KR20190027007A - Apparatus and method for laminating a film to a substrate - Google Patents

Apparatus and method for laminating a film to a substrate Download PDF

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Publication number
KR20190027007A
KR20190027007A KR1020170112753A KR20170112753A KR20190027007A KR 20190027007 A KR20190027007 A KR 20190027007A KR 1020170112753 A KR1020170112753 A KR 1020170112753A KR 20170112753 A KR20170112753 A KR 20170112753A KR 20190027007 A KR20190027007 A KR 20190027007A
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KR
South Korea
Prior art keywords
substrate
film
plate
lower
lower plate
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KR1020170112753A
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Korean (ko)
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KR101986619B1 (en
Inventor
김두철
Original Assignee
에이엠티 주식회사
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Priority to KR1020170112753A priority Critical patent/KR101986619B1/en
Publication of KR20190027007A publication Critical patent/KR20190027007A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus

Abstract

The present invention relates to a device for laminating a film on a substrate in order to reinforce strength in one side of the flexible substrate in a process of producing a semiconductor device; and a method thereof. The device loads a thin film and the substrate in a chamber while maintaining a predetermined interval between the thin film and the substrate, attaches the central part of the substrate to the film first by a pressure member whose central part is convex and then, gradually adheres the edge side of the substrate to the film. For the above, the present invention comprises: a chamber (10) consisting of a main body (11) and an openable cover (12); a lower plate (30) installed in the chamber (10) and having a thin film (20) loaded thereon; an eject plate (50) elastically installed on the bottom surface of the lower plate (30) to be ascended and descended by an elastic member (60), and having a plurality of lower guide shafts (40), on which a substrate (21) is loaded, installed to be exposed to the upper part of the lower plate (30); an upper plate (70) installed in the upper part of the lower plate (30) to be ascended and descended by a driving means (80); and a pressure member (90) fixated and installed on the bottom surface of the upper plate (70), having a convex part (91) which is formed in the lower center and a slope surface (92) which gradually rises towards the edge of both sides, and having elastic force.

Description

[0001] Apparatus and method for laminating a film to a substrate [0002]

The present invention relates to an apparatus and a method for laminating a film to a substrate for the purpose of reinforcing strength on one surface of a flexible substrate in a process of producing a semiconductor device, and more particularly, A film is laminated on the substrate so that the central portion of the substrate is first adhered to the film by the pressing member having the central portion convexly formed and then gradually adhered to the edge side by loading the film of the thin plate and the substrate while keeping the predetermined distance therebetween. And a method thereof.

Recently, along with the development of the electronic parts industry, miniaturization and high integration of PCB products are progressing, and flexible substrates having high durability (FPCB, strip, substrate, etc.) are increasingly used for repeated bending.

However, if the thickness of the flexible substrate is too thin, it is difficult to keep the substrate in a flat state between the processes, and it is difficult to form a pattern on the substrate or to mount the semiconductor device. There is a limit in reducing the production cost of the product.

In addition, when a flexible substrate is transported between the processes or transported, the backside of the substrate is contaminated, which causes a defect. Therefore, it is possible to prevent contamination of the substrate between the processes by laminating a thin film on the backside of the substrate The strength of the flexible substrate is reinforced.

However, up to now, in the state that the substrate is loaded on a flat plate, a film of a thin plate having a thickness of 0.05 mm on which an adhesive is applied on one side is placed, and then the film is adhered using a pressure roller.

(Prior art document)

(Patent Document 0001) Korean Patent Laid-Open No. 10-2011-0013103 (Published on Mar. 2, 2011)

However, in the conventional film laminating method, a flexible substrate is loaded on a plate, and a thin film coated with an adhesive is placed on the upper surface of the flexible substrate, and the film is laminated on the substrate using a pressure roller. Voids were formed on the adhesive surface of the thin plate, and there was a limit to maintaining the flatness of the film of the thin plate precisely.

Accordingly, a device for automatically laminating a thin film to a flexible substrate has not been developed.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a vacuum chamber in which a pressing member having a convex central portion can be raised and lowered, The central portion of the substrate is first laminated to the film by the pressing member as the pressing member is lowered while the predetermined distance is maintained to be lowered and then the film is gradually laminated to the edge side so that voids are not generated or wrinkles are generated in the film It has its purpose.

According to an aspect of the present invention for achieving the above object, there is provided a plasma display apparatus comprising: a chamber including a main body and a cover that can be opened and closed; a lower plate installed inside the chamber and loaded with a thin film; An eject plate provided on the upper plate so that a plurality of lower guide shafts on which the substrate is loaded are exposed to the upper portion of the lower plate, And a pressing member which is fixed to the bottom surface of the upper plate and has a convex portion formed at the center of the lower portion and has an inclined surface upwardly directed toward both side edges and has an elastic force.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: loading a thin film on an upper surface of a lower plate in a state in which a lid is opened from a body of the chamber; A step of sealing the inside of the chamber with a lid to cover the main body and then maintaining the inside of the chamber in a vacuum state, and a step of forming a convex portion in the lower center and a slope upward A step of lowering a pressing member having an elastic force and releasing air from the center of the substrate to both sides of the substrate, laminating the film on the substrate, releasing the vacuum pressure inside the chamber, opening the lid from the main body of the chamber, The step of unloading the film-laminated substrate is performed sequentially A method of laminating a film to a substrate according to claim is provided for.

In the present invention, the center of the substrate is first laminated to the film by the convex portion of the pressing member fixed on the upper plate in a vacuum state in which the thin film is loaded on the upper surface of the lower plate and the flexible substrate is loaded on the upper side of the lower guide shaft As the upper plate is gradually lowered, the substrate is sequentially pressurized to laminate the film on the substrate, so that bubbles are generated or wrinkles are generated on the film of the thin plate.

In addition, by automating the equipment, it is possible not only to remarkably reduce the production cost due to the process of bonding the film to the substrate, but also to reduce the defect rate.

1 is a perspective view showing a configuration of the present invention;
Fig. 2 is a plan view showing a state in which the lid is separated in the present invention
FIGS. 3A to 3C are longitudinal sectional views for explaining the operating state of the present invention,
3A shows an initial state diagram
3B shows a state in which the upper guide shaft is aligned with the lower guide shaft
FIG. 3C shows a state in which the film is laminated on the substrate by the pressing member
4 is a flow chart for explaining the laminating method of the present invention

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. The drawings are schematic and illustrate that they are not drawn to scale. The relative dimensions and ratios of the parts in the figures are shown exaggerated or reduced in size for clarity and convenience in the figures, and any dimensions are merely illustrative and not restrictive. And to the same structure, element or component appearing in more than one drawing, the same reference numerals are used to denote similar features.

FIG. 1 is a perspective view showing the construction of the present invention. FIG. 2 is a plan view of a state in which a lid is separated in the present invention, and FIGS. 3a to 3c are longitudinal sectional views for explaining an operating state of the present invention. A lower plate 30 on which the thin film 20 is loaded, a plurality of lower guide shafts 40 on which the substrate 21 is loaded so as to be spaced apart from the film 20, An elastic member 60 for restoring the ejection plate; an upper plate 70 installed to be able to move up and down in the chamber 10; driving means 80 for moving up and down the upper plate; A pressing member 90 having an elastic force fixed to the bottom surface of the upper plate 70, and the like.

1 and 3, the chamber 10 includes a main body 11 and a lid 12 which can be opened and closed. When the main body 11 is closed with the lid 12, a vacuum generator (not shown) So that a vacuum is applied to the interior of the chamber 10.

The lower plate 30 is fixedly installed inside the main body 11 by a plurality of support rods 31 and a thin film 20 is loaded on the upper surface.

The ejection plate 50 is resiliently mounted on the bottom surface of the lower plate 30 by an elastic member 60 such as a plurality of coil springs so that the ejection plate 50 can be raised and lowered. The guide shaft 40 is fixed and the lower guide shaft 40 is exposed to the upper portion of the lower plate 30 through each through hole 32 formed in the lower plate 30, The substrate 21 is loaded on the upper surface so as to be spaced apart from the film 20 by a predetermined distance.

An urging member 90 having an elastic force is mounted and fixed to the bottom surface of the upper plate 70 which is installed inside the lid 12 by the driving means 80 and which is lowered by the driving means 80, The pressing member 90 has a convex portion 91 formed at the center of the lower portion and the inclined surface 92 is formed symmetrically on both sides of the convex portion 91 so as to be gradually increased toward the edge side.

This is because the convex portion 91 of the pressing member 90 first comes into contact with the substrate 21 and then the pressing member 90 is continuously lowered and pressed on the upper surface of the lower plate 50, It is understood that the pressing member 90 can be made of silicone or rubber material.

The present invention is provided with an aligning means for always contacting a predetermined point when the upper plate 70 is lifted or lowered.

A protrusion 41 is formed on the upper surface of the lower guide shaft 40 exposed to the upper portion of the lower plate 30 by the aligning means and a protrusion 41 is formed on the lower surface of the lower guide shaft 40 The upper guide shaft 45 having the insertion hole 46 in which the projection 41 formed on the upper surface is inserted is provided so as to correspond to the insertion hole 46 of the upper guide shaft 45 as the upper plate 70 is lowered And the projections 41 are fitted so as to be aligned.

On the other hand, guiders 15 each having an inclined surface 15a are fixed to both the left and right sides of the main body 11 so as to guide the position of the lid 12 when the lid 12 is closed.

The driving means 80 includes an actuator 81 fixed to the upper surface of the lid 12, a connecting rod 82 fixed to the actuator rod 85, And a ball bush 84 fixed to the lid 12 and guiding the lifting and lowering of the guide shaft 83. The guide shaft 83 is fixed to the upper plate 70 at one end thereof, .

In the present invention, a method of laminating the substrate 21 on the film 20 will be described as follows.

4 is a flow chart for explaining a laminating method of the present invention in which the laminating face is directed upward from the main body 11 of the chamber 10 to the upper face of the lower plate 30 in a state in which the lid 12 is opened The ejection plate 50 is brought into close contact with the bottom surface of the lower plate 30 by the restoring force of the elastic member 60 at this time (S100), so that the thin film 20 is loaded in a straight- And the lower guide shaft 40 provided on the eject plate 50 is exposed to the upper portion of the lower plate 30 as much as possible.

The loading operation of the film 20 can be carried out manually by an operator, automatically by a picker, or by spreading a film wound on a bobbin in a roll form and then cutting the film with a cutter The details of this need not be limited.

After the thin film 20 is loaded on the upper surface of the lower plate 30 as described above, the substrate 21 is loaded on the upper surface of the plurality of lower guide shafts 40 exposed at the upper portion of the lower plate 30 (S200) The lower guide shaft 40 is exposed upward by a predetermined distance from the lower plate 30 so that the substrate 21 is spaced apart from the film 20 by a predetermined distance.

At this time, the lower guide shaft 40 is provided with the protrusion 41, which is a means for aligning the central portion of the lower guide shaft 40, so that the substrate 21 is supported on one side space of the protrusion 41, The area of the substrate 21 to be contacted can be minimized, and thus the phenomenon of contamination of the lining surface of the substrate 21 can be minimized.

The substrate 21 is loaded on the lower plate 30 so as to keep a predetermined distance from the film 20 on the lower guide shaft 40 and the main body 11 The lower portions of both sides of the lid 12 are guided by the inclined surfaces 15a of the guider 15 and are brought into close contact with the main body 11 so that the inside of the chamber 10 is sealed as shown in Fig.

After the inside of the chamber 10 is sealed by the above-described operation, a vacuum generator (not shown) is operated to maintain the inside of the chamber 10 in a vacuum state (S300).

3B, when the actuator 81 of the driving means 80 is operated and the lower plate 70 is lowered as shown in FIG. 3B, the convex portion 91 of the pressing member 90 fixed to the bottom surface of the lower plate 70, The rest of the substrate 21 is not touched because the inclined surface 92 gradually increases toward both sides of the convex portion 91 of the pressing member 90 when the substrate 21 touches the center portion of the substrate 21.

The lower plate 30 is further lowered so that the convex portion 91 of the pressing member 90 contacts the substrate 21. When the lower guide shaft 40 is moved by the insertion hole 46 of the upper guide shaft 45, The upper guide shaft 45 fixed to the bottom surface of the upper plate 70 pushes the lower guide shaft 40 by an amount that the upper plate 70 is lowered in a state where the projection 41 of the upper plate 70 is inserted and aligned The eject plate 50 to which the lower guide shaft 40 is fixed is lowered while compressing the elastic member 60.

As the upper guide shaft 45 pushes down the lower guide shaft 40 by lowering the upper plate 70 as described above, the ejection plate 50 is lowered so that the convexities of the pressing member 90 provided on the upper plate 70 The substrate 91 is first laminated to the film 20 at the center portion of the substrate 21 and then the pressing member 90 is pressed and deformed gradually to the upper surface of the lower plate 30, The air existing between the substrate 21 and the film 20 is completely discharged to the edge side of the film 20 so that voids are generated due to laminating of the film 20 As well as the occurrence of wrinkles in the film 20 (S400).

3C, the lower plate 30 is lowered to the bottom dead center so that the film 20 is completely laminated to the substrate 21, that is, the lower plate 30 is fixed to the ejection plate 50, The ejection plate 50 is also lowered to the bottom dead center by compressively deforming the elastic member 60 when the upper guide shaft 40 is pushed by the upper guide shaft 45 and received in the through hole 32 formed in the lower plate 30.

After the film 20 is laminated on the substrate 21 in the above-described operation, the vacuum pressure applied to the chamber 10 is released, and the actuator 81 is driven again to raise the top plate 70 to the top dead center When the force applied to the lower guide shaft 40 is removed by the upward movement of the upper plate 70, the eject plate 50, which has lowered to the bottom dead center while compressing the elastic member 60, .

3A, when the lower guide shaft 40 is removed from the through hole 32 of the lower plate 30 due to the upward movement of the eject plate 50, the substrate 21 placed on the lower plate 30 is lifted The unloading operation of the substrate 21 on which the film 20 is laminated is facilitated.

 When the upper plate 70 is returned to the initial state, the lid 12 is opened from the main body 11 and then the film 20 is unloaded from the lower guide shaft 40 by the laminated substrate 21, The film and the substrate can be loaded (S500).

The substrate 20 is loaded on the lower guide shaft 40 so as to be spaced apart from the film 20 and then the chamber 10 is vacuum- The film 20 is first brought into contact with the central portion of the substrate 21 by the pressing member 90 and then gradually laminated while gradually applying force to the edge side to release the internal vacuum of the chamber 10, A cycle of unloading the completed substrate 21 has been described so that the thin film 20 is loaded on the lower plate 30 and the substrate 21 is placed on the lower guide shaft 40 It is understandable that the same operation is performed continuously.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention may be embodied with various changes and modifications without departing from the scope of the invention. will be.

It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive, the scope of the invention being described in the foregoing specification is defined by the appended claims, Ranges and equivalents thereof are to be construed as being included within the scope of the present invention.

10: chamber 11:
12: cover 15: guider
15a: slope surface 20: film
21: substrate 30: lower plate
40: lower guide shaft 41: projection
45: upper guide shaft 46: insertion hole
50: eject plate 60: elastic member
70: upper plate 80: driving means
90: pressing member 91:
92: slope

Claims (6)

  1. A lower plate 30 which is installed inside the chamber 10 and on which a thin film 20 is loaded and a lower plate 30 which is installed in the lower plate 30 And a plurality of lower guide shafts 40 to which the substrate 21 is loaded are installed to be exposed to the upper portion of the lower plate 30, An upper plate 70 mounted on the lower plate 30 and raised and lowered by a driving means 80 and a lower plate 70 fixed to the lower surface of the upper plate 70, And a pressing member (90) having an inclined surface (92) formed upwardly toward both side edges thereof and having an elastic force.
  2. The method according to claim 1,
    Protrusions 41 are formed on the upper surface of the lower guide shaft 40 exposed above the lower plate 30 and projections 41 formed on the upper surface of the lower guide shaft 40 are formed on the lower surface of the upper plate 70, Is provided with an upper guide shaft (45) having an insertion hole (46) in which the upper guide shaft (45) is inserted.
  3. The method according to claim 1,
    The driving means (80)
    An actuator 81 fixed to the upper surface of the lid 12,
    A connecting rod 82 fixed to the actuator rod 85,
    A guide shaft 83 having one end fixed to both ends of the connecting rod 82 and the other end fixed to the upper plate 70,
    And a ball bush (84) fixed to the lid (12) and guiding the lifting and lowering of the guide shaft (83).
  4. A step S100 of loading the thin film 20 onto the upper surface of the lower plate 30 with the lid 12 opened from the main body 11 of the chamber 10, (S200) of loading the substrate (21) so as to maintain a predetermined spacing on the film (20) of the thin film laminated on the substrate (20) A step S300 of keeping the inside of the chamber 10 in a vacuum state after the chamber 10 is closed and a slope 92 which is formed at the lower center with the convex portion 91 and upward to both side edges, (S400) of laminating the film (20) on the substrate (21) while discharging air from both sides of the center of the substrate (21) by lowering the member (90) The lid 12 is opened from the main body 11 of the chamber 10 and the film is laminated on the lower plate 30, Step (S500) for unloading the substrate 21 is laminated to the film which comprises in sequence a substrate.
  5. The method of claim 4,
    The substrate 21 is loaded on the upper surfaces of a plurality of lower guide shafts 40 protruding and retracted through the through holes 32 formed in the lower plate 30 so that the pressing member 90 presses the central portion of the substrate 21 The film 20 is adhered to the substrate 21 as the lower guide shaft 40 is lowered while compressing the elastic member 60 when the substrate 21 is continuously pressed while the bottom surface of the pressing member 90 is deformed, Wherein the laminate is laminated to the substrate.
  6. The method of claim 5,
    The plurality of lower guide shafts 40 are fixed to the ejection plate 50 and an elastic member 60 is provided on the bottom surface of the ejection plate 50 so that the ejection plate 50 is elastically Characterized in that the substrate (21) laminated with the film (20) is placed on the lower guide shaft (40) so as to be spaced from the lower plate (30) when the film is lifted by the restoring force of the member (60) How to.
KR1020170112753A 2017-09-04 2017-09-04 Apparatus and method for laminating a film to a substrate KR101986619B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102078115B1 (en) 2019-05-30 2020-02-17 주식회사 톱텍 Laminating apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008221840A (en) * 2007-02-15 2008-09-25 Nichigo Morton Co Ltd Film-like resin laminating apparatus and film-like resin laminating method using the same
KR20140115299A (en) * 2011-11-22 2014-09-30 쓰리엠 이노베이티브 프로퍼티즈 컴파니 A laminated product, an apparatus and a method for forming a laminated product
KR20140148202A (en) * 2013-06-21 2014-12-31 삼성디스플레이 주식회사 Apparatus for sticking film on display panel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008221840A (en) * 2007-02-15 2008-09-25 Nichigo Morton Co Ltd Film-like resin laminating apparatus and film-like resin laminating method using the same
KR20140115299A (en) * 2011-11-22 2014-09-30 쓰리엠 이노베이티브 프로퍼티즈 컴파니 A laminated product, an apparatus and a method for forming a laminated product
KR20140148202A (en) * 2013-06-21 2014-12-31 삼성디스플레이 주식회사 Apparatus for sticking film on display panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102078115B1 (en) 2019-05-30 2020-02-17 주식회사 톱텍 Laminating apparatus

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