KR20180117570A - Led module having sub lighting area for lighting - Google Patents

Abstract

The present invention relates to an LED module having a sub-light emitting area for lighting. The LED module having a sub-light emitting area for lighting according to an aspect of the present invention comprises: a substrate; at least one LED bare chip mounted on the substrate; a light diffusing lens formed adjacent to a side surface of the LED bear chip on the substrate; and at least one color conversion sheet attached to the light diffusing lens to cover at least one LED bare chip on the substrate and including a phosphor. The light diffusing lens transmits light emitted from the LED bare chip to the side surface so that the light reaches an area not corresponding to the LED bare chip in the color conversion sheet, wherein an area corresponding to the LED bare chip and an area corresponding to the light diffusing lens in the color conversion sheet forms a main light emitting area, and an area not corresponding to the LED bare chip and the light diffusing lens forms a sub-light emitting area by allowing light reached by the light diffusing lens to be excited or move and be excited in the color conversion sheet.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an LED module,

The present invention relates to an LED module, and more particularly, to an LED module for illumination having a sub-luminescent region in which light is excited and emitted even in an area where an LED bare chip is not disposed in an LED module structure to significantly suppress shading.

A light emitting diode (LED) refers to a device that emits a predetermined light by making a small number of injected carriers (electrons or holes) using a pn junction structure of a semiconductor and recombining them. A green light emitting diode using GaP or the like, and a blue light emitting diode using an InGaN / AlGaN double hetero structure.

In particular, recent light emitting devices for illumination realize white light by combining a light emitting diode chip and a phosphor mold. For example, a phosphor is disposed on a light emitting diode chip that emits blue light to obtain white light by blue light emission of a light emitting diode chip and yellow-green or yellow light emission of a phosphor. That is, a blue light emitting diode chip composed of a semiconductor component emitting a wavelength of 430 nm to 480 nm and a phosphor emitting blue-green light and yellow-green and yellow light are excited to realize white light.

That is, up to now, a white light emitting device for illumination has been used in a method in which light having a sufficiently high energy emitted from a blue LED bare chip of a high luminance is molded on the LED bare chip and excited by a phosphor mold disposed thereon to induce white color.

To form a phosphor mold, a reflector is provided and a phosphor resin is injected into a reflector to constitute a so-called LED package. Such an LED package is required not only to raise the cost according to the complexity of the manufacturing process, It is pointed out that the problem of irregularity of light emission due to irregular deposition of the phosphor upon curing, high defective rate of devices, and poor color reproducibility is continuously pointed out, because the mixing ratio of the epoxy resin or silicone resin used in coating, thermal instability of such resin, It is true. In addition, even when the LED package is mounted on the substrate to implement the lighting device, shading occurs in a region where the LED package is not mounted on the substrate, and it is very difficult to realize a high-quality LED module for illumination.

In the non-illuminating LED module, there is an attempt to irradiate the side surface of the light by attaching the light diffusing lens to the LED package. However, this also does not fundamentally suppress the occurrence of shading and is not compatible with the illumination product. Further, There is a problem that the color rendering property of light is lowered during the process of diffusing the light excited by the phosphor by the light diffusing lens, thereby lowering the quality of the illumination.

[Prior Art Literature]

An encapsulant having a different sphere and an LED package using the encapsulant and an LED package using the encapsulant.

An object of the present invention is to provide an LED module which is easy to manufacture, suppresses thermal durability and shading, and has excellent color reproducibility.

However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided an LED module for illumination having a sub-luminescent region, comprising: a substrate; at least one LED bare chip mounted on the substrate; a light diffusion lens formed on a side surface of the LED bare chip, And at least one color conversion sheet attached to the light diffusing lens so as to cover at least one LED bare chip on the substrate, the light diffusing lens including a phosphor, Wherein the main light emitting region is formed in a region corresponding to the LED bear chip and a region corresponding to the light diffusion lens in the color conversion sheet, Wherein the light diffusing lens is disposed in a region not corresponding to the LED bear chip and the light diffusing lens, And is emitted to form a sub-emission region.

At this time, the light diffusion lens can come into contact with the upper surface or the side surface of the LED bare chip.

The height of a region of the color conversion sheet corresponding to the LED bear chip may be equal to or greater than a height of a region of the color conversion sheet not corresponding to the LED bear chip.

Further, the color conversion sheet may include a lower adhesive layer, and the color conversion sheet may be attached to the upper surface of the light diffusion lens or the substrate.

Further, one color conversion sheet may be formed to cover at least one LED bare chip, or one color conversion sheet may be formed to cover at least two LED bare chips.

The LED module of the present invention has a color conversion sheet and does not have an LED package manufacturing process, so that the LED module can be manufactured more easily.

Further, since the color conversion sheet is provided instead of the phosphor mold, the phosphor mold is prevented from being deteriorated by heat, and white color can be reproduced with excellent performance.

Further, since the light diffusing lens attached to the LED bare chip is formed, heat generated from the LED bare chip can be efficiently emitted to prevent the color conversion sheet from being deteriorated.

Further, the light emitted from the LED bare chip is transmitted to the side by the light diffusing lens, and further transmitted to the intermediate region of the LED bare chip and the adjacent LED bare chip by the color conversion sheet, So that the shading of the lighting product can be remarkably reduced.

In addition, a buffer space for further diffusing light is provided on the side of the light diffusing lens to further increase lateral transmission of light, thereby remarkably reducing the generation of shade, thereby providing a high-grade LED illumination.

1 is a perspective view illustrating an LED module according to an embodiment of the present invention.
2 is a cross-sectional view illustrating an LED module according to an exemplary embodiment of the present invention.
3 is a view showing a color conversion sheet and a method of manufacturing the same in an LED module according to an embodiment of the present invention.
4 is a view for explaining the operation of an LED module according to an embodiment of the present invention.

The present invention can be variously modified and may have various embodiments, and specific embodiments will be described in detail with reference to the drawings. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another.

For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, the present invention and its preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating an LED module according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view illustrating an LED module according to an embodiment of the present invention.

1 and 2, the LED module 101 according to the present embodiment includes a substrate 21, an LED bare chip 25, a light diffusion lens 22, and a color conversion sheet 10 .

The substrate 21 can be any substrate that can mount the LED bare chip 25 at a high density. Such as, but not limited to, alumina, quartz, calcium zirconate, forsterite, SiC, graphite, fused silica, Mullite, cordierite, zirconia, beryllia, and aluminum nitride, low temperature co-fired ceramic (LTCC), and the like.

The substrate 21 may be formed of a straight, circular or polygonal plate. A first wire 23 and a second wire 24 for supplying power to the LED bear chip 25 are installed on the substrate 21 . The LED module 101 according to the present embodiment is electrically connected to the LED bear chip 25 and the substrate 21 through the soldering portion 27 and does not have a separate bonding wire. The soldering portion 27 electrically connects the LED bear chip 25 and the substrate 21 and electrically connects the terminal 26 formed on the LED bear chip 25 to the substrate 21. The soldering portion 27 may be formed by Surface Mount Technology (SMT).

Meanwhile, the LED module according to an embodiment of the present invention may further apply a reflective material for reflecting light to the upper portion of the substrate 21. Emitting efficiency in a sub-luminescent region to be described later.

The LED bear chip 25 is a blue light emitting LED chip, and may be made of a semiconductor component emitting a wavelength of 430 nm to 480 nm. However, it is needless to say that the LED bear chip 25 may be an LED bear chip that emits different color light, and the scope of the present invention is not limited to the specific LED bear chip.

Meanwhile, the LED module according to an embodiment of the present invention includes at least one LED bear chip. This is because the LED module according to this embodiment has a structure for the organic connection relationship of the LED bear chip 25, the light diffusion lens 22 and the color conversion sheet 10, which is possible only in the LED module structure. Further, although the LED module according to an embodiment of the present invention will be described in detail later, a structure in which a plurality of so-called " LED packages " in which a reflector is provided in a conventional LED bare chip and a fluorescent molding layer is formed therebetween Quality LED lighting module that removes the LED package structure and is not shaded according to the LED bare chip, light diffusing lens 22, and color conversion sheet 10.

The light diffusing lens 22 can be formed using materials such as acrylic, polycarbonate, silicon, and PET excellent in light transmittance and excellent in moldability, (25). That is, the LED generally has a directional width that increases the amount of light emitted toward the upper side, and it is necessary to adjust the irradiation range of the light by using an additional lens to transmit the light. At this time, the light diffusion lens 22 preferably comprises a combination of a concave lens or a convex lens having a focal length within a set range.

2, the light diffusing lens 22 is formed adjacent to the side surface of the LED bear chip 25 to contact the side surface or the upper surface to transmit the light to the side surface area apart from the LED bare chip 25 . Further, the light diffusion lens 22 is formed on the substrate 21 so as to abut simultaneously with the plurality of LED bare chips and the substrate, which is formed so as to fill the space between the LED bare chips and the adjacent LED bare chips So that light emission efficiency in the sub-emission region can be further increased through continuous light transmission to the side.

A light diffusion lens; 2, the light diffusion lens 22 can form a buffer space 28 that does not come in contact with the side surface of the LED bare chip 25. The buffer space 28 may be triangular channel shaped and may have a triangular profile. Light emitted from the LED bare chip 25 spreads in the buffer space 28 and then enters the light diffusing lens 22 according to the buffer space 28, thereby further enhancing the lateral transmission efficiency of light, can do. More specifically, the light diffusion lens 22 transmits light radiated by the LED bare chip 25 to the side so as to reach the entire region of the color conversion sheet 10 that does not correspond to the LED bear chip on the substrate 21 .

The color conversion sheet 10 is a sheet including a phosphor and is attached on the substrate 21 or on the light diffusing lens 22 so as to cover at least one LED bare chip 25. More specifically, the color conversion sheet 10 may be attached to the upper surface of the light diffusing lens 22 or the substrate 21. One color conversion sheet 10 may be installed on the substrate 21 so as to cover all the LED bear chips 25 provided on the substrate 21. [ At this time, the color conversion sheet 10 may be made of a unibody.

However, the present invention is not limited thereto, and a plurality of color conversion sheets 10 may be provided on one substrate 21. In this case, the color conversion sheet 10 may be provided so as to cover the plurality of LED bear chips 25 and cover at least one LED bear chip 25. However, considering the production cost of the LED module, it may be more preferable to cover at least two LED bear chips 25.

At this time, the color conversion sheet 10 has a height corresponding to a height of a region of the color conversion sheet 10 corresponding to the LED bear chip 25 which does not correspond to the LED bear chip 25 of the color conversion sheet 10 Are formed. Reflects the fact that the height of the area of the color conversion sheet 10 which does not correspond to the LED bear chip 25 becomes smaller than the corresponding area as the pressing pressure increases in the process of attaching the color conversion sheet 10. That is, the color conversion sheet 10 is also brought into close contact with the substrate in the region where the LED bear chip 15 or the light diffusion lens 22 is not disposed in order to serve as a light guide plate, thereby preventing light loss. It is possible to more easily confirm the structure of the LED module not adopting the package structure according to the embodiment of the present invention when the difference in height is confirmed.

On the other hand, the color conversion sheet 10 serves to externally excite the light transmitted to the side of the light diffusion lens 22 or transmit the light transmitted to the side of the light diffusion lens 22 to the side further do. As a result, light is emitted even in areas that do not correspond to the LED bare chip 25 and the light diffusion lens 22. More specifically, the color conversion sheet 10 is disposed on the substrate 21, and the LED bear chip 25 is formed on the substrate in a plurality of layers, and the LED bear chip 25 and the adjacent LED bear chip 25 The light diffusion lens 22 and the color conversion sheet 10 are arranged in the space between the color conversion sheet 10 and the color conversion sheet 10,

Hereinafter, the color conversion sheet 10 will be described in more detail. 3 is a view showing a color conversion sheet and a method of manufacturing the same in an LED module according to an embodiment of the present invention.

As shown in Fig. 3, the color conversion sheet 10 is formed of a first sheet 11 having a phosphor 15, and may further include a second sheet 12 having adhesiveness as required . The first sheet 11 includes a first substrate 11a and a phosphor layer 11b applied to the first substrate 11a. The first base material 11a may be made of a resin, and the resin may be, for example, a silicone resin, an epoxy resin, a glass, a glass ceramic, a polyester resin, an acrylic resin, a urethane resin , Thermosetting resins having transparency such as nylon resin, polyamide resin, polyimide resin, vinyl chloride resin, polycarbonate resin, polyethylene resin, Teflon resin, polystyrene resin, polypropylene resin and polyolefin resin.

The phosphor layer 11b is manufactured by using as a main component a phosphor whose yellow wavelength is excited by the blue light emitted from the LED bear chip 25. Here, the present embodiment corresponds to the case where the LED bear chip 25 outputs the blue light and constitutes the color conversion sheet 10 for producing the white light, but the LED bear chip 25 outputs the green light or the red light In the case of a phosphor, other phosphors may be used to produce white light.

The phosphor layer 11b may be applied on the first substrate 11a in a printing manner using a slot die or a doctor blade. At this time, the first sheet 11 is formed in the shape of a ribbon wound on a roller and can be conveyed at a speed of 1 m / min to 15 m / min, and the first sheet 11 is cured through a thermosetting section of 10 m or more .

The second sheet 12 includes a second base material 12a and an adhesive layer 12b formed on the second base material 12a. The second base material 12a may be made of a resin having an adhesive force, and may be made of heat-resistant transparent silicone. The adhesive layer 12b may include a transparent adhesive such as a UV curable resin, a thermosetting resin, and a sealant.

The adhesive layer 12b may be applied on the second substrate 12a in a printing manner using a slot die or a doctor blade. The hardness of the second sheet 12 is formed to be smaller than the hardness of the first sheet 11 and the hardness of the second sheet 12 can be made to have a Shore A hardness of 5 or more and 20 or less. Further, the thickness of the second sheet 12 may be larger than 15 mu m and smaller than the thickness of the LED bear chip 25. However, the present invention is not limited thereto, and the second sheet 12 may have various structures.

The second sheet 12 is formed to have a greater thermal conductivity than the first sheet 11. The second sheet 12 may be made of a polyimide resin and the second sheet 12 may be made of a thermoplastic resin A metal oxide such as ITO (indium tin oxide) may be included. Further, the first sheet 11 and the second sheet 12 can be pressurized and adhered by a roll-to-roll process.

Hereinafter, the operation of the LED module according to an embodiment of the present invention will be described. 4 is a view for explaining the operation of an LED module according to an embodiment of the present invention.

The LED module 101 according to the embodiment of the present invention is configured such that the region where the light diffusing lens 22 disposed close to the LED bare chip 25 is disposed forms the main light emitting region A, To form the light-emitting region (B). That is, the light diffusion lens 22 transmits the light emitted by the LED bare chip 25 to the side (direction a) and transmits the light to the color conversion sheet 10 in the region separated from the LED bear chip, And is further distributed to the side surface to be evenly distributed in the space between the LED bear chips 25.

That is, the sub-luminescent region B is a region in which the LED bare chip 25 originally reflected upwardly and is transmitted to the side to reach the side, the light originally emitted from the LED bare chip 25 to the side, Light transmitted to the side surface of the color conversion sheet 10, and light transmitted to the side surface of the color conversion sheet 10 is transmitted again to the side surface of the color conversion sheet 10, and the light thus reached is emitted after excitation (in the direction b) to form a light emitting region.

At this time, since the light emitted from the surrounding LED bare chip reaches the sub-emissive area B at the same time, a light flux similar to the main emissive area A is realized, so that the generation of the heat generation is remarkably reduced. In addition, the LED module according to the embodiment of the present invention moves to the side before the light initially emitted from the LED bear chip 25 is excited by the phosphor included in the color conversion sheet 10, 10) and finally emitted. Therefore, it becomes possible to realize the highest quality LED module for illumination that does not deteriorate the color rendering property of light.

As described above, preferred embodiments of the present invention have been disclosed in the present specification and drawings, and although specific terms have been used, they have been used only in a general sense to easily describe the technical contents of the present invention and to facilitate understanding of the invention , And are not intended to limit the scope of the present invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

101: LED module
10: Color conversion sheet
22: Light diffusion lens
23: first wire
24: second wire
25: LED bear chip
26: Terminal
27: soldering portion
28: buffer space

Claims (2)

In the LED module for illumination,
Board;
A plurality of LED bear chips mounted on the substrate;
A light diffusion lens formed on the substrate so as to be in contact with the plurality of LED bare chips and the substrate at the same time;
A color conversion sheet attached on the light diffusing lens so as to cover a plurality of LED bare chips on the substrate and including a phosphor; Lt; / RTI >
The light diffusing lens transmits light emitted from the LED bare chip to the side so as to allow light to reach an area not corresponding to the LED bear chip of the color conversion sheet on the substrate and an area without the LED bear chip on the substrate,
Wherein a region where the LED bear chip is formed on the substrate forms a main light emitting region and a region spaced apart from the LED bear chip on the substrate forms a sub light emitting region.
The method according to claim 1,
The region where the color conversion sheet corresponds to the LED bear chip is relatively protruded upward and the region where the color conversion sheet does not correspond to the LED bear chip is formed with convex concave patterns alternately directed downward relative to each other Emitting sub-light emitting region.

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