High Temperature Co-fired Ceramic) substrate, and a soldering state.

Referring to FIG. 3, in a process of manufacturing a camera module, a lens driving part of a VCM (Voice Coil Motor) method and a HTCC (High Temperature Co-fired Ceramic) substrate are subjected to laser soldering using a solder, The soldering operation is carried out by irradiating the laser beam with the correct soldering position.

In the soldering process, however, even if the lead is supplied to the correct position through the vision camera, solid solder is changed into fluid form during laser melting, and accurate soldering is not performed due to positional deviation, poor soldering area, It is true.

Due to the problem of this soldering process, most camera module makers are currently conducting 100% manual full inspection using a microscope after soldering process. Manual hand-over inspection leads to a drop in productivity, secondary pollution, and rising labor costs, which ultimately lead to higher camera module prices.

That is, the lens driving part of the VCM (Voice Coil Motor) method is soldered using HTCC (High Temperature Co-fired Ceramic) substrate and precision laser soldering. However, when lead is melted by laser, The position is changed and various soldering defects such as shifting to one side or flowing down are occurred, so that manual manual preliminary inspection is performed.

Thus, conventionally, the operator inspects the soldering area using a microscope, but since there is not enough data on the soldering area, the defect frequency varies depending on the skill of the operator.

Generally, a method for detecting soldering failure is a detection method through electric conduction, a method for detecting a soldering height, etc. However, since it is not suitable for application to a small-sized camera module,

There is a demand for development of a system that can reliably and automatically perform a soldering operation between a VCM (Voice Coil Motor) type lens driving unit and an HTCC (High Temperature Co-fired Ceramic) substrate.

SUMMARY OF THE INVENTION The present invention has been proposed in order to solve the above-

Provides a VCM type lens actuator and an automatic soldering condition inspection system of HTCC board that can automatically check the soldering condition of the camera module by using the vision inspection camera and the laser displacement sensor simultaneously.

According to an embodiment of the present invention, there is provided an image forming apparatus including: a tray transferring unit for transferring a transfer tray having a plurality of camera modules in which a VCM lens actuator and an HTCC substrate are soldered; A camera module pickup unit for sequentially picking up a camera module mounted on the transfer tray and moving the camera module to an inspection area; A soldering state inspecting unit for simultaneously using the vision inspection camera and the laser displacement sensor to inspect the soldering state of the camera module located in the inspection area; And a carrier transfer unit for transferring the carrier on which the camera module inspected by the soldering condition inspection unit is mounted.

The camera module pickup unit may be configured to move the camera module to the inspection area between the vision inspection camera and the laser displacement sensor arranged in the horizontal direction and then to move the camera module between the vision inspection camera and the laser displacement sensor during the first measurement period The camera module is held in such a manner that one side of the camera module is opposed to the vision inspection camera and the other side of the camera module is opposed to the laser displacement sensor, 180 degrees so that one side of the camera module faces the laser displacement sensor and the other side of the camera module faces the vision inspection camera.

The camera module pickup unit classifies and loads the camera module located in the inspection area on the carrier based on the inspection result of the soldering condition inspection unit after the first measurement period and the second measurement period are completed .

In addition, the soldering state inspection unit may be configured to determine the soldering state of the solder ball on the basis of information on the position and area of the soldering area measured by the vision inspection camera, information on the position and thickness of the soldering area measured by the laser displacement sensor, And the result of the determination is converted into a database.

The soldering condition inspection unit may compare the information about the position and the area of the soldering area measured by the vision inspection camera and the position and thickness of the soldering area measured by the laser displacement sensor with the inspection reference information, And the reflection ratio of the information measured by the vision inspection camera and the information measured by the laser displacement sensor is adjustable.

The carrier may include a plurality of loading grooves formed corresponding to the shape of the camera module when the camera modules inspected by the soldering condition checking unit are loaded. And a clamp which is formed adjacent to each of the loading grooves and presses and fixes the camera module inserted in the loading groove in the horizontal direction, wherein the two reference surfaces for pressing the camera module are formed in a structure corresponding to the shape of the camera module .

The automatic inspection of the soldering condition of the VCM lens actuator and the HTCC board according to the embodiment of the present invention automatically checks the soldering condition of the camera module by using the vision inspection camera and the laser displacement sensor simultaneously, Can be obtained.

1 is a view showing a structure of a camera module mounted on a portable device;
2 is a block diagram of a camera module equipped with an auto focus (AF) actuator of VCM (Voice Coil Motor)
FIG. 3 is a view showing a configuration of a camera module including a VCM (Voice Coil Motor) type lens driving unit and an HTCC (High Temperature Co-fired Ceramic)
4 is a perspective view of a soldering state automatic inspection system 1 according to an embodiment of the present invention.
5 is a top view of the soldering state automatic inspection system 1
6 is a diagram showing the configuration of the tray transferring unit 100 of the automatic soldering state inspection system 1. FIG.
7 is a diagram showing the configuration of the camera module pickup unit 200 of the automatic soldering condition inspection system 1. [
8 is a diagram showing the configuration of the soldering state inspection unit 300 of the automatic soldering state inspection system 1. [
9 and 9A show a configuration of the carrier conveyance unit 400 of the automatic soldering condition inspection system 1. FIG.
10 is a view showing the structure of the carrier 500 loaded with the camera modules inspected by the soldering condition inspection unit 300
11 is a view showing a process of determining a soldering state in the soldering state checking unit 300;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, in order to facilitate a person skilled in the art to easily carry out the technical idea of the present invention.

FIG. 4 is a perspective view of the soldering state automatic inspection system 1 according to the embodiment of the present invention, and FIG. 5 is a plan view of the soldering state automatic inspection system 1. FIG.

The automatic soldering state inspection system 1 according to the present embodiment includes only a simple structure for clearly explaining the technical ideas to be proposed.

4 and 5, the soldering state automatic inspection system 1 includes a tray transfer unit 100, a camera module pickup unit 200, a soldering state checking unit 300, and a carrier transfer unit 400.

The detailed configuration and main operation of the soldering state automatic inspection system 1 constructed as described above will be described below.

In the process of operating the soldering state automatic inspection system 1, the feed tray is basically fixed after the feed tray having a plurality of camera modules inserted therein, and the camera module pickup unit 200 sequentially picks up the camera module, And the inspection is performed using the vision inspection camera and the laser displacement sensor simultaneously in the inspection area. Then, the normal and the defect are judged and the work is classified into the carrier.

The tray transfer unit 100 transfers a transfer tray on which a plurality of camera modules having a VCM (Voice Coil Motor) lens actuator and an HTCC (High Temperature Co-fired Ceramic) substrate are soldered.

That is, a plurality of camera modules requiring soldering inspection are arranged in the transfer tray, and a plurality of transfer trays are accommodated in a magazine.

At this time, all the camera modules are all picked up by the camera module pick-up unit 200, and the empty transport tray is horizontally conveyed by the magazine elevator or the like to be accommodated in another magazine.

The camera module pick-up unit 200 sequentially picks up the camera module mounted on the transport tray and moves it to the inspection area.

The camera module pickup unit 200 includes an X-axis driving motor, a Y-axis driving motor, a Z-axis driving motor, and the like to sequentially pick up camera modules mounted on the transport tray, To the inspection area.

The soldering state checking unit 300 checks the soldering state of the camera module located in the inspection area by using the vision inspection camera and the laser displacement sensor at the same time.

The soldering condition inspector 300 analyzes the soldering position, size, and thickness by using the solder joints at both the vision inspection camera and the laser displacement sensor, and selects the good products and defects through the statistical analysis technique of the measurement information, can do.

The soldering portions are located on each side of the camera module. Therefore, the camera module is placed in the test area between the vision inspection camera and the laser displacement sensor arranged in the horizontal direction, and both sides are inspected at the same time.

Next, the camera module pick-up unit 200 rotates the camera module 180 degrees in the horizontal direction, and then the both sides are inspected again using the vision inspection camera and the laser displacement sensor. With this operation, each side of the camera module is measured by both the vision inspection camera and the laser displacement sensor.

The carrier transferring unit 400 transfers the carrier loaded with the camera modules inspected in the soldering condition checking unit 300.

That is, the carrier transfer unit 400 supplies the empty carriers to the soldering state inspecting unit 300, and the camera module pickup unit 200 applies the camera module located in the inspecting area to the carrier on the basis of the inspection result of the soldering state inspecting unit 300 So that they are sorted and loaded.

6 is a configuration diagram of the tray transfer unit 100 of the automatic soldering condition inspection system 1. In FIG.

6, the tray conveying unit 100 includes a conveying tray 110, a tray fixing unit 120, elevator driving motors 130A and 130B, a tray conveying unit 140, a magazine 150, do.

The tray transfer unit 100 transfers a transfer tray 110 having a plurality of camera modules in which a VCM (Voice Coil Motor) lens actuator and an HTCC (High Temperature Co-fired Ceramic) substrate are soldered.

That is, a plurality of camera modules requiring soldering inspection are arranged in the transport tray 110, and a plurality of transport trays 110 are accommodated in a magazine 150.

At this time, all the camera modules are picked up by the camera module pick-up unit 200, and the empty transfer tray is horizontally moved by the elevator driving motors 130A and 130B, the tray conveying means 140 including the ball screw and the LM guide, Direction and accommodated in another magazine (magazine).

That is, the tray transfer unit 100 may be defined as a magazine-elevator type tray transfer unit. In order to accurately pick up the camera module from the camera module pickup unit 200, a cylinder-type tray fixing unit 120, It can be fixed within 5 mu m.

7 is a configuration diagram of the camera module pickup unit 200 of the automatic soldering condition inspection system 1. In FIG.

7, the camera module pickup unit 200 includes an X-axis driving motor 210, a Y-axis driving motor 220, a Z-axis driving motor 230, a suction type pickup tool unit 240, (250).

The camera module pick-up unit 200 sequentially picks up the camera module mounted on the conveyance tray 110 and moves it to the inspection area.

The camera module pickup unit 200 is moved by driving of the X axis driving motor 210, the Y axis driving motor 220 and the Z axis driving motor 230 and the camera modules mounted on the feeding tray 110 are sequentially The soldering condition inspection unit 300 performs an operation of transferring the solder to the inspection zone (TEST AREA) waiting.

That is, the pick-up tool unit 240 descends at the upper portion of the TEST AREA, and enters the camera module into the TEST AREA.

The suction type pickup tool unit 240 is configured to suck and pick up the camera module in a vacuum system so that scratches and breakage do not occur on the surface of the camera module.

The rotation unit 250 is configured to horizontally rotate the camera module so that the side surface of the camera module can be measured by the vision inspection camera and the laser displacement sensor, respectively.

The rotation unit 250 may be constructed of a motor driving method with a rotation resolution of 0.1 degree or less so as to improve the measurement accuracy of the vision inspection camera and the laser displacement sensor.

When the camera module pick-up unit 200 transfers the camera module to the inspection area, if the repeat accuracy is lowered, the LM guide and the ball screw can be precisely manufactured so that the inspection error can be realized within the repeat accuracy of 5 μm desirable.

The camera module pickup unit 200 moves the camera module to the inspection area between the vision inspection camera and the laser displacement sensor arranged in the horizontal direction,

First, one side of the camera module is kept facing the vision inspection camera during the first measurement period of the vision inspection camera and the laser displacement sensor, and the other side of the camera module is kept facing the laser displacement sensor.

Next, during the second measurement period after the first measurement period, the camera module is rotated 180 degrees in the horizontal direction so that one side of the camera module faces the laser displacement sensor, and the other side of the camera module faces the vision inspection camera .

In addition, the camera module pickup unit 200, after the first measurement period and the second measurement period are completed,

Based on the inspection result of the soldering state inspection unit 300, the camera module located in the inspection area is classified and loaded on the carrier.

8 is a configuration diagram of the soldering condition checking unit 300 of the automatic soldering condition checking system 1. In FIG.

8, the soldering state inspection unit 300 includes a vision inspection camera 310, a laser displacement sensor 320, an illumination 330, a feed motor 340, a forward ball screw 350A, and a reverse ball screw 350B ).

The vision inspection camera 310 is defined as a camera used in a VIS (Vision Inspection System) and is an automated machine vision device using a camera.

In other words, it is a device that can improve the efficiency and objectively and precisely control the quality by automating the part that was previously inspected by the operator with the computer-based camera image processing technology. The vision inspection camera 310 can be applied to various fields such as color inspection, product classification, foreign object inspection, missing inspection, and packaging defect inspection.

Since the vision inspection camera 310 is configured to recognize the shape of the target object based on the two-dimensional image, when inspecting the soldering region of the camera module, the position and area of the soldering region can be identified through the two-dimensional image.

The laser displacement sensor 320 is defined as a device capable of checking the state of a measurement object through a basic operation of determining a distance to a measurement object through a process of transmitting and receiving a signal having a predetermined wavelength. Accordingly, when the soldering region of the camera module is inspected using the laser displacement sensor 320, the position, area, and thickness of the soldering region can be all identified. For reference, the laser displacement sensor 320 may be configured to identify the measurement object in a two-dimensional form or in a three-dimensional form.

The illumination unit 330 may include a plurality of light guide plates so that the light source can uniformly emit light to the camera module and uniformly output light.

The feed motor 340 horizontally feeds the vision inspection camera 310 and the laser displacement sensor 320 by using the forward direction ball screw 350A and the reverse direction ball screw 350B, As shown in FIG. That is, the space of the TEST AREA may be automatically adjusted in consideration of the size of the camera module. The forward ball screw 350A and the reverse ball screw 350B can move the vision inspection camera 310 and the laser displacement sensor 320 independently of each other.

For example, when the TEST AREA test mode is executed and the reference camera module enters the TEST AREA, the size of the reference camera module is automatically measured and then the width of the TEST AREA It is adjusted automatically.

When the TEST AREA test mode is executed, the vision inspection camera 310 and the laser displacement sensor 320 measure the soldering state of the reference camera module a predetermined number of times

When the area measurement information deviates from the pre-stored reference value range, the width of the test area is automatically adjusted until it is included in the reference value range. Here, enlarging the width of the TEST AREA means that the space of the TEST AREA is widened, and the gap between the vision inspection camera 310 and the laser displacement sensor 320 is also proportionally spaced .

For reference, the size of the reference camera module may be measured by a size sensor for transmitting and receiving infrared rays,

In the test mode, after the vision inspection camera 310 or the laser displacement sensor 320 measures the size of the module of the reference camera, the width of the TEST AREA may be automatically adjusted in consideration of the measured size information There will be.

The soldering condition checking unit 300 checks the soldering condition of the camera module located in the test area by using the vision inspection camera 310 and the laser displacement sensor 320 at the same time.

The soldering condition inspection unit 300 analyzes the soldering position, size, and thickness by using the solder joints of the vision inspection camera 310 and the laser displacement sensor 320 at the same time. The reliability of the inspection can be ensured.

The soldering portions are located on each side of the camera module. Accordingly, the camera module is positioned in the test zone between the vision inspection camera 310 and the laser displacement sensor 320 arranged in the horizontal direction, and both sides are inspected at the same time.

Next, after the camera module pickup unit 200 rotates the camera module 180 degrees in the horizontal direction, the operation of inspecting both side surfaces again using the vision inspection camera 310 and the laser displacement sensor 320 is performed.

That is, the camera module pickup unit 200 moves the camera module to an inspection zone (TEST AREA) between the vision inspection camera 310 and the laser displacement sensor 320 arranged in the horizontal direction,

During the first measurement period of the vision inspection camera 310 and the laser displacement sensor 320, one side of the camera module is held to face the vision inspection camera 310, and the other side of the camera module is connected to the laser displacement sensor 320 .

Next, the camera module is rotated 180 degrees in the horizontal direction during the second measurement period after the first measurement period to keep one side of the camera module facing the laser displacement sensor 320, and the other side of the camera module is visually inspected To be opposed to the camera < RTI ID = 0.0 > 310 < / RTI >

In addition, the camera module pickup unit 200, after the first measurement period and the second measurement period are completed,

And performs an operation of classifying and loading the camera module located in the inspection area (TEST AREA) on the carrier (500) based on the inspection result of the soldering condition inspection part (300).

The soldering state inspection unit 300 considers both the position and area information of the soldering area measured by the vision inspection camera 310 and the information about the position and thickness of the soldering area measured by the laser displacement sensor 320 Determines whether or not the soldering state is defective, and stores the result of the determination in a database.

Further, the soldering condition checking unit 300 may be configured to determine,

Information on the position and area of the soldering area measured by the vision inspection camera 310 and information on the position and thickness of the soldering area measured by the laser displacement sensor 320 are compared with the inspection reference information to determine whether the soldering state is poor or not Lt; / RTI >

The reflection ratio of the information measured by the vision inspection camera 310 and the information measured by the laser displacement sensor 320 can be adjusted. That is, when determining whether the soldering state is normal or defective, information measured by the vision inspection camera 310 and information measured by the laser displacement sensor 320 may be given different weights.

9 and 9A are structural diagrams of the carrier conveyance unit 400 of the automatic soldering state inspection system 1. FIG.

9 and 9A, the carrier transfer unit 400 includes an X axis transfer unit 410, an X axis drive motor 420, a step transfer clamp 430, and a step transfer linear motion guide 440, do.

The carrier transfer unit 400 transfers the carrier 500 loaded with the inspected camera module in the soldering condition inspection unit 300.

That is, the carrier transfer unit 400 transfers the empty carrier to the soldering state inspecting unit 300 (see FIG. 3) using the X-axis transferring unit 410, the X-axis driving motor 420, the step transferring clamp 430, and the step transfer linear motion guide 440 And the camera module pickup unit 200 categorizes and loads the camera module located in the inspection area on the carrier 500 based on the inspection result of the soldering condition inspection unit 300.

10 is a view showing the structure of the carrier 500 loaded with the camera modules inspected by the soldering condition inspector 300. As shown in FIG.

The camera module mounted on the carrier 500 determined to be good is subjected to a process of being bonded to the flexible circuit board (FPCB) in the next step.

Referring to FIG. 10, in the conventional carrier, a loading groove having a camera module shape for loading a camera module is formed constantly. Since the conventional carrier has a structure in which the camera module is simply inserted into the loading groove, a floating phenomenon occurs after insertion, and many errors are generated in the process of picking up for processing in the next process.

Therefore, in the embodiment of the present invention, the carrier 500 has a structure in which the movable clamp 510 is disposed in a region adjacent to the loading groove to prevent lifting of the camera module.

That is, in the carrier 500, when the camera module inspected in the soldering condition inspector 300 is loaded,

A plurality of loading grooves formed corresponding to the shape of the camera module,

A camera module inserted in the loading groove is formed in the loading groove, and the two reference surfaces 511 for pressing the camera module are formed in a shape corresponding to the shape of the camera module, 510).

That is, the two reference surfaces 511 of the clamp 510 provide a force to the camera module in the horizontal direction by an elastic member or the like, so that lifting of the camera module can be prevented. The clamp 510 is preferably configured to move a predetermined distance in the horizontal direction so that the camera module can be easily inserted into the loading groove.

11 is a view illustrating a process of determining a soldering state in the soldering condition inspector 300. FIG.

Referring to FIG. 11, reference numeral 11 denotes a reference area for a reference area (AREA_REF) of a soldering area detected by the vision inspection camera 310 when the reference camera module is located in an inspection area TEST AREA. Information,

And information on the reference height h_REF of the soldering region detected by the laser displacement sensor 320. Such information can be stored in a database and displayed as a two-dimensional or three-dimensional graphic on the screen. That is, the soldering state inspection unit 300 is equipped with inspection software, and the data obtained by the database can be statistically displayed on the screen.

Herein, the reference camera module refers to a module that is ideally soldered to be a reference for testing. When the reference camera module is not provided, numerical reference information is input to the soldering condition inspector 300, And the information of the reference camera module can be received and the test can proceed.

The second figure 12 shows the soldering state of the camera module determined to be defective. The information about the two-dimensional area AREA1 of the soldering area detected by the vision inspection camera 310 is shown in FIG. Since it is within the error range, it is judged that the test for the area has passed. However, when the height h1 of the soldering region detected by the laser displacement sensor 320 is considered, it is determined that the portion is defective due to the portion where the deflection occurs to one side. Basically, it is determined that the soldering state is normal when both the measured area and height are within the error range of the reference information.

The third figure 13 shows the soldering state of the camera module determined to be defective. When the information about the two-dimensional area AREA2 of the soldering area detected by the vision inspection camera 310 is the reference area AREA_REF ), The test for the area is judged to be defective. Further, even when the height h2 of the soldering region detected by the laser displacement sensor 320 is taken into account, it is determined to be defective due to the portion where the deflection occurs to one side.

In FIG. 11, the reference height of the soldering region detected by the laser displacement sensor 320 is displayed in a two-dimensional form, but the soldering region can be displayed in a 3D form by being displayed in a three-dimensional form. Also, the soldering state inspection unit 300 may calculate the volume of the soldering region and may further utilize the volume information to determine the failure.

For example, the camera module having the soldering region corresponding to the error range of the reference volume of the soldering region of the reference camera module can be determined to be normal.

In addition, the soldering condition checking unit 300 continuously calculates the amount of change in the volume while calculating the volume of the soldering area of all the camera modules to be tested, and recording the volume in the database. In other words, if the change in the amount of change in volume is severe, there is a problem in the soldering process itself, so the monitoring situation may be automatically notified to the previous soldering process system.

For example, when the amount of change in the volume of the soldering region is uniformly maintained, for example, when the deviation is maintained at 3% to 5% or less, the soldering state checking unit 300 checks the inspection reference information Can be automatically expanded. That is, since the amount of change in volume is uniform, it means that the soldering operation is performed uniformly, so that even if the error range of the inspection reference information is extended, the defect rate can be kept constant. At this time, if the deviation of the volume exceeds 5% for a predetermined time, the error range of the inspection reference information of the camera module to be inspected is automatically returned to the initial setting.

Further, in order to improve the test speed of the soldering area, a sampling test mode may be executed.

In the sampling test mode, the vision inspection camera 310 measures the position and area of the soldering area, and the laser displacement sensor 320 receives the position and area of the soldering area measured by the vision inspection camera 310.

At this time, the laser displacement sensor 320 can measure the height of the soldering area at every predetermined interval without measuring the height of the soldering area, and determine whether the solder is good or defective by using only the information.

In addition, the laser displacement sensor 320 may measure the height of only the area of the outer rim area among the area of the soldering area, and then determine whether the product is good or defective based on only information of the area.

In addition, the laser displacement sensor 320 may measure the height of the outer rim portion and a portion of the height of the most central region among the areas of the soldering region, and then determine whether the product is good or defective based on only information of the region.

The pickup tool unit 240 of the camera module pickup unit 200 may be provided with a vibration sensor which detects the vibration amplitude while the pickup tool unit 240 positions the camera module in the test zone To the soldering state checking unit 300. [ At this time, the soldering state checking unit 300 can automatically adjust the error range of the inspection reference information in consideration of the magnitude of vibration. For example, when the magnitude of the vibration exceeds a predetermined range, the test reliability may be deteriorated, so that the error range of the inspection reference information may be further narrowed to improve the test reliability.

The automatic inspection of the soldering condition of the VCM lens actuator and the HTCC board according to the embodiment of the present invention automatically checks the soldering condition of the camera module by using the vision inspection camera and the laser displacement sensor simultaneously, Can be obtained.

Thus, those skilled in the art will appreciate that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

100:
110: Feed tray
120: tray fixing unit
130A, 130B: elevator drive motor
140: tray transport means
150: Magazine
200: Camera module pickup part
210: X-axis drive motor
220: Y-axis drive motor
230: Z-axis driving motor
240: Suction type pickup tool unit
250: rotation unit
300: soldering state inspection section
310: vision inspection camera
320: Laser displacement sensor
330: Lighting
340: Feed motor
350A: Forward Ball Screw
350B: reverse ball screw
400: carrier carrier
410: X-axis conveying means
420: X-axis drive motor
430: Step feed clamp
440: Step-transfer linear motion guide

Claims (6)

A tray conveying unit for conveying a conveyance tray having a plurality of camera modules in which a VCM type lens actuator and an HTCC substrate are soldered;
A camera module pickup unit for sequentially picking up a camera module mounted on the transfer tray and moving the camera module to an inspection area;
A soldering state inspecting unit for simultaneously using the vision inspection camera and the laser displacement sensor to inspect the soldering state of the camera module located in the inspection area; And
A carrier transferring unit for transferring the carrier loaded with the camera modules inspected by the soldering state checking unit;
The soldering state automatic inspection system comprising:
The method according to claim 1,
The camera module pick-
Wherein the camera module is moved to the inspection area between the vision inspection camera and the laser displacement sensor arranged in the horizontal direction, The other side of the camera module is held to face the laser displacement sensor,
The camera module is rotated 180 degrees in the horizontal direction during the second measurement period after the first measurement period to keep one side of the camera module facing the laser displacement sensor, and the other side of the camera module faces the vision inspection camera So as to maintain the soldering state automatically.
3. The method of claim 2,
The camera module pick-
After the primary measurement interval and the secondary measurement interval are completed,
And the camera module located in the inspection area is classified and loaded on the carrier based on the inspection result of the soldering condition inspection unit.
The method according to claim 1,
The soldering condition checking unit may include:
Determining whether or not the soldering state is defective based on information on the position and area of the soldering area measured by the vision inspection camera and information on the position and thickness of the soldering area measured by the laser displacement sensor, Wherein the system is made into a database.
The method according to claim 1,
The soldering condition checking unit may include:
The information on the position and area of the soldering area measured by the vision inspection camera and information on the position and thickness of the soldering area measured by the laser displacement sensor are compared with the inspection reference information to determine whether the soldering condition is defective or not,
Wherein a reflection ratio of the information measured by the vision inspection camera and the information measured by the laser displacement sensor is adjustable.
The method according to claim 1,
The carrier
When the camera module that has been inspected in the soldering condition inspection unit is loaded,
A plurality of loading grooves formed corresponding to the shape of the camera module; And
And a clamp which is formed adjacent to each of the loading grooves and presses and fixes the camera module inserted in the loading groove in the horizontal direction, wherein the two reference surfaces for pressing the camera module are formed in a structure corresponding to the shape of the camera module The soldering state automatic inspection system.

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