KR20180125639A - Package for Light Emitting Device - Google Patents

Package for Light Emitting Device Download PDF

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Publication number
KR20180125639A
KR20180125639A KR1020167033420A KR20167033420A KR20180125639A KR 20180125639 A KR20180125639 A KR 20180125639A KR 1020167033420 A KR1020167033420 A KR 1020167033420A KR 20167033420 A KR20167033420 A KR 20167033420A KR 20180125639 A KR20180125639 A KR 20180125639A
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KR
South Korea
Prior art keywords
fluorescent material
phosphor layer
light emitting
thickness
emitting diode
Prior art date
Application number
KR1020167033420A
Other languages
Korean (ko)
Inventor
민재식
이재엽
장재영
조병철
조병구
조병권
Original Assignee
(주)라이타이저코리아
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by (주)라이타이저코리아 filed Critical (주)라이타이저코리아
Publication of KR20180125639A publication Critical patent/KR20180125639A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Abstract

The present invention provides a light emitting diode device including a light emitting diode device for providing light of a predetermined wavelength, a circuit board disposed on a lower surface of the light emitting diode device and electrically connected to the light emitting diode device, A first phosphor layer formed in a cap shape and having a thickness of a side portion and a thickness of an upper portion uniformly formed thereon, and a cap formed so as to surround a side surface and an upper surface of the first phosphor layer, And a second phosphor layer having a uniform thickness formed thereon.

Description

[0001] The present invention relates to a Package for Light Emitting Device

The present invention relates to a light emitting device package, and more particularly, to a light emitting device package in which a thickness of a side portion and a thickness of an upper portion are uniformly formed in a cap shape, and a phosphor layer including a single- The present invention relates to a light emitting device package capable of providing various bright colors while suppressing scattering due to the mixing of different fluorescent materials.

Recently, a light emitting device in which Ga or Al is doped with Al or In has been attracting attention due to its long lifetime, low power consumption, excellent brightness and environmental friendliness that are not harmful to the human body, as compared with conventional incandescent lamps. More and more.

Such a light emitting device has been used for automobile lighting, a traffic signal, and a backlight unit (BLU) of a liquid crystal display device due to the advantages described above.

Recently, the MacAdam Rule has been proposed as an index for evaluating whether the color coordinates measured in the artificial light source are the same as the color coordinates when viewed with human eyes. These MacAdam Rule provides a four-step criteria. In the Americas, artificial light sources that do not meet the MacAdam Rule's three-step criteria are not allowed to be sold. In order to satisfy the three steps of MacAdam Rule, it is very important to reduce the color deviation of white light.

Korean Patent Laid-Open Publication No. 10-2008-0070193 discloses a fluorescent film on which a fluorescent substance is formed on the film surface of a resin material. When the above-mentioned fluorescent film is attached to a light emitting diode device, It is difficult to reduce the color deviation of the white light because of the electrostatic force or the adhesive force between the light emitting diode and the fluorescent film due to the electrostatic force or the adhesive force.

In addition, when a fluorescent material is mixed with the above-mentioned fluorescent film, scattering is caused thereby resulting in a problem that the energy efficiency is lowered.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a phosphor layer having a cap shape and uniform thickness of a side portion and a top portion, The present invention provides a light emitting device package capable of providing a variety of bright and colorful light while suppressing scattering due to the mixing of different kinds of fluorescent materials by arranging the upper and lower surfaces of the light emitting diode device in multiple layers by color.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise forms disclosed. .

According to an aspect of the present invention, there is provided a light emitting device package including: a light emitting diode device for providing light of a predetermined wavelength; a light emitting diode device disposed on a bottom surface of the light emitting diode device, A first phosphor layer formed in a cap shape so as to surround the side surface and the upper surface of the light emitting diode device and having a thickness of a side portion and a thickness of an upper portion uniformly formed on the side surface of the first phosphor layer, And a second phosphor layer formed in a cap shape so as to surround the upper surface and having the thickness of the side portion and the thickness of the upper portion uniformly formed.

In the light emitting device package according to an embodiment of the present invention, the first fluorescent material layer may include a red fluorescent material, and the second fluorescent material layer may include a green fluorescent material.

In the light emitting device package according to an embodiment of the present invention, the first phosphor layer includes a green fluorescent material, and the second fluorescent material layer includes a red fluorescent material.

According to another aspect of the present invention, there is provided a light emitting device package including: a light emitting diode device for providing light having a predetermined wavelength; a light emitting diode device disposed on a bottom surface of the light emitting diode device, A first phosphor layer formed in a cap shape so as to surround the side surface and the upper surface of the light emitting diode element and having a thickness of the side portion and a thickness of the upper portion uniformly formed on the side surface of the first phosphor layer, A second phosphor layer formed in a cap shape so as to surround the upper surface and having a thickness of the side portion and a thickness of the upper portion uniformly and a cap formed to surround the side surface and the upper surface of the second phosphor layer, And a third phosphor layer having a thickness and an upper thickness uniformly formed.

In the light emitting device package according to another embodiment of the present invention, the first phosphor layer includes a red fluorescent material, the second fluorescent material layer includes a yellow fluorescent material, and the third fluorescent material layer includes a green fluorescent material can do.

In the light emitting device package according to another embodiment of the present invention, the first phosphor layer includes a red fluorescent material, the second fluorescent material layer includes a green fluorescent material, and the third fluorescent material layer includes a yellow fluorescent material can do.

In the light emitting device package according to another embodiment of the present invention, the first phosphor layer includes a yellow fluorescent material, the second fluorescent material layer includes a red fluorescent material, and the third fluorescent material layer includes a green fluorescent material .

In the light emitting device package according to another embodiment of the present invention, the first phosphor layer includes a yellow fluorescent material, the second fluorescent material layer includes a green fluorescent material, and the third fluorescent material layer includes a red fluorescent material can do.

In the light emitting device package according to another embodiment of the present invention, the first phosphor layer includes a green fluorescent material, the second fluorescent material layer includes a yellow fluorescent material, and the third fluorescent material layer includes a red fluorescent material can do.

In the light emitting device package according to another embodiment of the present invention, the first phosphor layer includes a green fluorescent material, the second fluorescent material layer includes a red fluorescent material, and the third fluorescent material layer includes a yellow fluorescent material can do.

The light emitting device package according to embodiments of the present invention includes a phosphor layer uniformly formed in the shape of a cap and having a thickness of a side portion and a thickness of an upper portion of the phosphor layer, It is possible to provide a variety of bright and colorful light while suppressing scattering due to the mixing of the fluorescent materials.

1 is a cross-sectional view of a light emitting device package according to an embodiment of the present invention;
2 is a cross-sectional view of a light emitting device package according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

1, a light emitting device package according to an embodiment of the present invention includes a light emitting diode device 1200, a circuit board 1100, a first phosphor layer 1310, and a second phosphor layer 1320 Lt; / RTI >

The light emitting diode device 1200 provides light of a predetermined wavelength. For example, the light emitting diode device 1200 can provide blue light.

The circuit board 1100 is disposed on the lower surface of the light emitting diode device 1200 and is electrically connected to the light emitting diode device 1200. The first phosphor layer 1310 is disposed on a side surface of the light emitting diode device 1200, And a second phosphor layer 1320 is formed on the side surface and the upper surface of the first phosphor layer 1310 so as to cover the upper surface of the first phosphor layer 1310. [ And the thickness of the side portion and the thickness of the upper portion are uniformly formed.

Here, the first phosphor layer 1310 includes a red fluorescent material, the second fluorescent material layer 1320 includes a green fluorescent material, the first fluorescent material layer 1310 includes a green fluorescent material And the second phosphor layer 1320 may include a red fluorescent material.

The light emitting device package according to an embodiment of the present invention can adjust the thickness of the side portion of the first phosphor layer 1310, the thickness of the upper portion or the concentration of the fluorescent material, the thickness of the side portion of the second phosphor layer 1320, Or by adjusting the concentration of the fluorescent material, the color of the provided light can be adjusted.

2, the light emitting device package according to another embodiment of the present invention includes a light emitting diode device 2200, a circuit board 2100, a first phosphor layer 2310, a second phosphor layer 2320, And a phosphor layer 2330 as shown in FIG.

The light emitting diode device 2200 provides light of a predetermined wavelength. For example, the light emitting diode element 2200 can provide blue light.

The circuit board 2100 is disposed on the lower surface of the light emitting diode device 2200 and is electrically connected to the light emitting diode device 2200. The first phosphor layer 2310 is connected to the side surface of the light emitting diode device 2200 And a second phosphor layer 2320 is formed on the side surface and the upper surface of the first phosphor layer 2310 so as to be uniform in thickness The third phosphor layer 2330 is formed in a cap shape so as to surround the side surface and the upper surface of the second phosphor layer 2320, And the thickness of the side portion and the thickness of the upper portion are uniformly formed.

Here, the first phosphor layer 2310 includes a red phosphor, the second phosphor layer 2320 includes a yellow phosphor, and the third phosphor layer 2330 includes a green phosphor , The first phosphor layer 2310 may include a red fluorescent material, the second fluorescent material layer 2320 may include a green fluorescent material, and the third fluorescent material layer 2330 may include a yellow fluorescent material. .

Meanwhile, the first phosphor layer 2310 may include a yellow fluorescent material, the second fluorescent material layer 2320 may include a red fluorescent material, the third fluorescent material layer 2330 may include a green fluorescent material, The first phosphor layer 2310 may include a yellow fluorescent material, the second fluorescent material layer 2320 may include a green fluorescent material, and the third fluorescent material layer 2330 may include a red fluorescent material.

Also, the first phosphor layer 2310 may include a green phosphor, the second phosphor layer 2320 may include a yellow phosphor, and the third phosphor layer 2330 may include a red phosphor, The first phosphor layer 2310 may include a green phosphor, the second phosphor layer 2320 may include a red phosphor, and the third phosphor layer 2330 may include a yellow phosphor.

The light emitting device package according to another embodiment of the present invention may adjust the thickness of the side portion of the first phosphor layer 2310, the thickness of the upper portion or the concentration of the fluorescent material, the thickness of the side portion of the second phosphor layer 2320, Or adjusting the concentration of the fluorescent material, or adjusting the thickness of the side of the third phosphor layer 2330, the thickness of the upper portion, or the concentration of the fluorescent material, the color of the provided light can be adjusted.

 While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

On the contrary, those skilled in the art will appreciate that many modifications and variations of the present invention are possible without departing from the spirit and scope of the appended claims.

Accordingly, all such appropriate modifications and changes, and equivalents thereof, should be regarded as within the scope of the present invention.

1200: light emitting diode element 1100: circuit board
1310: first phosphor layer 1320: second phosphor layer

Claims (10)

A light emitting diode element for providing light of a wavelength of a predetermined region;
A circuit board disposed on a lower surface of the light emitting diode device and electrically connected to the light emitting diode device;
A first phosphor layer formed in a cap shape so as to surround a side surface and an upper surface of the light emitting diode, the thickness of the side portion being uniform and the thickness of the upper portion being uniform; And
And a second phosphor layer formed in a cap shape so as to surround the side surface and the upper surface of the first phosphor layer and having the thickness of the side portion and the thickness of the upper portion uniformly formed. The method according to claim 1,
Wherein the first phosphor layer comprises a red fluorescent material and the second fluorescent material layer comprises a green fluorescent material. The method according to claim 1,
Wherein the first phosphor layer comprises a green phosphor and the second phosphor layer comprises a red phosphor. A light emitting diode element for providing light of a wavelength of a predetermined region;
A circuit board disposed on a lower surface of the light emitting diode device and electrically connected to the light emitting diode device;
A first phosphor layer formed in a cap shape so as to surround a side surface and an upper surface of the light emitting diode, the thickness of the side portion being uniform and the thickness of the upper portion being uniform;
A second phosphor layer formed in a cap shape so as to surround the side surface and the upper surface of the first phosphor layer and having the thickness of the side portion and the thickness of the upper portion uniformly formed; And
And a third phosphor layer formed in a cap shape so as to surround the side surface and the upper surface of the second phosphor layer and having a thickness of a side portion and a thickness of an upper portion uniformly formed. 5. The method of claim 4,
Wherein the first phosphor layer includes a red fluorescent material, the second fluorescent material layer includes a yellow fluorescent material, and the third fluorescent material layer includes a green fluorescent material. 5. The method of claim 4,
Wherein the first phosphor layer comprises a red fluorescent material, the second fluorescent material layer comprises a green fluorescent material, and the third fluorescent material layer comprises a yellow fluorescent material. 5. The method of claim 4,
Wherein the first phosphor layer includes a yellow fluorescent material, the second fluorescent material layer includes a red fluorescent material, and the third fluorescent material layer includes a green fluorescent material. 5. The method of claim 4,
Wherein the first phosphor layer comprises a yellow fluorescent material, the second fluorescent material layer comprises a green fluorescent material, and the third fluorescent material layer comprises a red fluorescent material. 5. The method of claim 4,
Wherein the first phosphor layer includes a green fluorescent material, the second fluorescent material layer includes a yellow fluorescent material, and the third fluorescent material layer includes a red fluorescent material. 5. The method of claim 4,
Wherein the first phosphor layer includes a green fluorescent material, the second fluorescent material layer includes a red fluorescent material, and the third fluorescent material layer includes a yellow fluorescent material.
KR1020167033420A 2016-06-27 2016-06-27 Package for Light Emitting Device KR20180125639A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2016/006836 WO2018004018A1 (en) 2016-06-27 2016-06-27 Light-emitting device package

Publications (1)

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KR20180125639A true KR20180125639A (en) 2018-11-26

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WO (1) WO2018004018A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009094262A (en) * 2007-10-09 2009-04-30 Toyoda Gosei Co Ltd Method for manufacturing light-emitting device
JP2010182809A (en) * 2009-02-04 2010-08-19 Stanley Electric Co Ltd Semiconductor light-emitting apparatus
JP5372868B2 (en) * 2010-08-06 2013-12-18 Ｄｏｗａエレクトロニクス株式会社 Light emitting device and manufacturing method thereof
KR20130014256A (en) * 2011-07-29 2013-02-07 엘지이노텍 주식회사 Light emitting device package and lighting system using the same
JP2014203932A (en) * 2013-04-03 2014-10-27 株式会社東芝 Light-emitting device

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